Electronic device

Abstract

To provide an electronic apparatus excellent in portability. A highly browsable electronic device is provided. Another object is to provide an electronic device including a novel light source that can be used when a photograph or a moving image is taken.SOLUTION: An electronic device comprising a camera and a flexible display portion, wherein the display portion comprises a first region and a second region, the first region is configured to emit light to an object of the camera, the second region is configured to display an image of the object taken by the camera, and the display portion is configured to be bent such that the first region and the second region are oriented in different directions.SELECTED DRAWING: Figure 1

Description

[Technical Field]

[0001] One aspect of the present invention relates to a display device. In particular, the display device has flexibility and can be bent. Further, one embodiment of the present invention relates to an electronic device including a display device.

[0002] Note that one embodiment of the present invention is not limited to the above technical fields. The technical field of one aspect relates to an article, a method, or a manufacturing method. One aspect of the present invention is a process, machine, manufacture, or composition. Therefore, the invention disclosed herein more specifically relates to The technical field of one embodiment of the present invention is a semiconductor device, a display device, a light-emitting device, a lighting device, a power storage device, Examples include storage devices, methods for driving them, and methods for manufacturing them. Cut. [Background technology]

[0003] In recent years, display devices have been expected to be used in a variety of applications, and are becoming increasingly diverse. For example, display devices used in portable electronic devices must be thin and lightweight. There is also a demand for new applications that have not been seen before. are.

[0004] In addition, Patent Document 1 discloses a film substrate on which transistors and other elements serving as switching elements are mounted. A flexible active matrix light emitting device having an organic EL element is disclosed. . [Prior art documents] [Patent documents]

[0005] [Patent Document 1] Japanese Patent Application Laid-Open No. 2003-174153 Summary of the Invention [Problem to be solved by the invention]

[0006] In recent years, the amount of information displayed has increased by enlarging the display area of ​​the display device, and the list of displayed information has On the other hand, for mobile device applications, the display area needs to be enlarged. If the number of pages is increased, portability will decrease. It has been difficult to achieve both high performance and high portability.

[0007] In addition, cameras are installed in electronic devices such as mobile information terminals, allowing users to easily take photos and videos. There is also a demand for higher brightness and lower power consumption of the light source that illuminates the subject. It is being done.

[0008] An object of one embodiment of the present invention is to provide an electronic device with excellent portability. It is an object of the present invention to provide an electronic device with excellent visibility. One object of the present invention is to provide an electronic device equipped with a new light source that can be used occasionally. Another object is to provide a novel display device, lighting device, or electronic device.

[0009] The description of these problems does not preclude the existence of other problems. It is not necessary to solve all of these problems. It will be clear from the description of the specification, etc. that there are other problems than those mentioned above. It is possible to extract it. [Means for solving the problem]

[0010] One embodiment of the present invention is an electronic device including a camera and a flexible display portion, The display unit has a first area and a second area, and the first area emits light to a subject of the camera. The second area has a function of displaying an image of a subject taken by a camera. The display unit has a function of bending so that the first area and the second area are oriented in different directions. It is an electronic device with the following functions.

[0011] Another embodiment of the present invention is a display device including a housing, a camera, and a flexible display portion. An electronic device, wherein the display unit has an area fixed to a first surface of a housing, and the camera has: The display unit has a region fixed to the second surface of the housing, and the display unit has a first region and a second region. The first area has a function of emitting light to a subject of the camera, and the second area has a function of detecting light by the camera. The display unit has a function of displaying an image of a subject photographed by the camera, and the display unit has a first area and a second area. It is an electronic device that has the function of bending so that the two regions are oriented in different directions.

[0012] The housing has a third surface, the third surface having an area in contact with the first surface, and a display It is preferable that the portion has a region provided along the third surface. It is preferable that the display unit has a recess, and the recess has a function of folding and storing the display unit.

[0013] The display unit has a first pixel and a second pixel, and the first pixel is a first light-emitting element. the second pixel has a second light-emitting element, and a third pixel is disposed between the first pixel and the second pixel. It is preferable that the first pixel and the second pixel have three light-emitting elements. The third light-emitting element has a function of being controlled by a passive matrix drive. It is preferable that the function be controlled by a switch drive.

[0014] The display unit has a third area and a fourth area, and the third area is The fourth region has a region provided along the contour of the third region. The fourth region preferably has a fourth light-emitting element. and wiring, and both or either one of the circuit and the wiring and the fourth light-emitting element are mutually Preferably, the third region has an area overlapping the active matrix. The fourth region has a function controlled by a passive matrix drive. It is preferable that the function be such that [Effects of the Invention]

[0015] According to one aspect of the present invention, an electronic device with excellent portability can be provided. Or, new light that can be used when taking photos or videos can be developed. An electronic device can be provided that includes a source. [Brief explanation of the drawings]

[0016] [Figure 1] 1A to 1C are diagrams illustrating examples of electronic devices according to an embodiment. [Figure 2] 1A to 1C are diagrams illustrating examples of electronic devices according to an embodiment. [Figure 3] 1A to 1C are diagrams illustrating examples of electronic devices according to an embodiment. [Figure 4] 1A to 1C are diagrams illustrating examples of electronic devices according to an embodiment. [Figure 5] 1A to 1C are diagrams illustrating examples of electronic devices according to an embodiment. [Figure 6] FIG. 2 is a diagram showing an example of a display unit according to an embodiment. [Figure 7] FIG. 10 is a diagram showing an example of a display area according to an embodiment. [Figure 8] 1A and 1B are diagrams illustrating examples of light-emitting panels according to an embodiment. [Figure 9] 1A and 1B are diagrams illustrating examples of light-emitting panels according to an embodiment. [Figure 10] 1A to 1C illustrate an example of a method for manufacturing a light-emitting panel according to an embodiment. [Figure 11] 1A to 1C illustrate an example of a method for manufacturing a light-emitting panel according to an embodiment. [Figure 12] FIG. 1 is a diagram showing an example of a touch panel according to an embodiment. [Figure 13] FIG. 1 is a diagram showing an example of a touch panel according to an embodiment. [Figure 14] FIG. 1 is a diagram showing an example of a touch panel according to an embodiment. [Figure 15] FIG. 1 is a diagram showing an example of a touch panel according to an embodiment. DETAILED DESCRIPTION OF THE INVENTION

[0017] The embodiments will be described in detail with reference to the drawings. However, the present invention is not limited to the following description. The present invention is not limited to the above embodiments, and various changes and modifications may be made in form and detail without departing from the spirit and scope of the present invention. Therefore, the present invention is based on the following embodiments. The present disclosure should not be construed as being limited to the contents of the preceding paragraph.

[0018] In the configuration of the invention described below, the same parts or parts having similar functions are The same reference numerals are used in common between different drawings, and repeated explanations thereof will be omitted. When referring to a function, the hatch pattern may be the same and no particular symbol may be assigned.

[0019] In each figure described in this specification, the size, layer thickness, or area of ​​each component is The figures may be exaggerated for clarity and are not necessarily limited to that scale. stomach.

[0020] In this specification, ordinal numbers such as "first" and "second" are used to avoid confusion of components. The number is not a numerical limitation.

[0021] (Embodiment 1) In this embodiment, a configuration example of an electronic device according to one embodiment of the present invention will be described.

[0022] [Example of electronic device configuration] 1A to 1E show an electronic device 100 exemplified below. 1(B) and 1(C) show a state in which the display unit 101 of the device 100 is unfolded. ) shows the state in which the display unit 101 of the electronic device 100 is folded. 1(D) and 1(E) show an example of the state in which the electronic device 100 is used.

[0023] The electronic device 100 includes a display unit 101 and a housing 102 .

[0024] The display unit 101 is flexible. The display unit 101 is fixed to a housing 102. The display unit 101 has a display area 103 for displaying an image. , and a non-display area 104 surrounding the display area 103.

[0025] The housing 102 has a camera 105 on its surface. 10 shows a case where a camera 105 is provided on the surface opposite to the surface on which the sensor is fixed.

[0026] In the electronic device 100 according to one embodiment of the present invention, a part of the flexible display unit 101 is mounted on the housing 10. The display unit 101 can be deformed by bending or the like. For example, the display unit 101 can be bent so that the display surface faces inward (inward bending), or It is possible to bend the display surface outward (outward bending). The term "foldable" refers to the surface on which an image is displayed. The electronic device 100 according to one embodiment of the present invention is portable when the display portion 101 is folded. When unfolded, the seamless, large display area provides excellent visibility of the display.

[0027] The housing 102 also has a recess in which the display unit 101 can be stored in a folded state. By providing such a recess, the display unit 101 can be easily folded. Therefore, it is possible to eliminate or reduce the protruding parts from the electronic device 10. This can prevent the display unit 101 from being damaged when carrying the device. This is suitable for carrying the electronic device 100 in a pocket or bag.

[0028] When using the electronic device 100 according to one embodiment of the present invention, the display unit 101 is in an unfolded state. The entire seamless display area 103 may be used, or the display surface of the display unit 101 may be By bending the display unit 101 so that it faces the side, a part of the display area 103 may be used. When the display surface of the display device is folded inward, a part of the display area 103 that is not visible to the user is hidden. This makes it possible to reduce the power consumption of the display unit 101.

[0029] The display area 103 of the display unit 101 is configured to have a predetermined aspect ratio when unfolded. For example, the aspect ratio should be set to 9:16. When the display unit 101 is folded (for example, as shown in FIG. 1B), It is preferable to set the aspect ratio to a value close to that of the image. It is possible to make the aspect ratio of the displayed image approximately the same when the screen is closed and when it is folded. As a result, the entire display area 103 that is visible in both the unfolded state and the folded state is the same. When enlarging or reducing an image, unnatural white space may appear in either state. Or, to prevent the image from being distorted due to different enlargement or reduction ratios between the vertical and horizontal directions. It is possible.

[0030] Moreover, it is preferable that the display unit 101 is provided on two or more surfaces of the housing 102. FIG. 1 shows a case where a display unit 101 is provided along one side surface of a housing 102. At this time, one image is displayed on the entire display area 103 including the part provided on the side of the housing 102. In addition, a part of the display area 103 provided on the side of the housing 102 may display an image. Notify you of incoming emails, SNS (social networking services), phone calls, etc. Display of the message, subject of email or SNS, sender name of email or SNS, etc. It can display various information such as date, time, remaining battery power, and antenna reception strength. Alternatively, images having functions such as operation buttons, icons, sliders, etc. may be displayed.

[0031] 1(D) and (E) show an example in which a camera 105 is used to take a photograph.

[0032] Here, a part of the display area 103 of the display unit 101 is designated as an area 1 which functions as a light source during photography. As shown in FIGS. 1(D) and 1(E), a part of the display unit 101 The light is emitted from the area 111 while being turned back toward the photographing direction of the camera 105. This allows you to brightly illuminate the subject.

[0033] The area 111 functions as a surface light source, and thus has the effect of blurring shadows when photographing a subject. When using a point light source such as an LED or flash lamp, the shadows are emphasized too much. However, by using the light emitted from the area 111, it is possible to capture an image with a soft impression. This becomes possible.

[0034] In addition, power consumption is extremely low compared to when a xenon light source is used to illuminate the subject. Therefore, when using a xenon light source, etc., a separate light source is required. There is no need to install a battery. In addition, the size of the area 111 can be freely set by the user. It is preferable that the area of ​​the region 111 is made larger so that the light of the same brightness can be emitted. This makes it possible to reduce the power consumption required to generate the signal.

[0035] When the area 111 is used as a light source, for example, the same color is displayed across the area 111. For example, white may be displayed over the entire area 111. Alternatively, warm white, daylight white, or daylight white may be displayed. Even if you assume a color temperature such as light color and display white with a color temperature in the range of 2000K to 8000K, Since the area 111 is a part of the display unit 101, light of various colors can be used as a light source. Alternatively, a single color other than white, such as red, blue, green, or yellow, may be displayed across the area 111. Good too.

