Method of manufacturing light emitting module
By fitting the optical member's convex portion into a through-hole in the substrate, the method aligns the light-emitting device and lens centers, enhancing light distribution in the light-emitting module.
Patent Information
- Application Number
- JP2024123354
- Authority / Receiving Office
- JP · JP
- Patent Type
- Applications
- Current Assignee / Owner
- Filing Date
- 2024-07-30
- Publication Date
- 2026-02-12
AI Technical Summary
The challenge is to ensure precise alignment of the center of the light-emitting device with the center of the lens in a light-emitting module.
A method involving the formation of a laminated structure with a light-emitting device and optical member, where the optical member's convex portion is fitted into a through-hole in the substrate, aligning the light-emitting device's center with the lens center using the light-emitting surface as a reference.
This method achieves high positional accuracy, ensuring the light-emitting device and lens centers coincide, thereby optimizing light distribution characteristics.
Smart Images
Figure 2026022022000001_ABST
Abstract
Description
[Technical Field]
[0001] The present invention relates to a method for manufacturing a light-emitting module. [Background technology]
[0002] A light emitting module that combines a light emitting device and a lens is known (for example, Patent Document 1). [Prior art documents] [Patent documents]
[0003] [Patent Document 1] Japanese Patent Application Laid-Open No. 2017-050356 Summary of the Invention [Problem to be solved by the invention]
[0004] It is required that the center of the light emitting device and the center of the lens coincide with each other. [Means for solving the problem]
[0005] The present disclosure includes the following configurations. a step of preparing a first intermediate body including: a first substrate having a first upper surface and a first lower surface opposite to the first upper surface, the first substrate having a first through-hole penetrating from the first upper surface to the first lower surface; and a light emitting device bonded onto the first upper surface via a first bonding member; preparing a second intermediate body having a second substrate including a second upper surface and a second lower surface opposite to the second upper surface, the second substrate including a first opening penetrating from the second upper surface to the second lower surface and into which the light emitting device can be inserted, and an electronic component bonded to the second upper surface via a second bonding member having a melting point different from that of the first bonding member; bonding the second lower surface of the second substrate and the first upper surface of the first substrate via a third bonding member so that the light emitting device is positioned within the first opening; forming a second through-hole that penetrates from the second upper surface to the second lower surface and has an opening diameter smaller than that of the first through-hole in the second substrate at a position that overlaps with the first through-hole when viewed from above, using the center of the light-emitting surface of the light-emitting device as a reference point, to form a laminated structure; preparing an optical member including a lens member and a holding member that holds the lens member, the holding member having a convex portion; a method for manufacturing a light emitting module, wherein the laminated structure and the optical member are fixed by fitting the convex portion of the optical member into the second through hole of the laminated structure; [Effects of the Invention]
[0006] As a result, a light emitting module can be obtained in which the center of the light emitting device and the center of the lens coincide with each other. [Brief explanation of the drawings]
[0007] [Figure 1A] FIG. 1 is a schematic top view showing a light-emitting module according to an embodiment. [Figure 1B] FIG. 1B is a schematic cross-sectional view taken along line IB-IB in FIG. 1A. [Figure 1C] 1 is a schematic cross-sectional view showing a light-emitting module according to an embodiment. [Figure 2A] 5A to 5C are schematic cross-sectional views showing a method for manufacturing a light-emitting module according to an embodiment. [Figure 2B] 5A to 5C are schematic cross-sectional views showing a method for manufacturing a light-emitting module according to an embodiment. [Figure 2C] 5A to 5C are schematic cross-sectional views showing a method for manufacturing a light-emitting module according to an embodiment. [Figure 2D] 5A to 5C are schematic top views illustrating a method for manufacturing a light emitting module according to an embodiment. [Figure 2E] FIG. 2E is a schematic cross-sectional view taken along line IIE-IIE in FIG. 2D. [Figure 3A] 5A to 5C are schematic cross-sectional views showing a method for manufacturing a light-emitting module according to an embodiment. [Figure 3B] 5A to 5C are schematic cross-sectional views showing a method for manufacturing a light-emitting module according to an embodiment. [Figure 3C] 5A to 5C are schematic cross-sectional views showing a method for manufacturing a light-emitting module according to an embodiment. [Figure 3D] 5A to 5C are schematic top views illustrating a method