Lighting device and lamp including the same

Abstract

To provide a lighting device and a lamp capable of realizing a uniform line light source or a surface light source.SOLUTION: The lighting device includes a reflective layer, a first resin layer on the reflective layer, a substrate on the first resin layer, a light emitting element between the first resin layer and the substrate, a second resin layer on the substrate, a half mirror layer on the second resin layer, and an optical member between the second resin layer and the half mirror layer, wherein light emitted through a light emitting surface of the light emitting element is reflected by the reflective layer and passes through the substrate, the light in the visible wavelength band may include a first wavelength band and a second wavelength band having different wavelength bands from each other, the half mirror layer may have a reflectance with respect to the light in the first wavelength band higher than a transmittance of the light in the first wavelength band, and the optical member may have a transmittance with respect to the light in the first wavelength band higher than a transmittance of the light in the second wavelength band.SELECTED DRAWING: Figure 1

Description

[Technical Field]

[0001] The embodiments relate to a lighting device and a lamp including the same. [Background technology]

[0002] Lighting devices, which provide light or adjust the amount of light, are used in a variety of fields. For example, lighting devices are applied to various fields, such as vehicles and buildings, to brighten the interior or exterior of a room. Recently, light-emitting devices have been used as lighting sources. Light-emitting devices, such as light-emitting diodes (LEDs), have advantages over existing light sources, such as fluorescent lamps and incandescent lamps, including low power consumption, a semi-permanent lifespan, fast response speed, safety, and environmental friendliness. Light-emitting diodes are applied to various optical assemblies, such as various display devices and interior and exterior lamps. Vehicles generally use lamps of various colors and shapes, and recently, lamps using light-emitting diodes as vehicle light sources have been proposed. For example, light-emitting diodes are used in vehicle headlights, taillights, turn signals, and the like. However, light-emitting diodes have a problem in that the angle of light emission is relatively small. Therefore, when light-emitting diodes are used as vehicle lamps, there is a demand for an increased light-emitting area. When light-emitting diodes are used in lamps, heat generated during operation of the light-emitting diodes can degrade the performance of the light-emitting diodes or reduce the uniformity of the light they emit.

[0003] When a lamp includes a light emitting diode, there is a problem that hot spots are formed by the light emitted from the light emitting diode, and in this case, when a surface light source is realized using the lamp, there is a problem that the uniformity of the light emitting surface is deteriorated.

[0004] Generally, when light-emitting diodes are applied to vehicle lamps, there is a problem that the light-emitting diodes are visible from the outside. For example, when the vehicle lamp is turned on, the light emitted from the light source makes the light-emitting diode invisible, but when the lamp is turned off, the light-emitting diodes are visible from the outside, which reduces the aesthetic appeal and design freedom of the lamp. Therefore, a new lighting device and lamp that can solve the above-mentioned problem are needed. Summary of the Invention [Problem to be solved by the invention]

[0005] The embodiments provide a lighting device and a lamp that can realize a uniform line light source or a surface light source. The embodiments provide a lighting device and a lamp that have improved aesthetics. The embodiments provide a lighting device and a lamp that can compensate for the optical spectrum of light emitted from a light emitting element. The embodiments provide a lighting device and a lamp that have improved heat dissipation characteristics. [Means for solving the problem]

[0006] An illumination device according to an embodiment of the invention includes a reflective layer, a first resin layer disposed on the reflective layer, a substrate disposed on the first resin layer, a light-emitting element disposed between the first resin layer and the substrate, a second resin layer disposed on the substrate, a half mirror layer disposed on the second resin layer, and an optical element disposed between the second resin layer and the half mirror layer, wherein light emitted through a light-emitting surface of the light-emitting element is reflected by the reflective layer and passes through the substrate, and light in the visible light wavelength band includes a first wavelength band having a partial wavelength band and a second wavelength band having a wavelength band different from the first wavelength band, and the half mirror layer has a reflectivity for light in the first wavelength band higher than a transmittance for light in the first wavelength band, and the optical element has a transmittance for light in the first wavelength band higher than a transmittance for light in the second wavelength band.

[0007] According to an embodiment of the invention, the optical member may include a first optical layer disposed between the second resin layer and the half mirror layer, and a second optical layer disposed between the first optical layer and the half mirror layer. The second wavelength band may include a 2-1 wavelength band and a 2-2 wavelength band different from the 2-1 wavelength band, and the first optical layer may have a higher transmittance for light in the 2-1 wavelength band than for light in the 2-2 wavelength band, and the second optical layer may have a higher transmittance for light in the 2-2 wavelength band than for light in the 2-1 wavelength band. Each of the first and second optical layers may have a thickness of 150 μm or less. The light emitting element may include a plurality of light emitting elements spaced apart from each other, and each of the plurality of light emitting elements may emit white light.

[0008] According to an embodiment of the present invention, the light-shielding device may further include a light-shielding layer disposed between the substrate and the optical member, the light-shielding layer including a plurality of light-shielding patterns formed on at least one of an upper surface and a lower surface of the light-shielding layer, and a portion of the light-shielding patterns being disposed in an area vertically overlapping with the light-emitting element.

[0009] According to an embodiment of the invention, an illumination device according to the embodiment includes a reflective layer, a first resin layer disposed on the reflective layer, a substrate disposed on the first resin layer, a light-emitting element disposed between the first resin layer and the substrate, a second resin layer disposed on the substrate, a half mirror layer disposed on the second resin layer, and an optical element disposed between the reflective layer and the first resin layer, wherein light emitted through a light-emitting surface of the light-emitting element passes through the optical element, is reflected by the reflective layer, and passes through the substrate, and light in the visible light wavelength band includes a first wavelength band having a partial wavelength band and a second wavelength band having a wavelength band different from the first wavelength band, and the half mirror layer has a reflectance for light in the first wavelength band higher than a transmittance for light in the first wavelength band, and the optical element has a transmittance for light in the first wavelength band higher than a transmittance for light in the second wavelength band.

[0010] According to an embodiment of the invention, the optical member may include a first optical layer disposed between the reflective layer and the first resin layer, and a second optical layer disposed between the first optical layer and the first resin layer. The second wavelength band may include a 2-1 wavelength band and a 2-2 wavelength band different from the 2-1 wavelength band, and the first optical layer may have a higher transmittance for light in the 2-1 wavelength band than the transmittance for light in the 2-2 wavelength band, and the second optical layer may have a higher transmittance for light in the 2-2 wavelength band than the transmittance for light in the 2-1 wavelength band.

[0011] According to an embodiment of the invention, a lighting device according to the embodiment includes a reflective layer, a first resin layer disposed on the reflective layer, a substrate disposed on the first resin layer, a light-emitting element disposed between the first resin layer and the substrate, a second resin layer disposed on the substrate, and a half mirror layer disposed on the second resin layer, wherein light emitted through a light-emitting surface of the light-emitting element is reflected by the reflective layer and passes through the substrate, the light-emitting elements include first to third light-emitting elements disposed adjacent to each other and forming a unit light-emitting group, the first light-emitting element emits red light, the second light-emitting element emits green light, and the third light-emitting element emits blue light, and the light in the visible light wavelength band includes a first wavelength band having a partial wavelength band and a second wavelength band having a wavelength band different from the first wavelength band, and the half mirror layer may have a reflectivity for light in the first wavelength band higher than a transmittance for light in the first wavelength band.

[0012] According to an embodiment of the invention, when the half mirror layer has a first color corresponding to the first wavelength band and the first color is red, the second light-emitting element may emit light at a luminous intensity lower than that of the first light-emitting element, and the light passing through the half mirror layer may be white. [Effects of the Invention]

[0013] The lighting device and lamp according to the embodiments can have improved light characteristics. Specifically, the lighting device and lamp can include a substrate, a reflective layer, a first resin layer, a second resin layer, etc., and the components can have a set thickness. As a result, light emitted from the light-emitting element and emitted outside the lighting device can have uniform brightness. Therefore, the lighting device and lamp can provide a line light source or a surface light source with improved light characteristics.

[0014] In the lighting device and lamp according to the embodiments, the light emitted from the light emitting element is not emitted directly but is emitted indirectly by being reflected by other internal components, thereby preventing the light emitting element from being directly viewed from the outside and ensuring a light guide distance for uniform brightness.

[0015] The lighting device and lamp according to the embodiments can prevent or minimize the occurrence of a hot spot phenomenon, which is a concentration of light emitted from a light emitting element. More specifically, the lighting device and lamp can control the concentration of light by controlling at least one of the half mirror layer and the light blocking pattern of the light blocking layer. As a result, the lighting device and lamp can provide light with uniform brightness.

[0016] The lighting device and lamp according to the embodiment may have improved heat dissipation characteristics. Specifically, the lighting device includes an electrode layer arranged in a predetermined pattern, and the electrode layer can effectively dissipate heat emitted from the light emitting element. Therefore, the lighting device and lamp according to the embodiment may have improved reliability and maintain uniform characteristics even when operated for a long time.

