Method and apparatus for generating a heat signature

Abstract

To provide a method and apparatus for generating a signature.SOLUTION: At least one thermal radiation emitting element, each of the at least one thermal radiation emitting elements extending between two spaced apart and opposing solid surfaces defined by two opposing electrodes; An array of carbon nanotubes (CNTs), the array being connected by its two opposite ends to the two opposing electrodes, respectively, and extending along a space between the electrodes, wherein the electrodes supply an electrical current through the thermal radiation emitting element to cause the thermal radiation emitting element to emit thermal radiation for generating a heat signature.SELECTED DRAWING: Figure 1

Description

[Technical Field]

[0001] The present invention relates to a method and apparatus for generating a thermal signature. [Background technology]

[0002] References believed to be relevant as background to the subject matter of this disclosure are listed below. Acknowledgement of references in this document as being relevant in any way to the patentability of the subject matter of this disclosure. It should not be concluded that this means

[0003] British Patent Application Publication No. 2274154 (Ian Hunter) to determine the infrared image of the vessel's surroundings and blend the vessel into its surroundings. Reflecting infrared radiation from the surroundings by a reflecting means that can pivot around a pivot point The document discloses that the infrared appearance of a vessel is altered by reflecting the reflected light. The stage is pivotable, allowing control over the manner in which the vessel's infrared appearance is changed. It is possible to visualize the infrared appearance of a ship against the background of a potential enemy's line of sight. By matching the reflectors, they can be made more difficult to detect by heat-seeking missiles. , semi-transparent to infrared radiation but opaque to visible radiation to reduce obscurity. and an inflatable envelope having a reflective surface, which may be covered with a band of material good.

[0004] International Publication No. 1996 / 004520, published February 15, 1996 (Donald James Highgate) for modifying the IR properties of objects. The present invention discloses a device having at least two distinct regions with different IR characteristics. a masking means for masking different portions of the surface; and a control means for operating the stage, and the masking means is controlled by the operation of the control means. Thus, two surfaces are arranged to provide the desired IR characteristics for the object to be detected at the remote point. The relative exposure of two or more regions is altered. The device has an inelastic surface composed of alternating low and high IR emissivity elements. The inner surface of the surface is bonded to the body, while the outer surface is formed with individual nitrogen-filled chambers. The mask is bonded to a polyethylene core divided into parallel inelastic strips. The strips are bonded to the outer surface of the core. These strips are made of low IR emissivity material. The interior is made of a material with a medium to low IR emissivity that is also colored in the visible light. The device is attached to the body for signaling to the remote detector. The coupling means is positioned above the surface to achieve the desired overall IR characteristics, and Relative motion is introduced at a known frequency to the detector, which is filtered at this frequency.

[0005] U.S. Patent No. 5,036,211 (Owen, issued July 30, 1991) S. Scott) means for reflecting and radiating electromagnetic energy in appropriate wavelength bands This means includes a surface that reflects energy in this wavelength range and a and an energy emitter that emits radiation from the surface. The combination of reflection and emission matches the background energy in this wavelength range. The emitter emits energy at such an intensity that these surfaces are camouflaged. The heater comprises a strip of material that heats up and radiates energy when an electric current is passed through it. This method also produces an electrical signal that is a function of the difference between the combined reflection and emission and the background. and further comprising at least one radiometer coupled to a comparison means for obtaining an electrical The signal controls the energization of the energy emitter.

[0006] U.S. Patent No. 6,613,420 (Leupo) published September 2, 2003 Iz et al. have proposed an infrared camera with a surface structure that has two groups of subregions. The first group of partial areas is directed downwards and the second group of partial areas is directed vertically. The second group of partial areas forms an angle α of 5° to 45° with respect to the , forming an angle β of 50° to 65° with respect to the vertical, and α + β < 90°.

[0007] U.S. Patent Application Publication No. 2009 / 0252982, published October 8, 2009 O'Keefe et al. have a surface texture with multiple reflective elements. The present invention discloses a sheet of heat reflective material, each element of which is substantially reflective at thermal infrared wavelengths. Each of the first facets is aligned with the plane (AB) of the sheet. and form an angle θ (0°<θ<90°). Preferably, the first facet is They are aligned so that thermal radiation is reflected from a common direction, away from cooler areas of the sky. By directing a sheet of heat-reflective material, a marking indicating a cold spot is created in the thermal imager. Materials can be provided.

[0008] https: / / www.telecom-bretagn on November 11, 2018 e.eu / data / Optique%20-%20PhD%20propositio "Applications of Liquid Crystal" taken from n.pdf s To Optical Camouflage Techniques In Th e Thermal Infrared Range”, PhD proposal n has revealed a camouflage technology that can adapt to the surrounding environment. In combat, these strategies allow a soldier or vehicle to have a decisive advantage over the enemy. In addition to camouflaging in the visible spectrum, they can be detected by observation systems such as infrared cameras. It also reduces reflected infrared IR radiance (thermal signature) to avoid detection A solution to this problem must be able to mitigate this signature. The use of an element with controlled IR reflection to allow for the liquid crystal material to be The purpose is to control the reflectance of the liquid crystal cell in the infrared spectrum. Three mechanisms using liquid crystals have been identified:

[0009] U.S. Patent Application Publication No. 2014 / 0125506, published May 8, 2014 At least one book (Peder Sjolund) is placed in a way that provides a predetermined heat distribution. The present invention discloses an apparatus for signature adaptation comprising one surface element, the surface element comprising: generating at least one predetermined temperature gradient across a portion of the at least one surface element; at least one temperature-generating element arranged to The surface element comprises at least one radar suppressing element, and the at least one radar suppressing element The element is configured to suppress reflection of incident radio waves. The present invention relates to an object that includes a device for a given application.

[0010] U.S. Patent No. 6,338,292 (Reyn) published January 15, 2002 Olds et al.) simulated the background infrared radiation of an object and the background visible radiation of an object. mimicking the visible spectrum and infrared by effectively hiding objects from detection First, the background on which the object appears is covered by the camouflage technique. The temperature and color are determined. The outer surface of the object, or a shield around the object, is then electrically Heating or cooling is achieved using a thermoelectric module that converts energy into a temperature gradient. The ability to cool or heat the joules allows the module output to be adjusted to the background temperature of the object. In combination with these thermocouples, this Light utilizes choleric liquid crystals to change the visible color of an object. The visible color can be changed by temperature, so the heating and cooling capabilities of the thermocouple can be used. This allows the color of the liquid crystal to be adjusted to match the background color of the object.

[0011] U.S. Patent No. 9,952,020 (Rene) published April 24, 2018 Schwarz discloses a method for visually adaptively camouflaging an object. and the background and / or surroundings in which the object is located and / or in front of which the object is located are: The background and / or the image are detected by a camera or a sensor array. Or the surroundings are reproduced as an image in a device for camouflaging an object.

[0012] International Publication No. 2011 / 000679, published on January 6, 2011 ( Rene Schwarz has developed a system for adaptive camouflage of objects, especially vehicles. The invention discloses a method for manufacturing a semiconductor device, comprising: The air drawn from the surroundings is drawn into the object before or during the supply to the layer. It can be controlled to a temperature that is at least approximately determined from the background.

[0013] Published at the 2010 Land Warfare Conference, Adaptive Camouflage Techniques for A Lig ht Armored Vehicle” (Wheaton, V., Vincent, I .and Dumas, J.) have historically used camouflage to It was revealed that the use of the tactical weapon was an important survival technique for equipment and personnel. In the military, camouflage is a craft specific to each soldier, platform, or installation. During World War II, industrially produced uniforms were developed as a distraction pattern. This has seen the development of patterned camouflage textiles for use on battlefields and nets. Presenting new challenges for traditional camouflage methods. Modern sensors can It can resolve extremely small differences between the object and the background, making it superior to traditional static camouflage. The strategy cannot maintain a close enough match to the environment unless the environment also remains static. To remain undetectable in a changing environment, camouflage systems must be adaptive. This study aims to clarify the adaptation of a lightly armored vehicle (Canadian Coyote) in a desert environment. Three techniques are being investigated: thermal signatures, Heat shielding covers for reducing solar heat transfer to vehicles and in the visible spectrum electrochromic cells to mimic chameleon-like behavior, and heat sealing Active thermal cells for dynamically generating disruptive heat patterns on the vehicle. By disrupting the silhouette and minimizing the difference in characteristics between the background and the vehicle, The goal is to create a system that reduces the visibility in the infrared and infrared spectrum. The paper presents results from a recent proof-of-concept study.

[0014] Nano letters, 2015, 15(12), pp.8365-8370 The published "Fast Adaptive Thermal Camouflage B ased On Flexible Vo2 / Graphene / Cnt Thin F ilms” (Xiao, L., Ma, H., Liu, J., Zhao, W., Jia, Y. .,Zhao,Q.,Liu,K.,Wu,Y.,Wei,Y.,Fan,S.and Jiang, K.) is a form of camouflage technology that allows the robot to blend naturally into the surrounding environment. Adaptive camouflage in thermal imaging has been a major challenge in the past few decades. They disclose that manipulating emissivity for thermal camouflage can effectively dissipate excessive heat. This is considered a more promising approach compared to simple temperature control, which must be dissipated. However, practical devices with active modulation of emissivity have not yet been fully investigated. This publication is based on the application of negative electrodes to graphene / carbon nanotube (CNT) thin films. The vanadium dioxide (VO2) layer with a differential thermal emissivity of This shows an active camouflage device capable of efficient thermal radiance control. This allows the device's emissivity to change significantly, and the device's emissivity can be quickly switched between low power consumption and excellent reliability. Possible thermal camouflage is achieved.

