Aligner, robot system, and substrate alignment method

Abstract

To achieve both improvement of throughput and suppression of damage to a substrate in alignment of the substrate.SOLUTION: The aligner 5 includes the rotary table 51 that rotates the substrate 9 around the first axis Ox, the support surface P1 that moves between the substrate receiving position P2 at which the substrate 9 is received and the substrate placing position 52a at which the substrate 9 is placed on the rotary table 51, the support surface driving unit 53 that moves the support surface 52a from the substrate receiving position P1 to the substrate placing position P2 and moves the support surface T2 from the substrate placing position P2 to the substrate receiving position P1 along the second trajectory that bypasses the substrate P on the rotary table 51, and the rotary table driving unit 54 that aligns the substrate 9 on the rotary table 51 in the rotating direction Ar by rotating the substrate 9 via the rotary table 51.SELECTED DRAWING: Figure 12

Description

[Technical Field]

[0001] The technology disclosed herein relates to an aligner, a robot system, and a method for aligning a substrate. [Background technology]

[0002] Patent Document 1 describes a conventional aligner. The conventional aligner includes a substrate mounting table and a temporary substrate rest part. The temporary substrate rest part is located above the substrate mounting table. The conventional aligner aligns the substrates mounted on the substrate mounting table and the temporary substrate rest part almost simultaneously. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Patent No. 7175735 Summary of the Invention [Problem to be solved by the invention]

[0004] The inventors attempted to improve throughput by arranging the substrates in two tiers, one above the other. However, there is room for further investigation into the specific configuration that utilizes this two-tier configuration. Depending on the configuration adopted, there is concern that the substrates may be damaged. [Means for solving the problem]

[0005] The technology disclosed herein relates to an aligner that includes a turntable that rotates a substrate about a first axis extending in the vertical direction, a support surface that supports the substrate and moves between a substrate receiving position that receives the substrate and a substrate placing position that places the substrate on the turntable, a support surface drive unit that moves the support surface from the substrate receiving position to the substrate placing position and also moves the support surface from the substrate placing position to the substrate receiving position along a trajectory that bypasses the substrate on the turntable, and a turntable drive unit that rotates the substrate via the turntable to align the substrate on the turntable in the rotational direction.

[0006] The technology disclosed herein relates to a substrate alignment method, in which a horizontal articulated transfer robot places a substrate held by a hand of the transfer robot on a support surface of an aligner, the aligner moves the support surface from a substrate receiving position where the substrate is received to a substrate placing position where the substrate is placed on a rotary table of the aligner, thereby transferring the substrate placed on the support surface onto the rotary table, the aligner moves the support surface from the substrate placing position to the substrate receiving position along a trajectory that bypasses the substrate on the rotary table, thereby causing the support surface to wait to receive another substrate, the aligner aligns the substrate transferred onto the rotary table, and the transfer robot returns to a FOUP that stores the other substrate before or during the alignment of the substrate and starts an operation of removing the other substrate from the FOUP. [Effects of the Invention]

[0007] The aligner can improve throughput and suppress damage to the substrate when aligning the substrate. [Brief explanation of the drawings]

[0008] [Figure 1] FIG. 1 shows a robot system for transporting a substrate. [Figure 2] FIG. 2 is a block diagram of the robot system. [Figure 3] Figure 3 shows a horizontal articulated robot. [Figure 4] FIG. 4 shows the operation of the first and second hands. [Figure 5] FIG. 5 is a perspective view of the first aligner and the second aligner. [Figure 6] FIG. 6 is a plan view of the first aligner and the second aligner. [Figure 7] FIG. 7 is a side view of the first and second aligners. [Figure 8] FIG. 8 is a plan view of the first aligner alone. [Figure 9] FIG. 9 is a side view illustrating the substrate receiving position and the buffer position. [Figure 10] FIG. 10 is a side view illustrating the substrate placement position and the alignment position. [Figure 11] FIG. 11 is a diagram illustrating the movement trajectory of the support surface. [Figure 12] FIG. 12 is a diagram illustrating the movement trajectory of the support surface. [Figure 13] FIG. 13 is a sequence diagram of a substrate alignment method. [Figure 14] FIG. 14 is a sequence diagram of a substrate alignment method. [Figure 15] FIG. 15 shows an aligner according to a modified example. DETAILED DESCRIPTION OF THE INVENTION

[0009] Hereinafter, embodiments of an aligner, a robot system, and a substrate alignment method will be described with reference to the drawings. The aligner, the robot system, and the substrate alignment method described here are merely examples.

[0010] (Robot System) FIG. 1 is a plan view of a substrate transfer system 1. FIG. 2 is a block diagram of the substrate transfer system 1. The substrate transfer system 1 transfers a substrate 9. The substrate 9 is a semiconductor wafer or a glass substrate. The substrate transfer system 1 is, for example, an Equipment Front End Module (EFEM). The substrate transfer system 1 is, for example, a sorter. The substrate transfer system 1 is, for example, a stocker. A robot system 6 is incorporated into the substrate transfer system 1.

[0011] The substrate transfer system 1 includes an aligner 5. The aligner 5 aligns the substrate 9. The aligner 5 includes a first aligner 5L and a second aligner 5R. The first aligner 5L and the second aligner 5R each align the substrate 9. Details of the aligner 5 will be described later. In the substrate transfer system 1, the first aligner 5L and the second aligner 5R are aligned along the second wall 12.

[0012] The substrate transfer system 1 includes a housing 10. The housing 10 has a first wall 11, a second wall 12, a third wall 13, and a fourth wall 14. The first wall 11, the second wall 12, the third wall 13, and the fourth wall 14 are each a wall perpendicular to an installation surface F.

[0013] The first wall 11 and the third wall 13 face each other in a first direction. The second wall 12 and the fourth wall 14 face each other in a second direction. The first and second directions are both horizontal directions, and the second direction is perpendicular to the first direction. The vertical direction perpendicular to the X and Y directions is defined as a third direction.

[0014] Hereinafter, the first direction will be referred to as the left-right direction or X direction, the second direction will be referred to as the front-back direction or Y direction, and the third direction will be referred to as the height direction or Z direction. Note that the X direction, Y direction, and Z direction are used for explaining the aligner 5 and the robot system 6, and are not used to limit the structures of the aligner 5 and the robot system 6.

[0015] Of the two directions along the X direction, the direction toward the first wall 11 is referred to as the "left," and the direction toward the third wall 13 is referred to as the "right." Of the two directions along the second direction, the direction toward the second wall 12 is referred to as the "rear," and the direction toward the fourth wall 14 is referred to as the "front."

[0016] Similarly, of the two directions along the third direction, the direction approaching the installation surface F is referred to as "downward," and the direction moving away from the installation surface F is referred to as "upward." Hereinafter, the position of each element in the up-down direction may be referred to as the "height position."

[0017] It should be noted that the six directions, i.e., front-rear, left-right, and up-down, are merely examples introduced for the sake of simplicity. For example, the correspondence between the four directions, i.e., front-rear and left-right, and the housing 10 may be appropriately interchanged.

[0018] The third direction may be defined as a direction perpendicular to the installation surface F. In that case, the first and second directions may be defined based on a positional relationship with the installation surface F, for example, a horizontal plane along the installation surface F. Regardless of the definition of the third direction, it is not essential that the up-down direction and the installation surface F are strictly orthogonal.

[0019] The first wall 11 and the second wall 12 are connected to each other, and the first wall 11 and the fourth wall 14 are connected to each other, and the third wall 13 and the second wall 12 are connected to each other, and the third wall 13 and the fourth wall 14 are connected to each other. The first wall 11, the second wall 12, the third wall 13, and the fourth wall 14 form a closed conveying space 15.

[0020] The housing 10 also has a ceiling wall that is connected to the first wall 11, the second wall 12, the third wall 13, and the fourth wall 14, and closes the upper end of the transfer space 15. The aligner 5 is located in the transfer space 15.

[0021] The third wall 13 separates the transfer space 15 from the substrate processing equipment 4. The third wall 13 has an opening 16. The opening 16 can be opened and closed. When the opening 16 is opened, the transfer space 15 and the substrate processing equipment 4 communicate with each other, and when the opening 16 is closed, the communication between the transfer space 15 and the substrate processing equipment 4 is blocked.

[0022] The substrate transfer system 1 has a FOUP (Front Opening Unified Pod) 41. The FOUP 41 accommodates a substrate 9. The FOUP 41 can accommodate multiple substrates 9 lined up in the Z direction. The substrate processing equipment 4 has multiple FOUPs 41. The multiple FOUPs 41 are lined up along a first wall 11. The first wall 11 has openings 17 corresponding to the FOUPs 41. A FOUP opener opens and closes the openings 17. The FOUP opener switches between communication and cut-off between the transfer space 15 and the FOUP 41.

