Gas supply pallet assembly, cleaning unit, and chemical mechanical polishing system having the same

Abstract

Disclosed herein are a modular gas pallet assembly and a cleaning unit and a chemical mechanical polisher having the same. In one embodiment, the gas pallet assembly includes three outlets and no more than two inlets. The gas pallet assembly has first and second primary gas conduits fixed to a first mounting plate. The second primary gas conduit splits into two branches, each with a flow control. The modular gas pallet assembly is configured to deliver gas toward a base plate of a substrate cleaner, substrate gripping pins of the substrate cleaner, and the bottom of a substrate held by the substrate gripping pins of the substrate cleaner.

Description

[Technical Field]

[0001]

[0001] The embodiments described herein relate generally to apparatus used in the manufacture of electronic devices, and more particularly to substrate processing systems that may be used to clean the surface of a substrate, particularly after or as part of a chemical mechanical polishing (CMP) system. [Background technology]

[0002] 2. Description of Related Art Chemical-mechanical polishing (CMP) is commonly used in the manufacture of high-density integrated circuits to planarize or polish a layer of material deposited on a substrate. In a typical CMP process, a substrate is held in a carrier head, which presses the front side of the substrate against a rotating polishing pad in the presence of a polishing fluid. A combination of chemical and mechanical activity, brought about by the polishing fluid and the relative motion between the substrate and the polishing pad, removes material across the surface of the material layer of the substrate in contact with the polishing pad. Typically, after one or more CMP processes are completed, the polished substrate is cleaned, for example, in a cleaning unit coupled to the CMP system. The cleaning unit may include multiple cleaning stations, or cleaning modules, used to perform various cleaning operations. Once post-CMP steps are complete, the substrate is removed from the CMP system and can then be delivered to a subsequent device manufacturing system, such as a lithography, etch, or deposition system.

[0003] In cleaning units with multiple cleaning modules, the space available for transferring substrates between the various modules is limited. This space limitation problem is exacerbated when cleaning equipment occupies valuable space that could be more cost-effectively utilized by other processing equipment, resulting in a high cost of ownership for fab operators. Furthermore, large cleaning enclosures unnecessarily increase the amount of time substrates are exposed to air, risking oxidation and particle contamination of the substrates. For this reason, modules within cleaning units are packed as closely together as possible, leaving little room for devices such as robots to grasp, turn, and insert substrates into different modules. This compressed space also reduces the space available for gas control systems and associated pathways within the cleaning unit, resulting in difficulties in maintaining and servicing the gas delivery system and a lack of ability to expand or replace it if future changes are made to the cleaning process.

[0004]

[0004] Therefore, there is a need for an improved gas supply system and cleaning unit having the same. Summary of the Invention

[0005]

[0005] Disclosed herein is a modular gas pallet assembly, and a cleaning unit and a chemical mechanical polisher having the same. In one embodiment, the gas pallet assembly includes first and second primary gas conduits secured to a first mounting plate. The first primary gas conduit includes a first inlet port, a first normally-closed valve, a first regulator coupled between the first normally-closed valve and the first inlet port, a first outlet port, a first filter coupled to the first outlet port, and a first flow controller coupled between the first filter and the first normally-closed valve. The second primary gas conduit includes a second inlet port, a second normally-closed valve, a second regulator coupled between the second normally-closed valve and the second inlet port, a second outlet port, a second filter coupled to the second outlet port, a second flow controller coupled between the second filter and the second normally-closed valve, a third normally-closed valve coupled to a tee disposed between the second regulator and the second normally-closed valve, a third outlet port, a third filter coupled to the third outlet port, and a third flow controller coupled between the second filter and the second normally-closed valve.

[0006] In another embodiment, a second pallet assembly configured identically to the pallet assembly described in the above paragraph is stacked vertically together.

[0007] In another embodiment, a cleaning unit is provided. The cleaning unit includes a gas palette assembly and a first cleaning module (FCM). The gas palette assembly has three outlets and no more than two inlets. The outlet of the gas palette assembly is connected to the FCM. The FCM includes a base plate having gripper pins configured to secure a substrate during processing, a first arm movable between a position above the base plate and a position spaced apart from the base plate, a first FCM outlet port disposed on the first arm connected to the first outlet port, a second FCM outlet port disposed on the first arm at the second outlet port, and a third FCM outlet port disposed on the base plate connected to the third outlet port.

[0008] In yet another embodiment, a substrate processing system is provided that includes a chemical mechanical polisher, a substrate transfer device, and a substrate cleaning unit. The substrate cleaning unit is coupled to the chemical mechanical polisher. The substrate transfer device is configured to move a substrate from the chemical mechanical polisher to the substrate cleaning unit. The substrate cleaning unit further includes a first plurality of stacked integrated cleaner dryers, a first plurality of stacked gas pallets positioned directly below the first plurality of stacked integrated cleaner dryers, a second plurality of stacked integrated cleaner dryers positioned laterally offset from the first plurality of stacked integrated cleaner dryers, and a second plurality of stacked gas pallets positioned directly below the second plurality of stacked integrated cleaner dryers. Each one of the first plurality of stacked gas pallets is coupled to a respective one of the first plurality of stacked integrated cleaner dryers. Each one of the second plurality of stacked gas pallets is coupled to a respective one of the second plurality of stacked integrated cleaner dryers.

[0009]

[0009] So that the features of the present disclosure described above may be understood in detail, a more particular description of the present disclosure briefly summarized above will be had by reference to embodiments, some of which are illustrated in the accompanying drawings. It should be noted, however, that the accompanying drawings illustrate only typical embodiments of the present disclosure and therefore should not be considered as limiting the scope of the present disclosure, which may also admit of other equally effective embodiments. [Brief explanation of the drawings]

[0010] [Figure 1A] 1 is a schematic top view of an exemplary chemical mechanical polishing (CMP) system having an integrated cleaning unit. [Figure 1B]

[0011] 1B is a schematic side view of the CMP system of FIG. 1A showing multiple gas pallet assemblies positioned at the bottom of the integrated cleaning unit. [Figure 2]

[0012] FIG. 1 is a side view of an example of an integrated cleaning and drying (ICD) station. [Figure 3]

[0013] FIG. 3 is a schematic diagram of two gas pallet assemblies configured to supply gas to separate ICD stations of FIG. 2. [Figure 4]

[0014] FIG. 1 is a top view of a gas pallet assembly. [Figure 5]

[0015] FIG. 2 is a partial schematic side view of a stacked gas assembly. DETAILED DESCRIPTION OF THE INVENTION

[0011]

[0016] For ease of understanding, where possible, the same reference numerals have been used to designate identical elements that are common to multiple figures. It is envisioned that elements and features of one embodiment may be beneficially incorporated in other embodiments without further recitation.

