Driving substrate and display device

Abstract

This application provides a driving substrate 1 and a display device 100. The driving substrate 1 includes a substrate 10, a first metal layer 20 and a second metal layer 30 that are insulated from each other, and a connecting layer 70, wherein the first metal layer 20 includes a first wiring 21, and the second metal layer 30 includes a second wiring 31, the first wiring 21 and the second wiring 31 are electrically connected by the connecting layer 70, a portion of the connecting layer 70 extends into the first through hole 51 to form a first conductive hole, and another portion of the connecting layer 70 extends into the second through hole 52 to form a second conductive hole, wherein one first conductive hole 61 and one second conductive hole 62 form a set of conductive connecting holes, the length of the intra-group current path of each set is smaller than the length of the extra-group paths, and the length of any one intra-group current path is equal to the length of any other intra-group current path. The driving substrate (1) can reduce the current density and the voltage drop.

Description

[Technical Field]

[0001] CROSS-REFERENCE TO RELATED APPLICATIONS This application claims priority from a Chinese patent application bearing application number 2022113548004, filed on October 31, 2022, the entire contents of which are incorporated herein by reference.

[0002] The present application relates to the field of display technology, and in particular to a driving substrate and a display device. [Background technology]

[0003] Inorganic micro light-emitting diode (Micro LED) display devices are currently one of the hotspots in the research field of display devices. Compared with organic light-emitting diode (OLED) display devices, Micro LED display devices have advantages such as high reliability, low power consumption, high brightness, and fast response time.

[0004] Because the light-emitting elements of a display device are current-driven light-emitting elements, the design of signal lines through which a driving substrate supplies current to the light-emitting elements must take into account issues of voltage drop (IR drop) and current density. In the prior art, when designing the circuit wiring of a driving substrate, the presence of cross wires inevitably necessitates the presence of layer transition through holes for signal lines. That is, a first metal wiring on the driving substrate is transferred to a second metal wiring through a conductive hole and a connection layer, so that current can be transmitted from the first metal wiring to the second metal wiring through the conductive hole and the connection layer. To reduce the voltage drop during signal transmission and the current density along the transmission path, multiple conductive holes are typically provided, allowing the current to be distributed and transmitted through the multiple conductive holes, thereby reducing the current density and voltage drop.

[0005] However, in the conventional design of the multiple conductive holes in the drive substrate, the current is mainly transmitted from some of the conductive holes along the connection layer to other metal wiring, and only a small amount of current passes through other conductive holes, which causes the current on the connection layer to be excessively concentrated and dense, increasing the voltage drop along this path and causing the temperature to become too high, resulting in the electrical connection structure at this location being burned. Summary of the Invention [Problem to be solved by the invention]

[0006] The driving substrate and display device provided by the present application solve the problem that in conventional driving substrates, current mainly passes through a small number of conductive holes, resulting in excessive current concentration in the connection layer, high density, large voltage drop in the path, and excessively high temperature that burns the electrical connection structure at that location. [Means for solving the problem]

[0007] In order to solve the above technical problems, one technical solution adopted by the present application provides a driving substrate, the driving substrate including a substrate, a first metal layer, a first insulating layer, a second metal layer, a second insulating layer and a connection layer, the first metal layer is disposed on one side of the substrate, the first metal layer includes a first wiring, the first insulating layer is disposed on a side of the first metal layer away from the substrate and covers the first metal layer, the second metal layer is disposed on a side of the first insulating layer away from the substrate, the second metal layer includes a second wiring, the second insulating layer is disposed on a side of the second metal layer away from the substrate and covers the second metal layer, the first insulating layer and the second insulating layer define a first through hole to partially expose the first wiring, the second insulating layer defines a second through hole to partially expose the second wiring, the connection layer is disposed on a side of the second insulating layer away from the substrate, and a portion of the connection layer extends into the first through hole to form a first conductive hole. the other part of the connection layer extends into the second through hole to form a second conductive hole, so that the first wiring and the second wiring are electrically connected via the connection layer, and one of the first conductive hole and one of the second conductive hole form a set of conductive connection holes, wherein the driving substrate includes a plurality of sets of the conductive connection holes, and the conductive connection holes of each set have an intra-group current path and an extra-group path, in each set of the conductive connection holes, the current path formed from the first conductive hole through the connection layer to the corresponding second conductive hole is the intra-group current path, and in any one set of the conductive connection holes, the current path formed from the first conductive hole through the connection layer to the second conductive hole in the conductive connection hole of another set is the extra-group path, wherein the length of the intra-group current path of the conductive connection holes of each set is shorter than the length of the extra-group path, and the length of the intra-group current path of any one set of the conductive connection holes is equal to the length of the intra-group current path of the conductive connection holes of the other sets.

[0008] Here, the first wiring includes a first body portion and a first extension portion, one end of the first extension portion is connected to the first body portion, the first extension portion corresponds to the plurality of first through holes, and the plurality of first through holes are arranged on the same straight line along the extension direction of the first extension portion, the second wiring includes a second body portion and a second extension portion, one end of the second extension portion is connected to the second body portion, and the projection of the second extension portion onto the first metal layer is arranged offset from the first extension portion, the second extension portion corresponds to the plurality of second through holes, and the plurality of second through holes are arranged on the same straight line along the extension direction of the second extension portion, and are aligned with the first conductive holes and have a one-to-one correspondence, so that each of the first conductive holes and the corresponding second conductive holes form a set of the conductive connection holes, and the lengths of the internal current paths of each set of the conductive connection holes are equal.

[0009] Here, the plurality of first through holes are arranged in the same row along the extension direction of the first extension portion, the plurality of second through holes are arranged in the same row along the extension direction of the second extension portion, and the plurality of first through holes and the plurality of second through holes are distributed in an array, so that in the column direction of the array, the second conductive holes and the first conductive holes located in the same column correspond to each other to form a set of the conductive connection holes.

[0010] Here, the first wiring includes a first body portion and a plurality of first extension portions arranged at intervals, one end of the first extension portions is connected to the first body portion, and each of the first extension portions corresponds to at least one of the first through holes; the second wiring includes a second body portion and a plurality of second extension portions arranged at intervals, one end of the second extension portions is connected to the second body portion, the projections of the second extension portions onto the first metal layer are offset from the first extension portions and arranged alternately in sequence, each of the second extension portions corresponds to at least one of the second through holes; the first through holes and the second through holes are arranged alternately in sequence in at least one row along the arrangement direction of the first extension portions and the second extension portions; one of the first conductive holes and one of the adjacent second conductive holes in the same row form a set of the conductive connection holes, and the lengths of the internal current paths of the conductive connection holes in each set are equal.

