Substrate loading cassette

Abstract

To provide a cassette for loading a substrate which effectively suppresses damage of a loaded target substrate.SOLUTION: The substrate loading cassette includes an upper frame and a lower frame facing the upper frame, a support frame formed in a vertical direction and connecting the upper frame and the lower frame at an edge, a transfer device coupling portion disposed on the upper frame and coupled to the transfer device, a transfer device coupling frame formed in a horizontal direction and a vibration damping portion disposed under the transfer device coupling frame, a first support frame disposed at left and right sides of the substrate loading cassette, and a second support frame disposed at a rear side of the substrate loading cassette, the substrate loading cassette may further include a support bar connected to the second support frame and extending into the substrate loading cassette. The vibration damping portion contains a polyamide resin. The compression strength of the vibration damping part is 600kg / cm2 or more. The elastic modulus of the support bar is 0. 03MPa to 0. 5MPa.SELECTED DRAWING: Figure 1

Description

[Technical Field]

[0001] The embodiment relates to a cassette for loading substrates. [Background technology]

[0002] Cassettes are used to easily, accurately, and smoothly transport and store a large number of substrates. Generally, cassettes are configured such that a large number of substrates are stacked vertically in multiple layers inside a frame with one side open, and the stacked substrates are pulled out, processed, and then inserted back into the cassette.

[0003] Glass substrates for semiconductor packaging are used as high-end packaging substrates, and are formed by forming numerous vias in thin glass substrates. Relatively thin glass substrates are vulnerable to vibration and impact due to their characteristics, and large-area glass substrates are likely to bend due to their own weight inside the cassette, which can accelerate damage to the glass substrate.

[0004] The above-mentioned background art is technical information that the inventor possessed for the purpose of deriving the present invention or that he acquired in the process of deriving the present invention, and is not necessarily publicly known art that was made public to the general public prior to the filing of the present invention. Summary of the Invention [Problem to be solved by the invention]

[0005] An object of the present embodiment is to provide a substrate loading cassette that can effectively prevent damage to the loaded target substrates during transportation by an OHT (Overhead Hoist Transport). [Means for solving the problem]

[0006] A substrate loading cassette according to an embodiment of the present disclosure includes an upper frame and a lower frame facing the upper frame.

[0007] The substrate loading cassette includes a support frame formed in a vertical direction of the substrate loading cassette and connecting the upper frame and the lower frame at an edge of the substrate loading cassette.

[0008] The substrate loading cassette is disposed on the upper frame and includes a transfer device coupling portion coupled to a transfer device of the substrate loading cassette.

[0009] The transfer device coupling part includes a transfer device coupling frame formed horizontally of the substrate loading cassette, and a vibration damping part disposed below the transfer device coupling frame.

[0010] The support frames include first support frames disposed on the left and right sides of the substrate loading cassette, and a second support frame disposed on the rear side of the substrate loading cassette.

[0011] The substrate loading cassette includes a support bar connected to the second support frame and extending inward of the substrate loading cassette.

[0012] The vibration damping portion includes a polyamide resin.

[0013] The compression strength of the vibration damping part is 600 kg / cm 2 That's all.

[0014] The elastic modulus of the support bar is 0.03 MPa to 0.5 MPa.

[0015] The support bar may have a Poisson's ratio of 0.4 or less.

[0016] The specific gravity of the support bar may be 1.2 to 1.8.

[0017] The vibration-damping portion may have a tensile modulus of elasticity of 15,000 MPa to 50,000 MPa.

[0018] The transfer device coupling portion may further include an anti-slip portion disposed below the vibration damping portion.

[0019] The slip prevention portion may have a higher coefficient of friction than the vibration damping portion.

[0020] The substrate loading cassette may include a substrate support portion connected to the first support frame and formed toward an inner side of the substrate loading cassette.

[0021] The substrate support may include a base and a protective layer surrounding at least a portion of the base.

[0022] The protective layer may include any one selected from the group consisting of PTFE (Polytetrafluoroethylene), FEP (Fluorinated ethylene propylene), PEEK (Polyetheretherketone), PEI (Polyetherimide), PES (Polyethersulfone), PFA (Perfluoroalkoxy copolymer), PAEK (Polyaryletherketone), and combinations thereof.