[0015] U.S. Patent Application Publication No. 2012 / 0318129, published December 20, 2012 Jackson et al. describes an electrode comprising an array of carbon nanotubes. a magnetic energy (EME) absorbing layer and a plurality of energy transfer elements embedded within the absorbing material; The present invention discloses a camouflage material comprising: an energy transfer element on an outer surface of an absorbent layer; The device may be operable to transfer energy to at least a portion of the device. [Prior art documents] [Patent documents]

[0016] [Patent Document 1] GB Patent Application Publication No. 2274154 [Patent Document 2] International Publication No. 1996 / 004520 Pamphlet [Patent Document 3] U.S. Patent No. 5,036,211 [Patent Document 4] U.S. Patent No. 6,613,420 [Patent Document 5] US Patent Application Publication No. 2009 / 0252982 [Patent Document 6] US Patent Application Publication No. 2014 / 0125506 [Patent Document 7] U.S. Patent No. 6,338,292 [Patent Document 8] U.S. Patent No. 9,952,020 [Patent Document 9] International Publication No. 2011 / 000679 Brochure [Patent Document 10] US Patent Application Publication No. 2012 / 0318129 [Non-patent literature]

[0017] [Non-Patent Document 1] “Applications of Liquid Crystals To Optical Camouflage Techniques In The Thermal Infrared Range”, PhD proposition, https: / / www.telecom-bretagne.eu / data / Optique%20-%20PhD%20proposition.pdf [Non-patent document 2] “Adaptive Camouflage Techniques for A Light Armored Vehicle”, Wheaton, V., Vincent, I. and Dumas, J., 2010, Land Warfare Conference. [Non-patent document 3] "Fast Adaptive Thermal Camouflage Based On Flexible Vo2 / Graphene / Cnt Thin Films", Xiao, L., Ma, H., Liu, J., Zhao, W., Jia, Y., Zhao, Q., Liu, K., Wu, Y., Wei, Y., Fan, S. and Jiang, K., 2015, Nano letters, 15(12), pp. 8365-8370 Summary of the Invention

[0018] According to a first aspect of the presently disclosed subject matter, there is provided a thermal signature generating device, the device comprising: At least one thermal radiation emitting element is provided, and each of the at least one thermal radiation emitting element has two a cavity extending between two spaced apart opposing solid surfaces defined by two opposing electrodes; an array of carbon nanotubes (CNTs), the array having two opposite ends Thus, the electrodes are connected to two opposing electrodes, extend along the space between the electrodes, and provides a current through the thermal radiation emitting element to generate a thermal signature on the thermal radiation emitting element This causes heat radiation to be emitted.

[0019] In some cases, the majority of the surface area of ​​the thermal radiation emitting element is in contact with any solid surface. not present.

[0020] In some cases, the CNT array is attached to two of the two electrodes to which the ends of the array are attached. The asymmetry between the cross-sectional dimension of the surface area of ​​the electrodes and the length of the array defined by the spacing between the electrodes. Regarding the aspect ratio, the cross-sectional dimension of each of the two surface areas is larger than the space between the electrodes. The axial length is configured to have a curvature ratio.

[0021] In some cases, the current through the thermal radiation emitting element is passed between electrodes aligned along the length of the CNT fibers. flows along the direction of

[0022] In some cases, the electrodes may be heat sinks to remove heat generated by the thermal radiation emitting elements. It is configured to function as a

[0023] In some cases, the device may include at least one heat dissipation device according to the thermal signature to be generated. configured and operative to generate a control signal for controlling current through the radiation emitting element; and a control unit adapted to modulate the current for at least a predetermined time. It has a corresponding predetermined pattern.

[0024] In some cases, the device further comprises a housing comprising the electrode and the thermal radiation emitting element; At least a portion of the housing allows thermal radiation to pass therethrough.

[0025] In some cases, the housing may include at least one heat sink to remove heat generated by the heat-radiating element. The semiconductor device further includes at least one heat sink.

[0026] In some cases, the housing provides a vacuum environment for the thermal radiation emitting element.

[0027] In some cases, at least a portion of the housing that allows thermal radiation to pass through is materials, namely germanium, Teflon, silicon, zinc selenide, or Made from one or more of polyethylene.

[0028] In some cases, the shape of the thermal radiation emitting element is a flat surface and the housing is configured to align the heat radiation emitting element in a desired direction. The user can select the direction of connection of the housing to the fuse holder so that heat radiation is It has markings to indicate this.

[0029] In some cases, the thermal radiation emitting element may be in the following shapes: spiral, cylinder, fiber, or It has one of the flat surfaces.

[0030] In some cases, the housing removably connects the housing to the fuse holder. It is formed as a fuse that allows

[0031] In some cases, housings and fuse holders comply with DIN 72581 standard do.

[0032] In some cases, the fuse holder can provide electrical current to the electrodes.

[0033] In some cases, the fuse holder has a reflector to direct the heat radiation in a desired direction. Prepare.

[0034] In some cases, the fuse holder has a reflective surface to reflect the heat radiation in a desired direction. is connected to.

[0035] In some cases, when the housing is connected to the fuse holder, the housing is Located within a substrate, the substrate is designed to reflect thermal radiation in a desired direction.

[0036] In some cases, the device further comprises a male connector, the male connector being perpendicular to the female connector. The device can be attached to the female connector regardless of the angle of rotation of the male connector around the axis of the male connector. To enable detachable connection.

[0037] In some cases, the at least one thermal radiation emitting element is a plurality of thermal radiation emitting elements; Each of the plurality of thermal radiation emitting elements includes at least one of the thermal radiation emitting elements. one of the thermal radiation emitting elements emits a first thermal radiation in a first direction, and at least another one of the thermal radiation emitting elements Emitting thermal radiation in a given direction such that a second thermal radiation is emitted in a second direction other than the first direction. Put out.

[0038] In some cases, the pattern is a predetermined pattern.

[0039] In some cases, the heat signature is generated to mark one or more objects. .

[0040] In some cases, the device includes a thermograph that can determine a heat map of the area of ​​interest. The system further includes a camera, and a pattern is generated to match the heat map.

[0041] In some cases, the pattern is used to camouflage objects located between the observer and the area of ​​interest. It is generated to

[0042] According to a second aspect of the presently disclosed subject matter, there is provided a thermal signature generation method, the method comprising: Providing current through the at least one thermal radiation emitting element to generate at least one thermal radiation emitting causing the element to emit thermal radiation to generate a thermal signature; Each of the two thermal radiation emitting elements has two spaced apart pairs of electrodes defined by two opposing electrodes. and a carbon nanotube (CNT) array extending between opposing solid surfaces. is connected by its two opposite ends to two opposing electrodes, respectively, and the electrodes , and the electrodes provide electrical current through the thermal radiation emitting element.

[0043] In some cases, the majority of the surface area of ​​the thermal radiation emitting element is in contact with any solid surface. not present.

[0044] In some cases, the CNT array is attached to two of the two electrodes to which the ends of the array are attached. The asymmetry between the cross-sectional dimension of the surface area of ​​the electrodes and the length of the array defined by the spacing between the electrodes. Regarding the aspect ratio, the cross-sectional dimension of each of the two surface areas is larger than the space between the electrodes. The axial length is configured to have a curvature ratio.

[0045] In some cases, the current through the thermal radiation emitting element is passed between electrodes aligned along the length of the CNT fibers. flows along the direction of

[0046] In some cases, the electrodes may be heat sinks to remove heat generated by the thermal radiation emitting elements. It is configured to function as a

[0047] In some cases, the method further comprises: selecting at least one thermal signature according to the thermal signature to be generated; generating a control signal to control a current through the thermal radiation emitting element; The control signal has a predetermined pattern that corresponds to at least a predetermined time modulation of the current.

[0048] In some cases, the electrodes and the thermal radiation emitting element are contained within a housing, At least a portion allows the passage of thermal radiation.

[0049] In some cases, the method may further comprise: directing heat generated by the thermal radiation emitting element to at least a portion of the housing; The method further includes removing the heat sink.

[0050] In some cases, the housing provides a vacuum environment for the thermal radiation emitting element.

[0051] In some cases, at least a portion of the housing that allows thermal radiation to pass through is materials, namely germanium, Teflon, silicon, zinc selenide, or Made from one or more of polyethylene.

[0052] In some cases, the shape of the thermal radiation emitting element is a flat surface and the housing is configured to align the heat radiation emitting element in a desired direction. The user can select the direction of connection of the housing to the fuse holder so that heat radiation is It has markings to indicate this.

[0053] In some cases, the thermal radiation emitting element may be in the following shapes: spiral, cylinder, fiber, or It has one of the flat surfaces.

[0054] In some cases, the housing removably connects the housing to the fuse holder. It is formed as a fuse that allows

[0055] In some cases, housings and fuse holders comply with DIN 72581 standard do.

[0056] In some cases, the current is supplied to the electrodes by a fuse holder.

[0057] In some cases, the fuse holder has a reflector to direct the heat radiation in a desired direction. Prepare.

[0058] In some cases, the fuse holder has a reflective surface to reflect the heat radiation in a desired direction. is connected to.

[0059] In some cases, when the housing is connected to the fuse holder, the housing is Located within a substrate, the substrate is designed to reflect thermal radiation in a desired direction.

[0060] In some cases, the at least one thermal radiation emitting element is a plurality of thermal radiation emitting elements; Each of the plurality of thermal radiation emitting elements includes at least one of the thermal radiation emitting elements. one of the thermal radiation emitting elements emits a first thermal radiation in a first direction, and at least another one of the thermal radiation emitting elements Emitting thermal radiation in a given direction such that a second thermal radiation is emitted in a second direction other than the first direction. Put out.

[0061] In some cases, the pattern is a predetermined pattern.

[0062] In some cases, the heat signature is generated to mark one or more objects. .

[0063] In some cases, a thermal imaging camera can determine a heat map of the area of ​​interest. A pattern can be generated to match the heatmap.

