Rail pressure sensor chip mounting equipment

Abstract

The invention relates to the technical field of chip mounting, and discloses a rail pressure sensor chip mounting device, which comprises a placement platform provided with a three-axis linear module and a conveying assembly; the connecting seat is fixedly mounted at the movable end of the three-axis linear module, a mounting seat is arranged at the bottom of the connecting seat, two clamping frames are fixedly mounted at the bottom of the mounting seat, and correcting grooves are formed in the opposite sides of the two clamping frames; the scraping assembly is arranged on the side edge of the mounting seat and is used for cleaning redundant soldering paste at the pin after reflow soldering; the cleaning assembly is arranged on the other side of the mounting base and used for cleaning and collecting the soldering paste left on the scraping assembly; according to the invention, through cooperation of a plurality of assemblies, the problem of dislocation of chip pins and bonding pads and the problem of connection of welding spots between the pins after welding can be effectively solved, the whole process is high in automation degree, the mounting precision and the production efficiency are greatly improved, and the welding quality of the rail pressure sensor chip is ensured.

Description

Technical Field

[0001] This invention relates to the field of chip mounting technology, and more specifically to a rail pressure sensor chip mounting device. Background Technology

[0002] The rail pressure sensor, short for common rail pressure sensor, is a key component in the common rail system of diesel engines. Its performance directly affects the fuel injection accuracy and operational stability of the engine. As the core component of the rail pressure sensor, the mounting quality of the chip is crucial to the overall performance of the sensor.

[0003] After the chip is placed on the circuit board coated with solder paste, it will undergo a second reflow soldering. Since the chip and the circuit board rely on the adhesive of the solder paste to adhere, the chip pins and pads are prone to misalignment during the transfer process. This can lead to poor soldering of the pins and pads after reflow soldering, resulting in problems such as cold solder joints, short circuits, or open circuits, which seriously affect the electrical performance and reliability of the rail pressure sensor. At the same time, after the soldering is completed, the solder joints between the pins may also become connected, which can further lead to the failure of the rail pressure sensor. Summary of the Invention

[0004] In order to overcome the above-mentioned defects of the prior art, the present invention provides a rail pressure sensor chip mounting device to solve the problems that chip pins and pads are prone to misalignment, resulting in poor soldering of pins and pads after reflow soldering, such as cold solder joints, short circuits or open circuits, and the problem that solder joints between pins may connect after soldering.

[0005] This invention provides the following technical solution: a rail pressure sensor chip mounting device, comprising: a placement platform, on which a three-axis linear module and a conveying assembly are disposed; a connecting seat, fixedly installed on the movable end of the three-axis linear module, with a mounting base at the bottom of the connecting seat, and two card holders fixedly installed at the bottom of the mounting base, with correction grooves opened on opposite sides of the two card holders; a scraping assembly, disposed on the side of the mounting base, for cleaning excess solder paste from the pins after reflow soldering; a cleaning assembly, disposed on the other side of the mounting base, for cleaning and collecting solder paste remaining on the scraping assembly; a storage assembly, disposed on the conveying assembly, for placing the circuit board and the chip; and a lifting assembly, disposed on the placement platform, located inside the conveying assembly, for supporting the chip.

[0006] As a further embodiment of the present invention, the scraping assembly includes: a second linear actuator, which is horizontally fixedly installed on the side of the mounting base; a first connecting frame is fixedly installed at one end of the movable shaft of the second linear actuator; a fixing frame is welded to one end of the first connecting frame; and a soldering iron tip is fixedly installed at one end of the fixing frame; a clearance groove for avoiding the pins is provided at the bottom of the soldering iron tip.

[0007] As a further embodiment of the present invention, the cleaning component includes: a first linear actuator, which is obliquely fixedly installed on the other side of the mounting base; a second connecting frame is fixedly installed at one end of the movable shaft of the first linear actuator; a scraper is welded to one end of the second connecting frame; a storage slot is provided on the top of the scraper, and the width of the storage slot is greater than the width of the soldering iron tip.

[0008] As a further embodiment of the present invention, a conical surface is provided on the bottom of the soldering iron tip near the scraper; an inclined surface is provided on the top of the scraper near the soldering iron tip, and the top of the inclined surface is connected to the storage slot; the conical surface and the inclined surface have the same inclination angle.

[0009] As a further embodiment of the present invention, the conveying assembly includes: two sets of conveyor belts, both fixedly installed above the placement platform, for driving the storage assembly and circuit board and chip to be transferred, and the lifting assembly is located between the two conveyor belts.

