Laser apparatus and method of manufacturing electronic device

Abstract

To provide a laser device in which a bypass device is detachably constituted.SOLUTION: A bypass device 60 is attachable to and detachable from a laser apparatus that outputs a pulsed laser beam, is provided in a laser apparatus 2A, and forms a bypass optical path that bypasses a pulse width extension device 50 that extends a pulse width of an incident pulsed laser beam. The plurality of optical elements include the first high-reflection mirror 61 that reflects pulsed laser light incident on the pulse width extension device toward the outside of the pulse width extension device and guides the pulsed laser light to the bypass optical path, and the second high-reflection mirror 64 that reflects pulsed laser light reflected by the first high-reflection mirror and incident via the bypass optical path and returns the pulsed laser light to the emission optical path of the pulse width extension device.SELECTED DRAWING: Figure 2

Description

[Technical Field]

[0001] The present disclosure relates to a bypass device, a laser device, and a method for manufacturing an electronic device. [Background technology]

[0002] In recent years, semiconductor exposure equipment has been required to improve its resolution in response to the miniaturization and high integration of semiconductor integrated circuits. To this end, the wavelength of light emitted from exposure light sources has been shortened. For example, gas laser devices used for exposure include KrF excimer laser devices that output laser light with a wavelength of approximately 248 nm and ArF excimer laser devices that output laser light with a wavelength of approximately 193 nm.

[0003] The spectral linewidth of the spontaneously oscillating light from KrF excimer laser devices and ArF excimer laser devices is as wide as 350 to 400 pm. Therefore, if a projection lens is constructed using a material that transmits ultraviolet light, such as KrF and ArF laser light, chromatic aberration may occur. As a result, resolution may decrease. Therefore, it is necessary to narrow the spectral linewidth of the laser light output from the gas laser device to a level where chromatic aberration is negligible. Therefore, a line narrowing module (LNM) containing a line narrowing element (e.g., an etalon or grating) may be installed inside the laser resonator of the gas laser device to narrow the spectral linewidth. Hereinafter, a gas laser device with a narrowed spectral linewidth is referred to as a line narrowing gas laser device. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] Japanese Patent Application Laid-Open No. 2005-148550 [Patent Document 2] Summary of JP-A-8-015618

[0005] A bypass device according to one aspect of the present disclosure is detachably attached to a laser device that outputs pulsed laser light, is provided within the laser device, and forms a bypass optical path that bypasses a pulse width stretcher that stretches the pulse width of incident pulsed laser light. The bypass device includes a plurality of optical elements that form the bypass optical path and a housing that houses the plurality of optical elements. The plurality of optical elements include a first high-reflection mirror that reflects the pulsed laser light incident on the pulse width stretcher toward the outside of the pulse width stretcher and guides it to the bypass optical path, and a second high-reflection mirror that reflects the pulsed laser light reflected by the first high-reflection mirror and incident via the bypass optical path, and returns it to an output optical path of the pulse width stretcher.

[0006] A laser device according to one aspect of the present disclosure includes a laser oscillator that outputs pulsed laser light and a pulse stretcher that stretches the pulse width of the incident pulsed laser light, and has a detachably attached bypass device that forms a bypass optical path that bypasses the pulse stretcher device, the bypass device including a plurality of optical elements that form the bypass optical path and a housing that houses the plurality of optical elements, and the plurality of optical elements include a first high-reflection mirror that reflects the pulsed laser light incident on the pulse stretcher device out of the pulse stretcher device and guides it to the bypass optical path, and a second high-reflection mirror that reflects the pulsed laser light reflected by the first high-reflection mirror and incident via the bypass optical path and returns it to an output optical path of the pulse stretcher.

[0007] A method for manufacturing an electronic device according to one aspect of the present disclosure includes: outputting the pulsed laser beam output from the laser apparatus, which includes a laser oscillator that outputs pulsed laser beam and a pulse width stretcher that stretches the pulse width of the incident pulsed laser beam, to an exposure apparatus to which a bypass device that forms a bypass optical path that bypasses the pulse width stretcher is detachably attached; and exposing a photosensitive substrate in the exposure apparatus to the pulsed laser beam to manufacture an electronic device, wherein the bypass device includes a plurality of optical elements that form the bypass optical path and a housing that houses the plurality of optical elements, and the plurality of optical elements include a first high-reflection mirror that reflects the pulsed laser beam incident on the pulse width stretcher toward outside the pulse width stretcher, thereby guiding the pulsed laser beam to the bypass optical path, and a second high-reflection mirror that reflects the pulsed laser beam that is reflected by the first high-reflection mirror and incident via the bypass optical path, thereby returning the pulsed laser beam to an output optical path of the pulse width stretcher. [Brief explanation of the drawings]

[0008] Some embodiments of the present disclosure will now be described, by way of example only, with reference to the accompanying drawings, in which: [Figure 1] FIG. 1 is a front view schematically showing the configuration of a laser device according to a comparative example. [Figure 2] FIG. 2 is a front view schematically showing an example of the configuration of the laser device according to the first embodiment. [Figure 3] FIG. 3 is a front view showing a state in which a bypass device is attached to the laser device according to the first embodiment. [Figure 4] FIG. 4 is a top view schematically showing the configuration of the laser device according to the second embodiment. [Figure 5] FIG. 5 is a front view schematically showing the configuration of the laser device according to the second embodiment. [Figure 6] FIG. 6 is a top view showing a state in which a bypass device is attached to the laser device according to the second embodiment. [Figure 7] FIG. 7 is a front view showing a state in which a bypass device is attached to the laser device according to the second embodiment. [Figure 8] FIG. 8 is a perspective view showing a state in which the bypass device is removed from the laser device according to the second embodiment. [Figure 9] FIG. 9 is a perspective view showing a state in which a bypass device is attached to the laser device according to the second embodiment. [Figure 10] FIG. 10 is a top view schematically showing the configuration of a laser device according to the third embodiment. [Figure 11] FIG. 11 is a front view schematically showing the configuration of a laser device according to the third embodiment. [Figure 12] FIG. 12 is a top view showing a state in which a bypass device is attached to the laser device according to the third embodiment. [Figure 13] FIG. 13 is a front view showing a state in which a bypass device is attached to a laser device according to the third embodiment. [Figure 14] FIG. 14 is a perspective view showing a state in which the bypass device is removed from the laser device according to the third embodiment. [Figure 15] FIG. 15 is a perspective view showing a state in which a bypass device is attached to the laser device according to the third embodiment. [Figure 16] FIG. 16 is a diagram schematically showing a configuration of a bypass device according to a first modified example of the first embodiment. [Figure 17] FIG. 17 is a diagram schematically showing a configuration of a bypass device according to a second modification of the first embodiment. [Figure 18] FIG. 18 is a diagram schematically showing an example of the configuration of an exposure apparatus. Embodiment

[0009] <Contents> 1. Comparative Example 1.1 Configuration 1.2 Operation 1.3 Challenges 2. First embodiment 2.1 Configuration 2.2 Operation 2.3 Effects 3. Second embodiment 3.1 Configuration 3.2 Operation 3.3 Effects 4. Third embodiment 4.1 Configuration 4.2 Operation 4.3 Effects 5. Modifications of the bypass device 5.1 First Modification 5.2 Second variant 5.3 Other Variations 6. Manufacturing method of electronic devices

[0010] Hereinafter, embodiments of the present disclosure will be described in detail with reference to the drawings. The embodiments described below show some examples of the present disclosure and do not limit the content of the present disclosure. Furthermore, not all of the configurations and operations described in each embodiment are necessarily essential as the configurations and operations of the present disclosure. Note that the same components are given the same reference symbols, and redundant explanations will be omitted.

