Door opening detection sensor and door opening detection system

Abstract

To provide a door opening detection sensor and a door opening detection system capable of enhancing detection accuracy of an opening history of a door.SOLUTION: The door opening detection sensor detects opening of a door that can be opened and closed with respect to an object to be moved. The door opening detection sensor includes a base material attached across the object to be moved and the door, an antenna for wireless communication provided on the base material, an IC chip electrically connected to the antenna, and a detection wiring provided on the base material and electrically connected to the IC chip. The base member includes a first attachment portion to be detachably attached to a first object by a first adhesive layer, the first object being one of an object to be moved and a door, and a second attachment portion to be attached to a second object by a second adhesive layer, the second object being the other of the object to be moved and the door. The IC chip detects an opening operation of the door by detecting a change in capacitance between the first attachment portion and the first object.SELECTED DRAWING: Figure 1

Description

[Technical Field]

[0001] The present invention relates to a door-opening detection sensor and a door-opening detection system. [Background technology]

[0002] A system has been proposed that uses an RFID tag to detect the open / closed state of a door (see, for example, Patent Document 1). This system includes an RFID tag installed on the side edge surface of the door and a reader that can communicate with the RFID tag. This system can determine whether the door is open or closed based on whether the reader can communicate with the RFID tag. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Japanese Patent Application Publication No. 2017-218766 Summary of the Invention [Problem to be solved by the invention]

[0004] However, in this system, the accuracy of detecting the door opening history can be low.

[0005] An object of one aspect of the present invention is to provide a door-opening detection sensor and a door-opening detection system that can improve the accuracy of detecting the door-opening history. [Means for solving the problem]

[0006] One aspect of the present invention provides a door-opening detection sensor that detects the opening of a door that can be opened and closed relative to an object to be operated, comprising: a substrate that is attached across the object to be operated and the door; an antenna for wireless communication provided on the substrate; an IC chip electrically connected to the antenna; and detection wiring that is provided on the substrate and electrically connected to the IC chip, wherein the substrate comprises a first adhesive portion that is releasably attached to a first object that is one of the object to be operated and the door by a first adhesive layer, and a second adhesive portion that is attached to a second object that is the other of the object to be operated and the door by a second adhesive layer, and the IC chip detects the opening operation of the door by detecting a change in electrostatic capacitance between the first adhesive portion and the first object.

[0007] It is preferable that when the first adhesive layer is peeled off from the base material or the first object, the adhesive strength of the first adhesive layer is reduced compared to when the first adhesive layer is attached.

[0008] It is preferable that the door-opening detection sensor further includes an auxiliary adhesive layer that attaches the first adhesive layer to the first object.

[0009] The first adhesive layer may be attached to an edge surface of the first object, and the second adhesive layer may be attached to a main surface of the second object.

[0010] One aspect of the present invention provides a door-opening detection system comprising the door-opening detection sensor and an external device that receives the detection result of the IC chip via the antenna by wireless communication. [Effects of the Invention]

[0011] According to one aspect of the present invention, it is possible to provide a door-opening detection sensor and a door-opening detection system that can improve the accuracy of detecting the door opening history. [Brief explanation of the drawings]

[0012] [Figure 1] 1 is a schematic cross-sectional view of a door-opening detection sensor according to a first embodiment. [Figure 2] FIG. 2 is a plan view of the door open detection sensor according to the first embodiment. [Figure 3] 1 is a schematic diagram showing an installation state of a door-opening detection sensor according to a first embodiment. FIG. [Figure 4] 5A to 5C are schematic diagrams showing the operation of the door open detection sensor according to the first embodiment. [Figure 5] FIG. 10 is a schematic cross-sectional view of a door-opening detection sensor according to a second embodiment. [Figure 6] FIG. 10 is a plan view of a door open detection sensor according to a second embodiment. [Figure 7] FIG. 10 is a schematic diagram showing an installation state of a door-opening detection sensor according to a second embodiment. [Figure 8] 10A and 10B are schematic diagrams showing the operation of the door open detection sensor according to the second embodiment. [Figure 9] 10A and 10B are schematic diagrams showing the operation of the door open detection sensor according to the second embodiment. [Figure 10] 10A and 10B are schematic diagrams showing the operation of the door open detection sensor according to the second embodiment. [Figure 11] FIG. 10 is a plan view of a door open detection sensor according to a third embodiment. [Figure 12] FIG. 10 is a schematic cross-sectional view of a door-opening detection sensor according to a third embodiment. [Figure 13] FIG. 10 is a schematic diagram showing an installation state of a door-opening detection sensor according to a third embodiment. [Figure 14] FIG. 10 is a cross-sectional view showing an installation state of a door-opening detection sensor according to a third embodiment. [Figure 15] 10A and 10B are schematic diagrams showing the operation of the door open detection sensor according to the third embodiment. [Figure 16] 10A and 10B are cross-sectional views showing the operation of the door open detection sensor according to the third embodiment. [Figure 17] 10A and 10B are schematic diagrams showing the operation of the door open detection sensor according to the third embodiment. [Figure 18] 10A and 10B are cross-sectional views showing the operation of the door open detection sensor according to the third embodiment. DETAILED DESCRIPTION OF THE INVENTION

[0013] Hereinafter, the door-opening detection sensor and the door-opening detection system according to the embodiment will be specifically described with reference to the drawings.