[0017] The lighting device and lamp according to the embodiments may have a hidden effect. Specifically, the lighting device and lamp may include a half-mirror layer having a hue that is the same as or similar to the color of the surrounding area. As a result, when the lighting device and lamp are turned off, the lighting device and lamp may not be visible or may be only minimally visible. The lighting device and lamp may also include an optical element that can compensate for the light spectrum that is changed by the half-mirror layer. As a result, when the lighting device and lamp are turned on, the hue of the light emitted from the lighting device and lamp may be prevented from being changed by the half-mirror layer and may be the same as or similar to the hue of the light emitted from the light-emitting element. Therefore, the lighting device and lamp according to the embodiments may have improved aesthetics and design freedom. [Brief explanation of the drawings]

[0018] [Figure 1] FIG. 1 is a cross-sectional view of a lighting device according to an embodiment. [Figure 2] FIG. 2 is an enlarged view of region A1 in FIG. [Figure 3] FIG. 2 is a plan view of a reflective layer according to an example. [Figure 4] FIG. 2 is an enlarged view of an optical member according to an example. [Figure 5] FIG. 10 is a cross-sectional view of the lighting device according to the embodiment in which a light-shielding layer is added. [Figure 6] FIG. 2 is a plan view of a light-shielding layer according to an example. [Figure 7] FIG. 10 is another cross-sectional view of the lighting device according to the embodiment. [Figure 8] FIG. 10 is another cross-sectional view of the lighting device according to the embodiment. [Figure 9] FIG. 10 is another cross-sectional view of the lighting device according to the embodiment. [Figure 10] FIG. 10 is a cross-sectional view of a lighting device according to a comparative example. [Figure 11] 10 is a diagram for explaining the light spectrum of an illumination device according to a comparative example. [Figure 12] 10 is a diagram for explaining the light spectrum of an illumination device according to a comparative example. [Figure 13] 2 is a diagram for explaining the light spectrum of the lighting device of FIG. 1. [Figure 14] 2 is a diagram for explaining the light spectrum of the lighting device of FIG. 1. [Figure 15] 2 is a diagram for explaining the light spectrum of the lighting device of FIG. 1. [Figure 16] FIG. 10 is a cross-sectional view of yet another lighting device according to the embodiment. [Figure 17] 17 is a diagram for explaining the light spectrum of the lighting device of FIG. 16. [Figure 18] 17 is a diagram for explaining the light spectrum of the lighting device of FIG. 16. [Figure 19] 17 is a diagram for explaining the light spectrum of the lighting device of FIG. 16. [Figure 20] 1 is a diagram illustrating an example in which a lamp including a lighting device according to an embodiment is applied to a vehicle. [Figure 21] 1 is a diagram illustrating an example in which a lamp including a lighting device according to an embodiment is applied to a vehicle. [Figure 22] 1 is a diagram illustrating an example in which a lamp including a lighting device according to an embodiment is applied to a vehicle. [Figure 23] 1 is a diagram illustrating an example in which a lamp including a lighting device according to an embodiment is applied to a vehicle. [Figure 24] 1 is a diagram illustrating an example in which a lamp including a lighting device according to an embodiment is applied to a vehicle. DETAILED DESCRIPTION OF THE INVENTION

[0019] DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings.

[0020] The technical concept of the present invention is not limited to the described embodiments and may be embodied in various forms. Elements of the embodiments may be selectively combined or substituted within the scope of the technical concept of the present invention. Furthermore, terms (including technical and scientific terms) used in the embodiments of the present invention, unless expressly specified, shall be interpreted as having meanings commonly understood by those skilled in the art to which the present invention pertains. Commonly used terms, such as dictionary-defined terms, shall be interpreted in light of the context of the relevant technology. Furthermore, the terms used in the embodiments of the present invention are intended to describe the embodiments and are not intended to limit the present invention. In this specification, the singular form "a," "an," or "an" may also include the plural form unless otherwise specified. For example, "at least one (or more) of A and B and C" refers to any combination of A, B, and C that can be combined. Furthermore, when describing elements of the embodiments of the present invention, terms such as "first," "second," "A," "B," "(a)," and "(b)" may be used. These terms are used to distinguish elements from other elements, and do not limit the nature or order of the elements. Furthermore, when a component is described as being "coupled," "coupled," or "connected" to another component, this includes both cases where the component is directly coupled or connected to the other component, and cases where further components are "coupled," "coupled," or "connected" between the components. Furthermore, when a component is described as being formed or located "above or below" another component, "above or below" does not only include cases where the two components are in direct contact, but also cases where one or more further components are formed or located between the two components. Furthermore, when the term "above or below" is used, it can mean not only the upper direction but also the lower direction based on one component.

[0021] The lighting device according to the present invention can be applied to various lamp devices requiring illumination, such as vehicle lamps, household optical assemblies, and industrial optical assemblies. For example, when applied to vehicle lamps, it can be used in headlamps, side mirror lights, side marker lights, fog lamps, tail lamps, brake lights, daytime running lights, vehicle interior lighting, door scuffs, rear combination lamps, and backup lamps. When applied to vehicle lamps, it can be used in rear side support systems (BSDs) located on side mirrors or A-pillars. The optical assembly of the present invention can also be used in indoor and outdoor advertising devices, display devices, and various train applications. It can also be used in all lighting-related and advertising-related fields that are currently being developed and commercialized, or that will be realized through future technological advances.

[0022] Before describing the embodiments of the present invention, the first direction may refer to the x-axis direction in the drawings, the second direction may refer to the y-axis direction in the drawings, and the third direction may refer to the z-axis direction in the drawings. Furthermore, the horizontal direction may refer to the first and second directions, and the vertical direction may refer to the third direction as a direction perpendicular to at least one of the first and second directions. For example, the horizontal direction may refer to the x-axis and y-axis directions in the drawings, and the vertical direction is the z-axis direction in the drawings, a direction perpendicular to the x-axis and y-axis directions.

[0023] Fig. 1 is a cross-sectional view of an illumination device according to an example, and Fig. 2 is an enlarged view of an A1 region in Fig. 1. Fig. 3 is a plan view of a reflective layer according to an example, and Fig. 4 is an enlarged view of an optical member according to an example.

[0024] 1 to 4 , a lighting device 1000 according to an embodiment may include a substrate 100, a light emitting device 200, a reflective layer 300, a first resin layer 410, a second resin layer 420, a half mirror layer 610, and an optical member 630. The lighting device 1000 may emit light emitted from the light emitting device 200 as a surface light source. The lighting device 1000 may be defined as a light emitting cell, a lighting module, or a light source module. The lighting device 1000 may include one or more light emitting cells on the substrate 100. The lighting device 1000 may emit light emitted from the light emitting device 200 as a surface light source. The lighting device 1000 may be defined as a light emitting cell, a lighting module, or a light source module. The lighting device 1000 may include one or more light emitting cells on the substrate 100.

[0025] The substrate 100 may include a light-transmitting material. The substrate 100 may include a material that transmits light through its upper and lower surfaces. The substrate 100 may be a transparent substrate. The substrate 100 may include at least one of PET (Polyethylene terephthalate), PS (Polystyrene), PI (Polyimide), PEN (Polyethylene naphthalate), and PC (Polycarbonate). The substrate 100 may have a thickness of 20 μm or more, for example, 20 μm to 300 μm. Specifically, the substrate 100 may have a thickness of 30 μm to 250 μm. More specifically, the substrate 100 may have a thickness of 50 μm to 200 μm. If the substrate 100 has a thickness of less than 20 μm, it may be difficult to effectively support a component disposed thereon, such as the light emitting device 200, and a problem may occur in which a region of the substrate 100 where the light emitting device 200 is disposed sags due to the weight of the light emitting device 200. This may reduce the reliability of the substrate 100 and cause alignment problems for the light emitting device 200 disposed on the substrate 100. If the thickness of the substrate 100 exceeds 300 μm, the overall thickness of the lighting device 1000 increases and the flexibility of the substrate 100 decreases. In addition, if the thickness of the substrate 100 exceeds 300 μm, the path of emitted light changes depending on the thickness of the substrate 100, making it difficult to realize a uniform surface light source.

[0026] An electrode layer (not shown) is disposed on the substrate 100. The electrode layer is disposed on the lower surface of the substrate 100. More specifically, the electrode layer is disposed on the lower surface of the substrate 100 facing the first resin layer 410. The electrode layer may include a first electrode (not shown) and a second electrode (not shown). The first electrode and the second electrode may be spaced apart from each other on the lower surface of the substrate 100. For example, the first electrode and the second electrode may be spaced apart in a first direction based on the light emitting device 200. This allows the first electrode and the second electrode to be electrically isolated from each other. The first electrode and the second electrode may include a conductive material. For example, the first electrode and the second electrode may include at least one of aluminum (Al), copper (Cu), silver (Ag), gold (Au), chromium (Cr), nickel (Ni), molybdenum (Mo), titanium (Ti), alloys thereof, carbon, and conductive polymers. The first electrode and the second electrode are made of a transparent conductive material, for example, ITO (indium tin oxide). The light emitting element 200 may include at least one of: IZO (indium zinc oxide), IZTO (indium zinc tin oxide), IAZO (indium aluminum zinc oxide), IGZO (indium gallium zinc oxide), IGTO (indium gallium tin oxide), AZO (aluminum zinc oxide), ATO (antimony tin oxide), and GZO (gallium zinc oxide). The first electrode and the second electrode may provide a current to the light emitting element 200. For example, the first electrode may provide a current having a first polarity to the light emitting element 200, and the second electrode may provide a current of a second polarity opposite to the first polarity to the light emitting element 200.

