Vibration analyzing method and vibration analyzing system

Abstract

To evaluate dynamic rigidity in an arbitrary attitude in a series of operations of an object device.SOLUTION: The vibration analysis method includes a three dimensional model generation step of generating a three dimensional model of a target device, a vibration data collection step of operating the target device and collecting an actual measurement value of vibration data of the target device, and a three dimensional animation generation step of generating a three dimensional animation in which the three dimensional model and the actual measurement value of the vibration data are combined.SELECTED DRAWING: Figure 4

Description

[Technical Field]

[0001] The present invention relates to a vibration analysis method and a vibration analysis system. [Background technology]

[0002] The following Patent Document 1 describes a method for calculating the dynamic characteristics, including the dynamic rigidity, of a machine tool by detecting vibrations when a tool in the machine tool is excited. If the dynamic characteristics of the machine tool can be obtained, it will be possible to determine machining conditions for improving the machining accuracy of the workpiece and to find the cause of chatter vibrations and the like. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Japanese Patent Application Laid-Open No. 2016-005858 Summary of the Invention [Problem to be solved by the invention]

[0004] When evaluating the dynamic rigidity of a target device, there are two methods: one is to apply an impact force using an impulse hammer or the like while the device is stationary, and the other is to apply a force by moving the device. Both of these methods can evaluate the dynamic rigidity of the target device in a specific state. However, when the target device moves, the position of each element changes, and the dynamic rigidity of the target device also changes, requiring re-evaluation in that state.

[0005] The present invention has been made in view of the above-mentioned problems, and has as its object to evaluate the dynamic stiffness of a target device in an arbitrary posture during a series of operations. [Means for solving the problem]

[0006] In order to solve the above problems, the vibration analysis method of the present invention includes a 3D model generation step of generating a 3D model of a target device, a vibration data collection step of operating the target device and collecting actual measured values ​​of vibration data of the target device, and a 3D animation generation step of generating a 3D animation that combines the 3D model and the actual measured values ​​of the vibration data.

[0007] In addition, the vibration analysis system of the present invention includes a 3D model generation unit that generates a 3D model of a target device, a vibration data collection unit that operates the target device and collects actual measured values ​​of vibration data of the target device, and a 3D animation generation unit that generates a 3D animation that combines the 3D model and the actual measured values ​​of the vibration data. [Effects of the Invention]

[0008] According to the present invention, it is possible to evaluate the dynamic stiffness of a target device in any posture during a series of operations. [Brief explanation of the drawings]

[0009] [Figure 1] 1 is a schematic diagram of a vibration analysis method according to an embodiment; [Figure 2] FIG. 1 is a perspective view of a target device according to one embodiment. [Figure 3] 1 is a configuration diagram of a vibration analysis system according to an embodiment. [Figure 4] 1 is an explanatory diagram of a vibration analysis method according to an embodiment; [Figure 5] FIG. 2 is a diagram showing one screen of a three-dimensional animation displayed on a display unit according to an embodiment. [Figure 6] 1 is a process diagram of a vibration analysis method according to an embodiment; DETAILED DESCRIPTION OF THE INVENTION

[0010] Hereinafter, an embodiment of the present invention will be described with reference to the drawings.

[0011] FIG. 1 is a schematic diagram of a vibration analysis method according to one embodiment. The target device 100 shown in Fig. 1(a) is a table device that supports and moves a tool and a workpiece in a machine tool. Note that the target device 100 is not limited to this table device. The target device 100 may be, for example, an articulated robot such as a robot arm.

[0012] The target device 100 includes a fixed unit 101 and two movable units 102 that move relative to the fixed unit 101. The number of movable units 102 may be one, or three or more. In this method, first, as shown in FIG. 1(b), a plurality of vibration sensors 103 are attached to each of the fixed unit 101 and the movable units 102.

[0013] An example of the vibration sensor 103 is an acceleration sensor. The vibration sensor 103 may be a displacement sensor, a velocity sensor, or the like, as long as it can detect vibration. After the vibration sensor 103 is attached to the target device 100, the target device 100 is then operated (driven) as shown in FIG. 1(c) to collect measured vibration data. Additionally, when the target device 100 is in a specific posture, an impact force may be applied by an impulse hammer 104 in a stationary state to collect vibration data of the target device 100.