for manufacturing a light emitting module according to an embodiment. [Figure 3E] FIG. 3E is a schematic cross-sectional view taken along line IIIE-IIIE in FIG. 3D. [Figure 4A] 5A to 5C are schematic cross-sectional views showing a method for manufacturing a light-emitting module according to an embodiment. [Figure 4B] 5A to 5C are schematic cross-sectional views showing a method for manufacturing a light-emitting module according to an embodiment. [Figure 4C] 5A to 5C are schematic cross-sectional views showing a method for manufacturing a light-emitting module according to an embodiment. [Figure 5A] 5A to 5C are schematic top views illustrating a method for manufacturing a light emitting module according to an embodiment. [Figure 5B] FIG. 5B is a schematic cross-sectional view taken along line VB-VB in FIG. 5A. [Figure 6A] 5A to 5C are schematic top views illustrating a method for manufacturing a light emitting module according to an embodiment. [Figure 6B] FIG. 6B is a schematic cross-sectional view taken along line VIB-VIB in FIG. 6A. [Figure 7A] 5A to 5C are schematic top views illustrating a method for manufacturing a light emitting module according to an embodiment. [Figure 7B] FIG. 7B is a schematic cross-sectional view taken along line VIIB-VIIB in FIG. 7A. [Figure 8] 5A to 5C are schematic cross-sectional views showing a method for manufacturing a light-emitting module according to an embodiment. DETAILED DESCRIPTION OF THE INVENTION
[0008] DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS The following embodiments of the present invention will be described with reference to the accompanying drawings. However, the embodiments are merely examples of methods for manufacturing a light emitting module that embody the technical concept of the present invention, and the present invention is not limited to the methods for manufacturing a light emitting module.
[0009] Furthermore, this specification does not in any way specify the components described in the claims as components of the embodiments. In particular, unless otherwise specified, the dimensions, materials, shapes, and relative positions of components described in the embodiments are not intended to limit the scope of this disclosure, but are merely illustrative examples. The sizes and relative positions of components shown in each drawing may be exaggerated or partially omitted for clarity. Furthermore, in the following description, the same names and symbols indicate the same or similar components, and detailed descriptions will be omitted as appropriate. Furthermore, in the following description, terms indicating specific directions or positions (e.g., "upper," "lower," "right," "left," and other terms incorporating these terms) are used as necessary. The use of these terms facilitates understanding of the invention with reference to the drawings, and the meanings of these terms do not limit the technical scope of the present invention. Furthermore, end views showing only the cut surface may be used as cross-sectional views. Furthermore, top views may be shown as perspective views that allow partial or complete visibility of components embedded within. In such cases, the embedded components are indicated by dashed lines.
[0010] 1A to 1C show a light emitting module 1000 obtained by the method for manufacturing a light emitting module according to the embodiment. As shown in light emitting module 1000A in FIG. 1B, light emitting module 1000 includes a laminated structure 100 including a light emitting device 13, and an optical member 200 including a lens member 40. Furthermore, as shown in light emitting module 1000B in FIG. 1C, light emitting module 1000 can further include a heat dissipation member 300.
[0011] The laminated structure 100 is formed by stacking a first intermediate 10 and a second intermediate 20 with a third bonding member 30 interposed therebetween. The first intermediate 10 includes a first substrate 11, a light emitting device 13, and a first bonding member 12. The first substrate 11 includes a first upper surface 11U and a first lower surface 11L opposite the first upper surface 11U. The first substrate 11 further includes a first through-hole 11T that penetrates from the first upper surface 11U to the first lower surface 11L. The light emitting device 13 is bonded to the first upper surface 11U with the first bonding member 12 interposed therebetween at a position that does not overlap with the first through-hole 11T.
[0012] The second intermediate 20 includes a second substrate 21, an electronic component 23, and a second bonding member 22. The second substrate 21 includes a second upper surface 21U and a second lower surface 21L opposite the second upper surface 21U. The second substrate 21 further includes a second through-hole T that penetrates from the second upper surface 21U to the second lower surface 21L. The second substrate 21 also includes a first opening 21A that penetrates from the second upper surface 21U to the second lower surface 21L at a position different from the second through-hole 21T, and through which the light emitting device 13 of the first intermediate 10 can be inserted. The electronic component 23 is bonded to the second upper surface 21U via the second bonding member 22 at a position that does not overlap with the second through-hole 21T and the first opening 21A.
