Cooling system for heterogeneous integrated semiconductor packaging structure

Abstract

To provide a cooling system of a heterogeneous integrated semiconductor packaging structure having high heat radiation efficiency.SOLUTION: A cooling system for a heterogeneous integration semiconductor packaging structure is provided, where the heterogeneous integration semiconductor packaging structure is disposed on a circuit board, the cooling system for the heterogeneous integration semiconductor packaging structure includes a cooling assembly, and the cooling assembly is disposed on the heterogeneous integration semiconductor packaging structure.SELECTED DRAWING: Figure 2

Description

[Technical Field]

[0001] The present invention relates to a cooling system for a heterogeneous integrated semiconductor packaging structure, and more particularly to a cooling system for a heterogeneous integrated semiconductor packaging structure for cooling a chip with multiple heat sources within the packaging structure. [Background technology]

[0002] With the advent of the era of high computing power of Artificial Intelligence (AI), the demand for high performance computing (HPC) and high frequency and high speed transmission is increasing day by day, and heterogeneous integrated packaging structure and silicon photonics packaging structure are gradually becoming the forefront technology. Summary of the Invention [Problem to be solved by the invention]

[0003] However, as people's demand for computing power and transmission speeds continues to grow exponentially, the power consumption of servers continues to increase, necessitating the need to improve cooling technology.

[0004] However, as it is predicted that an era will come in which even higher computing power will be required in the future, it is predicted that the heat dissipation capacity of current air cooling will become insufficient, and in recent years, forward-looking direct liquid cooling technology has emerged.

[0005] In addition, existing liquid cooling technologies include immersion, cold plate, microchannel, jet impingement, and the like.

[0006] On the other hand, liquid cooling technology has a relatively high heat dissipation capacity, and related technologies have been developed for a long time. However, it has not been put into mass production, mainly because the heat dissipation capacity of air-cooled technology can only barely cope with the heat consumption of conventional computing systems.

[0007] In view of these circumstances, the present invention provides a cooling system for a heterogeneous integrated semiconductor packaging structure that uses a cooling fluid to dissipate heat from the semiconductor packaging structure, thereby improving the shortcomings of the prior art and further addressing the need for improved heat dissipation capabilities that may be faced by high computing power and high transmission speeds. [Means for solving the problem]

[0008] The cooling system of the heterogeneous integrated semiconductor packaging structure further includes a thermally conductive fastener and a heat sink, the heat sink being disposed on the opposite side of the circuit board from the heterogeneous integrated semiconductor packaging structure, and the thermally conductive fastener being usable to connect the cooling component and the heat sink.

[0009] In this embodiment, the cooling system of the heterogeneous integrated semiconductor packaging structure further includes a stiffening plate, which can be installed on the circuit board, and the thermally conductive fastener can be used to connect the cooling component, the stiffening plate, and the heat sink.

[0010] In this embodiment, the cooling system of the heterogeneous integrated semiconductor packaging structure further includes a reinforcement support, which can be installed on the circuit board and contacts the cooling component.

[0011] In this embodiment, the cooling component includes a vapor chamber.

[0012] In addition, in this embodiment, the cooling system of the heterogeneous integrated semiconductor packaging structure can include a cooling fluid driving module. Also, the reinforcement support includes a cooling fluid passage. The cooling fluid passage can be connected to the cooling fluid driving module. Furthermore, the cooling fluid driving module is suitable for supplying cooling fluid to the cooling fluid passage.

[0013] In this embodiment, the cooling system of the heterogeneous integrated semiconductor packaging structure further includes a plurality of oxygen-free copper sealing components, which are provided at the joints of the flow path component and the cooling component.

[0014] In this embodiment, the cooling component further includes a main fluid chamber, a fluid supply chamber, a fluid return chamber, and a plurality of fluid return holes, the plurality of fluid supply holes can connect the main fluid chamber and the fluid supply chamber, and the plurality of fluid return holes can connect the main fluid chamber and the fluid return chamber, and the arrangement density of the plurality of fluid supply holes in the first heat generating portion is higher than the arrangement density of the plurality of fluid supply holes in the second heat generating portion.

[0015] In this embodiment, the fluid supply module may include a fluid supply pump, a fluid distribution valve, a first inlet pipe, and a second inlet pipe.

[0016] The first inlet pipe has two ends that can connect the fluid distribution valve to the first fluid chamber, and the second inlet pipe has two ends that can connect the fluid distribution valve to the second fluid chamber.

[0017] The fluid supply pump is adapted to supply cooling fluid to the fluid distribution valve, the fluid distribution valve supplying a greater flow rate of cooling fluid to the first inlet pipe than to the second inlet pipe.

[0018] In this embodiment, the liquid supply module may include a first fluid supply pump adapted to supply cooling fluid to the first fluid chamber and a second fluid supply pump adapted to supply cooling fluid to the second fluid chamber.

[0019] Here, the flow rate of the cooling fluid supplied by the first fluid supply pump to the first fluid chamber is greater than the flow rate of the cooling fluid supplied by the second fluid supply pump to the second fluid chamber.

[0020] In this embodiment, the fluid supply module includes a fluid supply pump, a first inlet pipe, and a second inlet pipe.

[0021] Both ends of the first inlet pipe can connect the fluid supply pump and the first fluid chamber, respectively, and both ends of the second inlet pipe can connect the fluid supply pump and the second fluid chamber, respectively.

[0022] The fluid supply pump supplies the cooling fluid to the first fluid chamber and the second fluid chamber via a first inlet pipe and a second inlet pipe, respectively, where the diameter of the first inlet pipe is larger than the diameter of the second inlet pipe.

[0023] In this embodiment, the fluid supply module includes a fluid supply pump, a first inlet pipe, and a second inlet pipe.

[0024] Both ends of the first inlet pipe can connect the fluid supply pump to the inlet hole of the first fluid chamber, and both ends of the second inlet pipe can connect the fluid supply pump to the inlet hole of the second fluid chamber, respectively.

[0025] The fluid supply pump is adapted to supply cooling fluid to the first fluid chamber and the second fluid chamber via the first inlet pipe and the second inlet pipe, respectively.

[0026] The inlet hole of the first fluid chamber may have a larger diameter than the inlet hole of the second fluid chamber.

[0027] In this embodiment, the cooling system of the heterogeneous integrated semiconductor packaging structure may further include a fluid supply module and a fluid recovery module, wherein the fluid supply module includes a cooling chamber and a recovery chamber, and the cooling chamber and the recovery chamber may be electrically connected to each other.

[0028] The fluid supply module can be connected to the cooling chamber and is suitable for supplying cooling fluid thereto. The fluid recovery module can be connected to the recovery chamber and can include a gas recovery pump, the gas recovery pump being suitable for drawing the cooling fluid into the recovery chamber after it has evaporated.

[0029] In this embodiment, the cooling system of the heterogeneous integrated semiconductor packaging structure may further include a fluid storage unit, a fluid supply pipeline, a fluid return pipeline, a first fluid pump, and a second fluid pump.

[0030] The cooling element may include a hollow chamber, a fluid storage unit for storing a cooling fluid, and two ends of a fluid supply pipeline and a fluid return pipeline may connect the fluid storage unit and the hollow chamber of the cooling element, respectively.

[0031] The first fluid pump may be located in the fluid supply pipeline, and the second fluid pump may be located in the fluid return pipeline.

[0032] The cooling fluid is supplied to the cooling components from the fluid supply pipeline via a first fluid pump, or the cooling fluid is supplied to the cooling components from the fluid return pipeline via a second fluid pump.

[0033] In this embodiment, the cooling system of the heterogeneous integrated semiconductor packaging structure includes a controller, a sensor, and a fluid driving unit.

[0034] The fluid driving unit is adapted to supply the cooling fluid to the cooling component, and the controller can be mounted on the circuit board, and the controller can be electrically connected to the sensor and the fluid driving unit.

[0035] Here, the controller controls the fluid driving unit based on the sensing (detection) results of the sensor, and the fluid driving unit supplies cooling fluid to the cooling component.

[0036] In this embodiment, a plurality of first fluid passages and a plurality of second fluid passages are included within the cooling component.

[0037] The plurality of first fluid passages and the plurality of second fluid passages may be arranged in a staggered manner in the cooling component so as to be substantially parallel to each other, and the cooling fluids in the plurality of first fluid passages and the plurality of second fluid passages that are adjacent to each other may flow in opposite directions.

[0038] In this embodiment, the cooling component may include a channel, and the inner wall surface of the channel may be covered with a diamond-like film.

[0039] Also, a cooling system for a heterogeneous integrated semiconductor packaging structure, comprising: the heterogeneous integrated semiconductor packaging structure is disposed on a circuit board; The cooling system of the heterogeneous integrated semiconductor packaging structure includes a cooling component; The cooling component is disposed on the heterogeneous integrated semiconductor packaging structure.

[0040] Also, further including a reinforcement support and cooling fluid drive module; the reinforcing support is provided on the circuit board and contacts the cooling component, the cooling component including a vapor chamber; A cooling fluid passage is included in the reinforcement support, the cooling fluid passage being connected to the cooling fluid drive module, the cooling fluid drive module being adapted to supply cooling fluid to the cooling fluid passage.