[0023] The substrate transfer system 1 includes a robot 2. The robot 2 is an example of a transfer robot. The robot 2 transfers substrates 9 between a FOUP 41, an aligner 5, and a substrate processing facility 4 (see the solid lines and the two-dot chain lines in FIG. 1). The robot 2 is located in a transfer space 15. The robot 2 is a horizontal articulated robot. The structure of the robot 2 will be described later.

[0024] The substrate transfer system 1 includes a system controller 18. Note that the system controller 18 is not an essential element of the robot system 6. The system controller 18 performs overall control of the substrate transfer system 1.

[0025] The robot controller 20 is electrically connected to the system controller 18. The electrical connection includes a wired or wireless connection. The robot controller 20 is also electrically connected to the robot 2. The robot controller 20 controls the robot 2. More specifically, the robot controller 20 receives a control signal from the system controller 18 and outputs a control signal to the robot 2. The robot 2 receives the control signal from the robot controller 20 and transports the substrate 9 in this case.

[0026] The aligner 5 is electrically connected to the robot controller 20. The aligner 5 may be connected to the system controller 18 and controlled by the system controller 18. The substrate transfer system 1 may also have an aligner controller dedicated to the aligner 5, separate from the system controller 18 and the robot controller 20. The aligner 5 may be connected to the aligner controller and controlled by the aligner controller.

[0027] The first aligner 5L is electrically connected to the robot controller 20. The first aligner 5L is controlled by the robot controller 20.

[0028] Specifically, the first aligner 5L is connected to the robot controller 20 via a first motor harness 81 and a first signal harness 82. The robot controller 20 supplies power for driving the spindle to the first aligner 5L via the first motor harness 81. The robot controller 20 sends a control signal to the first aligner 5L via the first signal harness 82.

[0029] The second aligner 5R is electrically connected to the first aligner 5L and the robot controller 20. The second aligner 5R is controlled by the robot controller 20 via the first aligner 5L.

[0030] Specifically, the second aligner 5R is connected to the first aligner 5L via a second signal harness 83. The second aligner 5R is connected to the robot controller 20 via a second motor harness 84. The first aligner 5L transmits a control signal from the robot controller 20 to the second aligner 5R via the second signal harness 83. The robot controller 20 supplies power to the second aligner 5R via the second motor harness 84.

[0031] It is not essential that the second aligner 5R be controlled by the robot controller 20 via the first aligner 5L. The second signal harness 83 may connect the second aligner 5R and the robot controller 20.

[0032] (Robot structure) As described above, the robot 2 is a horizontal articulated robot. FIG. 3 is a side view of the robot 2. FIG. 4 is a plan view of the hand of the robot 2. As shown in FIG. 1 or 3, the robot 2 has a base 21. The base 21 is installed in the transfer space 15. The robot 2 has a manipulator 200. The manipulator 200 includes an arm 22 and hands 31 and 32.

[0033] The base 21 supports the arm 22. The arm 22 can be raised and lowered in the Z direction relative to the base 21. A first actuator 23 raises and lowers the arm 22. The arm 22 has links 221 and 222. The arm 22 has a plurality of links 221 and 222. The arm 22 of the illustrated robot 2 has two links, link 221 and link 222. Note that the number of links forming the arm 22 is not limited to two.

[0034] A first end of link 221 is supported by base 21. Link 221 is rotatable about a first axis Z1 extending in the Z direction relative to base 21. A second actuator 24 rotates link 221. A second end of link 221 is connected to a first end of link 222. Link 222 is rotatable about a second axis Z2 extending in the Z direction relative to link 221. A third actuator 25 rotates link 222.

[0035] The robot 2 has a first hand 31 and a second hand 32. The first hand 31 and the second hand 32 are connected to the second end of the link 222 in a state where they are overlapped in the Z direction. As shown in Fig. 3, the first hand 31 and the second hand 32 are positioned differently from each other by H in the Z direction.

[0036] The first hand 31 is rotatable about a third axis Z3 extending in the Z direction relative to the link 222, and the second hand 32 is also rotatable about the third axis Z3 relative to the link 222. The third axis Z3 is an example of a rotation axis. The fourth actuator 26 rotates the first hand 31 and the second hand 32 individually. The first hand 31 and the second hand 32 can change their positions between an overlapping state in the Z direction as shown in the upper diagram of FIG. 4 and a separated state as shown in the lower diagram of FIG. 4. As shown by the two-dot chain line in the lower diagram of FIG. 4, the first hand 31 and the second hand 32 can move away from each other to a position where the substrates 9 they are holding do not overlap. Note that the first hand 31 and the second hand 32 are not limited to changing their positions symmetrically in a plan view.

[0037] The first hand 31 and the second hand 32 have the same structure. Hereinafter, the first hand 31 and the second hand 32 will be collectively referred to as the hand 3. The hand 3 is an end effector that holds the substrate 9. As shown in FIG. 4, the hand 3 has a main body 301 and a holding portion 302. The main body 301 supports the holding portion 302. The main body 301 is rotatably connected to the second end of the link 222.

[0038] The holding portion 302 is substantially Y-shaped in a plan view, and has an open tip. As shown in FIG. 3, the holding portion 302 is in the form of a thin plate. The hand 3 generally holds the substrate 9 in various ways, such as gripping, suction, placing, or fitting, and releases the held substrate 9. The hand 3 in the illustration is an edge grip hand. The hand 3 holds the substrate 9 by having multiple guides grip the edges of the substrate 9. The hand 3 releases its hold on the substrate 9 when the guides move away from the edges of the substrate 9. The edge grip hand has a size corresponding to the diameter of the substrate 9. The size of the edge grip hand is relatively large.

[0039] (Aligner structure) FIG. 5 is a perspective view of the first aligner 5L and the second aligner 5R. FIG. 6 is a plan view of the first aligner 5L and the second aligner 5R. FIG. 7 is a side view of the first aligner 5L and the second aligner 5R. FIG. 8 is a plan view of the first aligner 51L alone. FIG. 9 is a side view illustrating the substrate receiving position P1 and the buffer position Pb. FIG. 10 is a side view illustrating the substrate placing position P2 and the alignment position Pa. In FIGS. 5, 6, and 7, the same reference numerals are used to designate components common to the first aligner 5L and the second aligner 5R.

[0040] The first aligner 5L and the second aligner 5R each align the substrate 9. The substrate 9 includes a first substrate 9 and a second substrate 9. The first substrate 9 is aligned by the first aligner 5L. The second substrate 9 is aligned by the second aligner 5R.

[0041] Specifically, the first aligner 5L rotates the first substrate 9 via the turntable 51, thereby aligning the first substrate 9 on the turntable 51 in the rotation direction Ar. The second aligner 5R rotates the second substrate 9 via the turntable 51, thereby aligning the second substrate 9 on the turntable 51 in the rotation direction Ar. As shown in FIG. 8 , the rotation direction Ar is the direction of rotation about a first axis Ox, which will be described later.

[0042] 5, the first aligner 5L and the second aligner 5R are aligned in the left-right direction. In other words, the second aligner 5R is located next to the first aligner 5L. In this embodiment, the left-right direction corresponds to the alignment direction of the first aligner 5L and the second aligner 5R.

[0043] 6, the right side as viewed from the first aligner 5L corresponds to the direction approaching the second aligner 5R. The left side as viewed from the first aligner 5L corresponds to the direction away from the second aligner 5R. The correspondence between each direction changes depending on the correspondence between the housing 10 and the four directions, i.e., the front-rear direction and the left-right direction.

[0044] As shown in Fig. 6, in this embodiment, the first aligner 5L and the second aligner 5R are positioned symmetrically about the center line CL in a plan view. Specifically, when the first aligner 5L and the second aligner 5R are installed at the same height, the components of the first aligner 5L and the second aligner 5R are positioned mirror-symmetrically about the reference plane CS extending on the center line CL illustrated in Fig. 5. In other words, the first aligner 5L and the second aligner 5R have the same structure at symmetrical positions in a plan view. However, it is not essential that the first aligner 5L and the second aligner 5R be positioned symmetrically about the center line CL in a plan view.

[0045] 1, the first aligner 5L, the second aligner 5R, and the robot 2 are arranged at an interval in the front-rear direction. In this embodiment, the front-rear direction corresponds to the arrangement direction of the first aligner 5L, the second aligner 5R, and the robot 2.

[0046] The front as seen from the first aligner 5L or the second aligner 5R corresponds to the direction approaching the robot 2. The rear as seen from the first aligner 5L or the second aligner 5R corresponds to the direction away from the robot 2.

