Surface mounting method and device based on internal elements of heterogeneous substrate

Abstract

The invention relates to a chip mounting method and device based on internal elements of a heterogeneous substrate, and the method comprises the following steps: conveying a three-dimensional heterogeneous substrate with a groove to a tin spraying station, recognizing a marking point of the substrate, positioning the position of a bonding pad in the groove of the substrate, and generating coordinate information; height data of the bottom of the groove of the substrate are detected, and the Z-axis height of the tin spraying nozzle is calculated and compensated according to preset height parameters; the pointed nozzle is controlled to move to the position above the groove bonding pad, and the solder paste is sprayed to the bonding pad according to preset parameters; mounting an electronic component on the tin-sprayed bonding pad in the groove; and reflow soldering is carried out on the substrate after surface mounting is completed, and surface mounting of the internal elements of the heterogeneous substrate is completed. According to the chip mounting method and device based on the internal elements of the heterogeneous substrate, the problem of non-uniform solder paste distribution caused by space interference in a traditional process is solved.

Description

Technical Field

[0001] This application relates to the field of optical patch technology, and in particular to a patching method and apparatus based on internal components of a heterogeneous substrate. Background Technology

[0002] Currently, the COB (Chip on Board) process is mainly used in the field of optical camera module packaging. This process encompasses SMT (Surface Mount Technology), DA (Adhesive Bonding), and WB (Wire Bonding). Traditional SMT involves applying solder paste to the pads of a planar circuit board using a stencil, followed by component mounting. The limitation of this process is that the substrate (such as a PCB or ceramic substrate) needs to be planar to accommodate the solder paste printing requirements. This results in a relatively large overall module size, making it difficult to adapt to compact product layouts and hindering the miniaturization of optical modules. To achieve a compact layout and reduce the size of optical modules, the planar substrate can be designed as a three-dimensional recessed structure, allowing components to be placed inside the substrate, thereby reducing the substrate's size on the plane.

[0003] However, substrates with groove structures cannot use traditional stencil printing methods to accurately tin the pads inside the grooves, which can easily lead to defects such as solder bridging, solder point misalignment, and cold solder joints. Furthermore, the limited space for component mounting restricts the miniaturization of modules.

[0004] Therefore, there is an urgent need in this field for a new technical solution to address the aforementioned technical problems. Summary of the Invention

[0005] The purpose of this application is to provide a method and apparatus for mounting components on a heterogeneous substrate, which solves the problem of uneven solder paste distribution caused by spatial interference in traditional processes.

[0006] In a first aspect, embodiments of this application provide a method for mounting components within a heterogeneous substrate, comprising the following steps: conveying a three-dimensional heterogeneous substrate with grooves to a solder spraying station; identifying substrate markers; locating the position of pads within the substrate grooves and generating coordinate information; detecting the height data of the bottom of the substrate grooves; calculating and compensating the Z-axis height of the solder spraying nozzle based on preset height parameters; controlling the pointed nozzle to move above the groove pads; spraying solder paste onto the pads according to preset parameters; mounting electronic components onto the solder-sprayed pads within the grooves; and reflow soldering the mounted substrate to complete the mounting of components within the heterogeneous substrate.

[0007] In one possible implementation, the step of conveying the three-dimensional heterogeneous substrate with grooves to the solder spraying station, identifying substrate marker points, locating the position of the pads within the substrate grooves, and generating coordinate information includes: identifying reference marker points on the substrate; determining the center position of the pads and storing the coordinates based on the reference marker points.

[0008] In one possible implementation, the height data of the bottom of the substrate groove is detected, and the Z-axis height of the solder spray nozzle is calculated and compensated according to the preset height parameters, including: obtaining the measured distance from itself to the bottom of the groove; calculating the actual height from the nozzle to the bottom of the groove by combining the fixed distance between the height measuring device and the nozzle; and comparing the actual height with the target solder spray height to complete automatic height compensation.

[0009] In one possible implementation, the control of the pointed nozzle to move above the grooved pad and spray solder paste onto the pad according to preset parameters includes: the pointed nozzle extending into the groove of the substrate to spray solder; wherein, during the solder spraying process, the nozzle and the sidewall of the groove remain in a non-interference state.

