Mixed fluid immersion cooling system and method

Abstract

Described herein are examples of devices that include a cooling housing. The cooling housing includes a storage area. The storage includes a heat source to be cooled. The housing includes a heat exchanger coupled to the housing. The heat exchanger transfers heat from the storage area to an environment surrounding the cooling housing. The housing includes a first fluid positioned within the storage area and partially surrounding a first portion of the heat source. The housing includes at least one second fluid positioned within the storage area and partially surrounding at least a second portion of the heat source. The first fluid is substantially separated from the at least one second fluid. The housing includes a third fluid in thermal contact with the at least one second fluid and a portion of the heat source.

Description

[Technical Field]

[0001] This application claims priority to U.S. Provisional Patent Application No. 63 / 374,001, entitled "MIXED FLUID IMMERSION COOLING SYSTEM AND METHOD," filed August 30, 2022. The entire contents of the above application are incorporated herein by reference for all purposes. [Background technology]

[0002] Modern electronic devices generate a significant amount of heat, and therefore most modern electronic components require robust cooling systems. Summary of the Invention

[0003] This specification will be more fully understood when viewed in conjunction with the accompanying drawings of various illustrative examples of refrigeration systems. This specification is not intended to limit refrigeration systems to any particular illustrative example. Rather, the specific illustrative examples shown and described are provided for explanation and understanding of refrigeration systems. Throughout the specification, drawings may be referred to as drawings, figures, and / or FIGs. [Brief explanation of the drawings]

[0004] [Figure 1] 1 illustrates a cross-sectional view of a cooling system, according to one embodiment. [Figure 2] 1 illustrates operation of a cooling system, according to one embodiment. [Figure 3] 1 illustrates a cross-sectional view of another cooling system, according to one embodiment. [Figure 4] 1 illustrates a cross-sectional view of another cooling system, according to one embodiment. [Figure 5] 1 shows a block diagram of a method for cooling a heat source, according to one embodiment. DETAILED DESCRIPTION OF THE INVENTION

[0005] The cooling system disclosed herein will be better understood by considering the following detailed description in conjunction with the drawings. The detailed description and drawings provide merely illustrative examples of various embodiments of the cooling system. Many variations are possible for various applications and design considerations. However, for the sake of brevity and clarity, not all possible variations may be individually described in the following detailed description. Those skilled in the art will understand how the disclosed examples can be changed, modified, and altered without substantially departing from the scope of the examples described herein.

[0006] Conventional cooling systems can include a fluid for transferring heat from an object to the surrounding environment. One type of conventional cooling system is a two-phase immersion cooling system. Two-phase immersion requires a large amount of expensive fluid to immerse the object being cooled, e.g., electronic equipment. In conventional cooling systems, the containment area must be airtight for proper function. However, this prevents fluid from entering or exiting the containment area without fluid loss (through gasification). Another type of cooling system is a single-phase immersion cooling system. Single-phase immersion does not have the efficiency of two-phase immersion. Furthermore, single-phase fluid transfers less energy per watt used to cool the containment area and requires a substantially higher flow rate per British thermal unit (BTU) removed.

[0007] Embodiments of a cooling system according to the present invention can address some or all of the above-mentioned problems. In an embodiment, the cooling system utilizes a dielectric single-phase fluid and a dielectric two-phase fluid in a single containment area. A container (heat source) having one electronic device can be immersed in the single-phase fluid and the two-phase fluid. The container is positioned so that high-performance components, which typically have high heat generation, can take advantage of the superior cooling provided by the two-phase fluid, while the remaining components can be cooled by the single-phase fluid. Due to the greater density of the two-phase fluid, the two-phase fluid and the single-phase fluid remain separated and / or substantially separated, with the single-phase fluid being located on top of the two-phase fluid when oriented against gravity. In an embodiment, the single-phase fluid has a greater density, thus reversing the directionality of the fluid.

