Cooling device and electronic apparatus system

Abstract

To provide a cooling device capable of cooling an imaging device when necessary without impairing the appearance of the imaging device, and to provide an electronic apparatus system.SOLUTION: A cooling device that cools heat generated in an electronic device including a movable monitor and a first attachment mechanism on an attached surface, the cooling device comprising: a heat sink having fins in a first formation region disposed on a first side and a second formation region disposed on a second side with respect to a fan that sends cooling air; and a power receiving connector that receives driving power of the fan from the electronic device.SELECTED DRAWING: Figure 3

Description

[Technical Field]

[0001] The technology of the present disclosure relates to a cooling device and an electronic device system. [Background technology]

[0002] Japanese Patent Application Laid-Open Publication No. 2019-114893 describes an imaging device having a heat source element, a Peltier element, and a heat sink sandwiched between the heat source element and the Peltier element and connected to the accessory mounting surface within a first housing having an accessory mounting surface on one side of the exterior. The heat absorbing surface of the Peltier element abuts against the heat sink. The accessory mounting surface has an opening that overlaps at least a portion of the Peltier element when projected from the normal direction of the accessory mounting surface. The imaging device described in Japanese Patent Application Laid-Open Publication No. 2019-114893 can be attached to the accessory mounting surface, and the heat generating surface of the Peltier element can be cooled by a second housing having a cooling means. Summary of the Invention

[0003] One embodiment of the technique of the present disclosure provides a cooling device and an electronic device system that can cool an imaging device when necessary without damaging the appearance of the imaging device. [Means for solving the problem]

[0004] The cooling device of the present disclosure is used in an electronic device having a mobile monitor and a first attachment mechanism on the attachment surface, and is a cooling device that cools heat generated by the electronic device, and is provided with a second attachment mechanism for detachably attaching to the electronic device, the second attachment mechanism being attached to the first attachment mechanism that is exposed when the mobile monitor moves from a position facing the attachment surface.

[0005] Preferably, the first attachment mechanism includes a fitting portion, and the second attachment mechanism includes a fitted portion that fits into the fitting portion.

[0006] The mobile monitor is preferably a vari-angle type monitor.

[0007] The cooling device comprises a fan that blows cooling air, a heat sink having fins in a first forming area arranged on a first side of the fan and a second forming area arranged on a second side of the fan, and a power receiving connector that receives driving power for the fan from an electronic device, wherein the heat source of the electronic device is on the first side and the power receiving connector is on the second side, and the area of ​​the first forming area is preferably larger than the area of ​​the second forming area.

[0008] The power receiving connector is preferably located below the center of the heat sink.

[0009] Preferably, the electronic device is an imaging device having an imaging element for capturing moving images, and the heat source is at least one of the imaging element and a processor for processing the moving images.

[0010] It is preferable to provide a protection member provided on the side facing the mobile monitor when the mobile monitor is moved from the position facing the mounting surface.

[0011] The protective member is preferably an elastic convex member or an elastic covering member.

[0012] When the cooling device is attached to an electronic device, it is preferable to provide an elastic sheet that adheres closely to the surface to which it is attached.

[0013] The elastic sheet preferably adheres closely to the step of the mounting surface.

[0014] The electronic device system of the present disclosure includes any of the cooling devices described above and an electronic device.

[0015] The electronic device system of the present disclosure includes the cooling device and an electronic device, and the mobile monitor is a vari-angle monitor. In this electronic device system, when the cooling device is attached to the electronic device, the electronic device system preferably includes an elastic sheet that adheres to the mounting surface, the elastic sheet adheres to a step in the mounting surface, and the step corresponds to the rotation of the vari-angle type of the mobile monitor.

[0016] The electronic device system of the present disclosure includes the above-mentioned cooling device and an electronic device, wherein the electronic device is an imaging device having an imaging element that captures moving images, and the heat source of the electronic device is at least one of the imaging element and the processor that processes the moving images. [Brief explanation of the drawings]

[0017] [Figure 1] FIG. 1 is a diagram illustrating a digital camera. [Figure 2] 10A and 10B are diagrams showing a state in which the mobile monitor has moved from a position facing the mounting surface. [Figure 3] FIG. 1 illustrates a digital camera system. [Figure 4] FIG. [Figure 5] FIG. [Figure 6] FIG. 2 is a three-view diagram of a heat sink. [Figure 7] FIG. [Figure 8] FIG. 10 is a diagram showing an E-type retaining ring. [Figure 9] FIG. 10 is an explanatory diagram of the arrangement position of the power receiving connector. [Figure 10] 10A and 10B are views showing a second embodiment in which insertion holes are provided through the fins. [Figure 11] 10A and 10B are views showing a second embodiment in which insertion holes are provided through the fins. [Figure 12] 10 is a diagram showing a digital camera system including a digital camera having a groove formed in its mounting surface and a cooling device according to a third embodiment. FIG. [Figure 13] FIG. 10 is a diagram showing a cooling device according to a third embodiment, which includes an elastic sheet. [Figure 14] FIG. 10 is a diagram showing another example of an elastic sheet. [Figure 15] 10A and 10B are diagrams illustrating a cooling device according to a fourth embodiment that includes a connector cover. [Figure 16]10A and 10B are diagrams illustrating the positional relationship between the connector cover and its housing portion. [Figure 17] FIG. 10 is a view showing a cooling device of a fifth embodiment in which a rubber cushion is attached to the side portion. [Figure 18] FIG. 10 is a view showing a cooling device of a fifth embodiment in which a rubber cover is attached to the side portion. [Figure 19] FIG. 10 is a diagram showing another example of an attachment mechanism. [Figure 20] 10A and 10B are diagrams illustrating yet another example of an attachment mechanism. DETAILED DESCRIPTION OF THE INVENTION