[0014] Once the vibration data has been collected, a 3D animation is generated by combining the vibration data with a 3D model 200 of the target device 100, as shown in Fig. 1(d). The 3D model 200 includes a fixed part model 201 that models the fixed part 101, a moving part model 202 that models the moving part 102, and a vibration sensor model 203 that models the vibration sensor 103.

[0015] In the three-dimensional animation, a series of movements of the target device 100 are represented by the movements of the fixed unit model 201 and the moving unit model 202, and the vibrations of the target device 100 at that time are represented by the displacement of the vibration sensor model 203. In other words, vibrations are represented by the displacement of the vibration sensor model 203 relative to the fixed unit model 201 and the moving unit model 202. Furthermore, in this three-dimensional animation, the movement of the three-dimensional model 200 can be stopped at any timing while the moving unit model 202 (moving unit 102) moves from the start point to the end point, and the displacements (vibration behavior) of the multiple vibration sensors 103 at that time can be observed (described later).

[0016] FIG. 2 is a perspective view of a target device 100 according to one embodiment. 2 includes a base 110 serving as a fixed unit 101, and a first table 120 and a second table 130 serving as a moving unit 102. The first table 120 supports, for example, a workpiece. The second table 130 supports, for example, a tool for machining the workpiece.

[0017] In the following description, an XYZ Cartesian coordinate system is set, and the positional relationship of each component is sometimes described with reference to this XYZ Cartesian coordinate system. The X-axis direction is set as a first horizontal direction. The Y-axis direction is set as a second horizontal direction perpendicular to the first horizontal direction. The Z-axis direction is a vertical direction perpendicular to both the first horizontal direction and the second horizontal direction.

[0018] The base 110 is a pedestal that forms the bottom of the target device 100 and extends along the XY plane. A first table 120 is attached to the upper surface of the base 110 so as to be movable along the XY plane. A wall 111 stands on the end of the base 110 in the Y-axis direction. A second table 130 is attached to the front of the wall 111 so as to be movable along the Z-axis direction.

[0019] The first table 120 is formed in the shape of a rectangular plate. The first table 120 is guided along the XY plane by a first linear guide device 140 and a second linear guide device 141. The first linear guide device 140 is provided as a pair on the upper surface of the base 110. The first linear guide device 140 includes a first rail extending in the Y-axis direction and a first moving block that moves along the first rail.

[0020] A plurality of rolling elements, such as balls or rollers, are interposed between the first rail and the first moving block. The first moving blocks of each of the pair of first linear guide devices 140 are fixed to the lower surface side of the intermediate member 121. The intermediate member 121 is connected to a first ball screw drive device 150 provided on the base 110, and moves in the Y-axis direction while being guided by the pair of first linear guide devices 140.

[0021] The second linear guide devices 141 are provided in pairs on the upper surface of the intermediate member 121. The second linear guide devices 141 include a second rail extending in the X-axis direction and a second moving block that moves along the second rail. A plurality of rolling elements, such as balls or rollers, are interposed between the second rail and the second moving block.

[0022] The second moving blocks of each of the pair of second linear guide devices 141 are fixed to the underside of the first table 120. The first table 120 is connected to a second ball screw drive device 151 provided on the intermediate member 121, and moves in the X-axis direction while being guided by the pair of second linear guide devices 141.

[0023] The second table 130 is formed in the shape of a rectangular plate. The second table 130 is guided along the Z-axis direction by a third linear guide device 142. The third linear guide devices 142 are provided in pair on the front side of the wall portion 111. The third linear guide devices 142 include a third rail extending in the Z-axis direction and a third moving block that moves along the third rail.

[0024] A plurality of rolling elements, such as balls or rollers, are interposed between the third rail and the third moving block. The third moving blocks of each of the pair of third linear guide devices 142 are fixed to the rear side of the second table 130. The second table 130 is connected to a third ball screw drive device 152 provided on the wall portion 111, and moves in the Z-axis direction while being guided by the pair of third linear guide devices 142.

[0025] The vibration sensors 103 are attached to each element of the target device 100. The vibration sensors 103 include a first vibration sensor group 103A attached to the base 110, a second vibration sensor group 103B attached to the wall portion 111, a third vibration sensor group 103C attached to the first table 120, a fourth vibration sensor group 103D attached to the intermediate member 121, and a fifth vibration sensor group 103E attached to the second table 130.

