Laminated film for pattern formation, unexposed screen printing plate, and method for producing the same

Abstract

To provide a laminated film for pattern formation which does not absorb moisture in air, does not leave unnecessary components on the surface of a plate film, and prevents tackiness of a photosensitive resin layer.SOLUTION: The laminated film for pattern formation is composed of a support layer, a paste layer, a water-insoluble polymer layer and a photosensitive resin layer in this order, and the unexposed screen printing plate adopts the laminated film for pattern formation.SELECTED DRAWING: Figure 1

Description

[Technical Field]

[0001] The present invention relates to a laminated film for pattern formation, an unexposed screen printing plate, and methods for producing the same. [Background technology]

[0002] One method for manufacturing screen printing plates is to use a pattern-forming film. Compared to directly applying a photosensitive resin, this method is advantageous in that the photosensitive resin layer is transferred using a pattern-forming film, resulting in a smooth photosensitive resin film on the screen and reduced thickness variations within the plate. This makes it possible to produce plates with high printing accuracy, with sharp pattern edges after development and minimal unevenness in the amount of ink transferred.

[0003] When manufacturing a screen printing stencil using such a pattern-forming film, first, water, a photosensitive resin, etc. is applied to the screen, the photosensitive resin layer of the pattern-forming film is laminated, and after sufficient drying, the support layer is peeled off to transfer the photosensitive resin layer to the screen. Thereafter, the photosensitive resin layer is exposed to light through a pattern mask, and then developed with water, etc., thereby forming a predetermined pattern on the screen.

[0004] However, the surface of the photosensitive resin layer is often tacky due to its constituent components, which can make it difficult to align the pattern mask during exposure, hinder uniform adhesion with the pattern mask, or cause problems such as damage to part of the photosensitive resin layer and contamination of the pattern mask when the pattern mask is peeled off from the photosensitive resin layer after exposure.

[0005] To prevent these problems, Japanese Patent Application Laid-Open No. 58-60745 and International Publication No. 2013-080958 propose a laminated film for pattern formation in which polyvinyl alcohol or a fluorine compound is disposed as an intermediate layer between a support layer and a photosensitive resin layer.

[0006] However, since polyvinyl alcohol is a water-soluble polymer, it absorbs moisture from the air and does not seem to be sufficient to suppress the tackiness of the printing plate.

[0007] Furthermore, this intermediate layer is essentially a non-photosensitive material that is removed during development. However, due to prolonged contact with the photosensitive resin layer, some of the photosensitive components migrate to the intermediate layer, making it insoluble in the developer during exposure. As a result, the components of the intermediate layer may remain on the surface of the plate without being removed by development. This can prevent the photosensitive resin from achieving its intended performance. [Prior art documents] [Patent documents]

[0008] [Patent Document 1] Japanese Patent Application Publication No. 58-60745 [Patent Document 2] International Publication No. 2013-080958 DISCLOSURE OF THE INVENTION [Problem to be solved by the invention]

[0009] The present invention aims to prevent absorption of moisture from the air, prevent unnecessary components from remaining on the surface of the printing plate, suppress the tackiness of the photosensitive resin layer, and improve adhesion failure and workability during exposure. [Means for solving the problem]

[0010] The present invention solves the above problems by providing a laminated film for forming a predetermined pattern. Therefore, the laminated film for pattern formation according to the present invention is characterized in that it comprises a support layer, an adhesive layer, a water-insoluble polymer layer, and a photosensitive resin layer in this order.

[0011] Such a laminated film for pattern formation according to the present invention preferably includes one in which the photosensitive resin layer is a photosensitive resin that can be developed with neutral water.

[0012] Such a laminated film for pattern formation according to the present invention preferably includes those in which the interlayer adhesion strength (x) between the support layer and the adhesive layer, the interlayer adhesion strength (y) between the adhesive layer and the water-insoluble polymer layer, and the interlayer adhesion strength (z) between the water-insoluble polymer layer and the photosensitive resin layer satisfy the following relationship: Interlayer adhesion (x) > interlayer adhesion (y) Interlayer adhesion (z) > Interlayer adhesion (y)

[0013] Such a laminated film for pattern formation according to the present invention preferably includes one in which the interlayer adhesive strength (y) between the adhesive layer and the water-insoluble polymer layer is 0.001 to 1.0 N / 25 mm.

[0014] Such a laminated film for pattern formation according to the present invention preferably includes one in which the water-insoluble polymer layer has a haze value of 5.0% or less.

[0015] In such a laminated film for pattern formation according to the present invention, the water-insoluble polymer layer preferably has a thickness of 1 to 100 μm.

[0016] In such a laminated film for pattern formation according to the present invention, the photosensitive resin layer preferably comprises a photosensitive resin containing the following components (A) and (B): Component (A): Polyvinyl alcohol with a saponification degree of 50 mol% or more Component (B): Diazo resin.

[0017] In such a laminated film for pattern formation according to the present invention, the photosensitive resin layer preferably comprises a photosensitive resin containing the following components (A), (C) and (D): Component (A): Polyvinyl alcohol with a saponification degree of 50 mol% or more Component (C): an epoxy compound having at least one epoxy group Component (D): Photoacid generator.

[0018] In such a laminated film for pattern formation according to the present invention, the photosensitive resin layer preferably comprises a photosensitive resin containing the following component (E): Component (E): Polyvinyl alcohol having a saponification degree of 50 mol % or more and having a styryl-substituted pyridinium group or a styryl-substituted quinolinium group.

[0019] In such a laminated film for pattern formation according to the present invention, the photosensitive resin layer preferably comprises a photosensitive resin further comprising the following components (F) and (G). Component (F): a radical polymerizable compound having at least one ethylenically unsaturated bond Component (G): Photoradical polymerization initiator.

[0020] In such a laminated film for pattern formation according to the present invention, the photosensitive resin layer preferably comprises a photosensitive resin further containing the following component (H). Component (H): Aqueous polymer emulsion.

[0021] Such a laminate film for pattern formation according to the present invention preferably includes one in which a protective layer is further laminated on the photosensitive resin layer side of the laminate film for pattern formation described above.

[0022] The unsensitized screen printing plate of the present invention is characterized in that it comprises a laminated film obtained by removing the support layer and adhesive layer from the pattern-forming laminated film, and a screen mesh laminated on the photosensitive resin layer side of the laminated film.

[0023] The method for producing an unexposed screen printing plate according to the present invention is characterized by comprising the following steps (a) and (b): Step (a): A step of joining a screen mesh to the photosensitive resin layer side of the pattern-forming laminate film. Step (b): A step of peeling off the support layer and adhesive layer from the water-insoluble polymer layer of the laminated film for pattern formation.

[0024] The screen printing plate according to the present invention is characterized in that it is produced by forming a latent image on an unexposed screen printing plate comprising a laminate film obtained by removing the support layer and adhesive layer from the pattern-forming laminate film, and a screen mesh laminated on the photosensitive resin layer side of the laminate film, and then developing the photosensitive resin layer.

[0025] The method for producing a screen printing plate according to the present invention is characterized by comprising the following steps (a) to (f):

[0026] Step (a): A step of joining a screen mesh to the photosensitive resin layer side of the pattern-forming laminate film. Step (b): A step of peeling the support layer and adhesive layer from the water-insoluble polymer layer of the pattern-forming laminate film. Step (c): A step of placing a pattern mask on the surface of the water-insoluble polymer layer. Step (d): forming a latent image on the photosensitive resin layer Step (e): Step of peeling off the water-insoluble polymer layer Step (f): A step of developing the photosensitive resin layer on which the latent image has been formed.

[0027] The photosensitive resist base material according to the present invention is characterized by comprising the above-mentioned laminated film for pattern formation and a substrate laminated on the photosensitive resin layer side of the laminated film for pattern formation. [Effects of the Invention]

[0028] The laminated film for pattern formation according to the present invention has a water-insoluble polymer layer laminated on the surface of a photosensitive resin layer, and since the water-insoluble polymer layer has a smooth surface, it is easy to position a pattern mask on the surface of the water-insoluble polymer layer.

[0029] Furthermore, the high and uniform adhesion between the pattern mask and the water-insoluble polymer layer prevents distortion of the pattern mask, allowing the photosensitive resin layer to be exposed to light and the latent image to be formed with great accuracy.

[0030] This water-insoluble polymer layer functions as a so-called protective layer for the photosensitive resin layer, preventing the photosensitive resin layer from being affected by the surrounding environment, deteriorating components, etc. For example, it prevents the photosensitive resin layer from absorbing moisture and prevents the migration of harmful components from other layers, thereby maintaining the excellent properties inherent to the photosensitive resin for a long period of time. Therefore, with the pattern-forming laminate film according to the present invention, it is possible to obtain a screen printing plate on which a desired high-definition pattern is accurately formed.

[0031] The laminate film for pattern formation according to the present invention has a water-insoluble polymer layer on the photosensitive resin layer during exposure, which eliminates the moisture absorption and residue that were a concern with conventional water-soluble polymer layers, and can prevent contamination of the pattern mask by photosensitive resin components.

[0032] Furthermore, poor adhesion due to tackiness of the photosensitive resin layer can be prevented, alignment is easy, adhesion of foreign matter is suppressed, and any foreign matter that does adhere can be easily removed. Furthermore, since the polymer layer is provided, there is no need to worry about tackiness, and the range of design for the photosensitive material is widened. [Brief explanation of the drawings]

[0033] [Figure 1] 1 is a schematic diagram of a preferred unsensitized screen printing plate according to the present invention. [Figure 2] 1 is a schematic diagram of a preferred unsensitized screen printing plate according to the present invention. [Figure 3] 1 is a diagram showing an outline of a preferred method for producing a screen printing plate according to the present invention. DETAILED DESCRIPTION OF THE INVENTION

[0034] [Laminated film for pattern formation] The laminated film for pattern formation according to the present invention is characterized by comprising a support layer, an adhesive layer, a water-insoluble polymer layer, and a photosensitive resin layer, in this order.

