Multilayer molding system and method for manufacturing multilayer molded article

Abstract

To suppress contamination of a stage for performing lamination processing.SOLUTION: A laminated molding system according to the present disclosure includes a pair of carrier films that sandwich a laminated object obtained by laminating a laminating material on a body to be laminated from above and below and convey the laminated object along a conveying direction, a film unwinding machine that unwinds the carrier films, a laminator that is disposed at a subsequent stage of the film unwinding machine and pressurizes the laminated object to mold a laminated molded article, a cooling unit that is disposed at a subsequent stage of the laminator and cools the laminated molded article, and a film winding machine that is disposed at a subsequent stage of the laminator and carries out the laminated molded article placed on the carrier films. The cooling part has an air flow generating means for making cooling air flow in a direction inclined by a predetermined angle from a direction substantially perpendicular to the conveying direction toward the rear stage side in the conveying direction.SELECTED DRAWING: Figure 1

Description

[Technical Field]

[0001] The present disclosure relates to a laminate molding system and a method for manufacturing a laminate molded product. [Background technology]

[0002] Patent Document 1 discloses a laminator that overlaps a continuous laminate film on a conveyed object to be laminated, and laminates the laminate by heating and pressing it with a laminating roller. A cooling fan is provided downstream of the laminating roller. The cooling fan is separated from the laminating roller and inclined away from the laminating roller so as not to cool the laminating roller. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Patent No. 3821706 Summary of the Invention [Problem to be solved by the invention]

[0004] Some laminating machines are equipped with multiple cooling fans to cool the object evenly. If the cooling air from multiple cooling fans is blown perpendicular to the object, the air will flow toward the upstream laminating stage, which may contaminate the laminating stage.

[0005] The present disclosure has been made to solve such problems, and aims to provide a lamination molding system and a method for manufacturing a laminate molded product that can suppress contamination of the stage where lamination processing is performed. Other problems and novel features will become apparent from the description of this specification and the accompanying drawings. [Means for solving the problem]

[0006] The laminate molding system according to the present disclosure includes a pair of carrier films that sandwich a laminate object, which is formed by laminating a laminate material onto a laminated object, from above and below and transport it along a transport direction, a film unwinder that unwinds the carrier film, a laminator that is arranged downstream of the film unwinder and pressurizes the laminate object to form a laminate molded product, a cooling unit that is arranged downstream of the laminator and cools the laminate molded product, and a film winder that is arranged downstream of the laminator and transports the laminate molded product placed on the carrier film. The cooling unit has an airflow generating means that blows cooling air in a direction inclined at a predetermined angle from a direction approximately perpendicular to the transport direction toward the downstream side of the transport direction.

[0007] The method for manufacturing a laminated molded product according to the present disclosure includes a process of sandwiching a laminated object, which is formed by laminating a laminate material onto a laminated body, between a pair of carrier films from above and below and transporting the laminated object along a transport direction; a process of pressurizing the transported laminated object to form a laminated molded product; a process of cooling the formed laminated molded product using an airflow generating means that blows cooling air in a direction inclined at a predetermined angle from a direction approximately perpendicular to the transport direction toward the subsequent side of the transport direction; and a process of transporting the laminated molded product placed on the carrier film. [Effects of the Invention]

[0008] According to the present disclosure, it is possible to suppress contamination of the stage where the lamination process is performed. [Brief explanation of the drawings]

[0009] [Figure 1] 1 is a diagram showing a schematic configuration of a laminator according to a first embodiment. [Figure 2] FIG. 2 is a side view of the cooling device of FIG. [Figure 3] FIG. 2 is a top view of the cooling device of FIG. [Figure 4] FIG. 10 is a diagram showing a state in which the upper cooling fan is retracted from above the cooling stage. [Figure 5] 10A and 10B are diagrams illustrating the mounting angle of the upper cooling fan. [Figure 6]FIG. 10 is a top view of the cooling device of the second embodiment. [Figure 7] FIG. 7 is a side view of the cooling device of FIG. 6. DETAILED DESCRIPTION OF THE INVENTION

[0010] The present invention will be described below through embodiments of the invention, but the invention according to the claims is not limited to the following embodiments. Furthermore, not all of the configurations described in the embodiments are necessarily required as means for solving the problems. For clarity of explanation, the following description and drawings have been omitted and simplified as appropriate. Note that identical elements in each drawing are designated by the same reference numerals, and redundant explanations are omitted as necessary. In the following description, positional relationships indicated by terms such as "left," "right," "inner," "outer," "axis," "center," "horizontal," and "orthogonal" are based on the positional relationships shown in the drawings. These terms are intended to facilitate explanation of the present embodiment and should not be understood as limiting the present embodiment.

