Setting support device and setting support program for measurement device

Abstract

To improve the measurement accuracy of a pin even when the tip shape of the pin is different.SOLUTION: A setting part 31c of a setting support device 1 of a measuring instrument has a tool for measuring a predetermined measuring object as a measuring item, receives designation of a measuring area and designation of an object area for specifying the measuring object in the measuring area in response to selection of the tool, and sets the tool including the measuring area and a filter parameter for measuring the measuring object according to the designation of the measuring area and a size of the object area and / or a representative height in the object area. The symbol corresponding to the target region is displayed on the height image, the measurement target corresponding to the filter parameter in the measurement region is specified based on the setting of the tool, and the measurement of the tool is executed based on the measurement value of the specified measurement target.SELECTED DRAWING: Figure 3

Description

[Technical Field]

[0001] The present disclosure relates to a setting support device and a setting support program for a measurement device that performs measurement of a measurement object. [Background technology]

[0002] For example, the pin terminal bend inspection device disclosed in Patent Document 1 is configured to acquire an image of a pin mounted on a circuit board or a pin provided on a connector plug while irradiating the pin with illumination light, and judge whether the pin is good or bad based on the amount of bend calculated based on the acquired image. In Patent Document 1, the amount of bend of the pin is defined as the amount of deviation of the center position of the tip of the pin from the center position of the base of the pin. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Japanese Patent Application Publication No. 11-040307 Summary of the Invention [Problem to be solved by the invention]

[0004] However, when measuring pins optically as in Patent Document 1, the image of the pin is likely to contain noise, making it difficult to accurately capture the shape of the pin. As another example, when optically measuring scratches on the surface of an object, the scratches themselves have very minute shapes, making it difficult to accurately capture the shape of the scratch. The distinction between what should be considered a target and what should be considered noise differs depending on the object being measured. As a result, there is a risk of a decrease in the accuracy of the pin tip position and the scratch measurement.

[0005] The present disclosure has been made in consideration of such points, and its purpose is to improve the measurement accuracy of the object to be measured by making it easier to distinguish between what should be the target and what should be noise depending on the object to be measured. [Means for solving the problem]

[0006] In order to achieve the above-mentioned object, a setting support device for a measuring device according to one embodiment of the present disclosure includes a receiving unit that receives shape data, a setting unit that sets one or more measurement elements and measurement items using the one or more measurement elements, an execution unit that performs measurements of the measurement items set by the setting unit for the shape data received by the receiving unit, and a screen generation unit that displays a height image based on the shape data received by the receiving unit in two dimensions and / or three dimensions, has a display area that displays the one or more measurement elements on the height image, and generates a display screen including a result display element that shows the results of the measurement performed by the execution unit.

[0007] The setting unit has a tool for measuring a specified measurement object as the measurement item, and in response to the selection of the tool, it can accept specification of a measurement area on the height image and specification of a target area for identifying the measurement object within the measurement area, and set a tool including a measurement area and filter parameters for measuring the measurement object according to the specification of the measurement area and the size of the target area and / or the representative height in the target area.

[0008] The screen generator displays a symbol corresponding to the target area on the height image. The execution unit identifies a measurement target in the measurement area according to the filter parameters based on the setting of the tool, and executes the measurement of the tool based on the measurement value of the identified measurement target.

[0009] According to this configuration, when setting up the tool, the specification of the measurement area and the target area for identifying the measurement target within the measurement area are accepted, making it easy to set up a distinction between what should be the target and what should be noise depending on the measurement target.

[0010] Another aspect of the present disclosure may be based on a setting support program for a measurement device executable by a processing device. The setting support program for a measurement device may cause the processing device to execute the following processes: receiving shape data, setting one or more measurement elements and measurement items using the one or more measurement elements, performing measurements of the measurement items for the shape data, and generating a display screen that displays a height image based on the shape data in two dimensions and / or three dimensions, has a display area for displaying the one or more measurement elements on the height image, and includes a result display element showing a result of the measurement; and, in response to a selection of a tool for measuring a predetermined measurement object, accepts designation of a measurement area and designation of a target area for identifying the measurement object within the measurement area on the height image, and sets a tool including a measurement area and filter parameters for measuring the measurement object according to the designation of the measurement area, a size of the target area, and / or a representative height of the target area; and displays a symbol corresponding to the target area on the height image, identifies the measurement object in the measurement area according to the filter parameters based on the setting of the tool, and performs measurement with the tool based on a measurement value of the identified measurement object. [Effects of the Invention]

[0011] As described above, according to the present disclosure, by facilitating the setting of a distinction between what should be a target and what should be noise depending on the measurement target, it is possible to improve the measurement accuracy of the measurement target. [Brief explanation of the drawings]

[0012] [Figure 1] FIG. 1 is a diagram illustrating the configuration of a setting support device for a measurement device according to a first embodiment of the present invention. [Figure 2] FIG. 2 is a diagram illustrating the configuration of a setting support device for a measurement device according to a second embodiment of the present invention. [Figure 3] FIG. 3 is a block diagram of a setting support device for a measurement device. [Figure 4]FIG. 4 is a flowchart showing an example of the flow of processing during setting. [Figure 5] FIG. 5 is a perspective view of the measurement object. [Figure 6] FIG. 6 is a plan view of the object to be measured. [Figure 7] FIG. 7 is a diagram showing an example of a reference image for pattern matching. [Figure 8] FIG. 8 is a diagram illustrating a case where pattern matching processing is performed on an input image. [Figure 9] FIG. 9 is a diagram showing a user interface screen that displays the object to be measured in two dimensions and three dimensions. [Figure 10] FIG. 10 is a diagram showing a user interface screen for specifying a reference plane. [Figure 11] FIG. 11 is a diagram showing a user interface screen for specifying a measurement region. [Figure 12] FIG. 12 is a diagram illustrating the operation of specifying a plurality of measurement regions. [Figure 13] FIG. 13 is a view equivalent to FIG. 9, showing a state in which the operation of specifying the measurement area has been completed. [Figure 14] FIG. 14 is a diagram equivalent to FIG. 12, illustrating the case of a measurement object having a different shape. [Figure 15] FIG. 15 shows the pin tool setting window. [Figure 16] FIG. 16 shows the origin specification window. [Figure 17] FIG. 17 is a diagram for explaining how to specify the origin. [Figure 18] FIG. 18 is a diagram showing another example of the origin designation window. [Figure 19] FIG. 19 is an example of a CSV file for specifying the center coordinates of each measurement area. [Figure 20] FIG. 20 is a conceptual diagram of the case where local coordinates are converted into global coordinates. [Figure 21] FIG. 21 is a diagram for explaining how to convert the center position of the local coordinate system into the center position of the global coordinate system. [Figure 22] FIG. 22 shows a plurality of pins with different tip shapes. [Figure 23] FIG. 23 is a diagram showing an example of a screen display when accepting the specification of an initial value. [Figure 24] FIG. 24 is a flowchart showing an example of the flow of measurement processing. [Figure 25] FIG. 25 is a diagram showing the result display screen. [Figure 26] FIG. 26 is a diagram illustrating the difference in display form between when the XY position of the pin tip is outside the tolerance range and when it is within the tolerance range. [Figure 27] FIG. 27 is a flowchart showing the flow of processing after tool selection. [Figure 28] FIG. 28 is a schematic diagram for explaining the processing content of the flaw tool. [Figure 29] FIG. 29 is a view of the flaw tool window showing the largest flaw being specified. [Figure 30] FIG. 30 is an illustration of the window for the flaw tool showing the specification of the detection size. [Figure 31] FIG. 31 is a diagram for explaining the processing contents of the fine scratch tool. [Figure 32] FIG. 32 is a view of the window for the fine flaw tool showing the largest flaw being specified. [Figure 33] FIG. 33 is a diagram of the window for the fine flaw tool showing the case where the detection size is specified. [Figure 34] FIG. 34 is a flowchart showing an example of the flow of processing during operation of the measurement device. DETAILED DESCRIPTION OF THE INVENTION

[0013] A measurement device setting support device and a measurement device setting support program according to an embodiment of the present invention will be described in detail below with reference to the drawings. Note that the following description of the preferred embodiment is essentially merely an example and is not intended to limit the present invention, its applications, or its uses.

[0014] 1 is a diagram illustrating the configuration of a measurement device setting support device 1 according to a first embodiment of the present invention. In the first embodiment, the measurement device setting support device (hereinafter simply referred to as "setting support device") 1 is separate from the measurement device 100 that is to be set by the setting support device 1. For example, the setting support device 1 and the measurement device 100 may be installed in different locations, or the user of the setting support device 1 may be different from the user who uses the measurement device 100 on-site, and in such cases, the first embodiment can be applied.