[0013] The third bonding member 30 is disposed between the first upper surface 11U of the first substrate 11 of the first intermediate body 10 and the second lower surface 21L of the second substrate 21 of the second intermediate body 20. The third bonding member 30 has a second opening 30A at a position overlapping with the first opening 21A of the second substrate 21 in a top view. Furthermore, the third bonding member 30 has a third through hole 30T at a position overlapping with the first through hole 11T and the second through hole 21T in a top view.
[0014] Optical member 200 includes lens member 40 and holding member 50 that holds lens member 40. Lens member 40 is arranged such that center 40C of lens member 40 coincides with center 13C of light-emitting surface 13L of light-emitting device 13 in top view. Holding member 50 is, for example, cylindrical, and includes one or more convex portions 50P on its lower surface.
[0015] The convex portion 50P of the holding member 50 of the optical member 200 is fitted into the second through-hole 21T of the second substrate 21 of the laminated structure 100. This allows the light-emitting module 1000 to be formed in which the laminated structure 100 and the optical member 200 are fixed with high positional accuracy.
[0016] A detailed description will now be given of a method for manufacturing the light emitting module 1000 having the above structure. The light emitting module 1000 is manufactured mainly through the following steps. (1) A step of preparing a first intermediate 10 comprising a first substrate 11 having a first through hole 11T and a light emitting device 13 bonded onto a first upper surface 11U of the first substrate 11 via a first bonding member 12. (2) A process of preparing a second intermediate 20 comprising a second substrate 21 having a first opening 21A that does not have a through hole and into which a light emitting device 13 can be inserted, and an electronic component 23 bonded onto a second upper surface 21U of the second substrate 21 via a second bonding member 22. (3) A process of bonding the second lower surface 21L of the second substrate 21 and the first upper surface 11U of the first substrate 11 together via a third bonding member 30 so that the light emitting device 13 is positioned within the first opening 21A. (4) When viewed from above, the center 13C of the light-emitting surface 13L of the light-emitting device 13 is used as a reference point, and a second through-hole 21T having an opening diameter smaller than that of the first through-hole 11T is formed in the second substrate 21 at a position overlapping with the first through-hole 11T, thereby forming a laminated structure 100. (5) A step of preparing an optical member 200 including a lens member 40 and a holding member 50 that holds the lens member 40 and has a convex portion 50P on its lower surface. (6) A step of fixing the laminated structure 100 and the optical member 200 by fitting the convex portion 50P of the optical member 200 into the second through-hole 21T.
[0017] The above-mentioned steps (1) preparing the first intermediate 10, (2) preparing the second intermediate 20, and (5) preparing the optical member 200 may be performed at any stage before the step (6) of fixing the laminated structure 100 and the optical member 200. In other words, steps (1), (2), and (5) may be performed in any order before step (6), or some or all of them may be performed simultaneously. Furthermore, the same names are used for the first substrate 11, the second substrate 21, and the third bonding member 30 before and after the formation of the through holes and / or openings.
[0018] (1) Step of preparing a first intermediate 10 The first substrate 11 is prepared. The first substrate 11 can be prepared by preparing a first substrate 11B without a through hole as shown in FIG. 2A and forming a first through hole 11T penetrating from the first upper surface 11U to the first lower surface 11L as shown in FIG. 2B. Alternatively, a first substrate 11 with a first through hole 11T penetrating from the first upper surface 11U to the first lower surface 11L as shown in FIG. 2 can be prepared by purchasing or the like. Alternatively, a substrate without a first through hole 11T penetrating from the first upper surface 11U to the first lower surface 11L as shown in FIG. 2A can be prepared by forming the first through hole 11T after disposing a first bonding member 12 (described later) or after disposing a light emitting device 13 on the first bonding member 12. The first through hole 11T can be formed, for example, by using a drill D as shown in FIG. 2B or by irradiating a laser beam. When the first substrate 11 is a metal plate, the first through hole 11T may be formed using a mold or the like.
[0019] Examples of materials for the first substrate 11 include metal materials, ceramic materials, and resin materials. The shape of the first substrate 11 can be, for example, a polygon such as a rectangle or hexagon, a circle, or a shape with a portion missing from these when viewed from above. The size of the first substrate 11 can be, for example, a rectangle with a side length of 40 mm or more and 100 mm or less. The thickness of the first substrate 11 can be, for example, 0.5 mm or more and 2.0 mm or less. Furthermore, since the light emitting device 13 is mounted on the first substrate 11, a material with excellent heat dissipation properties is preferred. Therefore, a metal plate is preferred for the first substrate 11, and Cu, Al, Ag, etc. are particularly preferred.
