Electronic component conveyance board and electronic component tester

Abstract

To provide an electronic component conveyance board and an electronic component inspection device which have excellent removal characteristics of abrasion powder and can be manufactured at low cost.SOLUTION: The electronic component transfer board has a first surface and a second surface opposite to the first surface, and is rotatably provided on the transfer board support plate with the first surface facing the transfer board support plate. The electronic component conveyance board includes a bearing portion provided at a central portion, a plurality of electronic component accommodating holes disposed on a concentric circle of the bearing portion and each penetrating from the first surface to the second surface, a suction groove portion formed on the first surface, communicating with the electronic component accommodating holes, and extending along a radial direction of a circle centered on the bearing portion, and a recessed portion formed on the first surface and disposed between the electronic component accommodating holes adjacent to each other in a circumferential direction among the plurality of electronic component accommodating holes.SELECTED DRAWING: Figure 3

Description

[Technical Field]

[0001] The present invention relates to an electronic component transport panel and an electronic component inspection device. [Background technology]

[0002] In recent years, electronic devices have become smaller and more powerful, and as a result, the number of electronic components incorporated into electronic devices has increased, while the individual electronic components have also become smaller. Such electronic components include, for example, chip capacitors, chip resistors, and chip inductors. These electronic components have a pair of electrodes at both ends of a main body.

[0003] However, if an electronic component incorporated into an electronic device has a defect, the electronic device will be deemed defective. For this reason, all electronic components incorporated into an electronic device are subjected to a preliminary inspection to determine whether they can exhibit the desired characteristics. Conventionally, chip electronic component inspection and sorting equipment has been used to perform such inspections continuously and at high speed.

[0004] Such a chip electronic component inspection and sorting device includes a conveying disk with a storage hole for storing electronic components, and a conveying disk support base that supports the conveying disk. The storage hole is a through hole that penetrates the conveying disk in the thickness direction, and the electronic components are stored in the storage hole so that a pair of electrodes are exposed from each side of the conveying disk. The conveying disk is disposed opposite the conveying disk support base and rotates. Therefore, the conveying disk and one of the electrodes of the electronic components stored in the storage hole may generate wear powder due to friction with the opposing surface of the conveying disk support base.

[0005] Wear particles from the conveying disk and electrodes can affect the inspection results of electronic components, and can also cause component transport and ejection problems. [Prior art documents] [Patent documents]

[0006] [Patent Document 1] Special publication 2000-501174 Summary of the Invention [Problem to be solved by the invention]

[0007] However, Patent Document 1 does not take any special measures against wear debris.

[0008] SUMMARY OF THE INVENTION It is therefore an object of the present invention to provide an electronic component transport panel and an electronic component inspection device that have good wear powder removal properties and can be manufactured at low cost. [Means for solving the problem]

[0009] In order to achieve the above object, the electronic component conveying board is an electronic component conveying board having a first surface and a second surface on the reverse side of the first surface, and rotatably mounted on a conveying board support plate with the first surface facing the conveying board support plate, and further comprising: a bearing portion provided in a central portion; a plurality of electronic component accommodating holes that are arranged concentrically with the bearing portion and each penetrate from the first surface to the second surface; The embodiment may include a suction groove portion formed on the first surface, connected to the electronic component accommodating hole, and extending radially around a circle centered on the bearing portion, and a concave portion formed on the first surface and positioned between circumferentially adjacent electronic component accommodating holes among the plurality of electronic component accommodating holes.

[0010] In the electronic component transport board of the above configuration, the dimension of the recessed portion along the radial direction of a circle centered on the bearing portion can be greater than or equal to the dimension of the electronic component accommodating hole along the radial direction of a circle centered on the bearing portion.

[0011] Furthermore, in an electronic component transport panel of the above configuration, when the annular area drawn by connecting the electronic component accommodating holes arranged circumferentially in one of the concentric circles is defined as an accommodating hole arrangement area, the recessed portion can be arranged so that at least a portion of it overlaps with the accommodating hole arrangement area.

[0012] In the electronic component transport board having the above configuration, the recessed portion and the electronic component accommodation hole adjacent to the recessed portion in the circumferential direction may be spaced apart from each other by 0.1 mm or more in the circumferential direction.

[0013] Furthermore, in the electronic component transport panel having the above configuration, the recessed portion and the electronic component accommodating hole adjacent to the recessed portion in the circumferential direction may be separated from each other by a distance that is equal to or greater than 10% of the radial dimension of a circle centered on the bearing portion of the electronic component accommodating hole.

[0014] In the electronic component transport board having the above configuration, the shape of the recessed portion may be circular or polygonal.

[0015] In the electronic component transport board having the above configuration, the shape of the recessed portion may include a straight portion and a curved portion.

[0016] In the electronic component transport board having the above configuration, a plurality of the recessed portions may be provided between adjacent ones of the plurality of electronic component accommodating holes in the circumferential direction.

[0017] In the electronic component transport board having the above configuration, the shape of the concave portion may include a straight portion, and the straight portion may intersect with the direction of rotation of the electronic component transport board.