[0041] The method further includes a flow path component, the flow path component being disposed on the opposite side of the heterogeneous integrated semiconductor packaging structure on the circuit board; The flow path component is coupled to the cooling component, the flow path component includes a plurality of fluid passages, the cooling component includes an internal chamber, and the plurality of fluid passages are connected to the internal chamber.

[0042] Furthermore, the heterogeneous integrated semiconductor packaging structure includes a first heat generating portion and a second heat generating portion; a heat dissipation design efficiency of the first heat generating portion is higher than a heat dissipation design efficiency of the second heat generating portion; the cooling component includes a plurality of fluid supply holes, the plurality of fluid supply holes corresponding to the heterogeneous integrated semiconductor packaging structure; The flow rate of the cooling fluid ejected from the fluid supply hole toward the first heat generating portion is greater than the flow rate of the cooling fluid ejected toward the second heat generating portion.

[0043] The heterogeneous integrated semiconductor packaging structure further includes a fluid supply module, and the heterogeneous integrated semiconductor packaging structure includes a first heat generating portion and a second heat generating portion; The first heat generating portion has a higher heat dissipation design efficiency than the second heat generating portion, and the cooling component includes a first fluid chamber and a second fluid chamber; the first fluid chamber corresponds to the first heat generating portion, and the second fluid chamber corresponds to the second heat generating portion; the fluid supply module is adapted to supply a cooling fluid to the first fluid chamber and the second fluid chamber; The fluid supply module supplies the cooling fluid to the first fluid chamber at a rate greater than the cooling fluid to the second fluid chamber. [Effects of the Invention]

[0044] As described above, the cooling system of the heterogeneous integrated semiconductor packaging structure provided by the present invention can greatly improve the heat dissipation capacity and meet the heat dissipation requirements that often arise when realizing high computing power and high-speed transmission. [Brief explanation of the drawings]

[0045] [Figure 1A] 1 is a cross-sectional view showing a first embodiment of a cooling system of a heterogeneous integrated semiconductor packaging structure of the present invention; [Figure 1B] FIG. 2 is a cross-sectional view showing a second embodiment of a cooling system for a heterogeneous integrated semiconductor packaging structure of the present invention. [Figure 2] FIG. 10 is a cross-sectional view showing a third embodiment of the cooling system of the heterogeneous integrated semiconductor packaging structure of the present invention. [Figure 3] FIG. 10 is a cross-sectional view showing a fourth embodiment of the cooling system of the heterogeneous integrated semiconductor packaging structure of the present invention. [Figure 4] FIG. 10 is a cross-sectional view showing a fifth embodiment of the cooling system of the heterogeneous integrated semiconductor packaging structure of the present invention. [Figure 5A] FIG. 10 is a cross-sectional view showing a sixth embodiment of the cooling system of the heterogeneous integrated semiconductor packaging structure of the present invention. [Figure 5B] FIG. 10 is a cross-sectional view showing a seventh embodiment of the cooling system of the heterogeneous integrated semiconductor packaging structure of the present invention. [Figure 5C] FIG. 10 is a cross-sectional view showing an eighth embodiment of the cooling system of the heterogeneous integrated semiconductor packaging structure of the present invention. [Figure 5D] FIG. 13 is a cross-sectional view showing a ninth embodiment of the cooling system of the heterogeneous integrated semiconductor packaging structure of the present invention. [Figure 6A] FIG. 19 is a perspective view showing a tenth embodiment of the cooling system of the heterogeneous integrated semiconductor packaging structure of the present invention. [Figure 6B] FIG. 19 is a cross-sectional view showing a tenth embodiment of the cooling system of the heterogeneous integrated semiconductor packaging structure of the present invention. [Figure 7]FIG. 19 is a perspective view showing an eleventh embodiment of the cooling system of the heterogeneous integrated semiconductor packaging structure of the present invention. [Figure 8] FIG. 11 is a block diagram showing an eleventh embodiment of the cooling system of the heterogeneous integrated semiconductor packaging structure of the invention. [Figure 9A] FIG. 13 is a cross-sectional view of a cooling component showing a thirteenth embodiment of the cooling system of the heterogeneous integrated semiconductor packaging structure of the present invention. [Figure 9B] FIG. 19 is a cross-sectional view of a cooling component showing a fourteenth embodiment of the cooling system of the heterogeneous integrated semiconductor packaging structure of the present invention. [Figure 10] 15A to 15C are cross-sectional views illustrating a coating process of the cooling system for the heterogeneous integrated semiconductor packaging structure according to the fifteenth embodiment of the present invention. DETAILED DESCRIPTION OF THE INVENTION

[0046] Various embodiments will be described below to explain the invention in detail. However, these embodiments are merely examples, and are not intended to limit the scope of the present invention to those described in the embodiments. Furthermore, in the present embodiments, some components are omitted from the drawings to clearly illustrate the technical features of the present invention. Furthermore, identical components are designated by the same reference numerals, and components highly related technically are designated by related reference numerals, for example, by using a different last digit. Furthermore, the drawings of the present invention are intended to provide a schematic description, are not necessarily drawn to a fixed scale, and not all components are shown in the drawings.

[0047] In the following description, a heterogeneous integrated semiconductor packaging structure will be used as an example of a cooling component, but the present invention is not limited thereto, and other technologically related semiconductor packaging structures, such as a silicon photonics packaging structure or other advanced packaging structures, can also be applied to the present invention.

[0048] First, a description will be given with reference to Figure 1A. Figure 1A is a cross-sectional view showing a first embodiment of a cooling system for a heterogeneous integrated semiconductor packaging structure of the present invention. A heterogeneous integrated semiconductor packaging structure I is formed in a substantially plate-like shape and is disposed approximately at the center in the horizontal direction on a circuit board B which is also formed in a plate-like shape and extends horizontally. The circuit board B is also formed in a plate-like shape extending horizontally, and has through-holes B1 formed on both ends in the horizontal direction.

[0049] The cooling system of the heterogeneous integrated semiconductor packaging structure includes a cooling component 2, a thermally conductive fastener 31, and a heat sink 32. The cooling component 2 is disposed on the upper side of the heterogeneous integrated semiconductor packaging structure I in FIG. 1A, and as will be described later, the main body is formed like a tank so as to be able to store a cooling fluid, and in addition, wing portions (not numbered) protruding from both horizontal ends have perforations 201 defined therein that are used to insert and fix the thermally conductive fastener 31.

[0050] In this embodiment, the cooling element 2 may be a cooling plate filled with a cooling fluid or an air-cooled plate, a vapor chamber, or any other cooling plate with heat conduction or heat dissipation functions.

[0051] The cooling fluid may be a refrigerant, pure water, ethylene glycol, propylene glycol, or a combination thereof. Alternatively, if the cooling fluid is non-conductive, deionized water, electronic fluorinated liquids, or other electronic process fluids may be used.

[0052] However, the cooling fluid is not limited to a liquid, and may be a low-temperature gas such as nitrogen, carbon dioxide, helium, or hydrogen.

[0053] The thermally conductive fastener 31 is a so-called fastener formed in a generally rod-like shape extending in a vertical direction perpendicular to the horizontal direction, and vertically passes through the perforation 201 of the cooling component 2, the through-hole B1 of the circuit board B, and the opening 34 of the reinforcing plate 33 (described later), and can be made of a metal material with a superior thermal conductivity. The thermally conductive fastener 31 is made of, for example, copper, and has a compression spring 6 attached to one end thereof and a barb 7 (a so-called barb) attached to the other end thereof. As described later, the force of the compression spring 6 attempting to expand is stopped by the barb 7 engaging with the heat sink 32, thereby allowing the cooling component 2 and the heat sink 32 to be tightly fixed to each other via the through-hole B1 of the circuit board B, the heterogeneous integrated semiconductor packaging structure I, and the perforation 201 of the cooling component 2. In this way, the compression spring 6 is used to tightly connect the cooling component 2, the heterogeneous integrated semiconductor packaging structure I, the circuit board B, and the heat sink 32, which makes it difficult for gaps with low thermal conductivity to form between them, resulting in the excellent effect of achieving high heat dissipation efficiency.

[0054] The heat sink 32 is formed in the shape of a plate extending in the horizontal direction, is disposed on the surface of the circuit board B opposite the heterogeneous integrated semiconductor packaging structure I, and has a pair of through-holes (not numbered) formed at both ends in the horizontal direction. In this embodiment, the heat sink 32 is disposed on the back surface (the lower side in the vertical direction in FIG. 1A ) of the circuit board B. Furthermore, the material of the heat sink 32 can be made of a metal material with a good thermal conductivity, such as copper, to help dissipate heat.

[0055] In this embodiment, an additional insulating pad (not shown) may be added between the circuit board B and the heat sink 32 to prevent the heat sink 32 from causing a short circuit between the circuit or electronic components on the circuit board B.

[0056] 1A also shows reinforcing plates 33 disposed at both ends in the horizontal direction on the same side of the circuit board B as the heterogeneous integrated semiconductor packaging structure I. Although it cannot be confirmed because FIG. 1A is a cross-sectional view, in plan view, the reinforcing plates 33 surround the heterogeneous integrated semiconductor packaging structure I on all four sides.

[0057] In this embodiment, the stiffener 33 may be a commonly used stiffener or other metal parts for reinforcing the strength of the circuit board B. The stiffener 33 may also be made of a metal material with a better thermal conductivity to help dissipate heat.