[0011] Here, each of the first extension portions corresponds to a plurality of the first through holes, and the plurality of first through holes are arranged in the same row along the extension direction of the first extension portion; each of the second extension portions corresponds to a plurality of the second through holes, and the plurality of second through holes are arranged in the same row along the extension direction of the second extension portion, and are aligned with the plurality of first through holes in adjacent rows, so that the first through holes and the second through holes are arranged in multiple rows alternately in sequence along the arrangement direction of the first extension portions and the second extension portions, and one adjacent second conductive hole in the same column as the first conductive hole forms one set of the conductive connection holes, and two adjacent sets of conductive connection holes in the same column share one of the first through holes or one of the second through holes.

[0012] Here, multiple rows of the first through holes and multiple rows of the second through holes are arranged alternately in sequence to form an array, so that in each column, the current paths from the first through holes to the adjacent second through holes via the connection layer are all equal.

[0013] Here, the first through hole and the second through hole are both square holes or rectangular holes, and a pair of opposite sides of the edge of the first through hole and a pair of opposite sides of the edge of the second through hole are both parallel to the row direction of the first through holes or the second through holes arranged in the same row.

[0014] Here, the portion of the first wiring corresponding to the first through hole is arranged to overlap the portion of the second wiring corresponding to the second through hole, and the first through hole and the corresponding second through hole of each set of conductive connection holes are arranged coaxially, so that current is uniformly distributed to the internal current paths of each set of conductive connection holes along the circumferential direction of the first through hole or the second through hole.

[0015] Here, the first through hole and the second through hole are square holes or circular holes, and the edge line of the first through hole and the edge line of the second through hole are parallel to each other.

[0016] To solve the above technical problem, another technical solution adopted by this application provides a display device, the display device includes a light-emitting unit and a driving substrate, the light-emitting unit is used to display an image, the light-emitting unit includes a current-driven light-emitting element, the driving substrate is electrically connected to the light-emitting unit and is used to provide a driving signal to the light-emitting unit, and the driving substrate is the driving substrate according to the above technical solution. [Effects of the Invention]

[0017] The advantageous effects of the embodiments of the present application are as follows: Different from the prior art, in the driving substrate and display device provided by the embodiments of the present application, the driving substrate includes a substrate, a first metal layer, a first insulating layer, a second metal layer, a second insulating layer, and a connection layer, which are sequentially stacked, the first metal layer includes a first wiring, the second metal layer includes a second wiring, the first insulating layer and the second insulating layer have a first through-hole to partially expose the first wiring, and the second insulating layer has a second through-hole to partially expose the second wiring, wherein a part of the connection layer extends into the first through-hole to form a first conductive hole, and another part of the connection layer extends into the second through-hole to form a second conductive hole, so that the first wiring and the second wiring are electrically connected via the connection layer, and one first conductive hole and one second conductive hole form one set of conductive connection holes; in the present application, the driving substrate includes multiple sets of conductive connection holes, so that multiple sets of conductive connection holes can be formed. the current path formed from the first conductive hole in each set of conductive connection holes through the connection layer to the corresponding second conductive hole is defined as an intra-group current path, and the current path formed from the first conductive hole in any one set of conductive connection holes through the connection layer to the second conductive hole in another set of conductive connection holes is defined as an extra-group path, and the length of the intra-group current path of each set of conductive connection holes is shorter than the length of the extra-group path, so that the current is transmitted from the first wiring to the second wiring along the path of the first conductive hole, the connection layer, and the second conductive hole corresponding to the first conductive hole, that is, the current is transmitted from the first wiring to the second wiring along the intra-group current path of each set of conductive connection holes, so that the current transmission path is shortened and the load on the circuit transmission path there is reduced, thereby reducing the voltage drop in the connection layer. Furthermore, the length of the current path within any one set of conductive connection holes is equal to the length of the current path within the other sets of conductive connection holes, so that each set of conductive connection holes can distribute the current evenly within the transmission path formed in the connection layer, effectively dispersing the current, thereby reducing the current density in the connection layer, further increasing the width of the current transmission path, further reducing the load on the circuit transmission path there, and further reducing the voltage drop in the connection layer, effectively reducing the risk of the connection layer being burned out due to local excessive temperatures (high temperatures) caused by excessive current concentration. [Brief explanation of the drawings]

[0018] In order to more clearly describe the technical solutions in the embodiments of the present application, the following briefly describes the drawings that need to be used in the description of the embodiments. Obviously, the drawings in the following description are only some embodiments of the present application. Those skilled in the art can obtain other drawings from these drawings without any creative efforts. [Figure 1] 1 is a schematic cross-sectional view of a driving substrate according to an embodiment of the present application; [Figure 2] FIG. 2 is a structural schematic diagram showing the arrangement of conductive contact holes provided in the first comparative example of the present application. [Figure 3] 1 is a structural schematic diagram showing the arrangement of conductive connection holes provided by the first embodiment of the present application; FIG. [Figure 4] 1A and 1B are simulation diagrams of current distribution in the first comparative example and the first embodiment of the present application, where FIG. 1A is a simulation diagram of current distribution in the first comparative example of the present application, and FIG. 1B is a simulation diagram of current distribution in the first embodiment of the present application. [Figure 5] FIG. 2 is a structural schematic diagram showing the arrangement of conductive connection holes provided by the second embodiment of the present application. [Figure 6] FIG. 10 is a structural schematic diagram showing the arrangement of conductive connection holes provided by the third embodiment of the present application. [Figure 7] FIG. 10 is a structural schematic diagram showing the arrangement of conductive connection holes provided by the fourth embodiment of the present application. [Figure 8] 8 is a schematic cross-sectional view of the embodiment of FIG. 7 taken along the line AA. [Figure 9] FIG. 10 is a structural schematic diagram showing the arrangement of conductive contact holes provided in the fourth comparative example of the present application. [Figure 10] 10A and 10B are simulation diagrams of current distribution in the fourth comparative example and the fourth embodiment of the present application, where FIG. 10C is a simulation diagram of current distribution in the fourth comparative example of the present application, and FIG. 10D is a simulation diagram of current distribution in the fourth embodiment of the present application. [Figure 11]1 is a structural schematic diagram of a display device according to an embodiment of the present application; DETAILED DESCRIPTION OF THE INVENTION

[0019] Hereinafter, the technical solutions of the embodiments of the present application will be clearly and completely described with reference to the drawings of the embodiments of the present application. It should be understood that the described embodiments are only a part of the embodiments of the present application, but not all of them. Based on the embodiments of the present application, all other embodiments that a person skilled in the art can obtain without inventive efforts fall within the scope of protection of the present application.

