Footwear assembly with 3D printed modular sole assembly

Abstract

Footwear comprising a modular sole assembly having an insole portion connected to an upper. The insole portion may have a compressible lattice structure with interconnected elongated members to support a wearer's foot. A midsole portion connected to the insole portion has a midsole perimeter that interfaces with the insole perimeter. The midsole portion is modularly attached to the insole portion. An outsole portion is connected to the midsole portion. A first locking mechanism is integrally formed along the lower perimeter of the upper or along the insole perimeter. A second locking mechanism is integrally formed along the midsole portion and removably mates with the first locking mechanism, configured to securely hold the midsole portion together with the insole portion and upper without the use of cementing or other adhesives.

Description

[Technical Field]

[0001] [CROSS-REFERENCE TO RELATED APPLICATIONS] This application claims the benefit of and priority to U.S. patent application Ser. No. 63 / 418,428, filed October 21, 2022, entitled "FOOTWEAR ASSEMBLY WITH 3-D PRINTED, MODULAR SOLE ASSEMBLY," which is incorporated herein by reference in its entirety.

[0002] This patent application is directed generally to footwear, and more particularly to modular sole assemblies using 3D printing or additive manufacturing methods. [Background technology]

[0003] Typically, footwear is assembled together by relying on lamination techniques to join or attach multiple individual layers (e.g., an insole, a midsole, and an outsole) that form the sole and an upper that is joined to these multiple layers. The upper covers the top and sides of a user's foot, and the sole covers the bottom of the user's foot and contacts the ground. The upper and sole components and / or parts thereof may be assembled together during or after the manufacture of each component. Traditional footwear has numerous components that must be created, finished, and assembled into a final product. As a result, each of these many parts must be handled during assembly, making the assembly process a labor-intensive task. Furthermore, the large number of components creates a large parts inventory that must be managed. The labor-intensive processes of creating, lasting, assembling, and finishing footwear with so many components increase the cost and complexity of assembling traditional footwear. There is a need for footwear assemblies that have significantly fewer components and can be made and assembled quickly, easily, and inexpensively, while still providing a product with high levels of fashionability, functionality, durability, and comfort. A significant improvement in footwear technology is disclosed in Applicant's U.S. Provisional Patent Application No. 63 / 345,833, entitled "Footwear Assembly with 3-D Printed Sole Assembly," filed May 25, 2022, which is incorporated herein by reference in its entirety. Despite this technological improvement, footwear with modular sole assemblies is highly desirable because its parts can be easily assembled, refurbished, recycled, and / or replaced based on demand (e.g., specific sizes, designs), minimizing the parts inventory that manufacturers or retailers must maintain. Summary of the Invention

[0004] The footwear assembly and related methods disclosed herein overcome the drawbacks of the prior art and provide further advantages. One embodiment of the present technology provides a footwear assembly including an upper defining an interior region configured to accommodate a wearer's foot, wherein the upper has a lower periphery. A modular sole assembly is secured to the lower periphery of the upper. The sole assembly is fabricated using one or more additive manufacturing processes and holds the components of the sole assembly together without the use of adhesives. The sole assembly includes an insole portion connected to the lower periphery of the upper. The insole portion can include a compressible lattice structure configured to absorb compressive loads from the wearer's foot, the lattice structure including interconnected elongated members (laths) extending away from the platform layer and configured to support the wearer's foot. The insole portion includes an insole periphery, the insole portion forming a first sole module. A midsole portion is connected to the insole portion and includes a midsole periphery mated with the insole periphery. At least the midsole portion forms a second sole module that is removably attached to the first sole module. An outsole portion is connected to the midsole portion and positioned to form a ground-contacting surface. A first locking mechanism is integrally formed along the lower periphery of the upper or along the periphery of the insole. A second locking mechanism is integrally formed along the midsole portion and removably mates with the first locking mechanism, configured to securely hold the midsole portion together with the insole portion and upper without the use of cement or other adhesives. This allows the upper to be easily disengaged when needed, allowing the upper to be recycled or otherwise disposed of separately from the sole assembly. The sole assembly may be made of a different material.