[0015] The setting support device 1 of the first embodiment includes a measurement head 2, a processing device 3, a display unit 4, and an operation unit 5. The processing device 3 stores measurement setting information in a storage medium 6, and the measurement setting information can be loaded into the measurement device 100 via the storage medium 6. The storage medium 6 is composed of, for example, a semiconductor memory, a hard disk drive, an optical disk, etc. After the measurement setting information created by the processing device 3 is stored in the storage medium 6, the storage medium 6 can be removed from the processing device 3 and connected to the measurement device 100, thereby loading the measurement setting information stored in the storage medium 6 into the measurement device 100. In the first embodiment, the storage medium 6 can be omitted, and the setting support device 1 and the measurement device 100 can be connected via a communication line, and the measurement setting information created by the processing device 3 can be loaded into the measurement device 100 via the communication line. The communication line may be wired or wireless. In the case of the first embodiment, during operation, an image of the measurement object is acquired by a separate measurement head (not shown) included in the measurement device 100, and measurement is performed.

[0016] 2 is a diagram illustrating the configuration of a measurement device setting support device 1 according to a second embodiment of the present invention. In the second embodiment, the measurement device 100 and the setting support device 1 are used in a connected state. For example, the measurement device 100 and the setting support device 1 are connected via a communication line 101, enabling communication between the measurement device 100 and the setting support device 1. The communication line may be wired or wireless.

[0017] The setting support device 1 of the second embodiment, like the first embodiment, includes a measuring head 2, a processing device 3, a display unit 4, and an operation unit 5. In the second embodiment, the measuring head 2 is connected to the measuring device 100, and therefore the measuring head 2 may be included in the measuring device 100. During use, the measuring head 2 acquires an image of the object to be measured and performs measurement. In this case, the setting support device 1 can use the measuring head 2 of the measuring device 100 to perform measurement settings. However, the measuring head 2 may be a part of the setting support device 1.

[0018] As described above, there are various embodiments of the setting support device 1, and it is also possible to use the setting support device 1 in embodiments other than the above-described embodiments 1 and 2. The setting support device 1 of embodiment 1 and the setting support device 1 of embodiment 2 have the same effects. The display unit 4 does not have to be included as a component constituting the setting support device 1. Alternatively, the setting support device 1 may be one in which the display unit 4 and the processing device 3 are integrated. Alternatively, the setting support device 1 may be one in which the operation unit 5 and the processing device 3 are integrated.

[0019] (Measuring head configuration) Fig. 3 is a block diagram of the setting support device 1. Since Fig. 3 corresponds to the first embodiment shown in Fig. 1, the measuring head 2 is connected to the processing device 3. Although not shown, in the case of the second embodiment shown in Fig. 2, the measuring head 2 is connected to the measuring device 100, and the measuring device 100 is connected to the setting support device 1. Therefore, the measuring head 2 is connected to the setting support device 1 via the measuring device 100, and the shape data acquired by the measuring head 2 can be received by the setting support device 1 via the measuring device 100.

[0020] The measurement head 2 is a device that captures an image of the measurement object W to generate shape data, and is composed of devices capable of acquiring three-dimensional shape data, such as a profiler, a structured illumination three-dimensional camera, or a stereo camera. The measurement object W measured by the measurement head 2 is not particularly limited, but examples include devices, instruments, components, devices, units, etc. that have pins. More specifically, examples include a circuit board with one or more pins, a connector plug with one or more pins, or an electrical device that has a circuit board or connector plug. The measurement object W may also be a component manufactured by cutting, molding, or the like, and have a flat or curved surface. The measurement object W may also be a component without pins.

[0021] The measurement object W may be stationary or may be transported in a predetermined direction by, for example, a conveyor A. At a site where a plurality of measurement objects W are transported sequentially, the transported measurement objects W can also be measured sequentially by the measuring head 2.

[0022] The measurement head 2 has a light-projecting element 20, an image sensor 21, a light-projecting / light-receiving control unit 22, a setting storage unit 23, a profile generation unit 24, and a head-side communication unit 25. The light-projecting element 20 is composed of, for example, an LED (Light Emitting Diode) or the like, is arranged to face the measurement object W, and is a component that irradiates illumination light onto the measurement object W. The image sensor 21 is composed of, for example, a CMOS (Complementary Metal-Oxide-Semiconductor) or other image sensor, is arranged to face the measurement object W, receives light reflected from the measurement object W, generates a signal according to the amount of received light, and outputs the signal to the profile generation unit 24.

[0023] The light projection and reception control unit 22 is a unit that controls the light projection element 20 and the image pickup element 21. The setting storage unit 23 is a unit that stores setting information for light projection and reception. The setting information for light projection and reception includes, for example, the light emission amount and light emission timing of the light projection element 20, the image pickup timing, exposure time, gain, etc. The setting information for light projection and reception stored in the setting storage unit 23 can be created by the setting support device 1 and transmitted to the measurement head 2 in the first embodiment, or can be created by the setting support device 1 or the measuring device 100 and transmitted to the measurement head 2 in the second embodiment. In either case, the setting information for light projection and reception can be stored in the setting storage unit 23, and the light projection and reception control unit 22 controls the light projection element 20 and the image pickup element 21 based on the setting information for light projection and reception stored in the setting storage unit 23.

[0024] The profile generation unit 24 generates shape data based on a signal related to the distribution of received light intensity transmitted from the image sensor 21, and is composed of, for example, a processor. A planar coordinate system (local coordinates) is predefined for the measurement head 2. The shape data generated by the profile generation unit 24 can be composed of planar position information according to the planar coordinate system predefined for the measurement head 2 and height information corresponding to each planar position in the planar coordinate system. For example, the planar position information according to the planar coordinate system can be composed of the XY coordinates of a grid-like array of points and the Z coordinates corresponding to each point. The points constituting the shape data are arranged in a grid pattern in the X and Y directions, so that they are equally spaced in the X and Y directions. The spacing between the points in the X and Y directions may be the same or different. Such shape data is called a distance image or height image, and image processing for two-dimensional images can be applied by treating the height information as brightness information. In addition to planar position information and height information, the shape data may also include brightness information corresponding to each planar position.

[0025] The head-side communication unit 25 is composed of a communication module and a communication interface that can communicate with the main body-side communication unit 30 of the processing device 3. The shape data generated by the profile generation unit 24 is transmitted to the processing device 3 via the head-side communication unit 25. In addition, light emission and reception setting information is received via the head-side communication unit 25.

[0026] The processing device 3 is configured, for example, by a desktop or notebook personal computer. The processing device 3 has a main body communication unit 30, a processor 31, and a storage device 32. The main body communication unit 30 is configured by a communication module and a communication interface that can communicate with the head communication unit 25 of the measuring head 2. The shape data generated by the profile generation unit 24 of the measuring head 2 is received by the main body communication unit 30. Therefore, the main body communication unit 30 is an example of a receiving unit of the present invention. The shape data is not limited to data generated by the measuring head 2, and may be, for example, three-dimensional CAD data. In the case of CAD data, it can be received by the main body communication unit 30 via a communication line such as the Internet.

[0027] The processor 31 includes, for example, a central processing unit (CPU), a ROM (read-only memory), a RAM (random access memory), etc. The ROM stores, for example, a system program, etc. The ROM is used as a working area when the central processing unit executes various processes.

[0028] The storage device 32 stores a measurement device setting support program (hereinafter simply referred to as the "setting support program") that can be executed by the processing device 3. The setting support program can be distributed in a state where it is stored on a storage medium B such as an optical disk or semiconductor memory, or it can be distributed, for example, via an internet line. In either distribution form, the setting support program can be stored in the storage device 32, i.e., installed.

[0029] The processor 31 can configure a height image generating unit 31a, a receiving unit 31b, a setting unit 31c, an execution unit 31d, and a screen generating unit 31e by executing a setting assistance program stored in the storage device 32. The height image generating unit 31a, the receiving unit 31b, the setting unit 31c, the execution unit 31d, and the screen generating unit 31e can be configured as a combination of hardware and software. Furthermore, parts of the height image generating unit 31a, the receiving unit 31b, the setting unit 31c, the execution unit 31d, and the screen generating unit 31e may be configured by one or more separate processors (not shown). The separate processors may be located separately from the processor 31. The processor 31 can execute the setting assistance program to cause the processing device 3 to perform each process described below.

[0030] The setting unit 31c is a part that executes a process of setting one or more measurement elements and measurement items using the one or more measurement elements during setting by the setting support device 1. The execution unit 31d is a part that executes measurement of the measurement items set by the setting unit 31c on shape data received by the main body side communication unit 30 when performing measurement after setting, and the execution unit 31d executes a process of executing measurement of the measurement items on the shape data.

[0031] The setting assistance program may be stored in a ROM or the like instead of or in addition to the storage device 32. The processor 31 may also directly read and execute the setting assistance program from the storage medium B. The setting assistance program may be stored on a so-called cloud server, in which case the setting assistance device 1 can provide setting assistance by accessing the cloud server.

