Processing apparatus and method of forming frame unit

Abstract

To form a frame unit without damaging a frame by a cutter.SOLUTION: A tape supply unit, a tape cutting unit that cuts a portion of the tape fixed to the frame between the opening and an outer peripheral edge of the frame in a radial direction of the opening, a height adjustment mechanism that adjusts a relative height position of the tape cutting unit with respect to the frame, a rotation drive mechanism that relatively rotates the tape cutting unit and the frame, a tape winding unit that winds a used tape, and a controller that controls operations of the tape cutting unit and the rotation drive mechanism, the tape cutting unit includes a cutter for cutting the tape and a piezoelectric element for applying vibration of an ultrasonic frequency to the cutter, and when the cutter cuts into the tape, the cutter to which the vibration of the ultrasonic frequency is applied is positioned at a height where the cutter does not come into contact with the frame by the height adjustment mechanism.SELECTED DRAWING: Figure 1

Description

[Technical Field]

[0001] The present invention relates to a processing device for forming a frame unit in which a tape is fixed to a frame having an opening so as to cover the opening and not extend beyond the outer edge of the frame, and to a method for forming this frame unit. [Background technology]

[0002] Semiconductor device chips are mounted on electronic devices such as mobile phones and PCs (Personal Computers).Semiconductor device chips are manufactured, for example, by thinning the backside of a semiconductor wafer (hereinafter simply referred to as wafer), which has multiple devices formed on its surface, by grinding and polishing, and then dividing the wafer into device units by cutting, laser processing, etc.

[0003] When processing wafers by cutting, laser processing, etc., it is known to form a frame unit in which the wafer is supported by a frame via adhesive tape in order to facilitate the transportation of the wafer by a processing device and the processing of the wafer (see, for example, Patent Document 1).

[0004] In the tape application mechanism described in Patent Document 1, adhesive tape is applied to cover the wafer and frame placed on a table, and then a cutter is made to cut the adhesive tape into a circular shape by moving it along a predetermined circumference, thereby forming a frame unit in which the frame and wafer are integrated via the adhesive tape.

[0005] However, when cutting the adhesive tape, the cutter may come into contact with the frame, causing scratches on the frame, which can cause problems such as particles being generated when the frame is scraped, and scratches on the frame making the adhesive tape more likely to peel off.

[0006] Adhesive tapes typically have a resin base layer and an adhesive layer (i.e., glue layer), with the adhesive layer covering substantially the entire surface of the base layer. Instead of such adhesive tapes, adhesive-free tapes are sometimes used. Adhesive-free tapes have only a base layer without an adhesive layer. Hereinafter, in this specification, both adhesive tapes and adhesive-free tapes may be collectively referred to simply as tapes.

[0007] When forming a frame unit using adhesive-free tape, the frame may be damaged when the adhesive-free tape is cut into a circular shape with a cutter, just as with adhesive tape. Also, when forming a frame unit that does not have a wafer and in which the frame and tape are integrated, the tape is cut with a cutter, and the same problem occurs.

[0008] To solve the above-mentioned problems caused by cutting the tape attached to the frame with a cutter, it is possible to use adhesive tape that has been cut into circles in advance (generally called pre-cut tape). However, when using pre-cut tape, another problem arises in that the cost of the tape is higher than when using conventional tape that is not pre-cut. [Prior art documents] [Patent documents]

[0009] [Patent Document 1] Japanese Patent Application Publication No. 6-177243 Summary of the Invention [Problem to be solved by the invention]

[0010] The present invention has been made in view of the above problems, and has as its object to form a frame unit without damaging the frame with a cutter. [Means for solving the problem]

[0011] According to one aspect of the present invention, a processing apparatus for forming a frame unit in which a tape is fixed to a frame having an opening so as to cover the opening and not protrude beyond the outer periphery of the frame includes a tape supplying section having a roll of long tape wound in a roll, a tape cutting section that cuts a portion of the tape supplied from the tape supplying section and fixed to the frame so as to cover the opening, between the opening and the outer periphery of the frame in the radial direction of the opening, a height adjusting mechanism that adjusts the height position of the tape cutting section relative to the frame, the tape cutting section, and the frame. a tape winding unit that winds up the used tape, including the outer peripheral region of the tape that is located outside the central region of the tape that has been circularly cut out by the tape cutting unit; and a controller that controls the operation of the tape cutting unit and the rotational drive mechanism, wherein the tape cutting unit includes a cutter for cutting the tape and a piezoelectric element that imparts ultrasonic frequency vibrations to the cutter, and when the cutter cuts the tape, the cutter to which the ultrasonic frequency vibrations have been applied is positioned by the height adjustment mechanism at a height that does not contact the frame.

[0012] Preferably, when the cutter cuts the tape, the controller controls the height adjustment mechanism to position the cutter, to which ultrasonic frequency vibrations are applied, at a height that does not contact the frame.

[0013] Preferably, the controller determines whether the cutter is in contact with the frame based on the impedance of the piezoelectric element during operation.

[0014] Preferably, the processing device further includes a measurement unit having an optical sensor or a camera, and after the tape cutting operation by the tape cutting section is completed, the controller uses the measurement unit to detect whether the tape is fixed to the frame or not, and if it is found that the tape is not fixed to the frame, it determines that the cutting of the tape was not completed normally and issues an alarm.

[0015] Preferably, the tape cutting unit includes a vibration-isolating member provided on the opposite side of the cutter with the piezoelectric element sandwiched therebetween, and the tape cutting unit is connected to the rotation drive mechanism via the vibration-isolating member.

[0016] According to another aspect of the present invention, there is provided a method for forming a frame unit in which a frame has an opening and a tape is fixed to the frame so as to cover the opening and not protrude beyond the outer peripheral edge of the frame, the method comprising: a fixing step of fixing a long piece of tape to the frame so as to cover the opening of the frame; a positioning step of, after the fixing step, positioning a cutter to which vibrations of an ultrasonic frequency are applied at a height so as not to come into contact with the frame; and a tape cutting step of, after the positioning step, rotating the frame and the cutter vibrating at the ultrasonic frequency relative to each other, thereby utilizing contact between the cutter and the tape and heat applied to the tape to cut the portion of the tape between the opening and the outer peripheral edge of the frame in the radial direction of the opening. [Effects of the Invention]

[0017] A processing device according to one aspect of the present invention includes a tape cutting unit, a height adjustment mechanism that adjusts the height position of the tape cutting unit relative to the frame, and a rotation drive mechanism that rotates the tape cutting unit and the frame relative to each other. The tape cutting unit includes a cutter for cutting the tape and a piezoelectric element that applies vibrations at an ultrasonic frequency to the cutter.

[0018] When the cutter cuts the tape, the ultrasonic vibration is applied to the cutter, and the height adjustment mechanism positions the cutter at a height that does not contact the frame. Then, the rotary drive mechanism rotates the cutter and the frame relative to each other, utilizing the contact between the cutter and the tape and the heat applied to the tape to cut the tape. This prevents the cutter from damaging the frame.