[0005] The insole perimeter may have a flange radiating outward from the lattice structure, the lower perimeter of the upper being sewn to the flange, and a first locking mechanism integrally formed along the insole perimeter. The first locking mechanism is integrally formed along the lower perimeter of the upper, extends downward beyond the insole perimeter, and can be removably connected to a second locking mechanism. The insole perimeter may have a flange radiating outward from the lattice structure, the lower perimeter of the upper being captured between the flange and the midsole perimeter. In some embodiments, the first locking mechanism extends downward from the platform layer of the insole and has multiple engagement hooks. The second locking mechanism comprises multiple slots along the midsole perimeter configured to mate with and removably retain the engagement hooks. In some embodiments, the first locking mechanism comprises multiple locking tabs spaced apart from one another along the lower perimeter of the upper or along the insole perimeter. The midsole portion has a plurality of slots disposed along the midsole periphery, where locking tabs extend through the slots and connect to locking posts to securely hold the midsole portion together with the insole portion and upper.

[0006] In some embodiments, a footwear assembly includes an upper defining an interior region configured to accommodate a wearer's foot, the upper having a lower perimeter. A sole assembly is coupled to the upper, wherein the sole assembly has a modular structure that connects the components of the sole assembly without the use of adhesives. The sole assembly includes an insole portion connected to the lower perimeter of the upper to form a first sole module. A midsole portion is connected to the insole portion to form a second sole module that is removably attached to the first sole module. The midsole portion includes a midsole perimeter that removably joins with the insole portion. An outsole portion is connected to the midsole portion and is positioned to form a ground-contacting surface. A first locking mechanism is disposed on a lower portion of the upper or the insole portion. A second locking mechanism is integrally formed along the midsole portion and configured to removably mate with the first locking mechanism and securely hold the midsole portion together with the insole portion and upper without the use of cementing or other adhesives.

[0007] Another embodiment of the present technology provides a modular sole assembly for use with a footwear upper. The sole assembly includes an insole portion connectable to the footwear upper, a midsole portion connected to the insole portion, and a modular first forefoot portion. A modular first heel portion is spaced apart from the modular first forefoot portion. An outsole portion is connected to the midsole portion and forms a ground-contacting surface. The outsole portion includes a modular second forefoot portion and a modular second heel portion. The modular second forefoot portion is removably connected to the modular first forefoot portion along a bottom of the midsole portion, and the modular second heel portion is removably connected to the modular first heel portion along a bottom surface of the midsole portion. The insole portion, midsole portion, and outsole portion are connected to each other without the use of cement or other adhesives. An insole portion, midsole portion, or outsole portion may be separated from another insole portion, midsole portion, or outsole portion and replaced with a replacement insole portion, midsole portion, or outsole portion. [Brief explanation of the drawings]

[0008] Embodiments of the footwear assemblies and manufacturing processes introduced herein can be more fully understood by reference to the following detailed description in conjunction with the accompanying drawings, in which like reference numbers indicate identical or functionally similar elements.

[0009] [Figure 1A] 1A-1D are side and isometric views of a footwear assembly in accordance with one or more embodiments of the present technology. [Figure 1B] 1A-1D are side and isometric views of a footwear assembly in accordance with one or more embodiments of the present technology.

[0010] [Figure 2A]FIG. 1 is an isometric view of a sole assembly shown removed from an upper of a footwear assembly in accordance with one or more embodiments of the present technology. [Figure 2B] FIG. 1 is an isometric view of a sole assembly shown removed from an upper of a footwear assembly in accordance with one or more embodiments of the present technology.

[0011] [Figure 3A] FIG. 14 is a partially exploded top and bottom isometric view of a sole assembly according to an embodiment of the present technology. [Figure 3B] FIG. 14 is a partially exploded top and bottom isometric view of a sole assembly according to an embodiment of the present technology.

[0012] [Figure 3C] FIG. 3C is an enlarged cross-sectional view taken generally along line 3C-3C of FIG. 3A.

[0013] [Figure 4A] 14A-14D are partially exploded top and bottom views of a sole assembly according to another embodiment of the present technology. [Figure 4B] 14A-14D are partially exploded top and bottom views of a sole assembly according to another embodiment of the present technology.

[0014] [Figure 4C] 4B is a partially exploded top view of a midsole portion of the sole assembly of FIG. 4A. FIG.

[0015] [Figure 4D] FIG. 4D is a bottom view of the midsole portion of the sole assembly of FIG. 4C, illustrating the assembled configuration of the modular components.

[0016] [Figure 4E] 4B is a bottom view of the insole portion of the sole assembly of FIG. 4A. FIG.

[0017] [Figure 4F]FIG. 4F is a cross-sectional view taken generally along line 4F-4F of FIG. 4A.

[0018] [Figure 5A] FIG. 1 is a bottom view of the assembled upper and midsole portion (the outsole portion has been omitted for clarity).

