System and method for manufacturing and assembling packaged electronic modules

Abstract

To provide a system and method for manufacturing and / or assembling a packaged electronic module for use in a smart card.SOLUTION: The packaged electronic module 300 includes the contact plate (s) 100, the printed circuit (s) 200 and / or value-added components 210, such as a display.SELECTED DRAWING: Figure 1

Description

[Technical Field]

[0001] This patent document contains material that is subject to copyright protection. The copyright owner has no objection to the reproduction of this patent document or any related material in the U.S. Patent and Trademark Office file file, but otherwise reserves all copyrights.

[0002] This application is a continuation-in-part of U.S. patent application Ser. No. 16 / 299,037, which is a continuation-in-part of U.S. patent application Ser. No. 15 / 645,234, now U.S. Patent No. 10,268,942, all of which are hereby incorporated by reference for all purposes.

[0003] The present invention relates to electronic modules, including systems and methods for manufacturing and / or assembling electronic modules for use in smart cards. [Background technology]

[0004] Smart cards, chip cards, or integrated circuit cards (ICCs) typically include credit card-sized cards with an embedded integrated circuit (IC) chip and other elements. Smart cards usually control access to assets such as bank or credit card accounts for financial transactions, personal identification, authentication, data storage, application processing, and other purposes.

[0005] Many smart cards include a pattern of metal contacts (eg, a contact plate) to provide electrical connection (eg, via a card reader) to an internal chip.

[0006] Current processes for manufacturing and / or assembling chips, contact plates and other elements into cards require multiple steps and are therefore time consuming, expensive and prone to problems.

[0007] Therefore, there is a need for a process for manufacturing and / or assembling packaged electronic modules for use in smart cards that reduces the number of steps, the time required for the process, the cost of the process, and potential problems that may arise. [Brief explanation of the drawings]

[0008] Various other objects, features and attendant advantages of the present invention will be better understood as they will be fully appreciated when considered in conjunction with the accompanying drawings, in which like reference characters refer to the same or similar parts throughout the several views. [Figure 1] FIG. 1 illustrates aspects of a packaged electronic module according to an exemplary embodiment of the present disclosure. [Figure 2A] FIG. 2A illustrates aspects of a contact plate according to an exemplary embodiment of the present invention. [Figure 2B] FIG. 2B illustrates aspects of a printed circuit according to an exemplary embodiment of the present invention. [Figure 3] FIG. 3 illustrates aspects of a packaged electronic module according to an exemplary embodiment of the present invention. [Figure 4] FIG. 4 illustrates aspects of a packaged electronic module according to an exemplary embodiment of the present invention. [Figure 5] FIG. 5 illustrates aspects of a packaged electronic module according to an exemplary embodiment of the present invention. [Figure 6] FIG. 6 illustrates aspects of a packaged electronic module according to an exemplary embodiment of the present invention. [Figure 7] FIG. 7 illustrates aspects of a packaged electronic module according to an exemplary embodiment of the present invention. [Figure 8] FIG. 8 illustrates aspects of a packaged electronic module according to an exemplary embodiment of the present invention. [Figure 9] FIG. 9 illustrates aspects of a packaged electronic module according to an exemplary embodiment of the present invention. [Figure 10]FIG. 10 illustrates a tape aspect of a contact plate according to an exemplary embodiment of the present invention. [Figure 11] FIG. 11 illustrates aspects of a printed circuit tape according to an exemplary embodiment of the present invention. [Figure 12] FIG. 12 illustrates aspects of a packaged electronic module according to an exemplary embodiment of the present invention. [Figure 13] FIG. 13 illustrates aspects of a packaged electronic module according to an exemplary embodiment of the present invention. [Figure 14] FIG. 14 illustrates aspects of an etched contact plate with a packaged electronic module according to an exemplary embodiment of the present invention. DETAILED DESCRIPTION OF THE INVENTION

[0009] Generally, and in accordance with exemplary embodiments herein, the present invention includes systems and methods for manufacturing and / or assembling packaged electronic modules that may then be integrated into value-added smart cards (e.g., value-added credit cards, value-added debit cards, etc.).

[0010] In certain embodiments, the present systems and methods require the use of only standardized equipment and / or machinery, thereby minimizing the need to develop or purchase new equipment.

[0011] Additionally, the systems and methods may use standardized components (e.g., ISO 7816 contact plates) and procedures so that current certifications and / or quality labels can be utilized on the final product (e.g., Mastercard's CQM (Card Quality Manufacturing) label for ICM). Note, however, that other components, which may or may not be standardized, may also be used.

