Substrate transport device and substrate transport method

Abstract

A substrate transfer device according to one or more embodiments includes a base 101, an elevator unit 111 connected to the base 101 so as to be able to move up and down, hand units 120 and 130 movably connected to the elevator unit 111 and configured to acquire the substrate 101, and a disk 140 provided at a position where the hand units 120 and 130 can move the substrate 101. The hand units 120 and 130 include an arm 120 rotatably connected to the elevator unit 111, and a hand 130 movably connected to the arm 120 and configured to acquire the substrate 101.

Description

[Technical Field]

[0001] The present disclosure relates to semiconductor manufacturing equipment, and more particularly to a substrate transfer apparatus and a substrate transfer method for transferring substrates including semiconductor wafers and liquid crystal substrates. [Background technology]

[0002] The manufacturing of semiconductor devices and liquid crystal devices involves the use of multiple manufacturing devices, including devices for performing processes such as element formation on substrates and substrate inspection devices. Substrate transport devices are used to transport semiconductor wafers and liquid crystal substrates between these manufacturing devices. Substrate transport devices include industrial robots, and industrial robots used in clean rooms where semiconductor manufacturing devices are installed are called clean robots. The clean robot removes substrates from a front-opening unified pod (FOUP) containing multiple substrates and transports them to a predetermined position in a substrate storage unit included in the manufacturing device for the next process. During this transport, the substrate may be photographed with an imaging device such as a camera to determine its position and orientation. The substrate transport device adjusts the position and orientation of the substrate based on the image from the imaging device and transports it to the semiconductor manufacturing device for the next process.

[0003] Japanese Patent Publication JP-H10-329064 (Iwata) discloses a technology for transporting a liquid crystal glass substrate using an industrial robot and recognizing the position of the liquid crystal glass substrate in a non-contact manner using multiple corresponding cameras. In this document, Iwata discloses an industrial robot that transports the liquid crystal glass substrate and places it in a predetermined position on a substrate holder, an upper illuminator and multiple fixed cameras for the substrate holder that are installed above the substrate holder at a mark recognition location that recognizes a positioning mark on the substrate holder, multiple fixed cameras for the liquid crystal glass substrate that are installed above the liquid crystal glass substrate at a position recognition location that recognizes the position of the liquid crystal glass substrate and a lower illuminator that is installed below the liquid crystal glass substrate, and a control device that commands the industrial robot to recognize the gripping position of the liquid crystal glass substrate while the industrial robot is gripping the liquid crystal glass substrate and commands the industrial robot to perform an operation to correct a difference between the gripping position recognition result and the position of the positioning mark recognized by the substrate holder. Summary of the Invention [Means for solving the problem]

[0004] A substrate transport device according to one or more embodiments may include a base, a lifting unit connected to the base so as to be freely raised and lowered, a hand unit connected to the lifting unit so as to be freely moved and to acquire a substrate, and a disk positioned so that the hand unit can move the substrate.

[0005] A substrate transport method according to one or more embodiments may include removing a substrate, transporting the removed substrate onto a disk, capturing an image of the substrate with a camera, calculating the position of the substrate based on the captured image, and placing the substrate based on the calculated correction amount. [Brief explanation of the drawings]

[0006] [Figure 1] FIG. 1 is a perspective view of a substrate transport apparatus according to one or more embodiments; [Figure 2]FIG. 2A is a top view of a disk according to one or more embodiments, and FIG. 2B is a cross-sectional view of the disk shown in FIG. 2A along line AA, for example. [Figure 3] FIG. 3A is a top view of a disk according to one or more embodiments, and FIG. 3B is a cross-sectional view of the disk shown in FIG. 3A taken along the line BB; [Figure 4] FIG. 4 is a flowchart illustrating the operation of a substrate transport apparatus according to one or more embodiments; [Figure 5] FIG. 5 is a perspective view of a substrate transport apparatus according to one or more embodiments; [Figure 6] FIG. 6 is a perspective view illustrating a state in which the removed substrate is transported onto a disk provided in the substrate transport device; [Figure 7] FIG. 7 is a top view illustrating a state in which the removed substrate is transported onto a disk provided in the substrate transport device; [Figure 8] FIG. 8 is a perspective view of a substrate transport apparatus according to one or more embodiments; [Figure 9] FIG. 9 is a perspective view of a substrate transport apparatus according to one or more embodiments; [Figure 10] FIG. 10 is a perspective view of a substrate transport apparatus according to one or more embodiments; [Figure 11] FIG. 11 is a perspective view of a substrate transport apparatus according to one or more embodiments. DETAILED DESCRIPTION OF THE INVENTION

[0007] A substrate transport device according to one or more embodiments will be described in detail with reference to the drawings. In the drawings, identical or similar parts may be designated by identical or similar reference numerals. The drawings are schematic, and the relationship between thickness and dimensions, and the ratios of length and thickness of each part, are merely examples and do not limit the technical concept of the present invention. Dimensional relationships and ratios may vary between drawings. In the following description, when describing the positional relationship of each component, terms such as "upper," "lower," "right side," and "left side" are used appropriately based on the orientation of the referenced drawings. However, these terms do not limit the technical concept of the invention. Terms such as "upper," "lower," "right side," and "left side" may also be used even when parts are not touching. The terms "X-axis," "Y-axis," and "Z-axis" may be used in the specification or drawings to describe directions, and the terms "XY plane," "YZ plane," and "ZX plane" may be used in the specification or drawings to describe planes corresponding to the "X-axis," "Y-axis," and "Z-axis" in the drawings. "Longitudinal direction" may refer to the direction of the long side of the main surface of a member, or the X direction or the direction opposite to the X direction in the drawings. The "width direction" may refer to the direction of the short side of the main surface of a member, and may refer to the Y direction or the direction opposite to the Y direction in the drawing. The "height direction" or "up-down direction" may refer to the Z direction or the direction opposite to the Z direction in the drawing.

[0008] FIG. 1 is a perspective view showing a substrate transfer apparatus 100 according to one or more embodiments. The substrate transfer apparatus 100 of FIG. 1 particularly shows a horizontal articulated clean robot. The substrate transfer apparatus 100 includes a base 101 and a hand unit including an arm 120 and a hand 130. The base 101 supports a lifting / lowering unit 111. The lifting / lowering movement of the base 101 is controlled by a controller 200 that controls the substrate transfer apparatus 100. The base 101 may be fixed to the floor on which the substrate transfer apparatus 100 is installed, or may be fixed to another semiconductor manufacturing facility. The lifting / lowering unit 111 raises and lowers the arm 120 in the Z-axis direction. The arm 120 is rotatably attached to the lifting / lowering unit 111. The lifting / lowering unit 111 may be cylindrical or rectangular.

