Mounting apparatus and mounting method

Abstract

To suppress reduction in productivity due to mounting failure.SOLUTION: An imaging unit (imaging device 12) acquires a first image by imaging a first region including a first mounting position of a first board before a first component is mounted on the first board, and acquires a second image by imaging a second region including a second mounting position of a second board before a second component is mounted on the second board. The acquisition unit 1231 acquires inspection information including an inspection result relating to a first mounting position of a first board and a first component on the first board by an inspection device. The storage unit 124 stores the first image when the state of the first mounting position of the first board is normal from the inspection information acquired by the acquisition unit 1231. The determination unit 1232 determines whether or not the state of the second mounting position of the second board is normal by comparing the second image acquired by the imaging unit with the first image stored in the storage unit 124.SELECTED DRAWING: Figure 2

Description

[Technical Field]

[0001] The present disclosure relates to a mounting apparatus and a mounting method. More particularly, the present disclosure relates to a mounting apparatus including an imaging unit that acquires a plurality of images, and a mounting method that includes an imaging step of acquiring a plurality of images. [Background technology]

[0002] Patent Document 1 describes a mounting system including a mounting head and an imaging device. The mounting head, with the capturing unit capturing a component, moves the capturing unit closer to the board and mounts the component on the mounting surface of the board. The imaging device is fixed to the mounting head and includes in its imaging field of view a specific area of ​​the mounting surface of the board that faces the capturing unit. The imaging device captures images of the state of the mounting surface of the board before and after component mounting. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] International Publication No. 2021 / 060064 Summary of the Invention [Problem to be solved by the invention]

[0004] In a mounting system (mounting device) such as that described in Patent Document 1, it is desirable to suppress a decrease in productivity due to mounting defects.

[0005] An object of the present disclosure is to provide a mounting apparatus and a mounting method that can suppress a decrease in productivity due to mounting defects. [Means for solving the problem]

[0006] A mounting device according to one aspect of the present disclosure includes an imaging unit, an acquisition unit, a storage unit, and a determination unit. The imaging unit performs a first imaging process and a second imaging process. In the first imaging process, a first image is acquired by capturing an image of a first region on a first board including a first mounting position where a first component is to be mounted before the first component is mounted on the first board. In the second imaging process, a second image is acquired by capturing an image of a second region on a second board including a second mounting position where a second component of the same type as the first component is to be mounted before the second component of the same type as the first board is mounted. The acquisition unit acquires inspection information including inspection results regarding the first mounting position on the first board and the first component on the first board, obtained by an inspection device that inspects the first board. The storage unit stores the first image when the inspection information acquired by the acquisition unit indicates that the state of the first mounting position on the first board is normal. The determination unit performs a determination process. In the determination process, the second image acquired by the imaging unit in the second imaging process is compared with the first image stored in the memory unit to determine whether the state of the second mounting position on the second board is normal or not.

[0007] A mounting device according to one aspect of the present disclosure includes an imaging unit, an acquisition unit, a storage unit, and a determination unit. The imaging unit performs a first imaging process and a second imaging process. In the first imaging process, after a first component is mounted on a first board, a first region on the first board including the first component is imaged to obtain a first image. In the second imaging process, after a second component of the same type as the first component is mounted on a second board of the same type as the first board, a second region on the second board including the second component is imaged to obtain a second image. The acquisition unit acquires inspection information including a first mounting position, which is a position on the first board where the first component is mounted, and an inspection result regarding the first component on the first board, obtained by an inspection device that inspects the first board. The storage unit stores the first image when the inspection information acquired by the acquisition unit indicates that the condition of the first component on the first board is normal. The determination unit performs a determination process. In the judgment process, the second image acquired by the imaging unit in the second imaging process is compared with the first image stored in the memory unit to determine whether the condition of the second component on the second board is normal.

[0008] A mounting method according to one aspect of the present disclosure includes a first imaging step, a second imaging step, an acquisition step, a storage step, and a determination step. In the first imaging step, a first image is acquired by imaging a first region on a first board including a first mounting position where a first component is to be mounted before the first component is mounted on the first board. In the second imaging step, a second image is acquired by imaging a second region on the second board including a second mounting position where a second component of the same type as the first component is to be mounted before the second component of the same type as the first board is mounted. In the acquisition step, inspection information including inspection results regarding the first mounting position on the first board and the first component on the first board is acquired by an inspection device that inspects the first board. In the storage step, the first image is stored if the condition of the first mounting position on the first board is normal based on the inspection information acquired in the acquisition step. In the determination step, the second image acquired in the second imaging step is compared with the first image stored in the storage step to determine whether the state of the second mounting position on the second board is normal.

[0009] A mounting method according to one aspect of the present disclosure includes a first imaging step, a second imaging step, an acquisition step, a storage step, and a determination step. In the first imaging step, after a first component is mounted on a first board, a first region on the first board including the first component is imaged to obtain a first image. In the second imaging step, after a second component of the same type as the first component is mounted on a second board of the same type as the first board, a second region on the second board including the second component is imaged to obtain a second image. In the acquisition step, inspection information including a first mounting position where the first component is mounted on the first board and inspection results regarding the first component on the first board is acquired by an inspection device that inspects the first board. In the storage step, if the inspection information acquired in the acquisition step indicates that the condition of the first component on the first board is normal, the first image is stored. In the determination step, the second image acquired in the second imaging step is compared with the first image stored in the storage step to determine whether the condition of the second component on the second board is normal. [Effects of the Invention]

[0010] According to the mounting apparatus and mounting method according to an aspect of the present disclosure, it is possible to suppress a decrease in productivity due to mounting defects. [Brief explanation of the drawings]

[0011] [Figure 1] FIG. 1 is a schematic configuration diagram of a production line management system equipped with a mounting device according to an embodiment. [Figure 2] FIG. 2 is a block diagram of the mounting device. [Figure 3] FIG. 3 is a schematic diagram of the mounting device. [Figure 4] FIG. 4 is a schematic diagram illustrating the state where an imaging unit of the mounting device acquires a pre-mounting image in a first operation. [Figure 5] FIG. 5 is a schematic diagram showing the mounting head of the mounting apparatus mounting components onto a board in a first operation. [Figure 6]FIG. 6 is a schematic diagram illustrating the state where the imaging unit of the mounting device acquires a post-mounting image in a first operation. [Figure 7] FIG. 7 is a schematic diagram of a pre-mounting image captured by an imaging unit of the mounting device in a first operation. [Figure 8] FIG. 8 is a schematic diagram of a post-mounting image captured by an imaging unit of the mounting device in a first operation. [Figure 9] FIG. 9 is a flowchart showing a first operation of the mounting device. [Figure 10] FIG. 10 is a schematic diagram illustrating the image capturing unit of the mounting device when capturing a pre-mounting image in a second operation. [Figure 11] FIG. 11 is a schematic diagram of a pre-mounting image captured by the imaging unit of the mounting device in the second operation. [Figure 12] FIG. 12 is a schematic diagram illustrating the imaging unit of the mounting device when acquiring a post-mounting image in the second operation. [Figure 13] FIG. 13 is a schematic diagram of a post-mounting image captured by the imaging unit of the mounting device in the second operation. [Figure 14] FIG. 14 is a flowchart showing a second operation of the mounting device. [Figure 15] FIG. 15 is a timing chart showing a second operation of the mounting device. DETAILED DESCRIPTION OF THE INVENTION

[0012] Hereinafter, a mounting apparatus and a mounting method according to an embodiment will be described with reference to the drawings. The drawings referred to in the following embodiments are schematic diagrams, and the sizes and thicknesses of the components in the drawings do not necessarily reflect the actual dimensions, and the size and thickness ratios between the components do not necessarily reflect the actual dimensional ratios.