[0008] In an embodiment, the single-phase fluid and the two-phase fluid may be liquids. Components release their heat into the two-phase fluid, which boils and carries the two-phase fluid through the two-phase fluid and the lighter single-phase fluid in gas form. The gas (formerly the two-phase liquid) is released into a pocket of air (or inert gas) above the fluid layer in the containment region. When the gas reaches the air pocket, the gas (from the two-phase fluid) condenses again via a heat exchanger in thermal communication with the air pocket of the containment region. In one example, the heat exchanger may be a device that facilitates the process of heat exchange between two or more fluids. In one example, the fluids may be at different temperatures. In another example, the fluids may be at the same temperature. In another example, the fluids may be different types of fluids. In another example, the heat exchanger may be a condenser coil that may be positioned within the air pocket of the containment region. As heat is transferred to the heat exchanger, the gas in the two-phase liquid condenses and flows back through the single-phase fluid layer to the two-phase fluid layer, thereby repeating the cycle and cooling the heat source in the containment region. In some embodiments, the heat exchanger may be located in a separate compartment or vessel.

[0009] Additionally, heat released to the top of the tank accumulates in the single-phase fluid, which can be pumped separately or left alone, boiling the two-phase fluid at the boundary, releasing the heat, and recirculating the fluid. The single-phase fluid adds the additional benefit of allowing access to the tank (e.g., cables) without losing two-phase fluid because the access point is within the single-phase fluid portion, e.g., the access point is immersed in the single-phase fluid. Additionally, the single-phase fluid acts as a natural seal, since gas at the top of the containment area cannot escape (much like air can become trapped in an upside-down canoe).

[0010] For example, a containment area for two or more fluids (which may be dielectric fluids), a condenser coil (for fluids such as, but not limited to, water (a non-dielectric liquid) or a water-glycol mixture), and electronics for cooling. Optionally, the containment area can include a secondary pump for cooling single-phase fluids independent of the condenser coil. Additionally, the condenser coil can include a plate on the inside or outside of the containment area (if on the outside, a cooler temperature (which may be caused by another fluid, a cold plate, and / or cold air) surrounding the containment area causes the gas to condense).

[0011] 1 illustrates a cooling system 100 for cooling a heat source 102, according to one embodiment. The cooling system 100 utilizes multiple layers of cooling fluid to cool the heat source 102. The heat source 102 is typically positioned such that high performance components with high heat generation can utilize one type of fluid, while the remaining components can be cooled by another type of fluid.

[0012] As shown in FIG. 1 , cooling system 100 includes a cooling housing 101 that forms a storage area 104. A heat source 102 is disposed within storage area 104. Heat source 102 may be any type of object, device, item, etc. that is desired to be cooled. In one embodiment, heat source 102 may be one or more electronic devices that require cooling. While FIG. 1 illustrates cooling housing 101 shaped as a square or rectangular cube, those skilled in the art will understand that the cooling housing 101 depicted in FIG. 1 is a general example and that the cooling housing 101 can be formed in any shape and any size. Similarly, while FIG. 1 illustrates storage area 104 shaped as a hollow cavity, those skilled in the art will understand that the storage area 104 depicted in FIG. 1 is a general example and that the storage area 104 can be formed in any shape and any size.

[0013] The containment region 104 of the cooling housing 101 includes a first fluid layer 106. The first fluid layer 106 is positioned within the containment region 104 such that the first fluid layer 106 surrounds a first portion of the heat source 102 (or the heat source 102 is positioned within the containment region 104). In some embodiments, the heat source 102 can be positioned such that the first fluid layer 106 surrounds a first portion of the heat source 102 that produces the most heat. For example, the first fluid layer 106 may be adjacent to a heat-producing electronic component. In some embodiments, the first fluid layer 106 may include a two-phase liquid, such as two-phase Novec by 3M, Flurinert by 3M, or the like.