[0032] The operation unit 5 is composed of, for example, a keyboard, a mouse, various pointing devices, etc. The operation unit 5 is connected to the reception unit 31b of the processor 31. The operation state of the operation unit 5 by the user is received by the reception unit 31b. This makes it possible to detect what operation the user has performed.

[0033] The display unit 4 is configured with, for example, a liquid crystal display panel, an organic EL (Electro Luminescence) panel, etc. The display unit 4 is connected to a screen generation unit 31e of the processor 31. Data constituting the display screen generated by the screen generation unit 31e is transmitted to the display unit 4 and displayed on the display unit 4.

[0034] The storage device 32 is provided with a tool storage section 32a. The tool storage section 32a stores a plurality of measurement tools (for example, measurement tool 1, measurement tool 2, etc.) for performing various measurements. The measurement tools include a pin tool for measuring pins as a measurement item, as well as a tool for measuring height, a tool for measuring flatness, etc.

[0035] The storage device 32 further includes a registered image storage section 32b, an image synthesis setting storage section 32c, and a measurement setting storage section 32d. The registered image storage section 32b stores images of the measurement object W captured in advance. The image synthesis setting storage section 32c stores setting information such as whether or not to perform synthesis processing on height images. The measurement setting storage section 32d stores measurement elements, measurement items, etc.

[0036] 4 is a flowchart showing the flow of processing during setting by the setting support device 1. During setting, the user operates the operation unit 5, and the setting unit 31c executes processing to set measurement elements and measurement items using the measurement elements. The setting process will be specifically described below.

[0037] This flowchart starts when a user performs a setting execution operation. In this embodiment, an example of measuring a measurement object W as shown in Figures 5 and 6 will be described. The measurement object W has a substrate W1, a plurality of pins W2 provided so as to protrude upward from the substrate W1, and a protrusion W3 protruding from the edge of the substrate W1.

[0038] When the user performs a setting execution operation, the measuring head 2 is caused to capture an image of the measurement target W, and the shape data generated by the profile generating unit 24 of the measuring head 2 is received by the main body side communication unit 30. This process is a process for receiving the shape data.

[0039] Then, in step SA1, the height image settings are accepted. In step SA1, the height image generating unit 31a reads whether or not height image synthesis processing is performed, which is stored in the image synthesis setting storage unit 32c, and if height image synthesis processing is performed, executes height image synthesis processing using the shape data. This results in a height image, which is temporarily stored. If height image synthesis processing is not performed, height image synthesis processing is not performed. In step SA1, the IP address of the measuring head 2 can also be specified.

[0040] In step SA2, a reference image 200 for pattern matching is registered, for example, as shown in Fig. 7. The reference image 200 for pattern matching is an image of the measurement target W captured from above by the measurement head 2, and is used when aligning the height image input at the start of setup so that it is at a predetermined position and inclination.

[0041] In step SA2, designation of an alignment region 201 in a reference image 200 for pattern matching is accepted from the user. With the reference image 200 for pattern matching being displayed on the display unit 4 by the screen generation unit 31e, the user operates the operation unit 5 to designate the alignment region 201. The designation operation of the alignment region 201 is accepted by the acceptance unit 31b. In this embodiment, the alignment region 201 is designated so as to include a protrusion W3, which has a characteristic shape in a planar view. The reference image 200 for pattern matching and the alignment region 201 are stored in an associated state in the registered image storage unit 32b.

[0042] For example, when a height image (input image 210) such as that shown on the left side of Fig. 8 is input, the execution unit 31d executes pattern matching based on the reference image 200 for pattern matching and the alignment region 201 shown in Fig. 7. As a result, the input image 210 can be rotated as shown on the right side of Fig. 8 and moved in the X direction or Y direction as necessary to align it with the reference image 200 for pattern matching shown in Fig. 7. Note that pattern matching does not have to be performed, and if pattern matching is not performed, step SA2 can be omitted.

[0043] In step SA3, as shown in FIG. 9, the screen generator 31e generates a setting display screen 220 for displaying a setting image and displays it on the display unit 4. The setting display screen 220 is provided with a three-dimensional display area 221 for three-dimensionally displaying a height image of the measurement target W and a two-dimensional display area 223 for two-dimensionally displaying the height image of the measurement target W, and the screen generator 31e generates a user interface screen that can simultaneously display the height image in three dimensions and the height image in two dimensions. In this manner, the screen generator 31e executes a process for generating various display screens. The screen generator 31e may generate a user interface screen that can only display the height image in three dimensions or the height image in two dimensions, or may generate a user interface screen that can switch between the three-dimensional display of the height image and the two-dimensional display of the height image.

[0044] In step SA4, it is determined whether the user selected the pin tool from among multiple measurement tools. When a measurement tool is selected, the screen generation unit 31e generates a user interface screen for selecting a measurement tool and displays it on the display unit 4. The user interface screen for selecting a measurement tool allows selection of various measurement tools in addition to the pin tool, and the user can select a desired measurement tool by operating the operation unit 5. Other measurement tools may include a flaw tool for measuring flaws such as dents on the surface of the measurement object W having a flat or curved surface, and a fine flaw tool for measuring flaws smaller than dents. In this embodiment, the setting unit 31c has a pin tool for measuring pins as one of the measurement items. The pin tool allows pins to be set as measurement elements and measurement items using pins to be set. When the reception unit 31b accepts that the pin tool has been selected, the setting unit 31c enters a state in which the pin tool has been selected. On the other hand, when the reception unit 31b accepts that a measurement tool other than the pin tool has been selected, the setting unit 31c enters a state in which a measurement tool other than the pin tool (referred to as a different tool) has been selected.

[0045] If a tool other than the pin tool is selected, step SA4 is judged as NO and the process proceeds to step SA5, where another tool process is executed. The other tool may include a scratch tool or a fine scratch tool. If the pin tool is selected, step SA4 is judged as YES and the process proceeds to step SA6.

[0046] In step SA6, the setting unit 31c accepts the designation of a reference plane. The reference plane is a measurement element, and in this embodiment, measurement items can be set using a pin and a reference plane. Specifically, the screen generation unit 31e generates a user interface screen 230 for designating the reference plane as shown in FIG. 10 and displays it on the display unit 4. The user interface screen 230 for designating the reference plane includes an image display area 231 that displays a two-dimensional height image of the measurement target W, a tool name display area 232, and an operation instruction area 233. The tool name display area 232 displays "Pin Tool" as the name of the selected tool. The operation instruction area 233 displays the operation procedure for designating the reference plane, so the user can designate the reference plane while viewing the operation procedure displayed in the operation instruction area 233.

[0047] The white arrow indicated by the reference symbol 231a in the image display area 231 is a mouse pointer included in the operation unit 5. The user can move the pointer 231a on the image (the image displayed in the image display area 231) in which the height image is displayed two-dimensionally by operating the operation unit 5. The user uses the pointer 231a to sequentially specify at least three points on the height image. For example, if the top surface of the substrate W1 of the measurement target W is used as the reference plane, the user can move the pointer 231a to any point on the top surface of the substrate W1 and click to specify that point as the first point for specifying the plane, and the X and Y coordinates of the first point are acquired. In other words, the user specifies the X and Y coordinates of a point for specifying the reference plane. This is repeated to specify the second and third points on the top surface of the substrate W1. The specification of these first to third points is accepted by the setting unit 31c. The setting unit 31c may also accept specification of the fourth, fifth, ... points.

[0048] By specifying three or more points during setup, a plane fitted to the height of each pixel at the positions specified by the X and Y coordinates of at least three points specified during setup can be specified as the reference plane during measurement. The height from this reference plane can then be used as the measured value. Note that, in addition to the height from the reference plane, the Z coordinate of the height image (height of the measuring head 2) itself can also be set to be used as the measured value.

[0049] In step SA7, the setting unit 31c accepts the designation of a measurement area in response to the selection of the pin tool. Specifically, the screen generation unit 31e generates a user interface screen 240 for designating a measurement area, as shown in FIG. 11, and displays it on the display unit 4. The user interface screen 240 for designating a measurement area includes an image display area 241 for two-dimensionally displaying a height image of the measurement target W, a designation method selection area 242, an array designation area 243, a shape designation area 244, and an operation instruction area 245. The designation method selection area 242 allows the user to select whether to designate the measurement area as an "area" or an "array." Designating the measurement area as an "array" indicates that multiple measurement areas exist within a certain range, and the arrangement of the measurement areas arranged within that range is specified. Specifically, the number of rows and columns of the measurement areas arranged within the range are individually specified in the array designation area 243. This allows the arrangement of multiple measurement areas arranged within the range to be identified. The setting unit 31c accepts a designation in the designation method selection area 242 and a designation in the arrangement designation area 243.