[0013] (Embodiment) (1) Overview First, an overview of a mounting device 1 according to an embodiment will be described with reference to FIGS.

[0014] The mounting apparatus 1 (mounting apparatuses M1 to M3) according to the embodiment is an apparatus that constitutes a production line L1 together with, for example, two inspection apparatuses M4 and M6 and one reflow apparatus M5, as shown in Fig. 1. The mounting apparatus 1 is also an apparatus that constitutes a production line management system 10 together with, for example, two inspection apparatuses M4 and M6, one reflow apparatus M5, and one management apparatus 2, as shown in Fig. 1.

[0015] 2 and 3, the mounting apparatus 1 according to the embodiment includes an imaging device 12 (imaging unit), an acquisition unit 1231, a storage unit 124, and a determination unit 1232. The imaging device 12 performs a first imaging process and a second imaging process. In the first imaging process, before a first component 100A (see FIG. 4) is mounted on a first board 200A (see FIG. 4), the imaging device 12 captures an image Im1 (see FIG. 7) by capturing an image of a first region R11 (see FIG. 4) including a first mounting position Po11 (see FIG. 7), which is a position where the first component 100A is to be mounted on the first board 200A. Furthermore, in the second imaging process, before a second component 100B (see FIG. 10) of the same type as the first component 100A is mounted on a second substrate 200B (see FIG. 10) of the same type as the first substrate 200A, the imaging device 12 captures an image Im3 (see FIG. 11) by capturing an image of a second region R12 (see FIG. 10) including a second mounting position Po12 (see FIG. 11) where the second component 100B will be mounted on the second substrate 200B. The acquisition unit 1231 acquires inspection information including inspection results regarding the first mounting position Po11 on the first substrate 200A and the first component 100A on the first substrate 200A, obtained by an inspection device M4 (see FIG. 1) that inspects the first substrate 200A. The storage unit 124 stores the image Im1 when the inspection information acquired by the acquisition unit 1231 indicates that the state of the first mounting position Po11 on the first substrate 200A is normal. The determination unit 1232 performs a determination process. In the determination process, the determination unit 1232 determines whether the state of the second mounting position Po12 of the second board 200B is normal or not by comparing the image Im3 acquired by the imaging device 12 in the second imaging process with the image Im1 stored in the storage unit 124. In this embodiment, the image Im1 corresponds to the first image, and the image Im3 corresponds to the second image.

[0016] In the mounting apparatus 1 according to the embodiment, in the above-described determination process, the determination unit 1232 determines whether the state of the second mounting position Po12 on the second substrate 200B is normal by comparing the image Im1 with the image Im3 before mounting the second component 100B on the second substrate 200B. If the state of the second mounting position Po12 on the second substrate 200B is not normal, the mounting apparatus 1 can be stopped before mounting the second component 100B on the second substrate 200B, thereby reducing loss of components 100 (second components 100B) due to mounting defects. In other words, the mounting apparatus 1 according to the embodiment can suppress a decrease in productivity due to mounting defects.

[0017] Furthermore, in the mounting apparatus 1 according to the embodiment, the imaging device 12 further performs a third imaging process and a fourth imaging process. In the third imaging process, after the first component 100A is mounted on the first board 200A, the imaging device 12 captures an image of a third region R13 (see FIG. 6) including the first component 100A on the first board 200A to acquire an image Im2 (see FIG. 8). In the fourth imaging process, after the second component 100B is mounted on the second board 200B, the imaging device 12 captures an image of a fourth region R14 (see FIG. 12) including the second component 100B on the second board 200B to acquire an image Im4 (see FIG. 13). The storage unit 124 further stores the image Im2 when the inspection information acquired by the acquisition unit 1231 indicates that the condition of the first component 100A on the first board 200A is normal. The determination unit 1232 further performs a second determination process that is different from the first determination process, which is the determination process described above. In the second determination process, the determination unit 1232 determines whether the state of the second component 100B on the second board 200B is normal by comparing the image Im4 captured by the imaging device 12 in the fourth imaging process with the image Im2 stored in the storage unit 124. In this embodiment, the image Im2 corresponds to the third image, and the image Im4 corresponds to the fourth image.

[0018] In the mounting apparatus 1 according to the embodiment, in the second determination process, the determination unit 1232 compares the image Im2 with the image Im4 after mounting the second component 100B on the second substrate 200B to determine whether the state of the second component 100B on the second substrate 200B is normal. If the state of the second component 100B on the second substrate 200B is not normal, the mounting apparatus 1 can be stopped before mounting the next component 100 on the second substrate 200B, thereby reducing the loss of components 100 due to mounting defects. In other words, the mounting apparatus 1 according to the embodiment can suppress a decrease in productivity due to mounting defects.

[0019] (2)Details Next, each component of the mounting apparatus 1 and the production line management system 10 according to the embodiment will be described with reference to FIGS.

[0020] As described above, the mounting apparatus 1 according to the embodiment is an apparatus that constitutes the production line L1 together with, for example, two inspection apparatuses M4 and M6 and one reflow apparatus M5. Also, as described above, the mounting apparatus 1 is an apparatus that constitutes the production line management system 10 together with, for example, two inspection apparatuses M4 and M6, one reflow apparatus M5, and one management apparatus 2.

[0021] As shown in FIG. 1, the production line management system 10 includes a production line L1 and a management device 2.

[0022] (2.1) Production Line First, the components of the production line L1 will be described with reference to FIG.