[0019] In addition, because the cutter does not come into contact with the frame, the cutter's lifespan is extended and the frequency of replacement can be reduced, thereby reducing the cost required for the cutter.Furthermore, the reduced frequency of cutter replacement also reduces the number of steps required for maintenance of the processing equipment.

[0020] A method for forming a frame unit according to another aspect of the present invention includes a positioning step in which a cutter to which ultrasonic frequency vibrations are applied is positioned at a height where it does not come into contact with the frame, followed by a tape cutting step in which the frame and the cutter vibrating at ultrasonic frequency are rotated relatively around the radial center of the frame, thereby utilizing contact between the cutter and the tape and heat applied to the tape to cut the portion of the tape between the opening in the frame and the outer peripheral edge of the frame in the radial direction of the opening.

[0021] In the method for forming the frame unit, the cutter can be prevented from damaging the frame. In addition, the cutter's life is extended and the frequency of replacement can be reduced, thereby reducing the cost required for the cutter. Furthermore, the reduced frequency of cutter replacement can also reduce the number of steps required for maintenance of the processing equipment. [Brief explanation of the drawings]

[0022] [Figure 1] FIG. 2 is a perspective view of the tape application device. [Figure 2] Figure 2(A) is a partial cross-sectional side view of the tape cutting section and table, Figure 2(B) is a plan view of the cutting mechanism showing the positional relationship between the cutter and the pressure roller, Figure 2(C) is a side view of the cutting mechanism showing the positional relationship between the lower end of the cutter and the lower end of the pressure roller, and Figure 2(D) is a block diagram showing the control system that controls the operation of the piezoelectric element. [Figure 3] FIG. 10 is a flow diagram of a method for forming a frame unit. [Figure 4] FIG. 4(A) is a diagram showing the state in which the pressure roller is lowered, FIG. 4(B) is a diagram showing the state in which the pressure roller is moved along the X-axis direction, and FIG. 4(C) is a diagram showing the state when the fixing process is completed. [Figure 5] FIG. 5(A) is a diagram showing the state in which the tape cutting unit is lowered, and FIG. 5(B) is a diagram showing the state when the positioning step is completed. [Figure 6] FIG. 6(A) is a diagram showing the tape cutting process, and FIG. 6(B) is a diagram showing the cutter vibrating in the tape cutting process. [Figure 7] FIG. 10 is a diagram illustrating an example of a change in impedance of a piezoelectric element. [Figure 8] FIG. 8(A) is a diagram showing how the presence or absence of tape is detected using an optical sensor, and FIG. 8(B) is a perspective view of a frame unit. [Figure 9] FIG. 9(A) is a diagram showing an optical sensor in a first modified example, and FIG. 9(B) is a diagram showing how the presence or absence of tape is detected using a camera in a second modified example. [Figure 10] FIG. 11 is a plan view of a tape cutting section in a third modified example. [Figure 11] FIG. 11(A) is a diagram showing a fixing step when forming a frame unit including a wafer, and FIG. 11(B) is a perspective view of the frame unit including a wafer. DETAILED DESCRIPTION OF THE INVENTION

[0023] (First embodiment) An embodiment according to one aspect of the present invention will be described with reference to the accompanying drawings. Fig. 1 is a perspective view of a tape application device (processing device) 2. In Fig. 1, some of the components of the tape application device 2 are shown in functional blocks.

[0024] The X-axis, Y-axis, and Z-axis shown in Fig. 1 are perpendicular to one another. The Z-axis is, for example, parallel to the vertical direction. In this specification, the direction parallel to the X-axis will be referred to as the X-axis direction, the direction parallel to the Y-axis will be referred to as the Y-axis direction, and the direction parallel to the Z-axis will be referred to as the Z-axis direction (up-down direction).

[0025] The tape application device 2 applies tape 13 to cover the opening 11a of a ring-shaped frame 11 made of a metal such as stainless steel, and then cuts the tape 13 located outside the opening 11a into a circular shape, thereby forming a frame unit 15 (see Figure 8(B)) in which the tape 13 is fixed around the entire circumference of the frame 11.

[0026] The tape 13 of this embodiment is an adhesive tape having a resin base layer and an adhesive layer (i.e., glue layer) made of a pressure-sensitive adhesive and provided over substantially the entire surface of the base layer. However, instead of the adhesive tape, an adhesiveless tape having only a base layer without an adhesive layer may be used.

[0027] The adhesive-free tape is, for example, a sheet made of polyolefin, but is not limited to polyolefin and may be a sheet made of other thermoplastic resins. The adhesive-free tape is fixed to the frame 11 by thermocompression bonding.

[0028] The tape application device 2 has a rectangular table 4. An upper surface 4a of the table 4 is provided with a disk-shaped central recess 4b for accommodating a wafer 17. The central recess 4b has a depth approximately equal to the thickness of the wafer 17 (see FIG. 11(A)) to be processed.

[0029] For example, if the wafer 17 is placed in the central recess 4b so that the front surface 17a of the wafer 17 is in contact with the bottom of the central recess 4b and the back surface 17b of the wafer 17 is exposed upward, the back surface 17b of the wafer 17 and the upper surface 4a of the table 4 will be at approximately the same height (see FIG. 11(A)). However, in this embodiment, the wafer 17 is not placed in the central recess 4b.

[0030] An annular recess 4c having an inner diameter larger than the diameter of the central recess 4b is provided radially outward from the central recess 4b. The inner periphery of the annular recess 4c has substantially the same size and shape as the circular inner periphery of the frame 11, and the outer periphery of the annular recess 4c has substantially the same size and shape as the outer periphery of the frame 11.

[0031] When the frame 11 is placed in the annular recess 4c, movement of the frame 11 in a direction parallel to the XY plane is restricted, and the frame 11 is held by the table 4. The annular recess 4c has a depth substantially equal to the thickness of the frame 11 to be processed.

[0032] When the frame 11 is placed in the annular recess 4c so that one surface 11b of the frame 11 contacts the bottom of the annular recess 4c and the other surface 11c of the frame 11 is exposed upward, the other surface 11c of the frame 11 and the upper surface 4a of the table 4 are at approximately the same height (see Figures 2(A) and 11(A)).

[0033] The table 4 is supported by a rectangular pillar-shaped support portion 6 and is fixed integrally with the support portion 6. A first lifting mechanism 8 is provided on one side of the support portion 6. The first lifting mechanism 8 is, for example, an air actuator having an air cylinder, and moves the support portion 6 up and down along the Z-axis direction.

[0034] The first lifting mechanism 8 adjusts the height of the table 4 (i.e., the position in the Z-axis direction) by adjusting the height of the support part 6. The first lifting mechanism 8 moves the table 4, for example, in the height direction, between a first position which is relatively low and a second position which is relatively high.

[0035] In this embodiment, when the table 4 is in the first position, the frame 11 is placed in the annular recess 4c of the table 4, and when the table 4 is in the second position, the tape 13 is attached (i.e., fixed) to the frame 11 placed in the annular recess 4c.

[0036] The first lifting mechanism 8 may have a ball screw (not shown) having a screw shaft, a nut, a motor, etc., instead of the air cylinder. In this case, the nut is provided on the support part 6, and the height position of the upper surface 4a of the table 4 moves according to the amount of rotation of the screw shaft caused by the motor.