[0014] The storage area 104 also includes a second fluid layer 108. The second fluid layer 108 is positioned within the storage area 104 such that the second fluid layer 108 surrounds a second portion of the heat source 102 (or the heat source 102 is positioned within the storage area 104). The second fluid layer 108 is positioned within the storage area 104 such that the first fluid layer 106 and the second fluid layer 108 are substantially separated. In embodiments, the second fluid layer 108 may comprise a single-phase liquid. In embodiments, the first fluid layer 106 may have a higher density relative to the second fluid layer 108. Thus, when the housing is oriented against gravity, the first fluid layer 106 settles to a lower portion of the storage area 104 and the second fluid layer 108 is positioned above the first fluid layer 106. In some embodiments, first fluid layer 106 can include a single-phase liquid and second fluid layer 108 can include a two-phase liquid. However, as described herein, separated and / or substantially separated means that one skilled in the art would understand that the fluid layers may intermingle at their interfaces as governed by the physical properties of the fluids being used. In one embodiment, containment volume 104 can include different single-phase fluids within the same container, such as single-phase fluids having different energy or wattage characteristics.

[0015] The storage area 104 also includes an nth fluid layer 110. The nth fluid layer 110 is positioned within the storage area 104 such that the nth fluid layer 110 surrounds a third portion of the heat source 102 (or the heat source 102 is positioned within the storage area 104). The nth fluid layer 110 is positioned within the storage area 104 such that the nth fluid layer 110 and the second fluid layer 108 are substantially separated. In an embodiment, the nth fluid layer 110 may comprise a gas, such as air. In an embodiment, the nth fluid layer 110 may have a lower density than the second fluid layer 108. Thus, the nth fluid layer 110 may be at an upper portion of the storage area 104, above the second fluid layer 108, with respect to gravity.

[0016] Although not shown, the storage area 104 may include two or more of the second fluid layers 108. That is, multiple second fluid layers 108 (e.g., third, fourth, fifth, sixth, seventh fluid layer, etc.) may be sandwiched between the nth fluid layer 110 and the first fluid layer 106. In some embodiments, the multiple second fluid layers 108 may include the same type of fluid. In some embodiments, the multiple second fluid layers 108 may include different types of fluid. In embodiments, each of the multiple second fluid layers 108 may have a different density, thereby forming a continuum of second fluid layers 108.

[0017] The cooling housing 101 also includes a heat exchanger 112. The heat exchanger 112 is positioned in thermal communication with the nth fluid layer 110 and an environment 114 surrounding the housing 101. The heat exchanger 112 transfers heat from the containment region 104 through the first fluid layer 106, the second fluid layer 108, and the nth fluid layer 110 to the environment 114 surrounding the housing 101, as described below in FIG. 2 . In an embodiment, the heat exchanger 112 may include a heat pump, a refrigerator system, a heat sink, a fan, or the like. In another embodiment, the heat exchanger 112 may be located outside the housing, such as in a different location. In another embodiment, the heat exchanger 112 may be located in a different section of the cooling housing 101.

[0018] In some embodiments, the heat exchanger 112 may be located in one or more separate compartments or vessels. The separate compartments or vessels containing the heat exchanger may be removable or separable from the housing 101. In this example, gas from the nth fluid layer may be separated or sequestered in one or more separate compartments or vessels for interaction with the heat exchanger.

[0019] 2 illustrates an operational cooling system 100 for cooling a heat source 102, according to one embodiment. The cooling system 100 utilizes multiple layers of cooling fluid to cool the heat source 102. The hottest portion of the heat source 102 is positioned with a first fluid layer 106, thereby utilizing the superior thermal properties of the first fluid layer 106.

[0020] As shown, a container containing a heat source 102, such as electronic equipment 200, may be immersed in a first fluid layer 106 and a second fluid layer 108. The heat source 102 is positioned such that the electronic equipment 200, which typically has a high heat generation rate, can take advantage of the superior cooling provided by the first fluid layer 106, while the remaining components can be cooled by the second fluid layer 108. Due to the greater density of the first fluid layer 106, the first and second fluid layers 106, 108 remain substantially separated, with the second fluid layer 108 being at the top of the two-phase fluid when oriented against gravity g.

