Component mounting control device, component mounting control method, component mounting control program, and recording medium

Abstract

To cope with variation in the shape of a component mounted on a substrate due to a vendor.SOLUTION: Component database Dc (component shape information) indicating the thickness of component C for each of the plurality of vendors supplying component C is acquired (step S102). Step S103 (shape checking process) of checking the thickness of component C supplied by a vendor included in the plurality of vendors based on component database Dc is performed on component C of which board-data 122 indicates mounting on board B.SELECTED DRAWING: Figure 5A

Description

[Technical Field]

[0001] The present invention relates to a component mounting technique for mounting components on a substrate. [Background technology]

[0002] As shown in Patent Document 1, there are multiple vendors (manufacturers) that supply components having the same functions. Therefore, when components are mounted on a board, components supplied by various vendors may be used. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Patent No. 3712872 Summary of the Invention [Problem to be solved by the invention]

[0004] However, component shapes (in other words, sizes), such as component thickness, length, and width, vary depending on the vendor that supplies the component. Such variations in component shapes can affect the mounting of components onto boards. Therefore, there was a need for technology that could accommodate variations in component shapes between vendors.

[0005] The present invention has been made in view of the above-mentioned problems, and has as its object to be able to accommodate variations in the shapes of components mounted on a board due to vendors. [Means for solving the problem]

[0006] The component mounting control device of the present invention includes a board data acquisition unit that acquires board data indicating the procedure for mounting components supplied by a component supply unit onto a board using a mounting head, a shape information acquisition unit that acquires component shape information indicating the shape of the components for each of multiple vendors that supply the components, and a judgment unit that executes a shape confirmation process for components indicated by the board data to be mounted on a board, the process confirming the shape of components supplied by vendors included in the multiple vendors based on the component shape information.

[0007] The component mounting control method according to the present invention includes a step of acquiring board data indicating a procedure for mounting components supplied by a component supply unit onto a board using a mounting head; a step of acquiring component shape information indicating the shape of the components for each of a plurality of vendors supplying the components; and a step of executing a shape confirmation process for the components indicated by the board data to be mounted on the board, the process confirming the shape of the components supplied by a vendor included in the plurality of vendors based on the component shape information.

[0008] A component mounting control program according to the present invention causes a computer to execute the component mounting control method described above.

[0009] A recording medium according to the present invention records the component mounting control program in a computer-readable manner.

[0010] In the present invention (component mounting control device, component mounting control method, component mounting control program, and recording medium) configured in this manner, component shape information indicating the shape of a component for each of multiple vendors supplying the component is acquired. Then, a shape confirmation process is executed for the component indicated by the board data to be mounted on a board, confirming the shape of the component supplied by a vendor included in the multiple vendors based on the component shape information. As a result, it is possible to address variations in the shape of components mounted on a board depending on the vendor.

[0011] The component mounting control device may also be configured so that the determination unit determines whether to prohibit mounting on the board components supplied by a vendor included in the plurality of vendors based on the results of the shape confirmation process. With this configuration, it is possible to prevent problems such as interference with other components already mounted on the board caused by attempting to mount a component with an inappropriate shape on the board.

[0012] The component mounting control device may also be configured so that the determination unit creates a list of components that are prohibited from being mounted on the board. Such a list can be effectively used to deal with variations in the shapes of components mounted on the board depending on the vendor.

[0013] The board data may also include a first mounting rule that requires that a specific plurality of components to be mounted on the board in a predetermined order be mounted on the board in ascending order of thickness. The determination unit may be configured to prohibit mounting of a specific component supplied by a vendor on the board if the thickness indicated by the component shape information for that vendor does not satisfy the first mounting rule. That is, the component mounting control device may be configured to mount the multiple components in a predetermined order according to the first mounting rule to prevent interference with components previously mounted on the board. However, variations in component thicknesses among vendors may result in cases where the multiple components cannot be mounted in the predetermined order while satisfying the first mounting rule. In such cases, prohibiting the mounting of the specific component supplied by that vendor on the board can prevent interference with other components already mounted on the board.

[0014] The board data may also include a second mounting rule that requires components to be mounted at a plurality of specific mounting points in a predetermined order, in order of increasing thickness of the components to be mounted at each of the plurality of specific mounting points. The determination unit may be configured to prohibit mounting of a component supplied by a vendor at a mounting point if the thickness indicated by the component shape information for the vendor to be mounted at one of the plurality of specific mounting points does not satisfy the second mounting rule. That is, the component mounting control device may execute control such that components are mounted at the plurality of mounting points in a predetermined order in accordance with the second mounting rule in order to prevent interference with components previously mounted on the board. However, component thicknesses may vary depending on the vendor, which may result in components being unable to be mounted at the plurality of mounting points in the predetermined order while satisfying the second mounting rule. In such cases, prohibiting mounting of a component supplied by the vendor at the one mounting point can prevent interference with other components already mounted on the board.

[0015] The component mounting control device may be configured to further include an alert output unit that outputs an alert indicating the component that the determination unit has prohibited from being mounted on the board. With this configuration, it becomes possible to respond to cases where mounting of a component on the board is prohibited.

[0016] The component mounting control device may be configured to further include a display unit that displays the content of the alert output from the alert output unit. In this configuration, the worker can understand the content of the alert and take appropriate action.

[0017] The component mounting control device may also be configured so that the display unit displays the components that are prohibited from being mounted on the board indicated by the alert. With this configuration, the worker can identify the components that are prohibited from being mounted on the board and take appropriate action.

[0018] The board data may also include a first mounting rule that requires that a specific plurality of components to be mounted on the board in a predetermined order be mounted on the board in ascending order of thickness. When the determination unit determines from the result of the shape confirmation process that the specific plurality of components includes components supplied by a specific vendor and that mounting the specific plurality of components in the predetermined order would result in the thickness of the components supplied by the specific vendor not satisfying the first mounting rule, the component mounting control device may be configured to change the mounting order of the specific plurality of components from the predetermined order so that the first mounting rule is satisfied. That is, the component mounting control device may execute control such that the multiple components are mounted in the predetermined order in accordance with the first mounting rule to prevent interference with components previously mounted on the board. However, variations in component thicknesses depending on the vendor may result in a case where the multiple components cannot be mounted in the predetermined order while satisfying the first mounting rule. In such a case, the determination unit may change the mounting order of the specific plurality of components from the predetermined order so that the first mounting rule is satisfied, thereby preventing interference with other components already mounted on the board.

[0019] The board data may also include a second mounting rule that requires components to be mounted at a plurality of specific mounting points in a predetermined order, in order of increasing thickness of the components to be mounted at each of the plurality of mounting points. The component mounting control device may be configured to change the mounting order of the plurality of specific components from the predetermined order so as to satisfy the second mounting rule when the determination unit determines, based on the result of the shape confirmation process, that a mounting point at which a component supplied by a particular vendor is to be mounted is included and that mounting the components at the plurality of specific mounting points in the predetermined order does not satisfy the second mounting rule. That is, the component mounting control device may execute control such that components are mounted at the plurality of mounting points in a predetermined order in accordance with the second mounting rule in order to prevent interference with components previously mounted on the board. However, due to variations in component thickness depending on the vendor, it may be impossible to mount components at the plurality of mounting points in the predetermined order while satisfying the second mounting rule. Therefore, in such a case, by changing the order in which components are mounted at specific mounting points from the predetermined order so that the second mounting rule is satisfied, it is possible to prevent interference with other components already mounted on the board.

[0020] The component mounting control device may further include a component information acquisition unit that acquires vendor information indicating the vendor of the component set in the component supply unit, and the determination unit executes a shape confirmation process to confirm the shape of a component supplied by multiple vendors based on the component shape information, and when the component information acquisition unit acquires the vendor information indicating the vendor of the component, determines whether to prohibit mounting of the component set in the component supply unit on the board based on the result of the shape confirmation process and the vendor information. With this configuration, it is possible to prevent problems such as interference with other components already mounted on the board caused by attempting to mount a component with an inappropriate shape on the board.