[0011] The embodiment relates to a lamination molding system including a laminator that carries in a lamination object, which is a laminated material laminated on a laminated body, from one side, performs a lamination process by pressing the lamination object under reduced pressure, and carries it out from the other side. Here, as an example of the lamination object, a substrate W to which at least a part of a laminate film is temporarily adhered will be described.

[0012] Embodiment 1. 1 is a diagram showing a schematic configuration of a laminate molding system according to Embodiment 1. As shown in FIG. 1, the laminate molding system 100 includes a supply device 10, a molding device 20, a cooling device 30, and a recovery device 40.

[0013] A supply device 10 is provided in a stage preceding the molding device 20. A cooling device 30 is provided in a stage following the molding device 20. A recovery device 40 is provided in a stage following the cooling device 30. The molding device 20 includes a first stage 21, a second stage 22, and a third stage 23. The second stage 22 and the third stage 23 are provided consecutively following the first stage 21. Below, an example will be described in which lamination processing is performed by a vacuum laminating device in the first stage 21, flattening processing is performed by a first pressing device in the second stage 22, and flattening processing is performed by a second pressing device in the third stage 23. That is, the example shown in FIG. 1 includes one "laminator" and two "flattening pressing devices."

[0014] The configuration of the forming device 20 is an example and is not limited to this. The forming device 20 may be any device that uses a film to progressively transport the substrate W, and may include at least the first stage 21. Either or both of the second stage 22 and the third stage 23 may be omitted.

[0015] The supply device 10 includes an upper film unwinding device 11, an upper film cleaning device 12, a lower film unwinding device 13, a lower film cleaning device 14, and a substrate receiving unit 15. The supply device 10 corresponds to a "film unwinding machine." The upper film unwinding device 11 and the lower film unwinding device 13 are equipped with film rolls on which strip-shaped film is wound. The upper film unwinding device 11 and the lower film unwinding device 13 supply a pair of carrier films that sandwich from above and below an object to be laminated, which is a substrate W, and transport it in the transport direction.

[0016] The pair of carrier films is inserted into the lamination molding system 100 and transports the substrate W, which is the object to be laminated, from one end side to the other end side of the lamination molding system 100 along a transport surface parallel to the hot plate of the lamination molding system 100. Hereinafter, the carrier film unwound from the upper film unwinding device 11 will be referred to as the upper film F1, and the carrier film unwound from the lower film unwinding device 13 will be referred to as the lower film F2.

[0017] A laminate film (not shown) is placed on the substrate W. The laminate film is a sheet, and is placed on the lower film F2 so as to overlap the substrate W. The laminate film is coated with, for example, a heat-sensitive adhesive, and becomes adhesive when heated. When the laminate of the laminate film and the substrate W is placed on the lower film F2, at least a portion of the laminate film may be temporarily welded.

[0018] The upper film cleaning device 12 and the lower film cleaning device 14 are equipped with, for example, adhesive rollers. The upper film cleaning device 12 and the lower film cleaning device 14 capture and remove dust adhering to the upper film F1 and the lower film F2, respectively, with the adhesive rollers. The upper film cleaning device 12 and the lower film cleaning device 14 may also have the function of collecting particles (dust foreign matter) generated within the laminating molding system 100 and preventing contamination of the laminate film.

[0019] The substrate receiving unit 15 supplies substrates W between the upper film F1 and the lower film F2 at a predetermined timing so as to maintain a constant pitch between the substrates W. The pitch between the substrates W is equal to the distance between the first stage 21, the second stage 22, and the third stage 23, for example. Therefore, after different substrates W are simultaneously processed on the first stage 21, the second stage 22, and the third stage 23, the substrate W on the first stage 21 is transported to the subsequent second stage 22, and the substrate W on the second stage 22 is transported to the third stage 23. The substrate W on the third stage 23 is transported to the cooling device 30 for the subsequent process.