[0014] [Door Opening Detection Sensor] (First Embodiment) Fig. 1 is a schematic cross-sectional view of a door-opening detection sensor 100 according to the first embodiment. Fig. 2 is a plan view of the door-opening detection sensor 100. Fig. 3 is a schematic diagram showing an installation state of the door-opening detection sensor 100. Fig. 4 is a schematic diagram showing the operation of the door-opening detection sensor 100.

[0015] As shown in FIG. 2, the door-opening detection system 1000 according to the embodiment includes the door-opening detection sensor 100 and an external device 1001. The door-opening detection sensor 100 includes a substrate 1, an antenna 2, an IC chip 3, a detection wiring 4, a pseudo-adhesive layer 5 (first adhesive layer), a second adhesive layer 6, and detection units 7 and 8. The door-opening detection sensor 100 is an RFID (Radio Frequency Identification) tag. A release sheet 50 (separator) is attached to the pseudo-adhesive layer 5 and the second adhesive layer 6 (see FIG. 1). The release sheet 50 is removed when the sensor is in use.

[0016] The left-right direction in Figure 2 is the X direction. One side of the X direction (the right side in Figure 2) is the +X side. The direction opposite the +X side is the -X side. The up-down direction in Figure 2 is the Y direction. The Y direction is perpendicular to the X direction. One side of the Y direction (the top side in Figure 2) is the +Y side. The direction opposite the +Y side is the -Y side. The Z direction is perpendicular to the X and Y directions. One side of the Z direction is the +Z side. The direction opposite the +Z side is the -Z side. Viewing from the Z direction is called planar view.

[0017] 1 and 2, the substrate 1 includes a first substrate portion 11, a second substrate portion 12, and a connecting portion 15. The substrate 1 is formed in a sheet shape. The first substrate portion 11 is formed, for example, in a circular shape in a plan view. The second main surface 11b is the surface on the -Z side of the first substrate portion 11 (see FIG. 1). The second substrate portion 12 is formed in a circular shape in a plan view. The second main surface 12b is the surface on the -Z side of the second substrate portion 12 (see FIG. 1).

[0018] The connecting portion 15 connects the first substrate portion 11 and the second substrate portion 12. The connecting portion 15 is formed in a strip shape along the X direction. The first substrate portion 11, the second substrate portion 12, and the connecting portion 15 are integrally formed.

[0019] 3, the first substrate portion 11 is attached to the first main surface 101c of the door 101 by the pseudo-adhesive layer 5. The first adhesive portion 13 (adhesive portion) is a region of the first substrate portion 11 that is attached to the door 101 by the pseudo-adhesive layer 5. The first adhesive portion 13 is, for example, the entire region of the first substrate portion 11.

[0020] The second substrate portion 12 is attached to the first main surface 102c of the object to be moved 102 by the second adhesive layer 6. The second adhesive portion 14 (adhesive portion) is a region of the second substrate portion 12 that is attached to the object to be moved 102 by the second adhesive layer 6. The second adhesive portion 14 is, for example, the entire region of the second substrate portion 12.

[0021] 2, the substrate 1 is, for example, a resin substrate, a paper substrate, etc. Materials for the resin substrate include polyester resins such as polyethylene terephthalate (PET), polyolefin resins, polyethylene fluoride resins, polyamide resins, vinyl polymers, acrylic resins, polystyrene, polycarbonate, etc. The substrate 1 is preferably flexible and has bending elasticity.

[0022] The antenna 2 is capable of wireless communication (non-contact communication) with the outside. The antenna 2 is an antenna for wireless communication. The antenna 2 has two radiating portions 21 and 22. The antenna 2 is formed on one main surface of the second base member 12. The two radiating portions 21 and 22 extend in directions away from each other along the longitudinal direction (Y direction) of the second base member 12. The radiating portions 21 and 22 gradually become wider in the extending direction (direction away from each other).

[0023] The antenna 2 can be formed from, for example, a conductive ink such as a polymer-type conductive ink or a silver ink composition. The antenna 2 may also be formed from, for example, a metal foil, a metal thin film formed by plating or the like, a metal thin film formed by metal vapor deposition or the like, a metal plate, or the like.

[0024] The IC chip 3 is not particularly limited as long as it is capable of writing and reading information contactlessly via the antenna 2. Examples of the IC chip 3 include a contactless IC tag, a contactless IC label, and a contactless IC card. The IC chip 3 is mounted on one main surface of the second substrate portion 12. The IC chip 3 is electrically connected to the antenna 2.

[0025] The detection wiring 4 includes a first wiring 31 and a second wiring 32. The first wiring 31 and the second wiring 32 are formed on one main surface of the base material 1. One end of the first wiring 31 and one end of the second wiring 32 are electrically connected to the IC chip 3 (more specifically, the capacitance sensor 3A). The first wiring 31 and the second wiring 32 extend from the IC chip 3 to the +X side and reach the first base material 11 via the connecting portion 15. The first wiring 31 and the second wiring 32 are arranged in parallel. The first wiring 31 and the second wiring 32 are formed with a gap between them in the Y direction. The first wiring 31 and the second wiring 32 are referred to as "wirings 31, 32." One end of the wirings 31, 32 is located on the second base material 12, and the other end of the wirings 31, 32 is located on the first base material 11, so the detection wiring 4 is formed across the first adhesive portion 13 and the second adhesive portion 14.

