Light emitting device

Abstract

The utility model relates to a light emitting device. The light-emitting device comprises a light-emitting assembly, a shading piece and a condensing lens, the light-emitting assembly comprises a light-emitting chip, the light-emitting assembly is provided with a mounting groove, and the light-emitting chip is arranged in the mounting groove. At least part of the shading piece is arranged in the installation groove, the shading piece is provided with a light passing hole corresponding to the light-emitting chip, the light passing hole is provided with a light passing opening for limiting the light passing amount, and the size of the light passing opening is smaller than or equal to the size of the light-emitting face of the light-emitting chip. The condensing lens is arranged on the light-emitting assembly or the shading piece and corresponds to the light passing hole. The light-emitting device can output small-angle light beams only by means of the shading piece and the condensing lens, a plurality of lenses do not need to be arranged, and the structure is simple; the size of the shading piece is matched with the size of the light-emitting chip, and the size of the condensing lens is matched with the size of the light passing hole, so that the size of the light-emitting device can be greatly reduced, the miniaturization of the light-emitting device is realized, and the cost of the light-emitting device is remarkably reduced.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of semiconductor light emitting, in particular to a light emitting device. BACKGROUND

[0002] In order to obtain a small-angle light beam, a lens group is usually arranged in front of a light source, the lens group comprising a plurality of lenses, the plurality of lenses performing multiple shaping, such as light condensation and collimation, on the light emitted by the light source, and projecting a small-angle light beam. Due to the arrangement of the lens group, the light emitting device outputting a small-angle light beam has a complex structure, a large volume and a high cost. SUMMARY

[0003] Therefore, it is necessary to provide a light emitting device to solve the problems of complex structure, large volume and high cost of the light emitting device outputting a small-angle light beam.

[0004] A light emitting device comprises:

[0005] A light emitting assembly, the light emitting assembly comprising a light emitting chip, the light emitting chip being provided with a mounting groove, the light emitting chip being arranged in the mounting groove;

[0006] An optical shielding member, at least a part of the optical shielding member being arranged in the mounting groove, the optical shielding member being provided with a light passing hole corresponding to the light emitting chip, the light passing hole having a light passing opening defining a light passing amount, the size of the light passing opening being less than or equal to the size of a light emitting surface of the light emitting chip; and

[0007] A light condensing lens, the light condensing lens being arranged on the light emitting assembly or the optical shielding member and corresponding to the light passing hole.

[0008] In one of the embodiments, at least a part of the optical shielding member is clamped in the mounting groove, the bottom surface of the optical shielding member is arranged in a spaced manner with the top surface of the light emitting chip, and the light passing hole is located above the light emitting chip.

[0009] In one of the embodiments, the side surface of the mounting groove is arranged in a diverging manner in the light emitting direction of the optical axis, and the side surface of the optical shielding member is arranged in a matched manner with the side surface of the mounting groove.

[0010] In one of the embodiments, the optical shielding member is located on the groove bottom of the mounting groove, and the light emitting chip is located in the light passing hole.

[0011] In one of the embodiments, the light emitting assembly further comprises a substrate and a reflecting member, the light emitting chip is arranged on the substrate, the reflecting member has a reflecting hole, and the reflecting member is arranged on the substrate so that the reflecting hole and the substrate enclose the mounting groove.

[0012] In one of the embodiments, the mounting groove is provided with the light emitting chip, and the hole wall of the reflection hole is attached to the side surface of the light emitting chip.

[0013] In one of the embodiments, the material of the reflection member is white resin filled with heat dissipation particles.

[0014] A light emitting device comprises:

[0015] A light emitting assembly comprises a light emitting chip;

[0016] A light shielding member is arranged on the light emitting assembly and is provided with a light passing hole corresponding to the light emitting chip, the light passing hole has a light passing opening defining a light passing amount, and the size of the light passing opening is less than or equal to the size of the light emitting chip; and

[0017] A condenser lens is arranged on the light shielding member and is arranged corresponding to the light passing hole.