[0023] As shown in FIG. 1, the production line L1 includes, for example, three mounting devices M1 to M3, two inspection devices M4 and M6, and one reflow device M5. In the production line L1, the mounting device M1, the mounting device M2, the mounting device M3, the inspection device M4, the reflow device M5, and the inspection device M6 are connected in series in this order. Although not shown, a solder printing device, a board supplying device that supplies a board 200 (see FIG. 3), and a board transfer device that transfers the board 200 supplied from the board supplying device to the solder printing device are provided upstream of the mounting device M1 (on the left side of FIG. 1). Similarly, although not shown, a board recovery device that recovers mounted boards (described below) is provided downstream of the inspection device M6 (on the right side of FIG. 1). The board supply device, board transfer device, solder printing device, three mounting devices M1 to M3, two inspection devices M4 and M6, reflow device M5, and board recovery device are each connected to management device 2 via communication network N1. That is, the board supply device, board transfer device, solder printing device, three mounting devices M1 to M3, two inspection devices M4 and M6, reflow device M5, and board recovery device are each capable of communicating with management device 2. Furthermore, each device can communicate with one another via communication network N1.

[0024] The solder printing device, three mounting devices M1 to M3, and reflow device M5 perform component mounting work to mount components 100 (see FIG. 3) on boards 200 (see FIG. 3) transported along production line L1. That is, boards 200 supplied by a board supply device are carried into the solder printing device via a board delivery device. The solder printing device performs solder printing work to screen-print solder for joining components onto the carried-in boards 200.

[0025] The solder-printed board 200 is sequentially handed over to three mounting devices M1 to M3. The three mounting devices M1 to M3 perform component mounting work, mounting components 100 on the solder-printed board 200. The board 200 after component mounting is carried into a reflow device M5 and heated according to a predetermined heating process. This melts and solidifies the solder for joining components printed on the heated board 200. Then, the components 100 are solder-joined to the board 200, thereby producing a mounted board, which is a finished product in which the components 100 are mounted on the board 200. The produced mounted board is collected by a board collection device.

[0026] Each of the two inspection devices M4, M6 is equipped with a camera. During mass production of mounted boards, each of the two inspection devices M4, M6 inspects the board 200 based on images captured by the camera. As shown in FIG. 1, the inspection device M4 is provided between the mounting device M3 and the reflow device M5. The inspection device M4 inspects the board 200 after components are mounted by the mounting devices M1 to M3. More specifically, the inspection device M4 inspects, for example, the state of the mounting position of each component 100 on the board 200. The inspection device M4 transmits the inspection results to the management device 2 via the communication network N1. As shown in FIG. 1, the inspection device M6 is provided on the opposite side of the reflow device M5 from the inspection device M4. That is, the inspection device M6 is provided downstream of the reflow device M5. The inspection device M6 inspects, for example, the board 200 after reflow. More specifically, the inspection device M6 inspects, for example, the state of the solder on the substrate 200 after reflow. The inspection device M6 transmits the inspection results to the management device 2 via the communication network N1.

[0027] Furthermore, in this embodiment, the inspection device M4 inspects the first board 200A after the first component 100A is mounted by the mounting device 1, for example, during prototype production before mass production of the mounted board. More specifically, the inspection device M4 uses the camera to capture an image of the first board 200A after the first component 100A is mounted, and inspects the state of the first board 200A based on the captured image. Specifically, the inspection device M4 inspects the state of the first mounting position Po11 on the first board 200A and the state of the first component 100A mounted on the first board 200A based on the captured image. For example, if the inspection result by the inspection device M4 is normal, it can be determined that the state immediately before the first component 100A is mounted on the first board 200A by the mounting device 1 and the state immediately after the first component 100A is mounted on the first board 200A by the mounting device 1 are also normal.

[0028] Then, the inspection device M4 transmits inspection information including the inspection results to each of the mounting devices M1 to M3 via the communication network N1.

[0029] (2.2) Mounting equipment Next, the components of the mounting apparatus 1 will be described with reference to FIGS.

[0030] In the following description, as an example, three mutually orthogonal axes, the X-axis, the Y-axis, and the Z-axis, are defined. The axes parallel to the surface of the substrate 200 are referred to as the "X-axis" and the "Y-axis," and the axis parallel to the thickness direction of the substrate 200 is referred to as the "Z-axis." Furthermore, one of the two directions along the Z-axis is referred to as the upward direction, and the other is referred to as the downward direction. For example, when the holding unit 112 faces the substrate 200, the substrate 200 is positioned below the holding unit 112. The X-axis, the Y-axis, and the Z-axis are all imaginary axes, and the arrows indicating "X," "Y," and "Z" in FIG. 3 are merely shown for explanatory purposes and do not have any physical substance. Furthermore, these directions are not intended to limit the directions in which the mounting apparatus 1 is used.

[0031] As described above, each of the three mounting devices M1 to M3 is a mounting device (hereinafter also referred to as a "mounting device 1") that performs component mounting work to mount components 100 on a board 200. As shown in Fig. 2, the mounting device 1 includes a mounting head 11, an imaging device 12, a moving device 13, a control device 14, a transport device 15, a plurality of component supply devices 16, and a fixed camera 17. Furthermore, as shown in Fig. 3, the mounting device 1 further includes a base 18.

[0032] (2.2.1) Mounting head The mounting head 11 is a device for mounting the components 100 supplied from each component supply device 16 onto the board 200. The mounting head 11 has a head unit 111 and a holder 112, as shown in FIG.

[0033] The holder 112 is, for example, a suction nozzle. The holder 112 is switchable between a state in which the component 100 is sucked and a state in which the component 100 is released from the suction. The holder 112 is not limited to a suction nozzle, and may be configured to hold the component by grasping (picking) it like a robot hand, for example.

[0034] The head unit 111 is, for example, made of metal and formed in a rectangular parallelepiped shape. The holding unit 112 and a vertical drive unit 132 (described later) are assembled to the head unit 111, whereby the head unit 111 holds the holding unit 112 and the vertical drive unit 132. In this embodiment, the holding unit 112 is indirectly held by the head unit 111 via the vertical drive unit 132 in a state in which the holding unit 112 is movable in the Z-axis direction and the θ-direction (described later). The mounting head 11 moves within the XY plane by the head unit 111 being moved within the XY plane by a horizontal drive unit 131 (described later). The "XY plane" here refers to a plane that includes the X-axis and the Y-axis and is perpendicular to the Z-axis. The head unit 111 also holds the imaging device 12 (see FIG. 3).

[0035] (2.2.2) Imaging device As shown in Fig. 3, the imaging device 12 is fixed to the mounting head 11. The imaging device 12 is, for example, a video camera that captures moving images. The imaging device 12 captures an image of an area R1 (see Fig. 4) including a mounting position Po1 (see Fig. 3) while the mounting head 11 is moving.

[0036] The imaging device 12 can be realized, for example, by a computer system having one or more processors and one or more memories. That is, the imaging device 12 functions as the imaging device 12 when one or more processors execute a program recorded in one or more memories of the computer system. Here, the program is pre-recorded in the memory of the computer system, but it may also be provided via a telecommunications line such as the Internet, or may be provided by recording it on a non-transitory recording medium such as a memory card.