[0027] The first electrode and the second electrode may have a predetermined shape on the substrate 100. For example, each of the first and second electrodes may include a plurality of sub-wirings extending in different directions. The sub-wirings have a predetermined line width and are arranged in a mesh shape intersecting each other on the substrate 100. As a result, an opening formed by the sub-wirings is formed on the substrate 100. Here, the opening is an area where the first and second electrodes are not arranged, and light provided to the substrate 100 can travel toward the upper or lower surface of the substrate 100 through the opening. That is, the first electrode and the second electrode form openings having a predetermined shape and size, which can smoothly emit light emitted from the light emitting device 200 in an upward direction and provide a path for effectively dissipating heat emitted from the light emitting device 200. As a result, the lighting device 1000 may have improved light emission and heat dissipation characteristics.

[0028] The light emitting device 200 is disposed on the substrate 100. For example, the light emitting device 200 is disposed on the lower surface of the substrate 100. The light emitting device 200 is disposed opposite the reflective layer 300, which will be described later. The light emitting device 200 includes an LED chip emitting light from at least five sides and may be disposed on the substrate 100 in a flip-chip configuration. Alternatively, the light emitting device 200 may be a horizontal or vertical chip. The horizontal chip has two different electrodes arranged horizontally, while the vertical chip has two different electrodes arranged vertically. The horizontal or vertical chip light emitting device 200 is connected to other chips or wiring patterns via wires. This increases the thickness of the module depending on the height of the wires, and requires pad space for wire bonding. The light emitting device 200 may include a package in which an LED chip is packaged. The LED chip can emit at least one of blue, red, green, ultraviolet (UV), and infrared light, and the light emitting device 200 can emit at least one of white, blue, red, green, and infrared light. The light emitting device 200 may be a top view type in which a bottom portion thereof is electrically connected to the substrate 100. The optical axis of the light emitting device 200 may be perpendicular to the bottom surface of the substrate 100.

[0029] The light emitting device 200 is electrically connected to the electrode layer. For example, the light emitting device 200 is electrically connected to a first electrode and a second electrode on the substrate 100 by a conductive bonding member (not shown). The conductive bonding member may be made of a solder material or a metal material. A plurality of the light emitting devices 200 may be arranged on the substrate 100. For example, as shown in FIG. 1, a plurality of light emitting devices 200a and 200b are arranged on the substrate 100, spaced apart in a first direction (x-axis direction). Although not shown in the drawing, a plurality of light emitting devices 200 are arranged on the substrate 100, spaced apart in a second direction (y-axis direction). For example, the plurality of light emitting devices 200 are arranged in a row x b columns (a and b are natural numbers that may be the same or different) in a plan view.

[0030] The light emitting device 200 may include a light emitting surface from which light is emitted. The light emitting surface of the light emitting device 200 may face the top surface of the reflective layer 300. The light emitting surface may be parallel to the top surface of the reflective layer 300. The light emitting surface of the light emitting device 200 may emit light with the highest intensity in the third direction (z-axis direction), for example, in the direction of the top surface of the reflective layer 300. The light emitting surface may be a vertical plane or may include a concave or convex surface.

[0031] The light emitting device 200 may emit light toward the reflective layer 300. For example, light emitted through a light emitting surface of the light emitting device 200 is provided to the reflective layer 300. The light provided to the reflective layer 300 is reflected by the reflective layer 300 and emitted toward the substrate 100, and the light passing through the substrate 100 may have the form of a line light source or a surface light source. That is, the lighting device 1000 may be an indirect lighting device. This prevents the light emitting device 200 from being viewed from the outside. In this case, the optical axis of the light emitting device 200 may be perpendicular to the bottom surface of the substrate 100. Alternatively, the optical axis of the light emitting device 200 may be perpendicular to the top surface of the reflective layer 300.

[0032] The reflective layer 300 is disposed on the substrate 100. More specifically, the reflective layer 300 is disposed on the lower surface of the substrate 100. The reflective layer 300 is disposed on the lower surface of the substrate 100 and below the light emitting element 200. The reflective layer 300 is spaced apart from the substrate 100 and the light emitting element 200 and faces the light emitting surface of the light emitting element 200. The reflective layer 300 may have an area greater than or equal to the area of ​​the lower surface of the substrate 100.

[0033] The reflective layer 300 may include a film layer (not shown). The film layer may be provided in the form of a film made of a metallic or non-metallic material. The metallic material may include metals such as aluminum, silver, and gold. The non-metallic material may include plastic or resin materials. The plastic material may be any one selected from the group consisting of polyethylene, polypropylene, polystyrene, polyvinyl chloride, polychlorinated biphenyl, polyethylene terephthalate, polyvinyl alcohol, polycarbonate, polybutylene terephthalate, polyethylene naphthalate, polyamide, polyacetal, polyphenylene ether, polyamide-imide, polyether-imide, polyether-ether-ketone, polyimide, polytetrafluoroethylene, liquid crystal polymer, fluororesin, copolymers thereof, and mixtures thereof. The resin material may be silicone or epoxy to which a reflective material, for example, a metal oxide such as TiO2, Al2O3, or SiO2, is added. The film layer may be implemented as a single layer or multiple layers, and such a layer structure can improve light reflection efficiency. The film layer may also be provided in a color. Specifically, the film layer may be provided in a color having low light absorption and excellent light reflectance. For example, the film layer may be provided in a white color having excellent light reflectance. Specifically, the film layer may be formed of white polyethylene naphthalate.

[0034] The reflective layer 300 may have a thickness of 50 μm or more, for example, a thickness in the range of 50 μm to 500 μm. Specifically, the reflective layer 300 may have a thickness of 80 μm to 400 μm. More specifically, the reflective layer 300 may have a thickness of 100 μm to 300 μm. If the thickness of the reflective layer 300 is less than 50 μm, the light reflection characteristics of the reflective layer 300 may be reduced, thereby reducing the reliability of the lighting device 1000. Furthermore, if the thickness of the reflective layer 300 exceeds 500 μm, the overall thickness of the lighting device 1000 increases, thereby reducing the flexibility of the lighting device 1000. Preferably, the reflective layer 300 may have a thickness of 80 μm to 350 μm, taking into consideration reliability, light reflection characteristics, etc.

[0035] The reflective layer 300 may include reflective patterns 310. The reflective patterns may have a plurality of dot shapes. The reflective patterns 310 are disposed on the lower surface of the substrate 100 and on the upper surface of the reflective layer 300 facing the light emitting device 200. The reflective patterns 310 are disposed in a protruding form on the upper surface of the reflective layer 300. For example, the reflective patterns 310 are disposed in a protruding form on the upper surface of the reflective layer 300 toward the light emitting device 200.

[0036] The reflective patterns 310 are spaced apart in the first and second directions and disposed in an area not corresponding to the light emitting device 200. Specifically, the reflective patterns 310 are disposed in an area not overlapping the light emitting device 200 in the vertical direction (third direction, z-axis direction). The reflective patterns 310 may be formed by a printing process. For example, the reflective patterns 310 may include reflective ink. The reflective patterns 310 may be printed using a material including any one of TiO2, CaCO3, BaSO4, Al2O3, silicon, and PS. The reflective patterns 310 may be made of white material, which has excellent reflective properties. The reflective patterns 310 may have various shapes, such as a circle, an ellipse, or a polygon, when viewed from above. Furthermore, each of the reflective patterns 310 may have a hemispherical or polygonal side cross section. The dot pattern density of the reflective patterns 310 may vary as the distance from the area corresponding to the light emitting device 200 increases. For example, the density of the reflective patterns 310 may increase as the distance from the overlapping region of the upper surface of the reflective layer 300 that vertically overlaps with the light emitting device 200 increases. That is, the density of the reflective patterns 310 may increase with increasing horizontal distance from the optical axis of the light emitting device 200. Furthermore, the size of each of the reflective patterns 310 may vary with increasing distance from the overlapping region. For example, the horizontal width of each of the reflective patterns 310 may increase with increasing distance from the overlapping region. The width of each of the reflective patterns 310 may increase with increasing horizontal distance from the optical axis of the light emitting device 200. That is, since the reflective patterns 310 are disposed on the upper surface of the reflective layer 300 that does not overlap with the light emitting device 200, the reflective layer 300 can improve the reflectivity of light emitted from the light emitting device 200. Therefore, the lighting device 1000 can reduce the loss of light emitted to the outside through open regions on the substrate 100 where no electrode layer is disposed, thereby improving the brightness of the surface light source.

[0037] The first resin layer 410 is disposed on the substrate 100. The first resin layer 410 is disposed on the lower surface of the substrate 100. The first resin layer 410 is disposed between the substrate 100 and the reflective layer 300. The first resin layer 410 is disposed between the lower surface of the substrate 100 and the upper surface of the reflective layer 300. The first resin layer 410 is disposed on the entire lower surface of the substrate 100 or a partial region thereof. The first resin layer 410 may be formed of a transparent material. The first resin layer 410 may include a resin material such as silicone or epoxy. The first resin layer 410 may include a thermosetting resin material, such as PC, OPS, PMMA, or PVC. The first resin layer 410 may be formed of glass, but is not limited thereto. For example, the first resin layer 410 may be primarily formed of a resin material containing urethane acrylate oligomer as a main raw material. For example, a mixture of a synthetic oligomer, urethane acrylate oligomer, and a polymer type, polyacrylic, can be used. Of course, a monomer containing a low-boiling point dilutable reactive monomer, such as IBOA (isobornyl acrylate), HPA (Hydroxylpropyl acrylate), or 2-HEA (2-hydroxyethyl acrylate), can be further included, and a photoinitiator (e.g., 1-hydroxycyclohexyl phenyl-ketone) or an antioxidant can be added as an additive. The first resin layer 410 is a resin layer that guides light, and is therefore thinner than glass and can be provided as a flexible plate. The first resin layer 410 can convert the point light emitted from the light emitting device 200 into a linear or planar light source.