[0018] In the electronic component transport panel having the above configuration, the suction groove portion may include a first suction groove portion that is connected to one of the electronic component accommodating holes and extends radially outward, and a second suction groove portion that extends radially inward.

[0019] In the electronic component transport panel of the above configuration, the suction groove portion that is included in the plurality of electronic component accommodating holes and that communicates with the electronic component accommodating hole that is located radially inner among the electronic component accommodating holes that are adjacent in the radial direction can be configured to extend radially inward relative to the electronic component accommodating hole, and the suction groove portion that communicates with the electronic component accommodating hole that is located radially outer can be configured to extend radially outward relative to the electronic component accommodating hole.

[0020] In the electronic component transport board having the above configuration, the suction groove may be included in the plurality of electronic component accommodating holes and may communicate with both of the electronic component accommodating holes that are adjacent to each other in the radial direction.

[0021] In order to achieve the above object, an electronic component inspection device can be provided with the electronic component transport panel having the above configuration.

[0022] Furthermore, in order to achieve the above object, an electronic component inspection device includes a conveyor board support plate, a first surface, and a second surface behind the first surface, and is rotatably mounted on the conveyor board support plate with the first surface facing the conveyor board support plate, and includes a bearing portion provided in a central portion, a plurality of electronic component accommodating holes that are arranged on concentric circles of the bearing portion and each penetrate from the first surface to the second surface, suction groove portions formed in the first surface, communicating with the electronic component accommodating holes, and extending in a radial direction of a circle centered on the bearing portion, and a suction groove portion formed in the first surface and configured to circumferentially separate the electronic component accommodating holes from adjacent ones of the plurality of electronic component accommodating holes. an exhaust device that sucks air from within the suction groove portion via the conveying board support plate; an electronic component supply device that supplies electronic components to the electronic component accommodating holes on the rotational path of the electronic component conveying board; an electrical characteristic measuring device having an inspection unit that inspects the electronic components accommodated in the electronic component accommodating holes on the rotational path of the electronic component conveying board; and an electronic component recovery device that discharges and recovers the electronic components accommodated in the electronic component accommodating holes on the rotational path of the electronic component conveying board. [Effects of the Invention]

[0023] According to the present invention, it is possible to provide an electronic component transport panel and an electronic component inspection device that have good wear powder removal properties and can be manufactured at low cost. [Brief explanation of the drawings]

[0024] [Figure 1] FIG. 1 is a perspective view of an electronic component to be inspected by an electronic component inspection apparatus according to the first embodiment. [Figure 2] FIG. 2 is a schematic diagram of the electronic component inspection device according to the first embodiment. [Figure 3] FIG. 3 is a front view of an electronic component conveying board used in the electronic component inspection device of the first embodiment. [Figure 4] FIG. 4 is an explanatory diagram showing the arrangement of the supply unit, inspection unit, and discharge unit of the electronic component in the electronic component inspection apparatus of the first embodiment. [Figure 5] FIG. 5 is a front view of the carrier board support plate. [Figure 6] 6(A) and 6(B) are explanatory diagrams showing the schematic configuration of a supply unit for electronic components to an electronic component conveying board. [Figure 7] FIG. 7 is an explanatory diagram showing a schematic configuration of an inspection unit for the electronic components accommodated on the electronic component transport board. [Figure 8] FIG. 8 is an explanatory diagram showing a schematic configuration of a discharge section for electronic components accommodated on an electronic component transport board. [Figure 9] Fig. 9(A) is a cross-sectional view showing an electronic component conveying panel and a conveying panel support plate that supports the electronic component conveying panel, taken along a line corresponding to line AA in Fig. 3. Fig. 9(B) is a cross-sectional view showing an electronic component conveying panel and a conveying panel support plate that supports the electronic component conveying panel, taken along a line corresponding to line AA in Fig. 3. Fig. 9(C) is an explanatory diagram that schematically shows how foreign matter is collected in the recessed portion. [Figure 10] Fig. 10(A) is an explanatory diagram comparing the dimensions of the accommodating hole for the electronic component and the recessed portion, and Fig. 10(B) is a cross-sectional view showing the distance between the accommodating hole for the electronic component and the recessed portion. [Figure 11] 11(A) to 11(C) are explanatory diagrams illustrating the radial arrangement of the recessed portions. [Figure 12] 12(A) to 12(C) are explanatory diagrams illustrating the arrangement of recesses when a plurality of recesses are provided between the housings for electronic components. [Figure 13] Fig. 13(A) is an explanatory diagram showing a modified example in which the recessed portions are substantially square in shape, and Fig. 13(B) is an explanatory diagram showing a modified example in which the corners of the substantially square recessed portions are aligned in the circumferential direction. [Figure 14] FIG. 14 is an explanatory view illustrating the shapes and arrangements of the accommodation holes for electronic components and the suction grooves communicating with the accommodation holes according to the second embodiment. [Figure 15] FIG. 15 is an explanatory view illustrating the shapes and arrangements of the accommodation holes for electronic components and the suction grooves communicating with the accommodation holes according to the third embodiment. [Figure 16] FIG. 16 is an explanatory view illustrating the shapes and arrangements of the accommodation holes for electronic components and the suction grooves communicating with the accommodation holes according to the fourth embodiment. [Figure 17] 17(A) to 17(D) are explanatory diagrams illustrating variations of the recessed portion. [Figure 18] 18(A) and 18(B) are explanatory diagrams illustrating examples of the installation angles of the recessed portions. DETAILED DESCRIPTION OF THE INVENTION

[0025] Hereinafter, an embodiment of the present invention will be described with reference to the drawings.

