Colloid-loaded porous chamber component coatings

Abstract

The method includes forming a porous ceramic coating on a processing chamber component, applying a colloidal suspension to the porous ceramic coating to fill the pores of the porous ceramic coating, and drying the component.

Description

Field

[0001] This disclosure relates to protective coatings for components of substrate processing chambers. In particular, this disclosure relates to porous coatings, such as anodized coatings and plasma spray coatings, for chamber components doped with colloidal particles.

[0002] Chambers are used in a variety of processing systems. Examples of chambers include etch chambers, deposition chambers, anneal chambers, etc. Typically, a substrate, such as a semiconductor wafer, is placed on a substrate support within the chamber, and conditions within the chamber are set and maintained to process the substrate. The characteristics of the substrate support affect the properties of the finished substrate. Processing system components may be exposed to harsh environments, such as corrosive gases, high electrical charges, and high temperatures. Overview

[0003] The following is a simplified summary of the disclosure in order to provide a basic understanding of some aspects of the disclosure. This summary is not an exhaustive overview of the disclosure. It is not intended to identify key or critical elements of the disclosure, nor is it intended to delineate the scope or claims of particular embodiments of the disclosure. Its sole purpose is to present some concepts of the disclosure in a simplified form as a prelude to the more detailed description that is presented later.

[0004] In one aspect of the present disclosure, a method includes forming a porous ceramic layer on a processing chamber component, applying a colloidal suspension to the porous ceramic layer to fill pores in the porous ceramic layer, and drying the component.

[0005] In another aspect of the present disclosure, a chamber component for a processing chamber includes a metal body, the chamber component further includes a porous coating on the metal body, and the chamber component further includes a material disposed within pores of the porous coating.

[0006] In another aspect of the present disclosure, a processing chamber includes a substrate support assembly. The substrate support assembly includes a chamber component. The chamber component includes an aluminum body. The chamber component includes a porous aluminum oxide coating. The chamber component includes a filler material disposed within the pores of the porous aluminum oxide coating. Further, the substrate support assembly includes a sealing component. The sealing component is disposed on the aluminum oxide coating of the chamber component to create a fluid seal. [Brief explanation of the drawings]

[0007] The present disclosure is illustrated by way of example, and not by way of limitation, in the figures of the accompanying drawings. [Figure 1] 1 is a cross-sectional view of a substrate processing chamber including one or more components with a filled porous protective coating according to some embodiments. [Figure 2A] 1 is a cross-sectional side view of a chamber component used in a processing chamber according to some embodiments. [Figure 2B] 1 is a cross-sectional side view of a chamber component including a filled porous protective layer according to some embodiments. [Figure 3] FIG. 1 is a cutaway perspective view of a protective porous coating on a chamber component, according to some embodiments. [Figure 4A] FIG. 1 is a flow diagram of a method for producing a filled porous protective layer, according to some embodiments. [Figure 4B] FIG. 1 is a flow diagram of a method for producing a filled porous protective coating, according to some embodiments. Detailed Description

[0008] Embodiments of the present disclosure provide a chamber component including a filled oxide coating. The chamber component may be a component of a substrate support assembly. The chamber component may be configured to create a fluid seal, for example, via a sealing component. The oxide coating may include an anodized metal coating, a plasma spray coating, or any other type of porous oxide coating. In some embodiments, the coating is a porous fluoride coating or a porous oxyfluoride coating. The coating layer may include a material that fills the pores of the oxide coating, fluoride coating, or oxyfluoride coating. The material that fills the pores of the coating may be a ceramic material, a metal oxide material, a metal fluoride material, a metal oxyfluoride material, or the like. The material that fills the pores of the coating may be applied via a colloidal suspension of the filler material.

[0009] Some conventional systems use metal components within the processing chamber, which may be exposed to harsh environments. For example, manufacturing processes performed within the processing chamber may involve the use of corrosive gases, plasma, high temperatures, etc.

[0010] In some systems, components of the processing chamber may be designed, constructed, manufactured, etc. to protect the components from one or more target processing environments. The components of the processing chamber may be provided with a protective coating to protect the components from the processing environment within the processing chamber.

[0011] In some systems, one or more components of the processing chamber can be coated with a protective metal oxide coating, a protective metal fluoride coating, or a protective metal oxyfluoride coating. One or more components of the processing chamber can include an outer coating comprising an oxide of the metal from which the component is made. The oxide coating, oxide layer, etc. can be applied to the component or generated from the material of the component. Alternatively, the metal of the oxide coating can be a different metal than the metal of the component. Similarly, one or more components of the processing chamber can include a metal fluoride coating or layer and / or a metal oxyfluoride coating or layer, where the metal can be the same metal as the metal of the component or a different metal than the metal of the component.