[0010] In one possible implementation, the controlled pointed nozzle moves above the grooved pad and sprays solder paste onto the pad according to preset parameters, including: applying solder paste onto the pad in a single-point spray manner; wherein each pad corresponds to only one solder point.

[0011] In one possible implementation, mounting the electronic component onto the solder pads that have been tinned within the groove includes: using the inner wall of the groove as a positioning reference, embedding the component inside the groove so that the bottom surface of the component contacts the solder dots on the solder pads.

[0012] In one possible implementation, the reflow soldering of the mounted substrate to complete the mounting of internal components of the heterogeneous substrate includes: melting solder paste and soldering it to pads and component leads according to a preset temperature rise profile.

[0013] In one possible implementation, after Z-axis height compensation is completed, the nozzle height position is locked, and then continuous soldering is performed on all the pads in the grooves on the same substrate.

[0014] Secondly, embodiments of this application provide a chip mounting apparatus based on internal components of a heterogeneous substrate, comprising: a substrate conveying unit for conveying a three-dimensional heterogeneous substrate to a solder spraying station and a chip mounting station; a vision positioning unit for identifying substrate marking points and locating the position of pads within a groove; a laser height measuring unit for detecting the height of the bottom of the substrate groove and outputting height data; a solder spraying execution unit, including a pointed nozzle and a solder spraying valve, for spraying solder paste onto the pads within the groove; a mounting unit for mounting electronic components onto the pads within the groove; and a control unit electrically connected to the substrate conveying unit, the vision positioning unit, the laser height measuring unit, the solder spraying execution unit, and the mounting unit, for coordinating the execution of the above-described methods by each unit.

[0015] In one possible implementation, the solder spraying unit further includes a Z-axis adjustment mechanism, which drives the pointed nozzle to complete automatic height compensation based on the detection data from the laser height measuring unit.

[0016] The chip mounting method and apparatus based on internal components of a heterogeneous substrate provided in this application successfully overcome the uneven solder paste distribution caused by spatial interference in traditional processes. By embedding components within the groove structure, not only is the overall volume of the substrate effectively reduced, but the spatial layout of the entire machine is further optimized, making the structure of the entire device more compact and rational. Simultaneously, by performing tinning operations on the pads within the three-dimensional groove structure, the soldering accuracy and reliability are significantly improved, thereby avoiding defects such as solder fly, solder bridging, and solder balls commonly found in traditional processes. The technical solution of this application not only improves production efficiency but also greatly enhances product yield and reliability, providing important reference value for the technological development in related fields. Attached Figure Description

[0017] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort. In addition, in the drawings, the same parts use the same reference numerals, and the drawings are not drawn to scale.

[0018] Figure 1 This application illustrates the flow chart of a method for mounting components on a heterogeneous substrate according to an embodiment of the present application. Figure 1 ; Figure 2 This application illustrates the flow chart of a method for mounting components on a heterogeneous substrate according to an embodiment of the present application. Figure 2 ; Figure 3This application illustrates the flow chart of a method for mounting components on a heterogeneous substrate according to an embodiment of the present application. Figure 3 ; Figure 4 This illustration shows the structure of a chip mounting device based on internal components of a heterogeneous substrate provided in an embodiment of this application. Figure 1 ; Figure 5 This illustration shows the structure of a chip mounting device based on internal components of a heterogeneous substrate provided in an embodiment of this application. Figure 2 ; Figure 6 This is a schematic diagram of the structure of a three-dimensional heterogeneous substrate provided in an embodiment of this application.

[0019] Explanation of reference numerals in the attached figures: 1. Visual positioning unit; 2. Laser height measurement unit; 3. Soldering actuator; 301. Pointed nozzle; 302. Soldering valve; 303. Z-axis adjustment mechanism; 100, three-dimensional heterogeneous substrate; 200, groove. Detailed Implementation

[0020] To make the objectives, technical solutions, and advantages of the embodiments of this application clearer, the technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0021] Substrates with groove structures cannot use traditional stencil printing methods to accurately tin the pads inside the grooves, which can easily lead to defects such as solder bridging, solder point misalignment, and cold solder joints. Furthermore, the limited space for component mounting restricts the miniaturization of modules.