[0026] (First embodiment) [Outline of electronic component inspection equipment] First, with reference to FIGS. 1 to 8, the schematic configuration of an electronic component inspection apparatus (hereinafter simply referred to as the "inspection apparatus") 10 according to the first embodiment will be described. FIG. 1 is a perspective view of an electronic component 1 to be inspected by the electronic component inspection apparatus 10 according to the first embodiment. FIG. 2 is a schematic configuration diagram of the inspection apparatus 10 according to the first embodiment. FIG. 3 is a front view of an electronic component conveyor board (hereinafter simply referred to as the "conveyor board") 21 used in the inspection apparatus 10 according to the first embodiment. FIG. 4 is an explanatory diagram showing the arrangement of a supply unit 50, an inspection unit 60, and a discharge unit 70 for electronic components 1 in the inspection apparatus 10 according to the first embodiment. FIG. 5 is a front view of a conveyor board support plate (hereinafter simply referred to as the "support plate") 30. FIGS. 6(A) and 6(B) are explanatory diagrams showing the schematic configuration of the supply unit 50 for electronic components 1 to the conveyor board 21. FIG. 7 is an explanatory diagram showing the schematic configuration of an inspection unit 60 for electronic components 1 accommodated on the conveyor board 21. FIG. 8 is an explanatory diagram showing a schematic configuration of a discharge section 70 for the electronic components 1 accommodated on the conveyor board 21. As shown in FIG.

[0027] Referring to FIG. 1 , the electronic component 1 is a chip component having a main body 2 and a pair of electrode portions 3 on both sides thereof. The electronic component of this embodiment is a multilayer ceramic electronic component. The multilayer ceramic electronic component of this embodiment is a multilayer ceramic capacitor, and the electrode portions 3 are external electrodes connected to internal electrode layers provided in the main body. The electronic component 1 is not limited to a multilayer ceramic capacitor, and may be, for example, a chip varistor, a chip inductor, or even a multilayer inductor. In short, it is sufficient that the electronic component has a configuration in which the electrode portions 3 are provided on both sides of the main body 2.

[0028] 2, the inspection device 10 includes a base 11, a control unit 12, and an exhaust device 13. The base 11 is provided with a conveying table 21 that rotates while storing electronic components 1 and conveys the electronic components 1. A support plate 30 shown in FIG. 5 is attached to the base 11. The support plate 30 is attached to the base 11 with a surface defined by the circumferential and radial directions inclined with respect to the vertical direction. The conveying table 21 is supported and attached to the base 11 in a rotatable state relative to the support plate 30, as shown in FIGS. 6(B) and 7, for example. Therefore, the conveying table 21 is also attached to the base 11 inclined with respect to the vertical direction. The inspection device 10 includes a supply unit 50, an inspection unit 60, and a discharge unit 70 for the electronic components 1.

[0029] <Outline of electronic component conveyor panel configuration> Referring to FIG. 3, the conveying board 21 has a bearing portion 22 in its central portion and is provided so as to be intermittently rotatable in the direction indicated by arrow 5a. The conveying board 21 is disk-shaped and has a first surface 21a and a second surface 21b that is the reverse side of the first surface 21a (see FIGS. 7 and 9). FIG. 3 shows the conveying board 21 as viewed from the first surface 21a side. As shown by enlarging portion X1 and then portion X2 in FIG. 3, the conveying board 21 has a plurality of electronic component accommodating holes (hereinafter simply referred to as "accommodating holes") 23. The accommodating holes 23 penetrate from the first surface 21a to the second surface 21b. The accommodating holes 23 are arranged concentrically around the bearing portion 22. In this embodiment, eight layers, i.e., eight rows, of the accommodating holes 23 are provided in the radial direction. The accommodating holes 23 in each layer are arranged along the circumferential direction. However, this arrangement is one example, and the number of layers of the accommodating holes 23 can be changed as appropriate, such as six layers or ten layers in the radial direction. The accommodating holes 23 are connected to suction grooves 24 that extend in the radial direction of a circle centered on the bearing portion 22. In this embodiment, the suction grooves 24 extend radially outward relative to the accommodating holes 23 with which they communicate, but the extending direction is not limited to this. The suction grooves 24 may, for example, extend radially inward relative to the accommodating holes 23 with which they communicate.

[0030] The first surface 21a of the conveying board 21 is provided with recesses 25 arranged between adjacent circumferentially adjacent ones of the plurality of accommodating holes 23. The recesses 25 have the function of scraping off and collecting foreign matter 27 that has entered between the conveying board 21 and the support plate 30. The foreign matter is abrasion powder generated when the conveying board 21, with electronic components 1 accommodated therein, rotates on the support plate 30. The recesses 25 will be described in detail later.