[0012] In some systems, the protective oxide layer can be produced by anodizing the component. The protective oxide layer can be porous. For example, anodizing aluminum can produce approximately cylindrical pores that penetrate at least a portion of the thickness of the anodized coating. Anodizing other materials (e.g., other metals, metal alloys, etc.) can produce similar structures.

[0013] In some systems, a protective oxide, fluoride, or oxyfluoride layer can be formed by performing a deposition process that forms a porous layer. One example of a deposition process that can be used is plasma spraying, such as air plasma spraying.

[0014] In embodiments, the porous oxide, fluoride, or oxyfluoride layer has a porosity of 1% to 15%, where porosity is the percentage of voids within the layer. Examples of upper and lower porosity limits include 1%, 2%, 3%, 4%, 5%, 6%, 7%, 8%, 9%, 10%, 11%, 12%, 13%, 14%, and 15%.

[0015] In some systems, the porous oxide layer can be sealed by converting at least a portion of the metal oxide to a hydroxide. Converting the metal oxide to a hydroxide can include exposing the coating to water. Converting the metal oxide to a hydroxide can include exposing the coating to heated water (e.g., boiling water). Converting the metal oxide to a hydroxide can seal or partially seal holes, pores, etc. in the metal oxide coating.

[0016] Conventional systems have many drawbacks. Treated oxide protective layers (e.g., pore-closing treatments, hydroxide formation treatments, application of heated water, etc.) may be susceptible to the process environment. For example, vacuum and / or high temperatures may remove moisture from the treated oxide layer. Vacuum and / or high temperatures may cause the sealed, treated, or closed oxide layer to become porous. Porous protective layers may provide reduced protection to the coated component. Some unprotected material may become accessible through the pores of the porous coating. In some areas, a thin layer of protective coating may separate the unprotected (e.g., bulk) material from the ambient environment or from pores accessible to gases in the ambient environment. Porous protective layers may have reduced dielectric breakdown resistance compared to non-porous protective layers. A thin layer of insulating coating may separate the core material of the component from the ambient environment or from pores, etc. Porous protective layers may make it difficult to create a fluid seal. Porous surfaces may provide vacuum leak paths for gases to bypass sealing components, such as O-rings and gaskets.

[0017] Aspects of the present disclosure can alleviate one or more drawbacks of conventional systems. In some embodiments, a component for a processing chamber is provided. The component can be made of one or more metals. The component can include one or more metallic materials. The component can be a component for maintaining a fluid seal within the processing chamber. The component can be configured to define a portion of a sealed volume, for example, the component can be configured to be disposed adjacent to a sealing component such as an O-ring, a gasket, or the like. The component can be aluminum. The component can be a component of a substrate support assembly.

[0018] In some embodiments, a porous protective layer is formed on the component. The porous protective layer may be a metal oxide, a metal fluoride, or a metal oxyfluoride. The porous protective layer may be produced by anodizing the component. The porous protective layer may be alumina (Al2O3).

[0019] In some embodiments, a material can be applied to the porous coating. The material can fill, partially fill, block, etc. the pores of the porous coating. The material applied to the porous coating can be a suspension. The material applied to the porous coating can include colloidal particles. The material applied to the porous coating can include ceramic materials, metal oxides, metal fluorides, and / or metal oxyfluorides.

[0020] In some embodiments, the colloidal material can be selected based on the strength of its interaction with the material of the porous coating. For example, an aluminum oxide coating can strongly interact with aluminum oxide colloidal particles. In some embodiments, the material of the colloidal particles can be selected to correspond to the material of the porous coating. For example, a silica coating treated with silica particles, an yttrium aluminum garnet (YAG) coating treated with YAG particles, etc. The material applied to the porous coating can include the same ceramic material, metal oxide, metal fluoride, or metal oxyfluoride as that constituting the porous protective layer. The material applied to the porous coating can be a colloidal suspension of ceramic material, metal oxide, metal fluoride, and / or metal oxyfluoride particles. In one example, the material applied to the porous coating can be a colloidal suspension of alumina particles.

[0021] In some embodiments, the suspension of colloidal particles may be an aqueous suspension, e.g., may include colloidal particles suspended in water. The water may be deionized, distilled, or otherwise purified. The solution may include one or more additional components. The solution may include additives to adjust solution properties, such as solution pH, solution viscosity, particle surface charge characteristics, and material affinity. The solution may include, for example, sodium oxide (NaO), aluminum oxyhydroxide (AlO(OH)), acetate (CHCOO), ammonia (NH), nitrate (NO), organic acid stabilizers, surfactants, or other additives. The colloidal particles may be nanoparticles. In some embodiments, the size of the colloidal particles may be about 10 nm. The size of the colloidal particles may be 5 nm to 50 nm, 1 nm to 100 nm, or any subrange of these sizes. The concentration of the colloidal particles in the colloidal suspension may vary depending on the solvent material, the intended application, the particle material, etc. The concentration of the colloidal particles in the colloidal solution may be about 20 wt. %. The concentration of the colloidal particles may be 15 wt. % to 25 wt. %. The concentration of colloidal particles may be 10% to 30% by weight, 5% to 40% by weight, any subrange within these ranges, and the like.