[0021] In an embodiment, the electronic device 200 releases heat into the first fluid layer 106, which boils and forms gas particles 202. The gas particles 202 travel through the second fluid layer 108, where they are released into the nth fluid layer 110, e.g., the gas layer, located above the second fluid layer 108 within the containment region 104. When the gas reaches the nth fluid layer 110 (or gas layer), the gas particles 202 contact components of the heat exchanger 112, thereby transferring heat to the environment 114. Due to heat loss, the gas particles 202 condense into liquid particles 204. The liquid particles 204 fall back to the surface of the second fluid layer 108 and return to the first fluid layer through the second fluid layer 108. This cycle repeats, cooling the heat source 102 within the containment region 104.

[0022] Additionally, heat released to the top of containment area 104 accumulates in the single-phase fluid, which can be pumped separately or left alone, boiling first fluid layer 106 at the interface, releasing the heat, and recirculating the fluid. Second fluid layer 108 adds the additional benefit of allowing access to the tank (e.g., cable 210) without losing two-phase fluid because the access port is within second fluid layer 108, e.g., the access port is immersed within second fluid layer 108. Additionally, second fluid layer 108 doubles as a natural seal, as gas at the top of containment area 104 cannot escape (much like air can become trapped in an upside-down canoe).

[0023] 3 illustrates a cooling system 300 for cooling a heat source 302, according to one embodiment. The cooling system 300 utilizes multiple layers of cooling fluid to cool the heat source 302. The cooling system 300 includes a heat pump 312 as a heat exchanger.

[0024] As shown in FIG. 3 , cooling system 300 includes a cooling housing 301 that forms a storage area 304. A heat source 302 is disposed within storage area 304. Heat source 302 may be any type of object, device, item, etc. that is desired to be cooled. In one embodiment, heat source 302 may be one or more electronic devices that require cooling. While FIG. 3 illustrates cooling housing 301 shaped as a square or rectangular cube, those skilled in the art will understand that the cooling housing 301 depicted in FIG. 3 is a general example and that the cooling housing 301 can be formed in any shape and any size. Similarly, while FIG. 3 illustrates storage area 304 shaped as a hollow cavity, those skilled in the art will understand that the storage area 304 depicted in FIG. 3 is a general example and that the storage area 304 can be formed in any shape and any size.

[0025] Containment region 304 of cooling housing 301 includes a two-phase liquid layer 306. Two-phase liquid layer 306 is positioned within containment region 304 such that two-phase liquid layer 306 surrounds a first portion of heat source 302 (or heat source 302 is positioned within containment region 304). In some embodiments, heat source 302 can be positioned such that two-phase liquid layer 306 surrounds a first portion of heat source 302 that produces the most heat. In some embodiments, two-phase liquid layer 306 may be Novec by 3M. Containment region 304 also includes a single-phase liquid layer 308. Single-phase liquid layer 308 is positioned within containment region 304 such that single-phase liquid layer 308 surrounds a second portion of heat source 302 (or heat source 302 is positioned within containment region 304). The single-phase liquid layer 308 is positioned within the containment area 304 such that the two-phase liquid layer 306 and the single-phase liquid layer 308 are substantially separated.

[0026] In an embodiment, two-phase liquid layer 306 can have a higher density relative to single-phase liquid layer 308. Thus, when the housing is oriented against gravity, two-phase liquid layer 306 settles to the bottom of containment area 304 and single-phase liquid layer 308 is positioned on top of two-phase liquid layer 306. However, as described herein, substantially separated means that one skilled in the art would understand that the fluid layers may intermix at their interfaces as governed by the physical properties of the fluids being used.

