Method for producing resin thin film

Abstract

To provide a method for producing a resin thin film which has high productivity and is hardly broken.SOLUTION: A method for manufacturing a resin thin film includes a base treatment step of applying a desired resin onto a substrate to form a reinforcing body, a first heat molding step of heating the reinforcing body, a raw material application step of applying a resin thin film raw material onto a surface of the reinforcing body to form a resin film, a second heat molding step of heating the resin film, a frame bonding step of bonding a frame to a surface of the resin film, a cooling step of cooling the substrate, the reinforcing body, and the resin film, and a substrate separation step of peeling off and separating the substrate from the reinforcing body. The method includes a reinforcing body peeling step of gelling the reinforcing body and peeling it from the resin film, and a drying step of washing and drying the resin film obtained in the peeling step.SELECTED DRAWING: Figure 4

Description

[Technical Field]

[0001] The present invention relates to a method for producing a resin thin film. [Background technology]

[0002] In the manufacture of semiconductor integrated circuits, the process of patterning a semiconductor wafer coated with a resist material by exposure is a critical step that determines the yield of integrated circuits. If scratches or dust exist on the mask that holds the original pattern during this process, the scratches or foreign matter will be printed on the wafer along with the pattern, causing short circuits, breaks, and other problems in the resulting circuits. Therefore, protecting and dust-proofing the mask are extremely important issues for improving productivity. For this reason, covering one or both sides of the mask with a thin, transparent plastic film has already been put into practical use for the purpose of protecting and dust-proofing the mask.

[0003] In the fabrication of semiconductor integrated circuits, various devices and circuit connections are defined using photoresist masks, which are created by coating a substrate with a resist layer and then exposing the resist layer to ultraviolet light through openings in the pattern mask. The light hardens the resist layer in the irradiated areas, in the case of negative resist, or degrades it, in the case of positive resist. The unhardened or degraded areas are then removed by a developer, which exposes portions of the substrate for, for example, a metal deposition process. Pattern masks typically consist of a transparent substrate with a pattern of opaque areas, such as silver or chrome, formed on one surface.

[0004] Conventionally, a known method for producing a resin thin film having a thickness of about 50 to 500 μm involves forming a resin thin film on a substrate such as glass using a spinner or spin coater, and then peeling the resin thin film from the substrate.

[0005] When a spin coater is used to produce a resin thin film, a silane coupling agent is applied to a substrate, such as glass, placed in the spin coater to form a reinforcing material. After the film is formed using the spin coater, it is heated to a predetermined temperature. The resin coated on the thin film is then attached to a frame using an adhesive or similar material. UV (low-pressure mercury lamp) is then irradiated for approximately 30 minutes to weaken the adhesion between the silane coupling agent and the resin film. Ultrasonic waves are then applied to the resin thin film and the substrate for approximately 60 minutes using an ultrasonic device to peel them off. However, this method requires approximately 180 minutes to produce the resin thin film, resulting in very poor productivity. Furthermore, when peeling the resin thin film from the substrate, depending on the desired thickness of the resin thin film and the thickness of the reinforcing material, the resin thin film may be damaged.

[0006] Various inventions have been proposed to address this issue. The invention of Patent Document 1 is characterized by comprising a first step of applying a resin solution having film-forming properties to a substrate using a roll coater, a second step of evaporating and removing the solvent from the applied resin solution, and a third step of peeling off the resulting resin thin film from the substrate after removing the solvent. The invention of Patent Document 2 is a method for producing a fluorine-containing resin thin film by forming a homogeneous fluorine-containing resin thin film on a substrate and peeling the thin film from the substrate, characterized in that a resin layer made of a resin containing no fluorine atoms and optionally containing silicone oil is formed in advance as an underlayer on the substrate, a fluorine-containing resin is applied to the surface of the underlayer to form a thin layer, and the formed thin film layer is peeled off from the surface of the underlayer to produce a free-standing thin film. [Prior art documents] [Patent documents]

[0007] [Patent Document 1] Japanese Patent Application Publication No. 05-16159 [Patent Document 2] Japanese Patent Application Publication No. 08-85728 Summary of the Invention [Problem to be solved by the invention]

[0008] However, the methods of Patent Documents 1 and 2 require a long time to produce the resin thin film, resulting in poor productivity, and do not solve the problem of breakage of the produced resin thin film.

