Liquid ejecting head and liquid ejecting apparatus

Abstract

To solve the problem that variations for arranging a plurality of head chips on a fixing plate are not sufficiently examined.SOLUTION: The liquid ejecting head includes a first head chip, a second head chip, and a fixing plate to which the first and second head chips are fixed, the fixing plate includes a first flat plate portion including a first fixing surface to which the first head chip is fixed and a first surface opposite to the first fixing surface, and a second flat plate portion including a second fixing surface to which the second head chip is fixed and a second surface opposite to the second fixing surface, and the first surface and the second surface face different directions by bending the fixing plate. When viewed in a first direction along an intersection line between the first surface and the second surface, an angle between the first surface and the second surface is less than 180 degrees.SELECTED DRAWING: Figure 5

Description

[Technical Field]

[0001] The present disclosure relates to a liquid ejection head and a liquid ejection apparatus. [Background technology]

[0002] Inkjet printers and other devices generally include a liquid jet head that jets liquid such as ink. The liquid jet head described in Patent Document 1 includes a plurality of head chips that jet liquid such as ink, and a fixing plate on which the plurality of head chips are arranged. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Japanese Patent Application Laid-Open No. 2015-39804 Summary of the Invention [Problem to be solved by the invention]

[0004] Conventionally, only arranging multiple head chips on a fixed plate parallel to one plane has been considered, and variations in arranging multiple head chips on a fixed plate have not been sufficiently considered. [Means for solving the problem]

[0005] In order to solve the above problems, a liquid ejecting head according to a preferred embodiment of the present disclosure comprises a plurality of head chips including a first head chip having a plurality of first nozzles for ejecting liquid and a second head chip having a plurality of second nozzles for ejecting liquid, a first exposed opening that exposes the plurality of first nozzles to the outside, and a second exposed opening that exposes the plurality of second nozzles to the outside, and a fixing plate to which the plurality of head chips are fixed, wherein the fixing plate includes a first flat plate portion including a first fixing surface to which the first head chip is fixed and a first surface opposite to the first fixing surface, and a second flat plate portion including a second fixing surface to which the second head chip is fixed and a second surface opposite to the second fixing surface, wherein the first surface and the second surface face in different directions by bending the fixing plate, and an angle formed by the first surface and the second surface is less than 180 degrees when viewed in a first direction along an intersection line between the first surface and the second surface.

[0006] A liquid ejection head according to another preferred aspect of the present disclosure includes a plurality of head chips including a first head chip having a plurality of first nozzles for ejecting liquid and a second head chip having a plurality of second nozzles for ejecting liquid, a first exposed opening that exposes the plurality of first nozzles to the outside, and a second exposed opening that exposes the plurality of second nozzles to the outside, and a fixing plate to which the plurality of head chips are fixed, the fixing plate including: a first flat plate portion including a first fixing surface to which the first head chip is fixed and a first surface opposite the first fixing surface, and a second flat plate portion including a second fixing surface to which the second head chip is fixed and a second surface opposite the second fixing surface, the first surface and the second surface facing in different directions by bending the fixing plate, and when viewed in a first direction along the intersection line between the first surface and the second surface, a first half-ray extending from the first surface in a direction perpendicular to the first surface and a second half-ray extending from the second surface in a direction perpendicular to the second surface intersect.

[0007] A liquid ejecting apparatus according to a preferred aspect of the present disclosure includes the liquid ejecting head according to the above aspect, and a conveying unit that conveys a medium onto which liquid ejected from the liquid ejecting head lands. [Brief explanation of the drawings]

[0008] [Figure 1] 1 is a schematic diagram of a liquid ejecting apparatus according to a first embodiment. [Figure 2] FIG. 1 is an exploded perspective view of a liquid jet head according to a first embodiment. [Figure 3] FIG. 2 is an exploded perspective view of a head chip. [Figure 4] FIG. 2 is a cross-sectional view of a head chip. [Figure 5] 1 is a schematic cross-sectional view of a liquid jet head according to a first embodiment. [Figure 6] FIG. 2 is a bottom view of the liquid jet head according to the first embodiment. [Figure 7] 1A and 1B are explanatory diagrams of a liquid jet head according to a first embodiment. [Figure 8] FIG. 10 is an explanatory diagram of a conventional liquid jet head. [Figure 9] FIG. 2 is a bottom view of a liquid jet head according to a first modified example of the first embodiment. [Figure 10] FIG. 10 is a bottom view of a liquid jet head according to a second modified example of the first embodiment. [Figure 11] FIG. 10 is a bottom view of a liquid jet head according to a third modified example of the first embodiment. [Figure 12] 10 is a schematic cross-sectional view of a liquid jet head according to a fourth modified example of the first embodiment. [Figure 13] FIG. 10 is a schematic diagram of a liquid ejecting apparatus according to a second embodiment. [Figure 14] FIG. 10 is a bottom view of the liquid jet head according to the second embodiment. [Figure 15] 10A and 10B are explanatory diagrams of a liquid jet head according to a second embodiment. [Figure 16] FIG. 10 is an explanatory diagram of a conventional liquid jet head. [Figure 17] FIG. 10 is a bottom view of a liquid jet head according to a modified example of the second embodiment. [Figure 18] 10A and 10B are explanatory diagrams of a liquid jet head according to a modified example of the second embodiment. DETAILED DESCRIPTION OF THE INVENTION

[0009] Preferred embodiments of the present disclosure will be described below with reference to the accompanying drawings. Note that the dimensions and scale of each part in the drawings may differ from the actual dimensions and are shown schematically to facilitate understanding. Furthermore, the scope of the present disclosure is not limited to these embodiments unless otherwise specified in the following description to the effect that the present disclosure is limited.

[0010] 1. First embodiment 1-1. Schematic configuration of the liquid ejection device FIG. 1 is a schematic diagram of a liquid ejection device 100 according to a first embodiment. For convenience, the following description will use the mutually intersecting X, Y, and Z axes as appropriate. In the following description, one direction along the X axis is the X1 direction, and the direction opposite the X1 direction is the X2 direction. Similarly, the Y1 and Y2 directions are opposite directions along the Y axis. Furthermore, the Z1 and Z2 directions are opposite directions along the Z axis. Here, the Z axis is typically a vertical axis, and the Z2 direction corresponds to the downward direction in the vertical direction. However, the Z axis does not have to be a vertical axis. Furthermore, the X, Y, and Z axes are typically perpendicular to each other, but are not limited thereto. For example, they may intersect at an angle between 80° and 100°.

[0011] In this embodiment, an example is shown in which the liquid ejection head 50 described below is applied to a serial method, with the Y1 direction corresponding to the first direction D1, the Z2 direction corresponding to the second direction D2, and the X2 direction corresponding to the third direction D3.

[0012] The liquid ejection device 100 is an inkjet printing device that ejects ink, which is an example of a "liquid," as droplets onto a medium M. The medium M is typically printing paper. However, the medium M is not limited to printing paper, and may be a printing target made of any material, such as a resin film or fabric.

[0013] As shown in FIG. 1, the liquid ejecting device 100 includes a liquid storage section 10, a control unit 20, a conveying section 30, a moving mechanism 40, and a liquid ejecting head 50.

[0014] The liquid storage unit 10 is a container that stores ink. Specific examples of the liquid storage unit 10 include a cartridge that is detachable from the liquid ejection device 100, a bag-shaped ink pack made of a flexible film, and a container such as an ink tank that can be refilled with ink.

[0015] Although not shown, the liquid storage unit 10 has multiple containers that store different types of ink. The inks stored in the multiple containers are not particularly limited, but include, for example, cyan ink, magenta ink, yellow ink, black ink, clear ink, white ink, and treatment liquid, and a combination of two or more of these is used. The composition of the ink is not particularly limited, and may be, for example, a water-based ink in which a coloring material such as a dye or pigment is dissolved in a water-based solvent, a solvent-based ink in which a coloring material is dissolved in an organic solvent, or a UV-curable ink.

[0016] The control unit 20 controls the operation of each element of the liquid ejection device 100. For example, the control unit 20 includes a processing circuit such as a CPU (Central Processing Unit) or an FPGA (Field Programmable Gate Array), and a storage circuit such as a semiconductor memory. The control unit 20 outputs a drive signal D and a control signal S to the liquid ejection head 50. The drive signal D is a signal including a drive pulse that drives a drive element of the liquid ejection head 50. The control signal S is a signal that specifies whether or not to supply the drive signal D to the drive element.

[0017] The transport unit 30 transports the medium M in a transport direction DM under the control of the control unit 20. In the example shown in FIG. 1, the transport direction DM is the Y1 direction. In the example shown in FIG. 1, the transport unit 30 includes a long transport roller along the X axis and a motor (not shown) that rotates the transport roller. Note that the transport unit 30 is not limited to a configuration using a transport roller, and may be configured, for example, to use a drum or an endless belt that transports the medium M while adsorbed to the outer peripheral surface by electrostatic force or the like.

[0018] The movement mechanism 40 reciprocates the liquid jet head 50 in the X1 direction and the X2 direction under the control of the control unit 20. In the example shown in FIG. 1 , the movement mechanism 40 has a substantially box-shaped support 41 called a carriage that houses the liquid jet head 50, and a conveyor belt 42 to which the support 41 is fixed. The support 41 supports the liquid jet head 50 and is made of a metal material. Note that, in addition to the liquid jet head 50, the aforementioned liquid storage unit 10 may be mounted on the support 41. Furthermore, a plurality of liquid jet heads 50 may be mounted on the support 41.

[0019] The liquid jet head 50 includes a plurality of head chips 54, and under the control of the control unit 20, ejects ink supplied from the liquid storage section 10 from each of a plurality of nozzles of each head chip 54 in the Z2 direction toward the medium M. This ejection is performed in parallel with the transport of the medium M by the transport section 30 and the reciprocating movement of the liquid jet head 50 by the movement mechanism 40, thereby forming a predetermined image in ink on the surface of the medium M. In this way, the transport section 30 transports the medium M onto which the ink ejected from the liquid jet head 50 lands.

[0020] 1-2. Liquid jet head 2 is an exploded perspective view of the liquid jet head 50 according to the first embodiment. As shown in FIG. 2, the liquid jet head 50 includes a flow path structure 51, a substrate unit 52, a holder 53, two head chips 54-1 and 54-2, and a fixing plate 55.

[0021] Each of head chips 54-1 and 54-2 is head chip 54 shown in Fig. 1. Here, head chip 54-1 is an example of a "first head chip," and head chip 54-2 is an example of a "second head chip." Hereinafter, when there is no need to distinguish between head chips 54-1 and 54-2, each of these head chips will be referred to as head chip 54.

[0022] The flow path structure 51, substrate unit 52, holder 53, head chips 54-1 and 54-2, and fixing plate 55 are arranged in this order, stacked in the Z2 direction. These are joined together appropriately by screws, adhesive, or the like. Each part of the liquid jet head 50 will be described below in order.

[0023] The flow path structure 51 is a structure having one or more flow paths therein for supplying ink stored in the liquid storage section 10 to the two head chips 54. In this embodiment, as will be described later, different types of ink are supplied to the head chips 54-1 and 54-2. Therefore, the flow path structure 51 has multiple flow paths therein. Note that, when the same type of ink is supplied to the head chips 54-1 and 54-2, a single flow path for distributing and supplying the ink to the head chips 54-1 and 54-2 may be provided within the flow path structure 51. Although not shown, the flow path structure 51 is composed of a laminate in which multiple substrates are stacked in the direction along the Z axis. Each of the multiple substrates is appropriately provided with grooves and holes for the supply flow paths described below, a filter chamber having a filter for capturing foreign matter contained in the ink, and the like. The multiple substrates are joined to each other, for example, by adhesive, brazing, welding, screw fastening, or the like. Note that, if necessary, a sheet-like sealing member made of a rubber material or the like may be appropriately disposed between the multiple substrates. The number or thickness of the substrates constituting the flow path structure 51 is determined depending on the shape of the supply flow path and is not particularly limited and is arbitrary. Each of the plurality of substrates is not particularly limited and may be made of, for example, a metal, a ceramic, or a resin composition.