[0027] Storage area 304 also includes a gas layer 310 (or a third fluid). Gas layer 310 is positioned within storage area 304 such that gas layer 310 surrounds a third portion of heat source 302 (or heat source 302 is positioned within storage area 304). Gas layer 310 is positioned within storage area 304 such that gas layer 310 and single-phase liquid layer 308 are substantially separated. In embodiments, gas layer 310 may include a gas such as air. In embodiments, gas layer 310 may have a lower density than single-phase liquid layer 308. Thus, gas layer 310 may be at an upper portion of storage area 304, above single-phase liquid layer 308, relative to gravity.

[0028] Although not shown, the containment area 304 may include two or more of the single-phase liquid layers 308 (which may be referred to as a third, fourth, or fifth liquid layer, and the gas layer may then be numbered higher or referred to as a gas layer). That is, the multiple single-phase liquid layers 308 may be sandwiched between the gas layer 310 and the two-phase liquid layer 306. In some embodiments, the multiple single-phase liquid layers 308 may include the same type of fluid. In some embodiments, the multiple second single-phase liquid layers 308 may include a different type of fluid. In embodiments, each of the multiple single-phase liquid layers 308 may have a different density, thereby forming a continuum of single-phase liquid layers 308.

[0029] The cooling housing 301 also includes a heat pump 312 as a heat exchanger. The heat pump 312 may include a condenser coil 316 coupled to a cooling device 320 by a supply line 318. The cooling device may include a fan, a radiator, a heat sink, or the like. The condenser coil 316 is positioned in thermal communication with the gas layer 310. The condenser coil 316 transfers heat from the containment region 304 through the two-phase fluid layer 306, the single-phase liquid layer 308, and the gas layer 310 to the environment 314 surrounding the housing 301, as described above in FIG. 2 . That is, heat is transferred to the fluid in the condenser coil 316 toward the cooling device 320 and then to the environment 314.

[0030] For example, a condenser fluid, such as a water / glycol / etc. mixture, circulates through a radiator. A single-phase liquid layer 308 on top of the two-phase liquid layer 306 generally provides direct cooling to components that produce less heat energy, boiling the two-phase liquid layer 306 as the fluid rises to a two-phase threshold temperature, allowing heat transfer from less dense components (where they contact). The boiling may be constant boiling, slow boiling, low boiling, or anything in between. Once condensed, the two-phase liquid layer 306 may rain down or be directed in some way (directed rain or collected and pumped back to be processed again).

[0031] 4 illustrates a cooling system 400 for cooling a heat source 402, according to one embodiment. The cooling system 400 utilizes multiple layers of cooling fluid to cool the heat source 402.

[0032] As shown in Figure 4, cooling system 400 includes a cooling housing 401 that defines a containment region 404. A heat source 402 is disposed within containment region 404, as described above in Figures 1-3. Containment region 404 of cooling housing 401 includes a two-phase liquid layer 406. Containment region 404 also includes a single-phase liquid layer 408. Two-phase liquid layer 406 and single-phase liquid layer 408 may be similar to those described above.

[0033] Containment area 404 also includes non-dielectric fluid layer 409. In an embodiment, non-dielectric fluid layer 409 can have a lower density relative to single-phase liquid layer 408. Thus, when the housing is oriented against gravity, non-dielectric fluid layer 409 is positioned on top of single-phase liquid layer 408. For example, water can be positioned on top of the single-phase liquid layer above the dielectric fluid. In this example, the water may be visible to provide a decorative and pleasing appearance.

[0034] The storage area 404 also includes a gas layer 410. The gas layer 410 is positioned within the storage area 404 such that the gas layer 410 surrounds a portion of the heat source 402 (or the heat source 402 is positioned within the storage area 404). The gas layer 410 is positioned within the storage area 404 such that the gas layer 410 and the non-dielectric fluid layer 409 are substantially separated. In embodiments, the gas layer 410 may include a gas such as air. In embodiments, the gas layer 410 may have a lower density than the non-dielectric fluid layer 409. Thus, the gas layer 410 may be located at the top of the storage area 404 above the single-phase liquid layer 408 relative to gravity. Although not shown, the storage area 404 may include two or more single-phase liquid layers 408, as described. The housing 401 may also include a heat exchanger 412, as described above.