[0031] 2 and 4, the conveyor board 21 is provided with a supply unit 50, an inspection unit 60, and a discharge unit 70, which are offset in the main direction. The configurations of these units will be described later.

[0032] <Schematic configuration of the conveyor support plate> FIG. 5 shows the surface 30a of the support plate 30 facing the conveying board 21. The support plate 30 has multiple annular suction grooves 31 arranged concentrically around the rotation axis AX. As shown in an enlarged view of area X3 in FIG. 5, each annular suction groove 31 has suction holes 32 spaced at predetermined intervals. The suction holes 32 are connected to the exhaust device 13 and exhaust air from the annular suction groove 31. The annular suction groove 31 is arranged so as to overlap with the suction groove portion 24 formed on the first surface 21a of the conveying board 21 when the first surface 21a of the conveying board 21 faces the facing surface 30a of the support plate 30 and is brought into contact with the first surface 21a. This reduces the pressure inside the accommodation hole 23 through the suction holes 32, the annular suction groove 31, and the suction groove portion 24.

[0033] A drive unit 40 having a rotary shaft member 40a is provided on the support plate 30. The rotary shaft member 40a is attached to a bearing portion 22 provided on the conveying plate 21, and rotatably supports the conveying plate 21. The drive unit 40 intermittently rotates the conveying plate 21 under the control of the control unit 12.

[0034] <Supply section> The supply unit 50 includes a mechanism for supplying electronic components 1 to the storage holes 23 of the conveyor platen 21. The supply unit 50 is disposed on the rotation path of the conveyor platen 21. The supply unit 50 has an arc shape to match the shape of the conveyor platen 21. As shown in FIGS. 6(A) and 6(B), the interior of the supply unit 50 includes a plurality of supply chambers 50a separated radially by partition walls 50b. The supply chambers 50a are arranged along the circumferential arrangement of the storage holes 23. A storage unit 51 for the electronic components 1 is connected to the supply unit 50. An input unit 52 for the electronic components 1 is connected to the storage unit 51. The electronic components 1 input into the input unit 52 are temporarily stored in the storage unit 51 and then introduced into the supply unit 50. At this time, the electronic components 1 are distributed to the supply chambers 50a. As shown in Fig. 6(B), the electronic components 1 distributed to the supply chamber 50a are supplied into the accommodation hole 23 by reducing the pressure inside the accommodation hole 23 through the suction annular groove 31 and the suction groove portion 24. The supply portion 50, the storage portion 51, and the input portion 52 function as part of an electronic component supply device.

[0035] <Inspection Department> The inspection unit 60 includes a mechanism for inspecting the electrical characteristics of the electronic components 1 accommodated in the accommodation holes 23 of the conveyor board 21. The inspection unit 60 is disposed on the rotation path of the conveyor board 21. The inspection unit 60 is connected to an inspection control unit 63 provided on the base 11 via a wiring group 64. The inspection unit 60 and the inspection control unit 63 function as an electrical characteristic measuring device that inspects the electrical characteristics of the electronic components 1.

[0036] 7, the inspection unit 60 includes an electrode support unit 61. The electrode support unit 61 includes a movable terminal 62a that faces the accommodating hole 23. The movable terminal 62a is provided so as to be able to move in and out of the electronic component 1 accommodated in the accommodating hole 23. A fixed terminal 62b that pairs with the movable terminal 62a is provided on the support plate 30 via an insulator at a position corresponding to the inspection unit 60. The movable terminal 62a and the fixed terminal 62b are each electrically connected to the inspection control unit 63 via wiring included in a wiring group 64. With the movable terminal 62a in contact with one electrode portion 3 of one electronic component 1 and the fixed terminal 62b in contact with the other electrode portion 3, a predetermined inspection signal is applied to the electronic component 1, thereby inspecting the electrical characteristics of the electronic component 1. Then, an electronic component 1 that exhibits the predetermined electrical characteristics is selected.

[0037] <Discharge section> The discharge unit 70 has a function of sorting and discharging the electronic components 1 accommodated in the accommodation holes 23 of the conveyor board 21. The discharge unit 70 is arranged on the rotation path of the conveyor board 21. The discharge unit 70 is provided with discharge pipes 71 corresponding to the positions of the accommodation holes 23. The discharge pipes 71 are supported by a discharge pipe support unit 72. A recovery unit 73 for the electronic components 1 is provided downstream of the discharge pipes 71.

[0038] At a position of the support plate 30 corresponding to the discharge portion 70, an injection hole 76 is provided, corresponding to the position of the accommodation hole 23. One end of a compressed air supply pipe 75, the other end of which is connected to a compressed air generator 74, is connected to the injection hole 76. The compressed air generator 74 can supply compressed air to the desired compressed air supply pipe 75 as shown by arrow 5b, based on a control signal from the control unit 12. As a result, the desired electronic components 1 are blown into the discharge pipe 71 as shown by arrow 5c, and can be collected in a separated state in the collection unit 73. The discharge portion 70, the discharge pipe 71, the discharge pipe support portion 72, the collection unit 73, the compressed air generator 74, the compressed air supply pipe 75, and the injection hole 76 are included in the electronic component collection device.