[0064] In some cases, the pattern is used to camouflage objects located between the observer and the area of ​​interest. It is generated to

[0065] According to a third aspect of the subject matter of the present disclosure, there is provided a method for implementing a computer-readable program code embodying: A non-transitory computer-readable storage medium is provided, and computer-readable program code is , executable by a computer controller to execute the thermal signature generation method. and the method includes providing an electric current through at least one thermal radiation emitting element to generate at least causing one thermal radiation emitting element to emit thermal radiation to generate a thermal signature. each of the at least one thermal radiation emitting element is defined by two opposing electrodes; The carbon nanotube (CNT) extends between two opposing solid surfaces separated by a gap. an array, the array being connected by its two opposite ends to two opposing electrodes; The electrodes are connected to each other and extend along the space between the electrodes, and the electrodes are connected to each other so that a current is passed through the thermal radiation emitting element. supply. [Brief explanation of the drawings]

[0066] To understand the subject matter of the present disclosure and see how it can be implemented in practice For that purpose, the present subject matter will now be described, by way of non-limiting example only, with reference to the accompanying drawings, in which: [Figure 1] FIG. 1 is a block diagram that schematically illustrates an example of a thermal signature generating device in accordance with the disclosed subject matter. [Figure 2]1 is a schematic diagram of an example of a fuse-type housing component configured to hold a thermal radiation emitting element in accordance with the subject matter of the present disclosure. [Figure 3] 1 is a schematic diagram of an example of a thermal radiation emitting device according to the presently disclosed subject matter. [Figure 4] 1 is a schematic diagram of an example of components of a holder configured to hold a thermal radiation emitting device in accordance with the disclosed subject matter. [Figure 5] 1 is a schematic diagram of an example of a thermal signature generating device in accordance with the presently disclosed subject matter. [Figure 6A] 1 is a schematic diagram of an example of a front view of a thermal radiation emitting device having a thermal radiation emitting element in accordance with the subject matter of the present disclosure. [Figure 6B] 1 is a schematic diagram of an example of a back view of a thermal radiation emitting device having a thermal radiation emitting element in accordance with the subject matter of the present disclosure. [Figure 7A] 1 is a schematic diagram of another example of a front view of another thermal radiation emitting device having a thermal radiation emitting element in accordance with the subject matter of the present disclosure. [Figure 7B] 1 is a schematic diagram of another example of a rear view of another thermal radiation emitting device having a thermal radiation emitting element in accordance with the subject matter of the present disclosure. [Figure 8A] 1 is a schematic diagram of an example of a front view of a thermal radiation emitting device having an array of thermal radiation emitting elements in accordance with the subject matter of the present disclosure. [Figure 8B] 1 is a schematic diagram of an example of a back view of a thermal radiation emitting device having an array of thermal radiation emitting elements in accordance with the subject matter of the present disclosure. [Figure 9A] 1 is a schematic diagram of an example of a front view of a thermal radiation emitting device having multiple thermal radiation emitting elements in a disk configuration in accordance with the subject matter of the present disclosure. [Figure 9B] 1 is a schematic diagram of an example of a rear view of a thermal radiation emitting device having multiple thermal radiation emitting elements in a disk configuration in accordance with the subject matter of the present disclosure. [Figure 10] Attention is now directed to a flowchart illustrating one example of a method for generating a thermal signature in accordance with the presently disclosed subject matter. DETAILED DESCRIPTION OF THE INVENTION

[0067] In the following detailed description, numerous specific examples are set forth in order to provide a thorough understanding of the subject matter of the present disclosure. However, it is to be understood that the subject matter of this disclosure may be practiced without these specific details. In other cases, those skilled in the art will understand that the present disclosure may be implemented in various ways. Well-known methods, procedures, and components have not been described in detail so as not to obscure the subject matter. It is not explained.

[0068] In the drawings and description set forth, identical reference numbers may refer to different embodiments or configurations. Common components are shown.

[0069] Unless otherwise specified, as will become apparent from the following description, throughout this specification: "Generate," "Receive," "Emit," "Remove," "Connect," "Command" Descriptions using terms such as "indicate," "reflect," and "control" computer operations and / or processes that manipulate and / or convert data into other data and / or The data represents physical objects. The term "computer" may refer to, by way of non-limiting example, a personal desktop computer. laptop computers, servers, computing systems, communication devices, Smartphones, tablet computers, smart TVs, processors (e.g., digital Digital signal processors (DSPs), microcontrollers, field programmable gates FPGAs, application specific integrated circuits (ASICs), etc.), and the implementation of various tasks. A group of multiple physical machines sharing a workload, or virtual servers coexisting on a single physical machine a server, any other electronic computing device, and / or any combination thereof It has been broadened to include any kind of electronic device with data processing capabilities, including should be interpreted as follows:

[0070] Operation according to the teachings herein may be performed by a computer specially constructed for the desired purpose. Even if executed by a computer program stored on a non-transitory computer-readable storage medium, The program is executed by a general-purpose computer specially configured for the desired purpose. The term "non-transient" is used herein to exclude transient propagating signals, but , which may be used to include any volatile or non-volatile computer memory technology suitable for the application. can be.

[0071] As used herein, "for example," "such as," and "for example" The phrases and variations thereof describe non-limiting embodiments of the presently disclosed subject matter. In this specification, "in some cases," "in some cases," or "in other cases," or References to these variations are to be construed as including any particular feature, structure, or characteristic described in connection with the embodiments. , is meant to be included in at least one embodiment of the subject matter of the present disclosure. The occurrence of "in some cases," "in some cases," or "in other cases," or variations of these , do not necessarily refer to the same embodiment.

[0072] Unless otherwise indicated, the invention will be described in the context of separate embodiments for clarity. Certain features of the disclosed subject matter may be provided in combination in a single embodiment. To the contrary, it will be understood that the present invention may be practiced in the context of a single embodiment for the sake of brevity. The various features of the subject matter of the present disclosure may be provided separately or in any suitable subcombination. It may be provided at

[0073] In embodiments of the presently disclosed subject matter, fewer and / or more stages than those shown in FIG. A number of steps and / or steps different from those shown in FIG. 10 may be performed. 1-9B show schematic diagrams of system architectures according to embodiments of the disclosed subject matter. Each module in Figure 1 is represented by a software component that performs the functions defined and described herein. may consist of any combination of software, hardware, and / or firmware. The modules in Figure 1 can be centralized in one location or distributed across two or more locations. In another embodiment of the presently disclosed subject matter, the system may include the model shown in FIG. Fewer and / or more modules than the modules shown in FIG. The module may be different from the module.

[0074] Any reference herein to a method includes a system capable of carrying out the method. should apply, mutatis mutandis, when executed by a computer. Any necessary modifications to a non-transitory computer readable medium storing instructions that result in the execution of this method. This should also apply.

[0075] Any reference herein to a system refers to the process that can be performed by that system. This should apply mutatis mutandis to the methods that can be used by this system. mutatis mutandis to a non-transitory computer readable medium storing instructions that can It should fit.

[0076] Any reference herein to a non-transitory computer readable medium includes this non-transitory computer readable medium. Any necessary modifications to a system capable of executing instructions stored on a computer-readable medium are required. Additionally, the present invention should be applicable to those skilled in the art who are skilled in the art. applies mutatis mutandis to computer-implemented methods for It should be.

[0077] Here, a thermal signature generating device 100 according to the subject matter of the present disclosure is Attention is directed to FIG. 1, which is a block diagram illustrating an example of a unit.

[0078] In accordance with the subject matter of the present disclosure, a thermal signature generating device 100 is configured to generate a thermal signature. It can be configured as follows.

[0079] The thermal signature generating device 100 may be configured to include a thermal radiation emitting device 110. The radiation emitting device 110 may be configured to include at least one thermal radiation emitting element 120. In some cases, as shown in FIG. 1, the thermal radiation emitting device 110 may include a single thermal radiation emitting Alternatively, in some cases, the thermal radiation emitting device 1 may be configured to include an emitting element 120. 10 is further described herein with particular reference to FIGS. 8A, 8B, 9A, and 9B. As will be described in more detail below, the thermal radiation emitting element 120 may include multiple thermal radiation emitting elements 120.

[0080] Each of the at least one thermal radiation emitting element 120 is defined by two opposing electrodes. The device may be configured to extend between two spaced apart, opposing solid surfaces. Each of the at least one thermal radiation emitting element 120 is connected by its two opposite ends to two 3, 6A, 6B, 7A, and 7B. 7B, 8A, 8B, 9A, and 9B. The electrode may extend along the space between the electrodes.

[0081] In some cases, each of the at least one thermal radiation emitting element 120 comprises carbon nanotubes. The array may comprise an array of carbon nanotubes (CNTs) bonded by their two opposite ends. Thus, each of the thermal radiation emitting elements 120 is connected to two opposing electrodes extending therebetween. 3, 6A, 6B, 7A, 7B, 8A, 8B, 9A, and and extending along the space between the electrodes, as further detailed herein with reference to FIG. 9B. Additionally or alternatively, in some cases, at least one thermal radiation Each of the emissive elements 120 may be made of one or more of stainless steel, aluminum, or nickel. In some cases, at least one thermal radiation emitting element 120 Each of the may be one or more resistors. In some cases, at least one thermal radiation emitter Each of the output elements 120 may be one of the following shapes: spiral, cylindrical, fiber, or flat surface. It can be configured to have one.

[0082] In some cases, a majority of the surface area of ​​each of the at least one thermal radiation emitting element 120 is In particular, FIGS. 3, 6A, 6B, 7A, 7B, 8A, 8B, 9A, and 9 not in contact with any solid surface, as further detailed herein with reference to B. .

[0083] In some cases, particularly Figs. 6A, 6B, 7A, 7B, 8A, 8B, 9A Arrays of CNTs can be formed by arraying, as further detailed herein with reference to FIG. 9B. The cross-sectional dimensions of the two surface areas of the two electrodes to which the ends of the battery are attached and the space between the electrodes The cross section of each of the two surface regions is determined by the aspect ratio between the length of the array and the It can be configured to have an aspect ratio whose dimensions are larger than the space between the electrodes.

[0084] The thermal radiation emitting device 110 is shown in, among others, FIGS. 3, 6A, 6B, 7A, 7B, 8A, As further detailed herein with reference to Figures 8B, 9A, and 9B, one or more The thermal radiation emitting element 120 may be further configured to include a housing 130 that holds the thermal radiation emitting element 120 . In some cases, as further detailed herein, particularly with reference to FIGS. 3 and 5 , the thermal radiation emitting element 120 may be contained within a housing 130 .