[0009] Arm 120 is attached so as to be movable up and down by elevator unit 111. Arm 120 is attached so as to be rotatable relative to elevator unit 111. Arm 120 may be a horizontally articulated arm. Arm 120 includes a first arm 121 and a second arm 122.

[0010] The first arm 121 is attached between the lifting unit 111 and the second arm 122. A first end of the first arm 122 is provided so as to be movable up and down in the Z direction shown by the lifting unit 111. The first arm 121 is attached so as to be rotatable in the XY plane shown in the figure, with the lifting unit 111 as the center. The second arm 122 is rotatably attached to a second end of the first arm 121. The rotation axis of the arm 120 may be located approximately in the center of the cross section of the lifting unit 111 in the XY plane.

[0011] The second arm 122 is attached between the first arm 121 and the hand 130. A first end of the second arm 122 is attached to the first arm 121 so as to be rotatable on the XY plane shown in the figure. The hand 130 is attached to a second end of the second arm 122 so as to be rotatable.

[0012] The hand 130 includes a wrist 131 and a fork 132, and is rotatably attached to the second arm 122 via the wrist 131. The wrist 131 is attached to a second end of the second arm 122 so as to be rotatable on the XY plane shown in the figure. The hand 130 uses the fork 132 to acquire a substrate W from a front opening unified pod (FOUP) on which a plurality of substrates such as wafers are loaded. The hand 130 then transports the acquired substrate W to a predetermined position in a substrate storage unit included in the manufacturing equipment.

[0013] 1 is a vacuum hand type, and the fork 132 of the hand 130 has a branched structure with a suction portion at the tip. The fork 132 transports the substrate W by sucking the surface of the substrate W with negative pressure. The suction type hand includes, for example, a Bernoulli chuck.

[0014] The hand 130 is not limited to a vacuum hand type, but may be a passive grip type or an edge grip type. A passive grip type hand is a grip that does not fix the substrate placed on the hand, and may not have a pressing member. An edge grip type hand has an edge guide provided at each of the branched tips of the fork. A pressing member is provided near the wrist. The pressing member can be slid along the surface of the hand by an actuator including an air cylinder. By sliding the pressing member with the substrate placed on the fork, the substrate is sandwiched and held between the edge guide and the pressing member. In either configuration, the hand 130 has a configuration for supporting the substrate W and transporting the substrate W.

[0015] The lifting unit 111, the first arm 121, the second arm 122, and the hand 130 may each be driven by a controller 200. The lifting unit 111, the first arm 121, the second arm 122, and the hand 130 may each be driven by an actuator (not shown). The actuator (not shown) may include, for example, an electric motor. Encoders (not shown) that detect the rotational positions of the first arm 121, the second arm 122, and the hand 130 may be attached to arm joints located between the lifting unit 111 and the first arm 121, between the first arm 121 and the second arm 122, and between the second arm 122 and the hand 130. The substrate transport apparatus 100 may also be provided with an encoder (not shown) that detects a change in the position of the first arm 121 in the height direction, for example, the amount of lift of the first arm 121 of the lifting unit 111. In this manner, the substrate W is transported by controlling the joints of the arm 120 and the hand 130.

[0016] The controller 200 is connected to the base 101 and performs various controls, including arm position control, of the substrate transport apparatus 100. The controller 200 controls the operation of actuators that drive the lifting unit 111, the first arm 121, the second arm 122, and the hand 130. These actuators may be controlled based on position information, including the rotational position or height position of the first arm 121, the second arm 122, or the hand 130, detected by an encoder (not shown). Although the controller 200 is housed in a separate housing from the base 101, the controller 200 and the base 101 may be housed in a single housing. Furthermore, the controller 200 only needs to be able to perform various controls of the substrate transport apparatus 100, and can be connected to the substrate transport apparatus 100 via a wired or wireless connection to perform the controls. The controller 200 does not need to be located near the substrate transport apparatus 100; for example, it can be connected via the Internet to perform various controls of the substrate transport apparatus 100.

[0017] The controller 200 may be, for example, a computer including a CPU (Central Processing Unit), which reads a computer program stored in a recording medium and performs various controls of the substrate transport apparatus 100. The recording medium may be a non-transitory computer-readable storage medium, such as a read-only memory (ROM), tape, disk, card, semiconductor memory, or programmable logic circuit. The computer may further include a random access memory (RAM) for loading the program. The program may be supplied to the computer via any transmission medium capable of transmitting the program (such as a communication network or broadcast waves). The program may also be realized in the form of a data signal embedded in a carrier wave, embodied by electronic transmission.

[0018] The substrate transfer device 100 includes a disk 140. The disk 140 is provided above the first end of the second arm 122. The disk 140 may be provided at a predetermined distance from the rotation axis (not shown) of the hand 130 in consideration of the handling of the hand 130. The hand 130 takes out the substrate W and moves the substrate W above the disk 140. After taking out the substrate W, the hand 130 rotates and moves on the illustrated XY plane and moves substantially parallel to the second arm 122. When the substrate W is moved onto the first end of the second arm 122, the disk 140 is positioned so that it is substantially below the substrate W in the illustrated Z-axis direction. The disk 140 shown in FIG. 1 has a circular shape, but this is not limiting and may be implemented. The shape and dimensions of the disk 140 may be determined in consideration of the shape and dimensions of the substrate W to be transferred and the environment in which the substrate transfer device 100 is installed. For example, the shape and dimensions of the disk 140 may be substantially the same as the shape and dimensions of the substrate W to be transferred. If the substrate W has a substantially circular shape, the disk 140 may also be substantially circular. The disk's diameter may be 50 mm to 500 mm, or 200 mm to 400 mm. Depending on the size of the substrate, a disk diameter of 500 mm or more may be possible. For example, if the substrate W is 300 mm, the disk may be 300 mm or more. The substrate transfer apparatus 100 of FIG. 1 includes a two-link arm having two arms, but this is not limited thereto. The number of arms may be one, three, four, or more. The disk may be provided at the end of an arm to which a hand is not connected. In the case of multiple arms, the disk may be located at the end of an arm connected to a hand, opposite the end connected to the hand in the arm's length direction. In other words, in the case of multiple arms, the disk may be located at the end of an arm connected to a hand, not connected to the hand. The disk may also be provided on an arm to which a hand is not connected. For example, in the substrate transfer apparatus 100 shown in FIG. 1, the disk 140 may be provided on the first arm 121. For example, the disk 140 may be provided near the first end of the first arm 121 .