[0012]

[0017] FIELD OF THE INVENTION

[0002] Embodiments described herein relate generally to apparatus used in the manufacture of electronic devices, and more particularly to a cleaning unit that can be used to clean a surface of a substrate following chemical mechanical polishing of the substrate in a semiconductor device manufacturing process. The cleaning unit includes modular gas pallet assemblies stacked in a bottom region of the cleaning unit. The gas pallet assemblies can be easily replaced and / or added to the cleaning unit, thereby enabling efficient and cost-effective maintenance and expansion of the cleaning unit. Stacking the gas pallet assemblies also facilitates maintenance, such as allowing one cleaning module of the cleaning unit to be maintained while other cleaning modules remain operational, minimizing the impact on factory throughput during servicing.

[0013]

[0018] 1A and 1B are schematic top and side views of an exemplary chemical mechanical polishing (CMP) system 100 having a cleaning unit 106 that utilizes a modular gas pallet assembly 124. The modular gas pallet assembly 124 can be easily removed, replaced, and / or added to the cleaning unit 106, as described further below.

[0014]

[0019] The CMP system 100 includes one or more polishing stations 105, a factory interface 102 having a first substrate handler 103, and a cleaning unit 106 including a second substrate handler 104. The factory interface 102 may include one or more loading stations 102A. The loading stations 102A may be, for example, FOUPs or cassettes. Each loading station 102A may contain one or more substrates 200 for CMP in the CMP system 100.

[0015]

[0020] The first substrate handler 103 is positioned to transfer substrates 200 to or from one or more of the loading stations 102A. The first substrate handler 103 transfers the substrate 200 from the loading station 102A to a cleaning unit 106, e.g., cleaner pass-through 102B, where the substrate 200 can be picked up by the second substrate handler 104. As another example, the first substrate handler 103 transfers the substrate 200 from the cleaning unit 106, e.g., cleaner pass-through 102B, to the loading station 102A.

[0016]

[0021] The substrate 200 is initially positioned at the loading station 102A prior to processing at the polishing station 105. The first substrate handler 103 transports the substrate 200 to the cleaner pass-through 102B. The first substrate handler 103 also returns the polished substrate 200 from the cleaning unit 106 to the loading station 102A.

[0017]

[0022] The second substrate handler 104 is positioned to transport the substrate 200 from the cleaner pass-through 102B to the transfer station 105A of the polishing station 105 for polishing. The second substrate handler 104 is also operable to transport the substrate 200 from the transfer station 105A of the polishing station 105 to the cleaning unit 106 after polishing at the polishing station 105. In one example, the second substrate handler 104 retrieves the polished substrate 200 from the transfer station 105A in the polishing station 105 and transports the substrate 200 to one of the cleaning modules in the cleaning unit 106.

[0018]

[0023] The polishing station 105 is a chemical-mechanical polisher that may include multiple polishing stations (not shown). The polishing station 105 includes one or more polishing assemblies used to polish the substrate 200. Typically, each of the one or more polishing assemblies includes a polishing platen (not shown) and a polishing head (not shown) configured to urge the substrate 200 against a polishing pad (not shown) disposed on the polishing platen. The substrate 200 is polished in the presence of a polishing liquid. The polishing liquid may include an abrasive. After undergoing chemical-mechanical polishing at the polishing station 105, residual abrasive particles and / or liquids, such as acidic or basic chemicals contained in the polishing liquid, may remain on the substrate 200.

[0019]

[0024] As shown in FIG. 1A , the cleaning unit 106 may be composed of two cleaning units 106A, 106B arranged parallel to each other on opposite sides of the second substrate handler 104. Each cleaning unit 106A, 106B includes multiple cleaning modules, such as one or more first cleaning modules, one or more second cleaning modules, and one or more third cleaning modules, as described below. Each gas pallet assembly 124 is configured to supply gas to a respective one of the cleaning modules of the cleaning units 106A, 106B. This allows maintenance of any cleaning module and / or gas pallet assembly 124 without shutting down the other modules, thereby allowing substrates in the cleaning units 106A, 106B to be cleaned even during maintenance. The gas pallet assemblies 124 can be stacked under each of the cleaning units 106A, 106B to conserve space within the system 100 and provide room for substrate transport.

[0020]

[0025] The cleaning unit 106A is essentially a mirror image of the cleaning unit 106B. The cleaning unit 106A includes multiple cleaning stations (i.e., modules shown in FIG. 1A as a first cleaning module 107, a second cleaning module 109, and a third cleaning module 110) and a third substrate handler 108. In some embodiments, the first cleaning module is often referred to herein as a pre-cleaning module 107, although this is not intended to be limiting with respect to the scope of the disclosure provided herein. In some embodiments, the second cleaning module 109 is often referred to herein as a vertical cleaning module 109, although this is not intended to be limiting with respect to the scope of the disclosure provided herein. In some embodiments, the third cleaning module 110 is often referred to herein as a drying (ICD) module 110, although this is not intended to be limiting with respect to the scope of the disclosure provided herein. In some embodiments, the vertical cleaning modules 109 can be provided as a first vertical cleaning module 109A and a second vertical cleaning module 109B. In some embodiments, the ICD module 110 may be provided as a first ICD module 110A and a second ICD module 110B. In some embodiments, as shown in FIG. 1A, the third substrate handler 108 within each of the cleaning units 106A, 106B is positioned at the outer edge of the cleaning units 106A, 106B of the CMP system 100. In this configuration, the substrate handler 108 is positioned outside the first, second, and third cleaning modules, opposite the inside of the first, second, and third cleaning modules that face the robot tunnel 104T and the second substrate handler 104 of the CMP system 100.

[0021]

[0026] The pre-cleaning module 107 is configured to process a substrate 200 positioned in a substantially horizontal orientation, i.e., in the XY plane, with the processing surface 201 facing upward. In some embodiments, each cleaning unit 106A, 106B includes two vertical cleaning modules 109A, 109B configured to process a substrate 200 positioned in a substantially vertical orientation, i.e., in the ZY plane, with the processing surface 201 facing toward the factory interface 102.

[0022]

[0027] As described above, the pre-cleaning module 107 receives the polished substrate 200 from the second substrate handler 104 through a first door 107A formed in a first side panel of the pre-cleaning module 107. The first door 107A may be, for example, a slit valve configured to separate an interior region of the pre-cleaning module 107 from an exterior region of the pre-cleaning module 107. The substrate 200 is received in a horizontal orientation by the pre-cleaning module 107 for positioning on a horizontally disposed substrate support surface therein. The pre-cleaning module 107 then performs a pre-cleaning process, such as buffing, on the substrate 200, after which the substrate 200 is transferred therefrom using a third substrate handler 108 (sometimes referred to herein as the third substrate handler 108). In some embodiments, buffing includes sweeping a buffing pad across the surface of the substrate positioned on the horizontally disposed substrate support surface to remove slurry (such as a polishing liquid), scratches, and other defects found on the surface of the substrate. The buffing pad may comprise a material such as polyurethane, acrylate, or other polymeric material.