[0018] Hereinafter, an example of an embodiment of the technology of the present disclosure will be described with reference to the drawings.

[0019] [First embodiment] As shown in FIG. 1 , a digital camera 2 includes a camera body 10 and a lens barrel 11 mounted on the front of the camera body 10. The lens barrel 11 includes a group of lenses that guide subject light representing a subject to an image sensor 12 within the camera body 10. The image sensor 12 is, for example, a complementary metal oxide semiconductor (CMOS) image sensor or a charge coupled device (CCD) image sensor. The image sensor 12 has a rectangular imaging surface that captures an image of the subject. The imaging surface receives subject light. As is well known, the imaging surface includes a two-dimensional array of pixels that photoelectrically convert the received subject light to output an electrical signal. The camera body 10 also includes a central processing unit (CPU) 13 that controls the operation of the image sensor 12. The front of the camera body 10 also includes a window for emitting strobe light. The digital camera 2 is an example of an “electronic device” and an “image sensor” according to the technology of the present disclosure. The CPU 13 is also an example of a “processor” according to the technology of the present disclosure.

[0020] The top surface of the camera body 10 is provided with a power switch 14, a mode dial 15, and a release button 16 located in the center of the mode dial 15. The power switch 14 is operated to turn the power of the digital camera 2 on and off. The mode dial 15 is rotated to switch between various operating modes of the digital camera 2, such as still image capture mode, video capture mode, and image playback mode. The release button 16 is pressed to capture an image. Although not shown, the camera body 10 is also provided with other operating members such as a menu button and a cross key.

[0021] A movable monitor 18 is provided on a rear surface 17 of the camera body 10. The movable monitor 18 is attached to the rear surface 17 via a hinge 19.

[0022] As an example, as shown in Figure 2, mobile monitor 18 can rotate 180° in the left-right direction (opening to the left and closing to the right) indicated by arrow A1, with hinge 19 as the fulcrum. Mobile monitor 18 can also rotate 360° in the up-down direction indicated by arrow A2. In other words, mobile monitor 18 is a vari-angle monitor. In Figure 2, mobile monitor 18 opened to the left is shown by a solid line, and mobile monitor 18 opened to the left and further rotated upward is shown by a dashed line.

[0023] A surface 17A of the back surface 17 (hereinafter referred to as the mounting surface) that faces the mobile monitor 18 when the mobile monitor 18 is in the position shown in FIG. 1 and that is exposed when the mobile monitor 18 is in the position shown in FIG. 2 is provided with a pair of screw holes 20 for detachably mounting a cooling device 25 (see FIG. 3), which will be described later. The screw holes 20 are located approximately at the center of the mounting surface 17A in the vertical direction and are arranged symmetrically with respect to the center of the mounting surface 17A in the horizontal direction. In addition, a power supply connector 21 for supplying power to the cooling device 25 is provided at the left end of the mounting surface 17A. The screw holes 20 are an example of a "first mounting mechanism" and a "fitting portion" according to the technology of the present disclosure.

[0024] As an example, as shown in FIG. 3, when the mobile monitor 18 is moved from the rear surface 17 for use, a cooling device 25 is attached to the attachment surface 17A as needed. The cooling device 25 has an attachment mechanism 26 that engages with the screw holes 20, and is detachably attached to the attachment surface 17A. The cooling device 25 and the digital camera 2 constitute a digital camera system 30. The digital camera system 30 is an example of an "electronic device system" according to the technology of the present disclosure. The attachment mechanism 26 is an example of a "second attachment mechanism" according to the technology of the present disclosure.

[0025] 4 and 5, the cooling device 25 includes a pair of device mounting screws 35, a housing 36, a holding frame 37, a fan 38, a power receiving unit 39, and a heat sink 40. The housing 36 covers the holding frame 37, the fan 38, the power receiving unit 39, and the heat sink 40.

[0026] The device mounting screw 35 is included in the mounting mechanism 26. The device mounting screw 35 has a long, cylindrical screw body 50 and a disk-shaped screw head 51 provided at one end of the screw body 50 and having a larger diameter than the screw body 50. The screw body 50 is made of metal, for example, stainless steel. The screw body 50 is composed of a threaded portion 52 at the tip, a body portion 53 in the middle, and a neck portion 54 at the base. The threaded portion 52 is threaded into the screw hole 20 of the mounting surface 17A. The body portion 53 has a slightly smaller diameter than the threaded portion 52 and the neck portion 54. The body portion 53 does not have a thread. A circumferential groove 55 is formed in the neck portion 54. The threaded portion 52 is an example of a "fitted portion" according to the technology of the present disclosure.