[0019] [Figure 5B] FIG. 10 is a partially exploded bottom view of a modular sole assembly showing the forefoot portion of the outsole separated from the forefoot portion of the midsole portion in accordance with an embodiment of the present technology.

[0020] [Figure 5C] FIG. 5B is an isometric view of an upper mating with the insole portion of the sole assembly of FIG. 5A.

[0021] [Figure 5D] FIG. 5B is a side view of the sole assembly of FIG. 5A showing the heel module separated from the forefoot module of the midsole assembly.

[0022] [Figure 6A] FIG. 14 is a partially exploded isometric view of a sole assembly according to an embodiment of the present technology.

[0023] [Figure 6B] 6B is a diagram showing the bottom surface of the insole portion separated from the top surface of the midsole portion of the sole assembly of FIG. 6A. FIG.

[0024] [Figure 6C] FIG. 6B is an enlarged partial cross-sectional view of the heel region of the sole assembly of FIG. 6A.

[0025] [Figure 7A] FIG. 13 is a bottom view of an insole portion coupled to a bottom portion of an upper according to an embodiment of the present technology.

[0026] [Figure 7B]FIG. 7B is a partially inverted exploded view showing the bottom surface of the insole portion of FIG. 7A separated from the top surface of the midsole portion in accordance with the sole assembly of the present technology.

[0027] [Figure 8] FIG. 10 is an isometric view of an insole portion of a sole assembly according to an embodiment of the present technology, the insole portion having a toe cap and a heel cup protruding from a perimeter of the insole portion;

[0028] [Figure 9A] FIG. 134 is a top isometric view of an insole portion separated from a midsole portion according to an embodiment of the present technology.

[0029] [Figure 9B] 9B is a diagram showing the bottom surface of the insole portion separated from the top surface of the midsole portion of the sole assembly of FIG. 9A. FIG.

[0030] [Figure 9C] FIG. 9C is an enlarged cross-sectional view of the sole assembly of FIG. 6A taken generally along line 9C-9C.

[0031] [Figure 10] FIG. 14 is an isometric view of a sole assembly according to an embodiment of the present technology.

[0032] The headings provided herein are for convenience only and do not necessarily affect the scope or meaning of the claimed embodiments. Additionally, the drawings are not necessarily drawn to scale. For example, the dimensions of some of the elements in the figures may be expanded or reduced to help to improve understanding of the embodiments. Furthermore, while the disclosed technology is susceptible to various modifications and alternative forms, specific embodiments have been shown by way of example in the drawings and are described in detail below. However, there is no intent to limit the described embodiments. On the contrary, the embodiments are intended to encompass all modifications, equivalents, and alternatives falling within the scope of the embodiments. DETAILED DESCRIPTION OF THE INVENTION

[0033] Various examples of the footwear assemblies described above will now be described in more detail. The following description provides specific details for purposes of explanation that enable a thorough understanding of these examples. However, those skilled in the art will understand that the techniques described herein may be practiced without many of these details. Likewise, those skilled in the art will understand that the present technology may include many other features not described in detail herein. Furthermore, to avoid unnecessarily obscuring the relevant description, some well-known structures or functions may not be shown or described in detail below. To maintain simplicity of description, footwear assemblies are described herein in reference to top and bottom, upper and lower, upward and downward, and / or left or right relative to the spatial orientation of the illustrated embodiments. However, it should be understood that the footwear assembly can be moved and used in different spatial orientations without changing the structure of the system.

[0034] The terms used below should be interpreted in their broadest reasonable manner, even when used in conjunction with the detailed description of some specific examples of embodiments. Indeed, some terms may even be emphasized below. However, any terms intended to be interpreted in any restrictive manner are expressly and specifically defined as such in this section.

[0035] 1A and 1B illustrate a footwear assembly 10 according to one or more embodiments of the present technology. Footwear assembly 10 has an upper 12 coupled to a sole assembly 20, which defines an interior region 13 that accommodates a wearer's foot. Footwear assembly 10 shown in FIGS. 1A and 1B are only two examples of footwear styles that may incorporate the present technology. It should be understood that footwear assembly 10 according to the present technology may include other footwear styles, i.e., styles that may have a heel strap, an enveloping heel cup, an open-toe configuration, or other configurations. Furthermore, footwear assembly 10 according to the present technology may be a shoe, a boot, a sandal, or other style of footwear.