[0020] The terms "first," "second," and "third" in this application are used for descriptive purposes only and should not be interpreted as indicating or implying relative importance or the number of technical features indicated. Therefore, features defined as "first," "second," and "third" can explicitly or implicitly include at least one of these features. In the description of this application, "plurality" means at least two, e.g., two, three, etc., unless otherwise clearly and specifically defined. All directional indications (up, down, left, right, front, rear, etc.) in the embodiments of this application are used only to describe the relative positional relationships between components in a specific position (as shown in the drawings), sports situations, etc.; when the specific position changes, the directional indications also change accordingly. Furthermore, the terms "comprise" and "have" and their variations are intended to cover a non-exclusive inclusion. For example, a process, method, system, product, or device comprising a series of steps or units is not limited to the listed steps or units, but may optionally include steps or units not listed, or may optionally include other steps or units, or may include other steps or units inherent to such process, method, product, or device.

[0021] Reference to an "embodiment" herein means that a particular feature, structure, or characteristic described in connection with that embodiment may be included in at least one embodiment of the present application. The appearances of this phrase in various places in the specification do not necessarily all refer to the same embodiment, nor are they separate or alternative embodiments mutually exclusive from other embodiments. Those skilled in the art will understand, either explicitly or implicitly, that the embodiments described herein can be combined with other embodiments.

[0022] The present application will be described in detail below with reference to the drawings and embodiments.

[0023] Referring to Figure 1, Figure 1 is a schematic cross-sectional view of a driving substrate according to an embodiment of the present application. In this embodiment, a driving substrate 1 is provided, which can be used in a display device 100 (see Figure 11) and provides current driving signals to the light-emitting units of the display device 100 to cause the light-emitting units to emit light. Specifically, the driving substrate 1 includes a substrate 10, a first metal layer 20, a first insulating layer 41, a second metal layer 30, a second insulating layer 42, and a connecting layer 70, which are stacked in order.

[0024] Here, the substrate 10 may be plate-shaped, and its shape and size can be set according to actual production needs. For example, the size, shape, material, etc. of the substrate 10 of the driving substrate 1 can be set according to factors such as the display area size of the display panel and the form of the display panel. The substrate 10 may be a flexible substrate or a rigid substrate. Specifically, the material of the substrate 10 may be an insulating material, such as glass, resin, or organic polymer material. The material of the substrate 10 may be a metal material, and an insulating layer must be further provided on the metal substrate to avoid problems such as short-circuiting with other metal layers in the driving substrate 1.

[0025] The first metal layer 20 is disposed on one side of the substrate 10, and includes a first wiring 21. Specifically, the first metal layer 20 is patterned to form the first wiring 21. The first wiring 21 is used to transmit signals, such as voltage signals or current signals. The material and thickness of the first metal layer 20 can be set according to actual needs, and the length, width, shape, and direction of the first wiring 21 can all be designed and selected according to actual needs.

[0026] The first insulating layer 41 is disposed on the side of the first metal layer 20 away from the substrate 10, and is used to cover and insulate the first metal layer 20, preventing the first metal layer 20 from shorting with other signal wiring and causing circuit abnormalities. The material and thickness of the first insulating layer 41 can be set according to actual needs and are not particularly limited.

[0027] The second metal layer 30 is disposed on the side of the first insulating layer 41 away from the substrate 10, and the second metal layer 30 includes a second wiring 31. Similar to the first wiring 21, the second wiring 31 can also be formed by patterning the second metal layer 30, and can be used to transmit signals, such as voltage signals or current signals. Similarly, the material and thickness of the second metal layer 30 can be set according to actual needs, and the length, width, shape, and direction of the second wiring 31 can all be designed and selected according to actual needs.

[0028] The second insulating layer 42 is disposed on the side of the second metal layer 30 away from the substrate 10, and is used to cover and insulate the second metal layer 30 to prevent the second metal layer 30 from shorting with other signal wiring and causing circuit abnormalities. Similarly, the material and thickness of the first insulating layer 41 can be set according to actual needs and are not particularly limited.

[0029] Here, the first insulating layer 41 and the second insulating layer 42 define a first through hole 51, which penetrates the second insulating layer 42 and the first insulating layer 41, thereby exposing a portion of the first wiring 21. The second insulating layer 42 defines a second through hole 52, which penetrates the second insulating layer 42, thereby exposing a portion of the second wiring 31.

[0030] Furthermore, a connection layer 70 is provided on the side of the second insulating layer 42 away from the substrate 10. A portion of the connection layer 70 extends into the first through-hole 51 to form a first conductive hole 61, and another portion of the connection layer 70 extends into the second through-hole 52 to form a second conductive hole 62, thereby electrically connecting the first wiring 21 and the second wiring 31 via the connection layer 70, thereby realizing signal transmission between the first wiring 21 and the second wiring 31. A specific signal transmission path is the first wiring 21 → first conductive hole 61 → connection layer 70 → second conductive hole 62 → second wiring 31, or the second wiring 31 → second conductive hole 62 → connection layer 70 → first conductive hole 61 → first wiring 21. The material of the connection layer 70 is specifically a conductive material, such as a metal material or an indium tin oxide (ITO) material, and is not particularly limited and can be selected according to actual needs to achieve electrical connection between the first wiring 21 and the second wiring 31. In this embodiment, the connection layer 70 is preferably made of ITO.

[0031] Referring to Figure 2, Figure 2 is a structural schematic diagram showing the arrangement of conductive through holes in a first comparative example of the present application. Similar to the embodiments of the present application, this example provides a substrate, which includes a substrate (not shown), a third metal layer (not shown), a third insulating layer (not shown), a fourth metal layer (not shown), a fourth insulating layer (not shown), and a connection layer 80, which are stacked in order. The structure of the substrate is similar to that of the driving substrate of the embodiments of the present application and will not be described in detail. For details, please refer to the above description. Here, the third metal layer includes the third wiring 22, the fourth metal layer includes the fourth wiring 32, the third through hole 53 penetrates the fourth insulating layer and the third insulating layer, thereby exposing a portion of the third wiring 22, and the fourth through hole 54 penetrates the fourth insulating layer, thereby exposing a portion of the fourth wiring 32. A portion of the connection layer 80 extends into the third through hole 53 to form a third conductive hole 63, and another portion of the connection layer 80 extends into the fourth through hole 54 to form a fourth conductive hole 64, thereby electrically connecting the third wiring 22 and the fourth wiring 32 via the connection layer 80.