[0038] The upper surface of the first resin layer 410 may diffuse light emitted from the light emitting device 200 to emit light. For example, beads (not shown) may be included in the first resin layer 410, and the beads may diffuse and reflect incident light to increase the amount of light. The beads may be disposed in a range of 0.01 to 0.3% by weight of the first resin layer 410. The beads may be made of any one selected from the group consisting of silicone, silica, glass bubbles, PMMA (Polymethyl methacrylate), urethane, Zn, Zr, Al2O3, and acrylic, and may have a particle size ranging from 1 μm to 20 μm, but is not limited thereto.

[0039] The first resin layer 410 may have a thickness greater than that of the light emitting device 200. For example, the first resin layer 410 may have a thickness of 4 mm or less. Specifically, the first resin layer 410 may have a thickness of 0.5 mm to 3 mm or less. More specifically, the first resin layer 410 may have a thickness of 1 mm to 3 mm. More specifically, the first resin layer 410 may have a thickness of 1.5 mm to 2.5 mm. If the thickness h1 of the first resin layer 410 is less than 0.5 mm, it is difficult to effectively guide the light emitted from the light emitting device 200. That is, the gap between the light emitting device 200 and the reflective layer 300 is too small, making it difficult for the lighting device 1000 to implement a surface light source. Furthermore, if the thickness h1 of the first resin layer 410 exceeds 4 mm, the overall light path increases. As a result, light loss occurs during the process of emitting light from the light emitting device 200. Therefore, it is preferable that the thickness h1 of the first resin layer 410 satisfies the above-mentioned range. The first resin layer 410 is disposed to surround the light emitting device 200. The first resin layer 410 can seal the light emitting device 200. The first resin layer 410 can protect the light emitting device 200 and reduce loss of light emitted from the light emitting device 200. The first resin layer 410 can be in contact with a surface of the light emitting device 200 and an emission surface of the light emitting device 200. In addition, the first resin layer 410 can be in contact with a lower surface of the substrate 100 and an upper surface of the reflective layer 300. That is, the first resin layer 410 can support the substrate 100, the light emitting element 200, and the reflective layer 300, and can maintain the components 100, 200, and 300 at a set interval and at a set position.

[0040] The second resin layer 420 is disposed on the substrate 100. The second resin layer 420 is disposed on the upper surface of the substrate 100, opposite the lower surface of the substrate 100 on which the first resin layer 410 is disposed. The second resin layer 420 is disposed on the entire upper surface of the substrate 100 or on a partial region thereof. The second resin layer 420 may be formed of a transparent material. The second resin layer 420 may include a resin material such as silicone or epoxy. The second resin layer 420 may include a thermosetting resin material, such as PC, OPS, PMMA, or PVC. The second resin layer 420 may be formed of glass, but is not limited thereto. For example, the main material of the second resin layer 420 may be a resin material whose main ingredient is urethane acrylate oligomer. For example, a mixture of a synthetic oligomer, urethane acrylate oligomer, and a polymer type such as polyacrylic may be used. Of course, the second resin layer 420 may further include a monomer containing a low-boiling point dilute reactive monomer such as IBOA (isobornyl acrylate), HPA (Hydroxylpropyl acrylate), or 2-HEA (2-hydroxyethyl acrylate), and may further include a photoinitiator (e.g., 1-hydroxycyclohexyl phenyl-ketone) or an antioxidant as an additive. The second resin layer 420 may include the same material as the first resin layer 410.

[0041] The second resin layer 420 serves as a light-guiding layer. For example, the second resin layer 420 may guide incident light that passes through the substrate 100. More specifically, the second resin layer 420 may further diffuse light that is reflected by the reflective layer 300 and passes through the first resin layer 410 and the substrate 100. For example, the second resin layer 420 may include beads (not shown), which may diffuse and reflect incident light to increase the amount of light. The beads may be disposed in a range of 0.01 to 0.3% by weight of the second resin layer 420. The beads may be made of any one selected from the group consisting of silicone, silica, glass bubbles, PMMA (Polymethyl methacrylate), urethane, Zn, Zr, Al2O3, and acrylic, and may have a particle size ranging from 1 μm to 20 μm, but are not limited thereto.

[0042] The second resin layer 420 may function as an adhesive layer. For example, the second resin layer 420 may be provided as an adhesive layer that bonds the substrate 100 disposed below the second resin layer 420 to the components disposed above it. The second resin layer 420 may have a predetermined thickness h2. For example, the thickness h2 of the second resin layer 420 may be 2 mm or less. Specifically, the thickness h2 of the second resin layer 420 may be 50 μm to 1.5 mm. More specifically, the thickness h2 of the second resin layer 420 may be 100 μm to 1 mm. If the thickness h2 of the second resin layer 420 is less than 50 μm, it may be difficult for the second resin layer 420 to function as an adhesive layer that bonds the substrate 100 to the components disposed above it, and it may be difficult to effectively guide light incident on the second resin layer 420. That is, because the thickness h2 of the second resin layer 420 is relatively thin, there may be insufficient space for guiding light emitted through the substrate 100. Furthermore, if the lighting device 1000 is bent in a third direction, for example, into a wave shape, due to an external force, the thickness h2 of the second resin layer 420 may be too thin to effectively guide the light emitted through the substrate 100 and the first resin layer 410. If the thickness h2 of the second resin layer 420 exceeds 2 mm, the overall thickness of the lighting device 1000 increases, reducing design freedom, and light loss occurs due to the thickness h2 of the second resin layer 420. Therefore, it is preferable that the thickness h2 of the second resin layer 420 satisfy the above-mentioned range.

[0043] The thickness h2 of the second resin layer 420 may be different from the thickness h1 of the first resin layer 410. Specifically, the thickness h2 of the second resin layer 420 may be thinner than the thickness h1 of the first resin layer 410. For example, the thickness h2 of the second resin layer 420 may be 0.03% to 95% of the thickness h1 of the first resin layer 410. As a result, the lighting device 1000 according to the embodiment can emit light with excellent uniformity. That is, the lighting device 1000 can provide a line or surface light source with excellent uniformity by having the first and second resin layers 410 and 420 satisfy the above-mentioned thickness ranges.

[0044] The half mirror layer 610 is disposed on the second resin layer 420. The half mirror layer 610 is disposed on the entire upper surface or a partial area of ​​the second resin layer 420. The half mirror layer 610 is provided with a planar area corresponding to that of the second resin layer 420. The half mirror layer 610 may include a metal. For example, the half mirror layer 610 may include at least one metal, such as aluminum (Al), silver (Ag), copper (Cu), nickel (Ni), gold (Au), platinum (Pt), titanium (Ti), or tungsten (W), provided in a thin film form. The half mirror layer 610 may include a substrate (not shown) and a metal layer (not shown). The substrate may include a material that can transmit light emitted from the light emitting device 200. For example, the substrate may be transparent. The metal layer may include at least one of various metals such as aluminum (Al), silver (Ag), copper (Cu), nickel (Ni), gold (Au), platinum (Pt), titanium (Ti), tungsten (W), etc. The metal layer may be formed on at least one of the one and other surfaces of the substrate by coating or deposition.

[0045] The half mirror layer 610 may have a predetermined thickness. For example, the thickness h3 of the half mirror layer 610 may be 100 μm or less to provide a semi-transmitting function. Specifically, the thickness h3 of the half mirror layer 610 may be 1 μm to 75 μm. More specifically, the thickness h3 of the half mirror layer 610 may be 1 μm to 50 μm. If the thickness h3 of the half mirror layer 610 is less than 1 μm, the semi-transmitting function of the half mirror layer 610 is reduced. Specifically, because the thickness of the half mirror layer 610 is relatively thin, components disposed in the lower region of the half mirror layer 610 are visible from the outside (the upper surface side of the half mirror layer 610). Furthermore, if the thickness h3 of the half mirror layer 610 exceeds 100 μm, the transmittance of light emitted from the light emitting device 200 is reduced. Specifically, the amount of light transmitted through the half mirror layer 610 is reduced depending on the thickness of the half mirror layer 610, thereby reducing the overall brightness of the lighting device 1000. The thickness h3 of the half mirror layer 610 is uniformly provided within the above-mentioned range. Specifically, the vertical thickness h3 of the half mirror layer 610 may be constant along the horizontal directions (x-axis and y-axis directions). Alternatively, the thickness h3 of the half mirror layer 610 may vary. For example, the thickness h3 of the half mirror layer 610 may be thicker in an area that vertically overlaps with the light emitting device 200 than in an area that does not overlap. Specifically, the thickness of the half mirror layer 610 in an area where a hot spot of the light emitting device 200 is formed may be thicker than the thickness of an area where a hot spot is not formed. For example, the half mirror layer 610 may have a concave-convex shape, and the cross section of the concave-convex shape may be a polygonal shape such as a semicircle, a triangle, or a polygon.

