Method for manufacturing inorganic material, apparatus for manufacturing inorganic material, and method for disassembling composite material

Abstract

To provide a method for producing an inorganic material by which the thermal decomposition temperature of an organic material can be made lower than that of a conventional method.SOLUTION: The method for manufacturing the inorganic material 105 includes a contact step S1 of bringing the composite material 101 including the inorganic material 105 composed of an inorganic substance and the organic material 106 composed of an organic substance into contact with the decomposition-accelerating ingredient 102 for accelerating thermal decomposition of the organic material 106, and a heat treatment step S3 of heating the integrated object 107 including the composite material 101 and the decomposition-accelerating ingredient 102 in contact with each other in an oxidizing atmosphere, the decomposition-accelerating ingredient 102 including a copper ingredient containing copper and titanium oxide. An amount of the copper component is at least 25% by mass and no greater than 75% by mass relative to a total amount of the copper component and the titanium oxide.SELECTED DRAWING: Figure 1

Description

[Technical Field]

[0001] The present disclosure relates to a method for producing an inorganic material, an apparatus for producing an inorganic material, and a method for decomposing a composite material. [Background technology]

[0002] In response to environmental regulations and energy conservation, efforts are being made to reduce the weight of structures such as home appliances, railway vehicles, aircraft, and automobiles. Among these, composite materials such as fiber-reinforced resins containing inorganic materials such as fibers and fillers are being used as structural components. This reduces the weight and improves the rigidity of structural components. However, composite materials contain multiple materials, and there is a demand for separating the inorganic materials from the composite materials in order to recycle the inorganic materials. Patent Document 1 describes a technique for separating the inorganic materials from the composite materials.

[0003] The abstract of Patent Document 1 states that "when producing fuel from a treatment object containing a polymeric organic substance, the method includes a step of contacting the treatment object with a catalyst containing an oxide semiconductor and a transition metal element, and a step of heating the treatment object that has been contacted with the catalyst containing the oxide semiconductor and the transition metal element in an atmosphere containing hydrogen and oxygen." [Prior art documents] [Patent documents]

[0004] [Patent Document 1] Japanese Patent Publication No. 2022-55446 Summary of the Invention [Problem to be solved by the invention]

[0005] In the technology described in Patent Document 1, organic matter is burned using copper and titanium oxide in a reducing atmosphere containing hydrogen as described above (paragraphs 0023, 0025, 0026, and 0039). This allows the inorganic matter in the composite material to be separated. As will be described in detail later with reference to the Examples, the inventors of the present invention have conducted research and found that heating in an oxidizing atmosphere can significantly lower the thermal decomposition temperature of organic matter. The problem to be solved by the present disclosure is to provide a method for producing an inorganic material, an apparatus for producing an inorganic material, and a method for decomposing a composite material, which are capable of lowering the thermal decomposition temperature of an organic material compared to conventional methods. [Means for solving the problem]

[0006] The method for producing an inorganic material according to the present disclosure includes a contacting step of contacting a composite material containing an inorganic material composed of an inorganic substance and an organic material composed of an organic substance with a decomposition-promoting component that promotes the thermal decomposition of the organic material, and a heating step of heating an integrated body containing the contacted composite material and the decomposition-promoting component in an oxidizing atmosphere, the decomposition-promoting component including a copper component containing copper and titanium oxide. Other solutions will be described later in the description of the preferred embodiments of the present invention. [Effects of the Invention]

[0007] According to the present disclosure, it is possible to provide a method for producing an inorganic material, an apparatus for producing an inorganic material, and a method for decomposing a composite material, which are capable of lowering the thermal decomposition temperature of an organic material compared to conventional methods. [Brief explanation of the drawings]

[0008] [Figure 1] 1 is a flowchart illustrating a method for producing an inorganic material according to the present disclosure. [Figure 2] 10 is a flowchart showing a method for manufacturing an inorganic material according to another embodiment. [Figure 3] 10 is a flowchart showing a method for manufacturing an inorganic material according to another embodiment. [Figure 4] FIG. 1 is a perspective view showing the inside of an inorganic material manufacturing apparatus according to the present disclosure. [Figure 5] FIG. 10 is a perspective view showing the inside of an inorganic material manufacturing apparatus according to another embodiment. [Figure 6] 1 is a graph showing the decomposition temperature versus the proportion of copper (II) oxide in the total mass of titanium oxide and copper (II) oxide. [Figure 7] 1 is a graph showing the change in mass of organic materials for each decomposition-accelerating component. DETAILED DESCRIPTION OF THE INVENTION

[0009] Hereinafter, modes for carrying out the present disclosure (hereinafter referred to as "embodiments") will be described with reference to the drawings. In the following description of one embodiment, other embodiments applicable to the one embodiment will also be described as appropriate. The present disclosure is not limited to the one embodiment described below, and different embodiments can be combined with each other or modified as desired without significantly impairing the effects of the present disclosure. Furthermore, the same components will be given the same reference numerals, and redundant descriptions will be omitted. Furthermore, components having the same functions will be given the same names. The contents shown are merely schematic, and for convenience of illustration, changes may be made from the actual configuration within the scope of not significantly impairing the effects of the present disclosure, and some components may be omitted or modified between drawings. Furthermore, the same embodiment does not necessarily have to include all of the configurations.

[0010] FIG. 1 is a flowchart showing a method for producing an inorganic material 105 according to the present disclosure (hereinafter simply referred to as the "production method of the present disclosure"). The production method of the present disclosure can be performed using, for example, a production apparatus 200 shown in FIG. 4, which will be described later. The production method of the present disclosure is a method for producing an inorganic material 105 from a composite material 101 containing an inorganic material 105 and an organic material 106 (for example, consisting of the inorganic material 105 and the organic material 106). The inorganic material 105 can be produced by thermally decomposing (for example, oxidatively decomposing (combustion, etc.)) the organic material 106 in the composite material 101. Therefore, the production method of the present disclosure is also a method for decomposing a composite material 101 according to the present disclosure (hereinafter simply referred to as the "decomposition method of the present disclosure"). The following description will focus on the production method of the present disclosure, and a description of the decomposition method of the present disclosure will be omitted as appropriate. The matters described below regarding the production method of the present disclosure can be similarly applied to the decomposition method of the present disclosure.

[0011] First, for convenience of explanation, the inorganic material 105, the organic material 106, and the composite material 101 will be explained, and then the manufacturing method of the present disclosure (the decomposition method of the present disclosure) will be explained.