[0035] The pattern-forming laminate film according to the present invention comprises a support layer, an adhesive layer, a water-insoluble polymer layer, and a photosensitive resin layer. Here, "comprises" includes not only those comprising only the listed layers (i.e., the support layer, adhesive layer, water-insoluble polymer layer, and photosensitive resin layer), but also those comprising layers or materials other than the listed layers. A typical example of such layers other than the listed layers is a protective layer.

[0036] The laminated film for pattern formation according to the present invention is applicable to, for example, various printing technical fields, particularly preferably to the screen printing field. When applying the laminated film for pattern formation according to the present invention to such printing fields, first, the interface between the adhesive layer and the water-insoluble polymer layer may be peeled off to remove the support layer and the adhesive layer, and then the water-insoluble polymer layer may be peeled off.

[0037] Therefore, particularly preferred pattern-forming laminate films of the present invention that are applicable to the screen printing field include those in which the interlayer adhesion strength (x) between the support layer and the adhesive layer, the interlayer adhesion strength (y) between the adhesive layer and the water-insoluble polymer layer, and the interlayer adhesion strength (z) between the water-insoluble polymer layer and the photosensitive resin layer satisfy the following relationships: Interlayer adhesion (x) > interlayer adhesion (y) Interlayer adhesion (z) > Interlayer adhesion (y) The interlayer adhesive strength (x) and the interlayer adhesive strength (z) may be such that (x) is greater than (z), or such that (x) is smaller than (z), or such that (x) is equal to (z).

[0038] <Support layer> In the present invention, the support layer can be made of various materials, for example, various resin materials, or natural materials.

[0039] Preferred materials include, for example, paper, release paper, polyesters such as polyethylene terephthalate, polyolefins such as polymethylpentene, polypropylene, and polyethylene, halogen-containing vinyl polymers such as polyvinyl fluoride and polyvinyl chloride, polyamides such as nylon, cellulose such as cellophane, polystyrene, acrylic resins, and polyimide films. The support layer may be transparent or opaque, and one or both sides may be subjected to a release treatment, matte treatment, or easy-adhesion treatment for the purpose of improving the functionality of the laminated film. For example, the above treatments make it easy to control the interlayer adhesive strength (x) between the support layer and the adhesive layer. The thickness of the support layer is not particularly limited, but is preferably 10 to 200 μm, and particularly preferably 30 to 125 μm.

[0040] <Glue layer> In the present invention, the adhesive layer can be made of various materials. That is, there are no particular restrictions on the adhesive material used for the adhesive layer, and various adhesive materials can be used. Preferred adhesive materials include, for example, acrylic adhesives or pressure-sensitive adhesives (one-component or two-component), rubber- or urethane-based adhesives or pressure-sensitive adhesives, silicone-based adhesives or pressure-sensitive adhesives, and vinyl acetate-based adhesives.

[0041] Furthermore, solventless types, solvent types, emulsion types, heat curing types, UV curing types, EB curing types, hot melt types, etc. can be used. The thickness of the adhesive layer is not particularly limited, but is preferably 0.5 to 30 μm, and particularly preferably 0.5 to 20 μm.

[0042] The adhesive layer can be formed by applying the above-mentioned adhesive material onto the support layer using a conventional coating method such as gravure, comma, air knife, doctor knife, bar coater, die coating method, or doctor blade method, and then drying and curing the adhesive material using a method such as heat treatment, ultraviolet irradiation treatment, or electron beam irradiation treatment.

[0043] The adhesive material used to form this adhesive layer can be selected so that the interlayer adhesive strength (y) between the adhesive layer and the water-insoluble polymer layer is preferably 0.001 to 1.0 N / 25 mm, and particularly preferably 0.005 to 0.5 N / 25 mm (relative to PET). A strength of less than 0.001 N / 25 mm is undesirable because it may result in insufficient adhesion to the water-insoluble polymer layer, causing peeling or lifting. On the other hand, a strength of more than 1.0 N / 25 mm is undesirable because it may be difficult to peel from the water-insoluble polymer layer, leave adhesive residue after peeling, or increase surface contamination. The interlayer adhesive strength (y) is measured by forming an adhesive layer on a 25 mm-wide polyethylene terephthalate film, and then laminating and pressing a polyethylene terephthalate film. The strength is expressed as the peel force at a 180° angle at a speed of 300 mm / min after 1 minute at 23°C (according to JIS-Z0237).

[0044] In the laminated film for pattern formation according to the present invention, it is preferable that the adhesive agent constituting the adhesive layer does not remain on the surface of the water-insoluble polymer layer after the support layer and the adhesive layer are peeled off from the water-insoluble polymer layer. 2 When the mass of the adhesive material is taken as 100, the content is preferably 5% or less, more preferably 1% or less, and particularly preferably 0.1% or less.

[0045] <Water-insoluble polymer layer> In the pattern-forming laminate film according to the present invention, the resin constituting the photosensitive resin layer is cured by light transmitted through the water-insoluble polymer layer. The water-insoluble polymer layer preferably has a low haze value. For example, the haze value is preferably 0.01 to 5.0%, and particularly preferably 0.05 to 3.0%. The haze value is measured according to JIS-K7136.

[0046] When the haze value is within the above preferred range, the photosensitive resin layer can be cured well even with a small amount of light irradiation, and a desired high-definition pattern can be formed in the photosensitive resin layer.

[0047] Preferred examples of the water-insoluble polymer layer include films of polyesters such as polyethylene terephthalate, polyolefins such as polymethylpentene, polypropylene, and polyethylene, halogen-containing vinyl polymers such as polyvinyl fluoride and polyvinyl chloride, polyamides such as nylon, celluloses such as cellophane, polystyrene, acrylic resins, polyimides, and polyethersulfone resins. Within the haze range, the water-insoluble polymer layer can be subjected to a release treatment or an easy-adhesion treatment on one or both sides for the purpose of improving the functionality of the laminate film. For example, the above treatment makes it easy to control the interlayer adhesive strength (y) between the adhesive layer and the water-insoluble polymer layer, and the interlayer adhesive strength (z) between the water-insoluble polymer layer and the photosensitive resin layer. Particularly preferred water-insoluble polymer layers include polyester films and polyolefin films, and the thickness is preferably 1 to 100 μm.

[0048] <Photosensitive resin layer> The photosensitive resin layer of the pattern-forming laminate film according to the present invention can be made of a resin that can form a latent image by irradiation with light and can be developed with neutral water, and is preferably one that can form a coating film using water as a solvent. Preferable examples of such a photosensitive resin layer include the following first, second and third specific examples.

[0049] <<First Photosensitive Resin Layer>> A first specific example of the photosensitive resin layer is made of a photosensitive resin containing the following components (A) and (B). Component (A): Polyvinyl alcohol with a saponification degree of 50 mol% or more Component (B): Diazo resin Here, "comprising" includes not only those containing only the listed components (i.e., component (A) and component (B)), but also those containing components other than the listed components. Representative examples of such components other than the listed components include components (F) to (H) (described in detail below).

[0050] The abundance ratio (mass %) of component (A) to component (B) is preferably 1:0.005 to 1:0.5, particularly preferably 1:0.01 to 1:0.2. The photosensitive resin containing the above components (A) and (B) can contain one or more of the components (F) to (H) as needed.

[0051] Component (A) Component (A) is polyvinyl alcohol with a saponification degree of 50 mol% or more. A saponification degree of 50 to 100 mol%, particularly 70 to 100%, is preferred, and copolymers with other vinyl monomers are also acceptable as long as water solubility is not impaired. The average polymerization degree is preferably 200 to 5,000, particularly 300 to 4,000. Two or more types of polyvinyl alcohol with different saponification degrees and polymerization degrees can also be mixed. Modified products, such as cation-modified and anion-modified products, can also be used.

[0052] Ingredient (B) Component (B) is a diazo resin. Specific examples include diazo resins of a condensate of p-diazodiphenylamine or 3-methoxy-4-diazodiphenylamine with 4,4'-bismethoxymethyldiphenyl ether, and sulfate, phosphate, and zinc chloride double salt anion complexes thereof, and diazo resins of a condensate of p-diazodiphenylamine or 3-methoxy-4-diazodiphenylamine with paraformaldehyde, sulfate, phosphate, and zinc chloride double salt anion complexes. As this type of diazo resin, in addition to paraaminodiphenylamine, water-soluble diazo resins obtained by condensing diazotized diphenylamines such as 4-amino-4'-methyldiphenylamine, 4-amino-4'-ethyldiphenylamine, 4-amino-4'-methoxydiphenylamine, 4-amino-4'-chlorodiphenylamine, and 4-amino-4'-nitrodiphenylamine with aldehydes such as paraformaldehyde, acetaldehyde, propionaldehyde, and n-butylaldehyde can be used.

[0053] Among these, a condensate of p-diazodiphenylamine and paraformaldehyde, a condensate of 3-methoxy-4-diazodiphenylamine and paraformaldehyde, a condensate of p-diazodiphenylamine and 4,4'-bismethoxymethyldiphenyl ether, and a condensate of 3-methoxy-4-diazodiphenylamine and 4,4'-bismethoxymethyldiphenyl ether are particularly preferred. The above component (B) can be used alone or in combination of two or more.