[0037] As shown in FIG. 2, the imaging device 12 includes an imaging element 121 and an optical system 122. The optical system 122 forms images Im1 to Im4 (see FIGS. 7, 8, 11, and 13) of an area R1 including the mounting position Po1 on the imaging element 121. The imaging element 121 is, for example, an image sensor such as a CCD (Charge Coupled Device) or a CMOS (Complementary Metal-Oxide Semiconductor). The imaging element 121 converts the image formed on its light-receiving surface into an electrical signal and outputs the electrical signal. The optical system 122 includes one or more lenses and mirrors. In the present embodiment, as an example, the optical system 122 is realized by a combination of multiple lenses (a lens group). The optical system 122 forms an image of light from an area including the mounting position Po1 on the light-receiving surface of the imaging element 121. The imaging element 121 and the optical system 122 are housed in the same housing 120 (see FIG. 4). The optical system 122 is not limited to the above configuration.

[0038] 3, the imaging device 12 is disposed below the head unit 111 and to the side of the holder 112 in plan view from the Z-axis direction. In this manner, the imaging device 12 is attached to the head unit 111 together with the holder 112, and moves in the XY plane together with the holder 112. Note that the imaging device 12 may be configured to move relative to the holder 112. For example, the head unit 111 may include an axis for moving the imaging device 12.

[0039] Furthermore, the imaging device 12 has an imaging optical axis Ax1 (see FIG. 4) that intersects with the Z axis (vertical direction). In other words, the imaging optical axis Ax1 of the imaging device 12 extends obliquely with respect to the vertical direction. That is, the imaging device 12 is fixed to the head unit 111 so that the imaging direction of the imaging device 12 intersects with the vertical direction, and images the region R1 including the mounting position Po1 from obliquely above. This makes it possible for the mounting device 1 to reduce the time required for mounting and improve productivity. Note that the horizontal direction is the direction along the XY plane, and the vertical direction is the direction perpendicular to the horizontal direction (the direction along the Z axis).

[0040] Imaging device 12 performs a first imaging process to acquire an image Im1 (see FIG. 7) and a second imaging process to acquire an image Im3 (see FIG. 11). More specifically, as shown in FIG. 4, in the first imaging process, before first component 100A is mounted on first board 200A, imaging device 12 acquires image Im1 (see FIG. 7) by imaging a first region R11 including first mounting position Po11 (see FIG. 7) where first component 100A will be mounted on first board 200A. Furthermore, as shown in FIG. 10, in the second imaging process, before second component 100B is mounted on second board 200B, imaging device 12 acquires image Im3 (see FIG. 11) by imaging a second region R12 including second mounting position Po12 (see FIG. 11) where second component 100B will be mounted on second board 200B. The first substrate 200A and the first component 100A are, for example, the substrate 200 and the component 100 used in the prototype stage before mass production of the above-mentioned mounting substrate or in the early stage of mass production. The second substrate 200B and the second component 100B are, for example, the substrate 200 and the component 100 used during mass production. The first substrate 200A and the second substrate 200B are the same type of substrate, and the first component 100A and the second component 100B are the same type of component. In other words, the second substrate 200B is the same type of substrate 200 as the first substrate 200A, and the second component 100B is the same type of component 100 as the first component 100A. In this embodiment, the image Im1 corresponds to the first image, and the image Im3 corresponds to the second image.

[0041] Furthermore, imaging device 12 further performs a third imaging process to acquire image Im2 (see FIG. 8) and a fourth imaging process to acquire image Im4 (see FIG. 13). More specifically, as shown in FIG. 6, in the third imaging process, after first component 100A is mounted on first board 200A, imaging device 12 captures a third region R13 including first component 100A on first board 200A to acquire image Im2 (see FIG. 8). Furthermore, as shown in FIG. 12, in the fourth imaging process, after second component 100B is mounted on second board 200B, imaging device 12 captures a fourth region R14 including second component 100B on second board 200B to acquire image Im4 (see FIG. 13). In this embodiment, image Im2 corresponds to the third image, and image Im4 corresponds to the fourth image.

[0042] 2, the imaging device 12 further includes a processing unit 123 and a storage unit 124. The processing unit 123 includes an acquisition unit 1231 and a determination unit 1232.

[0043] The acquiring unit 1231 acquires the inspection information from, for example, the inspection device M4. The inspection information includes an inspection result regarding the first mounting position Po11 of the first board 200A by the inspection device M4 (see FIG. 1) that inspects the first board 200A. For example, if an image captured by the camera of the inspection device M4 shows that no other component 100 is present within the first mounting position Po11 of the first board 200A, the inspection information includes an inspection result indicating that the state of the first mounting position Po11 of the first board 200A is normal. On the other hand, if the image captured shows that another component 100 is present within the first mounting position Po11 of the first board 200A, the inspection information includes an inspection result indicating that the state of the first mounting position Po11 of the first board 200A is not normal (abnormal).

[0044] The inspection information also includes an inspection result regarding first component 100A on first board 200A by inspection device M4 (see FIG. 1) that inspects first board 200A. For example, if an image captured by a camera of inspection device M4 shows that first component 100A is properly mounted in first mounting position Po11 on first board 200A, the inspection information includes an inspection result indicating that the state of first component 100A on first board 200A is normal. On the other hand, if the image captured shows that first component 100A is not properly mounted in first mounting position Po11 on first board 200A, the inspection information includes an inspection result indicating that the state of first component 100A on first board 200A is not normal (abnormal).

[0045] The determination unit 1232 performs a determination process (hereinafter referred to as a "first determination process") to determine whether the state of the second mounting position Po12 on the second board 200B is normal. More specifically, in the first determination process, the determination unit 1232 determines whether the state of the second mounting position Po12 on the second board 200B is normal by comparing the image Im3 acquired by the imaging device 12 in the second imaging process with the image Im1 stored in the storage unit 124. Specifically, if the image Im1 and the image Im3 match, the determination unit 1232 determines that the state of the second mounting position Po12 on the second board 200B is normal. On the other hand, if the image Im1 and the image Im3 do not match, the determination unit 1232 determines that the state of the second mounting position Po12 on the second board 200B is not normal. Here, "image Im1 and image Im3 match" includes cases where image Im1 and image Im3 match completely, and cases where image Im1 and image Im3 differ to the extent that the functionality of second substrate 200B is not impaired.

