Low-temperature, low-abundance atomic object dispensing

Abstract

Methods and dispensers for dispensing atomic objects are provided. One exemplary method for dispensing atomic objects includes depositing a composition including a reactant and the atomic object inside a crucible chamber of a crucible and heating the composition including the atomic object to an atomization reaction temperature that causes an atomization chemical reaction. The reactant includes a material that is a participant in the atomization chemical reaction, the result of the atomization chemical reaction is an elemental atomic object, and (c) the elemental atomic object is dispensed during the atomization chemical reaction.

Description

[Technical Field]

[0001] CROSS-REFERENCE TO RELATED APPLICATIONS This application claims priority to and the benefit of U.S. Provisional Application No. 63 / 412,247, filed September 30, 2022, entitled "LOW TEMPERATURE LOW-ABUNDANCE ATOMIC OBJECT DISPENSING METHODS," the contents of which are incorporated herein by reference in their entirety.

[0002] Various embodiments relate to devices, systems, and methods related to dispensing low-abundance atomic objects. For example, some embodiments relate to dispensing low-abundance atomic objects at low chemical reaction temperatures. [Background technology]

[0003] Ion traps can trap multiple atomic objects within a potential well using a combination of electric and magnetic fields. Atomic objects can be trapped for many purposes, which may include, for example, mass analysis, research, and / or quantum state control. In some cases, the atomic objects to be trapped may be available in small quantities. For example, atomic objects may pose radioactive or other safety concerns in large quantities, be very expensive, difficult to obtain or manufacture, and / or the like. Through dedicated effort, ingenuity, and innovation, many deficiencies in conventional atomic object dispensers and / or dispensing techniques have been overcome by developing structured solutions in accordance with embodiments of the present invention, many examples of which are described in detail herein. Summary of the Invention [Means for solving the problem]

[0004] Exemplary embodiments provide methods, systems, devices, computer program products, and / or the like that dispense atomic objects using only small amounts of a composition comprising the atomic objects, such that the kinetic energy of the dispensed atomic objects allows the atomic objects to be captured and / or confined within an atomic object confinement device. For example, various embodiments may be used to load atomic objects that are available only in small amounts due to safety, availability, and / or other concerns into an atomic object confinement device (e.g., a surface ion trap, a three-dimensional ion trap, a magneto-optical trap, and / or the like). For example, various embodiments may be used to load radioactive atomic objects (e.g., 133 In various embodiments, the atomic object is an ion or an atom.

[0005] In various embodiments, the atomic objects are available and / or provided as part of a composition that includes the atomic objects, hi various embodiments, the composition that includes the atomic objects must undergo at least one decomposition and / or atomization chemical reaction to produce elemental atomic objects (e.g., atomic objects that are not part of a molecule but rather individual atomic objects).

[0006] According to one aspect of the present disclosure, a method for dispensing atomic objects is provided. In an exemplary embodiment, the method includes depositing a composition including a reactant and an atomic object inside a crucible chamber of a crucible, the crucible being disposed in a pressure-controlled chamber, and heating the composition including the atomic object to an atomizing reaction temperature that causes an atomizing chemical reaction. The reactant includes a material that is a participant in the atomizing chemical reaction. The result of the atomizing chemical reaction is an elemental atomic object. The elemental atomic object is dispensed during the atomizing chemical reaction.

[0007] In an exemplary embodiment, the atomization chemical reaction is a reduction reaction, and the material is a reducing agent in the atomization chemical reaction. In an exemplary embodiment, the atomic object is barium (Ba) atoms, the reducing agent is tantalum (Ta), and the atomization reaction temperature is less than 900°C. In an exemplary embodiment, the reaction component includes tantalum (Ta) powder. In an exemplary embodiment, the reaction component includes tantalum (Ta) mesh. In an exemplary embodiment, the reaction component includes tantalum (Ta) foil. In an exemplary embodiment, the atomic object is barium (Ba) atoms, the material is tantalum (Ta), and the atomization reaction temperature is approximately 800°C. In an exemplary embodiment, the method further includes, prior to inducing the atomization chemical reaction, heating the crucible to a decomposition reaction temperature to induce a decomposition chemical reaction, the atomization chemical reaction being carried out using at least a portion of the molecules produced by the decomposition chemical reaction. In an exemplary embodiment, the decomposition reaction temperature is approximately 600°C. In an exemplary embodiment, the dispenser is coupled to a first pressure-controlled chamber during the decomposition chemical reaction and to a second pressure-controlled chamber during dispensing of the atomic objects. In an exemplary embodiment, the method further includes heating the crucible to a degassing temperature for at least one hour before inducing the atomization chemical reaction. In an exemplary embodiment, the atomic objects are radioactive. In an exemplary embodiment, the method further includes capturing the dispensed elemental atomic objects using an atomic object confinement device. In an exemplary embodiment, the atomic object confinement device is a component of a quantum computer. In an exemplary embodiment, the composition including the atomic objects is an aqueous solution. In an exemplary embodiment, the atomic objects are barium (Ba) atoms, and the composition including the atomic objects is barium nitrate.

[0008] The invention is described in general terms and with reference to the accompanying drawings, which are not necessarily to scale. [Brief explanation of the drawings]

[0009] [Figure 1] 1 is a flowchart illustrating various processes, operations, and / or procedures for dispensing atomic objects in accordance with an illustrative embodiment. [Figure 2A] 1 is a cross-sectional view of an exemplary dispenser according to one exemplary embodiment. [Figure 2B] FIG. 1 illustrates an enlarged view of an exemplary crucible liner that may be used in a dispenser, according to one exemplary embodiment. [Figure 2C] FIG. 10 is a close-up view of an exemplary opening cap for a crucible liner that may be used in a dispenser, according to one exemplary embodiment. [Figure 2D] FIG. 10 is a close-up view of an exemplary crucible liner with an opening cap that may be used in a dispenser, according to one exemplary embodiment. [Figure 3] FIG. 1 is a schematic diagram illustrating an exemplary quantum computing system including an atomic object confinement device loaded with atomic objects using a dispenser of an exemplary embodiment. [Figure 4] FIG. 1 is a schematic diagram of an example controller of a quantum computer configured to perform one or more deterministic reshaping and / or reordering functions, according to various embodiments. [Figure 5] FIG. 1 is a schematic diagram of an exemplary computing entity of a quantum computer system that may be used by an exemplary embodiment. DETAILED DESCRIPTION OF THE INVENTION

[0010] The present invention will now be described in more detail below with reference to the accompanying drawings, in which some, but not all, embodiments of the invention are shown. Indeed, the present invention may be embodied in many different forms and should not be construed as limited to the embodiments set forth herein; rather, these embodiments are provided so that this disclosure will satisfy applicable legal requirements. The term "or" (also written " / ") is used herein in both an alternative and connective sense, unless otherwise noted. The terms "exemplary" and "exemplary" are used as examples without denoting a level of quality. The terms "generally," "substantially," and "about" refer to within engineering and / or manufacturing tolerances and / or user measurement capabilities, unless otherwise noted. Like numbers refer to like elements throughout.

[0011] In various embodiments, methods, devices, systems, computer program products, and / or the like are provided for dispensing atomic objects using small amounts of compositions comprising the atomic objects. For example, various embodiments may be used to load atomic objects that are available in small amounts due to safety, availability, and / or other concerns into atomic object containment devices (e.g., surface ion traps, three-dimensional ion traps, magneto-optical traps, and / or the like). For example, various embodiments may be used to load radioactive atomic objects (e.g., 133 The present invention provides a method and / or an atomic object dispenser for loading an atomic object (Ba) into an atomic object containment device. In various embodiments, the atomic object is an ion or an atom.