[0032] Here, the third through holes 53 are arranged in an array of multiple rows and multiple columns, the fourth through holes 54 are disposed on one side of the third through holes 53, the number of the fourth through holes 54 is the same as the number of the third through holes 53, and the arrangement of the fourth through holes 54 corresponds to the third through holes 53 and is arranged in an array of multiple rows and multiple columns. In this embodiment, a case where the third through holes 53 and the fourth through holes 54 are arranged in an array of two rows and two columns is described as an example. Since current has the characteristic of transmitting by selecting the shortest path, in this embodiment, current flows concentratedly through the path between the two pairs of third through holes 53 and fourth through holes 54 that are closest to each other (indicated by solid arrows in FIG. 2), and only a small current or no current flows through the path between other third through holes 53 and fourth through holes 54 that are relatively far apart (indicated by dotted arrows in FIG. 2). As a result, only the two sets of third through holes 53 and fourth through holes 54 are effective through holes and play a major role in current transmission, while the other third through holes 53 and fourth through holes 54 have a relatively weak effect on current transmission and are therefore considered ineffective through holes. This is because a large amount of current needs to be transmitted through the two sets of third through holes 53 and fourth through holes 54, and the current is relatively concentrated and dense in the transmission path between these two sets of third through holes 53 and fourth through holes 54, which increases the voltage drop along this path and further increases the temperature of the connection layer 80, increasing the risk of burning the connection layer 80 or other wiring or components nearby. Therefore, to solve the above technical problem, the third through holes 53 and fourth through holes 54 need to be redesigned.

[0033] 3, which is a structural schematic diagram showing the arrangement of conductive connection holes according to the first embodiment of the present application. In this embodiment, one first conductive hole 61 and one corresponding second conductive hole 62 form a set of conductive connection holes 60, and the driving substrate 1 includes multiple sets of conductive connection holes 60, so that the current can be evenly distributed along the transmission path between each set of the first conductive hole 61 and the second conductive hole 62, reducing the current density along the transmission path and the voltage drop along the transmission path.

[0034] Specifically, each set of conductive contact holes 60 has an intra-group current path and an extra-group current path. Here, the intra-group current path is a current path formed in each set of conductive contact holes 60 from the first conductive hole 61 through the connecting layer 70 to the corresponding second conductive hole 62, i.e., a path formed by current flowing from the first conductive hole 61 through the connecting layer 70 to the second conductive hole 62 in each set of conductive contact holes 60. The extra-group current path is a current path formed from the first conductive hole 61 of any one set of conductive contact holes 60 through the connecting layer 70 to the second conductive hole 62 of another one of the conductive contact holes 60, i.e., a path formed by current flowing from the first conductive hole 61 of any one set of conductive contact holes 60 through the connecting layer 70 to the second conductive hole 62 of another one of the conductive contact holes 60.

[0035] In a specific embodiment, in each set of conductive connection holes 60, the length of the current path within the set is shorter than the length of the path outside the set, so that the shortest path is formed between the first conductive hole 61 and the second conductive hole 62 of each set of conductive connection holes 60, so that the current is transmitted from the first wiring 21 to the second wiring 31 along the shortest path, effectively shortening the current transmission path and reducing the load on the current transmission path, thereby reducing the voltage drop on the current transmission path.

[0036] Furthermore, among the multiple sets of conductive connecting holes 60, the length of the current path within any one set of conductive connecting holes 60 is equal to the lengths of the current paths within the other sets of conductive connecting holes 60, i.e., the current path lengths from the first conductive hole 61 through the connecting layer 70 to the second conductive hole 62 of each set of conductive connecting holes 60 are all the same, so that the current is uniformly distributed along the transmission path between the first conductive holes 61 and the second conductive holes 62 of each set, allowing each set of the first conductive holes 61 and the second conductive holes 62 to transmit current effectively, improving the effective utilization of the conductive holes and effectively dispersing the current, effectively reducing the current density along the transmission path, widening the current transmission path, further reducing the load on the circuit transmission path there, and further reducing the voltage drop along the transmission path, which effectively prevents the connection layer 70 from becoming too hot and reduces the risk of burning the connection layer 70 or other wiring and components nearby.

[0037] Specifically, the first wiring 21 includes a first body portion 211 and a first extension portion 212, one end of the first extension portion 212 is connected to the first body portion 211, and the first extension portion 212 corresponds to the plurality of first through holes 51, i.e., the first through hole 51 exposes a portion of the first extension portion 212, and the plurality of first through holes 51 are arranged on the same line along the extension direction of the first extension portion 212. The second wiring 31 includes a second body portion 311 and a second extension portion 312, one end of the second extension portion 312 is connected to the second body portion 311, and the projection of the second extension portion 312 onto the first metal layer 20 is arranged at a different position from the first extension portion 212, i.e., the projection of the second extension portion 312 onto the first metal layer 20 does not overlap with the first extension portion 212. The second extension portion 312 corresponds to a plurality of second through holes 52, i.e., the second through holes 52 expose a portion of the second extension portion 312, and the plurality of second through holes 52 are arranged in the same straight line along the extension direction of the second extension portion 312 and are respectively aligned with and correspond one-to-one to the plurality of first through holes 51, so that each first conductive hole 61 and the corresponding second conductive hole 62 form a set of conductive connection holes 60, and the lengths of the current paths within each set of conductive connection holes 60 are all equal.

[0038] Here, the first extension portion 212 and the second extension portion 312 may have a shape such as a rectangle, a wavy strip, a folded strip, etc., and can be specifically arranged according to actual needs. The plurality of first through holes 51 are arranged on the same line along the extension direction of the first extension portion 212, i.e., the extension direction of the connecting lines of the plurality of first through holes 51 is the same as the extension direction of the second extension portion 312. Similarly, the plurality of second through holes 52 are arranged on the same line along the extension direction of the second extension portion 312, i.e., the extension direction of the connecting lines of the plurality of second through holes 52 is the same as the extension direction of the second extension portion 312. For ease of installation and production, in this embodiment, the first extension portion 212 and the second extension portion 312 are arranged in a rectangular shape, the multiple first through holes 51 are arranged in the same row along the extension direction of the first extension portion 212, the multiple second through holes 52 are arranged in the same row along the extension direction of the second extension portion 312, and the multiple first through holes 51 and the multiple second through holes 52 are distributed in an array, and in the column direction of the array, the second conductive holes 62 and the first conductive holes 61 located in the same column correspond to form a set of conductive connection holes 60. That is, the plurality of first through holes 51 are arranged in a row at equal intervals, and the plurality of second through holes 52 are also arranged in a row at equal intervals and are arranged parallel to the first through holes 51 in the row, the spacing between the first through holes 51 and the spacing between the second through holes 52 are the same, and one second through hole 52 corresponds to and is arranged opposite one first through hole 51, so that each pair of oppositely arranged first conductive holes 61 and second conductive holes 62 form a pair of conductive connecting holes 60, the current paths within each pair of conductive connecting holes 60 are all equal, and the current is uniformly distributed along the transmission path between each pair of first conductive holes 61 and second conductive holes 62, so that each pair of first conductive holes 61 and second conductive holes 62 can effectively transmit current, improve the effective utilization rate of the conductive holes, effectively distribute the current, effectively reduce the current density on the transmission path, increase the width of the current transmission path, further reduce the load on the circuit transmission path, and further reduce the voltage drop along the transmission path. This effectively prevents the temperature of the connection layer 70 from becoming too high, reducing the risk of burning out the connection layer 70 or other wiring and components nearby.