[0018] In one of the embodiments, the light emitting assembly further comprises a substrate and a light guide member, the light emitting chip is arranged on the substrate, and the light guide member is arranged on the light emitting chip; and the light shielding member is arranged on the top surface of the light guide member.

[0019] In one of the embodiments, the light emitting assembly further comprises a light transmitting adhesive layer, the light transmitting adhesive layer covers the light emitting chip, and the bottom surface of the light guide member is adhered to the top surface of the light transmitting adhesive layer.

[0020] The light emitting device has the following advantages. The light shielding member is arranged on the light emitting assembly, the light passing hole is arranged on the light shielding member, the light passing hole has the light passing opening defining the light passing amount, and the size of the light passing opening is less than or equal to the size of the light emitting chip. Therefore, the main light emitting of the light emitting chip can pass through the light passing opening and be emitted, and the light beam with a light emitting angle as small as 5° can be projected after being condensed by the condenser lens, so that the light emitting device can output the small-angle light beam by means of the light shielding member and the condenser lens. Therefore, the light emitting device can output the small-angle light beam without the need of arranging multiple lenses, and the structure of the light emitting device is simple. Meanwhile, the size of the light shielding member is adapted to the size of the light emitting chip, and the size of the condenser lens is adapted to the size of the light passing hole, so that the volume of the light emitting device can be greatly reduced, the miniaturization of the light emitting device can be realized, the application scenarios of the light emitting device can be increased, and the cost of the light emitting device can be significantly reduced. BRIEF DESCRIPTION OF DRAWINGS

[0021] Figure 1 FIG. 1 is a sectional view of a light emitting device according to a first embodiment of the present application.

[0022] Figure 2 FIG. 2 is a sectional view of a light emitting device according to a second embodiment of the present application.

[0023] Figure 3A sectional view of a light emitting device according to a third embodiment of the present application.

[0024] Figure 4 A sectional view of a light emitting device according to a fourth embodiment of the present application.

[0025] Explanation of Reference Numerals:

[0026] 100 - light emitting device; 110 - light emitting component; 111 - light emitting chip; 112 - mounting groove; 113 - support; 114 - base; 115 - conductive structure; 116 - substrate; 117 - reflecting member; 118 - light guide member; 119 - light transmitting adhesive layer; 120 - light shielding member; 121 - light passing hole; 122 - light passing opening; 130 - condensing lens; 140 - light transmitting adhesive layer. DETAILED DESCRIPTION

[0027] In order to make the above objectives, features and advantages of the present application more clear and comprehensible, specific embodiments of the present application will be described in detail below with reference to the accompanying drawings. In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present application. It will be apparent, however, to one skilled in the art that the present application can be practiced without using some or all of these specific details, and that the present application is not limited to the specific embodiments disclosed below.

[0028] In the description of the present application, it is to be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like, indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, and are merely used for the purpose of facilitating the description of the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be construed as limiting the present application.

[0029] In addition, if the terms "first", "second" appear, these terms are used only for the purpose of description and cannot be construed as indicating or implying relative importance or implying the number of technical features indicated. Therefore, the features limited by "first", "second" can explicitly or implicitly include at least one of the features. In the description of the present application, if the term "plurality" appears, the meaning of "plurality" is at least two, for example, two, three, etc., unless otherwise specifically limited.

[0030] In the present application, unless specifically defined otherwise, if there is an appearance of the terms "mount", "connect", "connection", "fixed", and the like, these terms should be interpreted broadly. For example, it can be fixedly connected, or it can be detachably connected, or it can be integrated; it can be mechanically connected, or it can be electrically connected; it can be directly connected, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two elements or the interaction relationship between two elements, unless otherwise specifically defined. For those skilled in the art, the specific meaning of the above terms in the present application can be understood according to the specific circumstances.

[0031] In the present application, unless specifically defined otherwise, if there is an appearance of the terms "mount", "connect", "connection", "fixed", and the like, these terms should be interpreted broadly. For example, it can be fixedly connected, or it can be detachably connected, or it can be integrated; it can be mechanically connected, or it can be electrically connected; it can be directly connected, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two elements or the interaction relationship between two elements, unless otherwise specifically defined. For those skilled in the art, the specific meaning of the above terms in the present application can be understood according to the specific circumstances.