[0022] The colloidal particle material can include any material important for enhancing the properties of the porous coating. Particle materials for application to the porous coating can include silica, alumina, yttria, zirconia, yttria-stabilized zirconia, zirconia acetate, and the like. Particle materials can include yttrium-containing compounds such as Y4Al2O9, ceramic compounds including Y2O3 and ZrO2, and the like. Particle materials for application to the porous coating (and in some embodiments, the porous coating material) can include Er2O3, ErAl x O y , YAl x O y , YZr x O y and YZr x Al y O z, Gd2O3, Yb2O3, Y2O3 stabilized ZrO2 (YSZ), Er3Al5O 12 (EAG), Y2O3-ZrO2 solid solution, or composite ceramics containing a solid solution of Y4Al2O9 and Y2O3-ZrO2, ceramic carbides (e.g., silicon carbide SiC, silicon-silicon carbide Si-SiC, boron carbide B4C, etc.), nitride ceramics (e.g., aluminum nitride AlN, silicon nitride SiN, etc.), yttrium fluoride YF 3、 It may include yttrium oxyfluoride (YOF), magnesium oxide, other ceramic materials, or a combination of materials.

[0023] In some embodiments, the material applied to the porous coating can be applied by dipping the component into the material, dipping into a solution containing the material, dipping into a colloidal suspension containing the material, etc. The material can be applied by spraying, brushing, dripping, painting, or otherwise introducing it into the porous coating. The application of the material to the porous material may be assisted, for example, by vacuum assistance, ultrasonic assistance, surface charge assistance, etc. The material can be applied such that the material fills or partially fills the pores of the porous protective coating.

[0024] In some embodiments, the component can be cured, dried, and / or treated. The component can be dried to remove solvent from the suspension applied to the porous protective coating. The component can be dried to harden, fuse, etc., the material occupying the pores of the porous protective coating. The component can be dried to harden the colloidal particles within the pores of the protective coating. Drying can remove solvent from the pores of the protective coating. Drying can cause the colloidal particles to bond with each other, for example, hardening the particles within the pores of the coating. Drying can produce a porous coating having at least partially filled and / or blocked pores.

[0025] Aspects of the present disclosure enable technical advantages over conventional systems. In some embodiments, aspects of the present disclosure enable processing chamber components with filled porous coatings. The filled porous coatings can provide additional protection to the component compared to unfilled porous coatings. The filled porous coatings can be resilient to process conditions. The filled porous coatings can withstand high temperatures. The filled porous coatings can withstand vacuum conditions. The filled porous coatings can increase the coating thickness between the component and the ambient environment. The filled porous coatings can provide additional protection, additional strength, and / or additional life of the protective coating compared to unfilled coatings. The filled porous coatings can provide additional dielectric breakdown resistance over unfilled porous coatings. The filled porous coatings can provide additional dielectric breakdown resistance by increasing the thickness of the insulating material. The filled porous coatings can provide a surface that is more suitable for seal formation than unfilled porous coatings. The filled porous coatings can provide a smoother surface than unfilled porous coatings. The filled porous coatings may have fewer vacuum leak paths and / or be less susceptible to vacuum than unfilled porous coatings.

[0026] In some aspects of the present disclosure, a method includes anodizing a processing chamber component to produce a metal oxide layer on the component, the method further includes applying a colloidal suspension to the metal oxide layer, and the method further includes drying the component.

[0027] In some aspects of the present disclosure, a chamber component for a processing chamber comprises a metal body, the chamber component further comprises a porous coating on the metal body, and the chamber component further comprises a material disposed within pores of the porous coating.

[0028] In some aspects of the present disclosure, a processing chamber includes a substrate support assembly. The substrate support assembly includes a chamber component. The chamber component includes an aluminum body. The chamber component further includes a porous aluminum oxide coating. The chamber component further includes a filler material disposed within the pores of the porous aluminum oxide coating. The substrate support assembly further includes a sealing component. The sealing component is disposed on the aluminum oxide coating of the chamber component to create a fluid seal. The sealing component and the chamber component can create a gas seal.

[0029] Although embodiments are described with respect to pore filling of metal oxide coatings formed by anodization, it should be understood that the embodiments described with respect to pore filling of metal oxide coatings and anodized layers also apply to pore filling of other types of porous coatings, such as metal oxide coatings, metal fluoride coatings, and metal oxyfluoride coatings deposited by deposition techniques other than anodization (e.g., deposition by plasma spray).