[0020] The supply device 10 may include one or more driven rollers. The driven rollers change the orientation of the upper film and the lower film to a horizontal position. The substrate W is supplied to the portion where the upper film and the lower film are in a horizontal position. The substrate W is transported while sandwiched between the upper film F1 and the lower film F2. The substrate W sandwiched between the upper film F1 and the lower film F2 is processed in the first stage 21, the second stage 22, and the third stage 23, respectively.

[0021] In this embodiment, the forming device 20 includes a laminator that performs lamination processing by pressing the object to be laminated (substrate W with a laminate film overlaid) under reduced pressure. The substrate W is transported in a predetermined transport direction (the direction of the white arrow in FIG. 1) along a transport surface (the horizontal surface on which the lower film F2 on which the substrate W is placed).

[0022] In the first stage 21, a lamination process is carried out by a vacuum laminator. The vacuum laminator uses a pressure body to heat and pressurize a laminate consisting of the substrate W, upper film F1, and lower film F2 in a vacuum chamber (not shown). The form of the pressure body is not particularly limited, but may be, for example, a bulging elastic membrane such as a diaphragm, or a plate-like body with a pressure surface made of resin such as elastomer or metal.

[0023] For example, in a vacuum laminating device, a lower platen is provided that can be raised and lowered relative to a fixed upper platen. The lower platen rises and abuts against the upper platen to form a chamber. A hot platen that is heated by a heater (not shown) is attached to the center underside of the upper platen, and a heat-resistant elastic sheet is attached to the surface of the hot platen.

[0024] Meanwhile, a hot plate heated by a heater (not shown) is attached to the central upper surface of the lower plate. A diaphragm, which acts as a pressurizing body, is attached to the surface of the hot plate of the lower plate. A compressor (not shown) sends pressurized air to the rear side of the diaphragm, causing the diaphragm to expand within the chamber, and the laminate is pressurized between the hot plates. This results in the substrate W being laminated with the upper film F1 and the lower film F2, resulting in a primary molded product. The above-described configuration of the vacuum laminating device is merely an example. For example, a diaphragm may be attached to the upper plate, and the substrate W may be pressed from the upper plate side. If the laminating system 100 includes only a laminator, the primary molded product will be a laminated product obtained by pressurizing the object to be laminated.

[0025] In the second stage 22, a flattening process can be performed by a first press. The first press further pressurizes the primary molded product laminated in the vacuum laminator to increase the flatness of the laminated surface of the laminated material and pressure-mold it into a secondary molded product. For example, in the first press, a lower platen is provided that can be raised and lowered relative to a fixed upper platen. The first press has a pressure means such as a hydraulic cylinder. Pressure blocks (not shown) are provided on the opposing surfaces of the upper and lower plates. Temperature control means such as a cartridge heater are provided on the pressure blocks. Cushioning materials such as rubber or resin film are attached to the surfaces of the pressure blocks. A second press is arranged in series downstream of the first press. The second press further pressurizes the secondary molded product to pressure-mold it into a flat tertiary molded product. The tertiary molded product becomes the laminated product obtained by the layer molding system 100.

[0026] When the laminate molding system 100 includes a laminator and a flattening press device, the secondary molded product and the tertiary molded product are also laminated molded products obtained by pressing the laminated object. The laminated molded product transported from the molding device 20 to the cooling device 30 is the cooling target to be cooled in the cooling device 30. In each drawing, the primary molded product, the secondary molded product, and the tertiary molded product are all referred to as substrate W. The configuration of the second press device may be the same as that of the first press device.

[0027] A cooling device 30 may be provided downstream of the molding device 20. That is, the cooling device 30 is a cooling section disposed downstream of the laminator for cooling the laminated molded product. The cooling device 30 has an airflow generating means for blowing cooling air in a direction inclined at a predetermined angle from a direction substantially perpendicular to the conveying direction toward the downstream side of the conveying direction. The airflow generating means may be, for example, a cooling fan equipped with rotating blades. Note that the airflow generating means may also be another air blowing mechanism, such as a slit air nozzle.

[0028] Here, an example will be described in which the airflow generating means is a plurality of cooling fans 31. Note that the number of cooling fans 31 is not limited to the following example, and the airflow generating means may be a single cooling fan 31.

[0029] The cooling device 30 is equipped with a plurality of cooling fans 31. The cooling fans 31 are aligned along the transport direction. In the example shown in FIG. 1, five cooling fans 31 are aligned along the transport direction on the upper surface side of the substrate W. Also, five cooling fans 31 are aligned along the transport direction on the lower surface side of the substrate W. The heated substrate W is transported into the cooling device 30 sandwiched between an upper film F1 and a lower film F2. The configuration of the cooling device 30 will be described in detail later.