[0032] It should be noted that if an element is referred to as "fixed to" or "disposed on" another element, it can be directly on the other element or there can be a middle element. If an element is considered to be "connected" to another element, it can be directly connected to the other element or there can be a middle element. If present, the terms "vertical", "horizontal", "up", "down", "left", "right", and similar expressions used in the present application are for illustrative purposes only and do not represent the only implementation.

[0033] Please refer to Figure 1 , Figure 1 A cross-sectional view of a light emitting device in the first embodiment of the present application is shown. The first embodiment of the present application provides a light emitting device 100, which includes a light emitting assembly 110, a light shielding member 120, and a condenser lens 130. The light emitting assembly 110 includes a light emitting chip 111, and the light emitting assembly 110 is provided with a mounting groove 112, and the light emitting chip 111 is disposed in the mounting groove 112. At least part of the light shielding member 120 is disposed in the mounting groove 112, and the light shielding member 120 is provided with a light passing hole 121 corresponding to the light emitting chip 111. The light passing hole 121 has a light passing opening 122 that defines the amount of light passing, and the size of the light passing opening 122 is less than or equal to the size of the light emitting chip 111. The condenser lens 130 is disposed on the light emitting assembly 110 and is arranged corresponding to the light passing hole 121.

[0034] By setting the light shielding piece 120 on the light emitting assembly 110, the light shielding piece 120 is provided with a light passing hole 121, the light passing hole 121 is provided with a light passing opening 122 which defines the light passing amount, the size of the light passing opening 122 is less than or equal to the size of the light emitting chip 111, the main light emitting of the light emitting chip 111 can pass through the light passing opening 122 and be emitted, after being condensed by the condenser lens 130, a light beam with a small light emitting angle of 5° can be projected, and a small angle light beam is output. Therefore, the light emitting device 100 can output a small angle light beam only by means of the light shielding piece 120 and the condenser lens 130, without the need to set multiple lenses, and the structure is simple; at the same time, the size of the light shielding piece 120 is adapted to the size of the light emitting chip 111, and the size of the condenser lens 130 is adapted to the size of the light passing hole 121, which can greatly reduce the volume of the light emitting device 100, realize the miniaturization of the light emitting device 100, increase the application scene, and significantly reduce the cost of the light emitting device 100.

[0035] It should be noted that the light passing opening 122 of the light passing hole 121 can be a light inlet, a light outlet or other light opening. When the light inlet determines the light passing amount of the light passing hole 121, the light passing opening 122 is a light inlet; when the light outlet determines the light passing amount of the light passing hole 121, the light passing opening 122 is a light outlet.

[0036] At least part of the light shielding piece 120 is clamped in the mounting groove 112, the bottom surface of the light shielding piece 120 is spaced apart from the top surface of the light emitting chip 111, and the light passing hole 121 is located above the light emitting chip 111. The light shielding piece 120 is fixed in the mounting groove 112 by clamping, which has good fixing effect and is convenient to install, and is conducive to improving the assembly efficiency of the light emitting device 100.

[0037] The side surface of the mounting groove 112 is gradually expanded in the light emitting direction of the optical axis, the side surface of the light shielding piece 120 is adapted to the side surface of the mounting groove 112, which simplifies the assembly structure of the two, and the bottom end of the light shielding piece 120 is small and the top end is large, which is easy to insert into the mounting groove 112. When the light shielding piece 120 is inserted to the appropriate position, it cannot continue to penetrate, so that the side surface of the light shielding piece 120 and the side surface of the mounting groove 112 are embedded and fixed with each other. The profile line of the side surface of the mounting groove 112 can be a straight line or a concave curve, and the side surface of the light shielding piece 120 is correspondingly a straight line or a concave curve.