[0027] The screw head 51 is made of a high-hardness, high-heat-resistant resin, such as phenolic resin. The screw head 51 is rotated by the user when attaching or detaching the cooling device 25. The screw head 51 is sized so that the user can easily grip it with their fingers, and has anti-slip grooves formed on the entire periphery. The screw head 51 also has a flathead groove for inserting a rotation jig or the like.

[0028] A pair of insertion holes 60 are formed in the housing 36, through which the screw main body 50 of the device mounting screw 35 is inserted. A recess 61 is formed around the insertion hole 60 to accommodate the screw head 51 of the device mounting screw 35. In this way, the screw main body 50 is disposed inside the housing 36, and the screw head 51 is disposed outside the housing 36 (see also FIG. 7).

[0029] Insertion holes 63 for inserting housing mounting screws 62 are formed in the four corners of housing 36. A plurality of fan-shaped air intake ports 64 are formed radially in the center of the front surface of housing 36. In addition, a plurality of slit-shaped air intake ports 65 are formed on both side surfaces of housing 36.

[0030] The holding frame 37 holds the fan 38 and the power receiving unit 39. A pair of insertion holes 70, into which the screw bodies 50 of the device mounting screws 35 are inserted, are formed at positions of the holding frame 37 corresponding to the insertion holes 60. Furthermore, screw holes 71 are formed at positions of the holding frame 37 corresponding to the insertion holes 63. Housing mounting screws 62 are screwed into the screw holes 71, thereby integrating the housing 36 and the holding frame 37. Furthermore, four insertion holes 72 are formed at positions of the holding frame 37 one size inward from the screw holes 71. Holding frame mounting screws 73 are inserted into the insertion holes 72.

[0031] The fan 38 blows cooling air to the heat sink 40. More specifically, the fan 38 is an axial fan that draws in air taken into the cooling device 25 through the air intakes 64 and 65 and expels the air toward the heat sink 40.

[0032] The power receiving unit 39 has a power receiving connector 75 and a flexible substrate 76. When the cooling device 25 is attached to the attachment surface 17A, the power receiving connector 75 connects to the power supply connector 21 on the attachment surface 17A. The power receiving connector 75 receives drive power for the fan 38 from the digital camera 2 via the power supply connector 21. One end of the flexible substrate 76 is connected to the power receiving connector 75, and the other end is connected to the fan 38. A drive circuit and a power supply circuit for the fan 38 are mounted on the flexible substrate 76.

[0033] A plurality of fins 81 for heat dissipation are formed on the entire front surface 80 of the heat sink 40, which faces the fan 38. The fins 81 are erected in the front-rear direction, extend in the left-right direction, and are arranged at approximately equal intervals in the up-down direction. A back surface 82 of the heat sink 40, opposite the front surface 80 on which the fins 81 are formed, comes into contact with the mounting surface 17A when the cooling device 25 is mounted.

[0034] A pair of insertion holes 83, into which the screw bodies 50 of the device mounting screws 35 are inserted, are formed at positions on the heat sink 40 corresponding to the insertion holes 60 and 70. The insertion holes 83 are included in the mounting mechanism 26. The insertion holes 83 are provided in the heat sink 40, which is an example of a "fin formation region" according to the technology of the present disclosure, and therefore the mounting mechanism 26 overlaps with the "fin formation region." Furthermore, a screw hole 84 is formed at a position on the heat sink 40 corresponding to the insertion hole 72. A holder frame mounting screw 73 is screwed into the screw hole 84. This integrates the holder frame 37 and the heat sink 40, and ultimately the fan 38.

[0035] A connector arrangement portion 85 that is U-shaped in plan view is formed at the left end of the heat sink 40. The connector arrangement portion 85 is provided by cutting out a part of the left end of the heat sink 40. The power receiving connector 75 is arranged in the connector arrangement portion 85 (see FIG. 9).

[0036] As an example, as shown in FIG. 6, the device mounting screws 35 and the insertion holes 83 included in the mounting mechanism 26 are provided at opposing positions on the left and right sides of the fan 38. The fins 81 include fins 811 with a height H1, fins 812A with a height H2A, fins 813 with a height H3, and fins 814 formed at the top and bottom ends. The insertion holes 83 are provided between two adjacent fins 812A. The height H2A of the fins 812A is shorter than the height H1 of the fins 811 (H2A

[0037] In a plan view, the fins 813 overlap with the fan 38. The height H3 of the fins 813 is smaller than the height H1 of the fins 811 (H3 <H1)。​

[0038] As shown in FIG. 7 as an example, an E-type retaining ring (also referred to as an E-ring) 90 shown in FIG. 8 as an example is fitted into the groove 55 of the neck 54 of the device mounting screw 35. The neck 54 is located between the housing 36 and the fin 812A. Therefore, the E-type retaining ring 90 is provided between the housing 36 and the fin 812A. The diameter of the E-type retaining ring 90 is smaller than the insertion hole 70 but larger than the insertion hole 60. Therefore, the device mounting screw 35 can move back and forth by the stroke between the insertion hole 60 and the insertion hole 70. Furthermore, the E-type retaining ring 90 prevents the screw body 50 of the device mounting screw 35 from falling off the insertion hole 60 and, ultimately, the housing 36. Note that a pin or the like inserted into a through-hole formed in the neck 54 may also be used as a member for preventing the device mounting screw 35 from falling off.