[0021] The component mounting control device may further include a component information acquisition unit that acquires vendor information indicating the vendor of a component set in the component supply unit, and the determination unit, when the component information acquisition unit acquires the vendor information indicating the vendor of the component, executes a shape confirmation process to confirm the shape of the component supplied by the vendor indicated in the vendor information based on the component shape information, and determines whether to prohibit mounting of the component set in the component supply unit on the board based on the result of the shape confirmation process and the vendor information. Such a configuration can prevent problems such as interference with other components already mounted on the board caused by attempting to mount a component with an inappropriate shape on the board. [Effects of the Invention]

[0022] As described above, according to the present invention, it is possible to accommodate variations in the shapes of components mounted on a board depending on the vendor. [Brief explanation of the drawings]

[0023] [Figure 1] FIG. 1 is a diagram schematically illustrating an example of a board production system that produces boards on which components are mounted. [Figure 2] FIG. 2 is a diagram schematically illustrating an example of a component mounter used in the board production system of FIG. 1. [Figure 3] FIG. 3 is a diagram schematically showing an example of an operation executed by the component mounter of FIG. 2. [Figure 4] FIG. 10 is a diagram schematically illustrating an operation executed by a calculation unit of a server computer in response to reception of a part ID from a communication unit. [Figure 5A] 10 is a flowchart showing a first example of component mounting control. [Figure 5B] 5B is a flowchart showing the creation of a prohibition list executed in the component mounting control of FIG. 5A; [Figure 5C] 5C is a flowchart illustrating the part group verification performed in the prohibition list creation of FIG. 5B. [Figure 5D] 5C is a flowchart showing mounting point group confirmation executed in creating the prohibition list of FIG. 5B; [Figure 6A] 10 is a flowchart showing a second example of component mounting control. [Figure 6B] 6B is a flowchart showing the creation of a prohibition list executed in the component mounting control of FIG. 6A; [Figure 6C] 6C is a flowchart illustrating the part group verification performed in the prohibition list creation of FIG. 6B. [Figure 6D] 6C is a flowchart showing mounting point group confirmation executed in creating the prohibition list of FIG. 6B; [Figure 7A] 10 is a flowchart showing a third example of component mounting control. [Figure 7B] 7B is a flowchart showing the mounting order adjustment executed in the component mounting control of FIG. 7A. [Figure 7C] FIG. 7C is a diagram schematically showing the operations executed in the mounting order adjustment of FIG. 7B. DETAILED DESCRIPTION OF THE INVENTION

[0024] Fig. 1 is a diagram schematically illustrating an example of a board production system that produces boards on which components have been mounted. As shown in Fig. 1, the board production system S includes multiple (three) component mounters 2 and a server computer 100 that controls each of the component mounters 2. Each of the multiple component mounters 2 includes a control unit 20 that controls the operation of that component mounter 2. The control unit 20 is configured with a processor, for example, a CPU (Central Processing Unit), or the like.

[0025] The server computer 100 includes a calculation unit 110, a storage unit 120, a display 130, and a communication unit 140. The calculation unit 110 is configured with a processor such as a CPU (Central Processing Unit), and the storage unit 120 is configured with a storage device such as an SSD (Solid State Drive). The storage unit 120 stores a component mounting control program 121, board data 122, and the like. The component mounting control program 121 will be described later. The board data 122 defines a procedure for mounting a component C on a board B in a component mounter 2, and is prepared for each component mounter 2 and stored in the storage unit 120. The display 130 displays a screen in response to a command from the calculation unit 110, allowing the operator to view the screen displayed on the calculation unit 110. For example, the display 130 may be a device that accepts input operations by the operator, such as a touch panel display. The communication unit 140 communicates with each component mounter 2 and an external server. The component mounting control program 121 described above is downloaded from an external server via the communication unit 140 and stored in the storage unit 120, for example.

[0026] FIG. 2 is a diagram schematically illustrating an example of a component mounter used in the board production system of FIG. 1, and FIG. 3 is a diagram schematically illustrating an example of an operation executed by the component mounter of FIG. 2. In FIG. 2, the horizontal X direction, the horizontal Y direction perpendicular to the X direction, and the vertical Z direction are appropriately indicated. As shown in FIG. 3, the component mounter 2 mounts components C1, C2, C3, ... on mounting points Pm1, Pm2, Pm3, ... on the board B. Note that when mounting points Pm1, Pm2, Pm3, ... are not particularly distinguished, they will be collectively referred to as mounting points Pm, and when components C1, C2, C3, ... are not distinguished, they will be collectively referred to as components C.

[0027] 2 includes a transport unit 21 that transports a board B in the X direction (board transport direction). This transport unit 21 has a pair of conveyors 211 arranged in parallel in the X direction, and transports the board B in the X direction by the conveyors 211. The spacing between these conveyors 211 is changeable in the Y direction (width direction) that is perpendicular to the X direction, and the transport unit 21 adjusts the spacing between these conveyors 211 according to the width of the board B being transported. This transport unit 21 transports the board B from the upstream side in the X direction, which is the board transport direction, to a predetermined work position L, and transports the board B, on which components C have been mounted at work position L, from work position L to the downstream side in the X direction.

[0028] This component mounter 2 is provided with a total of four component supply carts 22. Specifically, two component supply carts 22 are lined up in the X direction on each side of the transport unit 21 in the Y direction. Each component supply cart 22 has multiple feeder set positions 221 arranged in the X direction, and a tape feeder 23 is detachably attached to each feeder set position 221. As a result, multiple tape feeders 23 are arranged in the X direction. Furthermore, each component supply cart 22 has multiple component supply reels arranged corresponding to the multiple tape feeders 23. A component storage tape is wound around the component supply reel. This component storage tape has multiple pockets arranged in a row, and components C are stored in each pocket. Each tape feeder 23 has a component supply position 231 at its tip on the transport unit 21 side in the Y direction, and intermittently feeds the component storage tape pulled out from the component supply reel toward the transport unit 21, thereby supplying components C from the component storage tape to the component supply position 231. The component C is, for example, a package component in which a resistor, a capacitor, an integrated circuit, or the like is housed in a package.

[0029] The component mounter 2 is also provided with a pair of Y-axis rails 241 extending in the Y direction, a Y-axis ball screw 242 extending in the Y direction, a Y-axis motor 243 that rotates and drives the Y-axis ball screw 242, and an X-axis rail 244. The X-axis rail 244 is fixed to a nut of the Y-axis ball screw 242 while being supported by the pair of Y-axis rails 241 so as to be movable in the Y direction. An X-axis ball screw 245 extending in the X direction and an X-axis motor 246 that rotates and drives the X-axis ball screw 245 are attached to the X-axis rail 244. The component mounter 2 is provided with a head unit 25, and the head unit 25 is fixed to a nut of the X-axis ball screw 245 while being supported by the X-axis rail 244 so as to be movable in the X direction. Therefore, the control unit 20 can rotate the Y-axis ball screw 242 using the Y-axis motor 243 to move the head unit 25 in the Y direction, or rotate the X-axis ball screw 245 using the X-axis motor 246 to move the head unit 25 in the X direction.

[0030] 2, the head unit 25 is an inline type having multiple mounting heads 26 arranged linearly in the X direction. However, the specific configuration of the head unit 25 is not limited to the example in FIG. 2, and the head unit 25 may be a rotary type having multiple mounting heads 26 arranged circumferentially. Furthermore, the number of mounting heads 26 that the head unit 25 has is not limited to multiple, and may be a single mounting head.

[0031] A nozzle 27 is detachably attached to the lower end of the mounting head 26, and the mounting head 26 picks up a component C using the nozzle 27. In this component mounter 2, the nozzle 27 attached to the mounting head 26 mounts the component C at a mounting point Pm on the board B. That is, the control unit 20 moves the mounting head 26 using the X-axis motor 246 and the Y-axis motor 243, thereby causing the nozzle 27 to face the component C supplied to the component supply position 231 from above. Next, the control unit 20 lowers the nozzle 27 using a Z-axis motor (not shown), which raises and lowers the mounting head 26, thereby bringing the nozzle 27 into contact with the upper surface of the component C supplied to the component supply position 231, and then causes the nozzle 27 to pick up the component C. Furthermore, the control unit 20 raises the nozzle 27 using the Z-axis motor. In this way, the head unit 25 picks up the component C from the component supply position 231 using the nozzle 27 of the mounting head 26. Next, control unit 20 moves mounting head 26 using X-axis motor 246 and Y-axis motor 243, thereby causing component C to be picked up by nozzle 27 to face mounting point Pm on board B from above. Furthermore, control unit 20 lowers nozzle 27 using the Z-axis motor, thereby placing component C on mounting point Pm on board B. In this way, component C supplied to component supply position 231 by tape feeder 23 is mounted on mounting point Pm.