[0023]

[0028] The third substrate handler 108 transfers the substrate 200 from the pre-cleaning module 107 through a second door 107B that covers an opening formed in a second side panel of the pre-cleaning module 107. The second door 107B may be, for example, a slit valve. The second side panel may be, for example, perpendicular to the first side panel. When the substrate 200 is removed from the pre-cleaning module 107, it is still oriented horizontally, i.e., in the XY plane. After the substrate 200 is transferred from the pre-cleaning module 107, the third substrate handler 108 rotates the substrate 200 so that it is oriented vertically, i.e., in the YZ plane, with the processing surface 201 facing the factory interface 102, for further processing in the vertical cleaning modules 109A, 109B of the cleaning unit 106. For example, after the substrate 200 is transferred from the pre-clean module 107, the third substrate handler 108 may rotate the substrate 200 90 degrees about the Y axis to a vertical position, and then rotate the substrate 180 degrees about the Z axis so that the processing surface 201 faces the factory interface 102. The Y axis rotation and the Z axis rotation may be completed consecutively or in overlapping time intervals.

[0024]

[0029] After rotating the substrate 200 so that the processing surface 201 faces the factory interface 102, the third substrate handler 108 transfers the substrate 200 to the vertical cleaning module 109A through a door 109C (shown in FIG. 1B ). The transfer process may include movement of the third substrate handler 108 in at least one direction, such as the X direction. The door 109C may be, for example, a slit valve. Each cleaning unit 106A, 106B may include two vertical cleaning modules 109A, 109B. The two vertical cleaning modules 109A, 109B may be arranged linearly, i.e., in the X direction, in the respective cleaning units 106A, 106B. The two vertical cleaning modules 109A, 109B may be arranged substantially below the pre-cleaning module 107, i.e., in the Z direction, in the respective cleaning units 106A, 106B. Such an arrangement of the vertical cleaning modules 109A, 109B below the pre-cleaning module 107 results in a reduced footprint for the overall cleaning unit 106 and may also reduce transfer times between these modules to improve throughput, and importantly, may help reduce the drying capacity of wet substrates and reduce the air exposure time of the substrates between cleaning steps.

[0025]

[0030] In some embodiments, the vertical cleaning modules 109A, 109B may be any one or a combination of contact and non-contact cleaning units, such as, for example, spray boxes and / or scrubber brush boxes, for removing polishing by-products from the surface of the substrate.

[0026]

[0031] The vertical cleaning module 109 includes a cylindrical roller actuable against a major surface of the substrate 200. A second processing liquid, such as deionized water and / or one or more second cleaning liquids, is applied to the surface of the substrate 200 from a second fluid source while the substrate 200 and the cylindrical roller are rotated by various actuators and motors. In some embodiments, the second processing liquid supplied to the surface of the substrate is different from the first processing liquid supplied to the surface of the substrate in the pre-cleaning module 107. During the cleaning process in each vertical cleaning module 109A, 109B, the substrate 200 can be positioned such that the processing surface 201 faces the factory interface 102. In another embodiment, the vertical cleaning modules 109A, 109B are oriented within the cleaning units 106A, 106B such that the processing surface 201 during the cleaning process is oriented substantially perpendicular (e.g., parallel to the XZ plane) to the factory interface 102. In another embodiment, the vertical cleaning modules 109A and 109B are oriented within the cleaning units 106A, 106B such that the processing surface 201 of the substrate 200 during the cleaning process is oriented at an angle between parallel to the XZ plane and parallel to the YZ plane.

[0027]

[0032] According to one embodiment, the cleaning units 106A and 106B may each be configured to sequentially process each substrate 200 through two vertical cleaning modules 109A and 109B as a two-stage cleaning process. That is, after the substrate 200 undergoes cleaning processing in the vertical cleaning module 109A closest to the polishing station 105, the third substrate handler 108 transfers the substrate 200 to the vertical cleaning module 109B closest to the factory interface 102 for further cleaning processing. During the cleaning process sequence, the substrate is processed in the first vertical cleaning module 109A for a first period, then transferred to the second vertical cleaning module 109B, and then processed for a second period, which is typically substantially similar to the first period. The processes performed in the first vertical cleaning module 109A and the second vertical cleaning module 109B may include using similar fluid chemistries and mechanical processing parameters (e.g., cylindrical roller rotation speed and applied force). In some embodiments, the first vertical cleaning module 109A is adapted to perform a coarse cleaning step to remove most of the residual contaminants remaining on the substrate after performing the first cleaning process in the first cleaning module, and the second vertical cleaning module 109B is configured to perform a cleaning process adapted to remove the residual contaminants remaining from the process performed in the first vertical cleaning module 109A.

[0028]

[0033] The third substrate handler 108 then transports the substrate 200 to an available one of the ICD modules 110A, 110B through a first door 110C (shown in FIG. 1A) formed in a first side panel of the available one of the ICD modules 110A, 110B. The door 110C may be, for example, a slit valve. As shown in FIGS. 1A-1B, each cleaning unit 106A, 106B may include two ICD modules 110A, 110B arranged vertically, i.e., in the Z direction. Each of the ICD modules 110A, 110B performs cleaning and drying processes on the substrate 200. For example, the ICD modules 110A, 110B may rinse and dry the substrate 200. For example, the ICD modules 110A, 110B may apply isopropyl alcohol (IPA) vapor while rinsing the substrate 200 with deionized water to adjust the surface tension of the liquid, thereby reducing adhesion of the liquid to the substrate 200 during the cleaning and drying process.

[0029]

[0034] The horizontal arrangement of the ICD modules 110A, 110B can increase the throughput of substrates 200 for cleaning and drying processes while maintaining a reduced overall footprint of the cleaning unit 106. Such an arrangement of the ICD modules 110A, 110B in the CMP system 100 helps to reduce the transfer time between the vertical cleaning module 109B and the ICD modules 110A, 110B, thereby increasing throughput, and importantly, reduces the drying capacity of wet substrates, thereby reducing the air exposure time of the substrates between cleaning steps.

[0030]

[0035] The cleaning unit 106 can operate with two, three, four, or more ICD modules 110. However, it is anticipated that in most applications, the cleaning unit 106 will operate with two or four ICD modules 110. That is, both cleaning units 106A, 106B can operate with the same number of ICD modules 110 (one or two). In some embodiments, each cleaning unit 106A, 106B includes two vertically stacked ICD modules 110. The ICD modules 110 are generally self-contained, allowing one type of ICD module 110 to be replaced with another, or additional ICD modules 110 to be added to the cleaning unit 106 at a later time.

[0031]

[0036] FIG. 2 is a schematic diagram of a cross-sectional view of an ICD module 110, representative of ICD modules 110A and 110B, which may be utilized in cleaning units 106A and 106B, as described above. The ICD module 110 may receive a substrate 200 to be cleaned after the substrate 200 has been cleaned in one or more of the pre-clean module 107 and vertical cleaning modules 109A and 109B and before the substrate 200 is received by the first substrate handler 103 in the factory interface 102. The ICD module 110 may be utilized to remove contamination on the substrate 200 that, if not removed, could result in the corresponding substrate 200 not meeting the cleanliness requirements of subsequent processing steps and being discarded. In one embodiment, the ICD module 110 is configured to perform a cleaning and drying process that prevents water droplets from forming on the surface of the substrate 200. Generally, the process performed in each ICD module 110 is the final cleaning process performed in a cleaning sequence performed on a substrate in the CMP system 100. The process performed in each ICD module 110 may include one or more cleaning steps in which a cleaning or rinsing liquid (such as deionized water) is applied to the top and / or bottom surfaces of the substrate, followed by a drying process on the substrate.