[0036] Alternatively, the area 111 may be divided into two or more parts, and each part may be displayed in a different color. Alternatively, the color may be changed continuously across the area 111 (also called a gradation). A display may be made.

[0037] Furthermore, the light emitted from the area 111 may be emitted in accordance with the timing of the photographing, or may be emitted simultaneously. It may be set to flash continuously for a fixed period of time. When shooting video, it is recommended to keep the flash on at all times. preferable.

[0038] Also, as shown in FIG. 1(E), the area 112 of the unfolded portion of the display area 103 At this time, the photographed image displayed in the area 112 can be displayed in its vertical and horizontal directions. It is preferable to display the ratio as a predetermined value, for example, 3:4. The user can take a photograph while viewing the image displayed in the area 112. The intensity of the light emitted from the region 111 and the area of ​​the region 111 can also be adjusted.

[0039] Additionally, area 113 of display area 103 can display shooting information for photos and videos. 13 may be placed near the area 112, and may be placed above, below, to the right, or to the left of the area 112. Alternatively, the area 112 and the area 113 may be overlapped. The shooting information that can be displayed in the area 113 includes aperture value, shutter speed, In addition to information such as photo speed, ISO sensitivity, and focal length, exposure compensation and filter settings are also included. , information such as the image quality, resolution, size, and number of gradations of the captured image, and the currently set shooting mode Display information such as macro mode, night view mode, backlight mode, auto mode, etc. can be done.

[0040] [Other examples of electronic device configurations] In FIG. 1, the display unit 101 is shown extending to the side surface of the housing 102. It may be provided so as to extend to the surface of the housing 102 on which the camera 105 is disposed.

[0041] In FIG. 2A, the display extends to the rear side of the housing 102 (the side where the camera 105 is located). In this example, the display unit 101 is provided in an extended manner. In the portion provided along the back surface of the device 2, a part of the area functions as the area 111. In addition to the folded portion of the display unit 101, the portion along the back surface of the housing 102 is preferably By using the LED as a light source during photography, the brightness of the light can be increased. The area of ​​the area 111 is increased, so it is possible to improve the effect of blurring the shadows created by the subject. It becomes Noh.

[0042] 2A, a light source 106 may be separately disposed in the housing 102. For example, an LED may be used as 106. This allows the light source to be selected according to the application. can be used interchangeably.

[0043] As shown in FIG. 2B, a display unit 101 is provided along the rear surface of the housing 102. An opening may be provided in the portion overlapping with the camera 105. By surrounding the periphery of 05 with the area 111, even if the subject is very close, This makes it possible to suitably illuminate the subject.

[0044] 3A and 3B, the non-display area 101 surrounding the display area 103 of the display unit 101 is 4, a light emitting area 114 that functions as a light source during photography is disposed. The light emitting area 114 is provided along the outline of the display area 103 .

[0045] The light emitting area 114 may be arranged to overlap a part of the non-display area 104, or may be arranged to overlap the non-display area 104. They may be arranged over the entire area 104. Also, as shown in FIG. When a part of the unit 101 is provided extending on the rear side of the housing 102, The light emitting area 114 may be disposed in part or all of the non-display area 104 provided along the stomach.

[0046] The light-emitting region 114 has a light-emitting element. The light-emitting element is provided in the display region 103. It is preferable that the light emitting region 114 is formed in the same process as the light emitting element. A circuit for driving a plurality of pixels in the display area 103, or a circuit for driving a plurality of pixels and a It is preferable that the wiring is provided so as to overlap with the wiring that is connected to the wiring.

[0047] A configuration in which a plurality of light-emitting elements are provided in the light-emitting region 114 and can be made to emit light individually. Preferably, each light-emitting element is controlled by a passive matrix drive. It is preferable that one light emitting element is provided across the light emitting region 114. However, by individually controlling the light emission, only the area facing the shooting direction of the camera 105 is illuminated. This is preferable because it can

[0048] In addition, the plurality of pixels provided in the display area 103 are controlled by active matrix driving. The light-emitting elements provided in the light-emitting region 114 are controlled by passive matrix driving. By setting the drive system individually in this way, it is possible to The supply of power supply potential for driving the light emitting region 114 can be cut off, thereby reducing power consumption. Furthermore, when taking a photograph, the image to be displayed in the display area 103 (for example, the photographed image) can be reduced. The display quality of the light-emitting area 114 can be improved by driving it as needed. For example, when the amount of light from the area 111 is sufficient for photography, the light emitting area 114 is It is also possible to prevent the motor from being driven.

[0049] In addition, a voltage for causing the light emitting elements in the light emitting area 114 to emit light is applied to the image in the display area 103. For example, the voltage applied to the light-emitting region 11 may be different from the voltage applied to the light-emitting element of the light-emitting region 11. By setting a high voltage to make the light emitting elements in the light emitting region 114 emit light, The brightness of the light from the area 111 can be increased to be higher than the brightness of the light from the area 112. By emitting light at a higher intensity, it is possible to irradiate the subject with light of a higher brightness.

[0050] The housing 102 contains a battery, a processor, a drive circuit, and other ICs. Various sensors including printed wiring boards, wireless receivers, wireless transmitters, wireless power receivers, and acceleration sensors By appropriately incorporating electronic components such as a sensor, the electronic device 100 can be used as a mobile terminal, a mobile display device, etc. The housing 102 can function as an image reproducing device, a portable lighting device, etc. , camera, speaker, various input / output terminals including power supply terminal, various sensors including optical sensors, etc. It may also incorporate sensors, operation buttons, etc.

[0051] Here, the electronic device 100 described above has been shown to have a configuration including one housing 102, but it may also have two or more housings. 4(A) to 4(D) show electronic devices 15 each having three housings. 0 configuration example is shown.

[0052] 4A shows the electronic device 150 in an unfolded state. 4(C) shows the display unit 10 in a folded state. 4(A) and 4(B) show the case where a part of the 1 is directed. 1 shows a schematic cross-sectional view of the

[0053] The electronic device 150 includes three housings (housings 102a, 102b, and 102c). The display unit 101 is held by the hinge 151. The display unit 101 can be bent inward or outward via the connector 51 .

[0054] At least one of the housings 102a, 102b, and 102c is provided with the electronic device described above. At this time, each electronic component can be installed in one of the multiple housings. The devices may be provided in a concentrated manner, or may be provided in a distributed manner in multiple housings, with the housings connected via hinges 151. The electronic components in the multiple housings may be electrically connected by connecting wires or the like. By distributing the electronic components among multiple housings, it is possible to reduce the thickness of each housing.

[0055] As shown in FIG. 4(D), a battery 152 may be incorporated into each of the multiple housings. By providing a battery 152 in each housing, the electronic device 150 can be It can be used for a long time. Also, it is possible to use a small battery to meet the specified capacity. By distributing the batteries 152 in each housing, the physical It is also possible to reduce the thickness, in which case the thickness of the electronic device 150 can be reduced. The thickness of the battery 152 can be reduced by using a stacked type power storage device. For example, a stacked lithium ion battery or the like can be used.

[0056] The electronic device 160 illustrated in FIGS. 5A to 5C has two outer housings (housings 102 and 103). A display unit 101 is provided on the side surface of the housing 10 (102a, 102c) from the side to the rear surface. On the rear side of the display unit 2c, a camera 105 is provided at a position overlapping with an opening provided in the display unit 101. The figure shows the configuration in which the

[0057] In this way, even when there are multiple housings, the display unit 101 can be arranged along two or more surfaces of the housings. By placing the electronic device 160 in the folded position, the display can be displayed on two or more sides of the housing. This becomes possible.

[0058] Although a configuration having three housings is shown here, the number of housings is not limited to this. It may be configured to have two housings, or may be configured to have four or more housings. In this case, the camera 105 may be placed on one surface of at least one of the housings.

[0059] In addition, in the drawings exemplified above, the thicknesses of the multiple housings are shown to be approximately the same. However, the thickness of each housing may be different. If all the housings are assumed to be of the same thickness, the horizontality of the light-emitting surface when the electronic device is unfolded is In addition, it is preferable that all of the various electronic components are housed in one of the multiple housings. A part or most of the components are integrated into the housing, and the housing is used as a relatively thick main body, and the thickness of the other housings is It is also possible to reduce the thickness and use it simply as a member for supporting the display unit 101.

[0060] [Display configuration example] 6A is a schematic top view of the display portion 101. The display portion 101 is made of a flexible substrate. 120, a display area 103, a circuit 121, a circuit 122, and a plurality of wirings 123 are provided. An FPC 124 that is electrically connected to the plurality of wirings 123 is attached to the substrate 120 . The FPC 124 is also provided with an IC 125 .

[0061] The display area 103 has a plurality of pixels. The pixels provided in the display area 103 include at least It is preferable that the display device has another display element. A representative example of the display element is an organic EL element. A light-emitting element such as a liquid crystal element or the like can be used.

[0062] The circuit 121 and the circuit 122 are circuits that have the function of driving the pixels of the display area 103. For example, it can function as a gate drive circuit. Although the configuration has two circuits sandwiching 103, it may be either one. When a signal is supplied to the pixel via C124, the circuit 121 and the circuit 122 are not provided. A different configuration may also be used.

[0063] The plurality of wirings 123 electrically connects the circuit 121, the circuit 122, or the pixels in the display area 103. Also, some of the wirings 123 are electrically connected to the terminals that connect to the FPC 124. To be continued.

[0064] In FIG. 6(A), an IC 125 is mounted on an FPC 124 by a COF method or the like. The IC 125 can function as a source driver circuit, for example. Alternatively, the image signal supplied to the display area 103 may be corrected. It is preferable to provide a circuit that can function as a source driver circuit on the flexible substrate 120. If the circuit is external, or if the IC125 is installed externally, the IC125 may not be mounted. In addition, if the number of pixels of the display unit 101 is large, a configuration in which a plurality of FPCs 124 are provided may be used. good.

[0065] Here, when the pixels of the display area 103 have light-emitting elements, there are cases where an image is displayed, and cases where an image is displayed. The potential supplied to the pixel is made different when it is used as a light source during photography. By doing so, when the light source is used for taking a picture, it is possible to display an image. In this case, the current flowing through the light emitting element is increased compared to the case where the light emitting element is in a low-energy state, and the light emitting luminance from the light emitting element is increased. For example, the display area 103 can be used as the area 111 that functions as a light source during photography. In this case, the wiring that functions as a gate line electrically connected to the pixel and the wiring that functions as a signal line If a potential higher (or lower) than the potential used to display an image is supplied to both wirings, That's fine.

[0066] Therefore, the circuits 121 and 122 that can function as gate drive circuits have two or more potentials. For example, two power lines may be arranged, and one of the power lines may be connected to the pixel. In addition, the potential of the pixel can be supplied to the pixel. C125 has a configuration in which the potential of the output signal can be set to two or more and either potential can be supplied to the pixel. For example, if the IC 125 has a level shifter circuit, It is only necessary to adopt a configuration that allows the output potential (amplitude) of the capacitor circuit to be changed.

[0067] In addition, the circuit 121 and the circuit 122 are divided into a plurality of parts, each of which is driven independently. In FIG. 6B, the circuit 121 may be divided into three circuits (circuits 121a, 121b, and 121c). , and when the circuit 122 is divided into three (circuits 122a, 122b, and 122c), 6B shows a plurality of wirings electrically connected to the circuit 121a. a plurality of wirings 126b electrically connected to the line 126a, the circuit 121b; a plurality of wirings 127a electrically connecting to the circuit 122b; and a plurality of wirings 127b electrically connecting to the circuit 122b. 1 shows a configuration having:

[0068] By dividing the circuit that can function as a gate drive circuit into multiple parts, the display unit 101 can be folded. This makes it easy to prevent the part of the display area 103 that is hidden when the display is folded from being driven. At this time, it becomes easy to cut off the power supply potential supplied to the circuit. The power consumption of the 01 can be made extremely low.