[0019] 2A and 2B are diagrams illustrating a disc according to one or more embodiments. Disc 141 shown in FIG. 2A has multiple lights 143 provided inside disc 141. The multiple lights 143 are provided on the surface of disc 141. The multiple lights 143 may be any type that emits light, such as light-emitted diodes (LEDs) or fluorescent lamps. FIG. 2B is a cross-sectional view of disc 141 taken along line AA. Disc 141 has multiple lights 143 provided on disc body 145. A cover 147 is provided to cover the multiple lights 143. Cover 147 is a transparent or translucent material that transmits or partially transmits light from the lights 143. This allows light from the multiple lights 143 to be emitted outside disc 141. In the embodiment of FIG. 2A, multiple lights 143 that are smaller than disc 141 are provided. However, this is not limited thereto; lights approximately the same size as disc 141 may be provided inside disc body 145. This allows a uniform amount of light to be obtained. Furthermore, the disc 141 is provided with a transparent or semi-transparent cover 147, but this is not limiting. For example, the light may be exposed to the outside without providing a cover.

[0020] 3A and 3B are diagrams illustrating a disk 142 according to one or more embodiments. The disk 142 illustrated in FIG. 3A includes multiple lights 143 disposed inside the disk 142. The multiple lights 143 are disposed on the surface of the disk 142 and arranged along the outer periphery of the disk 142. The multiple lights 143 may be light-emitting devices, such as light-emitted diodes (LEDs) or fluorescent lamps. FIG. 3B is a cross-sectional view of the disk 142 taken along the line B-B. The disk 142 includes multiple lights 143 disposed on the outer periphery of a disk body 148. A cover 149 is provided to cover the multiple lights 143. The cover 149 is a transparent or translucent material that transmits or partially transmits light from the lights 143. This allows light from the multiple lights 143 to be emitted outside the disk 142. In the embodiment illustrated in FIG. 3A, multiple lights 143 smaller than the disk 142 are provided. However, this is not limited to this. Lights approximately the same size as the disk 142 may be disposed on the inner periphery of the disk body 148. This allows a uniform amount of light to be obtained on the outer periphery of the disk 142. Furthermore, the disk 142 is provided with a transparent or semi-transparent cover 149, but this is not limiting, and for example, the light may be exposed to the outside without a cover.

[0021] Here, the light 143 may be configured to be on / off controlled. That is, the light 143 may be turned on only when the substrate W is moved onto the disk 140 and an image is captured by a camera (not shown), and may be turned off when the image is captured by the camera. This not only reduces power consumption but may also mitigate possible substrate deterioration caused by the light 143. The light intensity of the light 143 may also be adjustable. This allows the camera to capture clear images regardless of the environment of the substrate transport device 100. The color temperature of the light 143 may be approximately 2600K to 7100K. Amber, warm white, warm white, white, daylight, or other colors may be selected depending on the environment of the substrate transport device and the characteristics of the substrate being used.

[0022] Next, the operation of the substrate transfer apparatus 100 will be described with reference to the drawings. FIG. 4 is a flowchart showing the operation of the substrate transfer apparatus 100 according to one or more embodiments. The substrate transfer apparatus 100 first removes a substrate from a FOUP or the like (step S101). The substrate W is removed using a fork 132 provided on a hand 130 of the substrate transfer apparatus 100. Next, the removed substrate W is transported onto a disk 140 provided on the substrate transfer apparatus 100 (step S102). The disk 140 is provided on an arm 120 of the substrate transfer apparatus 100. The hand 130 that removed the substrate W is rotated, and the substrate W is moved onto the disk 140 provided on the arm 120 of the substrate transfer apparatus 100. Next, an image of the substrate W is captured by a camera (not shown) (step S105). When capturing an image, a light (not shown) provided on the disk 140 is turned on and illuminates the substrate W. This allows a clearer image to be obtained. The light (not shown) may be turned on only when capturing an image of the substrate W and turned off at other times. This reduces power consumption and may extend the life of the light (not shown). It also reduces possible degradation of the substrate W due to light. The camera (not shown) may capture either still or video images. The objects detected by the camera (not shown) include the position of the substrate W, its orientation, detection of defective substrates W, and type recognition of the substrate W. Next, the position of the substrate W is calculated based on the captured image (step S107). To calculate the position of the substrate W, for example, the positions of the notch and orientation flat of the substrate W are acquired from the captured image, and a correction amount for the position of the substrate W is calculated based on the position and orientation of the substrate W relative to the position and orientation of the fork 132. For details on measuring and correcting the positional misalignment of the substrate W, see U.S. Patent Publication No. 2021 / 0257242. Next, the substrate W is placed in the manufacturing equipment for the next process based on the calculated correction amount (step S109).

[0023] Thus, according to one or more embodiments of the substrate transfer device 100, when acquiring an image of the substrate to be used for substrate position correction, the substrate is transferred onto a disk having a light that illuminates the substrate. Because the disk is mounted on the arm of the substrate transfer device, the distance the disk travels can be shortened, thereby reducing the time it takes to move the disk. Furthermore, because the image is captured above the arm, detection of the position and orientation of the substrate is improved.

[0024] FIG. 5 is a perspective view showing a substrate transfer apparatus 300 according to one or more embodiments. The substrate transfer apparatus 300 in FIG. 5 particularly illustrates a horizontal articulated clean robot. The substrate transfer apparatus 300 includes a base 301 and a hand unit including an arm 320 and a hand 330. The substrate transfer apparatus 300 may have a lifting unit. The arm 320 may be connected to the lifting unit so that it can be raised and lowered in the Z-axis direction shown in the figure. The base 301 may be connected to a controller (not shown) that controls the substrate transfer apparatus 300. The base 301 may be fixed to the floor on which the substrate transfer apparatus 300 is installed, or may be fixed to another semiconductor manufacturing facility. The lifting unit (not shown) raises and lowers the arm 320 to move it in the Z-axis direction. The arm 320 is rotatably attached to the lifting unit (not shown). Here, if movement of the substrate W in the Z-axis direction shown in the figure is not required, the lifting unit (not shown) is not necessary.

[0025] The arm 320 is attached so as to be movable up and down by an elevator unit (not shown). The elevator unit (not shown) is attached to the arm 320 so as to be rotatable on the XY plane shown in the figure. The arm 320 may be a horizontally articulated arm. The arm 320 includes a first arm 321 and a second arm 322.