[0039] Here, the first through hole 51 and the second through hole 52 are both square or rectangular holes, and one set of opposite edges of the first through hole 51 and one set of opposite edges of the second through hole 52 are both parallel to the row direction of the array, and another set of opposite edges of the first through hole 51 and the other set of opposite edges of the second through hole 52 are both parallel to the column direction of the array. Specifically, the sizes of the first through hole 51 and the second through hole 52 can be set according to actual needs, and the shape and size of the first through hole 51 can be the same as or different from the shape and size of the second through hole 52, and can be specifically set according to actual needs. In this embodiment, the shape and size of the first through hole 51 are the same as the shape and size of the second through hole 52, which facilitates production and reduces process complexity. At the same time, the shape and size of the first through holes 51 are the same as the shape and size of the second through holes 52, so that in each set of conductive connection holes 60, the side of the first through hole 51 closest to the second through hole 52 and the side of the second through hole 52 closest to the first through hole 51 can be aligned at both ends, thereby increasing the width of the current path within each set of conductive connection holes 60, and making the current more evenly distributed within the current path within each set of conductive connection holes 60. Furthermore, the current is further dispersed, reducing the current density and voltage drop.

[0040] Specifically, the number of conductive connection holes 60 can be set according to actual needs and is not particularly limited, for example, 2 sets, 4 sets, 6 sets, 8 sets, 12 sets, 15 sets, 18 sets, 20 sets, etc. In this embodiment, in order to facilitate comparison with the comparative example of FIG. 2 , four sets of conductive connection holes 60 are taken as an example, and four first conductive holes 61 are arranged in a row at equal intervals along the extension direction of the first extending portion 212, and four second conductive holes 62 are arranged in a row at equal intervals along the extension direction of the second extending portion 312, with the spacing distance between adjacent first conductive holes 61 and the spacing distance between adjacent second conductive holes 62 being the same, so that the four first conductive holes 61 and the four second conductive holes 62 are arranged in a 2-row, 4-column matrix. In the column direction, the second conductive holes 62 in the same column correspond to the adjacent first conductive holes 61 to form a set of conductive connection holes 60, so that the lengths of the current paths within each set of conductive connection holes 60 are equal, that is, in each column, the current paths from each first conductive hole 61 through the connection layer 70 to the second conductive hole 62 are equal and the shortest, so that the current paths within each set of conductive connection holes 60 play the same role in current transmission, and the current flows in a uniformly distributed manner through each set of conductive connection holes 60. Compared with the first comparative example, in this embodiment, the current transmitted to each set of conductive connection holes 60 is only half of the current transmitted to the effective through-holes in the first comparative example, and the width of the current transmission path in the connection layer 70 is twice as wide as that in the connection layer 70 in the first comparative example. That is, the load on the transmission path is half that of the first comparative example, the current density in the current transmission path on the connection layer 70 is half that of the first comparative example, and the voltage drop is one-fourth that of the first comparative example. The embodiment of the present application can effectively reduce the current density and voltage drop in the current path of the cross wire transition structure on the drive substrate 1, thereby effectively avoiding excessive temperature in the cross wire transition structure and reducing the risk of burning the connection layer 70 or other wiring or components nearby.

[0041] Referring to FIG. 4, FIG. 4 is a simulation diagram of current distribution in the first comparative example and the first embodiment of the present application, where FIG. 4(a) is a simulation diagram of current distribution in the first comparative example of the present application, and FIG. 4(b) is a simulation diagram of current distribution in the first embodiment of the present application. In the simulation, the same current magnitude is passed through the first comparative example and the present embodiment. As can be seen from FIG. 4(a), in the first comparative example, the current is mainly concentrated between the two closest pairs of third through holes 53 and fourth through holes 54, and the current density along the transmission path is relatively high. As can be seen from FIG. 4(b), in the present embodiment, the current is transmitted relatively uniformly between the first conductive hole 61 and the second conductive hole 62 of each pair of conductive connection holes 60, resulting in a wider transmission path and a smaller current density along the transmission path. As can be seen from the simulation results, the arrangement of the conductive connection holes 60 in the embodiment of the present application can effectively reduce the current density and voltage drop on the current path in the cross-wire transition structure on the driving substrate 1, thereby effectively preventing the temperature in the cross-wire transition structure from becoming too high and reducing the risk of burning the connection layer 70 or other wiring, components, etc. nearby.

[0042] 5 and 6, Fig. 5 is a structural schematic diagram showing the arrangement of conductive connection holes provided by a second embodiment of the present application, and Fig. 6 is a structural schematic diagram showing the arrangement of conductive connection holes provided by a third embodiment of the present application. In the second and third embodiments, the first wiring 21 includes a first body 211 and a plurality of first extensions 212 spaced apart from each other, one end of each first extension 212 is connected to the first body 211, i.e., one end of each first extension 212 is short-circuited by the first body 211, and each first extension 212 corresponds to at least one first through hole 51, i.e., each first extension 212 has at least one first through hole 51 exposing a portion of the first extension 212, so that a portion of the connection layer 70 extends into the first through hole 51 to form a first conductive hole 61, thereby electrically connecting to the first extension 212. The second wiring 31 includes a second main body portion 311 and a plurality of spaced apart second extension portions 312, one end of which is connected to the second main body portion 311, i.e., one end of each of the plurality of second extension portions 312 is short-circuited by the second main body portion 311, each second extension portion 312 corresponds to at least one second through hole 52, i.e., each second extension portion 312 has at least one second through hole 52 exposing a portion of the second extension portion 312, thereby allowing other portions of the connection layer 70 to extend into the second through hole 52 to form second conductive holes 62 and be electrically connected to the second extension portions 312, and the projections of the second extension portions 312 onto the first metal layer 20 are arranged alternately with the first extension portions 212 and are parallel to each other. Correspondingly, the first through holes 51 and the second through holes 52 are arranged in sequence with each other along the arrangement direction of the first extension portion 212 and the second extension portion 312, forming at least one row, with the first through holes 51 forming first conductive holes 61 and the second through holes 52 forming second conductive holes 62, so that one first conductive hole 61 and one adjacent second conductive hole 62 in the same row form a set of conductive connection holes 60, and the lengths of the current paths within each set of conductive connection holes 60 are all equal.