[0012] The composite material 101 can be, for example, so-called "waste plastics" obtained from waste products such as home appliances (washing machines, dryers, refrigerators, vacuum cleaners, hot water heaters, etc.), aircraft, railroad cars, automobiles, and industrial products. Therefore, the manufacturing method (disassembly method) of the present disclosure can also be said to be a method for recycling the composite material 101 and the inorganic material 105. The obtained inorganic material 105 can be reused as a part of a new composite material 101, for example, as a recycled material.

[0013] The inorganic material 105 in the composite material 101 from which the inorganic material 105 is produced (separated and recovered) may be a virgin material or a recycled material. The recycled material may be, for example, an inorganic material 105 produced by the production method of the present disclosure. Hereinafter, when simply referring to the "inorganic material 105," the inorganic material 105 may be either a virgin material or a recycled material unless otherwise specified.

[0014] In the decomposition method of the present disclosure, the organic material 106 in the composite material 101 is thermally decomposed at a lower temperature than conventional temperatures (for example, 400°C or lower, preferably 380°C or lower, more preferably 370°C or lower, even more preferably 350°C or lower, and particularly preferably 330°C or lower), as will be described in detail later. In the present disclosure, the thermal decomposition (thermal decomposition reaction) of the organic material 106 is carried out in an oxidizing atmosphere, and therefore can also be considered oxidative decomposition. By performing the thermal decomposition at a lower temperature than conventional temperatures, thermal degradation of the inorganic material 105 contained together with the organic material 106 can be suppressed, and changes in the physical properties of the inorganic material 105, such as a decrease in strength, can be suppressed. This makes it possible to produce a new composite material 101 whose physical properties are comparable to those of a composite material 101 using virgin inorganic material 105.

[0015] The inorganic material 105 contained in the composite material 101 is composed of an inorganic substance. Examples of inorganic substances include inorganic fibers, inorganic fillers, and metals. Examples of inorganic fibers include glass fibers, asbestos fibers, carbon fibers, silica fibers, silica-alumina fibers, alumina fibers, zirconia fibers, potassium titanate fibers, Tyranno fibers, silicon carbide fibers, and metal fibers. These inorganic fibers can be used alone or in combination of two or more. Inorganic fibers are used in the form of continuous fibers, long fibers, short fibers, chopped fibers, and the like, and in the form of unidirectional materials, plain weaves, nonwoven fabrics, and the like. However, the fiber shape or state is not limited to these fiber shapes or states.

[0016] Examples of inorganic fillers include powders of fused silica, crystalline silica, alumina, zircon, calcium silicate, calcium carbonate, potassium titanate, silicon carbide, aluminum nitride, boron nitride, beryllia, zircon, fosterite, stearite, spirel, mullite, titania, etc., as well as beads obtained by spheroidizing these. There are no limitations on the shape of the inorganic filler, and any shape, such as spherical or flaky, may be used.

[0017] Examples of metals contained in the inorganic material 105 include steel, aluminum, aluminum alloys, magnesium alloys, titanium alloys, etc. There is no limitation on the shape of the metal, and any shape such as plate, sphere, or flake may be used.

[0018] Of these, the inorganic material 105 preferably includes at least one of carbon fiber and glass fiber. These are often used to improve the strength of the composite material 101, for example. For this reason, the composite material 101 has high strength, but due to this high strength, it is difficult to remove (separate) the inorganic material 105 from the composite material 101, for example, by crushing the composite material 101. However, according to the manufacturing method of the present disclosure, as described above, the thermal decomposition temperature of the organic material 106 can be lowered compared to conventional methods. Therefore, the organic material 106 can be easily thermally decomposed, and the inorganic material 105 can be removed (manufactured) from the composite material 101.

[0019] The organic material 106 is made of an organic substance, and the organic substance includes a resin such as a thermosetting resin or a thermoplastic resin. Examples of thermosetting resins include epoxy resin, phenolic resin, urea resin, melamine resin, unsaturated polyester resin, silicone resin, polyimide resin, bismaleimide resin, and thermosetting urethane resin. Examples of thermoplastic resins include polyethylene, polypropylene, polystyrene, acrylonitrile butadiene styrene, polyvinyl chloride, methacrylic resin, polyethylene terephthalate, polybutylene terephthalate, polyvinyl alcohol, polyamide, and polycarbonate. One type of resin may be used alone, or two or more types may be used in any desired ratio.

[0020] In particular, it is preferable that the organic material 106 contains a thermosetting resin. Because a thermosetting resin hardens when heated, it is difficult to melt the organic material 106, and it is difficult to separate the inorganic material 105 contained therein from the organic material 106. However, according to the manufacturing method of the present disclosure, the thermal decomposition temperature of the organic material 106 can be lowered compared to conventional methods. This allows the organic material 106 to be easily thermally decomposed, and the inorganic material 105 to be extracted from the composite material 101.

[0021] When the inorganic material 105 is a resin and the organic material 106 is a fiber, the composite material 101 is, for example, a fiber-reinforced resin.

[0022] There are no particular limitations on the contents of inorganic material 105 and organic material 106 in composite material 101. For example, the content of inorganic material 105 in composite material 101 may be 30% by mass or more and 70% by mass or less, and the remainder other than inorganic material 105 may be organic material 106.

[0023] The composite material 101 may contain additives such as flame retardants, antioxidants, light stabilizers, dispersants, lubricants, plasticizers, antistatic agents, pigments, and dyes, as needed.

[0024] The manufacturing method of the present disclosure includes a contacting step S1, an atmosphere controlling step S2, and a heating step S3. The contacting step S1 is a step of contacting a composite material 101 with a decomposition-promoting component 102. The contact results in a united product 107 in which the composite material 101 and the decomposition-promoting component 102 have come into contact with each other (i.e., the united product 107 includes the contacted composite material 101 and the decomposition-promoting component 102). In the present disclosure, mixing is exemplified as an example of contact. Therefore, the contacting of the composite material 101 with the decomposition-promoting component 102, i.e., mixing, produces a mixture (an example of the united product 107) including the composite material 101 and the decomposition-promoting component 102. Note that the "mixing" does not necessarily mean that the composite material 101 and the decomposition-promoting component 102 are mixed completely and uniformly; for example, the composite material 101 and the decomposition-promoting component 102 may coexist in the same reaction vessel 1 (FIG. 4).