[0039] <Details of the electronic component conveyor panel> Next, the conveying board 21 will be described in detail. First, referring to FIG. 10(A), the suction groove 24 is connected to the receiving hole 23. The receiving hole 23 is generally square. However, the four corners are rounded. The receiving hole 23 has an outer side 23a located radially outward and an inner side 23b located radially inward. The outer side 23a and the inner side 23b are straight lines that extend generally along the circumferential direction. Here, the circumferential center point of the outer side 23a is defined as the outer side center point 23a1. The circumferential center point of the inner side 23b is defined as the inner side center point 23b1. The direction connecting the outer side center point 23a1 and the inner side center point 23b1 is the radial direction. The suction groove 24 extends radially outward along the line connecting the outer side center point 23a1 and the inner side center point 23b1. That is, the suction groove portion 24 is connected to the outer side 23a.

[0040] FIG. 10A shows the radial dimensions of the receiving holes 23 and the recessed portions 25 when one circular recessed portion 25 is provided between circumferentially adjacent receiving holes 23. Here, if the radial dimension of the receiving holes 23 is Sp and the radial dimension of the recessed portions 25 is Sz, then Sz = Sp. Alternatively, the radial dimension Sz of the recessed portions 25 may be Sz > Sp. In other words, it is desirable that the radial dimension of the recessed portion be equal to or greater than the radial dimension of the receiving holes 23. The recessed portions 25 collect foreign matter 27, primarily consisting of wear particles generated when the conveying board 21 rotates on the support plate 30. The wear particles are, for example, plating residue from the electrodes 3 of the electronic components 1 accommodated in the receiving holes 23. Therefore, wear particles are likely to be generated in the receiving holes 23. Therefore, by making the radial dimension of recess 25 equal to or greater than the radial dimension of accommodation hole 23, foreign matter 27 can be effectively collected. By collecting foreign matter 27, the influence on the inspection of electronic component 1 can be mitigated, and clogging of electronic component 1 can be avoided.

[0041] Next, with reference to Fig. 10(B), the distance d along the circumferential direction between circumferentially adjacent receiving holes 23 and recessed portions 25 will be described. The distance d is desirably 0.1 mm or more. This is to ensure the strength of the wall separating the receiving holes 23 and the recessed portions 25. The distance d may be 10% or more of the radial dimension Sp of the receiving holes 23 (see Fig. 10(A)).

[0042] Next, the arrangement, number and shape of the recessed portions 25 will be described with reference to FIGS. 11(A) to 13(B).

[0043] 11(A) to 11(C), the receiving hole arrangement region 28 is shown by applying a mesh. Each receiving hole arrangement region 28 is an annular region, and multiple receiving hole arrangement regions 28 are set in a concentric pattern (only a portion of one receiving hole arrangement region 28 is shown in FIGS. 11(A) to 11(C)). The receiving holes 23 are arranged along the circumferential direction of the receiving hole arrangement region 28 so as to fit within the receiving hole arrangement region 28. In other words, the receiving hole arrangement region 28 is an annular region drawn by connecting the receiving holes arranged along the circumferential direction in one of the concentric circles. The outer boundary 28a of the receiving hole arrangement region 28 is drawn by connecting outer edge center points 23a1, which are the circumferential center points of the outer edges 23a of the receiving holes 23. The inner boundary 28b of the receiving hole arrangement region 28 is drawn by connecting inner edge center points 23b1, which are the circumferential center points of the inner edges 23b of the receiving holes 23.

[0044] In FIGS. 11(A) to 11(C), one recessed portion 25 is disposed between each pair of circumferentially adjacent receiving holes 23. In FIGS.

[0045] The recessed portion 25 is disposed so that at least a portion thereof overlaps with the receiving hole arrangement region 28. In other words, the recessed portion 25 is disposed so that at least a portion thereof overlaps with the receiving hole arrangement region 28.

[0046] When the relationship between the radial dimension Sz of the concave portion 25 and the radial dimension Sp of the accommodation hole 23 (both refer to FIG. 10(A)) is Sp = Sz, the concave portion 25 can be arranged so as to contact the outer boundary line 28a and the inner boundary line 28b.

[0047] Also, as shown in FIG. 11(A), the concave portion 25 may be arranged with a shift to the outside in the radial direction. Further, as shown in FIG. 11(B), the concave portion 25 may be arranged with a shift to the inside in the radial direction.

[0048] As described above, the relationship between the radial dimension Sz of the concave portion 25 and the radial dimension Sp of the accommodation hole 23 (both refer to FIG. 10(A)) can be Sz > Sp. In this case, as shown in FIG. 11(C), the concave portion 25 can be arranged so as to straddle the outer boundary line 28a and the inner boundary line 28b.

[0049] By arranging in such a manner, the concave portion 25 can effectively collect the foreign matter 27.

