Conveyance apparatus, lithography apparatus, and article manufacturing method

Abstract

To provide a technique advantageous for appropriately controlling conveyance of an object.SOLUTION: A conveyance apparatus for conveying an object includes a measurement unit configured to measure a foreign substance on a surface of the object, a conveyance unit including a holding unit configured to hold the object by coming into contact with a part of the surface and configured to convey the object while holding the object by the holding unit, and a control unit configured to control conveyance of the object by the conveyance unit in accordance with the foreign substance in a contact region of the surface with which the holding unit comes into contact, the foreign substance being obtained from a measurement result by the measurement unit.SELECTED DRAWING: Figure 1

Description

[Technical Field]

[0001] The present invention relates to a transport apparatus, a lithographic apparatus, and an article manufacturing method. [Background technology]

[0002] Lithography apparatuses that form patterns on substrates are equipped with transport devices that transport objects such as originals and substrates while holding them by vacuum suction or the like. Lithography apparatuses are required to improve productivity (throughput), and transport devices may also be required to shorten the time required to transport objects. Patent Document 1 describes a technique that detects the strength of the suction force when an object is being suction-held by a suction-holding device, and controls the movement speed of the suction-holding device based on the detected strength of the suction force. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Japanese Patent Application Laid-Open No. 2006-41386 Summary of the Invention [Problem to be solved by the invention]

[0004] As described in Patent Document 1, if an object is transported at high speed based on the suction force, the object may not be transported accurately even if the suction force is sufficient. For example, if a large amount of foreign matter adheres to the suction-holding area of ​​the object to be transported, the friction between the suction-holding means and the object may decrease even if the suction force is sufficient. If the object is transported at high speed in this state, the object may slip from the suction-holding means, causing a shift in the relative position between the suction-holding means and the object. As a result, the object cannot be transported accurately to the stage to which it is to be transported, and additional time may be required to position the object. Furthermore, foreign matter caught between the suction-holding means and the object may become distorted.

[0005] Therefore, an object of the present invention is to provide an advantageous technique for appropriately controlling the transportation of an object. [Means for solving the problem]

[0006] In order to achieve the above-mentioned object, one aspect of the present invention is a conveying device that conveys an object, characterized in that it comprises: a measuring unit that measures foreign matter on the surface of the object; a holding unit that contacts a portion of the surface and holds the object, and the conveying unit conveys the object while holding it in the holding unit after the foreign matter has been measured by the measuring unit; and a control unit that controls the conveying of the object by the conveying unit in accordance with the foreign matter in the contact area of ​​the surface that the holding unit contacts, as determined from the measurement results by the measuring unit.

[0007] Further objects and other aspects of the present invention will become apparent from the following description of preferred embodiments with reference to the accompanying drawings. [Effects of the Invention]

[0008] According to the present invention, for example, it is possible to provide an advantageous technique for appropriately controlling the transportation of an object. [Brief explanation of the drawings]

[0009] [Figure 1] 1 is a schematic diagram showing an example of the configuration of an exposure apparatus according to a first embodiment; [Figure 2] Schematic diagram showing an example of the surface configuration of the master [Figure 3] Schematic diagram showing a configuration example of a hand of a second transport mechanism [Figure 4] Schematic diagram showing an example of the configuration of a foreign matter inspection device [Figure 5A] FIG. 10 is a diagram showing an example of a distribution of foreign matter adhesion obtained by a foreign matter inspection device. [Figure 5B] FIG. 10 is a diagram showing an example of a distribution of foreign matter adhesion obtained by a foreign matter inspection device. [Figure 6] 1 is a flowchart showing a method for transporting an original according to a first embodiment; [Figure 7]Flowchart showing foreign matter inspection in the second embodiment [Figure 8] 10 is a flowchart showing a method for predicting and notifying a time when the foreign matter adhesion state of the contact area will no longer satisfy a predetermined condition in the third embodiment. [Figure 9] FIG. 10 is a diagram showing an example of the relationship between the number of conveyances and the state of foreign matter adhesion. [Figure 10] 10 is a flowchart showing a method for changing predetermined conditions in accordance with a deviation in the conveying position of an original in the fourth embodiment. DETAILED DESCRIPTION OF THE INVENTION

[0010] Hereinafter, embodiments will be described in detail with reference to the accompanying drawings. Note that the following embodiments do not limit the scope of the invention claimed. Although multiple features are described in the embodiments, not all of these multiple features are necessarily essential to the invention, and multiple features may be combined arbitrarily. Furthermore, in the accompanying drawings, the same reference numerals are used to designate the same or similar components, and redundant explanations will be omitted.

[0011] In this specification and the accompanying drawings, directions are typically indicated in an XYZ coordinate system, with the XY plane being a direction parallel to the horizontal plane. The directions parallel to the X, Y, and Z axes in the XYZ coordinate system are defined as the X direction, Y direction, and Z direction, respectively, and rotation around the X axis, rotation around the Y axis, and rotation around the Z axis are defined as θX, θY, and θZ, respectively. Control and drive (movement) about the X axis, Y axis, and Z axis refer to control or drive (movement) about a direction parallel to the X axis, a direction parallel to the Y axis, and a direction parallel to the Z axis, respectively. Furthermore, control or drive about the θX axis, θY axis, and θZ axis refer to control or drive about a rotation about an axis parallel to the X axis, a rotation about an axis parallel to the Y axis, and a rotation about an axis parallel to the Z axis, respectively.

[0012] In the following embodiments, an exposure apparatus that transfers a pattern of an original, such as a reticle or a mask, onto a substrate by exposing the substrate will be described as an example of a lithography apparatus that forms a pattern on a substrate, but the present invention is not limited to this. For example, the present invention can also be applied to other lithography apparatuses, such as a molding apparatus (imprint apparatus, planarization apparatus) that molds a composition on a substrate using an original, such as a mold. Furthermore, in the following embodiments, an original will be described as an example of a transport object (object) transported by a transport apparatus, but the transport object may also be a substrate.