[0025] The manner of contact is not particularly limited. For example, composite material 101 pulverized into rods having a length of approximately 1 mm to 10 mm can be mixed with decomposition-promoting component 102 in powder form (for example, an average particle size determined by a laser diffraction scattering method of, for example, 10 μm to 500 μm). In particular, by using decomposition-promoting component 102 in powder form and bringing powdered decomposition-promoting component 102 into contact with composite material 101, the contact area between decomposition-promoting component 102 and composite material 101 can be increased. This can promote the thermal decomposition of organic material 106 that occurs at the contact area between decomposition-promoting component 102 and organic material 106.

[0026] However, the mode of the decomposition-promoting component 102 and the composite material 101 is not limited to contact between the powdered decomposition-promoting component 102 and the composite material 101, and for example, a structure in which the powdered decomposition-promoting component 102 is supported on, for example, a honeycomb carrier may be brought into contact with the composite material 101. In this case, the decomposition-promoting component 102 after being supported does not have a powdery form because it is supported on the honeycomb carrier.

[0027] The contact (e.g., mixing) can be carried out, for example, inside the reaction vessel 1 (an example of a vessel). Specifically, the contact can be carried out by placing the composite material 101 and the decomposition-promoting component 102 in the reaction vessel 1 and appropriately stirring, vibrating, or the like. Alternatively, the decomposition-promoting component 102 may be attached to a structure such as the wall surface of the reaction vessel 1 or the stirring mechanism 5 (FIG. 4), and the composite material 101 may be brought into contact with the attached decomposition-promoting component 102. Alternatively, since it is sufficient that the composite material 101 and the decomposition-promoting component 102 are in contact with each other, the composite material 101 may be placed on a plate-shaped decomposition-promoting component 102 and brought into contact with it.

[0028] The decomposition-accelerating component 102 is a component that accelerates the thermal decomposition of the organic material 106. The decomposition-accelerating component 102 includes a copper component containing copper and titanium oxide. The copper contained in the copper component may be simple copper, copper bonded to any element, copper ions ionized in the liquid, or the like. Hereinafter, when simply referring to "copper," this refers collectively to these.

[0029] The total content of the copper component and titanium oxide is preferably 50% by mass or more, more preferably 70% by mass or more, and particularly preferably 100% by mass, of the entire decomposition-accelerating component 102. Furthermore, it is preferable that the decomposition-accelerating component 102 contains a copper component and titanium oxide as main components. The term "main component" refers to the component (simple substance or compound) that is present in the largest amount by mass when the copper component and titanium oxide are considered collectively as one component. For example, the main component refers to that component when only one component is present (here, the copper component and titanium oxide are considered collectively as one component), the component that is present in a relatively large amount when two components are present, and the component that is present in the largest amount when three or more components are present.

[0030] The copper component (copper) contained in the decomposition-accelerating component 102 is preferably at least one of elemental copper and a copper compound. Specific examples of copper compounds include inorganic copper compounds (inorganic copper compounds) and organic copper compounds (organic copper compounds). Examples of inorganic copper compounds include copper oxides such as copper(I) oxide (cuprous oxide, CuO) and copper(II) oxide (CuO), copper chloride, copper sulfate, and copper alloys. Examples of organic copper compounds include copper(II) acetate and copper acetylacetonate(II). One type of copper compound may be contained alone, or two or more types may be contained in any ratio.

[0031] Of these, the copper component preferably contains at least one of copper (I) oxide and copper (II) oxide, and particularly preferably contains at least copper (II) oxide. By including at least copper (II) oxide, the amount of organic material 106 to be thermally decomposed can be increased, improving the processing efficiency of composite material 101. Furthermore, copper (II) oxide remains copper (II) oxide even when heated in an oxidizing atmosphere. Therefore, by using copper (II) oxide, copper (II) oxide can be reused.

[0032] The copper component also preferably includes an organic copper compound. The organic copper compound has a carbon skeleton and therefore has excellent affinity with the organic material 106. Therefore, the organic copper compound easily acts on the organic material 106, and can easily promote the thermal decomposition of the organic material 106.

[0033] It is preferable that the decomposition-promoting component 102 does not contain any oxide semiconductors (excluding copper oxide and titanium oxide). Copper oxide here refers to copper oxide (I) and copper oxide (II). Copper oxide is an oxide semiconductor. As described above, by using a copper compound and titanium oxide in combination, the organic material 106 can be thermally decomposed at a lower temperature than conventional methods. Therefore, by not containing any oxide semiconductors other than titanium oxide and copper oxide (copper oxide), which is an example of a copper compound, the organic material 106 can be thermally decomposed at a low temperature. However, although it is preferable that the component does not contain any oxide semiconductors other than copper oxide and titanium oxide, it may supplementarily contain oxide semiconductors other than copper oxide and titanium oxide.

[0034] The oxide semiconductor other than copper oxide and titanium oxide may include, for example, at least one of a compound that is a thermally stable oxide semiconductor and a compound that forms a thermally stable oxide semiconductor when heated with the organic material 106. Examples of such compounds include at least one of CaO, MnO, ZrO2, WO2, V2O5, Cr2O3, NiO, Fe2O3, Fe3O4, ZnO, CoO, and Co3O4.

[0035] The components contained in the decomposition-promoting component 102 may include components that do not change during the thermal decomposition of the organic material 106, and components that change during the thermal decomposition. Of these, the former components that do not change during the thermal decomposition can be referred to as, for example, a "catalyst." Examples of components that function as such catalysts include, for example, copper (II) oxide and titanium oxide, among the above-mentioned compounds. Examples of components that change during the thermal decomposition include, for example, elemental copper, copper (I) oxide, and organic copper compounds, among the above-mentioned compounds.

[0036] When copper is used as decomposition-accelerating component 102, heating in an oxidizing atmosphere changes the copper to copper oxide (II). However, when copper oxide (II) is used as decomposition-accelerating component 102, as described above, the copper oxide (II) that was originally contained does not usually change.

[0037] The mechanism by which the combined use of copper and titanium oxide can oxidatively decompose the organic material 106 at low temperatures is not entirely clear, but the following mechanism is conceivable, for example: However, the following mechanism is merely speculation, is not limited to this, and other reasons may also be possible.