[0020] The opening diameter of the first through hole 11T in the first substrate 11 is larger than the opening diameter of the second through hole 21T in the second substrate 21. The opening diameter of the first through hole 11T can be, for example, 125% to 200% of the opening diameter of the second through hole 21T. Specifically, the opening diameter of the first through hole 11T can be 1.25 mm to 6.0 mm. The first substrate 11 can have one or more first through holes 11T. For example, the example shown in FIG. 2B has two first through holes 11T. When a plurality of first through holes 11T are provided, they can be arranged at positions sandwiching the planned placement location of the light emitting device 13. Furthermore, when a plurality of first through holes 11T are provided, the size and / or shape of each first through hole 11T may be the same or different in part or in whole. For example, the first through hole 11T can have a shape with an aspect ratio of 1, such as a circle, square, or regular polygon, when viewed from above, or a shape with an aspect ratio greater than 1, such as a rectangle, ellipse, or track shape. A track shape is a shape having two linear portions spaced apart from each other and two arc-shaped portions arranged to connect the ends of the two linear portions. In the example shown in FIG. 2D , there are two first through holes 11T, one of which is a perfect circle. The other is track-shaped. By providing first through holes 11T of different shapes in this way, it is possible to reduce the occurrence of process errors, such as incorrect orientation of the first substrate 11. Note that if the opening shape of the first through hole 11T is a perfect circle, the opening diameter of the first through hole 11T is the diameter of the perfect circle. Note that if the opening shape of the first through hole 11T is not a perfect circle, the opening diameter of the first through hole 11T is the longest diameter. The definition of the opening diameter is the same for the second through-hole 21T.
[0021] 2D , when the light emitting device 13 is rectangular, the track-shaped first through-hole 11T is preferably oriented so that its long side and the linear portion of the track shape of the first through-hole 11T are parallel to each other. When the light emitting device 13 is rectangular, particularly when the light emitting surface 13L of the light emitting device 13 is rectangular, misalignment of the light emitting device 13 in the long side direction has a greater effect on the thermal expansion of the light emitting module 1000 than misalignment in the short side direction. Therefore, by forming the first through-hole 11T to extend in a direction parallel to the long side direction of the light emitting device 13, it is possible to reduce misalignment and achieve more accurate adjustment.
[0022] Next, as shown in FIG. 2C , the first bonding member 12 is placed on the first upper surface 11U of the first substrate 11. The first bonding member 12 is a member for fixing the light emitting device 13, and is therefore placed at a position where the light emitting device 13 will be placed. The first bonding member 12 is placed at a position that does not overlap the first through hole 11T in a top view. The first bonding member 12 can be made of a sintered silver material, a silver paste, a sintered gold material, or a gold paste. The silver paste and the gold paste are hardened by heating at a temperature of 200°C or less. After hardening, the silver paste and the gold paste may or may not contain an organic component. The sintered silver material and the sintered gold material are hardened by heating at a temperature of 200°C or more. The first bonding member 12 has a different melting point from the second bonding member 22.
[0023] Next, the light emitting device 13 is placed on the first bonding member 12. Then, by heating, the light emitting device 13 can be bonded to the first substrate 11 via the first bonding member 12 as shown in FIGS. 2D and 2E. The heating temperature is 150°C or higher and 300°C or lower. This allows the preparation of a first intermediate 10. The light emitting device 13 includes one or more semiconductor light emitting elements. The light emitting device 13 may further include a substrate on which the semiconductor light emitting element is mounted, a sealing member that seals the semiconductor light emitting element, a conductive member for applying electricity to the semiconductor light emitting element, and a protective element such as a Zener diode that protects the semiconductor light emitting element from static electricity. The light emitting device 13 has a light emitting surface 13L on its upper surface, and an optical axis at its center 13C. The light emitting surface 13L can be quadrangular (e.g., square or rectangular), circular, elliptical, or a shape with a missing portion thereof. The light emitting device 13 can emit light of a chromaticity selected from white, red, green, blue, and mixed colors thereof.