[0046] The half mirror layer 610 may provide a semi-transmissive function. The half mirror layer 610 may have a relatively low light transmittance and a relatively high reflectance for incident light of a color corresponding to the half mirror layer 610. For example, the visible light wavelength band may include a first wavelength band defined as a partial wavelength band and a second wavelength band having a wavelength band different from the first wavelength band. In this case, the half mirror layer 610 may have a first color corresponding to the first wavelength band. In this case, the half mirror layer 610 may have a relatively low transmittance for light of the first wavelength band and a relatively high reflectance for light of the first wavelength band. That is, the half mirror layer 610 may have a higher reflectance for light of the first wavelength band than the transmittance for light of the first wavelength band. Furthermore, the half mirror layer 610 may have a lower transmittance for light of the first wavelength band than the transmittance for light of the second wavelength band. As a result, the lighting device 1000 according to this embodiment may have improved aesthetics due to the half mirror layer 610 having a predetermined light transmittance and reflectance. In detail, when the lighting device 1000 emits light, the light emitted from the light emitting device 200 is provided to the outside through the half mirror layer 610 .

[0047] When the lighting device 1000 does not emit light, a first color, which is the hue of the half mirror layer 610, is visible from the outside, thereby improving aesthetics. For example, when the lighting device 1000 does not emit light, the half mirror layer 610 is provided to have a color that is the same as or similar to the color of the surrounding area of ​​the lighting device 1000. As a result, the lighting device 1000 may have a hidden effect that prevents or minimizes visibility from the outside. The half mirror layer 610 may be relatively thick in an area corresponding to a hot spot formed by the light emitting element 200, thereby effectively preventing the hot spot phenomenon. As a result, light emitted through the half mirror layer 610 may have uniform brightness, and the lighting device 1000 may provide a line light source or a surface light source with improved light characteristics.

[0048] An optical member 630 is disposed on the second resin layer 420. The optical member 630 is disposed between the second resin layer 420 and the half mirror layer 610. The optical member 630 may prevent or minimize a change in the color of light emitted through the lighting device 1000 from the color of light emitted from the light emitting device 200. More specifically, the optical member 630 may compensate for a light spectrum that is changed by the half mirror layer 610. The optical member 630 may include a material that can control the transmittance, reflectance, etc. of light in a set wavelength band. For example, the optical member 630 may include a material such as metal, resin, ceramic, etc., and may be provided in the form of a film or a prism sheet.

[0049] The optical member 630 may have a predetermined thickness. For example, the thickness h4 of the optical member 630 may be 300 μm or less. Specifically, the thickness h4 of the optical member 630 may be 1 μm to 300 μm. More specifically, the thickness h4 of the optical member 630 may be 1 μm to 250 μm.

[0050] If the thickness h4 of the optical member 630 is less than 1 μm, the optical spectrum compensation function is insufficient. Specifically, because the thickness h4 of the optical member 630 is relatively thin, the optical spectrum compensation effect of the half mirror layer 610 is insufficient. As a result, the hue of the light emitted to the outside of the lighting device 1000 does not correspond to the hue of the light emitted from the light emitting device 200. If the thickness h4 of the optical member 630 exceeds 300 μm, the transmittance of the light emitted from the light emitting device 200 decreases. Specifically, because the thickness of the optical member 630 is relatively thick, the amount of light transmitted through the optical member 630 decreases, thereby reducing the overall brightness of the lighting device 1000. Furthermore, if the thickness h4 of the optical member 630 is too thick, the optical spectrum compensation function is degraded. As a result, the hue of the light emitted to the outside of the lighting device 1000 does not correspond to the hue of the light emitted from the light emitting device 200. Preferably, when the optical member 630 is provided in the form of a thin film, the thickness h4 of the optical member 630 may be 1 μm to 150 μm, and when the optical member 630 is provided in the form of a prism sheet, the thickness h4 of the optical member 630 may be 50 μm to 250 μm.

[0051] The optical member 630 may provide an optical spectrum compensation function through the half mirror layer 610. For example, the half mirror layer 610 may be provided in the first color, and the transmittance for light in the first wavelength band may be lower than the transmittance for light in the second wavelength band. In this case, the optical member 630 is provided to have a higher transmittance for light in the first wavelength band than the transmittance for light in the second wavelength band. As a result, the optical spectrum of the light emitted from the light emitting device 200 is compensated due to the difference in optical transmittance depending on the wavelength band while passing through the optical member 630 and the half mirror layer 610. Therefore, the light emitted to the outside of the lighting device 1000 may have a color corresponding to the light emitting device 200, for example, a color that is the same as or similar to the color of the light emitted from the light emitting device 200.

[0052] For example, an embodiment may include a plurality of light emitting elements 200, each of which may emit light of the same color, for example, white. The half mirror layer 610 may be provided in a first color, e.g., red, and may have a relatively low transmittance for light in a first wavelength band corresponding to the first color and a relatively high transmittance for light in a second wavelength band. Thus, when white light emitted from the light emitting device 200 passes through the half mirror layer 610, the color of the transmitted light may be similar to cyan, rather than white. The optical member 630, located in the light emission path of the light emitting device 200, may have a relatively high transmittance for light in the first wavelength band and a relatively low transmittance for light in the second wavelength band, e.g., green and blue. That is, the optical member 630 may have a higher transmittance for red light than for green and blue light. As a result, the light emitted from the light emitting device 200 passes through the optical member 630 and the half mirror layer 610, respectively, and the optical spectrum is compensated due to the difference in transmittance between the wavelength bands of the optical member 630 and the half mirror layer 610, thereby improving luminance. Therefore, when white light is emitted from the light emitting element 200, the light emitted to the outside of the lighting device 1000 may have a color that is the same as or similar to the white light emitted from the light emitting element 200.

[0053] The optical member 630 may be provided as a single layer or multiple layers. For example, when the optical member 630 is provided as a single layer, the single layer may compensate for light in a wavelength band having a relatively low transmittance through the half mirror layer 610 and reduce the transmittance of light in a wavelength band having a relatively high transmittance through the half mirror layer 610. As a result, the optical member 630 may compensate for the optical spectrum that is changed by the half mirror layer 610. For example, the optical member 630 may be provided as multiple layers. For example, the optical member 630 may include a first optical layer 631 and a second optical layer 632. The first optical layer 631 is disposed between the second resin layer 420 and the half mirror layer 610. The second optical layer 632 is disposed between the first optical layer 631 and the half mirror layer 610.

[0054] Each of the first optical layer 631 and the second optical layer 632 may have a predetermined thickness. For example, the thickness h5 of the first optical layer 631 and the thickness h6 of the second optical layer 632 may be 150 μm or less. Specifically, the thickness h5 of the first optical layer 631 and the thickness h6 of the second optical layer 632 may be 0.5 μm to 125 μm. More specifically, the thickness h5 of the first optical layer 631 and the thickness h6 of the second optical layer 632 may be 0.5 μm to 100 μm. Preferably, the thickness h5 of the first optical layer 631 and the thickness h6 of the second optical layer 632 may be 0.5 μm to 75 μm for optical efficiency and luminous intensity compensation.

[0055] The first optical layer 631 and the second optical layer 632 may compensate for light in a wavelength band having a relatively low transmittance in the half mirror layer 610. For example, the second wavelength band of the visible light wavelength band may include a 2-1 wavelength band and a 2-2 wavelength band different from the 2-1 wavelength band. The first optical layer 631 may have a relatively high transmittance for light in the first wavelength band and the 2-1 wavelength band, and a relatively low transmittance for light in the 2-2 wavelength band. In this case, the transmittance of the first optical layer 631 for light in the first and 2-1 wavelength bands may be higher than the transmittance for light in the 2-2 wavelength band. The second optical layer 632 may have a relatively high transmittance for light in the first wavelength band and the 2-2 wavelength band, and a relatively low transmittance for light in the 2-1 wavelength band. In this case, the transmittance of the second optical layer 632 for light in the first and 2-2 wavelength bands may be higher than the transmittance for light in the 2-1 wavelength band.

[0056] The first and second optical layers 631 and 632 may compensate in advance for the optical spectrum that is changed by the half mirror layer 610. For example, each of the light emitting devices 200 may emit white light, and the first optical layer 631 may be provided in the first color, e.g., red. In this case, the first optical layer 631 has a relatively high transmittance for light in the first and 2-1 wavelength bands and a low transmittance for light in the 2-2 wavelength band. For example, the first optical layer 631 has a relatively high transmittance for light in wavelength bands corresponding to red and green and a relatively low transmittance for light in a wavelength band corresponding to blue.

[0057] The second optical layer 632 may have a relatively high transmittance for light in the first and 2-2 wavelength bands and a low transmittance for light in the 2-1 wavelength band. For example, the second optical layer 632 may have a relatively high transmittance for light in wavelength bands corresponding to red and blue and a relatively low transmittance for light in a wavelength band corresponding to green. As a result, the luminous intensity of the light L emitted from the light emitting device 200 is compensated due to the difference in transmittance depending on the wavelength band of each of the first and second optical layers 631, 632, and the half mirror layer 610 while passing through them, respectively. Therefore, when white light L is emitted from the light emitting device 200, the light L emitted to the outside of the lighting device 1000 may have the same or a similar color as the white light L emitted from the light emitting device 200.