[0050] The shape of the measurement area can be specified in the shape specification area 244. Examples of the shape of the measurement area include a circle and a rectangle. When the measurement area is specified as an "array," the shape of the measurement area is specified collectively for all of the multiple measurement areas. In this way, the setting unit 31c accepts the specification of the shape of the measurement area in the shape specification area 244.

[0051] When the measurement area is designated as an "array," the setting unit 31c identifies the range of existence of multiple measurement areas based on the user's designation of three points on the height image. The operation instruction area 245 displays the operation procedure for designating the range of existence of the measurement area, indicating that the operation of designating three points in order is sufficient. The user can perform the operation of identifying the range of existence of the measurement area while looking at the operation procedure displayed in the operation instruction area 245.

[0052] Specifically, when a height image of the measurement target W is displayed two-dimensionally as shown in image display area 241A in Fig. 12 , the user operates pointer 241a via operation unit 5 to sequentially specify points P1, P2, and P3, as shown in image display area 241B, in the same manner as when specifying a reference plane. The order in which points P1, P2, and P3 are specified is the order in which they are displayed in operation explanation area 245 in Fig. 11 . When points P1, P2, and P3 are specified, screen generation unit 31e generates a rectangular box B1 having points P1, P2, and P3 as vertices and displays it in image display area 241B. By specifying points P1, P2, and P3, even if the range of the measurement area is tilted with respect to the horizontal line of the screen, a rectangular box B1 with an inclination angle corresponding to the inclination can be generated.

[0053] Simultaneously with or after the rectangular box B1 is displayed, the screen generator 31e generates and displays area boxes C0 to C8 in the image display area 241C, which indicate the position, size, and shape of the measurement area, as shown in the image display area 241C. The area boxes C0 to C8 correspond to the measurement area, and the user can understand the size, position, etc. of the measurement area by looking at the area boxes C0 to C8.

[0054] This example shows a case where the number of rows and the number of columns are specified as 3 in the array specification area 243 shown in Fig. 11, and therefore area boxes C0 to C8 indicating nine measurement areas are automatically displayed in the image display area 241C in Fig. 12. In the initial setting, the row spacing and column spacing of the area boxes C0 to C8 are set to equal intervals. Specifically, the row spacing of the area boxes C0 to C8 is set to equal intervals that divide the row dimension of the rectangular box B1, and the column spacing of the area boxes C0 to C8 is set to equal intervals that divide the column dimension of the rectangular box B1.

[0055] As shown in this example, there may be eight pins W2 on the measurement target W, which is different from the number specified in the array specification area 243. In this case, as shown in the image display area 241D, the user operates the operation unit 5 to delete the area box C5 and change the positions of the area boxes C3 and C4 so that the pin W2 is included. In this way, by operating the operation unit 5, the user can delete any one or more of the area boxes C0 to C8 and move any one or more of the area boxes. The setting unit 31c accepts the designation of the area box to be deleted and the movement of the area box.

[0056] The size of the measurement area at the initial setting is set so that adjacent measurement areas do not touch each other. This size of the measurement area at the initial setting can be changed to correspond to the size of the area where the pin W2 actually exists. The user can change the size of the area box C0 to any size by operating the operation unit 5, for example, selecting the area box C0 and dragging the area box C0 in the direction of decreasing or increasing the size. Since multiple pins W2 often have the same thickness, when the size of the area box C0 is changed, the screen generation unit 31e changes the size of the other area boxes C1 to C4 and C6 to C8 to the same size as the area box C0 and displays them in the image display area 241D. In this way, for example, the sizes of the other area boxes C1 to C4 and C6 to C8 are changed in conjunction with the change in the size of the area box C0.

[0057] Changes to the sizes of the area boxes C1 to C4, C6 to C8 are accepted by the setting unit 31c. That is, the setting unit 31c accepts a change to the size of a first measurement area (e.g., area box C0), which is any one of the multiple measurement areas arranged in the existence range, and when the change to the size of the first measurement area is accepted, the sizes of the other measurement areas (e.g., area boxes C1 to C8) are set to the changed size of the first measurement area. This allows the sizes of multiple area boxes C0 to C8 to be changed all at once, reducing the burden on the user when making settings.

[0058] When the position and size of the area boxes C0 to C8 are changed by a user operation, the center coordinates of each measurement area are changed. Once the position and size of the area boxes C0 to C8 are fixed, the setting unit 31c specifies the center coordinates of each measurement area.

[0059] Once the setting of the region boxes C0 to C8 is complete, the process proceeds to step SA8. In step Sa8, as shown in Fig. 13, the region boxes C0 to C8 (excluding region box C5) are displayed in three-dimensional form in the three-dimensional display area 221, with their lengths in the height direction of the pin W2, and the region boxes C0 to C8 (excluding region box C5) are displayed in a planar form in the two-dimensional display area 223. This allows the user to easily determine whether the setting of the region boxes C0 to C8 corresponds to the measurement target W. After confirmation, the position, shape, and size of the region boxes C0 to C8 can be modified.

[0060] The arrangement of the pins W2 of the measurement target W may differ from that shown in FIGS. 5 and 6. FIG. 14 shows an image display area 241E in which a height image of such a measurement target W is displayed in two dimensions. In this case, the origin of the local coordinate system and the center coordinates of each measurement area are specified. The center coordinates of each measurement area can be input using, for example, a CSV file.

[0061] That is, when setting the measurement region of the measurement target W shown in FIG. 14, the screen generator 31e generates a pin tool setting window 250 as shown in FIG. 15 and displays it on the display unit 4. The pin tool setting window 250 is provided with a reference plane designation section 251 for designating the reference plane described above, a measurement region designation section 252 for designating the measurement region, a pin tip shape designation section 253, an upper pin height input section 254, a lower pin height input section 255, and an extraction size input section 256. When the user operates the edit button in the measurement region designation section 252, the screen generator 31e generates an origin designation window 260 shown in FIG. 16 and displays it on the display unit 4. The origin designation window 260 is provided with an X-axis designation section 261 for designating the X-axis line, a Y-axis designation section 262 for designating the Y-axis line, an origin position designation section 263 for designating the origin position, and a slope designation section 264 for designating the slope of the coordinates.

[0062] Fig. 17 is a diagram for explaining how to specify an origin using the origin specification window 260 shown in Fig. 16. The diagram on the left side of Fig. 17 shows a case where two straight lines, one for the X axis and one for the Y axis, are specified. The X axis straight line can be specified using the X axis specification section 261 shown in Fig. 16, and the Y axis straight line can be specified using the Y axis specification section 262. The intersection of the two specified straight lines is specified as the origin.

[0063] The diagram on the right side of FIG. 17 shows a case where a straight line and a point on the X-axis are specified. In this case, the screen generation unit 31e generates an origin specification window 260 as shown in FIG. 18 and displays it on the display unit 4. This origin specification window 260 has a point specification unit 265 for specifying a point instead of the Y-axis specification unit 262. The X-axis specification unit 261 shown in FIG. 18 specifies the X-axis straight line, and the point can be specified using the point specification unit 265. A straight line perpendicular to the X-axis that passes through the specified point is defined as the Y-axis, and the origin is specified by this Y-axis and the specified X-axis straight line. The specified origin is the origin in local coordinates and can be displayed, for example, in the image display areas 241E and 241F shown in FIG. 14.

[0064] After specifying the origin as described above, the center coordinates of each measurement area are specified using the origin as a reference. The method for specifying the center coordinates of each measurement area is not particularly limited, but specification using a CSV file such as that shown in FIG. 19 can be used, for example. This CSV file, for example, contains measurement area numbers 0 to 8, and the X and Y coordinates of each measurement area are included in association with the measurement area number. The CSV file shown in FIG. 19 is a file that indicates the position of pin W2 of the measurement target W shown in image display area 241E in FIG. 14.

[0065] The setting unit 31c reads the CSV file to set the center coordinates of each measurement area. As shown in Fig. 14, the screen generation unit 31e generates area boxes C0 to C8 based on the center coordinates of each measurement area and displays them in the image display area 241F. The sizes of the area boxes C0 to C8 can be changed as described above.

[0066] After the setting unit 31c receives the designation of the reference plane and sets the center coordinates of each measurement area in local coordinates, the setting unit 31c switches the local coordinates to global coordinates. As shown in Fig. 20, the L origin (origin of the local coordinates) is set as the G origin (origin of the global coordinates), the LX axis (X axis of the local coordinates) is set as the GX axis (X axis of the global coordinates), and the LY axis (Y axis of the local coordinates) is set as the GY axis (Y axis of the global coordinates). Furthermore, as shown in Fig. 21, the center position L(X,Y) in the local coordinates is converted to the center position G(X,Y) in the global coordinates.