[0058] Here, the cooling component 2 includes a plurality of perforations 201, preferably four perforations 201, as described above, and can be arranged at the four corners of the cooling component 2. That is, in Fig. 1A, only a pair of perforations 201 on the front side are visible due to the angle, but a similar pair of perforations 201 is also defined on the back side, so that a total of four perforations 201 are included.

[0059] A plurality of through holes B1 are provided in the circuit board B, and a plurality of openings 34 are also provided in the reinforcing plate 33. The number and positions of the through holes B1 and openings 34 must correspond to the perforations 201 in the cooling member 2.

[0060] Furthermore, the number of the thermally conductive fasteners 31 also matches the number of the perforations 201 in the cooling component 2 .

[0061] As described above, each thermally conductive fastener 31 passes through the perforation 201 of the cooling component 2, the opening 34 of the reinforcing plate 33, the through hole B1 of the circuit board B, and the through hole (unnumbered) of the heat sink 32, and the barb 7, which is a barb formed on the other end of the thermally conductive fastener 31, is pulled upward by the force of the compression spring 6 as it tries to expand, and engages with the underside of the heat sink 32.

[0062] Of these, the compression spring 6 is sandwiched between the lower end of a large-diameter portion (no symbol) formed on one end side of the thermally conductive fastener 31 and the above-mentioned wing portion (no symbol) of the cooling component 2, and applies a force that presses the cooling component 2 downward, so that the lower surface of the cooling component 2 is securely attached to the upper surface of the heterogeneous integrated semiconductor packaging structure I.

[0063] As described above, the thermally conductive fastener 31 of this embodiment employs barbs 7 to facilitate fastening and detachment. In addition, the pressure applied to the cooling component 2 can be adjusted by replacing the compression spring 6 with one with a different pressure, allowing for flexible adjustment of the pressure.

[0064] Furthermore, the thermally conductive fastener 31 has excellent thermal conductivity and can conduct heat from the cooling component 2 to the reinforcing plate 33 and the heat sink 32. The reinforcing plate 33 and the heat sink 32 can assist in heat dissipation, thereby improving the heat dissipation efficiency.

[0065] 1B, a cross-sectional view showing a second embodiment of the cooling system for a heterogeneous integrated semiconductor packaging structure of the present invention is shown. The main difference between the second embodiment and the above-described embodiments is that a chip socket S is provided on the circuit board B, and in this embodiment, the chip socket S is used instead of the reinforcing plate 33 in the above-described embodiments.

[0066] In this embodiment, the thermally conductive fastener 31 also penetrates the cooling component 2, the chip socket S, the circuit board B, and the heat sink 32, and the barbs 7 of the thermally conductive fastener 31 engage with the underside of the heat sink 32. The chip socket S in FIG. 1B differs from the reinforcing plate 33 in FIG. 1A in that it is integrally formed rather than being provided as a horizontally separated piece. As a result, the chip socket S also extends directly below the heterogeneous integrated semiconductor packaging structure I so as to be in close contact with it.

[0067] Therefore, the heat dissipation can be assisted by the heat dissipation plate 32, and the heat dissipation efficiency can be improved.

[0068] Next, a description will be given with reference to Fig. 2. Here, Fig. 2 is a cross-sectional view showing a third embodiment of a cooling system for a heterogeneous integrated semiconductor packaging structure of the present invention.

[0069] In this embodiment, the cooling component 2 is a vapor chamber, which is in contact with the reinforcing support 3. The vapor chamber has excellent thermal conductivity and can quickly diffuse heat around the heterogeneous integrated semiconductor packaging structure I where heat density is highly concentrated, preventing the heterogeneous integrated semiconductor packaging structure I from becoming too hot.

[0070] In this embodiment, the reinforcing support 3 may be a stiffener or other metal part that is generally used to reinforce the strength of the circuit board B. The material of the reinforcing support 3 may also be a metal with a good thermal conductivity, such as copper.

[0071] Also shown in FIG. 2 is a cooling fluid drive module 4 which includes a pump (not numbered) and fluid delivery pipes (not numbered).

[0072] In the reinforcing support 3, a cooling fluid passage 41 is provided which is connected to a cooling fluid driving module 4. The cooling fluid driving module 4 is suitable for supplying the cooling fluid passage 41 with a cooling fluid.

[0073] In this embodiment, the reinforced support 3 is fully utilized, a cooling fluid passage 41 is drilled in the reinforced support 3, and the cooling fluid-driven module 4 is combined with the reinforced support 3. The excellent heat conduction properties of the vapor chamber allow heat to move toward the surrounding reinforced support 3, and then the heat is quickly removed by the cooling fluid, resulting in a rapid heat dissipation effect. In addition, there is no need to use heat dissipation components on the entire underside of the heterogeneous integrated semiconductor packaging structure I as in the embodiment shown in FIG. 1B. Furthermore, by using the vapor chamber, the cooling component 2 can be made thinner due to its excellent heat dissipation effect, thereby achieving the advantage of space saving.

[0074] In this embodiment, the cooling fluid driving module 4 may further include a liquid storage tank (not shown) and a heat exchanger (not shown). The liquid storage tank may store an appropriate amount of cooling fluid so that the cooling fluid driving module 4 can continuously supply cooling fluid to the reinforcement support 3.

[0075] The heat exchanger may be a finned heat exchanger equipped with a fan to further remove heat from the circulating cooling fluid, or in other embodiments, the heat exchanger may be a chiller to further adjust the temperature of the cooling fluid to a lower temperature.

[0076] Next, reference will be made to FIG. 3, which is a cross-sectional view showing a fourth embodiment of the cooling system for a heterogeneous integrated semiconductor packaging structure of the present invention.

[0077] 3, the cooling system of the heterogeneous integrated semiconductor packaging structure includes a cooling component 2 and a flow path component 5. The cooling component 2 is arranged to cover the heterogeneous integrated semiconductor packaging structure I from above, and the flow path component 5 is arranged on the side of the circuit board B opposite to the heterogeneous integrated semiconductor packaging structure I, i.e., on the lower surface of the circuit board B.

[0078] In this embodiment, the cooling component 2 may be a cooling plate including an internal chamber 20 and a plurality of openings 21, each formed into a plurality of rectangular shapes in a cross-sectional view, arranged in a horizontal line, and communicating with each other through a channel at the back side (not shown), as shown in FIG. 3 . The flow path component 5 may be a flow guide back plate including a plurality of fluid passages 51 extending horizontally inside the horizontally extending fluid component 5 and a plurality of protrusions 52 protruding upward from the upper surface of the fluid passages 5. Here, within the fluid passages 51 shown in light gray in FIG. 3 , fluid flows in the direction of the arrow. Although not shown in FIG. 3 because the fluid passages 51 are interrupted, the fluid passages 51 on the lower side of the flow path component 5 are connected to the fluid passages 51 formed on the upper side of the fluid component 5 at the turnback portion, and as a whole, a single fluid passage 51 is connected to the cooling component 2.

[0079] The circuit board B has a plurality of through holes B2, and the protrusions 52 of the flow path component 5 are joined to the cooling component 2 via the respective through holes B2.

[0080] 3, the cooling component 2 and the flow path component 5 can be connected by screws. More specifically, a set screw 70 can be inserted vertically through the cooling component 2 and the circuit board B to fix the cooling component 2 to the flow path component 5. The fluid flow paths 51 of the flow path member 5 extend horizontally and then change direction to a generally V-shape to extend to the protrusions 52, and are connected to the internal chamber 20 of the cooling component 2 via the openings 21.

[0081] In other embodiments, the protrusion 52 of the flow path component 5 is not limited to being joined to the cooling component 2 via the through-hole B2 of the circuit board B. In other words, if the circuit board B does not have the through-hole B2, the protrusion 52 may be joined to the cooling component 2 by extending upward along the side edge of the circuit board B, although this embodiment is not shown.

[0082] That is, in other embodiments, the joining position between the cooling component 2 and the flow path component 5 can be adjusted based on actual requirements, such as the side edge of the circuit board B or other suitable locations.

[0083] Furthermore, in this embodiment, oxygen-free copper sealing parts 55 can be provided at each joint between the flow path parts 5 and the cooling parts 2.

[0084] The reason for using oxygen-free copper for sealing parts is that copper is soft, strong, has excellent ductility, and has a long lifespan.

[0085] On the other hand, each protrusion 52 includes a first protrusion sealing unit 53 that can be arranged to correspond to the shape of an oxygen-free copper sealing part 55 such as an annular structure, as shown in the enlarged view of the main part shown in the lower left of FIG.

[0086] Similarly, the cooling component 2 may include a plurality of second protruding sealing units 54, each surrounding the opening 21, and the position, size, and shape of the second protruding sealing units 54 may match those of the first protruding sealing units 53.

[0087] This allows the first protrusion sealing unit 53 and the second protrusion sealing unit 54 to enter both sides of the oxygen-free copper sealing part 55, respectively, and the protrusions 52 to engage with the cooling part 2 to form a seal.

[0088] In this manner, in this embodiment, the cooling fluid is supplied to the cooling component 2 through the fluid passage 51 of the flow path component 5, and the cooling fluid can be further forcedly circulated, thereby achieving a higher heat dissipation effect.

