Component suction control device and control method thereof, and electronic device

By using a component pick-up control device, and through the synergistic effect of data storage, scanner, and leveler, the problem of pick-up failure and falling caused by uneven component tops is solved, thereby improving production efficiency and quality.

CN122269679APending Publication Date: 2026-06-23INSPUR SUZHOU INTELLIGENT TECH CO LTD
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
INSPUR SUZHOU INTELLIGENT TECH CO LTD
Filing Date
2026-05-27
Publication Date
2026-06-23

AI Technical Summary

Technical Problem

During surface mount technology (SMT) processes, unevenness on the top of components can cause air leakage from the nozzle, preventing proper suction or causing components to fall off after being sucked up. This increases the risk of board scrap and affects production yield and costs.

Method used

The component manufacturing process is identified by a data storage device, the flatness is detected by a scanner, the suction force is calculated by a processor, and the top is leveled by a leveler, thus realizing a component pick-up control device to ensure stable pick-up by the nozzle.

Benefits of technology

This addresses the issue of component pick-up failures and component drops caused by uneven component tops at the source, reducing circuit board rework and scrap, and improving production efficiency and quality.

✦ Generated by Eureka AI based on patent content.

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Abstract

The application discloses a component suction control device and a control method thereof and electronic equipment, and relates to the technical field of circuit boards.The component suction control device comprises a data storage unit, a processor and a scanner.The data storage unit is configured to send top dimension data of components belonging to a surface mount process to the processor.The processor is configured to synchronize the top dimension data to the scanner, calculate effective suction force of a suction nozzle according to a flatness detection result of the scanner and relevant parameters of the suction nozzle, determine suction risk of the component based on the effective suction force of the suction nozzle, and control a chip mounter and a planarizer to perform corresponding actions.The scanner is configured to detect flatness of the top of the component according to a preset scanning rule, and feed back the flatness detection result to the processor.The planarizer is configured to select a corresponding specification of a planarizing patch according to a repair instruction of the processor, and attach the planarizing patch to an uneven area of the top of the component.Thus, problems such as inability to suction, falling after suction and the like caused by unevenness of the top of the component can be solved from the source, and the production efficiency of the board and the product quality are significantly improved.
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