[0022] The embodiments of this application aim to solve the above-mentioned technical problems, and therefore provide a method and apparatus for mounting components based on internal components of a heterogeneous substrate, which solves the problem of uneven solder paste distribution caused by spatial interference in traditional processes.

[0023] Specifically, such as Figure 1 As shown, this application provides a method for mounting components based on internal components of a heterogeneous substrate, including the following steps: S1: The three-dimensional heterogeneous substrate 100 with groove 200 is conveyed to the solder spraying station, the substrate marking points are identified, the position of the pads in the substrate groove 200 is located and coordinate information is generated. S2: Detect the height data of the bottom of the substrate groove 200, calculate and compensate the Z-axis height of the solder spray nozzle according to the preset height parameters; S3: Control the pointed nozzle 301 to move above the groove 200 pad and spray solder paste onto the pad according to the preset parameters; S4: Mount the electronic components onto the solder pads that have been sprayed with tin in the groove 200; S5: Reflow soldering is performed on the mounted substrate to complete the mounting of internal components of the heterogeneous substrate.

[0024] In a specific example, the method provided in this application embodiment operates as follows: First, the three-dimensional heterogeneous substrate 100 with the groove 200 design needs to be transferred to the solder plating station, which is the first step of the entire process. At this station, the system will accurately locate the specific position of the pads within the groove 200 of the substrate by identifying the marker points on the substrate, and generate corresponding coordinate information so that subsequent operations can be performed accurately.

[0025] Next, the height data of the bottom of the substrate groove 200 is detected. By acquiring the height data, the system can calculate and compensate for the Z-axis height of the solder paste nozzle based on preset height parameters. This adjustment is crucial to the embodiments of this application, because only by ensuring that the distance between the nozzle and the pad is appropriate can the quality and accuracy of subsequent solder paste application be guaranteed.

[0026] Continuing the above operations, the control system will drive the pointed nozzle 301 to move directly above the pad in the groove 200. At this point, the nozzle will spray an appropriate amount of solder paste onto the pad surface according to the preset parameters. This step not only requires accurate nozzle positioning but also careful control of the amount and uniformity of solder paste sprayed to ensure optimal soldering results.

[0027] Subsequently, the electronic components are mounted onto the solder pads that have already been tinned within the groove 200. This step requires strict precision in mounting, as even the slightest deviation can lead to soldering failure or malfunction of the components.

[0028] Finally, the mounted substrate is sent to a reflow soldering machine for soldering. Heating melts and re-solders the solder paste, achieving a strong connection between the electronic components and the pads. This process completes the component mounting process on the heterogeneous substrate. This mounting method, through multi-step, refined operations, effectively improves mounting efficiency and quality, providing reliable technical support for the manufacturing of complex electronic products.

[0029] In one possible implementation, such as Figure 2As shown, in step S1, the three-dimensional heterogeneous substrate 100 with grooves 200 is conveyed to the solder spraying station, the substrate marking points are identified, the positions of the pads within the substrate grooves 200 are located, and coordinate information is generated, including: S101: Reference mark point for identifying the substrate; S102: Determine the center position of the pad and store the coordinates based on the reference mark point.

[0030] In a specific example, the specific operation process of step S1 is as follows: First, the three-dimensional heterogeneous substrate 100 with the groove 200 structure is accurately delivered to the solder spraying station via a conveyor device. During this process, the stability and positional accuracy of the substrate must be ensured. Subsequently, the system automatically identifies the marker points on the substrate. These marker points, as key elements for positioning reference, help the equipment quickly lock the overall position and orientation of the substrate. Next, the specific positions of the pads inside the groove 200 of the substrate are further located, and corresponding precise coordinate information is generated to provide reliable data support for subsequent processing. This process specifically includes the following two steps: A visual recognition system scans and identifies reference markers on the substrate. These reference markers are typically located in specific areas of the substrate and have unique shapes or patterns, facilitating rapid capture and analysis by the system. After identification, the system establishes a preliminary coordinate system based on the positional information of these markers, laying the foundation for subsequent precise positioning.