[0032] At this time, the mounting point Pm where the mounter 2 mounts the component and the component C to be mounted at the mounting point Pm are specified in the board data 122. That is, the control unit 20 mounts the component C on the board B in accordance with the board data 122 stored in the storage unit 120. The board data 122 is generated by the calculation unit 110 of the server computer 100 and transmitted to the control unit 20 of each mounter 2 via the communication unit 140.

[0033] Next, a description will be given of the operation executed by the server computer 100. The calculation unit 110 of the server computer 100 optimizes the mounting procedure of components C on the board B in the component mounter 2, and displays a setup screen on the display 130 showing the results of determining the components C to be set at each feeder set position 221. Then, the worker sets the components C at the feeder set positions 221 in accordance with the setup screen displayed on the display 130.

[0034] The calculation unit 110 also acquires information about the component C that the worker has set at the feeder set position 221. That is, a component ID for identifying the component C is attached to the component supply reel that holds the component storage tape that stores the component C. The worker has the scanner read the component ID, and then attaches the tape feeder 23 that supplies the component C with the component ID attached to the feeder set position 221. The scanner also transmits the read component ID to the communication unit 140. When the communication unit 140 receives the component ID from the scanner, the calculation unit 110 executes the operation shown in FIG. 4.

[0035] Fig. 4 is a diagram schematically showing the operation executed by the calculation unit of the server computer in response to reception of a component ID from the communication unit. The storage unit 120 of the server computer 100 stores the vendor-specific component DB information Ic and component database Dc shown in Fig. 4. The vendor-specific component DB information Ic or component database Dc is acquired, for example, by input by an operator into the display 130, which functions as a user interface, or by downloading from an external server, and then stored in the storage unit 120.

[0036] The vendor-specific component DB information Ic shows the component name, component ID, and DB number in correspondence with each other. The component name is the name of the component C, and the same component name is assigned to the same type of component C regardless of the vendor that supplies the component C. The component ID is an identifier that identifies the component C, as described above, and the component ID differs when the combination of the component name of the component C and the vendor that supplies the component C differs. The DB number is a serial number assigned to each component ID.

[0037] The parts database Dc shows DB numbers, part names, comments, and shape data in association with one another. The DB numbers and part names are as described above. The comments are entered by the worker, and in this example indicate the company name of the vendor of part C (Company A, Company B, Company C, ...). The shape data indicates the width, length, and thickness of part C. In other words, the parts database Dc corresponds to "part shape information" that indicates the thickness of parts C with the same part name (i.e., one type of part C) for each of multiple vendors that supply that part C.

[0038] The board data 122 indicates the component number, set number, component name, comment, shape data, and DB number in correspondence with one another. The component number is a serial number indicating the order in which component C is to be mounted on board B, and the board data 122 indicates the set number, component name, comment, shape data, and DB number for component C to be mounted in the order indicated by the component number. Here, the set number is a number that identifies the feeder set position 221 at which component C is set. The component name, comment, shape data, and DB number are as described above.

[0039] When the communication unit 140 receives a component ID, the calculation unit 110 references the vendor-specific component DB information Ic to obtain the DB number associated with the component ID from the vendor-specific component DB information Ic. For example, if the component ID received by the communication unit 140 is "44105_B," the DB number "1025" is obtained. Next, the calculation unit 110 obtains the component name, comment, and shape data associated in the component database Dc with the DB number "1025" obtained from the vendor-specific component DB information Ic.

[0040] The calculation unit 110 then associates the DB number acquired from the vendor-specific component DB information Ic with the component name, comment, and shape data acquired from the component database Dc based on the DB number, and the set number, and registers them in the board data 122. The calculation unit 110 acquires the set number from the control unit 20 of the component mounter 2 via the communication unit 140. That is, when the control unit 20 detects that the worker has attached the tape feeder 23 to the feeder set position 221, it transmits the set number corresponding to the feeder set position 221 to the communication unit 140. That is, the calculation unit 110 associates the component name, comment, shape data, and DB number corresponding to the component ID received by the communication unit 140 with the set number received by the communication unit 140 following the component ID, and registers them in the board data 122.

[0041] The set number, component name, comment, shape data, and DB number acquired for component C are registered in the board data 122 in association with the component number indicating the order in which the component C is to be mounted. In this way, the feeder set position 221 in which the component C to be mounted in the order of the component number is set is associated with the component name, comment, shape data, and DB number for the component C, and are registered in the board data 122.

[0042] However, due to differences in the thickness of components C (in other words, the dimension of board B in the Z direction when placed on board B), interference may occur between component C already mounted on board B and nozzle 27. This point will be explained using FIG. 3. As shown in the "Mounting Example" column of FIG. 3, three mounting points Pm1, Pm2, and Pm3 are provided on the top surface of board B, and three components C1, C2, and C3 are mounted at the three mounting points Pm1, Pm2, and Pm3, respectively. Here, component C2 is thicker than component C1, and component C3 is thicker than component C2. Therefore, as shown in the "First Example of Interference Mode" column of FIG. 3, when component C2 is mounted at mounting point Pm2 adjacent to mounting point Pm1 and an attempt is made to mount component C1 at mounting point Pm1, nozzle 27, which is moving downward toward mounting point Pm1 while picking up component C1, interferes with component C2. Furthermore, as shown in the "Second example of interference mode" in Figure 3, when component C3 is mounted at mounting point Pm3 adjacent to mounting point Pm2 and an attempt is made to mount component C2 at mounting point Pm2, nozzle 27, which is adsorbing component C2 and descending toward mounting point Pm2, interferes with component C3.

[0043] In response to this, the calculation unit 110 optimizes the mounting procedure to avoid such interference and generates board data 122. Specifically, the board data 122 defines mounting rules that indicate the order in which mounting should be performed on board B, and the control unit 20 mounts component C at mounting point Pm in the order indicated by the mounting rules. This avoids the above-mentioned interference.

[0044] The first mounting rule (first mounting rule) is a component group mounting rule. This component group mounting rule requires that specific components C to which the rule applies be mounted on board B in ascending order of their thickness. In other words, it requires that specific components C to be mounted on board B in a predetermined order (component mounting order) be mounted on board B in ascending order of their thickness. Explaining the example of FIG. 3, it is assumed that multiple components C1, C2, and C3 are specified in board data 122 as specific components C1, C2, and C3 to be mounted in a predetermined component mounting order (the order of components C1, C2, and C3). In this case, the component group mounting rule requires that specific components C1, C2, and C3 be mounted on board B in ascending order of their thickness, i.e., in the order of components C1, C2, and C3.

[0045] The second mounting rule (second mounting rule) is a mounting point group mounting rule. This mounting point group mounting rule requires that, for a specific plurality of mounting points Pm to which the rule applies, components C be mounted at the specific plurality of mounting points Pm in ascending order of thickness of the components C to be mounted at each of the specific plurality of mounting points Pm. In other words, for a specific plurality of mounting points Pm at which components C are to be mounted in a predetermined order (mounting point mounting order), it requires that components C be mounted at the specific plurality of mounting points Pm in ascending order of thickness of the components C to be mounted at each of the specific plurality of mounting points Pm. Using the example of FIG. 3 as an example, it is assumed that multiple mounting points Pm1, Pm2, and Pm3 are specified in the board data 122 as specific multiple mounting points Pm1, Pm2, and Pm3 at which components C1, C2, and C3 are to be mounted in a predetermined mounting point mounting order (the order of mounting points Pm1, Pm2, and Pm3). In this case, the mounting point group mounting rule requires that for a specific number of mounting points Pm1, Pm2, Pm3, component C is mounted at the multiple mounting points Pm1, Pm2, Pm3 in the order of the thicknesses of the components C1, C2, C3 to be mounted at each of the specific mounting points Pm1, Pm2, Pm3, i.e., in the order of mounting points Pm1, Pm2, Pm3.