[0024] The second substrate 21 is prepared. As shown in FIG. 3A, the second substrate 21 can be prepared by preparing a second substrate 21B1 without a through-hole, and then forming a first opening 21A that penetrates from the second upper surface 21U to the second lower surface 21L, as shown in FIG. 3B, to prepare a second substrate 21B2. Alternatively, as shown in FIG. 3B, the second substrate 21B2 that has the first opening 21A that penetrates from the second upper surface 21U to the second lower surface 21L can be prepared by purchasing or the like. The first opening 21A can be formed, for example, by drilling, irradiating a laser beam, using a router, pressing a mold, or the like.
[0025] The second substrate 21 can be made of a material with lower heat dissipation properties than the first substrate 11. However, because the second substrate 21 uses solder as the second bonding member 22 for bonding the electronic components 23, a material with excellent heat resistance at the melting temperature of the solder is preferred. The second substrate 21 can be made of an insulating base material and a wiring substrate having wiring thereon. The wiring may also be covered with an insulating protective film so that a portion of the wiring necessary for current flow is exposed. The base material for the second substrate 21 can be a substrate such as paper or glass cloth impregnated with a resin such as phenolic resin, epoxy resin, or polyimide resin. Specific examples include a paper phenolic substrate, a glass epoxy substrate, and a glass polyimide substrate. Examples of wiring include Cu, Al, Ag, Ni, and alloys thereof. The wiring is electrically connected to the light-emitting device 13 arranged on the first substrate 11 via a wire after the laminated structure 100 is formed, as described below. That is, the first substrate 11 is a substrate that does not contribute to the conduction of electricity to the light emitting device 13, and the second substrate is a substrate that contributes to the conduction of electricity to the light emitting device 13 and the electronic components .
[0026] The shape of the second substrate 21 can be the same as or different from the shape of the first substrate 11 when viewed from above. The shape of the second substrate 21 can be, for example, a polygon such as a rectangle or a hexagon, a circle, or a shape with a portion missing from any of these. The size of the second substrate 21 can be, for example, a rectangle with a side length of 40 mm or more and 100 mm or less. The thickness of the second substrate 21 can be, for example, 0.2 mm or more and 1.0 mm or less.
[0027] The second substrate 21B has one first opening 21A. The size of the first opening 21A need only be large enough to allow the light emitting device 13 to be inserted therein. The shape of the first opening 21A can be, for example, a rectangle as shown in FIG. 3D , a square, a circle, an ellipse, a polygon such as a triangle, a shape with a portion missing from any of these, or a combination of these shapes. At this stage, the second substrate 21B has the first opening 21A but does not have the second through-hole 21T.
[0028] Next, as shown in FIG. 3C , second bonding members 22 are placed on the second upper surface 21U of the second substrate 21. The second bonding members 22 are members for supplying electricity to the electronic components 23 and for fixing the electronic components 23. Therefore, they are placed at positions where the electronic components 23 are to be placed. The second bonding members 22 are also placed at positions that do not overlap with the first through holes 11T of the first substrate 11 in a top view. Eutectic solder, lead-free solder, or the like can be used as the second bonding members 22. The second bonding members 22 have a higher melting point than the first bonding members 12. The second bonding members 22 can be placed by a method such as printing, transferring, or dispensing.
[0029] Next, the electronic components 23 are placed on the second bonding members 22. Thereafter, by heating, the electronic components 23 can be bonded to the second substrate 21 via the second bonding members 22, as shown in FIGS. 3D and 3E. The heating temperature is 140°C or higher and 250°C or lower. This allows the second intermediate 20 to be prepared. Examples of the electronic components 23 include protection elements such as Zener diodes and varistors, integrated circuits such as ICs and LSIs, resistors, capacitors, inductors, and transistors. The number, types, and placement locations of the electronic components 23 can be selected as appropriate.
[0030] (3) Step of forming a laminated structure The third bonding member 30 is prepared. As shown in FIG. 4A, the third bonding member 30B is a sheet such as an adhesive resin sheet sandwiched between upper and lower covers 31. Examples of the sheet include a resin sheet or a rubber sheet. Specifically, silicone resin, silicone rubber, acrylic resin, acrylic rubber, urethane resin, and urethane rubber can be used. At this stage, the third bonding member 30B does not have a second opening 30A and a third through hole 30T. Next, as shown in FIG. 4B, a second opening 30A is formed in the third bonding member 30 and the upper and lower covers 31 at a position corresponding to the first opening 21A in the second substrate 21, and a third through hole 30T is formed at a position corresponding to the first through hole 11T in the first substrate 11. The third through hole 30T can be formed by, for example, drilling, laser irradiation, die-cutting, or other methods. Alternatively, as shown in FIG. 4B, the third bonding member 30 having the second opening 30A and the third through hole 30T may be purchased and prepared in advance.