[0030] A recovery device 40 is provided downstream of the cooling device 30. The recovery device 40 includes an upper film winding device 41 and a lower film winding device 42. The recovery device 40 corresponds to a film winding device. In addition to recovering the carrier film, the recovery device 40 also has the function of recovering the laminated product (laminated substrate W). The recovery device 40 cooperates with the supplying device 10 to transport the upper film F1 and the lower film F2. That is, the supplying device 10 and the recovery device 40 transport the substrate W in the transport direction along the transport surface. The rotation of the upper film winding device 41 and the lower film winding device 42 is controlled by a motor (not shown). The upper film winding device 41 controls the feed amount and film tension of the upper film F1 between the upper film unwinding device 11 and the lower film unwinding device 13. The lower film winding device 42 controls the feed amount and film tension of the lower film F2 between the lower film unwinding device 13 and the upper film unwinding device 11.

[0031] The upper film F1 is redirected upward via one or more driven rolls and taken up by the upper film take-up device 41. After the upper film F1 has been taken up, the lower film F2 is transported horizontally a certain distance towards another driven roll. This portion becomes the discharge outlet from which the laminated substrate W is discharged. The lower film F2 is then taken up by the lower film take-up device 42, which is provided below, via one or more driven rollers.

[0032] Although not shown here, the laminate molding system 100 may be provided with a control device that is connected to the supply device 10, the molding device 20, the cooling device 30, and the recovery device 40 and controls the entire laminate molding system 100. The control device includes a processor and a memory, and the processor executes a program stored in the memory to control the operation of each part, such as the transport of the substrate W and the lamination process. The control device may also have the function of an air volume adjustment means that adjusts the air volume of the cooling device 30.

[0033] Here, the cooling device 30 will be described with reference to Figures 2 and 3. Figure 2 is a side view of the cooling device 30 of Figure 1. Figure 3 is a top view of the cooling device 30. In Figures 2 and 3, the conveying direction is the x direction, and the direction perpendicular to the x direction on the conveying plane is the y direction. The direction perpendicular to the conveying plane is the z direction. Of the multiple cooling fans 31, the cooling fan 31 arranged on the upper surface side of the substrate W is referred to as the upper cooling fan 31a, and the cooling fan 31 arranged on the lower surface side of the substrate W is referred to as the lower cooling fan 31b. In the cooling device 30, the area where the substrate W heated in the forming device 20 stops and is cooled by the cooling fan 31 is referred to as the cooling stage 32.

[0034] As shown in FIG. 3, when viewed from above, five upper cooling fans 31a are aligned in the transport direction, and two rows are arranged in the y direction. That is, the cooling device 30 is equipped with ten upper cooling fans 31a. Although not shown here, ten lower cooling fans 31b may be provided similarly to the upper cooling fans 31a. That is, two rows of five lower cooling fans 31b aligned in the transport direction may be provided below the lower film F2. By providing cooling fans 31 above and below the substrate W in this manner, the substrate W can be rapidly cooled. Furthermore, by arranging multiple cooling fans 31 in a lattice pattern, the entire surface of the substrate W can be efficiently cooled.

[0035] The interval between adjacent cooling fans 31 may be constant. However, the interval between adjacent cooling fans 31 may vary. For example, the interval between cooling fans 31 on the upstream side may be smaller than the interval between cooling fans 31 on the downstream side.

[0036] In the example shown in FIG. 3, the upper cooling fan 31a is attached to a rail that straddles the cooling stage 32 in the y direction. The upper cooling fan 31a is movable in a direction perpendicular to the conveying direction. FIG. 4 shows a state in which the upper cooling fan 31a is retracted from above the cooling stage 32. In the laminate molding system 100, when replacing the laminate film or performing maintenance work on the cooling stage 32, the upper cooling fan 31a can be retracted to the side from above the cooling stage 32 as shown in FIG. 4. This makes it easier for workers to perform their work and improves the maintainability of the laminate molding system 100. Note that the cooling fan 31 only needs to be movable in at least one direction of the conveying direction (x direction), a direction approximately perpendicular to the conveying direction on the conveying plane (y direction), and a direction approximately perpendicular to the conveying plane (z direction).

