Vibration damping control method, and device for electroplating device, electroplating device, and electronic device

Abstract

The present application provides a vibration damping control method and device for an electroplating apparatus, as well as electronic equipment. The method includes obtaining a resonant frequency of the electroplating apparatus and selecting an operating frequency of a paddle based on the resonant frequency. The operating frequency is equal to m times the resonant frequency, where m is a real number in the range (0, 0.5), and the operating cycle of the paddle is shorter than the electroplating process time. The operating frequency is the frequency at which the paddle vibrates in a stepped reciprocating manner within the electroplating chamber of the electroplating apparatus. The vibration damping control method, device for an electroplating apparatus, and electronic equipment of the present application accurately control the operating frequency of the paddle within the electroplating chamber of the electroplating apparatus and the vibration mode of the paddle in each electroplating chamber according to the different resonant frequencies of different electroplating apparatuses. This significantly reduces the impact of paddle vibration, ensuring substrate stability in an actual process environment and ensuring substrate processing quality, thereby improving substrate yield.

Description

[Technical Field]

[0001] This application relates to the technical field of integrated circuit manufacturing and production, and more particularly to vibration damping control methods, apparatus for electroplating equipment, and electronic devices. [Background technology]

[0002] With the rapid development of integrated circuit production and manufacturing technology, chip area continues to expand, and the number of transistors per chip is also increasing dramatically. Chips can contain tens of thousands, or even tens of billions, of transistors. In electroplating processes, the requirements for plating speed and production volume are becoming increasingly higher. In the field of advanced packaging, the requirements for chip uniformity are also increasing. To ensure stable quality transmission in the electroplating process and meet production capacity and quality requirements, high-speed vibrating paddle assemblies are being introduced into electroplating equipment. The paddle assembly includes multiple paddles parallel to the surface of the substrate. The paddles reciprocate to agitate the electroplating solution, thereby thoroughly delivering metal ions and electroplating solution additives to the substrate surface.

[0003] For details, please refer to FIG. 1. FIG. 1 shows a schematic structural diagram of an electroplating apparatus disclosed in Chinese Patent Application No. 202110154928.5. As shown in FIG. 1, the electroplating apparatus includes an electroplating tank 101, a substrate clamp 102, and a plurality of strip-shaped paddles 103 arranged in parallel. Here, the substrate clamp 102 is used to clamp a substrate 104. The paddle 103 is disposed between the substrate 104 and an electrode (not shown), and is parallel to the substrate 104. During electroplating, the substrate 104 and the paddle 103 are immersed in the electroplating solution in the electroplating tank 101. The paddle 103 is driven by a driving mechanism 105 to reciprocate in a direction parallel to the substrate 104, thereby stirring the electroplating solution. The movement direction of the paddle 103 may be further restricted by a guide rail 109 connected thereto. A controller 106 is connected to the driving mechanism 105. The controller 106 controls the movement of the paddle 103 by controlling the operation of the drive mechanism 105 according to a program. a is defined as the width of the paddle, and b is the narrowest gap between adjacent paddles. See FIG. 2, which illustrates the movement mode of the paddle 103. FIG. 2 is a schematic diagram illustrating the change in the position of the paddle in one cycle when the paddle in the prior art is vibrated in a stepwise reciprocating stepping manner. As can be seen from FIG. 2, the movement of the paddle 103 in one operation cycle can be divided into four steps: step 501, in which the paddle moves right from the coordinate origin (black triangle) to coordinate Δ; step 502, in which the paddle moves left to coordinate a; step 503, in which the paddle moves right to coordinate Δ+a; and step 504, in which the paddle moves left to the coordinate origin. In one operation cycle, the paddle 103 moves alternately left and right. Since each corresponding point on the substrate 104 is blocked by the paddle 103 for the same time, when the electric field is uniformly distributed, each corresponding point on the substrate 104 receives the same amount of electricity, resulting in the same electroplating height at each point. In order to prevent the coordinate ranges covered by the paddle 103 at each turning position in one operating cycle from overlapping with each other, it is necessary that Δ≧a+b, i.e., Δ≧2a, so that the stirring degree at each point in the electroplating is more balanced.In the electroplating process, the paddle 103 completes one operation cycle and then immediately begins the next operation cycle.

[0004] As demand for high-speed electroplating increases, high-speed copper electroplating equipment is becoming the standard, followed by high-speed tin-silver electroplating equipment. More and more electroplating chambers with high-speed vibrating paddles are being configured on the same electroplating equipment. For example, one electroplating equipment previously had eight copper electroplating chambers with paddles, but now four tin-silver electroplating chambers with paddles have been added. A total of 12 electroplating chambers are equipped with paddles. However, the main mechanical frame of the electroplating equipment is interconnected. When multiple electroplating chambers operate simultaneously, each electroplating chamber generates vibrations, causing the various modules of the electroplating equipment to interact with each other. At a certain frequency, the entire electroplating equipment resonates. At this time, the substrate inside the electroplating chamber is prone to movement, and the movement data was measured to be 0.5 mm. This movement frequently triggers alarms indicating substrate position deviation, affecting the normal processing of the substrate. Measurements showed that the resonant frequency at which the electroplating equipment and paddles resonate in this case is 1 Hz. A schematic diagram of the electroplating apparatus and the period during which the puddle reaches resonance is shown in Figure 3.

[0005] As the demand for uniform electroplating increases, the paddle 103 adopts the aforementioned vibration mode of a stepwise reciprocating motion. The vibration of the paddle 103 and the vibration of the electroplating equipment generate two vibration frequencies similar to the harmonics and carrier waves of electromagnetic waves. When the two frequencies are close to each other, resonance is likely to occur. When resonance occurs, the overall amplitude of the electroplating equipment increases, and the vibration of the electroplating equipment is transmitted to each module of the machine via the machine mainframe, causing passive vibration of related components. For example, the substrate loading box and substrate alignment device in the front-end module are both affected by the vibration, causing substrate misalignment. The manipulator itself can also be affected, potentially causing substrates to fall or become misaligned during high-speed movement. Summary of the Invention

[0006] In view of the above, embodiments of the present invention at least partially solve the problems existing in the prior art, and provide a vibration damping control method, an apparatus for an electroplating apparatus, and electronic equipment that can reduce vibrations in an electroplating apparatus during operation and achieve the purpose of stabilizing the substrate process and the apparatus.