[0038] Heating copper components and titanium oxide in an oxidizing atmosphere generates copper (II) oxide in the presence of titanium oxide. This causes thermal excitation within the copper (II) oxide, generating holes and electrons. The oxidizing power of the holes causes them to steal electrons from organic matter (organic material 106) surrounding the copper (II) oxide, resulting in oxidative decomposition of the organic matter. In addition, the electrons generated by thermal excitation are transferred to oxygen contained in the atmosphere, generating active oxygen. Active oxygen promotes the oxidative decomposition of organic matter, which also contributes to the oxidative decomposition of the organic matter.

[0039] Furthermore, due to the high activity (reactivity) of copper (II) oxide, the valence of copper contained in copper (II) oxide, and the ease with which holes and electrons are generated in copper (II) oxide, decomposition of organic material 106 may begin, and the decomposition products may be further decomposed by titanium oxide.

[0040] In the decomposition-accelerating component 102, the content of the copper component is, for example, 25% by mass or more and less than 100% by mass, preferably 25% by mass or more and 75% by mass or less, more preferably 30% by mass or more and 70% by mass or less, and particularly preferably 40% by mass or more and 60% by mass or less, relative to the total amount of the copper component and titanium oxide. By containing the copper component in this range, the organic material 106 can be thermally decomposed at a low temperature. Note that when the content of the copper component is less than 100% by mass relative to the total amount of the copper component and titanium oxide, the decomposition-accelerating component 102 contains both the copper component and titanium oxide.

[0041] The content of decomposition-accelerating component 102 relative to organic material 106 is preferably 10% by mass or more and 300% by mass or less. By using an amount of decomposition-accelerating component 102 within this range, organic material 106 can be thermally decomposed. However, the content of decomposition-accelerating component 102 is not limited to this range and can be adjusted as appropriate depending on, for example, the shapes of organic material 106 and decomposition-accelerating component 102, etc.

[0042] The atmosphere control step S2 (FIG. 1) is a step of controlling the atmosphere at the contact portion where the composite material 101 and the decomposition-promoting component 102 are brought into contact. In the example of the present disclosure, for example, the atmosphere of the space (internal space of the reaction vessel 1) in which the integrated object 107 obtained in the contact step S1 is present is controlled. In the atmosphere control step S2, for example, the atmosphere of the space in which the integrated object 107 is placed is controlled to an oxygen-containing gas 103 (FIG. 4), thereby controlling the space to an oxidizing atmosphere. That is, the integrated object 107 is present in the gas 103. The oxidizing atmosphere gas 103 is, for example, air, oxygen gas, etc., but may also contain, for example, 0.01% by volume or less of hydrogen.

[0043] In addition, if at least one of the composite material 101 and the decomposition-promoting component 102 contains a component that can create a desired atmosphere during the heating step S3 (for example, a component that generates oxygen), the atmosphere control step S2 does not need to be included.

[0044] The heating step S3 is a step of heating the integral body 107 containing the contacted composite material 101 and the decomposition-promoting component 102 in an oxidizing atmosphere. In the example of the present disclosure, the heating step S3 is a step of heating the integral body 107 present in the gas 103 inside the reaction vessel 1.

[0045] The heating step S3 is performed by heating at a temperature that thermally decomposes the organic material 106. Heating at this temperature allows the organic material 106 to be thermally decomposed. Specifically, the heating step S3 is performed at a temperature of, for example, 200°C or higher and 400°C or lower, preferably 230°C or higher and 380°C or lower, more preferably 250°C or higher and 370°C or lower, even more preferably 250°C or higher and 350°C or lower, and particularly preferably 300°C or higher and 330°C or lower. Among these, the heating step S3 is preferably performed at a temperature of, for example, 400°C or lower, preferably 380°C or lower, more preferably 370°C or lower, even more preferably 350°C or lower, and particularly preferably 330°C or lower. Heating within this temperature range allows the organic material 106 to be thermally decomposed and also suppresses thermal degradation of the inorganic material 105, which has a significant impact when the recycled inorganic material 105 is reused.

[0046] As described above, the heating step S3 is performed in an oxidizing atmosphere, which can promote oxidative decomposition of the organic material 106 and enable the organic material 106 to be decomposed at a low temperature.

[0047] The oxidizing atmosphere referred to here is preferably a gas containing oxygen and, for example, a hydrogen content of 0.01% by volume or less (it may contain no hydrogen at all). By using such a gas, the organic material 106 can be oxidatively decomposed, and the generation of minor components such as hydrocarbons due to the coexistence of hydrogen can be suppressed. The hydrogen content may be an amount that does not create a reducing atmosphere, for example, 0.01% by volume or less, but may also be, for example, 0.1% by volume or less, preferably 0.05% by volume or less.

[0048] The heating step S3 is preferably performed in a gas phase such as gas 103. That is, it is preferable to heat the integrated body 107 in a gas phase of an oxidizing atmosphere. This makes it easier to control the heating temperature and to remove the inorganic material 105.

[0049] The heating step S3 is preferably performed while at least one of vibrating and stirring the integrated object 107. This increases the contact opportunity between the composite material 101 and the decomposition-promoting component 102, and suppresses a decrease in reaction efficiency due to uneven reaction.

[0050] The heating step S3 is preferably carried out inside the reaction tank 1 (container) used in the contacting step S1. That is, after the contacting step S1 in which the composite material 101 and the decomposition-promoting component 102 are brought into contact inside the reaction tank 1, it is preferable to carry out the heating step S3 directly inside the reaction tank 1 without transferring the integrated object 107 to another container. This can reduce the effort required to put the composite material 101 and the like into and take it out of the reaction tank 1, and the inorganic material 105 can be produced continuously.

[0051] The heating time in the heating step S3 is not particularly limited, but may be, for example, 5 minutes to 1 hour.

[0052] The solid organic material 106 is converted into exhaust gas 104 (FIG. 4) by thermal decomposition of the organic material 106 in the heating step S3. The exhaust gas 104 contains, for example, carbon dioxide and is appropriately discharged to the outside. Meanwhile, the inorganic material 105 contained in the composite material 101 remains in the reaction vessel 1. Therefore, the inorganic material 105 can be extracted from the reaction vessel 1.