[0037] A tape supply unit 10 is provided above the table 4 and outside the table 4 in the X-axis direction. The tape supply unit 10 has a cylindrical supply roller 12 whose longitudinal direction is arranged along the Y-axis direction. The supply roller 12 is rotatably fixed to a bracket (not shown) and can rotate around a rotation axis that is approximately parallel to the Y-axis direction.

[0038] The supply roller 12 in this embodiment is a driven roller, and is not driven by a motor such as a servo motor or a stepping motor. However, the supply roller 12 may be a drive roller that rotates by power transmitted from a motor.

[0039] A roll body 21 formed by bonding together a long (i.e., strip-shaped) tape 13 and a release film 19, each having a predetermined width, and winding them into a roll is attached to the supply roller 12. In this embodiment, the width of the roll body 21 means the length along the Y-axis direction.

[0040] The release film 19 is in contact with the adhesive surface (i.e., the other surface of the adhesive layer opposite to the surface in contact with the base layer) of the tape 13. The release film 19 used in this embodiment has a resin base layer, and substantially the entire surface of this base layer is coated with a release agent such as PTFE or silicone resin.

[0041] It should be noted that release paper may be used instead of release film 19. The release paper has a base layer made of paper, and one surface of the base layer that comes into contact with the adhesive surface of tape 13 is coated with a release agent almost entirely. A tape pull-out section 14 is provided below supply roller 12.

[0042] The tape pull-out section 14 has a cylindrical first pull-out roller 14a and a cylindrical second pull-out roller 14b. The first pull-out roller 14a and the second pull-out roller 14b are also rotatably fixed to the bracket and are rotatable around a rotation axis that is substantially parallel to the Y-axis direction.

[0043] The first pull-out roller 14a is a drive roller driven by a motor 14c such as a servo motor, a stepping motor, etc. However, the second pull-out roller 14b is a driven roller that is not driven by a motor.

[0044] The first pull-out roller 14a and the second pull-out roller 14b are spaced apart in the X-axis direction by a distance substantially equal to the thickness of the tape 13 and the release film 19, and the rotation of the first pull-out roller 14a pulls out the tape 13 and the release film 19 from the roll body 21. At this time, the rotation of the first pull-out roller 14a is transmitted to the second pull-out roller 14b.

[0045] A release film take-up unit 16 is provided above the second pull-out roller 14b to take up the release film 19. The release film take-up unit 16 has a cylindrical release film take-up roller 18 whose longitudinal direction is arranged along the Y-axis direction.

[0046] The release film take-up roller 18 is rotatably fixed to the bracket and is rotatable around a rotation axis that is substantially parallel to the Y-axis direction. The release film take-up roller 18 is rotated by being driven by a motor 18a such as a servo motor or a stepping motor.

[0047] The release film 19 is wound around the release film take-up roller 18 to form a roll body 23. A pair of cylindrical guide rollers 20 are provided on the opposite side of the table 4 from the tape pull-out portion 14 in the X-axis direction.

[0048] The pair of guide rollers 20 are located outside the table 4 in the X-axis direction and above the table 4. Each of the pair of guide rollers 20 is a driven roller. The pair of guide rollers 20 are rotatably fixed to the bracket, and can rotate around a rotation axis that is substantially parallel to the Y-axis direction.

[0049] A tape take-up unit 22 is provided above the pair of guide rollers 20 to take up the remaining tape 13 (i.e., used tape 13) that is not fixed to the frame 11. The tape take-up unit 22 has a cylindrical tape take-up roller 24 whose longitudinal direction is arranged along the Y-axis direction.

[0050] The tape take-up roller 24 is rotatably fixed to the bracket and is rotatable about an axis of rotation substantially parallel to the Y-axis direction. The tape take-up roller 24 is driven by a motor 24a such as a servo motor or a stepping motor. Used tape 13 is wound around the tape take-up roller 24 in a roll to form a roll body 25.

[0051] When fixing the tape 13 to the frame 11, the tape 13 is supplied directly above the table 4 so as to cover the upper surface 4a of the table 4 and be approximately parallel to the XY plane. At this time, the adhesive surface of the tape 13 directly above the table 4 is exposed downward.

[0052] A cylindrical pressure roller 26 is provided above the tape 13. The pressure roller 26 has a length in the Y-axis direction that is approximately the same as the width of the tape 13. The width of the tape 13 (i.e., the length along the Y-axis direction) is greater than the width of the frame 11 held by the table 4 (i.e., the length along the Y-axis direction).

[0053] The pressure roller 26 is movable along the Z-axis direction. For example, an air actuator (not shown) moves the pressure roller 26 along the Z-axis direction. The pressure roller 26 moves along the Z-axis direction between a standby position (see FIG. 1) which is at a relatively high position and a pressing position (see FIG. 4(A)) which is at a relatively low position.

[0054] The pressure roller 26 is rotatable about a rotation axis that is substantially parallel to the Y-axis direction, and is also movable along the X-axis direction (see FIG. 4(B)). The pressure roller 26 is moved along the X-axis direction by a drive mechanism (not shown), such as a ball screw or a linear motor. The pressure roller 26 also moves along the X-axis direction while rotating while pressing the tape 13 downward.

[0055] Returning to FIG. 1, a cutting mechanism 28 is provided directly above the table 4. The cutting mechanism 28 has a beam 30 in the shape of a rectangular bar. A second lifting mechanism (height adjustment mechanism) 32 is provided at the base end of the beam 30. The second lifting mechanism 32 adjusts the height of a tape cutting unit 40 and other components provided at the tip of the beam 30.

[0056] In particular, the second lifting mechanism 32 adjusts the relative height position of the tape cutting unit 40 (details of which will be described later) with respect to the frame 11, with respect to the upper surface 4a of the table 4. The second lifting mechanism 32 has, for example, a screw shaft, a motor such as a servo motor or a stepping motor, and a nut unit (all of which are not shown).

[0057] A nut is fixed to the base end of the beam 30, and the nut is rotatably connected to the screw shaft via a plurality of balls (not shown). By rotating a motor fixed to one end of the screw shaft, the height position of the lower end of the cutter 48 (see FIG. 2(A)) of the tape cutting unit 40 is adjusted.

[0058] Since the height position of the lower end of the cutter 48 requires adjustment with relatively high precision, it is preferable that the second lifting mechanism 32 be constructed with a ball screw, but other moving mechanisms may be used as long as precision can be ensured.

[0059] A rotation drive mechanism 34 is provided on the underside of the tip of the beam 30. The rotation drive mechanism 34 has the function of relatively rotating the tape cutting unit 40 and the table 4 (i.e., the frame 11 fixed to the table 4). The rotation drive mechanism 34 has a motor 36 such as a servo motor or a stepping motor.

[0060] The output shaft 36a of the motor 36 functions as a rotation shaft of the cutter 48. The longitudinal direction of the output shaft 36a is approximately parallel to the Z-axis direction, and the longitudinal center of the upper surface of a rectangular bar (i.e., a connecting member) 38 is fixed to the lower end of the output shaft 36a.