[0007] According to a first aspect, an embodiment of the present invention provides a vibration damping control method for an electroplating apparatus, the vibration damping control method comprising: Obtaining the resonant frequency of the electroplating apparatus; and selecting an operating frequency of the paddle based on the resonant frequency, wherein the operating frequency is equal to m times the resonant frequency, m being a real number within a numerical range (0, 0.5), and the operating cycle corresponding to the operating frequency of the paddle is shorter than the processing time of the electroplating; The operating frequency is characterized as the frequency at which the paddle periodically moves in a stepwise reciprocating stepping manner within the electroplating chamber of the electroplating apparatus.

[0008] According to a specific implementation of an embodiment of the present invention, the electroplating apparatus may include a pre-wetting chamber, an electroplating chamber, a cleaning chamber, a frame of the electroplating apparatus, and a manipulator.

[0009] According to a specific implementation example of an embodiment of the present invention, the method may further include, after selecting an operating frequency of the paddle, calculating, based on the operating frequency, the displacement amount Δ required for the paddle to move forward once and then move backward once using equation (1).

[0010] Equation (1) is Δ=L×mf×t1×R where, L represents the distance between the start point and the end point in the vibration process of the paddle in a stepwise reciprocating stepping manner. f represents the resonant frequency of the electroplating equipment. t1 represents the amount of time it takes for the paddle to move forward and then back. R represents the number of times the paddle travels the distance L in one vibration cycle.

[0011] According to a specific implementation example of the embodiment of the present invention, when the number of electroplating chambers in the electroplating apparatus is even, the paddles in two adjacent electroplating chambers may move in opposite directions to each other.

[0012] According to a specific implementation example of an embodiment of the present invention, when the number of electroplating chambers in the electroplating apparatus is even, two adjacent electroplating chambers at the same horizontal height are defined as one group, and the paddles of the electroplating chambers in the same group may move in opposite directions to each other.

[0013] According to a second aspect, there is provided a vibration damping control method for an electroplating apparatus, characterized in that when the number of electroplating chambers in the electroplating apparatus is even, the paddles in two adjacent electroplating chambers move in opposite directions.

[0014] According to a specific implementation example of an embodiment of the present invention, when the number of electroplating chambers in the electroplating apparatus is even, two adjacent electroplating chambers at the same horizontal height are defined as one group, and the paddles of the electroplating chambers in the same group may move in opposite directions to each other.

[0015] According to a third aspect, there is provided a vibration damping control device for an electroplating apparatus, the device comprising: an information acquisition unit for acquiring a resonance frequency of the electroplating apparatus and transmitting the resonance frequency of the electroplating apparatus to a processing unit; a processing unit for receiving the resonance frequency of the electroplating apparatus transmitted from the information acquisition unit and selecting an operating frequency of the paddle based on the resonance frequency of the electroplating apparatus, wherein the operating frequency of the paddle is defined as m times the resonance frequency, where m is a real number within a numerical range (0, 0.5), and the operating cycle corresponding to the operating frequency of the paddle is shorter than the processing time of the electroplating, and the operating frequency of the paddle is a frequency at which the paddle periodically moves in a stepped reciprocating manner in the electroplating chamber of the electroplating apparatus; and a control unit for controlling the operation of the paddle in accordance with the operating frequency of the paddle selected by the processing unit.

[0016] According to a specific implementation example of the embodiment of the present invention, the processing unit may be further configured to calculate a displacement amount required for the paddle to move forward once and then move backward once based on the operating frequency of the paddle, generate stepping command data for the paddle based on the displacement amount required for the paddle to move forward once and then move backward once, and transmit the command data to the control unit.

[0017] According to a specific implementation example of the embodiment of the present invention, the control unit may be further configured to receive stepping command data transmitted from the processing unit, the stepping command data corresponding to a displacement amount required for the paddle to move forward once and then move backward once, and the operation of the paddle is controlled in accordance with the command data.

[0018] According to a specific example of an embodiment of the present invention, the electroplating apparatus may include a pre-wetting chamber, an electroplating chamber, a cleaning chamber, an electroplating apparatus frame, and a manipulator.

[0019] According to a specific example of the embodiment of the present invention, the processing unit calculates a generated displacement amount required for the paddle to move forward once and then move backward once based on the operating frequency of the paddle, and the calculation includes: This may include calculating the displacement amount Δ that needs to be generated each time the paddle moves forward once and then moves backward once using equation (1).

[0020] Equation (1) is Δ=L×mf×t1×R where, L represents the distance between the start point and the end point in the vibration process of the paddle in a stepwise reciprocating stepping manner. f represents the resonant frequency of the electroplating equipment.

[0021] t1 represents the amount of time it takes for the paddle to move forward and then back. R represents the number of times the paddle travels the distance L in one vibration cycle.

[0022] According to a fourth aspect, there is provided an electroplating apparatus comprising the vibration damping control device according to any one of the third aspects.

[0023] According to a specific implementation example of the embodiment of the present invention, when the number of electroplating chambers in the electroplating apparatus is even, the paddles in two adjacent electroplating chambers may move in opposite directions to each other.

[0024] According to a specific implementation example of an embodiment of the present invention, when the number of electroplating chambers in the electroplating apparatus is even, two adjacent electroplating chambers at the same horizontal height are defined as one group, and the paddles of the electroplating chambers in the same group may move in opposite directions to each other.

[0025] According to a fifth aspect, there is provided an electronic device, the electronic device comprising: at least one processor; a memory unit communicatively coupled to the at least one processor; The electronic device provides an electronic device in which a memory unit stores instructions to be executed by at least one processor, and the instructions are executed by the at least one processor, thereby enabling the processor to execute the vibration damping control method for an electroplating apparatus described in any of the first or second aspects.

[0026] According to a sixth aspect, there is provided a non-transitory computer-readable storage medium storing computer instructions for causing a computer to perform the method for controlling vibration damping of an electroplating apparatus according to any one of the first and second aspects.