[0011] 1. Comparative Example 1.1 Configuration 1 shows a schematic configuration example of a laser device 2 according to a comparative example. The comparative example of the present disclosure is a configuration that the applicant recognizes as being known only by the applicant, and is not a publicly known example that the applicant acknowledges.

[0012] In FIG. 1, the height direction of the laser device 2 is defined as the V-axis direction, the length direction as the Z-axis direction, and the depth direction as the H-axis direction. The V-axis direction may be parallel to the direction of gravity, and the direction opposite to the direction of gravity is defined as the "+V-axis direction." The emission direction of the pulsed laser light emitted from the laser device 2 is defined as the "+Z-axis direction." The direction toward the front of the paper surface of FIG. 1 is defined as the "+H-axis direction."

[0013] The laser device 2 includes a master oscillator (MO) 10, an MO beam steering unit 20, a power oscillator (PO) 30, a PO beam steering unit 40, and an optical pulse stretcher (OPS) 50.

[0014] The master oscillator 10 includes a line narrowing module (LNM) 11 , a chamber 14 , and an output coupling mirror (OC) 17 .

[0015] The LNM 11 includes a prism beam expander 12 for narrowing the spectral linewidth, and a grating 13. The prism beam expander 12 and the grating 13 are arranged in a Littrow configuration so that the angle of incidence and the angle of diffraction match.

[0016] The output coupling mirror 17 is a reflecting mirror with a reflectance in the range of 40% to 60%. The output coupling mirror 17 and the LNM 11 are arranged to form an optical resonator.

[0017] The chamber 14 is disposed on the optical path of the optical resonator. The chamber 14 includes a pair of discharge electrodes 15a, 15b and two windows 16a, 16b through which the pulsed laser light passes. The chamber 14 contains an excimer laser gas therein. The excimer laser gas may include, for example, Ar gas or Kr gas as a rare gas, F gas as a halogen gas, and Ne gas as a buffer gas.

[0018] The MO beam steering unit 20 includes a high-reflection mirror 21a and a high-reflection mirror 21b. The high-reflection mirror 21a and the high-reflection mirror 21b are arranged so that the pulsed laser light output from the master oscillator 10 is incident on the power oscillator 30. The high-reflection mirror in this disclosure is a flat mirror in which a high-reflection film is formed on the surface of a substrate made of, for example, synthetic quartz or calcium fluoride (CaF2). The high-reflection film is a dielectric multilayer film, for example, a film containing a fluoride.

[0019] The power oscillator 30 includes a rear mirror 31, a chamber 32, and an output coupling mirror 35. The rear mirror 31 and the output coupling mirror 35 are arranged to form an optical resonator.

[0020] The chamber 32 is disposed on the optical path of the optical resonator. The chamber 32 may have a configuration similar to that of the chamber 14 of the master oscillator 10. That is, the chamber 32 includes a pair of discharge electrodes 33a, 33b and two windows 34a, 34b through which the pulsed laser light passes. The chamber 32 contains an excimer laser gas therein.

[0021] The rear mirror 31 is a reflective mirror with a reflectance in the range of 50% to 90%. The output coupling mirror 35 is a reflective mirror with a reflectance in the range of 10% to 30%.

[0022] The PO beam steering unit 40 includes a high-reflection mirror 40a and a high-reflection mirror 40b. The high-reflection mirror 40a and the high-reflection mirror 40b are arranged so that the pulsed laser light output from the power oscillator 30 enters the OPS 50.

[0023] The OPS 50 includes a beam splitter 52 and four concave mirrors 54a to 54d. The beam splitter 52 is disposed on the optical path of the pulsed laser light output from the PO beam steering unit 40. The beam splitter 52 is a reflective mirror that transmits a portion of the incident pulsed laser light and reflects the remaining pulsed laser light. The reflectance of the beam splitter 52 is preferably within a range of 40% to 70%, and more preferably approximately 60%. The beam splitter 52 outputs the pulsed laser light that has passed through the beam splitter 52 from the laser device 2.

[0024] The four concave mirrors 54a to 54d constitute a delay optical path 56 for the pulsed laser light reflected by the first surface of the beam splitter 52. The pulsed laser light reflected by the first surface of the beam splitter 52 is reflected by the four concave mirrors 54a to 54d, and is again positioned so that the beam is imaged by the beam splitter 52.

[0025] The four concave mirrors 54a to 54d may all have approximately the same focal length. The focal length f of each of the concave mirrors 54a to 54d may correspond to the distance from the beam splitter 52 to the concave mirror 54a, for example.

[0026] The concave mirrors 54a and 54b are arranged so that the pulsed laser light reflected by the first surface of the beam splitter 52 is reflected by the concave mirror 54a and incident on the concave mirror 54b. The concave mirrors 54a and 54b are arranged so that the pulsed laser light reflected by the first surface of the beam splitter 52 forms an image on the first surface of the beam splitter 52 as a first image at an equal magnification (1:1).

[0027] Concave mirrors 54c and 54d are arranged so that the pulsed laser light reflected by concave mirror 54b is reflected by concave mirror 54c and incident on concave mirror 54d. Furthermore, concave mirror 54d is arranged so that the pulsed laser light reflected by concave mirror 54d is incident on a second surface of beam splitter 52, opposite the first surface. Concave mirrors 54c and 54d are arranged so that the first image is formed as a second image on the second surface of beam splitter 52 at a 1:1 ratio.

[0028] The OPS 50 may include a beam splitter and two or more highly reflective mirrors.

[0029] 1.2 Operation When a discharge occurs in chamber 14 of master oscillator 10, the laser gas is excited, and pulsed laser light, which has been narrowed in bandwidth by an optical resonator formed by output coupling mirror 17 and LNM 11, is output from output coupling mirror 17. This pulsed laser light is made incident on rear mirror 31 of power oscillator 30 as seed light by MO beam steering unit 20.