[0012] In various embodiments, the atomic object is available or provided as part of a composition that includes the atomic object. For example, in various embodiments, the atomic object is a radioisotope (e.g., 133Ba), which may generally only be available in aqueous solutions (e.g., dilute saline). In various embodiments, a composition including atomic objects must undergo at least one decomposition and / or atomization chemical reaction to produce elemental atomic objects (e.g., atomic objects that are not part of a molecule but rather individual atomic objects). For example, a composition including atomic objects may be heated to a decomposition reaction temperature that causes a decomposition chemical reaction to produce a partially decomposed composition including the atomic objects. A partially decomposed composition including atomic objects may be heated to an atomization reaction temperature that causes an atomization chemical reaction to produce elemental atomic objects. In some embodiments, an atomization chemical reaction may be used to produce elemental atomic objects from a composition including atomic objects (e.g., a decomposition chemical reaction may not be necessary in some embodiments).

[0013] As used herein, an atomization chemical reaction is a chemical reaction that starts with a composition that includes atomic objects and / or a partially decomposed composition that includes atomic objects, and results in elemental atomic objects. As used herein, a decomposition chemical reaction is a chemical reaction that starts with a composition that includes atomic objects, and results in a partially decomposed composition that includes atomic objects, but in which a significant portion of the atomic objects are not in elemental form (e.g., are part of molecules).

[0014] In various embodiments, atomic objects are efficiently captured and / or confined within an atomic object confinement device loaded with atomic objects when at least a threshold ratio and / or threshold percentage of atomic objects dispensed within the atomic object confinement device can be captured by the atomic object confinement device. An atomic object can be captured by the atomic object confinement device when the kinetic energy of the atomic objects dispensed within the atomic object confinement device is less than or equal to the depth of the potential well created by the atomic object confinement device at the loaded position. As will be appreciated, for a population of atomic objects (e.g., atomic objects dispensed from dispenser 200), the average kinetic energy E of the atomic objects within the population of atomic objects can be calculated by the atomic object confinement device. k teeth,

[0015]

number

[0016] where k is the Boltzmann constant and T is the temperature in Kelvin of the collection of atomic objects. In an exemplary embodiment, the atomization reaction temperature and / or potential well depth is determined by the average kinetic energy E of the atomic objects dispensed through the dispensing aperture. k is approximately 0.4 to 0.6 times the potential well depth of the atomic object confinement device (e.g., 0.5 times the potential well depth) in the loading configuration, such that the atomic object confinement device can efficiently capture atomic objects dispensed from dispenser 200 (possibly after photoionizing or otherwise ionizing the atomic objects).

[0017] In one exemplary embodiment, the atomic object is radioactive barium 133 Ba. For example, radioactive barium 133Safety concerns due to the radioactivity of Ba have arisen due to the large amounts of radioactive barium 133 This prevents Ba from being readily available and / or being able to be used safely. Furthermore, radioactive barium, which is a synthetic element and not found in nature, is 133 Due to the difficulty of producing Ba, radioactive barium is not generally available in elemental form. 133 In one exemplary embodiment, the composition comprising the atomic object is radioactive barium nitrate. 133 The decomposition chemical reaction is that radioactive barium nitrate decomposes into radioactive barium oxide (e.g., 133 Ba(NO3)2 → BaO 1+x The decomposition reaction temperature may be approximately 600°C. The atomization chemical reaction may then be carried out such that radioactive barium oxide decomposes to produce elemental radioactive barium (e.g., 5 when tantalum (Ta) is used as a reducing agent). 133 BaO+2Ta→5 133 Ba(g)+TaO) atomization reaction temperature. In this exemplary embodiment, the atomization reaction temperature is about 800° C. In various exemplary embodiments, the atomization reaction temperature is at least 800° C. and can exceed 1000° C. Various embodiments described herein advantageously enable lower decomposition reaction temperatures and lower atomization reaction temperatures compared to at least some traditional atomic object dispensing methods.

[0018]

[0013] Figure 1 presents a flowchart illustrating an exemplary technique for dispensing atomic objects from a dispenser using small amounts of a composition including the atomic objects. Several exemplary embodiments of dispensers that may be used to dispense atomic objects using small amounts of a composition including the atomic objects are shown in Figure 2A. In particular, Figure 2A illustrates a cross-sectional view of several exemplary embodiments of a dispenser 200, such as a Radak I and / or modified Radak I oven manufactured by Luxel.

[0019] In various embodiments, the dispenser 200 is an oven that includes a crucible 210 configured to cause a decomposition and / or atomization chemical reaction to occur therein. For example, the crucible 210 defines a crucible chamber 240 in which a composition including atomic objects and reactive components is disposed (e.g., deposited) to promote the decomposition and / or atomization chemical reaction.

[0020] Dispenser 200 includes a heating component 270 that includes at least one heating element and is configured to heat at least a portion of crucible 210. In an exemplary embodiment, heating component 270 includes a heating element that surrounds at least a portion of crucible 210. In various embodiments, crucible 210 is disposed substantially within heating component 270. For example, in various embodiments, heating component 270 defines an interior cavity configured to receive at least a portion of crucible 210 therein, such that a heating element (e.g., a filament, a wire coil, and / or the like) of heating component 270 surrounds at least a portion of (e.g., the exterior of) the crucible. In this manner, the heating component can be configured to uniformly heat crucible 210.

[0021] As shown in FIG. 2A , in an exemplary embodiment, dispenser 200 further includes outer cover 220 (e.g., a metal cover) configured to be disposed over crucible 210 and heating component 270. In the exemplary embodiment, as shown in FIG. 2A , crucible 210 and heating component 270 may be coupled to and / or secured within an end of outer cover 220. For example, in some embodiments, heating component 270 may be mounted on and / or include base 255, and crucible 210 may be disposed within an interior cavity defined by heating component 270, such that crucible 210 and heating component 270 (or at least a portion thereof) may be secured within an end of outer cover 220. In some embodiments, outer cover 220 may be coupled to and / or secured to base 255 using one or more coupling mechanisms. For example, in the illustrated embodiment of FIG. 2A , outer cover 220 may be coupled to and / or secured to base 255 using one or more attachment mechanisms to thread onto base 255. In some embodiments, dispenser 200 may be coupled to and / or secured to a flange (not shown) configured to secure dispenser 200 to a pressure control chamber such that crucible 210 is disposed within the pressure control chamber. For example, the flange may be configured to secure dispenser 200 to a pressure control chamber such that atomic objects are dispensed within the pressure control chamber. As shown in FIG. 2A , in some embodiments, dispenser 200 may include a mounting ridge 290 (e.g., a threaded mounting ridge) configured to couple and / or secure the dispenser to a flange (not shown). In the embodiment shown in FIG. 2A , mounting ridge 290 may be a ¼-20 threaded mounting ridge. However, in some embodiments, the mounting ridge may be a threaded mounting ridge of a different size.

[0022] 2A also includes a baffle structure 245 (e.g., a radiation baffle structure) configured to shield a portion of the pressure-controlled chamber (e.g., a vacuum chamber) from heat radiated from the heating component 270 and / or the crucible 210 during decomposition and / or atomization chemical reactions (e.g., crucible heat load). For example, in various embodiments, the baffle structure 245 is positioned between the outer cover 220 and the crucible 210 (or the heating component 270, where the heating component includes a heating element that surrounds at least a portion of the exterior of the crucible 210). In various embodiments, the baffle structure 245 substantially surrounds the exterior of the crucible 210 and / or the heating component 270.