[0023] The substrate loading cassette may include a guide block disposed on the upper frame.

[0024] The support bar may include a first end located on the second support frame side, and a second end located opposite the first end.

[0025] The second end may be located higher than the first end.

[0026] The difference between the height of the second end when the support bar supports the target substrate and the height of the second end before the support bar supports the target substrate may be 3 mm or less.

[0027] The substrate loading cassette may include a substrate receiving member disposed on the support bar and protruding upward.

[0028] The substrate receiving member may have a convex shape. [Effects of the Invention]

[0029] The substrate loading cassette of the embodiment can stably prevent damage to the target substrates loaded in the cassette during the transfer process by a transfer device, particularly a ceiling-mounted transfer device. [Brief explanation of the drawings]

[0030] [Figure 1] 1 is a perspective view showing a substrate loading cassette according to an embodiment; [Figure 2A] 10 is a cross-sectional view illustrating a coupling portion of a transfer device applied to a substrate loading cassette according to an embodiment of the present invention; [Figure 2B] 10 is a cross-sectional view showing a state in which the transport device coupling portion is coupled to the grip unit of the transport device. FIG. [Figure 2C] 10 is a cross-sectional view illustrating a coupling portion of a transfer device applied to a substrate loading cassette according to another embodiment; FIG. [Figure 3] FIG. 2 is a cross-sectional view taken along line II' in FIG. [Figure 4] FIG. 2 is a side view showing the support bar of FIG. 1. [Figure 5] 10 is a perspective view showing a substrate loading cassette according to still another embodiment; FIG. BEST MODE FOR CARRYING OUT THE INVENTION

[0031] The present invention will now be described in detail with reference to the accompanying drawings so that those skilled in the art can easily understand the present invention. However, the present invention may be embodied in various different forms and is not limited to the embodiments described herein. The same reference numerals are used throughout the specification to refer to similar parts.

[0032] Throughout this specification, the term "combinations thereof" contained in a Markush form phrase means a mixture or combination of one or more selected from the group of elements set forth in the Markush form phrase, and means including one or more selected from the group of elements.

[0033] Throughout this specification, terms such as "first," "second," or "A," "B" are used to distinguish between identical terms, and singular expressions include plural expressions unless the context clearly indicates otherwise.

[0034] In this specification, the term "-" may mean that the compound includes a compound corresponding to "-" or a derivative of "-".

[0035] In this specification, the term "B is located on A" means that B is located on A in direct contact with A, or that B is located on A with another layer located therebetween, and is not to be interpreted as being limited to B being located in contact with the surface of A.

[0036] In this specification, the expression "B is linked to A" means that A and B are directly linked or that A and B are linked via another component therebetween, and unless otherwise specified, it is not to be interpreted as being limited to A and B being directly linked.

[0037] In this specification, unless otherwise specified, the singular expression is to be construed as including the singular or plural as the context requires.

[0038] In this specification, the shape, relative size, angle, etc. of each component in the drawings are illustrative and may be exaggerated for the purpose of explanation, and the rights should not be interpreted as being limited to the drawings.

[0039] In this specification, "A and B are adjacent" means that A and B are adjacent to each other, or A and B are not adjacent to each other but are located close to each other. In this specification, the expression "A and B are adjacent to each other" is not interpreted as being limited to A and B being adjacent to each other unless otherwise specified.

[0040] In this specification, the difference between the A value and the B value means the absolute value of the difference between the A value and the B value.

[0041] In this specification, "based resin" means to include "based resin" and its derivatives. For example, aromatic polyether-based resin means to include aromatic polyether resin and its derivatives (aromatic polyether copolymer resin).

[0042] Unless otherwise specified, the physical properties described herein are values ​​measured at room temperature.

[0043] In manufacturing environments with complex production lines in limited spaces, substrates can be efficiently transported via overhead hoist transports (OHTs). OHTs are transport devices installed on the ceiling of manufacturing facilities. During the process of transporting cassettes by the OHT, particularly during the process of lifting the cassettes and moving the OHT loaded with the cassettes along rails installed on the ceiling, physical impacts can occur to the substrates. As the substrates being loaded become more highly integrated and thinner, the frequency and extent of damage to the substrates due to such impacts can become even greater.