[0046] Furthermore, the determination unit 1232 performs a determination process (hereinafter referred to as a "second determination process") to determine whether the second component 100B on the second substrate 200B is normal. More specifically, in the second determination process, the determination unit 1232 determines whether the state of the second component 100B on the second substrate 200B is normal by comparing the image Im4 acquired by the imaging device 12 in the fourth imaging process with the image Im2 stored in the storage unit 124. Specifically, if the image Im2 and the image Im4 match, the determination unit 1232 determines that the state of the second component 100B on the second substrate 200B is normal. If the image Im2 and the image Im4 do not match, the determination unit 1232 determines that the state of the second component 100B on the second substrate 200B is not normal. Here, "image Im2 and image Im4 match" includes cases where image Im2 and image Im4 match completely, and cases where image Im2 and image Im4 differ to the extent that the functionality of second substrate 200B is not impaired.

[0047] The storage unit 124 includes, for example, a semiconductor memory such as a read-only memory (ROM), a random access memory (RAM), or an electrically erasable programmable read-only memory (EEPROM). Note that the storage unit 124 is not limited to a semiconductor memory, and may be a hard disk drive or the like.

[0048] For example, the storage unit 124 stores an image Im1 (see FIG. 7) when the state of the first mounting position Po11 on the first board 200A is normal based on the inspection information acquired by the acquisition unit 1231. Furthermore, the storage unit 124 stores an image Im2 (see FIG. 8) when the state of the first component 100A on the first board 200A is normal based on the inspection information acquired by the acquisition unit 1231.

[0049] 2, in the mounting device 1 according to this embodiment, the acquisition unit 1231, the determination unit 1232, and the storage unit 124 are provided in the imaging device 12. More specifically, the acquisition unit 1231, the determination unit 1232, and the storage unit 124 are provided in the housing 120. That is, the imaging device 12 (the image sensor 121 and the optical system 122), the acquisition unit 1231, the storage unit 124, and the determination unit 1232 are housed in the same housing 120. This makes it possible to improve the processing speed compared to when the first determination process or the second determination process is performed outside the mounting device 1.

[0050] (2.2.3) Mobile Devices The moving device 13 is a device for moving the mounting head 11. The moving device 13 moves the head unit 111 of the mounting head 11 horizontally within the XY plane, and moves the holder 112 of the mounting head 11 vertically along the Z axis. That is, the moving device 13 moves the head unit 111 in the X-axis direction and the Y-axis direction. In this embodiment, the holder 112 and the imaging device 12 are fixed to the head unit 111, and therefore the moving device 13 also moves the holder 112 and the imaging device 12 together with the head unit 111 in the X-axis direction and the Y-axis direction. In FIG. 3 , the moving device 13 moves the mounting head 11 between above the component supply port 161 of the component supply device 16 and above the board 200 positioned in the mounting space of the transport device 15.

[0051] Specifically, the moving device 13 includes a horizontal driving unit 131 and a vertical driving unit 132, as shown in FIG.

[0052] The horizontal drive unit 131 has an X-axis drive unit 1311 and a Y-axis drive unit 1312. The X-axis drive unit 1311 moves the mounting head 11 linearly in the X-axis direction. The Y-axis drive unit 1312 moves the mounting head 11 linearly in the Y-axis direction. The Y-axis drive unit 1312 moves the mounting head 11 linearly in the Y-axis direction by moving the mounting head 11 together with the X-axis drive unit 1311 along the Y-axis. The X-axis drive unit 1311 includes an X-axis motor and drives the X-axis motor. The Y-axis drive unit 1312 includes a Y-axis motor and drives the Y-axis motor. Each of the X-axis motor and the Y-axis motor is, for example, a linear motor. Therefore, in this embodiment, the X-axis drive unit 1311 moves the mounting head 11 linearly in the X-axis direction by using a driving force generated by the X-axis motor when power is supplied. Furthermore, the Y-axis driving unit 1312 receives power supply and uses the driving force generated by the Y-axis motor to move the mounting head 11 linearly in the Y-axis direction.

[0053] The vertical driving unit 132 moves the holding unit 112 linearly in the Z-axis direction. Furthermore, the vertical driving unit 132 rotates the holding unit 112 in a rotational direction (hereinafter referred to as the "θ direction") around an axis along the Z-axis direction. That is, the vertical driving unit 132 is an actuator that moves the holding unit 112 linearly in the Z-axis direction and rotates the holding unit 112 in the θ direction. In this embodiment, as an example, the vertical driving unit 132 drives the holding unit 112 with a driving force generated by a linear motor to move the holding unit 112 in the Z-axis direction. Furthermore, the vertical driving unit 132 drives the holding unit 112 with a driving force generated by a rotary motor to move the holding unit 112 in the θ direction. As described above, the head unit 111 of the mounting head 11 moves linearly in the X-axis direction and the Y-axis direction by the horizontal driving unit 131. As a result, the holding part 112 attached to the head unit 111 can be moved in the X-axis direction, the Y-axis direction, the Z-axis direction, and the θ direction by the horizontal driving part 131 and the vertical driving part 132.

[0054] (2.2.4) Control device The control device 14 can be realized, for example, by a computer system having one or more processors and one or more memories. That is, the one or more processors execute a program recorded in one or more memories of the computer system, thereby functioning as the control device 14. Here, the program is pre-recorded in the memory of the computer system, but it may also be provided via a telecommunications line such as the Internet, or may be provided by recording it on a non-transitory recording medium such as a memory card.

[0055] The control device 14 controls each part of the mounting apparatus 1. The control device 14 is electrically connected to, for example, the mounting head 11, the imaging device 12, the moving device 13, the conveying device 15, the plurality of component supply devices 16, and the fixed camera 17. The control device 14 outputs a control signal to the moving device 13 and controls the driving of the moving device 13 so as to mount the components 100 held by the holding unit 112 on the mounting surface 201 of the board 200. The control device 14 also outputs a control signal to the imaging device 12 and the fixed camera 17 to control each of the imaging device 12 and the fixed camera 17 and to acquire images captured by the imaging device 12 and the fixed camera 17 from the imaging device 12 and the fixed camera 17.

[0056] Furthermore, the control device 14 outputs a control signal to the transport device 15, and controls the transport device 15 so that the board 200 is positioned in the mounting space. The control device 14 also outputs a control signal to the plurality of component supply devices 16, and controls the plurality of component supply devices 16 so that the components 100 are positioned at the respective component supply ports 161.

[0057] (2.2.5) Conveyor The transport device 15 is a device for transporting the board 200. For example, as shown in FIG. 3, the transport device 15 has a pair of conveyor mechanisms 151. The transport device 15 transports the board 200 in the X-axis direction (a direction perpendicular to the plane of FIG. 3) by the pair of conveyor mechanisms 151. The transport device 15 transports the board 200 to a mounting space that is at least below the mounting head 11, that is, that faces the holder 112 in the Z-axis direction. The transport device 15 then stops the board 200 in the mounting space until the mounting head 11 has completed mounting the components 100 on the board 200.