[0010] As a further embodiment of the present invention, the lifting assembly includes: a cylinder, fixedly installed at the bottom of the placement platform, with a top plate fixedly installed at the movable end of the cylinder; multiple guide rods, respectively located at the four corners of the top plate and slidably connected to the placement platform, for limiting the rotation of the top plate; and a baffle, fixedly installed at the top of the conveyor belt bracket, with a gap between it and the conveyor belt.

[0011] As a further embodiment of the present invention, the storage module includes: a placement rack placed on two conveyor belts, the placement rack passing through the gap between the baffle and the conveyor belts; and multiple placement slots evenly opened on the top of the placement rack for positioning circuit boards.

[0012] As a further embodiment of the present invention, a rotating shaft is fixedly mounted on the top of the mounting base; a servo motor is fixedly mounted on the top of the connecting base, and the output shaft of the servo motor is connected and fixed to the rotating shaft through a coupling.

[0013] As a further embodiment of the present invention, it also includes: an air outlet head, which is fixedly installed at the bottom of the mounting base and connected to an external air inlet pipe; and a heating wire, which is fixedly installed inside the air outlet head and used to heat the air blown out from the air outlet head.

[0014] As a further embodiment of the present invention, a pressing block is fixedly installed at the bottom of the mounting base, and the pressing block is located between two card holders.

[0015] The technical effects and advantages of this invention are as follows: 1. This invention, through the coordinated operation of multiple components, can effectively solve the problems of misalignment between chip pins and pads, as well as the problem of solder joint connection between pins after soldering. The entire process is highly automated, greatly improving mounting accuracy and production efficiency, and ensuring the soldering quality of rail pressure sensor chips.

[0016] 2. This invention effectively removes excess solder paste between and around the pins through precise control of the scraping action. The presence of the clearance groove allows the soldering iron tip to move flexibly between dense pins. Even for chips with small pin spacing, solder paste can be cleaned without dead angles. It fully considers the safety and efficiency of the scraping process, ensuring the cleanliness of the chip pins and the stability of electrical performance after soldering.

[0017] 3. By promptly intervening with the cleaning component, this invention ensures that the soldering tip remains clean after each scraping operation, preventing residual solder paste from hardening and affecting subsequent scraping results, or from falling and contaminating equipment or products during movement.

[0018] 4. By incorporating a lifting component, this invention enables precise alignment between the lifting action and the conveyor belt's transport action. The entire process is highly automated, stable, and reliable, providing a solid foundation for subsequent processes such as chip positioning correction, soldering, and solder paste cleaning.

[0019] 5. This invention, through the combined use of the venting head and the heating wire, can significantly accelerate the melting speed of the solder paste, enabling the solder paste to reach a molten state in a shorter time, thereby shortening the soldering operation time and improving overall work efficiency. Attached Figure Description

[0020] Figure 1 This is a three-dimensional structural diagram of the present invention.

[0021] Figure 2 This is an enlarged structural schematic diagram of the connector of the present invention.

[0022] Figure 3 This is an enlarged schematic diagram of the bottom structure of the mounting base of the present invention.

[0023] Figure 4 This is an enlarged schematic diagram of the card holder structure of the present invention.

[0024] Figure 5 This is an enlarged structural schematic diagram of the scraping component of the present invention.

[0025] Figure 6 This is an enlarged structural schematic diagram of the cleaning component of the present invention.

[0026] Figure 7 This is a schematic diagram of the initial state of the soldering iron tip and scraper of the present invention.

[0027] Figure 8 This is a schematic diagram showing the comparison between the width of the soldering iron tip and the storage slot in this invention.

[0028] Figure 9 This is a schematic diagram of the working structure of the soldering iron tip and scraper of the present invention.

[0029] Figure 10This is an enlarged schematic diagram of the conveyor belt structure of the present invention.

[0030] Figure 11 This is an enlarged structural schematic diagram of the placement rack of the present invention.