[0047] 7, the second aligner 5R is offset upward or downward relative to the first aligner 5L. The offset in the vertical direction is achieved by making the height of the installation surface F different between the first aligner 5L and the second aligner 5R.

[0048] Specifically, the mounting surface F includes a first mounting surface Fl that supports the first aligner 5L and a second mounting surface Fr that supports the second aligner 5R. The first mounting surface Fl is higher than the second mounting surface Fr in the vertical direction. The first aligner 5L according to this embodiment is offset upward relative to the second aligner 5R.

[0049] It is not essential that the heights of the first installation surface Fl and the second installation surface Fr are different. The first aligner 5L and the second aligner 5R may be offset from each other in the vertical direction by making the height dimensions of the first aligner 5L and the second aligner 5R different.

[0050] The configuration of the first aligner 5L will be described below. The configuration of the second aligner 5R is the same as that of the first aligner 5L, except for several differences. As described above, the several differences include that the second aligner 5R is offset in the height direction relative to the first aligner 5L. The several differences include that the second aligner 5R is mirror-symmetric with respect to the first aligner 5L with respect to a reference plane CS extending along the Y and Z directions. The several differences include that the electrical connection structure between the second aligner 5R and the robot controller 20 is different.

[0051] Specifically, the first aligner 5L comprises a first housing 50, the rotating table 51, a support unit 52, a support surface driving unit 53, a rotating table driving unit 54, a detection table 55, a first sensor 56, a second sensor 57, and a third sensor 58.

[0052] -1st enclosure 50- The first housing 50 is installed on an installation surface F. The first housing 50 has a top surface 50a that supports a rotating table 51 and a detection table 55. The first housing 50 has multiple outer surfaces including the top surface 50a. In this embodiment, the first housing 50 has six outer surfaces.

[0053] 8, the first housing 50 has a connection part 50b, an air supply part 50c, and an air discharge part 50d. The connection part 50b, the air supply part 50c, and the air discharge part 50d are located on a top surface 50a, which is the outer surface of the first housing 50.

[0054] The connection part 50b is connected to a vacuum pump 61 via a first tube 63. The air supply part 50c is connected to an air pump 62 via a second tube 64. The air discharge part 50d is connected to an external space via a third tube 65. The external space is, for example, the space outside the first housing 50.

[0055] The top surface 50a faces upward. The rotating base 51 and the detection base 55 extend upward from the top surface 50a. The rotating base 51 may be integrated with each part of the first housing 50, such as the top surface 50a. The detection base 55 may be integrated with each part of the first housing 50, such as the top surface 50a. It is not necessary to consider the first housing 50 as an independent element from the rotating base 51 or the detection base 55.

[0056] -Rotating table 51- The turntable 51 rotates the substrate 9 around a first axis Ox. The first axis Ox is an axis extending in the vertical direction. More specifically, the turntable 51 supports the substrate 9 via a vacuum pad 51c connected to a vacuum pump 61. The turntable 51 rotates the substrate 9 supported by the vacuum pad 51c. The vacuum pad 51c forms the upper end of the turntable 51. As shown in FIG. 7, a mounting surface 51d on which the substrate 9 is placed is located at the upper end of the turntable 51.

[0057] Specifically, the turntable 51 according to this embodiment includes a second housing 51a, a spindle 51b, and a vacuum pad 51c. The second housing 51a is located on the top surface 50a. The outer surfaces of the second housing 51a include a top surface 511 facing upward, a left side surface 512 facing left, and a right side surface 513 facing right.

[0058] The spindle 51b extends upward from the upper surface 511 of the second housing 51a. The vacuum pad 51c is located at the upper end of the spindle 51b. The vacuum pad 51c adsorbs the lower surface of the substrate 9 when the vacuum pump 61 is driven. The substrate 9 is supported by the first aligner 5L by the vacuum pad 51c.

[0059] The spindle 51b rotates about a first axis Ox relative to the second housing 51a. The spindle 51b rotates while adsorbing the substrate 9 via the vacuum pad 51c, thereby rotating the substrate 9 about the first axis Ox.

[0060] A distance D3 between the center of the spindle 51b of the first aligner 5L and the center of the spindle 51b of the second aligner 5R is longer than the diameter Dw of the substrate 9. As shown in FIG. 6, the substrate 9 placed on the spindle 51b of the first aligner 5L and the substrate 9 placed on the spindle 51b of the second aligner 5R do not overlap in a plan view. In this embodiment, a gap D4 is provided between the substrate 9L and the substrate 9, allowing the support surface 52a to move up and down along the center line CL. In other words, in this embodiment, the distance D3 is longer than the diameter Dw of the substrate plus the gap D4.

[0061] -Support part 52- The support part 52 has a support surface 52a that supports the substrate 9. The support part 52 moves the support surface 52a between a substrate receiving position P1 and a substrate placing position P2. The substrate receiving position P1 is a position where the support part 52 receives the substrate P from the robot 2. The substrate placing position P2 is located below the substrate receiving position P1, and is a position where the substrate 9 is placed on the turntable 51 from the support part 52.

[0062] In this embodiment, the substrate receiving position P1 is located above the turntable 51, as shown in Fig. 9. The substrate placing position P2 is located below the substrate receiving position P1, as shown in Fig. 10. The positional relationship between the substrate receiving position P1 and the substrate placing position P2 may be reversed upside down. The substrate receiving position P1 and the substrate placing position P2 may also be offset from each other in the front-rear or left-right directions.

[0063] The support portion 52 moves the support surface 52a from the substrate receiving position P1 to the substrate placing position P2, waits at the substrate placing position P2, moves from the substrate placing position P2 to the substrate receiving position P1, and waits at the substrate receiving position P1.

[0064] Specifically, the support unit 52 according to this embodiment has an arm unit 7. The arm unit 7 extends from the rotating table 51. In this embodiment, there are multiple arm units 7. The majority of the multiple arm units 7 extend in a direction away from the second aligner 5R along the arrangement direction.

[0065] In this embodiment, there are three arms 7. The arms 7 include a first arm 71, a second arm 72, and a third arm 73. The second arm 72 and the third arm 73 extend in a direction away from the second aligner 5R. The number of arms 7 may be two, or may be four or more. The arms 7 are not essential elements of the first aligner 5L.

[0066] As shown in Fig. 8, the first arm portion 71 extends from the right side surface 513 of the second housing 51a. The first arm portion 71 has a base end portion 71a that extends rightward from the right side surface 513. The first arm portion 71 extends rightward from the right side surface 513 and then extends upward. After extending upward, the first arm portion 71 bends back and extends forward.

[0067] 6, the first arm portion 71 has a base end portion 71a, a connecting portion 71b, and a tip end portion 71c. The base end portion 71a extends in the proximal direction from the inner side surface (hereinafter referred to as the inner side surface) of the housing 51a. The connecting portion 71b extends upward from the inner end of the base end portion 71a and then bends back and extends forward. The tip end portion 71c is located at the front end of the connecting portion 71b, i.e., at the tip of the first arm portion 71. The tip end portion 71c has one or more suction pads on its upper surface.

[0068] The second arm portion 72 extends from the left side surface 512 of the second housing 51a. The second arm portion 72 has a base end portion 72a extending rightward from the right side surface 513. The second arm portion 72 extends leftward from the left side surface 512 and then extends upward. After extending upward, the second arm portion 72 bends back and extends toward the right. A third arm portion 73 branches off and extends from the portion of the second arm portion 72 that bends back toward the right. The third arm portion 73 branches off from the second arm portion 72 and extends forward, and then extends toward the right.

[0069] 5, the second arm portion 72 has a base end portion 72a, a connecting portion 72b, and a tip end portion 72c. The base end portion 72a extends in the away direction from the outer side surface (hereinafter referred to as the outer surface) of the housing 51a. The connecting portion 72b extends upward from the inner end of the base end portion 72a and then folds back and extends in the approaching direction. The tip end portion 72c is located at the inner end of the connecting portion 72b, i.e., at the tip of the second arm portion 72. The tip end portion 72c has one or more suction pads on its upper surface.

[0070] As shown in Fig. 5, the third arm portion 73 has a connecting portion 73b and a tip portion 73c. ​​The connecting portion 73b extends forward from the folding point of the connecting portion 72b, and then folds back and extends in the approaching direction. The tip portion 73c is located at the inner end of the connecting portion 73b, i.e., at the tip of the third arm portion 73. The tip portion 73c has one or more suction pads on its upper surface.