[0058] (2.2.6) Parts supply device Each component supply device 16 supplies components 100 held by holding portions 112 of the mounting head 11. Each component supply device 16 has tape feeders attached side by side in the X-axis direction to feeder bases 22 of carriages 21 connected to the base 18. Each component supply device 16 pitch-feeds carrier tape 24 supplied from reels 23, and supplies components 100 held on carrier tape 24 to component supply ports 161. Reels 23 are held by carriages 21.

[0059] Each component supply device 16 may have a tray on which a plurality of components 100 are placed, instead of or in addition to the tape feeder. Also, each component supply device 16 may have a bulk feeder, instead of or in addition to the tape feeder.

[0060] (2.2.7) Fixed Camera Fixed camera (component recognition camera) 17 captures an image from below of mounting head 11 moving between above component supply port 161 of component supply device 16 and above board 200 positioned in the mounting space. Therefore, the image captured by fixed camera 17 shows component 100 held by holder 112. In other words, the image captured by fixed camera 17 contains information about the relative positional relationship between holder 112 and component 100, in other words, information about the misalignment of component 100 with respect to holder 112.

[0061] It is preferable that the fixed camera 17 captures an image of the mounting head 11 moving from the component supply port 161 toward the board 200 from below. In this case, the fixed camera 17 does not capture images all the time, but captures images when the holder 112 holding the component 100 passes above the fixed camera 17. The fixed camera 17 may also be installed below the component supply port 161.

[0062] (2.2.8) Other In addition to the above configuration, the mounting device 1 may also include, for example, a lighting device and a communication unit.

[0063] The lighting device illuminates the imaging area of ​​the imaging device 12. The imaging area is, for example, an area including the mounting position Po1. The lighting device only needs to be turned on at least at the timing when the imaging device 12 captures an image, and for example, emits light in synchronization with the imaging timing of the imaging device 12. In this embodiment, the images Im1 to Im4 of the imaging device 12 are full-color moving images, so the lighting device outputs light in the wavelength range of the visible light region, such as red or blue. In this embodiment, as an example, the lighting device has multiple light sources such as LEDs (Light Emitting Diodes). The lighting device illuminates the imaging area of ​​the imaging device 12 by emitting light from the multiple light sources. The lighting device is realized by an appropriate lighting method, for example, a diffused type or an oblique light type. For example, the lighting device is fixed to the mounting head 11 together with the imaging device 12.

[0064] The communication unit is configured to communicate with the management device 2 directly or indirectly via a network or a relay, etc. This allows the mounting device 1 to exchange data with the management device 2.

[0065] (2.3) Management device The management device 2 is a device for managing the above-mentioned board supply device, board transfer device, solder printing device, three mounting devices M1 to M3, two inspection devices M4 and M6, reflow device M5, and board recovery device. The management device 2 is connected to each device via a communication network N1 and can communicate with each device.

[0066] The management device 2 is, for example, a personal computer. The management device 2 can be realized, for example, by a computer system having one or more processors and one or more memories. That is, the management device 2 functions as a computer system when one or more processors execute a program recorded in one or more memories of the computer system. Here, the program is pre-recorded in the memory of the management device 2, but it may also be provided via a telecommunications line such as the Internet, or may be recorded on a non-transitory recording medium such as a memory card and provided.

[0067] (3) Operation Next, the operation of the mounting apparatus 1 according to the embodiment will be described with reference to Figures 4 to 15. Note that in Figures 4 to 6, 8, and 10 to 13, the component 100 is hatched with dots, but this hatching is added to distinguish between the component 100 and components other than the component 100, and does not indicate a cross section of the component 100.

[0068] The mounting device 1 according to the embodiment performs a first operation and a second operation. In the first operation, an image Im1 (see FIG. 7) and an image Im2 (see FIG. 8) that serve as judgment criteria in the first judgment process and the second judgment process of the judgment unit 1232 are acquired and stored (registered) in the storage unit 124. In the second operation, the judgment unit 1232 performs the first judgment process and the second judgment process using the images Im1 and Im2 acquired in the first operation. The first operation and the second operation will be specifically described below with reference to the drawings.

[0069] (3.1) First action First, a first operation of the mounting apparatus 1 will be described with reference to FIGS.

[0070] As shown in FIG. 4, before the first component 100A is mounted on the first board 200A, the imaging device 12 of the mounting apparatus 1 captures an image Im1 (see FIG. 7) by imaging a first region R11 including a first mounting position Po11, which is the position where the first component 100A is to be mounted on the first board 200A (step ST1 of FIG. 9).

[0071] Next, as shown in FIG. 5, mounting head 11 of mounting apparatus 1 mounts first component 100A held by holder 112 at first mounting position Po11 on first board 200A (step ST2 in FIG. 9).

[0072] Then, as shown in FIG. 6, after the first component 100A is mounted on the first substrate 200A, the imaging device 12 of the mounting apparatus 1 captures an image Im2 (see FIG. 8) by imaging the third region R13 including the first component 100A on the first substrate 200A (step ST3 of FIG. 9).

[0073] Furthermore, the processing unit 123 of the mounting device 1 determines whether or not there is a next mounting position Po1 on the first board 200A (step ST4 in FIG. 9). If there is a next mounting position Po1 (step ST4 in FIG. 9: Yes), the above-mentioned steps ST1 to ST3 are repeated. If there is no next mounting position Po1 (step ST4 in FIG. 9: No), the acquisition unit 1231 of the processing unit 123 acquires inspection information from the inspection device M4 (step ST5 in FIG. 9).

[0074] When the acquisition unit 1231 acquires the above inspection information (step ST5 in FIG. 9: Yes), the judgment unit 1232 of the processing unit 123 judges from the above inspection information whether the state of the first mounting position Po11 on the first board 200A and the state of the first component 100A on the first board 200A are normal or not (step ST6 in FIG. 9).

[0075] If the state of the first mounting position Po11 of the first substrate 200A is normal (step ST6: Yes in FIG. 9), the storage unit 124 stores (registers) the image Im1 acquired in step ST1 as a non-defective image (step ST7 in FIG. 9). On the other hand, if the state of the first mounting position Po11 of the first substrate 200A is not normal (step ST6: No in FIG. 9), the storage unit 124 does not store (register) the image Im1 acquired in step ST1 (step ST8 in FIG. 9). In this case, the state of the first mounting position Po11 is determined to be normal for the second and subsequent first substrates 200A, and the same process is repeated until the image Im1 acquired in step ST1 is registered.

[0076] Furthermore, if the condition of the first component 100A on the first substrate 200A is normal (step ST6 in FIG. 9: Yes), the storage unit 124 stores (registers) the image Im2 acquired in step ST3 as a non-defective image (step ST7 in FIG. 9). On the other hand, if the condition of the first component 100A on the first substrate 200A is not normal (step ST6 in FIG. 9: No), the storage unit 124 does not store (register) the image Im2 acquired in step ST3 (step ST8 in FIG. 9).