[0023] Various other dispensers may be used in various embodiments. For example, generally, Figure 2A illustrates one exemplary embodiment of dispenser 200 including crucible 210 and heating component 270 configured to heat crucible 210. In some embodiments, dispenser 200 may include vapor shield 275. In some embodiments, dispenser 200 may further include a cooling component (not shown) configured to cool at least a portion of crucible 210.

[0024] In various embodiments, crucible 210 includes a crucible wall and a crucible bottom end 211, where crucible wall 214 and crucible bottom end 211 define a tube. In one illustrative example, the tube defined by crucible wall 214 is generally cylindrical and / or semi-conical. For example, a cross-section of the tube defined by crucible wall 214 taken in a plane substantially perpendicular to the longitudinal axis 205 defined by the tube may be circular. In various other embodiments, a cross-section of the tube defined by crucible wall 214 taken in a plane substantially perpendicular to the longitudinal axis 205 defined by the tube may have various shapes, such as a regular or irregular polygon, an ellipse, and / or the like, as appropriate for the application. In various embodiments, the length of the tube defined by crucible walls 214 in a direction substantially parallel to longitudinal axis 205 is greater than the width (e.g., radius or diameter) of the tube in a plane substantially perpendicular to longitudinal axis 205. For example, in one exemplary embodiment, the length of the tube defined by crucible walls 214 along longitudinal axis 205 (e.g., the length of crucible 210) is about 1 inch, and the outer diameter of the tube in a cross section taken generally perpendicular to longitudinal axis 205 is about 0.5 inch. In some embodiments, the length of the tube defined by crucible walls 214 along longitudinal axis 205 may be greater than or less than 1 inch. In some embodiments, the outer diameter of the tube in a cross section taken generally perpendicular to longitudinal axis 205 may be greater than or less than 0.5 inch. For example, in some embodiments, the outer diameter of the tube in a cross section taken generally perpendicular to the longitudinal axis 205 may be in the range of 0.3 inches to 0.6 inches. In one exemplary embodiment, the crucible 210 may have a length (e.g., the length of the tube defined by the crucible walls 214 along the longitudinal axis 205) of about 1.06 inches (27 mm), an outer diameter (e.g., the outer diameter of the tube in a cross section taken generally perpendicular to the longitudinal axis 205) of about 0.5 inches (12.8 mm), and an inner diameter (e.g., the inner diameter of the tube in a cross section taken generally perpendicular to the longitudinal axis 205) of about 0.35 inches (8.9 mm).In some embodiments, the crucible 210 can have an inner diameter greater than or less than 0.35 inches. In various embodiments, the tube defines an internal cavity having a volume in the range of 0.5 cc to 2.5 cc. In various embodiments, the tube defines an internal cavity having a volume of approximately 1.0 cc.

[0025] In various embodiments, bottom end 211 closes one end of a tube defined by crucible wall 214 and bottom end 211. In various embodiments, crucible wall 214 and bottom end 211 are made from a material (e.g., a thermally conductive material) such as stainless steel, alumina, aluminum, and / or the like that allows crucible 210 to be heated (e.g., via heating component 270). For example, crucible wall 214 and bottom end 211 are made from a material that can withstand the temperatures of the heating components imparted to crucible wall 214 and bottom end 211 during the decomposition and / or atomization chemical reaction without melting or otherwise deforming crucible wall 214 and / or bottom end 211. In one exemplary embodiment, crucible wall 214 and / or bottom end 211 have a melting temperature that is higher (e.g., significantly higher) than the atomization reaction temperature. For example, crucible wall 214 and / or bottom end 211 may have a melting temperature greater than 1300° C.

[0026] In various embodiments, a layer of another material may be disposed within crucible 210. For example, in the embodiment of FIG. 2A, a crucible liner 215 is disposed within crucible 210. FIG. 2B shows an enlarged view of exemplary crucible liner 215. In various embodiments, crucible liner 215 may be made from the same material as the reactive components. For example, if the reactive components include tantalum and the atomic object is barium, 133 In the exemplary embodiment where Ba is used, the crucible liner 215 may include tantalum (e.g., a tantalum crucible liner). It should be understood that in other embodiments, the crucible liner 215 may be made from other materials, including tungsten, nickel, molybdenum, and / or the like, and may not be the same as the reducing agent.

[0027] In various embodiments, the crucible liner 215 includes a crucible liner wall 216 and a crucible liner bottom end 212 that defines a tube. In one exemplary embodiment, the tube defined by the crucible liner wall 216 and the crucible liner bottom end 212 is generally cylindrical and / or semi-conical. For example, a cross-section of the tube defined by the crucible liner wall 216 and the crucible liner bottom end 212 taken in a plane substantially perpendicular to the longitudinal axis 205 defined by the tube may be circular. In various other embodiments, a cross-section of the tube defined by the crucible liner wall 216 and the crucible liner bottom end 212 taken in a plane substantially perpendicular to the longitudinal axis 205 defined by the tube may have various shapes, such as a regular or irregular polygon, an ellipse, and / or the like, as appropriate for the application. In various embodiments, the length of the tube defined by the crucible liner wall 216 and the crucible liner bottom end 212 in a direction substantially parallel to the longitudinal axis 205 is greater than the width (e.g., radius or diameter) of the tube in a plane substantially perpendicular to the longitudinal axis 205. For example, in one exemplary embodiment, the length of the tube defined by the crucible liner wall 216 and the crucible liner bottom end 212 along the longitudinal axis 205 (e.g., the length of the crucible 215) is approximately 1.1 inches (27.65 mm), and the outer diameter of the tube defined by the crucible liner wall 216 and the crucible liner bottom in a cross section taken generally perpendicular to the longitudinal axis 205 is approximately 0.345 inches (8.8 mm). In some embodiments, the length of the tube defined by the crucible liner wall 216 along the longitudinal axis 205 may be greater than or less than 1.1 inches. In some embodiments, the outer diameter of the tube defined by the crucible liner wall 216 and the crucible liner bottom end 212 in a cross section taken generally perpendicular to the longitudinal axis 205 may be greater than or less than 0.345 inches. For example, in some embodiments, the outer diameter of the tube defined by the crucible liner wall 216 and the crucible liner bottom end 212 in a cross section taken generally perpendicular to the longitudinal axis 205 may be in the range of 0.2 inches to 0.5 inches.In one exemplary embodiment, the crucible liner 215 may have a length (e.g., the length of the tube defined by the crucible liner walls 216 and the crucible liner bottom end 212 along the longitudinal axis 205) of about 1.1 inches (27.65 mm), an outer diameter (e.g., the outer diameter of the tube defined by the crucible liner walls 216 and the crucible liner bottom end 212 in a cross section taken generally perpendicular to the longitudinal axis 205) of about 0.345 inches (8.8 mm), and an inner diameter (e.g., the inner diameter of the tube defined by the crucible liner walls 216 and the crucible liner bottom end 212 in a cross section taken generally perpendicular to the longitudinal axis 205) of about 0.295 inches (7.5 mm). In some embodiments, the crucible 210 may have an inner diameter greater than or less than 0.295 inches.

[0028] In various embodiments, the tube defined by the crucible liner wall 216 and the crucible liner bottom end 212 defines an interior cavity having a volume smaller than the volume of the interior cavity of the tube defined by the crucible wall 214 (e.g., the crucible liner 215 has a volume smaller than the volume of the crucible 210). In various embodiments, the tube defines an interior cavity having a volume in the range of 0.5 cc to 2.5 cc. In various embodiments, the tube defined by the crucible liner wall 216 and the crucible liner bottom end 212 defines an interior cavity having a volume of approximately 0.5 cc.