[0009] In view of the above problems, the present invention provides a method for producing a resin thin film that is highly productive and that is less likely to be damaged. [Means for solving the problem]

[0010] In order to solve the above problems, the method for producing a resin thin film according to the present invention is a method for forming a resin thin film on a substrate and easily peeling the thin film from the substrate, characterized in that a reinforcing body having a thickness of 1 μm to 1 mm is formed on the surface of the substrate using a desired resin, a raw resin is then applied to the surface of the reinforcing body to a thickness of 0.4 μm to 20 μm to form a resin thin film, the reinforcing body is then separated from the substrate by peeling it off, and the reinforcing body with the resin thin film placed on it is washed with water at 10°C to 80°C to gel the reinforcing body, thereby peeling the reinforcing body from the resin thin film and producing the resin thin film. After the reinforcing body is separated from the base by peeling it off, the reinforcing body with the resin thin film placed on it can be immersed in water at 10°C to 80°C while applying ultrasound to it to gel the reinforcing body, thereby allowing the resin thin film to be suitably peeled off from the reinforcing body.

[0011] Alternatively, the raw resin can be applied to the surface of the reinforcing body to a thickness of 0.4 μm to 20 μm to form a thin resin film, and then a frame can be attached to the thin resin film. The reinforcing body with the thin resin film placed on it can be immersed in water at 10°C to 80°C to gel the reinforcing body, after which the thin resin film will be attached to the frame, and the reinforcing body can be washed with alcohol or the like and dried to form the finished product.

[0012] The desired resin for forming the reinforcing body is a water-soluble resin, and in particular a resin that gels, swells, or dissolves in warm water. For example, polyacrylamide, polyvinyl alcohol, polyethylene oxide, polyvinyl acetal, carboxymethyl cellulose, water-soluble phenolic resin, etc. can be used. Furthermore, the raw material resin can be selected from fluorine-based resins and silicone resins.

[0013] The method for producing a resin thin film according to the present invention is characterized by comprising a base treatment step of applying a desired resin onto a substrate using a coater to form a reinforcing body, a first heat-molding step of heating the reinforcing body, a raw material application step of applying a resin thin film raw material onto the surface of the reinforcing body to form a resin film, a second heat-molding step of heating the resin film, a frame bonding step of adhering a frame to the surface of the resin film, a cooling step of cooling the substrate, the reinforcing body, and the resin film, a base separation step of peeling the substrate from the reinforcing body to separate it, a peeling step of immersing the resin film with the reinforcing body attached in water to gel the reinforcing body and peel it from the resin film, and a drying step of washing and drying the resin film obtained in the peeling step. [Effects of the Invention]

[0014] The method for producing a resin thin film according to the present invention has the advantages of high productivity, no damage to the resin thin film, and a high yield. [Brief explanation of the drawings]

[0015] [Figure 1] FIG. 1 is a conceptual diagram showing a layer structure necessary for forming a resin thin film according to the present invention. [Figure 2] 1A to 1C are diagrams showing a step of peeling off a resin thin film according to the present invention from a substrate. [Figure 3] FIG. 10 is a view showing a state in which the resin thin film according to the present invention has been peeled off from the reinforcing body. [Figure 4] FIG. 1 is a flow chart showing a manufacturing process of a resin film according to the present invention. DETAILED DESCRIPTION OF THE INVENTION

[0016] Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. In each drawing, the same parts are given the same numbers, and duplicate explanations will be omitted. Please note that the drawings may be exaggerated to facilitate understanding of the present invention, and are not necessarily drawn to scale. However, the present invention is not limited to the embodiments shown below. [Example]

[0017] Example 1 will be described in detail with reference to the drawings. Fig. 2 is a diagram showing the process of peeling the resin thin film according to the present invention from the substrate. Fig. 3 is a diagram showing the state in which the resin thin film according to the present invention has been peeled from the reinforcing body.