[0069] In addition, the circuit that can function as a gate drive circuit is divided into multiple parts, and each part is driven individually. By doing so, it is easy to supply a different potential to a part of the display area 103 from that to the other parts. As a result, an image is displayed in a part of the display area 103, and a photograph is taken in another part of the display area 103. For example, in FIG. 6(B), In the illustrated configuration, the power supply potential supplied to the circuits 121a and 122a is supplied to the circuits 121b and 122b. b, 121c, and 122c. As a result, the luminance of light emitted from the pixels electrically connected to the circuits 121a and 122a is reduced by the luminance of light emitted from the other parts. can be higher than minutes.

[0070] In FIG. 6C, the circuit 121, the circuit 122, and a plurality of wirings 123 are overlapped, and ...2, the circuit 122, and a plurality of wirings 123 are overlapped, and the circuit 1 The figure shows a case where a light emitting region 114 having a function as a light source is provided. In addition, a light-emitting region 114 is provided so as to overlap the circuits and wiring arranged around the display region 103. Therefore, the area of ​​the non-display area of ​​the display unit 101 can be reduced compared to when these are not overlapped. It becomes possible.

[0071] [Example of display area configuration] In the following, a plurality of pixels for displaying an image in the display area 103 and light-emitting elements between the pixels will be described. An example in which an element is provided will be described.

[0072] FIG. 7A shows a pattern of pixel electrodes in pixels provided in the display area 103. Here, the display area 103 is provided with red (R), green (G) or blue (B ) will be described.

[0073] The pixel that emits red light has a pixel electrode 131R. Similarly, the pixel that emits green light has The pixel that emits blue light has a pixel electrode 131G, and the pixel that emits blue light has a pixel electrode 131B.

[0074] In addition, an electrode 132 is provided between adjacent pixels. are electrically isolated from each other and arranged in a grid pattern.

[0075] FIG. 7B is a schematic cross-sectional view of the display unit 101 taken along the line AB in FIG. 7A. As an example, in FIG. 7(B), a top panel in which a white-emitting organic EL element is used as the light-emitting element is shown. 1 shows a cross section of the vicinity of a light emitting element when an emission type light emitting element is used. A more specific configuration example will be described later.

[0076] Each pixel electrode and the electrode 132 are provided on an insulating layer 141. An insulating layer 143 is provided to cover the end of the electrode 132. A layer containing a light-emitting organic compound (hereinafter referred to as an EL layer 133) covers the insulating layer 143. An electrode 134 is provided to cover the EL layer 133.

[0077] Also provided is a substrate 142 that is bonded to the insulating layer 141 via a sealing material 144. Color filters 135R, 135G, and 135B are provided on one surface of the plate 142. A color filter 135R that transmits red light is provided so as to overlap the pixel electrode 131R. A color filter 135G that transmits green light is provided overlapping the pixel electrode 131G. A color filter 135B that transmits blue light is set to overlap the pixel electrode 131B. Furthermore, no color filter is provided at a position overlapping with the electrode 132.

[0078] FIG. 7C shows a case where a light-emitting element manufactured by a color-coded method is used. An EL layer 136R that emits red light is provided on the pixel electrode 131R. An EL layer 136G that emits green light is disposed on the pixel electrode 131G, and an EL layer 136G that emits green light is disposed on the pixel electrode 131B. On the electrode 132, an EL layer 136B that emits blue light is provided. An EL layer 133 that emits white light is provided.

[0079] Although the substrate 142 is shown without a color filter in this example, FIG. ) a color filter may be provided at a position overlapping each pixel electrode.

[0080] With this configuration, a full-color image can be displayed in the display area 103. Furthermore, white light can be emitted from the light emitting element including the electrode 132, the EL layer 133, and the electrode 134. Light (W) can be used as a light source when taking pictures.

[0081] Furthermore, by providing a plurality of such electrodes 132 in the display area 103, light emitting elements including each electrode can be generated. It is possible to individually control the light emission of the optical elements. For example, the light emitting element including the electrode 132 is When the light emitting element is controlled by passive matrix driving, This is preferable because it is not necessary to provide a separate transistor or the like.

[0082] This concludes the description of the display area.

[0083] Although an example in which a light-emitting element is used as a display element has been shown, One embodiment of the form is not limited to this.

[0084] For example, in this specification, a display element, a display device which is a device having a display element, or Display panels, light-emitting elements, and light-emitting devices that have light-emitting elements can be used in various forms. It can have various elements, such as a display element, a display device, a display panel, a light-emitting element, etc. The element or light-emitting device may be, for example, an EL (electroluminescence) element (organic and inorganic EL elements, organic EL elements, inorganic EL elements), LEDs (white LEDs, red LEDs, Green LED, blue LED, etc.), transistors (transistors that emit light depending on the current), Electron emission element, liquid crystal element, electronic ink, electrophoretic element, grating light valve (G LV), plasma display (PDP), MEMS (microelectromechanical systems) Display elements using the Digital Micromirror Device (DMD), DMS (Digital Micro Shutter), MIRASOL (registered trademark), IMOD (Interface Optical interference MEMS display elements, electrowetting elements, piezoelectric ceramic displays , a display element using carbon nanotubes, etc. In addition, contrast, brightness, reflectivity, transmittance, etc. can be changed by electrical or magnetic effects. An example of a display device using an EL element is an EL display. An example of a display device using electron-emitting elements is a field emitter. Surface-Mounted Display (FED) or Surface-Mounted Display (SED) ace-conduction Electron-emitter Display) An example of a display device using a liquid crystal element is a liquid crystal display (transmissive liquid crystal Displays, semi-transmissive LCD displays, reflective LCD displays, direct-view LCD displays (Electronic ink, electronic liquid powder (registered trademark), An example of a display device using an electrophoretic element is electronic paper. When realizing a transparent or reflective LCD, part of the pixel electrode, Alternatively, the entire pixel electrode may function as a reflective electrode. A part or the whole of the material may contain aluminum, silver, etc. In this case, it is possible to provide a memory circuit such as an SRAM under the reflective electrode. Furthermore, power consumption can be reduced.

[0085] For example, in this specification, an active matrix type having active elements in pixels, or Alternatively, a passive matrix system in which pixels do not have active elements can be used.

[0086] In the active matrix system, the active element (active element, nonlinear element) is a transistor. By using not only transistors but also various active elements (active elements, nonlinear elements), For example, MIM (Metal Insulator Metal) or T It is also possible to use FD (Thin Film Diode) and other elements. Since the number of manufacturing steps is small, it is possible to reduce manufacturing costs and improve yields. Alternatively, these elements can improve the aperture ratio due to their small size. This makes it possible to achieve low power consumption and high brightness.

[0087] Other than the active matrix type, active elements (active elements, nonlinear elements) It is also possible to use a passive matrix type that does not use active elements (active elements). Since it does not use any nonlinear elements, there are fewer manufacturing steps, which reduces manufacturing costs and improves yield. Alternatively, active elements (active elements, non-linear elements) can be used. Since the aperture ratio is not increased, it is possible to achieve low power consumption or high brightness. This can be done.

[0088] This embodiment may be combined, at least in part, with other embodiments described in this specification. It can be implemented in combination.

[0089] (Embodiment 2) In this embodiment, a light-emitting panel that can be used for a display portion of an electronic device according to one embodiment of the present invention will be described. A configuration example and a manufacturing method example will be described.

[0090] <Example 1> FIG. 8A shows a plan view of the light-emitting panel. An example of a cross-sectional view is shown in FIG. 8(C). The light-emitting panel shown in Example 1 uses a color filter method. In this embodiment, the light-emitting panel is a top-emission type. For example, a configuration in which one color is expressed using three sub-pixels of R (red), G (green), and B (blue), A single color is expressed using four sub-pixels: R (red), G (green), B (blue), and W (white). There are no particular limitations on the color elements, and colors other than RGBW may be used. For example, , yellow, cyan, magenta, etc.

[0091] The light-emitting panel shown in FIG. 8A includes a light-emitting section 804, a driving circuit section 806, and an FPC (Flexible Printed Circuit). The light emitting unit 804 and the driving circuit The light emitting element and the transistor included in the path portion 806 are formed by the substrate 801, the substrate 803, and the sealing layer 8 It is sealed by 23.

[0092] The light-emitting panel shown in FIG. 8(C) includes a substrate 801, an adhesive layer 811, an insulating layer 813, and a plurality of transistors. Transistor, conductive layer 857, insulating layer 815, insulating layer 817, a plurality of light-emitting elements, insulating layer 82 1, sealing layer 823, overcoat 849, coloring layer 845, light-shielding layer 847, insulating layer 843 , adhesive layer 841, and substrate 803. The sealing layer 823, overcoat 849, insulating Layer 843, adhesive layer 841, and substrate 803 are transparent to visible light.

[0093] The light emitting section 804 is a transistor on the substrate 801 via an adhesive layer 811 and an insulating layer 813. The light emitting element 830 includes a lower electrode 83 on an insulating layer 817. 1, an EL layer 833 on the lower electrode 831, and an upper electrode 835 on the EL layer 833. The lower electrode 831 is electrically connected to the source electrode or the drain electrode of the transistor 820. The end of the lower electrode 831 is covered with an insulating layer 821. Preferably, the upper electrode 835 is transparent to visible light.

[0094] The light-emitting section 804 includes a colored layer 845 overlapping the light-emitting element 830 and a layer overlapping the insulating layer 821. The colored layer 845 and the light-shielding layer 847 are covered with an overcoat 849. The space between the light emitting element 830 and the overcoat 849 is filled with a sealing layer 823. There are.

[0095] The insulating layer 815 has the effect of suppressing the diffusion of impurities into the semiconductor that constitutes the transistor. The insulating layer 817 also has a planarizing function to reduce surface irregularities caused by the transistor. It is preferable to select an insulating layer having

[0096] The driving circuit section 806 is formed by forming a transistor on the substrate 801 via an adhesive layer 811 and an insulating layer 813. In FIG. 8C, one of the transistors included in the driver circuit portion 806 is 1 shows two transistors.

[0097] The insulating layer 813 and the substrate 801 are bonded together by an adhesive layer 811. The insulating layer 813 and the insulating layer 803 are bonded to each other by the adhesive layer 841. If a film with low water permeability is used for 843, impurities such as water may get into the light emitting element 830 or the transistor 820. This is preferable because it can prevent objects from entering and improve the reliability of the light-emitting panel.

[0098] The conductive layer 857 transmits signals (video signals, clock signals, switch signals, etc.) from the outside to the driving circuit section 806. It is electrically connected to an external input terminal that transmits a signal (such as a start signal or a reset signal) or a potential. Here, an example is shown in which an FPC808 is provided as an external input terminal. To prevent this, the conductive layer 857 is made of the same material as the electrodes and wiring used in the light emitting section and the drive circuit section. Here, the conductive layer 857 is preferably formed by a process. This shows an example in which the electrode is made of the same material and in the same process as the electrode to be used.

[0099] In the light-emitting panel shown in FIG. 8C, the connector 825 is located on the substrate 803. 25 includes a substrate 803, an adhesive layer 841, an insulating layer 843, a sealing layer 823, an insulating layer 817, and The conductive layer 857 is connected to the connector 82 through an opening provided in the insulating layer 815. 5 is connected to the FPC 808. The FPC 808 and the conductive layer 857 are connected via the connector 825. When the conductive layer 857 and the substrate 803 overlap, an opening is made in the substrate 803. By using a substrate with an opening, the conductive layer 857, the connector 825, and the FP C808 can be electrically connected.

[0100] In Example 1, the insulating layer 813, the transistor 820, and the light-emitting element 820 are formed on a highly heat-resistant substrate. The substrate 830 is then peeled off, and an insulating layer 8 is formed on the substrate 801 using an adhesive layer 811. 13, a transistor 820, and a light-emitting element 830. In addition, in Example 1, the insulating layer 843 and the colored layer 845 are formed on a highly heat-resistant substrate. and a light-shielding layer 847 is formed, the substrate on which the layer is formed is peeled off, and the layer is formed on the substrate 803 using the adhesive layer 841. A light-emitting panel can be produced by transposing the insulating layer 843, the colored layer 845, and the light-shielding layer 847. It shows.