[0036] The sole assembly 20 of the illustrated embodiment is attached to or otherwise connected to the bottom of the upper 12. The sole assembly 20 includes an insole portion 14, a midsole portion 16, and an outsole portion 18. The insole portion 14 is located beneath or within a portion of the upper 12, the midsole portion 16 is located beneath the insole portion 14, and the outsole portion 18 is located beneath the midsole portion 16. In the embodiment of FIGS. 1A and 1B, a bottom perimeter 17 of the upper 12 is secured to the sole assembly 20. In other embodiments, the bottom of the upper 12 can encase a portion of the sole assembly 20, thereby capturing the actual end region of the upper 12 on or within a portion of the sole assembly 20, as will be described in more detail below. The upper 12 may be sewn to the sole assembly 20 or otherwise joined, for example, using other fasteners or a combination of non-adhesive fastening techniques. As described in more detail below, the upper 12 or insole portion 14 has a first locking mechanism along its periphery, and the midsole portion 16 has a second locking mechanism configured to removably mate with the first locking mechanism and securely hold the midsole portion 16 together with the insole portion 14 and upper 12 without the use of any adhesive.

[0037] 2A and 2B are isometric views of an embodiment of a sole assembly 20 shown with the upper removed. The sole assembly 20 is configured to support a wearer's foot over an insole portion 14 connected to a midsole portion 16. In the illustrated embodiment, an outsole portion 18, which forms a durable bottom surface that contacts the ground, is connected to the midsole portion 16. The midsole portion 16 and outsole portion 18 may be integrally connected to each other to form a single component. In FIG. 2A, a compressible lattice structure 23 is part of the insole portion 14 and overlies a platform layer 25. The compressible lattice structure 23 has interconnected elongated members 24 that extend away from the platform layer 25 and are configured to support the wearer's foot. In FIG. 2B, the compressible lattice structure 23 is part of the insole portion 14 and underlies the platform layer 25. The outsole portion 18 of the illustrated embodiment has an anchor flap 27. It extends upwardly from the side of midsole portion 16 and is configured to couple to an upper (e.g., a sandal strap or other upper member) to accommodate the wearer's foot. Compressible lattice structure 23 may be part of midsole portion 16 or may be part of outsole portion 18. In some embodiments, sole assembly 20 may not include compressible lattice structure 23. In some embodiments, a sockliner may be positioned over insole portion 14 to form an upper surface that contacts the wearer's foot.

[0038] The insole portion 14, the midsole portion 16, and / or the outsole portion 18 may be fabricated using 3D printing and / or other additive manufacturing processes, such as selective laser melting (SLM), selective laser sintering (SLS), electron beam melting (EBM), or other powder bed fusion or other additive manufacturing processes. In some embodiments, described below, the insole portion 14 and the midsole portion 16 are formed or otherwise fabricated integrally and integrally connected to one another as a single component assembled with the separately fabricated outsole portion 18 via additive manufacturing. In other embodiments, described below, the midsole portion 16 is integrally formed and connected to the outsole portion 18 as a single component, and the insole portion 14 is fabricated separately and bonded to an upper surface of the midsole portion 16 during assembly. In yet other embodiments, described below, the midsole portion 16 and the outsole portion 18 may have a segmented structure, each with a forefoot portion spaced apart from a heel portion. An arch section may be located between the forefoot and heel sections, although other embodiments may not include an arch section. This manufacturing process and the materials used in manufacturing result in modular components that have several advantages. For example, modular components can be individually refurbished and / or recycled based on supply and demand. Modular components also reduce the number of individual parts that must be assembled to form sole assembly 20. This simplifies the assembly process, reduces the number of assembled parts, shortens assembly time, and reduces the cost of footwear assembly 10 (FIGS. 1A and 1B).

[0039] 3A and 3B are exploded isometric top and bottom views of the sole assembly 30 shown in FIG. 2B . FIG. 3C is an enlarged cross-sectional view taken generally along line 3C-3C in FIG. 3A . The illustrated sole assembly 30 of the illustrated embodiment includes an insole portion 14 removably connected to a midsole portion 16 and an outsole portion 18 (which may be integrally formed as a single structure or may be separate components connected to one another). The insole portion 14 has a platform layer 25 with a compressible lattice structure 23 below the platform layer 25. A flange 31 is disposed radially outward from the lattice structure 23 along the insole periphery. An insole locking mechanism 32 extends downwardly from the platform layer 25 and has a plurality of engagement hooks 33 configured to engage with the midsole portion 16. The midsole portion 16 of the illustrated embodiment includes a midsole wall 34 and a second locking mechanism 35, which may be formed by a slot 36 along the midsole periphery. Second locking mechanism 35 is spaced from midsole wall 34 to accommodate thickness and provide a friction fit and engagement for first locking mechanism 32. Slot 36 is configured to matingly engage hook 33, thereby providing a highly secure connection holding insole portion 14 and midsole portion 16 together. This configuration with mating locking mechanisms 32 and 35 provides a fixed interconnection between the components, but also allows the insole portion to be removed from the midsole portion, for example, to refurbish the sole assembly or to recycle components of the assembly.