[0044] The inventors of the embodiment applied technical features to the cassette, such as introducing a vibration damping unit to the connection part of the transfer device in the cassette and controlling the mechanical properties of the support bar, etc. Through this, the inventors confirmed that it is possible to provide a cassette for loading substrates that can stably prevent damage to the loaded substrates during the transfer process by the OHT, and completed the embodiment.

[0045] The specific examples will be described below.

[0046] frame 1 is a perspective view of a substrate loading cassette according to an embodiment of the present invention, and the substrate loading cassette of the present embodiment will be described with reference to FIG.

[0047] The substrate loading cassette 100 of the embodiment supports and loads target substrates.

[0048] The target substrate may be a glass substrate. For example, the target substrate may be an alkali borosilicate plate glass, an alkali-free borosilicate plate glass, an alkali-free alkaline earth borosilicate plate glass, or the like, and any plate glass used as an electronic component may be used. The target substrate may be a glass substrate for an electronic device.

[0049] The target substrate may have a thickness of 50 μm or more. The thickness may be 100 μm or more. The thickness may be 250 μm or more. The thickness may be 400 μm or more. The thickness may be 500 μm or more. The thickness may be 3000 μm or less. The thickness may be 2000 μm or less. The thickness may be 1000 μm or less.

[0050] The target substrate may be a large area substrate. The area of ​​the target substrate may be 160,000 mm 2 The area may be 180,000 mm or more. 2 The area may be 200,000 mm or more. 2 The area may be 500,000 mm or more. 2 The area may be 400,000 mm or less. 2 It may be the following:

[0051] The target substrate may include a core via that penetrates the substrate in a thickness direction. The core via may have a substantially uniform diameter in the thickness direction, or may have a diameter that varies in the thickness direction. The core via may include a first opening that contacts the upper surface of the target substrate, a second opening that contacts the lower surface of the target substrate, and a minimum inner diameter portion that connects the first opening and the second opening and is the area where the inner diameter is narrowest.

[0052] The substrate loading cassette 100 includes an upper frame 10 and a lower frame 20 facing the upper frame 10 .

[0053] The upper frame 10 and the lower frame 20 are frames arranged in the horizontal direction (x, y) of the substrate loading cassette. The upper frame 10 and the lower frame 20 may be matrix-shaped frames in which bar-shaped frames are additionally formed inside a square or rectangular frame.

[0054] The substrate loading cassette 100 may further include a support frame 30. The support frame 30 is formed in the vertical direction of the substrate loading cassette and connects the upper frame 10 and the lower frame 20 at the edge of the substrate loading cassette. The support frame 30 may have a bar shape.

[0055] The support frame 30 may include first support frames disposed on the left and right sides of the substrate loading cassette 100 , and a second support frame disposed on the rear side of the substrate loading cassette 100 .

[0056] When the first support frame has a bar shape, the substrate loading cassette 100 can include one to five first support frames on each of the left and right sides, as needed.

[0057] The substrate loading cassette 100 may include one second support frame in the center of the rear side, but the substrate loading cassette 100 may include two or more second support frames as needed.

[0058] The materials of the upper frame 10, the lower frame 20 and the support frame 30 are not limited as long as they are materials commonly used in the field of substrate loading cassettes, and for example, materials such as aluminum and stainless steel may be used.

[0059] The substrate loading cassette 100 may include a protective layer (not shown) surrounding at least a portion of the support frame 30. The protective layer has adjusted elasticity and may help prevent excessive physical damage to the substrates when the substrates collide with the support frame 30 during the substrate loading process or during the transport of the cassette with the substrates loaded therein.

[0060] The protective layer may surround the entire surface of the support frame 30. The protective layer may surround the surface of the support frame 30 that faces the inside of the substrate loading cassette 100. The protective layer may be disposed in contact with the surface of the support frame 30. Other components may be disposed between the protective layer and the surface of the support frame 30.

[0061] The protective layer may include any one selected from the group consisting of PTFE (Polytetrafluoroethylene), FEP (Fluorinated ethylene propylene), PEEK (Polyetheretherketone), PEI (Polyetherimide), PES (Polyethersulfone), PFA (Perfluoroalkoxy copolymer), PAEK (Polyaryletherketone), and combinations thereof. In this case, physical damage to the substrates loaded in the cassette by the support frame 30 can be suppressed.