[0030] FIG. 1 is a cross-sectional view of a substrate processing chamber 100 including one or more components with a filled porous coating, according to some embodiments. The substrate processing chamber 100 includes a substrate support assembly 150, which includes several components. One or more components of the substrate support assembly 150 may include a filled porous coating. One or more components of the substrate processing chamber 100 may include a porous coating having pores filled or partially filled with a colloidal material. One or more components of the substrate processing chamber 100 may include a porous coating having metal oxide particles disposed within the pores of the porous coating. The substrate support assembly 150 includes a puck 166 (e.g., which may include an electrostatic chuck (ESC)). The puck 166 may perform a chucking operation, such as a vacuum chuck, an electrostatic chuck, or the like. The puck 166 may include an upper puck plate bonded to a lower puck plate (not shown). The puck 166 may be coupled to (e.g., may be in thermal communication with) a cooling plate 164. The cooling plate 164 may be formed of a metal. The cooling plate 164 may be aluminum. The cooling plate 164 may include a filled porous coating. The cooling plate 164 may include an anodized metal oxide coating, the pores of which may be filled with metal oxide particles.

[0031] Further, the substrate support assembly 150 may include a base plate 162 and an insulating plate 101. The base plate 162 may be coupled to the puck 166, for example, attached to the puck 166 by fasteners. The base plate 162 may support the cooling plate 164. The insulating plate 101 may include a material that is insulating from RF radiation, such as a plastic material, a polymer material (e.g., a cross-linked polymer of polystyrene and divinylbenzene), etc. The base plate 162 may be a metal component. The base plate 162 may be an aluminum component. The base plate 162 may include a filled porous protective layer, such as an anodized aluminum layer filled with alumina particles.

[0032] The processing chamber 100 includes a chamber body 102 and a lid 104 that enclose an interior volume 106. The chamber body 102 can be fabricated from aluminum, stainless steel, or other suitable materials. The chamber body 102 generally includes a sidewall 108 and a bottom 110. An outer liner 116 can be disposed adjacent to the sidewall 108, for example, to protect the chamber body 102. The outer liner 116 can be fabricated from and / or coated with a plasma- or halogen-containing gas-resistant material. The outer liner 116 can be fabricated from or coated with aluminum oxide. The outer liner 116 can be fabricated from or coated with yttria, yttrium alloys, oxides thereof, etc.

[0033] An exhaust port 126 can be formed in the chamber body 102 to couple the internal volume 106 to a pumping system 128. The pumping system 128 can include one or more pumps, valves, lines, manifolds, tanks, etc. used to evacuate the internal volume 106 and regulate the pressure.

[0034] A lid 104 may be supported on a sidewall 108 of the chamber body 102. The lid 104 is openable and closable, providing access to the interior volume 106. When closed, the lid 104 may enclose the processing chamber 100. A gas panel 158 may be coupled to the processing chamber 100 and may supply gases, such as process gases, cleaning gases, backing gases, and flushing gases, to the interior volume 106 via a gas distribution assembly 130. The gas distribution assembly 130 may be integral with the lid 104.

[0035] Examples of process gases that can be used in the processing chamber 100 include halogen-containing gases such as C2F6, SF6, SiCl4, HBr, NF3, CF4, CHF3, CH2F3, Cl2, and SiF4. Other reactive gases include O2 or N2O. Non-reactive gases such as N2, He, and Ar can be used for flushing or as carrier gases. The gas distribution assembly 130 (e.g., a showerhead) can have multiple openings 132 in a downstream surface of the gas distribution assembly 130. The openings 132 can direct a flow of gas toward the surface of the substrate 144. In some embodiments, the gas distribution assembly can have a nozzle (not shown) extending through a retaining portion of the lid 104. A seal can be formed between the nozzle and the lid 104. The gas distribution assembly 130 can be fabricated from and / or coated with a ceramic material, such as silicon carbide or yttrium oxide, to withstand the processing conditions of the processing chamber 100.

[0036] The substrate support assembly 150 is positioned within the interior volume 106 of the processing chamber 100 below the gas distribution assembly 130. The substrate support assembly 150 holds the substrate 144 during processing. The substrate support assembly 148 may be coated on its periphery with an inner liner (not shown). The inner liner may share features (e.g., manufacturing materials, functionality, etc.) with the outer liner 116.

[0037] The substrate support assembly 150 may include a support pedestal 152, an insulating plate 101, a base plate 162, a cooling plate 164, and a puck 166. The puck 166 may include an electrode 136 that serves one or more functions. The electrode 136 may include a chucking electrode (e.g., to secure the substrate 144 to the upper surface of the puck 166), a heating electrode, etc.