[0077] Furthermore, the processing unit 123 of the mounting device 1 determines whether or not there is a next mounting position Po1 on the first substrate 200A (step ST9 in FIG. 9). If there is a next mounting position Po1 (step ST9 in FIG. 9: Yes), the above steps ST6 to ST9 are repeated. If there is no next mounting position Po1 (step ST9 in FIG. 9: No), the series of processes ends.

[0078] (3.2)Second operation Next, a second operation of the mounting apparatus 1 will be described with reference to FIGS.

[0079] As shown in FIG. 10, before the second component 100B is mounted on the second substrate 200B, the imaging device 12 of the mounting apparatus 1 captures an image Im3 (see FIG. 11) by imaging the second region R12 including the second mounting position Po12, which is the position where the second component 100B is to be mounted on the second substrate 200B (step ST11 of FIG. 14).

[0080] Next, determination unit 1232 of processing unit 123 of mounting apparatus 1 compares image Im3 acquired in step ST11 with image Im1 stored in storage unit 124 (step ST12 in FIG. 14). If image Im1 and image Im3 match (step ST13 in FIG. 14: Yes), mounting head 11 mounts second component 100B held by holder 112 at second mounting position Po12 on second board 200B (step ST14 in FIG. 14).

[0081] On the other hand, for example, as shown in FIG. 11, if another component 100C has entered the second mounting position Po12 where the second component 100B is mounted, and the images Im1 and Im3 do not match (step ST13 in FIG. 14: No), the processing unit 123 stops the moving device 13 via the control device 14, and further displays a warning on a monitor or the like (not shown) (for example, "The device has been stopped due to the presence of a foreign object") (step ST20 in FIG. 14).

[0082] Then, as shown in FIG. 12, after the second component 100B is mounted on the second substrate 200B, the imaging device 12 of the mounting apparatus 1 captures an image of the fourth region R14 including the second component 100B on the second substrate 200B to obtain an image Im4 (see FIG. 13) (step ST15 of FIG. 14).

[0083] Then, the determination unit 1232 of the processing unit 123 determines whether or not the image Im4 acquired in step ST15 matches the image Im2 (see FIG. 8) stored in the storage unit 124 (step ST17 in FIG. 14).

[0084] If the images Im2 and Im4 match (step ST17 in FIG. 14: Yes), the processing unit 123 of the mounting apparatus 1 determines whether or not there is a next mounting position Po1 on the second substrate 200B (step ST18 in FIG. 14). If there is a next mounting position Po1 (step ST18 in FIG. 14: Yes), the processing unit 123 performs the above-described steps ST11 to ST17 and ST20. If there is no next mounting position Po1 (step ST18 in FIG. 14: No), the processing unit 123 determines whether or not there is a next second substrate 200B (step ST19 in FIG. 14). If there is a next second substrate 200B (step ST19 in FIG. 14: Yes), the processing unit 123 performs the above-described steps ST11 to ST18 and ST20. If there is no next second substrate 200B (step ST19 in FIG. 14: No), the processing unit 123 ends the above-described steps ST11 to ST18 and ST20.

[0085] That is, the mounting apparatus 1 according to the embodiment executes the following two mounting methods.

[0086] The mounting method according to the embodiment includes a first imaging step ST1, a second imaging step ST11, an acquisition step ST5, a storage step ST7, and a determination step ST13. In the first imaging step ST1, before a first component 100A is mounted on a first board 200A, an image Im1 is acquired by capturing an image of a first region R11 including a first mounting position Po11 where the first component 100A will be mounted on the first board 200A. In the second imaging step ST11, before a second component 100B of the same type as the first component 100A is mounted on a second board 200B of the same type as the first board 200A, an image Im3 is acquired by capturing an image of a second region R12 including a second mounting position Po12 where the second component 100B will be mounted on the second board 200B. In the acquisition step ST5, inspection information including inspection results for the first mounting position Po11 of the first board 200A and the first component 100A on the first board 200A is acquired by an inspection device M4 (see FIG. 1) that inspects the first board 200A. In the storage step ST7, if the state of the first mounting position Po11 of the first board 200A is normal based on the inspection information acquired in the acquisition step ST5, an image Im1 is stored. In the determination step ST13, by comparing the image Im3 acquired in the second imaging step ST11 with the image Im1 stored in the storage step ST7, it is determined whether the state of the second mounting position Po12 on the second board 200B is normal.

[0087] Furthermore, the mounting method according to the embodiment includes a third imaging step ST3, a fourth imaging step ST15, an acquiring step ST5, a storing step ST7, and a determining step ST17. In the third imaging step ST3, after a first component 100A is mounted on a first board 200A, an image Im2 is acquired by capturing an image of a third region R13 on the first board 200A that includes the first component 100A. In the fourth imaging step ST15, after a second component 100B of the same type as the first component 100A is mounted on a second board 200B of the same type as the first board 200A, an image Im4 is acquired by capturing an image of a fourth region R14 on the second board 200B that includes the second component 100B. In the acquisition step ST5, inspection information including the first mounting position Po11, where the first component 100A is mounted on the first substrate 200A, and the inspection results for the first component 100A on the first substrate 200A, is acquired by inspection device M4 (see FIG. 1) that inspects the first substrate 200A. In the storage step ST7, if the condition of the first component 100A on the first substrate 200A is normal based on the inspection information acquired in the acquisition step ST5, an image Im2 is stored. In the determination step ST17, by comparing the image Im4 acquired in the imaging step ST15 with the image Im2 stored in the storage step ST7, it is determined whether the condition of the second component 100B on the second substrate 200B is normal.

[0088] In this embodiment, the determination step ST13 corresponds to the first determination step, and the determination step ST17 corresponds to the second determination step.

[0089] FIG. 15 is a timing chart showing the operation of the mounting apparatus 1 according to the embodiment. In the example of FIG. 15, the mounting apparatus 1 executes operations Mv1 to Mv6. Each of operations Mv1, Mv3, and Mv5 indicates movement of the mounting head 11 in the XY plane. Each of operations Mv2 and Mv4 indicates movement of the holder 112 in the Z-axis direction. The mounting apparatus 1 also executes processes Pr1 to Pr6. Each of processes Pr1 and Pr4 indicates an imaging process by the imaging device 12. Each of processes Pr2 and Pr5 indicates a determination process by the determination unit 1232. Each of processes Pr3 and Pr6 indicates a stop process of the moving device 13 by the control device 14.

[0090] Operation Mv1 is performed in a first period from time t1 to time t3. That is, in the first period, the mounting head 11 moves within the XY plane. Operation Mv2 is performed in a second period from time t3 to time t6. That is, in the second period, the holding part 112 moves along the Z axis.