[0031] The attached diagram is labeled as follows: 1. Placement platform; 2. Three-axis linear module; 3. Conveyor belt; 4. Connecting seat; 5. Servo motor; 6. Rotating shaft; 7. Mounting seat; 8. First linear actuator; 9. Air outlet; 10. Heating wire; 11. Second linear actuator; 12. Lower pressure block; 13. Card holder; 14. Correction groove; 15. First connecting frame; 16. Fixing frame; 17. Soldering iron tip; 18. Alternating groove; 19. Conical surface; 20. Second connecting frame; 21. Scraper; 22. Storage groove; 23. Inclined surface; 24. Baffle; 25. Placement frame; 26. Top plate; 27. Placement groove; 28. Guide rod; 29. ​​Cylinder. Detailed Implementation

[0032] The technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings. In addition, the forms of the various structures described in the following embodiments are merely illustrative. The present invention is not limited to the structures described in the following embodiments. All other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0033] Reference Figures 1-11 The present invention provides a rail pressure sensor chip mounting equipment, including a placement platform 1. The placement platform 1 is the mounting platform for the reflow soldering equipment (reflow oven) in the chip mounting equipment. The figure only shows a part of the reflow soldering equipment and does not fully show the overall structure of the reflow soldering equipment. The placement platform 1 is equipped with a three-axis linear module 2 and a conveying component for driving the circuit board and chip to transfer. The three-axis linear module 2 is composed of an X-axis linear module, a Y-axis linear module and a Z-axis linear module. It is a commonly used existing technology and will not be described in detail. The conveying assembly includes two sets of conveyor belts 3, both of which are fixedly installed above the placement platform 1. The lifting assembly is located between the two conveyor belts 3. The conveyor belts 3 are existing belt-type conveyor belts with a high-temperature resistant silicone layer on their surface, which can effectively prevent the circuit board from sliding during the conveying process and can withstand the high temperature environment in the reflow oven without deformation. The two sets of conveyor belts 3 are arranged in parallel to ensure that the circuit board can be smoothly conveyed to the designated position. The above are all commonly used structures for reflow soldering equipment, and will not be described in detail. Those skilled in the art can set them according to actual needs.

[0034] It also includes a connector 4 fixedly installed on the movable end of the three-axis linear module 2. The bottom of the connector 4 is provided with a mounting base 7. Two card holders 13 are fixedly installed on the bottom of the mounting base 7. Correction grooves 14 are opened on the opposite sides of the two card holders 13. The groove size formed between the correction grooves 14 matches the edge contour of the chip. A pressing block 12 is fixedly installed on the bottom of the mounting base 7. The pressing block 12 is located between the two card holders 13. The bottom surface of the pressing block 12 is higher than the bottom surface of the card holders 13. When the pressing block 12 descends with the three-axis linear module 2, the card holders 13 first contact the chip. The correction grooves 14 are used to perform preliminary positioning and guidance of the chip edge to ensure that the chip is accurately positioned in the horizontal direction. The pressing block 12 can be made of polytetrafluoroethylene, which has good high temperature resistance and insulation. A scraping component is provided on the side of the mounting base 7 to clean excess solder paste from the pins after reflow soldering; a cleaning component is provided on the other side of the mounting base 7 to clean and collect the solder paste remaining on the scraping component; a storage component is provided on the conveyor belt 3 to place the circuit board and chip; and a lifting component is provided on the placement platform 1 to support the chip, located between the two conveyor belts 3. Based on the above, the simplified workflow is as follows: The conveyor belt 3 transports the storage component containing the chips and circuit boards to the top of the lifting component. The lifting component then lifts the circuit boards and chips to a set height, causing them to detach from the surface of the conveyor belt 3. Subsequently, the three-axis linear module 2 drives the connecting seat 4, the mounting seat 7 and the card holder 13 on it to move above the chip, and places the two card holders 13 on both sides of the chip respectively; Next, the three-axis linear module 2 drives the mounting base 7 and the card holder 13 to descend, so that the edge of the chip is embedded in the correction groove 14 of the card holder 13. Through the guiding and limiting function of the correction groove 14, the position of the chip is precisely corrected to ensure that the pins are accurately aligned with the pads on the circuit board. After the card holder 13 completes the initial correction of the chip, the mounting base 7 continues to press down, which will cause the pressing block 12 to squeeze the chip and fix the chip firmly above the storage component, ensuring that the chip will not be poorly soldered. After the correction is completed, the chip is soldered to the circuit board. After soldering, the excess solder paste on the chip pins is scraped off by the scraper assembly. After the scraping operation is completed, the component cleaning operation is performed to clean and collect the solder paste remaining on the scraped component for subsequent processing or recycling.