[0050] Next, referring to FIGS. 12(A) to 12(C), two concave portions 25 are arranged between the accommodation holes 23 adjacent to each other in the circumferential direction. The number of concave portions 25 arranged between the accommodation holes 23 adjacent to each other in the circumferential direction may be three or more. The relationship between the radial dimension Sz of the concave portion 25 and the radial dimension Sp of the accommodation hole 23 (both refer to FIG. 10(A)) shown in FIGS. 12(A) to 12(C) is Sz < Sp. As described above, it is desirable that the relationship between the dimension Sz and the dimension Sp is Sz ≧ Sp, but this relationship does not necessarily have to be satisfied. In particular, as shown in FIGS. 12(A) to 12(C), when there are a plurality of concave portions 25 arranged between the accommodation holes 23 adjacent to each other in the circumferential direction, it may be Sz < Sp.

[0051] As shown in FIG. 12(A), the recessed portions 25 may be arranged so that all of them fit within the receiving hole arrangement region 28. Furthermore, as shown in FIGS. 12(B) and 12(C), two recessed portions 25 arranged between circumferentially adjacent receiving holes 23 may be arranged so that they are offset radially inward and outward. In FIGS. 12(B) and 12(C), the rotation direction of the conveying platen 21 is indicated by arrow 5d. As shown in FIG. 12(B), the two recessed portions 25 may be arranged so that the recessed portion 25 located upstream in the rotation direction of the conveying platen 21 is offset outward, and the recessed portion 25 located downstream in the rotation direction of the conveying platen 21 is offset inward. As shown in FIG. 12(C), the two recessed portions 25 may be arranged so that the recessed portion 25 located upstream in the rotation direction of the conveying platen 21 is offset inward, and the recessed portion 25 located downstream in the rotation direction of the conveying platen 21 is offset outward.

[0052] The circumferential spacing of the accommodating holes 23 included in the accommodating hole arrangement regions 28 set corresponding to the innermost concentric circles becomes narrower. Therefore, the dimensions, arrangement, and number of the recessed portions 25 may differ for each of the accommodating hole arrangement regions 28 that are located at different radial positions.

[0053] 13(A), a roughly square recess 80 is formed in place of the circular recess 25. However, the four corners are rounded. Even with this recess 80, foreign matter 27 can be scraped off and collected.

[0054] Next, referring to FIG. 13(B), a generally square recessed portion 81 is arranged. Comparing the recessed portion 81 with the recessed portion 80 shown in FIG. 13(A), the arrangement angle is different. Arrow 5e shown in FIG. 13(B) indicates the rotation direction of the conveyor board 21. Arrow 5f indicates a generally radial direction. The edge 81a of the recessed portion 81 intersects the rotation direction indicated by arrow 5e and the radial direction indicated by arrow 5f. The edge 81a corresponds to a straight portion. As a result, when the conveyor board 21 rotates in the direction indicated by arrow 5e, the edge 81a, which has a different angle relative to the rotation direction, can scrape off the foreign matter 27. Note that the recessed portion 81 is arranged at an angle of approximately 45° relative to the recessed portion 80, but the angle of inclination can be set as appropriate. The recessed portion 80 and the recessed portion 81 may also be used in combination.

[0055] (Second embodiment) Next, a second embodiment will be described with reference to FIG. 14. Similar to the first embodiment, the second embodiment includes a recess 25 between circumferentially adjacent accommodating holes 23. In the second embodiment, in addition to the first suction groove 24, a second suction groove 124 is provided. The first suction groove 24 and the second suction groove 124 each communicate with one accommodating hole 23. The first suction groove 24 corresponds to the suction groove 24 in the first embodiment and extends radially outward. The second suction groove 124 extends radially inward.

[0056] The first suction groove portion 24 and the second suction groove portion 124 are provided so as to overlap with the annular suction groove 31 provided in the support plate 30. As a result, the accommodating hole 23 is sucked from both the first suction groove portion 24 and the second suction groove portion 124. As a result, the position of the electronic component 1 in the accommodating hole 23 is not fixed, and the area of ​​adhesion of the foreign matter 27 is also dispersed. As a result, it is thought that the amount of adhesion of the foreign matter 27 per unit area is reduced. If the amount of adhesion of the foreign matter 27 per unit area is reduced, the impact on the measurement accuracy of the inspection unit 60 can be alleviated. Furthermore, if the amount of adhesion of the foreign matter 27 per unit area is reduced, it becomes easier for the recessed portion 25 to scrape off the foreign matter 27.

[0057] (Third embodiment) Next, a third embodiment will be described with reference to Fig. 15. Similar to the first example, the third embodiment includes a recessed portion 25 between the receiving holes 23 adjacent to each other in the circumferential direction.

[0058] In the third embodiment, attention is focused on the accommodating holes 23 that are included in the plurality of accommodating holes and are adjacent in the radial direction. Of the accommodating holes 23 that are adjacent in the radial direction, the suction groove portion 224 that communicates with the accommodating hole 23 that is located on the radially inner side extends radially inward. Of the accommodating holes 23 that are adjacent in the radial direction, the suction groove portion 24 that communicates with the accommodating hole 23 that is located on the radially outer side extends radially outward.

[0059] Of the accommodating holes 23 adjacent in the radial direction, the accommodating hole 23 located on the radially outer side is connected to the suction groove portion 24 that extends radially outward, similar to the accommodating holes 23 in the first embodiment. In other words, in the third embodiment, the suction groove portions that communicate with the accommodating holes 23 adjacent in the radial direction extend in different directions.