[0030] A discharge occurs in chamber 32 in synchronization with the incidence of the seed light that has passed through rear mirror 31. As a result, the laser gas is excited, and the seed light is amplified by a Fabry-Perot optical resonator formed by output coupling mirror 35 and rear mirror 31, and the amplified pulsed laser light is output from output coupling mirror 35. The pulsed laser light output from output coupling mirror 35 passes through PO beam steering unit 40 and enters OPS 50.

[0031] A portion of the pulsed laser light incident on the OPS 50 passes through the beam splitter 52 and is output, and a portion of the pulsed laser light is reflected by the beam splitter 52. The pulsed laser light reflected by the beam splitter 52 travels around a delay optical path 56 formed by the first to fourth concave mirrors 54a to 54d and again enters the beam splitter 52. Then, a portion of the pulsed laser light incident on the beam splitter 52 is reflected and output from the OPS 50. The pulsed laser light transmitted through the beam splitter 52 travels around the delay optical path 56 again.

[0032] In this way, the pulsed laser light repeatedly circulates through the delay optical path 56, and as a result, pulsed laser light of 0 circumnavigation light, 1 circumnavigation light, 2 circumnavigation light, 3 circumnavigation light, etc. is output from the OPS 50. The optical intensity of the pulsed laser light output from the OPS 50 decreases as the number of circumnavigations through the delay optical path 56 increases.

[0033] The pulsed laser beams from the first revolution onwards are delayed relative to the pulsed laser beam of the zeroth revolution by an integer multiple of the delay time determined by the optical path length of the delay optical path 56, and then combined and output. That is, the pulse waveforms of the pulsed laser beams from the first revolution onwards are sequentially superimposed on the pulse waveform of the pulsed laser beam of the zeroth revolution, each delayed by the delay time. In this way, the pulse width of the pulsed laser beam is extended by the OPS 50.

[0034] By extending the pulse width of the pulsed laser light using the OPS50, the coherence is reduced, which in turn suppresses the occurrence of speckle. Speckle is a bright and dark spot that occurs due to interference when laser light is scattered in a random medium.

[0035] 1.3 Challenges The laser device 2 according to the comparative example may have abnormalities in laser performance due to malfunctions or the like. Examples of abnormalities in laser performance include a decrease in the power of pulsed laser light and a decrease in beam characteristics of pulsed laser light. The decrease in beam characteristics is, for example, an increase in beam divergence.

[0036] If an abnormality occurs in the laser performance, it may be possible to remove the OPS 50 and check the laser performance again to identify the cause. This is to determine whether the cause lies in the laser oscillator (master oscillator 10 or power oscillator 30) or in the OPS 50. For example, if the power of the pulsed laser light decreases, the cause may be a decrease in the output of the laser oscillator or a decrease in the light transmittance of the OPS 50. If the laser performance does not improve even after removing the OPS 50, it can be determined that the cause lies in the laser oscillator. Conversely, if the laser performance improves when the OPS 50 is removed, it can be determined that the cause lies in the OPS 50.

[0037] However, the process of removing OPS 50 from laser device 2 and then reinstalling it to laser device 2 can take, for example, half a day or more, during which time the factory's production line may have to be stopped. Furthermore, when reinstalling OPS 50 that has been removed from laser device 2, the optical axis that was adjusted before removal may not be restored. In this case, the optical axis must be adjusted again, which can take even more time.

[0038] Thus, when an abnormality occurs in the laser performance, it is required to be able to identify the cause in a short time.

[0039] 2. First embodiment 2.1 Configuration Fig. 2 schematically illustrates an example configuration of a laser device 2A according to a first embodiment of the present disclosure. Differences between the configuration of the laser device 2A shown in Fig. 2 and the laser device 2 according to the comparative example shown in Fig. 1 will be described. The laser device 2A according to the first embodiment differs from the configuration of the laser device 2 according to the comparative example in that the bypass device 60 is configured to be detachable.

[0040] Laser apparatus 2A includes a master oscillator 10, an MO beam steering unit 20, a power oscillator 30, a PO beam steering unit 40, and an OPS 50. These elements may be similar to the configuration of laser apparatus 2 shown in FIG. 1. Master oscillator 10, or the combination of master oscillator 10 and power oscillator 30, is an example of a "laser oscillator" in the present disclosure. OPS 50 is an example of a "pulse width stretcher" in the present disclosure. PO beam steering unit 40 is an example of a "beam steering device" in the present disclosure.

[0041] The bypass device 60 forms a bypass optical path that bypasses the delay optical path 56 included in the OPS 50. The bypass device 60 includes four high-reflection mirrors 61 to 64. The high-reflection mirrors 61 to 64 are an example of the "plurality of optical elements" in the present disclosure. The high-reflection mirror 61 is an example of the "first high-reflection mirror" in the present disclosure. The high-reflection mirror 64 is an example of the "second high-reflection mirror" in the present disclosure.

[0042] The high-reflection mirrors 61 to 64 are housed in a housing 65 and are held at predetermined positions within the housing 65. The high-reflection mirrors 61 to 64 form a bypass optical path that bypasses the OPS 50.

[0043] The laser device 2A has space secured on the light input side and light output side of the OPS 50 so that a portion of the bypass device 60 can be inserted. The housing 65 of the bypass device 60 is configured to be detachable from the laser device 2A. In FIG. 2, the position where the bypass device 60 is attached to the laser device 2A is indicated by a dashed line. When the housing 65 is attached to the laser device 2A, it is positioned and fixed relative to the OPS 50. In FIG. 2, the solid line indicates the state where the bypass device 60 is removed from the laser device 2A.

[0044] 3 shows a state in which the bypass device 60 is attached to the laser apparatus 2A. When the bypass device 60 is attached to the laser apparatus 2A, the high-reflection mirror 61 is arranged so as to reflect the pulsed laser light emitted from the PO beam steering unit 40 and make it incident on the high-reflection mirror 62. For example, the high-reflection mirror 61 is arranged at an angle of 45° with respect to the incident optical axis of the OPS 50, and so as to reflect the pulsed laser light traveling along the incident optical axis at a reflection angle of 45°.

[0045] High-reflection mirror 62 and high-reflection mirror 63 are arranged to guide the pulsed laser light reflected by high-reflection mirror 61 to high-reflection mirror 64. For example, high-reflection mirror 62 is arranged to reflect the pulsed laser light incident from high-reflection mirror 61 at a reflection angle of 45° to make it incident on high-reflection mirror 63. High-reflection mirror 63 is arranged to reflect the pulsed laser light incident from high-reflection mirror 62 at a reflection angle of 45° to make it incident on high-reflection mirror 64.