[0035] Through the coordinated operation of multiple components, the misalignment problem between chip pins and pads, as well as the problem of solder joints connecting pins after soldering, can be effectively solved. First, the correction slot 14 of the card holder 13 is precisely designed. Under the precise drive of the three-axis linear module 2, it can make fine adjustments to the chip in the horizontal and vertical directions, ensuring that the chip is in the ideal mounting position before soldering, which fundamentally reduces the risk of poor soldering, short circuit or open circuit caused by inaccurate initial positioning. Secondly, the scraping component immediately scrapes off excess solder paste from the pins after soldering, while the cleaning component promptly cleans off any residual solder paste on the scraping component. This ensures that the scraping component remains clean for the next operation, avoiding interference from residual solder paste on subsequent scraping operations. In addition, the collected solder paste can be reused after processing, which reduces production costs to some extent. In addition, the storage component provides a stable support platform for the circuit board and chip. Its positioning structure ensures that the circuit board does not shift during the conveying and lifting process. The lifting component, through smooth lifting and lowering movements, accurately lifts the circuit board and chip to be soldered to the working height for soldering and subsequent processing. It is seamlessly connected with the conveying action of the conveyor belt 3. The whole process is highly automated, which greatly improves the mounting accuracy and production efficiency, and ensures the soldering quality of the rail pressure sensor chip.

[0036] Among them, reference Figure 5 The scraping assembly includes a second linear actuator 11 that is horizontally fixedly mounted on the side of the mounting base 7. A first connecting frame 15 is fixedly mounted on one end of the movable shaft of the second linear actuator 11. A fixing frame 16 is welded to one end of the first connecting frame 15. A soldering iron tip 17 is fixedly mounted on one end of the fixing frame 16. The soldering iron tip 17 has a flat structure and its bottom surface is parallel to the plane where the chip pins are located.

[0037] The soldering iron tip 17 can be made of copper with excellent thermal conductivity, and its working surface is plated with a layer of high-temperature resistant nickel alloy, which not only ensures good heat conduction efficiency, but also improves the wear resistance and corrosion resistance of the surface. The temperature of the soldering iron tip 17 can be adjusted by a temperature control module matched with the soldering iron tip 17, usually set at a temperature slightly higher than the melting point of solder paste, such as 220-250 degrees Celsius. The specific structure is not described in detail. Those skilled in the art can select according to actual needs. The bottom of the soldering iron tip 17 has a relief groove 18 to avoid the pins. The shape and size of the relief groove 18 are specially designed according to the arrangement spacing and width of the chip pins. This ensures that the pins themselves will not be touched during the scraping process, preventing damage or displacement of the pins, thereby ensuring the safety and accuracy of the scraping operation. When it is necessary to scrape off excess solder paste from the chip pins, the three-axis linear module 2 will move the soldering tip 17 to the part of the pin closest to the inside. At this time, the second linear actuator 11 will be activated, and its movable axis will drive the first connecting frame 15, the fixed frame 16 and the soldering tip 17 to move horizontally away from the chip pins. During the movement, the relief groove 18 at the bottom of the soldering iron tip 17 will precisely avoid each pin of the chip, ensuring that the cutting edge of the soldering iron tip 17 can accurately act on the excess solder paste between and around the pins. Before operation, the soldering tip 17 is preheated to a suitable temperature (usually slightly above the melting point of the solder paste). When the preheated soldering tip 17 comes into contact with excess solder paste, it can quickly heat it to a molten state. At this time, the cutting edge of the soldering tip 17 can easily scrape the molten excess solder paste from the root of the pin by the smooth pushing force provided by the second linear actuator 11, avoiding the situation where the solder joints between the pins are connected because the solder paste is difficult to remove after cooling and solidification. By precisely controlling the scraping action, excess solder paste between and around the pins is effectively removed. The presence of the relief groove 18 allows the soldering tip 17 to move flexibly between dense pins. Even for chips with small pin spacing, solder paste can be cleaned without dead angles. The safety and efficiency of the scraping process are fully considered, ensuring the cleanliness of the chip pins and the stability of electrical performance after soldering.