[0039] 9, the heat source 95 of the digital camera 2 is located approximately in the center of the camera body 10. The heat source 95 includes, for example, the image sensor 12, a drive circuit for the image sensor 12, a power supply circuit, and a CPU 13. In contrast, the cooling device 25 is attached to a position shifted to the left of the center of the camera body 10. Therefore, when viewed from the cooling device 25, the heat source 95 is shifted to the right.

[0040] In FIGS. 6 and 9, the heat sink 40 has a first formation region 96 of fins 81 arranged on the right side with respect to the fan 38 and a second formation region 97 of fins 81 arranged on the left side with respect to the fan 38. Most of the heat source 95 is in the right-side first formation region 96. In other words, the heat source 95 overlaps more with the first formation region 96 than with the second formation region 97. On the contrary, the connector arrangement portion 85 of the heat sink 40, and thus the power reception connector 75, is in the left-side second formation region 97. The area S1 of the first formation region 96 is larger than the area S2 of the second formation region 97 (S2 < S1) by the amount where the connector arrangement portion 85 is not provided. Also, in FIG. 9, the connector arrangement portion 85, and thus the power reception connector 75, is arranged below the center C of the heat sink 40. Here, the right side with respect to the fan 38 is an example of the "first side" according to the technology of the present disclosure. Also, the left side with respect to the fan 38 is an example of the "second side" according to the technology of the present disclosure. Note that the heat source 95 may include at least one of the imaging element 12 and the CPU 13. Also, since the cooling device 25 is intended to more efficiently cool the heat source 95 close to the back surface 17 inside the digital camera 2, based on FIG. 1, the heat source 95 is preferably the CPU 13 closer to the back surface 17 than the imaging element 12.

[0041] Next, the operation of the above configuration will be described. When the user takes an image or the like, the user moves the mobile monitor 18 from the back surface 17 and positions and angles the mobile monitor 18 at a desired position. When the user selects a moving image shooting mode with the mode dial 15 and performs moving image shooting (for example, moving image shooting at 120 frames per second (4K / 120p) with an image quality equivalent to 4K resolution), particularly when heat generation of the heat source 9 is a concern, the user attaches the cooling device 25 to the mounting surface 17A. At this time, the user connects the power reception connector 75 to the power supply connector 21 of the mounting surface 17A and screws the screw portion 52 of the device mounting screw 35 into the screw hole 20 of the mounting surface 17A.

[0042] The back surface 82 of the heat sink 40 contacts the mounting surface 17A. Therefore, heat generated by the heat source 95 is transferred from the mounting surface 17A to the heat sink 40 and dissipated by the fins 81 of the heat sink 40. In addition, driving power is supplied via the power receiving connector 75, and the fan 38 is operated. As a result, cooling air is sent from the fan 38 to the heat sink 40, and the heat transferred to the heat sink 40 is cooled.

[0043] As described above, the cooling device 25 includes the heat sink 40 on which a plurality of fins 81 for heat dissipation are formed, and the attachment mechanism 26 for detachably attaching the heat sink 40 to the attachment surface 17A of the digital camera 2. As shown in FIG. 6, the insertion holes 83 that are part of the attachment mechanism 26 overlap the area where the fins 81 are formed. Therefore, the fins 81 are not sacrificed by the attachment mechanism 26. Therefore, it is possible to cool the digital camera 2 when necessary and to prevent a decrease in cooling performance.

[0044] 4 and 5, the attachment mechanism 26 is provided in the area where the fins 81 are formed, and includes insertion holes 83 through which the device attachment screws 35 are inserted. This allows the attachment mechanism 26 to have a simple structure.

[0045] 6, the insertion hole 83 is provided between two adjacent fins 812A, so that the insertion hole 83 can be easily formed.

[0046] 4, the device mounting screw 35 has a screw body 50 that is inserted into the insertion hole 83, and a screw head 51 that is provided at one end of the screw body 50 and is operated by the user when attaching or detaching the heat sink 40 (cooling device 25). This makes it easy to attach or detach the heat sink 40 (cooling device 25).

[0047] The cooling device 25 includes a housing 36 that covers the heat sink 40. As shown in FIG. 7 , the screw head 51 is disposed outside the housing 36, and the screw body 50 is disposed inside the housing 36. An E-type retaining ring 90 is attached to the neck 54, which is the boundary between the screw body 50 and the screw head 51, as a retaining member that prevents the device mounting screw 35 from falling off the housing 36. This prevents the device mounting screw 35 from falling off the housing 36. The housing 36 covers not only the heat sink 40 but also the holding frame 37, the fan 38, and the power receiving unit 39, but it still covers the heat sink 40.