[0013] First Embodiment An exposure apparatus 100 according to a first embodiment of the present invention will be described. FIG. 1 is a schematic diagram showing an example of the configuration of exposure apparatus 100 according to this embodiment, illustrating the interior of a chamber that covers the entire exposure apparatus 100. Exposure apparatus 100 is a step-and-scan exposure apparatus (a so-called scanner) that performs an exposure process in which an original R (reticle, mask) and a substrate S (wafer) are scanned relative to each other to expose the substrate S, thereby transferring a pattern from the original R onto the substrate S. This exposure process is performed for each of a plurality of shot areas on the substrate S. Note that although this embodiment will be described using a step-and-scan exposure apparatus as an example, the present invention can also be applied to a step-and-repeat exposure apparatus (a so-called stepper).

[0014] As shown in FIG. 1, the exposure apparatus 100 may include a forming apparatus 100a, a master transport apparatus 100b, a controller CNT, and a user interface UI. The controller CNT is configured by a computer (information processing device) including a processor such as a CPU (Central Processing Unit) and a storage unit such as a memory, and controls the overall operation of the exposure apparatus 100. The controller CNT may control the exposure process performed in the forming apparatus 100a and the master transport process performed in the master transport apparatus 100b. The user interface UI may include an input unit that accepts input from a user (operator) and a notification unit that notifies the user (operator) of information. The notification unit may include, for example, a display for displaying information. Note that FIG. 1 does not illustrate a chamber that covers the entire exposure apparatus 100 and a substrate transport apparatus that transports a substrate S.

[0015] The forming apparatus 100a forms a pattern on the substrate S by performing an exposure process. The forming apparatus 100a of this embodiment may include, for example, an illumination optical system 1 that illuminates the original R, an original stage 2 that can move while holding the original R, a projection optical system 3 that projects an image of the pattern of the original R onto the substrate S, and a substrate stage 4 that can move while holding the substrate S. The original R has a pattern (e.g., a circuit pattern) to be transferred onto the substrate S, and is illuminated via the illumination optical system 1 with light generated from a light source (not shown) such as an excimer laser. The light that passes through the original R is projected onto the substrate S at a predetermined magnification by the projection optical system 3 as an image of the pattern of the original R. In the forming apparatus 100a of this embodiment, the original stage 2 and the substrate stage 4 relatively scan the original R and the substrate S in a predetermined scanning direction (e.g., the Y direction) while synchronizing them with each other at a speed ratio corresponding to the projection magnification of the projection optical system 3. This allows the pattern of the original R to be transferred onto the substrate S.

[0016] The original transport device 100b transports the original R to and from the forming device 100a. The original transport device 100b of this embodiment may include, for example, a first transport mechanism 9, a second transport mechanism 14, and a foreign matter inspection device 12.

[0017] The first transport mechanism 9 is a mechanism that transports the original R between the pod openers 7 and 8, the reticle stocker 11, the foreign matter inspection device 12, and the alignment stage 13 while holding a portion of the back surface (e.g., the lower surface) of the original R. The second transport mechanism 14 is a mechanism (transport unit) that transports the original R between the alignment stage 13 and the original stage 2 of the forming device 100a while holding a portion of the front surface (e.g., the upper surface) of the original R. The foreign matter inspection device 12 is a device that inspects the surface of the original R for foreign matters adhering thereto.

[0018] The master storage containers 5, 6 are airtight containers that can store one or more masters R and that can be opened and closed, and are placed on pod openers 7, 8, respectively. The master storage containers 5, 6 are sometimes called SMIF pods. The pod openers 7, 8 are devices for opening and closing the master storage containers 5, 6, and are equipped with a lifting mechanism (not shown) for opening the master storage containers 5, 6 and withdrawing the master R from them. The master R withdrawn from the master storage containers 5, 6 by the pod openers 7, 8 is transported by a first transport mechanism 9.

[0019] The first transport mechanism 9 may be configured as a transport robot including, for example, a hand 9a that holds a portion of the back surface of the original R and a drive mechanism 9b that drives the hand 9a about multiple axes (e.g., six axes: X-axis, Y-axis, Z-axis, θX-axis, θY-axis, and θZ-axis). The original R is carried out from the pod openers 7 and 8 while being held by the hand 9a of the first transport mechanism 9. After the identification code of the original R is read by a code reader 10, the original R is transported to a reticle stocker 11. The reticle stocker 11 is a storage unit (storage cabinet) that stores multiple originals R and has, for example, a shelf-like structure. The multiple originals R stored in the reticle stocker 11 may be managed by the control unit CNT based on the identification codes read by the code reader 10. Of the multiple originals R stored in the reticle stocker 11 , the original R to be used in the next exposure process is carried out of the reticle stocker 11 by the first transport mechanism 9 and transported to the foreign matter inspection device 12 .

[0020] The foreign matter inspection device 12 is a device that inspects the size, position, and amount of foreign matter adhering to the surface of the original R, and functions as a measurement unit that measures foreign matter on the surface of the original R. In other words, the foreign matter inspection device 12 measures the distribution of foreign matter adhering to the surface of the original R. Here, if a pellicle is formed on the surface of the original R, the foreign matter inspection device 12 inspects the size, position, and amount of foreign matter adhering to the surface of the pellicle. The surface of the pellicle may be understood as part of the surface of the original R.

[0021] After the original R has been inspected for foreign matter (measured for foreign matter) by the foreign matter inspection device 12, it is transported by the first transport mechanism 9 to the alignment stage 13. The alignment stage 13 aligns the original R, for example, in the X direction, Y direction, and θZ direction, so that the amount of deviation in the position and orientation of the original R relative to the alignment reference falls within a specified range. The alignment reference may be understood as a reference value (target value) for the position and orientation of the original R.

[0022] The original R, which has been aligned by the alignment stage 13, is transported onto the original stage 2 of the forming apparatus 100a by the second transport mechanism 14. The second transport mechanism 14 includes a hand 14a that holds the original R by contacting a portion of the surface of the original R, and a drive mechanism 14b that drives the hand 14a. In the second transport mechanism 14 of this embodiment, the hands 14a are provided at both ends of a beam-shaped support member 14c, and the drive mechanism 14b drives the hand 14a by rotating the support member 14c in the θZ direction and raising and lowering it in the Z direction. As a result, the second transport mechanism 14 holds the original R on the alignment stage 13 with the hand 14a, and transports the original R to the original stage 2 by using the drive mechanism 14b to rotate the support member 14c in the θZ direction.