[0024] Although not shown, the flow path structure 51 is provided with two supply flow paths, one for each of the two types of ink. Each of the two supply flow paths has one inlet for receiving the ink and one outlet for discharging the ink. The inlet of each supply flow path is provided on a surface of the flow path structure 51 facing the Z1 direction. In contrast, the outlet of each supply flow path is provided on a surface of the flow path structure 51 facing the Z2 direction.

[0025] In this way, the flow path structure 51 includes one or more flow paths that communicate with the flow paths of the multiple head chips 54, and is configured by stacking multiple substrates. Here, the second direction D2 is the direction in which the multiple substrates are stacked, and in this embodiment, it is the Z2 direction.

[0026] A plurality of connecting pipes 51a are provided on the surface of the flow path structure 51 facing the Z1 direction. Each of the plurality of connecting pipes 51a is a pipe body protruding from the surface of the flow path structure 51 facing the Z1 direction. In the example shown in FIG. 2, two connecting pipes 51a corresponding to the two supply flow paths described above are provided in the flow path structure 51, and each connecting pipe 51a is connected to the inlet of the corresponding supply flow path. Separate ink tubes are connected to the two connecting pipes 51a so that different types of ink are supplied to each connecting pipe 51a, and each connecting pipe 51a is connected to the liquid storage section 10 described above via the ink tubes.

[0027] The flow path structure 51 is also provided with a plurality of wiring holes 51b for passing wiring 52c (described later) of the substrate unit 52. The flow path structure 51 is also provided with holes (not shown) and is fixed to the holder 53 by screws using the holes.

[0028] The board unit 52 is an assembly having mounted components for electrically connecting the liquid jet head 50 to the control unit 20. The board unit 52 has a circuit board 52a, a connector 52b, and wiring 52c.

[0029] The circuit board 52a is a printed wiring board such as a rigid wiring board having wiring for electrically connecting each head chip 54 and the connector 52b. The circuit board 52a is disposed between the flow path structure 51 and the holder 53, and the connector 52b is provided on the surface of the circuit board 52a facing the Z1 direction. The circuit board 52a is provided with a plurality of wiring holes 52d through which the wiring boards 54i of the head chips 54 pass. As a result, the wiring boards 54i are connected to the surface of the circuit board 52a facing the Z1 direction through the wiring holes 52d.

[0030] The connector 52b is a connecting part that is electrically connected to the circuit board 52a. A wiring 52c is connected to the connector 52b. The wiring 52c is a flexible wiring board such as a COF (Chip On Film), an FPC (Flexible Printed Circuit), or an FFC (Flexible Flat Cable) that electrically connects the connector 52b and the control unit 20. The circuit board 52a is fixed to the flow path structure 51 or the holder 53 by screws or the like.

[0031] The holder 53 is a structure that houses and supports the multiple head chips 54. The holder 53 is made of, for example, metal, ceramic, or a resin composition. The holder 53 is provided with a recess 53a and multiple wiring holes 53b. The recess 53a is open in the Z2 direction and is a space in which the multiple head chips 54 are arranged. Each of the multiple wiring holes 53b is a hole through which the wiring substrate 54i of the head chip 54 passes toward the substrate unit 52. Note that the recess 53a may be made up of multiple recesses divided into sections for each head chip 54.

[0032] Although not shown, holder 53 includes one or more flow paths for supplying to two head chips 54, and also functions as a flow path structure. Therefore, the supply flow paths of flow path structure 51 are connected to head chip 54 via the flow paths of holder 53. For example, similar to flow path structure 51, such holder 53 may be configured as a laminate in which multiple substrates are stacked in the direction along the Z axis. Note that the flow paths of holder 53 may be provided as necessary or may be omitted. In this case, the supply flow paths of flow path structure 51 are connected to head chip 54 without going through the flow paths of holder 53.

[0033] Each head chip 54 has a nozzle surface FN that ejects ink. Here, head chip 54-1 ejects a first ink, which is one of the two types of ink mentioned above. Head chip 54-2 ejects a second ink, which is the other of the two types of ink mentioned above. Each head chip 54 is provided with a wiring substrate 54i. Note that FIG. 2 shows a simplified configuration of each head chip 54. Details of the head chips 54 will be explained later with reference to FIGS. 3 and 4.

[0034] The fixing plate 55 is a plate-like member to which the two head chips 54 and the holder 53 are fixed, and includes exposure openings 55a-1 and 55a-2. The exposure opening 55a-1 is an example of a "first exposure opening" and exposes the multiple nozzles N of the head chip 54-1 to the outside. The exposure opening 55a-2 is an example of a "second exposure opening" and exposes the multiple nozzles N of the head chip 54-2 to the outside. The fixing plate 55 is disposed so as to sandwich the two head chips 54 between itself and the holder 53, and each head chip 54 and the holder 53 are fixed with an adhesive or the like. In this manner, the head chips 54-1 and 54-2 are fixed to the fixing plate 55. Note that hereinafter, the exposure openings 55a-1 and 55a-2 may be referred to as exposure openings 55a without distinction.

[0035] Fixing plate 55 is made of a metal material such as stainless steel, titanium, or magnesium alloy. Fixing plate 55 is bent so as to change the installation postures of head chips 54-1 and 54-2. This will be described later with reference to Figures 5 to 7.

[0036] 1-3.Head chip configuration Fig. 3 is an exploded perspective view of head chip 54. Fig. 4 is a cross-sectional view of head chip 54. Note that Fig. 4 is a cross-sectional view of head chip 54 taken along line VI-VI in Fig. 3. In this embodiment, head chips 54-1 and 54-2 have a common configuration, and each of head chips 54-1 and 54-2 has the configuration described below.

[0037] In the following, for the convenience of explaining the positions and directions of the head chip 54, the x-axis, y-axis, and z-axis, which intersect with each other, will be used as appropriate. The x-axis, y-axis, and z-axis are local coordinates based on the head chip 54. In the following, one direction along the x-axis is the x1 direction, and the direction opposite to the x1 direction is the x2 direction. Similarly, the y1 direction and the y2 direction are opposite directions along the y-axis. Furthermore, the z1 direction and the z2 direction are opposite directions along the z-axis. In this embodiment, when the head chip 54 is installed on the fixing plate 55 as described below, the y-axis is parallel to the Y-axis, but the x-axis is inclined with respect to the X-axis and the z-axis is inclined with respect to the Z-axis. Note that the y-axis may be inclined with respect to the Y-axis.

[0038] As shown in FIGS. 3 and 4, the head chip 54 has a plurality of nozzles N arranged in the direction along the y-axis. The plurality of nozzles N is divided into a first row Ln1 and a second row Ln2 arranged at intervals along the x-axis. Each of the first row Ln1 and the second row Ln2 is a collection of a plurality of nozzles N arranged linearly in the direction along the y-axis. Note that, although the head chip 54 of this embodiment has two nozzle rows in which a plurality of nozzles N are arranged in the direction along the y-axis, the number of nozzle rows is not limited to this, and the number of nozzle rows may be one, three, or more.

[0039] The head chips 54 are configured to be approximately symmetrical with respect to each other in the direction along the x-axis. However, the positions of the multiple nozzles N in the first row Ln1 and the multiple nozzles N in the second row Ln2 in the direction along the y-axis may or may not match. Figures 3 and 4 illustrate a configuration in which the positions of the multiple nozzles N in the first row Ln1 and the multiple nozzles N in the second row Ln2 in the direction along the y-axis match each other.

[0040] As shown in Figures 3 and 4, the head chip 54 has a flow path substrate 54a, a pressure chamber substrate 54b, a nozzle plate 54c, a vibration absorber 54d, a vibration plate 54e, multiple piezoelectric elements 54f, a protective plate 54g, a case 54h, a wiring board 54i, and a drive circuit 54j.

[0041] The flow path substrate 54a and the pressure chamber substrate 54b are stacked in this order in the z1 direction to form a flow path for supplying ink to the multiple nozzles N. In an area located further in the z1 direction than the stack of the flow path substrate 54a and the pressure chamber substrate 54b, a diaphragm 54e, multiple piezoelectric elements 54f, a protective plate 54g, a case 54h, a wiring board 54i, and a drive circuit 54j are installed. On the other hand, in an area located further in the z2 direction than the stack, a nozzle plate 54c and a vibration absorber 54d are installed. Each element of the head chip 54 is roughly a plate-like member elongated in the y direction and is joined to each other, for example, by an adhesive. Each element of the head chip 54 will be described in order below.

[0042] The nozzle plate 54c is a plate-like member having a plurality of nozzles N arranged in a first row Ln1 and a second row Ln2. Therefore, the head chip 54 has a plurality of nozzles N that eject liquid. Each of the nozzles N is a through-hole that allows ink to pass through. As described below, the ink is ejected in response to pressure changes in the pressure chambers C caused by deformation of the vibration plate 54e due to driving of the piezoelectric element 54f. The surface of the nozzle plate 54c facing the z2 direction is the nozzle surface FN. The nozzle plate 54c is manufactured by processing a silicon single crystal substrate using semiconductor manufacturing techniques, such as dry etching or wet etching. However, other known methods and materials may also be used to manufacture the nozzle plate 54c. The cross-sectional shape of the nozzle is typically circular, but is not limited thereto and may be non-circular, such as polygonal or elliptical.

[0043] The flow path substrate 54a is provided with a flow path R1, a plurality of supply flow paths Ra, and a plurality of communication flow paths Na for each of the first row Ln1 and the second row Ln2. The flow path R1 is an elongated opening extending in the direction along the y-axis in a plan view seen in the direction along the z-axis. Each of the supply flow paths Ra and the communication flow paths Na is a through-hole formed for each nozzle N. Each supply flow path Ra is in communication with the flow path R1.

[0044] The pressure chamber substrate 54b is a plate-like member in which a plurality of pressure chambers C, called cavities, are provided in each of a first row Ln1 and a second row Ln2. The pressure chambers C are arranged in a direction along the y-axis. Each pressure chamber C is formed for each nozzle N and is an elongated space extending in a direction along the x-axis in a plan view. Like the nozzle plate 54c described above, the flow path substrate 54a and the pressure chamber substrate 54b are each manufactured by processing a silicon single crystal substrate using semiconductor manufacturing technology, for example. However, other known methods and materials may also be used as appropriate to manufacture the flow path substrate 54a and the pressure chamber substrate 54b.

[0045] The pressure chambers C are spaces located between the flow path substrate 54a and the vibration plate 54e. A plurality of pressure chambers C are arranged in the direction along the y-axis in each of the first row Ln1 and the second row Ln2. The pressure chambers C are also connected to the communication flow path Na and the supply flow path Ra. Therefore, the pressure chambers C are connected to the nozzle N via the communication flow path Na and to the flow path R1 via the supply flow path Ra.

[0046] A diaphragm 54e is disposed on the surface of the pressure chamber substrate 54b facing the z1 direction. The diaphragm 54e is a plate-like member that can elastically vibrate. The diaphragm 54e has, for example, a first layer and a second layer, which are stacked in this order in the z1 direction. The first layer is, for example, an elastic film made of silicon oxide (SiO2). The elastic film is formed, for example, by thermally oxidizing one surface of a silicon single crystal substrate. The second layer is, for example, an insulating film made of zirconium oxide (ZrO2). The insulating film is formed, for example, by forming a zirconium layer by sputtering and then thermally oxidizing the layer. Note that the diaphragm 54e is not limited to the configuration of the stacked first and second layers described above, and may be, for example, a single layer or three or more layers.

[0047] On the surface of the vibration plate 54e facing the z1 direction, a plurality of piezoelectric elements 54f corresponding to the nozzles N are arranged as drive elements in each of the first row Ln1 and the second row Ln2. Each piezoelectric element 54f is a passive element that deforms when a drive signal is supplied. Each piezoelectric element 54f has an elongated shape extending in the direction along the x-axis in a plan view. The plurality of piezoelectric elements 54f are arranged in the direction along the y-axis so as to correspond to the plurality of pressure chambers C. The piezoelectric elements 54f overlap the pressure chambers C in a plan view.