[0046] High-reflection mirror 64 is disposed at an angle of 45° with respect to the output optical axis of OPS 50, and is disposed so as to reflect the pulsed laser beam incident from high-reflection mirror 63 at a reflection angle of 45° and return the pulsed laser beam to the output optical path of OPS 50. In other words, high-reflection mirror 64 is disposed so as to output the pulsed laser beam that has traveled through the bypass optical path onto the optical path of the pulsed laser beam output from OPS 50 when bypass device 60 is not attached to laser device 2A.

[0047] That is, the high-reflection mirrors 61 to 64 are arranged so that the angle between the incident light and the reflected light is 90°.

[0048] A light entrance window (not shown) is formed in the housing 65 of the bypass device 60, through which the pulsed laser light emitted from the PO beam steering unit 40 is incident on the high-reflection mirror 61. In addition, a light exit window (not shown) is formed in the housing 65, through which the pulsed laser light reflected by the high-reflection mirror 64 is emitted out of the housing 65.

[0049] The high-reflection mirrors 61 to 64 may be arranged so that the angle between the incident light and the reflected light is an angle other than 90°. The high-reflection mirror 61 serving as the first high-reflection mirror may be arranged so as to reflect the pulsed laser light incident on the OPS 50 out of the OPS 50, thereby guiding the pulsed laser light to the bypass optical path. The high-reflection mirror 64 serving as the second high-reflection mirror may be arranged so as to reflect the pulsed laser light reflected by the high-reflection mirror 61 and incident via the bypass optical path, thereby returning the pulsed laser light to the output optical path of the OPS 50.

[0050] 2.2 Operation When the bypass device 60 is not attached to the laser device 2A, the pulsed laser light emitted from the power oscillator 30 enters the OPS 50 via the PO beam steering unit 40. The pulsed laser light incident on the OPS 50 has its pulse width expanded by the delay optical path 56, and is then emitted from the laser device 2A.

[0051] The bypass device 60 is attached to the laser device 2A, for example, during investigation work to identify the cause when an abnormality occurs in the laser performance of the pulsed laser beam emitted from the laser device 2A. When the bypass device 60 is attached to the laser device 2A, the pulsed laser beam emitted from the PO beam steering unit 40 and traveling along the incident optical axis of the OPS 50 enters the bypass device 60, travels through the bypass optical path without passing through the OPS 50, and is then output along the output optical axis of the OPS 50.

[0052] 2.3 Effects According to the laser apparatus 2A and bypass device 60 of the first embodiment, by attaching the bypass device 60 to the laser apparatus 2A, it becomes possible to output pulsed laser light by bypassing the OPS 50 without removing the OPS 50 from the laser apparatus 2A. Therefore, if an abnormality occurs in the laser performance of the laser apparatus 2A, the cause can be easily identified and investigated by attaching and removing the bypass device 60.

[0053] The installation of the bypass device 60 does not change the mirror angle of the OPS 50 and other components placed in the optical path, and the optical path returns to its original state when the bypass device 60 is removed, eliminating the need for optical axis adjustment. This reduces the overall work time required to identify the cause.

[0054] Because the bypass device 60 can be easily attached and detached to the laser device 2A, the pulse width of the pulsed laser beam can be switched by attaching and detaching the bypass device 60. Furthermore, since the output of the pulsed laser beam decreases when it passes through the OPS 50, when the bypass device 60 is attached to the laser device 2A, the pulse width of the pulsed laser beam becomes shorter while the output increases. Therefore, by attaching and detaching the bypass device 60, it becomes possible to select whether to prioritize the pulse width or the output of the pulsed laser beam, thereby enhancing the practical performance of the laser device 2A.

[0055] 3. Second embodiment Next, a laser device 2B according to a second embodiment of the present disclosure will be described, focusing on differences in configuration from the laser device 2 according to the comparative example.

[0056] 3.1 Configuration FIG. 4 is a top view schematically illustrating the configuration of a laser device 2B according to the second embodiment. FIG. 5 is a front view schematically illustrating the configuration of the laser device 2B. Note that the "front" of the laser device 2B refers to the outer peripheral surface of the laser device 2B on the side where an exterior cover panel (not shown) opens wide for maintenance of the laser device 2B. When the exterior cover panel of the laser device 2B is opened, the side on which the internal arrangement structure of the device as shown in FIG. 5 can be seen is the "front."

[0057] The laser device 2B includes a master oscillator 10, an MO beam steering unit 20, a power oscillator 30, and an OPS 50. These elements may have the same configuration as the laser device 2 shown in FIG.

[0058] The laser device 2B is equipped with a long optical pulse stretcher 100 (hereinafter referred to as "L-OPS100") for generating a long-distance optical path difference that stretches the pulse width. The L-OPS 100 is disposed on the rear surface of the laser device 2B. The "rear surface" is the rear side when viewed from the front surface of the laser device 2B, and is the surface opposite the front surface. The L-OPS 100 is an example of a "pulse width stretcher" in this disclosure.

[0059] Laser device 2B includes PO beam steering unit 42 instead of PO beam steering unit 40 shown in Fig. 1. PO beam steering unit 42 includes high-reflection mirror 44a, high-reflection mirror 44b, and high-reflection mirror 44c for transmitting and receiving light to and from L-OPS 100.

[0060] High-reflection mirror 44a is arranged to reflect the pulsed laser light output from power oscillator 30 and make it incident on high-reflection mirror 44b. High-reflection mirror 44b is arranged to reflect the pulsed laser light reflected by high-reflection mirror 44a and make it incident on L-OPS 100. High-reflection mirror 44c is arranged to reflect the pulsed laser light output from L-OPS 100 and make it incident on OPS 50.

[0061] The L-OPS 100 is composed of multiple concave mirrors, multiple high-reflection mirrors, and multiple beam splitters. FIG. 4 shows only the multiple concave mirrors 102 and one beam splitter 104 among the components of the L-OPS 100. The beam splitter 104 is disposed at a position where the pulsed laser light reflected by the high-reflection mirror 44b of the PO beam steering unit 42 is incident. The L-OPS 100 includes a delay optical path 106 formed by the above components. In other words, the laser apparatus 2B according to the second embodiment includes two pulse width expanders: the OPS 50 and the L-OPS 100. Each of the OPS 50 and the L-OPS 100 may include a beam splitter and two or more high-reflection mirrors.

[0062] The laser device 2B is configured such that the bypass device 70 is detachable. The bypass device 70 includes two high-reflection mirrors 72 and 74. The high-reflection mirrors 72 and 74 are an example of the "plurality of optical elements" in the present disclosure. The high-reflection mirror 72 is an example of the "first high-reflection mirror" in the present disclosure. The high-reflection mirror 74 is an example of the "second high-reflection mirror" in the present disclosure.

[0063] The high-reflection mirrors 72 and 74 are housed in a housing 76 and held at predetermined positions within the housing 76. The high-reflection mirrors 72 and 74 form a bypass optical path that bypasses the L-OPS 100.