[0012] Thus, the present invention provides a system and method for the manufacture and / or assembly of integrally packaged electronic modules that is practical, cost-effective, and scalable for industrial production.

[0013] The present invention, according to exemplary embodiments herein, will now be described in further detail with reference to Figures 1-14. It will be understood that the elements illustrated in Figures 1-14 may or may not be to scale, or may or may not be shown in actual proportion with respect to each other.

[0014] 1 shows a schematic diagram of a contact plate 100 electrically configured with a printed circuit 200 to form a packaged electronic module 300. Contact plate 100 includes a top surface 102 and a bottom surface 104, and printed circuit 200 includes a top surface 202 and a bottom surface 204. In one embodiment, printed circuit 200 includes electronic components 208 and value-added components 210. In one embodiment, value-added components 210 may include a display, a fingerprint sensor, an LED device, any other type of value-added component, and any combination thereof.

[0015] In one embodiment, the contact plate 100 and printed circuit 200 are electrical connectors. Electrical connections are made by electrical connectors (EC). Figure 1 is for illustrative purposes only. It will be understood that this diagram is not intended to represent the number, configuration, or location of the electrical connectors (EC), nor is this diagram intended to represent the relative size and shape of the contact plate 100, the printed circuit 200, or the electrical connectors (EC). In some embodiments, the electrical connectors (EC) include electrical elements comprised in the contact plate 100, electrical elements comprised in the printed circuit 200, and / or any combination thereof.

[0016] [2-part assembly 1] 2A shows the top surface 102 and bottom surface 104 of contact plate 100. In one exemplary embodiment herein, contact plate 100 includes one or more electrical connectors 106 on one surface (e.g., on the bottom surface 104 of contact plate 100) and one or more corresponding electrical contact points 108 on the opposite surface (e.g., on the top surface 102 of contact plate 100). Each electrical connector 106 is electrically coupled with one or more associated contact points 108, preferably according to the pinout of packaged electronic module 300.

[0017] Other types of components, such as electronic components 208, one or more antennas, and / or other devices may also be configured on the back surface 104 of the contact plate 100. In some embodiments, a corresponding area on the printed circuit 200 may be prepared to accommodate the electronic components 208 when the contact plate 100 and the printed circuit 200 are electrically coupled. In other embodiments, the devices configured on the back surface 104 of the contact plate 100 may fit within a gap formed between the contact plate 100 and the printed circuit 200 when the contact plate 100 and the printed circuit 200 are coupled, as will be discussed elsewhere below.

[0018] In one implementation as shown, the contact plate 100 includes five electrical connectors 106. In other embodiments, the contact plate 100 may include a different number of electrical connectors 106. For example, if the contact plate 100 includes an antenna or other components on its backside, the contact plate 100 may include seven electrical connectors 106 (two additional electrical connectors 106 for the antenna). Any other number of electrical connectors 106 may be used.

[0019] In some embodiments, the contact plate 100 conforms to the ISO 7816 contact plate specification. However, it will be understood that other types of contact plates 100 conforming to other standards may also be used, and the scope of the system 10 is not limited in any way by the type of contact plate 100 that may be used.

[0020] In some embodiments, the electrical connector 106 is formed into the contact plate 100 during the manufacturing process of the contact plate 100. In other embodiments, the electrical connector 106 is attached to the contact plate 100 using surface mount technology (SMT), using conductive adhesives with anisotropic conductive adhesives / films (ACF adhesives), soldering, wire bonding, other attachment techniques, or any combination thereof.

[0021] 2B illustrates a top surface 202 and a bottom surface 204 of printed circuit 200. In an exemplary embodiment herein, printed circuit 200 includes one or more electrical connectors 206 on one surface (e.g., on top surface 202 of printed circuit 200) that connect to associated electronic components 208 configured on printed circuit 200 according to the pinout of packaged electronic module 300. In one implementation as shown, printed circuit 200 includes five electrical connectors 206. However, it will be understood that printed circuit 200 may include any number of electrical connectors 206.

[0022] In some embodiments, the electrical connector 206 is formed on the printed circuit 200 during the manufacturing process of the printed circuit 200. In other embodiments, the electrical connector 206 is formed on the surface It may be attached to the printed circuit 200 using surface mount technology (SMT), conductive adhesive with anisotropic conductive adhesive / film (ACF adhesive), soldering, wire bonding, other attachment techniques, or any combination thereof.