[0048] Each piezoelectric element 54f includes a first electrode, a piezoelectric layer, and a second electrode, which are stacked in this order in the z1 direction (not shown). One of the first and second electrodes is an individual electrode spaced apart from each other for each piezoelectric element 54f, to which a drive signal D is applied. The other of the first and second electrodes is a strip-shaped common electrode extending along the y-axis so as to span the plurality of piezoelectric elements 54f, to which a predetermined reference potential is applied. The piezoelectric layer is made of a piezoelectric material such as lead zirconate titanate (Pb(Zr,Ti)O3) and, for example, has a strip-like shape extending along the y-axis so as to span the plurality of piezoelectric elements 54f. When the vibration plate 54e vibrates in response to the deformation of the piezoelectric elements 54f, the pressure in the pressure chamber C fluctuates, causing ink to be ejected from the nozzle N. Note that instead of the piezoelectric elements 54f, a heating element that heats the ink in the pressure chamber C may be used as the drive element.

[0049] The wiring board 54i is mounted on the surface of the diaphragm 54e facing the z1 direction and is a mounting component for electrically connecting the control unit 20 and the head chip 54. The wiring board 54i is, for example, a flexible wiring board similar to the wiring 52c. In this embodiment, a drive circuit 54j for supplying a drive voltage to each piezoelectric element 54f is mounted on the wiring board 54i. The drive circuit 54j is a circuit including a switching element that switches whether or not at least a portion of the waveform included in the drive signal D is supplied as a drive pulse to the drive element based on the control signal S.

[0050] The protective plate 54g is a plate-like member placed on the surface of the diaphragm 54e facing the z1 direction, and protects the multiple piezoelectric elements 54f and reinforces the mechanical strength of the diaphragm 54e. The multiple piezoelectric elements 54f are housed between the protective plate 54g and the diaphragm 54e.

[0051] The case 54h is a structure for storing ink to be supplied to the multiple pressure chambers C and defines a flow path R2. The case 54h is made of, for example, a resin material. A flow path R2 is provided in the case 54h for each of the first row Ln1 and the second row Ln2. The flow path R2 is a space that communicates with the flow path R1 described above and, together with the flow path R1, functions as a common liquid chamber RR that stores ink to be supplied to the multiple pressure chambers C. The case 54h is provided with an inlet HL for supplying ink to each common liquid chamber RR. This allows liquid to be introduced into the flow path R2 through the inlet HL. The ink in each common liquid chamber RR is supplied to the pressure chambers C via each supply flow path Ra. In this way, the head chip 54 has a common liquid chamber RR that communicates with multiple nozzles N. Note that in the example shown in FIG. 3, two inlet ports HL are provided for one common liquid chamber RR, but this is not limited thereto and the number may be, for example, one.

[0052] The vibration absorber 54d is a flexible thin film member that forms the wall surface of the common liquid chamber RR. The vibration absorber 54d absorbs pressure fluctuations of the ink in the common liquid chamber RR. The surface of the vibration absorber 54d facing the z1 direction is bonded to the flow path substrate 54a with an adhesive or the like. On the other hand, a frame 54k is bonded to the surface of the vibration absorber 54d facing the z2 direction with an adhesive or the like. The frame 54k is a frame-shaped member that fits along the outer periphery of the vibration absorber 54d and is fixed with an adhesive or the like so as to come into contact with the aforementioned fixing plate 55. Here, the frame 54k is made of a metal material such as stainless steel.

[0053] 1-4.Fixing plate Fig. 5 is a schematic cross-sectional view of the liquid jet head 50 according to the first embodiment. Fig. 6 is a bottom view of the liquid jet head 50 according to the first embodiment. For ease of explanation, Fig. 5 representatively shows the holder 53, head chips 54-1 and 54-2, and fixing plate 55 among the components of the liquid jet head 50. Fig. 6 is a view of the liquid jet head 50 as viewed in the Z2 direction, and shows the positional relationship between the head chips 54-1 and 54-2 and the fixing plate 55.

[0054] As shown in FIG. 5, head chip 54-1 and head chip 54-2 are housed in recess 53a of holder 53. In the example shown in FIG. 5, the bottom surface of recess 53a includes surfaces FH1 and FH2. Surface FH1 is a surface parallel to first fixing surface FF1 (described later), and the surface of head chip 54-1 facing the z1 direction is disposed along surface FH1. Surface FH1 may or may not be in contact with the surface of head chip 54-1 facing the z1 direction. Surface FH2 is a surface parallel to second fixing surface FF2 (described later), and the surface of head chip 54-2 facing the z1 direction is disposed along surface FH2. Surface FH2 may or may not be in contact with the surface of head chip 54-2 facing the z1 direction. In this way, because the surface FH1 is parallel to the first fixing surface FF1, it is easy to connect the flow path opening of the holder 53 (not shown) formed on the surface FH1 to the inlet HL provided on the upper surface of the head chip 54-1 (the surface opposite to the nozzle surface FN). The same is true for the surface FH2 and the second fixing surface FF2.

[0055] In this manner, in this embodiment, the normal lines to the surfaces FH1 and FH2 are inclined with respect to the Z axis. However, the normal lines to the surfaces FH1 and FH2 are not limited to being inclined with respect to the Z axis, and may be parallel to the Z axis, for example.

[0056] Furthermore, holder 53 is provided with surfaces FH3 and FH4 around recess 53a. Surface FH3 is a surface that is inclined with respect to a plane perpendicular to the Z axis so as to be parallel to first fixing surface FF1 (described later), and a first flat plate portion BD1 (described later) is bonded to surface FH3 with an adhesive or the like. Surface FH4 is a surface that is inclined with respect to a plane perpendicular to the Z axis so as to be parallel to second fixing surface FF2 (described later), and a second flat plate portion BD2 (described later) is bonded to surface FH4 with an adhesive or the like.

[0057] As shown in FIG. 5, fixing plate 55 includes a first flat plate portion BD1 and a second flat plate portion BD2. First flat plate portion BD1 is a part of fixing plate 55 and is a plate-shaped portion including first fixing surface FF1 and first surface F1. First flat plate portion BD1 has an exposure opening 55a-1, and head chip 54-1 is fixed to first fixing surface FF1 with an adhesive or the like. First surface F1 is the surface opposite first fixing surface FF1. Second flat plate portion BD2 is a part of fixing plate 55 and is a plate-shaped portion including second fixing surface FF2 and second surface F2. Second flat plate portion BD2 has an exposure opening 55a-2, and head chip 54-2 is fixed to second fixing surface FF2 with an adhesive or the like. Second surface F2 is the surface opposite second fixing surface FF2.

[0058] As shown in FIG. 6, the head chip 54-1 has a plurality of nozzles N-1 that eject ink. The nozzles N-1 are nozzles N that are an example of "first nozzles." The exposure opening 55a-1 exposes the plurality of nozzles N-1 to the outside. The head chip 54-2 has a plurality of nozzles N-2 that eject ink. The nozzles N-2 are nozzles N that are an example of "second nozzles." The exposure opening 55a-2 exposes the plurality of nozzles N-2 to the outside.

[0059] Here, exposure opening 55a-1 and exposure opening 55a-2 are lined up in this order in the X1 direction, and head chip 54-1 and head chip 54-2 are lined up in this order in the X1 direction.

[0060] 6, in this embodiment, the plurality of nozzles N-1 are arranged side by side along the first direction D1, and the plurality of nozzles N-2 are arranged side by side along the first direction D1. Furthermore, at a position facing the liquid jet head 50, the transport unit 30 transports the medium M in the first direction D1 along a plane perpendicular to the second direction D2. Here, the first direction D1 is a direction along an intersection line LC between the first surface F1 and the second surface F2, and in this embodiment, is the Y1 direction.

[0061] 5, the first surface F1 and the second surface F2 face in different directions by bending the fixing plate 55. When viewed in the first direction D1, the angle θ formed between the first surface F1 and the second surface F2 is less than 180 degrees.

[0062] Therefore, the normals of the first surface F1 and the second surface F2 are non-parallel to each other and point toward each other. Therefore, when viewed in the first direction D1 along the intersection line LC between the first surface F1 and the second surface F2, a first ray LH1 extending from the first surface F1 in a direction perpendicular to the first surface F1 intersects with a second ray LH2 extending from the second surface F2 in a direction perpendicular to the second surface F2. The first ray LH1 is a ray extending from the first surface F1 in a direction from the first fixing surface FF1 toward the first surface F1. The second ray LH2 is a ray extending from the second surface F2 in a direction from the second fixing surface FF2 toward the second surface F2. The normal direction of the first surface F1 substantially coincides with the liquid ejection direction of the head chip 54-1, and the normal direction of the second surface F2 substantially coincides with the liquid ejection direction of the head chip 54-2.

[0063] 8, the head chips 54-1 and 54-2 are fixed to the same flat portion of a fixed plate 55X, whose in-plane direction is perpendicular to the Z axis, and therefore liquid is ejected from both head chips 54-1 and 54-2 in the same Z2 direction. Therefore, when dots are formed by causing liquid to land from the head chips 54-1 and 54-2 at the same position on the medium M in the direction along the X axis, there is a time difference between when the liquid ejected from one of the head chips 54-1 and 54-2 lands at a predetermined position in the direction along the X axis and when the liquid ejected from the other head chip 54-1 or 54-2 lands at the same predetermined position. This time difference corresponds to the length of time required for the carriage to move the distance between the nozzle N-1 of the head chip 54-1 and the nozzle N-2 of the head chip 54-2 in the direction along the X axis, which is the main scanning direction of the carriage, in the conventional liquid ejection head 50X.

[0064] On the other hand, in this embodiment, because angle θ is less than 180 degrees, the landing positions of the liquid droplets from head tip 54-1 and head tip 54-2, which are ejected at the same timing, can be made closer to each other. As a result, the landing time difference can be shortened when dots are formed by causing liquid droplets from head tip 54-1 and head tip 54-2 to land at the same position in the direction along the X axis on medium M.

[0065] In this embodiment, the multiple nozzles N-1 are arranged in a row along the first direction D1, and the multiple nozzles N-2 are arranged in a row along the first direction D1, so that for the multiple nozzles N spanning a range in the first direction D1, the landing positions of the liquid from the head chip 54-1 and the landing positions of the liquid from the head chip 54-2 can be made closer to each other.

[0066] Furthermore, as described above, at a position facing the liquid ejection head 50, the transport section 30 transports the medium M in the first direction D1 along a plane perpendicular to the second direction D2, which is the stacking direction of the multiple substrates of the flow path structure 51. Therefore, in the serial method, the landing position of the liquid from the head chip 54-1 and the landing position of the liquid from the head chip 54-2 can be brought closer to each other.

[0067] Therefore, a suitable combination of liquids for use in the head chip 54-1 and the head chip 54-2, i.e., a combination of the first ink and the second ink, is one in which such a short difference in landing time is desirable. For example, in the case of a combination of a reaction liquid, which is an example of a pretreatment liquid, and a water-based resin, which is an example of a pigment ink or a clear ink, the ink coagulates quickly, thereby reducing the ink's wetting and spreading, thereby reducing ink bleeding. The reaction liquid is a liquid containing a coagulant that coagulates the pigment, resin, and the like contained in the ink composition. Examples of coagulants include polyvalent metal salts, cationic polymers, cationic surfactants, and organic acids. These coagulants may be used alone or in combination. The reaction liquid may also be used as a post-treatment liquid that is sprayed after the pigment ink or the clear ink. Furthermore, when different color inks are combined, the color tone can be improved.

[0068] Another advantage is that by bringing the landing positions of the liquid from head chip 54-1 and the liquid from head chip 54-2 closer to each other, errors in the transport of the medium are less likely to affect print quality.

[0069] Furthermore, the distance between the upper surfaces (surfaces opposite to the surface on which fixed plate 55 is installed) of head chip 54-1 and head chip 54-2 can be widened. This has the advantage that head chips 54 can be easily grasped when aligning head chips 54-1 and 54-2 on fixed plate 55 after fixing plate 55 is bent. Note that alignment, which adjusts the positions of multiple head chips 54 relative to fixing plate 55, may be performed while checking the positions of head chips 54 relative to fixing plate 55 using an optical device such as a camera. Also, fixing plate 55 may be bent after aligning multiple head chips 54. In this case, multiple head chips 54 can be aligned while fixing plate 55 is flat, making alignment easier.