[0029] In various embodiments, the crucible liner bottom end 212 closes one end of a tube defined by the crucible liner wall 216 and the crucible liner bottom end 212. In various embodiments, the crucible liner wall 216 and the crucible liner bottom end 212 are made from a material (e.g., a thermally conductive material) such as stainless steel, alumina, aluminum, and / or the like that allows the crucible liner 215 to be heated (e.g., via the heating component 270). For example, the crucible liner wall 216 and the crucible liner bottom end 212 are made from a material that can withstand the temperature of the heating component that is transmitted to the crucible liner wall 216 and the crucible liner bottom end 212 during the decomposition and / or atomization chemical reaction without melting or otherwise deforming the crucible liner wall and / or the crucible liner bottom end 212. In one exemplary embodiment, the crucible liner wall 216 and / or the crucible liner bottom end 212 have a melting temperature that is higher (e.g., significantly higher) than the atomization reaction temperature. For example, the crucible liner wall 216 and / or the crucible liner bottom end 212 may have a melting temperature greater than 1300°C.

[0030] In various embodiments, the crucible liner 215 further comprises an opening cap 218 at least partially closing the other end of the tube defined by the crucible liner wall 216 and the crucible liner bottom end 212, opposite the crucible liner bottom end 212. For example, the crucible liner bottom end 212 may close a first end of the tube defined thereby, and the opening cap 218 may at least partially close a second, opposing end of the tube. For example, the opening cap 218 may be releasably secured to the opposing end of the tube defined by the crucible liner wall 216 and the crucible liner bottom end 212. FIG. 2C shows an enlarged view of an exemplary opening cap 218, and FIG. 2D shows an exemplary crucible liner 215 with the opening cap 218 secured to the crucible liner 215. In one exemplary embodiment, the opening cap 218 is secured to the opposing end of the tube via fasteners that secure the opening cap 218 to the crucible liner wall 216, an adhesive that secures the opening cap 218 to the crucible liner wall 216, a friction fit of the opening cap 218 to the crucible liner wall 216, and / or similar means. In some embodiments, the dimensions (e.g., length) of the crucible liner 215 and the crucible 210 are selected so that when the crucible liner 215 is disposed within the crucible 210, an upper portion of the crucible liner 215 extends beyond the crucible 210, allowing the opening cap 218 to be properly secured to the crucible liner (e.g., so that the opening cap fits snugly against the crucible liner such that the opening cap is secured to the crucible liner via a friction fit). In one exemplary embodiment, the opening cap 218 has a substantially circular shape. In one exemplary embodiment, the opening cap 218 is a disk. In various embodiments, aperture cap 218 includes a dispensing aperture 219 extending therethrough. In one exemplary embodiment, dispensing aperture 219 is positioned at the center of aperture cap 218. In various embodiments, dispensing aperture 219 is not positioned at the center of aperture cap 218. In various implementations, elemental atomic objects are dispensed from dispenser 200 through dispensing aperture 219.

[0031] In one exemplary embodiment, the dispensing aperture 219 has a diameter (measured in a plane substantially perpendicular to the longitudinal axis 205) of approximately 0.05 to 1.2 mm. For example, in some embodiments, the dispensing aperture 219 has a diameter (measured in a plane substantially perpendicular to the longitudinal axis 205) of approximately 0.5 mm. However, it should be understood that in some embodiments, the dispensing aperture 219 may have a diameter (measured in a plane substantially perpendicular to the longitudinal axis 205) that differs from the above example. In one exemplary embodiment, the aperture cap 218 may have a thickness of approximately 0.1 mm. For example, in some embodiments, the aperture cap 218 may have a thickness of approximately 0.127 mm. In one exemplary embodiment, the diameter of the dispensing aperture 219 and the length of the crucible liner are configured to provide at least a semi-collimated beam of atomic objects directed toward a load hole and / or target component of an atomic object containment device. In one exemplary embodiment, the aperture cap 218 comprises a plurality of dispensing apertures.

[0032] In various embodiments, the crucible liner wall 216, the crucible liner bottom end 212, and the opening cap 218 define a crucible chamber 240 of the crucible 210. In various embodiments, the crucible chamber 240 has a volume in the range of 0.4 cc to 2.0 cc. In various embodiments, the crucible chamber 240 has a volume of approximately 0.5 cc. In various embodiments, the crucible chamber 240 is a volume and / or cavity within the crucible 210. For example, decomposition and atomization chemical reactions can occur within the crucible chamber 240. In various embodiments, the crucible chamber 240 is dimensioned such that the distance between the contents (e.g., a composition including reactive components and atomic objects) deposited within the crucible chamber 240 during operation and a detector within a residual gas analyzer (RGA) (e.g., configured to monitor the progress of the reaction) is approximately 6 inches. In various embodiments, the crucible 210 and / or the crucible liner 215 are removable.

[0033] As described above, in various embodiments, dispenser 200 includes heating component 270. In various embodiments, heating component 270 includes a heating element (e.g., a resistive heating element). In one exemplary embodiment, heating component 270 is operated by supplying current and / or voltage to the heating element. For example, current and / or voltage may be applied to the heating element to heat the composition including the atomic objects and / or the partially decomposed composition including the atomic objects. In various embodiments, the heating element may be a coil heater including a heating filament and / or coil wire wrapped around at least a portion of crucible 210. For example, current and / or voltage may be applied to the heating element to heat crucible 210 and / or crucible liner 215. In an exemplary embodiment, heating component 270 may be secured in electrical communication with electrical leads that may be used to supply current and / or voltage to the heating component (e.g., the heating element of heating component 270).

[0034] In an exemplary embodiment, a composition including atomic objects and reactive components is disposed (e.g., deposited) within the crucible chamber 240. In various embodiments, the heating element may be secured in electrical communication with electrical leads that may be used to supply current and / or voltage to the heating element. When current and / or voltage is applied to the heating element, the heating element causes the crucible 210 and / or crucible liner 215 to radiate heat and heat the composition including the atomic objects, the crucible 210, and / or the crucible liner (e.g., to a decomposition reaction temperature and / or an atomization reaction temperature), which may cause the decomposition and / or atomization chemical reactions to proceed. In various embodiments, the dispenser 200 may include one or more thermocouples 265 configured to enable monitoring of the temperature within the crucible chamber 240. As shown in FIG. 2A , the dispenser may include a thermocouple plug 285 coupled to the one or more thermocouples 265.

[0035] In some embodiments, a composition including reactive components and atomic objects may be disposed within and mixed within crucible chamber 240. In one exemplary embodiment (e.g., when the atomic object is radioactive barium), 133 In the case of Ba), the reactive components may include tantalum powder, tantalum mesh, and / or tantalum foil, and the reactant is tantalum. In various embodiments, the use of tantalum powder, tantalum mesh, and / or tantalum foil advantageously increases the surface area available for decomposition and / or atomization chemical reactions. However, it should be understood that in other embodiments, the tantalum reactant may be embodied in other forms.

[0036] When an electric current and / or voltage is applied to the heating component 270 (e.g., its heating element), the heating element of the heating component 270 radiates heat, causing the composition including the atomic objects and / or the partially decomposed composition including the atomic objects and / or at least a portion of the crucible 210 and / or crucible liner 215 to be heated (e.g., to a decomposition reaction temperature and / or an atomization reaction temperature), and the decomposition and / or atomization chemical reactions may proceed. In an exemplary embodiment, the heating element is disposed outside the crucible chamber 240, and the heating element may be wrapped around at least a portion of the exterior of the crucible wall of the crucible.