[0023] 3, the contact plate 100 is aligned two-dimensionally over the printed circuit 200, with the electrical connectors 106 on the contact plate 100 aligned with at least one of the one or more electrical connectors 206 on the printed circuit 200, with the electrical connectors 106 on the contact plate facing the electrical connectors 206 on the printed circuit 200. In a preferred implementation, the one or more electrical connectors 106 on the contact plate 100 are aligned with corresponding electrical connectors 206 on the printed circuit 200. For example, in a preferred implementation, the five electrical connectors 106 on the contact plate (best seen in FIG. 2A) are aligned with corresponding five electrical connectors 206 on the printed circuit (best seen in FIG. 2B).

[0024] 4, once two-dimensionally aligned, the contact plate 100 and printed circuit 200 are joined such that the desired electrical connectors 106 on the contact plate 100 are electrically coupled to the corresponding electrical connectors 206 on the printed circuit 200. The contact plate 100 is then assembled with the printed circuit 200 to form a packaged electronic module 300. A conductive grease (conductive paste) may be used to couple the electrical connectors 106, 206, respectively, to reduce contact resistance, provide moisture protection, inhibit corrosion, and prevent static buildup. Other bonding techniques may also be used.

[0025] In certain exemplary embodiments herein, the electronic component 208 is not damaged or degraded in any way by mating the contact plate 100 and the printed circuit 200. In certain embodiments, the height of the electronic component 208 (along the Y-axis in FIG. 4 ) is less than the height of the gap between the contact plate 100 and the printed circuit 200 that is formed by mating the contact plate 100 and the printed circuit 200. In certain embodiments, the height of the mated electrical connectors 106 and 206 forms a gap between the contact plate 100 and the printed circuit 200 that can safely accommodate the electronic component 208.

[0026] 5, the cavity formed between the contact plate 100 and the printed circuit 200 in the assembled packaged electronic module 300 may be potted with a thermoplastic 302, polyurethane, silicone rubber gel, or other suitable potting material, which adheres the contact plate 100 to the printed circuit 200 and may help prevent damage from shock and vibration to the electronic module 300 and keep out more moist and / or corrosive elements.

[0027] [2-part assembly 2] In one exemplary embodiment herein, shown in FIG. 6 , the electrical connectors 206 of the printed circuit are mated with their corresponding electrical connectors 106 on the contact plate 100 before the contact plate 100 is assembled with the printed circuit 200. In this manner, the electrical connectors 206 of the printed circuit can function as extensions to the electrical connectors 106 of the contact plate. In this implementation, corresponding areas 207 on the printed circuit 200 (e.g., on the top surface 202 of the printed circuit 200) are adapted to receive the electrical connectors 206. The corresponding areas 207 are preferably free of obstructions and are prepared to receive the electrical connectors 206 simply by electrically coupling the contact plate 100 and the printed circuit 200. The corresponding areas 207 can include electrical contacts that electrically couple with the electrical connectors 206 to electrically connect the electrical connectors 206 with electronic components 208 and other components.

[0028] In one embodiment, the mated electrical connectors 106 and 206 are mated. The contact plate 100 may be replaced by a single electrical connector 106 that may include a length generally equivalent to the length of the combined electrical connectors 106, 206. In this manner, the single (longer) electrical connector 106 may provide the same or similar results as the combined electrical connectors 106, 206 by extending from the back surface 104 of the contact plate 100 to a corresponding area 207 on the printed circuit 200 (e.g., on the top surface 202 of the printed circuit 200).

[0029] Other types of components, such as electronic components 208, one or more antennas and / or other devices 1. Devices configured on the back surface 104 of the contact plate 100 may also be configured on the back surface 104 of the contact plate 100. In some embodiments, corresponding areas on the printed circuit 200 may be prepared to accommodate electronic components 208 simply by electrically coupling the contact plate 100 and the printed circuit 200. In other embodiments, devices configured on the back surface 104 of the contact plate 100 may fit within gaps formed between the contact plate 100 and the printed circuit 200 when the contact plate 100 and the printed circuit 200 are coupled, as will be discussed elsewhere below.

[0030] 6, with the contact plate 100 two-dimensionally aligned over the printed circuit 200, and with the contact plate electrical connectors 106 configured to have the printed circuit electrical connectors 206 facing surfaces on the printed circuit 200, one or more mating electrical connectors 106, 206 on the contact plate 100 preferably align with at least some of the corresponding areas 207 on the printed circuit 200 that are prepared to receive the printed circuit electrical connectors 206. In a preferred implementation, one or more mating electrical connectors 106, 206 on the contact plate 100 align with respective corresponding areas 207 on the printed circuit 200 that are prepared to receive the electrical connectors 206. For example, in a preferred implementation, five mated electrical connectors 106, 206 on the contact plate 100 (e.g., in a pattern as seen in FIG. 2A) are aligned with five corresponding areas 207 of the printed circuit (in a pattern as seen in FIG. 2B) that are prepared to receive the electrical connectors 206 of the printed circuit.