[0070] The angle θ between the first surface F1 and the second surface F2 is the dihedral angle between the first surface F1 and the second surface F2 in a range that does not pass through the first fixing surface FF1 and the second fixing surface FF2. When the first flat plate portion BD1 and the second flat plate portion BD2 are not adjacent to each other as in a modified example of the second embodiment described below, the angle θ is the dihedral angle between the first flat plate portion BD1 and the second flat plate portion BD2 when the first fixing surface FF1 and the second fixing surface FF2 are virtually positioned so that their closer ends coincide with each other when viewed in a direction along the intersection line LC, or is the angle formed by the planes extending from the first surface F1 and the second surface F2. The angle θ between the first surface F1 and the second surface F2 corresponds to the angle obtained by subtracting the angle between the first fixing surface FF1 and the second fixing surface FF2 from 360 degrees.

[0071] The angle θ may be less than 180 degrees, but is preferably 90 degrees or greater, more preferably 135 degrees or greater, and even more preferably 170 degrees or greater. The angle θ is also preferably 179 degrees or less, more preferably 177 degrees or less, and even more preferably 175 degrees or less. This allows the landing positions of the liquid from head chip 54-1 and the liquid from head chip 54-2 to be suitably close to each other.

[0072] The fixed plate 55 is bent in directions such that the ejection directions of the head chip 54-1 and the head chip 54-2 approach each other. For this reason, the fixed plate 55 includes a bent portion BE. The bent portion BE is a portion bent between the first flat plate portion BD1 and the second flat plate portion BD2. The first flat plate portion BD1 and the second flat plate portion BD2 are adjacent to each other via the bent portion BE. This makes it possible to bring the landing positions of the liquid from the head chip 54-1 and the liquid from the head chip 54-2 closer to each other, and to reduce the size of the liquid ejection head 50.

[0073] As shown in Figure 5, the bent portion BE has a thin portion TH that is thinner than the first flat plate portion BD1. This makes it easy to form the bent portion BE. Also, the restoring force (springback) caused by bending in the bent portion BE can be reduced. As a result, misalignment of the head chip 54-1 and the head chip 54-2 can be reduced.

[0074] From the viewpoint of facilitating the formation of the bent portion BE, it is preferable that the thin portion TH extends in the first direction D1. The thin portion TH may extend continuously along the first direction D1 from the end of the fixing plate 55 in the first direction D1 to the end in the opposite direction of the first direction D1, or may extend intermittently as indicated by the dashed line. The thin portion TH is formed, for example, by providing a groove such as a V-notch on at least one surface of the bent portion BE. Furthermore, the thin portion TH may be provided as necessary or may be omitted.

[0075] Fig. 7 is an explanatory diagram of the liquid jet head 50 according to the first embodiment. For convenience of explanation, Fig. 7 representatively shows the head chips 54-1 and 54-2 and the fixing plate 55 among the components of the liquid jet head 50 when viewed in the Y1 direction.

[0076] As described above, the plurality of head chips 54 are arranged in the second direction D2 with respect to the flow path structure 51. Here, as shown in FIG. 7, when viewed in the first direction D1, the center position Pa-1 of the plurality of nozzles N-1 is the first position P1. When viewed in the first direction D1, the center position Pa-2 of the plurality of nozzles N-2 is the second position P2. The end of the fixing plate 55 in the second direction D2 is located at the third position P3.

[0077] Let the distance between the first position P1 and the second position P2 in the third direction D3, which is orthogonal to both the first direction D1 and the second direction D2, be L1, the distance between the first position P1 and the third position P3 in the second direction D2 be L2, and the distance between the second position P2 and the third position P3 in the second direction D2 be L3. When viewed in the first direction D1, let the angle formed by the straight line extending in the second direction D2 and the first half-line LH1 be θ1, and the angle formed by the straight line extending in the second direction D2 and the second half-line LH2 be θ2. Then, L1-(L2×tanθ1+L3×tanθ2)<R is satisfied. In the present embodiment, the third direction D3 is the X2 direction. Each of θ1 and θ2 is an acute angle.

[0078] As shown in FIG. 8 to be described later, when the head chips 54-1 and 54-2 are arranged adjacent to each other in the arrangement direction so as to contact each other, and the nozzle surfaces FN of the head chips 54-1 and 54-2 face the same direction, R is the length of the line segment connecting the center position Pa-1 in the arrangement direction of the plurality of nozzles N-1 and the center position Pa-2 in the arrangement direction of the plurality of nozzles N-2. In FIG. 8, the arrangement direction is the direction along the X axis.

[0079] By satisfying the relationship of L1 - (L2×tanθ1 + L3×tanθ2) < R, the landing time difference between the liquids from the head tips 54-1 and 54-2 can be surely shortened. Here, when the distance between the head tip 54 and the medium M is minimized, the distance between the landing position Pb-1 of the ink from the head tip 54-1 to the medium M and the landing position Pb-2 of the ink from the head tip 54-2 to the medium M is defined as A, and the relationship of A = L1 - (L2×tanθ1 + L3×tanθ2) is satisfied. Therefore, the relationship of A < R is satisfied. The distance A becomes shorter as the distances L2 and L3 become longer. However, it is necessary to satisfy the relationship of L1 > (L2×tanθ1 + L3×tanθ2).

[0080] The first position P1 is, when viewed in the first direction D1, the midpoint of the line segment connecting the nozzle N-1 located at one end and the nozzle N-1 located at the other end in the direction along the first surface F1 and orthogonal to the first direction D1 among the plurality of nozzles N-1, and corresponds to the central position of the nozzle group of the plurality of nozzles N-1. The second position P2 is, when viewed in the first direction D1, the midpoint of the line segment connecting the nozzle N-2 located at one end and the nozzle N-2 located at the other end in the direction along the second surface F2 and orthogonal to the first direction D1 among the plurality of nozzles N-2, and corresponds to the central position of the nozzle group of the plurality of nozzles N-2. When the head tip 54-1 has only one nozzle row in which the plurality of nozzles N-1 are arranged in the direction along the Y axis, the first position P1 corresponds to the central position of any nozzle N-1. This is the same for the second position P2.

[0081] In the example shown in FIG. 7 , when viewed in the first direction D1, the angle α1 formed between the line Lz extending in the second direction D2 and the first surface F1 is equal to the angle α2 formed between the line Lz extending in the second direction D2 and the second surface F2. In other words, when viewed in the first direction D1, the angle formed between the line Lz and the first half-ray LH1 is equal to the angle formed between the line Lz and the second half-ray LH2. This improves the ease of assembly of the liquid jet head 50 compared to an embodiment in which these angles α1 and α2 are different from each other. Furthermore, the distances from the head chip 54-1 and the head chip 54-2 to the medium M can be made uniform. This facilitates adjustment of the position of the liquid from the head chip 54-1 and the head chip 54-2 to the medium M. Note that the angles α1 and α2 may be different from each other.

[0082] 8 is an explanatory diagram of a conventional liquid jet head 50X. The liquid jet head 50X is configured similarly to the liquid jet head 50, except that the jetting direction of the head chips 54-1 and 54-2 is parallel to the Z axis. The liquid jet head 50X includes a fixing plate 55X instead of the fixing plate 55. The fixing plate 55X is configured similarly to the fixing plate 55, except that the fixing plate 55X has a shape that is entirely flat.

[0083] As shown in Figure 8, when head chip 54-1 and head chip 54-2 are arranged adjacent to each other in the alignment direction so that they are in contact with each other and the nozzle surfaces FN of head chip 54-1 and head chip 54-2 are arranged so that they face the same direction, the distance between center positions Pa-1 and Pa-1 in the alignment direction is length R.

[0084] The liquid ejection head 50X satisfies the relationship B = R. Here, B is the distance between the ink landing position Pb-1 from the head chip 54-1 to the medium M and the ink landing position Pb-2 from the head chip 54-2 to the medium M in the arrangement direction. Thus, in the liquid ejection head 50X where the head chips 54-1 and 54-2 are arranged on the same flat plate portion, physically, the distance B cannot be made shorter than the distance R. In practice, since it is not easy to manufacture the liquid ejection head 50X in which the head chips 54-1 and 54-2 are arranged so as to contact each other on the same flat plate portion, in a conventional liquid ejection head in which the head chips 54-1 and 54-2 are arranged on the same flat plate portion, the relationship B > R holds, and it has been difficult to shorten the landing time difference.

[0085] In contrast, in the liquid ejection head 50, by bending the fixed plate, the relationship A < R can be easily satisfied, so that the distance A can be made shorter than that of the liquid ejection head 50X.

[0086] 1-A. Modified Example 1 of the First Embodiment Hereinafter, this modified example will be described. For elements whose operations and functions are the same as those of the first embodiment in the forms exemplified below, the reference numerals used in the description of the first embodiment are reused, and the detailed description of each is appropriately omitted.

[0087] FIG. 9 is a bottom view of the liquid ejection head 50C according to this modified example. The liquid ejection head 50C is configured in the same manner as the liquid ejection head 50 of the first embodiment, except that the number and arrangement of the head chips 54 are different and it has a configuration associated therewith. The liquid ejection head 50C includes a fixed plate 55C instead of the fixed plate 55 of the first embodiment and includes four head chips 54. The fixed plate 55C is configured in the same manner as the fixed plate 55 of the first embodiment, except that the arrangement and number of the exposed openings 55a are different.

[0088] In this modified example, as in the first embodiment, although not shown, at a position facing the liquid jet head 50C, the transport unit 30 transports the medium M in the first direction D1 along a plane perpendicular to the second direction D2, and the movement mechanism 40 reciprocates the liquid jet head 50C along an axis along the third direction D3. That is, this example illustrates an aspect in which the liquid jet head 50C described below is applied to a serial system, in which the Y1 direction corresponds to the first direction D1, the Z2 direction corresponds to the second direction D2, and the X2 direction corresponds to the third direction D3. Although not shown, in this modified example, as in the first embodiment, the first surface F1 and the second surface F2 are oriented in different directions by bending the fixing plate 55, and the angle θ formed between the first surface F1 and the second surface F2 when viewed in the first direction D1 is less than 180 degrees.

[0089] In the fixing plate 55C, the first flat plate portion BD1 is provided with two exposed openings 55a aligned in a direction along the X-axis, and two head chips 54 corresponding to the two exposed openings 55a are fixed to the first fixing surface FF1 with an adhesive or the like. Either of the two exposed openings 55a is an example of a "first exposed opening," and of the two head chips 54, the head chip 54 corresponding to the first exposed opening is an example of a "first head chip."

[0090] Meanwhile, in the fixing plate 55C, the second flat plate portion BD2 is provided with two exposed openings 55a aligned in the direction along the X-axis, and two head chips 54 corresponding to the two exposed openings 55a are fixed to the second fixing surface FF2 with an adhesive or the like. Either of the two exposed openings 55a is an example of a "second exposed opening," and of the two head chips 54, the head chip 54 corresponding to the second exposed opening is an example of a "second head chip."

[0091] In this way, the number of head chips 54 fixed to each of the first flat plate portion BD1 and the second flat plate portion BD2 may be two or more. In this modified example, the multiple nozzles N of each head chip 54 are arranged side by side along the first direction D1. Furthermore, it is preferable that the combination of liquid types used for the head chip 54 fixed to the first flat plate portion BD1 and the head chip 54 fixed to the second flat plate portion BD2 is the same as the combination of liquid types used for the head chip 54-1 and the head chip 54-2 in the first embodiment, i.e., the combination of the first ink and the second ink described above.

[0092] This modification also provides the same effects as the first embodiment.

[0093] 1-B. Modification 2 of the First Embodiment This modified example will be described below. In the following exemplary embodiment, for elements whose actions and functions are similar to those of the first embodiment, the reference numerals used in the description of the first embodiment will be used and detailed description of each element will be omitted as appropriate.

[0094] 10 is a bottom view of a liquid jet head 50D according to this modification. The liquid jet head 50D has the same configuration as the liquid jet head 50 of the first embodiment, except that the number and arrangement of the head chips 54 are different and that the liquid jet head 50D has an associated configuration. The liquid jet head 50D includes a fixing plate 55D instead of the fixing plate 55 of the first embodiment, and includes four head chips 54. The fixing plate 55D has the same configuration as the fixing plate 55 of the first embodiment, except that the arrangement and number of the exposure openings 55a are different.