[0023] When the exposure process is completed in the forming apparatus 100a, the second transport mechanism 14 holds the original R on the original stage 2 with the hand 14a and transports the original R onto the alignment stage 13 by rotating the support member 14c in the θZ direction with the drive mechanism 14b. The original R on the alignment stage 13 is transported by the first transport mechanism 9 to the reticle stocker 11 and temporarily stored therein. If the original R is not scheduled to be used again for the exposure process, it is transported by the first transport mechanism 9 to one of the pod openers 7, 8 and finally stored in one of the original storage containers 5, 6.

[0024] FIG. 2 is a schematic diagram showing an example of the configuration of the surface of the original R, as viewed from above (the +Z direction side). As shown in FIG. 2, the surface of the original R may include a pattern region R1 having a pattern to be transferred onto a substrate, and a peripheral region R2 surrounding the pattern region R1 in the X direction. Here, the pattern region R1 of the original R may be understood as the region illuminated by the illumination optical system 1 in the forming apparatus 100a (illumination region, exposure region). Furthermore, the peripheral region R2 of the original R may be understood as the region other than the pattern region R1.

[0025] Next, a configuration example of the hand 14a that holds the original R in the second transport mechanism 14 will be described with reference to FIG. 3. FIG. 3(a) is a schematic diagram showing a configuration example of the hand 14a of the second transport mechanism 14, as viewed from below (the -Z direction side) of the hand 14a. The hand 14a of the second transport mechanism 14 has multiple suction pads 141 (holding units) that contact a portion of the original R and hold the original R by vacuum suction or the like. By aligning the original R on the alignment stage 13, the reference position Rr (e.g., the center of gravity position, see FIG. 2) of the original R and the reference position 140 (e.g., the center of gravity position) of the hand 14a are approximately aligned. When aligned in this manner, the multiple suction pads 141 are arranged to contact and hold a portion of the peripheral region R2 of the surface of the original R.

[0026] 3(b) is an enlarged view of one suction pad 141. The suction pad 141 has an intake hole 142 for performing vacuum suction and an outer edge portion 143 for defining a space in which vacuum suction is performed via the intake hole 142. The outer edge portion 143 is the portion that comes into contact with the surface of the original R. Here, the contact region Rc of the surface of the original R with which the suction pad 141 (outer edge portion 143) comes into contact is included in the peripheral region R2, as shown in FIG.

[0027] Next, an example of the configuration of the foreign matter inspection device 12 will be described with reference to Fig. 4. Fig. 4 is a schematic diagram showing an example of the configuration of the foreign matter inspection device 12. The foreign matter inspection device 12 has a foreign matter detection unit 120 made up of a laser light source 121 and a line sensor 122. The foreign matter inspection device 12 also has a processing unit 123 that controls the foreign matter detection unit 120 and processes signals output from the foreign matter detection unit 120 (line sensor 122).

[0028] A plurality of foreign substance detection units 120 may be provided in the foreign substance inspection device 12, for example, to inspect the front and back surfaces of the original R for foreign substances. FIG. 4 shows only the foreign substance detection unit 120 for inspecting the front surface of the original R for foreign substances, and does not show the foreign substance detection unit 120 for inspecting the back surface of the original R for foreign substances. The line sensor 122 extends along the Y direction, and the length of the line sensor 122 in the Y direction may be equal to or greater than the length of the original R in the Y direction. The foreign substance inspection device 12 also has a drive mechanism (not shown) that drives the original R and the foreign substance detection unit 120 relative to each other in the direction (X direction) perpendicular to the extension direction (Y direction) of the line sensor 122. The relative drive range of the drive mechanism between the original R and the foreign substance detection unit 120 may be equal to or greater than the length of the original R in the X direction.

[0029] In the foreign substance inspection device 12, a laser light source 121 emits laser light obliquely in a line onto the surface of the original R, and a line sensor 122 receives reflected light 124 from the surface of the original R. The line sensor 122 is configured by arranging multiple pairs of photoelectric conversion elements and optical systems (e.g., lenses) in a line in the Y direction. The foreign substance inspection device 12 can inspect the entire surface of the original R for foreign substances by relatively driving the original R and the foreign substance detection unit 120 in a direction (X direction) perpendicular to the line of laser light irradiated onto the surface of the original R.

[0030] The processing unit 123 also sequentially receives signals output from the line sensor 122 and generates a foreign matter adhesion distribution on the surface of the original R based on those signals. As shown in FIG. 4, if a foreign matter 206 is attached to the surface of the original R, the laser light from the laser light source 121 is scattered by the foreign matter 206 and received as scattered light by the line sensor 122. Therefore, the output signal from the line sensor 122 can obtain the magnitude of the reflected light (scattered light), the relative position in the X direction between the original R and the foreign matter detection unit 120 when the line sensor 122 receives the scattered light, and the Y direction position of the sensor in the line sensor 122 that receives the scattered light. Based on this information, the processing unit 123 can calculate the size and position of the foreign matter on the surface of the original R and generate a foreign matter adhesion distribution that represents them as a map on the XY plane.

[0031] 5A is a diagram showing an example of a foreign matter adhesion distribution 200 acquired (measured) by the foreign matter inspection device 12. As described above, the foreign matter adhesion distribution 200 is a map of the sizes and positions of foreign matters adhering to the surface of the original R, which is obtained by receiving reflected light (scattered light) with the line sensor 122 while driving the original R and the foreign matter detection unit 120 relatively in the X direction. The Y-direction coordinate "0" in the foreign matter adhesion distribution 200 indicates the reference position (e.g., center position, center of gravity position) of the line sensor 122, and the X-direction coordinate "0" indicates the reference position (e.g., center position, center of gravity position) of the drive stroke of the foreign matter detection unit 120 relative to the original R. In other words, the coordinate (0,0) in the foreign matter adhesion distribution 200 indicates a position 210 corresponding to the reference position Rr of the original R.

[0032] In the foreign matter adhesion distribution 200, the sizes of foreign matter adhering to the surface of the original R are classified into small, medium, and large particle sizes based on the magnitude of the scattered light signal. The foreign matter adhesion distribution 200 shown in FIG. 5A indicates that small particle size foreign matter 201, medium particle size foreign matter 202, and large particle size foreign matter 203 are adhering to the original R.