[0089] On the other hand, in this embodiment, a flow path is also arranged below the circuit board B, and cooling can be performed simultaneously by sandwiching the heterogeneous integrated semiconductor packaging I from both the upper and lower sides, and the heat dissipation area is increased, so there is no need to provide a large cooling component 2 as shown in FIGS. 1A and 1B. As a result, significant space can be saved and the configuration of related components on the circuit board B can be simplified, which is advantageous for disassembly, assembly, maintenance, etc. of electronic components on the circuit board B.

[0090] Furthermore, when assembling the cooling component 2, the connection of the fluid flow path 51 is also completed at the same time, so that assembly can be performed fully automatically.

[0091] Next, a description will be given with reference to Fig. 4. Here, Fig. 4 is a cross-sectional view showing a fifth embodiment of the cooling system for a heterogeneous integrated semiconductor packaging structure of the present invention.

[0092] As shown in FIG. 4, the heterogeneous integrated semiconductor packaging structure I includes a first heat generating portion Ia and a second heat generating portion Ib, each of which may be a chiplet.

[0093] In this embodiment, the heat dissipation design efficiency (Thermal Design Power, TDP, meaning heat dissipation capacity) of the first heat generating portion Ia is preset to be higher than the heat dissipation design efficiency of the second heat generating portion Ib.

[0094] That is, during operation of the two chiplets, the temperature of the first heat generating part Ia will be higher than the temperature of the second heat generating part Ib.

[0095] In such a case, even in a general semiconductor packaging structure, problems such as uneven temperature distribution throughout the entire package, particularly thermal crosstalk, occur, which affect the reliability of the semiconductor packaging structure.

[0096] As shown in FIG. 4, the cooling component 2 may have a plurality of fluid supply holes 22 extending vertically therein, each corresponding to a first heat generating portion Ia and a second heat generating portion Ib.

[0097] However, in this embodiment, in order to solve the above-mentioned problem of uneven temperature of the semiconductor packaging structure, a jet impingement technique can be used, which can be realized by, for example, making the flow rate of the cooling fluid sprayed from the fluid supply holes 22 onto the first heat generating portion Ia greater than the flow rate of the cooling fluid sprayed onto the second heat generating portion Ib.

[0098] Supplying a large flow rate of cooling fluid can remove more heat than supplying a small flow rate of cooling fluid, which can significantly reduce the temperature of the first heat generating element Ia and keep the temperatures of the first heat generating element Ia and the second heat generating element Ib as constant as possible.

[0099] Specifically, as shown in FIG. 4, the cooling component 2 includes a main fluid chamber 23, a fluid supply chamber 24, a fluid return chamber 25, a plurality of fluid supply holes 22, and a plurality of fluid return holes .

[0100] The plurality of fluid supply holes 22 are connected to a main fluid chamber 23 and a fluid supply chamber 24 , and the fluid recovery hole 26 is connected to the main fluid chamber 23 and a fluid recovery chamber 25 .

[0101] 4 is the area depicted in dark gray, and specifically, fluid is supplied from a pipeline (unnumbered) extending horizontally depicted in the upper left of FIG. 4, passes through the fluid supply chamber 24, and then through a plurality of fluid supply holes 22 also depicted in dark gray, and is supplied to the main fluid chamber 23. This cools the heterogeneous integrated semiconductor packaging structure I including the first heat-generating portion Ia and the second heat-generating portion Ib.

[0102] On the other hand, taking the fluid recovery chamber 25 as an example, the liquid to be dissipated heat is recovered from the main chamber 23 through multiple fluid recovery holes 26 depicted in light gray and temporarily stored in the liquid recovery chamber 25, after which the heat-containing liquid is recovered via a recovery pipeline (unnumbered) depicted extending horizontally in the upper right corner of Figure 4.

[0103] In this way, although the liquid supply chamber 24 is connected to the liquid recovery chamber 25 via the main fluid chamber 23, separate flow paths for the fluid supply system and the recovery system are provided, so that the fluid before being used for heat dissipation does not mix with the fluid after being used for heat dissipation, resulting in a high heat dissipation effect.

[0104] Here, the arrangement density of the plurality of fluid supply holes 22 corresponding to the first heat generating portion Ia is higher than the arrangement density of the plurality of fluid supply holes 22 corresponding to the second heat generating portion Ib.

[0105] In other words, compared to the second heat generating section Ib, the first heat generating section Ia has a higher heat dissipation design efficiency, and by providing a larger number of fluid supply holes 22, which are jet collision holes, and arranging them more densely, the heat dissipation efficiency can be improved.

[0106] The specific arrangement of the fluid supply holes 22 can be determined based on the heat flux (HF). Here, the relationship of the heat flux is as follows: Flux (HF) = Thermal Design Power (TDP) / Surface area of ​​heat generating part.

[0107] For example, the heat flux (HF1) of the first heat generating portion Ia=the thermal design efficiency (TDP1) of the first heat generating portion Ia / the surface area of ​​the upper surface of the first heat generating portion Ia.

[0108] Similarly, the heat flux (HF2) of the second heat generating portion Ib = the thermal design efficiency (TDP2) of the second heat generating portion Ib / the surface area of ​​the upper surface of the second heat generating portion Ib.

[0109] When the heat flux (HF1) of the first heat generating portion Ia is greater than the heat flux (HF2) of the second heat generating portion Ib, the arrangement density (ρ1) of the multiple fluid supply holes Ps corresponding to the first heat generating portion Ia is greater than the arrangement density (ρ2) of the multiple fluid supply holes Ps corresponding to the second heat generating portion Ib.

[0110] In other embodiments using a closed cold plate, thermal control can also be performed for multiple chiplets with different thermal design efficiencies.

[0111] First, reference will be made to Fig. 5A, which is a cross-sectional view showing a sixth embodiment of a cooling system for a heterogeneous integrated semiconductor packaging structure of the present invention.

[0112] The cooling system of the heterogeneous integrated semiconductor packaging structure shown in Figure 5A further includes a fluid supply module 8. The heterogeneous integrated semiconductor packaging structure I also includes a first heat generating part Ia and a second heat generating part Ib, and the heat dissipation design efficiency of the first heat generating part Ia is greater than the heat dissipation design capacity of the second heat generating part Ib.

[0113] The cooling component 2 also has a first fluid chamber C1 and a second fluid chamber C2, with the first fluid chamber C1 corresponding to the first heat generating portion Ia and the second fluid chamber C2 corresponding to the second heat generating portion Ib.

[0114] However, in this embodiment, the first heat generating portion Ia and the second heat generating portion Ib can perform heat control by adjusting the flow rate of the cooling fluid in the first fluid chamber C1 and the second fluid chamber C2, respectively.

[0115] That is, this can be achieved by controlling the flow rate of the cooling fluid supplied to the first fluid chamber C1 by the fluid supply module 8 to be greater than the flow rate of the cooling fluid supplied to the second fluid chamber C2.

[0116] In the embodiment of FIG. 5A, the fluid supply module 8 includes a fluid supply pump 81 , a fluid distribution valve 82 , a first inlet pipe 83 , a second inlet pipe 84 , a first outlet pipe 87 , and a second outlet pipe 88 .

[0117] Both ends of the first inlet pipe 83 are connected to the fluid distribution valve 82 and the most upstream side of the first fluid chamber C1 (meaning the leftmost side in the embodiment of FIG. 5A, since the fluid flows from left to right as shown by the arrows), and both ends of the second inlet pipe 84 are connected to the fluid distribution valve 82 and the most upstream side of the second fluid chamber C2.

[0118] One end of the first outlet pipe 87 is connected to the most downstream side of the first fluid chamber C1, and the other end is connected to a liquid storage tank (not shown). Similarly, one end of the second outlet pipe 88 is connected to the most downstream side of the second fluid chamber C2, and the other end is connected to a fluid storage tank (not shown).

[0119] Here, the fluid distribution valve 82 may be a proportional flow control valve, which is a device that controls the flow of fluids (liquids and gases) by electronic signals.

[0120] The specific operation of this embodiment is as follows: The fluid supply pump 81 supplies cooling fluid to the fluid distribution valve 82, which then distributes the cooling fluid to the most upstream side of the first fluid chamber C1 and the most upstream side of the second fluid chamber C2 based on a predetermined ratio.

[0121] Here, since a "partition wall" (not shown) is provided between the first fluid chamber C1 and the second fluid chamber C2, the cooling fluid that has undergone heat exchange in the first fluid chamber C1 flows out through the first outlet pipe 87. In addition, the cooling fluid that has undergone heat exchange in the second fluid chamber C2 flows out through the second outlet pipe 88.

[0122] However, in this embodiment, the heat dissipation design efficiency of the first heat-generating part Ia needs to be higher than the heat dissipation design efficiency of the second heat-generating part Ib, so the fluid distribution valve 82 needs to distribute the cooling fluid at a ratio such that the flow rate of the cooling fluid supplied to the first inlet pipe 83 is greater than the flow rate of the cooling fluid supplied to the second inlet pipe 84.