[0048] As shown in FIG. 6, the fin 81 includes a fin 811 and a fin 812A that is shorter than the fin 811. The fin 812A is adjacent to the insertion hole 83. This allows space to be secured on the front surface 80 side of the fin 812A. In this example, the neck 54 is disposed in this space. Therefore, an E-type retaining ring 90 can be fitted into the groove 55 of the neck 54 to prevent the device mounting screw 35 from coming off.

[0049] The device mounting screw 35 has a screw body 50 made of metal. Therefore, similar to the fins 81 of the heat sink 40, the screw body 50 can function as a heat dissipation member. On the other hand, the device mounting screw 35 has a screw head 51 made of a highly heat-resistant resin. Therefore, heat from the screw body 50 is not transferred to the screw head 51. Therefore, the user's fingers holding the screw head 51 can be protected from heat.

[0050] The cooling device 25 includes a fan 38 that sends cooling air to the heat sink 40. As shown in FIG. 6, the pair of mounting mechanisms 26 are provided at positions sandwiching the fan 38. This increases the stability of the cooling device 25 when it is mounted on the mounting surface 17A. Wobbling of the cooling device 25 due to vibration of the fan 38 can be reduced.

[0051] As shown in FIG. 6, the fan 38 is attached to the area where the fins 81 are formed. The fins 81 include fins 811 and fins 813 that are shorter than the fins 811. In a plan view, the fins 813 overlap the fan 38. This allows space for the fan 38 to be secured on the front surface 80 side of the fins 813. This can contribute to making the cooling device 25 more compact.

[0052] 3, digital camera system 30 includes digital camera 2 equipped with mobile monitor 18, and cooling device 25 for cooling heat generated by digital camera 2. Recently, heat generation, particularly during video capture, has become a problem with digital cameras 2. For this reason, cooling device 25 can efficiently cool the heat generated by digital camera 2 when necessary, such as when capturing video images.

[0053] Digital camera 2 includes mobile monitor 18 and screw holes 20 in mounting surface 17A. Cooling device 25 includes attachment mechanism 26 for detachably attaching heat sink 40 to digital camera 2. Attachment mechanism 26 is attached to screw holes 20 that become exposed when mobile monitor 18 moves from a position facing mounting surface 17A. Mounting surface 17A is normally covered by mobile monitor 18. Therefore, screw holes 20 are also normally hidden by mobile monitor 18. This provides a better appearance than a digital camera whose screw holes 20 are always exposed. Furthermore, because there is less opportunity for dust or other foreign matter to get into screw holes 20, there is less risk of malfunction and maintenance is easier than with a digital camera whose screw holes 20 are always exposed.

[0054] Digital camera 2 includes screw hole 20, which is a fitting portion, and attachment mechanism 26 of cooling device 25 includes screw portion 52, which is a fitted portion that fits into screw hole 20. Therefore, cooling device 25 can be attached to and detached from digital camera 2 with a simple structure.

[0055] 2, the portable monitor 18 is a vari-angle type monitor. Therefore, compared to a tilt type in which the portable monitor is pulled rearward from the back and rotated up and down, the area of ​​the mounting surface 17A is larger, and a larger contact surface with the heat sink 40 of the cooling device 25 can be ensured. This allows for greater cooling efficiency.

[0056] As shown in FIG. 5, the heat sink 40 has a connector arrangement portion 85. A power receiving connector 75 that receives drive power for the fan 38 from the digital camera 2 is arranged in the connector arrangement portion 85. As shown in FIG. 9, the heat source 95 of the digital camera 2 is on the right side of the first forming region 96, and the power receiving connector 75 is on the left side of the second forming region 97. The area S1 of the first forming region 96 is larger than the area S2 of the second forming region 97. The power receiving connector 75 is arranged below the center C of the heat sink 40.

[0057] The portion where the connector arrangement portion 85 is formed has poor cooling performance because it does not have fins 81. For this reason, if the connector arrangement portion 85 were formed in the same first formation region 96 as the heat source 95 that requires cooling, there is a concern that cooling efficiency would decrease. However, in this example, the connector arrangement portion 85 is formed in the second formation region 97 on the opposite side of the first formation region 96, and the power receiving connector 75 is arranged therein, so there is little concern that cooling efficiency will decrease.

[0058] Furthermore, heat tends to be trapped relatively in the upper part of the heat sink 40. For this reason, there is a concern that cooling efficiency will decrease if the connector arrangement portion 85 is formed above the center of the heat sink 40. However, in this example, the connector arrangement portion 85 is formed below the center C of the heat sink 40 and the power receiving connector 75 is arranged therein, so there is little concern that cooling efficiency will decrease.