[0033] However, if a large amount of foreign matter adheres to the contact area Rc of the surface of the original R, where the hand 14a (outer edge 143) of the second transport mechanism 14 comes into contact, the friction between the hand 14a and the original R may decrease even if the suction force of the hand 14a is sufficient. In this state, if the hand 14a is driven at high speed, the original R may slip from the hand 14a, causing a shift in the relative position between the hand 14a and the original R. As a result, the original R cannot be transported accurately onto the original stage 2, and the positioning of the original R by the forming device 100a may require additional time. Furthermore, foreign matter caught between the hand 14a and the original R may cause distortion of the original R. Therefore, the original transport device 100b of this embodiment controls the transport of the original R by the second transport mechanism 14 based on the number of foreign matters in the contact area Rc of the surface of the original R, where the hand 14a (outer edge 143) comes into contact, as determined from the inspection results (measurement results) of the foreign matter inspection device 12. Furthermore, the original transport device 100b of this embodiment controls the transport of the original R by the second transport mechanism 14 in accordance with the presence of foreign matter in a pattern region R1 on the surface of the original R, which has a pattern to be transferred onto a substrate.

[0034] FIG. 5B shows a foreign matter adhesion distribution 200 acquired by the foreign matter inspection device 12, superimposed on it, with a region 221 (hereinafter, sometimes referred to as the contact-equivalent region 221) corresponding to the contact region Rc of the original R. If the reference position Rr of the original R and the reference position 140 of the hand 14a of the second transport mechanism 14 coincide, the contact-equivalent region 221 can be shown on the foreign matter adhesion distribution 200. By comparing the foreign matter adhesion distribution 200 with the contact-equivalent region 221, the control unit CNT can determine the foreign matter adhesion status, which indicates the size and position of foreign matter adhering to the contact region Rc on the surface of the original R. Note that in FIG. 5B, a region 220 (hereinafter, sometimes referred to as the pattern-equivalent region 220) corresponding to the pattern region R1 of the original R is also shown superimposed on the foreign matter adhesion distribution 200.

[0035] Next, a method for transporting the original R in the original transport device 100b of this embodiment will be described. Fig. 6 is a flowchart showing a method for transporting the original R from the reticle stocker 11 onto the original stage 2 of the forming device 100a in the original transport device 100b of this embodiment. The flowchart in Fig. 6 can be executed by the control unit CNT.

[0036] In step S101, the control unit CNT acquires identification information (ID) of the original R to be transported to the original stage 2 of the forming apparatus 100a. For example, the control unit CNT can acquire the identification information of the original R via the user interface UI. Next, in step S102, the control unit CNT controls the first transport mechanism 9 to unload the original R corresponding to the identification information acquired in step S101 from the reticle stocker 11 and transport the original R to the foreign substance inspection apparatus 12.

[0037] In step S103, the control unit CNT causes the foreign matter inspection device 12 to perform a foreign matter inspection on the surface of the original R (i.e., measurement of the foreign matter adhesion distribution 200). The foreign matter inspection by the foreign matter inspection device 12 is as described above. This allows the control unit CNT to acquire the foreign matter adhesion distribution 200 from the foreign matter inspection device 12. After the foreign matter inspection by the foreign matter inspection device 12 is completed, the control unit CNT can transport the original R from the foreign matter inspection device 12 onto the alignment stage 13 using the first transport mechanism 9.

[0038] In step S104, the control unit CNT compares the foreign matter adhesion distribution 200 acquired in step S103 with the pattern corresponding region 220. Next, in step S105, the control unit CNT obtains the foreign matter adhesion state in the pattern region R1 of the original R based on the comparison result of step S104, and determines whether the foreign matter adhesion state in the pattern region R1 satisfies a specified condition. The specified condition is, for example, a condition that can satisfy the specifications of the exposure process for the foreign matter adhesion state in the pattern region R1 of the original R, and can be set in advance by experiment, simulation, or the like.

[0039] For example, the control unit CNT can determine the area occupancy rate of foreign matter in the pattern region R1 as the foreign matter adhesion state, and if the area occupancy rate is less than a specified value, determine that the foreign matter adhesion state of the pattern region R1 satisfies the specified condition. The area occupancy rate of foreign matter in the pattern region R1 can be calculated based on the size and amount of foreign matter adhering to the pattern region R1. Alternatively, the control unit CNT can determine the amount of foreign matter in the pattern region R1 as the foreign matter adhesion state, and if the amount of foreign matter is less than a specified value, determine that the foreign matter adhesion state of the pattern region R1 satisfies the specified condition. Furthermore, the control unit CNT can determine the size of foreign matter in the pattern region R1 as the foreign matter adhesion state. In this case, the control unit CNT can determine that the foreign matter adhesion state of the pattern region R1 satisfies the specified condition if there are no foreign matters (e.g., medium-sized foreign matter 202 and large-sized foreign matter 203) larger than the specified size in the pattern region R1.

[0040] If the foreign matter adhesion state in the pattern region R1 satisfies the specified condition, the process proceeds to step S106, whereas if the foreign matter adhesion state in the pattern region R1 does not satisfy the specified condition, the process proceeds to step S111.

[0041] In step S106, the control unit CNT determines whether the number of times the second transport mechanism 14 has transported the original R is the first time or a predetermined number or more. If this is the first time the second transport mechanism 14 has transported the original R, there is a possibility that a large amount of foreign matter has already adhered to the peripheral region R2 (contact region Rc) on the surface of the original R when the original R was carried into the exposure apparatus 100. If the number of times the second transport mechanism 14 has transported the original R is the predetermined number or more, there is a possibility that a large amount of foreign matter has accumulated in the peripheral region R2 (contact region Rc) on the surface of the original R due to previous transports. The predetermined number is, for example, the upper limit number of times that can keep within an allowable range the deviation in the relative position between the hand 14a and the original R that may occur during transport of the original R by the second transport mechanism 14, and can be set in advance through experiments, simulations, etc. If the number of times the second transport mechanism 14 has transported the original R is the first time or equal to or greater than the specified number of times, the process proceeds to step S107, and if the number of times is less than the specified number of times (excluding the first time), the process proceeds to step S109.

