Grinding apparatus

Abstract

To supply processing water to a fixed water landing point without adjusting an angle of a processing water nozzle even when a desired flow rate of the processing water changes.SOLUTION: In the processing water nozzle 60, the second pipe 62 merges with the jet port 65 of the first pipe 61 at an acute angle. Therefore, the flow rate and the jet angle of the processing water jetted from the jet port 65 can be adjusted by adjusting the flow rate (first flow rate) of the processing water in the first pipe 61 and the flow rate (second flow rate) of the processing water in the second pipe 62. The registration unit registers, for each desired flow rate, the first flow rate and the second flow rate for causing the processing water at the desired flow rate to land on the predetermined water landing point, and the control unit adjusts the first flow rate and the second flow rate based on the first flow rate and the second flow rate. Therefore, even when the desired flow rate of the processing water jetted from the jet port 65 changes, the processing water can be supplied to a fixed water landing point without adjusting the angle of the processing water nozzle 60.SELECTED DRAWING: Figure 2

Description

[Technical Field]

[0001] The present invention relates to a grinding device. [Background technology]

[0002] In a grinding device that uses a grinding wheel to grind a plate-shaped workpiece to make it thinner, processing water is supplied to the processing point where the workpiece and the grinding wheel come into contact, which has a cooling effect that improves grinding performance and washes away grinding chips generated during grinding (see Patent Document 1). [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Japanese Patent Application Laid-Open No. 2024-67243 Summary of the Invention [Problem to be solved by the invention]

[0004] The optimal flow rate of processing water varies depending on the processing conditions. For this reason, the flow rate of processing water is changed as needed depending on the processing conditions. However, since the position where the processing water hits the workpiece changes as the flow rate changes, workers have to adjust the angle of the processing water nozzle every time the flow rate is changed.

[0005] Therefore, an object of the present invention is to supply processing water to a constant water landing point without adjusting the angle of the processing water nozzle even if the desired flow rate of the processing water changes. [Means for solving the problem]

[0006] The first grinding apparatus of the present invention is a grinding apparatus comprising at least a holding table for holding a workpiece, a grinding unit having a spindle on which a grinding wheel having a plurality of grinding stones arranged in a ring is mounted, a processing water nozzle for supplying processing water at a desired flow rate so that the water lands at a predetermined water landing point where the grinding stone and the workpiece come into contact, and a control unit, wherein the processing water nozzle comprises a first pipe through which the processing water flows and having an injection port at its tip for injecting the processing water, and a control unit for adjusting a first flow rate which is the flow rate of the processing water introduced into the first pipe from a water source. the control unit is characterized by comprising a first flow rate adjustment section for adjusting a second flow rate, which is the flow rate of the processing water introduced into the second pipe from a water source, a second pipe through which the processing water flows and whose tip joins the nozzle at an acute angle, and a registration section for registering the first flow rate and the second flow rate for causing the processing water at the desired flow rate to land at the predetermined water landing point, and a control section for controlling the first flow rate adjustment section and the second flow rate adjustment section based on the first flow rate and the second flow rate corresponding to the desired flow rate registered in the registration section.

[0007] In the first grinding device, the control unit may further include a calculation unit that calculates the first flow rate and the second flow rate for landing the desired flow rate of machining water at the predetermined landing point, and the registration unit may be configured to register the first flow rate and the second flow rate calculated by the calculation unit.