[0031] Next, as shown in FIG. 4C, the cover 31 arranged on the lower surface of the third bonding member 30 is removed, and as shown in FIGS. 5A and 5B, the lower surface of the third bonding member 30 is placed facing the first upper surface 11U of the first substrate 11. The first through hole 11T of the first substrate 11 and the third through hole 30T of the third bonding member 30 are arranged so as to overlap in a top view. Next, the cover 31 arranged on the upper surface of the third bonding member 30 is removed. Then, as shown in FIGS. 6A and 6B, the upper surface of the third bonding member 30 is arranged so as to face the second lower surface 21L of the second substrate 21 of the second intermediate body 20. This allows the first intermediate body 10 and the second intermediate body 20 to be bonded together. The third bonding member 30 may also be arranged on the second lower surface 21L of the second substrate 21.
[0032] (4) Step of forming the second through-holes 21T Next, as shown in FIGS. 7A and 7B, a second through hole 21T is formed in the second substrate 21. The second through hole 21T is formed at a position overlapping the first through hole 11T in a top view. The second through hole 21T can be formed by irradiating it with laser light, as shown in FIG. 7B. Alternatively, a drill or the like may be used. If a drill is used, care must be taken to prevent a portion of the spindle from interfering with the electronic component 23 during processing. When forming the second through hole 21T, the center 13C of the light-emitting surface 13L of the light-emitting device 13 is recognized by a camera, and the position where the second through hole 21T is formed is determined using the center 13C as a reference point. The opening diameter of the second through hole 21T is smaller than that of the first through hole 11T. The opening diameter of the second through hole 21T is, for example, 1.0 mm or more and 3.0 mm or less. When the second through holes 21T are formed by irradiating laser light, they are formed without contacting the second substrate 21, and therefore can be formed with higher positional accuracy than when the second through holes 21T are formed by contacting a tool such as a drill with the second substrate 21. Furthermore, since the opening diameter of the first through holes 11T is larger than the opening diameter of the second through holes 21T, processing chips generated when forming the second through holes 21T can fall into the first through holes 11T.
[0033] (5) A process for preparing optical components The optical element 200 includes a lens element 40 and a holding element 50 that holds the lens element 40. The holding element 50 has a convex portion 50P on its underside. This convex portion 50P is a portion that can be mated with the second through-hole 21T of the second substrate 21 of the laminated structure 100. The optical element 200 can be prepared by forming the lens element 40, forming the holding element 50, and combining these elements. Alternatively, the optical element 200 can be prepared by forming or purchasing the lens element 40, and then forming the holding element 50 by integral molding with the lens element 40. The optical element 200 can also be prepared by purchasing it.
[0034] One or more lens members 40 may be provided. In the example shown in FIG. 8, two lens members 40 are provided, and the first lens member 41 provided on the side closer to the light emitting device 13 is a plano-convex lens with a flat bottom surface and a convex top surface. The second lens member 42 arranged above the first lens member 41 is a biconvex lens with convex top and bottom surfaces. The number, size, curvature, etc. of the lens members 40 can be selected appropriately depending on the optical characteristics of the light emitting device 13, the optical characteristics of the light emitting module 1000, etc. When multiple lens members 40 are provided, they are arranged so that the centers of the lens members 40 overlap when viewed from above. The lens members 40 may be made of a material such as glass or plastic, for example.
[0035] The holding member 50 is a member that holds the lens member 40 and may be cylindrical, for example. Examples of materials that can be used for the holding member 50 include metal materials such as Al and Mg alloys, and resin materials such as polycarbonate and ABS resin. The holding member 50 has a protrusion 50P on its lower surface facing the second upper surface 21U of the second substrate 21. The protrusion 50P may be integrally formed from the same material as the cylindrical portion. Alternatively, the holding member 50 may be formed by attaching a columnar or other member separate from the cylindrical portion to the lower surface of the cylindrical portion. For example, the lower surface of the cylindrical portion may have a screw hole, and a screw with a columnar head may be fitted into the screw hole. The shape of the protrusion 50P when viewed from below is the same as the shape of the second through-hole 21T. The protrusion 50P may be, for example, a columnar, prism, cylinder, or square tube. The protrusions 50P only need to be fitted into the second through holes 21T of the second substrate 21, and may further be inserted into the third through holes 30T of the third joint member 30 and the first through holes 11T of the first substrate 11. In other words, the height of the protrusions 50P can be approximately the same as or greater than the thickness of the second substrate 21. The number of protrusions 50P can be the same as or less than the number of second through holes 21T of the second substrate 21. In other words, there may be second through holes 21T into which no protrusions 50P are fitted.