[0038] The light emitting component 110 further comprises a bracket 113, and the mounting groove 112 is formed in the bracket 113. The bracket 113 comprises a base 114 and a conductive structure 115, the edge of the conductive structure 115 is embedded in the bottom of the base 114, and the mounting groove 112 is enclosed by the base 114 and the conductive structure 115. The conductive structure 115 forms the bottom of the mounting groove 112, and the base 114 forms the side of the mounting groove 112. The conductive structure 115 comprises a first part (not numbered) and a second part (not numbered) arranged at intervals, and the light emitting chip 111 is arranged on the first part. The electrode on the top surface of the light emitting chip 111 is electrically connected to the second part through a bonding wire (not shown).

[0039] The size of the light emitting chip 111 is 20 μm to 200 μm. Further, the size of the light emitting chip 111 can be, but is not limited to, 50 μm to 100 μm, and specifically can be 80 μm, 90 μm or 100 μm. The light emitting chip 111 can be, but is not limited to, an LED chip or a semiconductor laser chip. The light emitting chip 111 can be a flip chip or a vertical chip. The number of the light emitting chip 111 can be set according to actual needs, and can be, but is not limited to, one.

[0040] In the embodiment, most of the light shielding member 120 is embedded in the mounting groove 112, that is, only a small part of the light shielding member 120 protrudes from the top surface of the mounting groove 112. When assembling the light shielding member 120, the light shielding member 120 can be first molded, then inserted into the mounting groove 112 to a suitable depth, and fixed. In other embodiments, the light shielding member 120 can be completely embedded in the mounting groove 112.

[0041] The light passing hole 121 of the light shielding member 120 is tapered in the light emitting direction of the optical axis, that is, the light inlet of the light passing hole 121 is larger than the light outlet, so that the light outlet can control the light emitting amount of the light passing hole 121, and the light outlet is the light passing hole 122. The inner side surface of the light passing hole 121 can further shield part of the light entering the light passing hole 121, so that the light emitting range of the light passing hole 121 is smaller and more concentrated, the brightness of the projected light spot of the light emitting device 100 is high, the uniformity is good, and the light spot edge is clear. The size of the light passing hole 122 (light outlet) can be equal to the size of the light emitting chip 111.

[0042] In the embodiment, only one light emitting chip 111 is arranged in the mounting groove 112, however, the number of the light emitting chip 111 is not limited thereto, and the light emitting chip 111 can be, but is not limited to, an LED chip. The optical axis L of the light emitting chip 111 is substantially coincident with the central axis of the light passing hole 121. The light passing hole 121 is square, and the light passing hole 122 is also square. It should be noted that in other embodiments, the light passing hole 122 can be in the shape of a circular truncated cone, a hexagon or other polygons.

[0043] In the embodiment, the light shielding member 120 is made of light absorbing material, which can be black material or resin filled with black particles, but is not limited to this. The surface of the light shielding member 120 can absorb the light irradiated thereon, so that the light cannot penetrate the light shielding member 120. In an alternative embodiment, the light shielding member 120 can be made of high reflective material, such as white resin or resin filled with high reflective particles, but is not limited to this. The surface of the light shielding member 120 can reflect the light irradiated thereon, so that the light cannot penetrate the light shielding member 120.

[0044] In the embodiment, the light collecting lens 130 is arranged on the top surface of the base 114, which can be fixed on the top surface of the base 114 by bonding, and can collect the light emitted from the light passing hole 121, reduce the light emitting angle, and improve the spot brightness.

[0045] In order to avoid the part of the light shielding member 120 extending out of the top surface of the base 114, the bottom surface of the light collecting lens 130 is provided with a clearance groove (not numbered), which accommodates the extending part of the light shielding member 120, so that the two do not interfere with each other. In other embodiments, the light collecting lens 130 can be directly arranged on the top surface of the light shielding member 120, so as to simplify the structure of the light collecting lens 130.

[0046] In the embodiment, the light collecting lens 130 can be, but is not limited to, a convex lens, specifically a plano-convex lens, and the light emitting surface thereof is a convex curved surface. However, in other embodiments, the plano-convex lens can be replaced by a biconvex lens, or the light collecting lens 130 can also be a Fresnel lens.