[0032]

[0037] The ICD module 110 includes a substrate gripping device 203, a sweep arm 230, a first exit port 240, a second exit port 241, a plenum 282, an exhaust 260, a drain 284, and a gas source 270. The ICD module 110 may further include a sensing device 294, such as a camera to detect the status of the cleaning process or a retro-reflective position sensing device to sense the position of the substrate within the interior space 295.

[0033]

[0038] The substrate gripping device 203 is configured to support, hold, and / or retain the substrate 200 in a horizontal orientation. For example, the substrate gripping device 203 is configured to support the substrate 200 in a horizontal orientation perpendicular to the vertical rotation axis 216. The substrate gripping device 203 includes a catch cup 210 and the substrate gripping device 203. The catch cup 210 may include a shroud 211 and a base plate 212. The shroud 211 may be coupled to the base plate 212. For example, the shroud 211 may be coupled to the base plate 212 via one or more bolts. One or more of the shroud 211 and the base plate 212 may include one or more threads configured to receive a threaded bolt.

[0034]

[0039] The base plate 212 may include drain holes 262 positioned in an array along the edge of the base plate 212, for fluid to flow into the drain 284 while the substrate 200, substrate gripping device 203, and catch cup 210 are rotated by the drive motor 222. Additionally, a labyrinth 264 may be formed between the catch cup 210 and the housing of the ICD module 110. The labyrinth 264 may be configured to at least partially restrict fluid from flowing through the labyrinth 264 into the interior space 295.

[0035]

[0040] The catch cup 210 includes a wall 213 having an inner annular surface 214. The inner annular surface 214 defines a processing space 297 within the substrate gripping device 203. The inner annular surface 214 has an angular section that is symmetric about a central axis, e.g., an axis of rotation 216, of the substrate gripping device 203. For example, the substrate 200 can be cleaned within the processing space 297.

[0036]

[0041] The substrate gripping device 203 holds the substrate 200 while deionized water and / or a third cleaning liquid is applied to the substrate 200 for cleaning. The substrate gripping device 203 may also include gripping pins 217 coupled to the plate 219. In one or more embodiments, each gripping pin 217 may be coupled to an element 280, which is configured to contact a housing of the shroud 211 when the plate 219 is positioned relative to the catch cup 210 through use of the actuator 229. Contact between the element 280 and the surface 214 of the shroud 211 imparts translational motion to the gripping pins 217. For example, when the plate 219 and the substrate gripping device 203 are moved in the +Z direction by the actuator 229 in response to the element 280 contacting the annular inner surface 214 of the shroud 211, the element 280 contacts and pivots against the annular inner surface 214 of the shroud 211. In response, a pivotal and / or translational movement is imparted to the gripping pins 217 coupled to the element 280. In one embodiment, the element 280 continues to pivot until the movement of the substrate gripping device 203 in the +Z direction stops. In one embodiment, the element 280 and the gripping pins 217 are positioned in the open position after the movement of the plate 219 in the +Z direction stops.

[0037]

[0042] A spring element, such as a leaf spring or coil spring, may further return element 280 to the starting position, moving gripping pin 217 to the gripping position in response to element 280 no longer contacting inner annular surface 214 of shroud 211. A biasing force from the spring element may load element 280 such that when element 280 no longer contacts the housing of shroud 211, element 280 returns to the starting position and gripping pin 217 returns to the gripping position.

[0038]

[0043] One or more fluids may be applied to the processing surface 201 of the substrate 200 by a first outlet port 240 and a second outlet port 241. For example, a first fluid source 243 may supply deionized water and / or IPA vapor to a second outlet port 241 positioned to deliver the fluid to the surface of the substrate 200, and the first outlet port 240 may apply deionized (DI) water to the processing side of the substrate 200. The second outlet port 241 may also be configured to supply a gas, such as an inert gas, nitrogen, or another desired gas, from a connected one of the gas palette assemblies 124.

[0039]

[0044] The first outlet port 240 may include, for example, a megasonic nozzle. The first outlet port 240 may include one or more elements, such as a megasonic actuator, configured to apply megasonic energy in the form of waves in an alternating current according to a sinusoidal or other pattern into the cleaning fluid to generate a megasonic-actuated fluid. The cleaning fluid may be delivered from a first fluid source 243 adapted to deliver deionized water and / or a cleaning solution (i.e., an acid or base solution). For example, the first outlet port 240 may be configured to apply megasonic energy in an alternating current in a sinusoidal pattern at a rate of approximately 430 kHz to 5 MHz, e.g., 950 kHz, to generate the megasonic-actuated deionized water that is delivered to the surface of the substrate 200. Alternatively, other frequencies may be used.

[0040]

[0045] Fluid may be applied to the backside of the substrate 200 while the substrate gripping device 203 and catch cup 210 are rotating through an opening 225 formed in a base plate 219 that is connected to a fluid source 223 via a shaft 224. The shaft 224 may include one or more tubes (not shown) configured to deliver deionized water, cleaning solution, and / or gas to the backside of the substrate 200. The opening 225 formed in the base plate 219 is also connected to one of the gas pallet assemblies 124 for supplying gas below the substrate 200 as needed.

[0041]

[0046] The drive motor 222 may be coupled to the substrate gripping device 203 via a shaft 224. The drive motor 222 rotates the substrate gripping device 203 and the catch cup 210 about the rotation axis 216. Furthermore, the drive motor may be one of a hydraulic motor, a pneumatic motor, an electromechanical motor, and a magnetic motor. The substrate gripping device 203, the substrate 200, and the catch cup 210 are configured to rotate together (e.g., simultaneously) so that the relative speed between the substrate 200 and the catch cup 210 is substantially the same, and the supply of fluid to the front or backside of the substrate reduces the likelihood that droplets ejected from the surface of the rotating substrate will bounce off the inner surface of the catch cup 210 and land on the surface of the substrate.