[0026] The detection wiring 4 has a shape in which the two wirings 31 and 32 are not connected to each other, but the detection wiring may have a loop shape (for example, a shape in which the tips of the two wirings are connected to each other).

[0027] The detection units 7 and 8 are formed on one main surface of the first substrate portion 11. Of the detection units 7 and 8, the first detection unit 7 is electrically connected to the tip of the first wiring 31. Of the detection units 7 and 8, the second detection unit 8 is electrically connected to the tip of the second wiring 32. The first detection unit 7 is wider than the first wiring 31. The second detection unit 8 is wider than the second wiring 32. The detection units 7 and 8 are, for example, rectangular in shape with long sides in the X direction.

[0028] Since the detection units 7 and 8 are formed wider than the wirings 31 and 32, respectively, the capacitance value that the capacitance sensor 3A can detect is larger. This makes it easier to detect changes in capacitance. Note that if the capacitance detection performance of the detection wiring 4 is sufficiently high, the detection units may have the same width as the wirings 31 and 32, respectively.

[0029] The detection wiring 4 and the detection units 7 and 8 can be formed, for example, from a conductive ink such as a polymer-type conductive ink or a silver ink composition. The detection wiring 4 and the detection units 7 and 8 can be formed, for example, by printing. The detection wiring 4 and the detection units 7 and 8 may also be formed, for example, from a metal foil, a metal thin film formed by plating, or a metal thin film formed by metal vapor deposition, or the like.

[0030] As shown in FIG. 1, the pseudo-adhesive layer 5 (pseudo-adhesive layer) is formed on the second main surface 11b of the first substrate portion 11. The adhesive strength of the pseudo-adhesive layer 5 to the object 102 is weaker than the adhesive strength of the second adhesive layer 6 to the door 101 (see FIG. 3). Because the pseudo-adhesive layer 5 has weak adhesive strength, it can be peeled off after being attached to the object. The pseudo-adhesive layer 5 has, for example, pressure-sensitive adhesive properties. The pseudo-adhesive layer 5 contains, for example, a pressure-sensitive adhesive that becomes adhesive when a predetermined pressure is applied and is peelable after being attached. When the pseudo-adhesive layer 5 having pressure-sensitive adhesive properties is peeled off after being attached to the object, its adhesive strength becomes lower than the adhesive strength at the time of attachment (when first attached to the object) unless pressure is applied. In other words, when the pseudo-adhesive layer 5 is peeled off, its adhesive strength becomes lower than the adhesive strength of the pseudo-adhesive layer 5 at the time of attachment. Therefore, the pseudo-adhesive layer 5 is difficult to re-adhere to the object once peeled off. "When peeled off, the adhesive strength becomes lower than when attached" also includes the case where the adhesive strength of the pseudo-adhesive layer 5 is lost after peeling (the adhesive strength of the pseudo-adhesive layer 5 becomes zero).

[0031] The adhesive strength of the pseudo-adhesive layer 5 can be measured, for example, in accordance with JIS K 6854. The adhesive strength can be measured, for example, using a peel tester (Shimadzu Corporation's "Autograph AGSH"), by measuring the resistance value when the substrate is peeled from the object at a speed of 300 mm / min and a peel angle of 90° (i.e., T-peel).

[0032] Known pressure-sensitive adhesives can be used as the pressure-sensitive adhesive. Suitable pressure-sensitive adhesives are those that contain an adhesive base (non-peeling adhesive base) that is difficult to peel once adhered, and a particulate filler that has no affinity for the adhesive base. Examples of the adhesive base include natural rubber latex. Examples of the particulate filler include zinc oxide, titanium oxide, calcium carbonate, etc.

[0033] The IC chip 3 incorporates a capacitance sensor 3A. The capacitance sensor 3A has two connection terminals. The two connection terminals are electrically connected to the detection wiring 4. Specifically, the two connection terminals are electrically connected to one end of the first wiring 31 and one end of the second wiring 32, respectively. The capacitance sensor 3A can detect capacitance via the detection wiring 4 and the detection units 7 and 8. For example, when a detection target (at least one of the door 101 and the operated object 102) approaches or moves away from the detection wiring 4 and the detection units 7 and 8, the detected capacitance value changes. The capacitance sensor 3A can transmit the detection result to an external device 1001 (e.g., a reader / writer) (see FIG. 1) via the antenna 2 by wireless communication. Specifically, for example, when the detected capacitance value exceeds or falls below a predetermined threshold, the capacitance sensor 3A can transmit a detection signal including information about the amount of change in capacitance.

[0034] The capacitance sensor 3A can set the capacitance threshold value at the following timing, for example. (1) When the door opening detection sensor 100 is manufactured and shipped. (2) When the door opening detection sensor 100 is installed on the object (the operated body 102 and the door 101).