[0064] In the laser apparatus 2B, a space is provided between the L-OPS 100 and the PO beam steering unit 42 so that the bypass device 70 can be inserted. The housing 76 of the bypass device 70 is configured to be detachable from the laser apparatus 2B. In FIGS. 4 and 5, the position where the bypass device 70 is attached to the laser apparatus 2B is indicated by a dashed line. When attached to the laser apparatus 2B, the housing 76 is positioned and fixed relative to the PO beam steering unit 42. In FIGS. 4 and 5, the solid lines indicate the state where the bypass device 70 is detached from the laser apparatus 2B.

[0065] 6 and 7 show the state in which the bypass device 70 is attached to the laser apparatus 2B. When the bypass device 70 is attached to the laser apparatus 2B, the high-reflection mirror 72 is arranged so as to reflect the pulsed laser light emitted from the PO beam steering unit 42 and make it incident on the high-reflection mirror 74. For example, the high-reflection mirror 72 is arranged at an angle of 45° with respect to the incident optical axis of the L-OPS 100, and so as to reflect the pulsed laser light traveling along the incident optical axis at a reflection angle of 45°.

[0066] The high-reflection mirror 74 is arranged to reflect the pulsed laser beam incident from the high-reflection mirror 72 and make it incident on the high-reflection mirror 44c of the PO beam steering unit 42. For example, the high-reflection mirror 74 is arranged to form an angle of 45° with respect to the output optical axis of the L-OPS 100, and to reflect the pulsed laser beam incident from the high-reflection mirror 72 at a reflection angle of 45° and return it to the output optical path of the L-OPS 100. In other words, the high-reflection mirror 74 is arranged to output the pulsed laser beam that has traveled through the bypass optical path onto the optical path of the pulsed laser beam output from the L-OPS 100 when the bypass device 70 is not attached to the laser device 2B.

[0067] That is, the high-reflection mirrors 72 and 74 are arranged so that the angle between the incident light and the reflected light is 90°.

[0068] 8 and 9 are perspective views schematically showing the configuration of the bypass device 70. Fig. 8 shows a state in which the bypass device 70 is removed from the laser device 2B. Fig. 9 shows a state in which the bypass device 70 is attached to the laser device 2B.

[0069] A housing 76 of the bypass device 70 is formed with a light entrance window 78A for allowing the pulsed laser beam emitted from the PO beam steering unit 42 to enter the high-reflection mirror 72. In addition, the housing 76 is formed with a light exit window 78B for allowing the pulsed laser beam reflected by the high-reflection mirror 74 to exit the housing 76.

[0070] The high-reflection mirrors 72 and 74 may be arranged so that the angle between the incident light and the reflected light is an angle other than 90°. The high-reflection mirror 72, which serves as the first high-reflection mirror, may be arranged so as to reflect the pulsed laser light incident on the L-OPS 100 out of the L-OPS 100, thereby guiding the pulsed laser light to the bypass optical path. The high-reflection mirror 74, which serves as the second high-reflection mirror, may be arranged so as to reflect the pulsed laser light that is reflected by the high-reflection mirror 72 and incident via the bypass optical path, thereby returning the pulsed laser light to the output optical path of the L-OPS 100.

[0071] 3.2 Operation When the bypass device 70 is not attached to the laser device 2B, the direction of the pulsed laser beam emitted from the power oscillator 30 is changed by the high-reflection mirrors 44a and 44b of the PO beam steering unit 42. The pulsed laser beam whose direction has been changed by the high-reflection mirrors 44a and 44b enters the L-OPS 100 on the back surface of the laser device 2B.

[0072] The pulsed laser light incident on the L-OPS 100 has its pulse width expanded by the delay optical path 106 and then returns to the PO beam steering unit 42. The direction of the pulsed laser light that has returned to the PO beam steering unit 42 is changed by the high-reflection mirror 44c and the pulsed laser light then enters the OPS 50. The pulse width of the pulsed laser light that has entered the OPS 50 is further expanded by the OPS 50 and the pulsed laser light is then emitted from the laser device 2B.

[0073] The bypass device 70 is attached to the laser device 2B, for example, when an abnormality occurs in the laser performance of the pulsed laser beam emitted from the laser device 2B and an investigation is performed to identify the cause. When the bypass device 70 is attached to the laser device 2B, the pulsed laser beam emitted from the high-reflection mirror 44b of the PO beam steering unit 42 and traveling along the incident optical axis of the L-OPS 100 enters the bypass device 70. The pulsed laser beam that enters the bypass device 70 travels through the bypass optical path without passing through the L-OPS 100 and is then output along the output optical axis of the L-OPS 100. The pulsed laser beam output from the bypass device 70 returns to the PO beam steering unit 42. The pulsed laser beam that returned to the PO beam steering unit 42 has its traveling direction changed by the high-reflection mirror 44c and enters the OPS 50. The pulse width of the pulsed laser beam that entered the OPS 50 is expanded by the OPS 50 and then emitted from the laser device 2B.

[0074] 3.3 Effects According to the laser apparatus 2B and bypass device 70 of the second embodiment, by attaching the bypass device 70 to the laser apparatus 2B, it becomes possible to output pulsed laser light by bypassing the L-OPS 100 without removing the L-OPS 100 from the laser apparatus 2B. Therefore, if an abnormality occurs in the laser performance of the laser apparatus 2B, the cause can be easily identified and investigated by attaching and removing the bypass device 70.

[0075] The installation of the bypass device 70 does not change the mirror angle of the L-OPS 100 and other components placed in the optical path, and the optical path returns to its original state when the bypass device 70 is removed, eliminating the need for optical axis adjustment. This allows the overall work time required to identify the cause to be shortened.

[0076] As in the first embodiment, the bypass device 70 can be easily attached and detached to the laser device 2B, so that it is possible to select whether to prioritize the pulse width or the output of the pulsed laser light by attaching and detaching the bypass device 70, thereby enhancing the practical performance of the laser device 2B.

[0077] 4. Third embodiment Next, a laser device 2C according to a third embodiment of the present disclosure will be described, focusing on differences in configuration from the laser device 2B according to the second embodiment.

[0078] 4.1 Configuration FIG. 10 is a top view schematically showing the configuration of a laser device 2C according to the third embodiment. FIG. 11 is a front view schematically showing the configuration of the laser device 2C. The laser device 2C is configured such that a bypass device 80 is detachable instead of the bypass device 70 of the second embodiment. The bypass device 80 is detachable from the front of the laser device 2C, i.e., the maintenance surface side. The other configurations of the laser device 2C are similar to the configuration of the laser device 2B according to the second embodiment.