[0095] Although not shown, at a position facing the liquid jet head 50D, the transport unit 30 transports the medium M in the first direction D1 along a plane perpendicular to the second direction D2. The movement mechanism 40 then reciprocates the liquid jet head 50D along an axis along the third direction D3. That is, this modification illustrates an aspect in which the liquid jet head 50D, which will be described later, is applied to a serial system, in which the Y1 direction corresponds to the first direction D1, the Z2 direction corresponds to the second direction D2, and the X2 direction corresponds to the third direction D3. Although not shown, in this modification, as in the first embodiment, the first surface F1 and the second surface F2 are oriented in different directions by bending the fixing plate 55D, and the angle θ formed between the first surface F1 and the second surface F2 when viewed in the first direction D1 is less than 180 degrees.

[0096] In the fixing plate 55D, the first flat plate portion BD1 is provided with two exposed openings 55a aligned in the direction along the Y axis, and two head chips 54-1 and 54-3 corresponding to the two exposed openings 55a are fixed to the first fixing surface FF1 with an adhesive or the like. Either of the two exposed openings 55a is an example of a "first exposed opening," and of the two head chips 54-1 and 54-3, the head chip 54 corresponding to the first exposed opening is an example of a "first head chip."

[0097] Meanwhile, in the fixing plate 55D, the second flat plate portion BD2 is provided with two exposed openings 55a aligned in the direction along the Y axis, and two head chips 54-2 and 54-4 corresponding to the two exposed openings 55a are fixed to the second fixing surface FF2 with an adhesive or the like. Either of the two exposed openings 55a is an example of a "second exposed opening," and of the two head chips 54-2 and 54-4, the head chip 54 corresponding to the second exposed opening is an example of a "second head chip."

[0098] 10, in this modification, the multiple nozzles N of each head chip 54 are arranged side by side along the first direction D1. The four head chips 54-1, 54-2, 54-3, and 54-4 are arranged in a staggered pattern in the Y2 direction in this order. Two adjacent head chips 54 of the four head chips 54, for example, head chip 54-1 and head chip 54-2, are arranged so that a portion of the nozzle row of head chip 54-1 and a portion of the nozzle row of head chip 54-2 overlap each other when viewed in the direction along the X axis. In such an arrangement of the head chips 54, if the same type of ink is used for the head chips 54-1 and 54-3 fixed to the first flat plate portion BD1 and the head chips 54-2 and 54-4 fixed to the second flat plate portion BD2, the effective printing width in the direction along the Y axis that can be printed on the medium M can be increased when the liquid ejection head 50D is scanned once in the X1 or X2 direction by the movement mechanism 40.

[0099] In this modified example, as described above, by bending the fixed plate 55D, the landing position of the ink ejected from the head chips 54-1 and 54-2 can be brought closer to the landing position of the same ink ejected from the head chips 54-2 and 54-4, which has the advantage that, as with the first embodiment, medium transport errors are less likely to affect print quality. Furthermore, even if the gap between adjacent head chips 54 in the direction along the X-axis is narrowed, as in the first embodiment, there is an advantage that the head chips 54 can be easily grasped when aligning the head chips 54 on the fixing plate 55D after bending the fixing plate 55D.

[0100] 1-C. Modification 3 of the First Embodiment This modified example will be described below. In the following exemplary embodiment, for elements whose actions and functions are similar to those of the first embodiment, the reference numerals used in the description of the first embodiment will be used and detailed description of each element will be omitted as appropriate.

[0101] 11 is a bottom view of a liquid jet head 50E according to this modification. The liquid jet head 50E is configured similarly to the liquid jet head 50 of the first embodiment, except that the number and arrangement of the head chips 54 are different and that the liquid jet head 50E has an associated configuration. The liquid jet head 50E includes a fixing plate 55E instead of the fixing plate 55 of the first embodiment, and includes eight head chips 54. The fixing plate 55E is configured similarly to the fixing plate 55 of the first embodiment, except that the arrangement and number of exposure openings 55a are different.

[0102] Although not shown, at a position facing the liquid jet head 50E, the transport unit 30 transports the medium M in the first direction D1 along a plane perpendicular to the second direction D2. The movement mechanism 40 then reciprocates the liquid jet head 50E along an axis along the third direction D3. That is, this modification illustrates an aspect in which the liquid jet head 50E, which will be described later, is applied to a serial system, in which the Y1 direction corresponds to the first direction D1, the Z2 direction corresponds to the second direction D2, and the X2 direction corresponds to the third direction D3. Although not shown, in this modification, as in the first embodiment, the first surface F1 and the second surface F2 are oriented in different directions by bending the fixing plate 55E, and the angle θ formed between the first surface F1 and the second surface F2 when viewed in the first direction D1 is less than 180 degrees.

[0103] In the fixing plate 55E, the first flat plate portion BD1 is provided with four exposed openings 55a arranged in a staggered pattern in the directions along the X-axis and Y-axis, and four head chips 54 corresponding to the four exposed openings 55a are fixed to the first fixing surface FF1 with an adhesive or the like. Any of the four exposed openings 55a is an example of a "first exposed opening," and of the four head chips 54, the head chip 54 corresponding to the first exposed opening is an example of a "first head chip."

[0104] Meanwhile, in the fixing plate 55E, the second flat plate portion BD2 is provided with four exposed openings 55a arranged in a staggered pattern in the directions along the X-axis and Y-axis, and four head chips 54 corresponding to the four exposed openings 55a are fixed to the second fixing surface FF2 with an adhesive or the like. Any of the four exposed openings 55a is an example of a "second exposed opening," and of the four head chips 54, the head chip 54 corresponding to the second exposed opening is an example of a "second head chip."

[0105] In this modified example, the multiple nozzles N of each head chip 54 are arranged side by side along the first direction D1. Also, as shown in Fig. 11, the layout of the four head chips 54 arranged on each of the first flat plate portion BD1 and the second flat plate portion BD2 is substantially the same as the layout of the four head chips 54 arranged on the fixing plate 55D described in Modification 2 of the first embodiment. In this arrangement of the head chips 54, it is preferable that the combination of liquid types used for the head chips 54 fixed to the first flat plate portion BD1 and the head chips 54 fixed to the second flat plate portion BD2 be the same as the combination of liquid types used for the head chips 54-1 and 54-2 of the first embodiment, i.e., the combination of the first ink and the second ink described above.

[0106] This modified example having the above configuration can achieve the same effects as the first embodiment.

[0107] 1-D. Modification 4 of the First Embodiment This modified example will be described below. In the following exemplary embodiment, for elements whose actions and functions are similar to those of the first embodiment, the reference numerals used in the description of the first embodiment will be used and detailed description of each element will be omitted as appropriate.

[0108] 12 is a schematic cross-sectional view of a liquid jet head 50G according to this modification. The liquid jet head 50G has the same configuration as the liquid jet head 50 of the first embodiment, except that it includes a holder 53G instead of the holder 53 and a fixing plate 55G instead of the fixing plate 55.

[0109] Although not shown, at a position facing the liquid jet head 50G, the transport unit 30 transports the medium M in the first direction D1 along a plane perpendicular to the second direction D2. The movement mechanism 40 then reciprocates the liquid jet head 50G along an axis along the third direction D3. In other words, this modified example illustrates an aspect in which the liquid jet head 50G, which will be described later, is applied to a serial system, and the Y1 direction corresponds to the first direction D1, the Z2 direction corresponds to the second direction D2, and the X2 direction corresponds to the third direction D3.

[0110] The holder 53G is configured similarly to the holder 53 of the first embodiment, except that it has recesses 53a1 and 53a2 instead of the recess 53a, thereby adding a surface FH5, and has surfaces FH6 and FH7 instead of the surfaces FH3 and FH4.

[0111] Holder 53G has outer peripheral wall 53w and partition 53s that define recesses 53a1 and 53a2. Head chip 54-1 is accommodated in recess 53a1. Head chip 54-2 is accommodated in recess 53a2. Surface FH5 is a surface provided on partition 53s between recesses 53a1 and 53a2 and is a flat surface facing the Z2 direction. Surface FH6 is a surface provided in the X2 direction relative to the opening of recess 53a1 and is a flat surface facing the Z2 direction. Surface FH7 is a surface provided in the X1 direction relative to the opening of recess 53a2 and is a flat surface facing the Z2 direction. Surface FH1, which is the bottom surface of recess 53a1, is a surface perpendicular to the Z2 direction and is non-parallel to the top surface on which inlet HL of head chip 54-1 is provided. Surface FH2, which is the bottom surface of recess 53a2, is a surface perpendicular to the Z2 direction and is non-parallel to the top surface on which inlet HL of head chip 54-2 is provided. Therefore, by providing flow path pipes 53h1 and 53h2 of different lengths protruding in the Z2 direction from surfaces FH1 and FH2, respectively, in holder 53G, it is possible to easily connect the flow path between flow path pipes 53h1 and 53h2 and inlet HL. Note that flow path pipes 53h1 and 53h2 may be provided in head chip 54 instead of holder 53.

[0112] The fixed plate 55G has a flat plate portion BDa and bent portions BEa and BEb instead of the bent portion BE, and is configured similarly to the fixed plate 55 of the first embodiment except for the addition of flat plate portions BDb and BDc and bent portions BEc and BEd.

[0113] Here, the first plate portion BD1 is adjacent to the plate portion BDa via a bent portion BEa, which is a bent portion, and adjacent to the plate portion BDb via a bent portion BEc, which is a bent portion, while the second plate portion BD2 is adjacent to the plate portion BDa via a bent portion BEb, which is a bent portion, and adjacent to the plate portion BDc via a bent portion BEd, which is a bent portion.

[0114] The flat plate portion BDa is a part of the fixing plate 55G and is a flat portion to which the head chip 54 is not fixed. The flat plate portion BDa faces in a direction different from both the first surface F1 and the second surface F2 and connects the first flat plate portion BD1 and the second flat plate portion BD2. This allows the bending angle at each of the bending portions BEa and BEb to be smaller than when the first flat plate portion BD1 and the second flat plate portion BD2 are connected only via the bending portion BE as in the first embodiment, thereby reducing springback. Furthermore, by fixing the surface FH5 of the partition portion 53s of the holder 53G to the flat plate portion BDa, deformation of the fixing plate 55G can be reduced. Furthermore, instead of the partition portion 53s, a sensing element such as a temperature sensor can be arranged on the surface of the flat plate portion BDa facing in the direction opposite to the second direction D2. In addition, in order to miniaturize the liquid ejection head 50G and reduce the difference in landing time of the liquid from the head chip 54-1 and the head chip 54-2, it is preferable that the length in the third direction D3 of the flat plate portion BDa to which the head chip 54 is not fixed be shorter than the length in the third direction D3 of each of the first flat plate portion BD1 and the second flat plate portion BD2.

[0115] Each of flat plate portions BDb and BDc extends along a plane perpendicular to second direction D2, is part of fixing plate 55G, and is a flat portion to which head chips 54 are not fixed. Flat plate portion BDb is disposed in the X2 direction, which is an example of third direction D3, relative to the plurality of head chips 54. Flat plate portion BDc is disposed in the X1 direction relative to the plurality of head chips 54. This improves ease of assembly, as surfaces FH6 and FH7, which are tip surfaces of outer peripheral wall portion 53w of holder 53G, are surfaces perpendicular to second direction D2.

[0116] The above-described present modification also provides the same effects as the first embodiment.

[0117] 2. Second embodiment A second embodiment of the present disclosure will be described below. In the following exemplary embodiment, for elements whose actions and functions are similar to those of the first embodiment, the reference numerals used in the description of the first embodiment will be used, and detailed descriptions of each element will be omitted as appropriate.

[0118] 13 is a schematic diagram of a liquid ejection device 100A according to this embodiment. The liquid ejection device 100A is a line-type device, and is configured similarly to the liquid ejection head 50 of the first embodiment, except that the movement mechanism 40 is omitted and a liquid ejection head 50A is provided instead of the liquid ejection head 50. However, in the liquid ejection device 100A, the transport direction DM of the medium M by the transport unit 30 is the X2 direction, and the width direction of the medium M is along the Y axis.