[0035] In (1), the threshold value is set at the time of shipment, so there is no need to set the threshold value when installing the door-opening detection sensor 100. This has the advantage of making the installation of the door-opening detection sensor 100 easier. In (2), if it is decided as part of the operation that the operation of the door-opening detection sensor 100 is to be checked when the sensor is installed, the capacitance threshold value can be set in conjunction with this operation check. If the operation check and threshold value setting can be performed in a single operation, the burden on the worker can be reduced. Furthermore, the door-opening detection sensor 100 can automatically set the capacitance threshold value in conjunction with the operation check using software pre-installed in the IC chip 3. In this case, the burden on the worker can be further reduced.

[0036] The second adhesive layer 6 is formed on the second main surface 12b of the second base material portion 12. The second adhesive layer 6 is formed of, for example, a known adhesive. The door opening detection sensor 100 has the pseudo-adhesive layer 5 and the second adhesive layer 6, and therefore can be attached to the surfaces of the door 101 and the operated object 102.

[0037] As shown in FIG. 3, the door 101 (first door) is formed in a plate shape. The door 101 is openable and closable relative to the moved object 102. The door 101 is rotatable, for example, about a rotation axis provided at the second side end (the side end opposite to the first side end 101a). When the door 101 is closed relative to the moved object 102, the end surface 101b of the first side end 101a of the door 101 faces the end surface 102b of the first side end 102a of the moved object 102. The first main surface 101c (main surface) is one surface of the door 101 (the surface on the +Z side).

[0038] The moved object 102 is formed, for example, in a plate shape. The moved object 102 may be a door (second door) that can be opened and closed relative to the door 101. When the moved object 102 is a door, the moved object 102 is rotatable, for example, around a rotation axis provided at a second side edge (the side edge opposite to the first side edge 102a). The moved object 102 may be a door frame that surrounds the door 101. The moved object 102 may also be a wall that constitutes a building. The first main surface 102c is one surface (the surface on the +Z side) of the moved object 102. When the door 101 is closed relative to the moved object 102, the first main surface 102c of the moved object 102 is flush with, for example, the first main surface 101c of the door 101.

[0039] The "main surface" refers to the widest surface of the plate-like body, specifically the front surface and back surface of the plate-like body. The end surface refers to the surface formed on the edge of the plate-like body, and is usually a surface perpendicular to the main surface.

[0040] For example, at least a portion of the door 101 is made of a conductive material. For example, at least a first main surface 101c of the door 101 is made of a conductive material (for example, metal). It is desirable that at least a portion of the door 101, which faces the detection units 7 and 8, is made of a conductive material.

[0041] When the moved object 102 is the detection target, the detection unit of the door-opening detection sensor is installed on the moved object 102. In this case, at least a portion of the moved object 102 is made of a conductive material. For example, at least the first main surface 102c of the moved object 102 is made of a conductive material (e.g., metal). It is desirable that at least a portion of the portion of the moved object 102 that faces the detection unit of the door-opening detection sensor is made of a conductive material.

[0042] The door 101 is opened by rotating it relative to the operated body 102. The door 101 is opened by rotating either the door 101 or the operated body 102, or both. To open the door 101, for example, only the door 101 may be rotated, or only the operated body 102 may be rotated, or both the door 101 and the operated body 102 may be rotated.

[0043] The door-open detection sensor 100 is installed across the operated object 102 and the door 101. The base material 1 is attached across the operated object 102 and the door 101. In other words, the base material 1 is provided from one side of the operated object 102 to the other side of the door 101.

[0044] If the door 101 is made of metal, a non-metallic spacer (not shown) may be provided between the pseudo-adhesive layer 5 and the door 101 in order to ensure communication performance by keeping the door-opening detection sensor 100 a certain distance away from the door 101. Similarly, if the operated object 102 is made of metal, a non-metallic spacer (not shown) may be provided between the second adhesive layer 6 and the operated object 102 in order to ensure communication performance by keeping the door-opening detection sensor 100 a certain distance away from the operated object 102. The spacer is formed of, for example, a non-conductive resin.

[0045] [Door open detection sensor operation] The operation of the door-open detection sensor 100 will be described with reference to Figures 3 and 4. In Figure 3, the door 101 is in a closed state relative to the object to be moved 102. The first substrate portion 11 (first adhesive portion 13) is attached to the first main surface 101c of the door 101 by a pseudo-adhesive layer 5. The second substrate portion 12 (second adhesive portion 14) is attached to the first main surface 102c of the object to be moved 102 by a second adhesive layer 6.

[0046] In this embodiment, the door 101 is the "first object." The object to be moved 102 is the "second object." The pseudo-adhesive layer 5 may be attached to one of the door 101 and the object to be moved 102. The second adhesive layer 6 may be attached to the other of the door 101 and the object to be moved 102.

[0047] In the state shown in FIG. 3, the detection units 7 and 8 (see FIG. 2) formed on the first substrate portion 11 are located close to the first main surface 101c, and therefore the capacitance detected by the capacitance sensor 3A is large.

[0048] As shown in Fig. 4, the door 101 is opened by rotating the door 101 in the -Z side relative to the operated body 102. The door 101 moves in a direction away from the first substrate portion 11 of the door-open detection sensor 100. This causes the first substrate portion 11 to peel off from the pseudo-adhesive layer 5. The pseudo-adhesive layer 5 separates from the first substrate portion 11 while remaining attached to the door 101.