[0123] Next, a description will be given with reference to FIG. 5B, which is a cross-sectional view showing a seventh embodiment of the cooling system for a heterogeneous integrated semiconductor packaging structure of the present invention. The main difference between this embodiment and the embodiment of FIG. 5A is that the fluid supply pump 81 and the fluid distribution valve 82 in the embodiment of FIG. 5A are replaced with a first fluid supply pump 85 and a second fluid supply pump 86.

[0124] Here, the first fluid supply pump 85 is dedicated to supplying cooling fluid to the first fluid chamber C1, and the second fluid supply pump 86 is dedicated to supplying cooling fluid to the second fluid chamber C2.

[0125] Similarly, the flow rate of the cooling fluid supplied by the first fluid supply pump 85 to the first fluid chamber C1 is greater than the flow rate of the cooling fluid supplied by the second fluid supply pump 86 to the second fluid chamber C2.

[0126] In this embodiment, the first fluid supply pump 85 and the second fluid supply pump 86 may be configured as pumps that supply different volumes of flow rate, or pumps that can switch the flow rate they supply may be used.

[0127] Next, a description will be given with reference to Fig. 5C, which is a cross-sectional view showing an eighth embodiment of the cooling system of the heterogeneous integrated semiconductor packaging structure of the present invention.

[0128] 5A and 5B is that the first inlet tube 83 and the second inlet tube 84 of this embodiment have different diameters. The flow rates of the cooling fluid entering the first fluid chamber C1 and the second fluid chamber C2 are controlled by the difference in tube diameter.

[0129] More specifically, as shown in FIG. 5C, the fluid supply module 8 includes a fluid supply pump 81, a first inlet pipe 83, a second inlet pipe 84, a first outlet pipe 87, and a second outlet pipe 88.

[0130] Both ends of the first inlet pipe 83 are connected to the fluid supply pump 81 and the upstream side of the first fluid chamber C1, respectively. Both ends of the second inlet pipe 84 are connected to the fluid supply pump 81 and the upstream side of the second fluid chamber C2, respectively.

[0131] One end of the first outlet pipe 87 is connected to the downstream side of the first fluid chamber C1, and the other end is connected to a fluid storage tank (not shown). Similarly, one end of the second outlet pipe 88 is connected to the downstream side of the second fluid chamber C2, and the other end is connected to a fluid storage tank (not shown).

[0132] In this way, the fluid supply pump 81 can supply cooling fluid to the upstream side of the first fluid chamber C1 and the upstream side of the second fluid chamber C2 via the first inlet pipe 83 and the second inlet pipe 84, respectively.

[0133] The cooling fluid in the first fluid chamber C1 and the second fluid chamber C2 can also be discharged via a first outlet pipe 87 and a second outlet pipe 88.

[0134] In this embodiment, the pipe diameters of the first inlet pipe 83 and the first outlet pipe 87 are larger than the pipe diameters of the second inlet pipe 84 and the second outlet pipe 88. Furthermore, a "partition wall" (not shown) is provided between the first fluid chamber C1 and the second fluid chamber C2, so that the cooling fluid that has flowed into the first fluid chamber C1 cannot move to the second fluid chamber C2.

[0135] Therefore, the flow rate of cooling fluid entering the first fluid chamber C1 is greater than the flow rate of cooling fluid entering the second fluid chamber C2.

[0136] Next, a description will be given with reference to Fig. 5D, which is a cross-sectional view showing a ninth embodiment of the cooling system of the heterogeneous integrated semiconductor packaging structure of the present invention.

[0137] 5A to 5C is that the opening size of the inlet hole 831 of the first fluid chamber C1 in this embodiment is different from the opening size of the inlet hole 841 of the second fluid chamber C2. These different opening sizes control the flow rates of the cooling fluids that flow into the first fluid chamber C1 and the second fluid chamber C2.

[0138] More specifically, the fluid supply module 8 includes a fluid supply pump 81 , a first inlet pipe 83 , a second inlet pipe 84 , a first outlet pipe 87 , and a second outlet pipe 88 .

[0139] Both ends of the first inlet pipe 83 are connected to the fluid supply pump 81 and the upstream side of the first fluid chamber C1, respectively. Both ends of the second inlet pipe 84 are connected to the fluid supply pump 81 and the upstream side of the second fluid chamber C2, respectively.

[0140] One end of the first outlet pipe 87 is connected to the downstream side of the first fluid chamber C1, and the other end is connected to a fluid storage tank (not shown).

[0141] Similarly, one end of the second outlet pipe 88 is connected to the downstream side of the second fluid chamber C2, and the other end is connected to a fluid storage tank (not shown).

[0142] Thus, the fluid supply pump 81 can supply cooling fluid to the first fluid chamber C1 and the second fluid chamber C2 via the first inlet pipe 83 and the second inlet pipe 84, respectively.

[0143] The cooling fluid in the first fluid chamber C1 and the second fluid chamber C2 can also exit through a first outlet pipe 87 and a second outlet pipe 88.

[0144] In this embodiment, the diameter of the inlet hole 831 of the first fluid chamber C1 is larger than the diameter of the inlet hole 841 of the second fluid chamber C2.

[0145] Therefore, the flow rate of cooling fluid entering the first fluid chamber C1 is greater than the flow rate of cooling fluid entering the second fluid chamber C2.

[0146] As described above, in the embodiment shown in Figures 5A to 5D, the cooling component 2 can be configured to include a first fluid chamber C1 and a second fluid chamber C2 for each of the first heat-generating portion Ia and the second heat-generating portion Ib on the heterogeneous integrated semiconductor packaging structure I, and the cooling system of the heterogeneous integrated semiconductor packaging structure can supply cooling fluid at different flow rates to each of the first fluid chamber C1 and the second fluid chamber C2, and the flow rates can be set based on the heat dissipation design efficiency of each of the first heat-generating portion Ia and the second heat-generating portion Ib.

[0147] High heat dissipation design efficiency means that the heat generating part generates a higher temperature. Therefore, by supplying a larger flow rate of cooling fluid to the fluid chamber corresponding to the heating part, the temperature of the heterogeneous integrated semiconductor packaging structure I can be kept as constant as possible and thermal crosstalk can be avoided.

[0148] Next, a description will be given with reference to Figures 6A and 6B. Figure 6A is a perspective view showing a tenth embodiment of the cooling system for a heterogeneous integrated semiconductor packaging structure of the present invention. Figure 6B is a cross-sectional view showing the tenth embodiment of the cooling system for a heterogeneous integrated semiconductor packaging structure of the present invention.

[0149] As shown in FIGS. 6A and 6B, this embodiment includes a fluid storage unit 60, a fluid supply module 61, and a fluid recovery module 62.

[0150] A cooling fluid is stored in the fluid storage unit 60. The fluid supply module 61 includes a liquid supply pump 610 and a fluid supply pipeline 63.

[0151] The fluid recovery module 62 includes a gas recovery pump 620 and a fluid recovery pipeline 64. The fluid supply pipeline 63 and the fluid recovery pipeline 64 are connected at their ends to the fluid storage unit 60 and the cooling component 2, respectively.

[0152] In addition, a liquid supply pump 610 is provided between the pair of fluid supply pipelines 63 so as to connect them, and a gas recovery pump 620 is provided between the pair of fluid recovery pipelines 64 so as to connect them.

[0153] Here, the cooling system of the heterogeneous integrated semiconductor packaging structure supplies cooling fluid to the cooling component 2 via a liquid supply pump 610 and a fluid supply pipeline 63. Then, the evaporated cooling fluid is sucked from the cooling component 2 via a gas recovery pump 620 and a fluid recovery pipeline 64.

[0154] 6(B), the cooling member 2 includes a cooling chamber 27 and a collection chamber 28. The two are connected via a plurality of through holes 270.

[0155] Based on the above configuration, when faced with the requirements of high performance computing (HPC), the temperature of the heterogeneous integrated semiconductor packaging structure I may rise to a temperature high enough to evaporate the cooling fluid, so a method such as two-phase immersion cooling, in which gas and liquid cooling fluids coexist, may be used.

[0156] At this time, when the liquid cooling fluid in the cooling chamber 27 provided below is heated and evaporated, the evaporated gas rises. As a result, the gaseous cooling fluid passes through the multiple through-holes 270 and flows into the recovery chamber 28 provided above the cooling chamber 27. The gas recovery pump 620 of this embodiment can pump the gaseous cooling fluid out of the recovery chamber 28.

[0157] As described above, in this embodiment, cooling fluid can be continuously supplied to the cooling component 2 via the liquid supply pump 610 and the fluid supply pipeline 63. Then, evaporated cooling fluid can be removed from the cooling component 2 via the gas recovery pump 620 and the fluid recovery pipeline 64.

[0158] This forces the liquid and gaseous cooling fluids to circulate, maintaining excellent heat dissipation. Additionally, in other embodiments, a condenser or other heat exchanger (not shown) may be added to the fluid return pipeline 64, which may be a fan-equipped fin heat exchanger, to dissipate heat from the circulating gaseous cooling fluid and condense it into a liquid cooling fluid.

[0159] On the other hand, due to the following factors, when the cooling element 2 is operated for a long time, the channels and internal holes of the cooling element 2 gradually narrow, and in the worst case, may even become completely blocked.

[0160] For example, metal chips generated during the manufacturing process of the cooling component 2 may not be cleaned, impurities may leak from the body of the cooling component 2, the coolant itself may contain impurities, or microorganisms may be growing in the microchannels or coolant.