[0031] After identifying the reference markers, the system calculates and determines the center position of the pads within the groove 200 based on the positional relationships of these markers. The system accurately obtains the coordinate values ​​of the pad centers and stores this coordinate information in the database for subsequent processes. This step helps ensure the accuracy of the solder plating process; only by accurately determining the position of the pads can the high-quality completion of the solder plating operation be guaranteed.

[0032] In one possible implementation, such as Figure 3 As shown, in step S2, the height data of the bottom of the substrate groove 200 is detected, and the Z-axis height of the solder spray nozzle is calculated and compensated according to the preset height parameters, including: S201: Obtain the measured distance from itself to the bottom of the groove 200; S202: Calculate the actual height from the nozzle to the bottom of the groove 200 by combining the fixed distance between the height measuring device and the nozzle; S203: Compare the actual height with the target soldering height to complete automatic height compensation.

[0033] In a specific example, in step S2, the height data of the bottom of the substrate groove 200 is detected, and the Z-axis height of the solder spray nozzle is calculated and compensated according to the preset height parameters. The actual operation steps are as follows: The measured distance from the nozzle itself to the bottom of the groove 200 is obtained using a height measuring device. The core of this step lies in accurately measuring the vertical distance from the reference point of the height measuring device to the bottom surface of the groove 200 using a high-precision height measuring device, thus providing basic data support for subsequent height calculations. Combined with the fixed distance between the height measuring device and the solder spraying nozzle, the actual height of the nozzle from the bottom of the groove 200 is calculated. Specifically, since there is a known and fixed vertical distance between the height measuring device and the nozzle, the specific height value of the nozzle relative to the bottom of the groove 200 can be obtained by mathematically calculating the measured distance obtained by the height measuring device with this fixed distance. The calculated actual height is compared and analyzed with the target solder spraying height, and automatic height compensation is performed based on the difference between the two. During this process, the system will determine whether the current nozzle height meets the requirements according to the preset target solder spraying height parameters. If there is a deviation, the Z-axis position of the nozzle is adjusted to achieve the ideal height, thereby ensuring the accuracy and consistency of the solder spraying process.

[0034] By implementing the above steps in detail, the automation level and precision of the tin plating operation can be effectively improved, while reducing errors caused by human intervention, thus ensuring high-quality production.

[0035] In one possible implementation, in step S3, the controlled pointed nozzle 301 moves above the pad of the groove 200 and sprays solder paste onto the pad according to preset parameters, including: The pointed nozzle 301 extends into the substrate groove 200 to perform solder spraying; during the solder spraying process, the nozzle and the side wall of the groove 200 remain in a non-interfering state.

[0036] In a specific example, regarding the operation in step S3, the process of controlling the pointed nozzle 301 to move above the pad of the groove 200 and accurately spraying solder paste onto the pad according to the preset parameters includes the following details: First, the pointed nozzle 301 needs to be accurately inserted into the groove 200 set on the substrate in order to perform the solder spraying operation; during this process, it is ensured that the nozzle and the side wall of the groove 200 always maintain a state of non-interference when performing the solder spraying operation. That is to say, the movement trajectory of the nozzle and its position adjustment will not come into contact or collide with the side wall of the groove 200, thereby ensuring that the entire solder spraying process can be completed smoothly and accurately.

[0037] Secondly, after the nozzle extends into the recess 200, the system initiates the soldering process based on preset parameters such as spray pressure, spray time, and solder paste flow rate. These parameters are pre-set according to the size and shape of the pads in the recess 200 and the characteristics of the solder paste to ensure that the solder paste can be evenly and appropriately covered on the pad surface. During spraying, the nozzle maintains a stable posture and position to avoid inaccurate solder paste spraying due to shaking or deviation. Simultaneously, the system monitors various data during the soldering process in real time, such as solder paste spray volume and nozzle temperature. If any abnormality is detected, soldering will be stopped immediately and an alarm will be issued so that operators can handle the situation promptly. Furthermore, to further improve the accuracy and quality of soldering, a rapid inspection of the solder paste on the pads is performed after soldering is completed. A visual recognition system determines whether the shape, size, and position of the solder paste meet the requirements. If deviations are found, the soldering parameters are fine-tuned to provide more accurate data support for the next soldering operation.