[0049] The capacitance detection value by the capacitance sensor 3A changes as the distance between the detection units 7 and 8 provided on the first base material 11 and the door 101 changes. Specifically, as the distance between the detection units 7 and 8 and the door 101 increases, the capacitance detection value decreases.

[0050] Because the pseudo-adhesive layer 5 has pressure-sensitive adhesive properties, it is difficult for it to re-adhere once peeled off from the object. Therefore, even when the door 101 is closed, the pseudo-adhesive layer 5 is difficult for it to re-adhere to the first substrate portion 11. Even when the door 101 is closed, the distance between the detection units 7 and 8 and the door 101 is greater than the distance between the detection units 7 and 8 and the door 101 in the installed state (see FIG. 3). Therefore, the detected value of the capacitance is difficult to return to the same value as the detected value of the capacitance in the installed state (see FIG. 3). Therefore, it can be said that the detected value of the capacitance irreversibly decreases.

[0051] Because the first substrate portion 11 is flexible, the first substrate portion 11 that has peeled off from the door 101 is likely to bend outward (away from the door 101). Therefore, even when the door 101 is closed, the first substrate portion 11 is unlikely to return to the same shape as in the installed state (see FIG. 3) (a shape in which the entire area of ​​the first adhesive portion 13 is in contact with the pseudo-adhesive layer 5). The distance between the detection units 7 and 8 and the door 101 is greater than the distance between the detection units 7 and 8 and the door 101 in the installed state (see FIG. 3). Therefore, the detected capacitance value is unlikely to return to the same value as the detected capacitance value in the installed state (see FIG. 3). In this way, the open door detection sensor 100 has a structure that makes it difficult for the detected capacitance value to increase again after decreasing.

[0052] A decrease in the detected capacitance value enables the door open detection sensor 100 to detect the opening history of the door 101. The door open detection sensor 100 can transmit the detection result to an external device 1001 (e.g., a reader / writer) (see FIG. 1) by wireless communication via the antenna 2. For example, the antenna 2 can transmit flag information based on the comparison result between the electrical resistance of the detection wiring 4 and a threshold value.

[0053] [Effects of the door opening detection sensor according to the embodiment] According to the door-opening detection sensor 100 of this embodiment, the detection units 7 and 8 detect the opening of the door 101 based on a change in capacitance between the detection units 7 and 8 and the door 101. Therefore, the opening history of the door 101 can be detected with high accuracy.

[0054] In the door-opening detection sensor 100, the pseudo-adhesive layer 5 has pressure-sensitive adhesive properties and therefore does not easily re-adhere to the first substrate portion 11. Therefore, even when the door 101 is closed, the detected capacitance value does not easily return to the same value as the detected capacitance value in the installed state (see FIG. 3). Therefore, even when the door 101 is opened and then closed, the opening history of the door 101 can be detected. This improves the detection performance of the opening history of the door 101.

[0055] The first substrate portion 11 is flexible. When the first substrate portion 11 is peeled off from the pseudo-adhesive layer 5, it is likely to bend, and therefore the detected capacitance value is unlikely to return to the same value as the detected capacitance value in the installed state (see FIG. 3). Therefore, even after the door 101 is closed, it is possible to detect the opening history of the door 101.

[0056] The door-opening detection system 1000 according to this embodiment includes the door-opening detection sensor 100, and therefore has the same effects as the door-opening detection sensor 100.

[0057] [Door Opening Detection Sensor] (Second Embodiment) Fig. 5 is a cross-sectional view of the door-opening detection sensor 200 according to the second embodiment. Fig. 6 is a plan view of the door-opening detection sensor 200. Fig. 7 is a schematic diagram showing the installation state of the door-opening detection sensor 200. Figs. 8 to 10 are schematic diagrams showing the operation of the door-opening detection sensor 200. Configurations common to other embodiments are given the same reference numerals and descriptions thereof will be omitted.

[0058] As shown in FIG. 6, the door-opening detection system 2000 includes a door-opening detection sensor 200 and an external device 1001. As shown in Figures 5 and 6, the door opening detection sensor 200 comprises a base material 1, an antenna 2, an IC chip 3, a detection wiring 4, a pseudo-adhesive layer 5, a second adhesive layer 6, detection units 7 and 8, an auxiliary adhesive layer 9, and a cover member 10.

[0059] The door-opening detection sensor 200 differs from the door-opening detection sensor 100 (see FIG. 1) in that it is provided with an auxiliary adhesive layer 9 and a cover member 10.

[0060] The auxiliary adhesive layer 9 is formed on the -Z side surface (outer surface) of the pseudo-adhesive layer 5. The auxiliary adhesive layer 9 has a higher adhesive strength (peel strength) to the object (door 101) than the pseudo-adhesive layer 5. Therefore, the pseudo-adhesive layer 5 is less likely to peel off from the door 101. The auxiliary adhesive layer 9 attaches the pseudo-adhesive layer 5 to the door 101.

[0061] The cover member 10 covers the first main surface of the base material 1 (the surface opposite to the second main surfaces 11b and 12b). The cover member 10 is formed in a sheet shape. The cover member 10 covers the antenna 2, the IC chip 3, the detection wiring 4, and the detection units 7 and 8. The cover member 10 is formed from, for example, paper, resin, or the like. The cover member 10 has the same shape as the base material 1. It is desirable that the cover member 10 be flexible.