[0042] In step S106 of this embodiment, the number of times the second transport mechanism 14 transports the original R is determined, but the present invention is not limited to this. For example, the period during which the original R was stored in the reticle stocker 11 (storage unit) before the foreign matter inspection was performed by the foreign matter inspection device 12 (i.e., before the measurement of the foreign matter adhesion distribution) may be determined. The longer the storage period of the original R stored in the reticle stocker 11, the more foreign matter may have accumulated on the surface of the original R. In this case, in step S106, the control unit CNT determines whether the storage period of the original R in the reticle stocker 11 (storage unit) is equal to or longer than a specified period. If the storage period is equal to or longer than the specified period, the process proceeds to step S107. If the storage period is shorter than the specified period, the process proceeds to step S109.

[0043] In step S107, the control unit CNT compares the foreign matter adhesion distribution 200 acquired in step S103 with the contact-equivalent region 221. Next, in step S108, the control unit CNT obtains the foreign matter adhesion state in the contact region Rc of the original R based on the comparison result of step S107, and determines whether the foreign matter adhesion state in the contact region Rc satisfies a first specified condition or a second specified condition. The first specified condition and the second specified condition are conditions for the foreign matter adhesion state in the contact region Rc, and can be set in advance through experiments, simulations, or the like. The first specified condition is, for example, a condition under which, even when the original R is transported by the second transport mechanism 14 at a first transport speed (high speed), any deviation in the relative position between the hand 14a and the original R that may occur during transport can be kept within an allowable range. Furthermore, the second specified condition is a condition under which, for example, if the original R is transported by the second transport mechanism 14 at a second transport speed (low speed) slower than the first transport speed, the deviation in the relative position between the hand 14a and the original R that may occur during transport can be kept within an acceptable range.

[0044] For example, the control unit CNT can determine the area occupancy rate of foreign matter in the contact region Rc as the foreign matter adhesion state, and determine whether the foreign matter adhesion state in the contact region Rc satisfies a first specified condition or a second specified condition based on the area occupancy rate. The area occupancy rate of foreign matter in the contact region Rc can be calculated based on the size and amount of foreign matter adhering to the contact region Rc. As an example, if the area occupancy rate of foreign matter in the contact region Rc is less than a first specified value (e.g., less than 3%), it is determined that the first specified condition is satisfied, and if the area occupancy rate is less than a second specified value (e.g., less than 10%), it is determined that the second specified condition is satisfied. If the area occupancy rate is equal to or greater than the second specified value (e.g., equal to or greater than 10%), it is determined that neither the first nor the second specified condition is satisfied.

[0045] Alternatively, the control unit CNT can determine the amount of foreign matter in the contact region Rc as the foreign matter adhesion state, and determine whether the foreign matter adhesion state in the contact region Rc satisfies the first specified condition or the second specified condition depending on the amount of foreign matter. The control unit CNT can also determine the size of foreign matter in the contact region Rc as the foreign matter adhesion state, and determine whether the foreign matter adhesion state in the contact region Rc satisfies the first specified condition or the second specified condition depending on the size of the foreign matter. For example, the control unit CNT can determine that the first specified condition is satisfied when there are neither medium-sized foreign matter 202 nor large-sized foreign matter 203 in the contact region Rc, and can determine that the second specified condition is satisfied when there are medium-sized foreign matter 202 but no large-sized foreign matter 203 in the contact region Rc.

[0046] If the foreign matter adhesion state in the contact area Rc satisfies the first specified condition, the process proceeds to step S109. In step S109, the control unit CNT causes the second transport mechanism 14 to transport the original R onto the original stage 2 at a first transport speed (high speed). In this case, in the forming apparatus 100a, the exposure process is performed using the original R as usual.

[0047] On the other hand, if the foreign matter adhesion state in the contact region Rc does not satisfy the first specified condition but satisfies the second specified condition, the process proceeds to step S110. In step S110, the control unit CNT causes the second transport mechanism 14 to transport the original R onto the original stage 2 at a second transport speed (low speed). In this case, the forming apparatus 100a performs an exposure process using the original R as usual. In addition, the control unit CNT notifies the user via the user interface UI that the amount of foreign matter adhering to the original R is increasing. This notification may be made, for example, after the exposure process is completed.

[0048] If the foreign matter adhesion state in the contact area Rc does not satisfy either the first or second specified condition, the process proceeds to step S111. In step S111, the control unit CNT transports the original R to the pod openers 7 and 8 using the first transport mechanism 9, and removes the original R from the exposure apparatus 100. In this case, the exposure process using the original R is not performed. Then, the control unit CNT notifies the user via the user interface UI that the second transport mechanism 14 cannot transport the original R onto the original stage 2 due to the amount of foreign matter adhering to the original R (an error notification). Note that the control unit CNT may also issue a notification to prompt the user to clean the original R. Here, since the original R is transported to the pod openers 7 and 8 in step S111, the transport destination of the original R is different from steps S109 to S110, in which the original R is transported to the original stage 2. In other words, the transport destination of the original R is changed depending on the foreign matter adhesion state in the contact area Rc.

[0049] As described above, the original transport device 100b of this embodiment determines the foreign matter adhesion state in the contact area Rc on the surface of the original R from the foreign matter adhesion distribution, and controls the transport of the original R by the second transport mechanism 14 in accordance with the foreign matter adhesion state in the contact area Rc. This makes it possible to appropriately control the transport of the original R by the second transport mechanism 14. Here, in this embodiment, the upper surface of the original R is exemplified as the surface of the original R that the hand 14a of the second transport mechanism 14 contacts, but it may also be the lower surface of the original R. In this case, the transport of the original R by the second transport mechanism 14 can be controlled in accordance with the foreign matter adhesion state of the lower surface of the original R obtained by the foreign matter inspection device 12.

[0050] Second Embodiment A second embodiment of the present invention will now be described. In the above first embodiment, an example was described in which the foreign particle inspection device 12 inspects the entire surface of the original R for foreign particles. In this embodiment, however, an example will be described in which foreign particle inspection is performed on a peripheral region R2 of the surface of the original R without inspecting the pattern region R1. Note that this embodiment basically follows on from the first embodiment, and can follow the first embodiment except for the matters mentioned below.