[0071] As shown in FIG. 8, the majority of the three arm units 7 are located on the opposite side of the robot 2 across the turntable 51. For example, in this embodiment, as shown in FIG. 8, the first arm unit 71 and the second arm unit 72 are located on the opposite side of the robot 2, i.e., in the rear space Sb. It is not an essential element of the robot system 6 that the first arm unit 71 and the second arm unit 72 are located on the opposite side of the robot 2. The first arm unit 71 and the second arm unit 72 may be located on the front side of the robot 2, for example.

[0072] A support surface 52a is located at the tip of each of the three arm sections 7. Each support surface 52a is formed by the upper surface of one or more suction pads. The support surface 52a contacts the substrate 9 from below. The support surface 52a supports the substrate 9 from below. The support surface 52a abuts against the outer peripheral edge of the lower surface of the substrate 9 and supports the substrate 9 from below.

[0073] It is not essential for the first aligner 5L that the support surface 52a be located at the tip of each arm portion 7. The support surface 52a may be located midway along each arm portion 7.

[0074] The height position of each support surface 52a is the same for each of the three arm units 7. A triangle Tr formed by connecting the support surfaces 52a of each arm unit 7 forms a plane extending along the horizontal direction. Unlike when two or four or more arm units 7 are used, using three arm units 7 reliably forms a plane.

[0075] As shown in FIG. 8, when the rotating table 51 is viewed in plan along the first axis Ox, the first axis Ox is located inside a triangle Tr formed by connecting the support surfaces 52a of the three arm portions 7.

[0076] 8, when the turntable 51 is viewed in plan along the first axis Ox, the support part 52 is located between the first axis Ox and the connection part 50b, the air supply part 50c, and the air discharge part 50d. In this embodiment, the connection part 50b, the air supply part 50c, and the air discharge part 50d are located rearward of the turntable 51 and the support part 52.

[0077] Furthermore, the arrangement direction of the connection portion 50b, the air supply portion 50c, and the air discharge portion 50d is along the extension direction of the base ends 71a, 72a of the first arm portion 71 and the second arm portion 72. When the first arm portion 71 and the second arm portion 72 are extended or displaced, interference between the first arm portion 71 and the second arm portion 72 and the first tube 63, the second tube 64, and the third tube 65 is suppressed.

[0078] 8, in the plan view, the three arm units 7 do not overlap with the rotating table 51. When the three arm units 7 are moved in the left-right and up-down directions, interference between each arm unit 7 and the rotating table 51 can be suppressed.

[0079] The support surface 52a of each arm portion 7 moves relative to the rotating table 51. Specifically, the support surface 52a of each arm portion 7 can move in the left-right direction in a direction away from the rotating table 51, a direction toward the rotating table 51, an upward direction, and a downward direction.

[0080] Specifically, each arm unit 7 extends and retracts in the left-right direction when power is received from the support surface drive unit 53. Each arm unit 7 is displaced in the up-down direction when power is received from the support surface drive unit 53. When each arm unit 7 extends and retracts and is displaced, the support surface 52a located at the tip of each arm unit 7 moves relative to the rotating table 51 as described above.

[0081] Each support surface 52a can be moved to a substrate receiving position P1 by moving the support surface 52a of each arm portion 7. As shown in Fig. 9, at the substrate receiving position P1, each support surface 52a is located above the spindle 51b and the vacuum pad 51c.

[0082] When each support surface 52a is on standby at the substrate receiving position P1, another substrate 9 can be received by each arm portion 7 while the substrate 9 is supported by the spindle 51b.

[0083] By moving each arm unit 7, each support surface 52a can be moved to substrate placement position P2. As shown by the gap ΔH in Figure 10, at substrate placement position P2, each support surface 52a is located below the upper end of spindle 51b, i.e., below vacuum pad 51c and placement surface 51d. Note that at substrate placement position P2, each support surface 52a may be located at the same height as vacuum pad 51c and placement surface 51d.

[0084] When each support surface 52a is moved from the substrate receiving position P1 to the substrate placing position P2, the substrate 9 supported by each arm portion 7 moves away from each support surface 52a and onto the spindle 51b.

[0085] Hereinafter, the substrate 9 supported by the support surface 52a located at the substrate receiving position P1 will be referred to as the substrate 9 located at the buffer position Pb. The buffer position Pb is a height position where the substrate 9 is temporarily placed on standby on the support surface 52a.

[0086] Hereinafter, the substrate 9 positioned on the vacuum pad 51c of the turntable 51 will be referred to as the substrate 9 positioned at the alignment position Pa. The alignment position Pa is a height position for aligning the substrate 9. As shown in FIG. 10, the height positions of the substrate 9 at the buffer position Pb and the alignment position Pa are different.

[0087] -Support surface drive unit 53- The support surface driving unit 53 moves each support surface 52a via the multiple arm units 7. The support surface driving unit 53 is, for example, an air cylinder connected to the air supply unit 50c and the air discharge unit 50d. The support surface driving unit 53 is driven by air supplied from the air supply unit 50c, and the air inside the cylinder is exhausted from the air discharge unit 50d. Note that it is not essential that the support surface driving unit 53 be configured as an air cylinder.

[0088] The support surface driving unit 53 according to this embodiment includes an air cylinder that moves each support surface 52a in the left-right direction, and an air cylinder that moves each arm unit 7 in the up-down direction.

[0089] 8, the support surface driving unit 53 is connected to the robot controller 20 by wire or wirelessly. The support surface driving unit 53 operates based on a control signal from the robot controller 20.

[0090] 11, the support surface driving unit 53 moves the support surface 52a from the substrate receiving position P1 to the substrate placing position P2. The support surface driving unit 53 lowers the support surface 52a via the corresponding arm unit 7 along a linear first locus T1.

[0091] In detail, when the support surfaces 52a move from the substrate receiving position P1 to the substrate placing position P2, the support surface driving unit 53 lowers each support surface 52a in the Z direction from the substrate receiving position P1 to the substrate placing position P2. The movement direction of the support surfaces 52a, i.e., the shape of the first locus T1, may be changed depending on the relative positional relationship between the substrate receiving position P1 and the substrate placing position P2.

[0092] For example, as shown in Fig. 11(a), at the start of movement from the substrate receiving position P1, the substrate 9 is located at the buffer position Pb. Thereafter, as shown in Fig. 11(b), just before completing movement to the substrate placing position P2, the substrate 9 arrives at the alignment position Pa.

[0093] Thereafter, as shown in Fig. 11(c), each support surface 52a completes its movement to the substrate placement position P2 by further descending below the height position shown in Fig. 11(b), forming the gap ΔH illustrated in Fig. 10.

[0094] By moving each support surface 52a along the first trajectory T1, the substrate 9 supported by each support surface 52a can be moved along a trajectory that is as short and simple as possible.

[0095] 12, the support surface driving unit 53 moves the support surface 52a from the substrate placing position P2 to the substrate receiving position P1 along a second locus T2 that bypasses the substrate 9 on the turntable 51. The support surface driving unit 53 raises each support surface 52a via the corresponding arm unit 7 along the U-shaped second locus T2.

[0096] In detail, when the support surface 52a moves from the substrate placing position P2 to the substrate receiving position P1, the support surface driving unit 53 raises the support surface 52a along the second locus T2 from the substrate placing position P2 to the substrate receiving position P1. The movement direction of the support surface 52a, i.e., the shape of the second locus T2, may be changed depending on the relative positional relationship between the substrate receiving position P1 and the substrate placing position P2.

[0097] More specifically, the second locus T2 has a sideways U-shape for each of the three arm units 7, with the opening of the U facing the turntable 51. When the second locus T2 is considered to be a sideways U-shape, the substrate 9 on the turntable 51 is located inside the U-shape.

[0098] In this embodiment, the second trajectory T2 is a combination of a trajectory that moves each support surface 52a in the left-right direction and a trajectory that moves each support surface 52a in the up-down direction. The second trajectory T2 includes movement away from the second aligner 5R, i.e., movement to the left. During movement of each support surface 52a, interference with the first aligner 5L is suppressed.

[0099] 12(d), a gap ΔH is formed at the start of movement from the substrate placement position P2. The substrate 9 and each support surface 52a are spaced apart in the vertical direction. Therefore, friction between the substrate 9 and the support surfaces 52a is avoided when the support surfaces 52a move from the substrate placement position P2.

[0100] Thereafter, as shown in FIG. 12(e), the support surface 52a moves along the second trajectory T2 that is shaped like a horizontal U, so that the support surface 52a moves while bypassing the substrate 9.

[0101] By moving each support surface 52a along the second locus T2, collision between each support surface 52a and the substrate 9 on the rotating table 51 can be avoided.