[0062] [Door open detection sensor operation] The operation of the door open detection sensor 200 will be described with reference to Figures 7 to 10. In Figures 7 and 8, the door 101 is in a closed state relative to the object to be moved . 7, the door-opening detection sensor 200 is installed across the operated object 102 and the door 101. Specifically, the first substrate portion 11 (first adhesive portion 13) is attached to the first main surface 101c of the door 101 by the pseudo-adhesive layer 5 and the auxiliary adhesive layer 9. The second substrate portion 12 (second adhesive portion 14) is attached to the first main surface 102c of the operated object 102 by the second adhesive layer 6.

[0063] As shown in Figure 8, door 101 is opened by rotating door 101 in the -Z side relative to object 102. Door 101 moves in a direction away from first substrate portion 11. As a result, first substrate portion 11 is peeled off from pseudo-adhesive layer 5. Pseudo-adhesive layer 5 and auxiliary adhesive layer 9 move away from first substrate portion 11 while remaining attached to door 101.

[0064] The capacitance detected by the capacitance sensor 3A changes as the distance between the detection units 7 and 8 provided on the first base material 11 and the door 101 changes. Specifically, as the distance between the detection units 7 and 8 and the door 101 increases, the detected value of the capacitance decreases.

[0065] Since the pseudo-adhesive layer 5 has pressure-sensitive adhesive properties, even when the door 101 is closed, the pseudo-adhesive layer 5 is unlikely to re-adhere to the first base material portion 11. The detected capacitance value is unlikely to return to the same value as the detected capacitance value in the installed state (see FIG. 7). Therefore, the capacitance irreversibly decreases.

[0066] As shown in FIG. 9, because the first substrate portion 11 and the cover member 10 are flexible, the first substrate portion 11 and the cover member 10 that have peeled off from the door 101 are likely to bend outward (away from the door 101). Therefore, as shown in FIG. 10, even when the door 101 is closed, the first substrate portion 11 and the cover member 10 are unlikely to return to the same configuration as in the installed state (see FIG. 7) (a configuration in which the entire area of ​​the first adhesive portion 13 is in contact with the pseudo-adhesive layer 5). The distance between the detection units 7 and 8 and the door 101 is greater than the distance between the detection units 7 and 8 and the door 101 in the installed state (see FIG. 7). Therefore, the detected capacitance value is unlikely to return to the same value as the detected capacitance value in the installed state (see FIG. 7). In this way, the open door detection sensor 200 has a structure that makes it difficult for the detected capacitance value to increase again after decreasing.

[0067] A decrease in the detected capacitance value enables the door open detection sensor 200 to detect the opening history of the door 101. The door open detection sensor 200 can transmit the detection result to the external device 1001 (see FIG. 6) by wireless communication via the antenna 2.

[0068] [Effects of the door opening detection sensor according to the embodiment] According to the door-opening detection sensor 200 of this embodiment, the detection units 7 and 8 detect the opening of the door 101 based on a change in capacitance. Therefore, the opening history of the door 101 can be detected with high accuracy.

[0069] In the door-opening detection sensor 200, the pseudo-adhesive layer 5 has pressure-sensitive adhesive properties and is therefore unlikely to re-adhere to the first substrate portion 11. Therefore, even when the door 101 is closed, the detected capacitance value is unlikely to return to the same value as the detected capacitance value in the installed state (see FIG. 7). Therefore, even when the door 101 is opened and then closed, the opening history of the door 101 can be detected. This improves the detection performance of the opening history of the door 101.

[0070] The first substrate portion 11 and the cover member 10 are flexible. The first substrate portion 11 and the cover member 10 that have been peeled off from the pseudo-adhesive layer 5 are likely to bend, and therefore the capacitance is unlikely to increase again. Therefore, even after the door 101 is closed, it is possible to detect the opening history of the door 101.

[0071] The door-opening detection sensor 200 has the auxiliary adhesive layer 9 that attaches the pseudo-adhesive layer 5 to the door 101, so when the door 101 is opened, the pseudo-adhesive layer 5 peels off from the first substrate portion 11. This improves the performance of detecting the opening history of the door 101.

[0072] The door-opening detection system 2000 according to this embodiment includes the door-opening detection sensor 200, and therefore has the same effects as the door-opening detection sensor 200.

[0073] [Door Opening Detection Sensor] (Third Embodiment) FIG. 11 is a plan view of a door-opening detection sensor 300 according to the third embodiment. FIG. 12 is a cross-sectional view of the door-opening detection sensor 300. FIG. 13 is a schematic diagram showing the installation state of the door-opening detection sensor 300. FIG. 14 is a cross-sectional view showing the installation state of the door-opening detection sensor 300. FIG. 15 is a schematic diagram showing the operation of the door-opening detection sensor 300. FIG. 16 is a cross-sectional view showing the operation of the door-opening detection sensor 300. FIG. 17 is a schematic diagram showing the operation of the door-opening detection sensor 300. FIG. 18 is a cross-sectional view showing the operation of the door-opening detection sensor 300. Configurations common to other embodiments are designated by the same reference numerals, and description thereof will be omitted.