[0054] Ingredient (F) Component (F) is a radically polymerizable compound having at least one ethylenically unsaturated bond, and examples thereof include the monomers and oligomers described in "Photocuring Technology Data Book" (Technonet Co., Ltd., 2000).

[0055] Specific examples of the monofunctional monomer include 2-ethylhexyl (meth)acrylate, isodecyl (meth)acrylate, 2-hydroxyethyl (meth)acrylate, 2-hydroxypropyl (meth)acrylate, 2-hydroxybutyl (meth)acrylate, 2-ethoxyethyl (meth)acrylate, 2(2-ethoxyethoxy)ethyl (meth)acrylate, n-butoxyethyl (meth)acrylate, morpholinoethyl (meth)acrylate, benzyl (meth)acrylate, phenyl (meth)acrylate, methoxydiethylene glycol (meth)acrylate, methoxytriethylene(propylene)glycol (meth)acrylate, methoxytetraethylene(propylene)acrylate, glycol (meth)acrylate, methoxypolyethylene(propylene)ylene glycol (meth)acrylate, ethoxydiethylene(propylene)ylene glycol (meth)acrylate, ethoxytriethylene(propylene)ylene glycol (meth)acrylate, cyclohexyl (meth)acrylate, tetrahydrofuryl (meth)acrylate, isobornyl (meth)acrylate, dicyclopentanyl (meth)acrylate, N,N-dimethylaminoethyl (meth)acrylate, N,N-diethylaminoethyl (meth)acrylate, oxide-modified phosphate (meth)acrylate, ω-carboxy-polycaprolactone monoacrylate, and monohydroxyethyl phthalate acrylate. In this specification, "(meth)acrylate" means both "methacrylate" and "acrylate", and "ethylene(propylene)" means both "ethylene" and "propylene".

[0056] Specific examples of polyfunctional monomers having two or more ethylenically unsaturated bonds include ethylene glycol di(meth)acrylate, diethylene glycol di(meth)acrylate, 1,3-trimethylene glycol di(meth)acrylate, 1,4-butanediol di(meth)acrylate, 1,6-hexanediol di(meth)acrylate, ethylene(propylene)oxide-modified bisphenol A diacrylate, neopentyl glycol di(meth)acrylate, bis(acryloxyneopentyl glycol) adipate, bis(methacryloxyneopentyl glycol) adipate, epichlorohydrin-modified 1,6-Hexanediol di(meth)acrylate, hydroxypivalic acid neopentyl glycol di(meth)acrylate, caprolactone-modified hydroxypivalic acid neopentyl glycol di(meth)acrylate, polyethylene glycol di(meth)acrylate, propylene glycol di(meth)acrylate, dipropylene glycol di(meth)acrylate, tripropylene glycol di(meth)acrylate, tetrapropylene glycol di(meth)acrylate, polypropylene glycol di(meth)acrylate, trimethylolpropane tri(meth)acrylate, ditrimethylolpropane tri(meth)acrylate, neopentyl glycol-modified trimethylolpropane di(meth)acrylate, ethylene(propylene)oxide-modified trimethylolpropane tri(meth)acrylate, hydroxypropyl acrylate-modified trimethylolpropane tri(meth)acrylate, pentaerythritol tri(meth)acrylate Acrylate, pentaerythritol tetra(meth)acrylate, pentaerythritol polypropoxyacrylate, stearic acid-modified pentaerythritol di(meth)acrylate, dipentaerythritol hexa(meth)acrylate, dipentaerythritol monohydroxypenta(meth)acrylate, alkyl-modified dipentaerythritol poly(meth)acrylate, caprolactone-modified dipentaerythritol poly(meth)acrylate, glycerin di(meth)acrylate, epichlorohydrin-modified glycerol tri(meth)acrylate, oxide-modified glycerol tri(meth)acrylate, tris(acryloxyethyl)isocyanurate, tris(methacryloxyethyl)isocyanurate, caprolactone-modified tris(acryloxyethyl)isocyanurate, caprolactone-modified tris(methacryloxyethyl)isocyanurate, oxide-modified bisphenol (meth)acrylate, etc.

[0057] Examples of oligomers that can be used include polyester (meth)acrylate oligomers, bisphenol A-type epoxy (meth)acrylates, caprolactone-added (meth)acrylates, phenol novolac-type epoxy (meth)acrylates, cresol novolac-type epoxy (meth)acrylates, and other epoxy (meth)acrylates, and urethane (meth)acrylates. Furthermore, polyester dendrimers containing ethylenically unsaturated bonds can be used. Specific examples of such polyester dendrimers containing ethylenically unsaturated bonds are described in, for example, JP-A Nos. 2005-76005, 2005-47979, and 2005-76005.

[0058] The above component (F) can be used alone or in combination of two or more. The amount (mass %) of component (F) present is preferably 1.0 to 800 mass %, particularly preferably 10 to 600 mass %, when the total of components (A) and (B) is taken as 100 mass %.

[0059] Ingredients (G) Component (G) is a photopolymerization initiator, and is not particularly limited. Examples include benzophenones such as benzophenone and bis-N,N-dimethylaminobenzophenone, and thioxanthones such as thioxanthone and isopropylthioxanthone.

[0060] In addition, oil-soluble photoradical polymerization initiators include benzoin and benzoin alkyl ethers such as benzoin, benzoin methyl ether, benzoin ethyl ether, and benzoin isopropyl ether; acetophenones such as acetophenone, 2,2-dimethoxy-2-phenylacetophenone, 2,2-diethoxy-2-phenylacetophenone, 1,1-dichloroacetophenone, 2-hydroxy-2-methyl-1-phenylpropan-1-one, 1-(4-isopropylphenyl)-2-hydroxy-2-methylpropan-1-one, 1-(4-dodecylphenyl)-2-hydroxy-2-methylpropan-1-one, 4-(2-hydroxyethoxy)-phenyl(2-hydroxy-2-propyl)ketone, and 1-hydroxycyclohexylphenyl ketone; and 2-methyl-1-[4-(methylthio)phenyl]-2 anthraquinones such as 2-methylanthraquinone, 2-ethylanthraquinone, 2-tert-butylanthraquinone, and 1-chloroanthraquinone; thioxanthones such as 2,4-dimethylthioxanthone, 2,4-diethylthioxanthone, 2-chlorothioxanthone, isopropylthioxanthone, and 2,4-diisopropylthioxanthone; ketals such as acetophenone dimethyl ketal and benzyl dimethyl ketal; benzophenones such as benzophenone, or xanthones, which can be used alone or in combination of two or more. Also, known sensitizers such as tertiary amines can be used alone or in combination of two or more. The amount (% by mass) of component (G) is preferably 0.1 to 20% by mass, particularly preferably 0.5 to 10% by mass, relative to the amount of component (F).

[0061] Ingredients (H) Component (H) is an aqueous polymer emulsion, such as polyvinyl acetate, vinyl acetate / ethylene copolymer, vinyl acetate / acrylic ester copolymer, (meth)acrylic acid polymer, styrene / butadiene copolymer, methyl methacrylate / butadiene copolymer, acrylonitrile / butadiene copolymer, chloroprene polymer, isoprene polymer, polyvinyl chloride, polyvinylidene chloride, polystyrene, silicone resin, polyethylene, polyurethane, fluororesin, etc. These hydrophobic polymer particles are obtained during the polymerization process, and examples thereof include polyvinyl acetate emulsion, ethylene-vinyl acetate copolymer emulsion, vinyl acetate-acrylic copolymer emulsion, ethylene-vinyl acetate-acrylic terpolymer emulsion, vinyl chloride-vinyl acetate copolymer emulsion, acrylic emulsion, styrene-butadiene latex emulsion, MBR latex emulsion, acrylonitrile-butadiene rubber latex emulsion, chloroprene rubber latex emulsion, and vinylidene chloride emulsion. Furthermore, aqueous emulsions of polymers having a crosslinked structure, prepared by emulsion polymerization of an aqueous emulsion prepared from a polyfunctional (meth)acrylate using a thermal polymerization initiator or a photopolymerization initiator, can also be suitably used. Useful synthetic polymer dispersions include polyethylene dispersions, polyolefin ionomer dispersions, and urethane ionomer dispersions. The abundance ratio (mass %) of component (H) is preferably 1 to 1500 mass %, particularly preferably 10 to 1000 mass %, when the total of components (A) and (B) is taken as 100 mass %.

[0062] Other ingredients Other components that may be added to the first photosensitive resin layer, as needed, include a crosslinking agent, organic or inorganic particles, a silane coupling agent, a pigment, a dye, a thermal polymerization inhibitor, a surfactant, a defoaming agent, an antioxidant, an adhesion promoter, a plasticizer, a solvent, a surface tension modifier, a stabilizer, a chain transfer inhibitor, a flame retardant, an antibacterial agent, and a preservative.

[0063] <<Second Photosensitive Resin Layer>> A second specific example of the photosensitive resin layer is made of a photosensitive resin containing the following components (A), (C), and (D). Component (A): Polyvinyl alcohol with a saponification degree of 50 mol% or more Component (C): an epoxy compound having at least one epoxy group Component (D): Photoacid generator

[0064] Here, "comprising" includes not only those containing only the listed components (i.e., components (A), (C), and (D)), but also those containing components other than the listed components. Representative examples of such layers other than the listed layers include components (F) to (H).

[0065] The ratio (mass%) of component (A) to component (C) is preferably 1:1 to 1:10, particularly preferably 1:2 to 1:6. The amount (mass%) of component (D) is preferably 1 to 20 mass%, particularly preferably 3 to 10 mass%, relative to the amount of component (C). The photosensitive resin containing the above components (A), (C) and (D) may contain one or more of the components (F) to (H) as needed.