[0062] The protective layer may further include other additives in addition to the resin. The additives may be any additive commonly used in the resin field. For example, the additives may include fillers, UV stabilizers, heat stabilizers, antioxidants, leveling agents, etc.

[0063] The support frame 30 may be disposed spaced apart from the target substrates loaded in the substrate loading cassette 100. Specifically, the width (defined in the y direction in FIG. 1 ) of a loading space surrounded by the first support frame disposed on the left side of the substrate loading cassette 100, the first support frame disposed on the right side of the substrate loading cassette 100, and the second support frame may be greater than the width of the target substrates. The depth (defined in the x direction in FIG. 1 ) of the loading space may be greater than the length of the target substrates. This prevents contamination and damage to the target substrates due to contact with the frames.

[0064] The substrate loading cassette 100 includes a support bar 50 connected to the second support frame and extending inward of the substrate loading cassette 100. The support bar 50 will be described in detail below.

[0065] The substrate loading cassette 100 may further include a cassette door 60 disposed at the front side. The cassette door has a function of opening and closing the substrate loading cassette 100 and may play a role in preventing the substrates loaded in the substrate loading cassette 100 from falling out of the cassette during transportation.

[0066] Transfer device coupling part 2A is a cross-sectional view showing a transfer device coupling part applied to a substrate loading cassette according to an embodiment, and FIG. 2B is a cross-sectional view showing a state in which the transfer device coupling part is coupled to a grip unit of a transfer device. The substrate loading cassette according to the embodiment will be described with reference to FIGS. 2A and 2B.

[0067] The substrate loading cassette 100 is disposed on the upper frame 10 and may include a transfer device coupling portion 40 coupled to a transfer device 200 that transfers the substrate loading cassette 100 .

[0068] The transfer device coupling section 40 is coupled to a transfer device 200 that transfers the substrate loading cassette 100, specifically, a grip unit 202 of the transfer device 200 such as an OHT, thereby enabling the cassette to be transferred by the OHT.

[0069] One or more transfer device coupling parts 40 may be arranged on the upper frame 10. When multiple transfer device coupling parts 40 are applied to the substrate loading cassette 100, each transfer device coupling part 40 may be arranged to face each other.

[0070] The transfer device coupling unit 40 may include a transfer device coupling frame 41 formed in the horizontal direction of the substrate loading cassette, and a vibration damping unit 42 disposed below the transfer device coupling frame 41. The transfer device coupling unit 40 may further include a connection frame 43 connecting the transfer device coupling frame 41 and the upper frame 10.

[0071] The vibration damping unit 42 may be disposed below and in contact with the transfer device coupling frame 41, or other components may be disposed between the vibration damping unit 42 and the transfer device coupling frame 41. The vibration damping unit 42 may be disposed on the lower surface side of the transfer device coupling frame 41 in a vertically recessed area. This may help to ensure that the vibration damping unit 42 can be stably fixed to the transfer device coupling frame 41.

[0072] After the transfer device coupling portion 40 is coupled with the grip unit 202 of the transfer device 200, which is an OHT, when the substrate loading cassette 100 is lifted, the end side of the grip unit 202 may be positioned below and in contact with the vibration damping portion 42, or other components may be positioned between the end of the grip unit 202 and the vibration damping portion 42.

[0073] When the substrate loading cassette 100 is moved by the OHT, the load of the cassette may be concentrated on the transfer device coupling part 40. As a result, vibrations generated during the operation of the OHT may be transmitted to the cassette via the transfer device coupling part 40. This may increase the possibility of damage to substrates having thin thicknesses and complex structures.

[0074] In this embodiment, by applying a vibration damping unit 42 to the transfer device coupling unit 40, vibrations caused by the operation of the OHT can be damped, which can contribute to reducing the frequency of physical damage to substrates loaded in the cassette.