[0079] The bypass device 80 includes five high-reflection mirrors 81 to 85. The high-reflection mirrors 81 to 85 are an example of the "plurality of optical elements" in the present disclosure. The high-reflection mirror 81 is an example of the "first high-reflection mirror" in the present disclosure. The high-reflection mirror 85 is an example of the "second high-reflection mirror" in the present disclosure.

[0080] The high-reflection mirrors 81 to 85 are housed in a housing 86 and are held at predetermined positions within the housing 86. The high-reflection mirrors 81 to 85 form a bypass optical path that bypasses the L-OPS 100.

[0081] In the laser apparatus 2C, a space is provided in the PO beam steering unit 42 that allows a portion of the bypass device 80 to be inserted. The housing 86 of the bypass device 80 is configured to be detachable from the laser apparatus 2C. In FIGS. 10 and 11, the position where the bypass device 80 is attached to the laser apparatus 2C is indicated by a dashed line. When attached to the laser apparatus 2C, the housing 86 is positioned and fixed relative to the PO beam steering unit 42. In FIGS. 10 and 11, the solid lines indicate the state where the bypass device 80 is detached from the laser apparatus 2C.

[0082] 12 and 13 show a state in which the bypass device 80 is attached to the laser device 2C. When the bypass device 80 is attached to the laser device 2C, the high-reflection mirrors 81 to 84 are arranged at positions where the pulsed laser light reflected by the high-reflection mirror 44a of the PO beam steering unit 42 is sequentially incident.

[0083] High-reflection mirror 85 is arranged to reflect the pulsed laser beam incident from high-reflection mirror 84 and make it incident on OPS 50. In other words, high-reflection mirror 85 is arranged to output the pulsed laser beam along the output optical axis of PO beam steering unit 42.

[0084] 14 and 15 are perspective views schematically showing the configuration of the bypass device 80. Fig. 14 shows a state in which the bypass device 80 is removed from the laser device 2C. Fig. 15 shows a state in which the bypass device 80 is attached to the laser device 2C.

[0085] A housing 86 of the bypass device 80 is formed with a light entrance window 87A through which the pulsed laser beam reflected by the high-reflection mirror 44a of the PO beam steering unit 42 is incident on the high-reflection mirror 81. In addition, the housing 86 is formed with a light exit window 87B through which the pulsed laser beam reflected by the high-reflection mirror 85 is emitted out of the housing 86.

[0086] As shown in FIG. 15, high-reflection mirror 81 is arranged to reflect the pulsed laser beam reflected by high-reflection mirror 44a of PO beam steering unit 42 and traveling in the -V-axis direction, and cause it to travel in the +H-axis direction. High-reflection mirror 82 is arranged to reflect the pulsed laser beam traveling in the +H-axis direction, and cause it to travel in the +Z-axis direction. High-reflection mirror 83 is arranged to reflect the pulsed laser beam traveling in the +Z-axis direction, and cause it to travel in the -V-axis direction. High-reflection mirror 84 is arranged to reflect the pulsed laser beam traveling in the -V-axis direction, and cause it to travel in the -H-axis direction. High-reflection mirror 85 is arranged to reflect the pulsed laser beam traveling in the -H-axis direction, and cause it to travel in the +Z-axis direction. That is, high-reflection mirrors 81 to 85 are arranged so that the angle between the incident light and the reflected light is 90°.

[0087] The high-reflection mirrors 81 to 85 may be arranged so that the angle between the incident light and the reflected light is an angle other than 90°. The high-reflection mirror 81, which serves as the first high-reflection mirror, may be arranged to reflect the pulsed laser light incident on the L-OPS 100 out of the L-OPS 100, thereby guiding the pulsed laser light to the bypass optical path. The high-reflection mirror 85, which serves as the second high-reflection mirror, may be arranged so that the pulsed laser light is reflected by the high-reflection mirror 81 and incident via the bypass optical path, thereby returning the pulsed laser light to the output optical path of the L-OPS 100. The output optical path of the L-OPS 100 refers to the optical path of the pulsed laser light output from the L-OPS 100 until it enters the OPS 50.

[0088] 4.2 Operation The operation of the laser apparatus 2C when the bypass device 80 is not installed is the same as the operation of the laser apparatus 2B according to the second embodiment. The direction of the pulsed laser beam emitted from the power oscillator 30 is changed by the PO beam steering unit 42 and then incident on the L-OPS 100 on the rear surface of the laser apparatus 2C. The pulsed laser beam incident on the L-OPS 100 has its pulse width extended by the L-OPS 100, returns to the PO beam steering unit 42, and then its direction of travel is changed by the PO beam steering unit 42 and incident on the OPS 50. The pulse width of the pulsed laser beam incident on the OPS 50 is further extended by the OPS 50 and then emitted from the laser apparatus 2C.

[0089] The bypass device 80 is attached to the laser device 2C, for example, when an abnormality occurs in the laser performance of the pulsed laser beam emitted from the laser device 2C and an investigation is performed to identify the cause. When the bypass device 80 is attached to the laser device 2C, the pulsed laser beam emitted from the power oscillator 30 has its traveling direction changed by the high-reflection mirror 44a of the PO beam steering unit 42 and then enters the bypass device 80. The pulsed laser beam that entered the bypass device 80 travels through the bypass optical path without passing through the L-OPS 100 and is then output along the emission optical axis of the PO beam steering unit 42. The pulsed laser beam output from the bypass device 80 enters the OPS 50, where its pulse width is expanded and then output from the laser device 2C.

[0090] 4.3 Effects According to the laser apparatus 2C and bypass device 80 of the third embodiment, by attaching the bypass device 80 to the laser apparatus 2C, it becomes possible to output pulsed laser light by bypassing the L-OPS 100 without removing the L-OPS 100 from the laser apparatus 2C. In particular, the bypass device 80 of the third embodiment can be attached and detached from the front side of the laser apparatus 2C, i.e., the maintenance side, making the attachment work easy.

[0091] In addition, the laser device 2C and the bypass device 80 according to the third embodiment have the same effects as the laser device 2B and the bypass device 70 according to the second embodiment.

[0092] 5. Modifications of the bypass device Next, a modified example of the bypass device will be described. The bypass device according to the modified example allows adjustment of the optical axis of the bypass optical path.

[0093] 5.1 First Modification 16 schematically shows the configuration of a bypass device 60A according to a first modified example of the first embodiment. Similar to the bypass device 60 according to the first embodiment, the bypass device 60A includes four high-reflection mirrors 61 to 64 for forming a bypass optical path.

[0094] Of the high-reflection mirrors 61 to 64, the high-reflection mirror 62 is held by a first actuator-equipped holder 90A, and the high-reflection mirror 63 is held by a second actuator-equipped holder 90B. The first and second actuator-equipped holders 90A and 90B are housed in a housing 65 together with the high-reflection mirrors 61 to 64. The first and second actuator-equipped holders 90A and 90B are an example of an "optical axis adjustment mechanism" in the present disclosure. The high-reflection mirror 62 is an example of a "first optical element" in the present disclosure. The high-reflection mirror 63 is an example of a "second optical element" in the present disclosure.