[0042]

[0047] The door 202 covers an opening formed in a wall (e.g., an enclosure wall) 283 and may provide access to an interior space 295 of the ICD module 110 for inserting and removing the substrate 200 from the ICD module 110. When the door 202 is in a closed position, the interior space 295 of the ICD module 110 may be referred to as an isolated environment. For example, when the door 202 is closed, the interior space 295 of the ICD module 110 is isolated from the external environment, such that fumes (e.g., IPA vapor) and liquids generated and / or used during cleaning of the substrate 200 do not escape from the ICD module 110 during the cleaning process. The fumes and cleaning liquids used and / or generated during the cleaning process are removed from the ICD module 110 in a controlled manner via the exhaust 260 and / or the drain 284. Air may be supplied to the plenum 282 by a gas source 270 and exhausted from the ICD module 110 by the exhaust 260. Additionally, the plenum 282 and exhaust 260 may be configured to control the flow of air within the ICD module 110 to prevent particles from redepositing on the surface of the substrate 200. The airflow supplied to the ICD module 110 may be supplied at a desired pressure and flow rate to ensure removal of vapors (e.g., IPA vapor) and / or airborne particles that form within the processing region of the ICD module 110 during processing. In some embodiments in which nitrogen gas is delivered to the ICD module 110, it may be desirable to eliminate the use of HEPA filters from the system to reduce system and maintenance costs and system complexity. In some embodiments, the gas source 270 is configured to supply filtered air or other gas such that a desired pressure (e.g., greater than atmospheric pressure) is maintained in the processing region of the ICD module 110A.

[0043]

[0048] The drain 284 may be utilized to remove excess moisture from the ICD module 110. In one embodiment, the drain 284 removes excess cleaning fluid from the ICD module 110 during the cleaning process.

[0044]

[0049] An interior space 295 of the ICD module 110 may be defined as being between the catch cup 210 and a wall (such as an enclosure wall) 283. A substrate (such as substrate 200) may be inserted into the interior space 295 when loaded into the ICD module 110 and removed from the interior space 295 when removed from the ICD module 110.

[0045]

[0050] The sensing device 294 may detect the substrate 200 within the ICD module 110. For example, the sensing device 294 may detect the substrate 200 within the interior space 295. Furthermore, the sensing device 294 may detect the substrate 200 while it is being held by the substrate gripping device 203. The sensing device 294 may detect when the substrate 200 is properly or improperly loaded onto the substrate gripping device 203. Furthermore, the sensing device 294 may detect when the substrate 200 has fallen or dropped from the substrate gripping device 203. The sensing device 294 may also determine when the substrate 200 is inserted into and removed from the ICD module 110.

[0046]

[0051] The sweep arm 230 is coupled to a sweep arm shaft 232 and a sweep arm drive motor 234. The sweep arm shaft 232 and the sweep arm drive motor 234 form a sweep arm drive assembly 236.

[0047]

[0052] The sweep arm drive motor 234 may be coupled to the sweep arm shaft 232 and configured to move the outlet ports 240, 241 at the distal end of the sweep arm 230 in an arcuate path parallel to the surface of the substrate 200. The sweep arm 230 may include one or more tubes for delivering fluid to the outlet ports 240, 241. The sweep arm drive assembly 236 is configured to move the outlet ports 240, 241 over the surface of the substrate 200 during the cleaning process so that the cleaning liquid output by the outlet ports 240, 241 is evenly distributed over the surface of the substrate 200. The sweep arm drive assembly 236 may also be configured to move the sweep arm 230 vertically to set the distance between the outlet ports 240, 241 and the surface of the substrate 200.

[0048]

[0053] In some embodiments, the second outlet port 241 is adapted to supply IPA vapor to the surface of the substrate 200 while the first outlet port 240 supplies deionized water to the surface of the substrate 200 to create a "Marangoni" effect for drying the surface of the substrate 200. The IPA vapor is supplied from an IPA vapor supply assembly, which may include an IPA vapor source 244 and a carrier gas source 245. The IPA vapor source 244 may include an IPA liquid vaporization device (not shown), which is configured to receive and convert liquid IPA into vapor, which is then mixed with a carrier gas (e.g., N) supplied from the carrier gas source 245 and then supplied to the surface of the substrate during the Marangoni drying process. During the horizontal Marangoni drying process, the sweep arm 230 moves the outlet ports 240, 241 in an arcuate path from the center region to the edge region of the substrate, creating a moving boundary of deionized water that moves outward from the center of the substrate toward the edge. In this case, as the sweep arm 230 moves the outlet ports 240, 241 in an arcuate path from the center region to the edge region, the first outlet port 240, which is supplying deionized water to the surface of the substrate, leads to the second outlet port 241, which is supplying the IPA vapor carrier gas mixture to the surface of the substrate. The first outlet port 240 is also configured to supply a gas, such as an inert gas, nitrogen, or another desired gas, from a connected gas pallet assembly 124.

[0049]

[0054] The position of the sweep arm 230 and / or the outlet ports 240, 241 can be adjusted so that the outlet ports 240, 241 pass through the center of the rotating substrate 200 during processing. Furthermore, the position of at least one of the sweep arm 230 and the outlet ports 240, 241 can be adjusted so that the outlet ports 240, 241 pass through a portion of the substrate 200 other than the center. For example, the outlet ports 240, 241 can be moved relative to the sweep arm 230 and / or the sweep arm 230 can be moved relative to the sweep arm shaft 232 to vary the position of the outlet ports 240, 241 relative to the surface of the substrate 200. Furthermore, the axial distance between the outlet ports 240, 241 and the surface of the substrate 200 can be varied to assist in the cleaning process. The sweep arm drive motor 234 moves the sweep arm shaft 232 to move the sweep arm 230 and the outlet ports 240, 241 over the substrate 200 during the cleaning process.

[0050]

[0055] The various modules 107, 109, 110 included in the washing unit 106 are modular, such that the modules 107, 109, 110 can be replaced as needed, for example, for service and / or scheduled maintenance or for a particular application.

[0051]

[0056] 1A-1B, the third substrate handler 108 may transport the substrate 200 from the vertical cleaning module 109B to an available one of the ICD modules 110A, 110B. That is, while one substrate 200 is undergoing a cleaning and drying process in one of the ICD modules 110A, 110B, the third substrate handler 108 may transport the substrate 200 to the other of the ICD modules 110A, 110B (generally, the ICD module 110) that is not currently performing the cleaning and drying process on the substrate 200. During the transfer of the substrate 200 from the vertical cleaning module 109B to the available ICD module 110, the third substrate handler 108 may rotate the substrate 200 by 90 degrees about the Y axis so that the processing surface 201 of the substrate 200 faces upward, i.e., in the Z direction, when positioned in the ICD module 110.

[0052]

[0057] The first substrate handler 103 can transport the substrate 200 from the ICD module 110 through a second door 110D formed in a second side panel of the ICD module 110. The first side panel of the ICD module 110 and the second side panel of the ICD module 110 can be parallel to each other and on opposite sides of the ICD module. The door 110D can be, for example, a slit valve. The first substrate handler 103 can transport the substrate 200 from the ICD module 110 to one of the loading stations 102A.

[0053]

[0058] The wash unit 106 also includes a fluid and piping section 111. For example, as shown in FIG. 1B , the fluid and piping section 111 is located below the bottom of the wash units 106A, 106B and the robot tunnel 104T. The fluid and piping section 111 includes a catch basin 120 to collect fluid that may leak from the piping or splash from one of the modules of the wash unit 106. The catch basin 120 includes a sensor 122 configured to detect the presence and / or level of fluid in the catch basin 120. The sensor 122 is coupled to a system controller (not shown). The system controller is configured to output an alarm signal, terminate one or more processes being performed in one or more of the wash units 106, or stop the flow of one or more fluids sent to one or more of the wash units 106 based on metrics indicative of the presence and / or level of fluid in the catch basin 120. The warning signal may be one or more of a visual signal, an audible signal, an electronic communication (eg, another controller, a computer system, a cell phone, an email, a text message, etc.).