[0060] Although not shown in Fig. 15, the suction groove 24 communicates with the suction hole 32 that is arranged radially inward of the suction groove 224 by one concentric circle. That is, the suction groove 224 and the suction groove 24 face each other in the radial direction. Also, the suction groove 224 communicates with the suction hole 32 that is arranged radially outward of the suction groove 24 by one concentric circle. That is, the suction groove 24 and the suction groove 224 face each other in the radial direction.

[0061] The recessed portions 25 arranged circumferentially alongside the accommodating holes 23 with which the suction grooves 224 communicate are in contact with the outer boundary line 28a of the accommodating hole arrangement region 28 and are shifted inward as shown by arrow 5g so as to straddle the inner boundary line 28b. On the other hand, the recessed portions 25 arranged circumferentially alongside the accommodating holes 23 with which the suction grooves 24 communicate are in contact with the inner boundary line 28b of the accommodating hole arrangement region 28 and are shifted inward as shown by arrow 5h so as to straddle the outer boundary line 28a.

[0062] (Fourth embodiment) Next, a fourth embodiment will be described with reference to Fig. 16. The fourth embodiment includes a suction groove 324 instead of the suction groove 24 in the first embodiment. The suction groove 324 communicates with both of the diametrically adjacent accommodating holes 23. The suction groove 324 is arranged so as to overlap with the annular suction groove 31 provided in the support plate 30 (see Fig. 5).

[0063] Since one suction groove portion 324 is connected to two accommodation holes 23, the conveyor board 21 can be made compact in configuration.

[0064] <Modification> Next, modified examples of the recessed portion will be described with reference to Figures 17(A) to 18(B). The recessed portion may be circular or polygonal like the recessed portion 25 and recessed portion 80 described above, but various other shapes can also be adopted. First, recessed portion 82 shown in Figure 17(A) has a straight portion 82a and a curved portion 82b. By having straight portion 82a and curved portion 82b, foreign matter 27 (see Figure 9(C) etc.) can be efficiently scraped off when conveyor board 21 rotates as indicated by arrow 5e. Curved portion 82b has a hemispherical shape, and scraped-off foreign matter 27 can be collected in this hemispherical portion.

[0065] The recessed portion 83 shown in Fig. 17(B) has a straight portion 83a and a curved portion 83b, and has an overall water drop shape. In the example shown in Fig. 17(B), the curved portion 83b with a large radius is located upstream in the direction of rotation of the conveying board 21, but the curved portion 83b may be positioned downstream in the direction of rotation. Also, as shown in Figs. 18(A) and 18(B), the recessed portion 83 may be positioned at a different angle relative to the direction of rotation. The angle of the arrangement can be set as appropriate.

[0066] The recessed portion 84 shown in FIG. 17(C) is roughly triangular. In the example shown in FIG. 17(C), two of the three sides are arranged so as to intersect with the direction of rotation. This allows foreign matter 27 to be effectively scraped off. A triangle, along with a square, i.e., a quadrilateral, is a type of polygon. In this way, the recessed portion can be polygonal, and may be, for example, pentagonal or more.

[0067] 17(D) includes a polygonal portion 85a. The polygonal portion 85a is located upstream in the direction of rotation. This allows the polygonal portion 85a to effectively scrape off the foreign matter 27.

[0068] [effect] According to each of the above-described embodiments, by providing recesses arranged between circumferentially adjacent receiving holes 23, foreign matter 27 such as wear powder can be effectively removed. Moreover, since the recesses are provided independently of each other, strength is high. Furthermore, since the conveying board 21 does not require long-distance groove machining, wear on cutting tools can be reduced and it can be manufactured at low cost.

[0069] By making the radial dimension of the recessed portion 25 equal to or greater than the radial dimension of the receiving hole 23, the foreign matter 27 can be effectively scraped off and removed.

[0070] The recessed portion is arranged so that at least a part of it overlaps within the receiving hole arrangement area, so that the foreign matter 27 can be effectively scraped off and removed.

[0071] The strength of the conveying board 21 can be increased by configuring the recessed portion and the accommodating hole 23 adjacent to the recessed portion in the circumferential direction to be spaced apart by 0.1 mm or more in the circumferential direction.

[0072] The strength of the conveying board 21 can be increased by arranging the recessed portion and the adjacent storage hole 23 circumferentially at a distance that is at least 10% of the radial dimension of the storage hole 23 along the circumferential direction.

[0073] The recessed portion can effectively remove the foreign matter 27 by devising various shapes thereof.