[0059] The electronic device is a digital camera 2 having an image sensor 12 that captures moving images, and the heat source 95 is the image sensor 12 and a CPU 13 that processes the moving images. Therefore, the heat source 95 can be efficiently cooled by the cooling device 25, especially during moving image capture when heat generation from the heat source 95 is a concern.

[0060] In the following description, the same members and parts as those described in the first embodiment are denoted by the same reference numerals as those in the first embodiment, and description thereof will be omitted.

[0061] [Second embodiment] In the first embodiment, the insertion hole 83 is provided between two adjacent fins 812A, but this is not limiting. For example, as in the heat sink 100 shown in Figures 10 and 11, the insertion hole 83 may be provided so as to penetrate the fin 812B.

[0062] As shown in FIG. 11, the height H2B of the fin 812B is smaller than the height H1 of the fin 811 (H2B

[0063] In this way, in the second embodiment, the insertion holes 83 pass through the fins 812B. Therefore, the screw bodies 50 of the device mounting screws 35 are not positioned between the fins 81. Therefore, compared to the first embodiment in which the screw bodies 50 impede the flow of air between the fins 812A, the flow of air can be improved.

[0064] In addition, the vertical width of the portion of the fin 812B where the insertion hole 83 is formed may be made larger than the other portions.

[0065] [Third embodiment] 12, digital camera 110 has recess 111 formed on mounting surface 17A. Recess 111 is a step that prevents corners of mobile monitor 18 from hitting mounting surface 17A when mobile monitor 18 is rotated up and down at an incomplete left-right opening angle. Recess 111 is an example of a "step" according to the technology of the present disclosure.

[0066] ​The cooling device 115 and the digital camera 110 constitute a digital camera system 120. The cooling device 115 has the same basic configuration as the cooling device 25 of the first embodiment, but differs from the cooling device 25 in that an elastic sheet 116 is attached to the cooling device 115 for tight contact with the recess 111 of the mounting surface 17A. The elastic sheet 116, as its name suggests, is elastic and has relatively high thermal conductivity. The elastic sheet 116 is, for example, a graphite sheet.

[0067] 13, the elastic sheet 116 is attached to the back surface 82 of the heat sink 40 that contacts the mounting surface 17A. The elastic sheet 116 almost completely covers the back surface 82, but leaves a small portion exposed. That is, the elastic sheet 116 has a circular hole 121 cut out to fit the insertion hole 83 and a rectangular corner 122 cut out to fit the power receiving connector 75. Because the insertion hole 83 is included in the mounting mechanism 26, the hole 121 prevents the elastic sheet 116 from being provided in the portion of the mounting mechanism 26. Furthermore, the corner 122 prevents the elastic sheet 116 from being provided in the portion of the power receiving connector 75.

[0068] As described above, cooling device 115 of the third embodiment includes elastic sheet 116 that is provided on back surface 82 of heat sink 40, which is the mounting surface to mounting surface 17A, and that is adapted to adhere to mounting surface 17A. Elastic sheet 116 adheres to recess 111 of mounting surface 17A. Therefore, even if mounting surface 17A has a step such as recess 111, the heat sink 40 can be more tightly attached to mounting surface 17A, and more heat can be transferred from mounting surface 17A to heat sink 40.

[0069] The elastic sheet 116 is not provided in the area of ​​the mounting mechanism 26. Therefore, the elastic sheet 116 does not interfere with the mounting of the cooling device 115 to the mounting surface 17A. Furthermore, the elastic sheet 116 is not provided in the area of ​​the power receiving connector 75. Therefore, the elastic sheet 116 does not interfere with the supply of power to the fan 38.

[0070] 14, an elastic sheet 126 may be used that is sized to fit inside the insertion hole 83 and the power receiving connector 75. In this case, the elastic sheet 126 is not provided in the area of ​​the attachment mechanism 26 and the power receiving connector 75.

[0071] Instead of attaching elastic sheet 116 or 126, protrusions corresponding to recesses 111 may be formed on rear surface 82 of heat sink 40. However, this method requires the effort of processing rear surface 82, so the method of attaching elastic sheet 116 or 126 is preferable.

[0072] [Fourth embodiment] 15 and 16, as an example, a cooling device 130 of the fourth embodiment includes a connector cover 131 that is detachably attached to the power receiving connector 75. The connector cover 131 is placed over the power receiving connector 75 to cover the power receiving connector 75 when the cooling device 130 is not in use.

[0073] A storage section 132 is provided between the power receiving connector 75 and the housing 36, in a portion of the housing 36 facing the power receiving connector 75. The storage section 132 stores the connector cover 131 that is removed from the power receiving connector 75 when the cooling device 130 is in use. The storage section 132 is provided with a holding mechanism (not shown) that holds the stored connector cover 131. The holding mechanism, for example, presses the connector cover 131 against the wall surface of the storage section 132 using the bias of a spring. Alternatively, the holding mechanism is a shutter that opens and closes the opening of the storage section 132. The holding mechanism may also be one that attracts and holds the connector cover 131 using magnetic force. When the connector cover 131 is to be removed from the storage section 132, the holding mechanism is released by operating a button or the like.