[0037] 2, the cooling fans 31 blow cooling air relative to the substrate W in a direction tilted at a predetermined angle θ1 from the approximately perpendicular direction (z direction) of the transport surface toward the downstream side in the transport direction (x direction). Specifically, the upper cooling fan 31a blows cooling air in a direction tilted from the perpendicular direction to the top surface of the substrate W toward the downstream side in the transport direction. The lower cooling fan 31b blows cooling air in a direction tilted from the perpendicular direction to the bottom surface of the substrate W toward the downstream side in the transport direction.

[0038] In the comparative example in which the cooling fan 31 blows cooling air perpendicular to the substrate W, the cooling air that hits the substrate W flows toward the forming device 20, which may cause particles to enter the forming device 20 from the cooling device 30 side. This may cause particles to get in between the substrate W and the upper film F1 or the lower film F2, or between these films and the hot plate, which may result in defects.

[0039] In contrast, in this embodiment, the cooling air from the cooling fan 31 is inclined at a predetermined angle θ1 toward the downstream side in the transport direction from a direction perpendicular to the substrate W. Therefore, the cooling air flows toward the recovery device 40 on the downstream side in the transport direction, and does not flow toward the molding device 20 on the upstream side in the transport direction. This makes it possible to prevent particles from entering the molding device 20 from the cooling device 30 side, and to suppress contamination of the molding stage, the substrate W, and the inside of the housing of the molding device 20.

[0040] Furthermore, since the cooling air is not directed toward the molding apparatus 20, it is possible to prevent cooling of components other than the substrate W that is the cooling target. For example, it is possible to prevent cooling of a hot plate provided in the molding apparatus 20 on the upstream side of the cooling apparatus 30. Furthermore, the air that has been warmed by cooling the substrate W can be circulated outside the laminate molding system 100 from an outlet for the substrate W on the downstream side, etc.

[0041] FIG. 5 is a diagram illustrating the mounting angle of the upper cooling fan 31a. The direction of the cooling air blown out from the upper cooling fan 31a is perpendicular to the cooling air blowing surface 33 of the upper cooling fan 31a. The mounting angle is defined as the angle θ2 formed by the blowing surface 33 of the upper cooling fan 31a and the xy plane parallel to the transport surface. The multiple upper cooling fans 31a are mounted at an angle such that their blowing surfaces 33 face downstream in the transport direction. The mounting angles of the multiple upper cooling fans 31a are equal to one another. This angle θ2 is equal to the angle θ1 at which the cooling air from the upper cooling fan 31a tilts from a direction perpendicular to the substrate W toward the downstream side in the transport direction.

[0042] Although not shown here, the multiple lower cooling fans 31b are each mounted at an angle θ2 so that their blowing surfaces 33 face downstream in the transport direction. This angle θ2 is equal to the angle θ1 at which the cooling air from the lower cooling fans 31b is tilted from a direction perpendicular to the substrate W toward the downstream in the transport direction. In this way, by making the mounting angles of the multiple upper cooling fans 31a and the multiple lower cooling fans 31b constant, mounting of the cooling fans 31 can be made easier.

[0043] The angle θ2 is, for example, 5 to 30 degrees, and preferably 10 to 20 degrees. For example, the mounting angle (angle θ2) of each of the multiple cooling fans 31 can be 15 degrees. The mounting angles of the cooling fans 31 may differ depending on the spacing between adjacent cooling fans 31, the balance between the upper cooling fans 31a and the lower cooling fans 31b, and other factors. For example, the mounting angle of the most upstream cooling fan 31 may be 45 degrees, and the mounting angles of the cooling fans 31 may decrease toward the downstream side.

[0044] When the substrates W are carried into the cooling device 30 from the forming device 20 at the above-mentioned pitch, there are cases where the substrates W stop at a position on the upstream side of the cooling stage 32, and no substrates W are arranged downstream. In this case, the above-mentioned control device may adjust the air volumes of the multiple cooling fans 31 so that the volume of cooling air flowing in the upstream region in the transport direction is greater than the volume of cooling air flowing in the downstream region. This allows strong cooling air to flow toward the position where the substrates W are arranged, making it possible to cool the substrates W efficiently.