[0067] 4, the setting unit 31c accepts designation of the tip shape of the pin W2 of the measurement object W in response to the selection of the pin tool. The tip shape of the pin W2 can be, for example, a cone (including a circular cone, a pyramid, etc.) D1, a frustum (frustum) D2, a flat surface D3, or a curved surface (including a round or hemispherical surface) D4, as shown in FIG. 22. When the tip shape is a cone or a frustum, the pin shape is cylindrical, and when the tip shape is a pyramid or a frustum, the pin shape is rectangular.

[0068] The tip shape of the pin W2 can be specified in a pin tip shape specification section 253 of a pin tool setting window 250 shown in Fig. 15. In the pin tip shape specification section 253, the user can specify a cone, a frustum, a flat surface, or a curved surface (hereinafter also referred to as a round shape) by operating the operation section 5. The pin tip shape specified in the pin tip shape specification section 253 is accepted by the setting section 31c and is included in the setting contents as information related to the pin tip shape.

[0069] The setting unit 31c has a tool for measuring pins as a measurement item, and in response to the selection of the pin tool, accepts the specification of a reference plane, a measurement area of ​​the pin, and a tip shape of the pin, and executes a process of setting the tool for measuring the pin in accordance with the acceptance of the specification of the reference plane, the measurement area of ​​the pin, and the tip shape of the pin.

[0070] Here, the measurement by the execution unit 31d will be described. Based on the pin tool settings by the setting unit 31c, the execution unit 31d calculates the measurement value in the measurement area using different algorithms depending on the pin tip shape, and performs pin tool measurement based on the measurement value. When the execution unit 31d calculates the measurement value from the reference plane in the measurement area, it can calculate the measurement value using different algorithms depending on the pin tip shape. In other words, the execution unit 31d calculates the pin tip height as a measurement value using different algorithms depending on the pin tip shape.

[0071] When the tip shape of the pin is a cone, the execution unit 31d applies an algorithm that sets the maximum height of the measurement area as the pin tip height. Furthermore, when the tip shape of the pin is a frustum or a truncated cone, the execution unit 31d applies an algorithm that sets the maximum height of a central area of ​​the measurement area as the pin tip height. Furthermore, when the tip shape of the pin is a flat surface, the execution unit 31d applies an algorithm that sets the average height of the central area of ​​the measurement area as the pin tip height. Furthermore, when the tip shape of the pin is round, the execution unit 31d applies an algorithm that sets the average height of the top n% of the heights of the measurement area as the pin tip height. n can be any number, such as 5 or 10. n may be changeable by the user.

[0072] The execution unit 31d can obtain the pin tip position as a measurement value using different algorithms depending on the pin tip shape. When the pin tip shape is a cone, the execution unit 31d applies an algorithm that sets the position of the maximum height in the measurement area as the center position of the pin tip. When the pin tip shape is a frustum or a truncated cone, the execution unit 31d applies an algorithm that sets the position of the maximum height in a central area of ​​the measurement area as the center position of the pin tip. When the pin tip shape is a flat surface, the execution unit 31d applies an algorithm that sets the center position of the pin tip to the center position of the center of gravity of the measurement area. When the pin tip shape is round, the execution unit 31d applies an algorithm that sets the center position of the pin tip to the center position of the center of gravity of the top n% of the measurement area in terms of height.

[0073] In this way, the execution unit 31d performs measurement by applying a different algorithm for each pin tip shape. The algorithm to be applied is set at the time of setting. That is, when a cone is specified in the pin tip shape specifying unit 253 in FIG. 15, an algorithm for obtaining the tip height in the case of a cone and an algorithm for obtaining the tip center position in the case of a cone are automatically set by the setting unit 31c, so that the user does not need to set the algorithm. Note that the user may set the algorithm to be applied in the case of a cone.

[0074] Furthermore, when a frustum is specified in the pin tip shape designation unit 253, the setting unit 31c automatically sets an algorithm for determining the tip height in the case of a frustum and an algorithm for determining the tip center position in the case of a frustum. Furthermore, when a flat surface is specified in the pin tip shape designation unit 253, the setting unit 31c automatically sets an algorithm for determining the tip height in the case of a flat surface and an algorithm for determining the tip center position in the case of a flat surface. Furthermore, when a round shape is specified in the pin tip shape designation unit 253, the setting unit 31c automatically sets an algorithm for determining the tip height in the case of a round shape and an algorithm for determining the tip center position in the case of a round shape. Note that the algorithm for determining the tip center position may be the center of gravity position of a region above a predetermined height threshold, regardless of the tip shape. Furthermore, the above algorithm is merely an example, and other algorithms may be used.

[0075] 4 is completed, the process proceeds to step SA10. In step SA10, the setting unit 31c accepts settings for the extraction conditions for pin candidates in the image and settings for various filters. Specifically, the user can make each setting using a pin tool setting window 250 as shown in FIG.

[0076] Here, the case where the execution unit 31d extracts pin candidates will be described. The execution unit 31d performs binarization processing on the shape data using a preset threshold, and then performs blob processing to identify the extracted area as a pin candidate area, and performs filter processing on the pin candidate area. The threshold for the binarization processing may be determined by the setting unit 31c based on the representative height of each measurement area. The setting unit 31c estimates the upper and lower height limits of the pin candidates based on the distribution of each representative height, such as a frequency distribution, and sets them as the upper and lower thresholds for the binarization processing. When the upper and lower height limits are set as the thresholds for the binarization processing, the execution unit 31d extracts pixels in each measurement area of ​​the shape data that have heights between the upper and lower thresholds as pin candidate areas. Next, the execution unit 31d performs blob processing on the extracted pixels, thereby recognizing each pixel extracted by the binarization processing as a pin candidate area.

[0077] After the binarization process, the execution unit 31d calculates the surface, perimeter, and position of the contour of the area extracted by the blob process, and performs filtering according to the calculated area size, perimeter length, and contour position. As this filtering process, the execution unit 31d can perform shape filtering, which filters the shape of the pin candidate area, height filtering, which filters the height of the pin candidate area, and size filtering, which filters the size of the pin candidate area.

[0078] For example, the threshold value used in the binarization process is set by the setting unit 31c in step SA10. After the binarization process, noise contained in the shape data may appear as whisker-like shapes, so it is necessary to correctly distinguish it from the pin shape. In order to correctly distinguish noise from the pin shape, after extracting a pin candidate area through the binarization process, an area between an upper threshold and a lower threshold of the height from the reference plane is extracted, and a contraction process is performed on the extracted area to remove noise (height filter process). If the area of ​​a pin candidate area is too small, the execution unit 31d does not adopt it as a pin candidate area (size filter process). If the perimeter of a pin candidate area is too long, the execution unit 31d does not adopt it as a pin candidate area (shape filter process). Furthermore, if the outline position of a pin candidate area is too far from the set shape, it is also not adopted as a pin candidate area.

[0079] Furthermore, the setting unit 31c accepts designation of upper and lower thresholds for the binarization process. When the setting unit 31c determines the upper and lower thresholds for the binarization process based on the representative heights of the respective measurement areas, the determined upper and lower thresholds are displayed as initial values ​​in the upper pin height input section 254 and the lower pin height input section 255 of the pin tool setting window 250 shown in Fig. 15. The setting unit 31c accepts designation of individual numerical changes to the initial values ​​of the upper and lower thresholds displayed in the upper pin height input section 254 and the lower pin height input section 255, respectively.

[0080] The setting unit 31c accepts a specification of an extraction size for size filtering via the extraction size input field 256 of the pin tool setting window 250 shown in FIG. 15. The execution unit 31d executes size filtering, which adopts areas equal to or larger than the extraction size accepted by the setting unit 31c as pin candidate areas and does not adopt areas smaller than the extraction size as pin candidates. As shown in FIG. 15, the setting unit 31c accepts a specification of a cursor position, a numerical value, or both. When the setting unit 31c accepts a specification of a position within the measurement area on the two-dimensional display area 222, the screen generation unit 31e generates a screen displaying a symbol of a size corresponding to the extraction size at a position within the specified measurement area. The symbol may be, for example, a rectangular or circular frame. When the setting unit 31c accepts a specification of a change to the extraction size via a specification of a cursor position or a numerical value, the screen generation unit 31e generates a screen displaying a symbol whose size has been changed in accordance with the specification within the measurement area on the two-dimensional display area 222. This allows the size of the extraction size to be intuitively grasped, making it easier to set the extraction size for size filtering.

[0081] As shown in FIG. 23, an initial value for the extraction size for size filtering may be accepted when proceeding to step SA9 in FIG. 4. An extraction size setting window 400 is displayed in the foreground to allow the user to input the initial value. The extraction size setting window 400 displays a guide 401 that guides the user as to what adjustments to make, as well as a cursor and a numeric box 402 for accepting the extraction size. When a position is specified in the two-dimensional display area 222, a rectangular symbol 222a corresponding to the predetermined extraction size is displayed superimposed on the two-dimensional display area 222, with the specified position as its center. A mouse pointer 222b and a center 222c of the rectangular symbol 222a are also displayed in the window 400. Once the initial value for the extraction size is set and the OK button is pressed, the process proceeds to step SA9 in FIG. 4. The extraction size can be adjusted even after proceeding to step SA9 by accepting the cursor position, numeric value, or both, as shown in FIG. 15.