[0058] The lighting device 1000 may further include a protective layer 500. The protective layer 500 is disposed on the substrate 100. The protective layer 500 is disposed on the second resin layer 420. The protective layer 500 is disposed on the half mirror layer 610. The protective layer 500 is disposed at the outermost periphery of the lighting device 1000. The protective layer 500 may include a light-transmitting material. More specifically, the protective layer 500 may include a material that transmits light passing through its upper and lower surfaces. That is, the protective layer 500 may be a light-transmitting layer. For example, the protective layer 500 may include at least one of PET (Polyethylene terephthalate), PS (Polystyrene), PI (Polyimide), PEN (Polyethylene naphthalate), and PC (Polycarbonate). The protective layer 500 has a predetermined thickness to protect underlying components, such as the substrate 100, the first resin layer 410, the optical member 630, and the half mirror layer 610. For example, the protective layer 500 may have a thickness of 100 μm or more, for example, 100 μm to 2.5 mm. Specifically, the protective layer 500 may have a thickness of 200 μm to 2 mm. More specifically, the protective layer 500 may have a thickness of 1 mm to 2 mm. If the protective layer 500 has a thickness of less than 100 μm, it may be difficult to effectively protect the underlying components due to its relatively small thickness. Furthermore, if the protective layer 500 has a thickness exceeding 2.5 mm, the overall thickness of the lighting device 1000 increases, resulting in reduced brightness. Furthermore, if the protective layer 500 has a thickness exceeding 2.5 mm, the flexibility of the lighting device 1000 may be reduced due to its thickness. In this case, the applicable structures and shapes of the lighting device 1000 may be limited. Therefore, it is preferable that the thickness of the protective layer 500 satisfies the above-mentioned range.

[0059] Fig. 5 is a cross-sectional view of a lighting device according to an embodiment in which a light-shielding layer is added, and Fig. 6 is a plan view of the light-shielding layer according to an embodiment. In the description using Fig. 5 and Fig. 6, the description of the same or similar components as those in the lighting device described above will be omitted, and the same reference numerals will be used for the same or similar components.

[0060] 5 and 6, the lighting device 1000 according to the embodiment may include a light-blocking layer 700. The light-blocking layer 700 is disposed on the upper surface of the substrate 100. The light-blocking layer 700 is disposed on the second resin layer 420. The light-blocking layer 700 is disposed between the second resin layer 420 and the protective layer 500.

[0061] The light-shielding layer 700 may include a light-transmitting material. For example, the light-shielding layer 700 may include at least one of PET (Polyethylene terephthalate), PS (Polystyrene), PI (Polyimide), PEN (Polyethylene naphthalate), and PC (Polycarbonate). The light-shielding layer 700 may have a predetermined thickness. For example, the thickness of the light-shielding layer 700 may be 50 μm to 300 μm. Specifically, the thickness of the light-shielding layer 700 may be 80 μm to 250 μm. More specifically, the thickness of the light-shielding layer 700 may be 100 μm to 200 μm. If the thickness of the light-shielding layer 700 is less than 50 μm, it may be difficult to effectively block light incident from below the light-shielding layer 700. That is, the light-shielding layer 700 does not have a sufficient thickness to prevent hot spots from being formed. Also, if the thickness of the light-shielding layer 700 exceeds 300 μm, the light emitted from the light emitting device 200 can be effectively prevented from being formed hot spots, but the light emitted from the light emitting device 200 is lost while passing through the light-shielding layer 700, resulting in a decrease in overall brightness. Therefore, it is preferable that the thickness of the light-shielding layer 700 satisfies the above-mentioned range.

[0062] The light-shielding layer 700 may include a plurality of light-shielding patterns 710 spaced apart from one another in a first direction and a second direction. The light-shielding patterns 710 are formed on at least one of a lower surface facing the second resin layer 420 and an upper surface facing the protective layer 500. The light-shielding patterns 710 may block light emitted through the substrate 100. The light-shielding patterns 710 may include ink. For example, the light-shielding patterns 710 may be printed using a material including any one of TiO2, CaCO3, BaSO4, Al2O3, silicon, and PS. The light-shielding patterns 710 may be white, which has excellent reflective properties. The light-shielding patterns 710 may also be formed in the form of recesses on at least one of the upper and lower surfaces of the light-shielding layer 700. For example, when the light-blocking pattern 710 is formed on the upper surface of the light-blocking layer 700, the light-blocking pattern 710 may be provided in the form of a groove recessed from the upper surface of the light-blocking layer 700 toward the lower surface thereof.

[0063] The light-blocking patterns 710 are disposed in areas corresponding to the light-emitting devices 200 . More specifically, some of the light-shielding patterns 710 are disposed in an area that vertically overlaps the light-emitting device 200. The density of the light-shielding patterns 710 may vary with increasing distance from the area corresponding to the light-emitting device 200. For example, the density of the light-shielding patterns 710 may decrease with increasing distance from the area of ​​the light-shielding layer 700 that overlaps with the optical axis of the light-emitting device 200. The sizes of the light-shielding patterns 710 may decrease with increasing distance from the area that overlaps with the optical axis of the light-emitting device 200, or may be the same size. The light-shielding patterns 710 may have a predetermined shape. For example, when viewed from above, the light-shielding patterns 710 may have various shapes such as a polygon, a circle, an ellipse, etc. The light-shielding region formed by the light-shielding patterns 710 may have a shape close to a circle, as shown in FIG. 6. The light-shielding region formed by the light-shielding patterns 710 may have a predetermined area. For example, the area of ​​the light-shielding region may be larger than the area of ​​the bottom surface of the light-emitting element 200. As an example, the area of ​​the light-shielding region may be five times or more, for example, 5 to 20 times, the area of ​​the bottom surface of the light-emitting element 200. Specifically, the area of ​​the light-shielding region may be 8 to 15 times the area of ​​the bottom surface of the light-emitting element 200.

[0064] If the area of ​​the light-shielding region formed by the plurality of light-shielding patterns 710 is less than five times the area of ​​the bottom surface of the light emitting device 200, it is difficult to prevent hot spots from being formed by light passing through the substrate 100. Also, if the area of ​​the light-shielding region exceeds 20 times the area of ​​the bottom surface of the light emitting device 200, the light passing through the substrate 100 can be prevented from forming hot spots, but the overall brightness of the lighting device 1000 is reduced by the light-shielding patterns 710. Therefore, it is preferable that the light-shielding region formed by the plurality of light-shielding patterns 710 satisfy the above-mentioned range.

[0065] 7 to 9 are other cross-sectional views of the lighting device according to the embodiment. In the description using Fig. 7 to Fig. 9, the description of the same or similar components as those of the lighting device described above will be omitted, and the same reference numerals will be used for the same or similar components.

[0066] Referring to FIG. 7, the optical member 630 is disposed under the first resin layer 410 . The optical member 630 is disposed between the reflective layer 300 and the first resin layer 410 . Light emitted through the light-emitting surface of the light-emitting device 200 may be reflected by the reflective layer 300 and pass through the substrate 100, and in this process, may pass through the optical member 630. Specifically, light emitted from the light-emitting device 200 passes through the optical member 630, is provided to the reflective layer 300, is reflected by the reflective layer 300, passes through the optical member 630 again, and passes through the substrate 100. The optical member 630 may have a predetermined thickness. For example, the thickness h4 of the optical member 630 may be 300 μm or less. Specifically, the thickness h4 of the optical member 630 may be 1 μm or more, for example, 1 μm to 300 μm. More specifically, the thickness h4 of the optical member 630 may be 1 μm to 250 μm.

[0067] The optical member 630 may prevent or minimize a change in the color of light emitted through the lighting device 1000 from the color of light emitted from the light emitting device 200. Specifically, the optical member 630 may compensate in advance for a change in the light spectrum caused by the half mirror layer 610. For example, the half mirror layer 610 may be provided with a first color, i.e., red, and the light emitting device 200 may emit white light. In this case, the optical member 630 is provided to have a higher transmittance for light in the first wavelength band (red) than for light in the second wavelength band (green, blue). As a result, the light L emitted from the light emitting device 200 may have a color close to red while passing through the optical member 630. Thereafter, the light may pass through the half mirror layer 610, which has a relatively low transmittance for light in the first wavelength band. Therefore, the light L emitted to the outside of the lighting device 1000 may have the same or a similar color as the light emitted from the light emitting device 200.

[0068] 8 and 9, the optical member 630 may be provided in a multi-layer structure. The optical member 630 may include a first optical layer 631 and a second optical layer 632. First, referring to FIG. 8, the first optical layer 631 is disposed between the reflective layer 300 and the first resin layer 410, and the second optical layer 632 is disposed between the first optical layer 631 and the first resin layer 410. Alternatively, referring to FIG. 9, the first optical layer 631 is disposed between the reflective layer 300 and the first resin layer 410, and the second optical layer 632 is disposed between the second resin layer 420 and the half mirror layer 610.