[0061] When the output shaft 36a rotates, the bar 38 also rotates. In this embodiment, the longitudinal direction of the bar 38 is perpendicular to the output shaft 36a. A tape cutting portion 40 is provided at one longitudinal end of the bar 38 so as to protrude from the underside of the bar 38. Here, the tape cutting portion 40 and other components will be described with reference to Figures 2(A) to 2(D).

[0062] 2(A) is a partial cross-sectional side view of the tape cutting unit 40 and the table 4. The tape cutting unit 40 has a plate-shaped vibration-isolating member 42. The vibration-isolating member 42 is formed of an elastic body such as gel or rubber. The shape of the vibration-isolating member 42 is not particularly limited, and may be a cylinder, a rectangular pillar, or the like. The vibration-isolating member 42 may also be a spring or the like, as long as it has the function of suppressing the transmission of vibrations.

[0063] The upper surface of the vibration-isolating member 42 is fixed to the lower surface of one longitudinal end of the bar 38. The vibration-isolating member 42 reduces the degree to which vibration is transmitted to the bar 38 from a piezoelectric element 44 fixed to the lower surface of the vibration-isolating member 42.

[0064] Incidentally, the vibration-damping member 42 is not essential to the tape cutting unit 40. The operation of the piezoelectric element 44 creates a standing wave in which nodes and antinodes alternate at regular intervals in the Z-axis direction. By configuring the tape cutting unit 40 so that the boundary between the upper surface of the piezoelectric element 44 and the lower surface of the bar 38 is located at the node of the vibration of this standing wave, it is possible to suppress the transmission of vibration from the piezoelectric element 44 to the bar 38 without providing the vibration-damping member 42.

[0065] The piezoelectric element 44 includes a piezoelectric material layer such as PZT (lead zirconate titanate), a first electrode layer in contact with the upper surface of the piezoelectric material layer, and a second electrode layer in contact with the lower surface of the piezoelectric material layer, i.e., the first and second electrode layers are spaced apart from each other along the Z-axis direction.

[0066] The piezoelectric element 44 in this embodiment is a bolt-clamped Langevin type transducer, but is not limited to this. A first lead wire 44a is connected to the first electrode layer, and a second lead wire 44b is connected to the second electrode layer (see FIG. 2(D)).

[0067] The first lead wire 44a and the second lead wire 44b are connected to an ultrasonic oscillator 50 (see FIG. 2(D)). In this embodiment, the ultrasonic oscillator 50 is a component of the tape cutting unit 40.

[0068] When power is supplied from the ultrasonic oscillator 50 to the piezoelectric element 44, a voltage is applied to the piezoelectric material layer along the Z-axis direction. The piezoelectric element 44 vibrates along the Z-axis direction at the ultrasonic frequency due to the AC voltage at the ultrasonic frequency (i.e., a frequency of 20 kHz or higher).

[0069] A holder 46 is fixed to the lower surface of the piezoelectric element 44, and a cutter 48 is held in the holder 46 in a manner that the cutter 48 protrudes downward from the holder 46. The vibration of the ultrasonic frequency in the piezoelectric element 44 is applied to the cutter 48 together with the holder 46.

[0070] Cutter 48 has the function of cutting tape 13 described above and the function of melting tape 13 with heat caused by vibration energy. Cutter 48 has one relatively long side 48a and another relatively short side 48b.

[0071] The lower end of one side 48a of the cutter 48 protrudes downward further than the lower end of the other side 48b (see FIG. 2(C)). A cutting edge 48c is provided between the lower end of one side 48a and the lower end of the other side 48b (see FIG. 2(C)).

[0072] That is, the cutter 48 of this embodiment is single-edged. However, there is no particular limitation on the shape of the cutter 48. The cutter 48 may be double-edged, with blades provided on both one side 48a and the other side 48b.

[0073] In this embodiment, a vibration-isolating member 42 is provided on the opposite side of the cutter 48 with the piezoelectric element 44 sandwiched therebetween, and the tape cutting section 40 is connected to the rotation drive mechanism 34 via this vibration-isolating member 42. Therefore, compared to a case where the vibration-isolating member 42 is not provided, the transmission of vibration to the bar 38, the rotation drive mechanism 34, the second lifting mechanism 32, etc. can be suppressed.

[0074] 2(A), the upper surface of a rectangular parallelepiped fixing member 52 is fixed to the underside of the other longitudinal end of bar 38. A rotation shaft 54 ​​is rotatably fixed to fixing member 52. The longitudinal direction of rotation shaft 54 ​​is approximately parallel to the longitudinal direction of bar 38.

[0075] A cylindrical pressure roller 56 made of hard rubber or the like is rotatably fixed to the rotary shaft 54. The pressure roller 56 has the function of simultaneously pressing the outside and inside of the cut groove in the tape 13 when the tape 13 is cut by the cutter 48.

[0076] Fig. 2(B) is a plan view of the cutting mechanism 28, showing the positional relationship between the cutter 48 and the press roller 56. Note that the beam portion 30 and the like are omitted from Fig. 2(B).

[0077] 2(C) is a side view of the cutting mechanism 28 showing the positional relationship between the lower end of the cutter 48 and the lower end of the pressure roller 56. For ease of explanation, in FIG. 2(C), the cutter 48 is shown as seen in the YZ plane, but the pressure roller 56 is shown as seen in the XZ plane.

[0078] 2(C), in the Z-axis direction, the lower end of cutter 48 (i.e., the lower end of cutting edge 48c) is always higher than the lower end of pressure roller 56. Note that the lower end of cutter 48 is higher than the lower end of pressure roller 56 even when cutter 48 is vibrating in the Z-axis direction at the ultrasonic frequency (see FIG. 6(B)).

[0079] 1, a description will now be given of other components of the tape application device 2. The tape application device 2 includes a touch panel display 58a that functions as an input device through which the operator inputs instructions and as a display device for displaying the input contents.

[0080] Furthermore, the tape application device 2 has an indicator light 58b. The indicator light 58b lights up in a first color (e.g., green) when the tape application device 2 is operating normally, and lights up or flashes in a second color (e.g., red) when an abnormality occurs in the operation of the tape application device 2.

[0081] A speaker is integrally provided with the indicator light 58b. When the tape application device 2 is operating normally and the scheduled work is completed, the speaker emits a predetermined sound indicating the end of work. On the other hand, when an abnormality occurs in the operation of the tape application device 2, the speaker emits a predetermined alarm sound.

[0082] Here, we will briefly explain the procedure for forming the frame unit 15 using the tape application device 2. First, as shown in Figures 4(A) to 4(C), tape 13 is supplied from the tape supply unit 10 to above the table 4 so as to cover the opening 11a of the frame 11.

[0083] Next, the pressure roller 26 moves in the X-axis direction while pressing the frame 11 downward via the tape 13. As a result, the tape 13 is fixed to the frame 11 over the entire other surface 11c of the frame 11.

