Electrodes and their uses

The electrode structure with a catalyst and protective layer effectively prevents additive contact, reducing consumption rates and costs in copper plating for printed circuit boards.

JP2025536136APending Publication Date: 2025-10-31MAGNETO SPECIAL ANODES SUZHOU CO LTD
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Patent Information

Application Number
JP2025518771
Authority / Receiving Office
JP · JP
Patent Type
Applications
Current Assignee / Owner
Filing Date
2022-10-02
Publication Date
2025-10-31

AI Technical Summary

Technical Problem

Existing MMO-coated anodes in copper vertical conveyor plating for printed circuit boards have high additive consumption rates, necessitating the use of carriers and brighteners to achieve fine grain copper grain structure and uniform thickness, which increases manufacturing costs.

Method used

An electrode structure comprising a substrate, a catalyst layer, and a protective layer, with optional intermediate and surface coatings, designed to prevent contact between additive molecules and metal active sites, using materials like mixed metal oxides and organic ionomers to reduce additive consumption.

Benefits of technology

The electrode design significantly reduces additive consumption rates, enhances chemical inertness during oxygen generation, and lowers manufacturing costs, making it suitable for copper plating applications.

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Abstract

An electrode and its use. The electrode includes a substrate, a catalyst layer, and a protective layer, the catalyst layer being selected from a mixed metal oxide layer, the protective layer being selected from an organic ionomer layer, and may further include a surface coating between the catalyst layer and the protective layer, and may further include an intermediate layer between the substrate and the catalyst layer. The electrode can be used as an anode for surface treatment applications.
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