[0066] Component (A) As the component (A) in the second specific example, those exemplified as the component (A) in the first specific example of the photosensitive resin can be used.

[0067] Ingredients (C) Component (C) is a compound having at least one epoxy group. Examples of difunctional or higher functional glycidyl epoxy compounds include ethylene glycol diglycidyl ether, diethylene glycol diglycidyl ether, polyethylene glycol diglycidyl ether, propylene glycol diglycidyl ether, tripropylene glycol diglycidyl ether, polypropylene glycol diglycidyl ether, resorcinol diglycidyl ether, neopentyl glycol diglycidyl ether, 1,6-hexanediol diglycidyl ether, glycerin diglycidyl ether, dibromoneopentyl glycol diglycidyl ether, hydrogenated bisphenol A diglycidyl ether, terephthalic acid diglycidyl ester, phthalic acid diglycidyl ester, hydrogenated phthalic acid diglycidyl ester, bisphenol A PO 2mol adduct diglycidyl ether, sorbitol polyglycidyl ether, glycerol polyglycidyl ether, diglycerol polyglycidyl ether, polyglycerol polyglycidyl ether, trimethylolpropane polyglycidyl ether, and pentaerythritol polyglycidyl ether. Further, examples of alicyclic epoxy compounds include 3,4-epoxycyclohexylmethyl-3',4'-epoxycyclohexanecarboxylate, an adduct of 3,4-epoxycyclohexylmethyl-3',4'-epoxycyclohexanecarboxylate and ε-caprolactone, 1,2,8,9-diepoxylimonene, (3,3'4,4'-diepoxy)bicyclohexyl, 1,2-epoxy-4-vinylcyclohexane), 1,2-epoxy-4-(2-oxiranyl)cyclohexane adduct of 2,2-bis(hydroxymethyl)-1-butanol, butanetetracarboxylic acid tetra(3,4-epoxycyclohexylmethyl) modified ε-caprolactone, and 3,4-epoxycyclohexylmethyl methacrylate.

[0068] Examples of monofunctional epoxy compounds include 2-ethylhexyl glycidyl ether, phenyl glycidyl ether, phenol (EO)5 glycidyl ether, p-tert-butylphenyl glycidyl ether, dibromophenyl glycidyl ether, lauryl alcohol (EO)15 glycidyl ether, Cl2 and Cl3 mixed alcohol glycidyl ether, and N-glycidyl phthalimide. Using these as reactive diluents allows for the production of high-viscosity or solid epoxy resins. Examples include phenol novolac epoxy resins, cresol novolac epoxy resins, trishydroxyphenylmethane epoxy resins, dicyclopentadiene phenol epoxy resins, bisphenol-A epoxy resins, bisphenol-F epoxy resins, biphenol epoxy resins, bisphenol-A novolac epoxy resins, naphthalene-containing epoxy resins, heterocyclic epoxy resins, epoxidized polybutadiene, epoxidized styrene-butadiene block copolymers, brominated epoxy resins, biphenyl epoxy resins, and amine epoxy resins. Furthermore, a compound having at least one oxetane group can be used in combination with the above epoxy compound.

[0069] Examples of the oxetane compound include the compounds described in JV Crivello and H. Sasaki, JMS Pure Appl. Chem., A30(2&3), 189 (1993) or JH Sasaki and V. Crivello, JMS Pure Appl. Chem., A30(2&3), 915 (1993). For example, monofunctional oxetane compounds such as 3-ethyl-3-hydroxymethyloxetane (oxetane alcohol), 2-ethylhexyloxetane, (3-ethyloxetan-3-yl)methyl methacrylate, (3-ethyloxetan-3-yl)methyl acrylate, and 3-ethyl-3-(4-hydroxybutyloxymethyl)oxetane; bifunctional oxetane compounds such as xylylene bisoxetane, 3-ethyl-3{[(3-ethyloxetan-3-yl)methoxy]methyl}oxetane, 4,4'-bis[(3-ethyl-3-oxetanyl)methoxymethyl]biphenyl), and bis[(3-ethyl-3-oxetanyl)methyl]isophthalate; and pentaerythritol tris(3-ethyl-3-oxetanylmethyl) ) ether, pentaerythritol tetrakis(3-ethyl-3-oxetanylmethyl) ether, dipentaerythritol hexa(3-ethyl-3-oxetanylmethyl) ether, dipentaerythritol pentakis(3-ethyl-3-oxetanylmethyl) ether, dipentaerythritol tetrakis(3-ethyl-3-oxetanylmethyl) ether, caprolactone-modified dipentaerythritol hexa(3-ethyl-3-oxetanylmethyl) ether, caprolactone-modified dipentaerythritol pentakis(3-ethyl-3-oxetanylmethyl) ether, and ditrimethylolpropane tetrakis(3-ethyl-3-oxetanylmethyl) ether. The above component (C) can be used alone or in combination of two or more.

[0070] Ingredients (D) Component (D) is an acid generator, and compounds used in chemically amplified photoresists and photocationic polymerization are used (see "Imaging Organic Materials," edited by the Organic Electronics Materials Research Group, Bunshin Publishing (1993), pp. 187-192). Specific examples of acid generators include onium cation compounds, halogen-containing compounds that generate hydrohalic acid, and sulfonated compounds that generate sulfonic acid.

[0071] As the ionic acid generator, for example, Cl of onium cations such as diazonium, ammonium, iodonium, sulfonium, phosphonium, and ferrocenium is used. - , Br - , I - , ZnCl3 - , HSO3 - , BF4 - , PF6 - , AsF6 - , SbF6 - , CH3SO3 - , CF3SO3 - , perfluorobutanesulfonate, perfluorooctane sulfonate, camphorsulfonate, benzenesulfonate, p-toluenesulfonate, 9,10-dimethoxyanthracene-2-sulfonate, cyclohexylaminosulfonate, (C6F5)4B - , (C4H9)4B - Examples of salts include:

[0072] Specific examples of the onium cation include phenyldiazonium, p-methoxydiazonium, α-naphthyldiazonium, biphenyldiazonium, diphenylamine-4-diazonium, 3-methoxydiphenylamine-4-diazonium, 2,5-diethoxy-4-methoxybenzoylamidophenyldiazonium, 2,5-dipropoxy-4-(4-tolyl)thiophenyldiazonium, 4-methoxydiphenylamine-4-diazonium, a condensate of 4-diazodiphenylamine and formaldehyde, 1-methoxyquinolinium, 1-ethoxyisoquinolinium, 1-phenacylpyridinium, 1-benzyl-4-benzoylpyridinium, 1-benzylquinolinium, and N-substituted benzothiazolium (see JP-A-5-140143).

[0073] Further, benzyltriphenylsulfonium, p-methoxyphenyldiphenylsulfonium, bis(p-methoxyphenyl)phenylsulfonium, tris(p-methoxyphenyl)sulfonium, p-phenylthiophenyldiphenylsulfonium, benzyltetramethylenesulfonium, phenacyltetramethylenesulfonium, phenacyldimethylsulfonium, p-methoxyphenyldiethylsulfonium, naphthyldialkylsulfonium (see JP-A-9-118663 and JP-A-5-140209), (2-naphthylcarbonylmethyl)tetramethylenesulfonium, (p-hydroxyphenyl)dimethylsulfonium, sulfonium, (4-hydroxynaphthyl)-dimethylsulfonium, (4,7-dihydroxynaphthyl)-1-dimethylsulfonium, (4,8-dihydroxynaphthyl)-1-dimethylsulfonium, diphenyliodonium, phenyl(4-methoxyphenyl)iodonium, phenyl{4-(tert-butyl)phenyl}iodonium, 4-bis{4-(tert-butyl)phenyl}iodonium, bis(4-dodecylphenyl)iodonium, (4-methoxyphenyl)(4-octyloxyphenyl)iodonium, phenacyltriphenylphosphonium, cyanomethyltriphenylphosphonium, and the like.

[0074] Acid generators that generate hydrohalic acid include 1-methyl-3,5-bis(trichloromethyl)-s-triazine, 1-phenyl-3,5-bis(trichloromethyl)-s-triazine, 1-(4-chlorophenyl)-3,5-bis(trichloromethyl)-s-triazine, 1-(4-methoxyphenyl)-3,5-bis(trichloromethyl)-s-triazine, 1-(4-butoxyphenyl)-3,5-bis(trichloromethyl)-s-triazine, and 1-(3,4-methylenedioxyphenyl)-3,5-bis(trichloromethyl)-s-triazine. )-3,5-bis(trichloromethyl)-s-triazine, 1-(3,4-dimethoxyphenyl)-3,5-bis(trichloromethyl)-s-triazine, 1-(4-methoxynaphthyl-1)-3,5-bis(trichloromethyl)-s-triazine, 1-{2-(4-methoxyphenyl)ethenyl}-3,5-bis(trichloromethyl)-s-triazine, 1-{2-(2-methoxyphenyl)ethenyl}-3,5-bis(trichloromethyl)-s-triazine, 1-{2-(3,4-dimethoxyphenyl)ethenyl}-3,5-bis(trichloromethyl)-s-triazine 1-{2-(3-chloro-4-methoxyphenyl)ethenyl}-3,5-bis(trichloromethyl)-s-triazine, 1-(biphenyl-1)-3,5-bis(trichloromethyl)-s-triazine, 1-(4-hydroxybiphenyl-1)-3,5-bis(trichloromethyl)-s-triazine, 1-(4-methoxybiphenyl-1)-3,5-bis(trichloromethyl)-s-triazine, 1-(4-methylbiphenyl)ethenyl Examples of suitable bromine-containing ...

