Component mounting apparatus and method of cleaning optical sensor in component mounting apparatus

Abstract

To provide a component mounting device and a cleaning method of an optical sensor in the component mounting device capable of easily cleaning the optical sensor without preparing to discharge all substrates on a production line.SOLUTION: A component mounting device provided with a conveyor 12 for conveying and positioning a substrate, a mounting head for moving to the substrate positioned by the conveyor 12 and mounting a component on the substrate, and an optical sensor 50 for detecting the substrate conveyed by the conveyor 12 is removably mounted on the mounting head and provided with a cleaning tool 70 for removing foreign matter adhering to the optical sensor 50 in a state of being moved by the mounting head so as to approach the optical sensor 50. The cleaner 70 includes an air ejection port 72, and ejects positive-pressure air P2 from the air ejection port 72 toward the optical sensor 50 to blow off and remove foreign matter adhering to the optical sensor 50.SELECTED DRAWING: Figure 10

Description

[Technical Field]

[0001] The present disclosure relates to a component mounting device that uses an optical sensor to detect and position a board transported by a conveyor, and mounts components sucked by a nozzle onto the positioned board, and a method for cleaning the optical sensor in the component mounting device. [Background technology]

[0002] The component mounting device is equipped with a conveyor that transports and positions boards, and a mounting head that mounts components onto the boards positioned by the conveyor. The mounting head is equipped with a detachable nozzle that generates suction at the bottom of the nozzle to pick up the components. Positive pressure air can also be supplied to the bottom of the nozzle, and when mounting a component on the board, the positive pressure air generates blow pressure to ensure the component is released from the bottom of the nozzle.

[0003] In a component mounting device configured as described above, the conveyor is equipped with an optical sensor that detects the position of the board being transported, and is used for controlling the positioning of the board, etc. The optical sensor has a light-emitting unit that emits inspection light and a light-receiving unit that receives the inspection light, and the position of the board is detected based on whether the light-receiving unit receives the inspection light that has been blocked by (or reflected from) the board.

[0004] In the optical sensor, whether the light-receiving unit is receiving the inspection light is determined by the amount of light received by the light-receiving unit. Therefore, if foreign matter such as dirt or dust adheres to the optical sensor, the amount of inspection light emitted and received by the optical sensor decreases, causing false detection. For this reason, workers have traditionally had to manually clean the optical sensor (light-emitting unit and light-receiving unit) periodically. Meanwhile, devices that automatically clean optical sensors have also been devised, and Patent Document 1 below discloses a board-type cleaning tool that cleans an optical sensor while it is being transported on a conveyor like a board. [Prior art documents] [Patent documents]

[0005] [Patent Document 1] Japanese Patent Application Laid-Open No. 2012-204448 Summary of the Invention [Problem to be solved by the invention]

[0006] However, with the above-mentioned board-type cleaning jig, it was not possible to clean the optical sensor while production was being carried out by the component mounting device, i.e., while a board was placed on one of the conveyors on the production line, because the cleaning jig could not be transported. This posed the problem that cleaning the optical sensor required extensive preparation, in which all boards on the production line were removed each time.

[0007] Therefore, the present disclosure aims to provide a component mounting device and a method for cleaning an optical sensor in a component mounting device that can easily clean an optical sensor without prior preparation such as removing all boards from the production line. [Means for solving the problem]

[0008] The component mounting device of the present disclosure includes a conveyor that transports and positions a board, a mounting head that moves relative to the board positioned by the conveyor and mounts components onto the board, an optical sensor that detects the board being transported by the conveyor, and a foreign matter removal unit that is detachably attached to the mounting head and removes foreign matter adhering to the optical sensor when moved by the mounting head so as to approach the optical sensor.