[0102] -Rotary drive unit 54- The turntable driving unit 54 rotates the substrate 9 via the turntable 51, thereby aligning the substrate 9 on the turntable 51 in the rotation direction Ar. The turntable driving unit 54 includes, for example, a motor. The turntable driving unit 54 operates based on a control signal from the robot controller 20.

[0103] The turntable driving unit 54 according to this embodiment is configured by a motor that rotates the spindle 51b and the vacuum pad 51c around the first axis Ox.

[0104] 8, the rotary table driving unit 54 is connected to the robot controller 20 by wire or wirelessly. The rotary table driving unit 54 operates based on a control signal from the robot controller 20.

[0105] -First sensor 56- The first sensor 56 detects the substrate 9 positioned on the turntable 51. In detail, the first sensor 56 outputs a detection signal for determining whether or not the substrate 9 is present at the alignment position Pa.

[0106] More specifically, the first sensor 56 outputs a detection signal to determine whether the substrate 9 is positioned on the turntable 51 before or after alignment by the turntable 51, or whether the substrate 9 is being aligned by the turntable 51.

[0107] The first sensor 56 is electrically connected to the robot controller 20 by wire or wirelessly. A detection signal from the first sensor 56 is input to the robot controller 20 or input to the system controller 18 via the robot controller 20.

[0108] The first sensor 56 is, for example, a pressure sensor. The first sensor 56 measures, for example, the pressure near the contact surface between the vacuum pad 51c and the substrate 9. Based on the detection signal of the first sensor 56, the robot controller 20 or the system controller 18 determines whether the substrate 9 is attached to the vacuum pad 51c.

[0109] -Detection stand 55- The detection table 55 is adjacent to the rotation table 51 in the horizontal direction. More specifically, the detection table 55 is adjacent to the rotation table 51 in a direction away from the second aligner 5R. For example, in this embodiment, the detection table 55 is adjacent to the left side of the rotation table 51.

[0110] When the turntable 51 is viewed in a plane along the first axis Ox, the majority of the multiple support surfaces 52a are closer to the detection table 55 than to the turntable 51 in the alignment direction of the turntable 51 and the detection table 55, i.e., in the left-right direction. In this embodiment, the support surfaces 52a of the second arm portion 72 and the support surfaces 52a of the third arm portion 73 are closer to the detection table 55.

[0111] 8, the second arm 72 and the third arm 73, which have the support surface 52a adjacent to the detection table 55, extend around the space S located on the opposite side of the rotation table 51, i.e., on the left side of the rotation table 51, across the detection table 55. Note that it is not essential for the first aligner 5L that one or more of the three arms 7 extend around the space S. For example, in the first aligner 5L, the second arm 72 and the third arm 73 may extend around another space located on the right side of the rotation table 51.

[0112] The detection stand 55 extends in the vertical direction and supports the second sensor 57. Specifically, the detection stand 55 extends so as to rise from the top surface 50a of the first housing 50. For example, in this embodiment, the detection stand 55 supports a third sensor 58 in addition to the second sensor 57. As shown in FIG. 8 , the second sensor 57 and the third sensor 58 are aligned in the front-to-back direction in a plan view. The second sensor 57 and the third sensor 58 overlap the outer periphery of the substrate 9 in a plan view.

[0113] 9, the detection table 55 has a recess 55a that is recessed in a direction away from the rotation table 51. The recess 55a has a horizontal U-shape. The opening of the U faces the rotation table 51. The distance between the recess 55a and the first axis Ox is longer than the radius of the substrate 9, which is expressed as Dw / 2.

[0114] 10, the peripheral edge 9a of the substrate 9 positioned at the alignment position Pa is located inside the recess 55a. Similarly, as shown in FIG. 9, the peripheral edge 9a of the substrate 9 positioned at the buffer position Pb is located inside the recess 55a.

[0115] -Second sensor 57- The second sensor 57 has an emitting portion 57a ​​and a light receiving portion 57b. The emitting portion 57a ​​emits detection light. The light receiving portion 57b receives the detection light. The second sensor 57 is an optical sensor that detects an object located between the emitting portion 57a ​​and the light receiving portion 57b based on the amount of light received by the light receiving portion 57b. Specifically, the second sensor 57 outputs a detection signal for determining whether or not a substrate 9 is present at the buffer position Pb.

[0116] The second sensor 57 is electrically connected by wire or wirelessly to the robot controller 20. A detection signal from the second sensor 57 is input to the robot controller 20 or input to the system controller 18 via the robot controller 20.

[0117] Specifically, the emission part 57a is located above the substrate receiving position P1 and the buffer position Pb. As shown in Fig. 9, the emission part 57a is located inside the outer peripheral edge 9b of the substrate 9 in the radial direction perpendicular to the first axis Ox.

[0118] The light receiving portion 57b is located below the substrate placement position P2 and the alignment position Pa. The light receiving portion 57b is located outside the outer peripheral edge 9b of the substrate 9 in the radial direction.

[0119] The optical axis La of the detection light obliquely intersects with a horizontal plane passing through the substrate receiving position P1. Specifically, the optical axis La extends radially outward as it extends downward.

[0120] For example, as shown in Fig. 9, the optical axis La obliquely intersects with the peripheral edge 9a of the substrate 9 located at the buffer position Pb. Also, as shown in Fig. 10, the optical axis La extends so as to avoid the peripheral edge 9a of the substrate 9 located at the alignment position Pa.

[0121] -Third Sensor 58- The third sensor 58 detects a notch located on the peripheral edge 9a of the substrate 9. More specifically, the third sensor 58 detects the notch of the substrate 9 rotated by the turntable 51. The third sensor 58 outputs a detection signal that characterizes the angular position of the substrate 9. The third sensor 58 is, for example, a laser line sensor. The third sensor 58 may include a sensor that reads the ID of the substrate 9. The third sensor 58 may include a sensor that determines the eccentricity of the substrate 9. The third sensor 58 may detect an orientation flat of the substrate 9 instead of the notch. The detection target of the third sensor 58 can be changed as appropriate depending on the outer shape and type of the substrate 9.

[0122] The third sensor 58 is electrically connected to the robot controller 20 by wire or wirelessly. A detection signal from the third sensor 58 is input to the robot controller 20 or input to the system controller 18 via the robot controller 20.

[0123] (Substrate alignment method) Next, an alignment method for the substrate 9 will be described with reference to Figures 13 and 14. Figure 13 is a sequence diagram of the alignment method for the substrate 9. Figure 14 is a sequence diagram of the alignment method for the substrate 9.

[0124] The method for aligning the substrate 9 is carried out using an aligner 5 and a robot 2 that transports the substrate 9 to the aligner 5. The aligner 5 is a combination of a first aligner 5L and a second aligner 5R.

[0125] The basic operation of the robot 2 is as follows: The robot 2 takes out the substrates 9 before alignment from the first FOUP 411 and transports them to the first aligner 5L and the second aligner 5R. The robot 2 also transports the aligned substrates 9 from the first aligner 5L and the second aligner 5R to the second FOUP 412. The robot 2 repeats the transport of the substrates 9 until alignment of all the substrates 9 is completed.

[0126] The basic operation of the aligner 5 is as follows: The aligner 5 receives the substrate 9 transferred from the robot 2 using the support surface 52a located at the substrate receiving position P1. The aligner 5 places the substrate 9 on the rotating table 51 by moving the support surface 52a from the substrate receiving position P1 to the substrate placing position P2. The aligner 5 aligns the substrate 9 on the rotating table 51. The aligner 5 also prepares to receive another substrate 9 by moving the support surface 52a from the substrate placing position P2 to the substrate receiving position P1.

[0127] 13, the substrate transfer system 1 causes the support surface 52a of the first aligner 5L to wait at the substrate receiving position P1, and the substrate transfer system 1 causes the support surface 52a of the second aligner 5R to wait at the substrate placing position P2.

[0128] In step S2, the robot 2 takes out the substrates 9 from the first FOUP 411 and transports the substrates 9 to the first aligner 5L and the second aligner 5R. The robot 2 transports the two substrates 9 using the first hand 31 and the second hand 32.

[0129] In step S3, the robot 2 simultaneously delivers the two transported substrates 9 to the first aligner 5L and the second aligner 5R. In detail, the robot 2 places the first substrate 9 held by the first hand 31 on the support surface 52a of the first aligner 5L, and places the second substrate 9 held by the second hand 32 on the support surface 52a of the second aligner 5R.

[0130] In other words, in step S3, the first aligner 5L receives the first substrate 9 from the first hand 31 by means of the support surface 52a waiting at the substrate receiving position P1. The second aligner 5R receives the second substrate 9 from the second hand 32 by means of the support surface 52a waiting at the substrate receiving position P1. The processing related to step S3 is executed based on the detection signal of the second sensor 57.

