Alloy resin
The alloy resin composition with a vinyl chloride resin, (meth)acrylic resin, and stabilizer compounds addresses the balance between fluidity and heat resistance, enhancing molding efficiency and product durability.
JP2026028383APending Publication Date: 2026-02-20SHIN ETSU POLYMER CO LTD
Patent Information
- Application Number
- JP2024130748
- Authority / Receiving Office
- JP · JP
- Patent Type
- Applications
- Current Assignee / Owner
- Filing Date
- 2024-08-07
- Publication Date
- 2026-02-20
AI Technical Summary
Technical Problem
Existing alloy resins face challenges in achieving a balance between high fluidity during melting and heat resistance in molded products, which are crucial for efficient molding and performance.
Method used
The alloy resin composition includes a vinyl chloride resin, a (meth)acrylic resin, and a stabilizer comprising a liquid and powdery organotin compound, with specific ratios and properties to enhance both fluidity and heat resistance.
Benefits of technology
The alloy resin achieves an excellent balance between fluidity when melted and heat resistance when cured, improving molding processability and product performance.
✦ Generated by Eureka AI based on patent content.
Smart Images

Figure 2026028383000001
Abstract
To provide an alloy resin excellent in the balance between fluidity in melting and heat resistance in curing.SOLUTION: A polymer alloy comprising a polyvinyl chloride (A), a (meth) acrylic resin (B), and a stabilizing agent (C), wherein the stabilizing agent (C) comprises a liquid organotin compound (c1) that is liquid at 20 °C and a powdery organotin compound (c2) that is powdery at 20 °C. It is preferable that the melt flow rate (210 °C., load: 98N) of the alloy resins is 20g / 10 minutes or more, and the deflection temperature under load of the alloy resins is 80 °C. or more.SELECTED DRAWING: None
Need to check novelty before this filing date? Find Prior Art
Citation Information
Patent Citations
Method for manufacturing alloy resin and method for manufacturing molded article
JP2022053913A