[0054]

[0059] The fluid and piping section 111 includes liquid delivery modules (LDMs) and gas palette assemblies 124. Each scrubbing unit 106A, 106B is associated with at least one LDM and at least one gas palette assembly 124. In FIG. 1B, LDMs 111A, 111B, 111D, and 111D (as well as conduits, valves, etc., not shown) are provided to supply process liquid needed by each individual module 107, 109, 110 within each scrubbing unit 106A, 106B. For example, LDM 111A may supply process liquid to pre-scrubbing module 107. Similarly, two different LDMs 111B may each supply process liquid to a respective one of vertical scrubbing modules 109A, 109B, and two different ICD LDMs 111C may each supply process liquid to a respective one of ICD modules 110.

[0055]

[0060] In some embodiments, each LDM 111A-111D may be a liquid supply module dedicated to supplying process liquid to a single specific one of the modules 107, 109, 110. Thus, if one of the cleaning units 106A, 106B is comprised of only a single ICD module 110 (as described above), a single ICD LDM 111C may be provided in the corresponding fluid and piping section 111 to supply process liquid to the single ICD module 110.

[0056]

[0061] As described above, the fluid and piping section 111 also includes at least one gas pallet assembly 124 for supplying gas to each of the cleaning units 106A, 106B. For example, each cleaning unit 106A, 106B includes at least one separate, dedicated gas pallet assembly 124. In FIG. 1B , the fluid and piping section 111 includes four gas pallet assemblies 124, labeled 124A, 124B, 124C, and 124D, respectively. For example, gas pallet assembly 124A supplies process gas to ICD module 110A, and gas pallet assembly 124B supplies process gas to the other ICD module 110B. Because each ICD module 110 of the cleaning units 106A, 106B has its own dedicated gas pallet assembly 124A, 124B, one gas pallet assembly 124 can be maintained or replaced while the other ICD modules in the cleaning units 106A, 106B remain operational. Furthermore, because each gas pallet assembly 124 is modular, additional or different gas pallet assemblies 124 can be added if the recipe or process within a particular gas pallet assembly 124 is changed, or if additional gas pallet assemblies 124 are added by simply replacing one gas pallet assembly 124 with another gas pallet assembly 124 and / or adding one or more additional gas pallet assemblies 124.

[0057]

[0062] Figure 3 is a schematic diagram of two gas pallet assemblies 124A, 124B configured to supply gas to separating ICD stations 110A, 110B of Figure 2. Gas pallet assembly 124A and gas pallet assembly 124B are identical except that the outlet port of gas pallet assembly 124A is coupled to ICD module 110A and the outlet port of gas pallet assembly 124B is coupled to ICD module 110B.

[0058]

[0063] The gas pallet assembly 124A generally includes an input port 302 and at least three outlet ports (e.g., a first outlet port 304, a second outlet port 306, and a third outlet port 308). The input port 302 of the gas pallet assembly 124A may be directly connected to a gas source 310 or may be coupled in parallel to the input port 302 of the gas pallet assembly 124B and / or one or more other input ports of the other gas pallet assemblies 124. The gas source 310 is configured to supply an inert gas, nitrogen, IPA vapor, clean dry air, or another desired gas.

[0059]

[0064] The first outlet port 304 is configured to connect to an opening 225 formed in the base plate 219 of the ICD module 110A, allowing the gas pallet assembly 124A to deliver gas below the substrate 200 when desired. The second outlet port 306 is configured to connect to a second outlet port 241 and is also configured to deliver gas, such as an inert gas, nitrogen, IPA vapor, clean dry air, or another desired gas, to the upper surface 201 of the substrate 200 as part of the final substrate cleaning. The third outlet port 308 is configured to connect to the first outlet port 240, allowing the gas pallet assembly 124A to deliver gas to dry the gripper pins 217, thereby preventing subsequently processed substrates from being cross-contaminated from slurry or other particles remaining on the gripper pins 217 after the final substrate cleaning process. The first and second outlet ports 240, 241 are attached to the arm 230 so that they can be rotated to different positions on the substrate 200 (and base plate 219) and also rotated to positions away from the substrate 200 (and base plate 219).

[0060]

[0065] The gas pallet assembly 124A includes two primary gas conduits 320, 322. Each primary gas conduit 320, 322 is coupled to an inlet port 302 via a tee 370. Alternatively, the primary gas conduits 320, 322 may include separate inlet ports 302 for direct connection to a gas source 310 (as shown later in FIG. 4).

[0061]

[0066] The first primary gas conduit 320 includes a pressure regulator 360, a shut-off valve 330, a flow controller 332, and a filter 334. The pressure regulator 360 is disposed downstream of the tee 370, if present, between the shut-off valve 330 and the inlet port 302. The pressure regulator 360 may be set manually or electronically to control the pressure of the gas entering the first primary gas conduit 320. The shut-off valve 330 is connected to the output of the pressure regulator 360 and may be any suitable shut-off valve. In one example, the shut-off valve 330 is a normally closed solenoid valve.

[0062]

[0067] A flow controller 332 is disposed between the shutoff valve 330 and the filter 334. The flow controller 332 may be a mass gas flow meter, a needle valve, a proportional valve, or other suitable gas flow controller. In the example shown in Figure 3, the flow controller 332 is a mass gas flow meter.

[0063]

[0068] The filter 334 is generally a micron-sized filter or other suitable filter. The inlet of the filter 334 is connected to the flow controller 332 and the output of the filter 334 is connected to the outlet port 304.

[0064]

[0069] The second primary gas conduit 322 includes a splitter 328, such as a tee, that divides the second gas conduit 322 into a first branch 324 and a second branch 326. The first branch 324 is connected to the second outlet port 306. The second branch 326 is connected to the third outlet port 308. The second gas conduit 322 may be split so that gas is not supplied through the first outlet port 240 to dry the gripping pins 217, while gas is not supplied through the second outlet port 241 to the top surface 201 of the substrate 200 during final substrate cleaning.

[0065]

[0070] A pressure regulator 362 is disposed between the splitter 328 and the inlet port 302. The pressure regulator 362 may be set manually or electronically to control the pressure of gas entering the first and second branches 324, 326 of the second primary gas conduit 322.

[0066]

[0071] First branch 324 includes a shut-off valve 340, a flow controller 336, and a filter 338. Shut-off valve 340 may be any suitable shut-off valve, and in one example is a normally closed solenoid valve.

[0067]

[0072] A flow controller 336 is disposed between the shutoff valve 340 and the filter 338. The flow controller 336 may be a mass gas flow meter, a needle valve, a proportional valve, or other suitable gas flow controller. In the example shown in Figure 3, the flow controller 336 is a mass gas flow meter.