[0053] In the heating step S3, heating may be performed in a state where water (liquid or gas) is intentionally present in the reaction system. That is, the oxidizing atmosphere during the heating step S3 may be, for example, an oxidizing atmosphere containing moisture, specifically, for example, air containing moisture. The moisture-containing air can be achieved, for example, by humidifying the air. There is no limit to the amount of humidification, but for example, the gas 103 can be humidified to the extent that it has a saturated water vapor content at the temperature of the gas 103 supplied to the reaction vessel 1, or it may be humidified to, for example, half or more of the saturated water vapor content. As a method of humidification, for example, water vapor can be added to the gas 103 supplied to the reaction vessel 1 (FIG. 5), or the inside of the reaction vessel 1 can be heated while spraying liquid water within a range that does not excessively lower the internal temperature. Heating in the presence of water (liquid or gas) in the reaction system can further lower the decomposition temperature.

[0054] The mechanism by which the decomposition temperature is lowered by the presence of water is not entirely clear, but the following mechanism is conceivable, for example: However, the following mechanism is merely speculation, is not limited to this, and other reasons may also be involved.

[0055] As described above, heating generates copper(II) oxide in the presence of titanium oxide, which causes thermal excitation within the copper(II) oxide, generating holes and electrons. The generated electrons migrate to water in the atmosphere, and the charged water molecules attack the organic matter, causing the organic matter to decompose at low temperatures. Furthermore, the copper(II) oxide and titanium oxide used in the manufacturing method of the present disclosure may function as hydrolysis catalysts, and in this case, the organic matter may react with water in the atmosphere, resulting in hydrolysis of the organic matter.

[0056] FIG. 2 is a flowchart showing a method for producing an inorganic material 105 according to another embodiment. In the embodiment shown in FIG. 2, unlike the embodiment shown in FIG. 1, a contacting step S1 is performed after an atmosphere controlling step S2. Specifically, for example, the atmosphere in the internal space of a reaction vessel 1 (FIG. 4) in which a decomposition-promoting component 102 is placed (housed) is, for example, an oxidizing atmosphere, and is composed of, for example, a gas 103 (FIG. 4) containing oxygen (atmosphere controlling step S2). Therefore, the decomposition-promoting component 102 is present in the gas 103. Then, by further housing a composite material 101 in the reaction vessel 1 in this state, the atmosphere around the integrated object 107 becomes, for example, an oxidizing atmosphere (contacting step S1).

[0057] The embodiment shown in FIG. 2 also makes it possible to oxidatively decompose the organic material 106 at a lower temperature than conventional methods.

[0058] FIG. 3 is a flowchart showing another embodiment of a method for producing an inorganic material 105. In the embodiment shown in FIG. 3, the heating step S3 in the embodiment shown in FIG. 2 above includes a preheating step S31 and a main heating step S32. After the atmosphere control step S2, the preheating step S31, which is part of the heating step S3, is performed. The preheating step S31 is a step of raising the temperature of the decomposition-promoting component 102 to the heating temperature in the main heating step S32 described below. After the temperature of the decomposition-promoting component 102 is raised to the desired temperature, the composite material 101 is introduced into the reaction vessel 1, and an integrated object 107 is produced (contact step S1). Then, the main heating step S32 is performed on the integrated object 107. The main heating step S32 can be performed in the same manner as the heating step S3 described above with reference to FIG. 1 etc.

[0059] 3 also makes it possible to oxidatively decompose organic material 106 at a lower temperature than conventional methods. Furthermore, because composite material 101 is brought into contact with preheated decomposition-promoting component 102, it is possible to shorten the time required from bringing composite material 101 into contact with decomposition-promoting component 102 until the temperature is raised to a temperature at which the composite material 101 can be thermally decomposed. This shortens the processing time for composite material 101.

[0060] Fig. 4 is a perspective view showing the inside of a manufacturing apparatus 200 for an inorganic material 105 according to the present disclosure. Fig. 4 illustrates an integrated object 107 in which a composite material 101 is uniformly dispersed in a powdered (particulate) decomposition-promoting component 102. In other words, the composite material 101 broken (crushed) into elongated rod shapes (chip shapes) is embedded in the powdered decomposition-promoting component 102. However, the integrated object 107 is not limited to the shape shown in the figure, and it is sufficient that the composite material 101 and the decomposition-promoting component 102 come into contact with each other and are integrated together.

[0061] The manufacturing apparatus 200 includes a reaction vessel 1, a heating mechanism 2, a supply port 3, a discharge port 4, and a stirring mechanism 5. The reaction vessel 1 (storage vessel) is a vessel that stores a composite material 101 and a decomposition-promoting component 102. In the example of the present disclosure, a thermal decomposition reaction (oxidative decomposition reaction) of the organic material 106 in the composite material 101 proceeds inside the reaction vessel 1. In the example of the present disclosure, the reaction vessel 1 is, for example, a hollow tank. The heating mechanism 2 is a mechanism that heats the inside of the reaction vessel 1. In the example of the present disclosure, the heating mechanism 2 heats the composite material 101 and the decomposition-promoting component 102 inside the reaction vessel 1. The heating mechanism 2 is provided at the bottom of the reaction vessel 1 and heats the composite material 101 and the decomposition-promoting component 102 from the bottom of the reaction vessel 1. The heating mechanism 2 is, for example, an electric heating wire, a boiler, or the like.

[0062] The supply port 3 is an opening (air inlet) for supplying a fluid into the reaction vessel 1. The fluid is, for example, gas 103. As described above, the gas 103 is a gas containing oxygen. Preferably, the gas 103 contains oxygen and has a hydrogen content of 0.01% by volume or less (it may contain no hydrogen at all). The outlet 4 is an opening (exhaust port) for discharging the fluid inside the reaction vessel 1 from the reaction vessel 1. The fluid is, for example, exhaust gas 104. The exhaust gas 104 contains gas (e.g., carbon dioxide, water vapor, etc.) generated by the thermal decomposition of the organic material 106. When the organic material 106 is discharged from the reaction vessel 1 as a gas, the inorganic material 105 remains inside the reaction vessel 1, making it easier to remove the inorganic material 105. The supply port 3 and the outlet 4 are provided at the top of the reaction vessel 1. Note that the exhaust gas 104 may also contain unreacted gas 103.

[0063] 5 is a perspective view showing the inside of a manufacturing apparatus 200 for manufacturing an inorganic material 105 according to another embodiment. The manufacturing apparatus 200 shown in FIG. 5 further includes a separation mechanism 6 that separates the inorganic material 105 from the inside of the reaction tank 1. The separation mechanism 6 is, for example, provided near the bottom of the reaction tank 1, and is an opening (separation port) that can separate the inorganic material 105 produced in the reaction tank 1 from the integral mass 107. By including the separation mechanism 6, for example, the inorganic material 105 can be separated from the integral mass 107 that remains while the oxidative decomposition reaction is progressing in the reaction tank 1.