[0051] FIG. 7 is a flowchart showing the foreign matter inspection (i.e., measurement of the distribution of foreign matter adhesion) performed in step S103 of FIG. 6 in this embodiment. In this embodiment, foreign matter inspection may be performed only in the peripheral region R2 of the surface of the original R. The foreign matter inspection of this embodiment will be described below using the coordinate system shown in FIGS. 5A and 5B. Here, in this embodiment, steps S104 and S105 may be omitted from the flowchart of FIG. 6. Furthermore, steps S102 and S103 may be performed between steps S106 and S107.

[0052] In step S201, the control unit CNT performs a foreign substance inspection while driving the original R and the foreign substance detection unit 120 relatively in the X direction at a first driving speed (low speed) in the range of X coordinates -80 to -60. This makes it possible to obtain a foreign substance adhesion distribution for the range of X coordinates -80 to -60. Here, the range of X coordinates -80 to -60 corresponds to the peripheral region R2 on the surface of the original R, which includes the contact region Rc. The first driving speed can be set to a relative speed between the original R and the foreign substance detection unit 120 that allows the foreign substance detection unit 120 to perform a foreign substance inspection.

[0053] In step S202, the control unit CNT drives the original R and the foreign matter detection unit 120 relatively in the X direction at a second driving speed (high speed) that is faster than the first driving speed within the range of coordinates -60 to +60 in the X direction. In step S202, foreign matter inspection by the foreign matter detection unit 120 is not performed. Therefore, the relative driving speed between the original R and the foreign matter detection unit 120 can be set to the second driving speed, which is faster than the first driving speed, which can be advantageous in terms of throughput. Here, the range of coordinates -60 to +60 in the X direction corresponds to the pattern region R1 on the surface of the original R. The second driving speed is preferably set to a speed faster than the maximum relative speed between the original R and the foreign matter detection unit 120 at which foreign matter inspection can be performed by the foreign matter detection unit 120.

[0054] In step S203, the control unit CNT performs foreign substance inspection while driving the original R and the foreign substance detection unit 120 relatively in the X direction at a third driving speed (low speed) in the range of X coordinates +60 to +80. This makes it possible to obtain a foreign substance adhesion distribution for the range of X coordinates +60 to +80. Here, the range of X coordinates +60 to +80 corresponds to the peripheral region R2 on the surface of the original R, which includes the contact region Rc. The third driving speed can be set to a relative speed between the original R and the foreign substance detection unit 120 that allows the foreign substance detection unit 120 to perform foreign substance inspection. The third driving speed is slower than the second driving speed and may be the same as the first driving speed.

[0055] As described above, in the second embodiment, foreign substance inspection is performed in the range corresponding to the peripheral region R2 (the range of X coordinates -80 to -60, +60 to +80) while driving the original R and the foreign substance detection unit 120 relatively in the X direction at the first drive speed or the third drive speed (low speed). On the other hand, in the range corresponding to the pattern region R1 (the range of X coordinates -60 to +60), the original R and the foreign substance detection unit 120 are driven relatively in the X direction at the second drive speed (high speed), but foreign substance inspection is not performed. This makes it possible to appropriately inspect the peripheral region R2 on the surface of the original R for foreign substances and can also be advantageous in terms of throughput.

[0056] <Third embodiment> A third embodiment of the present invention will be described. In this embodiment, an example will be described in which, based on the results of multiple foreign matter inspections (measurements of foreign matter adhesion distribution) performed on the original R by the foreign matter inspection device 12, a time will be predicted and reported when the foreign matter adhesion state in the contact area Rc will no longer satisfy predetermined conditions for transport by the second transport mechanism 14. The predetermined conditions may include at least one of a first predetermined condition and a second predetermined condition. In the following, both the first predetermined condition and the second predetermined condition will be described as examples of the predetermined conditions. Note that this embodiment basically inherits the first embodiment and may follow the first embodiment except for the matters mentioned below. Furthermore, the second embodiment may also be applied to this embodiment.

[0057] 8 is a flowchart showing a method for predicting and notifying the timing when the foreign matter adhesion state in the contact area Rc will no longer satisfy predetermined conditions (first specified condition, second specified condition). The flowchart in FIG. 8 can be executed by the control unit CNT. Here, in step S108 in FIG. 6, the control unit CNT stores the foreign matter adhesion state found for the contact area Rc of the original R in the storage unit in association with the number of times the original R has been transported by the second transport mechanism 14. The flowchart in FIG. 8 can be executed, for example, every time the foreign matter adhesion state in the contact area Rc is found in step S108.

[0058] In step S301, the control unit CNT acquires the relationship between the number of conveyances by the second conveyance mechanism 14 and the foreign matter adhesion state in the contact area Rc. As described above, the foreign matter adhesion state may be determined by using the area occupancy rate of foreign matter in the contact area Rc, or by using the amount or size of foreign matter in the contact area Rc.

[0059] In step S302, the control unit CNT predicts the time (number of conveyances) when the foreign matter adhesion state of the contact area Rc will no longer satisfy the predetermined condition, based on the relationship between the number of conveyances and the foreign matter adhesion state obtained in step S301. FIG. 9 is a diagram showing an example of the relationship between the number of conveyances and the foreign matter adhesion state. For example, the control unit CNT calculates an approximation function 31 (e.g., an approximate straight line) for the relationship 30 between the number of conveyances and the foreign matter adhesion state obtained so far. This allows the control unit CNT to predict the time T1 (number of conveyances) when the first specified condition will be reached and the time T2 (number of conveyances) when the second specified condition will be reached, based on the approximation function 31. Note that time T2 may also be understood as the time when cleaning of the original R should be performed.

[0060] In step S303, the control unit CNT notifies the times T1 and T2 predicted in step S302 via the user interface UI. For example, the control unit CNT may notify the times T1 and T2 by displaying them on the display of the user interface UI. Here, in the present embodiment, an example has been described in which both the time T1 when the first specified condition is reached and the time T2 when the second specified condition is reached are notified, but this is not limitative, and only the time T2 may be notified. Alternatively, only the time T1 may be notified.