[0119] Fig. 14 is a bottom view of a liquid jet head 50A according to this embodiment. Fig. 15 is an explanatory diagram of the liquid jet head 50A according to this embodiment. The liquid jet head 50A has the same configuration as the liquid jet head 50 of the first embodiment, except that the number and arrangement of the head chips 54 are different so that the multiple nozzles N are distributed across the entire width of the medium M, and the liquid jet head 50A has a configuration associated with this. The liquid jet head 50A includes a fixing plate 55A instead of the fixing plate 55 of the first embodiment, and includes head chips 54-1 to 54-4 as the head chips 54. Note that Fig. 15 omits the configuration of the liquid jet head 50A other than the fixing plate 55A and the head chips 54.

[0120] In this embodiment, at a position facing the liquid jet head 50A, the transport unit 30 transports the medium M in the first direction D1 along a plane perpendicular to the second direction D2. That is, this illustrates an example of an aspect in which the liquid jet head 50A is applied to a line system, in which the X2 direction corresponds to the first direction D1, the Z2 direction corresponds to the second direction D2, and the Y1 direction corresponds to the third direction D3.

[0121] The fixed plate 55A is configured in the same manner as the fixed plate 55 of the first embodiment, except that the arrangement and number of the exposure openings 55a are different. However, in this embodiment, the intersection line LC is parallel to the X-axis.

[0122] In fixing plate 55A, first flat plate portion BD1 is provided with exposure openings 55a-1 and 55a-3, and head chips 54-1 and 54-3 are fixed to first fixing surface FF1 with an adhesive or the like. Meanwhile, in fixing plate 55A, second flat plate portion BD2 is provided with exposure openings 55a-2 and 55a-4, and head chips 54-2 and 54-4 are fixed to second fixing surface FF2 with an adhesive or the like.

[0123] As shown in FIG. 14, the exposure opening 55a-1 exposes a plurality of nozzles N-1, which are nozzles N as an example of "first nozzles," to the outside. The exposure opening 55a-2 exposes a plurality of nozzles N-2, which are nozzles N as an example of "second nozzles." The exposure opening 55a-3 exposes a plurality of nozzles N-3, which are nozzles N, to the outside. The exposure opening 55a-4 exposes a plurality of nozzles N-4, which are nozzles N, to the outside.

[0124] In this embodiment, the same type of ink is ejected from head chip 54-1 and head chip 54-2, and the same type of ink is ejected from head chip 54-3 and head chip 54-4. For example, in the case where magenta ink is ejected from head chip 54-1 and head chip 54-2 and cyan ink is ejected from head chip 54-3 and head chip 54-4, the liquid ejection head 50A can be a line head that supports multiple colors.

[0125] The type of ink ejected from head chip 54-1 and head chip 54-2 may be the same as the type of ink ejected from head chip 54-3 and head chip 54-4. In this case, the nozzle row of head chip 54-1 and the nozzle row of head chip 54-2 may be arranged so as to be offset by half the pitch of the nozzles N constituting the nozzle row, and the nozzles of head chip 54-3 and head chip 54-4 may be arranged in a similar manner to improve resolution. Furthermore, the ink ejected from at least one of head chip 54-1 and head chip 54-3 may be the same type as the ink ejected from at least one of head chip 54-2 and head chip 54-4.

[0126] In this embodiment, exposed opening 55a-1 and exposed opening 55a-2 are aligned in this order in the Y1 direction. Also, head chip 54-1 and head chip 54-2 are aligned in this order in the Y1 direction. Here, when viewed in the direction opposite to second direction D2, multiple nozzles N-1 are aligned along third direction D3, and multiple nozzles N-2 are aligned along third direction D3.

[0127] Similarly, exposure opening 55a-3 and exposure opening 55a-4 are aligned in this order in the Y1 direction. Furthermore, head chip 54-3 and head chip 54-4 are aligned in this order in the Y1 direction. Here, when viewed in the direction opposite to second direction D2, multiple nozzles N-3 are aligned along third direction D3, and multiple nozzles N-4 are aligned along third direction D3.

[0128] 14, exposure opening 55a-1 and exposure opening 55a-3 are aligned in this order in the X1 direction. Therefore, head chip 54-1 and head chip 54-3 are aligned in this order in the X1 direction. Similarly, exposure opening 55a-2 and exposure opening 55a-4 are aligned in this order in the X1 direction. Therefore, head chip 54-2 and head chip 54-4 are aligned in this order in the X1 direction.

[0129] 15, when viewed in the first direction D1, the angle θ formed between the first surface F1 and the second surface F2 is less than 180 degrees. This allows the landing positions of the liquid from head tip 54-1 and the liquid from head tip 54-2 to be closer to each other. Similarly, the landing positions of the liquid from head tip 54-3 and the liquid from head tip 54-4 to be closer to each other.

[0130] The arrows in Fig. 15 schematically show the trajectory of ink ejected from each nozzle N of each head chip 54 until it lands on the medium M. In the example shown in Fig. 15, at the joint between the landing area of ​​the liquid from head chip 54-1 and the landing area of ​​the liquid from head chip 54-2, there is an overlapping area where a part of the landing area of ​​the liquid from head chip 54-1 (the end of the landing area in the Y1 direction) and a part of the landing area of ​​the liquid from head chip 54-2 (the end of the landing area in the Y2 direction) overlap. Similarly, a part of the landing area of ​​the liquid from head chip 54-3 (the end of the landing area in the Y1 direction) and a part of the landing area of ​​the liquid from head chip 54-4 (the end of the landing area in the Y2 direction) overlap each other. 16, the effective printing width of the liquid jet head 50A as a line head can be increased by simply aligning the head chips 54-1 and 54-2 in the direction along the Y axis without shifting the head chips 54-1 to 54-4 relative to each other in the direction along the X axis, and by providing an overlapping region, it is possible to suppress deterioration in printing quality at the joint portions described above. As a result, the size of the liquid jet head 50A in the direction along the X axis can be reduced.

[0131] 16 is an explanatory diagram of a conventional liquid jet head 50Y. The liquid jet head 50Y is configured similarly to the liquid jet head 50A, except that the jetting direction of the head chips 54-1 to 54-4 is parallel to the Z axis and the arrangement of the head chips 54-1 to 54-4 is different. The liquid jet head 50Y includes a fixed plate 55Y instead of the fixed plate 55A. The fixed plate 55Y is configured similarly to the fixed plate 55A, except that the arrangement of the exposed openings 55a-1 to 55a-4 is different and the fixed plate 55Y has a shape that follows a plane as a whole.

[0132] In the liquid jet head 50Y, the entire fixed plate 55Y has a shape that follows a plane, and therefore the jetting directions of the head chips 54-1 to 54-4 are parallel to the Z axis. Therefore, in order to overlap a portion of the landing area of ​​the liquid from the head chip 54-1 and a portion of the landing area of ​​the liquid from the head chip 54-2 with respect to the medium M, the head chips 54-1 and 54-2 need to be arranged so as to be offset from each other in the direction along the X axis, as shown in FIG. 16 . Similarly, the head chips 54-3 and 54-4 need to be arranged so as to be offset from each other in the direction along the X axis. In this manner, in a configuration in which the head chips 54-1 to 54-4 are offset from each other in the direction along the X axis, the size of the liquid jet head 50Y in the direction along the Y axis increases.

[0133] In contrast, as described above, in the liquid jet head 50A, there is no need to shift the head chips 54-1 to 54-4 relative to each other in the direction along the X axis, and therefore the size of the liquid jet head 50A in the direction along the X axis can be made smaller than that of the liquid jet head 50Y.

[0134] Furthermore, in liquid ejection head 50Y, when droplets ejected from head tip 54-1 and droplets ejected from head tip 54-2 are intended to land on medium M at the same position in the direction along the X axis on medium M, head tip 54-1 and head tip 54-2 are arranged offset in the X axis direction, so the landing timing of those droplets on medium M is different. When the landing timings are different, there is a risk that the impact of landing position deviation will occur depending on the transport precision.

[0135] In contrast, with the liquid jet head 50A, as described above, there is no need to shift the head chips 54-1 and 54-2 from each other in the direction along the X axis, so that the landing timing can be made the same, improving print quality. The same is true for the head chips 54-3 and 54-4.

[0136] 14, in the liquid jet head 50A, the distance between the group of head chips 54-1 and 54-2 and the group of head chips 54-3 and 54-4 in the first direction D1 can be set smaller than the dimension of the head chips 54 in the first direction D1. This also makes it possible to improve the printing quality.

[0137] Furthermore, in liquid jet head 50A, even if head chip 54-1 and head chip 54-2 are brought closer to each other in third direction D3 to ensure the above-mentioned overlapping region, because fixing plate 55A is bent, head chip 54-1 and head chip 54-2 can be arranged with a gap between them in the upper part opposite to nozzle surface FN of head chip 54. Therefore, by gripping both end portions in the y-axis direction, which is the longitudinal direction of head chip 54, head chips 54-1 and 54-2 can be aligned to bent fixing plate 55A.

[0138] 2-A. Modification of the second embodiment Modifications of the second embodiment of the present disclosure will be described below. In the following examples, elements whose actions and functions are similar to those of the second embodiment will be designated by the same reference numerals as those used in the description of the second embodiment, and detailed descriptions of each element will be omitted where appropriate.

[0139] FIG. 17 is a bottom view of a liquid jet head 50B according to this modified example. FIG. 18 is an explanatory diagram of the liquid jet head 50B according to this modified example. Note that FIG. 18 omits illustration of the configuration of the liquid jet head 50B other than the fixing plate 55B and the head chips 54. The liquid jet head 50B has the same configuration as the liquid jet head 50 of the second embodiment, except that the number and arrangement of the head chips 54 are different and the liquid jet head 50B has the corresponding configuration. The liquid jet head 50B includes a fixing plate 55B instead of the fixing plate 55A of the second embodiment, and also includes head chips 54-1 to 54-3. The head chip 54-1 is an example of a "first head chip," and the head chip 54-2 is an example of a "second head chip." The head chip 54-3 is an example of a "third head chip," and includes a plurality of nozzles N-3, which are an example of a "third nozzle."

[0140] As in the second embodiment, at a position facing the liquid jet head 50B, the transport unit 30 transports the medium M in the first direction D1 along a plane perpendicular to the second direction D2. That is, this illustrates an example of an aspect in which the liquid jet head 50B is applied to a line method such that the transport direction DM of the medium M by the transport unit 30 is the X2 direction and the width direction of the medium M is along the Y axis, where the X2 direction corresponds to the first direction D1, the Z2 direction corresponds to the second direction D2, and the Y1 direction corresponds to the third direction D3.

[0141] The fixed plate 55B is configured similarly to the fixed plate 55A of the second embodiment, except that the arrangement and number of the exposure openings 55a are different.

[0142] The fixing plate 55B includes a first flat plate portion BD1, a second flat plate portion BD2, and a third flat plate portion BD3. The first flat plate portion BD1 and the second flat plate portion BD2 are connected via the third flat plate portion BD3. That is, in the third direction D3, the third flat plate portion BD3 is disposed between the first flat plate portion BD1 and the second flat plate portion BD2.

[0143] The third flat plate portion BD3 is a part of the fixed plate 55B and is a plate-like portion including the third fixed surface FF3, the third surface F3, and the exposure opening 55a-3. The exposure opening 55a-3 is an example of the “third exposure opening.”

[0144] The head chip 54-3 is fixed to the third fixing surface FF3 with an adhesive or the like. The third surface F3 is the surface opposite to the third fixing surface FF3. In the example shown in Fig. 18, the third surface F3 is a surface perpendicular to the second direction D2. The exposure opening 55a-3 exposes the multiple nozzles N-3 to the outside.

[0145] Here, exposure opening 55a-1, exposure opening 55a-3, and exposure opening 55a-2 are aligned in this order in the Y1 direction, i.e., third direction D3, and head chip 54-1, head chip 54-3, and head chip 54-2 are aligned in this order in the Y1 direction, i.e., third direction D3.