[0038] A protective ring 146 may be positioned to cover a portion of the outer periphery of the puck 166. The puck 166 may be coated with a protective layer (not shown). The protective layer may be made of a material such as Y2O3 (yttria or yttrium oxide), Y4Al2O9 (YAM), Al2O3 (alumina), Y3Al5O 12 The protective layer may be a ceramic such as YAG, YAlO (YAP), quat, SiC (silicon carbide), SiN (silicon nitride), sialon, AlN (aluminum nitride), AlON (aluminum oxynitride), TiO (titania), ZrO (zirconia), TiC (titanium carbide), ZrC (zirconium carbide), TiN (titanium nitride), TiCN (titanium carbon nitride), Y2O3 stabilized ZrO (YSZ), etc. The protective layer may be a ceramic composite such as YAG dispersed in an alumina matrix, yttria-zirconia solid solution, silicon carbide-silicon nitride solid solution, etc. The protective layer may be sapphire or MgAlON.

[0039] The puck 166 may include an upper puck plate (not shown) and a lower puck plate (not shown) joined by metallurgical and / or diffusion bonding. The upper puck plate may be made of a dielectric or electrical insulator (e.g., with an electrical resistivity of 10 or less) suitable for substrate processing applications. 14The upper back plate may have a resistance of greater than Ω·m. In some embodiments, the upper back plate may be fabricated from a material suitable for use at temperatures from about 20°C to about 500°C. The upper back plate may be comprised of AlN. The AlN upper back plate may be doped or undoped. For example, the upper back plate may be doped with samarium oxide (Sm2O3), cerium oxide (CeO2), titanium dioxide (TiO2), or a transition metal oxide. The upper back plate may be comprised of Al2O3. The Al2O3 upper back plate may be doped or undoped. For example, the upper back plate may be doped with titanium dioxide (TiO2) or a transition metal oxide.

[0040] Additionally, the processing chamber 100 may include a mounting plate (not shown) coupled to the bottom 110 of the chamber body 102 and including passages for routing utilities (e.g., fluids, power lines, sensor leads, etc.) to components of the substrate support assembly 150. For example, cooling fluid may be provided to the cooling plate 164 through the passages, electrical power may be supplied to the electrodes 176 of the puck 166 through the passages, etc.

[0041] Heating elements (e.g., electrodes 176 in puck 166, one or more heating elements (not shown) disposed in cooling plate 164, etc.) can be used to control the temperature of puck 166, substrate 144, etc. Puck 166 can include individually controlled heating zones capable of maintaining different temperatures. Puck 166 can include radial heating zones, segmented heating zones, etc. The temperatures of puck 166, substrate 144, cooling plate 164, base plate 162, etc. can be monitored by one or more temperature sensors.

[0042] Additionally, the puck 166 may include multiple gas passages, such as grooves, mesas, and other features that may be formed in the top surface of the puck 166. The gas passages may be fluidly coupled to a gas source. Gas from the gas source may be utilized as a heat transfer gas or a backside gas, may be utilized to control one or more lift pins of the puck 166, and the like. Multiple gas sources may be utilized. The gas passages may provide a gas flow path for a backside gas, such as He, through holes drilled in the puck 166. The backside gas may be supplied to the gas passages at a controlled pressure to improve heat transfer between the puck 166 and the substrate 144.

[0043] According to embodiments, any component of the substrate support assembly 150 and / or chamber 100 may include a filled porous layer. Components other than those included in the substrate support assembly 150 may include a filled porous protective coating. A filled porous protective coating can provide benefits to many components of a processing chamber. A filled porous protective coating can improve the component's resistance to the process environment, improve fluid seals associated with the component, and improve the component's resistance to dielectric breakdown.

[0044] 2A is a cross-sectional view of a chamber component 200A for use in a processing chamber (e.g., a semiconductor manufacturing chamber) according to some embodiments. Chamber component 200A includes an article 202 and an anodized layer 203 on the article. In one embodiment, anodized layer 203 includes a buffer layer 204 and a porous layer 206. Porous layer 206 includes vertical portions 210 and pores 212 of diameter D between vertical portions 210. Chamber component 200A is illustrated, but not necessarily to scale.

[0045] The article 202 can be made of a metal or metal alloy. The article 202 can be aluminum or an aluminum alloy. The article 202 can be other metals. The article 202 can be other metals that can be anodized. The article 202 can be stainless steel, titanium, a titanium alloy, yttrium, a yttrium alloy, magnesium, a magnesium alloy, etc. The article 202 can be any processing chamber component, for example, a component that would benefit from protection by an oxide coating. The article 202 can be a component of a substrate support assembly, such as a cooling plate, a base plate, etc.