[0009] The disclosed method for cleaning an optical sensor in a component mounting device includes a conveyor that transports and positions a board, a mounting head that moves relative to the board positioned by the conveyor and mounts components onto the board, and an optical sensor that detects the board transported by the conveyor, and includes a foreign matter removal unit mounting step of mounting a foreign matter removal unit to the mounting head, an approach step of moving the mounting head to bring the foreign matter removal unit close to the optical sensor, and a foreign matter removal step of removing foreign matter adhering to the optical sensor by the foreign matter removal unit that has been brought close to the optical sensor. [Effects of the Invention]

[0010] According to the present disclosure, the optical sensor can be easily cleaned without prior preparation such as removing all the substrates from the production line. [Brief explanation of the drawings]

[0011] [Figure 1] 1 is a perspective view of a component mounting device according to a first embodiment of the present disclosure. [Figure 2] FIG. 2 is a perspective view of a conveyor included in the component mounting device according to the first embodiment of the present disclosure. [Figure 3] FIG. 1 is a plan view of a conveyor according to a first embodiment of the present disclosure. [Figure 4] FIG. 2 is a perspective view of a mounting head included in the component mounting device according to the first embodiment of the present disclosure. [Figure 5] 4 is a diagram showing a path for supplying air to a lower end of a nozzle attached to a shaft member in the component mounting device according to the first embodiment of the present disclosure. FIG. [Figure 6] 1 is a side cross-sectional view of a conveyor according to a first embodiment of the present disclosure. [Figure 7] FIG. 2 is a block diagram showing a control system of the component mounting device according to the first embodiment of the present disclosure. [Figure 8] 1 is a perspective view showing a mounting head provided in a component mounting device according to a first embodiment of the present disclosure together with an air-jet cleaning tool. FIG. [Figure 9]1 is a side view showing a state in which an air-jet cleaning tool is attached to a shaft member included in the component mounting device in accordance with the first embodiment of the present disclosure. [Figure 10] 1 is a perspective view showing a state in which the component mounting device according to the first embodiment of the present disclosure is cleaning an optical sensor with an air-jet cleaning tool. FIG. [Figure 11] FIG. 11 is a perspective view showing a mounting head provided in a component mounting device according to a second embodiment of the present disclosure, together with a brush-type cleaning tool. [Figure 12] FIG. 11 is a perspective view showing a state in which the component mounting device according to the second embodiment of the present disclosure is cleaning an optical sensor with a brush-type cleaning tool. DETAILED DESCRIPTION OF THE INVENTION

[0012] (Embodiment 1) 1 shows a component mounting device 1 according to a first embodiment of the present disclosure. The component mounting device 1 is a device that mounts components BH on a board KB sent from the upstream side and carries it out downstream, and forms a production line together with other printing devices, inspection devices, etc. that are arranged upstream and downstream of the component mounting device 1. For ease of explanation, the transport direction of the board KB in the component mounting device 1 (the left-right direction as seen from the operator OP) is defined as the X direction, the horizontal direction perpendicular to the X direction (the front-back direction as seen from the operator OP) is defined as the Y direction, and the up-down direction is defined as the Z direction.

[0013] In FIG. 1, the component mounting device 1 includes a base 11, a conveyor 12, a plurality of component feeders 13, a mounting head 14, a head moving mechanism 15, and a nozzle changer 16.

[0014] 2 and 3, the conveyor 12 is provided on a base 11. The conveyor 12 is made up of two conveyor units 12U that extend in the X direction on the base 11 and are arranged opposite each other in the Y direction. Each of the two conveyor units 12U includes a conveyor base 21 that extends in the X direction, a plurality of pulleys 22 attached to the conveyor base 21, and an endless belt 23 that is stretched around these pulleys 22.

[0015] 2 and 3, a drive motor 24 is attached to the conveyor base 21. When the drive motor 24 drives the pulley 22, the endless belt 23 runs in the X direction. The two endless belts 23 run while supporting from below two ends of the substrate KB that face each other in the Y direction, thereby transporting the substrate KB in the Y direction (arrow A shown in FIG. 3).

[0016] A plurality of part feeders 13 are provided at the Y-direction end of the base 11. Each part feeder 13 continuously supplies parts BH to a part pick-up position 13T set at the end on the far side (conveyor 12 side) as seen from the operator OP in the Y direction. The part feeder 13 is, for example, a tape feeder that supplies parts by conveying a part supply tape (not shown) that contains a large number of parts BH arranged in a row.