[0101] If a substrate is made of a material with low heat resistance (such as resin), the substrate is exposed to high temperatures during the manufacturing process. Since it is difficult to form a thin film on the substrate, there are limitations on the conditions for forming transistors and insulating layers on the substrate. When using a highly permeable material (such as resin) for the substrate, high temperatures are applied to form a low-permeability film. In the manufacturing method of this embodiment, it is preferable to form a transistor on a manufacturing substrate having high heat resistance. High temperature can be used to produce highly reliable transistors and transistors with sufficient water permeability. Then, they can be transferred to the substrate 801 or the substrate 803. Thus, in one embodiment of the present invention, a light-emitting panel with high reliability can be manufactured. A light-weight, thin, and highly reliable light-emitting panel can be realized. Details of the manufacturing method will be described later. do.

[0102] <Example 2> FIG. 8B shows a plan view of the light-emitting panel. An example of a cross-sectional view is shown in FIG. 8(D). The light-emitting panel shown in Specific Example 2 is different from Specific Example 1 in that It is a top-emission type light-emitting panel that uses a color filter method. Only the differences from Example 1 will be described in detail, and explanations of the points in common with Example 1 will be omitted.

[0103] The light-emitting panel shown in FIG. 8(D) differs from the light-emitting panel shown in FIG. 8(C) in the following respects.

[0104] The light-emitting panel shown in FIG. 8D has spacers 827 on the insulating layer 821. By providing 827, the distance between the substrate 801 and the substrate 803 can be adjusted.

[0105] 8(D), the substrate 801 and the substrate 803 are different in size. The connector 825 is located on the insulating layer 843 and does not overlap the substrate 803. The conductive layer 843, the sealing layer 823, the insulating layer 817, and the insulating layer 815 are provided with openings. Since there is no need to provide an opening in the substrate 803, the material of the substrate 803 is The fee is not limited.

[0106] <Example 3> FIG. 9(A) shows a plan view of the light-emitting panel, and the area between the dashed dotted lines A5 and A6 in FIG. An example of a cross-sectional view is shown in Figure 9(C). The light-emitting panel shown in Example 3 uses a color-coded method. It is a top-emission type light-emitting panel.

[0107] The light-emitting panel shown in FIG. 9(A) has a light-emitting section 804, a driving circuit section 806, and an FPC 808. The light emitting element and the transistor included in the light emitting section 804 and the driving circuit section 806 are mounted on the substrate 80. 1, the substrate 803, the frame-shaped sealing layer 824, and the sealing layer 823.

[0108] The light-emitting panel shown in FIG. 9(C) includes a substrate 801, an adhesive layer 811, an insulating layer 813, and a plurality of transistors. Transistor, conductive layer 857, insulating layer 815, insulating layer 817, a plurality of light-emitting elements, insulating layer 82 1, a sealing layer 823, a frame-shaped sealing layer 824, and a substrate 803. Plate 803 transmits visible light.

[0109] The frame-shaped sealing layer 824 is preferably a layer having higher gas barrier properties than the sealing layer 823. This prevents moisture and oxygen from entering the light-emitting panel from the outside. This makes it possible to realize a highly reliable light-emitting panel.

[0110] In Example 3, light emitted from the light emitting element 830 is extracted from the light emitting panel through the sealing layer 823. Therefore, it is preferable that the sealing layer 823 has higher light-transmitting properties than the frame-shaped sealing layer 824. Furthermore, it is preferable that the refractive index of the sealing layer 823 is higher than that of the frame-shaped sealing layer 824. Furthermore, the sealing layer 823 has a smaller shrinkage in volume when hardened than the frame-shaped sealing layer 824. It is preferable that:

[0111] The light emitting section 804 is a transistor on the substrate 801 via an adhesive layer 811 and an insulating layer 813. The light emitting element 830 includes a lower electrode 83 on an insulating layer 817. 1, an EL layer 833 on the lower electrode 831, and an upper electrode 835 on the EL layer 833. The lower electrode 831 is electrically connected to the source electrode or the drain electrode of the transistor 820. The end of the lower electrode 831 is covered with an insulating layer 821. Preferably, the upper electrode 835 is transparent to visible light.

[0112] The driving circuit section 806 is formed by forming a transistor on the substrate 801 via an adhesive layer 811 and an insulating layer 813. In FIG. 9C, one of the transistors included in the driver circuit portion 806 is 1 shows two transistors.

[0113] The insulating layer 813 and the substrate 801 are bonded together by an adhesive layer 811. If a film with low water permeability is used, impurities such as water may penetrate into the light emitting element 830 and the transistor 820. This is preferable because it can suppress the penetration of light and improve the reliability of the light-emitting panel.

[0114] The conductive layer 857 serves as an external input terminal for transmitting signals and potentials from the outside to the driving circuit portion 806. Electrically connect. Here, an example is shown where an FPC808 is used as the external input terminal. Here, the conductive layer 857 is made of the same material as the electrode of the transistor 820. An example produced using the same process is shown below.

[0115] In the light-emitting panel shown in FIG. 9C, the connector 825 is located on the substrate 803. 25 is an opening provided in the substrate 803, the sealing layer 823, the insulating layer 817, and the insulating layer 815. The connector 825 is connected to the conductive layer 857 via the FPC 808. The FPC 808 and the conductive layer 857 are electrically connected via the connector 825.

[0116] In Example 3, the insulating layer 813, the transistor 820, and the light-emitting element 820 are formed on a substrate having high heat resistance. The substrate 830 is then peeled off, and an insulating layer 8 is formed on the substrate 801 using an adhesive layer 811. 13, a transistor 820, and a light-emitting element 830. Since transistors and other devices can be manufactured on a highly heat-resistant substrate, This allows for the formation of highly reliable transistors and films with sufficiently low water permeability. By transferring these to the substrate 801, a highly reliable light-emitting panel can be fabricated. Therefore, in one embodiment of the present invention, a light-emitting panel that is lightweight or thin and has high reliability can be realized. Cut.

[0117] <Example 4> FIG. 9B shows a plan view of the light-emitting panel. An example of a cross-sectional view is shown in Figure 9(D). The light-emitting panel shown in Example 4 uses a color filter method. The bottom-emission type light-emitting panel used here is

[0118] The light-emitting panel shown in FIG. 9(D) includes a substrate 801, an adhesive layer 811, an insulating layer 813, and a plurality of transistors. Transistor, conductive layer 857, insulating layer 815, colored layer 845, insulating layer 817a, insulating layer 81 7b, a conductive layer 816, a plurality of light-emitting elements, an insulating layer 821, a sealing layer 823, and a substrate 803 The substrate 801, the adhesive layer 811, the insulating layer 813, the insulating layer 815, the insulating layer 817a, and The insulating layer 817b transmits visible light.

[0119] The light emitting section 804 is a transistor on the substrate 801 via an adhesive layer 811 and an insulating layer 813. The light-emitting element 830 includes an insulating layer A lower electrode 831 on the EL layer 833, an EL layer 833 on the lower electrode 831, and an upper electrode 832 on the EL layer 833. The lower electrode 831 is the source electrode or drain electrode of the transistor 820. The end of the lower electrode 831 is covered with an insulating layer 821. The upper electrode 835 preferably reflects visible light. The lower electrode 831 preferably transmits visible light. The position where the colored layer 845 overlapping the light emitting element 830 is provided is not particularly limited. If it is provided between the edge layer 817a and the insulating layer 817b, or between the insulating layer 815 and the insulating layer 817a, good.

[0120] The driving circuit section 806 is formed by forming a transistor on the substrate 801 via an adhesive layer 811 and an insulating layer 813. In FIG. 9D, two of the transistors included in the driver circuit portion 806 are 1 shows two transistors.

[0121] The insulating layer 813 and the substrate 801 are bonded together by an adhesive layer 811. If a film with low water permeability is used, impurities such as water can easily penetrate the light emitting element 830 and the transistors 820 and 822. This is preferable because it can prevent impurities from entering and improve the reliability of the light-emitting panel.

[0122] The conductive layer 857 serves as an external input terminal for transmitting signals and potentials from the outside to the driving circuit portion 806. Electrically connect. Here, an example is shown where an FPC808 is used as the external input terminal. Here, the conductive layer 857 is formed using the same material and in the same process as the conductive layer 816. Here is an example.

[0123] In Example 4, the insulating layer 813, the transistor 820, and the light-emitting element 820 are formed on a highly heat-resistant substrate. The substrate is peeled off, and an insulating layer is formed on the substrate 801 using the adhesive layer 811. A light-emitting panel that can be produced by transposing 813, a transistor 820, a light-emitting element 830, etc. Since transistors and other devices can be manufactured on a highly heat-resistant substrate, This allows for the formation of highly reliable transistors and films with sufficiently low water permeability. By transferring these to the substrate 801, a highly reliable light-emitting panel can be fabricated. As a result, in one embodiment of the present invention, a light-weight or thin and highly reliable light-emitting panel can be realized. It can be realized.

[0124] <Example 5> FIG. 9(E) shows an example of a light-emitting panel different from the specific examples 1 to 4.

[0125] The light-emitting panel shown in FIG. 9(E) includes a substrate 801, an adhesive layer 811, an insulating layer 813, and a conductive layer 8 14, conductive layer 857a, conductive layer 857b, light-emitting element 830, insulating layer 821, sealing layer 823 , and a substrate 803.

[0126] The conductive layer 857a and the conductive layer 857b are external connection electrodes of the light-emitting panel, and are connected to an FPC or the like. Electrical connection can be made.

[0127] The light emitting element 830 has a lower electrode 831, an EL layer 833, and an upper electrode 835. The end of the bottom electrode 831 is covered with an insulating layer 821. The light emitting element 830 is a bottom emitting element. The light extraction side is either a top-emission type or a dual-emission type. The electrode, the substrate, the insulating layer, etc. are transparent to visible light. and electrically connect it.

[0128] The substrate on the light extraction side has a light extraction structure consisting of a hemispherical lens and a microlens array. For example, the resin substrate may have a film with a concave-convex structure, a light-diffusing film, or the like. The lens or film is placed on a plate with a refractive index similar to that of the substrate or the lens or film. By bonding the substrate using an adhesive having the above-mentioned properties, a light extraction structure can be formed.

[0129] The conductive layer 814 is not necessarily provided, but it is possible to reduce the voltage drop due to the resistance of the lower electrode 831. For the same purpose, the upper electrode 835 and the electrode A conductive layer electrically connected to the insulating layer 821, the EL layer 833, or the upper electrode 835 is formed on the insulating layer 821, the EL layer 833, or the upper electrode 835. It may be provided.

[0130] The conductive layer 814 may be made of copper, titanium, tantalum, tungsten, molybdenum, chromium, or neodymium. Materials selected from the group consisting of aluminum, scandium, nickel, and aluminum, or materials containing these as their main components The conductive layer 814 can be formed as a single layer or a stacked layer using an alloy material or the like. For example, it can be 0.1 μm or more and 3 μm or less, and preferably 0.1 μm or more and 0.1 μm or less. It is less than 0.5μm.

[0131] A paste (such as silver paste) is used as the material for the conductive layer electrically connected to the upper electrode 835. When the conductive layer is heated, the metal constituting the conductive layer becomes granular and aggregates. This results in a structure with many gaps, making it difficult for the EL layer 833 to completely cover the conductive layer, and This is preferable because it becomes easier to electrically connect the conductive layer to the conductive layer.

[0132] In Example 5, the insulating layer 813, the light emitting element 830, etc. are fabricated on a highly heat-resistant fabrication substrate. The substrate is peeled off, and an insulating layer 813 and a light emitting element 83 are formed on the substrate 801 using an adhesive layer 811. This shows a light-emitting panel that can be manufactured by transposing 0 etc. on a highly heat-resistant manufacturing substrate. By applying high temperature, an insulating layer 813 or the like having a sufficiently low water permeability is formed, and the insulating layer 813 is transferred to the substrate 801. As a result, a light-emitting panel with high reliability can be manufactured. This makes it possible to realize a thin and highly reliable light-emitting panel.