[0069] Each of the first optical layer 631 and the second optical layer 632 may have a predetermined thickness. For example, the thickness h5 of the first optical layer 631 and the thickness h6 of the second optical layer 632 may be 150 μm or less. Specifically, the thickness h5 of the first optical layer 631 and the thickness h6 of the second optical layer 632 may be 0.5 μm to 125 μm. More specifically, the thickness h5 of the first optical layer 631 and the thickness h6 of the second optical layer 632 may be 0.5 μm to 100 μm. Preferably, the thickness h5 of the first optical layer 631 and the thickness h6 of the second optical layer 632 may be 0.5 μm to 75 μm for optical efficiency and optical spectrum compensation. The first optical layer 631 and the second optical layer 632 may compensate for light in a wavelength band whose transmittance is relatively low in the half mirror layer 610. For example, the first optical layer 631 may have a relatively high transmittance for light in the first and 2-1 wavelength bands and a relatively low transmittance for light in the 2-2 wavelength band, and the second optical layer 632 may have a relatively high transmittance for light in the first and 2-2 wavelength bands and a relatively low transmittance for light in the 2-1 wavelength band.

[0070] The first and second optical layers 631 and 632 may compensate in advance for the optical spectrum that is changed by the half mirror layer 610. For example, the half mirror layer 610 may be provided with a first color defined as red, and the light emitting device 200 may emit white light. In this case, the first optical layer 631 may be provided with a high transmittance for light in the first and 2-1 wavelength bands (red and green) and a low transmittance for light in the 2-2 wavelength band (blue). The second optical layer 632 may be provided with a high transmittance for light in the first and 2-2 wavelength bands (red and blue) and a low transmittance for light in the 2-1 wavelength band (green). As a result, light L emitted from the light emitting device 200 may have a color close to red while passing through the first optical layer 631 and the second optical layer 632. Thereafter, the light may pass through the half mirror layer 610, which has a relatively low transmittance for light in the first wavelength band. Therefore, the light L emitted to the outside of the lighting device 1000 may have the same or similar color as the light emitted from the light emitting element 200 .

[0071] Fig. 10 is a cross-sectional view of a lighting device according to a comparative example, and Figs. 11 and 12 are diagrams for explaining the optical spectrum of the lighting device according to the comparative example. Also, Figs. 13 to 15 are diagrams for explaining the optical spectrum by wavelength of the lighting device of Fig. 1.

[0072] The functions and effects of the present invention will be explained in more detail below with reference to comparative examples and examples.

[0073] <Comparative Example> A lighting device was manufactured by disposing a reflective layer 300, a first resin layer 410 disposed on the reflective layer 300, a substrate 100 disposed on the first resin layer 410, a light emitting element 200 disposed between the first resin layer 410 and the substrate 100, a second resin layer 420 disposed on the substrate 100, and a half mirror layer 610 on the second resin layer 420. The light emitting element 200 emits white light, and is disposed such that the light emitting surface of the light emitting element 200 faces the upper surface of the reflective layer 300. The half mirror layer 610 is provided in red, and is formed so that it is visible in red when the light emitting element 200 does not emit light.

[0074] <Example> Compared to the lighting device according to the comparative example, the lighting device was manufactured by further disposing an optical member 630 between the second resin layer 420 and the half mirror layer 610. In this case, the light emitting device 200 emitted white light, and the light emitting surface of the light emitting device 200 was disposed facing the upper surface of the reflective layer 300. In addition, the half mirror layer 610 was provided in red, and was formed so that it was visible in red when the light emitting device 200 did not emit light.

[0075] 10 to 12, the light emitting element 200 in the lighting device 1000 according to the comparative example can emit white light. Specifically, the light emitting element 200 can emit white light through its light-emitting surface, and the light can be reflected by the reflective layer 300 and pass through the substrate 100. The light can then pass through the half mirror layer 610. If the lighting device 1000 according to the comparative example does not include the half mirror layer 610, the light emitted from the lighting device 1000 has an optical spectrum as shown in FIG. 11 and is white. Furthermore, if the lighting device 1000 according to the comparative example includes the half mirror layer 610 having the first color, for example, red, the half mirror layer 610 has a reduced transmittance for light in a wavelength band corresponding to the first color. That is, the half mirror layer 610 has a low transmittance for light in a wavelength band corresponding to red. As a result, the light emitted from the lighting device 1000 after passing through the half mirror layer 610 has the optical spectrum shown in Fig. 12 and may have a color similar to cyan. That is, in the lighting device 1000 according to the comparative example, the light emitted from the light emitting element 200 and the light emitted to the outside of the lighting device 1000 have different hues.

[0076] However, in the lighting device 1000 according to the embodiment, the light emitted from the light emitting device 200 and the light emitted to the outside of the lighting device 1000 may have the same or similar color.

[0077] 13 to 15, the light emitting element 200 in the lighting device 1000 according to the embodiment can emit white light. Specifically, the light emitting element 200 can emit white light through the light emitting surface, and the light can be reflected by the reflective layer 300 and pass through the substrate 100. Thereafter, the light can pass through the optical member 630 and the half mirror layer 610. When the lighting device 1000 according to the embodiment does not include the optical member 630 and the half mirror layer 610, the light emitted from the lighting device 1000 has an optical spectrum as shown in FIG. 13 and has white color. When the lighting device 1000 according to the embodiment includes the optical member 630, the light emitted from the lighting device 1000 can have an optical spectrum as shown in FIG. 14 and has white color containing a small amount of red. Furthermore, when the lighting device 1000 according to the embodiment includes the optical member 630 and the half mirror layer 610, the light emitted from the lighting device 1000 may have a light spectrum as shown in FIG. 15 and may have white color. That is, in the lighting device 1000 according to the embodiment, the light emitted from the light emitting element 200 and the light emitted to the outside of the lighting device 1000 may be the same or similar to each other. As a result, the lighting device 1000 according to the embodiment may have improved aesthetics. More specifically, when the lighting device 1000 is turned on, the optical member 630 and the half mirror layer 610 cause light of the same hue as the light emitted from the light emitting element 200 to be emitted to the outside of the lighting device 1000. When the lighting device 1000 is turned off, the inside of the lighting device 1000 cannot be seen from the outside of the lighting device 1000, but the color of the half mirror layer 610 is seen. This allows the lighting device 1000 to have improved aesthetics.

[0078] Fig. 16 is yet another cross-sectional view of the lighting device according to the embodiment, and Figs. 17 to 19 are diagrams for explaining the light spectrum of the lighting device of Fig. 16. In the explanation using Figs. 16 to 19, explanations of components that are the same or similar to those of the lighting device described above will be omitted, and the same reference numerals will be used for the same or similar components.

[0079] 16 to 19, a lighting device 1000 according to the embodiment may include a substrate 100, a light emitting element 200, a reflective layer 300, a first resin layer 410, a second resin layer 420, and a half mirror layer 610. The lighting device 1000 of FIG. 16 may omit the optical member 630 compared to the lighting device 1000 described above. The light emitting element 200 is disposed on the substrate 100, with the light emitting surface facing the reflective layer 300. Thus, light emitted through the light emitting surface of the light emitting element 200 can be reflected by the reflective layer 300 and pass through the substrate 100. The light then passes through the half mirror layer 610 and is emitted to the outside of the lighting device 1000. A plurality of the light emitting elements 200 may be disposed on the substrate 100. Specifically, the light emitting element 200 may include a first light emitting element 201, a second light emitting element 202, and a third light emitting element 203 that are disposed adjacent to each other. The first to third light emitting elements 201, 202, and 203 may form one unit light emitting group. A plurality of the unit light emitting groups may be disposed on the substrate 100. For example, the substrate may include a plurality of unit light emitting groups spaced apart from each other in a first direction (x-axis direction) and / or a second direction (y-axis direction).

[0080] Each of the first to third light emitting elements 201, 202, and 203 can emit light of a predetermined color. Specifically, the first light emitting element 201 can emit red light, the second light emitting element 202 can emit green light, and the third light emitting element 203 can emit blue light. This allows the unit light emitting group to emit light of various colors. For example, the unit light emitting group can control the color of light passing through the half mirror layer 610 to white by controlling the luminous intensities of the first to third light emitting elements 201, 202, and 203. Specifically, if the lighting device 1000 does not include the half mirror layer 610, the light emitted from the lighting device 1000 has a light spectrum as shown in FIG. 17 and is white. Furthermore, when the lighting device 1000 includes the half mirror layer 610, light emitted from the lighting device 1000 may have an optical spectrum as shown in FIG. 18 and may have a color similar to cyan. The lighting device 1000 can compensate for the optical spectrum that varies depending on the half mirror layer 610. Specifically, the lighting device 1000 can compensate for the optical spectrum by controlling the luminous intensity of the light emitting element 200. For example, the half mirror layer 610 is provided in a first color, e.g., red. That is, the half mirror layer 610 has a relatively low transmittance for light in a first wavelength band corresponding to the first color and a relatively high transmittance for light in a second wavelength band, e.g., green and blue. In this case, the lighting device 1000 can control the luminous intensities of the first light emitting element 201, the second light emitting element 202, and the third light emitting element 203. In detail, in the lighting device 1000, the first light emitting element 201 corresponding to the light of the first wavelength band can emit light with high luminous intensity, and the second light emitting element 202 and the third light emitting element 203 corresponding to the light of the second wavelength band can emit light with lower luminous intensity than the first light emitting element 200. That is, the lighting device 1000 can control the luminous intensity of each of the plurality of light emitting elements 201, 202, and 203 included in the unit light emitting group in consideration of the light transmittance of the half mirror layer 610 according to the wavelength band.As a result, the light emitted from the lighting device 1000 has the light spectrum shown in FIG. 19 and can have white color.