[0075] The vibration damping portion 42 may include a polyamide resin. Polyamide resins include polycaprolactam (PA6), polyundecanamide (PA11), polylauryllactam (PA12), polybutylene adipamide (PA46), polyhexamethylene adipamide (PA66), polyhexamethylene azelamide (PA69), polyhexamethylene sebacamide (PA610), polyhexamethylene dodecanediamide (PA612), polydecamethylene dodecanediamide (PA1012), and polydecamethylene sebacamide (PA1014). The polyamide resin may be any one selected from the group consisting of polydodecamethylene dodecanediamide (PA1010), polydodecamethylene dodecanediamide (PA1212), polyamide copolymers PA11 / NHUA, PA BACM6, PA BACM10, PA BACM12, PA6 / 66, PA6 / 12, and combinations thereof. The polyamide resin may be polycaprolactam. The polyamide resin may be MC nylon resin.

[0076] In the embodiment, the compressive strength of the vibration damping unit 42 can be controlled, thereby adjusting the degree of deformation of the vibration damping unit 42 due to the load of the cassette loaded with substrates, which can help ensure that the grip unit 202 of the OHT can be stably coupled to the transfer device coupling unit 40.

[0077] The compressive strength of the vibration damping portion 42 is measured in accordance with ASTM D-695.

[0078] The compression strength of the vibration damping portion 42 is 600 kg / cm2 The compressive strength may be 700 kg / cm or more. 2 The compressive strength may be 800 kg / cm or more. 2 The compressive strength may be 850 kg / cm or more. 2 The compressive strength may be 1,500 kg / cm or more. 2 It may be the following:

[0079] In such a case, the OHT can stably transport the cassette loaded with substrates.

[0080] In this embodiment, the elasticity of the vibration damping unit 42 can be controlled within a preset range, which can more effectively prevent vibrations caused by the operation of the OHT and help the grip unit 202 of the OHT to stably grip the cassette.

[0081] The tensile modulus of elasticity of the vibration-damping portion 42 is measured in accordance with ASTM D-790.

[0082] The tensile modulus of elasticity of the vibration damping portion 42 may be 15,000 MPa to 50,000 MPa. The tensile modulus of elasticity may be 20,000 MPa or more. The tensile modulus of elasticity may be 25,000 MPa or more. The tensile modulus of elasticity may be 40,000 MPa or less.

[0083] In such a case, it is possible to effectively suppress the vibrations transmitted to the substrates loaded on the cassette.

[0084] The vibration damping portion 42 may have a pad shape. The vibration damping portion 42 may have a pad shape with a partially recessed portion.

[0085] The vibration damping unit 42 may be fixed to the transfer device coupling frame 41 via a fastening means such as an adhesive or a bolt, but the means for fixing the vibration damping unit 42 to the transfer device coupling frame 41 is not limited thereto.

[0086] The area of ​​the vibration damping section 42 is 1,000 mm 2 The area may be 1,200 mm or more. 2 The area may be 1,500 mm or more. 2 The area may be 5,000 mm or more. 2 The area may be 10,000 mm or more. 2 It may be the following:

[0087] The thickness of the vibration damping section 42 may be 1 mm or more. The thickness may be 2 mm or more. The thickness may be 3 mm or more. The thickness may be 20 mm or less. When the vibration damping section 42 has a thickness that varies in the in-plane direction, the minimum value of the thickness of the vibration damping section 42 shall be the thickness.

[0088] In such a case, the vibration attenuator 42 can stably protect the substrate from vibrations caused by the operation of the OHT.

[0089] 2C is a cross-sectional view showing a transfer device coupling portion applied to a substrate loading cassette according to another embodiment. The substrate loading cassette of the embodiment will be described with reference to FIG. 2C.

[0090] The substrate loading cassette includes an upper frame, a lower frame facing the upper frame, and a support frame formed vertically on the substrate loading cassette and connecting the upper frame and the lower frame along the edge of the substrate loading cassette. The substrate loading cassette also includes a transfer device coupling portion disposed on the upper frame and to which a grip unit of a transfer device of the substrate loading cassette is coupled. The transfer device coupling portion includes a transfer device coupling frame formed horizontally on the substrate loading cassette and a vibration damping portion disposed below the transfer device coupling frame. The specific configuration of the substrate loading cassette is the same as that described above with reference to FIGS. 1, 2A, and 2B. The following description will focus on differences.

[0091] The transport device coupling portion 40 may further include an anti-slip portion 44 disposed below the vibration damping portion 42. When the transport device coupling portion 40 is coupled to a grip unit 202 of the transport device, i.e., the OHT, an end of the grip unit 202 may be disposed below and in contact with the anti-slip portion 44.