[0038] In one possible implementation, step S3 involves controlling the pointed nozzle 301 to move above the pads of the groove 200 and spraying solder paste onto the pads according to preset parameters, including: Solder paste is applied to the pads using a single-point spray method; each pad corresponds to only one solder point.

[0039] In a specific example, regarding the specific operation process in step S3, the pointed nozzle 301 is controlled to move along a predetermined path to a position directly above the pad of the groove 200. Then, according to the preset parameters, solder paste is precisely sprayed onto the surface of the pad. This process includes the following details: the solder paste is applied to the pad in the form of single-point spraying. That is, in actual operation, the solder paste is released into the target area in the form of an independent dot. In addition, it should be noted that each pad corresponds to only one solder dot, ensuring that the solder paste on each pad is evenly distributed and meets the process requirements, avoiding the occurrence of excess solder dots or insufficient solder, thereby ensuring that the soldering quality meets the expected standards.

[0040] During single-point spraying, parameters such as the spraying pressure, spraying time, and distance from the pad surface of the pointed nozzle 301 must all be executed according to preset values. The spraying pressure directly affects the speed and shape of the solder paste ejected from the nozzle. Insufficient pressure may prevent the solder paste from smoothly detaching from the nozzle to form a complete solder dot, while excessive pressure may cause solder paste to splatter or form irregular shapes on the pad. The spraying time determines the amount of solder paste sprayed in a single pass and must be precisely set according to the pad size and the required amount of solder paste to ensure that the volume of each solder dot meets the soldering requirements. The distance between the nozzle and the pad surface affects the trajectory of the falling solder paste and its spreading effect after landing. Too close a distance may cause the nozzle to contact the pad or already sprayed solder paste, while too far a distance may cause the solder paste to deviate from its target position due to air resistance and other factors during flight. Precise control of these parameters ensures that the single-point sprayed solder dots are not only accurately positioned but also maintain a high degree of consistency in their diameter, height, and roundness, laying a solid foundation for subsequent component placement and soldering processes.

[0041] In one possible implementation, step S4, mounting the electronic component onto the solder pads already coated with tin within the recess 200, includes: When mounting components, use the inner wall of the groove 200 as a positioning reference to embed the components into the groove 200 so that the bottom surface of the components contacts the solder points on the pads.

[0042] In a specific example, step S4, where electronic components are mounted onto pre-tinned pads within the recess 200, can be broken down as follows: During component mounting, the inner wall of the recess 200 serves as a positioning reference. Through alignment, the electronic components are gradually embedded into the internal area of ​​the recess 200. During this process, it is ensured that the bottom surface of the electronic component makes full contact with the pre-plated solder dots on the pads, thus providing a reliable electrical connection foundation for subsequent soldering processes. This mounting method not only relies on the precise positioning of the inner wall of the recess 200 but also requires ensuring that the fit between the component and the pad meets design requirements to avoid soldering quality problems caused by positional deviations.

[0043] In one possible implementation, step S5 involves reflow soldering the mounted substrate to complete the mounting of internal components on the heterogeneous substrate, including: Follow the preset heating curve to melt the solder paste and solder it to the pads and component leads.

[0044] In a specific example, step S5 includes the following: First, the heating operation must be strictly performed according to the pre-set temperature rise profile to ensure that the temperature change meets the process requirements. By precisely controlling the heating process, the solder paste gradually reaches its molten state, thereby achieving reliable soldering between the solder pads and component leads. The design of the temperature rise profile is particularly critical in this process, as it effectively avoids the problem of decreased soldering quality due to excessively rapid or slow temperature changes, ultimately ensuring the stability and reliability of the surface mount technology (SMT) process.