[0037] In various embodiments, the decomposition chemical reaction, the atomization chemical reaction, and / or the dispensing of the elemental atomic objects are performed with the crucible 210 disposed within a pressure-controlled environment. For example, at least a portion of the dispenser 200 may be disposed within the pressure-controlled environment during the decomposition chemical reaction and / or the atomization chemical reaction. For example, the dispenser 200 may include a flange (not shown) configured to couple the dispenser 200 to a pressure-controlled chamber such that the crucible 210 is disposed within the pressure-controlled chamber. For example, the flange may couple the dispenser 200 to a vacuum and / or cryostat chamber 40 (see FIG. 3 ) such that the crucible 210 is disposed within the vacuum and / or cryostat chamber. The portion of the dispenser 200 within the pressure-controlled chamber may include the crucible 210 and at least a portion of the heating component 270. For example, a portion of dispenser 200 disposed within the pressure control chamber may be configured such that elemental atomic objects dispensed from dispenser 200 through dispensing opening 219 are dispensed within the pressure control chamber. In various embodiments, a portion of dispenser 200 disposed outside the pressure control chamber may include a thermocouple component coupled to a thermocouple (as described above), one or more couplings and / or connections (e.g., couplings and / or connections to a cooling system, a coupling between a thermocouple and a thermocouple component, a lead attached to a heating element), and / or the like.

[0038] In various embodiments, dispenser 200 may include various other components not described in detail herein. For example, dispenser 200 may include one or more cooling components. In another example, dispenser 200 may include one or more sensors and / or measurement devices configured to monitor the completeness and / or status of a decomposition chemical reaction, an atomization chemical reaction, and / or the dispensing of elemental atomic objects.

[0039] As noted above, FIG. 1 illustrates an exemplary technique for dispensing elemental atomic objects using small amounts of a composition including the atomic objects. Beginning with step / operation 102 shown in FIG. 1 , reactive components are disposed within crucible chamber 240 (e.g., within a crucible liner). In various embodiments, the reactive components are weighed and deposited within crucible 210. In one exemplary embodiment, the reactive components include one or more materials that are participants in an atomization chemical reaction. In one exemplary embodiment, the reactive components include tantalum powder, and the reactant is tantalum. In some embodiments, the reactive components include tantalum mesh and / or tantalum foil. In various embodiments, an amount of a reactive component (e.g., its reactant) is weighed prior to deposition within crucible chamber 240 (e.g., a weighed amount of the reactant is deposited within the crucible liner). In various embodiments, the use of tantalum powder, tantalum mesh, and / or tantalum foil advantageously allows for the use of greater amounts of starting material (e.g., compositions including reactants and / or atomic objects), thus extending lifespan.

[0040] In step / operation 104, a composition including atomic objects is deposited into the crucible chamber 240. In various embodiments, the composition including atomic objects is in aqueous solution form and may be deposited into the crucible chamber 240 using a pipette (e.g., a micropipette). In various embodiments, the quantity / amount of the composition including atomic objects deposited into the crucible chamber 240 is controlled. For example, in various embodiments, a measured amount of the composition including atomic objects is deposited into the crucible chamber 240 as described above. In various embodiments, the amount of the composition including atomic objects deposited into the crucible chamber 240 may depend on the amount of reactive components deposited into the crucible chamber 240, and vice versa. For example, in one exemplary embodiment, the atomic object is radioactive barium. 133If the reactant is Ba and the reactant is tantalum, the molar ratio of the reactant to the composition including the atomic objects is about 5 to 1, respectively (e.g., a 5:1 molar ratio of Ta:Ba). In the exemplary embodiment above, the molar ratio of the reactant to the composition including the atomic objects may be selected so that there is an excess of the reactant to ensure that all of the composition including the atomic objects is reacted. In various embodiments, the composition including the atomic objects is deposited within the crucible chamber 240 such that it is deposited on top of the reactant inside the crucible chamber 240.

[0041] In various embodiments, the crucible 210 (e.g., containing the reactants and the composition including the atomic objects) is heated at a drying temperature to remove the liquid (e.g., water) and leave a dry composition (e.g., a mixture thereof) including the atomic objects and the reactants in the crucible chamber 240. For example, in some embodiments, the composition including the atomic objects is Ba(NO3)2 and the reactant may be tantalum powder, and when the crucible 210 is heated, the liquid is removed, leaving a dry salt of barium nitrate on the tantalum powder reactant. In some embodiments, the crucible 210 is heated using a hot plate (not shown). For example, in some embodiments, after depositing the reactants and the composition including the atomic objects in the crucible chamber 240 of the crucible 210, the crucible 210 is placed on a hot plate, thereby removing the liquid (as described above). In some embodiments, a chemical reaction can be performed to obtain a composition including the atomic objects. In one exemplary embodiment, if the atomic object is radioactive barium, the composition including the atomic objects can be obtained as a result of the chemical reaction. For example, in some embodiments, the composition including the atomic objects comprises barium nitrate. 133 Ba(NO3)2, and the chemical reaction (e.g., BaCl2 + 2AgNO3 → 2AgCl(s) + 133 It can be obtained from Ba(NO3)2).

[0042] In step / operation 106, the composition including at least the reactive components and the atomic object is enclosed within crucible chamber 240 (e.g., opening cap 218 is secured thereto), and crucible 210 and / or crucible liner 215 are in thermal communication with heating component 270 (e.g., a heating element thereof). In an exemplary embodiment, dispenser 200 may then be secured (e.g., via a flange) to a first pressure-controlled chamber. In an exemplary embodiment, crucible 210 and / or crucible liner 215 may be degassed and / or cleaned while secured to the first pressure-controlled chamber by operation of the heating element of heating component 270. For example, the heating element may be operated to heat at least a portion of crucible 210 and / or crucible liner 215 such that any material within crucible chamber 240 (e.g., material other than the composition including the atomic object) is dispensed from the crucible chamber through dispensing opening 219. In one exemplary embodiment, degassing and / or cleaning of the crucible 210 and / or crucible liner 215 may occur during the decomposition chemical reaction. In one exemplary embodiment, if the atomic object is radioactive barium 133 For example, in various embodiments, if the atomic object is radioactive barium, the degassing temperature may be about 200° C. 133 In the case of Ba, the degassing temperature may be at least 200° C. for at least 1 hour.

[0043] In step / operation 108, the heating element of heating component 270 is used to heat the mixture including the reactive components and the composition including the atomic objects to promote a decomposition chemical reaction. For example, the heating component may heat the composition including the atomic objects to a decomposition reaction temperature that may cause a decomposition reaction to occur. The decomposition chemical reaction results in a partially decomposed composition including the atomic objects. In an exemplary embodiment, at least a portion of the crucible (e.g., crucible chamber 240) is maintained at and / or around the decomposition reaction temperature (e.g., a range of temperatures in an exemplary embodiment) until formation of by-products of the decomposition chemical reaction is no longer detected within the crucible. For example, a residual gas analyzer (RGA), ion gauge, pressure gauge, and / or the like within the first pressure control chamber may be used to detect by-products (and / or other materials) exiting crucible chamber 240 through dispensing opening 219. The decomposition chemical reaction may be determined to be complete when the RGA, ion gauge, pressure gauge, and / or the like stops detecting and / or detects a significant decrease in the amount of by-products and / or other materials dispensed through the dispensing opening 219. In various embodiments, a composition including atomic objects does not undergo a decomposition chemical reaction, as the atomic objects may be decomposed in a single atomization chemical reaction to yield elemental atomic objects. In one exemplary embodiment, the atomic objects are radioactive barium. 133 For example, in various embodiments, if the atomic object is radioactive barium, the decomposition temperature may be about 600° C. 133 In the case of Ba, the decomposition chemistry involves a dwell at about 600° C. for at least about 1 hour, resulting in complete decomposition of barium nitrate.