[0161] If these symptoms occur, it may affect the heat dissipation effect of the cooling component 2, or the cooled semiconductor packaging structure may become too hot or even malfunction and burn.

[0162] In order to solve the above problems, the following embodiment is provided, which will be described with reference to Fig. 7. Here, Fig. 7 is a perspective view showing an eleventh embodiment of a cooling system for a heterogeneous integrated semiconductor packaging structure of the present invention.

[0163] The embodiment shown in FIG. 7 comprises a cooling component 2 , a fluid storage unit 71 , a fluid supply pipeline 72 , a fluid return pipeline 73 , a first fluid pump 74 and a second fluid pump 75 .

[0164] The cooling component 2 may also include a hollow chamber C. A cooling fluid is stored in the fluid storage unit 71. Both ends of a fluid supply pipeline 72 are connected to the fluid storage unit 71 and the hollow chamber C of the cooling component 2, respectively. Both ends of a fluid return pipeline 73 are connected to the fluid storage unit 71 and the hollow chamber C of the cooling component 2, respectively.

[0165] The first fluid pump 74 is provided between the pair of fluid supply pipelines 72 to connect them, and the second fluid pump 75 is provided between the pair of fluid return pipelines 73 to connect them.

[0166] Here, the cooling system of the heterogeneous integrated semiconductor packaging structure can supply cooling fluid to the hollow chamber C of the cooling component 2 in the direction of the solid arrow via the first fluid pump 74 and the fluid supply pipeline 72. The cooling fluid can also be supplied to the hollow chamber C of the cooling component 2 from the fluid recovery pipeline 73 in the direction of the hollow arrow via the second fluid pump 75.

[0167] Specifically, when the system is operating normally, the second fluid pump 75 is stopped, and the cooling fluid is supplied to the cooling component 2 by the first fluid pump 74 through the fluid supply pipeline 72. The cooling fluid is forced to circulate by the first fluid pump to dissipate heat. The cooling fluid is returned to the fluid storage unit 71 through the fluid recovery pipeline 73.

[0168] On the other hand, when it is desired to thoroughly wash the inside of the cooling component 2 by forcefully spraying fluid into the internal flow paths and internal holes, the first fluid pump 74 is stopped.

[0169] Then, when the second fluid pump 75 is driven, the cooling fluid is supplied to the cooling component 2 via the second fluid pump 75 through the fluid recovery pipeline 73 and returned to the fluid storage unit 71 via the fluid supply pipeline 72.

[0170] Therefore, the second fluid pump 75 generates a flow of cooling fluid in a direction opposite to that of normal operation.

[0171] Therefore, by flowing fluid from another direction, solid remains in blind spots that would be missed if fluid was flowing only from one side, and solid remains stuck to the interior or walls of the fluid supply pipeline 72 and the fluid recovery pipeline 73, can be effectively washed away. In another embodiment, a filter member (not shown) may be placed in the fluid supply pipeline 72 or the fluid recovery pipeline 73 to filter out foreign matter and impurities that are washed away. In this way, according to this embodiment, foreign matter and impurities that adhere to the cooling component 2, the fluid supply pipeline 72, and the fluid recovery pipeline 73 can be removed, so the momentum of the fluid flow can be maintained high, and a high heat dissipation effect can be obtained for a long period of time.

[0172] Additionally, in other embodiments, the first fluid pump 74 and the second fluid pump 75 may be bidirectional pumps, allowing the flow direction to be switched.

[0173] That is, by utilizing a bidirectional pump, during normal operation, both the first fluid pump 74 and the second fluid pump 75 can operate and drive fluid in the same direction, for example, counterclockwise as indicated by the solid arrow in FIG. 7.

[0174] On the other hand, when it is necessary to flush the inside of the cooling component 2, the second fluid pump 75 is also activated in addition to the first fluid pump 74. However, after switching the flow direction, these two pumps flow the cooling fluid in opposite directions, such as the clockwise direction indicated by the white arrow in Figure 7. Note that in this embodiment using a bidirectional pump, it is also possible to configure the system with only one bidirectional pump.

[0175] Incidentally, many conventional liquid cooling systems employ a separation method for operational monitoring, and are independent of the computing system they are intended to cool, such as a server, with no information exchanged between them.

[0176] In other words, the liquid cooling system's liquid temperature sensing, flow rate monitoring and distribution, cooling fluid pressure drop sensing, and real-time control of the fluid-driven pump are all performed solely by the cooling system and do not communicate in real-time with the server system (not shown).

[0177] Therefore, if an abnormality occurs in the server system, the cooling system cannot detect it immediately and respond in time.Similarly, if an abnormality occurs in the cooling system, the server system cannot detect it immediately and respond in time.

[0178] Furthermore, conventional liquid cooling systems are independent of the computer systems they are intended to cool, such as servers. This means that sensors associated with conventional cooling systems cannot be integrated into the computing system, which means that the wiring for the sensors tends to be complicated and cumbersome, resulting in increased maintenance effort and costs.

[0179] To solve the above-mentioned problems, an embodiment of the present invention will be described with reference to Fig. 8. Here, Fig. 8 is a block diagram showing a twelfth embodiment of the cooling system for a heterogeneous integrated semiconductor packaging structure of the present invention.

[0180] The cooling system of this embodiment further includes a controller 11, a plurality of sensors 12, a fluid driving unit 13, and cooling distribution units (CDU) 14.

[0181] The controller 11 may be a microprocessor on a server mainboard, a system on a chip (SOC), a microcontroller, a field programmable gate array (FPGA), an application specific integrated circuit (ASIC), or other controller or processor on a motherboard.

[0182] In a particular embodiment, a baseboard management controller (BMC) may be used.

[0183] In this embodiment, the sensors 12 may include other sensors that monitor the condition of the cooling fluid, such as, but not limited to, leakage sensors, flow meters, pressure sensors, and fluid temperature sensors.

[0184] In this embodiment, the fluid driving unit 13 is suitable for supplying cooling fluid to the cooling component 2. The fluid driving unit 13 may include a driving circuit 131 and a pump 132. The driving circuit 131 is also used to control the on / off and operating state of the pump 132.

[0185] Additionally, a cooling fluid distribution system 14 may include, but is not limited to, a fluid storage tank, a radiator, a heat exchanger, a filter, etc., whichever is responsible for evenly distributing the cooling fluid throughout the system.

[0186] As shown in FIG. 8, the controller 11 is electrically connected to the sensor 12 and the fluid driving unit 13 .

[0187] That is, the control unit 11 can control the fluid driving unit 13 to supply cooling fluid to the cooling component 2 according to the detection result of the sensor 12.

[0188] For example, if the sensor 12 detects an abnormality such as a cooling fluid leak, the controller 11 can not only control the fluid driving unit 13 to stop the supply of cooling fluid, but also take necessary protective measures such as synchronously controlling the server system to shut down.

[0189] On the other hand, if an abnormality occurs in the server system, such as the processor temperature being too high, the controller 11 can control the fluid driving unit 13 to increase the flow rate of the cooling fluid or to lower the temperature of the cooling fluid. In another embodiment, when the server system is shut down, the controller 11 can control the entire cooling system to stop operation.

[0190] In short, the controller 11 on the motherboard can coordinate the operation between the cooling system of the heterogeneous integrated semiconductor packaging structure and the server system, achieving real-time monitoring of the temperature, flow rate, pressure, leakage, etc. at the board level. In this way, the temperature, flow rate, and pressure of the cooling fluid can be controlled in a timely manner according to the sensing results, thereby maintaining the system at optimal performance and avoiding serious system failures.

[0191] Furthermore, the controller 11 on the motherboard can also control the cooling system of the heterogeneous integrated semiconductor packaging structure to perform corresponding operations according to the operating status of the server system, such as starting operation, stopping operation, increasing the flow rate of the cooling fluid, increasing the temperature of the cooling fluid, decreasing the flow rate of the cooling fluid, or decreasing the temperature of the cooling fluid, etc.

[0192] Furthermore, since each sensor 12 is located on the same circuit board as the server's electronic components, the cost of wiring the sensors can be reduced and the complexity of the sensor wiring can be reduced.

[0193] Furthermore, the cooling system of the heterogeneous integrated semiconductor packaging structure of this embodiment can further realize remote control, for example, the controller 11 and the cooling liquid distribution device 14 are connected to a remote device 15.

[0194] The cooling system and server system of the heterogeneous integrated semiconductor packaging structure can be remotely managed and monitored via a remote device 15 .

[0195] In the cooling system of the heterogeneous integrated semiconductor packaging structure, when an abnormality occurs in the server system, the controller 11 immediately notifies the remote device 15 and takes immediate action.

[0196] An embodiment of the present invention will be described with reference to Figures 9A and 9B. Figure 9A is a cross-sectional view of a cooling component showing a thirteenth embodiment of a cooling system for a heterogeneous integrated semiconductor packaging structure of the present invention. Figure 9B is a cross-sectional view of a cooling component showing a fourteenth embodiment of a cooling system for a heterogeneous integrated semiconductor packaging structure of the present invention.

[0197] Conventional liquid cooling systems use a cold plate to cool electronic components, and by creating a flow path inside the cold plate, the contact area between the coolant and the cold plate is increased, thereby improving cooling efficiency.