[0026] The hand 330 is rotatably attached to the second arm 322 via a wrist 331. The wrist 331 is attached to the second end of the second arm 322 so as to be rotatable in the XY plane shown in the figure. The hand 330 removes a substrate W, such as a wafer, from a FOUP (Front Opening Unified Pod) containing multiple substrates and transports it to a predetermined position in a substrate storage unit included in the manufacturing equipment. The hand 330 includes suction units 333A and 333B that suck the substrate W. The substrate W is sucked by the suction units onto a fork 332, and the hand 330 has a vacuum hand that moves the substrate. The vacuum hand can reduce the blocking of light from the disk 340 compared to an edge grip hand. To reduce this blocking of light, a light (not shown) may be provided on the fork 332 of the hand 330. When light is irradiated onto the substrate W using the disk 340 as a backlight, the fork blocks the light. A light 333 is provided on the fork 332, and the light irradiates the substrate. This allows the light from the lamp to compensate for the light from the disc 340 even if the fork blocks the light.

[0027] The disk 340 is provided on the top of the first end of the second arm 322. The disk 340 may be, for example, the disk shown in Figures 2A, 2B, 3A, and 3B.

[0028] Next, the operation of the substrate transfer device 300 will be described in detail with reference to the drawings. As shown in Fig. 5, the substrate transfer device 300 first removes the substrate W from a FOUP (not shown) or the like. When removing the substrate W, the substrate transfer device 300 controls the position of the hand 330, moves it to a predetermined position in the FOUP (not shown), and removes the substrate. Next, the removed substrate W is transferred onto a disk 340 provided on the substrate transfer device 300.

[0029] FIG. 6 is a perspective view illustrating the state in which the removed substrate W has been transferred onto the disk 340 provided on the substrate transfer device 300. The hand 330 rotates in the XY plane to move the substrate W onto the disk 340. As shown in the figure, the disk 340 is positioned substantially above the substrate W. Next, the substrate W is imaged using the camera 350. When imaging, a light (not shown) provided on the disk 340 is turned on and illuminates the substrate. This allows for a clearer image to be obtained. The light may be turned on only when imaging the substrate and turned off at other times. This may reduce power consumption and extend the life of the light (not shown). The camera 350 may capture either still images or videos. The camera 350 may detect the position and orientation of the substrate, detect defective substrates, and recognize the type of substrate. Next, the position of the substrate is calculated based on the captured image. To calculate the position of the substrate, for example, the positions of the substrate's notch and orientation flat are obtained from the captured image, and a correction amount for the substrate position is calculated based on the position and orientation of the substrate relative to the position and orientation of the fork. Next, based on the calculated correction amount, the substrate is placed in the substrate storage unit of the manufacturing equipment for the next process. The camera 350 may be positioned in any position that allows it to capture an image of the substrate W. The camera 350 may be located above the movement range of the disk 340. This minimizes disk movement. This minimizes the disk movement time, thereby improving substrate transport throughput.

[0030] FIG. 7 is a top view illustrating a state in which the removed substrate W has been transported onto a disk 340 provided on the substrate transport device 300. The example of FIG. 6 shows an example in which the hand 330 and the second arm 322 overlap, and the substrate W has been moved onto the upper surface of the disk 340. The example of FIG. 7 shows an example in which the hand 330, the second arm 322, and the first arm 321 overlap, and the substrate W has been moved onto the upper surface of the disk 340. For example, the hand 330 rotates in the XY plane to move the substrate W onto the disk 340. Then, the second arm 322 moves onto the first arm 321. As shown in the figure, the disk 340 is positioned approximately above the substrate W. If the light (not shown) of the disk 340 is turned on and the first arm 321, which captures an image of the substrate W with a camera (not shown), is in the same position, the position of the disk 340 in the arrangement shown in FIG. 6 will be the same as the position of the disk 340 in the arrangement shown in FIG. 7. This increases the degree of freedom in arranging the camera, and further allows the camera to be arranged near the substrate transport device 300. This increases the degree of freedom in floor planning.

[0031] According to one or more embodiments of the substrate transport device, by disposing the camera 350 at a predetermined position above the disk 340, it is not necessary to move the substrate W to a station where the camera is installed, for example, to recognize the position and orientation of the substrate W. This reduces the time required to place the substrate W on a hand, recognize its position and orientation, and move it to a predetermined device, thereby maintaining high throughput. Furthermore, since there is no need to provide a station where a camera is installed, this also contributes to space savings. Furthermore, since there is no need to provide a station, the clean room environment can be improved. Furthermore, by providing a disk including lighting on the arm, design flexibility is improved and the camera can be located near the substrate transport device.

[0032] FIG. 8 is a perspective view showing a substrate transfer apparatus 400 according to one or more embodiments. The substrate transfer apparatus 400 in FIG. 8 is a horizontal articulated clean robot, and in particular, shows a portion of a clean robot with a column-type lifting shaft. The substrate transfer apparatus 400 includes a lifting column 401, a lifting unit 411, and a hand unit including an arm 420 and a hand 430. The lifting column 401 supports the lifting unit 411 so that it can move up and down. The lifting unit 411 is controlled to move up and down by a controller (not shown) that controls the substrate transfer apparatus 400. The lifting column 401 may be fixed to the floor on which the substrate transfer apparatus 400 is installed, or may be fixed to another semiconductor manufacturing facility (not shown). The lifting unit 411 raises and lowers the arm 420 in the vertical direction (Z-axis direction) along a groove provided in the lifting column 401. The arm 420 is rotatably attached to the lifting unit 411. Considering the rotation of arm 420, there is a predetermined gap between the rotation axis (not shown) of arm 420 and lifting column 401. Lifting column 401 in Fig. 8 has a rectangular parallelepiped structure with a groove along which lifting unit 411 moves, but is not limited to this. For example, it may have a cylindrical structure with a groove along which lifting unit 411 moves.

[0033] The arm 420 is attached so as to be able to move up and down while the lifting unit 411 moves up and down and moves up and down (in the Z-axis direction). The arm 420 is attached so as to be able to rotate freely on the lifting unit 411. The arm 420 may be a horizontally articulated arm. The arm 420 includes a first arm 421 and a second arm 422. The rotation axis of the arm 420 may be located approximately in the center of the arm 420. This makes it possible to minimize the distance between the arm 420 and the lifting column 401 while avoiding contact with the lifting column 401 due to the rotational movement of the arm 420.

[0034] The first arm 421 is attached between the elevator unit 411 and the second arm 422. A first end of the first arm 421 is provided so as to be movable up and down in the Z direction by the elevator unit 411. The first arm 421 is attached so as to be rotatable on the XY plane shown in the figure. The second arm 422 is attached to a second end of the first arm 421.