[0038] Furthermore, refer to Figure 6 The cleaning component includes a first linear actuator 8 that is tilted and fixedly installed on the other side of the mounting base 7. A second connecting frame 20 is fixedly installed at one end of the movable shaft of the first linear actuator 8. A scraper 21 is welded to one end of the second connecting frame 20. A storage slot 22 is provided on the top of the scraper 21. After the scraping assembly completes the scraping of excess solder paste from the chip pins, the first linear actuator 8 is activated. Its movable shaft drives the second connecting bracket 20 and the scraper 21 to move closer to the soldering tip 17. Since the first linear actuator 8 is tilted, the top of the scraper 21 will move to the bottom of the soldering tip 17 (see reference). Figure 9 ); Then the second linear actuator 11 is activated, which drives the soldering iron tip 17 to continue moving towards the scraper 21. When the scraper 21 moves to contact the soldering iron tip 17, the first linear actuator 8 is activated, causing the movable shaft to move in the opposite direction, thereby driving the scraper 21 to perform scraping operation on the soldering iron tip 17. Then the second linear actuator 11 resets, driving the fixing frame 16 and soldering tip 17 to reset, so that the scraped solder paste is completely collected in the storage tank 22 for subsequent unified processing and recycling; then wait for the next cleaning instruction; By promptly cleaning the components, the soldering tip 17 is ensured to remain clean after each scraping operation, preventing residual solder paste from hardening and affecting subsequent scraping results, or from falling and contaminating equipment or products during movement.

[0039] As a further explanation of the above scheme, the width of the storage slot 22 is greater than the width of the soldering iron tip 17 (e.g., Figure 8 As shown, this ensures that when the scraper 21 scrapes the soldering tip 17, all the solder paste scraped off the soldering tip 17 falls into the storage tank 22, preventing solder paste leakage and waste or contamination.

[0040] The depth design of the storage tank 22 has also been considered to ensure that it can hold a certain amount of solder paste after multiple cleaning operations, reducing the need for frequent solder paste dumping and improving the continuity of work. Meanwhile, the inner wall of the storage tank 22 is treated with a smooth non-stick coating, such as a Teflon coating, which effectively prevents solder paste from remaining and sticking in the tank, making it easier to clean and recycle the collected solder paste, and further improving the efficiency and cleanliness of solder paste recycling.

[0041] The bottom of the soldering iron tip 17 has a conical surface 19 near the scraper 21, and the top of the scraper 21 has a slope 23 near the soldering iron tip 17. The top of the slope 23 is connected to the storage slot 22, and the conical surface 19 and the slope 23 have the same inclination angle (e.g., Figure 9 As shown), this ensures that the scraper 21 can completely scrape the solder paste on the conical surface 19, avoiding incomplete scraping due to angular deviation; During the cleaning of the soldering tip 17, when the scraper 21 moves toward the soldering tip 17 under the drive of the first linear actuator 8, and the soldering tip 17 moves toward the scraper 21 under the drive of the second linear actuator 11, the conical surface 19 at the bottom of the soldering tip 17 and the inclined surface 23 at the top of the scraper 21 can make precise contact, at which point the second linear actuator 11 stops operating. When the first linear actuator 8 drives the scraper 21 to move in the opposite direction to perform the scraping operation, the tight fit of the conical surface 19 of the inclined surface 23 allows the top of the scraper 21 to fit tightly against the bottom of the soldering iron tip 17, thereby completely scraping off the solder paste remaining on the working surface of the soldering iron tip 17. The design of the conical surface 19 also serves as a guide for the scraped solder paste, guiding it to slide down the conical surface 19 into the storage tank 22, further ensuring the thorough collection of solder paste and effectively preventing solder paste from scattering or remaining on the edge corners of the soldering iron tip 17 during the scraping process.

[0042] It should be noted that both the first linear actuator 8 and the second linear actuator 11 can be miniature linear actuators of model XLA-5. This model of linear actuator is small in size, has moderate driving force, and can meet the precise movement requirements of the scraper 21 and the soldering iron tip 17. Its stroke can be adjusted according to the actual cleaning and scraping distance, and it has good high temperature resistance, which can adapt to the working environment around the reflow soldering equipment. Those skilled in the art can choose according to actual needs.

[0043] Among them, reference Figures 10-11 The lifting assembly includes a cylinder 29 fixedly installed at the bottom of the placement platform 1. A top plate 26 is fixedly installed at the movable end of the cylinder 29. Guide rods 28 are fixedly installed at the four corners of the top plate 26. The guide rods 28 are slidably connected to the placement platform 1 to limit the rotation of the top plate 26. A baffle 24 is fixedly installed on the top of the conveyor belt 3 support. When it is necessary to lift the circuit board and chip, the conveyor belt 3 transports the storage components to the top plate 26. Then, the cylinder 29 is activated, and its movable end extends upward, driving the top plate 26 to rise smoothly along the axial direction of the guide rod 28, so that the storage components are clamped and fixed by the top plate 26 and the baffle 24. At this time, the chip can be soldered. After the chip position correction is completed and the soldering, solder paste removal and other operations are finished, the movable end of the cylinder 29 retracts, driving the top plate 26 to descend, and the stored components fall back onto the conveyor belt 3, which continues to transport them to the next process.