[0085] The housing 130 may be configured to include an electrical interface 132. The thermal interface 132 includes, for each of the at least one thermal radiation emitting element 120: Each thermal radiation emitting element 120 has two opposing electrodes extending therebetween and two opposing electrodes. and two electrical connections connected to the electrodes, respectively. Non-limiting examples of interface 132 are shown in Figures 2, 3, 6B, 7B, 8A, 9A, 10A, 11A, 12A, 13A, 14A, 15A, 16A, 17A, 18A, 19A, 20A, 21A, 22A, 23A, 24A, 25A, 26A, 27A 8B, and further presented herein with reference to FIG. 9B. Electrical Interface 1 32 may be configured to receive an electric current. The electrodes of the electrical interface 132 provide electrical current through the thermal radiation emitting element 120. causing the thermal radiation emitting element 120 to emit thermal radiation for generating a thermal signature; This can be done.

[0086] In some cases, each of the at least one thermal radiation emitting element 120 comprises an array of CNTs. In this case, the current passing through each thermal radiation emitting element 120 is aligned with the length of the CNT fiber, The thermal radiation emitting element 120 may be connected to a heat source 124. can.

[0087] In some cases, the housing 130 is at least a portion of the housing 130; It is further configured to include at least one thermally transparent body 134 that allows the passage of thermal radiation. In some cases, at least one thermally transparent body 134 is made of the following materials: gel aluminum, Teflon (registered trademark), silicon, zinc selenide, or polyethylene Non-limiting examples of the at least one thermally transparent body 134 include: , as further detailed herein with reference to, inter alia, FIGS. 2 and 3, a heat-transmitting sleeve It is Bu.

[0088] In some cases, the housing 130 may be configured to remove heat generated by the thermal radiation emitting element 120. The device may further be configured to include at least one heat sink 136 for heating the device. In this case, at least one heat sink 136 is As further detailed herein, the first pair of heat sinks and the second pair of heat sinks In some cases, the electrodes may be, among others, as shown in FIGS. 6B, 7B, 8A, and 9. 8B, and as further detailed herein with reference to FIG. 9B, the thermal radiation emitting element emits The device may be configured to act as a heat sink to remove the generated heat.

[0089] In some cases, as further detailed herein, particularly with reference to FIG. The ring 130 may be configured to surround the thermal radiation emitting element 120. In this case, the housing 130 is configured to provide a vacuum environment for the thermal radiation emitting element 120. It is possible.

[0090] In some cases, the housing 130 may be formed as a cylindrical fuse (such as The housing 130 is hereinafter referred to as the "fuse-type housing." Non-limiting examples of the ring 130 are described in further detail herein, with particular reference to FIGS. 2 and 3. By forming the housing as a cylindrical fuse, the housing: 1. The fuse holder 140 may be removably connected to the fuse holder 140 as described in detail below.

[0091] The thermal signature generating device 100 may be configured to include a control unit 150. The unit 150 is configured to generate at least one thermal radiation emitting element in response to a thermal signature to be generated. configured and operable to generate a control signal for controlling the current through element 120. and the control signal has a predetermined pattern corresponding to at least a predetermined time modulation of the current. do.

[0092] In some cases, the thermal radiation emitting device 110 may be any of the devices shown in Figures 4, 6A, 7A, 8A, and a control unit 150, as further detailed herein with reference to FIG. 9A. Alternatively, the thermal signature generating device 100 may be configured to include multiple thermal radiation emitting devices 102. In some cases, the thermal signature generating device 110 may include a plurality of The thermal radiation emitting device 110 may be configured to include a control unit 150 associated with the thermal radiation emitting device 110. .

[0093] The thermal signature generating device 100 includes a plurality of thermal radiation emitting devices 110, and therefore a corresponding plurality of In some cases, the thermal radiation emitting element 120 includes a plurality of thermal radiation emitting elements 120. The radiation emitting elements 120 are arranged such that at least one of the thermal radiation emitting elements 120 is oriented in a first direction. and at least one other one of the thermal radiation emitting elements 120 is radiated in a first direction or more. to emit a second thermal radiation in a second direction outward, It can be configured.

[0094] In some cases, a device for controlling the current through at least one thermal radiation emitting element 120 The generation of the control signal may be performed by a user of the thermal signature generation unit 100, e.g. This can be done by manually opening and closing a switch.

[0095] In some cases, the thermal signature generating device 100 may be configured as described, inter alia, with reference to FIGS. 4 and 5. A holder 14 for holding a thermal radiation emitting device 110, as described in further detail herein. 0. In some cases, the present invention may be As will be described in further detail herein, the holder 140 is configured to include a reflector 145. It is possible.

[0096] In some cases, the thermal signature to be generated by the thermal signature generating device 100 may be , pattern. Furthermore, in some cases, the control unit 150 may a control signal for controlling a current through the at least one thermal radiation emitting element 120 according to In some cases, the pattern may be pre-defined. It may be a defined pattern.

[0097] In some cases, the thermal signature may be one or more signals, e.g., according to a predetermined pattern. In some cases, the markings may be generated to mark an object, as shown in Figs. 6B, 7A, 7B, 8A, 8B, 9A, and 9B. As will be described in more detail below, one or more thermal radiation emitting elements 120 may be included. The structure of the emitter 110 allows the at least one thermal radiation emitting element 120 to cool rapidly. Therefore, at least one thermal radiation emitting element 120 is in a current-carrying state (i.e., It alternates between a current-carrying state (i.e., on) and a current-free state (i.e., rest) at a high rate. This allows the thermal signature generating device 100 to map one or more objects. This allows for the emission of thermal radiation at high pulse rates for heating. For example, At least one thermal radiator for maximum energy-efficient marking of one or more objects The emissive element 120 passes a current for about 1 / 100th of a second at a temperature of about 400° C. The thermal radiation emitting element 120 does not need to pass current for as little as 1 / 100 seconds. Note that it may be possible to cool from 400°C in a reasonable amount of time.

[0098] In some cases, the thermal signature generator 100 determines a heat map of the region of interest. and further configured to include a thermographic camera (not shown in FIG. 1) capable of A pattern (i.e., a thermal signature) can be generated to match the heat map. In some cases, to camouflage objects located between the observer and the area of ​​interest, To do this, a pattern can be generated to match the heat map. To achieve camouflage, at least one thermal radiation emitting element 120 is heated to a temperature of about 40°C to 120°C. It can be heated continuously at a temperature between 0.5°C.

[0099] Here, a fuse configured to hold a thermal radiation emitting element 120 in accordance with the subject matter of the present disclosure is Attention is now directed to FIG. 2, which is a schematic diagram of an example of components of lens housing 130.

[0100] In accordance with the subject matter of the present disclosure, components of the fuse-type housing 130 include, but are not limited to: The first cap 210, the second cap 220, and the first pair of heat a heat sink 230, a second pair of heat sinks 240, and a thermally transparent sleeve 250. It can be configured.

[0101] In some cases, the first cap 210 may be cylindrical and may include a fuse-type housing. The seal 130 may be configured to seal at its first longitudinal end. In this case, the first cap 210 constitutes the first electrode of the electrical interface 132. The first electrical contact and the first electrode may be configured to: It is made from at least one electrically conductive material.

[0102] In some cases, the second cap 220 may also be cylindrical and may include a fuse-type The fuse-type housing 130 has a second longitudinal end opposite the first longitudinal end of the fuse-type housing 130. It may be configured to seal at the longitudinal ends. In some cases, the second cap The plate 220 includes a second electrical contact that constitutes the second electrode of the electrical interface 132. The second electrical contact and the second electrode may be further configured to include at least one conductive It is made from non-woven materials.

[0103] The first pair of heat sinks 230 includes a first heat sink 232 and a second heat sink In some cases, as shown in FIG. 2, the first The first heat sink 232 and the second heat sink 234 are each semicircular or semi-elliptical. It may be formed.

[0104] The second pair of heat sinks 240 includes a third heat sink 242 and a fourth heat sink In some cases, as shown in FIG. 2, a third head may be included. The second heat sink 242 and the fourth heat sink 244 are each semicircular or semi-elliptical. It may be formed.

[0105] The thermally transparent sleeve 250 may be a cylindrical sleeve. The Reeve 250 is made of the following materials: germanium, Teflon, silicon , zinc selenide, or polyethylene.

[0106] Attention is now directed to FIG. 3, which is a schematic diagram of an example of a thermal radiation emitting device 110 in accordance with the subject matter of the present disclosure. do.

[0107] According to the subject matter of the present disclosure, in some cases, the thermal radiation emitting device 110 may include a thermal radiation emitting element 120 and a fuse-type housing 130. The components of group 130 have been described in detail herein above, with particular reference to FIG.

[0108] In some cases, the first cap 210 of the fuse-type housing 130 is a contact and an electrical interface that contacts the thermal radiation emitting element 120 at its first end. The first electrode of the sensor 132 may be configured to include a first electrode of the sensor 132.

[0109] In some cases, the second cap 220 of the fuse-type housing 130 may be a second electrical a contact point and a second end of the thermal radiation emitting element 120 opposite the first end of the thermal radiation emitting element 120; and a second electrode of the electrical interface 132 that contacts the first electrode at the first contact portion. That is, the thermal radiation emitting element 120, which may comprise, for example, an array of CNTs, is formed by two opposing It extends along the space between two spaced apart, opposing solid surfaces defined by the electrodes. Applying a voltage across the first and second electrical contacts of the electrical interface 132 and the first electrical contact, the thermal radiation emitting element 120, and the second electrical contact (in that order). or in the opposite order) and thus the thermal radiation emitting element 120 The thermal radiation can be emitted to generate some or all of the thermal signature.