[0084] Thereafter, the cutting mechanism 28 lowers the cutter 48, which vibrates at an ultrasonic frequency, to a position where it does not come into contact with the frame 11, causing it to cut into the tape 13 (see FIGS. 5(A) and 5(B)). Then, in this state, the bar 38 rotates once (see FIG. 6(A)).

[0085] As a result, the tape 13 located between the opening 11a of the frame 11 and the outer periphery of the frame 11 in the radial direction of the opening 11a is cut into a circular shape (see FIGS. 8(A) and 8(B)). That is, the tape 13 is separated into a central region 13a cut into a circular shape and an outer periphery region 13b located outside the central region 13a.

[0086] In this manner, in this embodiment, when the cutter 48 is caused to cut into the tape 13 by the second lifting mechanism 32, the cutter 48 to which the ultrasonic frequency vibration is applied is positioned at a height that does not contact the frame 11.

[0087] Then, the cutter 48 and the frame 11 are rotated relative to each other by the rotation drive mechanism 34, whereby the tape 13 is cut by utilizing contact between the cutter 48 and the tape 13 and heat applied to the tape 13. This prevents the cutter 48 from damaging the frame 11.

[0088] The height at which the cutter 48 to which ultrasonic frequency vibrations are applied does not come into contact with the frame 11 means, for example, that the lower end of the blade tip 48c that is cutting into the tape 13 in the vibrating state is always at least a predetermined distance (e.g., 10 μm) away from the other surface 11c of the frame 11 that is less than the thickness of the tape 13.

[0089] In addition, because the cutter 48 does not come into contact with the frame 11, the life of the cutter 48 is extended and the frequency of replacement can be reduced, thereby reducing the cost required for the cutter 48. Furthermore, because the frequency of replacement of the cutter 48 is reduced, the number of steps required for maintenance of the tape application device 2 can also be reduced.

[0090] The outer peripheral region 13b of the tape 13, which has been cut so as not to protrude from the outer peripheral edge of the frame 11, is collected by being wound up by the tape winding unit 22. During winding, a predetermined length of the tape 13 is newly unwound, and the unused region of the tape 13 is supplied directly above the table 4.

[0091] If the tape 13 is not properly cut during this winding, the central region 13a will remain connected to the outer peripheral region 13b, and the central region 13a may peel off from the frame 11 and be collected into the tape winding section 22 together with the outer peripheral region 13b.

[0092] Therefore, after the tape cutting unit 40 has completed the cutting operation of the tape 13, a measurement unit 66 (see FIG. 8(A)) is used to detect whether or not the tape 13 is fixed to the frame 11. The measurement unit 66 of this embodiment has an optical sensor 68 housed in a circular recess 4d provided at the bottom of the central recess 4b.

[0093] The optical sensor 68 of this embodiment is a so-called reflective type, and includes a light-projecting unit and a light-receiving unit. The light-projecting unit includes a light source such as an LED (Light Emitting Diode) that emits a laser beam (i.e., light) in the wavelength band of ultraviolet or visible light, and the light-receiving unit includes a photoelectric conversion element that converts the light from the light source into electricity.

[0094] When the tape 13 is properly fixed to the frame 11, the optical sensor 68 receives reflected light with an amount of light equal to or greater than the threshold (see FIG. 8(A)). In contrast, when the central region 13a of the tape 13 that has peeled off the frame 11 is collected in the tape take-up section 22, the tape 13 is no longer fixed to the frame 11, and the optical sensor 68 receives almost no reflected light from the tape 13.

[0095] If it is determined that the tape 13 is not fixed to the frame 11, the controller 60, which will be described later, determines that cutting of the tape 13 has not been completed normally, and issues an alarm by displaying an alarm on the touch panel display 58a, lighting up the indicator light 58b, sounding an alarm from the speaker, etc. If an alarm is issued, it is preferable that the operator check whether there is any malfunction in the tape application device 2.

[0096] The tape application device 2 has a controller 60 that controls the operation of the first lifting mechanism 8, motors 14c, 18a, 24a, pressure roller 26, second lifting mechanism 32, tape cutting section 40 (i.e., motor 36, ultrasonic oscillator 50, etc.), touch panel display 58a, indicator light 58b, speaker, measurement unit 66, etc.

[0097] The controller 60 is configured by a computer having a processor 60a, such as a CPU (Central Processing Unit), and a memory 60b. The memory 60b includes a main storage device such as a DRAM (Dynamic Random Access Memory) and an auxiliary storage device such as a flash memory, a hard disk drive, or a solid state drive.

[0098] The auxiliary storage device stores software including a predetermined program. The functions of the controller 60 are realized by operating the processor 60a and other components in accordance with this software.

[0099] 2(D) is a block diagram showing a control system for controlling the operation of the piezoelectric element 44. The power supplied by the ultrasonic oscillator 50 to the piezoelectric element 44, the operating frequency of the piezoelectric element 44, the amplitude of the piezoelectric element 44 in the Z-axis direction, etc. are specified by a controller 60.

[0100] The ultrasonic oscillator 50 has a function similar to that of an impedance analyzer, and measures the impedance of the piezoelectric element 44. The ultrasonic oscillator 50 supplies power to the piezoelectric element 44 and measures the impedance of the piezoelectric element 44 in real time while it is vibrating at an ultrasonic frequency (i.e., while it is operating).

[0101] The impedance of the piezoelectric element 44 increases, for example, when the cutter 48 comes into contact with the frame 11 and the displacement of the piezoelectric element 44 in the Z-axis direction is restricted. The ultrasonic oscillator 50 notifies the controller 60 of the measured impedance in real time.

[0102] The controller 60 determines whether the cutter 48 is in contact with the frame 11 based on the impedance of the piezoelectric element 44 during operation. T If the difference exceeds the predetermined value, it is determined that the cutter 48 has come into contact with the frame 11.

[0103] If the measured impedance is below a threshold Z T If the difference exceeds this value, the controller 60 issues an alarm via the touch panel display 58a, etc., thereby informing the operator that the cutter 48 has come into contact with the frame 11.

[0104] When an alarm is issued, it is preferable that the worker check whether there is any malfunction in the tape application device 2, and whether there is any abnormality in the frame unit 15 and the cutter 48.

[0105] Next, a method for forming the frame unit 15 using the tape application device 2 will be described with reference to Fig. 3 to Fig. 8(B). Fig. 3 is a flow diagram of the method for forming the frame unit 15. In this embodiment, the steps are performed in the following order: a fixing step S10, a positioning step S20, a tape cutting step S30, and a tape presence / absence detection step S40.

[0106] First, a fixing step S10 is performed in which the tape 13 is fixed to the frame 11 so as to cover the opening 11a (see FIG. 4(A)). In the fixing step S10, with the unused area of ​​the tape 13 placed on the frame 11 placed in the annular recess 4c of the table 4, a pressure roller 26 is lowered onto one end of the upper surface 4a of the table 4 in the X-axis direction.

[0107] This presses the tape 13 against the frame 11 and the table 4. Fig. 4(A) is a diagram showing the state in which the pressure roller 26 is lowered. Next, the pressure roller 26 is moved along the X-axis direction from one end to the other end of the upper surface 4a of the table 4 in the X-axis direction.