[0044] This design enables precise alignment between the lifting action and the conveying action of conveyor belt 3, resulting in a high degree of automation and stable and reliable operation. This provides a solid foundation for subsequent processes such as chip positioning, welding, and solder paste cleaning.

[0045] Among them, reference Figure 11 The storage module includes a placement rack 25 placed on two conveyor belts 3. The placement rack 25 passes through the gap between the baffle 24 and the conveyor belt 3. The top of the placement rack 25 is evenly provided with multiple placement slots 27 for positioning circuit boards. The inner wall of the placement slot 27 can be attached with an anti-static rubber pad to prevent the circuit board from being damaged by static electricity during placement and lifting. At the same time, it increases the friction between the circuit board and the inner wall of the placement slot 27 to prevent the circuit board from shaking or shifting during lifting or lowering.

[0046] The dimensions of the placement slot 27 are designed according to the specifications of common circuit boards, and its depth is slightly less than the thickness of the circuit board, so that after the circuit board is placed in the placement slot 27, its top surface can be higher than the top surface of the placement rack 25.

[0047] In addition, the placement rack 25 is equipped with positioning marks that are easy for the three-axis linear module 2 or other detection devices to identify. These positioning marks match the placement slot 27 and can help the equipment quickly locate the position of the internal circuit board, ensuring the accuracy of subsequent lifting and chip correction operations.

[0048] To enable scraping and cleaning operations from multiple directions, a servo motor 5 is fixedly installed on the top of the connecting base 4. The output shaft of the servo motor 5 is fixedly connected to a rotating shaft 6 via a coupling. The rotating shaft 6 is fixed to the top of the mounting base 7. When it is necessary to scrape solder paste off the pins on different sides of the chip or adjust the position of the cleaning component to adapt to different operational needs, the servo motor 5 starts, and its output shaft drives the rotating shaft 6 to rotate through the coupling, thereby driving the mounting base 7 and its bottom bracket 13, the scraping component and the cleaning component to rotate 360 ​​degrees around the axis of the rotating shaft 6, so as to realize flexible switching of the operation position.

[0049] For example, after the solder paste is scraped off one side of the chip pins, the servo motor 5 can drive the mounting base 7 to rotate 180 degrees, so that the scraping component is aligned with the other side of the chip pins. This eliminates the need for the three-axis linear module 2 to make large-scale position adjustments, which improves work efficiency and reduces positioning errors that may be caused by multiple movements.

[0050] The servo motor 5 has high-precision position control capabilities, ensuring that the mounting base 7 can accurately stop at the preset angle after rotation, guaranteeing the accurate working position of the scraping and cleaning components, and further improving the automation level and operational flexibility of the entire equipment.

[0051] To further enhance the melting rate of the solder paste, an air outlet 9 is also included, which is fixedly installed at the bottom of the mounting base 7. The air outlet 9 is connected to an external air inlet pipe. A heating wire 10 is fixedly installed inside the air outlet 9. The heating wire 10 can be a 0.5mm diameter nickel-chromium alloy heating wire. At the same time, the air outlet of the air outlet 9 is designed as a flat strip, and its width is adapted to the width of the soldering iron tip 17 to ensure that the hot air flow can evenly cover the entire scraping area and avoid the phenomenon of incomplete melting of local solder paste due to uneven heating. When the soldering iron tip 17 performs soldering operation on the solder paste at the chip pins, the external air source delivers gas to the air outlet 9 through the air inlet pipe. When the gas flows through the interior of the air outlet 9, it is quickly heated to the set temperature by the heating wire 10, forming a hot airflow. The heated airflow is directed from the air outlet of the air outlet 9 to the contact area between the soldering iron tip 17 and the chip pin. The heat is transferred to the solder paste through thermal convection, which can significantly accelerate the melting speed of the solder paste and make the solder paste reach the molten state in a shorter time, thereby shortening the soldering operation time and improving the overall work efficiency.

[0052] At the same time, the hot airflow can also quickly dry the surface of the pins after scraping to a certain extent, reducing the adverse effects that may occur during the cooling process of the solder paste and ensuring the stability of the electrical performance of the pins after soldering.