[0026] Although not shown, the vibration sensors 103 are also attached to each element of the first linear guide device 140 to the third linear guide device 142 and each element of the first ball screw drive device 150 to the third ball screw drive device 152. The vibration sensors 103 are attached to corners on each surface of the elements of the target device 100. The attachment locations of the vibration sensors 103 and the number of installed vibration sensors 103 shown in Fig. 2 are merely examples and are not limited to these.

[0027] FIG. 3 is a configuration diagram of a vibration analysis system 1 according to an embodiment. As shown in FIG. 3, the vibration analysis system 1 includes a three-dimensional model generation unit 10, a three-dimensional model storage unit 11, a vibration data collection unit 12, a vibration data analysis unit 13, a three-dimensional animation generation unit 14, and a display unit 15.

[0028] The vibration analysis system 1 is configured by, for example, a computer including a CPU and memories such as RAM and ROM. The functions of the 3D model generation unit 10, vibration data analysis unit 13, and 3D animation generation unit 14 are realized by, for example, computer programs. The functions of the 3D model storage unit 11 and vibration data collection unit 12 are realized by, for example, memories. The function of the display unit 15 is realized by, for example, a display.

[0029] The three-dimensional model generation unit 10 generates a three-dimensional model 200 of the target device 100. The three-dimensional model generation unit 10 generates the three-dimensional model 200 from, for example, three-dimensional data (CAD data, etc.) of the target device 100 input from outside. The three-dimensional model generation unit 10 deletes unnecessary elements of the target device 100, replaces complex shapes, sets various parameters, sets boundary conditions, and creates a mesh model for FEM analysis.

[0030] The three-dimensional model storage unit 11 stores the three-dimensional model generated by the three-dimensional model generation unit 10. The vibration data collection unit 12 collects actual measured values ​​of vibration data output from vibration sensors 103 attached to the target device 100. The vibration data collection unit 12 receives the actual measured values ​​of vibration data from a first vibration sensor group 103A to a fifth vibration sensor group 103E attached to each element of the target device 100.

[0031] The vibration data analysis unit 13 performs vibration analysis based on the vibration data collected by the vibration data collection unit 12. The vibration data analysis unit 13 outputs natural frequencies, frequency response functions, natural modes, etc. by performing, for example, nonlinear analysis (static stiffness analysis) or linear analysis (dynamic stiffness analysis).

[0032] The three-dimensional animation generation unit 14 generates a three-dimensional animation by combining the three-dimensional model 200 generated by the three-dimensional model generation unit 10 with the actual measured values ​​of the vibration data collected by the vibration data collection unit 12. The display unit 15 displays the three-dimensional animation generated by the three-dimensional animation generation unit 14 and the data analyzed by the vibration data analysis unit 13 (described later).

[0033] Next, the vibration analysis method of this embodiment will be described with reference to FIGS.

[0034] Fig. 4 is an explanatory diagram of a vibration analysis method according to an embodiment. Fig. 5 is a screen of a 3D animation displayed on display unit 15 according to an embodiment. Fig. 6 is a process diagram of a vibration analysis method according to an embodiment. As shown in FIG. 6, in this method, first, a model of the target device 100 (CAD data of the target device 100, a three-dimensional model 200) is created (step S1).

[0035] Next, in this method, an actual target device 100 is manufactured (step S2). After the target device 100 is manufactured, measurement points where vibration sensors 103 are to be attached are considered (step S3). After the measurement points are considered, the vibration sensors 103 are attached to the measurement points (step S4).

[0036] Next, in this method, the target device 100 to which the vibration sensor 103 is attached is driven (step S5). For example, as shown in Fig. 4, the first table 120 is moved from the left (starting point) to the right (ending point), and the second table 130 is moved from the top (starting point) to the bottom (ending point). Then, actual measured values ​​of vibration data (e.g., acceleration data) are continuously collected until the moving unit 102 (first table 120, second table 130) moves from the starting point to the ending point (step S6).

[0037] Next, in this method, data analysis is performed based on the collected vibration data (step S7). Then, the created 3D model 200 is combined with the measurement data (actual measurements) of the vibration sensor 103 (step S8). The results (3D animation, analysis data) are output to the display unit 15 (step S9).

[0038] As shown in FIG. 5, the display unit 15 configures a GUI (Graphical User Interface) including a three-dimensional animation display unit 20 and a vibration data display unit 30.