[0040] In some embodiments, an upper (not shown) may be stitched or otherwise mechanically joined (without adhesive) to flange 31, for example, to the inside of the flange or between the outside of flange 31 and the inside of midsole wall 34. Midsole portion 16 and outsole portion 18 form a cavity 38 in sole assembly 30 with an internal support structure 37 that supports the wearer's foot.

[0041] In some embodiments, midsole portion 16 and outsole portion 18 are separate components that are not integrally formed. In some embodiments, compressible lattice structure 23 overlies platform layer 25. In some embodiments, multiple engaging hooks 33 and multiple slots 36 may be interchanged, such that the hooks are spaced apart along second locking mechanism 35 and the slots are spaced apart along first locking mechanism 32. In some embodiments, outsole portion 18 may not have sandal flap 27.

[0042] 4A and 4B are partially exploded top and bottom views of a sole assembly according to another embodiment of the present technology. The sole assembly 40 includes an insole portion 14, a midsole portion 16, and an outsole portion 18 formed as interconnectable modular components. The illustrated insole portion 14 includes a compressible lattice structure 23 surrounded by a flange 31 to which the upper 12 may be sewn or otherwise joined. The insole portion 14 includes a plurality of first locking mechanisms 32 formed as locking tabs 41 extending downwardly and medially below the platform layer 25. The locking tabs 41 are spaced apart along the insole periphery (FIG. 4E). Each locking tab 41 has an opening 44 at its distal end for securely fastening to the midsole portion 16. In other embodiments, the locking tabs 41 may have other engagement mechanisms for connecting to the midsole portion 16. The midsole portion 16 is secured to the insole portion 14 by a plurality of slots 43 along the midsole periphery and a second locking mechanism 35, e.g., a plurality of locking posts 44 extending downward from the bottom surface of the midsole platform. The locking posts 44 are sized and configured to pass through openings 44 at the distal ends of the locking tabs 41. The locking tabs pass through the slots 43 and wrap around and under the bottom platform of the midsole. Thus, the locking tabs 41 extend over and capture the locking posts 44, thereby quickly connecting to and securely retaining the midsole portion. Similarly, the locking tabs 41 of the insole portion 14 can be easily and quickly disengaged from the midsole portion 16 by disengaging from the locking posts 44 and removing them from the slots 43. This allows the insole portion to be separated from the midsole portion 16.

[0043] 4C is a partially exploded top view of the midsole portion 16, and FIG. 4D is a bottom view of the midsole portion 16 with the locking post 44 disengaged from the insole portion (not shown). The illustrated midsole portion 16 has a modular construction, with a forefoot portion 46a spaced apart from a heel portion 46c. In some embodiments, a modular arch portion 46b may be positioned between and removably connected to the modular heel portion 46c and the modular forefoot portion 46a. In the illustrated embodiment, the modular arch portion 46b is removably connected to the forefoot portion 46a and heel portion 46c by an interconnection mechanism 45, which securely holds the midsole module together without the need for adhesives.

[0044] As illustrated in Figures 4A and 4B, outsole portion 18 similarly includes a modular forefoot portion 48a, a modular arch portion 48b, and a modular heel portion 48c. Figure 4F is a cross-sectional view of sole assembly 40 taken generally along line 4F-4F in Figure 4B. Midsole portion 16 has a lower perimeter flange 47 that extends around the midsole portion, and outsole portion 18 has an engagement portion 49 that removably mates with lower perimeter flange 47 to securely hold outsole portion 18 to midsole portion 16. Outsole portion 18 further includes a plurality of built-in support structures 48d that define cavities 48e, which also support the wearer's foot. Thus, the forefoot portion 48a, arch portion 48b, and heel portion 48c of the outsole securely and removably couple to the bottom surfaces of the forefoot portion 46a, arch portion 46b, and heel portion 48c of the midsole, respectively, thereby forming the ground-contacting lower surface of the sole assembly.