[0146] By bending fixing plate 55B, third surface F3 faces a different direction from first surface F1 and second surface F2. As viewed in first direction D1, angle θa between third surface F3 and first surface F1 and angle θb between third surface F3 and second surface F2 are both less than 180 degrees. In other words, as viewed in first direction D1, a third ray extending from third surface F3 in a direction perpendicular to third surface F3 intersects with both a first ray extending from first surface F1 in a direction perpendicular to first surface F1 and a second ray extending from second surface F2 in a direction perpendicular to second surface F2. This allows the landing positions of liquid from head chip 54-1 and head chip 54-3 to be closer to each other, and the landing positions of liquid from head chip 54-2 and head chip 54-3 to be closer to each other. Specifically, at the joint between the landing area of ​​the liquid from head tip 54-1 and the landing area of ​​the liquid from head tip 54-2, there is an overlapping area where a portion of the landing area of ​​the liquid from head tip 54-1 (the end of the landing area in the Y1 direction) and a portion of the landing area of ​​the liquid from head tip 54-2 (the end of the landing area in the Y2 direction) overlap. At the joint between the landing area of ​​the liquid from head tip 54-3 and the landing area of ​​the liquid from head tip 54-2, there is an overlapping area where a portion of the landing area of ​​the liquid from head tip 54-3 (the end of the landing area in the Y1 direction) and a portion of the landing area of ​​the liquid from head tip 54-2 (the end of the landing area in the Y2 direction) overlap. As a result, the relationship between head tip 54-1 and head tip 54-3 and the relationship between head tip 54-2 and head tip 54-3 can each achieve the same effects as the relationship between head tip 54-1 and head tip 54-2 in the second embodiment. Furthermore, by providing three flat plate portions to which head chips 54 are fixed and arranging these flat plate portions so that they face in different directions, it is possible to make the effective printing width of the line head longer than in Embodiment 2. Note that the number of flat plate portions to which head chips 54 are fixed may be four or more.

[0147] Here, the fixing plate 55 includes bending portions BE1 and BE2. The bending portion BE1 is a portion bent between the first flat plate portion BD1 and the third flat plate portion BD3. The first flat plate portion BD1 and the third flat plate portion BD3 are adjacent to each other via the bending portion BE1. The bending portion BE2 is a portion bent between the second flat plate portion BD2 and the third flat plate portion BD3. The second flat plate portion BD2 and the third flat plate portion BD3 are adjacent to each other via the bending portion BE2. Note that each of the bending portions BE1 and BE2 may be provided with a thin portion TH, similar to the bending portion BE in the first embodiment.

[0148] Each of the angles θa and θb is preferably in the same range as the angle θ in the first embodiment.

[0149] In this modification, the first plane F1 and the second plane F2 do not intersect because the fixing plate 55B has the third flat plate portion BD3 between the first flat plate portion BD1 and the second flat plate portion BD2. In such a case, as shown in Fig. 18, the intersection line LC between the first plane F1 and the second plane F2 may be interpreted as corresponding to the intersection line between an imaginary plane parallel to the first plane F1 and an imaginary plane parallel to the second plane F2.

[0150] 3. Variations The above-described exemplary embodiments can be modified in various ways. Specific modified embodiments that can be applied to the above-described embodiments are exemplified below. Two or more embodiments arbitrarily selected from the following examples can be combined as appropriate within the scope of not mutually contradictory.

[0151] 3-1. Variation 1 In the above-described embodiment, a liquid ejection device including one of the liquid ejection heads 50, 50A, 50B, 50C, 50D, 50E, and 50G is exemplified, but the present invention is not limited to this embodiment, and the liquid ejection device may include a plurality of the liquid ejection heads 50, 50A, 50B, 50C, 50D, 50E, and 50G. In addition, two or more of the liquid ejection heads 50, 50A, 50B, 50C, 50D, 50E, and 50G may be combined.

[0152] 3-2. Variation 2 In the above-described embodiments, the number, arrangement, orientation, etc. of the head chips 54 of the liquid jet heads 50, 50A, 50B, 50C, 50D, 50E, and 50G are merely examples and may be changed as appropriate within the scope of the effects of the present disclosure.

[0153] 3-3. Variation 3 In the first embodiment and its respective modified examples, the liquid jet heads 50, 50C, 50D, 50E, and 50G may be applied to the line system described in the second embodiment. In this case, at a position facing the liquid jet heads 50, 50C, 50D, 50E, and 50G, the transport unit 30 transports the medium M in the third direction D3 along a plane perpendicular to the second direction D2. That is, the liquid jet heads 50, 50C, 50D, 50E, and 50G may be applied to the line system so that the transport direction DM of the medium M by the transport unit 30 is the X2 direction and the width direction of the medium M is along the Y axis, with the Y1 direction corresponding to the first direction D1, the Z2 direction corresponding to the second direction D2, and the X2 direction corresponding to the third direction D3. This also achieves the same effects as the first embodiment and its respective modified examples. Note that the combination of liquid types ejected from each head chip 54 may be the same as those described in the first embodiment and its respective modified examples.

[0154] 3-4. Variation 4 The first embodiment and each of its variants may be configured, as in the variant of the second embodiment, to have three or more flat plate portions to which the head chip 54 is fixed, and the flat plate portions may be arranged so that they face in different directions from each other.

[0155] 3-5. Variation 5 In the second embodiment and its modified example, the liquid jet heads 50A and 50B may be applied to the serial system described in the first embodiment. At a position facing the liquid jet heads 50A and 50B, the transport unit 30 transports the medium M in the third direction D3 along a plane perpendicular to the second direction D2. The movement mechanism 40 may be applied to the liquid jet heads 50A and 50B in a line system so as to reciprocate the liquid jet heads 50A and 50B along an axis along the first direction D1, where the X2 direction corresponds to the first direction D1, the Z2 direction corresponds to the second direction D2, and the Y1 direction corresponds to the third direction D3. This also allows the liquid jet heads 50A and 50B to be printed in a single scan without increasing their size in the main scanning direction of the movement mechanism 40. This increases the effective print width that the liquid jet heads 50A and 50B can print in a single scan, achieving the same effects as the second embodiment and its modified example. The combination of types of liquids to be ejected from each head chip 54 may be the same as those described in the second embodiment and its modified examples.

[0156] 3-6. Variation 6 The liquid ejection apparatus exemplified in the above-described embodiment can be employed in various devices such as facsimile machines and copiers, in addition to devices dedicated to printing. However, the uses of the liquid ejection apparatus are not limited to printing. For example, a liquid ejection apparatus that ejects a solution of a coloring material is used as a manufacturing apparatus for forming color filters for display devices such as liquid crystal display panels. Furthermore, a liquid ejection apparatus that ejects a solution of a conductive material is used as a manufacturing apparatus for forming wiring and electrodes on a wiring board. Furthermore, a liquid ejection apparatus that ejects a solution of an organic substance related to a living body is used as a manufacturing apparatus for manufacturing biochips, for example.

[0157] 4. Notes A summary of this disclosure is provided below.

[0158] (Supplementary Note 1) A first aspect, which is a preferred example of the liquid ejecting head of the present disclosure, comprises a plurality of head chips including a first head chip having a plurality of first nozzles for ejecting liquid and a second head chip having a plurality of second nozzles for ejecting liquid; a first exposed opening that exposes the plurality of first nozzles to the outside; and a second exposed opening that exposes the plurality of second nozzles to the outside, and a fixing plate to which the plurality of head chips are fixed, wherein the fixing plate includes a first flat plate portion including a first fixing surface to which the first head chip is fixed and a first surface opposite to the first fixing surface, and a second flat plate portion including a second fixing surface to which the second head chip is fixed and a second surface opposite to the second fixing surface, wherein the first surface and the second surface face in different directions by bending the fixing plate, and an angle formed by the first surface and the second surface is less than 180 degrees when viewed in a first direction along an intersection line between the first surface and the second surface.

[0159] (Appendix 2) In the second aspect, which is a preferred example of the first aspect, the fixing plate includes a bent portion bent between the first flat plate portion and the second flat plate portion, and the first flat plate portion and the second flat plate portion are adjacent to each other via the bent portion.

[0160] (Appendix 3) In a third aspect, which is a preferred example of the first or second aspect, a flow path structure is provided which includes one or more flow paths communicating with each of the flow paths of the plurality of head chips and is formed by stacking a plurality of substrates in a second direction, and when viewed in the first direction, the angle between a straight line extending in the second direction and the first surface is equal to the angle between a straight line extending in the second direction and the second surface.

[0161] (Appendix 4) In a fourth aspect, which is a preferred example of any of the first to third aspects, the fixing plate includes a bent portion bent between the first flat plate portion and the second flat plate portion, and the bent portion has a thin portion that is thinner than the first flat plate portion.

[0162] (Appendix 5) In a fifth aspect which is a preferred example of any of the first to fourth aspects, the plurality of head chips include a third head chip having a plurality of third nozzles for ejecting liquid, and the fixing plate includes a third fixing surface to which the third head chip is fixed, a third surface opposite the third fixing surface, and a third flat plate portion including a third exposed opening for exposing the plurality of third nozzles to the outside, and the third surface faces in a direction different from the first surface and the second surface by bending the fixing plate, and when viewed in the first direction, the angle formed between the third surface and the first surface and the angle formed between the third surface and the second surface are each less than 180 degrees.

[0163] (Appendix 6) In the sixth aspect, which is a preferred example of the fifth aspect, a flow path structure is provided which includes one or more flow paths connected to each flow path of the plurality of head chips and is formed by stacking a plurality of substrates in a second direction, and in a third direction perpendicular to both the first direction and the second direction, the third flat plate portion is arranged between the first flat plate portion and the second flat plate portion, and the third surface is a surface perpendicular to the second direction.

[0164] (Appendix 7) In the seventh aspect, which is a preferred example of any of the first to fourth aspects, the fixing plate includes a flat plate portion to which the head chip is not fixed, and the flat plate portion faces in a direction different from both the first surface and the second surface, and connects the first flat plate portion and the second flat plate portion.

[0165] (Appendix 8) In the eighth aspect, which is a preferred example of any of the first to seventh aspects, a flow path structure is provided which includes one or more flow paths communicating with each flow path of the plurality of head chips and is formed by stacking a plurality of substrates in a second direction, and the fixed plate includes a flat plate portion to which the head chips are not fixed, and the flat plate portion extends along a plane perpendicular to the second direction and is arranged in a third direction perpendicular to both the first direction and the second direction relative to the plurality of head chips.

[0166] (Supplementary Note 9) In a ninth aspect that is a suitable example of the liquid jet head of the present disclosure, the liquid jet head includes a plurality of head chips including a first head chip having a plurality of first nozzles that eject liquid and a second head chip having a plurality of second nozzles that eject liquid, a first exposure opening that exposes the plurality of first nozzles to the outside, and a second exposure opening that exposes the plurality of second nozzles to the outside, and a fixing plate to which the plurality of head chips are fixed, wherein the fixing plate is and a first flat plate portion including a first fixing surface to which the second head chip is fixed and a first surface opposite to the first fixing surface, and a second flat plate portion including a second fixing surface to which the second head chip is fixed and a second surface opposite to the second fixing surface, wherein the first surface and the second surface are oriented in different directions by bending the fixing plate, and when viewed in a first direction along an intersection line between the first surface and the second surface, a first half-ray extending from the first surface in a direction perpendicular to the first surface and a second half-ray extending from the second surface in a direction perpendicular to the second surface intersect.

[0167] (Supplementary Note 10) In the 10th aspect which is a preferred example of the 9th aspect, it includes one or a plurality of flow paths communicating with each flow path of the plurality of head chips, and is provided with a flow path structure formed by laminating a plurality of substrates in the second direction. The fixing plate includes a bent portion bent between the first flat portion and the second flat portion. The first flat portion and the second flat portion are adjacent to each other through the bent portion. The plurality of head chips are arranged in the second direction with respect to the flow path structure. When viewed in the first direction, the center positions of the plurality of first nozzles are at a first position, and when viewed in the first direction, the center positions of the plurality of second nozzles are at a second position. The end in the second direction of the fixing plate is located at a third position. The distance between the first position and the second position in the third direction orthogonal to both the first direction and the second direction is defined as L1, the distance between the first position and the third position in the second direction is defined as L2, and the distance between the second position and the third position in the second direction is defined as L3. When viewed in the first direction, the angle formed by the straight line extending in the second direction and the first half line is defined as θ1, and when viewed in the first direction, the angle formed by the straight line extending in the second direction and the second half line is defined as θ2. When the first head chip and the second head chip are arranged adjacent to each other in the alignment direction so as to be in contact with each other, and the nozzle surfaces of the first head chip and the second head chip face the same direction, when the length of the line segment connecting the center position in the alignment direction of the plurality of first nozzles and the center position in the alignment direction of the plurality of second nozzles is defined as R, L1 - (L2 × tanθ1 + L3 × tanθ2) < R is satisfied.