[0075] Acid generators that generate sulfonic acid include 2-nitrobenzyl p-toluenesulfonate, 2,6-dinitrobenzyl p-toluenesulfonate, 1-(p-toluenesulfonyloxyimino)-1-phenylethanenitrile, 1-(p-toluenesulfonyloxyimino)-1-phenylethanenitrile, benzoin p-toluenesulfonate, 2-p-toluenesulfonyloxy-2-benzoylpropane, p-nitrobenzyl 9,10-dimethoxyanthracene-2-sulfonate, N-trifluoromethanesulfonyloxydiphenylmaleimide, N-p-toluenesulfonyloxysuccinimide, N-camphorsulfonyloxysuccinimide, N-trifluoromethanesulfonyloxysuccinimide, N-perfluorobutanesulfonyloxysuccinimide, Examples thereof include N-toluenesulfonyloxysuccinimide, N-p-toluenesulfonyloxyphthalimide, N-camphorsulfonyloxyphthalimide, N-trifluoromethanesulfonyloxyphthalimide, N-perfluorobutanesulfonyloxyphthalimide, N-p-toluenesulfonyloxy-1,8-naphthalenecarboximide, N-camphorsulfonyloxy-1,8-naphthalenecarboximide, N-trifluoromethanesulfonyloxy-1,8-naphthalenecarboximide, N-perfluorobutanesulfonyloxy-1,8-naphthalenecarboximide, 1,2,3-tris(p-toluenesulfonyloxy)benzene, bis(phenylsulfone), and bis(phenylsulfonyl)methane.

[0076] A sensitizer can be used in combination with the acid generator, and the sensitizer used is preferably an electron-donating compound. Sensitizers with such properties include, but are not limited to, aromatic polycyclic compounds, porphyrin compounds, phthalocyanine compounds, polymethine dye compounds, merocyanine compounds, coumarin compounds, thiopyrylium compounds, pyrylium compounds, p-dialkylaminostyryl compounds, and thioxanthene compounds. Many of these are listed in "Dye Handbook" edited by Okawa, Hirashima, Matsuoka, and Kitao (Kodansha), "Color Materials Engineering Handbook" edited by the Japan Color Materials Association (Asakura Shoten, 1989), and "Dye Catalogue" published by the Hayashibara Biochemical Research Institute's Photosensitive Dye Research Institute.

[0077] Ingredient (F) As the component (F) in the second specific example, those exemplified as the component (F) in the first specific example of the photosensitive resin can be used. The abundance ratio (mass %) of component (F) is preferably 1 to 60 mass %, particularly preferably 5 to 30 mass %, when the total of the above components (A), (C), and (D) is taken as 100 mass %.

[0078] Ingredients (G) As the component (G) in the second specific example, those exemplified as the component (G) in the first specific example of the photosensitive resin can be used. The abundance ratio (% by mass) of component (G) is preferably 0 to 20% by mass, particularly preferably 0.1 to 10% by mass, relative to the above component (F).

[0079] Ingredients (H) As the component (H) in the second specific example, those exemplified as the component (H) in the first specific example of the photosensitive resin can be used. The abundance ratio (mass %) of component (H) is preferably 0.5 to 200 mass %, particularly preferably 1 to 100 mass %, when the total of the above components (A), (C), and (D) is taken as 100 mass %.

[0080] Other ingredients The second photosensitive resin layer may contain other components, such as a crosslinking agent, organic or inorganic particles, a silane coupling agent, a pigment, a dye, a thermal polymerization inhibitor, a surfactant, a defoaming agent, an antioxidant, an adhesion imparting agent, a plasticizer, a solvent, a surface tension modifier, a stabilizer, a chain transfer inhibitor, a flame retardant, an antibacterial agent, and a preservative, as needed.

[0081] <<Third Photosensitive Resin Layer>> A third specific example of the photosensitive resin layer is one made of a photosensitive resin containing the following component (E). Component (E): Polyvinyl alcohol having a saponification degree of 50 mol% or more and having a styryl-substituted pyridinium group or a styryl-substituted quinolinium group The photosensitive resin containing the above component (E) can contain one or more of the components (F) to (H) as needed.

[0082] Ingredient (E) Component (E) is a saponified vinyl acetate polymer having a styryl-substituted pyridinium group or a styryl-substituted quinolinium group and a degree of saponification of 50 mol % or more, which itself has photocrosslinkability. Specific preferred examples include compounds represented by the following general formula (1) or (2): [ka]

[0083] (In the formula, R 1 represents a hydrogen atom, an alkyl group, or an aralkyl group, which may be substituted with a hydroxy group or a carbamoyl group, and the carbon-carbon bond between them may be via an oxygen atom or an unsaturated bond. 2 represents a hydrogen atom or an alkyl group having 1 to 3 carbon atoms. m is an integer of 1 to 6. n is 0 or 1. X -represents a halogen ion, a phosphate ion, a methosulfate ion, a sulfonate ion, a radical polymerizable monomer having an anion dissociation ability, or a mixture of these anions. R 1 The alkyl group or aralkyl group preferably has 1 to 10 carbon atoms, and more preferably has 1 to 7 carbon atoms. 1 Examples of m include methyl, ethyl, propyl, butyl, pentyl, hexyl, 2-hydroxyethyl, 3-hydroxypropyl, 2-methoxyethyl, 3-methoxypropyl, allyl, crotyl, and benzyl. If m exceeds the range of 1 to 6, the film after photoinsolubilization tends to swell, so a value of 1 to 4 is more preferable. n may be either 0 or 1.

[0084] X - The ions are phosphate ions, methosulfate ions, and halogen ions such as Cl. - or Br - , as sulfonate ion, CH3SO3 - , CH3CH2SO3 - , C6H5SO3 - , p‐CH3C6H4SO3 - Also, X -Examples of radical polymerizable monomers include those having at least one ethylenically unsaturated bond as a radical polymerizable group and having anion dissociation ability. Examples of residues having anion dissociation ability include sulfonic acid, carboxylic acid, and phosphoric acid, which are used as radical monomers having an anion group by converting them into alkali salts or ammonium salts of aliphatic amines. Examples of radical polymerizable unsaturated groups in the monomers used for this purpose include (meth)acryloyl groups (hereinafter, (meth)acryloyl refers to both acryloyl and methacryloyl), maleic acid monoester groups, styryl groups, and allyl groups. Examples of undissociated acid type monomers include acrylic acid, methacrylic acid, maleic acid monomethyl ester, maleic acid monoethyl ester, phthalic acid 2-(meth)acryloyloxyethyl ester, phthalic acid 3-(meth)acryloyloxy-2-propyl ester, phthalic acid 3-(meth)acryloyloxy-2-propyl ester, cyclohexane-3-ene-1,2-dicarboxylic acid 2-(meth)acryloyloxyethyl ester, succinic acid 2-(meth)acryloyloxyethyl ester, cyclohexane-1,2-carboxylic acid 2-(meth)acryloyloxyethyl ester, maleic acid 2-(meth)acryloyloxyethyl ester, Examples of the acrylic acid 2-(meth)acryloyloxyethyl ester, ω-carboxy-polycaprolactone monoacrylate, acrylic acid dimer, 2-(meth)acryloyloxyethyl phosphate, 3-(meth)acryloyloxypropyl phosphate, 2-(meth)acryloyloxy-3-propyl phosphate, ω-(meth)acryloylpolyethyleneoxyethylene phosphate, ω-(meth)acryloylpolypropyleneoxyethylene phosphate, styrene sulfonic acid, N-(2-sulfoethyl)acrylamide, N-(2-sulfoethyl)methacrylamide, and the like can be mentioned, but are not limited to these.

[0085] Ingredient (F) As the component (F) in the third specific example, those exemplified as the component (F) in the first specific example of the photosensitive resin can be used. The abundance ratio (% by mass) of the component (F) is preferably 1.0 to 800% by mass, and particularly preferably 10 to 600% by mass, when the component (E) is taken as 100% by mass.

[0086] Ingredients (G) As the component (G) in the third specific example, those exemplified as the component (E) in the first specific example of the photosensitive resin can be used. The abundance ratio (% by mass) of the component (G) is preferably 0.1 to 20% by mass, and particularly preferably 0.5 to 10% by mass, when the component (F) is taken as 100% by mass.

[0087] Ingredients (H) As the component (H) in the third specific example, those exemplified as the component (H) in the first specific example of the photosensitive resin can be used. The abundance ratio (mass %) of component (H) is preferably 1 to 1500 mass %, particularly preferably 10 to 1000 mass %, when the above component (E) is taken as 100 mass %.

[0088] Other ingredients The third photosensitive resin layer may contain other components, such as a crosslinking agent, organic or inorganic particles, a silane coupling agent, a pigment, a dye, a thermal polymerization inhibitor, a surfactant, a defoaming agent, an antioxidant, an adhesion imparting agent, a plasticizer, a solvent, a surface tension modifier, a stabilizer, a chain transfer inhibitor, a flame retardant, an antibacterial agent, and a preservative, as needed.

[0089] <Protective layer> The laminated film for pattern formation according to the present invention may contain layers other than the support layer, adhesive layer, water-insoluble polymer layer, and photosensitive resin layer. A typical example of such layers is a protective layer.

[0090] This protective layer mainly functions to protect the laminate film for pattern formation according to the present invention, and for example, when this protective layer is disposed on the surface of the photosensitive resin layer, it can prevent the photosensitive resin layer from being damaged by external impact, pressure, etc., and can prevent deterioration due to moisture, gas, light, etc. Furthermore, it makes it easy to store the laminate film for pattern formation according to the present invention by stacking it or rolling it up into a roll.