[0035] The second arm 422 is attached between the first arm 421 and the hand 430. A first end of the second arm 422 is attached to the first arm 421 so as to be rotatable on the XY plane shown in the figure. The hand 430 is attached to a second end of the second arm 422.

[0036] The hand 430 includes a wrist and a fork, and is attached to the second arm 422 via the wrist so as to be rotatable on the XY plane shown in the figure. The wrist is attached to a second end of the second arm 422 so as to be rotatable on the XY plane shown in the figure. The hand 430 uses the fork to retrieve the substrate W from a FOUP (Front Opening Unified Pod) on which a plurality of substrates such as wafers are loaded. The hand 430 then transports the retrieved substrate W to a predetermined position in a substrate storage unit included in the manufacturing equipment.

[0037] The fork of the hand 430 shown in Fig. 8 may be, for example, an edge grip type having a branched structure as shown in Fig. 5. Furthermore, the hand 430 is not limited to the edge grip type, and may be a passive grip type or a suction type. The hand 430 supports the substrate W and transports the substrate W.

[0038] The operation of each of the lifting unit 411, the first arm 421, the second arm 422, and the hand 430 is controlled by a controller (not shown). Each of the lifting unit 411, the first arm 421, the second arm 422, and the hand 430 may be driven by an actuator (not shown). The actuator (not shown) may include, for example, an electric motor. Encoders (not shown) that detect the rotational positions of the first arm 421, the second arm 422, and the hand 430 may be attached to arm joints located between the lifting unit 411 and the first arm 421, between the first arm 421 and the second arm 422, and between the second arm 422 and the hand 430. The substrate transport device 400 may also be provided with an encoder (not shown) that detects a change in the position of the first arm 421 in the height direction, for example, the amount of lift of the first arm 421 of the lifting unit 411. In this way, the joints of the arm 420 and the hand 430 are controlled to transport the substrate.

[0039] The substrate transfer device 400 includes a disk 440. The disk 440 is provided above the first end of the first arm 421. Taking into consideration the handling of the arm 420 and the hand 430, the disk 440 may be provided at a predetermined distance from the rotation axis (not shown) of the second arm. After removing the substrate W, the hand 430 rotates in the illustrated XY plane around the rotation axis of the second end of the second arm 422, and the first arm 421 rotates in the illustrated XY plane to position the substrate W substantially above the disk 440 in the illustrated Z-axis direction. The disk 440 shown in FIG. 8 has a circular shape, but this is not a limitation and is also practicable. The shape and dimensions of the disk 440 may be similar to those of the above-described embodiment. Furthermore, the substrate transfer device 400 in FIG. 8 includes a two-link arm having two arms, but this is not a limitation and the number of arms may be one, three, four, or more. The disk may be provided at the end of the arm to which the hand is not connected. In the case of multiple arms, the disk may be placed on an arm connected to the hand, at an end of the arm opposite the end connected to the hand in the longitudinal direction of the arm. In other words, in the case of multiple arms, the disk may be placed on an arm connected to the hand, at an end not connected to the hand. The disk may also be provided on the lifting unit.

[0040] Next, the operation of the substrate transfer device 400 will be described. The substrate transfer device 400 may operate as shown in the flowchart of FIG. 4. That is, the substrate transfer device 400 first removes the substrate W from a FOUP or the like (step S101). The substrate W is removed using a fork provided on the hand 430 of the substrate transfer device 400. Next, the removed substrate W is transported onto a disk 440 provided on the substrate transfer device 400 (step S102). The disk 440 is provided on the first arm 421 of the substrate transfer device 400. The hand 430 that removed the substrate W rotates in the illustrated XY plane and moves the substrate W onto the disk 440 provided on the first arm 421. Next, an image of the substrate W is captured by a camera (not shown) (step S105). When capturing an image, a light (not shown) provided on the disk 440 may be turned on and illuminated onto the substrate W. The light and camera provided on the disk 440 may be the same as those in the above-described embodiment. Next, the position of the substrate W is calculated based on the captured image (step S107). To calculate the substrate position, for example, the positions of the notch and orientation flat of the substrate W are obtained from the captured image, and a correction amount for the substrate position is calculated based on the position and orientation of the substrate W relative to the position and orientation of the fork. For measurement and correction of positional deviation of the substrate W, U.S. Patent Publication No. 2021 / 0257242 is incorporated by reference. Next, the substrate is placed in the manufacturing equipment for the next process based on the calculated correction amount (step S109).

[0041] Thus, according to the substrate transfer device 400 of one or more embodiments, when acquiring an image of the substrate to be used for position correction of the substrate W, the substrate is transferred onto a disk having a light that illuminates the substrate. Because the disk is mounted on the arm of the substrate transfer device, the distance the disk travels can be shortened, and the time it takes to move the disk can also be reduced. Furthermore, because the imaging location is on the upper part of the arm, detection of the position and orientation of the substrate is improved.

[0042] FIG. 9 is a perspective view showing a substrate transfer apparatus 500 according to one or more embodiments. The substrate transfer apparatus 500 in FIG. 9 is a horizontal articulated clean robot, and in particular, shows a portion of a clean robot with a column-type lifting shaft. The substrate transfer apparatus 500 includes a lifting column 501, a lifting unit 511, and a hand unit including an arm 520 and a hand 530. The lifting column 501 supports the lifting unit 511 so that it can move up and down in the Z-axis direction shown in the figure. The lifting unit 511 is controlled to move up and down by a controller (not shown) that controls the substrate transfer apparatus 500. The lifting column 501 may be fixed to the floor on which the substrate transfer apparatus 500 is installed, or may be fixed to another semiconductor manufacturing facility (not shown). The lifting unit 511 raises and lowers the arm 520 in the Z-axis direction shown in the figure, along a groove provided in the lifting column 501. The arm 520 is rotatably attached to the lifting unit 511. 9 has a rectangular parallelepiped structure having a groove along which the lifting unit 511 moves, but is not limited to this. For example, it may have a cylindrical structure having a groove along which the lifting unit 511 moves.

[0043] The arm 520 is attached so as to be able to move up and down while the lifting / lowering unit 511 moves up and down. The arm 520 is attached so as to be able to rotate freely relative to the lifting / lowering unit 511. The arm 520 may be a horizontally articulated arm. The arm 520 includes a first arm 521 and a second arm 522.

[0044] The first arm 521 is attached between the lifting unit 511 and the second arm 522. A first end of the first arm 521 is attached to the lifting unit 511 so as to be rotatable on the XY plane shown in the figure. The second arm 522 is attached to a second end of the first arm 521.