[0110] In some cases, as shown in FIG. 3, a first pair of heat sinks 230 may be 3. In addition, in some cases, a thermal radiation emitter may be connected to the chip 210. A portion of the output element 120 is connected to a first heat sink 232 and a second heat sink 234 (shown in FIG. 2). It may be located between the

[0111] In some cases, as shown in FIG. 3, a second pair of heat sinks 240 may be provided for the second capacitor. 3. In addition, in some cases, a thermal radiation emitter may be connected to the chip 220. A portion of the output element 120 is connected to a third heat sink 242 and a fourth heat sink 244 (shown in FIG. 2). It may be located between the

[0112] In some cases, as shown in FIG. 3, a first longitudinal end of the thermally transparent sleeve 250 can be connected to the first cap 210, and the first longitudinal direction of the heat-transmitting sleeve 250 A second longitudinal end of the heat-transmitting sleeve 250 opposite the forward end is attached to the second cap 220. In this way, the heat-transmitting sleeve 250 can be connected to the The thermal radiation emitting device 110 is located between the first cap 210 and the second cap 220. In some cases (not shown in FIG. 3), the device may be configured to surround the component. The first electrode and the second electrode of the electrical interface 132 are electrically connected to the thermal radiation emitting element 1. Note that the length of the 20 may extend along the length of the 20. In some cases, as shown in FIG. Thus, the thermally transparent sleeve 250 is configured to provide a thermally transparent barrier between the following components of the thermal radiation emitting device 110: The radiation emitting element 120, at least a portion of the first heat sink 232, the second heat sink at least a portion of the third heat sink 242, and The heat sink 244 may be configured to surround at least a portion of the heat sink 244. By surrounding the element 120, the thermally transparent sleeve 250 provides thermal insulation to the thermal radiation emitting element 120. Isolating the radiation-emitting device 110 from the external environment protects the thermal radiation-emitting element 120 from damage. The majority of the surface area of ​​the thermal radiation emitting element 120 is in contact with any solid surface. Note that only the ends of the thermal radiation emitting element 120 come into contact with the solid surface, so that the I want to be done that.

[0113] In some cases, the thermally transparent sleeve 250 provides a vacuum environment for the thermal radiation emitting element 120. This can be configured to provide a thermal radiation emitting element 120 with a lower thermal radiation output than a thermal radiation emitting element 120 in a non-vacuum environment. To improve the durability of the thermal radiation emitting element 120 and prevent structural damage to the thermal radiation emitting element 120 It is possible.

[0114] In some cases, the thermal radiation emitting element 120 may be configured to comprise an array of CNTs. The array is held by its two opposite ends in a first cap 210 and in a second cap 211. It is connected to two opposing electrodes in the cap 220 and extends along the space between the electrodes.

[0115] In some cases, as shown in FIG. 3, the thermal radiation emitting element 120 may be configured to have a flat surface. In some cases where the thermal radiation emitting element 120 has a flat surface, The fuse housing 130 may be attached to, for example, the outer surface of the first cap 210 or the outer surface of the second cap 220. 220. The device is configured with markings (not shown), such as vertical marks along the outer surface of the device. The markings allow a user of the thermal signature generating device 100 to easily identify the fuse-type housing 13. 10 to the holder 140. In this way, the thermal radiation emitting element 12 0 allows the thermal signature generation unit 100 to direct the thermal radiation in a desired direction. The thermal signature generation unit 100 may be oriented such that

[0116] 1, a holder configured to hold a thermal radiation emitting device 110 according to the subject matter of the present disclosure. Attention is directed to FIG. 4, which is a schematic diagram of an example of the components of 140.

[0117] In accordance with the subject matter of the present disclosure, in some cases, as shown in FIG. 4, the holder 140 2 and 3, and holds the fuse-type housing 130 previously described herein. The fuse holder 140 may be configured as a holder 140 that can hold a fuse.

[0118] In some cases, as shown in FIG. 4, the fuse holder 140 may include a thermal radiation emitting element 1 20 includes a reflector 145 for directing the thermal radiation emitted by the It can be configured as follows.

[0119] In some cases, as shown in FIG. 4, the fuse holder 140 may include a first mounting bracket. It may be further configured to include a racket 420 and a second mounting bracket 430. Additionally, reflector 145 is described in more detail herein, particularly with reference to this figure and FIG. As described, the first mounting bracket 420 and the second mounting bracket 43 0.

[0120] In some cases, as shown in FIG. 4, the fuse holder 140 may include a mount 440. Additionally, in some cases, the reflector 145 may be As will be described in further detail herein, particularly with reference to FIG. 5, the first mounting bracket 42 0, a second mounting bracket 430, and a mount 440. It can be done.

[0121] In some cases, as shown in FIG. 4, the reflector 145 includes a planar portion 411, a first The first angled portion 412 and the second angled portion 413 may be configured as follows: In this case, as shown in FIG. 4, the flat portion 411 is divided into the first oblique portion 412 and the second oblique portion 413. Each of the oblique portions 413 is connected to the flat portion 411 at an obtuse angle relative to the flat portion 411. , may be connected between the first diagonal portion 412 and the second diagonal portion 413.

[0122] In some cases, as shown in FIG. 4, the reflector 145 may include a first continuous cutout. The first cutout portion 414 and the second cutout portion 415 may be configured to include a first continuous cutout portion 414 and a second continuous cutout portion 415. Each of the first continuous cutout portion 414 and the second continuous cutout portion 415 is The first inclined portion 412, the flat portion 411, and the second inclined portion 413 are 5, as will be further detailed herein. 145 is attached to the first mounting bracket 420 and the second mounting bracket 430. It can be made possible to attach it.

[0123] In some cases, as shown in FIG. 4, a first reflector mounting bracket 420 comprises a first upright component 422, a second upright component 424, and a first planar component 426. A portion of the first planar component 426 may be configured to include a first upright structure. between the first upstanding component 422 and the second upstanding component 424 (e.g., as shown in FIG. 4 ). The first upright component 422 can be located between the lower end of the first upright component 422 and the lower end of the second upright component 424. The first upright component 422 and the second upright component 424 are 6 and may be substantially perpendicular to each other along a first transverse horizontal axis "y." It can be done.

[0124] In some cases, the fuse holder 140 may be a fuse-type housing 130 electrical interconnect. The first lift may be configured to provide a current to the interface 132. At least a portion of the rectifier mounting bracket 420 may be electrically conductive, e.g., Based on the control signal generated by unit 150, the first reflector mounting bracket The electrical interface 132 of the fuse-type housing 130 is connected to the socket 420. This allows the supply of a current.

[0125] Additionally, in some cases, a second reflector mounting bracket may be used, as shown in Figure 4. The base 430 includes a third upright component 432, a fourth upright component 434, and a second planar A portion of the second planar component 436 may be configured to include a third planar component 436. Between the first upright component 432 and the fourth upright component 434 (e.g., as shown in FIG. 4 between the bottom end of the third upright component 432 and the bottom end of the fourth upright component 434 The third upright component 432 and the fourth upright component 434 are in the second planar configuration. The elements 436 may be connected substantially perpendicular to one another along a first transverse horizontal axis "y." can be opposed to.

[0126] In some cases, at least a portion of the second reflector mounting bracket 430 is conductive. may be electrically conductive, for example based on a control signal generated by the control unit 150. The fuse-type housing 130 is electrically connected to the second reflector mounting bracket 430. This allows current to be supplied to the electrical interface 132.

[0127] In some cases, the mount 440 includes a first reflector mounting bracket 420 and a second reflector mounting bracket 420. and a second reflector mounting bracket 430 that can be detachably connected to the mount 440. Additionally, in some cases, mount 440 may be configured as described above. As described above and explained in more detail herein with particular reference to FIG. 5, the reflector 4. The mount 440 may be configured to allow a portion of the 145 to be attached to the mount 440. The illustration of mount 440 is provided for illustrative purposes only. The composition may be manufactured in any manner consistent with the teachings herein.

[0128] Turning now to FIG. 5, which is a schematic diagram of an example thermal signature generating device 100 in accordance with the subject matter of the present disclosure. Pay attention.

[0129] In accordance with the subject matter of the present disclosure, as previously detailed herein, particularly with reference to FIG. In some cases, the thermal signature generating device 100 may include a thermal radiation emitting device 110 and a The thermal radiation emitting device 110 may be configured to include a housing 130 and a heater 140. a thermal radiation emitting element 120 (not shown in FIG. 5) held by a housing 130; The device is configured to include:

[0130] In some cases, the same effects as those already detailed herein, particularly with reference to FIGS. As shown in FIG. 5, the housing 130 of the thermal radiation emitting device 110 is a fuse-type housing. It may be a jing 130.

[0131] In some cases, as already detailed herein with particular reference to FIG. 4 and shown in FIG. As shown, the holder 140 has a holder that can hold the fuse-type housing 130. It may be a fuse holder 140 .

[0132] In some cases, as already detailed herein with particular reference to FIG. 4 and shown in FIG. As shown, the fuse holder 140 includes a reflector 145 and a first reflector mounting a reflector mounting bracket 420, a second reflector mounting bracket 430, and a mount 440. In some cases, as shown in FIG. 5, the first reflector Each of the first reflector mounting bracket 420 and the second reflector mounting bracket 430 is , may be removably connected to mount 440. Further, in some cases, the Thus, the reflector 145 is mounted on the first plane of the first reflector mounting bracket 420. Component 426, first backstop 442 of mount 440 and second backstop bracket 444, as well as the second planar component of the second reflector mounting bracket 430. 436. In addition, in some cases, as shown in FIG. The reflector 145 includes a first continuous cutout portion 414 (shown in FIG. 4) of the reflector 145. (which is attached to the reflector bracket 420) and lower it. 145 (shown in FIG. 4) as a second continuous cutout portion 415 of the second reflector. It can be mounted by lowering it over the mounting bracket 430 .

[0133] In some cases, as shown in FIG. 5, a fuse-type housing 130 is provided. 5. In some cases, the device may be removably connected to the holder 140. , the fuse-type housing 130 is attached to a first reflector mounting bracket 420 and a second The reflector mounting bracket 430 is connected to the fuse-type housing 130. The first longitudinal end is a first upright component of the first reflector mounting bracket 420. The element 422 and the second upright component 424 of the first reflector mounting bracket 420 and a fuse mold located between the fuse mold housing 130 and opposite the first longitudinal end. A second longitudinal end of the housing 130 is attached to a second reflector mounting bracket 430. The third upright component 432 and the fourth upright component of the second reflector mounting bracket 430 The fuse-type housing 130 is attached to the fuse holder 434 so that it is positioned between the fuse-type housing 130 and the component 434. 140 can be detachably connected.

[0134] In some cases, the fuse-type housing 130 and fuse holder 140 may be DIN It can be configured to comply with the 72581 standard.