[0047] Please refer to Figure 2 , Figure 2 shows a cross-sectional view of the light emitting device in the second embodiment of the present application. Compared with the light emitting device 100 in the first embodiment, the light shielding member 120 in the light emitting device 100 in the second embodiment is located on the groove bottom of the mounting groove 112, and the light emitting chip 111 is located in the light passing hole 121. The light shielding member 120 is supported by the groove bottom of the mounting groove 112, and is more stable in installation.

[0048] The light shielding member 120 can be arranged only around the light emitting chip 111, so as to reduce the amount of material. The light shielding member 120 can also be arranged according to the shape of the mounting groove 112.

[0049] In the embodiment, the light passing hole 121 is tapered in the light emitting direction of the optical axis, i.e., the light inlet of the light passing hole 121 is larger than the light outlet, the light inlet can be sleeved on the light emitting chip 111, and the light outlet can control the light emitting amount of the light passing hole 121.

[0050] It should be noted that, in order to reduce the Fresnel loss of the light emitting chip 111, transparent glue (not shown) can be filled in the light passing hole 121, and the transparent glue covers the light emitting chip 111.

[0051] As other aspects of the light emitting device 100 in the embodiment are substantially the same as those of the light emitting device 100 in the first embodiment described above, details thereof can be referred to the description of the first embodiment and will not be repeated here.

[0052] Please refer to Figure 3 , Figure 3 A cross-sectional view of the light emitting device in the third embodiment of the present application is shown. Compared with the light emitting device 100 in the first embodiment described above, the light emitting assembly 110 in the light emitting device 100 in the embodiment adopts a substrate 116 and a reflector 117 instead of the bracket 113. The light emitting assembly 110 further includes the substrate 116 and the reflector 117, and the light emitting chip 111 is arranged on the substrate 116. The reflector 117 has a reflecting hole, and is arranged on the substrate 116 so that the reflecting hole (not labeled) and the substrate 116 enclose the mounting groove 112. The reflecting hole of the reflector 117 can reflect light towards the light shielding member 120, increase the light output of the light passing hole 121, and improve the brightness of the projected light spot.

[0053] In the embodiment, the reflecting hole of the reflector 117 is arranged in a diverging manner in the light output direction of the optical axis, which facilitates the arrangement of the light shielding member 120. In other embodiments, the reflecting hole of the reflector 117 can be arranged in a converging manner in the light output direction of the optical axis, and the light is collected and concentrated through multiple reflections of the reflecting hole, thereby significantly increasing the light output of the light passing hole 121 and improving the brightness of the small-angle light beam emitted.

[0054] In the embodiment, only one light emitting chip 111 is arranged in the mounting groove 112, the hole wall of the reflecting hole is attached to the side surface of the light emitting chip 111, and the size of the reflector 117 can be adapted to the size of the light emitting chip 111, thereby reducing the volume of the light emitting device 100. It should be noted that the number of light emitting chips 111 in the mounting groove 112 is not limited to one, and can be set according to actual needs.

[0055] In the embodiment, the reflector 117 is directly molded on the substrate 116 by using white resin, and the hole wall naturally forms a reflecting surface after curing and molding, without the need for additional processing of the reflecting surface. It should be noted that in other embodiments, the reflecting surface can be formed by coating or electroplating a high-reflectivity layer on at least part of the hole wall of the reflecting hole.

[0056] In the embodiment, the material of the reflector 117 is white resin filled with heat dissipation particles, which has good reflecting performance and heat dissipation performance, directly contacts the side surface of the light emitting chip 111, and quickly leads out the heat of the light emitting chip 111. The heat dissipation particles can be, but are not limited to, white carbon black, aluminum oxide or boron nitride, the white resin can be, but is not limited to, high-reflectivity base resin, and the material of the reflector 117 can be, but is not limited to, white carbon black filler modified base resin.

[0057] In the embodiment, the light-emitting device 100 further comprises a light-transmitting adhesive layer 140, which is arranged on the top surface of the light-emitting chip 111, and the top surface of the light-transmitting adhesive layer 140 is a convex curved surface. The light-transmitting adhesive layer 140 not only can reduce Fresnel loss, but also can concentrate light on the top surface of the light-transmitting adhesive layer 140, so that more light emitted by the light-emitting chip 111 is directed to the light-transmitting hole 121, thereby further improving the brightness of the projected light spot. When the light-transmitting adhesive layer 140 is formed, an appropriate amount of light-transmitting adhesive can be directly dropped on the top surface of the light-emitting chip 111, and then the top surface of the light-transmitting adhesive layer 140 is formed by means of a mold and surface tension.