[0133] <Example of materials> Next, materials that can be used for the light-emitting panel will be described. The explanation of the configuration may be omitted.

[0134] The substrate can be made of materials such as glass, quartz, organic resin, metal, and alloy. The substrate on the side from which light from the optical element is extracted is made of a material that is translucent to the light.

[0135] In particular, it is preferable to use a flexible substrate. For example, an organic resin or a flexible substrate may be used. Any thickness of glass, metal or alloy can be used.

[0136] Since organic resin has a smaller specific gravity than glass, when organic resin is used as a flexible substrate, This is preferable because it allows the light-emitting panel to be lighter than when glass is used.

[0137] It is preferable to use a highly tough material for the substrate. This makes it possible to achieve excellent impact resistance and breakage resistance. For example, it is possible to realize a light-emitting panel that is hard to damage. By using a metal or alloy substrate, it is lighter and less susceptible to breakage than when using a glass substrate. It is possible to create a light-emitting panel.

[0138] Metallic and alloy materials have high thermal conductivity and can easily conduct heat across the entire substrate, making it possible to This is preferable because it can suppress local temperature rises in the panel. The thickness of the substrate is preferably 10 μm or more and 200 μm or less, and more preferably 20 μm or more and 50 μm or less. It is more preferable to do so.

[0139] The material for forming the metal substrate or alloy substrate is not particularly limited, but for example, aluminum Preferably, the material is a metal alloy such as aluminum, copper, nickel, or an aluminum alloy or stainless steel. It can be used appropriately.

[0140] In addition, if a material with high thermal emissivity is used for the substrate, the surface temperature of the light-emitting panel will increase. This can prevent damage to the light-emitting panel and a decrease in reliability. A stack of high emissivity layers (for example, metal oxides or ceramic materials can be used) It may also be constructed as such.

[0141] Examples of materials that are flexible and transparent include polyethylene terephthalate (PE T), polyester resins such as polyethylene naphthalate (PEN), polyacrylonitrile resin, polyimide resin, polymethyl methacrylate resin, polycarbonate (PC) resin Resin, polyethersulfone (PES) resin, polyamide resin, cycloolefin resin, Examples of resins that can be used include polystyrene resins, polyamide-imide resins, and polyvinyl chloride resins. It is preferable to use a material with a low expansion coefficient, such as polyamide-imide resin or polyimide. Resin, PET, etc. can be suitably used. Also, a substrate (printed) in which a fiber body is impregnated with resin can be used. Use a substrate with a reduced thermal expansion coefficient by mixing inorganic fillers into organic resins. It is also possible.

[0142] As for the flexible substrate, the layer using the above material acts as a hard layer to protect the surface of the device from scratches. Coating layers (e.g., silicon nitride layers) and layers of materials that can disperse pressure (e.g., ara The insulating layer may be laminated with a polymer layer (e.g., a polymer layer).

[0143] The flexible substrate may be formed by stacking a plurality of layers. This means that the barrier properties against water and oxygen can be improved, resulting in a highly reliable light-emitting panel. can.

[0144] For example, a flexible substrate in which a glass layer, an adhesive layer, and an organic resin layer are laminated from the side closer to the light emitting element is used. The thickness of the glass layer is preferably 20 μm or more and 200 μm or less. The thickness is preferably 25 μm or more and 100 μm or less. A glass layer with such a thickness is highly resistant to water and oxygen. The thickness of the organic resin layer can be set to 1. The thickness is 0 μm or more and 200 μm or less, preferably 20 μm or more and 50 μm or less. By placing the mechanical resin layer on the outside of the glass layer, breakage and cracks in the glass layer are suppressed. Such a composite material of glass material and organic resin can improve the mechanical strength. By applying it to the substrate, it becomes possible to create a highly reliable flexible light-emitting panel. can.

[0145] For adhesive and sealing layers, there are various types of adhesives, such as UV-curable adhesives, reactive-curable adhesives, and heat-curable adhesives. Various curing adhesives such as adhesives and anaerobic adhesives can be used. Epoxy resin, acrylic resin, silicone resin, phenolic resin, polyimide resin, Imide resin, PVC (polyvinyl chloride) resin, PVB (polyvinyl butyral) resin Examples of the resin include EVA (ethylene vinyl acetate) resin. A material with low wettability is preferred. A two-component resin may also be used. etc. may also be used.

[0146] The resin may also contain a desiccant. For example, an oxide of an alkaline earth metal (an acid The material used is one that absorbs moisture by chemical adsorption, such as calcium oxide or barium oxide. Alternatively, materials such as zeolite and silica gel can absorb water by physical adsorption. If a desiccant is included, impurities such as moisture can be absorbed into the functional element. This is preferable because it can suppress the intrusion of foreign matter and improve the reliability of the light-emitting panel.

[0147] Furthermore, by mixing a filler with a high refractive index or a light scattering material into the resin, it is possible to For example, titanium oxide, barium oxide, Zeolite, zirconium, etc. can be used.

[0148] The structure of the transistors included in the light-emitting panel is not particularly limited. The transistor may be a top gate transistor or an inverted staggered transistor. The transistor may have either a top-gate or bottom-gate structure. The semiconductor material is not particularly limited, and examples thereof include silicon and germanium. , In-Ga-Zn-based metal oxides, etc. An oxide semiconductor including one of these may be used.

[0149] The crystallinity of the semiconductor material used in the transistor is not particularly limited. A semiconductor having crystallinity (a microcrystalline semiconductor, a polycrystalline semiconductor, a single-crystal semiconductor, or a semiconductor having a partially crystalline region) If a semiconductor having crystallinity is used, This is preferable because it can suppress deterioration of the resistor characteristics.

[0150] For stabilizing the characteristics of the transistor, it is preferable to provide an underlayer film. , silicon oxide film, silicon nitride film, silicon oxynitride film, silicon nitride oxide film, etc. The base film can be formed by a single layer or a multilayer structure using an organic insulating film. , CVD (Chemical Vapor Deposition) method (Plasma CVD method, thermal CVD method, MOCVD (Metal Organic CVD) method, etc.), ALD (Atomic Layer Deposition), coating, printing, etc. In addition, the undercoat film may not be provided if it is not necessary. The layer 813 can also serve as an underlying film for the transistor.

[0151] The light emitting element can be a self-luminous element that can be illuminated by current or voltage. This category includes devices whose light intensity is controlled, such as light-emitting diodes (LEDs), organic An EL element, an inorganic EL element, etc. can be used.

[0152] Light-emitting elements are available in top-emission, bottom-emission, and dual-emission types. The electrode on the light extraction side uses a conductive film that transmits visible light. In addition, it is preferable to use a conductive film that reflects visible light for the electrode on the side from which light is not extracted. stomach.

[0153] The conductive film that transmits visible light is made of, for example, indium oxide or indium tin oxide (ITO). Indium Tin Oxide, Indium Zinc Oxide, Zinc Oxide, Gallium-doped It can be formed using zinc oxide containing gold, silver, platinum, magnesium, etc. , nickel, tungsten, chromium, molybdenum, iron, cobalt, copper, palladium, if Metallic materials such as titanium, alloys containing these metallic materials, or nitrides of these metallic materials (e.g. For example, titanium nitride can be used by forming it thin enough to have light transmission properties. Also, a laminated film of the above materials can be used as the conductive layer. For example, a laminated film of silver and magnesium It is preferable to use a laminated film of an alloy of ITO and a rubber material, as this can increase the electrical conductivity. Graphene or the like may also be used.

[0154] The conductive film that reflects visible light is made of, for example, aluminum, gold, platinum, silver, nickel, tungsten, or the like. Metallic materials such as stainless steel, chromium, molybdenum, iron, cobalt, copper, or palladium, or In addition, the above metal materials and alloys may contain lanthanum. Tungsten, neodymium, germanium, etc. may be added. Aluminum alloys such as tungsten alloys, aluminum-nickel alloys, and aluminum-neodymium alloys Alloys containing palladium (aluminum alloys), silver and copper alloys, silver, palladium and copper alloys, It can be formed using an alloy containing silver, such as an alloy of silver and magnesium. The alloy is preferable because of its high heat resistance. By laminating the metal oxide film, oxidation of the aluminum alloy film can be suppressed. Examples of materials for the metal film and metal oxide film include titanium and titanium oxide. A conductive film that transmits visible light and a film made of a metal material may be laminated. For example, silver and ITO A laminated film of an alloy of silver and magnesium and ITO can be used.

[0155] The electrodes may be formed by vapor deposition or sputtering. Forming using ejection methods such as ink jet printing, printing methods such as screen printing, or plating methods It can be achieved.

[0156] A voltage higher than the threshold voltage of the light emitting element is applied between the lower electrode 831 and the upper electrode 835. When this occurs, holes are injected into the EL layer 833 from the anode side, and electrons are injected from the cathode side. The electrons and holes are recombined in the EL layer 833, and the light-emitting material contained in the EL layer 833 emits light. It glows.

[0157] The EL layer 833 has at least a light-emitting layer. The EL layer 833 includes the following layers other than the light-emitting layer: Materials with high hole injection properties, materials with high hole transport properties, hole blocking materials, materials with high electron transport properties Highly electron-injecting or bipolar material (highly electron-transporting and hole-transporting properties) The layer may further include a layer containing a material.

[0158] The EL layer 833 can be made of either a low molecular weight compound or a high molecular weight compound. The layers constituting the EL layer 833 may be formed by evaporation (vacuum evaporation). It can be formed by methods such as transfer method, printing method, ink jet method, coating method, etc. Cut.

[0159] The light emitting element is preferably provided between a pair of insulating films with low water permeability. This makes it possible to prevent impurities such as water from entering the light emitting element, thereby preventing a decrease in the reliability of the light emitting device. It can be controlled.

[0160] As insulating films with low water permeability, films containing nitrogen and silicon such as silicon nitride film and silicon nitride oxide film are used. and films containing nitrogen and aluminum, such as an aluminum nitride film. A silicon oxide film, a silicon oxynitride film, an aluminum oxide film, or the like may also be used.

[0161] For example, the water vapor permeation rate of a low-permeability insulating film is 1×10 -5 [g / m 2 ·day] or later Below, preferably 1 x 10 -6 [g / m 2 ·day] or less, preferably 1×10 -7 [ g / m 2 ·day] or less, more preferably 1 × 10 -8 [g / m 2 ·day] or less do.

[0162] It is preferable to use an insulating film with low water permeability for the insulating layer 813 and the insulating layer 843.

[0163] The insulating layer 815 may be, for example, a silicon oxide film, a silicon oxynitride film, or an aluminum oxide film. An inorganic insulating film such as an inorganic film can be used. The insulating layer 817b may be made of, for example, polyimide, acrylic, polyamide, or polyimide. Organic materials such as amide and benzocyclobutene resins can be used. Low dielectric constant materials (low-k materials) can be used. Each insulating layer may be formed by

[0164] The insulating layer 821 is formed using an organic insulating material or an inorganic insulating material. Examples of the resin include polyimide resin, polyamide resin, acrylic resin, siloxane resin, and epoxy resin. In particular, photosensitive resin materials can be used. It is preferable that the side wall of the opening is formed as an inclined surface having a continuous curvature. I wish.

[0165] The method for forming the insulating layer 821 is not particularly limited, but may be a photolithography method, a sputtering method, or the like. , evaporation method, droplet ejection method (inkjet method, etc.), printing method (screen printing, offset printing) It is best to use a printing press, etc.

[0166] The spacer 827 may be formed using an inorganic insulating material, an organic insulating material, a metal material, or the like. For example, inorganic insulating materials and organic insulating materials can be used for the insulating layer. Examples of metal materials that can be used include titanium and aluminum. The spacer 827 containing a conductive material and the upper electrode 835 are electrically connected to each other. This can suppress the potential drop caused by the resistance of the upper electrode 835. The shape of the 27 may be either a forward tapered shape or a reverse tapered shape.