[0018] Please refer to Fig. 1. Fig. 1 is a conceptual diagram showing the layer structure required to form the resin thin film according to the present invention.

[0019] The formation of the reinforcing member 2 of the present invention will be described with reference to FIG. 1(a). That is, a desired resin is dissolved in an appropriate solvent to prepare a polymer solution, which is then applied to a thickness of about 1 μm to 1 mm on the substrate 3 to form the reinforcing body 2. Alternatively, a sheet-like reinforcing body 2 may be cut to the shape and size of the substrate and attached to the substrate 3. There are no particular limitations on the method for forming the reinforcing body 2 on the substrate 3, but a spin coating method, which has excellent film thickness controllability when forming a thin film, is preferred.

[0020] The desired resin for producing the reinforcing body 2 is preferably a water-soluble resin, particularly one that gels, swells, or melts when immersed in warm water; for example, polyacrylamide, polyvinyl alcohol, polyethylene oxide, polyvinyl acetal, carboxymethyl cellulose, water-soluble phenolic resin, etc. can be used. The substrate 3 used in the present invention may be glass, a silicon wafer, silicone, a PET sheet, or the like.

[0021] In Example 1, a resin solution is prepared by dissolving a fluororesin as a raw resin in an appropriate solvent, and this is applied to the reinforcing body 2 to a thickness of 0.4 μm to 20 μm to form the resin thin film layer 1. In the present invention, the fluororesin film is not necessarily formed by a specific method, and any method can be used as long as it can form a thin film with a smooth and clean surface. However, the spin coating method is preferred because of its excellent accuracy in controlling the film thickness.

[0022] Next, with reference to Figure 1(c), the attachment of the frame 4 to the resin thin film 1 will be described. As shown in Figure 1(c), the frame 4 is attached to the peripheral surface of the fluororesin thin layer 1 using a silicone-based adhesive or the like. As will be described later, the frame 4 can assist in the peeling of the resin thin film 1 from the reinforcing body 2, and a transparent, homogeneous resin thin film with extremely high film cleanliness and free of defects such as wrinkles and scratches can be obtained.

[0023] A method for peeling off the resin thin film 1 will be described with reference to Figures 2 and 3. Figure 2 is a diagram showing a process for peeling off the resin thin film 1 according to the present invention from the base body 3. Figure 3 is a diagram showing the state in which the resin thin film 1 according to the present invention has been peeled off from the reinforcing body 2. First, the set of the base 3, the reinforcing body 2, the resin thin film 1 and the frame 4 (the state shown in FIG. 1(c)) is separated from the base 3 by peeling the reinforcing body 2 and the base 3 off. Next, as shown in Figure 2(a), the set of reinforcing body 2, resin thin film 1, and frame 4 is placed in a water tank AQ filled with warm water, and while applying ultrasonic waves, the set is washed with water at 10°C to 80°C to gel or dissolve the reinforcing body 2 (Figure 2(b)). Note that, according to this example, by performing ultrasonic treatment while immersed in warm water, the resin thin film is easily peeled off from the reinforcing body 2, and the reinforcing body 2 remains in the warm water. Next, as shown in FIG. 3, the resin thin film 1 is taken out together with the frame 4 from the water tank AQ.

[0024] The steps for producing the resin thin film 1 according to the present invention will be described with reference to FIG. First, as a surface treatment step, a desired resin is formed into a film on the base 3 using a coater or the like to form the reinforcing body 2 (S101). Next, in the first heat forming step, the reinforcing body 2 is heated to 120 to 160° C. using an infrared heater or the like (S102). Then, in the raw material application step, a resin thin film raw material is applied to the surface of the reinforcing body 2 to a thickness of 800 nm to form a resin film (S103). Next, in the second heat-molding step, the resin film 1 is heated to 120 to 160° C. using an infrared heater or the like (S104). Then, in a frame bonding step, a frame 4 is bonded to the surface of the resin film 1 (S105). Next, in the cooling step, the base body 3, the reinforcing body 2 and the resin film 1 are placed on a cooling plate and cooled to about 60° C. (S106). Then, after a base separation process (S107) in which the base 3 is peeled off from the reinforcing body 2 to separate it, a reinforcing body peeling process is carried out in which the reinforcing body 2 and the resin film 1 are immersed in warm water at approximately 50°C, the reinforcing body 2 is gelled, and the reinforcing body 2 is peeled off from the resin film 1 (S108). Finally, in the washing and drying step, the resin film obtained in the peeling step is washed with ethanol and dried (S109). By going through these steps, the time required to manufacture the resin thin film 1 is 9 minutes and 30 seconds for the entire process, which is a significant reduction compared to the current required time of 96 minutes.