[0074] As described above, the cooling device 130 of the fourth embodiment includes a connector cover 131 that covers the power receiving connector 75 when not in use, and a storage section 132 that stores the connector cover 131 when removed from the power receiving connector 75. The connector cover 131 reduces the chance of foreign matter such as dust getting into the power receiving connector 75 when not in use, thereby reducing the risk of malfunction and contributing to improved maintainability. Furthermore, the storage section 132 ensures a place for the connector cover 131 when removed from the power receiving connector 75, thereby preventing the connector cover 131 from being lost.

[0075] The accommodation portion 132 is provided between the power receiving connector 75 and the housing 36. This allows for easy access when placing the connector cover 131 over the power receiving connector 75 when not in use, and when storing the connector cover 131 after removing it from the power receiving connector 75 when in use.

[0076] [Fifth embodiment] As an example, as shown in FIG. 17 , cooling device 135 has a plurality of trapezoidal cylindrical rubber cushions 137 attached to side portion 136. Side portion 136 is the portion that faces mobile monitor 18 when mobile monitor 18 moves from the position facing mounting surface 17A. Rubber cushion 137 is an example of the "protective member" and "convex member" according to the technology of the present disclosure. Thanks to rubber cushion 137, even if mobile monitor 18 accidentally hits side portion 136, mobile monitor 18 will not be damaged. Therefore, mobile monitor 18 can be protected.

[0077] 18, a rubber cover 142 that covers the side portion 141 may be used instead of the rubber cushion 137. The rubber cover 142 is an example of the "protective member" and "covering member" according to the technology of the present disclosure. The rubber cover 142 protrudes less outward than the rubber cushion 137, thereby improving the appearance.

[0078] In the above-described embodiments, the device mounting screw 35 is exemplified as the mounting mechanism 26, but this is not limiting. As an example, a device mounting pin 150 shown in FIG. 19 may be used. The device mounting pin 150 is a so-called rotary lock pin and includes a pin body 151 and a rotary knob 152 provided at one end of the pin body 151. The pin body 151 is made of metal, and the rotary knob 152 is made of a high-hardness, high-heat-resistant resin. The rotary knob 152 is rotated by a user when attaching or detaching the heat sink 40. A pair of cylindrical protrusions 154 are formed at opposing positions on a tip 153 of the pin body 151. The protrusions 154 (pin body 151) rotate 90° in conjunction with the rotation of the rotary knob 152. The tip 153 is an example of a "fitted portion" according to the technology of the present disclosure.

[0079] On the other hand, a fitting hole 155 into which the tip portion 153 fits is formed in the mounting surface 17A. The fitting hole 155 has a shape that follows the cross-sectional shape of the tip portion 153 including the protrusion 154. A circumferential groove 156 into which the protrusion 154 fits is formed inside the fitting hole 155. The fitting hole 155 and the groove 156 are an example of a "fitting portion" according to the technology of the present disclosure.

[0080] When attaching the cooling device to attachment surface 17A, tip 153 of pin main body 151 is inserted into fitting hole 155, and then rotary knob 152 is rotated to rotate protrusion 154 by 90°, thereby fitting protrusion 154 into groove 156. On the other hand, when removing the cooling device from attachment surface 17A, rotary knob 152 is rotated in the opposite direction to rotate protrusion 154 by 90° in the opposite direction, thereby releasing the fitting between protrusion 154 and groove 156, and then pin main body 151 is pulled up from fitting hole 155.

[0081] As another example, a device mounting pin 160 shown in FIG. 20 may be used. The device mounting pin 160 is a so-called ball lock pin and includes a pin body 161 and a knob 162 provided at one end of the pin body 161. A button 163 is provided on the knob 162. The pin body 161 is made of metal, and the knob 162 is made of a high-hardness, high-heat-resistant resin. The button 163 is pressed by a user when attaching or detaching the heat sink 40. Four balls 165 are attached to a tip 164 of the pin body 161, spaced at 90° intervals in the circumferential direction, for example. The balls 165 can retract from the tip 164. When the button 163 is not pressed, the balls 165 protrude from the tip 164. When the button 163 is not pressed, the balls 165 retract into the tip 164. The tip portion 164 is an example of a "fitted portion" according to the technology of the present disclosure.

[0082] On the other hand, a fitting hole 166 into which the tip portion 164 fits is formed in the mounting surface 17A. The fitting hole 166 has a shape that follows the cross-sectional shape of the tip portion 164 with the ball 165 recessed, i.e., a circular shape. A circumferential groove 167 into which the ball 165 fits is formed inside the fitting hole 166. The fitting hole 166 and the groove 167 are an example of a "fitting portion" according to the technology of the present disclosure.

[0083] When attaching the cooling device to attachment surface 17A, button 163 is pressed so that ball 165 is recessed within tip portion 164. Then, tip portion 164 is inserted into fitting hole 166. Thereafter, the pressure on button 163 is released, causing ball 165 to protrude from tip portion 164, thereby fitting ball 165 into groove 167. On the other hand, when removing the cooling device from attachment surface 17A, button 163 is pressed so that ball 165 is recessed within tip portion 164, thereby releasing the fitting between ball 165 and groove 167, and then pin main body 161 is pulled up from fitting hole 166.