[0135] In some cases, the fuse holder 140 includes a reflector 145. 140, connected to a reflective surface (not shown) to reflect the thermal radiation in a desired direction. Specifically, the fuse holder 140 can be disposed within a substrate of a reflective surface. The substrate is designed to reflect the thermal radiation in a desired direction. When the thermal radiation emitting device 110 is connected to the fuse holder 140, the thermal radiation emitting device 110 located within the substrate, such that the thermal radiation emitted by the thermal radiation emitting device 110 is It is reflected in the direction.

[0136] Attention is now directed to FIGS. 6A and 6B, which respectively illustrate the subject matter of the present disclosure. 1A and 1B are front and rear views of a thermal radiation emitting device 110 having a thermal radiation emitting element 120 according to the present invention. FIG. 1 is a schematic diagram of an example.

[0137] In accordance with the subject matter of the present disclosure, in some cases, the thermal radiation emitting device 110 may be, for example, a printed It includes a heat radiation emitting element 120 attached to a housing 130, which is a printed circuit board (PCB). The thermal radiation emitting element 120 may be configured to be oriented between 0° and 90° from the vertical axis "z". It may be at an angle.

[0138] In some cases, the thermal radiation emitting element 120 may comprise an array of CNTs.

[0139] The thermal radiation emitting element 120 is defined by two opposing electrodes 620-a and 620-b. The thermal radiation emitting element may extend between two spaced apart, opposing solid surfaces. 120 is connected by its two opposite ends to two opposing The electrodes 620-a and 620-b may be connected to The thermal radiation emitting element 120 may include an array of CNTs. In some cases, the CNT array is divided into two pairs by its two opposite ends. The electrodes 620-a and 620-b may be connected to the electrodes 620-a and 620-b. -b can extend along the space between

[0140] In some cases, as shown in FIGS. 6A and 6B, the surface of the thermal radiation emitting element 120 The majority of the volume is not in contact with any solid surface.

[0141] In some cases, as shown in FIGS. 6A and 6B, the thermal radiation emitting element 120 The two electrodes 620-a and 620-b to which the ends of the radiation emitting element 120 are attached The cross-sectional dimensions of the two surface areas and the space between electrodes 620-a and 620-b define The aspect ratio between the length of the thermal radiation emitting element 120 and the length of each of the two surface areas is An aspect ratio where the cross-sectional dimension "x" is larger than the space "y" between electrodes 620-a and 620-b. The thermal radiation emitting element 120 may be configured to have an array of CNTs. In some cases, the array of CNTs is connected to two electrodes 620-a to which the ends of the array are attached. and 620-b, and the cross-sectional dimensions of the two surface areas of electrodes 620-a and 620-b. The aspect ratio between the length of the array defined by the space between the two surface areas is The cross-sectional dimension "x" of each of the regions is greater than the space "y" between electrodes 620-a and 620-b. The optical element may be configured to have a large aspect ratio.

[0142] The thermal radiation emitting device 110 includes a first electrical connector 622-a that connects to the electrode 620-a. , and a second electrical connector 622-b that connects to electrode 620-b. .

[0143] In some cases where the thermal radiation emitting element 120 comprises an array of CNTs, the thermal radiation emitting element 1 The current through 20 is aligned with the length of the CNT fibers and passes through electrodes 620-a and 620-b. can flow between them along the direction "y".

[0144] As shown in FIG. 6B, in some cases, electrodes 620-a and 620-b may be used for heat dissipation. The radiation emitting element 120 is configured to act as a heat sink to remove the heat generated by the radiation emitting element 120. It can be done.

[0145] As shown in FIGS. 6A and 6B, the two surfaces of electrodes 620-a and 620-b The cross-sectional dimension "x" of each of the regions is less than the space "y" between electrodes 620-a and 620-b. In some cases with large aspect ratios, this aspect ratio allows for a small energy loss while still providing a large energy loss. This allows for maximum surface area for the electrodes 620-a and 620-b, thus providing a thermal radiation emitting element. 120 to optimally use the electrical energy supplied to heat the thermal radiation emitting element 120 Furthermore, the thermal radiation emitting element 120 can be configured such that the spatial dimension "y" is 6A and 6B. The thermal radiation emitting element 120 shown in FIG. 1 is such that the space "y" between the electrodes is not in contact with any solid, uncooled surface. Furthermore, this aspect ratio ( x > y) is the aspect ratio where the cross-sectional dimension x is smaller than the spatial dimension y. at least one thermal radiation emitting element 120 emits thermal radiation at a higher pulse rate compared to It can make it possible to do this.

[0146] In some cases, the thermal signature generating device 100 has one thermal radiation emitting element 120. In such a case, the thermal radiation emitting device 110 may be configured to include one thermal radiation emitting device 110. The radiation emitting device 110 controls the current through the thermal radiation emitting element 120 according to the thermal signature to be generated. a control unit 150 configured and operable to generate a control signal for controlling It may be configured to include

[0147] Alternatively, in some cases, the thermal signature generating device 100 may generate a plurality of corresponding thermal radiation emissions. The thermal radiation emitting device 110 may be configured to include a plurality of thermal radiation emitting devices 110 each having an emitting element 120. In this case, the thermal signature generating device 100 generates a plurality of heat radiation signals according to the thermal signature to be generated. configured and operative to generate a control signal for controlling the current through the radiating element 120 The control unit 150 may be configured to include a

[0148] Attention is now directed to FIGS. 7A and 7B, which respectively illustrate the subject matter of the present disclosure. 1A and 1B are front and rear views of another thermal radiation emitting device 110 having a thermal radiation emitting element 120 according to the present invention. FIG. 10 is a schematic diagram of another example of the

[0149] In accordance with the subject matter of the present disclosure, in some cases, the thermal radiation emitting device 110 may be, for example, a printed It includes a heat radiation emitting element 120 attached to a housing 130, which is a printed circuit board (PCB). In some cases, the housing 130 includes a male connector 715. The male connector 715 may be configured such that the axis of the male connector 715 is perpendicular to the female connector. Regardless of the rotation angle of the male connector 715 about the center, the thermal radiation emitting device 110 is This allows for a detachable connection to the

[0150] In some cases, the thermal radiation emitting element 120 may be configured to include an array of CNTs. .

[0151] The thermal radiation emitting element 120 is defined by two opposing electrodes 720-a and 720-b. The thermal radiation emitting element may extend between two spaced apart, opposing solid surfaces. 120 is connected by its two opposite ends to two opposing The electrodes 720-a and 720-b may be connected to The thermal radiation emitting element 120 may include an array of CNTs. In some cases, the CNT array is divided into two pairs by its two opposite ends. The electrodes 720-a and 720-b may be connected to the electrodes 720-a and 720-b. It can extend along the space between 0-b.

[0152] In some cases, as shown in FIGS. 7A and 7B, the surface of the thermal radiation emitting element 120 The majority of the volume is not in contact with any solid surface.

[0153] In some cases, as shown in FIGS. 7A and 7B, the thermal radiation emitting element 120 The two electrodes 720-a and 720-b to which the ends of the radiation emitting element 120 are attached The cross-sectional dimensions of the two surface areas and the space between electrodes 720-a and 720-b define The aspect ratio between the length of the thermal radiation emitting element 120 and the length of each of the two surface areas is An aspect ratio where the cross-sectional dimension "x" is larger than the space "y" between electrodes 720-a and 720-b. The thermal radiation emitting element 120 may be configured to have an array of CNTs. In some cases, the array of CNTs is connected to two electrodes 720-a to which the ends of the array are attached. and 720-b, and the cross-sectional dimensions of the two surface areas of electrodes 720-a and 720-b. The aspect ratio between the length of the array defined by the space between the two surface areas Each cross-sectional dimension "x" is greater than the space "y" between electrodes 720-a and 720-b. It can be configured to have an aspect ratio.

[0154] Furthermore, in some cases where the thermal radiation emitting element 120 comprises an array of CNTs, The current through the output element 120 is aligned with the length of the CNT fibers and passes through electrodes 720-a and 720-b. It can flow between 0 and b along the direction "y".

[0155] As shown in FIG. 7B, in some cases, electrodes 720-a and 720-b may be used for heat dissipation. The radiation emitting element 120 is configured to act as a heat sink to remove the heat generated by the radiation emitting element 120. It can be done.

[0156] As shown in FIGS. 7A and 7B, the cross-sectional dimension "x" of each of the two surface regions is In some cases, the aspect ratio is larger than the space "y" between 720-a and 720-b. In this case, this aspect ratio is required to minimize energy loss while maintaining the The thermal radiation emitting element 120 is preferably a material that has a maximum surface area, and therefore is preferably a material that is heat resistant. It allows optimal use of the electrical energy supplied for heating. The radiation-emitting element 120 can be moved more quickly than if the spatial dimension "y" were greater than the cross-sectional dimension "x". In addition, the thermal radiation emitting element 120 shown in FIGS. , the space between the electrodes "y" is not in contact with any solid, uncooled surface, so Furthermore, this aspect ratio ("x" > "y") is Compared to the case where the aspect ratio is smaller than the space "y", there is at least one thermal radiation This can enable the radiation element 120 to emit thermal radiation at a higher pulse rate. .

[0157] In some cases, the thermal signature generating device 100 has one thermal radiation emitting element 120. In such a case, the thermal radiation emitting device 110 may be configured to include one thermal radiation emitting device 110. The radiation emitting device 110 controls the current through the thermal radiation emitting element 120 according to the thermal signature to be generated. a control unit 150 configured and operable to generate a control signal for controlling It may be configured to include

[0158] Alternatively, in some cases, the thermal signature generating device 100 may generate a plurality of corresponding thermal radiation emissions. The thermal radiation emitting device 110 may be configured to include a plurality of thermal radiation emitting devices 110 each having an emitting element 120. In this case, the thermal signature generating device 100 generates a plurality of heat radiation signals according to the thermal signature to be generated. configured and operative to generate a control signal for controlling the current through the radiating element 120 The control unit 150 may be configured to include a

[0159] Attention is now directed to FIGS. 8A and 8B, which respectively illustrate the subject matter of the present disclosure. A series of thermal radiation emitting elements (e.g., 120-a, 120-b, 120-c, 120 1A-C are schematic diagrams of an example of a front and rear view of a thermal radiation emitting device 110 having a thermal radiation emitting device 110A having a thermal radiation emitting device 110B and a thermal radiation emitting device 110C.