[0074] As shown in Figures 11 and 12, the door opening detection sensor 300 comprises a base material 201, an antenna 2, an IC chip 3, a detection wiring 204, a second adhesive layer 306, detection units 7 and 8, a cover member 307, and a pseudo-adhesive layer 305 (pseudo-adhesive layer) (first adhesive layer).

[0075] The substrate 201 includes a first substrate portion 211 and a second substrate portion 212. The substrate 201 is formed in a sheet shape. The first substrate portion 211 is formed in a rectangular shape in a plan view. The first substrate portion 211 is formed in a rectangular shape having long sides along the X direction, for example. The first main surface 211a is the surface of the first substrate portion 211 on the +Z side. The second main surface 211b is the surface of the first substrate portion 211 on the -Z side.

[0076] The second substrate portion 212 is formed in a rectangular shape in a plan view. The second substrate portion 212 is formed in, for example, a rectangular shape having long sides along the Y direction. The second substrate portion 212 is formed integrally with the first substrate portion 211. The first main surface 212a is the surface of the second substrate portion 212 on the +Z side. The second main surface 212b is the surface of the second substrate portion 212 on the -Z side.

[0077] The first substrate portion 211 and the second substrate portion 212 are integrally formed. The first substrate portion 211 extends to the -X side from the center in the length direction (Y direction) of the second substrate portion 212. The substrate 201 is T-shaped in plan view.

[0078] 13 and 14 , the first substrate part 211 is attached to the end surface 102b of the moved object 102 by the pseudo-adhesive layer 305. The first attachment part 13 is a region of the first substrate part 211 that is attached to the moved object 102 by the pseudo-adhesive layer 305. The first substrate part 211 is attached across the moved object 102 and the door 101.

[0079] The second substrate portion 212 is attached to the first main surface 101c of the first housing 101 by the second adhesive layer 306. The second attachment portion 14 is a region of the second substrate portion 212 that is attached to the object to be moved 102 by the second adhesive layer 306. The second attachment portion 14 is, for example, the entire region of the second substrate portion 212.

[0080] 11 and 12, the substrate 201 is, for example, a resin substrate, a paper substrate, or the like. The substrate 201 (at least the first substrate portion 211) is preferably flexible. The substrate 201 (at least the first substrate portion 211) is preferably flexurally elastic.

[0081] The antenna 2 and the IC chip 3 are provided on the first main surface 212 a of the second base material portion 212 . The detection wiring 204 includes a first wiring 231 and a second wiring 232. The first wiring 231 and the second wiring 232 are provided on the first main surfaces 211a, 212a from the second substrate portion 212 to the first substrate portion 211. One end of the first wiring 231 and one end of the second wiring 232 are electrically connected to the IC chip 3. The detection wiring 204 is formed across the first attachment portion 13 and the second attachment portion 14.

[0082] The detection units 7 and 8 are provided on the first main surface 211a of the first base material portion 211. Of the detection units 7 and 8, the first detection unit 7 is electrically connected to the tip of the first wiring 231. Of the detection units 7 and 8, the second detection unit 8 is electrically connected to the tip of the second wiring 232. The first detection unit 7 is wider than the first wiring 231. The second detection unit 8 is wider than the second wiring 232. The detection units 7 and 8 are, for example, rectangular in shape with long sides in the X direction.

[0083] The cover member 307 has the same shape as the base material 201. The cover member 307 is formed in a sheet shape. The cover member 307 is, for example, a resin base material, a paper base material, or the like. The cover member 307 (at least the portion overlapping the first base material portion 211) is flexible. The cover member 307 (at least the portion overlapping the first base material portion 211) may have bending elasticity.

[0084] The cover member 307 is placed on the +Z side surface (first principal surfaces 211a, 212a) of the base material 201. Therefore, the antenna 2, the IC chip 3, and the detection wiring 204 are sandwiched between the base material 201 and the cover member 307.

[0085] The pseudo-adhesive layer 305 is provided on the +Z side surface (outer surface) of the cover member 307. More specifically, the pseudo-adhesive layer 305 is provided on the +Z side surface (outer surface) of at least a part of the portion of the cover member 307 that overlaps with the first base material portion 211. The pseudo-adhesive layer 305 is formed, for example, in a region including the tip of the cover member 307 (the tip of the portion that overlaps with the first base material portion 211). The pseudo-adhesive layer 305 has, for example, pressure-sensitive adhesiveness. The second adhesive layer 306 is provided on the second main surfaces 211b and 212b of the base material 201.

[0086] [Door open detection sensor operation] 13 to 18, the operation of the door open detection sensor 300 will be described. In Fig. 13 and Fig. 14, the door 101 is in a closed state relative to the object to be moved . As shown in Figures 13 and 14, the door-opening detection sensor 300 is installed across the object to be moved 102 and the door 101. The second adhesive portion 14 of the second base material portion 212 is attached to the first main surface 101c of the door 101 by the second adhesive layer 306. In this embodiment, the object to be moved 102 is the "first object." The door 101 is the "second object."