[0131] In step S4, the first aligner 5L and the second aligner 5R each move their support surfaces 52a from the substrate receiving position P1 to the substrate placing position P2 along the first trajectory T1. By moving their support surfaces 52a, the first aligner 5L transfers the first substrate 9 placed on each support surface 52a onto the turntable 51 of the first aligner 5L. By moving their support surfaces 52a, the second aligner 5R transfers the second substrate 9 placed on each support surface 52a onto the turntable 51 of the second aligner 5R. The first substrate 9 and the second substrate 9 move away from their support surfaces 52a and are attracted to the corresponding vacuum pads 51c. The processing related to step S4 is executed based on the detection signal of the first sensor 56.

[0132] In step S5, the first aligner 5L and the second aligner 5R reposition their respective support surfaces 52a from the substrate placement position P2 to the substrate receiving position P1. Specifically, the first aligner 5L and the second aligner 5R each move from the substrate placement position P2 to the substrate receiving position P1 along the second trajectory T2. By moving their respective support surfaces 52a, the first aligner 5L places each of the support surfaces 52a, which have released the first substrate 9, on standby to receive another substrate 9. The second aligner 5R moves their respective support surfaces 52a, which have released the second substrate 9, on standby to receive another substrate 9.

[0133] In step S6, the first aligner 5L and the second aligner 5R each perform alignment, including positioning, of the substrate 9 transferred onto the rotary table 51. In detail, the first aligner 5L and the second aligner 5R check the eccentricity of the substrate 9, read the ID of the substrate 9, and detect and align the notch of the substrate 9. The alignment of the substrate 9 is performed based on the detection performed by the third sensor 58. The alignment of the substrate 9 may be performed in parallel with step S5, or may be started before the execution of step S5.

[0134] In steps S7 and S8, the robot 2 returns to the first FOUP 411 accommodating other substrates 9 before or during the alignment of the substrates 9. The robot 2 starts the operation of taking out the next two substrates 9 as the other substrates 9 from the first FOUP 411.

[0135] In detail, after the robot 2 delivers the two substrates 9 in step S3, it returns to the first hoop 411 (step S7). The robot 2 takes out the next two substrates 9 from the first hoop 411 (step S8).

[0136] Steps S7 and S8 are performed while the first aligner 5L and the second aligner 5R are performing alignment of the substrate 9 in step S6 after steps S4 and S5.

[0137] Thereafter, in step S9 of FIG. 14, the robot 2 transports the next two substrates 9 to the first aligner 5L and the second aligner 5R.

[0138] In step S10, the robot 2 simultaneously delivers the next two transported substrates 9 to the first aligner 5L and the second aligner 5R. In detail, the robot 2 places the next first substrate 9 held by the first hand 31 on the support surface 52a of the aligner 5L waiting at the substrate receiving position P1, and also places the next second substrate 9 held by the second hand 32 on the support surface 52a of the second aligner 5R.

[0139] In other words, in step S10, the first aligner 5L receives the next first substrate 9 from the first hand 31 using the support surface 52a waiting at the substrate receiving position P1. The second aligner 5R receives the next second substrate 9 from the second hand 32 using the support surface 52a waiting at the substrate receiving position P1. In step S10, the aligned substrate 9 is placed on the vacuum pad 51c of the turntable 51.

[0140] In step S11, the robot 2 places the substrate 9 on the support portion 52, and then removes the aligned substrate 9 from the vacuum pads 51c of the first aligner 5L and the second aligner 5R. The first aligner 5L and the second aligner 5R wait without operating the turntable 51 and the support portion 52 (step S12).

[0141] In step S13, the robot 2 transports the aligned substrate 9 to the second FOUP 412. The robot 2 stores the aligned substrate 9 in the second FOUP 412. The robot 2 returns to the process of step S7 and returns to the first FOUP 411.

[0142] When the substrate 9 is removed from the vacuum pad 51c in step S12, the first aligner 5L and the second aligner 5R are in the same state as in step S3 (step S12). While the robot 2 is transporting the substrate 9 in steps S13, S7, S8, and S9, the process of the first aligner 5L and the second aligner 5R proceeds from step S12 to step S4.

[0143] After the process transition, the first aligner 5L and the second aligner 5R transfer the substrate 9 from the support part 52 to the rotating table 51 in step S4, change the position of the support surface 52a in step S5, and align the substrate 9 in step S6. During or after aligning the substrate 9, the robot 2 also places the substrate 9 on the support surface 52a of the first aligner 5L and the second aligner 5R in step S10.

[0144] The first aligner 5L and the second aligner 5R repeat steps S12, S4, S5, S6, and S7, and the robot 2 repeats steps S11, S13, S7, S8, and S9, thereby repeatedly performing alignment of the substrate 9. Because the support surface 52a holds and transfers the substrate 9, the robot 2 can transport the substrate 9 while the first aligner 5L and the second aligner 5R are performing alignment.

[0145] By receiving the substrate 9 by the support surface 52a waiting at the substrate receiving position P1, the robot 2 does not need to wait for the alignment to be completed. Moving the support surface 52a between the substrate receiving position P1 and the substrate placing position P2 significantly improves the throughput of the alignment of the substrate 9.

[0146] (Action and effect) The robot system 6 has a configuration in which the robot 2 transports the substrate 9 to the first aligner 5L and the second aligner 5R simultaneously, and a configuration in which the support part 52 moves up and down to hand over or receive the substrate 9 to the spindle 51b. Because the support part 52 receives and hands over (transfers) the substrate 9, the robot 2 can transport the substrate 9 while the first aligner 5L and the second aligner 5R are performing alignment. This reduces the waiting time of the robot, and improves the throughput of substrate 9 alignment.

[0147] The distance D3 between the center of the spindle 51b of the first aligner 5L and the center of the spindle 51b of the second aligner 5R is longer than the diameter Dw of the substrate. In other words, the substrate 9 placed on the spindle 51b of the first aligner 5L and the substrate 9 placed on the spindle 51b of the second aligner 5R do not overlap in a plan view. With the substrate supported by the spindle 51b of the first aligner 5L and the second aligner 5R, the spindle 51b of the first aligner 5L or the second aligner 5R can be operated independently.

[0148] In this embodiment, a gap D4 is provided between the substrate 9L and the substrate 9, allowing the tip 71c of the support member 52 to move up and down along the center line CL. In the example of FIG. 4, the distance D3 is longer than the diameter of the substrate plus the gap D4. The provision of a gap through which the tip 71c of the first arm 71 can pass allows a buffer mechanism to be added to the dual aligner configuration with minimal space. Furthermore, a large space is secured between the first aligner 5L and the second aligner 5R for the first hand 31 and the second hand 32 to receive or deliver the substrate 9.

[0149] Furthermore, the center of the substrate 9 placed on the support part 52 and the center of the substrate 9 placed on the spindle 51b coincide or nearly coincide in the Z direction. The first hand 31 and the second hand 32 of the robot 2 are positioned at the same position in a plan view relative to the first aligner 5L and the second aligner 5R, respectively, when transferring the transferred substrate 9 to the support part 52 and when receiving the aligned substrate 9 from the spindle 51b. Whether transferring the substrate 9 to the first aligner 5L and the second aligner 5R or transferring the substrate 9 from the first aligner 5L and the second aligner 5R, the movement trajectories of the first hand 31 and the second hand 32 can be made the same in a plan view, reducing the burden of teaching the robot 2.

[0150] 11, the first aligner 5L places the substrate 9 received from outside on the turntable 51 by lowering the support surface 52a along a linear first trajectory T1 from a substrate receiving position P1 to a substrate placing position P2. By lowering the substrate 9 along the linear first trajectory T1, damage to the substrate 9 can be reduced compared to a configuration in which the substrate 9 is moved back and forth and left and right.

[0151] 12, the first aligner 5L transfers the substrate 9 from the support surface 52a onto the turntable 51, and then moves the support surface 52a from the substrate placement position P2 to the substrate receiving position P1 along the second trajectory T2. By using a trajectory that bypasses the substrate 9 on the turntable 51 as the second trajectory T2, the support surface 52a can be moved to the substrate receiving position P1 without coming into contact with the substrate 9. Damage to the substrate 9 can be reduced compared to configurations that use other trajectories.

[0152] Another substrate 9 can be placed on the support surface 52a that has returned from the substrate placement position P2 to the substrate receiving position P1. Another substrate 9 can be placed on the support surface 52a without waiting for the completion of alignment of the substrate 9 positioned on the turntable 51. This improves throughput.