[0167] For light-emitting panels that function as electrodes and wiring of transistors or auxiliary electrodes of light-emitting elements, The conductive layer used may be made of, for example, molybdenum, titanium, chromium, tantalum, tungsten, or aluminum. Metallic materials such as aluminum, copper, neodymium, scandium, etc., or alloy materials containing these elements The conductive layer can be formed as a single layer or a laminated layer using a conductive metal oxide. The conductive metal oxide may be indium oxide (In2O3, etc.). ), tin oxide (SnO2, etc.), zinc oxide (ZnO), ITO, indium zinc oxide (I ZnO, etc.) or these metal oxide materials containing silicon oxide. It is possible.

[0168] The colored layer is a colored layer that transmits light in a specific wavelength band. For example, A red (R) color filter transmits light in the green wavelength band, and a green (G) color filter transmits light in the green wavelength band. A blue (B) color filter that transmits light in the blue wavelength band can be used. Each color layer can be formed using various materials by printing, inkjet printing, photolithography, etc. They are formed at desired positions by etching using a graphic technique or the like.

[0169] The light-shielding layer is provided between adjacent colored layers. The light-shielding layer blocks light from the adjacent light-emitting element. The colored layer is formed on the edge of the light-shielding layer to prevent color mixing between adjacent light-emitting elements. By providing the light-shielding layer so that it overlaps the light-shielding layer, it is possible to suppress light leakage. Materials that block light emitted from the light-emitting element can be used, and include, for example, metal materials, pigments, and dyes. The black matrix may be formed using a resin material containing the light-shielding layer. If the light emitting element is provided in an area other than the light emitting part, unintended light leakage due to guided light can be suppressed. This is preferable.

[0170] In addition, an overcoat may be provided to cover the colored layer and the light-shielding layer. By doing so, it is possible to prevent impurities contained in the colored layer from diffusing into the light emitting element. The overcoat is made of a material that transmits light emitted from the light emitting element, such as silicon nitride. It uses inorganic insulating films such as silicon oxide films, and organic insulating films such as acrylic films and polyimide films. The insulating film may have a laminated structure of an organic insulating film and an inorganic insulating film.

[0171] In addition, when the material for the sealing layer is applied onto the colored layer and the light-shielding layer, the material for the overcoat is It is preferable to use a material that has high wettability with respect to the material of the sealing layer. As the substrate, oxide conductive films such as ITO films and metal films such as Ag films that are thin enough to be transparent are used. It is preferred to use a membrane.

[0172] The connector is a paste or sheet made of a thermosetting resin mixed with metal particles. For example, a material that exhibits anisotropic conductivity when thermocompressed can be used. For example, particles with layers of two or more metals, such as nickel particles coated with gold, are used. It is preferable that

[0173] <Example of manufacturing method> Next, a method for manufacturing a light-emitting panel will be illustrated with reference to FIGS. 10 and 11. The following description will be given taking the light-emitting panel having the configuration of 1 (FIG. 8(C)) as an example.

[0174] First, a peeling layer 203 is formed on a fabrication substrate 201, and an insulating layer 813 is formed on the peeling layer 203. Next, a plurality of transistors, a conductive layer 857, an insulating layer 815, an insulating layer 816, and a conductive layer 857 are formed on the insulating layer 813. An edge layer 817, a plurality of light-emitting elements, and an insulating layer 821 are formed. In this manner, openings are formed in the insulating layer 821, the insulating layer 817, and the insulating layer 815 (FIG. 10(A)). ).

[0175] In addition, a peeling layer 207 is formed on the fabrication substrate 205, and an insulating layer 843 is formed on the peeling layer 207. Next, a light-shielding layer 847, a coloring layer 845, and an overcoat 84 are formed on the insulating layer 843. 9 is formed (Figure 10(B)).

[0176] The substrates 201 and 205 are made of glass, quartz, and surface treatment. A fiber substrate, a ceramic substrate, a metal substrate, or the like can be used.

[0177] The glass substrate may be made of, for example, aluminosilicate glass or aluminoborosilicate glass. Glass materials such as glass and barium borosilicate glass can be used. If the degree of hardness is high, it is advisable to use one with a strain point of 730°C or higher. By adding more BaO, a more practical heat-resistant glass can be obtained. Russ etc. can be used.

[0178] When a glass substrate is used as the substrate for fabrication, a silicon oxide film, an acid film, or the like is formed between the substrate for fabrication and the peeling layer. When an insulating film such as a silicon nitride film, a silicon nitride film, or a silicon nitride oxide film is formed, the glass This is preferable because it can prevent contamination from the substrate.

[0179] The peeling layer 203 and the peeling layer 207 are made of tungsten, molybdenum, and titanium, respectively. Niobium, tantalum, niobium, nickel, cobalt, zirconium, zinc, ruthenium, rhodium an element selected from the group consisting of palladium, osmium, iridium, and silicon; It is made of an alloy material or a compound material containing the element, and is a single layer or a laminated layer. The crystal structure of the layer containing silicon may be amorphous, microcrystalline, or polycrystalline.

[0180] The release layer can be formed by sputtering, plasma CVD, coating, printing, etc. The coating method includes a spin coating method, a droplet ejection method, and a dispensing method.

[0181] When the release layer has a single layer structure, it is made up of a tungsten layer, a molybdenum layer, or a combination of tungsten and molybdenum. It is preferable to form a layer containing a mixture of tungsten and tungsten. a layer containing an oxynitride, a layer containing an oxide or oxynitride of molybdenum, or a layer containing tungsten Alternatively, a layer containing an oxide or oxynitride of a mixture of silicon and molybdenum may be formed. The mixture of tungsten and molybdenum is, for example, a mixture of tungsten and molybdenum. Correct.

[0182] In addition, a layer containing tungsten and a layer containing tungsten oxide may be used as a peeling layer. When forming a structure, a layer containing tungsten is formed, and an insulating layer formed of oxide is formed on top of it. By forming a film, a tungsten oxide film is formed at the interface between the tungsten layer and the insulating film. The surface of the tungsten-containing layer may be subjected to thermal oxidation. Oxidizing agents such as oxygen plasma treatment, nitrous oxide (N2O) plasma treatment, and ozone water A layer containing tungsten oxide may be formed by treating with a solution or the like. Treatment and heating may be carried out using oxygen, nitrogen, or nitrous oxide, either alone or in combination with other gases. The plasma treatment or heat treatment may be performed under a mixed gas atmosphere. By changing the temperature, it is possible to control the adhesion between the release layer and the insulating film that will be formed later. be.

[0183] Each insulating layer is formed by using a sputtering method, a plasma CVD method, a coating method, a printing method, etc. For example, it is possible to form a thin film at a temperature of 250°C or higher and 400°C or higher by plasma CVD. By forming the membrane at a temperature of 100° C. or lower, a dense membrane with extremely low water permeability can be obtained.

[0184] Thereafter, the surface of the production substrate 205 on which the colored layer 845 and the like are provided or the light-emitting element of the production substrate 201 is A material for the sealing layer 823 is applied to the surface on which the chip 830 and the like are provided, and the The fabrication substrate 201 and fabrication substrate 205 are bonded together so that their surfaces face each other (FIG. 10( C).

[0185] Then, the fabrication substrate 201 is peeled off, and the exposed insulating layer 813 and the substrate 801 are bonded to the adhesive layer 81 1. The manufacturing substrate 205 is peeled off, and the exposed insulating layer 843 and the substrate 11A, the substrate 803 is attached to the conductive layer 803 by using an adhesive layer 841. Although the conductive layer 857 does not overlap with the substrate 803, the conductive layer 857 may overlap with the substrate 803.

[0186] For example, a peeling layer may be formed by a method using a film made of a material such as a resin. When a layer containing a metal oxide film is formed on the side in contact with the peeling layer, the metal oxide film is crystallized. The layer to be peeled off can be peeled off from the substrate by weakening the film. When an amorphous silicon film containing hydrogen is formed as a peeling layer between the substrate and the peeled layer, laser light The amorphous silicon film is removed by irradiation or etching, and the layer to be peeled is separated from the substrate. The peeling layer can be peeled off from the peeled layer. The metal oxide film is weakened by crystallization, and a part of the peeling layer is then dissolved in a solution or NF. 3. After removal by etching using fluoride gases such as BrF3 and ClF3, the weakened It can be peeled off from the metal oxide film. Furthermore, nitrogen, oxygen, hydrogen, etc. can be used as a peeling layer. (for example, amorphous silicon film containing hydrogen, hydrogen-containing alloy film, oxygen-containing alloy film, etc.) The peeling layer is irradiated with laser light to release nitrogen, oxygen, and hydrogen contained in the peeling layer as gas. A method of promoting peeling between the peeled layer and the substrate by releasing the peeled layer may also be used. The substrate is mechanically removed or fluorinated with a solution or fluoride gas such as NF3, BrF3, or ClF3. In this case, the peeling layer can be removed without providing a peeling layer. good.

[0187] In addition, by combining a plurality of the above peeling methods, the peeling process can be carried out more easily. In other words, laser irradiation, etching of the peeling layer with gas or solution, sharp knife or Mechanical removal is performed using a scalpel or similar tool to make the peeling layer and the peeled layer easier to peel off. Peeling can also be performed by physical force (using a machine, etc.).

[0188] In addition, a liquid is allowed to penetrate into the interface between the peeling layer and the layer to be peeled, and the layer to be peeled is peeled from the substrate. Furthermore, the peeling may be performed while pouring a liquid such as water on the film.

[0189] As for other peeling methods, if the peeling layer is made of tungsten, ammonia water and The peeling layer may be etched with a mixed solution of hydrogen peroxide and water to perform the peeling.

[0190] Note that if peeling can be performed at the interface between the formation substrate and the peeled layer, a peeling layer may not be provided. For example, glass is used as the substrate, and polyimide, polyester, or polyimide is placed in contact with the glass. Forming organic resins such as polyolefin, polyamide, polycarbonate, and acrylic, Insulating films, transistors, etc. are formed on the resin. In this case, by heating the organic resin, It can be peeled off at the interface between the substrate and the organic resin. A metal layer is provided, and the metal layer is heated by passing an electric current through the metal layer, and an organic resin is formed at the interface between the metal layer and the organic resin. Peeling may also be performed.

[0191] Finally, the insulating layer 843 and the sealing layer 823 are opened to expose the conductive layer 857. (FIG. 11B). In the case where the substrate 803 overlaps with the conductive layer 857, The substrate 803 and adhesive layer 841 are also opened to expose 7 (FIG. 11(C)). The method is not particularly limited, and examples thereof include laser ablation, etching, and ion beam. A sputtering method or the like may be used. Alternatively, an incision may be made in the membrane and a portion of the membrane may be peeled off by physical force.

[0192] In this manner, a light-emitting panel can be manufactured.

[0193] This embodiment may be combined, at least in part, with other embodiments described in this specification. It can be implemented in combination.

[0194] (Embodiment 3) In this embodiment, a folding LCD panel that can be applied to a display portion of an electronic device according to one embodiment of the present invention will be described. Possible touch panel configurations will be described with reference to Figs. 12 to 15. For details, please refer to embodiment 2.

[0195] <Configuration example 1> Fig. 12(A) is a top view of the touch panel. Fig. 12(B) is a diagram showing the touch panel along the dashed line in Fig. 12(A). 12(C) is a cross-sectional view taken along the dashed line in FIG. This is a cross-sectional view between EF.

[0196] As shown in FIG. 12A, the touch panel 390 includes a display unit 301 .

[0197] The display unit 301 includes a plurality of pixels 302 and a plurality of imaging pixels 308. This allows the detection of a finger or the like touching the display unit 301. A touch sensor can be configured using the above.

[0198] The pixel 302 includes a plurality of sub-pixels (for example, the sub-pixel 302R), each of which includes a light-emitting element and a The pixel circuit is capable of supplying power to drive the light emitting element.