[0082] After performing step SA10 in FIG. 4, the process proceeds to step SA11. In step SA11, after the above-described setting is completed, the execution unit 31d executes measurement. FIG. 24 shows the details of step SA11. In step SB1 of the flowchart in FIG. 24, the execution unit 31d reads the X coordinates and Y coordinates of at least three points specified during setting, extracts the height of each pixel at the position specified by these X coordinates and Y coordinates, and specifies a plane fitted to the heights of the extracted three points as a reference plane.

[0083] In step SB2, the execution unit 31d applies the pin candidate extraction conditions, shape filter, size filter, height filter, etc., that were set for each measurement area specified during setup. As a result, the execution unit 31d extracts pixels that are at a height above a certain level from the reference plane, recognizes pixel clusters through blob processing to set them as pin candidate areas, and determines the shape of the blob from the area, perimeter, etc. of the pin candidate area. The execution unit 31d determines that any blob shape that deviates from the typical pin shapes of a circle or rectangle is noise and removes it. The execution unit 31d also removes any blob whose size is below a certain level as noise.

[0084] In step SB3, the execution unit 31d determines the pin tip shape specified during setup. Specifically, the execution unit 31d reads the pin tool settings, acquires information about the pin tip shape included in the read settings, and determines, based on the acquired information, whether the pin tip shape specified during setup is conical, frustum, flat, or round. If it is determined in step SB3 that the pin tip shape specified during setup is conical, the process proceeds to step SB4. In step SB4, the execution unit 31d applies an algorithm for when the pin tip shape is conical, calculates the maximum height of the measurement area, and sets the calculated maximum height of the measurement area as the pin tip height. In step SB5, the XY position at which the measurement area calculated in step SB4 achieves the maximum height is identified. The identified position becomes the XY position of the pin tip. Then, the process proceeds to step SB6.

[0085] If it is determined in step SB3 that the tip shape of the pin specified at the time of setting is a frustum, the process proceeds to step SB7. In step SB7, an algorithm for when the tip shape of the pin is a frustum is applied, and the execution unit 31d calculates the maximum height of the central region, and sets the calculated maximum height of the central region as the tip height of the pin. In step SB8, the XY position at which the maximum height of the central region calculated in step SB8 is achieved is identified. The identified position becomes the XY position of the tip of the pin. Then, the process proceeds to step SB6.

[0086] If it is determined in step SB3 that the tip shape of the pin specified during setting is a flat surface, the process proceeds to step SB9. In step SB9, an algorithm for when the tip shape of the pin is a flat surface is applied, and the execution unit 31d calculates the average height of the central region, and sets the calculated average height of the central region as the tip height of the pin. In step SB10, the XY position at which the average height of the central region calculated in step SB9 is achieved is identified. The identified position becomes the XY position of the tip of the pin. Then, the process proceeds to step SB6.

[0087] If it is determined in step SB3 that the tip shape of the pin specified during setup is round, the process proceeds to step SB11. In step SB11, the algorithm for when the pin tip shape is round is applied, and the execution unit 31d calculates the average height of the top n% of the heights of the measurement area, and sets the calculated average height as the pin tip height. In step SB12, the XY position of the center of gravity of the area in the top n% of the heights of the measurement area is identified. The identified position becomes the XY position of the pin tip. Then, the process proceeds to step SB6.

[0088] As described above, a measurement simulation can be performed by obtaining the measurement value of each pin using a different algorithm depending on the shape of the pin tip. This measurement simulation may be performed by the processing device 3 shown in Fig. 1, or by the measuring device 100 shown in Fig. 2. When the measurement simulation is performed by the measuring device 100 shown in Fig. 2, the results of the measurement simulation may be transmitted to the processing device 3 and acquired by the processing device 3. Depending on the results of the measurement simulation, it is possible to modify, for example, the imaging conditions, the size and position of the measurement area, etc.

[0089] In step SB6, the execution unit 31d applies a measurement value filter to remove, as noise, deviations in the height direction or in the XY position that are greater than the reference value. At this time, the execution unit 31d may specify a tolerance range for the reference value of height or the reference value of the XY position, and perform an inspection to determine whether the height or the XY position is within the tolerance range. The specification of the tolerance range is accepted by the setting unit 31c.

[0090] When the flowchart shown in Fig. 24 ends, the process proceeds to step SA12 in the flowchart shown in Fig. 4. In step SA12, the measurement results are displayed. To display the measurement results, the screen generation unit 31e generates a result display screen 300 (shown in Fig. 25) for displaying an image of the measurement results, and displays it on the display unit 4. The result display screen 300 is provided with a three-dimensional display area 301 that displays a height image of the measurement object W in three dimensions, and a two-dimensional display area 302 that displays the height image of the measurement object W in two dimensions. In this way, the screen generation unit 31e generates a user interface screen that allows three-dimensional display and two-dimensional display simultaneously.

[0091] In the example shown in FIG. 25, pin W2a located near the left front corner is tilted beyond the tolerance range. In this case, the screen generator 31e displays the measurement area C6 including pin W2a, a measurement element whose measurement value is determined by the execution unit 31d to be outside the tolerance range, in a different format in the three-dimensionally displayed height image or the two-dimensionally displayed image than when the measurement area C6 is determined to be within the tolerance range. Specifically, the color indicating the measurement area C6 including pin W2a whose measurement value is outside the tolerance range is a different color from the color indicating the measurement areas C0 to C5, C7, and C8 including pin W2 whose measurement value is determined to be within the tolerance range. Alternatively, the measurement area including the measurement element whose measurement value is determined to be outside the tolerance range and the measurement area whose measurement value is determined to be within the tolerance range can be displayed in different formats by changing the type of line surrounding the measurement area, or by hatching or filling the measurement area and changing the type or color of the hatching or filling. Furthermore, by adding letters or symbols to measurement areas including measurement elements that are determined to be outside the tolerance range, it is possible to display them in a different form from measurement areas that are determined to be within the tolerance range. The screen that displays measurement areas including measurement elements that are determined to be outside the tolerance range and measurement areas that are determined to be within the tolerance range in different forms may be displayed in only one of the three-dimensional display area 301 and the two-dimensional display area 302, or may be displayed in both.

[0092] In short, the result display screen 300 has a display area that displays a height image based on the shape data received by the main body communication unit 30 in two dimensions and three dimensions, and displays one or more measurement elements on the height image. The result display screen 300 includes result display elements that show the results of the measurement performed by the execution unit 31d, such as lines surrounding the measurement area or hatching or filling in the measurement area, so that the user can easily understand whether the height or position of the pin is within the tolerance range just by looking at the three-dimensional display area 301 or the two-dimensional display area 302.

[0093] In this embodiment, for example, a plurality of three-dimensional images are captured in advance, and the user can switch between the captured three-dimensional images to sequentially display them in the three-dimensional display area 301. By switching between the captured images and displaying them, the user can check whether the XYZ positional deviation, θ angle deviation, and tilt deviation can be correctly tracked while viewing the three-dimensional images.

[0094] As shown enlarged in FIG. 26, the result display screen 300 can distinguish between cases where the XY position of the pin tip is outside the tolerance range (left diagram) and cases where it is within the tolerance range (right diagram). Pin W2a is a pin that is tilted beyond the tolerance range, and the XY position of its tip is identified as point P10, which is displayed on the result display screen 300. The measurement area C6 is displayed as a semi-transparent cylinder on the result display screen 300. A straight line (center line) L1 passing through the center of the measurement area C6 is also displayed on the result display screen 300. The center line L1 is the measurement reference based on the reference value. By viewing the result display screen 300, the user can easily understand that point P10 is deviated from the line L1, as well as the amount and direction of the deviation. In this way, the screen generation unit 31e generates the result display screen 300, which displays the measurement reference based on the reference value and the deviation amount of pin W2a from the reference as result display elements.

[0095] On the other hand, in the diagram on the right side of Figure 26, the measurement value of pin W2 is within the tolerance range, so point P11, which indicates the XY position of the tip of pin W2, is located on the center line L2 of measurement area C7. On result display screen 300 shown in Figure 26, the color and line type of circle S1 surrounding the top end of measurement area C6 may be made different from the color and line type of circle S2 surrounding the top end of measurement area C7. The color of circle S1 may be made red, for example, to more clearly indicate that it is outside the tolerance range.

[0096] 26, the height of the pin tip is displayed as a numerical value. That is, the screen generation unit 31e acquires the measurement value of the height of the tip of each pin calculated by the execution unit 31d, and generates a result display screen 300 that displays the acquired measurement value in association with the pin. For example, leader lines L3 and L4 starting from the tip of the pin are generated for each pin, and the leader lines L3 and L4 are displayed in association with the measurement value, respectively. This allows the user to easily grasp the height of each pin.