[0008] The second grinding apparatus of the present invention is a grinding apparatus comprising at least a holding table for holding a workpiece, a grinding unit having a spindle on which a grinding wheel having a plurality of grinding stones arranged in a ring is mounted, a processing water nozzle for supplying processing water at a desired flow rate so that the water lands at a predetermined water landing point where the grinding stone and the workpiece come into contact, and a control unit, wherein the processing water nozzle comprises a first pipe through which the processing water flows and having an injection port at its tip for injecting the processing water, and a first flow rate control unit for controlling the flow rate of the processing water introduced into the first pipe from a water source. a second pipe through which the processing water flows and whose tip joins the nozzle at an acute angle; and a second flow rate adjustment unit that adjusts a second flow rate, which is the flow rate of the processing water introduced from a water source into the second pipe, and the control unit is characterized by comprising a calculation unit that calculates the first flow rate and the second flow rate for landing the processing water at the desired flow rate at the predetermined landing point, and a control unit that controls the first flow rate adjustment unit and the second flow rate adjustment unit based on the first flow rate and the second flow rate calculated by the calculation unit. [Effects of the Invention]

[0009] In the present invention, the second pipe joins the nozzle of the first pipe at an acute angle, so that the flow rate and spray angle of the processing water sprayed from the nozzle of the first pipe can be adjusted by adjusting the flow rate of the processing water in the first pipe (first flow rate) and the flow rate of the processing water in the second pipe (second flow rate).

[0010] Furthermore, the control unit's control section acquires the first and second flow rates for landing the processing water at a desired flow rate on a predetermined landing point, and controls the first and second flow rate adjustment sections based on these. Therefore, even if the flow rate (desired flow rate) of processing water sprayed from the nozzle changes, it is possible to supply processing water to a constant landing point without adjusting the angle of the processing water nozzle. [Brief explanation of the drawings]

[0011] [Figure 1] FIG. 2 is a perspective view showing the configuration of a grinding device. [Figure 2]FIG. 2 is a perspective view showing the configuration of a processing water nozzle. [Figure 3] FIG. [Figure 4] FIG. 10 is an explanatory diagram showing a correspondence table. DETAILED DESCRIPTION OF THE INVENTION

[0012] As shown in Fig. 1, the grinding apparatus 1 according to this embodiment is an apparatus for grinding a wafer 100 as a workpiece. The wafer 100 is, for example, a semiconductor wafer. A front surface 101 of the wafer 100, which faces downward in Fig. 1, holds multiple devices and is protected by, for example, the attachment of a protective tape (not shown). A back surface 102 of the wafer 100 is the grinding surface on which the grinding process is performed.

[0013] The grinding device 1 includes a rectangular parallelepiped base 10 and a column 11 extending upward.

[0014] An opening 13 is provided on the upper surface side of the base 10. Inside the opening 13, a holding table 20 for holding the wafer 100 is disposed.

[0015] The holding table 20 has a substantially disk-shaped frame 23, and a holding portion 21 made of a porous material is provided in a recess provided in the frame 23. The upper surface of the holding portion 21 serves as a holding surface 22 that holds the wafer 100 by suction. The holding surface 22 is connected to a suction source (not shown), thereby holding the wafer 100 by suction. That is, the holding table 20 holds the wafer 100 by means of the holding surface 22. Furthermore, a frame surface 24, which is the upper surface of the frame 23, is formed to be flush with the holding surface 22.

[0016] In addition, a table rotation mechanism 25 that rotates and drives the holding table 20 is provided below the holding table 20. This driving member allows the holding table 20, with the wafer 100 held by the holding surface 22, to rotate about a rotation axis that passes through the center of the holding surface 22 and extends in the Z-axis direction.

[0017] A cover plate 27 is provided around the holding table 20, and moves in the Y-axis direction together with the holding table 20. A bellows cover 12 that expands and contracts in the Y-axis direction is connected to the cover plate 27. A table moving mechanism 26 is provided below the holding table 20. The table moving mechanism 26 moves the holding table 20 in the Y-axis direction.

[0018] In this embodiment, the holding table 20 is moved along the Y-axis direction by a Y-axis movement mechanism between a holding position on the -Y-axis side for holding the wafer 100 on the holding surface 22 and a grinding position on the +Y-axis side where the wafer 100 is ground.