[0091] In the present invention, the protective layer can be made of various materials, for example, various resin materials, or natural materials. There is no specific limitation on the material of the protective layer, and for example, the same material as that of the support layer can be used. There is no particular limitation on the thickness of the protective layer, but it is preferably 1 to 50 μm.

[0092] When the laminate film for pattern formation according to the present invention, in which a protective layer is disposed on the surface of a photosensitive agent layer, is applied to, for example, a screen printing plate, the protective layer is peeled off before the other layers constituting the laminate film for pattern formation according to the present invention. Therefore, it is preferable that the interlayer adhesive strength between the protective layer and the photosensitive agent layer is lower than the other interlayer adhesive strengths (x) to (z) (i.e., lower than the interlayer adhesive strength (y)). Therefore, the laminate film may be subjected to a release treatment on one or both sides.

[0093] The laminated film may be transparent or opaque. Examples of the laminated film include paper, release paper, polyesters such as polyethylene terephthalate, polyolefins such as polymethylpentene, polypropylene, and polyethylene, halogen-containing vinyl polymers such as polyvinyl fluoride and polyvinyl chloride, polyamides such as nylon, celluloses such as cellophane, polystyrene, acrylic resins, and polyimides. Furthermore, one or both surfaces of the laminated film may be subjected to a release treatment, a matte treatment, or an easy-adhesion treatment, as long as the function of the laminated film is not lost.

[0094] <Unexposed screen printing plate (first unexposed screen printing plate)> The first unsensitized screen printing plate according to the present invention is characterized by comprising the above-mentioned pattern-forming laminate film and a screen mesh laminated on the photosensitive resin layer side of the pattern-forming laminate film.

[0095] Figure 1 shows a preferred example of a first unsensitized screen printing plate 8 according to the present invention. The preferred unsensitized screen printing plate 8 according to the present invention shown in Figure 1 comprises a laminated film for pattern formation 1 (specifically, a laminated film for pattern formation 1 comprising a support layer 2, an adhesive layer 3, a water-insoluble polymer layer 4, and a photosensitive resin layer 5, in this order), and a screen mesh 6 laminated on the photosensitive resin layer 5 side of the laminated film for pattern formation 1. Here, the screen mesh 6 is attached to a frame material 7, similar to a typical screen printing plate.

[0096] <Method for manufacturing an unexposed screen printing plate (first unexposed screen printing plate)> The method for producing an unsensitized screen printing plate (first unsensitized screen printing plate) according to the present invention is characterized by comprising the following step (a): Step (a): A step of joining a screen mesh to the photosensitive resin layer side of the pattern-forming laminate film. According to this method for producing a screen printing plate, for example, an unexposed screen printing plate 8 shown in FIG. 1 can be produced.

[0097] In step (i), when the screen mesh 6 is bonded to the photosensitive resin layer 5 side of the pattern-forming laminate film 1, preferred methods include, for example, (1) a method in which a photosensitive material (preferably a photosensitive material identical to or similar to the photosensitive resin forming the photosensitive resin layer 5) or water is applied to the screen mesh 6 in advance, and the photosensitive resin layer 5 of the pattern-forming laminate film 1 is then bonded thereto; or (2) a method in which the photosensitive resin layer 5 of the pattern-forming laminate film 1 is superimposed on the screen mesh 6, and then a photosensitive material identical to or similar to the photosensitive resin forming the photosensitive resin layer or water is applied to the superimposed portion.

[0098] <Unexposed screen printing plate (second unexposed screen printing plate)> Another preferred embodiment of the second unsensitized screen printing plate according to the present invention (second unsensitized screen printing plate) is characterized in that it comprises a laminate film obtained by removing the support layer and adhesive layer from the pattern-forming laminate film, and a screen mesh laminated on the photosensitive resin layer side of the laminate film.

[0099] FIG. 2 shows a preferred embodiment of a second unsensitized screen printing plate 9 according to the present invention. A preferred unsensitized screen printing plate 9 according to the present invention shown in Figure 2 comprises a laminate film 1' obtained by removing the support layer 2 and adhesive layer 3 from the pattern-forming laminate film 1 in the unsensitized screen printing plate 8 shown in Figure 1, and a screen mesh 6 laminated on the photosensitive resin layer 5 side of the laminate film 1'.

[0100] <Method for manufacturing an unexposed screen printing plate (second unexposed screen printing plate)> The method for producing an unsensitized screen printing plate (second unsensitized screen printing plate) according to the present invention is characterized by comprising the following steps (a) and (b): Step (a): A step of joining a screen mesh to the photosensitive resin layer side of the pattern-forming laminate film. Step (b): A step of peeling the support layer and adhesive layer from the water-insoluble polymer layer of the pattern-forming laminate film. FIG. 2 shows a preferred example of an unexposed screen printing plate 9 obtained by such a manufacturing method.

[0101] <Screen printing plate manufacturing method> The method for producing a screen printing plate according to the present invention is characterized by comprising the following steps (a) to (f). Step (a): A step of joining a screen mesh to the photosensitive resin layer side of the pattern-forming laminate film. Step (b): A step of peeling the support layer and adhesive layer from the water-insoluble polymer layer of the pattern-forming laminate film. Step (c): A step of placing a pattern mask on the surface of the water-insoluble polymer layer. Step (d): forming a latent image on the photosensitive resin layer Step (e): Step of peeling off the water-insoluble polymer layer Step (f): A step of developing the photosensitive resin layer on which the latent image has been formed.

[0102] FIG. 3 is a diagram showing an outline of a method for producing a screen printing plate according to the present invention, FIG. 3A shows an outline of step (a) of joining a screen mesh 6 to the photosensitive resin layer 5 side of the pattern-forming laminate film 1, FIG. 3B shows an outline of step (ii) of peeling the support layer 2 and adhesive layer 3 from the water-insoluble polymer layer 4 of the pattern-forming laminate film 1. FIG. 3C shows an outline of step (iii) of disposing a pattern mask 10 on the surface of the water-insoluble polymer layer 4. FIG. 3D shows an outline of step (iv) of irradiating the photosensitive resin layer 5 with energy rays from the surface of the pattern mask 10 to form a latent image α in the photosensitive resin; FIG. 3E shows an outline of the step (e) of peeling off the water-insoluble polymer layer 4. 3F shows an outline of a screen printing plate 11 obtained by carrying out step (f) of developing the photosensitive resin layer 5 on which the latent image α has been formed. In this step (f), a development process is carried out in which the photosensitive resin layer 5 on which the latent image α has been formed is washed with water (e.g., neutral water) to remove uncured areas of the photosensitive resin layer 5 (i.e., areas on which the latent image α has not been formed). Thereafter, the developed product is dried to obtain a screen printing plate 11 having a predetermined opening pattern.

[0103] The pattern-forming laminate film 1 according to the present invention has a water-insoluble polymer layer 3, and a pattern mask 10 is placed on the surface of this water-insoluble polymer layer 3. Thereafter, energy rays are irradiated and a latent image α is formed through this pattern mask 10. This water-insoluble polymer layer 3 prevents the photosensitive resin layer from absorbing moisture or becoming tacky due to migration of constituent components, making it easy to position the mask pattern 10 on the surface of the water-insoluble polymer layer 3.

[0104] According to the screen printing plate of the present invention, the finished printing plate has a flat surface, which results in good print reproducibility and good adhesion to the printed material, which prevents ink from seeping through to the back of the printing plate and reduces the number of times the plate needs to be wiped.

[0105] <Photosensitive resist base material> The photosensitive resist base material according to the present invention is characterized by comprising the above-mentioned laminated film for pattern formation and a substrate laminated on the photosensitive resin layer side of the laminated film for pattern formation.

[0106] The substrate to be laminated on the photosensitive resin layer side can be made of various materials, including wood, stone, fabric, paper, ceramics, glass, synthetic resins such as cellulose acetate, polyester, polyolefin, polyimide, and epoxy resin, glass fiber reinforced resin, metals such as aluminum, copper, nickel, iron, zinc, magnesium, and cobalt, semiconductor materials such as silicon and gallium arsenide germanium, and insulating materials such as silicon nitride and silicon oxide.

[0107] The photosensitive resist base material of the present invention is a photosensitive resin that can be developed with neutral water, and therefore does not require a solvent or alkaline aqueous solution as a developer, making it more environmentally and operationally advantageous than conventional photosensitive resist base materials.