[0095] The first and second actuator-equipped holders 90A and 90B each include, for example, a holder, a PZT (lead zirconate titanate) actuator, and an automatic micrometer.

[0096] The first actuator-equipped holder 90A holds the high-reflection mirror 62 and changes the attitude angle of the high-reflection mirror 62 about two orthogonal axes. For example, the first actuator-equipped holder 90A rotates the high-reflection mirror 62 about the H-axis and about an axis that is parallel to the surface of the high-reflection mirror 62 and orthogonal to the H-axis.

[0097] Similarly, the second actuator-equipped holder 90B holds the high-reflection mirror 63 and changes the attitude angle of the high-reflection mirror 63 about two orthogonal axes. For example, the second actuator-equipped holder 90B rotates the high-reflection mirror 63 about the H-axis and about an axis that is parallel to the surface of the high-reflection mirror 63 and orthogonal to the H-axis. The first and second actuator-equipped holders 90A and 90B are controlled by a controller (not shown).

[0098] The optical axis of the bypass optical path can be adjusted by changing the attitude angles of the high-reflection mirrors 62 and 63 about two axes. Specifically, the traveling direction and position of the pulsed laser beam traveling through the bypass optical path can be adjusted.

[0099] When the bypass device 60A is attached to the laser device 2A according to the first embodiment, there is a possibility that the output optical axis of the OPS 50 may be misaligned with the output optical axis of the bypass device 60A. Even if such a misalignment occurs, the output optical axis of the bypass device 60A can be aligned with the output optical axis of the OPS 50 by controlling the first and second actuator-equipped holders 90A and 90B.

[0100] It should be noted that the present invention is not limited to the example shown in FIG. 16, and any two of the high-reflection mirrors 61 to 64 may be held by the first and second actuator-equipped holders 90A and 90B.

[0101] 5.2 Second variant 17 schematically illustrates the configuration of a bypass device 60B according to a second modification of the first embodiment. The bypass device 60B includes four highly reflective mirrors 61-64 and a light-transmitting parallel-plate substrate 66. The parallel-plate substrate 66 is made of, for example, synthetic quartz or calcium fluoride (CaF2). The highly reflective mirrors 61-64 and the parallel-plate substrate 66 are examples of the "plurality of optical elements" in this disclosure.

[0102] Of the high-reflection mirrors 61 to 64, the high-reflection mirror 62 is held by a first actuator-equipped holder 90C. The first actuator-equipped holder 90C has the same configuration as the first actuator-equipped holder 90A described in the first modified example, and holds the high-reflection mirror 62 and changes the attitude angle of the high-reflection mirror 62 about two orthogonal axes. The first and second actuator-equipped holders 90C and 90D are housed in a housing 65 together with the high-reflection mirrors 61 to 64 and the parallel plate substrate 66. The first and second actuator-equipped holders 90C and 90D are an example of an "optical axis adjustment mechanism" in the present disclosure. The high-reflection mirror 62 is an example of a "first optical element" in the present disclosure.

[0103] The parallel plate substrate 66 is disposed at an angle on the optical path along which the pulsed laser light reflected by the high-reflection mirror 62 travels toward the high-reflection mirror 63. The parallel plate substrate 66 transmits the pulsed laser light incident from the high-reflection mirror 62 and causes it to be incident on the high-reflection mirror 63. The parallel plate substrate 66 is an example of a "second optical element" in the present disclosure.

[0104] The parallel plate substrate 66 is held by a second actuator-equipped holder 90D. The second actuator-equipped holder 90D has a configuration similar to the first actuator-equipped holder 90A described in the first modified example, and holds the parallel plate substrate 66 and changes the attitude angle of the parallel plate substrate 66 about two orthogonal axes. For example, the second actuator-equipped holder 90D rotates the parallel plate substrate 66 around the H axis and around an axis parallel to the surface of the parallel plate substrate 66 and orthogonal to the H axis. The first and second actuator-equipped holders 90C and 90D are controlled by a controller (not shown).

[0105] The optical axis of the bypass optical path can be adjusted by changing the attitude angles of the high-reflection mirror 62 and the parallel plate substrate 66 about two axes. Specifically, by changing the attitude angle of the high-reflection mirror 62, the traveling direction of the pulsed laser light traveling through the bypass optical path can be adjusted.

[0106] Furthermore, the position of the pulsed laser beam can be adjusted by changing the attitude angle of the parallel plate substrate 66. The amount of change in the position of the pulsed laser beam as it passes through the parallel plate substrate 66 depends on the angle of incidence on the parallel plate substrate 66, the thickness of the parallel plate substrate 66, and the refractive index of the parallel plate substrate 66. By changing the attitude angle of the parallel plate substrate 66, the angle of incidence of the pulsed laser beam on the parallel plate substrate 66 changes, and the position of the pulsed laser beam changes accordingly.

[0107] In the example shown in Figure 17, the high-reflection mirror 62 is held by a first actuator-equipped holder 90C that serves as an optical axis adjustment mechanism, but any of the high-reflection mirrors 61 to 64 may be held by the first actuator-equipped holder 90C.

[0108] 17, the parallel plate substrate 66 is disposed between the high-reflection mirror 62 and the high-reflection mirror 63. Alternatively, the parallel plate substrate 66 may be disposed between the high-reflection mirror 61 and the high-reflection mirror 62, or between the high-reflection mirror 63 and the high-reflection mirror 64. The parallel plate substrate 66 may also be disposed on the light incident side of the high-reflection mirror 61 or on the light exit side of the high-reflection mirror 64.

[0109] 5.3 Other Variations Each of the high-reflection mirrors 72, 74 included in the bypass device 70 according to the second embodiment may be provided with a holder with an actuator as an optical axis adjustment mechanism. Alternatively, one of the high-reflection mirrors 72, 74 may be provided with a holder with an actuator, and a parallel-plate substrate held by the holder with an actuator may be disposed between the high-reflection mirror 72 and the high-reflection mirror 74. Alternatively, a parallel-plate substrate held by a holder with an actuator may be disposed on the light-incoming side of the high-reflection mirror 72 or on the light-outgoing side of the high-reflection mirror 74. Furthermore, the light-incoming window 78A and the light-outgoing window 78B are not essential and may simply be openings through which light passes.

[0110] Furthermore, any two of the high-reflection mirrors 81 to 85 included in the bypass device 80 according to the third embodiment may be provided with actuator-equipped holders. Alternatively, one of the high-reflection mirrors 81 to 85 may be provided with an actuator-equipped holder, and a parallel-plate substrate held by the actuator-equipped holder may be disposed between the two high-reflection mirrors 81 to 85. Alternatively, a parallel-plate substrate held by an actuator-equipped holder may be disposed on the light-incoming side of the high-reflection mirror 81 or on the light-outgoing side of the high-reflection mirror 85. Furthermore, the light-incoming window 87A and the light-outgoing window 87B are not essential and may simply be openings through which light passes.