[0045] In one possible implementation, after Z-axis height compensation is completed, the nozzle height position is locked, and then continuous soldering is performed on all pads within the grooves 200 on the same substrate.

[0046] In a specific example, after the height compensation operation in the Z-axis direction is completely completed, the nozzle height position needs to be locked to ensure it remains constant during subsequent operations. Next, for all the pads inside the grooves 200 on the same substrate, continuous soldering operations are performed sequentially according to predetermined process requirements. This process effectively ensures the uniformity and consistency of solder coverage, thereby improving overall production quality.

[0047] In practice, the parameters for the solder spraying operation must be precisely matched according to the pad size, groove 200 depth, and solder paste characteristics. For example, for smaller pads, the solder spraying pressure should be appropriately reduced and the spraying time shortened to prevent solder paste from overflowing from the groove 200; while for deeper grooves 200, the relative angle between the nozzle and the pad needs to be adjusted to ensure that the solder paste can fully fill the bottom of the groove 200. Simultaneously, during continuous solder spraying, the system monitors the solder output and solder paste temperature in real time. When an abnormality is detected (such as a solder output fluctuation exceeding ±5% or a solder paste temperature deviating from the set value by more than 2℃), a pause mechanism will be immediately triggered and an alarm will be issued. Solder spraying can only continue after the operator has investigated and resolved the issue, thus ensuring that the solder spraying quality of each groove 200 pad meets the process standards.

[0048] This application also provides a patch device based on internal components of a heterogeneous substrate, such as... Figure 4 and Figure 5 Combination Figure 6As shown, the system includes: a substrate transport unit for transporting the three-dimensional heterogeneous substrate 100 to the solder spraying station and the chip mounting station; a vision positioning unit 1 for identifying substrate markings and locating the position of pads within the recess 200; a laser height measurement unit 2 for detecting the bottom height of the substrate recess 200 and outputting height data; a solder spraying execution unit 3, including a pointed nozzle 301 and a solder spraying valve 302, for spraying solder paste onto the pads within the recess 200; a mounting unit for mounting electronic components onto the pads within the recess 200; and a control unit electrically connected to the substrate transport unit, vision positioning unit 1, laser height measurement unit 2, solder spraying execution unit 3, and mounting unit, for coordinating the execution of the above methods by each unit.

[0049] In one possible implementation, the solder spraying execution unit 3 further includes a Z-axis adjustment mechanism 303, which drives the pointed nozzle 301 to complete automatic height compensation based on the detection data of the laser height measuring unit 2.

[0050] Specifically, the substrate conveying unit efficiently and stably transports the three-dimensional heterogeneous substrate 100 to the solder spraying station and the chip mounting station, ensuring the continuity of the entire production process; the vision positioning unit 1 has high-precision image recognition capabilities, accurately identifying the marking points on the substrate and further precisely locating the specific position of the pads within the groove 200, providing reliable basic data support for subsequent operations; the laser height measurement unit 2 uses laser measurement technology to detect the height information of the bottom of the substrate groove 200 and outputs this height data in real time for subsequent processing by other units; the solder spraying execution unit 3 includes a pointed nozzle 301. The two core components, the solder spray valve 302, are mainly used to accurately spray an appropriate amount of solder paste onto the pads in the groove 200, thereby laying a good soldering foundation for the placement of electronic components. The placement unit is responsible for placing the electronic components onto the pads in the groove 200, ensuring the accuracy and stability of the placement position. Finally, there is the control unit, which acts as the "brain" of the entire device. It is electrically connected to the substrate transfer unit, vision positioning unit 1, laser height measurement unit 2, solder spray execution unit 3, and placement unit. Its main function is to coordinate the operation between the various units to ensure that they can perform their respective tasks in an orderly manner according to the above methods.

[0051] Furthermore, the solder spraying execution unit 3 is equipped with a Z-axis adjustment mechanism 303. This mechanism is highly intelligent and can automatically and dynamically adjust the height of the pointed nozzle 301 based on the height data detected by the laser height measuring unit 2, thereby completing the automatic height compensation operation. This design not only significantly improves the accuracy of the solder spraying process but also effectively avoids the problem of uneven solder spraying caused by the height difference of the substrate groove 200, further enhancing the adaptability and reliability of the device.