[0108] In addition to screen mesh, this pattern-forming laminated film can be bonded to substrates such as metal and glass to produce a photosensitive resist substrate. Unlike conventional organic solvent-containing resins, it uses neutral water as the solvent, resulting in less environmental pollution. Development can also be done with neutral water, rather than organic solvents or alkaline water, which is advantageous in terms of the environment, work, and storage and disposal of the developer. Furthermore, some substrates can be discolored or deformed by organic solvents or alkalis, so the ability to develop with neutral water allows for a wide range of substrates to be selected. [1] A laminated film for pattern formation, characterized in that it is composed of a support layer, an adhesive layer, a water-insoluble polymer layer, and a photosensitive resin layer in this order. [2] The pattern-forming laminate film according to [1], wherein the photosensitive resin layer is a photosensitive resin that can be developed with neutral water. [3] A laminated film for pattern formation described in [1] or [2], wherein the interlayer adhesion strength (x) between the support layer and the adhesive layer, the interlayer adhesion strength (y) between the adhesive layer and the water-insoluble polymer layer, and the interlayer adhesion strength (z) between the water-insoluble polymer layer and the photosensitive resin layer satisfy the following relationship: Interlayer adhesion (x) > interlayer adhesion (y) Interlayer adhesion (z) > Interlayer adhesion (y) [4] The laminated film for pattern formation according to any one of [1] to [3], wherein the interlayer adhesive strength (y) between the adhesive layer and the water-insoluble polymer layer is 0.001 to 1.0 N / 25 mm. [5] The laminated film for pattern formation according to any one of [1] to [4], wherein the water-insoluble polymer layer has a haze value of 5.0% or less. [6] The laminated film for pattern formation according to any one of [1] to [5], wherein the water-insoluble polymer layer has a thickness of 1 to 100 μm. [7] The pattern-forming laminate film according to any one of [1] to [6], wherein the photosensitive resin layer is made of a photosensitive resin containing the following component (A) and component (B): Component (A): Polyvinyl alcohol with a saponification degree of 50 mol% or more Component (B): Diazo resin [8] The pattern-forming laminate film according to any one of [1] to [6], wherein the photosensitive resin layer is made of a photosensitive resin containing the following components (A), (C), and (D): Component (A): Polyvinyl alcohol with a saponification degree of 50 mol% or more Component (C): an epoxy compound having at least one epoxy group Component (D): Photoacid generator [9] The laminated film for pattern formation according to any one of [1] to [6], wherein the photosensitive resin layer is made of a photosensitive resin containing the following component (E): Component (E): Polyvinyl alcohol having a saponification degree of 50 mol% or more and having a styryl-substituted pyridinium group or a styryl-substituted quinolinium group

[10] The pattern-forming laminate film according to any one of [7] to [9], wherein the photosensitive resin layer is made of a photosensitive resin further containing the following component (F) and component (G): Component (F): a radical polymerizable compound having at least one ethylenically unsaturated bond Component (G): Photoradical polymerization initiator

[11] The laminated film for pattern formation according to any one of [7] to

[10] , wherein the photosensitive resin layer is made of a photosensitive resin further containing the following component (H): Component (H): Water-based polymer emulsion

[12] The laminate film for pattern formation according to any one of [1] to

[11] , wherein a protective layer is further laminated on the photosensitive resin layer side of the laminate film for pattern formation.

[13] An unexposed screen printing plate comprising a laminate film obtained by removing the support layer and adhesive layer from the laminate film for pattern formation described in any one of [1] to

[11] , and a screen mesh laminated on the photosensitive resin layer side of the laminate film.

[14] A method for producing an unexposed screen printing plate, comprising the following steps (a) and (b): Step (a): A step of joining a screen mesh to the photosensitive resin layer side of the laminated film for pattern formation according to any one of [1] to

[11] . Step (b): A step of peeling the support layer and adhesive layer from the water-insoluble polymer layer of the pattern-forming laminate film.

[15] A screen printing plate, characterized by being produced by forming a latent image on an unexposed screen printing plate comprising a laminate film obtained by removing the support layer and adhesive layer from the laminate film for pattern formation according to any one of [1] to

[11] , and a screen mesh laminated on the photosensitive resin layer side of the laminate film, and developing the photosensitive resin layer.

[16] A method for producing a screen printing plate, comprising the following steps (a) to (f): Step (a): A step of joining a screen mesh to the photosensitive resin layer side of the laminated film for pattern formation according to any one of [1] to

[11] . Step (b): A step of peeling the support layer and adhesive layer from the water-insoluble polymer layer of the pattern-forming laminate film. Step (c): A step of placing a pattern mask on the surface of the water-insoluble polymer layer. Step (d): forming a latent image on the photosensitive resin layer Step (e): Step of peeling off the water-insoluble polymer layer Step (f): A step of developing the photosensitive resin layer on which the latent image is formed.

[17] A photosensitive resist base material comprising a laminated film for pattern formation according to any one of [1] to

[11] and a base material laminated on the photosensitive resin layer side of the laminated film for pattern formation. [Example]

[0109] Example 1 Fabrication of laminated film for pattern formation A 75 μm thick polyethylene terephthalate film was prepared as a support layer, and an ethylene-vinyl acetate emulsion type adhesive was applied to it using a bar coater and dried at 100°C for 3 minutes to form a 10 μm thick adhesive layer. A 6 μm thick polyethylene terephthalate film was then attached to the top using a laminator as a layer made of a water-insoluble polymer. Next, photosensitive resin 1 consisting of the above-mentioned component (A) and components (B), (F), (G), and (H) was applied using a bar coater and dried by heating at 40°C for 30 minutes to form a photosensitive resin layer with a thickness of 20 μm, thereby obtaining a laminated film for pattern formation.

[0110] <Example 2> A laminated film for pattern formation was produced in the same manner as in Example 1, except that after the photosensitive resin layer of Example 1 was formed, a polyethylene film having a thickness of 25 μm was laminated thereon as a protective layer.

[0111] Example 3 A laminated film for pattern formation was produced in the same manner as in Example 1, except that an acrylic pressure-sensitive adhesive was used for the adhesive layer and a polyolefin film having a thickness of 12 μm was used for the layer C made of a water-insoluble polymer.

[0112] <Comparative Example 1> Fabrication of laminated film for pattern formation A 75 μm-thick polyethylene terephthalate film was prepared as a support layer, and a 5.0 mass% aqueous solution of polyvinyl alcohol (Kuraray Poval 95-88, manufactured by Kuraray Co., Ltd.) was applied thereon using a bar coater and dried by heating at 40°C for 30 minutes to form a 5 μm-thick layer made of a water-soluble polymer. Photosensitive resin 1, consisting of the above-mentioned components (A) and (B), (F), (G), and (H), was then applied thereon using a bar coater and dried by heating at 40°C for 30 minutes to form a 20 μm-thick photosensitive resin layer, thereby obtaining a laminated film for pattern formation.

[0113] <Comparative Example 2> A laminated film for pattern formation was produced in the same manner as in Comparative Example 1, except that a fluorine compound-containing resin (SP-2050UC manufactured by Murakami Co., Ltd., no diazo resin added) was used as the layer made of a water-soluble polymer.

[0114] <Comparative Example 3> A 75 μm thick polyethylene terephthalate film was prepared as a support layer, and photosensitive resin 1 consisting of the above-mentioned components (A) and (B), (F), (G), and (H) was applied onto the support layer using a bar coater. The resulting film was then dried at 40°C for 30 minutes to form a 20 μm thick photosensitive resin layer, thereby obtaining a pattern-forming film.

[0115] <Evaluation Method 1> Photosensitive resin 1, consisting of the above-mentioned components (A) and (B), (F), (G), and (H), was applied using a stainless steel bucket to a polyester fiber mesh fixed to an aluminum frame, and the photosensitive resin layer side of the pattern-forming laminate film prepared above was laminated. For the pattern-forming laminate film prepared in Example 2, the protective layer was peeled off immediately before lamination, and then the photosensitive resin layer side was laminated. After drying at 40°C for 30 minutes, the support layer was peeled off. For the pattern-forming laminate films prepared in Examples 1, 2, and 3, the adhesive layer was peeled off at the same time as the support layer was peeled off.

[0116] Next, a pattern mask was placed over the plate, and the plate was evacuated. The photosensitive resin layer was exposed to light using a 3kW metal halide lamp at a distance of 1m from the plate surface for 2 minutes. The pattern mask was then removed, and the resin layer was developed using tap water. This produced a screen printing plate. In Examples 1, 2 and 3, the water-insoluble polymer layer was removed before development.

[0117] Surface tackiness 1 The pattern masks were evaluated as A to C depending on the ease of alignment when they were superimposed. A: The pattern mask can be moved smoothly, making alignment easy. B: The pattern mask cannot be moved smoothly, making alignment difficult. C: The pattern mask sticks to the surface and cannot be aligned.

[0118] Surface tackiness 2 The pattern mask was evaluated as A to C based on ease of peeling after vacuum exposure. A: The pattern mask could be peeled off easily without any resistance. B: There was resistance when peeling off the pattern mask, and it was not possible to peel it off smoothly. C: The pattern mask stuck to the surface, causing part of the surface to be damaged.

[0119] Surface condition The surface condition of the screen printing plate after development was evaluated from ◯ to ×. ◯: Nothing remains on the surface of the photosensitive resin layer. ×: Other components remain on the surface of the photosensitive resin layer.

[0120] The evaluation results are shown in Table 1.

[0121] [Table 1]

[0122] Example 4 Fabrication of laminated film for pattern formation A 75 μm thick polyethylene terephthalate film was prepared as a support layer, and a silicone adhesive was applied to it using a bar coater and dried at 100°C for 3 minutes to form a 5 μm thick adhesive layer. A 12 μm thick polyolefin film was then laminated on top of the silicone adhesive layer using a laminator as a layer made of a water-insoluble polymer. Next, photosensitive resin 2 consisting of the above-mentioned components (E) and (F), (G), and (H) was applied using a bar coater and dried by heating at 40°C for 30 minutes to form a photosensitive resin layer with a thickness of 30 μm, thereby obtaining a laminated film for pattern formation.

[0123] <Example 5> A laminated film for pattern formation was produced in the same manner as in Example 4, except that an ethylene-vinyl acetate emulsion type pressure-sensitive adhesive was used for the adhesive layer.

[0124] Example 6 A laminated film for pattern formation was produced in the same manner as in Example 4, except that a urethane-based adhesive was used for the adhesive layer.

[0125] Example 7 A laminated film for pattern formation was produced in the same manner as in Example 4, except that an acrylic pressure-sensitive adhesive was used for the adhesive layer.

[0126] <Comparative Example 4> Fabrication of laminated film for pattern formation A laminated film for pattern formation was produced in the same manner as in Example 4, except that a release film in which a 25 μm-thick polyester film with one side treated with silicone release was used as the layer made of a water-insoluble polymer. The release film was attached with the silicone release-treated surface facing the photosensitive resin layer.