[0097] The screen generator 31e can also generate a display screen that displays the distance between the tip point P10 of the pin and the center line L1. For example, a leader line L5 starting from the tip point P10 of the pin is generated for each pin, and the leader line L5 is displayed in association with the distance. Both the pin height and the distance may be displayed, or only one of them may be displayed.

[0098] The measurement values ​​may be displayed in the form of a list, for example. That is, the screen generation unit 31e allows multiple pins to be identified by numbers, displays the numbers in a table, and generates a list in which the measurement values ​​of the pins identified by the numbers are displayed next to the numbers, and displays the list on the display unit 4. The measurement values ​​displayed in the list may be both the pin height and the XY position, or only one of them. The generated list can also be output externally.

[0099] Although not a required configuration, the setting support device 1 may have a source code generation function and a function to import the generated source code into a user's inspection program. That is, the setting support device 1 can generate setting support information, which includes text code (source code), libraries, reference shape data, etc. The setting support device 1 generates text code including multiple pieces of processing program information and measurement elements and measurement items set during setting. The generated text code is associated with libraries and reference shape data, respectively. The setting support device 1 outputs the associated text code, library, and reference shape data as setting support information to the user's inspection program. This allows the user to perform measurement and inspection using the source code generated by the setting support device 1.

[0100] In addition to the source code, you can also import execution libraries for communicating with the measuring head 2 to acquire 3D images and for various inspection tools. You can also import libraries for easily displaying 3D images. You can also import registered images that you have set. (Various measurement tools) When a measurement tool is selected, the screen generation unit 31e generates a user interface screen for selecting the measurement tool and displays it on the display unit 4. The user interface screen for selecting the measurement tool allows the selection of various measurement tools in addition to the pin tool, and the user can select the desired measurement tool by operating the operation unit 5 (step SA5' in FIG. 27). For each measurement tool, a measurement target and filter processing corresponding to the measurement tool are prepared in advance, and even if the measurement target W is difficult to measure with settings other than the optimal settings, optimal settings can be easily achieved, making measurement easier.

[0101] The measurement target of the pin tool is a representative height of the pin tip region in each measurement area, and when a reference plane is used, the representative height of the pin tip region from the reference plane. The measurement target of the pin tool may further include a representative position of the pin tip region.

[0102] The measurement targets of the flaw tool include the presence or absence of flaws having a certain depth from the reference surface in the measurement area, flaws having a certain height from the reference surface, the number of flaws, and the total area of ​​all flaws. The measurement targets of the flaw tool may further include the maximum depth of concave flaws and the maximum height of convex flaws. Furthermore, the measurement targets of the flaw tool may include the area, maximum depth, and maximum height of each detected flaw.

[0103] The measurement targets of the fine flaw tool include, for each segment area in the measurement area, the flaw level indicating the likelihood of the segment area being flawed, the presence or absence of flaws with a flaw level above a certain level, the number of flaws, and the total area of ​​all flaws. The flaw level is determined, for example, based on a certain change in the unevenness between each segment area and its surrounding area. The size of the segment area corresponds to the size of the flaw to be detected. The measurement targets of the fine flaw tool may also include the area of ​​each detected flaw and the representative flaw level.

[0104] (Reception of area for filter settings) When accepting settings for various filters in various measurement tools, a height image is displayed in step SA8', and at least one filter parameter is accepted for specifying an area or position on the height image (step SA9'). Then, a symbol corresponding to the extraction size is superimposed on the height image. When a change in the extraction size is accepted, the symbol size on the height image is also changed in accordance with the change in the extraction size.

[0105] In step SA10', the extraction conditions and various filters are specified. Then, the process proceeds to steps SA11' and SA12'. Steps SA11' and SA12' are the same as steps SA11 and SA12 shown in FIG.

[0106] In step SA10', for example, the extraction size of the pin tool corresponds to the minimum detection size adopted as a candidate region for the pin tip, and by adjusting the extraction size so that the symbol fits the smallest pin tip region on the height image, it is possible to optimally distinguish between the pin tip region and noise.

[0107] The extraction size of the flaw tool corresponds to the definition of the flaw area for determining the maximum depth of concave flaws and the maximum height of convex flaws. Adjusting the extraction size to encompass the largest flaw area allows for the setting of depth and height thresholds that optimally separate flaw areas from noise. For example, when extracting a free-form surface that fits a height image of a measurement target as a reference surface, adjusting the extraction size changes the conformance of the free-form surface depending on the size of the flaw. By reducing the extraction size, a free-form surface that conforms to and fits even large flaws is extracted as the reference surface. In this case, when the difference between the height image of the measurement target and the reference surface is calculated to obtain a differential height image, large flaws are less likely to appear. On the other hand, by increasing the extraction size, a free-form surface that does not conform to large flaws but fits areas other than large flaws is extracted as the reference surface. In this case, when the difference between the height image of the measurement target and the reference surface is calculated to obtain a differential height image, large flaws will appear.

[0108] The extraction size of the fine flaw tool corresponds to the size of the flaw area to be detected, and by adjusting the extraction size so that it encompasses the largest flaw area to be detected, it is possible to optimally separate the flaw area from noise. As with the flaw tool, by adjusting the extraction size, the ability of the free-form surface extracted as the reference surface to follow the flaw changes depending on the flaw size. In addition, the size of the flaw area to be detected may correspond to the size of the segment area used to determine the flaw level. (Scratch Tool) The processing of the flaw tool will be explained using Figure 28, which shows a schematic cross section of a height image. The reference surface is obtained by executing a reference surface extraction process that extracts a free-form surface corresponding to the extraction size from the height image of the object to be measured. A difference between the height image of the object to be measured and the reference surface is calculated to obtain a differential height image. The position of the flaw area is then specified on this differential height image. If the flaw corresponding to the flaw area is a concave flaw, the maximum depth of the flaw area is calculated, and a depth threshold is calculated based on the maximum depth as the detection threshold, which is a filter parameter. If the flaw corresponding to the flaw area is a convex flaw, the maximum height of the flaw area is calculated, and a height threshold is calculated based on the maximum height as the detection threshold, which is a filter parameter. Changing the extraction size changes the flaw area, and the detection threshold is calculated again accordingly. Of the candidate flaw areas, those whose maximum depth or maximum height is equal to or greater than the detection threshold are adopted as flaws, while areas that do not satisfy these criteria are rejected as flaws.

[0109] As shown in FIG. 29, the screen generation unit 31e may display a window 410 for the flaw tool on the display unit 4, and the flaw type may be selected in the window 410 for the flaw tool. The window 410 for the flaw tool is provided with a flaw type input unit 411 that allows the flaw type to be selected. The flaw types include, for example, uneven flaws, concave flaws, convex flaws, etc. When uneven flaws are selected in the flaw type input unit 411, both concave flaws and convex flaws become targets for detection. When concave flaws are selected in the flaw type input unit 411, concave flaws become targets for detection but convex flaws do not become targets for detection. When convex flaws are selected in the flaw type input unit 411, convex flaws become targets for detection but concave flaws do not become targets for detection. Selection operations and the like in the window 410 for the flaw tool are accepted by the acceptance unit 31b.

[0110] The flaw tool window 410 has an upper limit number input field 412 in which the upper limit of the number of flaws to be detected can be input. The upper limit number input field 412 can accept and set the upper limit of the number of flaws to be detected. If flaw candidate regions exceeding the upper limit are detected, a detection threshold that does not exceed the upper limit of the number of flaws to be detected is automatically set. The area of ​​the flaw candidate region can be included in the filter parameters. By checking the checkbox 413 shown in FIG. 29, candidate flaw regions between the upper and lower limits of area are adopted, and other candidate regions are rejected. FIG. 29 shows a case in which the largest flaw among the displayed flaws is designated with the mouse pointer 414. FIG. 30 shows a case in which the detection size is adjusted to match the size of the flaw, and in the case of FIG. 30, the detection threshold is optimized. (Fine Scratch Tool) The processing of the fine flaw tool will be described using FIG. 31, which shows a schematic diagram of a differential height image and the difference in flaw level depending on the size of a segment area. The receiving unit 31b receives the specification of the position of the flaw area on the differential height image. The extraction size corresponds to the trackability to the flaw size when extracting a free-form surface that fits the height image of the measurement target as a reference surface from the height image. The extraction size may also correspond to the size of the segment area. The average height within the segment area is calculated, and the flaw level of that segment area is calculated based on the difference from the surrounding segment areas. FIG. 32 shows a window 420 for the fine flaw tool generated by the screen generating unit 31e and displayed on the display unit 4. This window 420 for the fine flaw tool includes an upper limit number input section 421 for inputting the upper limit of the number of flaws to be detected, a lower limit flaw level input section 422 for inputting the lower limit of the flaw level, a lower limit flaw amount input section 423 for inputting the lower limit of the flaw amount, and a segment size input section 424 for inputting the segment size. Selection operations and the like on the window 420 for the fine scratch tool are accepted by the accepting unit 31b.