[0027] The vibration damping control method, electrolytic plating apparatus, and electronic device of the present invention accurately controls the operating frequency of the paddle in the electrolytic plating chamber of the electrolytic plating apparatus and the vibration mode of the paddle in each electrolytic plating chamber according to the different resonance frequencies of each electrolytic plating apparatus, thereby significantly reducing the impact of paddle vibration, ensuring substrate stability in the actual process environment, ensuring substrate processing quality, and improving substrate yield. [Brief explanation of the drawings]

[0028] In order to more clearly describe the technical solutions of the embodiments of the present invention, the drawings that need to be used in the embodiments are briefly introduced below. The drawings in the following description are only some embodiments of the present invention, and it is obvious that those skilled in the art can obtain other drawings based on these drawings without creative efforts. FIG. 1 is a schematic diagram of a conventional electroplating apparatus. FIG. 2 is a schematic diagram showing the positional change of a paddle in one cycle when the paddle is vibrated in a stepwise reciprocating stepping manner in the prior art. FIG. 3 is a schematic diagram showing the period until a prior art electroplating apparatus reaches resonance with a puddle. FIG. 4a is a flow chart showing a vibration damping control method for an electroplating apparatus according to one embodiment of the present invention. FIG. 4b is a flow chart showing a vibration damping control method for an electroplating apparatus according to another embodiment of the present invention. 5a and 5b are schematic diagrams illustrating the operation of a paddle according to one embodiment of the present invention. FIG. 6 is a schematic diagram illustrating the vibration period when the operating frequency of the paddle is one-tenth the resonant frequency of the electroplating apparatus in one embodiment of the present invention. FIG. 7 is a schematic view showing the movement of paddles in two electroplating chambers in an electroplating apparatus according to one embodiment of the present invention having two electroplating chambers. FIG. 8 is a schematic diagram of a vibration damping control device for an electroplating apparatus according to one embodiment of the present invention. FIG. 9 is a timing diagram of vibration control of paddles in adjacent electroplating chambers according to one embodiment of the present invention. FIG. 10 is a schematic diagram of the oscillation period of paddles in adjacent electroplating chambers according to one embodiment of the present invention. DETAILED DESCRIPTION OF THE INVENTION

[0029] Hereinafter, an embodiment of the present invention will be described in detail with reference to the accompanying drawings.

[0030] Hereinafter, embodiments of the present invention will be described in conjunction with specific and detailed embodiments. Those skilled in the art will easily understand other advantages and effects of the present invention from the disclosure of this specification. Naturally, the described embodiments are only a portion of the embodiments of the present invention, and are not all of the embodiments. The present invention can also be implemented or applied in other different specific embodiments, and various details of this specification can be modified or changed based on different perspectives and applications without departing from the spirit of the present invention. It should be noted that the following embodiments and features in the embodiments can be combined with each other without contradiction. Based on the embodiments of the present invention, all other embodiments that can be obtained by those skilled in the art without making creative efforts under the premise thereof also fall within the scope of protection of the present invention.

[0031] Various aspects of embodiments within the scope of the appended claims are described below. It is apparent that the aspects described herein may be embodied in a wide variety of forms, and that any specific structure and / or function described herein is merely exemplary. Based on the present invention, one skilled in the art will understand that one aspect described herein can be implemented independently of any other aspect, and that two or more of these aspects can be combined in various ways. For example, an apparatus can be implemented and / or a method can be practiced using any number of the aspects described herein. Furthermore, an apparatus can be implemented or a method can be practiced using other structure and / or function in addition to one or more of all of the aspects described herein.

[0032] It should also be noted that the drawings provided in the following embodiments merely show the basic concept of the present invention in a simplified manner. Furthermore, the drawings do not correspond to the number, shape, and size of components in an actual implementation, but only show components related to the present invention. In an actual implementation, the type, number, and proportion of each component may be arbitrarily changed, and the component layout may be more complex.

[0033] Furthermore, in the following description, specific details are provided to facilitate a thorough understanding of the embodiments, but it will be understood by those skilled in the art that the described aspects may be practiced without these specific details.

[0034] An embodiment of the present invention provides a vibration damping control method for an electroplating apparatus. The vibration damping control method includes obtaining the resonant frequency of the electroplating apparatus and selecting a paddle operating frequency based on the resonant frequency of the electroplating apparatus. The paddle operating frequency should be equal to m times the resonant frequency of the electroplating apparatus, where m is a real number in the range of (0, 0.5). The operating cycle corresponding to the paddle operating frequency is shorter than the electroplating processing time. The paddle operating frequency is the frequency at which the paddle periodically moves in a stepped reciprocating manner within the electroplating chamber of the electroplating apparatus. The present invention controls the paddle operating frequency according to the vibration frequency of the entire system during the operation process of the electroplating apparatus, thereby achieving the goals of vibration damping and substrate stabilization during the electroplating process and ensuring substrate processing yield.

[0035] Hereinafter, the vibration damping control method for an electroplating apparatus provided by the present invention will be described in detail with reference to specific embodiments.

[0036] Please refer to Fig. 4a. Fig. 4a is a flow chart showing a vibration damping control method for an electroplating apparatus according to an embodiment of the present invention. As shown in Fig. 4a, the vibration damping control method for an electroplating apparatus provided by an embodiment of the present invention includes: Step S100: obtaining the resonant frequency of the electroplating apparatus; and The method includes a step S200 of selecting an operating frequency of a paddle based on a resonant frequency of the electroplating apparatus, wherein the operating frequency is equal to m times the resonant frequency, where m is a real number within a numerical range of (0, 0.5), the operating cycle corresponding to the operating frequency of the paddle is shorter than the processing time of the electroplating, and the operating frequency of the paddle is a frequency at which the paddle periodically moves in a stepped reciprocating stepping manner within the electroplating chamber of the electroplating apparatus.

[0037] The value of m is 0.5 or less. When m=0.5, it means that the operating frequency of the paddle is 0.5 times the resonant frequency of the electroplating equipment. When m=0.1, it means that the operating frequency of the paddle is 0.1 times the resonant frequency of the electroplating equipment. When m=0.01, it means that the operating frequency of the paddle is 0.01 times the resonant frequency of the electroplating equipment. It should be understood that the smaller the value of m, the greater the difference between the operating frequency of the paddle and the resonant frequency of the electroplating equipment. The lower the possibility of resonance between the paddle and the electroplating equipment, the better the vibration damping effect. The specific value selected for m is selected within a range of greater than 0 and less than or equal to 0.5 according to actual process requirements, and is not limited to these values ​​in the present embodiment.

[0038] The electroplating apparatus includes, but is not limited to, a pre-wetting chamber, an electroplating chamber, a cleaning chamber, a frame of the electroplating apparatus, a manipulator, etc., and all components provided in the electroplating apparatus are included in the system.

[0039] An embodiment of the present invention will be described in detail using an electroplating apparatus for performing a high speed copper electroplating process as an example.

[0040] When it is determined that the electroplating apparatus is about to perform a high-speed copper plating process, the resonant frequency of the electroplating apparatus is measured in advance before the process is performed. The data value of the resonant frequency of the electroplating apparatus during the process is measured. In an embodiment of the present invention, the measured resonant frequency is 1 Hz. Figure 3 is a diagram of the resonant period of the electroplating apparatus. The vibration period of the electroplating apparatus is 1 second, and the resonant frequency is 1 Hz.