[0045] In some embodiments, as shown in Figures 5A and 5B, the midsole portion 16 does not include a modular arch portion 46b. As such, the forefoot portion 46a and the heel portion 46c are spaced apart from one another. Similarly, the modular outsole portion does not use an arch portion 48c. This can serve both functional purposes (e.g., improving the flexibility of the sole assembly 50) and aesthetic purposes (Figure 5D). In other embodiments, the midsole portion 16 and / or the outsole portion 18 are integrated whole-foot components, which may be created by 3D printing or other additive manufacturing processes.

[0046] 5B and 5C, locking tabs 41 are connected to the lower periphery of upper 12 rather than to the insole portion. In these embodiments, insole portion 14 may be disposed in an interior region of upper 12, or upper 12 may be disposed over insole portion 14 with locking tabs 41 extending over the peripheral edge of the insole portion and through slots 43 in the midsole portion, thereby securely capturing and retaining insole portion 14 between the upper and midsole portion 16.

[0047] 6A, 6B, and 6C illustrate a sole assembly 60 according to another embodiment of the present technology. The sole assembly 60 includes an insole portion 14, a midsole portion 16, and an outsole portion 18. The insole portion 14 may include a compressible lattice structure 23 extending upward from a platform layer 25 and a locking mechanism 32 extending downward from a bottom surface of the platform layer 25. The first locking mechanism 32 in the illustrated embodiment is a plurality of plugs 61 integrally connected to the platform layer 25 at a proximal end 61 a, and a free distal end 61 b ​​spaced below the platform layer 25 and configured to couple to the midsole portion 16. The midsole portion 16 includes a plurality of second locking mechanisms 35 formed by a plurality of holes 64 that matingly receive and engage the plurality of plugs 61 to releasably couple the insole portion 14 to the midsole portion 16. In the illustrated embodiment, the distal end 61b of each plug 61 includes a telescoping opening 62. Each telescoping opening is configured to receive an expansion insert 63 that widens the distal end 61b of the plug 61, thereby expanding the diameter of the distal end 61b and helping to lock the plug 61 into a mating hole 64 in the midsole portion 16. In other embodiments, the distal end 61b of each plug 61 may have a different shape that releasably engages with the midsole portion 16 in its respective hole 64 to lock the plug in place, thereby securely connecting the insole and midsole portion to one another without the use of adhesives.

[0048] 7A and 7B illustrate a sole assembly 70 according to another embodiment of the present technology. Here, the insole portion 14 has a plurality of plugs 61 and a plurality of snap-on hooks 71 forming the first locking mechanism 32. The midsole portion 16 has a plurality of holes 64 and grooves 74 forming the second locking mechanism 35. The plurality of holes 64 are configured to matingly receive and engage the plurality of plugs 61, and the plurality of grooves 74 are configured to matingly receive and engage the plurality of snap-on hooks 71, thereby releasably locking the insole portion 14 to the midsole portion 16. In the illustrated embodiment, the upper 12 has a closed lower end with a plurality of openings 75 that match the pattern of the first locking mechanism 32. The insole portion 14 may be inserted inside the upper 12 such that the plugs 61 and snap-on hooks 74 protrude through the openings 75. Plug 61 and telescoping hook 71 may then be inserted into hole 64 and locked into place within the midsole portion, thereby holding insole portion 14 and midsole portion 16 together with the lower portion of upper 12 securely captured between insole portion 14 and midsole portion 16.

[0049] As seen in FIG. 8 , in some embodiments, the insole portion 14 may include an integrated toe cap 82 and heel counter 84 that extend upwardly relative to the platform layer 25. In other embodiments, only the toe cap 82 or only the heel counter 84 may be included. The insole portion 14 may be disposed within the upper 12 such that the toe cap 82 and / or heel counter 84 are covered and encased by the upper 12. The upper 12 may have a lower panel with an opening that accommodates the first locking mechanism 32, as described above in connection with FIG. 7A . In other embodiments, the lower periphery of the upper may be sewn to a flange that extends around the periphery of the insole portion. In yet other embodiments, the insole portion 14 with the toe cap 82 and / or heel counter 84 may be external to the upper 12 and connected to the midsole portion 16 in the manner described above.