[0017] In Figure 4, the mounting head 14 has multiple (four in this example) shaft members 31 extending downward. A nozzle 32 is attached to the lower end of each shaft member 31 (see also Figure 5). The nozzle 32 has a detachable portion 32a, a cylindrical tubular portion 32b extending downward from the detachable portion 32a, and a flange-like portion 32c positioned between the detachable portion 32a and the tubular portion 32b and widening in the horizontal plane. When the detachable portion 32a is attached to the lower end of the shaft member 31, the nozzle 32 is attached to the shaft member 31.

[0018] 5, an air duct 41 is formed inside each shaft member 31. When the detachable part 32a is attached to the shaft member 31, an internal nozzle duct 42 formed inside the nozzle 32 connects to the air duct 41 inside the shaft member 31.

[0019] 4, a control valve 43 is attached to the mounting head 14. The control valve 43 is connected to each of the air pipes 41 extending to the outside of each shaft member 31.

[0020] 5, the control valve 43 is connected to an air pipe 44 that extends outside the mounting head 14. The air pipe 44 consists of a negative pressure air pipe 44a for supplying negative pressure air and a positive pressure air pipe 44b for supplying positive pressure air. The negative pressure air pipe 44a is connected to a negative pressure source S1 that supplies negative pressure air P1, and the positive pressure air pipe 44b is connected to a positive pressure source S2 that supplies positive pressure air P2.

[0021] 1, the head moving mechanism 15 includes a fixed beam 15a that is provided on the base 11 and extends in the Y direction, and a movable beam 15b that is supported at one end by the fixed beam 15a and extends in the X direction. A mounting head 14 is attached to the movable beam 15b. The movable beam 15b is movable in the Y direction along the fixed beam 15a, and the mounting head 14 is movable along the movable beam 15b. The mounting head 14 can move within a horizontal plane (XY plane) by the movement of the movable beam 15b in the Y direction and the movement of the mounting head 14 itself in the X direction.

[0022] 2 and 3, the conveyor base 21 of each of the two conveyor units 12U is provided with an optical sensor 50 that detects the board KB transported by the endless belt 23. The optical sensor 50 is made up of a light-emitter 51 that is a light-emitter section that emits inspection light 50L and a light-receiver 52 that is a light-receiving section that receives the inspection light 50L. The light-emitter 51 is provided on the conveyor base 21 of one of the two conveyor units 12U, and the light-receiver 52 is provided on the conveyor base 21 of the other of the two conveyor units 12U.

[0023] As shown in Figure 6 (Figure 6 is a cross-sectional view taken along the line VV in Figure 3), sensor holes 21K are provided at opposing positions on each of the two conveyor bases 21 (see also Figures 2 and 3). The light-emitter 51 and the light-receiver 52 are installed in the sensor holes 21K of the corresponding conveyor bases 21, and are positioned facing the opposing surfaces (inner surfaces) of the conveyor bases 21.

[0024] 7, a control unit 60 provided in the component mounting device 1 controls the operations of the conveyor 12, the multiple part feeders 13, the mounting head 14, and the head moving mechanism 15. The control unit 60 controls the operation of the conveyor 12 to transport the board KB and position it at the work position, and controls the operation of each part feeder 13 to supply the component BH to the respective component take-out position 13T.

[0025] The control unit 60 controls the operation of the control valve 43 so that negative pressure air P1 from the negative pressure source S1 is supplied to the air pipe 41 in each shaft member 31, thereby generating a suction force at the lower end of the nozzle 32 attached to that shaft member 31. The control unit 60 also controls the operation of the control valve 43 so that positive pressure air P2 from the positive pressure source S2 is supplied to the air pipe 41 of each shaft member 31, thereby generating a blow pressure at the lower end of the nozzle 32 attached to that shaft member 31.

[0026] The control unit 60 is connected to the optical sensor 50 (light projector 51 and light receiver 52) (see also FIG. 6), and while the light projector 51 projects the inspection light 50L, it monitors the reception status of the inspection light 50L by the light receiver 52 (whether or not the inspection light 50L is being received). When the light receiver 52 receives the inspection light 50L, the control unit 60 determines that the board KB is not positioned to block the inspection light 50L, and when the light receiver 52 is not receiving the inspection light 50L, it determines that the board KB is positioned to block the inspection light 50L.