[0041] Based on the resonant frequency f = 1 Hz of the electroplating equipment obtained in step S100, the paddle operating frequency F can be selected according to the resonant frequency f. Specifically, to ensure the stability of the substrate during the process, the paddle operating frequency needs to be shifted from the resonant frequency of the electroplating equipment. Possible treatment methods include lowering the paddle operating frequency or increasing the paddle operating frequency. The method adopted by the present invention is to set the paddle operating frequency F lower than the resonant frequency f of the electroplating equipment and set the paddle operating frequency F as low as possible. However, to achieve uniform electroplating in the electroplating process, it is also necessary to consider the factor that the paddle must complete at least one cycle in the electroplating chamber within one electroplating treatment time to ensure that each corresponding point on the substrate is cumulatively blocked by the paddle for an equal period of time in one operating cycle. Therefore, assuming that the paddle can reciprocate nearly infinitely, it is also necessary that the paddle can complete one cycle within the predetermined electroplating treatment time. Therefore, when selecting the operating frequency, the operating frequency needs to be equal to m times the resonant frequency. Since m is a real number in the numerical range (0, 0.5], F = mf. The operating frequency of the paddle is F = mf.

[0042] 4b is a flow chart showing a vibration damping control method for an electroplating apparatus according to one embodiment of the present invention. As shown in FIG. 4b, the vibration damping control method for an electroplating apparatus according to another embodiment of the present invention further includes step S300, which calculates the displacement amount required for one forward and one backward movement of the paddle, i.e., one reciprocating step, in accordance with the paddle operating frequency F. Based on the displacement amount required for one reciprocating step, paddle stepping command data can be generated. The paddle is controlled to operate in a stepped reciprocating stepping manner in accordance with the command data.

[0043] For example, in step S100, if the operating frequency F of the paddle is set to m times the resonance frequency f of the electroplating apparatus, the displacement Δ required for the paddle to move forward once and then back once can be calculated using Equation 1. Equation 1 is expressed as follows: Δ=L×mf×t1×R...Equation (1) Here, Δ represents the displacement generated by one forward and one backward movement of the paddle. L represents the distance between the start and end points of the paddle's vibration process in a stepwise reciprocating manner and is a specific value determined based on the actual equipment size. m represents the number of times the paddle's operating frequency is higher than the resonant frequency and is a constant preset according to the actual process requirements. f represents the resonant frequency of the electroplating equipment and is determined as a known value before the process is executed. t1 represents the time required for the paddle to move forward and then back again, i.e., the time required for each paddle position change to generate each displacement of Δ. t1 is determined by the drive mechanism selected for the actual process and is a known value during the calculation process. This value can be adjusted by selecting the drive mechanism according to the actual process conditions. R represents the number of times the paddle moves to the distance L during one vibration cycle.

[0044] It is important to note that in the embodiment of the present invention, the end point in the vibration process of the paddle in the stepwise reciprocating stepping manner refers to the position to which the paddle can move furthest from the start point in the movement process.

[0045] Specifically, frequency is the number of times a periodic change is completed per unit time, so frequency is a quantity that represents the frequency of a periodic movement. F=1 / T=mf (2)

[0046] Here, T is the time required for the paddle to complete a motion cycle within the electroplating chamber. In this embodiment, the time required for one motion cycle refers to the time from the start of the paddle motion until each corresponding point on the substrate is first cumulatively blocked by the paddle for an equal period of time. See Figures 5a, 5b, and 6. One motion cycle of the paddle during the vibration process is divided into equal intervals, R. R is set to 2 or 4, with the starting point being point A and the end point being point B. End point B is the end point of the paddle's reciprocating stepping motion and refers to the furthest position the paddle can move from the starting point during the movement process. The distance from point A to point B is set to L, and the displacement caused by the paddle is 1L for each interval obtained by dividing the time into R.

[0047] As described above, to prevent resonance between the paddle and the electroplating equipment, the operating frequency of the paddle must be shifted from the resonant frequency of the electroplating equipment. Possible solutions include lowering the operating frequency of the paddle or raising the operating frequency of the paddle. It can be understood that if the vibration frequency of the paddle is higher or lower than the resonant frequency of the electroplating equipment, resonance of the paddle or the electroplating equipment will not occur, thereby solving the substrate instability problem caused by resonance in existing equipment. In embodiments of the present invention, a more effective solution can be achieved by selecting the operating frequency of the paddle to be much higher or much lower than the resonant frequency. In embodiments of the present invention, "much higher" means that the operating frequency of the paddle is at least 1.5 times the resonant frequency of the electroplating equipment, and "much lower" means that the operating frequency of the paddle is at most 0.5 times the resonant frequency of the electroplating equipment. For example, in embodiments of the present invention, control is performed to limit the operating frequency of the paddle to be much lower than the resonant frequency. Next, it is specified that for each L, the paddle must operate N times in a stepwise reciprocating stepping manner. If N is not an integer, a positive integer greater than N is automatically adopted during the calculation process. For the paddle to complete a motion cycle, it must move a distance of R×L, i.e., perform R×N motions. The time required for the paddle to perform each of the N motions is defined as t1. In this embodiment, each of the N motions should be understood to mean that the paddle moves forward once within the electroplating chamber and then retreats once. Therefore, as follows: T=R×N×t1...Equation (3)

[0048] Combining equation (3) and equation (2) gives the following equation: F=1 / T=1 / (R×N×t1)=mf

[0049] The above formula can be transformed as follows: N=1 / (R×t1×mf)...Equation (4)

[0050] Then, in the process from the starting point A to the end point B, or from the end point B to the starting point A, the displacement amount Δ that occurs each time the paddle moves forward once and then moves backward once is as follows: Δ=L / N=L×F×t1×R=L×mf×t1×R...Equation (1)

[0051] The calculated value Δ represents the displacement Δ required for the paddle to move forward once and then move backward once. Stepping command data for the paddle is generated based on the calculated value Δ, and the paddle is controlled to move in a stepped reciprocating stepping manner according to the command data.

[0052] Because the size of the equipment is fixed, the time t1 required for the drive mechanism to advance the paddle once and then retreat once is also fixed. The distance L the paddle must travel in each operating cycle can be preset. That is, after determining the operating frequency of the paddle, the paddle control method can be determined by directly calculating the displacement Δ generated each time the paddle advances and retreats once. Therefore, it can be concluded that the present invention is effective in solving the problem of passive vibration of related components due to resonance between the paddle and the electroplating equipment, which affects the stability of the substrate and ultimately the substrate processing yield. The present invention utilizes the resonant frequency of the electroplating equipment to calculate the displacement required each time the paddle advances and retreats once in a stepped reciprocating manner. The calculated displacement is then combined with the actual size of the equipment to control the paddle vibration, thereby avoiding resonance during the electroplating process and achieving the effect of stabilizing the substrate.