[0019] Furthermore, a column 11 is erected on the +Y direction side of the base 10. The column 11 is provided with a grinding unit 70 that grinds the wafer 100 and a grinding feed mechanism 30.

[0020] The grinding feed mechanism 30 is configured to move the grinding unit 70 in the Z-axis direction relative to the holding table 20.

[0021] The grinding feed mechanism 30 includes a pair of Z-axis guide rails 31 parallel to the Z-axis direction, a Z-axis moving table 33 that slides on the Z-axis guide rails 31, a Z-axis ball screw 32 parallel to the Z-axis guide rails 31, a Z-axis motor 34, and a holder 36 attached to the Z-axis moving table 33. The holder 36 supports the grinding unit 70.

[0022] The Z-axis moving table 33 is slidably installed on the Z-axis guide rail 31. A nut portion (not shown) is fixed to the Z-axis moving table 33. A Z-axis ball screw 32 is threadedly engaged with this nut portion. The Z-axis motor 34 is connected to one end of the Z-axis ball screw 32.

[0023] In the grinding feed mechanism 30, the Z-axis motor 34 rotates the Z-axis ball screw 32, causing the Z-axis moving table 33 to move in the Z-axis direction along the Z-axis guide rail 31. As a result, the holder 36 attached to the Z-axis moving table 33 and the grinding unit 70 supported by the holder 36 move in the Z-axis direction together with the Z-axis moving table 33.

[0024] The grinding unit 70 grinds the wafer 100 held by suction on the holding surface 22. The grinding unit 70 includes a spindle housing 71 fixed to the holder 36, a spindle 72 rotatably held in the spindle housing 71, a spindle motor 73 that rotates the spindle 72, a wheel mount 74 attached to the lower end of the spindle 72, and a grinding wheel 75 supported by the wheel mount 74.

[0025] The spindle housing 71 is held by the holder 36 so as to extend in the Z-axis direction. The spindle 72 extends in the Z-axis direction so as to be perpendicular to the holding surface 22 of the holding table 20, and is rotatably supported by the spindle housing 71.

[0026] The spindle motor 73 is connected to the upper end side of the spindle 72. The spindle motor 73 rotates the spindle 72 about a rotation axis extending in the Z-axis direction.

[0027] The wheel mount 74 is formed in a disk shape and is fixed to the lower end (tip) of the spindle 72. The wheel mount 74 supports the grinding wheel 75.

[0028] The grinding wheel 75 is formed to have an outer diameter that is approximately the same as the outer diameter of the wheel mount 74. The grinding wheel 75 includes a wheel base 76 formed from a metal material. A plurality of grinding stones 77 arranged in a ring shape are fixed to the underside of the wheel base 76 around the entire circumference. The grinding stones 77 are rotated together with the spindle 72 by the spindle motor 73, and grind the back surface 102 of the wafer 100 held on the holding table 20 with their grinding surface (lower surface).

[0029] Thus, the grinding unit 70 has a spindle 72 on which a grinding wheel 75 having a plurality of grinding stones 77 arranged in a ring shape is mounted, and is configured to grind the wafer 100 held on the holding table 20 by the grinding stones 77 that rotate together with the spindle 72.

[0030] A thickness gauge 55 is disposed at a position adjacent to the holding table 20 on the base 10. The thickness gauge 55 can measure the thickness of the wafer 100 during grinding, for example, by contact. That is, the thickness gauge 55 has a first contactor 56 for contacting the frame surface 24, which is flush with the holding surface 22 of the holding table 20, to measure its height, and a second contactor 57 for contacting the wafer 100 to measure its height.

[0031] The thickness measuring device 55 uses the first contactor 56 and the second contactor 57 to determine the height of the holding surface 22 of the holding table 20 and the height of the wafer 100, and measures the thickness of the wafer 100 based on the difference between these heights. The thickness measuring device 55 may be a non-contact type thickness measuring device.