[0050] 9A and 9B illustrate a sole assembly 90 according to another embodiment of the present technology. FIG. 9C is an enlarged cross-sectional view of the sole assembly of FIG. 6A taken generally along line 9C-9C. The sole assembly includes an insole portion 14 configured for locking engagement with a midsole portion 16 by pushing or telescoping. The insole portion 14 has a perimeter flange 96 extending upwardly from a platform layer 25. In another embodiment, the insole portion 14 may include the perimeter flange 96 without including a platform layer, and the upper 12 may be sewn to the perimeter flange 96. The midsole portion 16 captures the perimeter flange 96 of the insole portion 14 with a hooked flange 98 formed around the upper perimeter of the midsole portion 16. Thus, during assembly, the insole portion 14 may be placed over the midsole portion 16 and pushed downwardly. This causes the insole's perimeter flange 96 to flex slightly inward and the midsole's hooked flange 98 to flex outward, until the hooked flange 98 rebounds back to its original state, allowing the hook portions of the midsole's hooked flange 98 to frictionally capture the upper side of the insole's perimeter flange. This allows the insole portion 14 to be removably attached to the midsole portion 16. In this embodiment, the insole's perimeter flange 96 is configured so that the lower perimeter of the upper (not shown) can be sewn to the inner surface of the flange 96. Thus, the inner portion of the midsole's hooked flange 98 is captured between the upper and the upper portion of the insole flange 96.

[0051] The sole assembly 90 may include an alignment feature 91 that helps maintain alignment of the insole portion 14 relative to the midsole portion 16 during and after installation of the insole portion. In the illustrated embodiment, the alignment feature 91 includes a protrusion 92 having a selected shape, such as a "+" shape, protruding from the bottom surface of the platform layer 25 of the insole portion. In other embodiments, the protrusion 92 may have a different shape. A matching receptacle 94 of the same shape is formed in the midsole portion. The protrusion 92 fits into and is received in the receptacle 94 to prevent lateral shifting or otherwise movement of the insole portion 14 relative to the midsole portion during and after installation of the insole portion 14. While the illustrated embodiment shows one alignment feature with a protrusion on the insole portion, other embodiments may include multiple alignment features 91, which may include a protrusion on the midsole portion 16 and a receptacle on the insole portion 14.

[0052] 10 illustrates a sole assembly 110 according to one embodiment of the present technology. In this embodiment, insole portion 14 has a locking mechanism including a plurality of hooks 112 and a plurality of slots 114 along the insole periphery. Midsole portion 16 has a second locking mechanism formed by a plurality of grooves 116 configured to matingly engage with the plurality of hooks 112, thereby securely and removably coupling insole portion 14 and midsole portion 16 together without the need for adhesives.

[0053] The above description and drawings are illustrative and should not be construed as limiting. Numerous specific details have been set forth in order to provide a thorough understanding of the present disclosure. However, in some instances, well-known details have not been set forth in order to avoid obscuring the description. Furthermore, various changes may be made without departing from the scope of the embodiments.

[0054] References herein to "one embodiment" or "an embodiment" mean that a particular feature, structure, or characteristic described in connection with that embodiment is included in at least one embodiment of the present disclosure. Appearances of the phrase "in one embodiment" in various places throughout this specification do not necessarily all refer to the same embodiment, nor are they mutually exclusive, separate, or alternative embodiments. Furthermore, various features may be described that are exhibited in some embodiments but not in other embodiments. Similarly, various requirements may be described that are requirements for one embodiment but not for other embodiments.

[0055] The terms used herein generally have their ordinary meaning in the art, within the context of this disclosure and in the specific context in which each term is used. It should be understood that the same meaning can be expressed in multiple ways. Therefore, alternative phrases and synonyms may be used for any one or more of the terms described herein, and no special significance should be attached to a term, regardless of whether it is recited or explained herein. Synonyms for some terms are provided. The statement of one or more synonyms does not preclude the use of other synonyms. The use of examples anywhere in this specification, including examples of any terms described herein, is for illustrative purposes only and is not intended to further limit the scope and meaning of the disclosure or any exemplified term. Similarly, this disclosure is not limited to the various embodiments set forth herein. Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by those of ordinary skill in the art to which this disclosure pertains. In the event of a conflict, the present document, including definitions, will control.

Claims

1. an upper defining an interior region configured to receive a wearer's foot, the upper having a lower perimeter; and a modular sole assembly secured to the lower perimeter of the upper, wherein the sole assembly is fabricated by one or more additive manufacturing processes and does not use adhesives, and wherein the sole assembly comprises: an insole portion connected to the lower perimeter of the upper and having a compressible lattice structure configured to absorb compressive loads from the wearer's foot, the lattice structure having interconnected elongated members extending away from a platform layer configured to support the wearer's foot, the insole portion having an insole perimeter, the insole portion forming a first sole module; a midsole portion connected to the insole portion and having a midsole periphery that interfaces with the insole periphery, wherein at least the midsole portion forms a second sole module that is removably attached to the first sole module; an outsole portion connected to the midsole portion and arranged to define a ground contact surface; a first locking mechanism integrally formed along the lower perimeter of the upper or along the perimeter of the insole; and a second locking mechanism integrally formed along the midsole portion and configured to removably mate with the first locking mechanism and securely hold the midsole portion together with the insole portion and the upper without the use of adhesives; have A footwear assembly comprising:

2. 2. The footwear assembly of claim 1, wherein the insole perimeter has a flange radiating outward from the lattice structure, the lower perimeter of the upper is stitched to the flange, and the first locking mechanism is integrally formed along the insole perimeter.