[0053] Figures 5a and 5b are diagrams showing the operation of the paddle in an embodiment of the present invention, where Figure 5a is a diagram showing the operation of the paddle when R is 2, and Figure 5b is a diagram showing the operation of the paddle when R is 4.

[0054] For example, referring to Figure 5a, in an embodiment of the present invention, L = 10 mm, f = 1 Hz, and t1 are set to 0.1 seconds. The multiple relationship m between the operating frequency and the resonant frequency of the paddle is set to 0.5, L needs to move twice within one cycle, and R is 2. Calculating from equation (1), it can be seen that the displacement Δ required for the paddle to move forward once and then back once is Δ = 1 mm.

[0055] After determining that the displacement Δ required for the paddle to move forward once and then back once is Δ = 1 mm, command data for the paddle based on the reciprocating stepping method is generated using this value of Δ = 1 mm. The paddle's movement is controlled according to this command data. Specifically, when the command data for the paddle based on the reciprocating stepping method is Δ = 1 mm, the paddle's control operation mode is as follows: Move 10 mm from point A to point B, then move 9 mm from point B to point A. At this time, the distance of 1 mm from point A is set as a new starting point, and the new starting point is recorded as point A'. Move 10 mm from point A' to point B until distance L (10 mm) is completed, then move 9 mm in the opposite direction toward point A', and reach the end point, point B. Next, using point B as the starting point, move 10 mm from point B to point A, and then move another 9 mm in the opposite direction toward point B. Step by Δ=1 mm for each reciprocating motion, and repeat the reciprocating motion 10 times to complete a total of 10 mm.

[0056] For example, referring to Figure 5b, in an embodiment of the present invention, L = 10 mm, f = 1 Hz, and t1 are set to 0.1 seconds. The multiple relationship m between the operating frequency of the paddle and the resonance frequency is set to 0.5, and L must move four times within one cycle, so R is 4. Calculating from equation (1) reveals that the displacement Δ required for the paddle to move forward once and then back once is Δ = 2 mm.

[0057] After determining that the displacement Δ required for the paddle to move forward once and then back once is Δ=2 mm, this value of Δ=2 mm is used to generate command data for the paddle based on a reciprocating stepping mechanism. The paddle's movement is controlled according to this command data. Specifically, when the command data for the paddle based on the reciprocating stepping mechanism is Δ=2 mm, the paddle's movement process can be divided into four processes: process 1) is movement from point A to point B, process 2) is movement from point B to point A, process 3) is movement from point A to point C, and process 4) is movement from point C to point A. The paddle's control operation mode in each process is controlled with reference to the control method shown in Figure 5a, and therefore will not be described in detail here.

[0058] To visualize the paddle's motion in an actual process, please refer to Figure 6. Figure 6 is a diagram illustrating the vibration period of the paddle when the paddle's motion frequency is 1 / 10 of the resonant frequency of the electroplating equipment in an embodiment of the present invention. 1 / 10 of the resonant frequency f of the electroplating equipment is set as the endpoint value of the maximum paddle motion frequency F. As can be seen from the diagram, in this embodiment of the present invention, L is 10 mm, t1 is 0.1 seconds, and the paddle must move the distance L twice in one cycle. Furthermore, R is 2, and Δ can be calculated from equation (1) as 0.2 mm.

[0059] After determining that the displacement Δ required for the paddle to move forward once and then back once is Δ=0.2 mm, command data for the paddle's reciprocating stepping motion is generated using this displacement Δ=0.2 mm. The paddle's motion is controlled according to this command data. Specifically, see FIG. 6, which schematically illustrates the motion of a paddle in an embodiment of the present invention. As shown in FIGS. 5a and 6, when the command data for the paddle's reciprocating stepping motion is Δ=0.2 mm, the paddle's control motion mode can be configured as follows: Move 10 mm from point A toward point B, then move 9.8 mm from point B toward point A. At this time, a position 0.2 mm away from point A is set as a new starting point, and this position is recorded as point A'. Next, move 10 mm from point A' toward point B, and then move 9.8 mm in the opposite direction toward point A'. Repeated movement with a step size of Δ=0.2 mm completes distance L (10 mm) and reaches end point B. Next, starting from point B, move 10 mm from point B towards point A, then move another 9.8 mm in the opposite direction towards point B. Each reciprocating motion moves with a step width of Δ = 0.2 mm. By repeating this back and forth motion, the total distance of 10 mm is divided into 50 movements.

[0060] Furthermore, in an embodiment of the present invention, when the number of electroplating chambers in an electroplating apparatus is even, the paddles in two adjacent electroplating chambers move in opposite directions, as shown in Figure 7, which schematically illustrates the operation of the paddles in two electroplating chambers. In this embodiment, when the number of electroplating chambers is even, the paddles can be vibrated using the stepwise reciprocating stepping method described in the above embodiment, or other vibration methods can be selected. Furthermore, only the paddles in the two adjacent electroplating chambers need to move in opposite directions, which allows vibration waves generated when the paddles vibrate in the adjacent electroplating chambers to cancel each other out.

[0061] Furthermore, if the number of electroplating chambers in the electroplating equipment is even, two adjacent electroplating chambers at the same horizontal height are defined as one group, and the paddles of the electroplating chambers in the same group move in opposite directions. This allows the vibration waves generated by the vibrations to cancel each other out, further improving the vibration damping effect.

[0062] In accordance with the above-described method embodiment, please refer to Fig. 8, which shows a schematic structural diagram of a vibration damping control device for an electroplating apparatus according to an embodiment of the present invention. As shown in Fig. 8, the embodiment of the present invention further provides a vibration damping control device for an electroplating apparatus. The vibration damping control device includes an information acquisition unit 310, a processing unit 320, and a control unit 330.

[0063] The information acquisition unit 310 is used to acquire the resonant frequency of the electroplating apparatus and transmit the resonant frequency of the electroplating apparatus to the processing unit 320 .

[0064] The processing unit 320 receives the resonant frequency of the electroplating apparatus transmitted from the information acquisition unit 310 and selects the operating frequency of the paddle based on the resonant frequency of the electroplating apparatus. This selection involves determining the operating frequency of the paddle as m times the resonant frequency, where m is a real number within the range (0, 0.5). The operating cycle corresponding to the operating frequency of the paddle is set shorter than the processing time of the electroplating. The operating frequency of the paddle refers to the frequency at which the paddle periodically moves in a stepwise reciprocating manner within the electroplating chamber of the electroplating apparatus. Similarly, the value of m is selected within a range greater than 0 and less than or equal to 0.5 according to the actual process requirements, and the specific value is not particularly limited in the embodiments of the present invention.