[0036] (5) Step of fixing the laminated structure 100 and the optical member 200 The optical element 200 is placed on the laminated structure 100 so that the convex portion 50P of the optical element 200 mates with the second through hole 21T of the second substrate 21 of the laminated structure 100. The laminated structure 100 and the optical element 200 can be fixed together simply by fitting the convex portion 50P into the second through hole 21T. Alternatively, uncured adhesive can be placed between the laminated structure 100 and the optical element 200 before fitting the convex portion 50P into the second through hole 21T, and the adhesive can be cured after fitting the convex portion 50P into the second through hole 21T. Alternatively, the convex portion 50P can be fixed together using a screw or the like after fitting the convex portion 50P into the second through hole 21T.
[0037] Furthermore, as shown in FIG. 1C, in the case of a light emitting module 1000B including a heat dissipation member 300, a step of attaching the heat dissipation member 300 to the first lower surface 11L of the first substrate 11 can be performed at any stage of the above steps.
[0038] In light-emitting module 1000 obtained as described above, second through-hole 21T is formed using center 13C of light-emitting surface 13L of light-emitting device 13 as a reference point, and therefore the center of light-emitting device 13 coincides with the center of lens member 40. This allows light-emitting module 1000 to have desired light distribution characteristics.
[0039] Embodiments of the present disclosure may include the following light emitting modules. [Section 1] a step of preparing a first intermediate body including: a first substrate having a first upper surface and a first lower surface opposite to the first upper surface, the first substrate having a first through-hole penetrating from the first upper surface to the first lower surface; and a light emitting device bonded onto the first upper surface via a first bonding member; preparing a second intermediate body having a second substrate including a second upper surface and a second lower surface opposite to the second upper surface, the second substrate including a first opening penetrating from the second upper surface to the second lower surface and into which the light emitting device can be inserted, and an electronic component bonded to the second upper surface via a second bonding member having a melting point different from that of the first bonding member; bonding the second lower surface of the second substrate and the first upper surface of the first substrate via a third bonding member so that the light emitting device is positioned within the first opening; forming a second through-hole that penetrates from the second upper surface to the second lower surface and has an opening diameter smaller than that of the first through-hole in the second substrate at a position that overlaps with the first through-hole when viewed from above, using the center of the light-emitting surface of the light-emitting device as a reference point, to form a laminated structure; preparing an optical member including a lens member and a holding member that holds the lens member, the holding member having a convex portion; a method for manufacturing a light emitting module, wherein the laminated structure and the optical member are fixed by fitting the convex portion of the optical member into the second through hole of the laminated structure; [Section 2] Item 2. The method for manufacturing a light emitting module according to item 1, wherein there are two first through holes, and the first through holes are arranged at positions sandwiching the light emitting device when viewed from above. [Section 3] the light-emitting device has a light-emitting surface having a shape selected from a rectangular shape, an elliptical shape, and a track shape when viewed from above; Item 1 or 2, a manufacturing method of a light-emitting module, wherein the second through hole has a shape selected from a rectangular, elliptical, and track-shaped shape when viewed from above, and has a side or a long axis parallel to the long side or a long axis of the light-emitting surface. [Section 4] Item 4. The method for manufacturing a light emitting module according to any one of items 1 to 3, wherein the first through hole has an opening diameter that is 125% to 200% of the opening diameter of the second through hole. [Section 5] The first through hole is formed by a drill, 5. The method for manufacturing a light-emitting module according to any one of items 1 to 4, wherein the second through hole is formed by irradiating with laser light. [Section 6] 6. The method for manufacturing a light emitting module according to any one of items 1 to 5, wherein the first substrate has a thickness of 0.5 mm or more and 2.0 mm or less. [Section 7] the first substrate is metal; The second substrate is a wiring substrate having an insulating base material and wiring on an upper surface of the base material. Item 7. A method for manufacturing a light-emitting module according to any one of items 1 to 6. [Section 8] Item 9. The method for manufacturing a light emitting module according to any one of items 1 to 8, wherein the first bonding member is selected from sintered silver, silver paste, sintered gold, and gold paste. [Section 9] Item 9. The method for manufacturing a light emitting module according to any one of items 1 to 8, further comprising the step of arranging a heat dissipation member on the first lower surface of the first substrate.