[0046] However, the thickness of component C can vary depending on the vendor that supplies that component C. Therefore, if the vendor of component C set at feeder set position 221 is changed after board data 122 is generated to avoid interference, it may not be possible to comply with mounting rules such as component group mounting rules or mounting point group mounting rules. Therefore, server computer 100 executes the following component mounting control.

[0047] Fig. 5A is a flowchart showing a first example of component mounting control, Fig. 5B is a flowchart showing prohibition list creation executed in the component mounting control of Fig. 5A, Fig. 5C is a flowchart showing component group confirmation executed in the prohibition list creation of Fig. 5B, and Fig. 5D is a flowchart showing mounting point group confirmation executed in the prohibition list creation of Fig. 5B. The component mounting control of Fig. 5A is defined by component mounting control program 121, and calculation unit 110 executes the component mounting control of Fig. 5A in accordance with component mounting control program 121.

[0048] 5A, in step S101, the calculation unit 110 acquires the board data 122 stored in the storage unit 120. In step S102, the calculation unit 110 acquires the vendor-specific component DB information Ic stored in the storage unit 120. In step S103, the calculation unit 110 creates a list (prohibition list) of components C that are prohibited from being mounted on the board B in order to comply with the mounting rules.

[0049] 5B, in creating the prohibition list, the calculation unit 110 executes component group confirmation (step S201). As shown in FIG. 5C (component group confirmation), in step S301, a component count value Nc for identifying a component C scheduled to be mounted in the board data 122 is reset to zero, and in step S302, the component count value Nc is incremented by 1. Here, the component count value Nc is an integer equal to or greater than 1 and corresponds to the component No. in the board data 122.

[0050] In step S303, it is determined whether a group number is set for the component C (target component C) with the component count value Nc, in other words, whether the target component C is included in the specific multiple components C to which the component group mounting rule defined by the board data 122 applies. If the target component C is not included in the specific multiple components C (if "NO" in step S303), the process returns to step S302. On the other hand, if the target component C is included in the specific multiple components C (if "YES" in step S303), the process proceeds to step S304. In step S304, the thicknesses of the components C before and after the target component C in the component mounting order indicated by the board data 122 are confirmed. That is, the thickness Tcb of the component C that will be mounted immediately before the target component C in the component mounting order and the thickness Tca of the component C that will be mounted immediately after the target component C are confirmed. Note that, among the multiple components C to which the component group mounting rule applies, if a component C exists either before or after the target component C in the component mounting order, the thickness of only that component C is acquired.

[0051] In step S305, a vendor count value Nv that identifies multiple vendors that supply the component C (target component C) with the component count value Nc is reset to zero, and in step S306, the vendor count value Nv is incremented by 1. Here, the vendor count value Nv is an integer equal to or greater than 1.

[0052] In step S307, the calculation unit 110 determines whether the component group mounting rule is satisfied. Specifically, if the thickness Tcc of a target component C supplied by a vendor with a vendor count value of Nv conflicts with the prohibition condition that the thickness Tcb is greater than the thickness Tcc or the prohibition condition that the thickness Tca is smaller than the thickness Tcc, the calculation unit 110 determines that the component group mounting rule is not satisfied (step S307: NO), and the target component C supplied by the vendor with a vendor count value of Nv is registered on the prohibition list (step S308). Specifically, the component ID indicating the target component C supplied by the vendor is registered on the prohibition list, and mounting of the component C with that component ID on the board B is prohibited. Then, the calculation unit 110 proceeds to step S309. On the other hand, if the thickness Tcc does not conflict with either of the prohibition conditions, the calculation unit 110 determines that the component group mounting rule is satisfied (step S307: YES), and the calculation unit 110 proceeds to step S309.

[0053] In step S309, it is determined whether the vendor count value Nv has reached the maximum value Nvx. Here, the maximum value Nvx is the number of vendors that supply the component C (target component C) with the component count value Nc. If the vendor count value Nv is less than the maximum value Nvx ("NO" in step S309), steps S306 to S308 are repeated. If the vendor count value Nv has reached the maximum value Nvx ("YES" in step S309), the process proceeds to step S310.

[0054] In step S310, it is determined whether the component count value Nc has reached the maximum value Ncx. Here, the maximum value Ncx corresponds to the maximum value of the component No. registered in the board data 122. If the component count value Nc is less than the maximum value Ncx ("NO" in step S310), steps S302 to S309 are repeated. If the component count value Nc has reached the maximum value Ncx ("YES" in step S310), component group confirmation is terminated.

[0055] As shown in Fig. 5B, in creating a prohibition list, component group confirmation (step S201) is performed. Once this is completed, mounting point group confirmation is performed (step S202). As shown in Fig. 5D (mounting point group confirmation), in step S401, a mounting point count value Nm for identifying mounting points Pm at which components C are scheduled to be mounted in board data 122 is reset to zero, and in step S402, the mounting point count value Nm is incremented by 1. Here, the mounting point count value Nm is an integer equal to or greater than 1, and corresponds to the mounting order of components C at each mounting point Pm specified in board data 122.

[0056] In step S403, it is determined whether a group number is set for the mounting point Pm (target mounting point Pm) of the mounting point count value Nm, in other words, whether the target mounting point Pm is included in the specific multiple mounting points Pm to which the mounting point group mounting rule defined by the board data 122 is applied. If the target mounting point Pm is not included in the specific multiple mounting points Pm (if "NO" in step S403), the process returns to step S402. On the other hand, if the target mounting point Pm is included in the specific multiple mounting points Pm (if "YES" in step S403), the process proceeds to step S404. In step S404, the thicknesses of the components C to be mounted at the mounting points Pm before and after the target mounting point Pm in the mounting point mounting order indicated by the board data 122 are confirmed. That is, the thickness Tmb of the component C to be mounted at the mounting point Pm immediately before the target mounting point Pm and the thickness Tma of the component C to be mounted at the mounting point Pm immediately after the target mounting point Pm in the mounting point mounting order are confirmed. In addition, among multiple mounting points Pm to which the mounting point group mounting rule is applied, if a mounting point Pm exists only either before or after the target mounting point Pm in the mounting point mounting order, the thickness of the component C to be mounted at only that one mounting point Pm is obtained.

[0057] In step S405, a vendor count value Nv that identifies multiple vendors supplying a component C to be mounted at a mounting point Pm (target mounting point Pm) of the mounting point count value Nm is reset to zero, and in step S406, the vendor count value Nv is incremented by 1. Here, the vendor count value Nv is an integer equal to or greater than 1.

[0058] In step S407, the calculation unit 110 determines whether the mounting point group mounting rule is satisfied. Specifically, if the thickness Tmc of a component C supplied by a vendor with a vendor count value Nv and mounted at a target mounting point Pm conflicts with the prohibition condition that the thickness Tmb is greater than the thickness Tmc or the prohibition condition that the thickness Tma is smaller than the thickness Tmc, it is determined that the mounting point group mounting rule is not satisfied (step S407: NO), and the component C supplied by a vendor with a vendor count value Nv and mounted at a target mounting point Pm is registered in the prohibition list (step S408). Specifically, the component ID indicating the component C supplied by that vendor is registered in the prohibition list, and mounting of the component C assigned with that component ID on the board B is prohibited. Then, the process proceeds to step S409. On the other hand, if the thickness Tmc does not conflict with either of the two prohibition conditions, it is determined that the mounting point group mounting rule is satisfied ("YES" in step S407), and the process proceeds to step S409.

[0059] In step S409, it is determined whether the vendor count value Nv has reached the maximum value Nvx. Here, the maximum value Nvx is the number of vendors that supply components C to be mounted at the mounting points Pm of the mounting point count value Nm. If the vendor count value Nv is less than the maximum value Nvx ("NO" in step S409), steps S406 to S408 are repeated. If the vendor count value Nv has reached the maximum value Nvx ("YES" in step S409), the process proceeds to step S410.