[0032] Furthermore, a processing water nozzle 60 is attached to the cover plate 27 on the +X direction side of the holding table 20. As shown in Fig. 3, the processing water nozzle 60 is disposed on the cover plate 27 via a pedestal 28 so as to extend toward above the center of the holding surface 22 of the holding table 20. During grinding, the processing water nozzle 60 supplies processing water at a desired flow rate from the outer periphery side of the holding table 20 so that the water lands at a predetermined water landing point (processing point) where the grinding wheel 77 of the grinding unit 70 comes into contact with the wafer 100.

[0033] 1, the grinding apparatus 1 includes a control unit 5 that controls each component of the grinding apparatus 1. The control unit 5 includes a CPU that performs calculations according to a program, a storage medium such as a memory, etc. The control unit 5 controls each component of the grinding apparatus 1 described above to perform grinding processing on the wafer 100. The control unit 5 also includes a control unit 51, a registration unit 52, and a calculation unit 53, which are used to control the flow rate of the processing water in the processing water nozzle 60 when the wafer 100 is ground.

[0034] A method for grinding the wafer 100, including control of the flow rate of the processing water in the processing water nozzle 60, which is controlled by the control unit 5, will be described below. First, we will explain the configuration of the processing water nozzle 60. As shown in Figure 2, the processing water nozzle 60 includes a first pipe 61 and a second pipe 62 through which processing water flows, a housing 66 that supports the first pipe 61 and the second pipe 62, a first flow rate adjuster 63 connected to the first pipe 61, and a second flow rate adjuster 64 connected to the second pipe 62.

[0035] The housing 66 is fixed to the base 28 of the cover plate 27 (see FIG. 3) in a state in which the first pipe 61 and the second pipe 62 are supported. The first pipe 61 is a main flow path having an injection port 65 at its tip for injecting the machining water, and faces obliquely upward so as to extend above the center of the holding surface 22 of the holding table 20 .

[0036] The second pipe 62 is a flow rate adjusting flow path, and is disposed so as to extend in a substantially horizontal direction above the first pipe 61 so that its tip joins the injection port 65 of the first pipe 61 at an acute angle. That is, the tip of the second pipe 62 is connected from above the first pipe 61 slightly closer to the base end than the injection port 65 of the first pipe 61 so that the intersection angle (connection angle) θ between the first pipe 61 and the second pipe 62 is an acute angle.

[0037] Thus, the processing water nozzle 60 comprises a first pipe 61, a second pipe 62 having a tip connected at an acute angle to the tip of the first pipe 61, and an injection port 65 arranged at the tip of the first pipe 61, through which the processing water flowing through the first pipe 61 and the second pipe 62 join and are injected.

[0038] The first flow rate adjustment unit 63 is disposed between and connected to the first pipe 61 and the water source 80. The first flow rate adjustment unit 63 adjusts the first flow rate, which is the flow rate of the processing water introduced from the water source 80 into the first pipe 61, and is made up of a valve in this embodiment.

[0039] The second flow rate adjustment unit 64 is disposed between and connected to the second pipe 62 and the water source 80. The second flow rate adjustment unit 64 adjusts the second flow rate, which is the flow rate of the processing water introduced from the water source 80 into the second pipe 62, and is made up of a valve in this embodiment.

[0040] Next, a method for grinding the wafer 100, including control of the flow rate of the processing water in the processing water nozzle 60, which is controlled by the control unit 5, will be described.

[0041] In grinding the wafer 100, first, an operator or a transfer device (not shown) places the wafer 100 on the holding surface 22 of the holding table 20 with the back surface 102 facing upward, as shown in Fig. 3. Thereafter, the control unit 51 of the control unit 5 connects the suction source to the holding surface 22, thereby holding the wafer 100 by the holding surface 22 (holding step).