[0045] The above-described control device may adjust some of the cooling fans so that the volume of cooling air blown by the cooling fan located downstream in the transport direction is greater than the volume of cooling air blown by the cooling fan located upstream. Generally, if the volume of air blown downstream is small, the cooling air blown upstream becomes clogged and flows to the side. As described above, increasing the volume of air blown by some of the downstream cooling fans makes it easier for the upstream cooling air to flow downstream. This allows the cooling air to flow in one direction along the transport direction. It also makes it possible to suppress dust being stirred up due to turbulence at the exhaust port and backflow caused by the air bouncing off the inner surface of the housing.

[0046] The cooling device 30 may be equipped with a measuring means for measuring the temperature of the substrate W. The control device can adjust the airflow rate of the multiple cooling fans 31 according to the temperature of the substrate W. The control device can also adjust the airflow rate by, for example, changing the number of operating cooling fans 31 among the multiple cooling fans 31. For example, the control device can set the cooling air generated by the cooling fans 31 to "strong airflow" by operating ten upper cooling fans 31a, "medium airflow" by operating half (five) of the upper cooling fans 31a, or "weak airflow" by operating one-fifth of the upper cooling fans 31a.

[0047] Embodiment 2. The laminate molding system 100 according to the second embodiment includes a supply device 10, a molding device 20, a cooling device 30A, and a recovery device 40. The supply device 10, the molding device 20, and the recovery device 40 are the same as those in the first embodiment, so redundant explanations will be omitted. Fig. 6 is a top view of the cooling device 30A. Fig. 7 is a side view of the cooling device 30A. In Figs. 6 and 7, the conveying direction is the x-direction, and the direction perpendicular to the x-direction on the conveying plane is the y-direction. The direction perpendicular to the conveying plane is the z-direction.

[0048] In the second embodiment, the plurality of upper cooling fans 31a are each attached to one mounting plate 34. As shown in Fig. 6, when viewed from above, five upper cooling fans 31a are aligned in the transport direction and attached to one mounting plate 34 in two rows aligned in the y direction. That is, the cooling device 30A includes a cooling fan unit 35 in which ten upper cooling fans 31a are attached to the mounting plate 34.

[0049] The cooling fan unit 35 is movable in at least one of the conveying direction (x direction), the direction substantially perpendicular to the conveying direction on the conveying surface (y direction), and the direction substantially perpendicular to the conveying surface (z direction). This allows the upper cooling fan 31a to be retracted from above the cooling stage 32 to the side when replacing the laminate film or performing maintenance work on the cooling stage 32.

[0050] Here, the direction of the cooling air blown out from the upper cooling fan 31a is perpendicular to the cooling air blowing surface 33 of the upper cooling fan 31a. The upper cooling fans 31a are attached to the mounting plate 34 so that the blowing surface 33 is approximately perpendicular to the conveying surface when the mounting plate 34 is parallel to the conveying surface.

[0051] 5 and 6, a frame 36 is provided to straddle the cooling stage 32 in the y direction. The downstream side of the mounting plate 34 is connected to the frame 36 so as to be rotatable about a rotation axis 37. By rotating the mounting plate 34 downward by an angle θ3 about the rotation axis 37 from a state parallel to the conveyance surface, the angles at which the cooling air flows from the multiple upper cooling fans 31a can be changed simultaneously.

[0052] When the mounting plate 34 is tilted by angle θ3, each upper cooling fan 31a can blow cooling air in a direction tilted by a predetermined angle θ1 toward the downstream side of the transport direction (x direction) from the direction approximately perpendicular to the transport surface (z direction) relative to the substrate W. This makes it possible to easily change the angle of the cooling air from the multiple upper cooling fans 31a.

[0053] As described above, according to the embodiment, it is possible to suppress the flow of cooling air upstream in the transport direction and prevent particles from entering the molding device 20. Furthermore, by making the mounting position, mounting angle, and number of operations of the cooling fan 31 variable, it is possible to efficiently cool the substrate W. Furthermore, by making the cooling fan 31 retractable from above the cooling stage 32, it is possible to improve maintainability.