[0065] Furthermore, the processing unit 320 is configured to calculate the displacement amount required for the paddle to move forward once and then move backward once based on the operating frequency of the paddle. Based on the displacement amount required for the paddle to move forward once and then move backward once, stepping command data for the paddle is generated and transmitted to the control unit 330.

[0066] The control unit 330 is used to control the operation of the paddles according to the operating frequency of the paddles selected by the processing unit 320 .

[0067] Specifically, the control unit 330 receives stepping command data from the processing unit based on the amount of displacement required to occur each time the paddle moves forward once and then moves backward once, and controls the operation of the paddle according to the command data.

[0068] Here, the processing unit 320 is also used to calculate the displacement Δ required for each forward movement of the paddle and then each backward movement of the paddle based on the operating frequency of the paddle using equation (1).

[0069] Equation (1) is as follows: Δ=L×mf×t1×R...Equation (1) Here, Δ represents the displacement generated by one forward and one backward movement of the paddle. L represents the distance between the start and end points of the paddle's stepping oscillation, and is a specific value determined based on the size of the actual equipment. m represents the number of times the paddle's operating frequency is higher than the resonant frequency and is a constant preset according to the actual process requirements. f represents the resonant frequency of the electroplating equipment and is a known value at the time the process is decided to be performed. t1 represents the length of time required for the paddle to move forward and then back again, i.e., the time required for each paddle position change to generate a displacement of Δ. t1 is determined by the drive mechanism selected for the actual process and is a known value during the calculation process. This value can be adjusted by selecting the drive mechanism according to the actual process conditions. R represents the number of times the paddle moves to reach the distance L within one oscillation cycle.

[0070] Furthermore, the electroplating apparatus includes a pre-wetting chamber, an electroplating chamber, a cleaning chamber, a frame of the electroplating apparatus, a manipulator, and the like.

[0071] As demand for high-speed electroplating increases, high-speed copper plating equipment is becoming the standard, followed by high-speed tin-silver plating equipment. More and more electroplating chambers equipped with high-speed vibrating paddles are being configured on the same electroplating equipment. For example, a certain electroplating equipment previously had eight copper plating chambers, but four new tin-silver plating chambers were added, bringing the total number of paddle-equipped electroplating chambers to 12. However, with the increasing demand for uniform electroplating, the paddles must operate in a stepwise, reciprocating, stepping vibration mode, which further increases the vibration intensity. Therefore, embodiments of the present invention also provide an electroplating apparatus equipped with the above-mentioned vibration damping control device.

[0072] Furthermore, when the number of electroplating chambers in the electroplating apparatus is even, the paddles in two adjacent electroplating chambers move in opposite directions. Two adjacent electroplating chambers include those adjacent at the same horizontal height as well as those adjacent in the vertical direction. Furthermore, in this embodiment, when the number of electroplating chambers in the electroplating apparatus is even, two adjacent electroplating chambers at the same horizontal height are defined as one group, and the paddles of the electroplating chambers in the same group move in opposite directions. By having the paddles in two adjacent electroplating chambers vibrate in opposite directions, resonance between the paddles and the electroplating apparatus can be avoided, and vibration of each module can be reduced, resulting in stabilization of the electroplating apparatus.

[0073] Specifically, the vibration of the paddle is affected by the process conditions and control commands within the electroplating chamber.

[0074] Next, a method for controlling the vibration directions of the paddles in two adjacent electroplating chambers to be opposite to each other will be described in detail with reference to Figures 7, 8, and 9. The two adjacent electroplating chambers shown in Figure 7 are defined as chamber A and chamber B, respectively. The control procedure for controlling the vibration directions of the paddles in the two adjacent electroplating chambers to be opposite to each other includes the following. 1) The control unit 330 detects the process states of chambers A and B. When the process state of chamber A or chamber B is in progress, the control unit 330 directly controls the paddles installed in chamber A and chamber B to move in opposite directions at the same moving speed and acceleration, respectively. Even when the process state of chamber A is in progress and the process state of chamber B is in standby, the control unit 330 similarly controls the paddles installed in chamber A and chamber B to move in opposite directions at the same moving speed and acceleration. Similarly, even when the process state of chamber B is in progress and the process state of chamber A is in standby, the control unit 330 controls the paddles installed in chamber A and chamber B to move in opposite directions at the same moving speed and acceleration. 2) The control unit 330 detects a control command for a drive mechanism connected to the paddles in the chambers A and B. The drive mechanism in this embodiment may be a motor. When the control unit 330 detects that the control command to the drive mechanism connected to the paddle in chamber A or chamber B is to activate the drive mechanism and vibrate the paddle, the control unit 330 directly controls the paddles installed in chamber A and chamber B to move in opposite directions at the same moving speed and acceleration.

[0075] When the control unit 330 detects that the process state of either one of the two adjacent electroplating chambers, i.e., chamber A and chamber B in this embodiment, is in an ongoing state, or When the control unit 330 detects that the control command to the drive mechanism connected to the paddle in either of two adjacent electroplating chambers (i.e., chamber A or chamber B in this embodiment) activates the drive mechanism to vibrate the paddle, the control unit 330 controls the paddles of the adjacent electroplating chambers to move in opposite directions at the same moving speed and acceleration. This allows vibration waves generated by the paddles in the adjacent electroplating chambers to cancel each other out, preventing resonance between the paddles and the electroplating apparatus, thereby reducing vibration in each module of the electroplating apparatus and stabilizing the electroplating apparatus. Only when the control unit 330 detects that both of the adjacent electroplating chambers are in a standby state and that the control command to the drive mechanism connected to the paddle in the two adjacent electroplating chambers has been stopped, the control unit 330 controls the paddle in the electroplating chamber to stop vibrating.

[0076] Specifically, this is shown in FIGS. 7 and 9. FIG. 9 shows a timing diagram of vibration control in adjacent electroplating chambers in an embodiment of the present invention. At time t1, the process states of chamber A and chamber B are both in a standby state, and control commands to the drive mechanisms connected to the paddles of chamber A and chamber B are both stopped. The paddles of each chamber are in a stopped state, and the position commands for the paddles of chamber A and chamber B are the same as the position commands in the initial state. Between t1 and t2, the process state of chamber A changes to a progress state, while the process state of chamber B remains in a standby state. Between t1 and t2, the control unit 330 receives a control command to the drive mechanism connected to the paddle in chamber A to activate the drive mechanism to vibrate the paddle. When the control command to the drive mechanism connected to the paddle in chamber B is stopped, the control unit 330 controls the paddles in chamber A and chamber B to move in opposite directions at the same moving speed and acceleration.