[0042] Thereafter, the control section 51 of the control unit 5 uses the table moving mechanism 26 to adjust the position of the holding table 20 in the Y-axis direction, thereby positioning the grinding wheel 77 above the center of the holding surface 22 of the holding table 20 that holds the wafer 100. Then, the control section 51 controls the spindle motor 73 of the grinding unit 70 to rotate the grinding wheel 77 together with the spindle 72 (arrow 301). Furthermore, the control unit 51 controls the table rotation mechanism 25 to rotate the holding table 20 holding the wafer 100 by the holding surface 22 (arrow 302).

[0043] Next, the control unit 51 uses the grinding feed mechanism 30 to lower the grinding unit 70, bringing the rotating grinding wheel 77 into contact with the back surface 102 of the rotating wafer 100 to grind the back surface 102 (grinding step). At this time, the control unit 51 uses a thickness measuring device 55 (see FIG. 1) to measure the thickness of the wafer 100. Then, when the thickness of the wafer 100 reaches a predetermined grinding thickness, the control unit 51 uses the grinding feed mechanism 30 to raise the grinding unit 70, thereby completing the grinding of the wafer 100.

[0044] 3, in the grinding process, the control unit 51 supplies processing water from the processing water nozzle 60 toward the contact point (processing point) between the grinding wheel 77 and the wafer 100, as indicated by the arrow W. At this time, the control unit 5 controls the flow rate of the processing water.

[0045] 2, in the processing water nozzle 60 according to this embodiment, the second pipe 62 extending in a substantially horizontal direction joins the nozzle 65 of the first pipe 61 extending diagonally upward at an acute angle from above. Therefore, by flowing processing water through the second pipe 62, this processing water hits the processing water flowing diagonally upward through the first pipe 61 in a substantially horizontal direction from above. As a result, the spray angle of the processing water sprayed from the nozzle 65 of the first pipe 61 changes to a downward direction compared to when processing water is flowed only through the first pipe 61.

[0046] Therefore, the flow rate and direction of the processing water sprayed from the nozzle 65 can be adjusted by adjusting the flow rate of the processing water in the first pipe 61 and the flow rate of the processing water in the second pipe 62. As a result, even if the flow rate of the processing water sprayed from the nozzle 65 changes, it is possible to supply the processing water to a constant water landing point without adjusting the angle of the processing water nozzle 60.

[0047] For example, if the diameter of the holding table 20 is 300 mm, the distance from the nozzle 65 of the first pipe 61 of the processing water nozzle 60 to the predetermined water landing point, which is the contact point between the grinding wheel 77 and the wafer 100 (the center point of the wafer 100 on the holding table 20), is 260 mm. Therefore, in this case, the processing water nozzle 60 lands the processing water on the center of the wafer 100, which is 260 mm away.

[0048] Meanwhile, the desired flow rate (appropriate total flow rate) of the processing water sprayed from the first pipe 61 varies depending on the type of wafer 100 and / or the type of grinding wheel 77, and is selected from, for example, 1.0, 2.0, 3.0, 4.0, and 5.0 L / min. In these cases, the flow rate (first flow rate) of the first pipe 61 and the flow rate (second flow rate) of the second pipe 62 are set as shown in the correspondence table in Fig. 4. By setting the first flow rate and the second flow rate in this manner, even if the desired flow rate of the processing water sprayed from the processing water nozzle 60 varies between 1.0 and 5.0 L / min, the processing water can be landed at the center of the wafer 100, which is the predetermined landing point.

[0049] The first flow rate and the second flow rate for landing the desired flow rate of processing water at the predetermined landing point are obtained, for example, by a test and / or calculation performed in advance by an operator.

[0050] In this embodiment, the registration section 52 of the control unit 5 registers (stores) the first flow rate and the second flow rate for landing the processing water at the desired flow rate at a predetermined landing point. Furthermore, during the grinding process, when processing water at a desired flow rate is supplied from the processing water nozzle 60 toward the contact point between the grinding wheel 77 and the wafer 100, the control unit 51 of the control unit 5 controls the first flow rate adjustment unit 63, which adjusts the flow rate (first flow rate) of the first pipe 61, and the second flow rate adjustment unit 64, which adjusts the flow rate (second flow rate) of the second pipe 62, based on the first flow rate and second flow rate corresponding to the desired flow rate registered in the registration unit 52.