[0054] The present invention is not limited to the above embodiment, and modifications can be made as appropriate without departing from the spirit and scope of the invention. In the above example, the direction of the cooling air is changed by changing the mounting angle of the cooling fan 31, but this is not limiting. For example, the direction of the cooling air can be changed by providing a louver in front of the blowing surface 33 of the cooling fan 31. [Explanation of symbols]

[0055] 100 Laminated Molding System 10 Feeding device 11 Upper film unwinding device 12 Upper film cleaning device 13 Lower film unwinding device 14 Lower film cleaning device 15 Substrate receiving unit 20 Molding equipment 21 Stage 1 22 Stage 2 23 Third Stage 30 Cooling device 30A cooling device 31 Cooling fan 31a Upper cooling fan 31b Lower cooling fan 32 Cooling stage 33 Blowout surface 34 Mounting plate 35 Cooling fan unit 36 frames 37 Rotating shaft 40 Recovery Device 41 Upper film winding device 42 Lower film winding device W substrate F1 top film F2 Lower Film

Claims

1. a pair of carrier films that sandwich the lamination object, which is formed by laminating the lamination material onto the lamination target, from above and below and transport the lamination object along the transport direction; a film unwinder that unwinds the carrier film; a laminator disposed downstream of the film unwinder and pressurizing the object to be laminated to form a laminated molded product; a cooling unit disposed downstream of the laminator and configured to cool the laminated molded product; a film winding machine disposed downstream of the laminator and configured to carry out the laminated molded product placed on the carrier film; the cooling unit has an airflow generating means for causing cooling air to flow in a direction inclined at a predetermined angle from a direction substantially perpendicular to the transport direction toward a downstream side of the transport direction. Laminated molding system.

2. the cooling unit has a plurality of airflow generating means arranged along the transport direction. The layered molding system of claim 1 .

3. The airflow generating means is a cooling fan equipped with rotating blades. The layered molding system of claim 2 .

4. The laminator further includes a flattening press device that applies pressure to the laminated product to increase the flatness of the laminated surface of the laminated material. The cooling unit is disposed downstream of the flattening press device. The layered molding system of claim 1 .

5. an air volume adjusting means for adjusting the air volumes of the plurality of air flow generating means so that the volume of cooling air flowing in the upstream region in the transport direction is greater than the volume of cooling air flowing in the downstream region in the transport direction, The layered molding system of claim 2 .

6. the air volume adjusting means adjusts some of the plurality of airflow generating means so that the volume of the cooling air blown by the airflow generating means arranged downstream in the conveying direction is greater than the volume of the cooling air blown by the airflow generating means arranged upstream in the conveying direction. The lamination molding system according to claim 5 .

7. Further provided is a measuring means for measuring the temperature of the laminated molded product, an air volume adjusting means for adjusting the air volume of the plurality of air flow generating means in accordance with the temperature of the laminated molded product; The layered molding system of claim 1 .

8. the airflow adjusting means adjusts the airflow by changing the number of operating airflow generating means among the plurality of airflow generating means. The lamination molding system according to any one of claims 5 to 7.

9. the plurality of airflow generating means are movable in at least one direction of the conveying direction, a direction substantially perpendicular to the conveying direction on the conveying surface, and a direction substantially perpendicular to the conveying surface; The layered molding system of claim 1 .

10. The mounting angles of the plurality of cooling fans with respect to a plane parallel to the conveyance surface are equal to each other. The lamination molding system of claim 3 .

11. The plurality of cooling fans are each attached to a single mounting plate, By tilting the mounting plate with respect to a plane parallel to the conveyance plane, the angles at which the cooling air flows from the plurality of cooling fans are simultaneously changed. The lamination molding system of claim 3 .

12. The cooling section is a plurality of upper cooling fans arranged on the upper surface side of the laminated molded product; a plurality of lower cooling fans arranged on the lower surface side of the laminated molded product, the upper cooling fan blows cooling air in a direction inclined from a direction perpendicular to an upper surface of the laminated molded product toward a downstream side in the conveying direction, the lower cooling fan blows cooling air in a direction inclined from a direction perpendicular to a lower surface of the laminated molded product toward the downstream side in the conveying direction. The lamination molding system of claim 3 .

13. a process of sandwiching a lamination object, in which a lamination material is laminated on a lamination target body, between a pair of carrier films from above and below and conveying the laminate object along a conveying direction; A process of pressing the transported laminate object to form a laminated molded product; a process of cooling the formed laminated molded product using an airflow generating means that blows cooling air in a direction inclined at a predetermined angle from a direction substantially perpendicular to the conveying direction toward a downstream side of the conveying direction; A process of carrying out the laminate molded product placed on the carrier film; Equipped with Manufacturing method for laminated molded products.

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