[0025] Although the preferred embodiment of the method for producing a resin thin film according to the present invention has been illustrated and explained above, it will be understood that various modifications are possible without departing from the technical scope of the present invention. [Industrial Applicability]

[0026] The method for manufacturing a resin thin film according to the present invention allows for the production of wrinkle-free, scratch-free, transparent, and optically homogeneous resin thin films with high yield, and can therefore be widely used in the manufacture of highly integrated semiconductor products. [Explanation of symbols]

[0027] 1. Thin resin layer 2 Reinforcement 3 Base 4 Frame

Claims

1. This is a method for forming a resin thin film on a substrate and easily peeling the resin thin film from the substrate, in which a reinforcing body having a thickness of 1 μm to 1 mm is formed on the surface of the substrate using a desired resin, a raw resin is then applied to the surface of the reinforcing body to a thickness of 0.4 μm to 20 μm to form a resin thin film, and the reinforcing body is then separated from the substrate by peeling it off, and the reinforcing body with the resin thin film placed on it is washed with water at 10°C to 80°C to gel the reinforcing body, thereby peeling off the reinforcing body and the resin thin film, thereby producing a resin thin film.

2. This is a method for forming a resin thin film on a substrate and easily peeling the resin thin film from the substrate, comprising the steps of: forming a reinforcing body of a desired resin with a thickness of 1 μm to 1 mm on the surface of the substrate; applying a raw resin material to the surface of the reinforcing body to a thickness of 0.4 μm to 20 μm to form a resin thin film; adhering a frame to the resin thin film; and peeling the reinforcing body from the substrate. After that, the reinforcing body with the resin thin film placed on it is washed with water at 10°C to 80°C to gel the reinforcing body, thereby peeling the reinforcing body from the resin thin film, thereby producing a resin thin film.

3. a surface treatment step in which a desired resin is applied to a substrate to form a reinforcement body; a first heat-molding step of heating the reinforcing body to harden and mold it; a raw material application step of applying a resin thin film raw material to the surface of the reinforcing body to form a resin film; a second heat-molding step of heating and curing the resin film to form it; a frame bonding step of bonding a frame to the surface of the resin film; a cooling step of cooling the base body, the reinforcing body, and the resin film; a substrate separation step of peeling and separating the substrate from the reinforcing body; a reinforcing body peeling step of immersing the reinforcing body and the resin film in water to gel the reinforcing body and peel it off from the resin film; a drying step of washing and drying the resin film obtained in the peeling step; A method for producing a resin thin film comprising the steps of:

4. 2. The method for producing a resin thin film according to claim 1, wherein the desired resin is a resin that gels with water.

5. 3. The method for producing a resin thin film according to claim 2, wherein the desired resin is a resin that gels with water.

6. 4. The method for producing a resin thin film according to claim 3, wherein the desired resin is a resin that gels with water.

7. 2. The method for producing a resin thin film according to claim 1, wherein the desired resin is selected from the group consisting of polyacrylamide, polyvinyl alcohol, polyethylene oxide, polyvinyl acetal, carboxymethyl cellulose, and water-soluble phenolic resin.

8. 3. The method for producing a resin thin film according to claim 2, wherein the desired resin is selected from the group consisting of polyacrylamide, polyvinyl alcohol, polyethylene oxide, polyvinyl acetal, carboxymethyl cellulose, and water-soluble phenolic resin.

9. 4. The method for producing a resin thin film according to claim 3, wherein the desired resin is selected from the group consisting of polyacrylamide, polyvinyl alcohol, polyethylene oxide, polyvinyl acetal, carboxymethyl cellulose, and water-soluble phenolic resin.

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