[0058] In the embodiment, the light-blocking member 120 is completely embedded in the mounting groove 112, and the material of the light-blocking member 120 is a high-reflectivity material, such as white resin or resin filled with high-reflectivity particles, but is not limited thereto. In this way, the surface of the light-blocking member 120 is a reflective surface, and light is reflected multiple times in the cavity formed between the light-blocking member 120 and the mounting groove 112, thereby fully mixing the light. At the same time, the hole wall of the light-transmitting hole 121 is also a reflective surface, which is conducive to the reflection and emission of light.

[0059] In the embodiment, the light-blocking member 120 is completely embedded in the mounting groove 112, and the material of the light-blocking member 120 is a high-reflectivity material, such as white resin or resin filled with high-reflectivity particles, but is not limited thereto. In this way, the surface of the light-blocking member 120 is a reflective surface, and light is reflected multiple times in the cavity formed between the light-blocking member 120 and the mounting groove 112, thereby fully mixing the light. At the same time, the hole wall of the light-transmitting hole 121 is also a reflective surface, which is conducive to the reflection and emission of light.

[0060] In the embodiment, the light-blocking member 120 is completely embedded in the mounting groove 112, and the material of the light-blocking member 120 is a high-reflectivity material, such as white resin or resin filled with high-reflectivity particles, but is not limited thereto. In this way, the surface of the light-blocking member 120 is a reflective surface, and light is reflected multiple times in the cavity formed between the light-blocking member 120 and the mounting groove 112, thereby fully mixing the light. At the same time, the hole wall of the light-transmitting hole 121 is also a reflective surface, which is conducive to the reflection and emission of light.

[0061] Please refer to Figure 4 , Figure 4 shows a cross-sectional view of the light-emitting device in the fourth embodiment of the present application. Compared with the light-emitting device 100 in the third embodiment described above, the light-emitting device 100 in the present embodiment uses a light guide member 118 instead of the reflective member 117. That is, the light-emitting assembly 110 further comprises the light guide member 118, which is arranged on the light-emitting chip 111. The light-blocking member 120 is arranged on the top surface of the light guide member 118. The light-concentrating lens 130 is arranged on the top surface of the light-blocking part 124. The light emitted by the light-emitting chip 111 is collected into the light guide member 118 through the bottom surface of the light guide member 118, thereby reducing the light loss of the light-emitting chip 111. After the light is transmitted through the light guide member 118, it is output from the top surface of the light guide member 118, thereby fully mixing the light and improving the brightness of the light output from the top surface of the light guide member 118.

[0062] In the embodiment, the light emitting component 110 further comprises a light-transmitting adhesive layer 119, which covers the light emitting chip 111, and the bottom surface of the light guide 118 is adhered to the top surface of the light-transmitting adhesive layer 119. The light-transmitting adhesive layer 119 not only plays a role of adhering and fixing the light guide 118, but also can coat and seal the light emitting chip 111, so as to protect the light emitting chip 111 and improve its service life. It should be noted that in other embodiments, the bottom end of the light guide 118 can coat the light emitting chip 111, and is fixed on the light emitting chip 111 and seals the light emitting chip 111; or the light guide 118 comprises a supporting structure and a light guide structure, the supporting structure is supported on the substrate 116, and the light guide structure is attached to the top surface of the light emitting chip 111.

[0063] In the embodiment, the light guide 118 is arranged straight in the light-out direction of the optical axis, that is, the size of the light-in end is equal to the size of the light-out end. At the same time, the sizes of the light-transmitting adhesive layer 119 and the light guide 118 are adapted to the arrangement of the light emitting chip 111, and the volumes of the light shielding member 120 and the condenser lens 130 are smaller, so that the volume of the light emitting device 100 is significantly reduced, and miniaturization of the light emitting device 100 is realized. In an alternative embodiment, the light guide 118 is arranged tapered in the light-out direction of the optical axis, that is, the light-in end is larger than the light-out end to converge and converge light rays, so that the light-out of the top surface of the light guide 118 is more concentrated, and the light-out brightness is better.