[0153] 10, the substrate placement position P2 is located below the vacuum pad 51c of the turntable 51. When the substrate 9 moves from the substrate placement position P2 to the substrate receiving position P1, interference between the support surface 52a and the underside of the substrate 9 can be suppressed. Damage to the substrate 9 can also be suppressed.

[0154] As shown in FIG. 8, the optical axis La of the detection light obliquely intersects with a horizontal plane passing through the substrate receiving position P1. Specifically, the detection light is emitted downward and radially outward. As shown in FIG. 9, the intersection C1 of the optical axis La with a horizontal plane extending along the turntable 51 is located radially outward of the intersection C2 of the optical axis La with a horizontal plane passing through the substrate receiving position P1, as shown in FIG. 10. The detection light can be set to intersect with the substrate 9 only when the substrate 9 is positioned at the buffer position Pb. The substrate 9 positioned at the buffer position Pb can be properly detected.

[0155] 8, the support surface 52a is located at the tip of each of the three arm portions 7. The substrate 9 and the support surface 52a can be brought into close to point contact. As the contact area is reduced, damage to the substrate 9 can be suppressed.

[0156] 8, the first axis Ox is located inside a triangle Tr formed by connecting the three support surfaces 52a. As the support surfaces 52a are lowered, tilting of the substrate 9 is suppressed when the substrate 9 is transferred onto the vacuum pad 51c. Since the posture of the substrate 9 is stabilized, damage to the substrate 9 can be suppressed.

[0157] 8, the support surfaces 52a of the second arm portion 72 and the third arm portion 73 are closer to the detection table 55 than to the rotation table 51. By moving the support surfaces 52a away from the rotation table 51, contact between the hand 3 and the support surfaces 52a can be avoided when transporting the substrate 9. Note that each support surface 52a may be closer to the rotation table 51 than to the detection table 55.

[0158] 8, the second arm portion 72 and the third arm portion 73 extend around into a space S located on the opposite side of the rotation table 51 with the detection table 55 in between in the left-right direction. The second arm portion 72 and the third arm portion 73 are moved away from both the detection table 55 and the rotation table 51. When the second arm portion 72 and the third arm portion 73 are operating, interference between the second arm portion 72 and the third arm portion 73 and the detection table 55 and the rotation table 51 can be suppressed.

[0159] 8, the connection part 50b, the air supply part 50c, and the air discharge part 50d are located rearward of the turntable 51 and the support part 52. By locating the connection part 50b etc. on the rear side, interference between the three arm parts 7 constituting the support part 52 and the first tube 63, the second tube 64, and the third tube 65 connected to the connection part 50b etc. can be suppressed.

[0160] Furthermore, by arranging the connection portion 50b etc. on the rear side, interference between the hand 3 and the first tube 63, the second tube 64 and the third tube 65 can be suppressed when the substrate 9 is transported.

[0161] 8, the first arm unit 71 and the second arm unit 72 are located on the opposite side, i.e., the rear side, of the robot 2. Interference between the hand 3 of the robot 2 and the first arm unit 71 and the second arm unit 72 can be suppressed.

[0162] (Variation) 15 illustrates an aligner 105L according to a modified example. The aligner 105L has a second locus T22 that is different in shape from the second locus T2 according to the above embodiment.

[0163] The second trajectory T2 is not limited to a combination of a trajectory for moving the support surface 52a in the left-right direction and a trajectory for moving the support surface 52a in the up-down direction, as shown in (e) of Fig. 12. As shown in the lower part of Fig. 15, the second trajectory T22 may be a trajectory that curves in a side view. Alternatively, the second trajectory T2 may be a combination of a trajectory for moving the support surface 52a in the front-rear direction and a trajectory for moving the support surface 52a in the up-down direction.

[0164] 13 is merely an example. The alignment in step S6 may be started before the repositioning in step S5 or simultaneously with the repositioning.

[0165] The robot 2 may have a first arm and a second arm. The first arm may support a first hand 31, and the second arm may support a second hand 32.

[0166] It is not essential that the aligner 5 includes the first aligner 5L and the second aligner 5R, but the aligner 5 may include only the first aligner 5L.

[0167] The functions of the elements disclosed herein can be performed using circuits or processing circuits, including general-purpose processors, special-purpose processors, integrated circuits, ASICs (Application Specific Integrated Circuits), conventional circuits, and / or combinations thereof, configured or programmed to perform the disclosed functions. A processor is considered a processing circuit or circuit because it includes transistors and other circuitry. In this disclosure, a circuit, unit, or means is hardware that performs the recited functions or hardware that is programmed to perform the recited functions. The hardware may be hardware disclosed herein or other known hardware that is programmed or configured to perform the recited functions. Where the hardware is a processor, which is considered a type of circuit, the circuit, means, or unit is a combination of hardware and software, and the software is used to configure the hardware and / or processor.

[0168] (Aspect) The above embodiment is a specific example of the following aspects.

[0169] (Aspect 1) a turntable (51) that rotates the substrate (9) around a first axis (Ox) extending in the vertical direction; a support surface (52a) that supports the substrate (9) and moves between a substrate receiving position (P1) that receives the substrate (9) and a substrate placing position (P2) that places the substrate (9) on the turntable (51); a support surface drive unit (53) that moves the support surface (52a) from the substrate receiving position (P1) to the substrate placing position (P2) and also moves the support surface (52a) from the substrate placing position (P2) to the substrate receiving position (P1) along a trajectory (T2) that bypasses the substrate (9) on the turntable (51); a turntable driving unit (54) that rotates the substrate (9) via the turntable (51) to align the substrate (9) on the turntable (51) in a rotation direction (Ar); Equipped with Alaina (5L, 5R, 105L).

[0170] When moving from the substrate placement position (P2) to the substrate receiving position (P1), the support surface (52a) can be moved to the substrate receiving position (P1) without coming into contact with the substrate (9) by using a trajectory (T2) that bypasses the substrate (9) on the turntable (51). By preventing contact between the support surface (52a) and the substrate (9), damage to the substrate (9) can be prevented.

[0171] Another substrate (9) can be placed on the support surface (52a) that has returned from the substrate placement position (P2) to the substrate receiving position (P1). Another substrate (9) can be placed on the support surface (52a) without waiting for the completion of alignment of the substrate (9) positioned on the turntable (51). This improves throughput.

[0172] (Aspect 2) The substrate receiving position (P1) is located above the turntable (51), the substrate placement position (P2) is located below the substrate receiving position (P1); the support surface drive unit (53) lowers the support surface (52a) from the substrate receiving position (P1) to the substrate placing position (P2) along the vertical direction, and also raises the support surface (52a) from the substrate placing position (P2) to the substrate receiving position (P1) along the trajectory (T2); Alaina (5L, 5R, 105L).

[0173] The substrate (9) can be placed on the turntable (51) simply by lowering the support surface (52a). The substrate (9) descends linearly downward without moving back and forth or side to side. By moving the substrate (9) along a simple trajectory (T1), damage to the substrate (9) is reduced compared to when the substrate (9) is moved back and forth or side to side.

[0174] By using the trajectory T2 when moving the support surface 52a from the substrate placement position P2 to the substrate receiving position P1, contact with the substrate 9 can be reduced compared to when the support surface 52a is simply raised, further reducing damage to the substrate 9.

[0175] (Aspect 3) At the substrate placement position (P2), the support surface (52a) is located below an upper end (51c) of the turntable (51). The aligner (5L, 5R, 105L) according to embodiment 2.

[0176] At the substrate placement position (P2), the support surface (52a) is separated from the lower surface of the substrate (9). When moving from the substrate placement position (P2) to the substrate receiving position (P1), interference between the support surface (52a) and the lower surface of the substrate (9) can be reduced, thereby reducing damage to the substrate (9).

[0177] (Aspect 4) an optical sensor (57) having an emission section (57a) that emits detection light and a light receiving section (57b) that receives the detection light, and that detects an object interposed between the emission section (57a) and the light receiving section (57b) based on the amount of light received by the light receiving section (57b); the optical axis (La) of the detection light obliquely intersects with a horizontal plane passing through the substrate receiving position (P1); The aligner (5L, 5R, 105L) according to embodiment 1.

[0178] The intersection (C2) of the optical axis (La) with a horizontal plane extending along the turntable (51) is located radially outward of the intersection (C1) of the optical axis (La) with a horizontal plane passing through the substrate receiving position (P1). The detection light can be set to intersect with the substrate (9) only when the substrate (9) is located at the buffer position (Pb). The substrate (9) located at the buffer position (Pb) can be properly detected.

[0179] (Aspect 5) A plurality of arm portions (7) extending from the rotating table (51) are provided, The support surface (52a) is located at the tip of each of the plurality of arm portions (7). The aligner (5L, 5R, 105L) according to any one of aspects 1 to 4.