[0168] (Supplementary Note 11) In the 11th aspect which is a preferred example of any one of the 1st to 10th aspects, the plurality of first nozzles are arranged side by side along the first direction, and the plurality of second nozzles are arranged side by side along the first direction.

[0169] (Appendix 12) A twelfth aspect, which is a preferred example of the liquid ejection device of the present disclosure, comprises the liquid ejection head of the eleventh aspect and a transport unit that transports a medium onto which liquid ejected from the liquid ejection head lands, wherein the liquid ejection head includes one or more flow paths that communicate with each of the flow paths of the plurality of head chips and has a flow path structure formed by stacking a plurality of substrates in a second direction, and at a position facing the liquid ejection head, the transport unit transports the medium in a third direction that is perpendicular to the first direction and the second direction, along a surface perpendicular to the second direction.

[0170] (Appendix 13) A twelfth aspect, which is a preferred example of a liquid ejection device of the present disclosure, comprises the liquid ejection head of the eleventh aspect and a transport unit that transports a medium onto which liquid ejected from the liquid ejection head lands, wherein the liquid ejection head includes one or more flow paths that communicate with each of the flow paths of the plurality of head chips and has a flow path structure formed by stacking a plurality of substrates in a second direction, and at a position facing the liquid ejection head, the transport unit transports the medium in the first direction along a plane perpendicular to the second direction.

[0171] (Appendix 14) In the 14th aspect, which is a preferred example of any of the 1st to 11th aspects, a flow path structure is provided which includes one or more flow paths connected to each flow path of the plurality of head chips and is formed by stacking a plurality of substrates in a second direction, wherein the plurality of first nozzles are arranged side by side along a third direction perpendicular to both the first direction and the second direction, and the plurality of second nozzles are arranged side by side along the third direction.

[0172] (Appendix 15) A fifteenth aspect, which is a preferred example of the liquid ejection device of the present disclosure, comprises the liquid ejection head of the fourteenth aspect and a transport unit that transports a medium onto which liquid ejected from the liquid ejection head lands, and at a position facing the liquid ejection head, the transport unit transports the medium in the first direction along a plane perpendicular to the second direction.

[0173] (Appendix 16) A sixteenth aspect, which is a preferred example of the liquid ejection device of the present disclosure, comprises the liquid ejection head of the fourteenth aspect and a transport unit that transports a medium onto which liquid ejected from the liquid ejection head lands, and at a position facing the liquid ejection head, the transport unit transports the medium in the third direction along a plane perpendicular to the second direction.

[0174] (Appendix 17) A seventeenth aspect, which is a suitable example of a liquid ejection device of the present disclosure, comprises a liquid ejection head according to any one of the first to tenth aspects, and a transport unit that transports a medium onto which liquid ejected from the liquid ejection head lands.

[0175] (Appendix 18) In the 18th aspect, which is a preferred example of the 17th aspect, the liquid jet head includes one or more flow paths that communicate with each flow path of the plurality of head chips, and is provided with a flow path structure formed by stacking a plurality of substrates in a second direction, and at a position facing the liquid jet head, the transport unit transports the medium along a plane perpendicular to the second direction. [Explanation of symbols]

[0176] 30…Transfer section, 50…Liquid jet head, 50A, 50B…, 50C, 50D, 50E, 50G, 50X, 50Y…Liquid jet head, 51…Flow path structure, 54…Head tap, 55, 55A, 55B, 55C, 55D, 55E, 55G, 55X, 55Y…Fixed plate, 55…Exposed opening, 100, 100A…Liquid jet device, A…Distance, BD1…First plate section, BD2…Second plate section, BD3…Third plate section, BDa…Plate section, BDb…Plate section, BDc…Plate section, BE…Bend section, BE1…Bend section, BE2…Bend section, BEa…Bend section, BEb… Bend, BEc… bend, BEd… bend, D1… first direction, D2… second direction, D3… third direction, F1… first face, F2… second face, F3… third face, FF1… first fixed face, FF2… second fixed face, FF3… third fixed face, L1… distance, L2… distance, L3… distance, LC… intersection line, LH1… first half line, LH2… second half line, Lz… line, N… nozul, P1… first position, P2… second position, P3… third position, Pa-1… center position, Pa-2… center position, R… distance, TH… thin flesh, α1… angle, α2… angle, θ… angle, θa… angle, θb… angle.

Claims

1. a plurality of head chips including a first head chip having a plurality of first nozzles for ejecting liquid and a second head chip having a plurality of second nozzles for ejecting liquid; a fixing plate including a first exposure opening that exposes the plurality of first nozzles to the outside and a second exposure opening that exposes the plurality of second nozzles to the outside, the fixing plate having the plurality of head chips fixed thereto; Equipped with The fixing plate is a first flat plate portion including a first fixing surface to which the first head chip is fixed and a first surface opposite to the first fixing surface; a second flat plate portion including a second fixing surface to which the second head chip is fixed and a second surface opposite to the second fixing surface, the first surface and the second surface are oriented in different directions by bending the fixing plate; When viewed in a first direction along an intersection line between the first surface and the second surface, the angle formed between the first surface and the second surface is less than 180 degrees. A liquid jet head characterized by:

2. the fixing plate includes a bent portion bent between the first flat plate portion and the second flat plate portion, The first flat plate portion and the second flat plate portion are adjacent to each other via the bent portion. The liquid jet head according to claim 1 .

3. a flow path structure including one or more flow paths communicating with each of the flow paths of the plurality of head chips, the flow path structure being configured by stacking a plurality of substrates in a second direction; When viewed in the first direction, an angle formed between a line extending in the second direction and the first surface is equal to an angle formed between a line extending in the second direction and the second surface. The liquid jet head according to claim 1 .

4. the fixing plate includes a bent portion bent between the first flat plate portion and the second flat plate portion, The bent portion has a thin portion that is thinner than the first flat plate portion. The liquid jet head according to claim 1 .

5. the plurality of head chips includes a third head chip having a plurality of third nozzles that eject liquid, the fixing plate includes a third fixing surface to which the third head chip is fixed, a third surface opposite to the third fixing surface, and a third flat plate portion including a third exposure opening portion that exposes the plurality of third nozzles to the outside, the third surface faces a direction different from the first surface and the second surface by bending the fixing plate; When viewed in the first direction, each of an angle formed between the third surface and the first surface and an angle formed between the third surface and the second surface is less than 180 degrees. The liquid jet head according to claim 1 .

6. a flow path structure including one or more flow paths communicating with each of the flow paths of the plurality of head chips, the flow path structure being configured by stacking a plurality of substrates in a second direction; In a third direction perpendicular to both the first direction and the second direction, the third flat plate portion is disposed between the first flat plate portion and the second flat plate portion, The third surface is a surface perpendicular to the second direction. The liquid jet head according to claim 5 .

7. the fixing plate includes a flat plate portion to which the head chip is not fixed, the flat plate portion faces a direction different from both the first surface and the second surface and connects the first flat plate portion and the second flat plate portion; The liquid jet head according to claim 1 .

8. a flow path structure including one or more flow paths communicating with each of the flow paths of the plurality of head chips, the flow path structure being configured by stacking a plurality of substrates in a second direction; the fixing plate includes a flat plate portion to which the head chip is not fixed, the flat plate portion extends along a plane perpendicular to the second direction and is disposed in a third direction perpendicular to both the first direction and the second direction with respect to the plurality of head chips; The liquid jet head according to claim 1 .

9. a plurality of head chips including a first head chip having a plurality of first nozzles for ejecting liquid and a second head chip having a plurality of second nozzles for ejecting liquid; a fixing plate including a first exposure opening that exposes the plurality of first nozzles to the outside and a second exposure opening that exposes the plurality of second nozzles to the outside, the fixing plate having the plurality of head chips fixed thereto; Equipped with The fixing plate is a first flat plate portion including a first fixing surface to which the first head chip is fixed and a first surface opposite to the first fixing surface; a second flat plate portion including a second fixing surface to which the second head chip is fixed and a second surface opposite to the second fixing surface, the first surface and the second surface are oriented in different directions by bending the fixing plate; When viewed in a first direction along an intersection line between the first surface and the second surface, a first ray extending from the first surface in a direction perpendicular to the first surface and a second ray extending from the second surface in a direction perpendicular to the second surface intersect with each other. A liquid jet head characterized by:

10. a flow path structure including one or more flow paths communicating with each of the flow paths of the plurality of head chips, the flow path structure being configured by stacking a plurality of substrates in a second direction; the fixing plate includes a bent portion bent between the first flat plate portion and the second flat plate portion, the first flat plate portion and the second flat plate portion are adjacent to each other via the bent portion, the plurality of head chips are arranged in the second direction with respect to the flow path structure, a central position of the plurality of first nozzles as viewed in the first direction is a first position; a central position of the plurality of second nozzles as viewed in the first direction is a second position; the end of the fixing plate in the second direction is located at a third position; a distance between the first position and the second position in a third direction perpendicular to both the first direction and the second direction is defined as L1; a distance between the first position and the third position in the second direction is L2; a distance between the second position and the third position in the second direction is L3; When viewed in the first direction, an angle formed between a line extending in the second direction and the first half-line is defined as θ1, When viewed in the first direction, an angle formed between a line extending in the second direction and the second half-line is defined as θ2, When the first head chip and the second head chip are arranged adjacent to each other in the arrangement direction so as to be in contact with each other, and the nozzle surfaces of the first head chip and the second head chip are arranged facing the same direction, and the length of a line segment connecting a center position of the plurality of first nozzles in the arrangement direction and a center position of the plurality of second nozzles in the arrangement direction is R, L1-(L2×tan θ1+L3×tan θ2)<R is satisfied. The liquid jet head according to claim 9 .

11. the plurality of first nozzles are arranged side by side along the first direction, The plurality of second nozzles are arranged side by side along the first direction. The liquid jet head according to claim 1 .

12. The liquid jet head according to claim 11, a conveying unit that conveys a medium onto which the liquid ejected from the liquid ejection head lands; Equipped with the liquid jet head includes one or more flow paths communicating with the respective flow paths of the plurality of head chips, and includes a flow path structure configured by stacking a plurality of substrates in a second direction; At a position facing the liquid ejection head, the transport unit transports the medium in a third direction perpendicular to the first direction and the second direction along a plane perpendicular to the second direction. A liquid ejection device characterized by:

13. The liquid jet head according to claim 11, a conveying unit that conveys a medium onto which the liquid ejected from the liquid ejection head lands; Equipped with the liquid jet head includes one or more flow paths communicating with the respective flow paths of the plurality of head chips, and includes a flow path structure configured by stacking a plurality of substrates in a second direction; At a position facing the liquid ejection head, the transport unit transports the medium in the first direction along a plane perpendicular to the second direction. A liquid ejection device characterized by:

14. a flow path structure including one or more flow paths communicating with each of the flow paths of the plurality of head chips, the flow path structure being configured by stacking a plurality of substrates in a second direction; the plurality of first nozzles are arranged side by side along a third direction perpendicular to both the first direction and the second direction, The plurality of second nozzles are arranged side by side along the third direction. The liquid jet head according to claim 1 .

15. The liquid jet head according to claim 14, a conveying unit that conveys a medium onto which the liquid ejected from the liquid ejection head lands; Equipped with At a position facing the liquid ejection head, the transport unit transports the medium in the first direction along a plane perpendicular to the second direction. A liquid ejection device characterized by:

16. The liquid jet head according to claim 14, a conveying unit that conveys a medium onto which the liquid ejected from the liquid ejection head lands; Equipped with At a position facing the liquid ejection head, the transport unit transports the medium in the third direction along a plane perpendicular to the second direction. A liquid ejection device characterized by:

17. A liquid jet head according to any one of claims 1 to 10; a conveying unit that conveys a medium onto which the liquid ejected from the liquid ejection head lands; A liquid ejection device comprising:

18. the liquid jet head includes one or more flow paths communicating with the respective flow paths of the plurality of head chips, and includes a flow path structure configured by stacking a plurality of substrates in a second direction; At a position facing the liquid ejection head, the transport unit transports the medium along a plane perpendicular to the second direction.

18. The liquid ejection apparatus according to claim 17.

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