[0199] The pixel circuit includes wiring that can supply a selection signal and wiring that can supply an image signal. The wiring is electrically connected to the wiring.

[0200] The touch panel 390 also includes a scan line driver that can supply selection signals to the pixels 302. circuit 303g(1), and an image signal line driving circuit capable of supplying an image signal to the pixel 302. It has a path 303s(1).

[0201] The imaging pixel 308 includes a photoelectric conversion element and an imaging pixel circuit that drives the photoelectric conversion element.

[0202] The imaging pixel circuit has wiring that can supply a control signal and a power supply potential. It is electrically connected to the wiring that can be used.

[0203] The control signal is used to select an imaging pixel circuit that reads out the recorded imaging signal, for example. a signal that can initialize the imaging pixel circuit, and a signal that can detect light when the imaging pixel circuit detects light. Examples of such signals include signals that can determine the time at which the signal is detected.

[0204] The touch panel 390 may provide control signals to the imaging pixels 308. and an imaging signal line drive circuit 303s(2) that reads out imaging signals. .

[0205] As shown in FIG. 12B, the touch panel 390 is formed on a substrate 510 and a substrate 510 facing the substrate 510. The substrate 570 is a substrate for supporting the semiconductor device.

[0206] A flexible material can be suitably used for the substrate 510 and the substrate 570 .

[0207] Materials that suppress the permeation of impurities can be suitably used for the substrates 510 and 570. For example, if the water vapor permeability is 10 -5 g / m 2 ·day or less, preferably 10 -6 g / m 2 Materials with a shelf life of 10 days or less can be suitably used.

[0208] Materials with approximately the same linear expansion coefficient can be suitably used for the substrates 510 and 570. For example, if the linear expansion coefficient is 1×10 -3 / K or less, preferably 5×10-5 / K or less, better Preferably 1 x 10 -5 A material having a solubility of 1 / K or less can be suitably used.

[0209] The substrate 510 includes a flexible substrate 510b and an insulating layer 510a that prevents impurities from diffusing into the light emitting element. and an adhesive layer 510c that bonds the flexible substrate 510b and the insulating layer 510a together. It is a laminate.

[0210] The substrate 570 includes a flexible substrate 570b and an insulating layer 570a that prevents impurities from diffusing into the light emitting element. and an adhesive layer 570c that bonds the flexible substrate 570b and the insulating layer 570a. do.

[0211] For example, polyester, polyolefin, polyamide (nylon, aramid, etc.), poly Imide, polycarbonate or acrylic, urethane, epoxy or siloxane bonded A material containing a resin having the formula (I) can be used for the adhesive layer.

[0212] The sealing layer 360 bonds the substrate 570 and the substrate 510 together. In addition, when light is extracted to the sealing layer 360 side, the sealing layer 360 is A layer that optically bonds two members (here, substrate 570 and substrate 510) sandwiching the stop layer 360. (hereinafter also referred to as an optical bonding layer) also functions as a pixel circuit and a light emitting element (for example, the first The light emitting element 350R is located between the substrate 510 and the substrate 570.

[0213] The pixel 302 includes a subpixel 302R, a subpixel 302G, and a subpixel 302B (see FIG. 12). (C)). The subpixel 302R includes a light-emitting module 380R, and the subpixel 302G includes a light-emitting The subpixel 302B comprises a light emitting module 380G, and the subpixel 302B comprises a light emitting module 380B.

[0214] For example, the subpixel 302R supplies power to the first light-emitting element 350R and the second light-emitting element 350R. (FIG. 12(B)) The light emitting module 380R includes a first light emitting element 350R and an optical element (for example, a first It has a colored layer 367R).

[0215] The first light emitting element 350R includes a first lower electrode 351R, an upper electrode 352, a first The EL layer 353 is disposed between the electrode 351R and the upper electrode 352 (FIG. 12(C)).

[0216] The EL layer 353 includes a first EL layer 353a, a second EL layer 353b, and a second EL layer 353c. An intermediate layer 354 is provided between 53a and the second EL layer 353b.

[0217] The light emitting module 380R has a first colored layer 367R on the substrate 570. The colored layer is particularly It is sufficient if it transmits light having a certain wavelength, for example, red, green, or blue. Alternatively, the light emitted by the light emitting element can be directly transmitted through the light emitting element. Alternatively, a transparent region may be provided.

[0218] For example, the light emitting module 380R includes a first light emitting element 350R and a first color layer 367R. The sealing layer 360 is in contact with the substrate.

[0219] The first colored layer 367R is located so as to overlap the first light emitting element 350R. A part of the light emitted by the first light emitting element 350R is reflected by the sealing layer 360, which also serves as an optical bonding layer, and the first The light is transmitted through the colored layer 367R and emitted to the outside of the light emitting module 380R as shown by the arrow in the figure. It is served.

[0220] The touch panel 390 has a light-shielding layer 367BM on a substrate 570. The light-shielding layer 367BM , and is provided so as to surround the colored layer (for example, the first colored layer 367R).

[0221] The touch panel 390 includes an anti-reflection layer 367p at a position overlapping the display unit 301. The antireflection layer 367p may be, for example, a circular polarizer.

[0222] The touch panel 390 includes an insulating layer 321. The insulating layer 321 is connected to the transistor 302t. The insulating layer 321 serves to flatten the unevenness caused by the pixel circuit. In addition, the diffusion of impurities into the transistor 302t and the like can be suppressed. An insulating layer having a laminate of layers that can be formed can be applied to the insulating layer 321.

[0223] The touch panel 390 has a light emitting element (for example, a first light emitting element 350R) mounted on an insulating layer 321. has.

[0224] The touch panel 390 has a partition wall 328 overlapping the end of the first lower electrode 351R and an insulating layer 3 21. Also, a spacer 329 for controlling the distance between the substrate 510 and the substrate 570 is provided on the substrate 510. It is located on the wall 328.

[0225] The image signal line driver circuit 303s(1) includes a transistor 303t and a capacitor 303c. The driver circuit can be formed on the same substrate as the pixel circuit in the same process. As shown in (B), the transistor 303t has a second gate 304 on the insulating layer 321. The second gate 304 is electrically connected to the gate of the transistor 303t. Alternatively, different potentials may be applied to the first and second electrodes. The second gate 304 may be provided to the transistor 308t, the transistor 302t, and so on.

[0226] The imaging pixel 308 converts light incident on the photoelectric conversion element 308p and the photoelectric conversion element 308p into a The imaging pixel circuit includes a transistor 308t. include.

[0227] For example, a pin-type photodiode can be used as the photoelectric conversion element 308p.

[0228] The touch panel 390 includes wiring 311 through which signals can be supplied, and terminals 319 The wiring 311 is provided to supply signals such as image signals and synchronization signals. The FPC 309(1) is electrically connected to the terminal 319. 1) may have a printed wiring board (PWB) attached.

[0229] The transistors formed in the same process are referred to as transistor 302t and transistor 303. This can be applied to transistors such as transistor 308t. Please refer to the second embodiment.

[0230] In addition to the gate, source, and drain of the transistor, each element constituting the touch panel Materials that can be used for the seed wiring and electrodes include aluminum, titanium, chromium, nickel, and the like. Nickel, copper, yttrium, zirconium, molybdenum, silver, tantalum, or tungsten Metals such as nickel or alloys containing nickel as the main component are used in a single layer structure or a laminated structure. For example, a single layer structure of an aluminum film containing silicon, or a structure in which an aluminum film is laminated on a titanium film, Two-layer structure: Two-layer structure with aluminum film laminated on tungsten film, copper-magnesium- Two-layer structure with copper film laminated on aluminum alloy film, two-layer structure with copper film laminated on titanium film , a two-layer structure in which a copper film is laminated on a tungsten film, a titanium film or titanium nitride film and its titanium An aluminum film or a copper film is laminated on the titanium nitride film or the titanium nitride film, and a titanium film is further laminated on the aluminum film or the copper film. a three-layer structure in which a titanium nitride film or a molybdenum nitride film is formed; a molybdenum film or a molybdenum nitride film; An aluminum film or a copper film is laminated on the molybdenum film or the molybdenum nitride film, and There is also a three-layer structure in which a molybdenum film or molybdenum nitride film is formed on top of the above. Transparent conductive materials containing indium, tin oxide, or zinc oxide may also be used. The use of copper is preferable because it improves the controllability of the shape by etching.

[0231] <Configuration example 2> 13(A) and (B) are perspective views of the touch panel 505. FIG. 14 is a cross-sectional view taken along the dashed line X1-X2 in FIG. 13(A). be.

[0232] The touch panel 505 includes a display unit 501 and a touch sensor 595 (FIG. 13(B)). The touch panel 505 also includes a substrate 510, a substrate 570, and a substrate 590. , the substrate 510, the substrate 570 and the substrate 590 are all flexible.

[0233] The display unit 501 includes a substrate 510, a plurality of pixels on the substrate 510, and a display device for supplying signals to the pixels. The plurality of wirings 511 are arranged on the periphery of the substrate 510. The terminal 519 is connected to the FPC 509 (1 ) and electrically connect it.

[0234] The substrate 590 includes a touch sensor 595 and a plurality of electrodes electrically connected to the touch sensor 595. The wiring 598 is routed around the periphery of the substrate 590, and some of the wiring 598 The terminal is electrically connected to the FPC 509(2). 13B, for clarity, the terminals provided on the rear surface side (substrate 510 side) of the substrate 590 are shown. The electrodes, wiring, etc. of the touch sensor 595 are indicated by solid lines.

[0235] As the touch sensor 595, for example, a capacitance type touch sensor can be applied. The capacitance type includes a surface capacitance type, a projected capacitance type, and the like.

[0236] The projected capacitive type is mainly divided into self-capacitance type and mutual capacitance type, which differ mainly in the driving method. The mutual capacitance method is preferable because it allows simultaneous multi-point detection.

[0237] In the following, when a projected capacitive touch sensor is applied, the following will be explained. This will be explained using:

[0238] In addition, various sensors that can detect the proximity or contact of a detection target such as a finger are used. It can be used.

[0239] The projected capacitive touch sensor 595 has an electrode 591 and an electrode 592. 591 is electrically connected to one of the plurality of wirings 598, and the electrode 592 is electrically connected to one of the plurality of wirings 598. and electrically connect to any other of the above.

[0240] As shown in FIGS. 13(A) and 13(B), the electrodes 592 are made up of a plurality of electrodes repeatedly arranged in one direction. The shape is such that two quadrilaterals are connected at their corners.

[0241] The electrode 591 is quadrilateral and is repeatedly arranged in a direction intersecting the direction in which the electrode 592 extends. It has been done.

[0242] The wiring 594 electrically connects the two electrodes 591 that sandwich the electrode 592. It is preferable to have a shape that minimizes the area of ​​the intersection between the electrode 592 and the wiring 594. This reduces the area of ​​the region where no electrodes are provided, and reduces variations in transmittance. As a result, unevenness in brightness of light passing through the touch sensor 595 can be reduced.

[0243] The shapes of the electrodes 591 and 592 are not limited to this, and may take various shapes. For example, a plurality of electrodes 591 are arranged with as few gaps as possible, and the electrodes 591 are connected to each other via an insulating layer. 92 may be provided at intervals so as to form an area that does not overlap with the electrode 591. At this time, a dummy electrode 592 is placed between two adjacent electrodes 592, and is electrically insulated from these electrodes. Providing an electrode is preferable because it can reduce the area of ​​the region with different transmittance.

[0244] The touch sensor 595 includes a substrate 590, electrodes 591 arranged in a staggered pattern on the substrate 590, and and electrode 592, an insulating layer 593 covering electrode 591 and electrode 592, and adjacent electrodes 591 and a wiring 594 for electrically connecting the

[0245] The adhesive layer 597 adheres the substrate 590 to the touch sensor 595 so that the touch sensor 595 overlaps the display unit 501. It is glued to board 570.