[0180] The support surface (52a) is located at the tip of the arm portion (7). The substrate (9) and the support surface (52a) can be brought into close to point contact. The reduced contact area can prevent damage to the substrate (9). By providing multiple arm portions (7), the support of the substrate (9) can be stabilized while still achieving close to point contact.

[0181] (Aspect 6) The plurality of arm portions (7) are three, When the rotating table (51) is viewed in a plane along the first axis (Ox), the first axis (Ox) is located inside a triangle (Tr) formed by connecting the support surfaces (52a) of the multiple arm portions (7). The aligner according to embodiment 5 (5L, 5R, 105L).

[0182] The first axis (Ox) is located inside a triangle (Tr) formed by connecting the three support surfaces (52a). As the support surfaces (52a) descend, tilting of the substrate (9) is suppressed when the substrate (9) is transferred onto the turntable (51). Because the orientation of the substrate (9) is stabilized, damage to the substrate (9) can be suppressed.

[0183] (Aspect 7) an optical sensor (57) having an emission section (57a) that emits detection light and a light receiving section (57b) that receives the detection light, and that detects an object interposed between the emission section (57a) and the light receiving section (57b) based on the amount of light received by the light receiving section (57b); a detection table (55) that is horizontally adjacent to the rotating table (51), extends in the vertical direction, and supports the optical sensor (57), When the rotating table (51) is viewed in a plane along the first axis (Ox), the support surfaces (52a) of the majority (72, 73) of the plurality of arm portions (7) are closer to the detection table (55) than to the rotating table (51) along the arrangement direction of the rotating table (51) and the detection table (55). The aligner (5L, 5R, 105L) according to aspect 5 or 6.

[0184] The support surfaces 52 a of the majority of the arm portions 72, 73 are closer to the detection table 55 than to the turntable 51. By moving the support surfaces 52 a away from the turntable 51, contact between the transfer robot 2 and the support surfaces 52 a during transfer of the substrate 9 can be avoided.

[0185] (Aspect 8) Among the plurality of arm portions (7), the majority of arm portions (72, 73) extend around a space (S) located on the opposite side of the rotation table (51) across the detection table (55) in the arrangement direction. The aligner (5L, 5R, 105L) according to embodiment 7.

[0186] The majority of the arm portions (72, 73) are moved away from both the detection table (55) and the rotating table (51). When the majority of the arm portions (72, 73) are in operation, interference between the majority of the arm portions (72, 73) and the detection table (55) and the rotating table (51) can be suppressed.

[0187] (Aspect 9) An aligner (5L, 5R, 105L) according to aspect 5 or 6; a horizontal articulated transfer robot (2) that transfers the substrate (9) to the aligner (5L, 5R, 105L), A majority (71, 72) of the plurality of arm sections (7) are located on the opposite side of the turntable (51) from the transport robot (2). Robotic systems (6).

[0188] The other majority of the arm sections (71, 72) are moved away from the transport robot (2), thereby preventing interference between the transport robot (2) and the other majority of the arm sections (71, 72).

[0189] (Aspect 10) An aligner (5L, 5R, 105L) according to any one of aspects 1 to 8; a horizontal articulated transfer robot (2) having a hand (3) for holding the substrate (9) and for transferring the substrate (9) to the aligner (5L, 5R, 105L), The transfer robot (2) places the substrate (9) held by the hand (3) on the support surface (52a), the aligner (5L, 5R, 105L) moves the support surface (52a) from the substrate receiving position (P1) to the substrate placing position (P2), thereby transferring the substrate (9) placed on the support surface (52a) onto the rotating table (51); After transferring the substrate (9), the aligner (5L, 5R, 105L) moves the support surface (52a) from the substrate placement position (P2) to the substrate receiving position (P1), thereby making the support surface (52a) stand by to receive another substrate (9); The aligner (5L, 5R, 105L) aligns the substrate (9) transferred onto the rotating table (51), The transfer robot (2) returns to the FOUP (411) containing the other substrate (9) before or during the alignment of the substrate (9), and starts an operation of removing the other substrate (9) from the FOUP (411). A method for aligning a substrate (9).

[0190] While the aligners (5L, 5R, 105L) are performing alignment, the robot 2 can transport the substrate 9. By receiving the substrate 9 using the support surface (52a) waiting at the substrate receiving position (P1), the robot 2 does not need to wait for the alignment to be completed. Moving the support surface (52a) between the substrate receiving position (P1) and the substrate placing position (P2) significantly improves the throughput of substrate 9 alignment. [Explanation of symbols]

[0191] 1. Substrate transport system 2. Robot (transport robot) 41 Hoop 5 Aligner 5L First Aligner 5R 2nd Aligner 105L First Aligner 50 1st cabinet (cabinet) 50b connection 51 Turntable 51b Spindle 51c Suction pad (upper end) 52 Support part 52a Support surface 53 Support surface drive unit 54 Rotating table drive unit 55 Detection stand 57 Second sensor (optical sensor) 57a Emitter 57b Light receiving section 61 Vacuum Pump 6. Robot System 7 Arm section 71 First arm 72 Second arm 73 Third Arm 9 Substrate Ar rotation direction C1 intersection C2 intersection La Optical axis of detection light Ox 1st axis P1 Board receiving position P2 PCB placement position S Space T1 1st trajectory T2 2nd trajectory Tr triangle

Claims

1. a turntable that rotates the substrate around a first axis extending in the vertical direction; a support surface that supports the substrate and moves between a substrate receiving position that receives the substrate and a substrate placing position that places the substrate on the rotating table; a support surface drive unit that moves the support surface from the substrate receiving position to the substrate placing position, and also moves the support surface from the substrate placing position to the substrate receiving position along a trajectory that bypasses the substrate on the turntable; a turntable driving unit that rotates the substrate via the turntable to align the substrate on the turntable in a rotation direction; Equipped with Alaina.

2. 2. The aligner according to claim 1, the substrate receiving position is located above the turntable; the substrate placement position is located below the substrate receiving position; the support surface driving unit lowers the support surface from the substrate receiving position to the substrate placing position along the up-down direction, and raises the support surface from the substrate placing position to the substrate receiving position along the trajectory. Alaina.

3. 3. The aligner according to claim 2, At the substrate placement position, the support surface is located below an upper end of the turntable. Alaina.

4. The aligner of claim 1 , an optical sensor having an emission unit that emits detection light and a light receiving unit that receives the detection light, and that detects an object interposed between the emission unit and the light receiving unit based on an amount of light received by the light receiving unit; an optical axis of the detection light obliquely intersects with a horizontal plane passing through the substrate receiving position; Alaina.

5. The aligner of claim 1 , a plurality of arms extending from the rotating base; The support surface is located at the tip of each of the plurality of arm portions. Alaina.

6. The aligner according to claim 5, the plurality of arm portions are three; When the rotating table is viewed in a plan view along the first axis, the first axis is located inside a triangle formed by connecting the support surfaces of the plurality of arm portions. Alaina.

7. The aligner according to claim 5, an optical sensor having an emission unit that emits detection light and a light receiving unit that receives the detection light, and that detects an object interposed between the emission unit and the light receiving unit based on the amount of light received by the light receiving unit; a detection base that is horizontally adjacent to the rotary base, extends in the vertical direction, and supports the optical sensor; When the rotating table is viewed in a plane along the first axis, the support surfaces of the majority of the plurality of arm portions are closer to the detection table than the rotating table along an arrangement direction of the rotating table and the detection table. Alaina.

8. The aligner of claim 7, Among the plurality of arm portions, the majority of the arm portions extend around a space located on the opposite side of the rotation table with the detection table therebetween in the arrangement direction. Alaina.

9. The aligner according to claim 5 ; a horizontal articulated transfer robot that transfers the substrate to the aligner, a majority of the plurality of arm units are located on the opposite side of the turntable from the transport robot; Robot system.

10. a horizontal articulated transfer robot places the substrate held by the hand of the transfer robot on a support surface of an aligner; the aligner moves the support surface from a substrate receiving position where the support surface receives the substrate to a substrate placing position where the substrate is placed on a rotating table of the aligner, thereby transferring the substrate placed on the support surface onto the rotating table; the aligner moves the support surface from the substrate placement position to the substrate receiving position along a trajectory that bypasses the substrate on the rotating table, thereby making the support surface stand by to receive another substrate; the aligner aligns the substrate transferred onto the rotary table; the transfer robot returns to a FOUP accommodating the other substrate before or during alignment of the substrate, and starts an operation of removing the other substrate from the FOUP. Methods for aligning substrates.

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