3. 2. The footwear assembly of claim 1, wherein the first locking mechanism is integrally formed along the lower perimeter of the upper, extends downwardly beyond the insole perimeter, and removably connects to the second locking mechanism.

4. The footwear assembly of claim 1 , wherein the outsole portion is integrally connected to the midsole portion along an outsole perimeter.

5. 2. The footwear assembly of claim 1, wherein the insole perimeter has a flange radiating outward from the lattice structure, the lower perimeter of the upper being captured between the flange and the midsole perimeter.

6. 2. The footwear assembly of claim 1, wherein the first locking mechanism extends downwardly from the platform layer of the insole portion and includes a plurality of engagement hooks, and the second locking mechanism includes a plurality of slots along the midsole periphery configured to mate with and releasably retain the engagement hooks.

7. 2. The footwear assembly of claim 1, wherein the first locking mechanism includes a plurality of locking tabs spaced apart from one another along the lower perimeter of the upper or along the perimeter of the insole, the locking tabs having openings at their distal ends, and the second locking mechanism includes a plurality of locking posts extending from the midsole portion, wherein the second locking mechanism releasably engages with the first locking mechanism with the locking posts passing through the openings in the locking tabs.

8. 8. The footwear assembly of claim 7, wherein the midsole portion has a plurality of slots disposed along the midsole periphery, wherein the locking tabs extend through the slots and connect to the locking posts to securely hold the midsole portion together with the insole portion and the upper.

9. The footwear assembly of claim 7 , wherein the plurality of locking tabs are integrally coupled to the insole periphery.

10. The footwear assembly of claim 7 , wherein the plurality of locking tabs are coupled to a periphery of the upper.

11. 11. The footwear assembly of claim 1, wherein the midsole portion has a modular forefoot portion and a modular heel portion spaced apart from the modular forefoot portion, the modular forefoot portion and the modular heel portion each removably connecting to the insole portion without the use of adhesive.

12. 12. The footwear assembly of claim 11, wherein the midsole portion further comprises a modular arch portion connected to the insole portion and disposed between the modular forefoot portion and the modular heel portion.

13. The footwear assembly of claim 12 , wherein the modular arch section is removably connected to each of the modular forefoot section and the modular heel section.

14. 11. The footwear assembly of claim 1, wherein the first locking mechanism includes a plurality of plugs extending downwardly from a bottom surface of the insole portion, and the second locking mechanism includes a plurality of holes configured to matingly receive and engage the plurality of plugs, thereby removably coupling the insole portion to the midsole portion.

15. 15. The footwear assembly of claim 14, wherein a distal end of each of the plurality of plugs has a stretchable opening and further includes a plurality of expanding inserts configured to be inserted into the stretchable openings to expand the distal ends of the plugs, thereby preventing removal of the plugs from the second locking mechanism while the expanding inserts are present within the stretchable openings.

16. 11. The footwear assembly of claim 1, wherein the insole portion further includes a toe cap and a heel counter extending upwardly relative to the platform layer and configured to be covered by the upper.

17. 11. The footwear assembly of claim 1, wherein the midsole portion has a lower perimeter flange extending around the midsole portion and having a first engagement portion, and the outsole portion has an outsole perimeter with a second engagement portion that releasably mates with the first engagement portion to securely hold the outsole portion to the midsole portion.

18. 18. The footwear assembly of claim 17, wherein the midsole portion has a modular first forefoot portion and a modular first heel portion, and the outsole portion has a modular second forefoot portion and a modular second heel portion, wherein the modular second forefoot portion releasably couples to the modular first forefoot portion along a bottom surface of the midsole portion and the modular second heel portion releasably couples to the modular first heel portion along a bottom surface of the midsole portion.

19. 11. The footwear assembly of claim 1, wherein the first locking mechanism includes a first flange extending upwardly relative to the platform layer to surround at least a portion of the insole portion, and the second locking mechanism includes a second flange with a groove formed along the first flange, the groove configured to capture the first flange therein when the insole portion is positioned over the midsole portion.

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