[0043] Here, for first through holes 51 and second through holes 52 in the same column, there are two second through holes 52 adjacent to a first through hole 51 in the column direction, and therefore a first conductive hole 61 formed by the first through hole 51 can form two sets of conductive connection holes 60 together with two conductive holes 62 formed by two adjacent second through holes 52. That is, the two sets of conductive connection holes 60 can share one first through hole 51, and current is transmitted from both sides of the same first conductive hole 61 through the connection layer 70 to the second conductive holes 62 of the two sets of conductive connection holes 60, and then via the two second conductive holes 62 to the second wiring 31. Similarly, the number of first through holes 51 adjacent to a second through hole 52 may also be two. As a result, the second conductive hole 62 formed by the second through hole 52 can form two sets of conductive connection holes 60 with the first conductive holes 61 formed by the two adjacent first through holes 51, and the two sets of conductive connection holes 60 can share one second through hole 52, and current flows from the two sets of two first conductive holes 61 through the connection layer 70 to both sides of the same second conductive hole 62, and is transmitted from both sides of the same second conductive hole 62 to the second wiring 31 via the second conductive hole 62. That is, by sharing the first through hole 51 or the second through hole 52 to form the conductive connection hole 60, the utilization rate of the first through hole 51 and the second through hole 52 can be improved, the current transmission efficiency can be improved, and the current density and voltage drop on the current path in the cross-wire transition structure in the driving substrate 1 can be further reduced, effectively preventing the temperature of the cross-wire transition structure from becoming too high and reducing the risk of the connection layer 70 or other wiring and components therein being burned. By reducing the number of the first through holes 51 and the second through holes 52, the same technical effect of dispersing the current and reducing the voltage drop can be achieved, thereby reducing the space occupied by the first through holes 51 and the second through holes 52 in the driving substrate 1 and increasing the design space for other components and structures.

[0044] As shown in FIG. 5 , in this embodiment, each first extension portion 212 corresponds to one first through hole 51, and each second extension portion 312 corresponds to one second through hole 52, and the first through holes 51 and the second through holes 52 are arranged alternately in a row along the arrangement direction of the first extension portions 212 and the second extension portions 312, and one first conductive hole 61 and one adjacent second conductive hole 62 form a pair of conductor connection holes 60, and two adjacent pairs of conductor connection holes 60 can share one first through hole 51 or one second through hole 52, and the current paths within each pair of conductive connection holes 60 are equal, thereby achieving the above-mentioned technical effects.

[0045] 6, in this embodiment, each first extending portion 212 corresponds to a plurality of first through holes 51, and the plurality of first through holes 51 are arranged in the same row along the extension direction of the first extending portion 212, so that all of the first through holes 51 are arranged in multiple rows. Each second extending portion 312 corresponds to a plurality of second through holes 52, and the plurality of second through holes 52 are arranged in the same row along the extension direction of the second extending portion 312, so that the second through holes 52 are arranged in multiple rows. The rows in which the first through holes 51 are located and the rows in which the second through holes 52 are located are arranged alternately, and the second through holes 52 in each row are aligned with the first through holes 51 in the adjacent row, so that the first through holes 51 and the second through holes 52 are arranged alternately in multiple rows along the arrangement direction of the first extending portions 212 and the second extending portions 312, and a first conductive hole 61 and an adjacent second conductive hole 62 in the same column form a pair of conductive connection holes 60, and two adjacent pairs of conductive connection holes 60 in the same column can share one first through hole 51 or one second through hole 52, and the lengths of the current paths within each pair of conductive connection holes 60 are all equal, thereby achieving the technical effects described above.

[0046] In this embodiment, multiple rows of first through holes 51 and multiple rows of second through holes 52 are alternately arranged to form an array, and in each column, the current paths from the first through holes 51 to the adjacent second through holes 52 via the connecting layer 70 are all equal, so that the current is uniformly distributed in the current paths formed by each group of conductive connecting holes 60, reducing the current density and voltage drop. At the same time, the first through holes 51 and the second through holes 52 are arranged in an array, which further uniformly distributes the current, optimizes the current spreading effect, and makes the arrangement of the first through holes 51 and the second through holes 52 more compact, which reduces the space occupied on the driving substrate 1 and provides more space for other structural designs.

[0047] In the second and third embodiments, the first through holes 51 and the second through holes 52 are both square or rectangular holes, and one pair of opposing edges of the first through holes 51 and one pair of opposing edges of the second through holes 52 are parallel to the row direction of the first through holes 51 or the second through holes 52 in the same row, i.e., parallel to the row direction of the array. The other pair of opposing edges of the first through holes 51 and the other pair of opposing edges of the second through holes 52 are parallel to the column direction of the array, i.e., adjacent edges of adjacent first through holes 51 and second through holes 52 are parallel to each other. Specifically, the sizes of the first through holes 51 and the second through holes 52 can be set according to actual needs, and the shape and size of the first through holes 51 can be the same as or different from the shape and size of the second through holes 52, and can be set according to actual needs. In this embodiment, the first through holes 51 and the second through holes 52 have the same shape and size, which facilitates production and reduces process complexity. At the same time, the first through holes 51 and the second through holes 52 have the same shape and size, which allows the sides of the first through holes 51 closest to the second through holes 52 in each set of conductive connecting holes 60 to be aligned at both ends with the sides of the second through holes 52 closest to the first through holes 51. This increases the width of the current path within each set of conductive connecting holes 60, which allows current to be distributed uniformly within the current path within each set of conductive connecting holes 60, further dispersing the current and reducing the current density and voltage drop.