[0045] The second arm 522 is attached between the first arm 521 and the hand 530. A first end of the second arm 522 is attached to a second end of the first arm 521 so as to be rotatable on the XY plane shown in the figure. The hand 530 is attached to the second end of the second arm 522.

[0046] The hand 530 includes a wrist and a fork. The hand 530 is attached to the second end of the second arm 522 via the wrist so as to be rotatable on the XY plane shown in the figure. The hand 530 uses the fork to retrieve the substrate W from a FOUP (Front Opening Unified Pod) on which a plurality of substrates such as wafers are loaded. The hand 530 then transports the retrieved substrate W to a predetermined position in a substrate storage unit included in the manufacturing equipment.

[0047] The fork of the hand 530 shown in Fig. 9 may be, for example, an edge grip type having a branched structure as shown in Fig. 5. Furthermore, the hand 530 is not limited to the edge grip type, and may be a passive grip type or a suction type. The hand 530 supports the substrate W and transports the substrate W.

[0048] The operation of each of the lifting unit 511, the first arm 521, the second arm 522, and the hand 530 is controlled by a controller (not shown). Each of the lifting unit 511, the first arm 521, the second arm 522, and the hand 530 may be driven by an actuator (not shown). The actuator (not shown) may include, for example, an electric motor. Encoders (not shown) that detect the rotational positions of the first arm 521, the second arm 522, and the hand 530 may be attached to arm joints located between the lifting unit 511 and the first arm 521, between the first arm 521 and the second arm 522, and between the second arm 522 and the hand 530. The substrate transport device 500 may also be provided with an encoder (not shown) that detects a change in the position of the first arm 521 in the height direction, for example, the amount of lift of the first arm 521 of the lifting unit 511. In this manner, the joints of the arm 520 and the hand 530 are controlled to transport the substrate.

[0049] The substrate transfer device 500 includes a disk 540. The disk 540 is provided above the elevator unit 511. The disk 540 may be provided at a predetermined distance from the rotation axis of the arm 520, taking into consideration the handling of the arm 520 and the hand 530. The hand 530 takes out the substrate W and moves the substrate W above the disk 540. For example, after taking out the substrate W, the hand 530 rotates and moves on the XY plane shown in the figure and moves substantially parallel to the second arm 522. The second arm 522 rotates and moves on the XY plane shown in the figure and moves substantially parallel to the first arm 521. The first arm 521 rotates and moves on the XY plane shown in the figure and moves substantially parallel to the first arm 521. When the substrate W is moved onto the elevator unit 511, the disk 540 is positioned so as to be substantially below the substrate W in the Z-axis direction shown in the figure. The disk 540 shown in FIG. 9 has a circular shape, but this is not limiting and the embodiment is not limited thereto. The shape and dimensions of the disk 540 may be the same as those of the above-described embodiment. Furthermore, the substrate transfer device 500 of FIG. 9 includes a two-link arm having two arms, but is not limited to this, and the number of arms may be one, three, four, or more. The disk 540 is provided on the lifting unit 511, but is not limited to this. The disk may be provided at the end of an arm to which a hand is not connected. In the case of multiple arms, the disk may be provided at the end of an arm connected to a hand, opposite the end connected to the hand in the arm's length direction. In other words, in the case of multiple arms, the disk may be provided at the end of an arm connected to a hand, not connected to the hand.

[0050] Next, the operation of the substrate transfer apparatus 500 will be described. The operation of the substrate transfer apparatus 500 may be as shown in the flowchart of FIG. 4. That is, the substrate transfer apparatus 500 first removes the substrate W from a FOUP or the like (step S101). The substrate W is removed using a fork provided on the hand 530 of the substrate transfer apparatus 500. Next, the removed substrate W is transported onto a disk 540 provided on the substrate transfer apparatus 500 (step S102). The disk 540 is provided on the lifting / lowering unit 511. The hand 530 that removed the substrate W is rotated to move the substrate W onto the disk 540 provided on the lifting / lowering unit 511 of the substrate transfer apparatus 500. Next, an image of the substrate W is captured by a camera (not shown) (step S105). When capturing the image, a light (not shown) provided on the disk 540 may be turned on and illuminated onto the substrate W. The light and camera provided on the disk 540 may be the same as those in the above-described embodiment. Next, the position of the substrate W is calculated based on the captured image (step S107). To calculate the substrate position, for example, the positions of the notch and orientation flat of the substrate W are obtained from the captured image, and a correction amount for the substrate position is calculated based on the position and orientation of the substrate W relative to the position and orientation of the fork. For measurement and correction of positional deviation of the substrate W, U.S. Patent Publication No. 2021 / 0257242 is incorporated by reference. Next, the substrate is placed in the manufacturing equipment for the next process based on the calculated correction amount (step S109).

[0051] As described above, according to the substrate transfer device 500 of one or more embodiments, when an image of the substrate to be used for position correction of the substrate W is acquired, the substrate is transferred onto a disk having a light that illuminates the substrate. Because the disk is mounted on the arm of the substrate transfer device, the distance the disk moves can be shortened, and the time it takes to move the disk can be reduced. Furthermore, since the imaging location is on the upper part of the arm, detection of the position and orientation of the substrate is improved. Furthermore, by mounting the disk 540 on the lifting unit 511, an unexpected effect is obtained in that the amount of light seen from the substrate W is stabilized.

[0052] FIG. 10 is a perspective view showing a substrate transfer apparatus 600 according to one or more embodiments. The substrate transfer apparatus 600 in FIG. 10 shows a horizontal articulated clean robot, particularly a portion of the clean robot in which the lifting column 601 is a column type and the hand 630 is directly connected to the lifting unit 611. The substrate transfer apparatus 600 includes the lifting column 601, the lifting unit 611, and the hand 630. The lifting column 601 supports the lifting unit 611. The lifting and lowering of the lifting unit 611 is controlled by a controller (not shown) that controls the substrate transfer apparatus 600. The lifting column 601 may be fixed to the floor on which the substrate transfer apparatus 600 is installed or may be fixed to another semiconductor manufacturing facility (not shown). The lifting unit 611 raises and lowers the hand 630 in the vertical direction (Z-axis direction) along a groove provided in the lifting column 601. The hand 630 is attached to the lifting unit 611 so as to be rotatable on the XY plane shown in the figure. The lifting support column 601 in Fig. 10 has a rectangular parallelepiped structure with a groove along which the lifting unit 611 moves, but is not limited to this. For example, it may have a cylindrical structure with a groove along which the lifting unit 611 moves.