[0060] In step S410, it is determined whether the mounting point count value Nm has reached the maximum value Nmx. Here, the maximum value Nmx corresponds to the number of mounting points Pm where the board data 122 indicates the mounting of components C. If the mounting point count value Nm is less than the maximum value Nmx ("NO" in step S410), steps S402 to S409 are repeated. If the mounting point count value Nm has reached the maximum value Nmx ("YES" in step S410), mounting point group confirmation is terminated.

[0061]

[0063] When the creation of the prohibition list in step S103 of Fig. 5A is thus completed, step S104 of Fig. 5A is executed. When communication unit 140 acquires a component ID from the scanner ("YES" in step S104) and acquires feeder set position 221 from control unit 20 ("YES" in step S105), calculation unit 110 determines whether the component ID acquired in step S104 is registered in the prohibition list. If the component ID is registered in the prohibition list ("YES" in step S106), calculation unit 110 displays a screen on display 130 indicating that mounting of component C set at feeder set position 221 acquired in step S105 on board B is prohibited (step S107). On the other hand, if the component ID is not registered in the prohibition list ("NO" in step S106), the calculation unit 110 displays a screen on the display 130 indicating that mounting of component C set at the feeder set position 221 obtained in step S105 onto board B is permitted (step S108).

[0062] In the embodiment described above, a component database Dc (component shape information) indicating the thickness of component C for each of multiple vendors supplying the component C is acquired (step S102). Then, step S103 (shape confirmation process) is executed for a component C whose board data 122 indicates that it will be mounted on a board B, in which the thickness of the component C supplied by a vendor included in the multiple vendors is confirmed based on the component database Dc. As a result, it is possible to accommodate variations in the thickness of the component C to be mounted on a board B depending on the vendor.

[0063] Furthermore, the calculation unit 110 (determination unit) determines, based on the result of step S103 (shape confirmation process), whether or not to prohibit mounting of a component C supplied by a vendor included in the multiple vendors onto the board B. With this configuration, it is possible to prevent problems such as interference with other components C already mounted on the board B due to an attempt to mount a component C having an inappropriate thickness onto the board B.

[0064] Furthermore, the calculation unit 110 creates a list of components C that are prohibited from being mounted on the board B (step S308). Such a prohibition list can be effectively used to deal with variations in the thickness of components C mounted on the board B depending on the vendor.

[0065] The board data 122 also includes a component group mounting rule (first mounting rule) that requires that a specific plurality of components C to be mounted on the board B in a predetermined component mounting order be mounted on the board B in ascending order of thickness. If the thickness indicated in the component database Dc for a vendor supplying one of the specific plurality of components C does not satisfy the component group mounting rule (if "NO" in step S307), the calculation unit 110 prohibits the mounting of the component C supplied by the vendor on the board B (step S308). That is, in order to prevent interference with a component C previously mounted on the board B, the calculation unit 110 can execute control such that the multiple components C are mounted in a component mounting order that conforms to the component group mounting rule. However, as a result of variations in the thickness of components C depending on the vendor, it may be impossible to mount the multiple components C in a component mounting order that satisfies the component group mounting rule. In such a case, by prohibiting the mounting of the component C supplied by the vendor on the board B, interference with other components C already mounted on the board B can be prevented.

[0066] Furthermore, the board data 122 includes a mounting point group mounting rule (second mounting rule) that requires that, for a specific plurality of mounting points Pm at which components C are mounted in a predetermined mounting point mounting order, components C are mounted at the multiple mounting points Pm in ascending order of thickness. If the thickness indicated in the component database Dc for a vendor supplying a component C to be mounted at one of the specific plurality of mounting points Pm does not satisfy the mounting point group mounting rule ("NO" in step S407), the calculation unit 110 prohibits mounting of the component C supplied by the vendor at the one mounting point Pm. In other words, in order to prevent interference with a component C previously mounted on the board B, control can be executed to mount components C at multiple mounting points Pm in a mounting point mounting order that complies with the mounting point group mounting rule. However, as a result of variations in the thickness of components C depending on the vendor, it may be impossible to mount components C at multiple mounting points Pm in a mounting point mounting order that satisfies the mounting point group mounting rule. Therefore, in such a case, by prohibiting the component C supplied by the vendor from being mounted at the one mounting point Pm, it is possible to prevent interference with other components C already mounted on the board B.

[0067] Furthermore, the calculation unit 110 (alert output unit) outputs an alert indicating component C that is prohibited from being mounted on board B. With this configuration, it becomes possible to deal with the case where mounting of component C on board B is prohibited.

[0068] Also provided is a display 130 (display unit) that displays the content of the alert output from the calculation unit 110. With this configuration, the operator can understand the content of the alert and take appropriate action.

[0069] Furthermore, the display 130 displays the component C that is prohibited from being mounted on the board B indicated by the alert. With this configuration, the worker can recognize the component C that is prohibited from being mounted on the board B and take appropriate action.

[0070] The component supply cart 22 (component supply unit) also includes a communication unit 140 (component information acquisition unit) that acquires a component ID (vendor information) that indicates the vendor of the component C set at the feeder set position 221. The calculation unit 110 (determination unit) executes step S103 (shape confirmation process) to confirm the thickness of one component C supplied by multiple vendors based on the component database Dc. When the communication unit 140 acquires the component ID that indicates the vendor of the one component C (YES in step S104), it determines whether or not to prohibit mounting of the one component C set at the feeder set position 221 of the component supply cart 22 on the board based on the result of step S307 and the component ID (step S106). This configuration can prevent problems such as interference with other components C already mounted on the board B due to an attempt to mount a component C with an inappropriate thickness on the board B.

[0071] Fig. 6A is a flowchart showing a second example of component mounting control, Fig. 6B is a flowchart showing prohibition list creation executed in the component mounting control of Fig. 6A, Fig. 6C is a flowchart showing component group confirmation executed in the prohibition list creation of Fig. 6B, and Fig. 6D is a flowchart showing mounting point group confirmation executed in the prohibition list creation of Fig. 6 B. The component mounting control of Fig. 6A is defined by component mounting control program 121, and calculation unit 110 executes the component mounting control of Fig. 6A in accordance with component mounting control program 121.

[0072] 6A, in step S501, the calculation unit 110 acquires the board data 122 stored in the storage unit 120. In step S502, the calculation unit 110 acquires the vendor-specific component DB information Ic stored in the storage unit 120. Then, when the communication unit 140 acquires the component ID from the scanner ("YES" in step S503) and acquires the feeder set position 221 from the control unit 20 ("YES" in step S504), the calculation unit 110 checks whether mounting of the component C identified by the component ID acquired in step S503 should be prohibited (step S505, prohibition check).

[0073] As shown in Fig. 6B, in creating the prohibition list, the calculation unit 110 executes component group confirmation (step S601). As shown in Fig. 6C (component group confirmation), in step S701, it is determined whether a group number is set for the component C of the component ID (target component ID) acquired in step S503, in other words, whether the component C of the target component ID is included in the specific multiple components C to which the component group mounting rule defined by the board data 122 applies. If the component C of the target component ID is not included in the specific multiple components C (if "NO" in step S601), it is determined that mounting of the component C of the target component ID is permitted (step S705), and the component group confirmation ends.

[0074] On the other hand, if the component C of the target component ID (target component C) is included in the specific multiple components C (if "YES" in step S701), the process proceeds to step S702. In step S702, the thicknesses of the components C before and after the target component C in the component mounting order indicated by the board data 122 are confirmed. That is, the thickness Tcb of the component C that will be mounted immediately before the target component C in the component mounting order and the thickness Tca of the component C that will be mounted immediately after the target component C in the component mounting order are confirmed. Note that, among the multiple components C to which the component group mounting rule is applied, if a component C exists either before or after the target component C in the component mounting order, the thickness of only that component C is acquired.