[0077] During the period from t2 to t3, the control unit 330 detects that the process states of both chambers A and B are in progress. When the control unit 330 detects a control command to start the drive mechanisms connected to the paddles in two adjacent electroplating chambers to vibrate the paddles, the control unit 330 controls the paddles in chambers A and B to move in opposite directions at the same moving speed and acceleration.

[0078] During the period from t3 to t4, control unit 330 detects that the process state of chamber A is in a standby state and that the process state of chamber B is in an ongoing state. When control unit 330 detects that the control command to the drive mechanism connected to the paddle in chamber A has been stopped and that the control command to the drive mechanism connected to the paddle in chamber B is a control command to start the drive mechanism and vibrate the paddle, control unit 330 controls the paddles in chambers A and B to move in opposite directions at the same moving speed and acceleration.

[0079] During the period from t4 to t5, when the control unit 330 detects that the process states of both chambers A and B are in an ongoing state and also detects that the control commands to the drive mechanisms connected to the paddles in chambers A and B are both control commands to start the drive mechanisms and vibrate the paddles, the control unit 330 controls the paddles in chambers A and B to move in opposite directions to each other at the same moving speed and the same acceleration.

[0080] During the period from t5 to t6, the control unit 330 detects that the process state of chamber A is in a standby state and the process state of chamber B is in an ongoing state. When the control unit 330 detects that the control command to the drive mechanism connected to the paddle in chamber A has been stopped and that the control command to the drive mechanism connected to the paddle in chamber B is a control command to start the drive mechanism and vibrate the paddle, the control unit 330 controls the paddles in chambers A and B to move in opposite directions at the same moving speed and acceleration.

[0081] During the period from t6 to t7, if the control unit 330 detects that the process states of the two adjacent electroplating chambers A and B are both in a standby state, and further detects that the control commands to the drive mechanisms connected to the paddles in the two adjacent electroplating chambers A and B have both been stopped, the control unit 330 controls the paddles in those electroplating chambers to stop vibrating.

[0082] In the above process, the oscillation periods of the paddles in chamber A and chamber B are shown in Figure 10. Figure 10 shows a schematic diagram of the oscillation periods of the paddles in adjacent electroplating chambers in an embodiment of the present invention.

[0083] An embodiment of the present invention further comprises: at least one processor; a memory unit communicatively connected to the at least one processor; An electronic device is provided in which a memory unit stores instructions to be executed by at least one processor, and the instructions are executed by the at least one processor, thereby enabling the processor to perform the vibration damping control method for an electroplating apparatus in the embodiment of the method described above.

[0084] An embodiment of the present invention also provides a non-transitory computer-readable storage medium having computer instructions stored thereon for causing a computer to perform the method for controlling vibration damping of an electroplating apparatus in the above-described method embodiment.

[0085] An embodiment of the present invention also provides a computer program product, which includes a computer program recorded on a non-transitory computer-readable storage medium, the computer program including program instructions that, when executed by a computer, cause the computer to perform the method for controlling vibration damping of an electroplating apparatus according to the method embodiment described above.

[0086] When the vibration damping control method for electroplating equipment is implemented as a computer program, the computer program may be recorded on a computer-readable storage medium as an article of manufacture. For example, computer-readable storage media may include, but are not limited to, magnetic storage devices (e.g., hard disks, floppy disks, magnetic tapes), optical disks (e.g., compact disks (CDs), digital versatile disks (DVDs)), smart cards, and flash memory devices (e.g., electrically erasable programmable read-only memories (EPROMs), cards, sticks, key drives). Additionally, various storage media described herein may represent one or more devices for storing information and / or other machine-readable media. The term "machine-readable medium" may include, but is not limited to, wireless channels and various other media (and / or storage media) capable of storing, containing, and / or transmitting code, instructions, and / or data.

[0087] It should be understood that the above-described embodiments are merely exemplary. The embodiments described herein may be implemented in hardware, software, firmware, middleware, microcode, or any combination thereof. In a hardware implementation, the processor may be implemented as one or more application-specific integrated circuits (ASICs), digital signal processors (DSPs), digital signal processors (DSPDs), programmable logic devices (PLDs), field-programmable gate arrays (FPGAs), processors, controllers, microcontrollers, microprocessors, and / or other electronic units designed to perform the functions described herein, or a combination thereof.

[0088] Some aspects of the present invention may be implemented entirely in hardware, entirely in software (including firmware, resident software, microcode, etc.), or a combination of hardware and software. Each of the above hardware or software may be referred to as a "data block," "module," "engine," "unit," "component," or "system." A processor may be one or more application-specific integrated circuits (ASICs), digital signal processors (DSPs), digital signal processors (DAPDs), programmable logic devices (PLDs), field-programmable gate arrays (FPGAs), processors, controllers, microcontrollers, microprocessors, or combinations thereof. Additionally, some aspects of the present invention may be embodied as a computer product recorded on one or more computer-readable media, including computer-readable program code. For example, computer-readable media include, but are not limited to, magnetic storage devices (e.g., hard disks, floppy disks, magnetic tapes, etc.), optical disks (e.g., compact disks (CDs), digital versatile disks (DVDs), etc.), smart cards, and flash memory devices (e.g., cards, sticks, key drives, etc.).

[0089] The computer-readable medium may also include a propagated data signal containing the computer program code, for example, on a baseband signal or as part of a carrier wave. The propagated signal may take various forms, including electromagnetic, optical, or any suitable combination thereof. The computer-readable medium may be any computer-readable medium, other than a computer-readable storage medium, that can be coupled to an instruction execution system, apparatus, or device to enable communication, propagation, or transmission for use with the program. The program code recorded on the computer-readable medium may be propagated through any suitable medium, including wireless, cable, fiber optic cable, radio frequency signal, or similar medium, or any combination thereof.

[0090] The flow diagrams and block diagrams in the drawings illustrate the architecture, functionality, and operation of possible implementations of systems, methods, and computer program products according to embodiments of the present disclosure. In this regard, each block in a flow diagram or block diagram may represent a module, program segment, or portion of code, including one or more executable instructions for implementing a specific logical function. It should also be noted that, in alternative embodiments, the functions within the blocks may be executed in an order different from that shown in the drawings. For example, two blocks shown in succession may actually be executed substantially in parallel, or, depending on the functionality, the two blocks may be executed in the reverse order. Furthermore, each block shown in the block diagrams and / or flow diagrams, and combinations of such blocks, may be implemented by a dedicated hardware-based system that performs a specific function or process, or by a combination of dedicated hardware and computer instructions.