[0053] The hand 630 is attached so as to be movable up and down as the lifting section 611 moves up and down. The hand 630 is attached so as to be rotatable relative to the lifting section 611 on the XY plane shown in the drawing.

[0054] The hand 630 includes a wrist and a fork, and is attached to the lifting unit 611 via the wrist so as to be rotatable on the XY plane shown in the figure. The hand 630 uses the fork to obtain a substrate W from a FOUP (Front Opening Unified Pod) on which a plurality of substrates such as wafers are loaded. The hand 630 then transports the obtained substrate W to a predetermined position in a substrate storage unit included in the manufacturing equipment.

[0055] The fork of the hand 630 shown in Fig. 10 may be, for example, an edge grip type having a branched structure as shown in Fig. 5. Furthermore, the hand 630 is not limited to the edge grip type, and may be a passive grip type or a suction type. The hand 630 supports the substrate W and transports the substrate W.

[0056] The operation of each of the lifting unit 611 and the hand 630 is controlled by a controller. Each of the lifting unit 611 and the hand 630 may be driven by an actuator (not shown). The actuator (not shown) may include, for example, an electric motor. An encoder (not shown) that detects the rotational position of the hand 630 may be attached to an arm joint located between the lifting unit 611 and the hand 630. The substrate transport device 600 may also be provided with an encoder (not shown) that detects a change in the position of the hand 630 in the height direction, for example, the amount of lift of the hand 630 of the lifting unit 611. In this manner, the joint of the hand 630 is controlled to transport the substrate.

[0057] The substrate transfer device 600 includes a disk 640. The disk 640 is provided above the elevator unit 611. The disk 640 may be provided at a predetermined distance from a hand rotation axis (not shown) in consideration of the handling of the hand 630. The hand 630 takes out the substrate W and moves the substrate W above the disk 640. For example, after taking out the substrate W, the hand 630 rotates and moves on the illustrated XY plane and moves substantially parallel to the top of the elevator unit 611. When the substrate W is moved onto the elevator unit 611, the disk 640 is positioned so that it is substantially below the substrate W in the illustrated Z-axis direction. The shape of the disk 640 shown in FIG. 10 is circular, but is not limited to this and other shapes are possible. The shape and dimensions of the disk 640 may be the same as those of the above-described embodiment.

[0058] Next, the operation of the substrate transfer device 600 will be described. The operation of the substrate transfer device 600 may be as shown in the flowchart of FIG. 4. That is, the substrate transfer device 600 first removes the substrate W from a FOUP or the like (step S101). The substrate W is removed using a fork provided on the hand 630 of the substrate transfer device 600. Next, the removed substrate W is transported onto a disk 640 provided on the substrate transfer device 600 (step S102). The disk 640 is provided on the lifting / lowering unit 611. The hand 630 that removed the substrate W is rotated to move the substrate W onto the disk 640 provided on the lifting / lowering unit 611 of the substrate transfer device 600. Next, an image of the substrate W is captured by a camera (not shown) (step S105). When capturing the image, a light (not shown) provided on the disk 640 may be turned on and illuminated onto the substrate W. The light and camera provided on the disk 640 may be the same as those in the above-described embodiment. Next, the position of the substrate W is calculated based on the captured image (step S107). To calculate the substrate position, for example, the positions of the notch and orientation flat of the substrate W are obtained from the captured image, and a correction amount for the substrate position is calculated based on the position and orientation of the substrate W relative to the position and orientation of the fork. For measurement and correction of positional deviation of the substrate W, see US Patent Publication 2021 / 0257242 by reference. Next, the substrate is placed in the manufacturing equipment for the next process based on the calculated correction amount (step S109).

[0059] As described above, according to one or more embodiments of the substrate transport device 600, when acquiring an image of the substrate to be used for position correction of the substrate W, the substrate is transported onto a disk having a light that illuminates the substrate. Because the disk is provided on the substrate transport device 600, the distance the disk moves can be shortened, thereby reducing the time it takes to move the disk. Furthermore, since the imaging location is on the upper part of the arm, detection of the position and orientation of the substrate is improved. Furthermore, providing the disk 640 on the lifting unit 611 has the unexpected effect of stabilizing the amount of light seen from the substrate W. Examples of the structure and operation of the embodiment shown in FIG. 10 are incorporated by reference in US8746631 and US10083851.

[0060] FIG. 11 is a perspective view illustrating a substrate transfer apparatus 700 according to one or more embodiments. The substrate transfer apparatus 700 in FIG. 11 illustrates a horizontal articulated clean robot, specifically a portion of the clean robot in which the lifting column 701 is a column-type column and the hand 730 is directly connected to a first lifting unit 711. This substrate transfer apparatus 700 is similar to the substrate transfer apparatus 600 illustrated in FIG. 10 , but differs in that a disk 740 is held by a disk holder 712. The disk holder 712 is connected to a groove in the lifting column 701, and the disk 740 is positioned at a predetermined distance from the lifting column 701. The disk holder 712 is positioned lower than the first lifting unit 711, but is not limited thereto. The disk holder 712 may also be positioned higher than the first lifting unit 711. The disk holder 712 is also positioned near the first lifting unit 711. The disc holding section 712 may be configured to move up and down in the Z-axis direction in the drawing in conjunction with the movement of the first lifting section 711.

[0061] The operation of the first lifting unit 711 and the hand 730 is controlled by a controller (not shown). The first lifting unit 711 and the hand 730 may be driven by an actuator (not shown). The actuator (not shown) may include, for example, an electric motor. An encoder (not shown) that detects the rotational position of the hand 730 may be attached to an arm joint located between the lifting unit 711 and the hand 730. The substrate transport device 700 may also be provided with an encoder (not shown) that detects a change in the position of the hand 730 in the height direction, for example, the amount of lift of the hand 730 of the lifting unit 711. In this manner, the joint of the hand 730 is controlled to transport the substrate. The disk holder 712 may be fixed to the lifting column 701, and its operation may be controlled by a controller (not shown). The disk holder 712 may also be driven by an actuator (not shown). The substrate transfer device 700 may also be provided with an encoder (not shown) that detects a change in the position of the disk holder 712 in the height direction, for example, the amount of elevation of the disk 740 on the disk holder 712.

