Light emitting device and method of manufacturing the same
The light-emitting device design minimizes resin-induced degradation by optimizing the arrangement of leads, elements, and lens portions, ensuring high brightness and light distribution.
JP2026015379APending Publication Date: 2026-01-29NICHIA CORP
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Patent Information
- Application Number
- JP2025186658
- Authority / Receiving Office
- JP · JP
- Patent Type
- Applications
- Current Assignee / Owner
- Priority Date
- 2022-02-18
- Filing Date
- 2025-11-05
- Publication Date
- 2026-01-29
AI Technical Summary
Technical Problem
Existing light-emitting devices suffer from degradation due to waterproof resins, which affect their characteristics.
Method used
A light-emitting device design with a resin package and molded resin portion that includes leads, light-emitting elements, and lens portions, arranged to minimize contact with waterproof resin, reducing its impact on device performance.
Benefits of technology
The design reduces degradation caused by waterproof resin, maintaining device brightness and light distribution efficiency.
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Smart Images
Figure 2026015379000001_ABST
Abstract
To provide a light-emitting device capable of reducing deterioration in characteristics of the light-emitting device due to a waterproof resin.SOLUTION: The light-emitting device includes a resin package that includes a plurality of leads and a resin member that fixes at least a part of the plurality of leads, the resin package having one recessed portion defined by the resin member and the plurality of leads on a main surface, each of the plurality of leads having an exposed region exposed to an upper inner surface of the one recessed portion, a plurality of light-emitting elements including first, second, and third light-emitting elements disposed in the one recessed portion of the resin package, each of the plurality of light-emitting elements being disposed in the exposed region of any of the plurality of leads, a base portion that seals the plurality of light-emitting elements, and a molded resin portion including a plurality of lens portions located above the base portion and integrally formed with the base portion. And a mold resin portion including first to third lens portions respectively overlapping with the first to third light emitting elements in a plan view.SELECTED DRAWING: Figure 2E
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Citation Information
Patent Citations
Semiconductor light emitting device and its manufacture
JP1998261821A