[0075] In step S703, the calculation unit 110 determines whether the component group mounting rule is satisfied. Specifically, if the thickness Tcc of the target component C conflicts with the prohibition condition that the thickness Tcb is greater than the thickness Tcc or the prohibition condition that the thickness Tca is less than the thickness Tcc, it is determined that the component group mounting rule is not satisfied (step S703: NO), and it is decided that mounting of the target component C is prohibited (step S704). Then, the component group confirmation is terminated. On the other hand, if the thickness Tcc does not conflict with either of the prohibition conditions, it is determined that the component group mounting rule is satisfied (step S703: YES), and it is decided that mounting of the component C with the target component ID is permitted (step S705). Then, the component group confirmation is terminated.

[0076] As shown in FIG. 6B, in creating a prohibition list, component group confirmation (step S601) is performed. Once this is completed, mounting point group confirmation is performed (step S602). As shown in FIG. 6D (mounting point group confirmation), in step S801, the mounting point count value Nm, which identifies the mounting points Pm at which components C are scheduled to be mounted in board data 122, is reset to zero, and in step S802, the mounting point count value Nm is incremented by 1. Here, the mounting point count value Nm is an integer equal to or greater than 1, and corresponds to the mounting order of components C at each mounting point Pm specified in board data 122.

[0077] In step S803, it is determined whether or not the component C (target component C) with the target component ID acquired in step S503 will be mounted at the mounting point Pm with the mounting point count value Nm. If the target component C is not mounted at the mounting point Pm with the mounting point count value Nm ("NO" in step S803), it is determined that mounting of the component C with the target component ID is permitted (step S808), and the process proceeds to step S809.

[0078] On the other hand, if the target component C is to be mounted at the mounting point Pm of the mounting point count value Nm (if "YES" in step S803), it is determined whether a group number is set for the mounting point Pm of the mounting point count value Nm, in other words, whether the mounting point Pm of the mounting point count value Nm (target mounting point Pm) is included in the specific multiple mounting points Pm to which the mounting point group mounting rule defined by the board data 122 applies (step S804). If the target mounting point Pm is not included in the specific multiple mounting points Pm (if "NO" in step S804), it is determined that mounting of the component C of the target component ID is permitted (step S808), and the process proceeds to step S809.

[0079] On the other hand, if the target mounting point Pm is included in the specific multiple mounting points Pm (if "YES" in step S804), the process proceeds to step S805. In step S805, the thicknesses of the components C to be mounted at the mounting points Pm before and after the target mounting point Pm in the mounting point mounting order indicated by the board data 122 are confirmed. That is, the thickness Tmb of the component C to be mounted at the mounting point Pm immediately before the target mounting point Pm in the mounting point mounting order and the thickness Tma of the component C to be mounted at the mounting point Pm immediately after the target mounting point Pm are confirmed. Note that, among the multiple mounting points Pm to which the mounting point group mounting rule is applied, if there is a mounting point Pm only either before or after the target mounting point Pm in the mounting point mounting order, the thickness of the component C to be mounted at only that mounting point Pm is acquired.

[0080] In step S806, the calculation unit 110 determines whether the mounting point group mounting rule is satisfied. Specifically, if the thickness Tmc of the target component C to be mounted at the target mounting point Pm conflicts with the prohibition condition that the thickness Tmb is greater than the thickness Tmc or the prohibition condition that the thickness Tma is smaller than the thickness Tmc, it is determined that the mounting point group mounting rule is not satisfied ("NO" in step S806), and it is determined that mounting of the component C with the target component ID (target component C) is prohibited (step S807). Then, the process proceeds to step S809.

[0081] In step S809, it is determined whether the mounting point count value Nm has reached the maximum value Nmx. Here, the maximum value Nmx corresponds to the number of mounting points Pm where the board data 122 indicates the mounting of components C. If the mounting point count value Nm is less than the maximum value Nmx ("NO" in step S809), steps S802 to S808 are repeated. If the mounting point count value Nm has reached the maximum value Nmx ("YES" in step S809), mounting point group confirmation is completed.

[0082] Thus, when the prohibition check of step S505 in FIG. 6A is completed, step S506 in FIG. 6A is executed. In step S506, it is determined whether the prohibition check determined that mounting of component C (target component C) having the target component ID acquired in step S503 is prohibited. If it is determined that mounting is prohibited (if "YES" in step S506), the calculation unit 110 displays a screen on the display 130 indicating that mounting of component C set at the feeder set position 221 acquired in step S504 onto board B is prohibited (step S507). On the other hand, if it is determined that mounting is permitted (if "NO" in step S506), the calculation unit 110 displays a screen on the display 130 indicating that mounting of component C set at the feeder set position 221 acquired in step S504 onto board B is permitted (step S508).

[0083] In the embodiment described above, a component database Dc (component shape information) is acquired that indicates the thickness of component C for each of multiple vendors that supply the component C. Then, step S505 (shape confirmation process) is executed for a component C whose board data 122 indicates that it will be mounted on a board B, in order to confirm the thickness of the component C supplied by a vendor included in the multiple vendors based on the component database Dc. As a result, it is possible to accommodate variations in the thickness of the component C to be mounted on a board B depending on the vendor.

[0084] Furthermore, the calculation unit 110 (determination unit) determines whether or not to prohibit mounting of a component C supplied by a vendor included in the multiple vendors on the board B based on the result of step S505 (shape confirmation process). With this configuration, it is possible to prevent problems such as interference with other components C already mounted on the board B due to an attempt to mount a component C having an inappropriate thickness on the board B.

[0085] The board data 122 also includes a component group mounting rule (first mounting rule) that requires that a specific plurality of components C to be mounted on the board B in a predetermined component mounting order be mounted on the board B in ascending order of thickness. If the thickness indicated in the component database Dc for a vendor supplying one of the specific plurality of components C does not satisfy the component group mounting rule (if "NO" in step S703), the calculation unit 110 prohibits the mounting of the component C supplied by the vendor on the board B (step S704). That is, in order to prevent interference with a component C previously mounted on the board B, the calculation unit 110 can execute control such that the multiple components C are mounted in a component mounting order that conforms to the component group mounting rule. However, as a result of variations in the thickness of components C depending on the vendor, it may be impossible to mount the multiple components C in a component mounting order that satisfies the component group mounting rule. In such a case, by prohibiting the mounting of the component C supplied by the vendor on the board B, interference with other components C already mounted on the board B can be prevented.

[0086] Furthermore, the board data 122 includes a mounting point group mounting rule (second mounting rule) that requires that, for a specific plurality of mounting points Pm at which components C are mounted in a predetermined mounting point mounting order, components C be mounted at the multiple mounting points Pm in ascending order of thickness. If the thickness indicated in the component database Dc for a vendor supplying a component C to be mounted at one of the specific plurality of mounting points Pm does not satisfy the mounting point group mounting rule ("NO" in step S806), the calculation unit 110 prohibits mounting of the component C supplied by the vendor at the one mounting point Pm (step S807). That is, in order to prevent interference with a component C previously mounted on the board B, control can be executed such that components C are mounted at multiple mounting points Pm in a mounting point mounting order that complies with the mounting point group mounting rule. However, as a result of variations in the thickness of components C depending on the vendor, it may be impossible to mount components C at multiple mounting points Pm in a mounting point mounting order that satisfies the mounting point group mounting rule. Therefore, in such a case, by prohibiting the component C supplied by the vendor from being mounted at the one mounting point Pm, it is possible to prevent interference with other components C already mounted on the board B.

[0087] Furthermore, the calculation unit 110 (alert output unit) outputs an alert indicating component C that is prohibited from being mounted on board B. With this configuration, it becomes possible to deal with the case where mounting of component C on board B is prohibited.

[0088] Also provided is a display 130 (display unit) that displays the content of the alert output from the calculation unit 110. With this configuration, the operator can understand the content of the alert and take appropriate action.

[0089] Furthermore, the display 130 displays the component C that is prohibited from being mounted on the board B indicated by the alert. With this configuration, the worker can recognize the component C that is prohibited from being mounted on the board B and take appropriate action.