[0198] However, conventional flow channel designs typically employ a parallel flow channel arrangement, with adjacent flow channels having the same coolant flow direction.

[0199] This flow path design improves heat dissipation efficiency. However, the temperature distribution in typical semiconductor packaging structures is often uneven. For example, the area near the water inlet has a low temperature, while the area near the water outlet has a high temperature.

[0200] To solve the above problems, the embodiment shown in Figures 9A and 9B provides a novel flow path design in the cooling element 2, which not only significantly improves the heat exchange efficiency but also makes the temperature distribution of the cooling element 2 uniform.

[0201] Referring to FIG. 9A, the cooling component 2 includes a first inlet Pi1, a first outlet Po1, a second inlet Pi2, a second outlet Po2, a plurality of first fluid passages CH1, and a plurality of second fluid passages CH2.

[0202] The first inlet Pi and the first outlet Po1 are located on corresponding sides of the cooling element 2. In FIG. 9, they are located on the lower right and left sides, respectively. The second inlet Pi2 and the first outlet Po1 are both located on the left side of the cooling element. The second outlet Po2 and the first inlet Pi1 are both located on the right side of the cooling element.

[0203] Furthermore, both ends of the first fluid passage CH1 are connected to a first inlet Pi1 and a first outlet Po1, respectively, and both ends of the second fluid passage CH2 are connected to a second inlet Pi2 and a second outlet Po2, respectively.

[0204] The first fluid passage CH1 and the second fluid passage CH2 are arranged in a staggered pattern in parallel within the cooling component 2. The first fluid passage CH1 and the second fluid passage CH2 are arranged in separate layers, or are formed in a single layer but offset in the height direction. In this embodiment, the second fluid passage CH2 flows on the lower side and the first fluid passage CH1 flows on the upper side, and the fluids flowing therethrough are designed not to mix. Note that, since it is sufficient to separate the first fluid passage CH1 and the second fluid passage CH2 into two layers or to offset them in the height direction so that the liquids in the first fluid passage CH1 and the second fluid passage CH2 do not mix, it is also acceptable to arrange the first fluid passage CH1 to be on the lower side and the second fluid passage CH2 to flow above it.

[0205] Generally, the longer the first fluid passage CH1 and other flow paths are, the lower the heat dissipation effect. However, in this embodiment, the fluid flows between the first inlet Pi1 and the first outlet Po1 without being turned back. Therefore, although there is a difference between the cooling component 2 and the fluid component 5, which is also used for cooling, the flow path can be shorter than in the embodiment of the flow path component 5 of Figure 3, in which a single flow path is turned back and formed in the opposite direction, resulting in higher heat dissipation efficiency.

[0206] With this configuration, the flow directions of the cooling fluid in the adjacent first fluid passage CH1 and second fluid passage CH2 can be reversed, making the temperature distribution of the cooling component 2 relatively uniform and preventing extremely hot spots from occurring, making it less likely that the heterogeneous integrated semiconductor packaging structure I will become too hot, malfunction, or burn.

[0207] Here, the temperature of the cooling fluid at the first inlet Pi1 and the second inlet Pi2 is relatively low, so as the cooling fluid flows along the first flow passage CH1 and the second flow passage CH2, it continuously exchanges heat with the main body of the cooling component 2. As a result, the cooling fluid flows to the first outlet Po1 and the second outlet Po2 and reaches its highest temperature near them.

[0208] However, the first inlet Pi1 and the second inlet Pi2, into which a low-temperature fluid flows, are arranged immediately adjacent to the first outlet Po1 and the second outlet Po2 so that the temperatures are offset and extremely hot spots are unlikely to occur, making it difficult for the heterogeneous integrated semiconductor packaging structure I to become too hot, malfunction, or burn.

[0209] Therefore, according to the configuration of the above embodiment, it is possible to make the temperature at various points in the cooling component 2 almost uniform. The uniformity of the temperature distribution on the surface of the heterogeneous integrated semiconductor packaging structure I is improved.

[0210] Furthermore, in the embodiment shown in FIG. 9B, the cooling section 2 includes a first inlet Pi1, a first outlet Po1, a second inlet Pi2, a second outlet Po2, a first spiral flow path CS1, and a second spiral flow path CS2.

[0211] Of these, the first inlet Pi1 and the first outlet Po1 are located at both ends of the first spiral channel CS1, and the second inlet Pi2 and the second outlet Po2 are located at both ends of the second spiral channel CS2.

[0212] Here, the first inlet Pi1 and the second outlet Po2 are located approximately at the center of the cooling component 2, and the first outlet Po1 and the second inlet Pi2 are located at two corners that are diagonally opposite each other of the cooling component 2, and are located at the farthest distance from each other.

[0213] Furthermore, the second spiral channel CS2 spirally surrounds the first spiral channel CS1 along the first spiral channel CS1, and the cooling fluid flows in opposite directions between the first spiral channel CS1 and the second spiral channel CS2 that are adjacent to each other. In other words, the first spiral channel CS1 and the second spiral channel CS2 are formed alternately from the center to the outside.

[0214] Therefore, in this embodiment, even if the cooling component 2 is not limited to a parallel flow path configuration, it is possible to achieve a substantially uniform temperature distribution, as in Fig. 9A. Furthermore, unlike the configuration in Fig. 9A, there is no need to form a two-layer structure or a single layer with offset height, which simplifies the formation method. In addition, there is no difference in height that would occur if two layers were formed or if a single layer was formed with offset height, so cooling can be achieved with both the first spiral flow path CS1 and the second spiral flow path CS2 in direct contact with each other.

[0215] Furthermore, in other embodiments, the flow path design can have other geometries, and the number of cooling fluid inlets and outlets is not limited to two; having more inlets and outlets generally increases the heat dissipation efficiency, as the cooled liquid can be released before it has fully heated up.

[0216] The description will be made with reference to Fig. 10. Here, Fig. 10 is a cross-sectional view illustrating a coating process showing a fifteenth embodiment of the cooling system for a heterogeneous integrated semiconductor packaging structure of the present invention.

[0217] Because copper has a high thermal conductivity, most conventional liquid cooling plates (cooling component 2) are made of copper.

[0218] However, the flow channels in conventional copper liquid cooling plates are generally made by machining methods such as die casting, shoveling, or cutting with a milling machine, which tends to result in a rough surface, resulting in a high coefficient of friction and large pressure losses when the cooling fluid flows through them.

[0219] To solve these problems, conventional techniques have increased fluid pressure by operating pumps at high speeds, but this increases power consumption, which increases costs and the risk of cooling fluid leaking.

[0220] On the other hand, because copper is prone to oxidation, it is common to prevent copper oxidation by adding a nickel plating layer to the surface of the flow path using electroplating. However, because the thermal conductivity of nickel (97.5 W / mK) is much lower than that of copper (398 W / mK), adding a nickel plating layer reduces the efficiency of the liquid cooling plate (cooling component 2).

[0221] To solve the above problems, the embodiment shown in Figure 10 provides a new coating method for the cooling fluid flow paths in the cooling component 2. The coating in this embodiment has high thermal conductivity (approximately 400 to 1000 W / mK).

[0222] This value is even higher than that of the cooling element 2 made of copper, so it does not affect the heat exchange effect or heat dissipation effect.

[0223] Furthermore, this coating can significantly reduce the roughness of the flow passage surface and effectively suppress the pressure drop of the cooling fluid.

[0224] In addition, the coating on the surface of the flow path is extremely fine, which suppresses the growth of microorganisms, makes it difficult for foreign matter to adhere, makes it difficult for the flow path to become clogged, and significantly improves the lifespan, allowing for excellent heat dissipation effects to be achieved over a long period of time.

[0225] The following describes the hardware configuration and related procedures required for the coating process in the fifteenth embodiment of the present invention. As shown in Fig. 10, the cooling component 2 includes a flow path 29, a fluid inlet 91, and a fluid outlet 92. Both ends of the flow path 29 are connected to the fluid inlet 91 and the fluid outlet 92, respectively.

[0226] Furthermore, the fluid inlet 91 is connected to a precursor gas supply 93 .

[0227] The fluid outlet 92 is connected to a negative pressure generator 94. The cooling component 2 is electrically connected to a power supply 95, the negative terminal of which is connected to the cooling component 2 and the positive terminal of which is grounded.

[0228] In this embodiment, the cooling component 2 is first evacuated by the negative pressure generator 94 .

[0229] Next, the precursor gas is supplied from the precursor gas supply device 93 into the cooling part 2, and the flow rate of the precursor gas is controlled. -1 ~10 -4 torr.

[0230] Here, the precursor gas includes, but is not limited to, alkanes, alkynes, silane, TEOS (tetraethoxysilane), etc. Next, when the power supply device 95 is started, plasma is generated on the inner wall surface of the flow path 29 of the cooling component 2, and a diamond-like film 90 is deposited on the inner wall surface of the flow path 29 of the cooling component 2.

[0231] The following provides the process parameters for this embodiment: power supply 95 provides pulsed DC at a voltage between 350 and 1000 volts.

[0232] The pulse period is between 5 μs and 35 μs, and the pulse rate is 21 KHz. The flow rate of the precursor gas supplied by the precursor gas supply device 93 may be between 2 sccm and 7 sccm.