[0039] The three-dimensional animation display unit 20 expresses the movement of the target device 100 as the movement of the three-dimensional model 200, and expresses the vibration of the target device 100 as the displacement of the vibration sensor 103. For example, the movement of the first table 120 from left (starting point) to right (ending point) and the movement of the second table 130 from up (starting point) to down (ending point) shown in FIG. 4 are expressed by the movements of two moving part models 202.

[0040] The vibrations of first table 120 and second table 130 at that time are expressed as the displacement (indicated by the arrow in FIG. 5) of vibration sensor model 203 (a spherical model). The displacement of vibration sensor model 203 can be displayed at any magnification. Therefore, even if the actual measured value of the vibration data is small, the vibration can be displayed in a visually easy-to-understand manner.

[0041] The three-dimensional model 200 is semi-transparent except for the vibration sensor model 203 (spherical model) to improve the visibility of the displacement of the vibration sensor model 203. In addition, although Fig. 5 shows a side view of the three-dimensional model 200, by dragging the three-dimensional animation display unit 20 with a mouse or the like, the three-dimensional model 200 can be rotated and the vibration behavior can be observed from any angle.

[0042] The vibration data display unit 30 displays the analysis results of the vibration data in conjunction with the 3D animation of the 3D animation display unit 20. Specifically, the vibration data display unit 30 displays a graph of a frequency response function, with compliance (m / N) set on the vertical axis and frequency (Hz) set on the horizontal axis. The analysis results of all the vibration sensors 103 are displayed on the vibration data display unit 30. Note that the number of vibration data display units 30 is not limited to one, and there may be multiple units so that the analysis results of multiple vibration sensor groups can be observed in parallel.

[0043] The vibration data display unit 30 displays a seek bar 36 that can be moved in the horizontal direction, and by moving the seek bar 36 with a mouse or the like, a 3D animation at the target frequency can be reflected in the 3D animation display unit 20. In other words, the behavior of the target device 100 at any frequency can be visualized in the 3D animation display unit 20.

[0044] As described above, in this method, as shown in FIG. 4, actual measured values ​​of vibration data (e.g., acceleration data) are continuously collected as the moving unit 102 moves from the start point to the end point. Then, a 3D animation is generated that combines the 3D model 200 and the actual measured values ​​of the vibration data. This 3D animation can be stopped at any timing. Then, by analyzing the vibration data at the time the animation is stopped, the dynamic stiffness of the target device 100 in any posture can be analyzed. For example, if chatter vibrations or the like are detected in a certain posture, by changing the 3D model 200 to that posture, the dynamic stiffness of that posture can be analyzed without changing the posture of the target device 100 and collecting and evaluating data again.

[0045] In this way, according to this technique, it is possible to evaluate the dynamic stiffness at any posture during a series of movements of the target device 100. For example, if the posture of the target device 100 at any timing is set to "verification position A," and vibration data is to be analyzed at that verification position A, the vibration data can be analyzed by changing the three-dimensional model 200 to verification position A as shown in step S10 of FIG. 6. Also, if the posture of the target device 100 at another timing is set to "verification position B," and vibration data is to be analyzed at that verification position B, the vibration data can be analyzed by changing the three-dimensional model 200 to verification position B as shown in step S11 of FIG. 6.

[0046] As described above, the vibration analysis method of this embodiment includes a 3D model generation step of generating a 3D model 200 of the target device 100, a vibration data collection step of operating the target device 100 and collecting measured values ​​of vibration data of the target device 100, and a 3D animation generation step of generating a 3D animation that combines the 3D model 200 and the measured values ​​of the vibration data. This makes it possible to evaluate the dynamic stiffness of the target device 100 in any posture during a series of operations.

[0047] In this embodiment, the target device 100 includes a fixed part 101 and a moving part 102 that moves relative to the fixed part 101, and in the vibration data collection step, a plurality of vibration sensors 103 are attached to each of the fixed part 101 and the moving part 102 to collect actual measured values ​​of vibration data of the target device 100. This makes it possible to evaluate the dynamic stiffness of each of the fixed part 101 and the moving part 102.

[0048] In the present embodiment, in the vibration data collection step, actual measured values ​​of vibration data are collected continuously from the time when the moving unit 102 moves from the start point to the end point, thereby making it possible to visualize the vibration behavior of the target device 100 in a series of operations.