[0048] Referring to Figures 7 and 8, Figure 7 is a structural diagram showing the arrangement of conductive connection holes provided by the fourth embodiment of the present application, and Figure 8 is a cross-sectional structural diagram of the embodiment of Figure 7 taken along the A-A direction. In this embodiment, a portion of the first through hole 51 corresponding to the first wiring 21 overlaps a portion of the second through hole 52 corresponding to the second wiring 31. The first through hole 51 and the second through hole 52 of each set of conductive connection holes 60 are arranged coaxially, and the diameter of the first through hole 51 is smaller than that of the second through hole 52, thereby exposing a portion of the second wiring 31 and electrically connecting the second wiring 31 to the connection layer 70. In each set of conductive connection holes 60, the length of the circuit path in the set is equal anywhere in the circumferential direction of the first through hole 51 or the second through hole 52. Current is uniformly distributed in the circuit path in each set of conductive connection holes 60 along the circumferential direction of the first through hole 51 or the second through hole 52. The current is distributed in the circumferential direction of the first through hole 51 and the second through hole 52, which further distributes the current, reduces the current density, decreases the voltage drop, and further improves the current transmission efficiency of the first through hole 51 and the second through hole 52. Furthermore, by arranging the first through hole 51 and the second through hole 52 coaxially, the length of the path that the current takes from the first conductive hole 61 of each set of conductive connection holes 60 through the connection layer 70 to the second conductive hole 62 can be effectively reduced, i.e., the current path within each set of conductive connection holes 60 can be significantly reduced, further reducing the load on the current transmission path and thereby further reducing the voltage drop. Furthermore, by arranging the first through hole 51 and the second through hole 52 coaxially, the space occupied by the through holes on the drive substrate 1 can be effectively reduced, providing more design space for other structures.

[0049] Specifically, the first through hole 51 and the second through hole 52 are square holes or circular holes, and the edge line of the first through hole 51 and the edge line of the second through hole 52 are parallel to each other. In addition, the fact that the edge line of the first through hole 51 and the edge line of the second through hole 52 are parallel to each other means that, when the first through hole 51 and the second through hole 52 are square holes, the edge line of the first through hole 51 and the edge line of the second through hole 52 each include four lines, and the four edge lines of the first through hole 51 are opposite and parallel to the four edge lines of the second through hole 52, respectively; and when the second through hole 52 and the second through hole 52 are circular holes, the edge lines of the first through hole 51 and the second through hole 52 are both circular, the circular edge line of the first through hole 51 and the circular edge line of the second through hole 52 are opposite and parallel to each other, and the projection of the edge line of the first through hole 51 and the edge line of the second through hole 52 onto the substrate 10 can be understood to be concentric circles. Because the edge lines of the first through holes 51 and the second through holes 52 are parallel to each other, in each set of conductive connection holes 60, the length of the current path within the set is the same everywhere in the circumferential direction of the first through holes 51 or the second through holes 52, so that the current is uniformly distributed in the current path within each set of conductive connection holes 60 along the circumferential direction of the first through holes 51 or the second through holes 52, and the current is uniformly distributed in the circumferential direction of the first through holes 51 and the second through holes 52.

[0050] Referring to FIG. 9, this is a structural schematic diagram showing the arrangement of conductive through holes provided in the fourth comparative example of the present application. In this embodiment, the fourth through hole 54 is located on one side of the third through hole 53. When a current is transmitted, the current is transmitted from the third through hole 53 along the connecting layer 80 to the fourth through hole 54, thereby achieving a cross-wire connection. It can be easily seen that, compared to the previous example, the fourth embodiment has a shorter current transmission path, a smaller voltage drop, and a more uniform current distribution in the circumferential direction of the first conductive hole 61 and the second conductive hole 62, resulting in a higher current transmission efficiency of the conductive connecting hole 60. Furthermore, compared to the fourth comparative example, the fourth embodiment requires fewer through holes to achieve the same current transmission size.

[0051] 10, which shows a simulation of current distribution in the fourth comparative example and the fourth embodiment of the present application, where FIG. 10(c) is a simulation of current distribution in the fourth comparative example and FIG. 10(d) is a simulation of current distribution in the fourth embodiment of the present application. The fourth comparative example was simulated using one third through hole 53 and one fourth through hole 54, and the fourth embodiment was simulated using one first through hole 51 and one second through hole 52. The same amount of current was applied to the fourth comparative example and the fourth embodiment during the simulation. As can be seen from the simulation results in the figure, the current in the fourth embodiment is more uniformly distributed through the first through hole 51 and the second through hole 52, the current density is relatively low, and the length of the current transmission path is shorter than in the fourth comparative example. This significantly reduces the load on the transmission path and the voltage drop, avoids excessive temperature, and effectively reduces the risk of burning the connection layer 70 or other wiring or components nearby.

[0052] 11, which is a structural schematic diagram of a display device provided in an embodiment of the present application. In this embodiment, a display device 100 is provided, which is used to display an image and can be used in the display field. Specifically, the display device 100 includes a light-emitting unit 2 and a driving substrate 1.

[0053] Here, the light emitting unit 2 is used to display an image, and includes a current-driven light emitting element 201, such as a light emitting diode (LED), a micro light emitting diode (Micro LED), a mini light emitting diode (Mini LED), and an organic light emitting diode (OLED) 20.

[0054] Here, the driving substrate 1 is electrically connected to the light-emitting unit 2 and is used to provide a driving signal to the light-emitting unit 2, thereby enabling the light-emitting unit 2 to display a corresponding image. Specifically, the specific structure and function of the driving substrate 1 are the same as or similar to those of the driving substrate 1 according to the above embodiment, and the same technical effects can be achieved. For details, please refer to the previous introduction, and a detailed description will be omitted here. The current in the driving substrate 1 is uniformly distributed along the transmission path, which can effectively reduce the current density and improve the width and length of the current transmission path. This not only reduces the load on the current signal transmission path, effectively reduces voltage drop, effectively prevents excessive temperature, and reduces the risk of burnout of the connection layer 70 and nearby wiring and components, but also improves the image display brightness of the light-emitting unit 2 and reduces the power consumption of the display device 100.

[0055] The above is merely an embodiment of the present application, and does not limit the patent scope of the present application. Any equivalent structure or equivalent process transformation made by utilizing the contents of the specification and drawings of the present application, or anything directly or indirectly applicable to other related technical fields, is similarly included within the scope of the claims of the present application.