[0061] As described above, in this embodiment, the time when the foreign matter adhesion state in the contact area Rc of the original R will no longer satisfy the predetermined condition is predicted and notified based on the relationship between the number of transports obtained so far and the foreign matter adhesion state. This allows the user (operator) to take appropriate measures, such as cleaning the original R, before the foreign matter adhesion state in the contact area Rc no longer satisfies the predetermined condition.

[0062] <Fourth embodiment> A fourth embodiment of the present invention will be described. In this embodiment, an example will be described in which the predetermined conditions for determining whether or not to transport the original R by the second transport mechanism 14 are changed depending on the positional deviation of the original R transported onto the original stage 2 (on the member) by the second transport mechanism 14. The predetermined conditions may include at least one of a first predetermined condition and a second predetermined condition. In the following, both the first predetermined condition and the second predetermined condition will be described as examples of the predetermined conditions. Note that this embodiment basically inherits the first embodiment and can follow the first embodiment except for the matters mentioned below. Furthermore, the second embodiment or the third embodiment may be applied to this embodiment.

[0063] FIG. 10 is a flowchart showing a method for changing the predetermined conditions depending on the positional deviation of the original R transported onto the original stage 2 by the second transport mechanism 14. The flowchart of FIG. 10 can be executed by the controller CNT after the original R is transported onto the original stage 2 via step S109 or step S110 in the flowchart of FIG. 6. Here, the exposure apparatus 100 (forming apparatus 100a) of this embodiment can be provided with a detection unit 15 that detects the position of the original R on the original stage 2, as shown in FIG. 1. The detection unit 15 can be understood as detecting the deviation between the target position on the original stage 2 to which the original R should be transported (placed) and the position to which the original R is actually transported by the second transport mechanism 14 (hereinafter, this may be referred to as a transport position deviation). For example, the detection unit 15 can be configured to detect the transport position deviation by detecting an alignment mark provided on the original R.

[0064] If the original R transported onto the original stage 2 by the second transport mechanism 14 is misaligned in its transport position, it is possible that the original R has slipped from the hand 14a during transport by the second transport mechanism 14, causing a shift in the relative position between the hand 14a and the original R. In this case, the predetermined conditions (first and second predetermined conditions) for determining whether or not to transport the original R by the second transport mechanism 14 may not be appropriate. Therefore, in this embodiment, the transport position misalignment of the original R on the original stage 2 is detected, and the predetermined conditions are changed based on the transport position misalignment.

[0065] In step S401, the control unit CNT detects the misalignment in the transport position of the original R using the detection unit 15. In step S402, the control unit CNT corrects the misalignment in the transport position of the original R. Next, in step S403, the control unit CNT performs an exposure process.

[0066] In step S404, the control unit CNT determines whether the misalignment of the original R transported, detected in step S401, is within the tolerance range. If the misalignment of the original R transported is within the tolerance range, the process ends. If the misalignment of the original R transported is outside the tolerance range, the process proceeds to step S405. In step S405, the control unit CNT changes the predetermined conditions (first and second conditions) for determining whether to transport the original R by the second transport mechanism 14. For example, if the misalignment of the original R transported is outside the tolerance range, the control unit CNT determines that the relative position between the hand 14a and the original R has shifted during transport of the original R by the second transport mechanism 14, and changes the predetermined conditions to be stricter. As an example, if the area occupancy rate of foreign matter in the contact region Rc is used as the foreign matter adhesion status, the control unit CNT may change the first specified value for the area occupancy rate of foreign matter in the contact region Rc from less than 3% to less than 2% as the first specified condition. Moreover, the control unit CNT changes, as a second prescribed condition, a second prescribed value regarding the area occupancy rate of foreign matter in the contact region Rc from less than 10% to less than 8%.

[0067] As described above, in this embodiment, the predetermined conditions (first and second specified conditions) for determining whether or not to transport the original R by the second transport mechanism 14 are changed in accordance with the transport position deviation of the original R transported onto the original stage 2 by the second transport mechanism 14. This makes it possible to appropriately control the transport of the original R by the second transport mechanism 14. Here, in this embodiment, steps S404 and S405 are performed after steps S402 and S403, but this is not limiting, and they may be performed before steps S402 and S403 or in parallel with steps S402 and S403.

[0068] <Embodiment of an article manufacturing method> The article manufacturing method according to an embodiment of the present invention is suitable for manufacturing articles such as microdevices, such as semiconductor devices, and elements having microstructures. The article manufacturing method according to this embodiment includes a formation step of forming a pattern on a substrate using the above-described lithography apparatus (exposure apparatus), a processing step of processing the substrate on which the pattern has been formed in the formation step, and a manufacturing step of manufacturing an article from the substrate processed in the processing step. Furthermore, this article manufacturing method also includes other well-known processes (oxidation, film formation, vapor deposition, doping, planarization, etching, resist stripping, dicing, bonding, packaging, etc.). The article manufacturing method according to this embodiment is advantageous over conventional methods in at least one of article performance, quality, productivity, and production cost.