[0111] Furthermore, the actuator-equipped holder as the optical axis adjustment mechanism may be provided for three or more of the optical elements forming the bypass optical path. Furthermore, two or more of the optical elements forming the bypass optical path may be parallel plate substrates, and each of the parallel plate substrates may be provided with an actuator-equipped holder.

[0112] 6. Manufacturing method of electronic devices 18 shows a schematic configuration example of an exposure apparatus 200. The exposure apparatus 200 includes an illumination optical system 204 and a projection optical system 206. The illumination optical system 204 illuminates a reticle pattern of a reticle (not shown) placed on a reticle stage RT with pulsed laser light incident thereon, for example, from the laser apparatus 2A according to the first embodiment. The projection optical system 206 reduces and projects the pulsed laser light that has passed through the reticle, forming an image on a workpiece (not shown) placed on a workpiece table WT. The workpiece is a photosensitive substrate such as a semiconductor wafer coated with photoresist.

[0113] The exposure apparatus 200 exposes the workpiece with pulsed laser light reflecting the reticle pattern by synchronously translating the reticle stage RT and the workpiece table WT. After the reticle pattern is transferred to the semiconductor wafer through the exposure process described above, a semiconductor device can be manufactured through multiple processes. A semiconductor device is an example of an "electronic device" in this disclosure.

[0114] Furthermore, a bypass device 60 may be attached to the laser device 2A that irradiates the pulsed laser beam into the exposure device 200, or the bypass device 60 may be removed. When exposing a wafer, it is possible to select whether to prioritize the pulse width or the output of the pulsed laser beam by attaching or detaching the bypass device 60. Note that the laser device is not limited to the laser device 2A, and the above-mentioned laser device 2B or laser device 2C may also be used.

[0115] The above description is intended to be illustrative rather than limiting. Thus, it will be apparent to those skilled in the art that modifications may be made to the embodiments of the present disclosure without departing from the scope of the appended claims.

[0116] Terms used throughout this specification and the appended claims should be interpreted as "open-ended" terms. For example, the terms "including" or "including" should be interpreted as "not limited to what is stated as including." The term "having" should be interpreted as "not limited to what is stated as having." Additionally, the modifier "a" or "an" used in this specification and the appended claims should be interpreted as meaning "at least one" or "one or more."

Claims

1. A bypass device that is detachably attached to a laser device that outputs pulsed laser light, is provided in the laser device, and forms a bypass optical path that bypasses a pulse width expander that expands a pulse width of incident pulsed laser light, a plurality of optical elements forming the bypass optical path; a housing that houses the plurality of optical elements; Equipped with The plurality of optical elements include: a first high-reflection mirror that reflects the pulsed laser beam incident on the pulse width stretcher toward the outside of the pulse width stretcher and guides the pulsed laser beam to the bypass optical path; a second high-reflection mirror that reflects the pulsed laser beam reflected by the first high-reflection mirror and incident via the bypass optical path back to the output optical path of the pulse width stretcher; Contains Bypass device.

2. 2. The bypass device of claim 1, an optical axis adjusting mechanism for adjusting the optical axis of the bypass optical path; Bypass device.

3. 3. The bypass device of claim 2, The optical axis adjustment mechanism includes a first actuator holder that holds a first optical element of the plurality of optical elements and changes its attitude angle, and a second actuator holder that holds a second optical element and changes its attitude angle. Bypass device.

4. 4. The bypass device of claim 3, The first optical element and the second optical element are high-reflection mirrors. Bypass device.

5. 4. The bypass device of claim 3, the first optical element is a highly reflective mirror, The second optical element is a light-transmitting parallel plate substrate. Bypass device.

6. 2. The bypass device of claim 1, the first high-reflection mirror reflects the pulsed laser beam output from a beam steering device that changes the traveling direction of the incident pulsed laser beam; The second high-reflection mirror outputs the pulsed laser light incident via the bypass optical path along the output optical axis of the pulse width stretching device and returns the pulsed laser light to the output optical path. Bypass device.

7. 2. The bypass device of claim 1, the first high-reflection mirror reflects the pulsed laser beam output from one high-reflection mirror included in a beam steering device that changes the traveling direction of the incident pulsed laser beam, The second high-reflection mirror outputs the pulsed laser light incident via the bypass optical path along the output optical axis of the pulse width stretcher and returns it to the beam steering device. Bypass device.

8. 2. The bypass device of claim 1, the first high-reflection mirror reflects the pulsed laser beam output from one high-reflection mirror included in a beam steering device that changes the traveling direction of the incident pulsed laser beam, The second high-reflection mirror outputs the pulsed laser light incident via the bypass optical path along the output optical axis of the beam steering device and returns the pulsed laser light to the output optical path. Bypass device.

9. 1. A laser device comprising: a laser oscillator that outputs pulsed laser light; and a pulse width stretcher that stretches the pulse width of the incident pulsed laser light, and a bypass device that forms a bypass optical path that bypasses the pulse width stretcher and is detachably attached to the laser oscillator, The bypass device a plurality of optical elements forming the bypass optical path; a housing that houses the plurality of optical elements; Equipped with The plurality of optical elements include: a first high-reflection mirror that reflects the pulsed laser beam incident on the pulse width stretcher toward the outside of the pulse width stretcher and guides the pulsed laser beam to the bypass optical path; a second high-reflection mirror that reflects the pulsed laser beam reflected by the first high-reflection mirror and incident via the bypass optical path back to the output optical path of the pulse width stretcher; Contains Laser device.

10. a laser device including a laser oscillator for outputting pulsed laser light and a pulse width expander for expanding the pulse width of the incident pulsed laser light, the pulsed laser light being output from the laser device to an exposure device, the laser device having a bypass device detachably attached thereto that forms a bypass optical path that bypasses the pulse width expander; a method for manufacturing an electronic device, the method comprising: exposing a photosensitive substrate to the pulsed laser light in the exposure apparatus to manufacture the electronic device, The bypass device a plurality of optical elements forming the bypass optical path; a housing that houses the plurality of optical elements; Equipped with The plurality of optical elements include: a first high-reflection mirror that reflects the pulsed laser beam incident on the pulse width stretcher toward the outside of the pulse width stretcher and guides the pulsed laser beam to the bypass optical path; a second high-reflection mirror that reflects the pulsed laser beam reflected by the first high-reflection mirror and incident via the bypass optical path back to the output optical path of the pulse width stretcher; Contains A method for manufacturing electronic devices.

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