[0108] When the pressure roller 26 is moved, the pressure roller 26 is kept pressed against the upper surface 4a of the table 4, so the pressure roller 26 rotates without slipping on the tape 13. Fig. 4(B) is a diagram showing how the pressure roller 26 is moved along the X-axis direction.

[0109] 4(C) is a diagram showing the state when the fixing step S10 is completed by moving the pressure roller 26 to the other end in the X-axis direction on the upper surface 4a of the table 4. After the pressure roller 26 moves from one end to the other in the X-axis direction, the pressure roller 26 rises and then moves in the opposite direction along the X-axis direction to return to the initial position.

[0110] After such a fixing step S10, a positioning step S20 is performed in which the cutter 48 to which ultrasonic frequency vibrations have been applied is positioned at a height that will not cause it to come into contact with the frame 11. Fig. 5(A) is a diagram showing how the tape cutting unit 40 is lowered by the second lifting mechanism 32 in the positioning step S20, and Fig. 5(B) is a diagram showing the state when the positioning step S20 is completed.

[0111] In the positioning step S20, the vibration of the cutter 48 may be started after the cutter 48 has cut into the tape 13, or the vibrating cutter 48 may cut into the tape 13. In either case, it is sufficient that the cutter 48 can be positioned at a height that does not cause it to come into contact with the frame 11.

[0112] After the positioning step S20, the motor 36 of the rotation drive mechanism 34 is operated. In this manner, the frame 11 and the cutter 48, which is vibrating at an ultrasonic frequency, are rotated relative to each other, thereby performing the tape cutting step S30.

[0113] In the tape cutting process S30, the cutter 48 uses the contact between the cutter 48 and the tape 13 and the heat applied to the tape 13 via the cutter 48 to cut the portion of the tape 13 between the opening 11a of the frame 11 in the radial direction of the opening 11a and the outer peripheral edge of the frame 11.

[0114] Fig. 6(A) is a diagram showing the tape cutting step S30, and Fig. 6(B) is a diagram showing the cutter 48 vibrating in the tape cutting step S30. For ease of explanation, in Fig. 6(B), the fusion region 13c where the tape 13 is fused by the cutter 48 is hatched differently from the tape 13.

[0115] In the tape cutting process S30, the cutter 48 vibrates along the Z-axis direction at an ultrasonic frequency, and the vibration energy is converted into frictional heat, causing the temperature of the tape 13 to rise to a temperature (e.g., 300°C) that exceeds the melting point of the resin that makes up the tape 13.

[0116] In this way, by utilizing the heat applied to the tape 13 via the cutter 48 in addition to the physical contact between the cutter 48 and the tape 13, the tape 13 can be melt-cut by the cutter 48. Therefore, the tape 13 can be cut even if the lower end of the cutting edge 48c of the cutter 48 is not in contact with the frame 11. This prevents the cutter 48 from damaging the frame 11.

[0117] Also, by preventing contact between the cutter 48 and the frame 11, the life of the cutter 48 is extended and the frequency of replacement can be reduced, thereby reducing the cost required for the cutter 48. Furthermore, by reducing the frequency of replacement of the cutter 48, the number of steps required for maintenance of the tape application device 2 can also be reduced.

[0118] An example of processing conditions employed in the positioning step S20 and the tape cutting step S30 is shown below.

[0119] Power supplied to piezoelectric element: 20W Vibration frequency of piezoelectric element: 40kHz Amplitude of the piezoelectric element in the Z-axis direction: 10 μm Cutter rotation speed: 20° / s Temperature of the contact area between the blade and the tape: 300 to 350°C

[0120] In the positioning step S20 and the tape cutting step S30, the ultrasonic oscillator 50 uses its impedance measurement function to monitor the change over time in impedance of the piezoelectric element 44. FIG. 7 is a diagram showing an example of the change in impedance of the piezoelectric element 44 measured by the ultrasonic oscillator 50.

[0121] When the piezoelectric element 44 vibrates along the Z-axis direction without the lower end of the cutter 48 coming into contact with the frame 11, the vibration of the piezoelectric element 44 is not strongly suppressed. At this time, the impedance of the piezoelectric element 44 becomes a relatively low value (see the period from time t=0 to time t1).

[0122] In contrast, when the vibration of the piezoelectric element 44 is strongly suppressed, the impedance of the piezoelectric element 44 becomes a relatively high value (see the dashed line in FIG. 7). In the example shown by the dashed line in FIG. 7, the lower end of the cutter 48 gradually approaches the frame 11 between time t1 and time t2, and at time t2, the impedance of the piezoelectric element 44 reaches the threshold value Z T has reached this level.

[0123] For example, when the impedance of the piezoelectric element 44 is below a threshold Z T, the lower end of the cutter 48 comes into contact with the frame 11. Such contact between the cutter 48 and the frame 11 is caused by, for example, variations in the thickness of the frame 11, variations in the depth of the annular recess 4c of the table 4, and the inclination of the output shaft 36a (i.e., the rotation axis of the cutter 48) with respect to the Z-axis direction.

[0124] However, since the position of the lower end of the cutter 48 is usually determined taking these variations and inclinations into consideration, unless a particular abnormality occurs in the tape application device 2, the impedance of the piezoelectric element 44 is kept below the threshold value Z T does not exceed.

[0125] In the example shown by the solid line in FIG. 7, the impedance remains constant even between time t1 and time t2. T In this case, the cutter 48 and the frame 11 are kept out of contact with each other.

[0126] In the positioning step S20 and the tape cutting step S30, the ultrasonic oscillator 50 detects whether the impedance of the piezoelectric element 44 is greater than the threshold Z T By monitoring whether the cutter 48 has come into contact with the frame 11, the controller 60 can determine whether the cutter 48 has come into contact with the frame 11.

[0127] In addition, if the controller 60 determines that the cutter 48 has come into contact with the frame 11, it will issue an alarm to the operator via the touch panel display 58a, indicator light 58b, speaker, etc., and will record the fact that contact has occurred as a log in the memory 60b.

[0128] The cutter 48 is rotated 360° or more around the opening 11a of the frame 11 to melt-cut the tape 13. At this time, the pressure roller 56 moves so as to trace the tape 13 directly above the cut groove.

[0129] After the tape 13 is cut by fusing, the second lifting mechanism 32 is operated to raise the cutting mechanism 28. Next, the first pull-out roller 14a, the motor 18a of the tape pull-out unit 14, the motor 24a of the tape take-up unit 22, etc. are operated to newly pay out a predetermined length of tape 13.

[0130] As a result, a new unused area of ​​the tape 13 is supplied directly above the table 4, and the used tape 13 is collected by the tape take-up unit 22. As described above, if the tape 13 is not properly cut, the central area 13a of the tape 13 that should be fixed to the frame 11 is collected by the tape take-up unit 22 together with the outer peripheral area 13b.

[0131] Therefore, in a tape presence detection step S40 after the tape cutting step S30, a measurement unit 66 detects whether or not the tape 13 is fixed to the frame 11. Fig. 8(A) is a diagram showing how the presence or absence of the tape 13 is detected using an optical sensor 68.