[0031] 7, while two-dimensionally aligned, the contact plate 100 and printed circuit 200 are brought together so that the desired mating electrical connectors 106, 206 on the contact plate 100 are electrically coupled with corresponding areas 207 on the printed circuit 200 that are prepared to receive the electrical connectors 206. The contact plate 100 is then assembled with the printed circuit 200 to form a packaged electronic module 300.

[0032] In some embodiments, the electrical connectors 206 are attached to corresponding areas 207 on the printed circuit 200 prepared to receive the electrical connectors 206 using surface mount technology (SMT), conductive adhesive with anisotropic conductive adhesive / film (ACF adhesive), soldering, wire bonding, other attachment techniques, or any combination thereof.

[0033] As with other embodiments, the electronic component 208 is not damaged or degraded in any way by mating the contact plate 100 and the printed circuit 200. In one embodiment, the height of the electronic component 208 (along the Y-axis in FIG. 7 ) is less than the height of the gap between the contact plate 100 and the printed circuit 200 that is formed by mating the contact plate 100 and the printed circuit 200. In one embodiment, the height of the mated electrical connectors 106 and 206 forms a gap between the contact plate 100 and the printed circuit 200 that can safely accommodate the electronic component 208.

[0034] As with the other embodiments, the cavity formed between the contact plate 100 and the printed circuit 200 in the assembled packaged electronic module 300 may be potted with a thermoplastic, polyurethane, silicone rubber gel, or other suitable potting material. This allows the contact plate 100 to adhere to the printed circuit 200, which may help prevent damage from shock and vibration to the electronic module 300 and keep out more moist and / or corrosive elements.

[0035] [Assembly with N parts] In one exemplary embodiment shown in Figure 8, packaged electronic module 300 may include two or more printed circuits 200A, 200B, ..., 200N and contact plate 100 that, when combined, form the entire printed circuit 200. For example, in Figure 8, Coupling of contact plate 100 with printed circuit 200A and printed circuit 200B can form packaged electronic module 300 of Figure 9. While Figure 8 shows electronic components 208 generally configured on the bottom surface of printed circuit 200A and on the top surface of printed circuit 200B, it will be understood that electronic components 208 can also be configured on the top surface of printed circuit 200A, on the bottom surface of printed circuit 200B, and / or on any other surface of printed circuit 200A and / or on any surface of printed circuit 200B.

[0036] In one embodiment, a printed circuit 200 (e.g., printed circuit 200A) configured directly beneath contact plate 100 includes electrical connectors 206A that are aligned with at least some of the electrical connectors 106 of the contact plate. Thus, when contact plate 100 is configured with printed circuit 200A, the electrical connectors 206A of the circuit board may electrically couple with the aligned electrical connectors 106 on contact plate 100.

[0037] In some embodiments, at least some of the electrical connectors 206A on the top surface of printed circuit 200A can penetrate printed circuit 200A and contact a lower printed circuit board 200 (e.g., 200B). In some embodiments, the top surface of lower printed circuit 200B includes corresponding areas 207 adapted to receive electrical connectors 206A that penetrate printed circuit 200A. Corresponding areas 207 are preferably free of obstructions and are prepared to receive electrical connectors 206A upon electrically coupling upper printed circuit 200A and lower printed circuit 200B. Corresponding areas 207 can include electrical contacts that electrically couple with electrical connectors 206A to electrically connect electrical connectors 206A with electrical components 208 and other components.

[0038] In some embodiments, upper printed circuit 200A includes electrical connector 206B that does not penetrate printed circuit 200A but is provided on the underside of printed circuit 200A and is adapted to mate with corresponding area 207 on lower printed circuit 200B when printed circuits 200A and 200B are electrically coupled. Corresponding area 207 may include electrical contacts that electrically couple with electrical connector 206B to electrically connect electrical connector 206B with electronic component 208 and other components.

[0039] It will be appreciated that the electrical connectors 200A and 200B may be adapted to electrically connect one or more electrical components 208 (located on the printed circuits 200A and / or 200B) with the contact plate 100.