[0052] In the specific embodiments described in this application, the substrate is a three-dimensional recessed substrate 200 with a special structure. A groove is cut into the middle of this substrate, and the cut-out portion contains pads required for component placement. In the actual operation process, solder paste is precisely sprayed onto the pads inside the recessed area 200 using a solder spray valve 302, followed by component placement. Because the components are embedded within the recessed area 200, this unique design significantly reduces the overall size of the product.

[0053] The height of the solder joint is subject to strict control, with a standard of 80±20µm. The position of the solder joint is also precisely defined; it must be located at the center of the pad, and the offset between the center of the solder joint and the center of the pad must be controlled within ±15µm. Simultaneously, the volume change of the solder joint must be strictly controlled within V±50%. For example, for the 01005 model, its volume is 2,400,000 μm³ ±50%; while for the 0201 model, its volume is 4,950,000 μm³ ±50%. The volume of a single solder joint is determined by three factors: opening time, pressure, and nozzle orifice diameter, which follow a specific formula: V = K·P·t, where K represents the rheological coefficient of the medium.

[0054] Due to the unique layout of the solder pads within the recess 200, this embodiment employs a pointed nozzle. The pointed nozzle 301 effectively reduces the volume of the nozzle tip. DOE (Design of Experiments) verification revealed that optimal results were achieved when the nozzle inner diameter was 0.1 ± 0.01 mm, the solder spray height was within the range of 0.2 mm to 0.45 mm, and the liquid supply pressure of the spray valve was maintained at 6 to 7.5 bar. This effectively avoids unnecessary interference between the nozzle and the substrate sidewall.

[0055] In addition, the nozzle inner diameter is 0.05±0.15mm, which fits well with the depth of the 200mm groove. Precise dispensing is achieved by dynamically adjusting the solder spray height. Specifically, the solder spray height ranges from 0.2mm to 0.45mm, the liquid supply pressure of the spray valve is 6 to 7.5 bar, the opening time of the solder spray valve 302 is 1.9 to 2.2ms, and the closing time is 9 to 11ms. The nozzle temperature needs to be controlled within the range of 30 to 50℃.

[0056] The chip mounting method and apparatus based on internal components of a heterogeneous substrate provided in this application successfully overcome the uneven solder paste distribution caused by spatial interference in traditional processes. By embedding components within the groove structure, not only is the overall volume of the substrate effectively reduced, but the spatial layout of the entire machine is further optimized, making the structure of the entire device more compact and rational. Simultaneously, by performing tinning operations on the pads within the three-dimensional groove structure, the soldering accuracy and reliability are significantly improved, thereby avoiding defects such as solder fly, solder bridging, and solder balls commonly found in traditional processes. The technical solution of this application not only improves production efficiency but also greatly enhances product yield and reliability, providing important reference value for the technological development in related fields.

[0057] It should be noted that the terms "one embodiment," "embodiment," "exemplary embodiment," "some embodiments," etc., mentioned in the specification indicate that the described embodiment may include a specific feature, structure, or characteristic, but not every embodiment necessarily includes that specific feature, structure, or characteristic. Furthermore, such phrases do not necessarily refer to the same embodiment. Moreover, when a specific feature, structure, or characteristic is described in connection with an embodiment, implementing such a feature, structure, or characteristic in conjunction with other embodiments, whether explicitly described or not, is within the knowledge scope of those skilled in the art.

[0058] It should be readily understood that “on,” “above,” and “on top of” in this disclosure should be interpreted in the broadest manner, such that “on” means not only “directly on something” but also “on something” with an intermediate feature or layer therebetween, and that “above” or “on top of” means not only “on something” but also “on something” without an intermediate feature or layer therebetween (i.e., directly on something).