[0046] Article 202 is anodized to form an anodized layer 203 on its surface. Pores 212 are formed between vertical portions 210. Pores 212 may be approximately cylindrical. The bottoms of pores 212 may be approximately hemispherical (e.g., adjacent buffer layer 204). Pores 212 may self-arrange in an approximately hexagonal pattern separated by vertical portions 210. Another view of anodized layer 203 is shown in FIG.

[0047] The anodized layer 203 may be a metal oxide. The anodized layer 203 may be a ceramic material. The anodized layer 203 may be alumina (Al2O3), yttria (YO3), or the like. The anodized layer 203 may be a metal oxide corresponding to the composition of the article 202. For example, if the article 202 is aluminum or an aluminum alloy, the anodized layer may be alumina. If the article 202 is yttrium or an yttrium alloy, the anodized layer 203 may be yttria. If the article 202 is magnesium or a magnesium alloy, the anodized layer 203 may be magnesia or MgO. The anodized layer 203 can be formed to a desired thickness. The thickness of the anodized layer 203 may be several micrometers. The thickness of the anodized layer 203 may be approximately 50 micrometers. The thickness of the anodized layer 203 may be 25 μm to 75 μm. The thickness of the anodized layer 203 may be approximately 5 μm to 200 μm, or any subrange of these values. The pores 212 in the anodized layer 203 may have a target diameter D. The diameter D may be approximately 100 nm. The diameter D may be 50 nm to 300 nm. The diameter D may be approximately 50 nm to 1 μm, or any subrange of these values. The pores 212 may have a high aspect ratio. For example, the diameter of the pores may be 200 nm, and their depth is approximately defined by the thickness of the porous coating (which may be approximately 50 μm). The pores 212 in the anodized layer 203 may be filled, for example, as shown in FIG. 2B.

[0048] FIG. 2B is a cross-sectional view of a chamber component including a filled porous protective layer according to some embodiments. The filled porous protective layer can be produced by applying a colloidal suspension to the anodized oxide layer 203. The colloidal suspension can include colloidal particles suspended in a solvent. The solvent can be water. The solvent can also be other materials, such as organic solvents. The solvent can include additional materials, such as additives, acids or bases, salts, or other materials. Solvent additives include sodium oxide, aluminum oxyhydroxide, acetates, ammonia, nitrates, etc. The colloidal particles can be at a concentration of about 20% by weight in the solution. The colloidal particles can be at a concentration of 10-30% by weight in the colloidal solution. The pH of the solution can be adjusted, for example, to manipulate the particle charge of the colloidal particles to facilitate penetration of the particles into the coating pores or to facilitate interaction or bonding of the particles with the coating. The diameter of the colloidal particles can be smaller than the diameter D of the pores 212. For example, the diameter of the colloidal particles can be about 10 nm. The colloidal particles can be approximately spherical. The colloidal particles may have a diameter of 10 nm to 100 nm. The colloidal particles may have a diameter of 1 nm to 100 nm. The colloidal particles may be metal oxide particles. The colloidal particles may be ceramic materials. The colloidal particles may be metal oxides corresponding to the article 202, the anodized layer 203, etc. For example, the article 202 may be aluminum, the anodized layer 203 may be aluminum oxide, and the colloidal particles 214 may be alumina.

[0049] In some embodiments, the colloid particles 214 may be approximately the same size. In some embodiments, the colloid particles 214 may be sized, for example, in a range of 10 nm to 100 nm in diameter. In some embodiments, the colloid particles 214 may substantially fill the pores 212. In some embodiments, the colloid particles 214 may partially fill, block, or occlude the pores 212.

[0050] The colloidal suspension can be applied to the surface of the anodized layer 203, filling the pores 212. At least a portion of the article 202 can be immersed in the suspension, or the suspension can be washed, brushed, sprayed, or otherwise applied to the surface of the article 202.

[0051] After applying the colloidal suspension, the component 200A is dried, cured, etc. The component 200A is dried to remove solvent from the pores 212. The component 200A may be dried at room temperature, elevated temperature, etc. The component 200A may be dried in a vacuum environment, a standard atmospheric environment, or other environment. The colloidal particles 214 may experience strong attractive forces with each other. The colloidal particles 214 may experience strong electrostatic forces. The colloidal particles 214 may experience attractive forces to the side walls of the pores 212. After drying the filled anodized coating, the colloidal particles 214 may be held within the pores 212 by electrostatic forces. The colloidal particles 214 may form bonds with each other and / or with the walls of the pores in which they are located.

[0052] FIG. 3 is a cutaway perspective view of a protective porous coating on a chamber component 300 according to some embodiments. The chamber component 300 includes an article 302 and an anodized layer 303 on the article. The anodized layer 303 includes a buffer layer 304 and a porous layer 306. The buffer layer can be disposed between pores 312 and the article 302. The porous layer 306 can include pores 312 and sidewalls 310. The porous layer 306 can include substantially cylindrical pores 312 having a diameter and a depth. The porous layer 306 can self-assemble during the anodization process. The pores 312 can be organized into a substantially hexagonal pattern, as shown by the dotted lines on the chamber component 300. The chamber component 300 can share one or more features with the chamber components 200A and / or 200B of FIGS. 2A-B.