[0092] The anti-slip portion 44 may be disposed below and in contact with the vibration-damping portion 42. Other components may be disposed between the anti-slip portion 44 and the vibration-damping portion 42.

[0093] The anti-slip portion 44 may be disposed in the recessed area located below the vibration-damping portion 42. In this case, the anti-slip portion 44 may help to be stably fixed to the vibration-damping portion 42.

[0094] In this embodiment, the coefficient of friction of the slip prevention portion 44 may be adjusted to be higher than the coefficient of friction of the vibration damping portion 42. This allows the OHT to more stably hold the transfer device coupling portion 40, thereby preventing slippage during the cassette lifting or transfer process.

[0095] The anti-slip portion 44 may include any one selected from the group consisting of a rubber-based compound, a silicone rubber-based compound, and a combination thereof. The anti-slip portion 44 may be any one selected from the group consisting of a rubber-based compound, a silicone rubber-based compound, and a combination thereof.

[0096] Examples of rubber compounds that can be used include polyisoprene rubber, styrene-butadiene rubber, acrylonitrile-butadiene rubber, polychloroprene rubber, butyl rubber, and ethylene-propylene rubber.

[0097] The anti-slip portion 44 may have a pad shape, and at least a portion of the surface of the anti-slip portion 44 may be roughened to provide a high coefficient of friction.

[0098] Substrate support and support bar Figure 3 is a cross-sectional view taken along line II' of Figure 1. Hereinafter, the substrate loading cassette of the embodiment will be described with reference to Figure 3.

[0099] The substrate loading cassette includes an upper frame, a lower frame facing the upper frame, and a support frame formed vertically on the substrate loading cassette and connecting the upper frame and the lower frame along the edge of the substrate loading cassette. The substrate loading cassette also includes a transfer device coupling portion disposed on the upper frame and to which a grip unit of a transfer device of the substrate loading cassette is coupled. The transfer device coupling portion includes a transfer device coupling frame formed horizontally on the substrate loading cassette and a vibration damping portion disposed below the transfer device coupling frame. The specific configuration of the substrate loading cassette is the same as that described above with reference to FIGS. 1, 2A, and 2B. The following description will focus on differences.

[0100] The substrate loading cassette 100 may include a substrate support portion 311 connected to the first support frame 31 and formed toward the inside of the substrate loading cassette 100. The substrate support portion 311 may support an edge of a target substrate to be loaded in the substrate loading cassette 100.

[0101] The substrate support 311 may include a base portion and a protective layer surrounding at least a portion of the base portion.

[0102] The base portion may be connected to and in contact with the first support frame 31. The base portion may be integrally formed with the first support frame 31. The material used for the base portion may be the same as that of the first support frame 31.

[0103] The protective layer may be disposed in an area including a portion where the target substrate to be loaded contacts the substrate support part 311. This provides a controlled elasticity to the surface of the substrate support part 311, thereby preventing the substrate support part 311 from causing damage such as scratches to the surface of the target substrate.

[0104] The description of the composition of the protective layer is omitted here since it overlaps with the above description.

[0105] The substrate loading cassette 100 of the embodied example may include a support bar 50 connected to the second support frame 32 and extending inward of the substrate loading cassette 100 .

[0106] The support bar 50 can support the target substrates loaded in the cassette together with the substrate support portion 311. The support bar 50 can support an area of ​​the target substrate that is located apart from the area supported by the substrate support portion 311, particularly the center portion of the target substrate. This can effectively prevent the center portion of the loaded target substrate from bending downward during storage.

[0107] In addition, since the support bar 50 supports the center of the target substrate, the target substrate does not easily shake horizontally within the cassette during loading and transporting, and thus the target substrate does not collide or come into contact with the support frame 30 of the cassette.

[0108] In addition, in embodiments, the mechanical properties of the support bar 50 may be adjusted within a predetermined range. Vibrations of the cassette that occur during the process of lifting and transporting the cassette by the OHT may be transmitted to the target substrate via the support bar 50 that contacts and supports the target substrate within the cassette. In embodiments, by introducing a support bar 50 with controlled elasticity, the vibrations propagating to the target substrate via the support bar 50 can be effectively attenuated.