Claims

1. A driving substrate including a substrate, a first metal layer, a first insulating layer, a second metal layer, a second insulating layer, and a connection layer, the first metal layer is disposed on one side of the substrate, the first metal layer including a first wiring; the first insulating layer is disposed on a side of the first metal layer away from the substrate and covers the first metal layer; the second metal layer is disposed on a side of the first insulating layer away from the substrate, and the second metal layer includes a second wiring; the second insulating layer is disposed on a side of the second metal layer away from the substrate and covers the second metal layer, the first insulating layer and the second insulating layer define a first through hole through which the first wiring is partially exposed, and the second insulating layer defines a second through hole through which the second wiring is partially exposed; the connection layer is disposed on a side of the second insulating layer away from the substrate, a portion of the connection layer extends into the first through hole to form a first conductive hole, and another portion of the connection layer extends into the second through hole to form a second conductive hole, whereby the first wiring and the second wiring are electrically connected via the connection layer, and one of the first conductive holes and one of the second conductive holes form one set of conductive connection holes; wherein the driving substrate includes a plurality of sets of the conductive connection holes, each set of the conductive connection holes having an in-set current path and an out-set path, and in each set of the conductive connection holes, the current path formed from the first conductive hole through the connection layer to the corresponding second conductive hole is the in-set current path, and the current path formed from the first conductive hole in any one set of the conductive connection holes through the connection layer to the second conductive hole in another set of the conductive connection holes is the out-set path, Here, the length of the current path within each set of conductive connection holes is smaller than the length of the path outside the set, and the length of the current path within any one set of conductive connection holes is equal to the length of the current path within another set of conductive connection holes.

2. the first wiring includes a first body portion and a first extension portion, one end of the first extension portion is connected to the first body portion, the first extension portion corresponds to the plurality of first through holes, and the plurality of first through holes are arranged on the same straight line along an extension direction of the first extension portion, 2. The driving substrate of claim 1, wherein the second wiring includes a second body portion and a second extension portion, one end of the second extension portion is connected to the second body portion, a projection of the second extension portion onto the first metal layer is offset from the first extension portion, the second extension portion corresponds to a plurality of the second through holes, the plurality of second through holes are arranged on the same line along the extension direction of the second extension portion, and are aligned with the first conductive holes one-to-one, so that each of the first conductive holes and the corresponding second conductive holes form a set of the conductive connection holes, and the lengths of the internal current paths of each set of the conductive connection holes are equal.

3. 3. The driving substrate of claim 2, wherein the plurality of first through holes are arranged in the same row along the extension direction of the first extension portion, the plurality of second through holes are arranged in the same row along the extension direction of the second extension portion, and the plurality of first through holes and the plurality of second through holes are distributed in an array, so that in the column direction of the array, the second conductive holes and the first conductive holes located in the same column correspond to form a set of the conductive connection holes.

4. the first through holes and the second through holes are both square holes or rectangular holes, and a pair of opposing sides of an edge of the first through hole and a pair of opposing sides of an edge of the second through hole are parallel to a row direction of the first through holes arranged in the same row or the second through holes arranged in the same row, The driving substrate described in claim 3, characterized in that the shape and size of the first through hole are the same as the shape and size of the second through hole, and in each set of conductive connection holes, the side of the first through hole closer to the second through hole and the side of the second through hole closer to the first through hole are aligned at both ends.

5. The drive substrate according to claim 2 , wherein the first extension portion and the second extension portion have a rectangular, wavy, or curved strip shape.

6. the first wiring includes a first body portion and a plurality of first extension portions arranged at intervals, one end of each of the first extension portions is connected to the first body portion, and each of the first extension portions corresponds to at least one of the first through holes; 2. The drive substrate of claim 1, wherein the second wiring includes a second body portion and a plurality of second extension portions arranged at intervals, one end of the second extension portions is connected to the second body portion, projections of the second extension portions onto the first metal layer are offset from the first extension portions and arranged alternately in sequence, each second extension portion corresponds to at least one of the second through holes, the first through holes and the second through holes are arranged alternately in sequence in at least one row along the arrangement direction of the first extension portions and the second extension portions, one of the first conductive holes and one of the adjacent second conductive holes in the same row form one set of the conductive connection holes, and the lengths of the internal current paths of the conductive connection holes in each set are equal.

7. The driving substrate of claim 6, characterized in that each of the first extension portions corresponds to one of the first through holes, each of the second extension portions corresponds to one of the second through holes, the first through holes and the second through holes are arranged alternately in a row along the arrangement direction of the first extension portions and the second extension portions, one of the first conductive holes and one of the adjacent second conductive holes form one set of the conductive connection holes, and two adjacent sets of the conductive connection holes share one of the first through holes or one of the second through holes.

8. 7. The driving substrate of claim 6, wherein each of the first extension portions corresponds to a plurality of the first through holes, and the plurality of first through holes are arranged in the same row along the extension direction of the first extension portion; each of the second extension portions corresponds to a plurality of the second through holes, and the plurality of second through holes are arranged in the same row along the extension direction of the second extension portion and are aligned with the plurality of first through holes in adjacent rows, so that the first through holes and the second through holes are alternately arranged in multiple columns along the arrangement direction of the first extension portions and the second extension portions; one adjacent second conductive hole in the same column as a first conductive hole forms one set of the conductive connection holes; and two adjacent sets of conductive connection holes in the same column share one of the first through holes or one of the second through holes.

9. The driving substrate described in claim 8, characterized in that multiple rows of the first through holes and multiple rows of the second through holes are arranged alternately in sequence to form an array, so that in each column, all current paths from the first through holes through the connection layer to the adjacent second through holes are equal.

10. The driving substrate described in claim 6, characterized in that the first through hole and the second through hole are both square holes or rectangular holes, and a pair of opposing sides of the edge of the first through hole and a pair of opposing sides of the edge of the second through hole are both parallel to the row direction of the first through holes arranged in the same row or the second through holes arranged in the same row.

11. The driving substrate of claim 10, characterized in that the shape and size of the first through holes are the same as the shape and size of the second through holes, and in each set of conductive connection holes, the side of the first through hole closer to the second through hole and the side of the second through hole closer to the first through hole are aligned at both ends.

12. The driving substrate of claim 1, characterized in that the portion of the first wiring corresponding to the first through hole is arranged to overlap the portion of the second wiring corresponding to the second through hole, and the first through hole and the corresponding second through hole of each set of conductive connection holes are arranged coaxially, so that current is uniformly distributed to the internal current paths of each set of conductive connection holes along the circumferential direction of the first through hole or the second through hole.

13. The driving substrate of claim 12 , wherein the first through-hole and the second through-hole are square or circular holes, and an edge line of the first through-hole and an edge line of the second through-hole are parallel to each other.

14. 16. The drive substrate according to claim 15, wherein the diameter of the first through-hole is smaller than the diameter of the second through-hole.

15. 2. The driving substrate according to claim 1, wherein in each set of the conductive connection holes, the current is uniformly distributed along the current path within the set.

16. A display device including a light-emitting unit and a driving substrate, The light emitting unit is used for displaying an image, and the light emitting unit includes a current-driven light emitting element; The display device, wherein the driving board is electrically connected to the light emitting unit and is used to provide a driving signal to the light emitting unit, and the driving board is the driving board according to claim 1.

17. 17. The display device according to claim 16, wherein the light-emitting unit includes a current-driven light-emitting element.

Images