[0091] The relevant units described in the embodiments of this specification may be realized by software or hardware, and the names of the units may not necessarily limit the units themselves.

[0092] The above is merely a specific embodiment of the present invention, and the scope of protection of the present invention is not limited thereto. Any modifications or alternatives that can be easily conceived by those skilled in the art within the technical scope of the present invention are also included in the scope of protection of the present invention. Therefore, the scope of protection of the present disclosure should be subject to the scope of protection of the claims.

Claims

1. 1. A vibration damping control method for an electroplating apparatus, comprising: obtaining a resonant frequency of the electroplating apparatus; and selecting an operating frequency for a paddle of the electroplating apparatus based on the resonant frequency; the operating frequency is equal to m times the resonant frequency, m being a real number within a numerical range (0, 0.5), and the operating cycle corresponding to the operating frequency of the paddle is shorter than the processing time of electroplating; The vibration damping control method for an electroplating apparatus, wherein the operating frequency is a frequency at which the paddle periodically moves in a stepwise reciprocating stepping manner within the electroplating chamber of the electroplating apparatus.

2. 2. The method for controlling vibration damping of an electroplating apparatus according to claim 1, wherein the electroplating apparatus comprises a pre-wetting chamber, an electroplating chamber, a cleaning chamber, a frame of the electroplating apparatus, and a manipulator.

3. After selecting the operating frequency of the paddle, calculating a generated displacement amount Δ required for the paddle to move forward once and then move backward once based on the operating frequency using equation (1), Equation (1) is as follows: Δ=L×mf×t1×R where: L represents the distance between the start point and the end point in the vibration process of the paddle in a stepwise reciprocating stepping manner; f represents the resonant frequency of the electroplating equipment; t1 represents the amount of time it takes for the paddle to move forward and then back again; 2. The vibration damping control method for an electroplating apparatus according to claim 1, wherein R represents the number of times the paddle travels the distance L in one vibration operation cycle.

4. 2. The vibration damping control method for an electroplating apparatus according to claim 1, wherein when the number of electroplating chambers in the electroplating apparatus is even, the paddles in two adjacent electroplating chambers move in opposite directions to each other.

5. 5. The vibration damping control method for an electroplating apparatus according to claim 4, wherein when the number of electroplating chambers in the electroplating apparatus is even, two adjacent electroplating chambers at the same horizontal height are defined as one group, and the paddles of the electroplating chambers in the same group move in opposite directions to each other.

6. 1. A vibration damping control method for an electroplating apparatus, comprising: A vibration damping control method for an electroplating apparatus, characterized in that, when the number of electroplating chambers in the electroplating apparatus is even, the paddles in two adjacent electroplating chambers move in opposite directions to each other.

7. 7. The vibration damping control method for an electroplating apparatus according to claim 6, wherein when the number of electroplating chambers in the electroplating apparatus is even, two adjacent electroplating chambers at the same horizontal height are defined as one group, and the paddles of the electroplating chambers in the same group move in opposite directions to each other.

8. 1. A vibration damping control device for an electroplating apparatus, comprising: an information acquisition unit for acquiring a resonance frequency of the electroplating apparatus and transmitting the resonance frequency of the electroplating apparatus to a processing unit; a processing unit for receiving the resonant frequency of the electroplating apparatus transmitted from the information acquisition unit and selecting an operating frequency of a paddle based on the resonant frequency of the electroplating apparatus, wherein the operating frequency of the paddle is defined as m times the resonant frequency, m being a real number within a numerical range (0, 0.5), and an operating cycle corresponding to the operating frequency of the paddle is shorter than a processing time of electroplating, and the operating frequency of the paddle is a frequency at which the paddle periodically moves in a stepped reciprocating manner within an electroplating chamber of the electroplating apparatus; a control unit for controlling the operation of the paddle in accordance with the operating frequency of the paddle selected by the processing unit.

9. The processing unit further 9. The vibration damping control device for an electroplating apparatus according to claim 8, wherein the vibration damping control device is configured to calculate the amount of displacement required for the paddle to move forward once and then move backward once based on the operating frequency of the paddle, generate stepping command data for the paddle based on the calculated amount of displacement required for the paddle to move forward once and then move backward once, and transmit the command data to the control unit.

10. The control unit further 10. The vibration damping control device for electroplating equipment according to claim 9, which is configured to receive stepping command data transmitted from the processing unit, the stepping command data corresponding to the amount of displacement required to be generated each time the paddle moves forward once and then moves backward once, and controls the operation of the paddle in accordance with the command data.

11. The electroplating apparatus comprises:

9. The vibration damping control system for an electroplating apparatus according to claim 8, comprising a pre-wetting chamber, an electroplating chamber, a cleaning chamber, a frame of the electroplating apparatus, and a manipulator.

12. The control unit further Calculating a displacement amount required for each time the paddle moves forward once and then moves backward once based on the operating frequency of the paddle, the calculation including: calculating a displacement amount Δ required for the paddle to move forward once and then move backward once using equation (1); Equation (1) is Δ=L×mf×t1×R and L represents the distance between the start point and the end point of the vibration process of the paddle in a stepwise reciprocating stepping manner; f represents the resonant frequency of the electroplating apparatus; t1 represents the amount of time it takes for the paddle to move forward and then back again; 10. The vibration damping control device for electroplating equipment of claim 9, wherein R represents the number of times the paddle travels the distance L in one vibration cycle.

13. An electroplating apparatus comprising the vibration damping control device for an electroplating apparatus according to any one of claims 8 to 12.

14. 14. The electroplating apparatus according to claim 13, wherein when the number of electroplating chambers in the electroplating apparatus is even, the paddles in two adjacent electroplating chambers move in opposite directions to each other.

15. When the number of electroplating chambers of the electroplating apparatus is even, 15. The electroplating apparatus of claim 14, wherein two adjacent electroplating chambers at the same horizontal height are defined as one group, and the paddles of the electroplating chambers in the same group move in opposite directions to each other.

16. at least one processor; a memory unit communicatively coupled to the at least one processor; The electronic device is characterized in that the memory unit stores instructions to be executed by at least one processor, and the instructions are executed by the at least one processor, thereby enabling the processor to execute the vibration damping control method for an electroplating apparatus described in any one of claims 1 to 5 and 6 to 7.

17. A non-transitory computer-readable storage medium storing computer instructions for causing a computer to execute the vibration damping control method for an electroplating apparatus according to any one of claims 1 to 5 and 6 to 7.

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