[0081] Therefore, the lighting device 1000 according to the embodiment can have improved aesthetics. More specifically, when the lighting device 1000 is turned on, light of a set hue is emitted to the outside of the lighting device 1000. In this case, the hue of the light emitted to the outside of the lighting device 1000 may be different from the hue of the light emitted from the light emitting element 200 due to a difference in transmittance depending on the wavelength band of the half mirror layer 610. Furthermore, when the lighting device 1000 is turned off, the inside of the lighting device 1000 cannot be seen from the outside of the lighting device 1000, but the hue of the half mirror layer 610 is seen. As a result, the lighting device 1000 can have improved aesthetics.

[0082] 20 to 24 are diagrams illustrating examples in which a lamp including an illumination device according to an embodiment is applied to a vehicle.

[0083] Fig. 20 is a top view of a vehicle to which a lamp having the lighting device is applied. Fig. 21 shows an example in which the lighting device according to the embodiment is disposed at the front of the vehicle, and Fig. 22 shows an example in which the lighting device according to the embodiment is disposed at the rear of the vehicle. Figs. 23 and 24 are examples for explaining that the lighting device according to the embodiment operates as a hidden lamp at the front of the vehicle.

[0084] 20 to 24, the lighting device 1000 according to the embodiment can be applied to a lamp of a vehicle 2000. One or more of the lamps are disposed at at least one of the front, rear, and side of the vehicle 2000. The lighting device 1000 can be provided in various shapes, such as curved or straight, and can be applied to lamps disposed in various areas of the vehicle 2000. For example, referring to FIG. 21, the lamp can be applied to a front lamp 2100 of a vehicle. The front lamp 2100 can include a first cover member 2110 and at least one lamp module including the lighting device. The first cover member 2110 can accommodate the lamp module.

[0085] The front lamp 2100 can provide multiple functions by controlling the driving timing of the lighting device 1000 included in at least one lamp module disclosed above. For example, the front lamp 2100 can include a first lamp module 2120 and a third lamp module 2130 that provide at least one function of a headlight, a turn signal light, a daytime running light, a high beam, a low beam, and a fog lamp by emitting light from the lighting device 1000. In addition, the front lamp 2100 can provide additional functions such as a welcome light or a celebration effect when the driver opens the vehicle door.

[0086] Referring to FIG. 22, the lamp may be applied to a rear lamp 2200 of a vehicle. The rear lamp 2200 may include at least one lamp module including a second cover member 2210 and the lighting device 1000. The second cover member 2210 may accommodate the lamp module. The rear lamp 2200 may provide multiple functions by controlling the driving timing of the lighting device 1000 included in the at least one lamp module. For example, the rear lamp 2200 may include a second lamp module 2220 that provides at least one function of a side light, a brake light, and a turn signal light by emitting light from the lighting device 1000. At least one lamp module of the front lamp 2100 and the rear lamp 2200 may be provided in a color corresponding to the vehicle 2000. For example, referring to FIGS. 23 and 24, the front lamp 2100 may further include a fourth lamp module 2140, and the fourth lamp module 2140 may have a color corresponding to the vehicle 2000. 23, when the fourth lamp module 2140 is in an on state, the fourth lamp module 2140 may emit light of a set wavelength. For example, the fourth lamp module 2140 may emit white light to provide a function as a daytime running light.

[0087] 24, when the fourth lamp module 2140 is in an off state, the fourth lamp module 2140 may have a color corresponding to or similar to that of the vehicle 2000. For example, the fourth lamp module 2140 may have a color corresponding to or similar to that of the vehicle 2000 in an off state due to the half mirror layer 610 having a color corresponding to or similar to that of the vehicle 2000. As a result, when the turned-off fourth lamp module 2140 is viewed from the front of the vehicle 2000, the fourth lamp module 2140 may have a hidden effect in which it is not visible or its visibility is minimized, thereby providing improved aesthetics and design freedom.

[0088] The features, structures, effects, etc. described in the above embodiments are included in at least one embodiment of the present invention and are not necessarily limited to one embodiment. Furthermore, the features, structures, effects, etc. exemplified in each embodiment can be combined or modified in other embodiments by a person skilled in the art to which the embodiment belongs. Therefore, the contents related to such combinations and modifications should be interpreted as being included within the scope of the present invention.

[0089] Furthermore, although the above description has focused on the embodiments, these are merely examples and are not intended to limit the present invention. A person skilled in the art to which the present invention pertains may make various modifications and applications not exemplified above within the scope of the essential characteristics of the present embodiments. For example, each component specifically presented in the embodiments may be modified and implemented. Differences related to such modifications and applications should be construed as being included within the scope of the present invention as defined by the appended claims.

Claims

1. A reflective layer; a first resin layer disposed on the reflective layer; a substrate disposed on the first resin layer; a light emitting element disposed between the first resin layer and the substrate; a second resin layer disposed on the substrate; a half mirror layer disposed on the second resin layer; an optical member disposed between the second resin layer and the half mirror layer, Light emitted through the light emitting surface of the light emitting device is reflected by the reflective layer and passes through the substrate, the light in the visible light wavelength band includes a first wavelength band having a partial wavelength band and a second wavelength band having a wavelength band different from the first wavelength band, the half mirror layer has a reflectance for light in the first wavelength band higher than a transmittance for light in the first wavelength band, The optical member has a higher transmittance for light in the first wavelength band than a transmittance for light in the second wavelength band.

2. 2. The lighting device according to claim 1, wherein the optical member includes a first optical layer disposed between the second resin layer and the half mirror layer, and a second optical layer disposed between the first optical layer and the half mirror layer.

3. the second wavelength band includes a 2-1 wavelength band and a 2-2 wavelength band different from the 2-1 wavelength band; the first optical layer has a transmittance for light in the 2-1 wavelength band higher than a transmittance for light in the 2-2 wavelength band; The lighting device according to claim 2 , wherein the second optical layer has a transmittance for light in the 2-2 wavelength band higher than a transmittance for light in the 2-1 wavelength band.

4. The lighting device of claim 3 , wherein the first and second optical layers each have a thickness of 150 μm or less.

5. The light emitting device includes a plurality of light emitting devices spaced apart from one another, The lighting device according to claim 1 , wherein each of the plurality of light-emitting elements emits white light.

6. The lighting device according to claim 1 , further comprising a light-shielding layer disposed between the substrate and the optical member.

7. the light-shielding layer includes a plurality of light-shielding patterns formed on at least one of an upper surface and a lower surface of the light-shielding layer, The lighting device according to claim 6 , wherein a portion of the light-shielding pattern is disposed in a region that overlaps the light-emitting element in a vertical direction.

8. A reflective layer; a first resin layer disposed on the reflective layer; a substrate disposed on the first resin layer; a light emitting element disposed between the first resin layer and the substrate; a second resin layer disposed on the substrate; a half mirror layer disposed on the second resin layer; an optical member disposed between the reflective layer and the first resin layer, Light emitted through the light emitting surface of the light emitting device passes through the optical member, is reflected by the reflective layer, and passes through the substrate; the light in the visible light wavelength band includes a first wavelength band having a partial wavelength band and a second wavelength band having a wavelength band different from the first wavelength band, the half mirror layer has a reflectance for light in the first wavelength band higher than a transmittance for light in the first wavelength band, The optical member has a higher transmittance for light in the first wavelength band than a transmittance for light in the second wavelength band.

9. 9. The lighting device according to claim 8, wherein the optical member includes a first optical layer disposed between the reflective layer and the first resin layer, and a second optical layer disposed between the first optical layer and the first resin layer.

10. the second wavelength band includes a 2-1 wavelength band and a 2-2 wavelength band different from the 2-1 wavelength band; the first optical layer has a transmittance for light in the 2-1 wavelength band higher than a transmittance for light in the 2-2 wavelength band; The lighting device according to claim 9 , wherein the second optical layer has a transmittance for light in the 2-2 wavelength band higher than a transmittance for light in the 2-1 wavelength band.

11. A reflective layer; a first resin layer disposed on the reflective layer; a substrate disposed on the first resin layer; a light emitting element disposed between the first resin layer and the substrate; a second resin layer disposed on the substrate; a half mirror layer disposed on the second resin layer, Light emitted through the light emitting surface of the light emitting device is reflected by the reflective layer and passes through the substrate, The light emitting elements include first to third light emitting elements arranged adjacent to each other to form a unit light emitting group, the first light emitting element emits red light; the second light emitting element emits green light; the third light emitting element emits blue light; the light in the visible light wavelength band includes a first wavelength band having a partial wavelength band and a second wavelength band having a wavelength band different from the first wavelength band, The half mirror layer has a reflectance for light in the first wavelength band that is higher than a transmittance for light in the first wavelength band.

12. the half mirror layer has a first color corresponding to the first wavelength band, and when the first color is red, the second light emitting element emits light at a luminous intensity lower than that of the first light emitting element; The lighting device according to claim 11, wherein the light that has passed through the half mirror layer is white.

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