[0090] The component supply cart 22 further includes a communication unit 140 (component information acquisition unit) that acquires a component ID (vendor information) indicating the vendor of a component C set at the feeder set position 221 of the component supply cart 22 (component supply unit). When the component database Dc acquires the component ID (vendor information) indicating the vendor of a component C ("YES" in step S504), the calculation unit 110 executes step S505 (shape confirmation process) to confirm the thickness of the component C supplied by the vendor indicated by the component ID based on the component database Dc. Then, based on the result of step S505 and the component ID, the calculation unit 110 determines whether or not to prohibit mounting of the component C set at the feeder set position 221 of the component supply cart 22 onto the board B. This configuration can prevent problems such as interference with other components C already mounted on the board B due to an attempt to mount a component C with an inappropriate thickness onto the board B.

[0091] Fig. 7A is a flowchart showing a third example of component mounting control, Fig. 7B is a flowchart showing mounting order adjustment executed in the component mounting control of Fig. 7A, and Fig. 7C is a diagram schematically showing operations executed in the mounting order adjustment of Fig. 7B. The component mounting control of Fig. 7A is defined by component mounting control program 121, and calculation unit 110 executes the component mounting control of Fig. 57 in accordance with component mounting control program 121.

[0092] 7A, in step S901, the calculation unit 110 acquires the board data 122 stored in the storage unit 120. In step S902, the calculation unit 110 acquires the vendor-specific component DB information Ic stored in the storage unit 120. Then, when the communication unit 140 acquires the component ID from the scanner ("YES" in step S903) and acquires the feeder set position 221 from the control unit 20 ("YES" in step S904), the calculation unit 110 adjusts the mounting order of the component C identified by the component ID acquired in step S903 (step S905).

[0093] 7B (mounting order adjustment), in step S1001, a mounting point count value Nm for identifying mounting points Pm at which components C are scheduled to be mounted in the board data 122 is reset to zero, and in step S1002, the mounting point count value Nm is incremented by 1. Here, the mounting point count value Nm is an integer equal to or greater than 1, and corresponds to the mounting order of components C at each mounting point Pm defined in the board data 122.

[0094] In step S1003, it is determined whether or not the component C (target component C) with the target component ID acquired in step S903 is mounted at the mounting point Pm of the mounting point count value Nm. If the target component C is not mounted at the mounting point Pm of the mounting point count value Nm ("NO" in step S1003), the process returns to step S1002.

[0095] On the other hand, if the target component C is to be mounted at the mounting point Pm of the mounting point count value Nm (if "YES" in step S1003), it is determined whether a group number is set for the mounting point Pm of the mounting point count value Nm, in other words, whether the mounting point Pm of the mounting point count value Nm (target mounting point Pm) is included in the specific multiple mounting points Pm to which the mounting point group mounting rule defined by the board data 122 is applied (step S1004). If the target mounting point Pm is not included in the specific multiple mounting points Pm (if "NO" in step S1004), the process returns to step S1002.

[0096] On the other hand, if the target mounting point Pm is included in the specific multiple mounting points Pm (if "YES" in step S1004), the process proceeds to step S1005. In step S1005, the thicknesses of the components C to be mounted at the mounting points Pm before and after the target mounting point Pm in the mounting point mounting order indicated by the board data 122 are confirmed. That is, the thickness Tmb of the component C to be mounted at the mounting point Pm immediately before the target mounting point Pm in the mounting point mounting order and the thickness Tma of the component C to be mounted at the mounting point Pm immediately after the target mounting point Pm are confirmed. Note that, among the multiple mounting points Pm to which the mounting point group mounting rule is applied, if there is a mounting point Pm either before or after the target mounting point Pm in the mounting point mounting order, the thickness of the component C to be mounted at only that mounting point Pm is acquired.

[0097] In step S1006, the calculation unit 110 determines whether the mounting point group mounting rule is satisfied. Specifically, when the thickness Tmc of a target component C to be mounted at a target mounting point Pm conflicts with a prohibition condition that the thickness Tmb is greater than the thickness Tmc or a prohibition condition that the thickness Tma is smaller than the thickness Tmc, the order in which components C are mounted at the two mounting points Pm related to the relevant prohibition condition is swapped, and the mounting point mounting order in the board data 122 is updated. For example, when the prohibition condition that the thickness Tmb is greater than the thickness Tmc is violated, the mounting order of the component C with the thickness Tmb and the component C with the thickness Tmc is swapped. Alternatively, when the prohibition condition that the thickness Tma is smaller than the thickness Tmc is violated, the mounting order of the component C with the thickness Tma and the component C with the thickness Tmc is swapped.

[0098] In step S1008, it is determined whether the mounting point count value Nm has reached the maximum value Nmx. Here, the maximum value Nmx corresponds to the number of mounting points Pm where the board data 122 indicates the mounting of components C. If the mounting point count value Nm is less than the maximum value Nmx ("NO" in step S1008), steps S1002 to S1007 are repeated. If the mounting point count value Nm has reached the maximum value Nmx ("YES" in step S1008), the mounting order adjustment is completed.

[0099] In the example of Fig. 7C, the three mounting points Pm mounted in mounting point mounting orders 2, 3, and 4 are targets for which the mounting point group mounting rule is applied. In the initial state of board data 122 before the mounting order adjustment is started, the thicknesses of the components C mounted at the three mounting points Pm in mounting point mounting orders 2, 3, and 4 are small, medium, and large (medium is larger than small, and large is larger than medium), respectively, which satisfies the mounting point group mounting rule. However, the thickness of the component C mounted at mounting point Pm in mounting point mounting order 4 has changed from large to minimal (minimal is smaller than small). As a result, the component C mounted at mounting point Pm in mounting point mounting order 4 no longer complies with the mounting point group mounting rule.

[0100] Therefore, the determination in step S1006 of the mounting order adjustment in Fig. 7B is "NO," and the order is changed (step S1007). As a result, as shown in the "first loop" in Fig. 7C, the order in which the minimum thickness component C is mounted at the mounting point Pm and the order in which the medium thickness component C is mounted at the mounting point Pm are switched. Furthermore, as shown in the "second loop" in Fig. 7C, the order in which the minimum thickness component C is mounted at the mounting point Pm and the order in which the small thickness component C is mounted at the mounting point Pm are switched.

[0101] Furthermore, board data 122 includes a mounting point group mounting rule (second mounting rule) that requires that, for a specific plurality of mounting points Pm at which components C are to be mounted in a predetermined mounting point mounting order, components C be mounted at the multiple mounting points Pm in ascending order of thickness of the components C to be mounted at each of the multiple mounting points Pm. When calculation unit 110 (determination unit) determines from the result of step S1006 (shape confirmation process) that a mounting point Pm at which components C supplied by one vendor are to be mounted is included among the specific plurality of mounting points Pm, and that mounting components C at the specific plurality of mounting points Pm in the mounting point mounting order would result in the thickness of the components C supplied by the one vendor not satisfying the mounting point group mounting rule, calculation unit 110 changes the mounting order of the specific plurality of components C from the initial mounting point mounting order so that the mounting point group mounting rule is satisfied. In other words, in order to suppress interference with components C that have been previously mounted on board B, control can be executed such that components C are mounted at the multiple mounting points Pm in a mounting point mounting order that complies with the mounting point group mounting rule. However, as a result of variations in the thickness of components C depending on the vendor, it may be impossible to mount components C at multiple mounting points Pm in the mounting point mounting order while satisfying the mounting point group mounting rule. In such cases, by changing the order in which components C are mounted at specific multiple mounting points Pm from the mounting point mounting order so that the mounting point group mounting rule is satisfied, it is possible to prevent interference with other components C that have already been mounted on the board B.

[0102] Note that the third example of component mounting control may be modified so that the same control is applied to the component group mounting rule. In this modification, the board data 122 includes a component group mounting rule (first mounting rule) that requires that a specific plurality of components C to be mounted on the board B in a predetermined component mounting order be mounted on the board B in ascending order of thickness. If the calculation unit 110 determines that the specific plurality of components C includes components C supplied by a single vendor and that mounting the specific plurality of components C in the component mounting order would result in thicknesses of the components C supplied by the single vendor not satisfying the component group mounting rule, the calculation unit 110 changes the mounting order of the specific plurality of components C so that the component group mounting rule is satisfied. In other words, control can be executed to mount the multiple components C in a component mounting order that complies with the component group mounting rule in order to suppress interference with the component C previously mounted on the board B. However, as a result of variations in the thickness of components C depending on the vendor, it may be impossible to mount the multiple components C in the component mounting order that satisfies the component group mounting rule. In such a case, the order in which specific components C are mounted can be changed so that the component group mounting rules are satisfied, thereby preventing interference with other components C already mounted on the board B.