[0035] FIG. 5 shows a block diagram of a method 500 of using a cooling system to remove heat from a heat source, according to one embodiment. In one embodiment, step 501 includes placing a heat source in a containment area within a cooling housing. The containment area is configured to receive the heat source. Step 502 includes coupling a heat exchanger to the housing. In one embodiment, the housing can be coupled to the heat exchanger by directly attaching the heat exchanger to the housing. In another embodiment, the housing can be indirectly coupled to the heat exchanger via a connection, such as a tube, pipe, or plumbing. The heat exchanger is configured to transfer heat from the containment area to an environment surrounding the cooling housing. Step 503 includes positioning a first fluid within the containment area. The first fluid surrounds a first portion of the heat source, and the first fluid comprises a two-phase liquid. Step 504 includes positioning a second fluid within the containment area. The second fluid surrounds a second portion of the heat source, and the second fluid comprises a single-phase liquid. Step 505 includes positioning a gas within the containment region, the gas in thermal communication with a second fluid and a portion of a heat exchanger, and a first fluid configured to receive heat, boil to form gas particles, travel upward through the second fluid and the gas, contact the heat exchanger, lose heat to the heat exchanger, condense to a liquid, travel downward through the gas and the second fluid, and return to the first portion of the heat source within the containment region.

[0036] Examples include methods that allow the second fluid to enter and exit the containment area, thereby allowing a user to access the heat source without losing the gas or the first fluid.

[0037] Examples include methods in which the second fluid can be maintained at a temperature to provide a constant boiling point for the first fluid at the interface between the first and second fluids.

[0038] Examples include methods in which the second fluid is cooled by a second heat exchanger to reduce the temperature of the second fluid and delay boiling of the first fluid.

[0039] A feature shown in one of the drawings may be the same or similar to a feature shown in another of the drawings. Similarly, a feature described in connection with one of the drawings may be the same or similar to a feature described in connection with another of the drawings. The same or similar features may be indicated by the same or similar reference characters unless otherwise specified. Furthermore, the description of a particular drawing may refer to a feature not shown in that particular drawing. This feature may be shown in and / or further described in connection with another drawing.

[0040] The foregoing description sets forth numerous specific details, such as examples of particular systems, components, methods, etc., to provide a thorough understanding of some embodiments. However, it will be apparent to one skilled in the art that at least some embodiments may be practiced without these specific details. In other instances, well-known components or methods are not described in detail or are presented in simple block diagram form in order to avoid unnecessarily obscuring the embodiments. Thus, the above specific details are merely illustrative. Particular embodiments may vary from these illustrative details and still be considered within the scope of the embodiments.

[0041] Related elements in the examples and / or embodiments described herein may be identical, similar, or different in different examples. For brevity and clarity, related elements may not be described redundantly. Instead, the use of identical, similar, and / or related element names and / or reference letters may inform the reader that an element with a given name and / or related reference letter may be similar to another related element with the same, similar, and / or related element name and / or reference letter in an example described elsewhere herein. Elements unique to a given example may be described with reference to that specific example. Those skilled in the art will understand that a given element need not be the same and / or similar to the specific depiction of the related element in any given figure or example to share the characteristics of the related element.

[0042] It is to be understood that the foregoing description is intended to be illustrative, and not limiting. Many other embodiments will become apparent to those skilled in the art upon reading and understanding the above description. Accordingly, the scope of the present embodiments should be determined with reference to the appended claims, along with the full scope of equivalents to which such claims are entitled.