[0064] The present disclosure is not limited to the above-described embodiments, and includes various modifications. For example, the above-described embodiments have been described to clearly explain the present disclosure, and the present disclosure is not necessarily limited to those having all of the described configurations. Next, the manufacturing method, manufacturing apparatus 200, and disassembly method of the present disclosure will be described in more detail with reference to examples. [Example]

[0065] Example 1 A bisphenol A diglycidyl ether type thermosetting epoxy resin (thermosetting resin) was used as the organic material 106, and glass fiber was used as the inorganic material 105, to produce a glass fiber reinforced plastic (GFRP) as the composite material 101. The content of inorganic material 105 in the composite material 101 was set to 50 mass %. Therefore, the content of organic material 106 in the composite material 101 was also 50 mass %. The composite material 101 was broken into chips measuring approximately 5 mm in length, 2 mm in width, and 0.2 mm in thickness.

[0066] Powdered copper oxide (II) oxide (CuO, an example of a copper component) and titanium oxide (TiO2) were prepared as decomposition-accelerating component 102. These were mixed in a mass ratio of 1:1 to produce decomposition-accelerating component 102 in which the contents of copper oxide (II) and titanium oxide were both 50 mass%. Therefore, in decomposition-accelerating component 102, the content of copper oxide (II) (copper component) was 50 mass% relative to the total amount of the copper component and titanium oxide.

[0067] The particle diameters of the copper (II) oxide and titanium oxide were, for example, 100 μm as the average particle diameter based on a laser diffraction scattering method. The chip-like composite material 101 and the powdered decomposition-promoting component 102 were mixed to obtain an integrated product 107. The content of the decomposition-promoting component 102 in the integrated product 107 was set to 50 mass %. Therefore, the content of the composite material 101 in the integrated product 107 was also 50 mass %. Therefore, the content of the decomposition-promoting component 102 relative to the organic material 106 in the composite material 101 was 200 mass %.

[0068] The decomposition behavior of the organic material 106 was analyzed using the monolith 107. The analysis was performed using a thermal mass reduction device. The analysis was performed by heating the monolith 107 from room temperature (25°C) to 700°C at a rate of 10°C / min. The analysis was performed by exposing the monolith 107 to an air atmosphere (an oxidizing atmosphere containing oxygen and with a hydrogen content of 0.01% by volume or less). The temperature at which the mass of the organic material 106 became 10% (i.e., almost no organic material 106 remained) was defined as the decomposition temperature.

[0069] Analysis revealed that the decomposition temperature was 301°C.

[0070] <Example 2> The decomposition temperature was analyzed in the same manner as in Example 1, except that copper (II) oxide and titanium oxide were used in combination so that the mass ratio of copper (II) oxide was 40 mass% and the mass ratio of titanium oxide was 60 mass% in decomposition-accelerating component 102. As a result, the decomposition temperature was 332°C.

[0071] Example 3 The decomposition temperature was analyzed in the same manner as in Example 1, except that copper (II) oxide and titanium oxide were used in combination so that the mass ratio of copper (II) oxide was 30 mass % and the mass ratio of titanium oxide was 70 mass % in the decomposition-accelerating component 102. As a result, the decomposition temperature was 342°C.

[0072] Example 4 The decomposition temperature was analyzed in the same manner as in Example 1, except that copper (II) oxide and titanium oxide were used in combination so that the mass ratio of copper (II) oxide was 60 mass % and the mass ratio of titanium oxide was 40 mass % in the decomposition-accelerating component 102. As a result, the decomposition temperature was 333°C.

[0073] <Example 5> The decomposition temperature was analyzed in the same manner as in Example 1, except that copper (II) oxide and titanium oxide were used in combination so that the mass ratio of copper (II) oxide was 70 mass % and the mass ratio of titanium oxide was 30 mass % in decomposition-accelerating component 102. As a result, the decomposition temperature was 348°C.

[0074] Example 6 The decomposition temperature was analyzed in the same manner as in Example 1, except that copper oxide (I) (CuO) was used instead of copper oxide (II). As a result, the decomposition temperature was 314°C.

[0075] Example 7 The decomposition temperature was analyzed in the same manner as in Example 1, except that copper (Cu) was used instead of copper (II) oxide. As a result, the decomposition temperature was 333°C.

[0076] Example 8 The decomposition temperature was analyzed in the same manner as in Example 1, except that the copper (II) oxide and titanium oxide were changed from powder to honeycomb. Specifically, the copper (II) oxide and titanium oxide, both in powder form, used in Example 1 were supported on the surface of a ceramic honeycomb carrier, which does not affect the decomposition temperature, to obtain a structure supporting the decomposition-promoting component 102. The size of the structure was a cube with a side length of 10 mm. The size of the holes present in the honeycomb alone was approximately 0.5 mm, and the composite material 101 could penetrate into the holes. The obtained structure was then brought into contact (mixed) with the composite material 101, and the decomposition temperature was analyzed in the same manner as in Example 1. As a result, the decomposition temperature was 349°C.

[0077] Example 9 Except for using carbon fiber instead of glass fiber, the decomposition temperature was analyzed in the same manner as in Example 1. As a result, the decomposition temperature was 308°C.

[0078] Example 10 The decomposition temperature was analyzed in the same manner as in Example 1, except that an unsaturated polyester resin, which is a thermosetting resin, was used instead of the bisphenol A diglycidyl ether type epoxy resin. As a result, the decomposition temperature was 328°C.

[0079] Example 11 The decomposition temperature was analyzed in the same manner as in Example 1, except that the content of the decomposition-accelerating component 102 in the monolith 107 was changed from 50% by mass to 10% by mass. Therefore, the content of the decomposition-accelerating component 102 relative to the organic material 106 in the composite material 101 was 20% by mass. As a result, the decomposition temperature was 342°C.

[0080] Example 12 The decomposition temperature was analyzed in the same manner as in Example 1, except that the atmosphere during analysis was changed to an air atmosphere containing water vapor at a saturated water vapor amount at 25°C (an oxidizing atmosphere containing oxygen and water vapor at a saturated water vapor amount at 25°C and with a hydrogen content of 0.01% by volume or less). As a result, the decomposition temperature was found to be 297°C.