[0109] The elastic modulus of the support bar 50 may be 0.03 MPa to 0.5 MPa. The elastic modulus may be 0.04 MPa or more. The elastic modulus may be 0.05 MPa or more. The elastic modulus may be 0.3 MPa or less. The elastic modulus may be 0.2 MPa or less. The elastic modulus may be 0.1 MPa or less. In such cases, the support bar 50 can contribute to damping vibrations caused by cassette transport while suppressing deflection of the target substrate.

[0110] The modulus of elasticity is measured at room temperature as specified in ASTM A370.

[0111] In this embodiment, it is possible to simultaneously adjust the Poisson's ratio and specific gravity of the support bar 50. The support bar 50 having such characteristics has excellent long-term durability because it has a weight below a certain level and is less susceptible to physical deformation (e.g., necking) caused by the load of the substrate.

[0112] The Poisson's ratio of the support bar 50 may be 0.4 or less. The Poisson's ratio may be 0.35 or less. The Poisson's ratio may be 0.32 or less. The Poisson's ratio may be 0.3 or less. The Poisson's ratio may be 0.2 or more.

[0113] Poisson's ratio is measured at room temperature as specified in ASTM A370.

[0114] The specific gravity of the support bar 50 may be 1.2 to 1.8. The specific gravity may be 1.7 or less. The specific gravity may be 1.65 or less. The specific gravity may be 1.62 or less.

[0115] In such a case, the support bar 50 can be useful for stably supporting the loaded target substrate for a long period of time.

[0116] 4 is a side view of the support bar of FIG. 1. Hereinafter, an embodiment will be described with reference to FIG.

[0117] The support bar 50 may include a first end 53 located on the second support frame 32 side and a second end 54 located opposite the first end 53. The second end 54 may be located higher than the first end 53.

[0118] When the support bar 50 is observed from the side, the height of the support bar 50 may increase from the first end 53 to the second end 54. When the support bar 50 is observed from the side, the support bar 50 may have a curved shape or a linear shape forming a slope. In this case, the contact area between the target substrate and the support bar 50 can be reduced to a certain level or below, thereby reducing the possibility of contamination of the target substrate due to contact with the support bar 50.

[0119] The difference between the height of second end 54 when support bar 50 supports the target substrate and the height of second end 54 before support bar 50 supports the target substrate may be 3 mm or less. The difference may be 2 mm or less. The difference may be 1.5 mm or less. The difference may be 0.1 mm or more. In such cases, support bar 50 and substrate support portion 311, which have the above-mentioned elastic properties, can both stably support the target substrate.

[0120] The material of the support bar 50 is not limited as long as it is a material commonly used in the field of substrate loading cassettes, and may be, for example, a carbon fiber-impregnated epoxy resin, glass fiber reinforced plastic, or the like.

[0121] The substrate loading cassette 100 of the embodied example may include a substrate receiving member 52 disposed on a support bar 50 and protruding upward.

[0122] When a target substrate is loaded in the substrate loading cassette 100, the substrate receiving member 52 can contact the surface of the target substrate to support the target substrate. The substrate receiving member 52 can have a function of reducing the contact area between the support bars 50 and the target substrate. The substrate receiving member 52 can have a convex shape. In this case, the contact area between the support bars 50 and the target substrate can be further reduced, thereby effectively reducing the possibility of contamination of the target substrate.

[0123] 5 is a perspective view showing a substrate loading cassette according to still another embodiment of the present invention. An embodiment of the present invention will be described with reference to FIG.

[0124] The substrate loading cassette includes an upper frame, a lower frame facing the upper frame, and a support frame formed vertically on the substrate loading cassette and connecting the upper frame and the lower frame along the edge of the substrate loading cassette. The substrate loading cassette also includes a transfer device coupling portion disposed on the upper frame and to which a grip unit of a transfer device of the substrate loading cassette is coupled. The transfer device coupling portion includes a transfer device coupling frame formed horizontally on the substrate loading cassette and a vibration damping portion disposed below the transfer device coupling frame. The specific configuration of the substrate loading cassette is the same as that described above with reference to FIGS. 1 to 4. The following description will focus on differences.