[0027] 1, the nozzle changer 16 is provided on a base 11. The nozzle changer 16 is provided with a nozzle transfer space in which a replacement nozzle 32 is placed, and a nozzle receiving space in which the nozzle 32 to be replaced (removed from the shaft member 31) is placed.

[0028] When the nozzle 32 attached to the shaft member 31 of the mounting head 14 is to be replaced with a different type of nozzle 32, the control unit 60 moves the mounting head 14 above the nozzle changer 16. Then, the nozzle 32 to be removed is raised and lowered from above the nozzle receiving space, and the nozzle 32 is placed in the nozzle transfer space. After the nozzle 32 has been removed, the shaft member 31 is moved above the nozzle transfer space and raised and lowered. In this way, once the nozzle 32 to be attached is attached to the lower end of the shaft member 31, the nozzle 32 replacement work is completed.

[0029] When the component mounting device 1 configured as described above performs a component mounting operation of mounting components BH on a board KB, the control unit 60 first operates the conveyor 12 to carry in the board KB supplied from outside the component mounting device 1 and position the board KB at a predetermined work position. At this time, the positioning of the board KB is completed when the optical sensor 50 detects that the board KB has reached the predetermined position.

[0030] After positioning the board KB as described above, the control unit 60 operates each part feeder 13 to supply the parts BH to the part pick-up position 13T of each part feeder 13. In parallel with this, the control unit 60 operates the head movement mechanism 15 to move the mounting head 14 back and forth between the part feeder 13 and the board KB.

[0031] The mounting head 14 moves back and forth between the part feeder 13 and the board KB, repeatedly performing a mounting turn consisting of an operation of picking up a component BH supplied by the part feeder 13 and an operation of mounting the picked-up component BH onto the board KB. When the mounting head 14 performs the operation of picking up a component BH, the control unit 60 actuates the control valve 43 to generate a suction force at the bottom end of the nozzle 32, so that the component BH is sucked onto the bottom end of the nozzle 32. When the mounting head 14 performs the operation of mounting the component BH onto the board KB, the control unit 60 actuates the control valve 43 to generate a blow pressure at the bottom end of the nozzle 32, so that the component BH is reliably released from the bottom end of the nozzle 32.

[0032] When all of the components BH to be mounted on the board KB have been mounted by the mounting head 14 repeatedly performing the above mounting turns, the control unit 60 operates the conveyor 12 to transport the board KB out of the component mounting device 1. This completes the component mounting operation for one board KB.

[0033] Next, a description will be given of the cleaning work (method for cleaning the optical sensor 50) of the component mounting device 1 configured as described above. To clean the optical sensor 50, a cleaning tool 70 (air-jet type cleaning tool 70P) serving as a foreign matter removal unit shown in FIG. 8 is used.

[0034] Air jet cleaning tool 70P has an overall shape similar to nozzle 32, and has cleaning tool detachable portion 72a similar to detachable portion 32a of nozzle 32, cleaning tool tubular portion 72b similar to tubular portion 32b, and cleaning tool flange portion 72c similar to flange portion 32c. Air jet cleaning tool 70P can be attached to shaft member 31 by attaching cleaning tool flange portion 72c to the lower end of shaft member 31.

[0035] 9, air jet cleaner 70P has jet air passage 71 extending downward inside, and air outlets 72 connected to jet air passage 71 are provided in the cylindrical side surface of cleaning tool tubular portion 72b. Here, two air outlets 72 are provided, but there may be one, or three or more. If there are multiple air outlets 72, it is preferable that at least two of these air outlets 72 are aligned vertically.

[0036] 9, when air jet cleaning tool 70P is attached to the lower end of shaft member 31, jet air passage 71 is connected to air pipe 41 inside shaft member 31. Therefore, when positive pressure air P2 is supplied from positive pressure air piping 44b into air pipe 41 by operation of control valve 43, positive pressure air P2 is jetted out of air jet cleaning tool 70P (horizontally) from air outlet 72 through jet air passage 71 (FIG. 9).

[0037] When cleaning the optical sensor 50 using the air-jet cleaner 70P, first, the air-jet cleaner 70P is attached to the mounting head 14 (FIG. 8, foreign matter removal unit attachment process). When attaching the air-jet cleaner 70P in place of the nozzle 32 already attached to the shaft member 31, the nozzle 32 is removed before attachment.