[0127] <Comparative Example 5> A laminated film for pattern formation was produced in the same manner as in Example 5, except that a release film in which a 75 μm-thick polyester film was treated with silicone release on one side was used as the support layer. The release film was attached with the silicone release-treated side facing the adhesive layer.

[0128] <Comparative Example 6> A laminated film for pattern formation was produced in the same manner as in Example 6, except that an easy-adhesion film in which one side of a 25 μm-thick polyester film was subjected to corona discharge treatment was used as the layer made of a water-insoluble polymer. The corona-treated side of the easy-adhesion film was attached to the adhesive layer side.

[0129] <Comparative Example 7> A laminated film for pattern formation was produced in the same manner as in Example 7, except that a photosensitive resin 3 comprising the above-mentioned components (A) and (B) and (H) was used for the photosensitive resin layer.

[0130] <Evaluation Method 2> The photosensitive resin used in each pattern-forming film was applied to a polyester fiber mesh fixed to an aluminum frame using a stainless steel bucket, and the photosensitive resin layer side of the pattern-forming laminate film prepared above was attached to the mesh. The resulting mixture was dried at 40°C for 30 minutes to obtain a test plate. After storing for 24 hours in an environment of 25°C and 50% humidity, cellophane tape was attached to the support layer and peeled off by pulling upwards, and it was confirmed which of interfaces 1 to 3 peeled off. Interface 1 Support layer / glue layer Interface 2 Glue layer / Water-insoluble polymer layer Interface 3 Water-insoluble polymer layer / photosensitive resin layer ○: Peeling occurred at interface 2, and no adhesive layer remained on the water-insoluble polymer layer. ×: Peeling occurs at a location other than interface 2.

[0131] The evaluation results are shown in Table 2 below.

[0132] [Table 2]

[0133] Example 8 Fabrication of laminated film for pattern formation A 75 μm thick polyethylene terephthalate film was prepared as a support layer, and a 3 μm thick adhesive layer was formed on top of it by applying a silicone adhesive with a bar coater and drying it for 3 minutes at 100°C.Furthermore, a 12 μm thick polyolefin film with a haze value of 0.3% was laminated on top of that as a layer made of a water-insoluble polymer using a laminator.

[0134] Next, a photosensitive resin 4 consisting of the above-mentioned components (A) and (B), (F), and (G) was applied using a bar coater and dried by heating at 40°C for 30 minutes to form a photosensitive resin layer with a thickness of 15 μm, thereby obtaining a laminated film for pattern formation.

[0135] The photosensitive resin used in each pattern-forming film was then applied to a stainless steel fiber mesh fixed to an aluminum frame using a stainless steel bucket, and the photosensitive resin layer of the pattern-forming laminate film prepared above was attached to the mesh. The resulting laminate was dried at 40°C for 30 minutes, and the support layer and adhesive layer were peeled off.

[0136] Next, a pattern mask was placed on top of the water-insoluble polymer layer, and the chamber was evacuated. The photosensitive resin layer was exposed to light using a 3 kW metal halide lamp as the light source, with a distance of 1 m between the light source and the plate surface, and irradiation times of 2, 3, 4, and 5 minutes. Subsequently, the pattern mask was removed, and the resin layer was developed with tap water, thereby obtaining a screen printing plate.

[0137] Example 9 A screen printing plate was obtained in the same manner as in Example 8, except that a highly transparent polyethylene terephthalate film having a thickness of 50 μm and a haze value of 1.0% was used as the water-insoluble polymer layer.

[0138] Example 10 A screen printing plate was obtained in the same manner as in Example 8, except that photosensitive resin 5 comprising the above-mentioned components (A) and (C) and (D) was used for the photosensitive resin layer.

[0139] <Comparative Example 8> A screen printing plate was obtained in the same manner as in Example 8, except that a polyolefin film having a thickness of 30 μm and a haze value of 6% was used as the water-insoluble polymer layer.

[0140] <Comparative Example 9> A laminated film for pattern formation was produced in the same manner as in Example 8, except that a general-purpose polyethylene terephthalate film having a thickness of 25 μm and a haze value of 5.7% was used for the water-insoluble polymer layer.

[0141] <Comparative Example 10> A laminated film for pattern formation was produced in the same manner as in Example 10, except that a polyolefin film having a thickness of 125 μm and a haze value of 1.5% was used as the water-insoluble polymer layer.

[0142] <Evaluation Method 3> The pattern on the resulting screen printing plate was confirmed with a 100x magnifying glass to determine the sensitivity and resolution. Sensitivity: The sensitivity was determined as the shortest exposure time for 7 or more steps of the step tablet. Resolution: The narrowest width (μm) of the L / S resolved at the sensitivity determined above was taken as the resolution. The evaluation results are shown in Table 3 below.

[0143] [Table 3] [Explanation of symbols]

[0144] 1: laminated film for pattern formation, 2: support layer, 3: adhesive layer, 4: non-water-soluble polymer layer, 5: photosensitive resin layer, 6: screen mesh, 7: frame material, 8: first unexposed screen printing plate, 9: second unexposed screen printing plate, 1': laminated film, 10: pattern mask, 11: screen printing plate

Claims

1. A laminated film for pattern formation, characterized in that it comprises a support layer, an adhesive layer, a water-insoluble polymer layer, and a photosensitive resin layer in this order.

2. 2. The pattern-forming laminate film according to claim 1, wherein the photosensitive resin layer is a photosensitive resin that can be developed with neutral water.

3. A laminated film for pattern formation as described in claim 1 or 2, wherein the interlayer adhesion strength (x) between the support layer and the adhesive layer, the interlayer adhesion strength (y) between the adhesive layer and the water-insoluble polymer layer, and the interlayer adhesion strength (z) between the water-insoluble polymer layer and the photosensitive resin layer satisfy the following relationship: Interlayer adhesive force (x) > Interlayer adhesive force (y) Interlayer adhesive force (z) > Interlayer adhesive force (y)

4. The pattern-forming laminate film according to any one of claims 1 to 3, wherein the interlayer adhesive strength (y) between the adhesive layer and the water-insoluble polymer layer is 0.001 to 1.0 N / 25 mm.

5. 5. The laminated film for pattern formation according to claim 1, wherein the water-insoluble polymer layer has a haze value of 5.0% or less.

6. 6. The pattern-forming laminate film according to claim 1, wherein the water-insoluble polymer layer has a thickness of 1 to 100 μm.

7. 7. The pattern-forming laminate film according to claim 1, wherein the photosensitive resin layer comprises a photosensitive resin containing the following components (A) and (B): Component (A): Polyvinyl alcohol with a saponification degree of 50 mol% or more Component (B): Diazo resin

8. The pattern-forming laminate film according to any one of claims 1 to 6, wherein the photosensitive resin layer is made of a photosensitive resin containing the following components (A), (C), and (D): Component (A): Polyvinyl alcohol with a saponification degree of 50 mol% or more Component (C): an epoxy compound having at least one epoxy group Component (D): Photoacid generator

9. 7. The pattern-forming laminate film according to claim 1, wherein the photosensitive resin layer comprises a photosensitive resin containing the following component (E): Component (E): Polyvinyl alcohol having a saponification degree of 50 mol % or more and having a styryl-substituted pyridinium group or a styryl-substituted quinolinium group

10. The pattern-forming laminate film according to any one of claims 7 to 9, wherein the photosensitive resin layer is made of a photosensitive resin further containing the following component (F) and component (G): Component (F): A radically polymerizable compound having at least one ethylenically unsaturated bond. Component (G): Photoradical polymerization initiator

11. The pattern-forming laminate film according to any one of claims 7 to 10, wherein the photosensitive resin layer is made of a photosensitive resin further containing the following component (H): Component (H): Aqueous polymer emulsion

12. The laminated film for pattern formation according to any one of claims 1 to 11, further comprising a protective layer laminated on the photosensitive resin layer side of the laminated film for pattern formation.

13. An unexposed screen printing plate, characterized by comprising a laminate film obtained by removing the support layer and adhesive layer from the laminate film for pattern formation according to any one of claims 1 to 11, and a screen mesh laminated on the photosensitive resin layer side of the laminate film.

14. A method for producing an unexposed screen printing plate, comprising the following steps (a) and (b): Step (a): A step of joining a screen mesh to the photosensitive resin layer side of the laminated film for pattern formation according to any one of claims 1 to 11. Step (b): A step of peeling the support layer and adhesive layer from the water-insoluble polymer layer of the pattern-forming laminate film.

15. A screen printing plate characterized by being obtained by forming a latent image on an unexposed screen printing plate comprising a laminate film obtained by removing the support layer and adhesive layer from the laminate film for pattern formation according to any one of claims 1 to 11, and a screen mesh laminated on the photosensitive resin layer side of the laminate film, and developing the photosensitive resin layer.

16. A method for producing a screen printing plate, comprising the following steps (a) to (f): Step (a): A step of joining a screen mesh to the photosensitive resin layer side of the laminated film for pattern formation according to any one of claims 1 to 11. Step (b): A step of peeling the support layer and adhesive layer from the water-insoluble polymer layer of the pattern-forming laminate film. Step (c): A step of placing a pattern mask on the surface of the water-insoluble polymer layer. Step (d): forming a latent image on the photosensitive resin layer Step (e): Step of peeling off the water-insoluble polymer layer Step (f): A step of developing the photosensitive resin layer on which the latent image is formed.

17. A photosensitive resist base material comprising the laminate film for pattern formation according to any one of claims 1 to 11 and a base material laminated on the photosensitive resin layer side of the laminate film for pattern formation.

Images