[0074] The above-described embodiments are merely examples for implementing the present invention, and the present invention is not limited to these. Various modifications of these embodiments are within the scope of the present invention. Furthermore, it is obvious from the above description that various other embodiments are possible within the scope of the present invention. [Explanation of symbols]

[0075] 1 Electronic component, 2 Main body, 3 Electrode section, 10 Electronic component inspection device, 11 Base, 21 Electronic component conveying board, 21a First surface, 21b Second surface, 22 Bearing section, 23 Accommodating hole, 23a Outer edge, 23a1 Outer edge center point, 23b Inner edge, 23b1 Inner edge center point, 24, 224 Suction groove section, 25 Concave section, 27 Foreign matter, 28 Accommodating hole arrangement area, 28a Outer boundary line, 28b Inner boundary line, 30 Conveying board support plate, 30a Opposing surface, 31 Suction annular groove, 32 Suction hole, 50 Supply section, 50a Supply chamber, 50b Partition wall, 51 Storage section, 52 Input section, 60 Inspection section, 70 Discharge section, 71 Discharge pipe, 72 Discharge pipe support section, 73 Recovery section, 74 Compressed air generating section, 75 compressed air supply pipe, 76 injection hole, 124 second suction groove section

Claims

1. An electronic component conveying board having a first surface and a second surface on the reverse side of the first surface, the electronic component conveying board being rotatably mounted on a conveying board support plate with the first surface facing the conveying board support plate, a bearing portion provided in the center; a plurality of electronic component accommodating holes arranged concentrically with the bearing portion and each penetrating from the first surface to the second surface; a suction groove formed on the first surface, communicating with the electronic component accommodating hole, and extending along a radial direction of a circle centered on the bearing portion; a recessed portion formed in the first surface and disposed between adjacent ones of the plurality of electronic component accommodating holes in a circumferential direction; Equipped with Electronic component transport panel.

2. 2. The electronic component conveying board according to claim 1, The recessed portion has a radial dimension that is equal to or greater than the radial dimension of the electronic component accommodating hole that is centered on the bearing portion. Electronic component transport panel.

3. 2. The electronic component conveying board according to claim 1, When an annular region drawn by connecting the electronic component accommodating holes arranged along the circumferential direction in one of the concentric circles is defined as an accommodating hole arrangement region, the recessed portion is arranged so that at least a portion of the recessed portion overlaps the accommodating hole arrangement region. Electronic component transport panel.

4. 2. The electronic component conveying board according to claim 1, The recessed portion and the electronic component accommodating hole adjacent to the recessed portion in the circumferential direction are spaced apart from each other by 0.1 mm or more in the circumferential direction. Electronic component transport panel.

5. 2. The electronic component conveying board according to claim 1, The recessed portion and the electronic component accommodating hole adjacent to the recessed portion in the circumferential direction are spaced apart from each other along the circumferential direction by a value equal to or greater than 10% of the dimension along the radial direction of a circle centered on the bearing portion of the electronic component accommodating hole. Electronic component transport panel.

6. 2. The electronic component conveying board according to claim 1, The shape of the recessed portion is circular or polygonal. Electronic component transport panel.

7. 2. The electronic component conveying board according to claim 1, The shape of the recessed portion includes a straight portion and a curved portion. Electronic component transport panel.

8. 2. The electronic component conveying board according to claim 1, The recessed portions are provided between adjacent ones of the plurality of electronic component accommodating holes in the circumferential direction. Electronic component transport panel.

9. 2. The electronic component conveying board according to claim 1, The shape of the recessed portion includes a straight portion, and the straight portion intersects with the rotation direction of the electronic component conveying board. Electronic component transport panel.

10. 2. The electronic component conveying board according to claim 1, The suction grooves each communicate with one of the electronic component accommodating holes and include a first suction groove extending radially outward and a second suction groove extending radially inward. Electronic component transport panel.

11. 2. The electronic component conveying board according to claim 1, Among the electronic component accommodating holes that are included in the plurality of electronic component accommodating holes and that are adjacent in the radial direction, the suction groove portion that communicates with the electronic component accommodating hole that is located on the radially inner side extends radially inward with respect to the electronic component accommodating hole, and the suction groove portion that communicates with the electronic component accommodating hole that is located on the radially outer side extends radially outward with respect to the electronic component accommodating hole. Electronic component transport panel.

12. 2. The electronic component conveying board according to claim 1, The suction groove is included in the plurality of electronic component accommodating holes and communicates with both of the electronic component accommodating holes adjacent to each other in the radial direction. Electronic component transport panel.

13. An electronic component conveying board according to claim 1 is provided. Electronic component inspection equipment.

14. A conveyor board support plate; an electronic component transport board having a first surface and a second surface behind the first surface, rotatably mounted on the transport board support plate with the first surface facing the transport board support plate, the electronic component transport board comprising: a bearing portion provided in a central portion; a plurality of electronic component accommodating holes arranged on concentric circles of the bearing portion, each penetrating from the first surface to the second surface; suction groove portions formed in the first surface, communicating with the electronic component accommodating holes, and extending in a radial direction of a circle centered on the bearing portion; and recessed portions formed in the first surface, arranged between adjacent electronic component accommodating holes in the circumferential direction among the plurality of electronic component accommodating holes; an exhaust device that sucks air from within the suction groove portion through the conveyor board support plate; an electronic component supply device that supplies electronic components to the electronic component accommodating holes on the rotation path of the electronic component conveying board; an electrical characteristic measuring device having an inspection unit that inspects the electronic components accommodated in the electronic component accommodation holes on the rotation path of the electronic component transport board; an electronic component recovery device that discharges and recovers the electronic components accommodated in the electronic component accommodation holes onto a rotation path of the electronic component transport board; Equipped with Electronic component inspection equipment.

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