[0233] In another embodiment, argon gas (Ar) may be first introduced before the precursor gas enters the flow passage 29 of the cooling element 2. A plasma cleaning step is first performed to remove organic contaminants on the surfaces of the flow passage 29.

[0234] Furthermore, after the plasma cleaning step, silane gas can be introduced first before the precursor gas is introduced into the flow passage 29 of the cooling element 2. A layer of amorphous silicon film is first pre-coated to improve the adhesion of the subsequent diamond-like film 90.

[0235] As described above, the diamond-like film 90 in the above embodiment has at least the following advantages: The diamond-like film 90 is dense, has a smooth surface, and has a low coefficient of friction, and can effectively suppress pressure drop.

[0236] Here, the diamond-like film 90 has high thermal conductivity, which can improve heat dissipation efficiency. In addition, the diamond-like film 90 has high hardness, so even when using nanofluid cooling technology in which nanoparticles are added to the coolant, it can withstand the high-speed collision of nanoparticles and reduce wear on the inner wall.

[0237] The diamond-like film 90 is corrosion-resistant and has a surface roughness smaller than the size of bacteria, which prevents the adhesion and proliferation of microorganisms. The diamond-like film 90 is also produced using a vacuum deposition method, which eliminates the need for waste liquid discharge and disposal, and is less likely to have a negative impact on the environment.

[0238] Although the present invention has been described above through the present embodiments, these embodiments are not intended to limit the scope of the present invention. Furthermore, those skilled in the art may make minor modifications and embellishments without departing from the spirit and scope of the present invention, and such modifications are also within the technical scope of the present invention. Furthermore, the technical scope of the present invention is defined by the claims. [Explanation of symbols]

[0239] 2 Cooling components 3 Enhanced Support 4 Cooling fluid drive module 5 Flow path parts 6 compression springs 7. Barb 8 Fluid Supply Module 11 Controller 12 sensors 13 Fluid drive unit 14 Cooling liquid distribution device 15 Remote Device 20 Inner Chamber 21 Aperture 22 Fluid supply hole 23 Main fluid chamber 24 fluid supply chamber 25 Fluid Collection Chamber 26 Fluid recovery hole 27 Cooling Chamber 28 Recovery Chamber 29 Flow path 31 Thermally conductive fasteners 32 Heat sink 33 Reinforcement plate 34 Aperture 41 Cooling fluid passage 51 Fluid passage 52 Protrusion 53 First protrusion sealing unit 54 Second protrusion sealing unit 55 Oxygen-free copper sealing parts 60 Fluid Storage Unit 61 Fluid Supply Module 62 Fluid Recovery Module 63 Fluid Supply Pipeline 64 Fluid Recovery Pipeline 70 Set screw 71 Fluid Storage Unit 72 Fluid Supply Pipeline 73 Fluid Recovery Pipeline 74 First Fluid Pump 75 Second fluid pump 81 Fluid supply pump 82 Fluid Distribution Valve 83 First inlet pipe 84 Second inlet pipe 85 First fluid supply pump 86 Second fluid supply pump 87 First outlet pipe 88 Second outlet pipe 90 Diamond-like film 91 Fluid inlet 92 Fluid outlet 93 Precursor gas supply device 94 Negative pressure generator 95 Power supply device 131 Drive circuit 132 Pump 201 Perforation 270 Through Hole 610 Liquid Supply Pump 620 Gas Recovery Pump 831 Entrance hole 841 Entrance hole B Circuit board B1 through hole B2 through hole C. Hollow chamber C1 First fluid chamber C2 Second fluid chamber CH1 First fluid passage CH2 Second fluid passage CS1 First spiral channel CS2 Second spiral channel I. Heterogeneous integrated semiconductor packaging structure Ia First heating element Ib Second heating element S-chip socket Pi1 First Entrance Pi2 Second Entrance Po1 1st Exit Po2 Second Exit

Claims

1. A cooling system for a heterogeneous integrated semiconductor packaging structure, the heterogeneous integrated semiconductor packaging structure being disposed on a circuit board, the cooling system includes a cooling component and a fluid supply module disposed on the heterogeneous integrated semiconductor packaging structure; the heterogeneous integrated semiconductor packaging structure includes a first heat generating portion and a second heat generating portion, and a heat dissipation design efficiency of the first heat generating portion is higher than a heat dissipation design efficiency of the second heat generating portion; the cooling component includes a first fluid chamber and a second fluid chamber; the first fluid chamber corresponds to the first heat generating portion, and the second fluid chamber corresponds to the second heat generating portion; the fluid supply module is configured to supply a cooling fluid to the first fluid chamber and the second fluid chamber; The fluid supply module supplies the cooling fluid to the first fluid chamber at a flow rate greater than the cooling fluid to the second fluid chamber. A cooling system for a heterogeneous integrated semiconductor packaging structure, comprising:

2. A cooling system for a heterogeneous integrated semiconductor packaging structure, the heterogeneous integrated semiconductor packaging structure being disposed on a circuit board, the cooling system includes a cooling component and a fluid supply module disposed on the heterogeneous integrated semiconductor packaging structure; the heterogeneous integrated semiconductor packaging structure includes a first heat generating portion and a second heat generating portion, and a heat dissipation design efficiency of the first heat generating portion is higher than a heat dissipation design efficiency of the second heat generating portion; the cooling component includes a first fluid chamber and a second fluid chamber; the first fluid chamber corresponds to the first heat generating portion, and the second fluid chamber corresponds to the second heat generating portion; the fluid supply module includes a fluid supply pump, a fluid distribution valve, a first inlet pipe, and a second inlet pipe; the first inlet pipe has both ends connected to the fluid distribution valve and the first fluid chamber, and the second inlet pipe has both ends connected to the fluid distribution valve and the second fluid chamber, The fluid supply pump is configured to supply cooling fluid to the fluid distribution valve, and the fluid distribution valve is configured such that a flow rate of the cooling fluid supplied to the first inlet pipe is greater than a flow rate of the cooling fluid supplied to the second inlet pipe. A cooling system for a heterogeneous integrated semiconductor packaging structure, comprising:

3. A cooling system for a heterogeneous integrated semiconductor packaging structure, the heterogeneous integrated semiconductor packaging structure being disposed on a circuit board, the cooling system includes a cooling component and a fluid supply module disposed on the heterogeneous integrated semiconductor packaging structure; the heterogeneous integrated semiconductor packaging structure includes a first heat generating portion and a second heat generating portion, and a heat dissipation design efficiency of the first heat generating portion is higher than a heat dissipation design efficiency of the second heat generating portion; the cooling component includes a first fluid chamber and a second fluid chamber; the first fluid chamber corresponds to the first heat generating portion, and the second fluid chamber corresponds to the second heat generating portion; the fluid supply module includes a first fluid supply pump and a second fluid supply pump, the first fluid supply pump for supplying a cooling fluid to the first fluid chamber, and the second fluid supply pump for supplying the cooling fluid to the second fluid chamber; The flow rate of the cooling fluid supplied by the first fluid supply pump to the first fluid chamber is greater than the flow rate of the cooling fluid supplied by the second fluid supply pump to the second fluid chamber. A cooling system for a heterogeneous integrated semiconductor packaging structure, comprising:

4. A cooling system for a heterogeneous integrated semiconductor packaging structure, the heterogeneous integrated semiconductor packaging structure being disposed on a circuit board, the cooling system includes a cooling component and a fluid supply module disposed on the heterogeneous integrated semiconductor packaging structure; the heterogeneous integrated semiconductor packaging structure includes a first heat generating portion and a second heat generating portion, and a heat dissipation design efficiency of the first heat generating portion is higher than a heat dissipation design efficiency of the second heat generating portion; the cooling component includes a first fluid chamber and a second fluid chamber; the first fluid chamber corresponds to the first heat generating portion, and the second fluid chamber corresponds to the second heat generating portion; the fluid supply module includes a fluid supply pump, a first inlet pipe, and a second inlet pipe; the first inlet pipe communicating between the fluid supply pump and the first fluid chamber, and the second inlet pipe communicating between the fluid supply pump and the second fluid chamber; The diameter of the first inlet pipe is larger than the diameter of the second inlet pipe. A cooling system for a heterogeneous integrated semiconductor packaging structure, comprising:

5. A cooling system for a heterogeneous integrated semiconductor packaging structure, the heterogeneous integrated semiconductor packaging structure being disposed on a circuit board, the cooling system includes a cooling component and a fluid supply module disposed on the heterogeneous integrated semiconductor packaging structure; the heterogeneous integrated semiconductor packaging structure includes a first heat generating portion and a second heat generating portion, and a heat dissipation design efficiency of the first heat generating portion is higher than a heat dissipation design efficiency of the second heat generating portion; the cooling component includes a first fluid chamber and a second fluid chamber; the first fluid chamber corresponds to the first heat generating portion and has a first inlet hole, the second fluid chamber corresponds to the second heat generating portion and has a second inlet hole, the fluid supply module is configured to supply cooling fluid to the first fluid chamber and the second fluid chamber via the first inlet hole and the second inlet hole, respectively; The diameter of the first inlet hole is wider than the diameter of the second inlet hole. Cooling system for heterogeneous integrated semiconductor packaging structure.

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