[0084] The number of attachment mechanisms 26 is not limited to the two illustrated. For example, four attachment mechanisms 26 may be arranged at the four corners of the cooling device. The mobile monitor 18 is not limited to the vari-angle type illustrated in the above embodiments, and may be a tilt type. Also, the fan 38 may be omitted.

[0085] The processor is not limited to the illustrated CPU 13. In addition to or instead of the CPU 13, a programmable logic device (PLD) that is a processor whose circuit configuration can be changed after manufacturing, such as an FPGA (Field Programmable Gate Array), or a dedicated electric circuit that is a processor having a circuit configuration designed exclusively for executing specific processing, such as an ASIC (Application Specific Integrated Circuit), may be used.

[0086] Although the digital camera 2 is used as an example of an electronic device, the present disclosure is not limited to this and can be applied to any electronic device equipped with a mobile monitor that may require cooling.

[0087] The technology of the present disclosure can be appropriately combined with the various embodiments and / or various modified examples described above. Furthermore, it is needless to say that it is not limited to the above-described embodiments, and various configurations can be adopted as long as they do not deviate from the gist of the present disclosure.

[0088] The above-described description and illustrations are a detailed explanation of the parts related to the technology of the present disclosure and are merely an example of the technology of the present disclosure. For example, the above description of the configuration, functions, actions, and effects is an explanation of an example of the configuration, functions, actions, and effects of the parts related to the technology of the present disclosure. Therefore, it goes without saying that unnecessary parts may be deleted, new elements may be added, or replacements may be made to the above-described description and illustrations within the scope of the gist of the technology of the present disclosure. Furthermore, to avoid confusion and facilitate understanding of the parts related to the technology of the present disclosure, the above-described description and illustrations omit explanations of common technical knowledge that do not require particular explanation to enable the implementation of the technology of the present disclosure.

[0089] In this specification, "A and / or B" is synonymous with "at least one of A and B." In other words, "A and / or B" means that it may be only A, only B, or a combination of A and B. Furthermore, in this specification, the same concept as "A and / or B" is also applied when three or more things are expressed connected by "and / or."

[0090] All publications, patent applications, and technical standards mentioned in this specification are herein incorporated by reference to the same extent as if each individual publication, patent application, or technical standard was specifically and individually indicated to be incorporated by reference.

Claims

1. A cooling device for use in an electronic device having a mobile monitor and a first attachment mechanism on an attachment surface, the cooling device cooling heat generated by the electronic device, comprising: A fan that blows cooling air, a heat sink having fins in a first forming region disposed on a first side of the fan and in a second forming region disposed on a second side of the fan; a power receiving connector that receives power to drive the fan from the electronic device, a heat source of the electronic device on the first side and a power receiving connector on the second side; The area of ​​the first formation region is larger than the area of ​​the second formation region. Cooling device.

2. a second attachment mechanism for detachably attaching the mobile monitor to the electronic device, the second attachment mechanism being attached to the first attachment mechanism that is exposed when the mobile monitor moves from a position facing the attachment surface; the first attachment mechanism includes a fitting portion; The cooling device according to claim 1 , wherein the second attachment mechanism includes a mating portion that fits into the fitting portion.

3. 2. The cooling device according to claim 1, wherein the mobile monitor is a vari-angle type monitor.

4. The cooling device according to claim 1 , wherein the power receiving connector is disposed below the center of the heat sink.

5. the electronic device is an imaging device having an imaging element for capturing moving images, The cooling device according to claim 1 , wherein the heat source is at least one of the image sensor and a processor that processes the moving image.

6. 2. The cooling device according to claim 1, further comprising a protection member provided on a side portion that faces the mobile monitor when the mobile monitor is moved from a position facing the mounting surface.

7. The cooling device according to claim 6 , wherein the protective member is an elastic convex member or an elastic covering member.

8. The cooling device according to claim 1 , further comprising an elastic sheet that comes into close contact with the mounting surface when the cooling device is mounted on the electronic device.

9. The cooling device according to claim 8 , wherein the elastic sheet is in close contact with a step on the mounting surface.

10. The cooling device according to claim 1 ; the electronic device; An electronic device system comprising:

11. The cooling device according to claim 1; the electronic device; Equipped with The electronic device system wherein the mobile monitor is a vari-angle type monitor.

12. an elastic sheet that comes into close contact with the mounting surface when the cooling device is mounted on the electronic device; The elastic sheet is in close contact with the step of the mounting surface, The electronic device system according to claim 11 , wherein the step corresponds to the vari-angle rotation of the mobile monitor.

13. The cooling device according to claim 1; the electronic device; Equipped with the electronic device is an imaging device having an imaging element for capturing moving images, An electronic device system in which a heat source of the electronic device is at least one of the imaging element and a processor that processes the moving image.

Images