[0064] The technical features of the above-described embodiments can be combined arbitrarily. In order to make the description simple, all possible combinations of the technical features in the above-described embodiments are not described, but as long as the combinations of the technical features do not exist contradictory, they should be considered as the scope of the present application.

[0065] The above-described embodiments only express several implementation manners of the present application, and the description is more specific and detailed, but it should not be understood as a limitation on the patent application scope. It should be noted that for ordinary skilled in the art, without departing from the concept of the present application, several modifications and improvements can be made, which are within the scope of the present application. Therefore, the patent protection scope of the present application should be subject to the appended claims.

Claims

1. A light-emitting device, characterized in that, include: A light-emitting component (110) includes a light-emitting chip (111), and the light-emitting component (110) is provided with a mounting groove (112), in which the light-emitting chip (111) is disposed; A light-shielding member (120), at least a portion of which is disposed in the mounting groove (112), the light-shielding member (120) having a light-passing hole (121) corresponding to the light-emitting chip (111), the light-passing hole (121) having a light-passing opening (122) that limits the amount of light passing through, the size of the light-passing opening (122) being less than or equal to the size of the light-emitting chip (111); and A condenser lens (130) is disposed on the light-emitting component (110) or the light-shielding component (120) and is disposed corresponding to the light-passing hole (121).

2. The light-emitting device according to claim 1, characterized in that, At least a portion of the light-shielding member (120) is fitted into the mounting groove (112), with the bottom surface of the light-shielding member (120) spaced apart from the top surface of the light-emitting chip (111), so that the light-passing hole (121) is located above the light-emitting chip (111).

3. The light-emitting device according to claim 2, characterized in that, The side of the mounting groove (112) is gradually widened in the light-emitting direction of the optical axis, and the side of the light-shielding member (120) is adapted to the side of the mounting groove (112).

4. The light-emitting device according to claim 1, characterized in that, The light-shielding member (120) is located on the bottom of the mounting groove (112), and the light-emitting chip (111) is located inside the light-passing hole (121).

5. The light-emitting device according to claim 2, characterized in that, The light-emitting component (110) further includes a substrate (116) and a reflector (117). The light-emitting chip (111) is disposed on the substrate (116), and the reflector (117) has a reflective hole. The reflector (117) is disposed on the substrate (116) such that the reflective hole and the substrate (116) enclose the mounting groove (112).

6. The light-emitting device according to claim 5, characterized in that, The mounting groove (112) contains a light-emitting chip (111), and the wall of the reflective hole is in contact with the side of the light-emitting chip (111).

7. The light-emitting device according to claim 6, characterized in that, The reflector (117) is made of white resin filled with heat dissipation particles.

8. A light-emitting device, characterized in that, include: The light-emitting component (110) includes a light-emitting chip (111). A light-shielding member (120) is disposed on the light-emitting component (110) and has a light-passing hole (121) corresponding to the light-emitting chip (111). The light-passing hole (121) has a light-passing opening (122) that limits the amount of light passing through. The size of the light-passing opening (122) is less than or equal to the size of the light-emitting chip (111). as well as A condenser lens (130) is disposed on the light shield (120) and is disposed corresponding to the light-passing hole (121).

9. The light-emitting device according to claim 8, characterized in that, The light-emitting component (110) further includes a substrate (116) and a light guide (118), wherein the light-emitting chip (111) is disposed on the substrate (116) and the light guide (118) is disposed on the light-emitting chip (111); The light-shielding member (120) is disposed on the top surface of the light guide member (118).

10. The light-emitting device according to claim 9, characterized in that, The light-emitting component (110) also includes a light-transmitting adhesive layer (119), which covers the light-emitting chip (111), and the bottom surface of the light guide (118) is bonded to the top surface of the light-transmitting adhesive layer (119).

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