[0069] <Summary of the embodiment> The disclosure of the present specification includes at least the following transport apparatus, lithography apparatus, and article manufacturing method. (Item 1) A conveying device for conveying an object, a measuring unit that measures foreign matter on the surface of the object; a conveying unit having a holding unit that holds the object in contact with a portion of the surface, the holding unit conveying the object after the foreign matter has been measured by the measuring unit; a control unit that controls the transport of the object by the transport unit in accordance with the foreign matter in the contact area of ​​the surface that is in contact with the holding unit, the foreign matter being determined from the measurement result by the measurement unit; A conveying device comprising: (Item 2) the surface of the object includes a pattern area having a pattern to be transferred onto a substrate, and a peripheral area surrounding the pattern area and having the contact area; 2. The conveying device according to item 1, wherein the control unit controls the conveyance of the object by the conveying unit further in accordance with the foreign matter in the pattern area determined from the measurement result by the measurement unit. (Item 3) 3. The conveying device according to item 1 or 2, wherein the control unit controls the conveying of the object by the conveying unit further based on the number of times the object has been conveyed by the conveying unit. (Item 4) a storage unit in which the object is stored before measurement by the measurement unit; 4. The transport device according to any one of items 1 to 3, wherein the control unit controls the transport of the object by the transport unit further based on the period during which the object has been stored in the storage unit. (Item 5) 5. The conveying device according to any one of items 1 to 4, wherein the control unit changes a conveying speed of the object by the conveying unit depending on the foreign matter in the contact area. (Item 6) 6. The conveying device according to any one of items 1 to 5, wherein the control unit changes the destination of the object depending on the foreign matter in the contact area. (Item 7) 7. The conveying device according to any one of items 1 to 6, wherein the control unit determines an area occupancy rate of the foreign matter in the contact area as a foreign matter adhesion state of the contact area from the measurement result. (Item 8) The conveying device according to any one of items 1 to 6, characterized in that the control unit determines at least one of the amount and size of foreign matter in the contact area from the measurement results as the foreign matter adhesion status of the contact area. (Item 9) the surface of the object includes a pattern area having a pattern to be transferred onto a substrate, and a peripheral area surrounding the pattern area and having the contact area; 9. The conveying device according to any one of items 1 to 8, wherein the measurement unit measures the foreign matter in an area including the pattern area and the surrounding area. (Item 10) the surface of the object includes a pattern area having a pattern to be transferred onto a substrate, and a peripheral area surrounding the pattern area and having the contact area; 9. The conveying device according to any one of items 1 to 8, wherein the measurement unit measures the foreign matter only in the surrounding area. (Item 11) The control unit is configured to predict and notify a time when the foreign matter in the contact area will no longer satisfy a predetermined condition for transport by the transport unit, based on the results of measurements taken multiple times by the measurement unit on the object. (Item 12) 12. The conveying device according to any one of items 1 to 11, wherein the control unit conveys the object onto a member using the conveying unit when the foreign matter in the contact area determined from the measurement result satisfies a predetermined condition, and changes the predetermined condition depending on a positional deviation of the object conveyed onto the member by the conveying unit. (Item 13) 1. A lithographic apparatus for forming a pattern on a substrate, comprising: A conveying device according to any one of items 1 to 12 is provided, A lithography apparatus, wherein the transport device transports the substrate or an original having a pattern to be transferred onto the substrate. (Item 14) A forming step of forming a pattern on a substrate using the lithography apparatus according to item 13; a processing step of processing the substrate on which the pattern has been formed in the forming step; a manufacturing process for manufacturing an article from the substrate processed in the processing process; A method for manufacturing an article, comprising:

[0070] The invention is not limited to the above-described embodiments, and various changes and modifications can be made without departing from the spirit and scope of the invention. Accordingly, the following claims are appended to apprise the public of the scope of the invention. [Explanation of symbols]

[0071] 100: exposure device, 100a: forming device, 100b: conveying device, 9: first conveying mechanism, 12: foreign substance inspection device (measurement unit), 14: second conveying device, CNT: control unit, R: original

Claims

1. A conveying device for conveying an object, a measuring unit that measures foreign matter on the surface of the object; a conveying unit having a holding unit that holds the object in contact with a portion of the surface, the holding unit conveying the object after the foreign matter has been measured by the measuring unit; a control unit that controls the transport of the object by the transport unit in accordance with the foreign matter in the contact area of ​​the surface that is in contact with the holding unit, the foreign matter being determined from the measurement result by the measurement unit; A conveying device comprising:

2. the surface of the object includes a pattern area having a pattern to be transferred onto a substrate, and a peripheral area surrounding the pattern area and having the contact area; 2. The conveying apparatus according to claim 1, wherein the control unit controls the conveyance of the object by the conveying unit further in accordance with the foreign matter in the pattern area determined from the measurement result by the measurement unit.

3. The conveying device according to claim 1 , wherein the control unit controls the conveying of the object by the conveying unit further based on the number of times the object has been conveyed by the conveying unit.

4. a storage unit in which the object is stored before measurement by the measurement unit; The transport device according to claim 1 , wherein the control unit controls the transport of the object by the transport unit further based on the period during which the object has been stored in the storage unit.

5. The conveying device according to claim 1 , wherein the control unit changes a conveying speed of the object by the conveying unit depending on the foreign matter in the contact area.

6. The conveying device according to claim 1 , wherein the control unit changes the destination of the object depending on the foreign matter in the contact area.

7. 2. The conveying apparatus according to claim 1, wherein the control unit determines an area occupancy rate of the foreign matter in the contact area as a foreign matter adhesion state of the contact area from the measurement result.

8. 2. The conveying device according to claim 1, wherein the control unit determines at least one of the amount and size of the foreign matter on the contact area from the measurement result as the foreign matter adhesion state on the contact area.

9. the surface of the object includes a pattern area having a pattern to be transferred onto a substrate, and a peripheral area surrounding the pattern area and having the contact area; 2. The conveying apparatus according to claim 1, wherein the measurement unit measures the foreign matter in an area including the pattern area and the surrounding area.

10. the surface of the object includes a pattern area having a pattern to be transferred onto a substrate, and a peripheral area surrounding the pattern area and having the contact area; The conveying device according to claim 1 , wherein the measuring unit measures the foreign matter only in the surrounding area.

11. 2. The conveying device according to claim 1, wherein the control unit predicts and notifies a time when the foreign matter in the contact area will no longer satisfy predetermined conditions for being conveyed by the conveying unit, based on the results of measurements of the object taken multiple times by the measuring unit.

12. 2. The conveying device according to claim 1, wherein the control unit causes the conveying unit to convey the object onto a member when the foreign matter in the contact area determined from the measurement results satisfies a predetermined condition, and changes the predetermined condition depending on a positional deviation of the object conveyed onto the member by the conveying unit.

13. 1. A lithographic apparatus for forming a pattern on a substrate, comprising: A conveying device according to any one of claims 1 to 12, A lithography apparatus, wherein the transport device transports the substrate or an original having a pattern to be transferred onto the substrate.

14. forming a pattern on a substrate using the lithography apparatus of claim 13; a processing step of processing the substrate on which the pattern has been formed in the forming step; a manufacturing process for manufacturing an article from the substrate processed in the processing process; A method for manufacturing an article, comprising:

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