[0081] Example 13 The decomposition temperature was analyzed in the same manner as in Example 1, except that copper (II) oxide and titanium oxide were used in combination so that the mass ratio of copper (II) oxide was 20 mass % and the mass ratio of titanium oxide was 80 mass % in decomposition-accelerating component 102. As a result, the decomposition temperature was 396°C.

[0082] Example 14 The decomposition temperature was analyzed in the same manner as in Example 1, except that copper (II) oxide and titanium oxide were used in combination so that the mass ratio of copper (II) oxide was 80 mass % and the mass ratio of titanium oxide was 20 mass % in decomposition-accelerating component 102. As a result, the decomposition temperature was 366°C.

[0083] <Comparative Example 1> The decomposition temperature was analyzed in the same manner as in Example 1, except that copper (II) oxide was not used in the decomposition-accelerating component 102 (i.e., the mass ratio of copper (II) oxide was 0 mass%). As a result, the decomposition temperature was 473°C.

[0084] <Comparative Example 2> The decomposition temperature was analyzed in the same manner as in Example 1, except that no titanium oxide was used in the decomposition-accelerating component 102 (i.e., the mass ratio of copper (II) oxide was 100 mass%). As a result, the decomposition temperature was 356°C.

[0085] <Comparative Example 3> The decomposition temperature was analyzed in the same manner as in Example 1, except that zinc oxide (II) (ZnO) was used instead of titanium oxide. As a result, the decomposition temperature was 409°C.

[0086] <Comparative Example 4> Except for using cobalt oxide (CoO) instead of titanium oxide, the decomposition temperature was analyzed in the same manner as in Example 1. As a result, the decomposition temperature was 404°C.

[0087] <Comparative Example 5> The decomposition temperature was analyzed in the same manner as in Example 1, except that tricobalt tetroxide (Co3O4) was used instead of titanium oxide. As a result, the decomposition temperature was 402°C.

[0088] <Comparative Example 6> The decomposition temperature was analyzed in the same manner as in Example 1, except that dichromium trioxide (Cr2O3) was used instead of titanium oxide. As a result, the decomposition temperature was 395°C.

[0089] <Comparative Example 7> The decomposition temperature was analyzed in the same manner as in Example 1, except that diiron trioxide (Fe2O3) was used instead of titanium oxide. As a result, the decomposition temperature was 412°C.

[0090] <Comparative Example 8> Except for using nickel oxide (NiO) instead of titanium oxide, the decomposition temperature was analyzed in the same manner as in Example 1. As a result, the decomposition temperature was found to be 375°C.

[0091] <Comparative Example 9> The decomposition temperature was analyzed in the same manner as in Example 1, except that tin (II) oxide (SnO) was used instead of titanium oxide, and the result was that the decomposition temperature was 405°C.

[0092] <Comparative Example 10> Except for using tungsten trioxide (WO3) instead of titanium oxide, the decomposition temperature was analyzed in the same manner as in Example 1. As a result, the decomposition temperature was 374°C.

[0093] <Comparative Example 11> Except for using magnesium oxide (MgO) instead of titanium oxide, the decomposition temperature was analyzed in the same manner as in Example 1. As a result, the decomposition temperature was 388°C.

[0094] <Comparative Example 12> The decomposition temperature was analyzed in the same manner as in Example 1, except that aluminum trioxide (Al2O3) was used instead of titanium oxide. As a result, the decomposition temperature was 375°C.

[0095] <Comparative Example 13> Except for using cerium dioxide (CeO2) instead of titanium oxide, the decomposition temperature was analyzed in the same manner as in Example 1. As a result, the decomposition temperature was 414°C.

[0096] <Comparative Example 14> The decomposition temperature was analyzed in the same manner as in Example 1, except that the decomposition conditions were changed from an air atmosphere (oxidizing atmosphere) to an air atmosphere containing hydrogen (reducing atmosphere described in the above Patent Document 1). As a result, the decomposition temperature was 418°C.

[0097] <Summary> The above results are summarized in Table 1 below.

[0098] [Table 1]

[0099] In Comparative Example 14, in which decomposition was performed in a reducing atmosphere, the decomposition temperature was 418°C, as described above. However, in Example 1, which was the same as Comparative Example 14 except for the atmosphere during decomposition, the decomposition temperature was 301°C, indicating that the decomposition temperature can be reduced by 100°C or more simply by changing the atmosphere during thermal decomposition. Therefore, from the results of Example 1 and Comparative Example 14, it was found that according to the present disclosure in which decomposition is performed in an oxidizing atmosphere, the thermal decomposition temperature of organic material 106 can be reduced compared to conventional methods.

[0100] In particular, as shown in Examples 1 to 14, by using copper component and titanium oxide so that the content of copper component is 25 mass % or more and less than 100% of the total amount of copper component and titanium oxide, the decomposition temperature could be further lowered to 380° C. or less (even 370° C. or less), which was found to enable thermal decomposition (oxidative decomposition) of organic material 106 at an even lower temperature than before.

[0101] In particular, as shown in Examples 1 to 12, by using copper component and titanium oxide so that the content of copper component is 25 mass % or more and 75 mass % or less relative to the total amount of copper component and titanium oxide, it was possible to lower the decomposition temperature to a particularly low temperature of 350° C. or less. This revealed that the organic material 106 could be thermally decomposed (oxidatively decomposed) at a temperature lower than conventionally possible.

[0102] <Effect of the content ratio of copper (II) oxide and titanium oxide on the decomposition temperature> 6 is a graph showing the decomposition temperature versus the proportion of copper (II) oxide in the total mass of titanium oxide and copper (II) oxide. In addition to summarizing the above Examples 1 to 5, 13, and 14 and Comparative Examples 1 and 2, the decomposition temperatures were also measured in the same manner as in Example 1 when copper (II) oxide was 10 mass% (titanium oxide was 90 mass%) and when copper (II) oxide was 90 mass% (titanium oxide was 10 mass%).

[0103] As shown in Fig. 6, when the content of copper (II) oxide was 20% by mass or more relative to the total amount of copper (II) oxide and titanium oxide, the decomposition temperature could be kept at approximately 400°C or less. Furthermore, when the content of copper (II) oxide was 25% by mass or more and 80% by mass or less (particularly 25% by mass or more and 75% by mass or less) relative to the total amount of copper (II) oxide and titanium oxide, the decomposition temperature could be kept at 370°C or less. In particular, by setting the content to 30% by mass or more and 70% by mass or less, the decomposition temperature could be kept at 350°C or less, which was lower than the decomposition temperature of copper (II) oxide alone (356°C shown in Comparative Example 2 above) and the decomposition temperature of titanium oxide alone (473°C shown in Comparative Example 1 above).