[0103] As described above, in this embodiment, the component supply cart 22 and the tape feeder 23 correspond to an example of a "component supply unit" of the present invention, the component C corresponds to an example of a "component" of the present invention, the mounting head 26 corresponds to an example of a "mounting head" of the present invention, the board B corresponds to an example of a "board" of the present invention, the board data 122 corresponds to an example of "board data" of the present invention, the calculation unit 110 corresponds to an example of a "board data acquisition unit" of the present invention, the component database Dc corresponds to an example of "component shape information" of the present invention, the storage unit 120 corresponds to an example of a "shape information acquisition unit" of the present invention, the calculation unit 110 corresponds to an example of a "determination unit" of the present invention, and the server computer 100 corresponds to an example of a "component implementation unit" of the present invention. the component group mounting rule corresponds to an example of a "first mounting rule" of the present invention, the mounting point Pm corresponds to an example of a "mounting point" of the present invention, the mounting point group mounting rule corresponds to an example of a "second mounting rule" of the present invention, the calculation unit 110 corresponds to an example of an "alert output unit" of the present invention, the display 130 corresponds to an example of a "display unit" of the present invention, the communication unit 140 corresponds to an example of a "component information acquisition unit" of the present invention, the component ID corresponds to an example of "vendor information" of the present invention, the component mounting control program 121 corresponds to an example of a "component mounting control program" of the present invention, and the storage unit 120 or the external server corresponds to an example of a "recording medium" of the present invention.

[0104] The present invention is not limited to the above-described embodiment, and various modifications can be made to the above-described embodiment without departing from the spirit of the present invention. For example, prohibiting mounting of a component C that does not satisfy the mounting point group mounting rule may be achieved by prohibiting mounting of the component C only at one mounting point Pm to which the mounting point group mounting rule applies, while permitting mounting of the component C at other mounting points Pm.

[0105] Furthermore, the number of components C to which the component group mounting rule is applied is not limited to three, but may be two, four or more.

[0106] Furthermore, the number of mounting points Pm to which the mounting point group mounting rule is applied is not limited to three, but may be two, four or more.

[0107] The above embodiment also addresses vendor-specific variations in the thickness of component C. However, the embodiment can be modified to address vendor-specific variations in the length or width of component C. In such a modification, a component database Dc (component shape information) indicating the length or width of component C for each of multiple vendors supplying that component C is acquired (step S102). Then, step S103 (shape confirmation process) is executed for a component C whose board data 122 indicates that it will be mounted on board B, in which the length or width of the component C supplied by a vendor included in the multiple vendors is confirmed based on the component database Dc. As a result, it becomes possible to address vendor-specific variations in the length or width of component C to be mounted on board B. [Explanation of symbols]

[0108] 100...Server computer 110...Arithmetic section 120...Storage section 121...Component mounting control program 122...Board data 130...Display 140…Communications Department 22...Parts supply cart 23...Tape feeder 26...Mounting head B...Substrate C…Parts Dc...Parts database ID…Parts Pm...Mounting point

Claims

1. a board data acquisition unit that acquires board data indicating a procedure for mounting components supplied by the component supply unit onto a board by the mounting head; a shape information acquisition unit that acquires component shape information indicating the shape of the component for each of a plurality of vendors that supply the component; a determining unit that executes a shape confirmation process for confirming the shapes of components supplied by vendors included in the plurality of vendors based on the component shape information for components indicated by the board data to be mounted on the board; A component mounting control device comprising:

2. The component mounting control device according to claim 1 , wherein the determining unit determines whether or not to prohibit mounting of components supplied by a vendor included in the plurality of vendors on the board based on a result of the shape confirmation process.

3. The component mounting control device according to claim 2 , wherein the determination unit creates a list of components that are prohibited from being mounted on the board.

4. the board data includes a first mounting rule that requires that a plurality of specific components to be mounted on a board in a predetermined order be mounted on the board in ascending order of thickness; 3. The component mounting control device according to claim 2, wherein the judgment unit prohibits mounting of one of the specific plurality of components supplied by a vendor on the board if the thickness indicated by the component shape information for that vendor does not satisfy the first mounting rule.

5. the board data includes a second mounting rule that requires that, for a plurality of specific mounting points at which components are mounted in a predetermined order, components are mounted at the plurality of mounting points in ascending order of thickness; 3. The component mounting control device according to claim 2, wherein, when the thickness indicated by the component shape information for a vendor that supplies a component to be mounted at one of the specific plurality of mounting points does not satisfy the second mounting rule, the judgment unit prohibits mounting of the component supplied by that vendor at the one mounting point.

6. The component mounting control device according to claim 2 , further comprising an alert output unit that outputs an alert indicating the component that the determination unit has prohibited from being mounted on the board.

7. The component mounting control device according to claim 6 , further comprising a display unit that displays the content of the alert output from the alert output unit.

8. The component mounting control device according to claim 7 , wherein the display unit displays the component that is prohibited from being mounted on the board, as indicated by the alert.

9. the board data includes a first mounting rule that requires that a plurality of specific components to be mounted on a board in a predetermined order be mounted on the board in ascending order of thickness; 2. The component mounting control device according to claim 1, wherein, when the judgment unit determines from the result of the shape confirmation process that the specific plurality of components includes components supplied by a single vendor and that if the specific plurality of components are mounted in the specified order, the thickness of the components supplied by the single vendor will not satisfy the first mounting rule, the judgment unit changes the order in which the specific plurality of components are mounted from the specified order so that the first mounting rule is satisfied.

10. the board data includes a second mounting rule that requires that, for a plurality of specific mounting points at which components are mounted in a predetermined order, components are mounted at the plurality of mounting points in ascending order of thickness; 2. The component mounting control device according to claim 1, wherein, when the specific plurality of mounting points includes a mounting point on which a component supplied by a single vendor is mounted, and when the determination unit determines from the result of the shape confirmation process that when the components are mounted on the specific plurality of mounting points in the specified order, the thickness of the component supplied by the single vendor does not satisfy the second mounting rule, the determination unit changes the order in which the specific plurality of components are mounted from the specified order so that the second mounting rule is satisfied.

11. a component information acquisition unit that acquires vendor information indicating a vendor of the component set in the component supply unit; 3. The component mounting control device according to claim 2, wherein the judgment unit executes the shape confirmation process to confirm the shape of a component supplied by the plurality of vendors based on the component shape information, and when the component information acquisition unit acquires the vendor information indicating the vendor of the component, the component mounting control device determines whether to prohibit the component set in the component supply unit from being mounted on a board based on the result of the shape confirmation process and the vendor information.

12. a component information acquisition unit that acquires vendor information indicating a vendor of a component set in the component supply unit; 3. The component mounting control device according to claim 2, wherein when the component information acquisition unit acquires the vendor information indicating the vendor of the one component, the judgment unit executes a shape confirmation process to confirm the shape of the component supplied by the vendor indicated in the vendor information based on the component shape information, and determines whether to prohibit the one component set in the component supply unit from being mounted on a board based on the result of the shape confirmation process and the vendor information.

13. acquiring board data indicating a procedure for mounting components supplied by a component supply unit onto a board by a mounting head; acquiring part shape information indicating the shape of the part for each of a plurality of vendors that supply the part; a step of executing a shape confirmation process for confirming the shapes of components supplied by vendors included in the plurality of vendors based on the component shape information for components indicated by the board data to be mounted on the board; A component mounting control method comprising:

14. A component mounting control program that causes a computer to execute the component mounting control method according to claim 13.

15. A recording medium on which the component mounting control program according to claim 14 is recorded so as to be readable by a computer.

Images