[0087] The first substrate portion 211 (first adhesive portion 13) is attached to the end surface 102b of the moved body 102 by the pseudo-adhesive layer 305. The end surface 102b of the moved body 102 is a surface that intersects with the first main surface 101c of the door 101 (for example, a surface perpendicular to the first main surface 101c). Therefore, the portion of the door opening detection sensor 300 that includes the first substrate portion 211 is bent in the thickness direction.

[0088] 15 and 16, the door 101 is opened by rotating the door 101 in the +Z direction relative to the operated object 102. By rotating the door 101 (opening operation of the door 101), the portion including the second substrate portion 212 moves in a direction away from the portion including the first substrate portion 211. A tensile force acts on the portion including the first substrate portion 211, and this portion peels off from the operated object 102.

[0089] The portion including the first substrate portion 211 moves away from the moved object 102. The capacitance decreases as the distance between the moving object 102 and the detecting units 7 and 8 provided on the first substrate portion 211 increases. The portion including the first substrate portion 211 assumes a form with less bending due to the bending elasticity of the first substrate portion 211 and the cover member 307.

[0090] 17 and 18, even when the door 101 is closed, the portion including the first base material portion 211 does not easily return to the same bent shape as in the installed state (see FIG. 13). Therefore, the distance between the detection units 7, 8 and the moved object 102 becomes larger than the distance between the detection units 7, 8 and the moved object 102 in the installed state (see FIG. 13). Therefore, the detected value of the capacitance between the detection units 7, 8 and the moved object 102 does not easily return to the same value as the detected value of the capacitance in the installed state (see FIG. 13).

[0091] A decrease in the detected capacitance value enables the door open detection sensor 300 to detect the opening history of the door 101. The door open detection sensor 300 can transmit the detection result to the external device 1001 (see FIG. 1) by wireless communication via the antenna 2.

[0092] [Effects of the door opening detection sensor according to the embodiment] According to the door-opening detection sensor 300 of this embodiment, the detection units 7 and 8 detect the opening of the door 101 based on a change in capacitance caused by the first substrate portion 211 peeling off from the pseudo-adhesive layer 305. Therefore, the opening history of the door 101 can be detected with high accuracy.

[0093] In the door opening detection sensor 300, the portion including the first substrate portion 211 is unlikely to return to the same bent shape as in the installed state (see Figure 13), so the opening history of the door 101 can be detected even after the door 101 is closed.

[0094] The above describes an embodiment of the present invention, but each configuration and their combination in the embodiment is an example, and additions, omissions, substitutions, and other modifications of the configuration are possible within the scope that does not deviate from the spirit of the present invention. As shown in Figure 4, in the door opening detection sensor 100, the capacitance decreases as the pseudo-adhesive layer 5 peels off from the first substrate portion 11, but the pseudo-adhesive layer 5 may peel off from the door 101 and remain on the first substrate portion 11. The antenna 2 in the door-opening detection sensor 100 shown in FIG. 1 has radiating portions 21 and 22, but the shape of the antenna is not particularly limited.

[0095] 13, in the door-opening detection sensor 300, the portion including the first substrate portion 211 is attached to the end surface 102b of the moved object 102, but the portion including the first substrate portion 211 (the portion where the detection portion is provided) may be attached to the end surface 101b of the door 101. For example, the portion including the first substrate portion 211 may be attached to the end surface 101b of the door 101, and the portion including the second substrate portion 212 may be attached to the first main surface 102c of the moved object 102. [Explanation of symbols]

[0096] 1,201...Base material, 2...Antenna, 3...IC chip, 4...Detection wiring, 5,305...Pseudo adhesive layer (first adhesive layer), 6,306...Second adhesive layer, 7...First detection unit (detection unit), 8...Second detection unit (detection unit), 9...Auxiliary adhesive layer, 13...First adhesion unit, 14...Second adhesion unit, 100, 200, 300...Door opening detection sensor, 101...Door (first object, second object), 101c...First main surface (main surface), 102...Operated object (first object, second object), 102b...End surface, 102c...First main surface, 1000, 2000...Door opening detection system, 1001...External device

Claims

1. A door open detection sensor that detects the opening of a door that can be opened and closed relative to an operated object, a base material attached across the operated body and the door; an antenna for wireless communication provided on the substrate; an IC chip electrically connected to the antenna; a detection wiring provided on the base material and electrically connected to the IC chip; The substrate is a first adhesive portion that is releasably attached to a first object, which is one of the operated body and the door, by a first adhesive layer; a second adhesive portion attached to a second object, which is the other of the operated body and the door, by a second adhesive layer; The IC chip detects a change in capacitance between the first attachment portion and the first object, thereby detecting an opening operation of the door. Door open detection sensor.

2. When the first adhesive layer is peeled off from the substrate or the first object, the adhesive strength of the first adhesive layer is reduced compared to when the first adhesive layer is attached. The door opening detection sensor according to claim 1.

3. Further, an auxiliary adhesive layer is provided to attach the first adhesive layer to the first object. The door opening detection sensor according to claim 1.

4. the first adhesive layer is attached to an end surface of the first object; The second adhesive layer is attached to a main surface of the second object. The door opening detection sensor according to claim 1.

5. A door opening detection sensor according to any one of claims 1 to 4; an external device that receives the detection result of the IC chip via the antenna by wireless communication; Door opening detection system.

Images