[0104] <Differences in decomposition behavior due to differences in decomposition-promoting components> FIG. 7 is a graph showing the change in mass of organic material 106 for each decomposition-promoting component. The horizontal axis represents temperature, and the vertical axis represents the mass of organic material 106. The graph shown in FIG. 7 evaluates the decomposition temperature when the type of metal oxide (titanium oxide, etc.) used in combination with copper (II) oxide (an example of a copper component) is changed. The graph shown in FIG. 7 shows the change in mass of organic material 106 when 5 mg of organic material 106 of Example 1, 2.5 mg of copper (II) oxide, and 2.5 mg of the metal oxide (part of decomposition-promoting component 102) in FIG. 7 are mixed and heated at a rate of 10°C / min in air (an oxidizing atmosphere). Therefore, the content of copper (II) oxide is 50% by mass with respect to the total amount of copper (II) oxide and metal oxide.

[0105] The metal oxides used were titanium oxide (Example), zinc oxide (hereinafter referred to as Comparative Example), cobalt oxide, tricobalt tetroxide, dichromium trioxide, triiron dioxide, nickel oxide, tin oxide, tungsten oxide, magnesium oxide, aluminum oxide, and cerium oxide. The other conditions were the same as in Example 1. The mass change was expressed as a relative value, with the mass at 200°C taken as 100%.

[0106] In both cases, the mass of organic material 106 decreased with increasing temperature, indicating that thermal decomposition of organic material 106 progressed. In particular, the mass of organic material 106 rapidly decreased at temperatures between approximately 300°C and 400°C, and it is believed that thermal decomposition of organic material 106 occurred in this range. However, when copper (II) oxide and titanium oxide, as indicated by the thick dotted line, were used in combination, a rapid mass decrease was confirmed at an even lower temperature of approximately 250°C. Furthermore, at approximately 300°C, the mass of organic material 106 decreased to approximately 10%. This demonstrates that the combined use of copper (II) oxide and titanium oxide allows organic material 106 to be decomposed at low temperatures, for example, between 250°C and 300°C. [Explanation of symbols]

[0107] 1 Reaction vessel 101 Composite materials 102 Degradation accelerating components 103 Gas 104 Exhaust Gas 105 Inorganic materials 106 Organic materials 107 One Piece 2 Heating mechanism 200 Manufacturing equipment 3 Supply port 4 Outlet 5 Stirring mechanism 6 Separation mechanism S1 Contact process S2 Atmosphere control process S3 heating process S31 Preheating process S32 Main heating process

Claims

1. a contacting step of contacting a composite material including an inorganic material composed of an inorganic substance and an organic material composed of an organic substance with a decomposition-promoting component that promotes thermal decomposition of the organic material; a heating step of heating an integrated body including the contacted composite material and the decomposition-promoting component in an oxidizing atmosphere; Including, The decomposition-accelerating component includes a copper component containing copper and titanium oxide. A method for producing an inorganic material, comprising:

2. The method for producing an inorganic material according to claim 1, The content of the copper component is 25% by mass or more and less than 100% by mass with respect to the total amount of the copper component and the titanium oxide. A method for producing an inorganic material, comprising:

3. The method for producing an inorganic material according to claim 1, The content of the copper component is 25% by mass or more and 75% by mass or less with respect to the total amount of the copper component and the titanium oxide. A method for producing an inorganic material, comprising:

4. The method for producing an inorganic material according to claim 1, The inorganic material includes at least one of carbon fiber and glass fiber. A method for producing an inorganic material, comprising:

5. The method for producing an inorganic material according to claim 1, The copper component includes at least one of copper (I) oxide and copper (II) oxide. A method for producing an inorganic material, comprising:

6. The method for producing an inorganic material according to claim 1, The heating step is carried out at a temperature of 380° C. or less. A method for producing an inorganic material, comprising:

7. The method for producing an inorganic material according to claim 1, The organic material includes a thermosetting resin. A method for producing an inorganic material, comprising:

8. The method for producing an inorganic material according to claim 1, The content of the copper component is 30% by mass or more and 70% by mass or less based on the total amount of the copper component and the titanium oxide. A method for producing an inorganic material, comprising:

9. The method for producing an inorganic material according to claim 7, The oxidizing atmosphere is a gas containing oxygen and having a hydrogen content of 0.01% by volume or less. A method for producing an inorganic material, comprising:

10. The method for producing an inorganic material according to claim 1, The decomposition-promoting component is in a powder form, The powdered decomposition-promoting component is brought into contact with the composite material. A method for producing an inorganic material, comprising:

11. The method for producing an inorganic material according to claim 1, The oxidizing atmosphere is air containing moisture. A method for producing an inorganic material, comprising:

12. The method for producing an inorganic material according to claim 1, The heating step is carried out in the gas phase. A method for producing an inorganic material, comprising:

13. The method for producing an inorganic material according to claim 1, The heating step is carried out while the integrated body is subjected to at least one of vibration and stirring. A method for producing an inorganic material, comprising:

14. The method for producing an inorganic material according to claim 1, a contacting step of contacting the composite material with the decomposition-promoting component inside a container, The heating step is carried out in the same vessel used in the contacting step. A method for producing an inorganic material, comprising:

15. a container for containing a composite material including an inorganic material composed of an inorganic substance and an organic material composed of an organic substance, and a decomposition-promoting component for promoting the thermal decomposition of the organic material; a heating mechanism for heating the inside of the container; a supply port for supplying a fluid into the container; a discharge port for discharging the fluid inside the storage tank from the storage tank, The decomposition-accelerating component includes a copper component containing copper and titanium oxide. An inorganic material manufacturing apparatus characterized by:

16. The inorganic material manufacturing apparatus according to claim 15, Further, a separation mechanism for separating the inorganic material from the inside of the storage tank is provided. An inorganic material manufacturing apparatus characterized by:

17. a contacting step of contacting a composite material including an inorganic material composed of an inorganic substance and an organic material composed of an organic substance with a decomposition-promoting component that promotes thermal decomposition of the organic material; a heating step of heating an integrated body including the contacted composite material and the decomposition-promoting component in an oxidizing atmosphere; Including, The decomposition-accelerating component includes a copper component containing copper and titanium oxide. A method for decomposing a composite material, comprising:

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