[0160] According to the subject matter of the present disclosure, in some cases, the thermal radiation emitting device 110 may include a series of thermal radiation emitting devices. The outlet element (e.g., 120-a, 120-b, 120-c, 120-d) and the housing 1 30. The thermal radiation emitting elements (e.g., 120-a, 120-b, 120-c, 120-d) are connected to the housing 130 as described in detail below. The housing 130 may be connected between any two solid surfaces. may be a printed circuit board (PCB).

[0161] One thermal radiation emitting element (e.g., 120-a, 120-b, 120-c, 120-d) Each of the electrodes is located between two spaced apart, opposing solid surfaces defined by two opposing electrodes. To illustrate this, attention is directed to FIG. 8B, which shows The thermal radiation emitting element 120-a is connected to two opposing electrodes 820-a and 820-b. 8B shows a cross-sectional view of a solid surface extending between two opposing, spaced apart solid surfaces. As shown, all remaining thermal radiation emitting elements of the thermal radiation emitting device 110 (e.g., 12 0-b, 120-c, 120-d) also have two separations defined by two opposing electrodes. Each electrode of the opposing electrodes extends between spaced apart solid surfaces, and in FIG. are shown by parallel, closely spaced dashed lines.

[0162] As shown in FIG. 8B, the thermal radiation emitting elements (e.g., 120-a, 120-b, 120 -c, 120-d) each of which is connected by its two opposite ends to two opposing may be connected to the electrodes, respectively, along the space between the electrodes (e.g., having a length "y"). It can be extended.

[0163] In some cases, thermal radiation emitting elements (e.g., 120-a, 120-b, 120-c, 1 20-d) each of which may comprise an array of CNTs, the array having two opposite orientations The ends of the electrodes are connected to the two opposing electrodes, respectively, and the space between the electrodes (e.g. For example, the length "y" of the wire.

[0164] In some cases, as shown in FIGS. 8A and 8B, each thermal radiation emitting element (e.g., For example, most of the surface area of ​​120-a, 120-b, 120-c, and 120-d) is There is no contact with any solid surface.

[0165] In some cases, as shown in FIGS. 8A and 8B, each thermal radiation emitting element (e.g., 120-a) is a heat radiation emitting element (e.g., 120-a) attached to the end of each heat radiation emitting element (e.g., 120-a). The cross-sectional dimensions of the two surface areas of the two electrodes (e.g., 820-a and 820-b) to be and that defined by the space between the electrodes (e.g., 820-a and 820-b). Regarding the aspect ratio between the length of each thermal radiation emitting element (e.g., 120-a), The cross-sectional dimension "x" of each of the two surface regions is the electrode (e.g., 820-a and 820-b). The thermal radiation emission element may be configured to have an aspect ratio greater than the space "y" between the elements. Each of the elements (e.g., 120-a, 120-b, 120-c, 120-d) is an array of CNTs. In some cases, each respective thermal radiation emitting element (e.g., 120-a) The CNT array is attached to two electrodes (e.g., 820-a and 820-b) to which the ends of the array are attached. and 820-b) and the cross-sectional dimensions of the two surface areas of the electrodes (e.g., 820-a and 820 -b) the length of the array defined by the space "y" between The cross-sectional dimension "x" of each of the two surface regions is the electrode (e.g., 820-a and 820-b). , and may be configured to have an aspect ratio greater than the space "y" between them.

[0166] Furthermore, thermal radiation emitting elements (e.g., 120-a, 120-b, 120-c, 120-d In some cases, each of the thermal radiation emitting elements (e.g., For example, current passing through 120-a) is aligned along the length of the CNT fibers, resulting in the respective thermal radiation emissions. Electrodes (e.g., 820-a and 820-b) to which elements (e.g., 120-a) are attached b) can flow along the direction "y" between

[0167] As shown in FIG. 8B, in some cases, each thermal radiation emitting element (e.g., 120 -a, 120-b, 120-c, 120-d) attached electrodes (e.g., 820- a and 820-b) are the components that emit their associated thermal radiation (e.g., 120-a). The device may be configured to act as a heat sink to remove heat generated by the device.

[0168] As shown in FIGS. 8A and 8B, each thermal radiation emitting element (e.g., 120-a) The aspect ratio of each of the two surface areas of the electrodes (e.g., 820-a and 820-b) is The cross-sectional dimension "x" of each electrode is smaller than the space "y" between the electrodes (e.g., 820-a and 820-b). In some cases, the aspect ratio of each thermal radiation emitting element (e.g., 12 0-a) is a method for minimizing energy loss while maintaining the stability of the electrodes (e.g., 820-a and 820-b). The maximum surface area possible allows for the electrical energy supplied to be converted into thermal radiation. It can be optimally used to heat the element (e.g., 120-a). Each thermal radiation emitting element (e.g., 120-a) is arranged such that the spatial dimension "y" is greater than the cross-sectional dimension "x". Each heat radiation emitting element (e.g., 120 - a) the space "y" smaller than the cross-sectional dimension "x" contains one large thermal radiation emitting element Instead of providing a thermal radiation emitting device 110, a series of thermal radiation emitting elements (e.g., 120-a, a thermal radiation emitting device 110 including a thermal radiation emitting element 120-b, 120-c, 120-d) Each thermal radiation emitting element (e.g., 120-a, 120-b, 120-c, 120-d) extending between two spaced apart, opposing solid surfaces defined by two opposing electrodes. Furthermore, each of the thermal radiation emitting elements (e.g., 120- The inter-electrode spacing "y" associated with any fixed Since the thermal radiation emitting elements (e.g., 120-a, 120 -b, 120-c, 120-d) can be cooled more quickly. The aspect ratio of the emitting element (e.g., 120-a) is determined by the aspect ratio of the electrodes (e.g., 820-a and The cross-sectional dimension "x" of each of the two surface areas of the electrodes (e.g., 820-a and 820-b) is and 820-b) is larger than the space "y" between them, The exit elements (e.g., 120-a, 120-b, 120-c, 120-d) have cross-sectional dimensions "x The higher pulse rate is achieved compared to the case where the aspect ratio is smaller than the spatial dimension y. It can emit thermal radiation.

[0169] As shown in FIGS. 8A and 8B, each thermal radiation emitting element (e.g., 120-a, 120-b, 120-c, 120-d) are connected to the two opposing electrodes, For example, in the view of FIG. 8A, the housing 130 The front portion includes electrical connections 812, 814, 816, and 818. Additionally, the diagram of FIG. 1, the rear of the housing 130 includes electrical connections 822, 824, 826, and 828. 8. Opposing electrodes of the thermal radiation emitting element 120-a are connected to the electrical connection portions 812 and 813, respectively. and 822, and the opposing electrodes of the thermal radiation emitting element 120-b are connected to the electrical connections 814 and 824, and the opposing electrodes of the thermal radiation emitting element 120-c are connected to The opposing electrodes of the thermal radiation emitting element 120-d are connected to the electrical connections 816 and 826. , connected to electrical connections 818 and 828, respectively.

[0170] The control unit 150 (not shown in FIGS. 8A and 8B) is configured and operable to generate a control signal for controlling the current through each of the thermal radiation emitting elements (e.g., 120-a, 120-b, 120-c, 120-d) according to the generated heat signal. Here, referring to FIGS. 9A and 9B, FIGS. 9A and 9B are schematic views of an example of a front view and a rear view of a thermal radiation emitting device 110 having a plurality of thermal radiation emitting elements 120 in a disk configuration according to the subject matter of the present disclosure. According to the subject matter of the present disclosure, in some cases, the thermal radiation emitting device 110 may be configured to include a plurality of thermal radiation emitting elements 120, and at least one of the thermal radiation emitting elements 120 (e.g., 120-a) can be oriented in a first direction and operate to emit first thermal radiation in the first direction, and at least one other thermal radiation emitting element (e.g., 120-e) of the thermal radiation emitting elements 120 can be oriented in a second direction other than the first direction and operate to emit second thermal radiation in the second direction. An example of such a thermal radiation emitting device 110 is shown in FIGS. 9A and 9B. In the figures of FIGS. 9A and 9B, the thermal radiation emitting device 110 includes a housing 130 having a disk configuration, and the housing 130 includes three side surfaces (e.g., 915-a, 915-b, 915-c). Each of the side surfaces (e.g., 915-a, 915-b, 915-c) includes a plurality of thermal radiation emitting elements 120 oriented in a given direction.

[0171] Here, referring to FIGS. 9A and 9B, FIGS. 9A and 9B are schematic views of an example of a front view and a rear view of a thermal radiation emitting device 110 having a plurality of thermal radiation emitting elements 120 in a disk configuration according to the subject matter of the present disclosure. The thermal radiation emitting device 110 according to the subject matter of the present disclosure has a plurality of thermal radiation emitting elements 120 in a disk configuration. It is a schematic view of an example of a front view and a rear view.

[0172] According to the subject matter of the present disclosure, in some cases, the thermal radiation emitting device 110 may be configured to include a plurality of thermal radiation emitting elements 120. At least one of the thermal radiation emitting elements 120 (e.g., 120-a) can be oriented in a first direction and operate to emit first thermal radiation in the first direction. At least one other thermal radiation emitting element (e.g., 120-e) of the thermal radiation emitting elements 120 can be oriented in a second direction other than the first direction and operate to emit second thermal radiation in the second direction. At least one of the thermal radiation emitting elements 120 can be oriented in a first direction and operate to emit first thermal radiation in the first direction. <00​​​​​​​​​​​​​​​​The thermal radiation emitting elements 120 housed on each side of the side (e.g., 915-a, 915-b, 915-c) For example, thermal radiation emission housed on the other side of 915-a, 915-b, 915-c) 9A and 9B, the housing 130 faces in a different direction than the element 120. The first side 915-a of the light source 915 faces a first direction and is movable to emit thermal radiation in the first direction. The thermal radiation emitting elements 120-a, 120-b, 120-c, and 120 Furthermore, the second side 915-b of the housing 130 may be oriented in a direction other than the first direction. a thermal radiation emitter operable to point in two directions and emit thermal radiation in the second direction; The housing includes elements 120-e, 120-f, 120-g, and 120-h. The third side surface 915-c of the block 130 faces a third direction other than the first direction and the second direction. a thermal radiation emitting element 120- operable to emit thermal radiation in a third direction; Includes i, 120-j, 120-k, and 120-l.