[0051] As a result, in this embodiment, even if the desired flow rate (total flow rate) of the processing water sprayed from the nozzle 65 of the processing water nozzle 60 changes, the processing water sprayed from the nozzle 65 of the processing water nozzle 60 can be made to land at the center of the wafer 100, which is the designated landing point, without the operator having to adjust the angle of the processing water nozzle 60.

[0052] As described above, in the processing water nozzle 60 according to this embodiment, the second pipe 62 merges at an acute angle with the outlet 65 of the first pipe 61. Therefore, by adjusting the flow rate of the processing water in the first pipe 61 (first flow rate) and the flow rate of the processing water in the second pipe 62 (second flow rate), the flow rate and spray angle of the processing water sprayed from the outlet 65 of the first pipe 61 can be adjusted.

[0053] Furthermore, the registration unit 52 registers (stores) a first flow rate and a second flow rate for landing the processing water at a desired flow rate on a predetermined landing point for each desired flow rate, and the control unit 51 controls the first flow rate adjustment unit 63 and the second flow rate adjustment unit 64 based on these. Therefore, even if the flow rate (desired flow rate) of the processing water sprayed from the spray port 65 changes, it is possible to supply the processing water to a constant landing point without adjusting the angle of the processing water nozzle 60.

[0054] In this embodiment, the first flow rate and the second flow rate for landing the processing water at the desired flow rate on the predetermined landing point, which are registered in the registration section 52 of the control unit 5, are obtained by a prior test and / or calculation by an operator. In this regard, the calculation section 53 of the control unit 5 may calculate the first flow rate and the second flow rate for landing the processing water at the desired flow rate on the predetermined landing point.

[0055] Calculation unit 53 can calculate the landing point of the processing water sprayed from nozzle 65 of processing water nozzle 60 based on, for example, the orientation (angle) and diameter of first pipe 61, the orientation (angle) and diameter of second pipe 62, the flow rate (first flow rate) of first pipe 61, and the flow rate (second flow rate) of second pipe 62. Therefore, when a desired flow rate (total flow rate) of processing water is input by, for example, an operator, calculation unit 53 can determine a combination of the first flow rate and the second flow rate such that the sum of the first flow rate and the second flow rate is the desired flow rate and the processing water lands at a predetermined landing point (the center of wafer 100).

[0056] In this case, the registration unit 52 is configured to register (store) the first flow rate and the second flow rate for landing the machining water at the desired flow rate at a predetermined landing point, which are calculated by the calculation unit 53. Then, during grinding, the control unit 51 controls the first flow rate adjustment unit 63 and the second flow rate adjustment unit 64 based on the first flow rate and the second flow rate corresponding to the desired flow rate registered in the registration unit 52.

[0057] In such control, it is preferable that, before the grinding process, the calculation unit 53 calculates the first flow rate and the second flow rate for landing the desired flow rate of processing water at the predetermined landing point, and that the registration unit 52 registers (stores) the calculated first flow rate and second flow rate.

[0058] Furthermore, in this embodiment, the control unit 51 controls the first flow rate adjustment unit 63 and the second flow rate adjustment unit 64 based on the first flow rate and the second flow rate corresponding to the desired flow rate registered in the registration unit 52. In this regard, the control unit 51 may control the first flow rate adjustment unit 63 and the second flow rate adjustment unit 64 based on the first flow rate and the second flow rate corresponding to the desired flow rate calculated by the calculation unit 53. In this case, the control unit 51 can directly handle the first flow rate and the second flow rate calculated by the calculation unit 53 without going through the registration unit 52. Therefore, the control unit 5 does not need to include the registration unit 52.