[0246] The electrode 591 and the electrode 592 are formed using a light-transmitting conductive material. Conductive materials that can be used include indium oxide, indium tin oxide, and indium zinc oxide. Conductive oxides such as zinc oxide and zinc oxide doped with gallium can be used. A film containing graphene can also be used. The film containing graphene is, for example, in the form of a film. The graphene oxide film can be formed by reducing the graphene oxide film. Examples of the method include a method of applying heat.

[0247] After forming a film of a light-transmitting conductive material on a substrate 590 by sputtering, By using various patterning techniques such as lithography, unnecessary parts are removed to form electrodes 59. 1 and electrode 592 can be formed.

[0248] The insulating layer 593 may be made of a resin such as acrylic or epoxy. In addition to resins with siloxane bonds, silicon oxide, silicon oxynitride, and aluminum oxide Inorganic insulating materials such as the above may also be used.

[0249] An opening reaching the electrode 591 is provided in the insulating layer 593, and a wiring 594 is formed on the adjacent electrode 591 is electrically connected. The transparent conductive material increases the aperture ratio of the touch panel. Therefore, it can be suitably used for the wiring 594. 2. Materials with higher conductivity can reduce electrical resistance and are therefore suitable for use as wiring 594. can.

[0250] One electrode 592 extends in one direction, and multiple electrodes 592 are provided in a stripe pattern. .

[0251] The wiring 594 is provided to intersect with the electrodes 592 .

[0252] A pair of electrodes 591 are provided with one electrode 592 sandwiched therebetween, and wiring 594 is connected to the pair of electrodes 591 are electrically connected.

[0253] The plurality of electrodes 591 do not necessarily have to be arranged in a direction perpendicular to one electrode 592. The angle between the first and second electrodes may be less than 90 degrees.

[0254] One of the wirings 598 is electrically connected to the electrode 591 or the electrode 592. The wiring 598 is made of, for example, aluminum, gold, platinum, silver, or the like. , nickel, titanium, tungsten, chromium, molybdenum, iron, cobalt, copper, or para Metal materials such as zinc and alloy materials containing such metal materials can be used.

[0255] Note that an insulating layer is provided to cover the insulating layer 593 and the wiring 594 to protect the touch sensor 595. It is possible.

[0256] Furthermore, the connection layer 599 electrically connects the wiring 598 and the FPC 509(2).

[0257] The connection layer 599 may be made of various anisotropic conductive films (ACFs). Conductive Film) and Anisotropic Conductive Paste (ACP) Opic Conductive Paste, etc. can be used.

[0258] The adhesive layer 597 is transparent. For example, a thermosetting resin or an ultraviolet curing resin may be used. Specifically, the resin may have an acrylic, urethane, epoxy, or siloxane bond. Resins such as resins can be used.

[0259] The display unit 501 includes a plurality of pixels arranged in a matrix. The display device includes a pixel circuit that drives the display element.

[0260] In this embodiment, an organic EL element that emits white light is applied to a display element. However, the display element is not limited to this.

[0261] For example, organic EL elements with different luminescent colors can be used as sub-pixels so that the color of light emitted varies from sub-pixel to sub-pixel. It may be applied pixel by pixel.

[0262] The substrate 510, the substrate 570, and the sealing layer 560 can have the same configuration as in the first configuration example.

[0263] The pixel includes a sub-pixel 502R, which comprises a light-emitting module 580R.

[0264] The sub-pixel 502R supplies power to the first light-emitting element 550R and the second light-emitting element 550R. The light emitting module further includes a pixel circuit including a transistor 502t. 580R includes a first light emitting element 550R and an optical element (eg, a color layer 567R).

[0265] The first light emitting element 550R has a lower electrode, an upper electrode, and an EL layer between the lower electrode and the upper electrode. Has.

[0266] The light emitting module 580R has a first colored layer 567R in the light extraction direction.

[0267] In addition, when the sealing layer 560 is provided on the light extraction side, the sealing layer 560 is It contacts the light emitting element 550R and the first colored layer 567R.

[0268] The first colored layer 567R is located so as to overlap the first light emitting element 550R. A part of the light emitted by the first light emitting element 550R is transmitted through the first colored layer 567R and becomes The light is emitted to the outside of light emitting module 580R in the direction of the arrow.

[0269] The display unit 501 has a light-shielding layer 567BM in the light-emitting direction. , and is provided so as to surround the colored layer (for example, the first colored layer 567R).

[0270] The display unit 501 includes an anti-reflection layer 567p at a position overlapping the pixel. For example, a circular polarizer can be used as p.

[0271] The display portion 501 includes an insulating film 521. The insulating film 521 covers the transistor 502t. The insulating film 521 is used as a layer for flattening unevenness caused by the pixel circuit. In addition, a laminated film including a layer capable of suppressing the diffusion of impurities may be applied to the insulating film 521. This can reduce the reliability of the transistor 502t and the like due to the diffusion of impurities. This can suppress the decline in

[0272] The display unit 501 has a light-emitting element (for example, a first light-emitting element 550R) on an insulating film 521. do.

[0273] The display portion 501 has a partition wall 528 on the insulating film 521, which overlaps with an end portion of the first lower electrode. In addition, a spacer for controlling the distance between the substrate 510 and the substrate 570 is provided on the partition wall 528 .

[0274] The scanning line driver circuit 503g(1) includes a transistor 503t and a capacitor 503c. In addition, the driver circuit can be formed on the same substrate as the pixel circuit in the same process.

[0275] The display unit 501 includes a wiring 511 capable of supplying a signal, and a terminal 519 is connected to the wiring 511. 11. In addition, F PC 509(1) is electrically connected to terminal 519.

[0276] A printed wiring board (PWB) may be attached to the FPC509(1). stomach.

[0277] The display portion 501 has wiring such as scanning lines, signal lines, and power supply lines. can be used for wiring.

[0278] Note that various transistors can be applied to the display portion 501. The configuration in which the data is applied to the display unit 501 is shown in FIGS.

[0279] For example, a semiconductor layer containing an oxide semiconductor, amorphous silicon, or the like is formed as shown in FIG. This can be applied to the transistor 502t and the transistor 503t shown.

[0280] For example, a semiconductor containing polycrystalline silicon crystallized by a process such as laser annealing. The layer is applied to the transistor 502t and the transistor 503t shown in FIG. It is possible.

[0281] 14 shows a configuration in which a top-gate transistor is applied to the display unit 501. Illustrated in (C).

[0282] For example, a single crystal silicon film transferred from a polycrystalline silicon or single crystal silicon substrate, etc. The semiconductor layer including the above is used as the transistor 502t and the transistor 502t shown in FIG. Can be applied to 03t.

[0283] <Configuration example 3> 15 is a cross-sectional view of touch panel 505B. The display unit 505B displays the supplied image information on the side where the transistor is provided. The touch sensor is provided on the substrate 510 side of the display unit. This is different from the touch panel 505 of Example 2. The different configuration will be described in detail here. The above description is applicable to the parts where the above configuration can be used.

[0284] The first colored layer 567R is located at a position overlapping the first light emitting element 550R. The first light emitting element 550R shown in A) emits light toward the side where the transistor 502t is provided. As a result, a part of the light emitted by the first light emitting element 550R is emitted through the first colored layer 567. The light passes through R and is emitted to the outside of light emitting module 580R in the direction of the arrow shown in the figure.

[0285] The display unit 501 has a light-shielding layer 567BM in the light-emitting direction. , and is provided so as to surround the colored layer (for example, the first colored layer 567R).

[0286] The touch sensor 595 is provided on the substrate 510 side of the display unit 501 (FIG. 15(A)). ).

[0287] The adhesive layer 597 is located between the substrate 510 and the substrate 590, and connects the display unit 501 and the touch sensor 5 Glue 95 together.

[0288] Note that various transistors can be applied to the display portion 501. The configuration when the data is applied to the display unit 501 is shown in FIGS.

[0289] For example, a semiconductor layer containing an oxide semiconductor, amorphous silicon, or the like is formed as shown in FIG. This can be applied to the transistor 502t and the transistor 503t shown.

[0290] For example, a semiconductor layer containing polycrystalline silicon or the like is formed as a transistor 5 shown in FIG. 02t and transistor 503t.

[0291] 15 shows a configuration in which a top-gate transistor is applied to the display unit 501. Illustrated in (C).

[0292] For example, a semiconductor layer including polycrystalline silicon or a transferred single-crystal silicon film is formed as shown in FIG. This can be applied to the transistor 502t and the transistor 503t shown in FIG. do.

[0293] This embodiment may be combined, at least in part, with other embodiments described in this specification. It can be implemented in combination. [Explanation of symbols]

[0294] 100 Electronic equipment 101 Display section 102 Case 102a housing 102b housing 102c chassis 103 Display area 104 Hidden area 105 Camera 106 Light source 111 areas 112 areas 113 areas 114 Luminous Area 120 boards 121 circuits 121a circuit 121b circuit 121c circuit 122 circuits 122a circuit 122b circuit 122c circuit 123 Wiring 124 FPC 125 IC 126a wiring 126b wiring 127a wiring 127b wiring 131B Pixel electrode 131G pixel electrode 131R pixel electrode 132 Electrode 133 EL layer 134 Electrode 135B Color Filter 135G Color Filter 135R color filter 136B EL layer 136G EL layer 136R EL layer 141 Insulating layer 142 PCB 143 Insulating Layer 144 Encapsulating material 150 Electronic equipment 151 Hinge 152 Battery 160 Electronic equipment 201 Fabricated substrate 203 Peeling layer 205 Fabricated substrate 207 Peeling layer 301 Display section 302 pixels 302B subpixel 302G subpixel 302R subpixel 302t transistor 303c capacity 303g(1) Scanning line driver circuit 303g(2) Imaging pixel drive circuit 303s(1) Image signal line driver circuit 303s(2) Image signal line driver circuit 303t transistor Gate 304 308 imaging pixels 308p photoelectric conversion element 308t transistor 309 FPC 311 Wiring 319 terminal 321 Insulating Layer 328 Bulkhead 329 Spacer 350R light emitting element 351R lower electrode 352 Upper electrode 353 EL layer 353a EL layer 353b EL layer 354 Middle Class 360 sealing layer 367BM light shielding layer 367p anti-reflection layer 367R colored layer 380B Light Emitting Module 380G light emitting module 380R Light Emitting Module 390 Touch Panel 501 Display section 502R subpixel 502t transistor 503c capacity 503g Scanning line driver circuit 503t transistor 505 touch panel 505B Touch Panel 509 FPC 510 board 510a Insulating layer 510b flexible substrate 510c adhesive layer 511 Wiring 519 terminal 521 Insulating film 528 Bulkhead 550R light emitting element 560 Sealing Layer 567BM light shielding layer 567p anti-reflection layer 567R colored layer 570 PCB 570a Insulating layer 570b flexible substrate 570c ​​adhesive layer 580R Light Emitting Module 590 PCB 591 Electrode 592 Electrode 593 Insulating Layer 594 Wiring 595 Touch Sensor 597 Adhesive layer 598 Wiring 599 Connection Layer 801 board 803 board 804 Light-emitting part 806 Drive circuit section 808 FPC 811 Adhesive layer 813 Insulation layer 814 Conductive layer 815 Insulation layer 816 Conductive layer 817 Insulating layer 817a Insulating layer 817b Insulating layer 820 transistors 821 Insulation layer 822 transistor 823 Sealing layer 824 Sealing layer 825 Connector 827 Spacer 830 Light-emitting element 831 Lower electrode 833 EL layer 835 Upper electrode 841 Adhesive layer 843 Insulation Layer 845 Colored layer 847 Light blocking layer 849 Overcoat 857 Conductive layer 857a Conductive layer 857b Conductive layer

Claims

[Claim 1] A camera and a display unit having an area located on the same side as the camera, the display unit has a plurality of pixels arranged in a matrix, Each of the plurality of pixels includes a transistor and a light-emitting element electrically connected to the transistor, The display unit has a function of displaying an image and a function of emitting light at a color temperature in the range of 2000K to 8000K as a light source when photographing a subject with the camera.

Images