[0053] The present invention is used in the following steps: S1: The conveyor belt 3 transports the placement rack 25 containing chips and circuit boards to the top plate 26, at which point the conveyor belt 3 stops; S2: The starting cylinder 29 extends, causing the top plate 26 to rise smoothly along the axial direction of the guide rod 28 and come into contact with the placement frame 25, thereby clamping and fixing the placement frame 25 by the top plate 26 and the baffle 24. S3: The three-axis linear module 2 drives the connector 4, the mounting base 7 and the card holder 13 on it to move above the chip, and places the two card holders 13 on both sides of the chip respectively. Then the three-axis linear module 2 drives the mounting base 7 and the card holder 13 to descend, so that the edge of the chip is embedded in the correction groove 14 of the card holder 13, and the position of the chip is precisely corrected to ensure that the pins are accurately aligned with the pads on the circuit board. S4: The three-axis linear module 2 continues to drive the mounting base 7 and the card holder 13 to descend, so that the lower pressure block 12 and the top plate 26 cooperate to clamp the chip; S5: At this time, the external air source delivers gas to the air outlet 9 through the air inlet pipe. When the gas flows through the inside of the air outlet 9, it is quickly heated to the set temperature by the heating wire 10 to form a hot airflow. The heated hot airflow is blown directionally from the air outlet of the air outlet 9 to the contact area between the soldering iron tip 17 and the chip pin. The heat is transferred to the solder paste by thermal convection, which significantly accelerates the melting speed of the solder paste and works with the reflow oven to complete the soldering of the chip pin. S6: Subsequently, the servo motor 5 starts, driving the rotating shaft 6 to rotate, which in turn drives the mounting base 7 and its bottom bracket 13, scraping component and cleaning component to rotate 180 degrees around the axis of the rotating shaft 6, completing the switch of the working direction; S7: After the switching is completed, the second linear actuator 11 starts and controls the stability of the soldering tip 17. Its movable shaft drives the first connecting frame 15, the fixed frame 16 and the soldering tip 17 to move horizontally away from the chip pins. During the movement, the avoidance groove 18 at the bottom of the soldering tip 17 will accurately avoid each pin of the chip, and the cutting edge will scrape off the molten excess solder paste from the root of the pin. S8: Subsequently, the first linear actuator 8 is activated, and its movable shaft drives the second connecting frame 20 and the scraper 21 to move towards the soldering tip 17, so that the top of the scraper 21 is below the bottom of the soldering tip 17. S9: Start the second linear actuator 11. The second linear actuator 11 drives the soldering iron tip 17 to continue moving towards the scraper 21. When the scraper 21 moves to contact the soldering iron tip 17, the second linear actuator 11 stops. S10: At this time, the first linear actuator 8 is activated, causing the movable shaft to move in the opposite direction. The tight fit of the conical surface 19 of the inclined plane 23 allows the top of the scraper 21 to fit tightly against the bottom of the soldering iron tip 17, thereby completely scraping the solder paste remaining on the working surface of the soldering iron tip 17 into the storage tank 22. S11: The second linear actuator 11 resets, driving the fixing frame 16 and the soldering tip 17 to reset. Then the first linear actuator 8 resets, so that the bottom of the scraper 21 is above the bottom of the soldering tip 17, thus enabling the soldering operation. S12: By repeating S6-S11, welding and cleaning operations in multiple directions are completed. Then, the mounting base 7 is moved by the three-axis linear module 2 to mount and weld another chip on the placement rack 25. S13: When the soldering and solder paste cleaning of all chips on the placement rack 25 are completed, the movable end of the cylinder 29 retracts, driving the top plate 26 to descend. The placement rack 25 then falls back onto the conveyor belt 3. The conveyor belt 3 starts to transport the completed placement rack 25 to the next process, and at the same time transports the next placement rack 25 to be processed to the top plate 26. The steps S1 to S12 above are repeated to realize continuous production operation.

[0054] Finally, the following points should be noted: In the description of this application, it should be noted that, unless otherwise specified and limited, the terms "installation", "connection" and "linkage" should be interpreted broadly, and can be mechanical or electrical connection, or internal connection between two components, or direct connection. "Up", "down", "left", "right", etc. are only used to indicate relative positional relationship. When the absolute position of the described object changes, the relative positional relationship may change. The electronic components and modules used in this invention can all be commonly used parts on the market that can achieve the specific functions in this case, and the specific models and sizes can be selected and adjusted according to actual needs; The accompanying drawings of the embodiments disclosed in this invention only involve structures relevant to the embodiments disclosed in this invention. Other structures can be referred to with common designs. Unless otherwise specified, the same embodiment and different embodiments of this invention can be combined with each other.