[0059] Furthermore, for ease of explanation, spatially relative terms such as "below," "below," "under," "above," and "above" may be used to describe the relationship of one element or feature relative to other elements or features as shown in the figures. Spatially relative terms are intended to encompass different orientations of the device in use or operation other than those shown in the figures. The device may have other orientations (rotated 90 degrees or in other orientations), and the spatially relative descriptive terms used herein may be interpreted accordingly.

[0060] It should be noted that the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes said element.

[0061] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of this application, and are not intended to limit them. Although this application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some or all of the technical features therein. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of this application.

Claims

1. A method for mounting components within a heterogeneous substrate, characterized in that, Includes the following steps: The three-dimensional heterogeneous substrate with grooves is conveyed to the solder spraying station, the substrate marking points are identified, the position of the pads in the substrate grooves is located and coordinate information is generated. The height data of the bottom of the substrate groove is detected, and the Z-axis height of the solder spray nozzle is calculated and compensated according to the preset height parameters; Control the pointed nozzle to move above the grooved pad and spray solder paste onto the pad according to the preset parameters; The electronic components are mounted onto the solder pads that have been sprayed with tin inside the groove; Reflow soldering is performed on the mounted substrate to complete the mounting of internal components on the heterogeneous substrate.

2. The method according to claim 1, characterized in that, The process of conveying a three-dimensional heterogeneous substrate with grooves to the solder plating station, identifying substrate markers, locating the position of the pads within the substrate grooves, and generating coordinate information includes: Identify the reference markings on the substrate; Based on the reference marker points, determine the center position of the pads and store the coordinates.

3. The method according to claim 1, characterized in that, The height data of the bottom of the detection substrate groove is used to calculate and compensate for the Z-axis height of the solder spray nozzle based on preset height parameters, including: Obtain the measured distance from itself to the bottom of the groove; Calculate the actual height from the nozzle to the bottom of the groove by combining the fixed distance between the height measuring device and the nozzle; The actual height is compared with the target soldering height to achieve automatic height compensation.

4. The method according to claim 1, characterized in that, The control of the pointed nozzle to move above the grooved pad and spray solder paste onto the pad according to preset parameters includes: A pointed nozzle is inserted into the groove of the substrate to perform solder plating; During the tin plating process, the nozzle and the sidewall of the groove remain in a state of non-interference.

5. The method according to claim 1, characterized in that, The control of the pointed nozzle to move above the grooved pad and spray solder paste onto the pad according to preset parameters includes: Solder paste is applied to the pads using a single-point spray method; Each pad corresponds to only one solder point.

6. The method according to claim 1, characterized in that, The process of mounting electronic components onto solder pads that have been soldered into grooves includes: When mounting components, use the inner wall of the groove as a positioning reference to embed the component into the groove so that the bottom surface of the component contacts the solder point on the pad.

7. The method according to claim 1, characterized in that, The reflow soldering of the mounted substrate to complete the mounting of internal components of the heterogeneous substrate includes: Follow the preset heating curve to melt the solder paste and solder it to the pads and component leads.

8. The method according to claim 3, characterized in that, After Z-axis height compensation is completed, the nozzle height position is locked, and then continuous soldering is performed on all the pads in the grooves on the same substrate.

9. A surface mount device based on internal components of a heterogeneous substrate, characterized in that, include: The substrate transfer unit is used to transport three-dimensional heterogeneous substrates to the solder plating station and the chip mounting station; A visual positioning unit is used to identify substrate markings and locate the position of pads within the groove; A laser height measurement unit is used to detect the height of the bottom of the substrate groove and output the height data; The solder spraying unit includes a pointed nozzle and a solder spraying valve for spraying solder paste onto the pads in the groove; The mounting unit is used to mount electronic components onto the pads in the groove; The control unit is electrically connected to the substrate transfer unit, the visual positioning unit, the laser height measurement unit, the solder spraying execution unit, and the mounting unit, respectively, and is used to coordinate each unit to perform the method described in any one of claims 1-8.

10. The apparatus according to claim 9, characterized in that, The solder spraying execution unit also includes a Z-axis adjustment mechanism, which drives the pointed nozzle to complete automatic height compensation based on the detection data of the laser height measuring unit.

Images