[0132] In this embodiment, the optical sensor 68 projects light of a predetermined wavelength, and then the controller 60 determines whether or not the tape 13 is fixed to the frame 11 based on the amount of reflected light received by the optical sensor 68. Fig. 8(B) is a perspective view of the frame unit 15 formed by fixing the tape 13 to the frame 11.

[0133] On the other hand, if it is determined that the tape 13 is not fixed to the frame 11, the controller 60 will cause the touch panel display 58a or the like to issue an alarm as described above, informing the operator that an abnormality has occurred.

[0134] Possible reasons why the tape 13 was not fixed to the frame 11 include improper cutting of the tape 13. For example, possible reasons include the lower end of the cutter 48 being positioned too high relative to the other surface 11c of the frame 11, or the output of the ultrasonic oscillator 50 being too weak.

[0135] 9(A) is a diagram showing an optical sensor 70 in a first modified example of the first embodiment. The optical sensor 70 is also a reflective sensor like the optical sensor 68, but differs from the optical sensor 68 in that it is provided above the top surface 4a of the table 4. The optical sensor 70 may be fixed to the beam 30 or the bar 38.

[0136] It should be noted that a transmission-type optical sensor may be used instead of the reflection-type optical sensors 68 and 70. The transmission-type optical sensor has a light-emitting section and a light-receiving section, one of which is provided in the circular recess 4d, and the other of which is provided directly above the other.

[0137] (Second Modification) Figure 9(B) is a diagram showing a measurement unit 66 in a second modification of the first embodiment, and shows how the presence or absence of tape 13 is detected using a camera 72 of the measurement unit 66.

[0138] The camera 72 has a condenser lens, an image sensor such as a solid-state image sensor, and a light source such as an LED. By capturing an image of the outer periphery of the tape 13 with the camera 72, an image of the other surface 11c of the frame 11 is obtained.

[0139] If the image contains a boundary line indicating the outer edge of the central region 13a of the tape 13, the controller 60 determines that the tape 13 is fixed to the frame 11 and that cutting of the tape 13 has been completed successfully.

[0140] On the other hand, if the image on the other surface 11c does not show a boundary line between the central region 13a and the outer peripheral region 13b of the tape 13, the controller 60 determines that cutting of the tape 13 has not been completed normally.

[0141] (Third Modification) Figure 10 is a plan view of the tape cutting unit 40 in a third modification of the first embodiment. The tape cutting unit 40 in the third modification has two pressure rollers 56. The two pressure rollers 56 are provided, one at each end of the bar 38, with the output shaft 36a sandwiched between them in the XY plane view.

[0142] That is, one pressure roller 56 is provided at one end of the bar 38 via a set of fixed members 52 and a rotating shaft 54, and similarly, another pressure roller 56 is provided at the other end of the bar 38 via another set of fixed members 52 and a rotating shaft 54.

[0143] Furthermore, a beam portion 38a is provided at the other end of the bar 38, extending in a direction perpendicular to the longitudinal direction of the bar 38 in the XY plane view, and the tape cutting portion 40 is provided on the underside of this beam portion 38a. For ease of explanation, the position of the tape 13 cut by the cutter 48 is indicated by a circular dashed line in Figure 10.

[0144] In the third modified example, in the tape cutting step S30, the two pressure rollers 56 can press down both radial ends of the tape 13, which form the central region 13a. Therefore, compared to the first embodiment, the change in the height position of both ends of the bar 38 around the output shaft 36a (i.e., the rotation axis of the tape cutting unit 40) can be further reduced. This can lead to more stable melt cutting of the tape 13.

[0145] (Fourth Variant) When the second lifting mechanism 32 employs an actuator such as an air cylinder that moves the bar 38 between two positions, a high position and a low position, in the Z-axis direction, the position of the lower end of the cutter 48 may be precisely adjusted by a pressure roller 56 (see the pressure roller 56 on the right side of Figure 10) located near the tape cutting section 40.

[0146] In this case, both the second lifting mechanism 32 and the pressure roller 56 located near the tape cutting section 40 function as height adjustment mechanisms for positioning the cutter 48, to which ultrasonic frequency vibrations are applied, at a height that prevents it from coming into contact with the frame 11.

[0147] By adjusting the relative positions of the pressure roller 56 and the cutter 48 in advance so that the lower end of the pressure roller 56 is several tens of μm higher than the lower end of the cutter 48 vibrating in the Z-axis direction, it is possible to prevent the cutter 48 from damaging the frame 11 when cutting the tape 13 with the cutter 48.

[0148] Even when one pressure roller 56 is provided instead of two, the pressure roller 56 located near the tape cutting section 40 may similarly precisely adjust the position of the lower end of the vibrating cutter 48.

[0149] Second Embodiment In the second embodiment, a frame unit 27 is formed in which a wafer 17 is integrated with a frame 11 via a tape 13. Fig. 11(A) is a diagram showing a fixing step S10 when forming a frame unit 27 including a wafer 17.

[0150] 11(B) is a perspective view of the frame unit 27 including the wafer 17. In the second embodiment, the wafer 17 is placed in the central recess 4b of the table 4, and then the fixing step S10 to the tape presence detection step S40 are performed. In the fixing step S10, the tape 13 is fixed over the entire circumferential direction of the frame 11, and also over the entire back surface 17b of the wafer 17.

[0151] In the second embodiment, since a wafer 17 is present in the central recess 4b, the tape presence detection process S40 uses the optical sensor 70 of the first modified example (see FIG. 9(A)) or the camera 72 of the second modified example (see FIG. 9(B)), but otherwise is the same as the first embodiment.

[0152] In the second embodiment, like the tape cutting section 40 of the third modified example (see FIG. 10), two pressure rollers 56 may be provided on the bar 38, or the fourth modified example may be applied.

[0153] In addition, the structures, methods, etc. according to the above-described embodiments can be modified as appropriate without departing from the scope of the present invention. For example, the presser roller 56 can be omitted from the cutting mechanism 28 shown in Figures 1 and 2.

[0154] One of the main functions of the pressure roller 56 is to make the output shaft 36a (i.e., the rotation axis for the cutter 48) perpendicular to the upper surface 4a of the table 4 (or the bottom surface of the annular recess 4c), so if the orthogonality of the output shaft 36a can be ensured with a specified accuracy, the pressure roller 56 may be omitted.

[0155] In addition, in order to adjust the relative height of the tape cutting section 40 with respect to the frame 11, instead of the second lifting mechanism 32 alone, both the first lifting mechanism 8 and the second lifting mechanism 32 may function as height adjustment mechanisms.

[0156] Incidentally, in the fixing step S10, a vacuum mounter (not shown) may be used instead of the pressure roller 26 to fix the tape 13 to the frame 11. The vacuum mounter has a cylindrical upper chamber with a top and a cylindrical lower chamber with a bottom.

[0157] In the fixing step S10, first, tape 13 is sandwiched between the opening edge of the upper chamber and the opening edge of the lower chamber. At this time, the base layer of tape 13 contacts the opening edge of the upper chamber, and the adhesive layer of tape 13 contacts the opening edge of the lower chamber.