[0044] In an exemplary embodiment, after the decomposition chemical reaction and / or degassing / cleaning of the crucible 210 and / or crucible liner 215 is completed, the dispenser 200 can be disconnected from the first pressure-controlled chamber and coupled to a second pressure-controlled chamber. In an exemplary embodiment, the atomic object containment device is disposed in the second pressure-controlled chamber. By performing the decomposition chemical reaction and / or degassing / cleaning of the crucible 210 and / or crucible liner 215 in the first pressure-controlled chamber and dispensing the elemental atomic objects into the second pressure-controlled chamber, the second pressure-controlled chamber can be kept clean. For example, experiments and / or similar operations can be performed in the second pressure-controlled chamber without interaction or contamination by by-products of the decomposition chemical reaction and / or other materials dispensed in the degassing / cleaning process. In one exemplary embodiment, the atomization chemical reaction is completed with the dispenser 200 coupled to a first pressure-controlled chamber, and the dispenser 200 is coupled to a second pressure-controlled chamber to dispense elemental atomic objects.

[0045] In step / operation 110, a heating component 270 (e.g., a heating element) is used to heat the reaction component and the composition including the atomic objects and / or the partially decomposed composition to drive the atomization chemical reaction. For example, the composition including the atomic objects and / or the partially decomposed composition may be heated, causing the mixture to heat to an atomization temperature. For example, the heating component 270 may heat the mixture including the atomic objects and the composition including the atomic objects and / or the partially decomposed composition to an atomization reaction temperature that may cause the atomization reaction to occur. In various embodiments, when the atomization chemical reaction occurs at the atomization reaction temperature, the atomic objects are dispensed from the dispenser 200. In one exemplary embodiment, the atomization chemical reaction is completed by heating the composition including the atomic objects and / or the partially decomposed composition only once.

[0046] In one exemplary embodiment, the atomic object is radioactive barium. 133 In the case of Ba, the atomization temperature may be about 800° C. Furthermore, in one exemplary embodiment, the atomic object is radioactive barium 133 In the case of Ba, the atomization reaction temperature may be in the range of 800 to 1000° C. In various embodiments, heating the crucible to the atomization reaction temperature causes elemental atomic objects in the mixture to sublimate and be dispensed through the dispensing opening 219. For example, the elemental atomic objects may vaporize and / or sublimate and move through the crucible chamber 240 toward the dispensing opening (e.g., depending on vapor pressure within the crucible chamber 240 and / or the like).

[0047] After an elemental atomic object is dispensed from dispensing opening 219, the elemental atomic object may pass through and be trapped within a loading hole and / or the like of atomic object confinement device 350 (see FIG. 4 ). For example, dispensing opening 219 may be aligned with a loading hole and / or a target component of the atomic object confinement device. For example, elemental atomic objects may be dispensed from dispensing opening 219, travel through a loading hole and / or the like of the atomic object confinement device, and be trapped as neutral atoms and / or as part of a group of neutral atoms (e.g., via one or more electromagnetic fields), or ionized (e.g., via application of an ionizing laser beam) and trapped as ions and / or as part of a group of ions. Various activities may be performed on the elemental atomic objects contained within the atomic object confinement device, as appropriate for the application.

[0048] Technical Advantages In various scenarios, it may be desirable to dispense elemental atomic objects so that they can be captured and / or confined by atomic object confinement devices, such as ion traps and / or the like. Furthermore, atomic objects may be available in small quantities due to various safety and / or cost concerns. For example, atomic objects may be radioactive, thus raising safety concerns. Additionally, atomic objects may not be readily available in elemental form, may be prone to oxidation, and / or have similar issues. Due to the small amount of available atomic objects, conventional atomic object dispensing methods, such as laser ablation, may not be an efficient solution in these scenarios. Therefore, compositions containing atomic objects may need to undergo decomposition and / or atomization chemical reactions to produce elemental atomic objects. However, the inventors have identified several drawbacks in conventional atomic object dispensing methods based on chemical reactions. Therefore, technical problems exist regarding how to dispense such atomic objects.

[0049] Various embodiments provide methods, apparatus, systems, and / or the like that provide technical solutions to this technical problem. For example, various embodiments provide methods, apparatus, systems, and / or the like for dispensing elemental atomic objects in scenarios where the atomic objects are not readily available in elemental form, are susceptible to oxidation, and / or are available only in small quantities (e.g., due to safety and / or cost concerns). By way of non-limiting example, various embodiments described herein enable uniform heating throughout a crucible (e.g., a crucible liner), resulting in consistent amounts of elemental atomic objects. Furthermore, various embodiments described herein enable the use of more starting material (e.g., reaction components and / or compositions comprising the atomic objects), thereby advantageously resulting in longer lifespans and improved efficiency compared to at least some traditional atomic object dispensing methods. Furthermore, exemplary embodiments provide improvements in the field of dispensing atomic objects and loading atomic objects into atomic object confinement devices (e.g., ion traps and / or the like that may be part of quantum computers and / or other systems).

[0050] Exemplary Quantum Computer with Atomic Object Confinement Device 3 is a schematic diagram of an exemplary quantum computer system 300 including an atomic object confinement device 350 (e.g., an ion trap and / or the like), according to one illustrative embodiment. In various embodiments, a dispenser 200 may be operated to cause the atomic object confinement device 350 to be loaded with an elemental atomic object. For example, a dispensing opening 219 of the dispenser 200 may be coupled to a loading hole of the atomic object confinement device 350. For example, a controller 30 of the quantum computer system 300, according to one illustrative embodiment, may control the operation of the cooling system and one or more voltage sources 50 to effect operation of the cooling and heating components 270 of the dispenser 200, such that the dispenser 200 dispenses an elemental atomic object, which is then loaded into and captured by the atomic object confinement device 350.

[0051] In various embodiments, quantum computer system 300 comprises computing entity 10 and quantum computer 310. In various embodiments, quantum computer 310 comprises controller 30, a cryostat and / or vacuum chamber 40 enclosing atomic object confinement device 350 (e.g., ion trap) and portion 252 of dispenser 200, and one or more manipulation sources 60. For example, cryostat and / or vacuum chamber 40 may be a second pressure-controlled chamber. In an exemplary embodiment, one or more manipulation sources 60 may comprise one or more lasers (e.g., optical lasers, microwave sources, and / or the like). In various embodiments, one or more manipulation sources 60 are configured to manipulate one or more atomic objects within the confinement device and / or cause the evolution of a controlled quantum state thereof. For example, in an exemplary embodiment, if one or more manipulation sources 60 comprise one or more lasers, the lasers may irradiate one or more laser beams on the confinement device within cryostat and / or vacuum chamber 40. In various embodiments, quantum computer 310 comprises one or more voltage sources 50. For example, voltage sources 50 may comprise multiple voltage drivers and / or voltage sources and / or at least one RF driver and / or voltage source. Voltage sources 50 may, in one exemplary embodiment, be electrically coupled to corresponding potential-generating elements (e.g., electrodes) of atomic object confinement device 350.