[0043] The foregoing disclosure encompasses multiple different examples with independent utility. While these examples have been disclosed in certain forms, the specific examples disclosed and illustrated above are not to be considered limiting, as many variations are possible. The subject matter disclosed herein includes novel and non-obvious combinations and subcombinations of the various elements, features, functions, and / or properties disclosed above, both explicitly and inherently. When this disclosure or a claim thereafter filed recites "an" element, "a first" element, or any such equivalent term, it should be understood that the disclosure or claim incorporates one or more such elements and does not require or exclude two or more of such elements.

[0044] As used herein, "same" means sharing all characteristics, and "similar" means sharing a substantial number of characteristics, or sharing substantially important characteristics even if a substantial number of characteristics are not shared. As used herein, "may" should be interpreted permissively and not indefinitely. Furthermore, the use of "is" with respect to an example, element, and / or feature should be interpreted specifically with respect to only that particular example, and not with respect to every example. Furthermore, references to "the disclosure" and / or "this disclosure" refer to the entire description of this specification and the accompanying drawings, and extend to all descriptions in each subsection of this specification, including the title, background, brief description of the drawings, detailed description, claims, abstract, and any other documents and / or resources incorporated by reference herein.

[0045] As used herein in connection with a list, "and" forms a group that includes all of the listed elements. For example, an example described as including A, B, C, and D is an example that includes A, includes B, includes C, and also includes D. As used herein in connection with a list, "or" forms a list of elements, any of which may be included. For example, an example described as including A, B, C, or D is an example that includes any of the elements A, B, C, and D. Unless otherwise specified, examples that include alternatively inclusive lists of elements do not exclude other examples that include various combinations of some or all of the alternatively inclusive elements. An example described using a list of alternatively inclusive elements includes at least one of the listed elements. However, an example described using a list of alternatively inclusive elements does not exclude other examples that include all of the listed elements. Also, an example described using a list of alternatively inclusive elements does not exclude other examples that include combinations of some of the listed elements. As used herein, "and / or" in reference to a list forms a list of elements that may be included singly or in any combination. For example, an example described as including A, B, C, and / or D is an example that may include A only, A and B, A, B and C, A, B, C and D, etc. The boundaries of an "and / or" list are defined by the complete set of combinations and permutations of the list.

[0046] Where multiple particular elements are shown in a figure and it is clear that the element is duplicated throughout the figures, only one label may be provided for that element, even though multiple instances of that element are present in the figures. Thus, other instances in the figures of an element having the same or similar structure and / or function may not be redundantly labeled. One of ordinary skill in the art will recognize redundant and / or duplicated elements in the same figure based on the disclosure herein. Nevertheless, redundant labeling may be included where it helps to clarify the structure of the illustrated example.

[0047] Applicant reserves the right to file claims directed to combinations and subcombinations of the disclosed examples that are believed to be new and unobvious. Examples embodied in other combinations and subcombinations of features, functions, elements, and / or properties may be claimed through amendment of those claims or the presentation of new claims in this or a related application. Such amended or new claims, whether directed to the same or different examples and whether different, broader, narrower, or equal in scope to the original claims, should be considered within the scope of the example subject matter described herein.

Claims

1. A cooling housing, a containment area configured to receive a heat source; a heat exchanger coupled to the cooling housing, a heat exchanger configured to transfer heat from the containment area to an environment surrounding the cooling housing; a first fluid, located within the storage area, surrounding a first portion of the heat source; a first fluid that is a two-phase liquid; a second fluid, located within the storage area, surrounding a second portion of the heat source; It is a single-phase liquid, a second fluid, the first fluid being separated from the second fluid; and a third fluid, located within the storage area, surrounding a third portion of the heat source; It is liquid, a third fluid, wherein the first fluid, the second fluid, and the third fluid are separated; and A gas, positioned in thermal contact with a portion of the third fluid; a gas located in a fourth portion of the heat source; 12. A device comprising: a cooling housing comprising:

2. the first fluid has a higher density than the second fluid; the second fluid has a higher density than the third fluid; The device of claim 1 , wherein the third fluid has a density greater than that of the gas.