[0174] Thermal radiation emitting elements (e.g., 120-a, 120-b, 120-c, 120-d, 120 -e, 120-f, 120-g, 120-h, 120-i, 120-j, 120-k, 1 20-1) are attached to two respective fixed portions of the housing 130, as will be described in detail below. In some cases, the housing 130 may be a printed circuit board. It may be a printed circuit board (PCB).

[0175] Thermal radiation emitting elements (e.g., 120-a, 120-b, 120-c, 120-d, 120 -e, 120-f, 120-g, 120-h, 120-i, 120-j, 120-k, 1 20-1) have been described in detail herein above, with particular reference to FIGS. 8A and 8B. As mentioned, two spaced apart opposing solid surfaces defined by two opposing electrodes It can extend between.

[0176] Furthermore, thermal radiation emitting elements (e.g., 120-a, 120-b, 120-c, 120-d , 120-e, 120-f, 120-g, 120-h, 120-i, 120-j, 120 -k, 120-l) each of which is connected by its two opposite ends to two opposing The electrodes may each be connected to a space between the electrodes (e.g., having a length "y"). It can exist.

[0177] In some cases, thermal radiation emitting elements (e.g., 120-a, 120-b, 120-c, 1 20-d, 120-e, 120-f, 120-g, 120-h, 120-i, 120-j , 120-k, 120-l) can each comprise an array of CNTs, the array comprising: connected by its two opposite ends to two respective opposing electrodes, It extends along the space between the electrodes (eg, having a length "y").

[0178] In some cases, as shown in FIGS. 9A and 9B, each thermal radiation emitting element (e.g., ba, 120-a, 120-b, 120-c, 120-d, 120-e, 120-f, 12 Large surface area of ​​0-g, 120-h, 120-i, 120-j, 120-k, 120-l) The moiety is not in contact with any solid surface.

[0179] In some cases, as shown in FIG. 9B, each thermal radiation emitting element (e.g., 120- d) is a pair of terminals to which the ends of the respective thermal radiation emitting elements (e.g., 120-d) are attached. The cross-sectional dimensions of the two surface areas of the electrodes (e.g., 920-a and 920-b) and the electrode ( For example, the respective thermal radiation determined by the space between 920-a and 920-b). The aspect ratio between the length of the emitting element (e.g., 120-d) and the surface area of ​​the two The cross-sectional dimension "x" of each of the regions is the space " y”. 120-a, 120-b, 120-c, 120-d, 120-e, 120-f, 120- g, 120-h, 120-i, 120-j, 120-k, 120-l) are CNTs In some cases with an array, each respective thermal radiation emitting element (e.g., 120-d ) CNT arrays are attached to two electrodes (e.g., 920-a) to which the ends of the array are attached. and 920-b) and the cross-sectional dimensions of the two surface areas of the electrodes (e.g., 920-a and 9 20-b) the aspect ratio between the length of the array defined by the space "y" between and the cross-sectional dimension "x" of each of the two surface areas "x" is the same as that of the electrodes (e.g., 920-a and 9 20-b) can be configured to have an aspect ratio greater than the space "y" between them.

[0180] Furthermore, thermal radiation emitting elements (e.g., 120-a, 120-b, 120-c, 120-d , 120-e, 120-f, 120-g, 120-h, 120-i, 120-j, 120 In some cases, each of the CNT arrays (120-k, 120-l) comprises a CNT array. The current passing through the emitting element (e.g., 120-d) is aligned with the length of the CNT fiber, Each thermal radiation emitting element (e.g., 120-d) is attached to an electrode (e.g., 920- 920-a and 920-b) along the direction "y".

[0181] As shown in FIG. 9B, in some cases, each thermal radiation emitting element (e.g., 120 -a, 120-b, 120-c, 120-d, 120-e, 120-f, 120-g, 1 20-h, 120-i, 120-j, 120-k, 120-l) attached electrodes ( 920-a and 920-b) are connected to their associated thermal radiation emitting elements (e.g., 20-d) is configured to function as a heat sink to remove heat generated by obtain.

[0182] The aspect ratio of each thermal radiation emitting element (e.g., 120-a) is The cross-sectional dimension "x" of each of the two surface areas of the electrode (e.g., 9 Some of the spaces between 920-a and 920-b) have an aspect ratio greater than "y". In this case, each heat radiation emitting element (e.g., 120-d) This allows for maximum surface area for the electrodes (e.g., 920-a and 920-b), thus providing The supplied electrical energy heats each of the heat radiation emitting elements (e.g., 120-d). Furthermore, each heat radiation emitting element (e.g., 120- d) can be cooled more quickly than if the space "y" were larger than the cross-sectional dimension "x". The cross-sectional dimension "x" of each thermal radiation emitting element (e.g., 120-a) is smaller than the cavity. The space "y" is one large heat radiation emitter on each side of the housing 130 having a disk configuration. Instead of providing a thermal radiation emitting device 110 containing an emitting element, a series of multiple thermal radiation emitting elements may be provided. elements (e.g., a series of thermal radiation emitting elements 120-a, 120-b, 120-c, 120-d) a thermal radiation emitting device 110 including a series of thermal radiation emitting elements (e.g., 120-a , 120-b, 120-c, 120-d) are connected to two opposing electrodes. By extending between two spaced apart, opposing solid surfaces defined by Furthermore, each of the thermal radiation emitting elements (e.g., 120-a, 120-b, 120- c, 120-d, 120-e, 120-f, 120-g, 120-h, 120-i, 12 0-j, 120-k, 120-l) the space between the electrodes "y" is any solid non-cooled Since the thermal radiation emitting elements (e.g., 120-a, 120-b, 120-c) are not in contact with the cooling surface, 20-c, 120-d, 120-e, 120-f, 120-g, 120-h, 120-i , 120-j, 120-k, 120-l) can be cooled more quickly. The aspect ratio of each thermal radiation emitting element (e.g., 120-a) is adjusted to the aspect ratio of the electrode (e.g., 820- The cross-sectional dimension "x" of each of the two surface areas of the electrode (e.g., 820 By making the aspect ratio larger than the space "y" between 820-a and 820-b), Thermal radiation emitting elements (e.g., 120-a, 120-b, 120-c, 120-d, 120- e, 120-f, 120-g, 120-h, 120-i, 120-j, 120-k, 12 0-l) is the case where the aspect ratio is such that the cross-sectional dimension "x" is smaller than the spatial dimension "y" It can emit thermal radiation at a higher pulse rate than conventional lasers.

[0183] Each of the thermal radiation emitting elements (e.g., 120-a, 120-b, 120-c, 120-d, 120-e, 120-f, 120-g, 120-h, 120-i, 120-j, 120- k, 120-l) to connect the two opposing electrodes to their respective electrical connections. (not shown in Figures 9A and 9B).

[0184] A control unit 150 (not shown in FIGS. 9A and 9B) determines the thermal signature to be generated. According to the nature of the thermal radiation emitting element (e.g., 120-a, 120-b, 120-c, 120 -d, 120-e, 120-f, 120-g, 120-h, 120-i, 120-j, 1 20-k, 120-l) and configured to generate a control signal for controlling the current through each of the It may be configured and operable.

[0185] Referring now to FIG. 10, a method 100 for generating a thermal signature in accordance with the subject matter of the present disclosure. Let us take a look at the flowchart showing an example of this.

[0186] In accordance with the subject matter of the present disclosure, two pairs of electrical interfaces 132 of housing 130 The facing electrode supplies current through at least one thermal radiation emitting element 120 to generate at least Each thermal radiation emitting element 120 is configured to emit thermal radiation for generating a thermal signature. Each of the at least one thermal radiation emitting element 120 may be configured as follows: and a carbon nanotube extending between two spaced apart opposing solid surfaces defined by The array comprises an array of carbon nanotubes (CNTs), the array being connected by its two opposite ends to the two The electrodes are connected to the opposing electrodes, and extend along the space between the electrodes. A current is provided through element 120 (block 1004).

[0187] Regarding FIG. 10, it is possible to decompose a block into several blocks and / or It should be noted that other blocks may be added. are described with reference to the elements of the system that realizes them, but this is by no means binding. Rather, the blocks may be performed by elements other than those described herein. be.

[0188] The subject matter of this disclosure may have applications as described in the description contained herein or as illustrated in the drawings. It should be understood that the present disclosure is not limited to the details shown in the drawings. It is possible that various embodiments may be practiced and carried out in various ways. Therefore, the phraseology and terminology used herein is for the purpose of description and not of limitation. Therefore, it should be understood that those skilled in the art, based on the present disclosure, The underlying concepts may be used to provide other structures, methods, and methods for carrying out some of the purposes of the subject matter of this disclosure. It will be appreciated that the results can easily be used as a basis for designing systems and methods.

[0189] Also, systems in accordance with the subject matter of the present disclosure may be implemented, at least in part, by suitably programmed It will be understood that the present invention can be implemented as a computer. The disclosed subject matter includes computer-readable programs for performing the disclosed methods. The subject matter of the present disclosure also contemplates computer programs for carrying out the methods of the present disclosure. machine-readable memory tangibly embodying a program of instructions that can be executed by a machine Li is also planning.

Claims

[Claim 1] at least one thermal radiation emitting element, each of the at least one thermal radiation emitting element extending between two spaced apart opposing solid surfaces defined by two opposing electrodes, comprising an array of carbon nanotubes (CNTs) connected by two opposite ends of the array to the two opposing electrodes, respectively, and extending along a space between the electrodes, the electrodes supplying an electric current through the thermal radiation emitting element to cause the thermal radiation emitting element to emit thermal radiation for generating a thermal signature; Heat signature generator.

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