[0040] As with other embodiments, electrical components 208 (contained on printed circuits 200A and / or 200B) are not damaged or degraded in any way by bonding printed circuits 200A and 200B together to form printed circuit 200, or by bonding printed circuits 200, 200A, and / or 200B with contact plate 100. In some embodiments, the height of electronic components 208 (along the Y-axis in FIG. 9 ) is less than the height of any gaps in which electronic components 208 may reside. For example, the height of electronic components 208 configured in the gaps between printed circuits 200A and 200B may be less than the height of the gaps between printed circuits 200A and 200B. In some embodiments, the height of electronic components 208 configured in the gaps between printed circuits 200A and 200B may be less than the height of the gaps between printed circuits 200A and 200B. The height of the electrical connector 206 between the printed circuits 200A and 200B forms a gap between the printed circuits 200A and 200B that securely houses the electronic component 208.

[0041] In other embodiments, the height of any electronic component 208 configured in the gap between the printed circuit 200A and the contact plate 100 may be less than the gap between the printed circuit 200A and the contact plate 100. In one embodiment, the height of the mated electrical connector 106 (on the bottom surface of the contact plate 100) and electrical connector 206 (on the top surface of the printed circuit 200A) forms a gap between the contact plate 100 and the printed circuit 200A that can safely accommodate the electronic component 208.

[0042] As with other embodiments, in the assembled packaged electronic module 300, the cavities formed between contact plate 100 and printed circuit 200A and between printed circuits 200A and 200B may be potted with a thermoplastic, polyurethane, silicone rubber gel, or other suitable potting material, thereby bonding contact plate 100 to printed circuit 200A and printed circuit 200A to printed circuit 200B, which may help prevent damage to electronic module 300 from shock and vibration and exclude more moist and / or corrosive elements.

[0043] 8 and 9 show two printed circuits 200A and 200B configured with contact plate 100 to form packaged electronic module 300, it will be understood that any number of printed circuits 200N may be combined with contact plate 100 to form packaged electronic module 300. It will also be understood that the details discussed above with respect to printed circuits 200A and 200B may also apply to the overall printed circuit 200 and / or any other printed circuits 200N that may be configured with printed circuit 200A and printed circuit 200B to form packaged electronic module 300. It will also be understood that the scope of system 10 is in no way limited by the number of printed circuits 200N that may be configured with contact plate 100 to form packaged electronic module 300.

[0044] [Contact Plate and / or Printed Circuit Formation] In certain exemplary embodiments herein, the contact plate 100 and the printed circuit 200 (whether a single printed circuit 200 or a printed circuit 200 comprising two or more printed circuits 200N) are each formed separately and then combined as described above to form the packaged electronic module 300.

[0045] 10, in certain exemplary embodiments herein, each contact plate 100 is formed as part of a tape 400 that includes multiple components. In some embodiments, the multiple components may be identical (e.g., identical contact plates 100), while in other embodiments, the components may be different or any combination thereof.

[0046] 11, in one exemplary embodiment herein, each printed circuit 200 is formed as part of a tape 500 that includes multiple components. In some embodiments, the multiple components may be identical (e.g., identical printed circuits 200), while in other embodiments, the components may be different or any combination thereof.

[0047] 10 illustrates tape 400 including two parallel rows of contact plates 100, and FIG. 11 illustrates tape 500 including two parallel rows of printed circuits 200, it will be understood that tape 400 may include any number of contact plates 100 in any arrangement, and tape 500 may include any number of printed circuits 200 in any arrangement. The number and arrangement of contact plates 100 included in tape 400 may vary depending on the number of printed circuits 200 included in tape 500. It is preferable that the number and arrangement of 00s be roughly the same, but this is not necessarily the case.

[0048] In certain exemplary embodiments herein, the tape 400 of the contact plates 100 may be cut into squares to cut each individual contact plate 100 from the tape 400. In certain exemplary embodiments herein, the tape 500 of the printed circuit 200 may be cut into squares to cut each individual printed circuit 200 from the tape 500. In certain embodiments, the tapes 400, 500 may each include weakened die-cut lines defining the perimeter of the contact plates 100 and the printed circuit 200, facilitating tearing the tapes 400, 500 along the weakened die-cut lines to cut out the respective components 100, 200. In other embodiments, a die-cutting tool or any other type of tool or method may be used to cut out the individual components from the tapes 400, 500.

[0049] Once the contact plate 100 and printed circuit 200 are extracted from the tapes 400, 500, respectively, the contact plate 100 and printed circuit 200 may be configured as described elsewhere. It will be understood that any number of printed circuits 200N may be formed on and cut from any number of tapes 500N and subsequently combined with the contact plate 100 as described.