[0052] In various embodiments, computing entity 10 is configured to allow a user to provide input to quantum computer 310 (e.g., via a user interface of computing entity 10), receive and display output from quantum computer 310, and / or perform similar operations thereon. Computing entity 10 may communicate with a controller 30 of quantum computer 310 via one or more wired or wireless networks 20 and / or via direct wired and / or wireless communication. In exemplary embodiments, computing entity 10 may translate, organize, format, and / or perform similar operations on information / data, quantum computing algorithms, and / or the like into a computing language, executable instructions, command set, and / or the like that controller 30 can understand and / or implement.

[0053] In various embodiments, quantum system controller 30 is configured to control voltage source 50, a cryostat system and / or vacuum system that controls the temperature and pressure within cryostat and / or vacuum chamber 40, components of dispenser 200, manipulation source 60, and / or other systems configured to control various environmental conditions (e.g., temperature, pressure, and / or the like) within cryostat and / or vacuum chamber 40, and / or manipulate one or more atomic objects within the containment device, and / or cause controlled evolution of the quantum state of one or more atomic objects. For example, controller 30 may cause controlled evolution of the quantum state of one or more atomic objects within the containment device to execute quantum circuits and / or algorithms. In various embodiments, atomic objects confined within the containment device are used as qubits in quantum computer 310.

[0054] Exemplary Controller In various embodiments, atomic object confinement device 350 is incorporated into a system (e.g., quantum computer 310) that includes controller 30. In various embodiments, controller 30 is configured to control various elements of the system (e.g., quantum computer 310). For example, controller 30 may be configured to control voltage source 50, a cryostat system and / or vacuum system that controls the temperature and pressure within cryostat and / or vacuum chamber 40, manipulation source 60, cooling system 70, and / or other systems configured to control environmental conditions (e.g., temperature, humidity, pressure, and / or the like) within cryostat and / or vacuum chamber 40, and / or to manipulate one or more atomic objects within the confinement device and / or to cause controlled evolution of the quantum state of one or more atomic objects.

[0055] 4, in various embodiments, the controller 30 may include various controller elements, including a processing element 405, a memory 410, a driver controller element 415, a communication interface 420, an analog-to-digital converter element 425, and / or similar elements. For example, the processing element 405 may include a programmable logic device (CPLD), a microprocessor, a coprocessing entity, an application-specific instruction set processor (ASIP), an integrated circuit, an application-specific integrated circuit (ASIC), a field-programmable gate array (FPGA), a programmable logic array (PLA), a hardware accelerator, other processing devices and / or circuits, and / or the like. The term circuit may refer to an entirely hardware embodiment or a combination of hardware and a computer program product. In one exemplary embodiment, the processing element 405 of the controller 30 includes and / or communicates with a clock.

[0056] For example, memory 410 may include non-transitory memory such as volatile and / or non-volatile memory storage such as one or more of a hard disk, ROM, PROM, EPROM, EEPROM, flash memory, MMC, SD memory card, memory stick, CBRAM, PRAM, FeRAM, RRAM, SONOS, racetrack memory, RAM, DRAM, SRAM, FPM DRAM, EDO DRAM, SDRAM, DDR SDRAM, DDR2 SDRAM, DDR3 SDRAM, RDRAM, RIMM, DIMM, SIMM, VRAM, cache memory, register memory, and / or the like. In various embodiments, memory 410 may store qubit records corresponding to qubits of a quantum computer (e.g., in a qubit record data store, qubit record database, qubit record table, and / or the like), calibration tables, executable cues, computer program code (e.g., in one or more computer languages, dedicated controller languages, and / or the like), and / or the like. In an exemplary embodiment, execution of at least a portion of the computer program code stored in memory 410 (e.g., by processing element 405) causes controller 30 to perform one or more steps, operations, processes, procedures, and / or the like described herein to track the phase of atomic objects in an atomic system and cause adjustments to the phase of one or more manipulation sources and / or signals generated thereby.

[0057] In various embodiments, driver controller element 415 may include one or more driver and / or controller elements each configured to control one or more drivers. In various embodiments, driver controller element 415 may comprise a driver and / or a driver controller. For example, a driver controller may be configured to cause one or more corresponding drivers to be operated according to executable instructions, commands, and / or the like scheduled and executed by controller 30 (e.g., by processing element 405). In various embodiments, driver controller element 415 may enable controller 30 to operate voltage source 50, manipulation source 60, cooling system 70, and / or the like. In various embodiments, the driver may be a laser driver, a vacuum component driver, a driver for controlling the flow of current and / or voltage applied to electrodes used to maintain and / or control the trapping potential of atomic object confinement device 350 and / or the flow of current and / or voltage applied to heating component 270 of dispenser 200 (and / or other drivers for providing driver operation sequences to potential-generating elements of the confinement device), a cryostat and / or vacuum system component driver, a cooling system driver, and / or the like. In various embodiments, controller 30 comprises means for communicating and / or receiving signals from one or more photoreceiver components, such as a camera, a MEMs camera, a CCD camera, a photodiode, a photomultiplier tube, and / or the like. For example, controller 30 may comprise one or more analog-to-digital converter elements 425 configured to receive signals from one or more photoreceiver components, calibration sensors, and / or the like.

[0058] In various embodiments, controller 30 may comprise a communications interface 420 for interfacing and / or communicating with computing entity 10. For example, controller 30 may comprise a communications interface 420 for receiving executable instructions, command sets, and / or the like from computing entity 10, and for providing to computing entity 10 output received from quantum computer 310 (e.g., from an optical concentration system) and / or results of processing the output. In various embodiments, computing entity 10 and controller 30 may communicate via a direct wired and / or wireless connection and / or one or more wired and / or wireless networks 20.

[0059] Exemplary Computing Entity 5 is an illustrative schematic diagram of an exemplary computing entity 10 that can be used in conjunction with embodiments of the present invention. In various embodiments, computing entity 10 is configured to enable a user to provide input to quantum computer 310 (e.g., via a user interface of computing entity 10) and receive, display, analyze, and / or perform similar operations on output from quantum computer 310.

[0060] 5, computing entity 10 may include an antenna 512, a transmitter 504 (e.g., wireless), a receiver 506 (e.g., wireless), and a processing element 508 that provides signals to transmitter 504 and receives signals from receiver 506. The signals provided to transmitter 504 and received from receiver 506, respectively, may include signaling information / data according to an applicable wireless system air interface standard for communicating with various entities, such as controller 30, other computing entities 10, and / or the like. In this regard, computing entity 10 may be operable with one or more air interface standards, communication protocols, modulation types, and access types. For example, computing entity 10 may be configured to receive and / or provide communications using a wired data transmission protocol, such as Fiber Distributed Data Interface (FDDI), Digital Subscriber Line (DSL), Ethernet, Asynchronous Transfer Mode (ATM), Frame Relay, Data Over Cable Service Interface Specification (DOCSIS), or any other wired transmission protocol.Similarly, the computing entity 10 may be configured to support any of the following standards: General Packet Radio System (GPRS), Universal Mobile Telecommunications System (UMTS), Code Division Multiple Access 2000 (CDMA2000), CDMA2000 1X (1xRTT), Wideband Code Division Multiple Access (WCDMA), Global System for Mobile Communications (GSM), Enhanced Data rates for GSM Evolution (EDGE), Time Division Synchronous Code Division Multiple Access (TD-SCDMA), Long Term Evolution (LTE), Evolved Universal Terrestrial Radio Access Network (E-UTRAN), Evolution-Data Optimized (EVDO), High Speed ​​Packet Access (HSPA), High Speed ​​Downlink Packet Access (HSDPA), IEEE 802.11 (Wi-Fi), Wi-Fi It may be configured to communicate over a wireless external communications network using any of a variety of protocols, such as Direct, 802.16 (WiMAX), Ultra Wideband (UWB), Infrared (IR) protocol, Near Field Communication (NFC) protocol, Wibree, Bluetooth protocol, Wireless Universal Serial Bus (USB) protocol, and / or any other wireless protocol.Computing entity 10 may communicate using such protocols and standards using Border Gateway Protocol (BGP), Dynamic Host Configuration Protocol (DHCP), Domain Name System (DNS), File Transfer Protocol (FTP), Hypertext Transfer Protocol (HTTP), HTTP over TLS / SSL / Secure, Internet Message Transfer Protocol (IMAP), Network Time Protocol (NTP), Simple Mail Transfer Protocol (SMTP), Telnet, Transport Layer Security (TLS), Secure Sockets Layer (SSL), Internet Protocol (IP), Transmission Control Protocol (TCP), User Datagram Protocol (UDP), Datagram Congestion Control Protocol (DCCP), Stream Control Transmission Protocol (SCTP), Hypertext Markup Language (HTML), and / or the like.