[0053] 3 shows empty pores and pores filled with particles 314. The particles 314 may be nanoparticles, colloidal particles, etc. The particles 314 may be metal oxides. The particles 314 may be ceramic particles. The particles 314 may be the same material as the anodized layer 303. The particles 314 may be alumina, silica, yttria, or other oxide materials.

[0054] The particles 314 may be approximately spherical. The particles 314 may fill, partially fill, block, etc., one or more pores 312 in the anodized layer 303. The particles 314 may be deposited in the pores 312 by applying a colloidal suspension of the particles. Introduction of the particles 314 into the pores 312 can be facilitated by several methods. The particles 314 may be placed in the pores 312 with vacuum assistance. The particles 314 may be placed in the pores 312 with electrostatic assistance, for example, by manipulating the surface charge of the chamber component 300. The chamber component 300 may be dried, for example, at room temperature, in an oven, in a vacuum chamber, etc., to remove the solvent from the resulting colloidal suspension of filled pores.

[0055] FIG. 4A is a flow diagram of a method 400A for creating a filled porous protective layer on a component, according to some embodiments. In block 402, a metal article is provided. The metal article is part of a component of a processing chamber. The metal article can include one or more surfaces of the component. The component can be part of a manufacturing system. The component can be part of a substrate processing system. The component can be part of a semiconductor processing and / or manufacturing system. The component can be part of a substrate support. The component can be aluminum. The component can be an alloy containing aluminum. The component can be other metallic materials, such as magnesium, yttrium, titanium, alloys, etc. The component can be used to create a fluid seal, for example, using a sealing component. The component can be subject to arcing, which can, for example, charge the component or nearby components. The component can be used in a harsh or corrosive environment, such as a corrosive gas environment, a plasma environment, or high temperatures. The article can have undergone some preparation, such as surface cleaning, surface preparation, surface finishing, surface polishing, or surface roughening.

[0056] In block 404, the article is anodized to form an anodized layer. The anodized layer may be a metal oxide. The anodized layer may be a metal oxide corresponding to the material of the article. For example, an aluminum article may have an aluminum oxide (Al2O3) anodized layer. The anodized layer may include a porous layer with pores extending therethrough. The anodized layer may include a barrier layer that isolates the article from the environment, the pores, etc. The article may be dried after anodizing, for example, to remove residual moisture from the pores of the anodized layer. The article may be dried at an elevated temperature, in a vacuum environment, etc. after anodizing. The porous layer of the anodized layer may include pores separated by walls of the anodized material (e.g., Al2O3).

[0057] In block 406, a colloidal suspension is applied to the anodized layer. The colloidal suspension can include colloidal particles (e.g., nanoparticles) suspended in a solvent. The size of the colloidal particles can be smaller than the pore size of the porous layer of the anodized layer. The diameter of the colloidal particles can be about 1 nm, about 10 nm, about 50 nm, about 100 nm, etc. The diameter of the colloidal particles can be between 10 nm and 100 nm. The diameter of the colloidal particles can be between 1 nm and 200 nm, or any subrange or combination of these ranges.

[0058] The colloidal suspension can include particles of one or more ceramic materials. The colloidal suspension can include particles of one or more metal oxide materials. The colloidal suspension can include particles of alumina, silica, yttria, zirconia, etc. The colloidal suspension can include particles containing a metal component corresponding to the metal component of a metal article, the metal component of an anodized film, etc.

[0059] At block 408, the metal article is cured to produce a filled porous layer. The filled porous layer can include particles disposed within the pores of the anodized layer. The metal article can be cured to remove solvent associated with the colloidal suspension. The metal article can be cured to form bonds, attractions, affinities, bonding, etc. between the particles disposed within the pores. The metal article can be cured to form bonds, attractions, etc. between the particles disposed within the pores and the anodized material forming the boundaries of the pores. The curing can include drying. The curing can include drying in an oven. The curing can include drying in a vacuum chamber. The curing can include drying in a vacuum oven.

[0060] FIG. 4B is a flow diagram of a method for producing a filled porous protective coating, according to some embodiments. In block 410, a component of a processing chamber is anodized. Anodization produces a metal oxide layer. In some embodiments, only a portion of the surface of the component may be anodized. In some embodiments, anodization can occur until the metal oxide layer (e.g., anodized layer) reaches a target thickness, depth, etc. The thickness of the anodized layer may be on the order of micrometers. The thickness of the anodized layer may be approximately 50 μm. The thickness of the anodized layer may be between 25 μm and 75 μm. The thickness of the anodized layer may be between approximately 10 μm and 200 μm.