[0158] A table (not shown) is provided in the lower chamber, and the frame 11 is supported by this table so as to be slightly below and spaced apart from the tape 13. The frame 11 supported by the table faces the adhesive layer of the tape 13.

[0159] After the tape 13 is sandwiched and fixed between the upper and lower chambers, the pressure in each of the internal spaces of the upper and lower chambers is reduced. For example, by sucking the internal spaces of the upper and lower chambers with a suction source (not shown) such as a vacuum pump, the pressure in each internal space becomes negative in terms of gauge pressure, with a predetermined pressure (for example, atmospheric pressure) as the reference.

[0160] Thereafter, while maintaining the pressure in the internal space of the lower chamber at a negative pressure, the internal space of the upper chamber is set to the above-mentioned reference internal pressure (for example, atmospheric pressure). As a result, the tape 13 is pressed against the frame 11 by utilizing the air pressure difference, and the tape 13 is fixed to the frame 11.

[0161] In addition, while maintaining the pressure in the internal space of the upper chamber at negative pressure, the internal space of the lower chamber may be changed from negative pressure to a predetermined pressure (e.g., atmospheric pressure), thereby pressing and fixing the tape 13 against the frame 11 placed in the upper chamber.

[0162] However, in this case, a frame holding section (not shown) that holds the frame 11 by magnetic force, electrostatic force, etc. is provided inside the upper chamber, and the adhesive layer of the tape 13 contacts the opening edge of the upper chamber, and the base layer of the tape 13 contacts the opening edge of the lower chamber.

[0163] Meanwhile, while the cutter 48 is cutting the tape 13, the controller 60 may change the height of the tape cutting section 40 in the Z-axis direction and change the power supplied to the piezoelectric element 44 according to the impedance of the piezoelectric element 44.

[0164] For example, when the cutter 48 is cutting the tape 13, the impedance of the piezoelectric element 44 exceeds the threshold Z T When the tape cutting section 40 approaches the Z-axis position, the controller 60 moves the tape cutting section 40 upward by a predetermined length and increases the power supplied to the piezoelectric element 44 to increase the amplitude of the piezoelectric element 44 in the Z-axis direction.

[0165] This allows the cutter 48 to avoid physical contact with the frame 11 while increasing the heat generated by the vibration of the ultrasonic frequency, thereby melting the tape 13. Note that when the impedance exceeds the threshold Z during cutting of the tape 13, T When the height of the tape cutting portion 40 has dropped sufficiently below this value, the height of the tape cutting portion 40 and the power supplied to the piezoelectric element 44 may be returned to their original values. [Explanation of symbols]

[0166] 2: Tape application device (processing device) 4: table, 4a: top surface, 4b: central recess, 4c: annular recess, 4d: circular recess 6: Support section, 8: First lifting mechanism, 10: Tape supply section 11: frame, 11a: opening, 11b: one surface, 11c: other surface 12: Supply roller 13: tape, 13a: central region, 13b: outer peripheral region, 13c: fusing region 14: Tape drawer 14a: first draw-out roller, 14b: second draw-out roller, 14c: motor 15: Frame unit 16: Release film winding section, 18: Release film winding roller, 18a: Motor 17: wafer, 17a: front surface, 17b: back surface, 19: release film 20: Guide roller 21, 23, 25: Roll body 22: tape winding section, 24: tape winding roller, 24a: motor 26: Pressure roller 27: Frame unit 28: Cutting mechanism, 30: Beam portion, 32: Second lifting mechanism (height adjustment mechanism) 34: Rotation drive mechanism, 36: Motor, 36a: Output shaft, 38: Bar, 38a: Beam 40: Tape cutting section, 42: Vibration-isolating member 44: Piezoelectric element, 44a: First lead wire, 44b: Second lead wire 46: holder, 48: cutter, 48a: one side, 48b: other side, 48c: cutting edge 50: Ultrasonic oscillator 52: Fixed member, 54: Rotating shaft, 56: Presser roller 58a: Touch panel display, 58b: Indicator light 60: Controller, 60a: Processor, 60b: Memory 66: Measurement unit, 68, 70: Optical sensors, 72: Camera Z T :Threshold S10: Fixing process, S20: Positioning process S30: Tape cutting process, S40: Tape presence detection process

Claims

1. A processing apparatus for forming a frame unit in which a tape is fixed to a frame having an opening so as to cover the opening and not protrude from an outer periphery of the frame, a tape supply unit having a roll body in which the long tape is wound in a roll shape; a tape cutting unit that cuts a portion of the tape that is supplied from the tape supply unit and fixed to the frame so as to cover the opening, between the opening and an outer peripheral edge of the frame in a radial direction of the opening; a height adjustment mechanism that adjusts the height position of the tape cutting unit relative to the frame; a rotation drive mechanism that rotates the tape cutting unit and the frame relative to each other; a tape winding section that winds up the used tape, including the outer peripheral region of the tape that is located outside the central region of the tape that has been circularly cut by the tape cutting section; a controller for controlling the operation of the tape cutting unit and the rotation drive mechanism; Equipped with The tape cutting section is a cutter for cutting the tape; a piezoelectric element that applies ultrasonic frequency vibrations to the cutter; When the cutter cuts the tape, the cutter to which ultrasonic frequency vibrations are applied is positioned by the height adjustment mechanism at a height that does not contact the frame.

2. 2. The processing apparatus according to claim 1, wherein when the cutter cuts the tape, the controller controls the height adjustment mechanism to position the cutter, to which ultrasonic frequency vibrations are applied, at a height that does not contact the frame.

3. 2. The processing device according to claim 1, wherein the controller determines whether the cutter is in contact with the frame based on the impedance of the piezoelectric element during operation.

4. further comprising a measurement unit having an optical sensor or a camera; The controller After the tape cutting operation by the tape cutting unit is completed, the measuring unit is used to detect whether the tape is fixed to the frame; 4. The processing device according to claim 1, wherein if it is found that the tape is not fixed to the frame, it is determined that cutting of the tape has not been completed normally, and an alarm is issued.

5. the tape cutting unit includes a vibration-isolating member provided on the opposite side of the cutter with the piezoelectric element sandwiched therebetween, 2. The processing apparatus according to claim 1, wherein the tape cutting section is connected to the rotation drive mechanism via the vibration isolating member.

6. A method for forming a frame unit, in which a frame unit is formed in a frame having an opening, in which a tape is fixed to the frame so as to cover the opening and not protrude from an outer periphery of the frame, comprising: a fixing step of fixing the elongated tape to the frame so as to cover the opening of the frame; a positioning step of positioning the cutter to which ultrasonic vibrations have been applied at a height such that the cutter does not come into contact with the frame after the fixing step; a tape cutting step in which, after the positioning step, the frame and the cutter vibrating at an ultrasonic frequency are rotated relative to each other to bring the cutter into contact with the tape and utilize heat applied to the tape to cut a portion of the tape between the opening and the outer periphery of the frame in the radial direction of the opening; A method for forming a frame unit, comprising:

Images