[0062] The substrate transfer device 700 includes a disk 740. The disk 740 is provided on a disk holding unit 712. The disk 740 may be positioned taking into consideration the position of the substrate W held by the hand 730. The hand 730 takes out the substrate W and moves the substrate W above the disk 740. For example, after taking out the substrate W, the hand 730 rotates on the illustrated XY plane to move the substrate W above the Z axis of the disk 740. The lifting unit 711 moves, for example, downward in the illustrated Z axis direction to position the substrate W approximately directly above the disk 740. As a result, the disk 740 is positioned approximately below the substrate W. The shape of the disk 740 shown in FIG. 11 is circular, but is not limited to this and may be implemented. The shape and dimensions of the disk 740 may be the same as those of the above-described embodiment.

[0063] Next, the operation of the substrate transfer device 700 will be described. The substrate transfer device 700 may operate as shown in the flowchart of FIG. 4. That is, the substrate transfer device 700 first removes the substrate W from a FOUP or the like (step S101). The substrate W is removed using a fork provided on the hand 730 of the substrate transfer device 700. Next, the removed substrate W is transported onto a disk 740 provided on the substrate transfer device 700 (step S102). The disk 740 is provided on the disk holding unit 712. The hand 730 that removed the substrate W is moved to move the substrate W onto the disk 740 provided on the disk holding unit 712 of the substrate transfer device 700. Here, when the removed substrate W is transported onto the disk 740 provided on the substrate transfer device 700, the lifting unit 711 may move the substrate W above the disk holding unit 712, or the disk holding unit 712 may move the disk 740 below the substrate W. Next, an image of the substrate W is captured by a camera (not shown) (step S105). When capturing an image, a light (not shown) provided on the disk 740 may be turned on and illuminate the substrate W. The light and camera provided on the disk 740 may be similar to those in the above-described embodiment. Next, the position of the substrate W is calculated based on the captured image (step S107). To calculate the substrate position, for example, the positions of the notch and orientation flat of the substrate W are obtained from the captured image, and a correction amount for the substrate position is calculated based on the position and orientation of the substrate W relative to the position and orientation of the fork. For measurement and correction of the positional deviation of the substrate W, see US Patent Publication No. 2021 / 0257242 by reference. Next, the substrate is placed in the manufacturing equipment for the next process based on the calculated correction amount (step S109).

[0064] As described above, according to the substrate transport apparatus 700 of one or more embodiments, when an image of the substrate to be used for position correction of the substrate W is acquired, the substrate is transported onto the disk 740 having a light for illuminating the substrate. Because the disk 740 is provided on the substrate transport apparatus 700, the distance traveled by the disk can be shortened, and the time required for moving the disk can also be reduced. Examples of the structure and operation of the embodiment shown in FIG. 11 are incorporated by reference in US8746631 and US10083851.

[0065] In related technologies, a substrate is placed on the hand of a substrate transport device and moved to the imaging location. Furthermore, an aligner for adjusting the orientation of the substrate must be located near the substrate transport device. This increases the disk travel distance and the disk travel time, affecting throughput. Furthermore, for example, if a dedicated imaging station or aligner is installed, additional equipment is required, which places limitations on the floor plan. Furthermore, the floor plan must be designed taking into account the movement of the arm of the substrate transport device.

[0066] According to one or more embodiments of the substrate transport device, a disk is provided within the substrate transport device, and images of the substrate are captured on the disk. This minimizes disk movement. This minimizes disk movement time, improving substrate transport throughput. The disk also includes a light that illuminates the substrate during imaging. Here, the camera is positioned above the substrate, and the disk is positioned below the substrate. In other words, the disk acts as a backlight during imaging, allowing for clearer images of the substrate to be obtained.

[0067] Furthermore, according to one or more embodiments of the substrate transfer device, a correction amount for the position and orientation of the substrate is calculated, and the substrate is placed in the semiconductor manufacturing equipment for the next process based on the correction amount. In this case, the substrate is placed in a predetermined position and orientation through a placement operation based on the correction amount. This eliminates the need to install an aligner in the substrate transfer device as in related art, thereby improving the flexibility of floorplanning.

[0068] One or more embodiments described herein above may be combined with each other as far as practicable within the scope of the intended embodiments. The above-described embodiments should be considered in all respects as illustrative and not restrictive. The illustrated and described embodiments may be expanded to encompass other embodiments in addition to those specifically described without departing from the intended scope of the invention. The scope of the invention should be determined not by the foregoing description alone but by the claims in light of the specification, including equivalents. Accordingly, all structures, including those falling within the scope of the claims in equivalent structure, are intended to be encompassed by the invention.

Claims

1. An apparatus for transporting a substrate, The base and a lifting unit connected to the base so as to be able to move up and down; a hand unit movably connected to the lifting unit and configured to acquire the substrate; a disk provided at a position where the substrate can be moved by the hand unit; A substrate transport apparatus comprising:

2. The hand unit includes: an arm rotatably connected to the lifting unit; a hand movably connected to the arm and configured to acquire the substrate; The substrate transport apparatus of claim 1 , further comprising:

3. 3. The substrate transfer device according to claim 2, wherein the disk is provided on the arm.

4. 2. The substrate transfer device according to claim 1, wherein the disk is provided on the base.

5. 3. The substrate transfer device according to claim 2, wherein when the hand is positioned so as to overlap the arm, the disk is positioned below the substrate taken out by the hand.

6. 2. The substrate transfer device according to claim 1, wherein the disk includes a light for irradiating the substrate with light.

7. 2. The substrate transport device according to claim 1, wherein the disk includes a plurality of lights for irradiating the substrate with light.

8. 8. The substrate transfer apparatus according to claim 7, wherein the plurality of lights are arranged over the entire surface of the disk.

9. 8. The substrate transfer apparatus according to claim 7, wherein the plurality of writes are arranged on the outer periphery of the disk.

10. 7. The substrate transport device according to claim 6, wherein the light is turned on when the disk is imaged.

11. The arm a first arm rotatably connected to the lifting unit; a second arm rotatably connected to the first arm, 3. The substrate transfer apparatus according to claim 2, wherein the disk is disposed on the second arm.

12. 3. The substrate transfer device according to claim 2, wherein the hand includes a suction hand having a suction portion.

13. 3. The substrate transport device according to claim 2, wherein the hand includes a light for emitting light.

14. In the substrate transport method, Remove the board and The removed substrate is transported onto a disk; taking an image of the substrate with a camera; Calculating the position of the substrate based on the captured image; A substrate transfer method comprising placing the substrate based on the calculated correction amount.

15. 15. The substrate transport method according to claim 14, wherein the substrate is irradiated with light when the image is captured.

16. 16. The substrate transport method according to claim 15, wherein the irradiation of the substrate with the light is stopped after the image capture is completed.

Images