[0111] With the fine scratch tool, scratches that are small relative to the segment area are averaged out and are less likely to be reflected in the scratch level. Also, scratches that are large relative to the segment size are less likely to appear as a difference with the surrounding segment areas and are less likely to be reflected in the scratch level. Therefore, scratches that correspond to the size of the segment area are more likely to be reflected in the scratch level. By setting a scratch level lower limit, areas that are above the scratch level lower limit become candidate scratch areas. Furthermore, by setting a scratch amount lower limit, the area of ​​the candidate scratch area can be included in the filter parameters. Candidate areas that are above the scratch amount lower limit are adopted, and candidate areas that are below the scratch amount lower limit are rejected. Figure 32 shows the case where the detection size is adjusted to match the size of the scratch, and in Figure 33 the detection threshold is optimized.

[0112] (during operation) FIG. 34 is a flowchart showing the process flow during operation of the measuring device 100. In step SC1, the measuring device 100 determines whether a predetermined trigger condition is satisfied. If the trigger condition is satisfied, the process proceeds to step SC2. In step SC2, the measuring device 100 acquires shape data from the measuring head 2 according to the settings made during setup. In step SC3, the measuring device 100 aligns the height image based on the reference image. In step SC4, the measuring device 100 performs measurements on each measurement area in the same manner as the process shown in the flowchart of FIG. 34. In step SC5, it determines whether the measurement values ​​are within the tolerance range. In step SC6, the measurement values ​​obtained in step SC4 and the determination result of step SC5 are output to an external device such as a programmable logic controller (PLC). Here, if the tolerance determination of step SC5 is not performed, the measurement values ​​obtained in step SC4 are output to the external device in step SC6. In step SC7, it determines whether the inspection is completed.

[0113] The above-described embodiments are merely examples in all respects and should not be construed as limiting. Furthermore, all modifications and variations within the scope of the claims are within the scope of the present invention. [Industrial Applicability]

[0114] As described above, the measurement device setting support device and setting support program according to the present disclosure can be used, for example, when measuring a pin or the like of a measurement object. [Explanation of symbols]

[0115] 1 Setting support device 3 Processing equipment 4 Display 31c Setting section 31d Executive Department 31e Screen generator

Claims

1. a receiving unit for receiving shape data; a setting unit for setting one or more measurement elements and measurement items using the one or more measurement elements; an execution unit that executes measurements of the measurement items set by the setting unit for the shape data received by the receiving unit; a screen generating unit that generates a display screen including a display area for two-dimensionally and / or three-dimensionally displaying a height image based on the shape data received by the receiving unit and displaying the one or more measurement elements on the height image, and a result display element that shows the result of the measurement executed by the executing unit; the setting unit has a tool for measuring a predetermined measurement object as the measurement item, and in response to selection of the tool, accepts designation of a measurement area on the height image and designation of a target area for identifying the measurement object within the measurement area, and sets a tool including a measurement area and filter parameters for measuring the measurement object according to the designation of the measurement area, the size of the target area, and / or a representative height in the target area; the screen generation unit displays a symbol corresponding to the target area on the height image; The execution unit identifies a measurement target in the measurement area according to the filter parameters based on the settings of the tool, and performs measurement of the tool based on the measurement values ​​of the identified measurement target.

2. 2. The measurement device setting support device according to claim 1, the setting unit receives a designation of a reference plane, and sets a tool for measuring pins in response to the designation of the reference plane; The execution unit determines a measurement value from the reference plane in the measurement region.

3. 2. The measurement device setting support device according to claim 1, the setting unit receives a change instruction for the size of the target region, and sets a tool including a filter parameter according to the size of the target region; The screen generation unit displays a symbol corresponding to a change in the size of the target area on the height image.

4. 2. The measurement device setting support device according to claim 1, the setting unit has a tool for measuring pins as the measurement item, and sets a tool including filter parameters according to the size of the target area; The execution unit identifies, as the measurement target, an area in the measurement area that is larger than the filter parameter based on the setting of the tool.

5. 2. The measurement device setting support device according to claim 1, the setting unit sets a plurality of measurement areas corresponding to the pins, The execution unit determines a representative height and a representative position of the pin tip in each of the plurality of measurement areas as measurements of the tool.

6. 2. The measurement device setting support device according to claim 1, the setting unit has a tool for measuring flaws as the measurement item, and sets the tool including a filter parameter corresponding to at least one of a representative depth or a representative height from a reference plane in the target area; The execution unit identifies, based on the setting of the tool, a region of the measurement region that is deeper than the filter parameter as the measurement target.

7. 7. The measurement device setting support device according to claim 6, The execution unit determines the number of flaws and the size of the flaws in the measurement area as measurements of the tool.

8. 8. The measurement device setting support device according to claim 7, The execution unit further determines a representative depth or a representative height of a flaw in the measurement area as a measurement of the tool.

9. 2. The measurement device setting support device according to claim 1, the setting unit has a tool for measuring fine scratches as the measurement item, and sets a tool including filter parameters according to the size of the target area; The execution unit identifies, as the measurement target, an area in the measurement area having a size close to the filter parameter based on the setting of the tool.

10. 10. The measurement device setting support device according to claim 9, The execution unit determines the number of flaws and the size of the flaws in the measurement area as measurements of the tool.

11. 11. The measurement device setting support device according to claim 10, The execution unit further determines a flaw level in the measurement area as a measurement of the tool.

12. 2. The measurement device setting support device according to claim 1, the setting unit receives a designation of a reference value for pin measurement, and sets a tool for measuring the pin in response to the designation of the reference value for pin measurement; The execution unit executes the measurement of the tool based on the measurement value and the reference value.

13. 2. The measurement device setting support device according to claim 1, The execution unit performs binarization processing on the shape data using a preset threshold, and then performs blob processing to extract areas as pin candidate areas, and performs filter processing on the pin candidate areas.

14. 14. The measurement device setting support device according to claim 13, The execution unit executes shape filtering processing, in which the shape of the pin candidate area is a filtering target, as the filtering processing.

15. 14. The measurement device setting support device according to claim 13, The execution unit executes height filtering processing, in which the height of the pin candidate area is filtered, as the filtering processing.

16. 14. The measurement device setting support device according to claim 13, The execution unit executes size filtering processing, as the filtering processing, in which the size of the pin candidate area is filtered.

17. 3. The measurement device setting support device according to claim 2, The setting support device for a measurement device, wherein the setting unit switches from local coordinates to global coordinates when it receives the designation of the reference plane.

18. 2. The measurement device setting support device according to claim 1, The setting unit specifies the ranges of existence of the plurality of measurement regions based on the user specifying three points on a height image.

19. 19. The measurement device setting support device according to claim 18, The setting unit receives designation of the number of rows and columns of the measurement areas to be arranged in the existence range, and the shape of the measurement areas.

20. 19. The measurement device setting support device according to claim 18, The setting unit accepts a change in the size of a first measurement area, which is any one of the multiple measurement areas arranged in the existence range, and upon accepting a change in the size of the first measurement area, sets the size of the other measurement areas to the changed size of the first measurement area.

21. 3. The measurement device setting support device according to claim 2, The screen generation unit generates a display screen that displays a measurement standard based on a reference value and a deviation amount of the pin from the standard as the result display element.

22. 22. The measurement device setting support device according to claim 21, the setting unit accepts a specification of a tolerance range for the reference value, The execution unit determines whether the measurement value is within the tolerance range, The screen generation unit displays the measurement area including the measurement element whose measurement value is determined by the execution unit to be outside the tolerance range in a three-dimensionally displayed height image in a form different from that when the measurement value is determined to be within the tolerance range.

23. A measurement device setting support program executable by a processing device, receiving shape data; A process of setting one or more measurement elements and measurement items using the one or more measurement elements; a process of performing a measurement of the measurement item on the shape data; and causing the processing device to execute a process of displaying a height image based on the shape data in two dimensions and / or three dimensions, and generating a display screen having a display area for displaying the one or more measurement elements on the height image, the display screen including a result display element showing the results of the measurement. a process of accepting, in response to a selection of a tool for measuring a predetermined measurement object, a designation of a measurement area on the height image and a designation of a target area for identifying the measurement object within the measurement area, and setting a tool including a measurement area and filter parameters for measuring the measurement object according to the designation of the measurement area, the size of the target area, and / or a representative height in the target area; A measurement device setting support program that causes the processing device to execute a process of displaying a symbol corresponding to the target area on the height image, identifying a measurement object in the measurement area corresponding to the filter parameters based on the settings of the tool, and performing measurement of the tool based on the measurement values ​​of the identified measurement object.

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