[0050] 12 and 13, the tape 400 of the contact plate 100 is aligned and electrically coupled with the tape 500 of the printed circuit 200 to form a combined tape 600 of the packaged electronic module 300. This may be referred to as assembling the elements 100, 200 roll-to-roll.

[0051] In certain exemplary embodiments herein, details described elsewhere regarding the coupling of individual contact plates 100 with individual printed circuits 200 (whether a single printed circuit 200 or a printed circuit 200 comprising two or more printed circuits 200N) to form individual packaged electronic modules 300 also apply to embodiments regarding the coupling of multiple contact plates 100 (as part of tape 400) with multiple printed circuits 200 (as part of tape 500) to form a tape 600 of corresponding multiple packaged electronic modules 300.

[0052] 10-13 show two tapes (contact plate 100 tape 400 and printed circuit 200 tape 500) being combined to form combined tape 600 of packaged electronic module 300, it will be understood that any number of tapes may be combined to form combined tape of packaged electronic module 300. For example, contact plate 100 tape 400 may be combined with first printed circuit tape 500-1 and second printed circuit tape 500-2 to form combined tape 600 of packaged electronic module 300. It will be understood that contact plate 100 tape 400 may be combined with any number of printed circuit tapes 500-N to form tape 600 of packaged electronic module 300.

[0053] In certain exemplary embodiments herein, the resulting tape 600 of packaged electronic modules 300 may be cut into squares to cut out each individual packaged electronic module 300 from the tape 600. In certain embodiments, tapes 400, 500, and 600 may each include weakened die-cut lines defining the perimeter of the packaged electronic module 300, which may facilitate tearing the combined tape 600 along the weakened die-cut lines to cut out each individual electronic module 300. In other embodiments, a die-cutting tool or any other type of tool or method may be used to cut out the tape. It may be used to cut out individual packaged electronic modules 300 from the chip 600.

[0054] In one exemplary embodiment herein, tapes 400 and 500 are industry standard 35 mm However, it will be appreciated that any type of tape 400, 500 of any width may be used.

[0055] [Etched contact plate] In certain exemplary embodiments herein, the contact plate 100 is etched onto a surface of the printed circuit 200. In certain embodiments, the etching of the contact plate 100 onto the printed circuit 200 may be performed during the manufacturing process of the printed circuit 200.

[0056] In some embodiments, a mask may be applied to the circuit laminate to protect the copper (or other metal) in the desired contact plate areas. The mask may then generally facilitate the formation of the contact plate during the etching process. Once the contact plate is formed, the mask may be removed. The resulting contact plate 100 etched into the surface (top surface) of the printed circuit 200 is shown in FIG. 14. Note that the contact plate 100 may be etched on the bottom surface of the printed circuit 200, as well as on any surface of any circuit board 200N.

[0057] [Additional Information] In any embodiment herein, the printed circuit 200 may include any type of substrate, including but not limited to PI (polyimide), FR-4 (fiberglass), any other type of substrate, and any combination thereof.

[0058] In any embodiment herein, the attachment and / or connection of electrical connector 106 to electrical connector 206 may include using Surface Mount Technology (SMT), Anisotropic Conductive Film (ACF), soldering, wire bonding, any other applicable technique, and any combination thereof.

[0059] In any embodiment herein, the attachment and / or connection of the electrical connector 106 and / or the electrical connector 206 to a corresponding area 207 adapted to receive the electrical connector 106, 206 on the printed circuit may include using Surface Mount Technology (SMT), Anisotropic Conductive Film (ACF), soldering, wire bonding, any other applicable technique, and any combination thereof.

[0060] In any embodiment herein, the electronic components 208 may be attached and / or connected to the printed circuits 200, 200A, 200B, . . . , 200N by any suitable method, including surface mount technology (SMT), anisotropic conductive film (ACF), soldering, wire bonding, etc. , any other applicable technique and any combination thereof.

[0061] In any embodiment herein, the physical footprint (size and shape) of the printed circuit 200 may be smaller than, substantially the same as, larger than, or any ratio to the footprint of the contact plate 100.

[0062] In any embodiment herein, the contact plate 100 may employ a 6-pin design, an 8-pin design, and / or any other number of pins (n-pin) design.

[0063] In any embodiment herein, the value-added components 210 of the resulting packaged electronic module 300 are 0 as contact plate 100, on the opposite side of packaged electronic module 300 as contact plate 100, or on any side of packaged electronic module 300.