[0038] As described above, the overall shape of air jet cleaning tool 70P is similar to that of nozzle 32, and so air jet cleaning tool 70P can be placed on nozzle changer 16. Therefore, when air jet cleaning tool 70P is placed on nozzle changer 16, it is also possible to automatically replace it with nozzle 32 using nozzle changer 16 in the same manner as when replacing nozzle 32 with respect to shaft member 31.

[0039] Once air jet cleaning tool 70P is attached to the lower end of shaft member 31, control unit 60 moves mounting head 14 to bring air jet cleaning tool 70P close to one of light projector 51 and light receiver 52 that make up optical sensor 50 (approaching step). Once air jet cleaning tool 70P has approached optical sensor 50, control unit 60 causes air jet cleaning tool 70P to remove foreign matter such as dirt and dust adhering to optical sensor 50 (foreign matter removing step). Note that this foreign matter removing step is performed when conveyor 12 is not transporting boards KB, for example by stopping the operation of conveyor 12.

[0040] In the foreign matter removal process, specifically, the control unit 60 operates the control valve 43 to allow positive-pressure air P2 from the positive pressure source S2 to reach the air jet passage 71 in the air jet cleaner 70P via the air pipe 41 in the shaft member 31. This causes the positive-pressure air P2 to be jetted from the air jet nozzle 72 of the air jet cleaner 70P toward the optical sensor 50 (FIG. 10), and foreign matter adhering to the optical sensor 50 is blown off and removed by the positive-pressure air P2. At this time, the control unit 60 may also cause the mounting head 14 to reciprocate with a small amplitude in the conveyance direction (X direction) of the substrate KB by the conveyor 12. After cleaning of one of the light projector 51 and the light receiver 52 that constitute the optical sensor 50 (light receiver 52 in FIG. 10) has been completed in this manner, the other (light projector 51) is subsequently cleaned.

[0041] As described above, the component mounting device 1 of the first embodiment is equipped with the cleaning tool 70 as a foreign matter removal unit that is detachably attached to the mounting head 14 and that removes foreign matter adhering to the optical sensor 50 when the mounting head 14 brings the cleaning tool 70 close to the optical sensor 50. The cleaning operation (cleaning method) of the optical sensor 50 in this component mounting device 1 is performed by attaching the cleaning tool 70 to the mounting head 14 (foreign matter removal unit attachment step), moving the mounting head 14 to bring the cleaning tool 70 attached to the mounting head 14 close to the optical sensor 50 (close step), and then removing foreign matter adhering to the optical sensor 50 with the cleaning tool 70 (foreign matter removal step).

[0042] Therefore, in the component mounting device 1 in the first embodiment (the method for cleaning the optical sensor 50 in the component mounting device 1), the optical sensor 50 can be easily cleaned without prior preparation such as removing all of the boards KB on the production line, unlike a conventional board-type cleaning jig that cleans the optical sensor 50 while it is being transported by the conveyor 12. Therefore, while continuing production by the component mounting device 1, the optical sensor 50 can be cleaned by utilizing the short time when the boards KB are not positioned on the conveyor 12, and since there is no need to interrupt production by the component mounting device 1 to clean the optical sensor 50, productivity can be improved and a conventional cleaning jig is not required, which is also cost-effective.

[0043] (Embodiment 2) Next, a second embodiment of the present disclosure will be described. The only difference between the component mounting device 1 in the second embodiment and the component mounting device 1 in the first embodiment is that the cleaning tool 70 is a brush-type cleaning tool 70Q shown in Fig. 11 , and the other configurations are the same as those in the first embodiment.

[0044] Similar to air-jet cleaner 70P in embodiment 1, brush-type cleaner 70Q has cleaning tool attachment / detachment section 72a, cleaning tool tubular section 72b, and cleaning tool flange section 72c. A brush section 73 extending laterally (horizontally) is provided on the cylindrical side surface of cleaning tool tubular section 72b. Similar to air-jet cleaner 70P, brush-type cleaner 70Q can be attached to shaft member 31 by attaching cleaning tool flange section 72c to the lower end of shaft member 31.