[0125] The substrate loading cassette according to yet another embodiment may further include a guide block 70 disposed on the upper frame.

[0126] The guide block 70 of the substrate loading cassette 100 may have a structure that engages with a guide block (not shown) included in the body of a transfer device. The guide block 70 of the substrate loading cassette 100 can guide the body of the transfer device, which approaches from above the cassette, to a predetermined position. This allows the grip unit of the transfer device to be accurately connected to a predetermined position (especially a vibration damping unit or slip prevention unit) within the transfer device coupling, thereby reducing the possibility of the cassette 100 falling off the transfer device or excessive vibration occurring in the cassette 100 during the transfer process.

[0127] Although the preferred embodiments of the present invention have been described in detail above, the scope of the present invention is not limited thereto, and various modifications and improvements made by those skilled in the art using the basic concept of the present invention defined in the appended claims also fall within the scope of the present invention. [Explanation of symbols]

[0128] 100 PCB loading cassette 10 Upper Frame 20 Lower frame 30 Support Frame 31 First support frame 311 Substrate support 32 Second support frame 40 Transfer device coupling part 41 Transfer device coupling frame 42 Vibration damping section 43 Connecting Frame 44 Anti-slip part 50 support bar 52 Circuit board support member 53 First end of support bar 54 Second end of support bar 60 Cassette Door 70 Guide Block 200 Transfer device 201 Main body of the transport device 202 Grip Unit 203 Rope x x-axis direction of the substrate loading cassette y y-axis direction of the substrate loading cassette z Vertical direction of cassette for loading boards

Claims

1. A substrate loading cassette, an upper frame and a lower frame facing the upper frame; a support frame formed in a vertical direction of the substrate loading cassette and connecting the upper frame and the lower frame at an edge of the substrate loading cassette; a transfer device coupling portion disposed on the upper frame and coupled to a transfer device of the substrate loading cassette; the transfer device coupling part includes a transfer device coupling frame formed in a horizontal direction of the substrate loading cassette, and a vibration damping part disposed below the transfer device coupling frame, the support frame includes first support frames disposed on the left and right sides of the substrate loading cassette, and a second support frame disposed on the rear side of the substrate loading cassette, a support bar connected to the second support frame and extending inward of the substrate loading cassette; the vibration damping portion contains a polyamide resin, The compression strength of the vibration damping portion is 600 kg / cm ２ That's all, The substrate loading cassette, wherein the elastic modulus of the support bar is 0.03 MPa to 0.5 MPa.

2. The Poisson's ratio of the support bar is 0.4 or less, 2. The substrate loading cassette according to claim 1, wherein the specific gravity of said support bars is 1.2 to 1.

8.

3. 2. The substrate loading cassette according to claim 1, wherein the vibration damping portion has a tensile modulus of elasticity of 15,000 MPa to 50,000 MPa.

4. the transfer device coupling portion further includes an anti-slip portion disposed below the vibration damping portion; 2. The substrate loading cassette according to claim 1, wherein the coefficient of friction of said slip prevention portion is higher than the coefficient of friction of said vibration damping portion.

5. a substrate support portion connected to the first support frame and formed toward an inner side of the substrate loading cassette; The substrate loading cassette of claim 1 , wherein the substrate support includes a base portion and a protective layer surrounding at least a portion of the base portion.

6. 6. The substrate loading cassette of claim 5, wherein the protective layer comprises any one selected from the group consisting of PTFE (Polytetrafluoroethylene), FEP (Fluorinated ethylene propylene), PEEK (Polyetheretherketone), PEI (Polyetherimide), PES (Polyethersulfone), PFA (Perfluoroalkoxy copolymer), PAEK (Polyaryletherketone), and combinations thereof.

7. 10. The substrate loading cassette of claim 1, further comprising a guide block disposed on said upper frame.

8. the support bar includes a first end portion located on the second support frame side and a second end portion located on the opposite side of the first end portion, The second end is located higher than the first end, 2. The substrate loading cassette of claim 1, wherein the difference between the height of the second end when the support bar supports the target substrate and the height of the second end before the support bar supports the target substrate is 3 mm or less.

9. a substrate receiving member disposed on the support bar and protruding upward; 2. The substrate loading cassette according to claim 1, wherein said substrate receiving member has a convex shape.

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