3. the first fluid is a dielectric fluid; the second fluid is a dielectric fluid; the third fluid is a non-dielectric fluid; The device of claim 1 , wherein the gas is an inert gas.

4. the first fluid surrounds the hottest portion of the heat source; The device of claim 1 , wherein the second fluid surrounds a second hottest portion of the heat source.

5. The device of claim 1 , wherein the second portion of the heat source surrounded by the second fluid is configured to be cooled by a second heat exchanger.

6. The heat exchanger is A condenser; a plate configured to condense a gas; The device of claim 1 further comprising:

7. The heat exchanger is configured to be removable from the cooling housing; The device of claim 6 , wherein the third fluid is configured to be removed with the heat exchanger.

8. The heat exchanger is It is a heat pump, The device of claim 1 located within the storage area.

9. placing a heat source in a containment area within a cooling housing; the storage area configured to receive the heat source; coupling a heat exchanger to the cooling housing, the heat exchanger configured to transfer heat from the containment area to an environment surrounding the cooling housing; Positioning a first fluid within the containment area, the first fluid surrounds a first portion of the heat source; the first fluid comprising a two-phase liquid; Positioning a second fluid within the containment area, the second fluid surrounds a second portion of the heat source; the second fluid comprising a single-phase liquid; Positioning a gas within the containment area, the gas being in thermal contact with the second fluid and a portion of the heat exchanger; A method comprising: The first fluid is Receives heat, boils to form gas particles, moving upwardly through the second fluid and the gas; contacting the heat exchanger; Heat is absorbed by the heat exchanger, condenses into a liquid, moving downwardly through the gas and the second fluid; Returning to the first portion of the heat source within the storage area A method configured to:

10. a third fluid positioned between the second fluid and the gas, A third fluid, which is a non-dielectric liquid.

10. The method of claim 9 further comprising:

11. the heat exchanger is located outside the cooling housing; The method of claim 9 , wherein heat is transferred to the heat exchanger through a condenser coil coupled to a cooling device.

12. 10. The method of claim 9, wherein the second fluid is allowed to enter and exit the containment area, thereby allowing a user to access the heat source without losing gas or the first fluid.

13. 10. The method of claim 9, wherein the second fluid can be maintained at a temperature to provide a constant boiling point of the first fluid at an interface between the first and second fluids.

14. 10. The method of claim 9, wherein the second fluid is cooled by a second heat exchanger to reduce the temperature of the second fluid and delay boiling of the first fluid.

15. a third fluid positioned between the second fluid and the gas, It is a single-phase fluid, The method of claim 14 further comprising a third fluid having a density lower than the second fluid and higher than the gas.

16. A cooling housing, a containment area configured to receive a heat source; a heat exchanger coupled to the cooling housing, a heat exchanger configured to transfer heat from the containment area to an environment surrounding the cooling housing; a first fluid, located within the storage area, a first fluid surrounding a first portion of the heat source; a second fluid, located within the storage area, surrounding a second portion of the heat source; a second fluid, wherein the first fluid and the second fluid are separated; and A gas, a portion of the second fluid; and positioned in thermal contact with a portion of the heat exchanger; a gas located in a fourth portion of the heat source; 12. A system comprising: a cooling housing comprising:

17. the first fluid is a two-phase liquid; the second fluid is a single-phase liquid; The system of claim 16 , wherein the gas is air.

18. a second heat exchanger positioned within the second fluid, Supply lines and A condenser coil; Heat pump and 17. The system of claim 16, further comprising a second heat exchanger comprising:

19. the heat exchanger is located outside the cooling housing; The system of claim 16 , wherein the heat exchanger is positioned in a removable compartment.

20. the first fluid has a higher density than the second fluid; The system of claim 16 , wherein the first portion of the heat source produces more heat than the second portion of the heat source.

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