[0049] Furthermore, in the present embodiment, in the 3D animation, the movement of the target device 100 is represented by the movement of the 3D model 200, and the vibration of the target device 100 is represented by the displacement of the multiple vibration sensors 103 attached to each of the fixed unit 101 and the moving unit 102. This makes it possible to visualize the vibration behavior of the target device 100, separate from the movement of the target device 100.

[0050] Furthermore, in this embodiment, in the 3D animation, the movement of the 3D model 200 can be stopped at any timing while the moving unit 102 moves from the start point to the end point, and the displacements of the multiple vibration sensors 103 can be observed. This makes it possible to visualize the vibration behavior of the target device 100 while stopping the movement of the target device 100 at any timing.

[0051] Furthermore, in this embodiment, the displacements of the multiple vibration sensors 103 can be observed in 3D animation at any magnification, which makes it possible to visually understand the behavior of minute vibrations of the target device 100.

[0052] The vibration analysis system of this embodiment also includes a 3D model generation unit 10 that generates a 3D model 200 of the target device 100, a vibration data collection unit 12 that operates the target device 100 and collects actual measured values ​​of vibration data of the target device 100, and a 3D animation generation unit 14 that generates a 3D animation that combines the 3D model 200 and the actual measured values ​​of the vibration data. With this configuration, it is possible to evaluate the dynamic stiffness of the target device 100 in any posture during a series of movements.

[0053] Although the preferred embodiments of the present invention have been described above with reference to the drawings, the present invention is not limited to the above-described embodiments. The shapes and combinations of the components shown in the above-described embodiments are merely examples, and various modifications can be made based on design requirements, etc., without departing from the spirit of the present invention. Furthermore, errors in dimensions and inclination are naturally permitted within the scope of the effects of the present invention. [Explanation of symbols]

[0054] 1...Vibration analysis system, 10...3D model generation unit, 1...3D model storage unit, 12...vibration data collection unit, 13...vibration data analysis unit, 14...3D animation generation unit, 15...display unit, 20...3D animation display unit, 30...vibration data display unit, 36...seek bar, 100...target device, 101...fixed unit, 102...moving unit, 103...vibration sensor, 103A...first vibration sensor group, 103B...second vibration sensor group, 103C...third vibration sensor group, 103D...fourth Vibration sensor group, 103E...fifth vibration sensor group, 104...impulse hammer, 110...base, 111...wall portion, 120...first table, 121...intermediate member, 130...second table, 140...first linear guide device, 141...second linear guide device, 142...third linear guide device, 150...driving device, 151...driving device, 152...driving device, 200...three-dimensional model, 201...fixed part model, 202...moving part model, 203...vibration sensor model, A...verification position, B...verification position

Claims

1. a three-dimensional model generation step of generating a three-dimensional model of the target device; a vibration data collection step of operating the target device and collecting actual measured values ​​of vibration data of the target device; a three-dimensional animation generating step of generating a three-dimensional animation by combining the three-dimensional model and the actual measurement values ​​of the vibration data. Vibration analysis method.

2. the target device includes a fixed unit and a moving unit that moves relative to the fixed unit, In the vibration data collection step, a plurality of vibration sensors are attached to each of the fixed part and the movable part, and actual measured values ​​of the vibration data are collected. The vibration analysis method according to claim 1 .

3. In the vibration data collecting step, actual measured values ​​of the vibration data are continuously collected until the moving part moves from the start point to the end point. The vibration analysis method according to claim 2 .

4. In the three-dimensional animation, expressing the movement of the target device as the movement of the three-dimensional model; The vibration of the target device is expressed by displacements of the plurality of vibration sensors attached to the fixed part and the movable part, respectively. The vibration analysis method according to claim 2 or 3.

5. In the three-dimensional animation, the movement of the three-dimensional model can be stopped at any timing during the movement of the moving part from the start point to the end point, and the displacement of the plurality of vibration sensors can be observed. The vibration analysis method according to claim 4.

6. a three-dimensional model generation unit that generates a three-dimensional model of the target device; a vibration data collection unit that operates the target device and collects actual measured values ​​of vibration data of the target device; a three-dimensional animation generating unit that generates a three-dimensional animation by combining the three-dimensional model and the actual measurement values ​​of the vibration data, Vibration analysis system.

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