[0045] When cleaning the optical sensor 50 using the brush-type cleaning tool 70Q, first, as in the case of the air-jet cleaning tool 70P, the brush-type cleaning tool 70Q is attached to the mounting head 14 (FIG. 11, foreign matter removal unit attachment step). After the brush-type cleaning tool 70Q is attached to the lower end of the shaft member 31, the control unit 60 moves the mounting head 14 to bring the brush-type cleaning tool 70Q close to one of the light projector 51 and the light receiver 52 that make up the optical sensor 50 (closeness step). Then, after bringing the brush-type cleaning tool 70Q close to the optical sensor 50, the control unit 60 uses the brush-type cleaning tool 70Q to remove foreign matter adhering to the optical sensor 50 (foreign matter removal step, FIG. 12).

[0046] In the above-described foreign matter removal process, specifically, the control unit 60 brings the tip of the brush unit 73 into contact with the optical sensor 50, and moves the mounting head 14 back and forth with a small amplitude in the direction (X direction) in which the substrate KB is transported by the conveyor 12 (arrow B shown in FIG. 12). As a result, the brush unit 73 moves relative to the optical sensor 50 while remaining in contact with it, and foreign matter adhering to the optical sensor 50 is brushed off and removed by the brush unit 73. In this way, once cleaning of one of the light-emitter 51 and the light-receiver 52 that make up the optical sensor 50 (light-receiver 52 in FIG. 12) is completed, the other (light-emitter 51) is also cleaned.

[0047] As described above, like the component mounting device 1 in the first embodiment, the component mounting device 1 in the second embodiment is provided with a cleaning tool 70 as a foreign matter removal unit that is detachably attached to the mounting head 14 and that removes foreign matter adhering to the optical sensor 50 when the mounting head 14 brings the cleaning tool 70 close to the optical sensor 50. Also in the second embodiment, the cleaning operation (cleaning method) of the optical sensor 50 is performed by attaching the cleaning tool 70 to the mounting head 14 (foreign matter removal unit attachment step), moving the mounting head 14 to bring the cleaning tool 70 attached to the mounting head 14 close to the optical sensor 50 (close step), and then removing foreign matter adhering to the optical sensor 50 with the cleaning tool 70 (foreign matter removal step). Therefore, the second embodiment can also achieve the same effects as the first embodiment.

[0048] As described above, in the component mounting apparatus 1 according to the first and second embodiments, the cleaning tool 70 serving as a foreign matter removal unit is attached to the mounting head 14, the mounting head 14 is then moved to bring the cleaning tool 70 close to the optical sensor 50, and the cleaning tool 70 removes foreign matter adhering to the optical sensor 50. Therefore, unlike a conventional board-type cleaning jig that cleans the optical sensor 50 while the optical sensor 50 is being transported by the conveyor 12, the optical sensor 50 can be easily cleaned without prior preparation such as removing all of the boards KB from the production line. Therefore, according to the component mounting apparatus 1 (the method for cleaning the optical sensor in the component mounting apparatus 1) according to the first and second embodiments, the optical sensor 50 can be cleaned during the short time when the boards KB are not positioned on the conveyor 12 while the component mounting apparatus 1 continues production. This eliminates the need to interrupt production by the component mounting apparatus 1 to clean the optical sensor 50, thereby improving the productivity of the component mounting apparatus 1.

[0049] While the embodiments of the present disclosure have been described above, the present disclosure is not limited to the above and various modifications are possible. For example, in the above-described first embodiment, air jet cleaner 70P is configured to jet positive pressure air P2 horizontally from air outlet 72, but positive pressure air P2 may be jetted obliquely. In particular, if positive pressure air P2 is jetted obliquely downward, there is an advantage in that the removed foreign matter can be guided directly downward.