[0064] In any of the embodiments herein, the printed circuit 200, 200A, 200B, . . . , 200N is electrically connected to an antenna embedded in the body of the smart card. The device may include an antenna and / or electrical connector for communicating with the device.

[0065] It will be understood that any detail, part, element and / or aspect described with respect to any one of the embodiments herein may also apply to any other of the embodiments described herein.

[0066] Those skilled in the art will recognize and understand, upon reading this description, that embodiments herein may provide different and / or other advantages, and that not all embodiments or implementations need possess all advantages.

[0067] Where a process is described herein, those skilled in the art will recognize that the process may operate without any user intervention. In alternative embodiments, the process includes some human intervention (e.g., steps are performed by or with human assistance).

[0068] As used herein, including in the claims, the term "at least some" means "one or more" and includes only one. Thus, for example, the term "at least some ABC" means "one or more ABC" and includes only one ABC.

[0069] As used herein, including in the claims, the term "at least one" should be understood to mean "one or more," and therefore includes both embodiments including one or more components. Furthermore, a dependent claim that references an independent claim that recites a feature using "at least one" has the same meaning both when the feature is referred to as "said" and when it is referred to as "said at least one."

[0070] As used in this description, the term "part" means part or all. Thus, for example, "part of X" can include part of "X" or all of "X." In the context of a conversation, the word "part" can mean part or all of the conversation.

[0071] As used herein, including in the claims, the phrase "uses" means "uses at least," and not exclusively. Thus, for example, the phrase "uses X" means "uses at least X." Unless specifically stated by use of the word "only," the phrase "uses X" does not mean "uses only X."

[0072] As used herein, including in the claims, the phrase "based on" means "based in part on" or "based at least in part on," and not exclusively. Thus, for example, the phrase "based on element X" means "based in part on element X" or "based at least in part on element X." Unless expressly stated by use of the word "sole," the phrase "based on X" does not mean "based only on X."

[0073] Generally, as used herein, including in the claims, the word "sole" should not be construed as inclusive unless it is specifically used in that language. .

[0074] As used herein, including in the claims, the phrase "distinct" means "at least partially distinct." Unless specifically stated otherwise, the phrase "distinct" does not mean "completely distinct." Thus, for example, the phrase "X is distinct from Y" means "X is at least partially distinct from Y," not "X is completely distinct from Y." Thus, as used herein, including in the claims, the phrase "X is distinct from Y" means "X is distinct from Y in at least some respect."

[0075] It will be understood that words such as "first," "second," etc., used in this specification and in the claims are used for distinction or specificity and not to denote sequential or numerical limitations. Similarly, letter designations (e.g., "(A)," "(B)," "(C)," etc., or "(a)," "(b)," etc.) and / or numbers (e.g., "(i)," "(ii)," etc.) are used for ease of reading and to aid in distinction and / or specificity and are not intended to imply or add any sequential or numerical or sequential limitations. Similarly, the words "particular," "specific," "certain," and "given," if used in this specification and in the claims, are used for distinction or specificity and are not intended to imply any other limitations.

[0076] As used herein, including in the claims, the words "multiple" and "plurality" mean "two or more," including "two." Thus, for example, the phrase "multiple ABC groups" means "two or more ABC groups" and includes "two ABCs." Similarly, for example, the phrase "multiple PQR groups" means "two or more PQR groups" and includes "two PQRs."

[0077] The present invention also covers the exact terms, characteristics, values, ranges, etc. when these terms, characteristics, values, ranges, etc. are used in combination with terms such as "about," "around," "roughly," "roughly," "substantially," "at least," etc. (i.e., "about 3" or "nearly 3" should also cover exactly 3, and "substantially constant" should also cover exactly constant).

[0078] As used herein, including in the claims, unless the context dictates otherwise, the singular forms of terms are to be construed as including the plural and vice versa. Thus, as used herein, it should be noted that the singular forms "a," "an," and "the" include plural references unless the context clearly dictates otherwise.

[0079] Throughout this specification and claims, the terms "comprise," "including," " The words "having" and "contain" and their variations are used interchangeably. "including but not limited to" should be understood to mean "including but not limited to" and is not intended to exclude other elements unless specifically so stated.

[0080] It will be understood that variations to the embodiments of the invention may be made while remaining within the scope of the invention. Alternative features serving the same, equivalent, or similar purpose may replace features disclosed herein, unless stated otherwise. Thus, unless stated otherwise, each disclosed feature represents an example of a generic series of equivalent or similar features.