[0061] Through these communication standards and protocols, computing entity 10 may communicate with various other entities using concepts such as Unstructured Supplementary Service Information / Data (USSD), Short Message Service (SMS), Multimedia Messaging Service (MMS), Dual Tone Multi-Frequency Signaling (DTMF), and / or Subscriber Identity Module Dialer (SIM dialer), etc. Computing entity 10 may also download modifications, add-ons, and updates to its firmware, software (including, e.g., executable instructions, applications, program modules), and operating system, for example.

[0062] Computing entity 10 may also include user interface devices including one or more user input / output interfaces (e.g., a display 516 and / or speaker / speaker driver coupled to processing element 508, as well as a touchscreen, keyboard, mouse, and / or microphone coupled to processing element 508). For example, the user output interface may be configured to provide applications, browsers, user interfaces, interfaces, dashboards, screens, web pages, pages, and / or similar terms used interchangeably herein running on and / or accessible via computing entity 10 for causing display or audible presentation of information / data and for interactive manipulation via one or more user input interfaces. The user input interface may comprise any of a number of devices that enable computing entity 10 to receive data, such as a keypad 518 (hard or soft), a touch display, a voice / speech or motion interface, a scanner, reader, or other input device. In embodiments including a keypad 518, the keypad 518 may include (or cause to be displayed) conventional numeric (0-9) and related keys (#, *), as well as other keys used to operate computing entity 10, and may include a set of keys that can be activated to provide a full set of alphabetic keys or a full set of alphanumeric keys. In addition to providing input, the user input interface may be used to activate or deactivate certain features, such as, for example, a screen saver and / or sleep mode. Through such input, computing entity 10 may collect information / data, user interaction / input, and / or the like.

[0063] Computing entity 10 may also include volatile storage or memory 522 and / or nonvolatile storage or memory 524, which may be embedded and / or removable. For example, the nonvolatile memory may be ROM, PROM, EPROM, EEPROM, flash memory, MMC, SD memory card, memory stick, CBRAM, PRAM, FeRAM, RRAM, SONOS, racetrack memory, and / or the like. The volatile memory may be RAM, DRAM, SRAM, FPM DRAM, EDO DRAM, SDRAM, DDR SDRAM, DDR2 SDRAM, DDR3 SDRAM, RDRAM, RIMM, DIMM, SIMM, VRAM, cache memory, registered memory, and / or the like. The volatile and nonvolatile storage or memory may store databases, database instances, database management system entities, data, applications, programs, program modules, scripts, source code, object code, byte code, compiled code, interpreted code, machine code, executable instructions, and / or the like to implement the functionality of computing entity 10.

[0064] conclusion Many modifications and other embodiments of the inventions set forth herein will come to mind to one skilled in the art to which these inventions pertain having the benefit of the teachings presented in the foregoing descriptions and the associated drawings. It is to be understood, therefore, that the inventions are not to be limited to the specific embodiments disclosed, and that modifications and other embodiments are intended to be included within the scope of the appended claims. Although specific terms are employed herein, they are used in a generic and descriptive sense only and not for purposes of limitation. [Explanation of symbols]

[0065] 10 Computing Entities 20 Wireless Network 30 Controllers 40 Cryostat 50 Voltage Source 60 Manipulation Source 200 Dispenser 205 Longitudinal Axis 210 Crucible 211 Crucible bottom end 212 Crucible liner bottom end 214 Crucible Wall 215 Crucible Liner 216 Crucible liner wall 218 Opening Cap 219 Dispensing Opening 220 outer cover 240 Crucible Room 245 Baffle Structure 252 part 255 Base 265 Thermocouple 270 Heating Components 275 Steam Shield 285 Thermocouple Plug 290 Mounting ridge 300 Quantum Computer System 310 Quantum Computer 350 Atomic Object Confinement Device 405 Processing Elements 410 memory 415 Driver Controller Elements 420 Communication Interface 425 Analog / Digital Converter Elements 504 Transmitter 506 Receiver 508 Processing Elements 512 Antenna 516 Display 518 keypad 522 Volatile Storage or Memory 524 Non-volatile storage or memory

Claims

1. 1. A method for dispensing atomic objects, comprising: depositing a composition including a reactant and the atomic object inside a crucible chamber of a crucible, the crucible being disposed in a pressure-controlled chamber; heating the composition including the atomic objects to an atomization reaction temperature to cause an atomization chemical reaction, wherein (a) reaction components include materials that are participants in the atomization chemical reaction, (b) a result of the atomization chemical reaction is an elemental atomic object, and (c) the elemental atomic object is dispensed during the atomization chemical reaction.

2. The method of claim 1 , wherein the atomization chemical reaction is a reduction reaction and the material is a reducing agent in the atomization chemical reaction.

3. 2. The method of claim 1, wherein the atomic object is a barium (Ba) atom, the reducing agent is tantalum (Ta), and the atomization reaction temperature is less than 900°C.

4. The method of claim 3 , wherein the reactive component comprises tantalum (Ta) powder.

5. The method of claim 3 , wherein the reactive component comprises a tantalum (Ta) mesh.

6. The method of claim 3 , wherein the reactive component comprises tantalum (Ta) foil.

7. 2. The method of claim 1, wherein the atomic objects are barium (Ba) atoms, the material is tantalum (Ta), and the atomization reaction temperature is about 800°C.

8. 10. The method of claim 1, further comprising, prior to inducing the atomization chemical reaction, heating the crucible to a decomposition reaction temperature that induces a decomposition chemical reaction, the atomization chemical reaction being carried out using at least a portion of the molecules produced by the decomposition chemical reaction.

9. 9. The method of claim 8, wherein the decomposition reaction temperature is about 600°C.

10. 10. The method of claim 8, wherein a dispenser is coupled to a first pressure-controlled chamber during the decomposition chemical reaction and to a second pressure-controlled chamber during the dispensing of the atomic object.

11. 10. The method of claim 1, further comprising the step of heating the crucible to a degassing temperature for at least one hour prior to causing the atomization chemical reaction.

12. The method of claim 1 , wherein the atomic object is radioactive.

13. The method of claim 1 , further comprising the step of capturing the dispensed elemental atomic objects using an atomic object containment device.

14. 14. The method of claim 13, wherein the atomic object confinement device is a component of a quantum computer.

15. The method of claim 13 , wherein the composition containing the atomic objects is an aqueous solution.

16. 10. The method of claim 1, wherein the atomic objects are barium (Ba) atoms and the composition comprising the atomic objects is barium nitrate.

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