Claims

1. A rail pressure sensor chip mounting device, characterized in that: include: A placement platform (1) is provided with a three-axis linear module (2) and a conveying assembly; The connecting seat (4) is fixedly installed on the movable end of the three-axis linear module (2). The bottom of the connecting seat (4) is provided with a mounting seat (7). Two card holders (13) are fixedly installed on the bottom of the mounting seat (7). The two card holders (13) have a correction groove (14) on their opposite sides. The scraper assembly, located on the side of the mounting base (7), is used to clean excess solder paste from the pins after reflow soldering. A cleaning component, located on the other side of the mounting base (7), is used to clean and collect solder paste left on the component; Storage components, located on the transport components, are used to hold circuit boards and chips; And a lifting component, which is set on the placement platform (1) and located inside the transport component, is used to support the chip.

2. The rail pressure sensor chip mounting equipment according to claim 1, characterized in that: The scraping assembly includes: The second linear actuator (11) is horizontally fixedly installed on the side of the mounting base (7). The first connecting frame (15) is fixedly installed at one end of the movable shaft of the second linear actuator (11). A fixing frame (16) is welded to one end of the first connecting frame (15). A soldering iron tip (17) is fixedly installed at one end of the fixing frame (16). The bottom of the soldering iron tip (17) has a relief groove (18) for avoiding the pins.

3. The rail pressure sensor chip mounting equipment according to claim 2, characterized in that: The cleaning component includes: The first linear actuator (8) is fixedly installed at an angle on the other side of the mounting base (7). A second connecting frame (20) is fixedly installed at one end of the movable shaft of the first linear actuator (8). A scraper (21) is welded to one end of the second connecting frame (20). The top of the scraper (21) is provided with a storage slot (22), and the width of the storage slot (22) is greater than the width of the soldering tip (17).

4. The rail pressure sensor chip mounting equipment according to claim 3, characterized in that: The bottom of the soldering iron tip (17) is provided with a conical surface (19) on the side near the scraper (21). The top of the scraper (21) is provided with a slope (23) on the side near the soldering iron tip (17), and the top of the slope (23) is connected to the storage slot (22); The conical surface (19) has the same inclination angle as the inclined surface (23).

5. The rail pressure sensor chip mounting equipment according to claim 1, characterized in that: The conveying assembly includes: Two sets of conveyor belts (3) are fixedly installed above the placement platform (1) to drive the storage components and circuit boards and chips to be transferred. The lifting component is located between the two conveyor belts (3).

6. The rail pressure sensor chip mounting equipment according to claim 5, characterized in that: The lifting assembly includes: The cylinder (29) is fixedly installed at the bottom of the placement platform (1), and the movable end of the cylinder (29) is fixedly installed with a top plate (26). Multiple guide rods (28) are located at the four corners of the top plate (26) and are slidably connected to the placement platform (1) to limit the rotation of the top plate (26); The baffle (24) is fixedly installed on the top of the support of the conveyor belt (3).

7. The rail pressure sensor chip mounting equipment according to claim 6, characterized in that: The storage module includes: A placement rack (25) is placed on two conveyor belts (3), and the placement rack (25) passes through the gap between the baffle (24) and the conveyor belts (3); Multiple placement slots (27) are evenly distributed on the top of the placement rack (25) for positioning circuit boards.

8. The rail pressure sensor chip mounting equipment according to claim 1, characterized in that: A rotating shaft (6) is fixedly installed on the top of the mounting base (7); A servo motor (5) is fixedly installed on the top of the connecting seat (4), and the output shaft of the servo motor (5) is connected and fixed to the rotating shaft (6) through a coupling.

9. The rail pressure sensor chip mounting equipment according to claim 1, characterized in that: Also includes: The air outlet (9) is fixedly installed at the bottom of the mounting base (7) and connected to the external air inlet pipe; Heating wire (10) is fixedly installed inside the air outlet (9) and is used to heat the air blown out from the air outlet (9).

10. The rail pressure sensor chip mounting equipment according to claim 1, characterized in that: The bottom of the mounting base (7) is fixedly installed with a pressure block (12), which is located between two card holders (13).

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