[0050] 11 and 12, the brush portion 73 of the brush-type cleaning tool 70Q extends in only one direction from the cleaning tool tubular portion 72b. However, this is merely an example, and the brush portion 73 may extend in multiple directions from the cleaning tool tubular portion 72b, for example, radially in a plan view. In the second embodiment, if the shaft member 31 can be rotated about an axis extending in the Z direction (the Z axis), the brush portion 73 may be repeatedly twisted (or rotated) about the Z axis to clean the optical sensor 50. When the brush portion 73 is twisted (or rotated) to clean the optical sensor 50, cleaning can be completed in a shorter time than when the entire mounting head 14 is moved back and forth over a small distance. Furthermore, the cleaning tool 70 may be configured to include an air outlet 72 and a brush portion 73, thereby functioning as both the air-jet cleaning tool 70P and the brush-type cleaning tool 70Q.

[0051] Furthermore, in the above-described first and second embodiments, the optical sensor 50 is a sensor (a so-called transmission type optical sensor) in which the light-emitting unit (light-emitting device 51) and the light-receiving unit (light-receiving device 52) are installed at separate locations facing each other, and the optical sensor 50 detects the substrate KB based on whether or not the inspection light emitted by the light-emitting unit and received by the light-receiving unit is blocked by the substrate KB. However, the optical sensor 50 may be a sensor (a so-called reflection type optical sensor) in which the optical sensor detects the substrate KB based on whether or not the inspection light emitted by the light-emitting unit is reflected by the substrate KB and received by the light-receiving unit. [Industrial Applicability]

[0052] To provide a component mounting device and a method for cleaning an optical sensor in the component mounting device, which can easily clean an optical sensor without prior preparation such as discharging all boards on a production line. [Explanation of symbols]

[0053] 1. Parts mounting device 12 Conveyor 14 Mounting head 16 Nozzle Changer 31 Shaft member 32 nozzles 50 Optical Sensor 50L inspection light 51 Floodlight 52 Receiver 70 Cleaning tool (foreign matter removal part) 70P Air-jet Cleaning Tool 70Q Brush-type cleaning tool 72 Air outlet 73 Brush section P1 Negative air pressure P2 positive air pressure BH parts KB board

Claims

1. a conveyor for transporting and positioning the substrate; a mounting head that moves relative to the substrate positioned by the conveyor and mounts components onto the substrate; an optical sensor that detects the substrate being transported by the conveyor; a foreign matter removal unit that is detachably attached to the mounting head and that removes foreign matter adhering to the optical sensor while being moved by the mounting head so as to approach the optical sensor; A component mounting device comprising:

2. 2. The component mounting device according to claim 1, wherein the foreign matter removal unit includes an air outlet, and blows off and removes foreign matter adhering to the optical sensor by ejecting positive pressure air from the air outlet toward the optical sensor.

3. 2. The component mounting device according to claim 1, wherein the foreign matter removal unit includes a brush unit, and the brush unit is moved relative to the optical sensor while in contact with the optical sensor, thereby brushing off and removing foreign matter adhering to the optical sensor.

4. 2. The component mounting device according to claim 1, wherein the foreign matter removal unit is attached to the mounting head in exchange for a nozzle that picks up components.

5. 1. A method for cleaning an optical sensor in a component mounting device including a conveyor that transports and positions a board, a mounting head that moves relative to the board positioned by the conveyor and mounts components on the board, and an optical sensor that detects the board transported by the conveyor, comprising: a foreign matter removal unit mounting step of mounting a foreign matter removal unit on the mounting head; an approaching step of moving the mounting head to bring the foreign substance removal unit closer to the optical sensor; a foreign matter removal step of removing foreign matter adhering to the optical sensor by the foreign matter removal unit brought close to the optical sensor; A method for cleaning an optical sensor in a component mounting device having the above structure.

6. 6. The method for cleaning an optical sensor in a component mounting device according to claim 5, wherein the foreign matter removal unit includes an air outlet, and in the foreign matter removal step, positive pressure air is ejected from the air outlet toward the optical sensor to blow off and remove foreign matter adhering to the optical sensor.

7. 6. The method for cleaning an optical sensor in a component mounting device according to claim 5, wherein the foreign matter removal unit includes a brush unit, and in the foreign matter removal step, the brush unit is moved relative to the optical sensor to brush off and remove foreign matter adhering to the optical sensor.

8. 6. The method for cleaning an optical sensor in a component mounting device according to claim 5, wherein in the foreign matter removal unit mounting step, the foreign matter removal unit is mounted on the mounting head in exchange for a nozzle that picks up components.

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