[0061] The component may be a component of a process chamber, a manufacturing system, a substrate manufacturing system, a semiconductor manufacturing system, etc. The component may be a component of a substrate support assembly. The component may be used to create a fluid seal in a manufacturing system. The component may be a metal or metal alloy. The component may be aluminum.

[0062] At block 412, a colloidal suspension can be applied to the metal oxide layer. The colloidal suspension can include nanoparticles of a metal oxide, ceramic material, etc., suspended in a solvent. The colloidal suspension can include alumina particles. The colloidal suspension can include particles of silica (SiO2), zirconia (ZrO2), yttria (YO3), etc.

[0063] At block 414, the components are dried. The components can be dried to remove solvents associated with the colloidal suspension. The components can be dried at room temperature or at an elevated temperature. The components can be dried at atmospheric pressure or under vacuum.

[0064] Unless otherwise specified, the terms "first," "second," "third," "fourth," etc. used herein are intended as labels to distinguish between different elements and may not have an ordinal meaning in terms of numerical designation.

[0065] Examples described herein also relate to apparatus for performing the methods described herein, which may be specially configured to perform the methods described herein or may include general-purpose systems selectively configured to perform the methods described herein.

[0066] As used herein, the terms "above," "below," "between," "disposed on," "supporting," and "on" refer to the relative position of a layer of material or component with respect to another layer or component. For example, if a layer is disposed on, above, or below another layer, that layer may be in direct contact with the other layer or may have one or more intervening layers. Furthermore, a layer disposed between two layers may be in direct contact with the two layers or may have one or more intervening layers. Similarly, unless otherwise specified, a feature disposed between two features may be in direct contact with the adjacent feature or may have one or more intervening layers.

[0067] The above description is intended to be illustrative, not limiting. While the present disclosure has been described with reference to specific examples and embodiments, it is understood that the disclosure is not limited to the described examples and embodiments. The scope of the present disclosure should be determined with reference to the following claims, along with the full scope of equivalents to which such claims are entitled.

Claims

1. forming a porous ceramic layer on a component of a processing chamber; applying a colloidal suspension to the porous ceramic layer to fill the pores of the porous ceramic layer; The method includes the step of drying the component.

2. the porous ceramic layer comprises a metal oxide layer; The method of claim 1 , wherein forming the porous ceramic layer comprises anodizing the component to produce a metal oxide layer.

3. The method of claim 1 , wherein the component comprises a component of a substrate support assembly.

4. The method of claim 1 , wherein the component comprises aluminum and the porous ceramic layer comprises alumina.

5. The method of claim 1 , wherein the colloidal suspension comprises metal oxide particles suspended in a solvent.

6. The method of claim 5 , wherein the metal oxide particles comprise alumina particles.

7. The method of claim 1 , wherein the step of forming the porous ceramic layer comprises plasma spraying.

8. The method of claim 1 , wherein the porous ceramic layer has a porosity of 1 to 15%.

9. The method of claim 1 , wherein the porous ceramic layer comprises a metal fluoride or a metal oxyfluoride.

10. The method of claim 1 , wherein the colloidal suspension comprises at least one of metal oxide particles, metal fluoride particles, or metal oxyfluoride particles suspended in a solvent.

11. 1. A chamber component for a processing chamber, comprising: A metal body; a porous coating on the metal body; A chamber component for a processing chamber comprising a material disposed within the pores of a porous coating.

12. The chamber component of claim 11 , wherein the metal body comprises aluminum.

13. The chamber component of claim 11 , wherein the porous coating comprises an anodized metal oxide coating.

14. The chamber component of claim 13 , wherein the material disposed within the pores of the porous coating comprises metal oxide particles.

15. The chamber component of claim 11 , wherein the porous coating comprises a metal oxide coating, a metal fluoride coating, or a metal oxyfluoride coating.

16. The chamber component of claim 11 , wherein the material disposed within the pores of the porous coating comprises at least one of metal oxide particles, metal fluoride particles, or metal oxyfluoride particles.

17. 1. A processing chamber comprising a substrate support assembly, the substrate support assembly comprising: A chamber component comprising: An aluminum body, a porous aluminum oxide coating; a chamber component comprising: a filler material disposed within the pores of the porous aluminum oxide coating; A processing chamber comprising a substrate support assembly comprising a seal component disposed over an aluminum oxide coating of a chamber component to create a fluid seal.

18. The processing chamber of claim 17 , wherein the metal body comprises aluminum.

19. The processing chamber of claim 17 , wherein the porous coating comprises an anodized metal oxide coating.

20. 20. The processing chamber of claim 17, wherein the material disposed within the pores of the porous coating comprises metal oxide particles.

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