[0081] The present invention also provides that these terms, characteristics, values, ranges, etc., are used in conjunction with "about," "near," "roughly," "approximate ... When used in conjunction with terms such as "is," "substantially," "essentially," "at least," etc., it covers the exact term, feature, value, range, etc. (i.e., "about 3" should cover exactly 3, or "substantially constant" should also cover exactly constant).

[0082] The use of exemplary language such as "for instance," "such as," "for example," ("eg," etc.) is intended merely to better describe the invention and does not imply a limitation on the scope of the invention unless specifically claimed as such.

[0083] While the present invention has been described in connection with what are presently considered to be the most practical and preferred embodiments, it is to be understood that the invention is not to be limited to the disclosed embodiments, but on the contrary, is intended to cover various modifications and equivalent arrangements included within the spirit and scope of the appended claims.

Claims

1. 1. A method of assembling a packaged electronic module for use in a smart card, said method comprising: (A) providing a first contact plate including a first electrical connector; The first electrical connector is provided on a first surface of the first contact plate. providing a first contact plate; (B) providing a first printed circuit including a second electrical connector; the second electrical connector is mounted on a first surface of the first printed circuit; providing a first printed circuit; (C) electrically coupling the first electrical connector to the second electrical connector to form a packaged electronic module; A method comprising:

2. The first surface of the first contact plate includes a bottom surface of the first contact plate, and the first surface of the first printed circuit includes a top surface of the first printed circuit. The method of claim 1.

3. The first contact plate includes one or more contact points, and the first electrical connector of the first contact plate is electrically connected to at least one of the one or more contact points. The method of claim 1.

4. The first printed circuit includes one or more electronic components, and the first electrical connector of the first printed circuit is electrically connected to at least one of the one or more electronic components. The method of claim 1.

5. (C) The electrical coupling of the first electrical connector with the second electrical connector forms a gap between the first surface of the first contact plate and the first surface of the first printed circuit, and at least one of the one or more electronic components fits within the gap. The method of claim 4.

6. The first printed circuit includes one or more value-added components selected from the group consisting of a display, a fingerprint sensor, and an LED device. The method of claim 1.

7. The first contact plate and / or the first printed circuit are configured to include an antenna. The method of claim 1.

8. The first contact plate is included in a first contact plate tape. The method of claim 1.

9. The first printed circuit is included in a first printed circuit tape. The method of claim 1.

10. 1. A method of assembling a packaged electronic module for use in a smart card, said method comprising: (A) providing a first contact plate including a first electrical connector; The first electrical connector is provided on a first surface of the first contact plate. providing a first contact plate; (B) providing a first printed circuit including a second electrical connector and a third electrical connector; the second electrical connector is mounted on a first surface of the first printed circuit; the third electrical connector is mounted on a second surface of the first printed circuit; providing a first printed circuit; (C) providing a second printed circuit including the first contact area; the first contact area is provided on a first surface of the second printed circuit; providing a second printed circuit; (D) electrically coupling the first electrical connector with the second electrical connector and the third electrical connector with the first contact area to form a packaged electronic module; A method comprising:

11. The first surface of the first contact plate includes a bottom surface of the first contact plate, the first surface of the first printed circuit includes a top surface of the first printed circuit, the second surface of the first printed circuit includes a bottom surface of the first printed circuit, and the first surface of the second printed circuit includes a top surface of the second printed circuit. The method of claim 10.

12. The second electrical connector is electrically connected to the third electrical connector. The method of claim 10.

13. The first printed circuit includes one or more first electronic components, and the first electrical connector of the first printed circuit is electrically connected to at least one of the one or more first electronic components. The method of claim 10.

14. The first contact plate and / or the first printed circuit and / or the second printed circuit are configured to include an antenna. The method of claim 10.

15. The electrical coupling of the first electrical connector with the second electrical connector in (D) forms a first gap between the first surface of the first contact plate and the first surface of the first printed circuit, and at least one of the one or more first electronic components fits within the first gap. The method of claim 13.

16. The second printed circuit includes one or more second electronic components, and the first contact area of ​​the second printed circuit is electrically connected to at least one of the one or more second electronic components. The method of claim 10.

17. (D) the electrical coupling with the first contact area of ​​the third electrical connector forms a second gap between the second surface of the first printed circuit and the first surface of the second printed circuit, and at least one of the one or more second electronic components fits within the second gap.

17. The method of claim 16.

18. The second printed circuit is a group consisting of a display, a fingerprint sensor, and an LED device. Contains one or more value-added components selected from the group The method of claim 10.

19. The first contact area includes a fourth electrical connector. The method of claim 10.

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