[0068]

[0073] The filter 338 is generally a micron-sized filter or other suitable filter. The inlet of the filter 338 is connected to the flow controller 336 and the output of the filter 338 is connected to the second outlet port 306.

[0069]

[0074] Similarly, second branch 326 includes a shut-off valve 350, a flow controller 352, and a filter 354. Shut-off valve 350 may be any suitable shut-off valve, and in one example is a normally closed solenoid valve.

[0070]

[0075] 3, flow controller 352 is disposed between shut-off valve 340 and filter 338. Flow controller 352 may be a mass flow controller, a needle valve, a regulating valve or orifice plate, or other suitable gas flow control device. In the example shown in FIG. 3, flow controller 352 is a needle valve because the flow of gas used to clean gripper pins 217 does not require precise control.

[0071]

[0076] The filter 338 is generally a micron-sized filter or other suitable filter. The inlet of the filter 338 is connected to the flow controller 352 and the output of the filter 338 is connected to the second outlet port 306.

[0072]

[0077] 4 is a top view of the gas palette assembly 124. The gas palette assembly 124 includes a mounting plate 402 to which the pressure regulators 360, 362, the shut-off valves 330, 340, 350, and the flow controllers 332, 336, 352 are mounted. The filters 334, 338, 354 may optionally be mounted to the mounting plate 402 or may simply be in-line filters. Each of the pressure regulators 360, 362, the shut-off valves 330, 340, 350, and the flow controllers 332, 336, 352 may be mounted to the mounting plate 402 using a bracket 420 that positions the pressure regulators 360, 362, the shut-off valves 330, 340, 350, and the flow controllers 332, 336, 352 above the top surface 416 of the mounting plate 402. Locating the above components above the top surface 416 of the mounting plate 402 provides extra space for the tools needed to tighten and loosen the tube fittings connecting the components together. Locating the components above the top surface 416 of the mounting plate 402 also makes it easier to detect potential leaks.

[0073]

[0078] The mounting plate 402 is fabricated from a polymer that is resistant to the fluids present in the cleaning unit. In one example, the mounting plate 402 is fabricated from CPVC or PVC. Alternatively, the mounting plate 402 is fabricated from a metal that is coated to resist damage from the fluids present in the cleaning unit.

[0074]

[0079] The mounting plate 402 is generally rectangular and includes two short sides 404, 408 and two long sides 406, 410. Generally, the input port 302 is located on a first side 404 of the mounting plate 402, and the outlet ports 304, 306, 308 are located on a second short side 408 of the mounting plate 402. In the embodiment of the gas pallet assembly 124 shown in FIG. 4, the first primary gas conduit 320 and the second primary gas conduit 322 each have a separate input port 302 located on the first side 404 of the mounting plate 402.

[0075]

[0080] Long side 410 includes a cutout 412. Cutout 412 is positioned generally over a sensor 122 configured to detect fluid within catch basin 120. The size and location of cutout 412 allows for maintenance of sensor 122 without removing gas pallet assembly 124 from fluid and piping section 111.

[0076]

[0081] The pressure regulators 360, 362 are generally positioned side-by-side on the top surface 416 of the mounting plate 402. However, one or more of the isolation valves 330, 340, 350 and / or one or more of the flow controllers 332, 336, 352 may be offset on the top surface 416 of the mounting plate 402 in a direction parallel to the long side 406 to provide smaller short sides 404, 408 and to provide additional tool space for tightening the various fittings connecting the regulators, valves, controllers, and filters of the gas pallet assembly 124.

[0077]

[0082] The top surface 416 of the mounting plate 402 includes a plurality of standoff receiving holes 414. In one embodiment, two standoff receiving holes 414 are positioned along the long side 406 and two additional standoff receiving holes 414 are positioned along the opposite long side 410. The standoff receiving holes 414 may be positioned elsewhere. As better shown in FIG. 5 , the bottom surface 502 of the mounting plate 402 also includes a plurality of standoff receiving holes 414 that align with or are single holes with the standoff receiving holes 414 present on the top surface 416. Thus, the standoffs 504 may be used to connect the top surface 416 of the mounting plate 402 of gas pallet assembly 124A to the bottom surface 502 of the mounting plate 402 of gas pallet assembly 124B. One or more additional gas pallet assemblies 124 may be stacked on top of gas pallet assembly 124B using the additional standoffs 504, space permitting.

[0078]

[0083] Accordingly, disclosed herein are modular gas pallet assemblies that can be stacked on the bottom region of a scrubbing unit. The gas pallet assemblies can be easily replaced and / or added to the scrubbing unit, thus enabling efficient and cost-effective maintenance and expansion of the scrubbing unit. Stacking gas pallet assemblies also facilitates maintenance, such as allowing one scrubbing module of the scrubbing unit to be serviced while other modules remain operational, minimizing the impact on plant throughput during service.

[0079]

[0084] While the foregoing is directed to embodiments of the present disclosure, other and further embodiments of the disclosure may be devised without departing from the basic scope thereof, the scope of which is determined by the claims that follow.

Claims

1. 1. A gas pallet assembly comprising: a first mounting plate; a first primary gas conduit secured to the first mounting plate, the first primary gas conduit comprising: a first inlet port; a first normally closed valve; a first regulator coupled between the first normally closed valve and the first inlet port; a first outlet port; a first filter coupled to the first outlet port; and a first flow controller coupled between the first filter and the first normally closed valve; a first primary gas conduit comprising: a second primary gas conduit secured to the first mounting plate, the second primary gas conduit comprising: a second inlet port; a second normally closed valve; a second regulator coupled between the second normally closed valve and the second inlet port; a second outlet port; a second filter coupled to the second outlet port; a second flow controller coupled between the second filter and the second normally closed valve; a third normally closed valve connected to a tee disposed between the second regulator and the second normally closed valve; a third outlet port; a third filter coupled to the third outlet port; and a third flow controller coupled between the second filter and the second normally closed valve; a second primary gas conduit comprising: A gas pallet assembly comprising:

2. 2. The gas pallet assembly of claim 1, wherein the first flow controller and the second flow controller are mass flow controllers.

3. 3. The gas pallet assembly of claim 2, wherein the third flow controller is selected from the group consisting of a mass flow controller, a needle valve, a regulating valve, or an orifice plate.

4. 3. The gas pallet assembly of claim 2, wherein said first mounting plate is fabricated from a plastic material.

5. The gas pallet assembly of claim 1 , wherein said first mounting plate is rectangular.

6. 6. The gas pallet assembly of claim 5, wherein said first mounting plate has notches disposed along a long edge of said rectangular first mounting plate.

7. 3. The gas pallet assembly of claim 2, wherein a fitting connecting said second normally closed valve to said second flow controller is exposed through a cutout in said first mounting plate.