[0059] In this case, the calculation unit 53 is configured to calculate, for example, the first flow rate and the second flow rate for landing the desired flow rate of machining water at a predetermined landing point every time grinding is performed (for example, at the start of the grinding process). [Explanation of symbols]

[0060] 1: Grinding device, 5: Control unit, 10: Base, 11: Column, 12: Bellows cover, 13: opening, 20: holding table, 21: holding portion, 22: holding surface, 23: frame body, 24: Frame surface, 25: Table rotation mechanism, 26: Table movement mechanism, 27: Cover plate, 28: Base, 30: Grinding feed mechanism, 31: Z-axis guide rail, 32: Z-axis ball screw, 33: Z-axis moving table, 34: Z-axis motor, 36: holder, 51: control unit, 52: Registration unit, 53: Calculation unit, 55: Thickness measuring device, 56: First contactor, 57: Second contactor, 60: Processing water nozzle, 61: First pipe, 62: Second pipe, 63: First flow rate adjustment unit, 64: second flow rate adjusting unit, 65: injection port, 66: housing, 70: grinding unit, 71: spindle housing, 72: spindle, 73: spindle motor, 74: wheel mount, 75: grinding wheel, 76: Wheel base, 77: Grinding wheel, 80: Water source, 100: wafer, 101: front surface, 102: back surface, θ: intersection angle

Claims

1. A grinding device comprising at least a holding table for holding a workpiece, a grinding unit having a spindle on which a grinding wheel having a plurality of grinding stones arranged in a ring is mounted, a processing water nozzle for supplying processing water at a desired flow rate so that the water lands at a predetermined water landing point where the grinding stone and the workpiece come into contact, and a control unit, The processing water nozzle is a first pipe through which the processing water flows and having an injection port at a tip thereof for injecting the processing water; a first flow rate adjusting unit that adjusts a first flow rate, which is a flow rate of the processing water introduced from a water source into the first pipe; a second pipe through which the processing water flows and whose tip joins the injection port at an acute angle; a second flow rate adjusting unit that adjusts a second flow rate, which is a flow rate of the processing water introduced from a water source into the second piping; The control unit a registration unit that registers the first flow rate and the second flow rate for landing the processing water at the desired flow rate at the predetermined landing point; a control unit that controls the first flow rate adjustment unit and the second flow rate adjustment unit based on the first flow rate and the second flow rate corresponding to the desired flow rate registered in the registration unit, A grinding device characterized by:

2. The control unit a calculation unit that calculates the first flow rate and the second flow rate for causing the processing water to land at the predetermined water landing point at the desired flow rate; The registration unit is configured to register the first flow rate and the second flow rate calculated by the calculation unit. The grinding device according to claim 1 .

3. A grinding device comprising at least a holding table for holding a workpiece, a grinding unit having a spindle on which a grinding wheel having a plurality of grinding stones arranged in a ring is mounted, a processing water nozzle for supplying processing water at a desired flow rate so that the water lands at a predetermined water landing point where the grinding stone and the workpiece come into contact, and a control unit, The processing water nozzle is a first pipe through which the processing water flows and having an injection port at a tip thereof for injecting the processing water; a first flow rate adjusting unit that adjusts a first flow rate, which is a flow rate of the processing water introduced from a water source into the first pipe; a second pipe through which the processing water flows and whose tip joins the injection port at an acute angle; a second flow rate adjusting unit that adjusts a second flow rate, which is a flow rate of the processing water introduced from a water source into the second piping; The control unit a calculation unit that calculates the first flow rate and the second flow rate for causing the processing water at the desired flow rate to land at the predetermined water landing point; a control unit that controls the first flow rate adjustment unit and the second flow rate adjustment unit based on the first flow rate and the second flow rate calculated by the calculation unit, A grinding device characterized by:

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