[0040] The embodiments of the present disclosure have been described above with reference to specific examples. However, the present disclosure is not limited to these specific examples. All forms that can be implemented by a person skilled in the art through appropriate design modifications based on the above-described embodiments of the present disclosure also fall within the scope of the present disclosure, as long as they include the gist of the present disclosure. In addition, within the scope of the concept of the present disclosure, a person skilled in the art may come up with various modifications and alterations, and these modifications and alterations also fall within the scope of the present disclosure. [Explanation of symbols]
[0041] 1000...Light emitting module 100...Laminated structure 10...First intermediate 11...1st board (11U...1st top surface, 11L...1st bottom surface, 11T...1st through hole) 12...First joining member 13...light-emitting device (13L...light-emitting surface, 13C...center of light-emitting surface) 20...Second intermediate 21...Second board (21U...second top surface, 21L...second bottom surface, 21T...second through hole, 21A...opening, 21B...base material, 21W...wiring) 22...Second joining member 23...Electronic components 30...Third joining member (30A...Second opening, 30T...Third through hole) 31...Cover 200...Optical components 40...Lens member (40C...Center of lens member) 41...first lens member 42...Second lens member 50...holding member (50P...protrusion) 300...heat dissipation member D...Drill LD: laser light
Claims
1. a step of preparing a first intermediate body including: a first substrate having a first upper surface and a first lower surface opposite to the first upper surface, the first substrate having a first through-hole penetrating from the first upper surface to the first lower surface; and a light emitting device bonded onto the first upper surface via a first bonding member; preparing a second intermediate body including a second substrate having a second upper surface and a second lower surface opposite to the second upper surface, the second substrate having a first opening penetrating from the second upper surface to the second lower surface and into which the light emitting device can be inserted, and an electronic component bonded to the second upper surface via a second bonding member having a melting point different from that of the first bonding member; bonding the second lower surface of the second substrate and the first upper surface of the first substrate together via a third bonding member so that the light emitting device is positioned within the first opening; forming a second through-hole that penetrates from the second upper surface to the second lower surface and has an opening diameter smaller than that of the first through-hole in the second substrate at a position that overlaps with the first through-hole when viewed from above, using the center of the light-emitting surface of the light-emitting device as a reference point, to form a laminated structure; preparing an optical member including a lens member and a holding member that holds the lens member, the holding member having a convex portion; the protrusion of the optical member is fitted into the second through-hole of the laminated structure to fix the laminated structure and the optical member.
2. The method for manufacturing a light-emitting module according to claim 1 , wherein the number of the first through holes is two, and the first through holes are disposed at positions sandwiching the light-emitting device when viewed from above.
3. the light-emitting device has a light-emitting surface having a shape selected from a rectangular shape, an elliptical shape, and a track shape when viewed from above; The method for manufacturing a light-emitting module according to claim 1 , wherein the second through hole has a shape selected from the group consisting of a rectangle, an ellipse, and a track shape when viewed from above, and has a side or a long axis parallel to the long side or a long axis of the light-emitting surface.
4. The method for manufacturing a light emitting module according to claim 1 , wherein the first through hole has an opening diameter that is 125% to 200% of the opening diameter of the second through hole.
5. The first through hole is formed by a drill, The method for manufacturing a light-emitting module according to claim 1 , wherein the second through-hole is formed by irradiating with laser light.
6. The method for manufacturing a light emitting module according to claim 1 , wherein the first substrate has a thickness of 0.5 mm or more and 2.0 mm or less.
7. the first substrate is metal; the second substrate is a wiring substrate having an insulating base material and wiring on an upper surface of the base material; A method for manufacturing the light emitting module according to claim 1 .
8. The method for manufacturing a light emitting module according to claim 1 , wherein the first bonding material is selected from the group consisting of sintered silver, silver paste, sintered gold, and gold paste.
9. The method for manufacturing a light emitting module according to claim 1 , further comprising the step of arranging a heat dissipation member on the first lower surface of the first substrate.
Citation Information
Patent Citations
Manufacturing method for light-emitting device
JP2017050356A