8. The gas pallet assembly of claim 2 , wherein the first mounting plate is fabricated from a polymer.

9. a second mounting plate coupled to the first mounting plate; a third primary gas conduit secured to the second mounting plate, the third primary gas conduit comprising: a fourth inlet port; a fourth normally closed valve; a fourth regulator coupled between the fourth normally closed valve and the fourth inlet port; a fourth outlet port; a fourth filter coupled to the fourth outlet port; and a fourth flow controller coupled between the fourth filter and the fourth normally closed valve; a third primary gas conduit comprising: a fourth primary gas conduit secured to the second mounting plate, the fourth primary gas conduit comprising: a fifth inlet port; a fifth normally closed valve; a fifth regulator coupled between the fifth normally closed valve and the fifth inlet port; a fifth outlet port; a fifth filter coupled to the fifth outlet port; a fifth flow controller coupled between the fifth filter and the fifth normally closed valve; a sixth normally closed valve connected to a tee disposed between the fifth regulator and the fifth normally closed valve; a sixth outlet port; a sixth filter coupled to the sixth outlet port; and a sixth flow controller coupled between the sixth filter and the sixth normally closed valve; a fourth primary gas conduit comprising:

10. The gas pallet assembly of claim 1, further comprising:

10. 10. The gas pallet assembly of claim 9, wherein the second mounting plate is stacked directly above the first mounting plate by a plurality of standoffs.

11. the first mounting plate is rectangular and has a first notch disposed along a long edge of the rectangular first mounting plate; 10. The gas pallet assembly of claim 9, wherein the second mounting plate is rectangular and has a second cutout disposed along a long edge of the rectangular second mounting plate, the first mounting plate and the second mounting plate have the same size, and the first cutout and the second cutout are aligned one above the other and have the same size.

12. 10. The gas pallet assembly of claim 1, wherein the first and second inlet ports are connected to a common supply fitting and configured to receive gas from a common gas source; a first cleaning module (FCM), a base plate having gripping pins configured to secure the substrate during processing; a first arm movable between a position above the base plate and a position spaced apart from the base plate; a first FCM outlet port disposed on the first arm, wherein a first FCM gas outlet port is connected to the first outlet port; a second FCM outlet port disposed on the first arm, wherein a second FCM gas outlet port is connected to the second outlet port; and a third FCM outlet port disposed in the base plate, a third FCM gas outlet port connected to the third outlet port; a first cleaning module (FCM) comprising: A substrate cleaning unit comprising:

13. The substrate cleaning unit of claim 12 , wherein the gas pallet assembly is disposed directly below the first cleaning module.

14. a second cleaning module stacked on the first cleaning module; a second gas pallet assembly coupled to the second cleaning module; The substrate cleaning unit of claim 12 further comprising:

15. the second gas pallet assembly comprising: a second mounting plate coupled to the first mounting plate; a third primary gas conduit secured to the second mounting plate, the third primary gas conduit comprising: a fourth inlet port; a fourth normally closed valve coupled to the fourth inlet port; a fourth regulator coupled between the fourth normally closed valve and the fourth inlet port; a fourth outlet port coupled to a first cleaning module (SMC) gas outlet port of the second cleaning module; a fourth filter coupled to the fourth outlet port; and a fourth flow controller coupled between the fourth filter and the fourth normally closed valve; a third primary gas conduit comprising: a fourth primary gas conduit secured to the second mounting plate, the fourth primary gas conduit comprising: a fifth inlet port, the fourth and fifth inlet ports being connected to a common supply fitting and configured to receive gas from the common gas source; a fifth normally closed valve; a fifth regulator coupled between the fifth normally closed valve and the fifth inlet port; a fifth outlet port coupled to a second SMC gas outlet port of the second cleaning module; a fifth filter coupled to the fifth outlet port; a fifth flow controller coupled between the fifth filter and the fifth normally closed valve; a sixth normally closed valve connected to a tee disposed between the fifth regulator and the fifth normally closed valve; a sixth outlet port coupled to the third SMC gas outlet port of the second cleaning module; a sixth filter coupled to the sixth outlet port; and a sixth flow controller coupled between the sixth filter and the sixth normally closed valve; a fourth primary gas conduit comprising: The substrate cleaning unit of claim 14 further comprising:

16. 16. The substrate cleaning unit of claim 15, wherein the second mounting plate is stacked directly above the first mounting plate and directly below the first and second cleaning modules.

17. the first mounting plate is rectangular and has a first notch disposed along a long edge of the rectangular first mounting plate; 17. The substrate cleaning unit of claim 16, wherein the second mounting plate is rectangular and has a second notch disposed along a long edge of the rectangular second mounting plate, the first mounting plate and the second mounting plate have the same size, and the first notch and the second notch are aligned one above the other and have the same size.

18. The drainage duct located below the first gas palette a fluid sensor disposed in the catch basin directly below and aligned with the first and second notches; and The substrate cleaning unit of claim 17 further comprising:

19. 1. A substrate processing system, comprising: A chemical mechanical polishing machine; a substrate transport device; a substrate cleaning unit connected to the chemical mechanical polisher; the substrate transfer device is configured to move a substrate from the chemical mechanical polisher to the substrate cleaning unit, the substrate cleaning unit comprising: a first plurality of stacked integrated cleaner-driers; a first plurality of stacked gas pallets positioned directly below the first plurality of stacked integrated cleaner-dryers, each one of the first plurality of stacked gas pallets coupled to a respective one of the first plurality of stacked integrated cleaner-dryers; a second plurality of stacked integrated cleaner-dryers positioned laterally offset from the first plurality of stacked integrated cleaner-dryers; and a second plurality of stacked gas pallets positioned directly below the second plurality of stacked integrated cleaner-dryers, each one of the second plurality of stacked gas pallets coupled to a respective one of the second plurality of stacked integrated cleaner-dryers; The substrate processing system further comprises:

20. each of the gas pallets of the first plurality of stacked gas pallets comprising: A mounting plate; a first primary gas conduit secured to a first mounting plate, the first primary gas conduit comprising: a first inlet port; a first normally closed valve; a first regulator coupled between the first normally closed valve and the first inlet port; a first outlet port coupled to a first gas outlet port positioned on a swing arm of a first one of the first plurality of stacked integrated cleaner-driers; a first filter coupled to the first outlet port; and a first flow controller coupled between the first filter and the first normally closed valve; a first primary gas conduit comprising: a second primary gas conduit secured to the first mounting plate, the second primary gas conduit comprising: a second inlet port coupled to the first inlet port, the first and second inlet ports configured to receive gas from a common source; a second normally closed valve; a second regulator coupled between the second normally closed valve and the second inlet port; a second outlet port coupled to a second gas outlet port positioned on the swing arm of the first of the first plurality of stacked integrated cleaner-driers; a second filter coupled to the second outlet port; a second flow controller coupled between the second filter and the second normally closed valve; a third normally closed valve connected to a tee disposed between the second regulator and the second normally closed valve; a third inlet port coupled to a third gas outlet disposed in a base plate of the first of the first plurality of stacked integrated cleaner-driers; a third filter coupled to the third outlet port; and a third flow controller coupled between the second filter and the second normally closed valve; a second primary gas conduit comprising: The substrate processing system of claim 19 further comprising:

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