[0091] In this embodiment, as described above, the imaging device 12 (the imaging element 121 and the optical system 122), the acquisition unit 1231, the storage unit 124, and the determination unit 1232 are housed in the same housing 120. Therefore, as shown in FIG. 15 , the second imaging process (process Pr1) by the imaging device 12 and the first determination process (process Pr2) by the determination unit 1232 can be performed in parallel. That is, in the mounting apparatus 1 according to the embodiment, the second imaging process and the determination process are performed in parallel. As a result, the control device 14 can perform process Pr3 to stop the moving device 13 between time t4 and time t5, which is before time t6 when the second component 100B held by the holder 112 is mounted on the second board 200B, thereby reducing loss of the second component 100B.

[0092] Furthermore, operation Mv3 is executed in a third period from time t6 to time t9. That is, during the third period, similarly to the first period, the mounting head 11 moves within the XY plane. Here, process Pr4 is a fourth imaging process performed by the imaging device 12. Furthermore, process Pr5 is a second determination process performed by the determination unit 1232. Furthermore, process Pr6 is a stop process of the moving device 13 performed by the control device 14. In the mounting device 1 according to the embodiment, as shown in FIG. 15, processes Pr4 and Pr5 can be performed in parallel, and as a result, process Pr6 can be performed to stop the mounting head 11 while operation Mv3 is being performed.

[0093] In this way, the mounting apparatus 1 according to the embodiment can reduce the loss of the second component 100B due to mounting defects.

[0094] (4) Effects In the mounting apparatus 1 according to the embodiment, in the first determination process, the determination unit 1232 determines whether the state of the second mounting position Po12 on the second substrate 200B is normal by comparing the image Im1 with the image Im3 before mounting the second component 100B on the second substrate 200B. If the state of the second mounting position Po12 on the second substrate 200B is not normal, the mounting apparatus 1 can be stopped before mounting the second component 100B on the second substrate 200B, thereby reducing loss of components 100 (second components 100B) due to mounting defects. In other words, the mounting apparatus 1 according to the embodiment can suppress a decrease in productivity due to mounting defects.

[0095] Furthermore, in the mounting apparatus 1 according to the embodiment, in the second determination process, the determination unit 1232 compares the image Im2 with the image Im4 after mounting the second component 100B on the second substrate 200B to determine whether the state of the second component 100B on the second substrate 200B is normal. If the state of the second component 100B on the second substrate 200B is not normal, the mounting apparatus 1 can be stopped before mounting the next component 100 on the second substrate 200B, thereby reducing the loss of components 100 due to mounting defects. In other words, the mounting apparatus 1 according to the embodiment can suppress a decrease in productivity due to mounting defects.

[0096] Furthermore, in the mounting device 1 according to the embodiment, the imaging device 12, the acquisition unit 1231, the storage unit 124, and the determination unit 1232 are housed in the same housing 120. This makes it possible to improve the processing speed compared to when the first determination process or the second determination process is performed outside the mounting device 1.

[0097] Furthermore, in the mounting device 1 according to the embodiment, the second imaging process and the first determination process are performed in parallel, which makes it possible to reduce the processing time.

[0098] Furthermore, in the mounting device 1 according to the embodiment, the fourth imaging process and the second determination process are performed in parallel, which makes it possible to reduce the processing time.

[0099] (5) Variations The above-described embodiment is merely one of various embodiments of the present disclosure. The above-described embodiment can be modified in various ways depending on the design, etc., as long as the object of the present disclosure can be achieved. Furthermore, functions similar to the mounting method according to the above-described embodiment may be embodied in a mounting device 1, a (computer) program, a non-transitory recording medium on which a program is recorded, or the like.

[0100] Modifications of the above-described embodiment are listed below. The modifications described below can be applied in appropriate combinations.

[0101] The implementation entity of the mounting apparatus 1 or the mounting method of the present disclosure includes a computer system. The computer system is primarily composed of a processor and memory as hardware. The processor executes a program stored in the memory of the computer system to realize the functions of the implementation entity of the mounting apparatus 1 or the mounting method of the present disclosure. The program may be pre-recorded in the memory of the computer system, provided via a telecommunications line, or provided in a non-transitory recording medium readable by the computer system, such as a memory card, optical disk, or hard disk drive. The processor of the computer system is composed of one or more electronic circuits including a semiconductor integrated circuit (IC) or a large-scale integrated circuit (LSI). The integrated circuits, such as ICs or LSIs, are referred to by different names depending on the degree of integration, and include integrated circuits called system LSIs, very large-scale integrations (VLSIs), or ultra-large-scale integrations (ULSIs). Furthermore, field-programmable gate arrays (FPGAs), which are programmed after the LSI is manufactured, or logic devices that allow the reconfiguration of internal connections or internal circuit partitions of the LSI, can also be used as processors. The electronic circuits may be integrated into one chip or distributed across multiple chips. The chips may be integrated into one device or distributed across multiple devices. The computer system referred to here includes a microcontroller having one or more processors and one or more memories. Therefore, the microcontroller is also composed of one or more electronic circuits including a semiconductor integrated circuit or a large-scale integrated circuit.

[0102] Furthermore, it is not essential for the mounting device 1 that multiple functions are concentrated in one housing, and the components of the mounting device 1 may be distributed across multiple housings. Furthermore, at least some of the functions of the mounting device 1, for example, some of the functions of the control device 14, may be realized by the cloud (cloud computing) or the like.

[0103] Conversely, in the above-described embodiment, at least some of the functions of the mounting apparatus 1 that are distributed among multiple devices may be integrated into a single housing. For example, some of the functions of the mounting apparatus 1 that are distributed between the mounting head 11 and the control device 14 may be integrated into a single housing.

[0104] In the above-described embodiment, the determination unit 1232 is provided in the imaging device 12, but the determination unit 1232 may be provided in, for example, the control device 14. In this case, too, it is possible to improve the processing speed compared to when the first determination process or the second determination process is performed outside the mounting device 1.

[0105] In the above-described embodiment, the inspection devices M4 and M6 are provided outside the mounting device 1. However, for example, the mounting device 1 may be provided with an inspection head. For example, if each of the three mounting devices M1 to M3 is provided with an inspection head, the acquisition unit 1231 of each mounting device M1 to M3 acquires inspection information from the corresponding inspection head. Also, for example, if the mounting device M3 is provided with an inspection head, the acquisition unit 1231 of each mounting device M1 to M3 acquires inspection results from the inspection head of the mounting device M3. In these modified examples, the inspection head provided in each mounting device M1 to M3 corresponds to an inspection device that inspects the first substrate 200A. In other words, the inspection device may be provided inside the mounting device.

[0106] (Aspect) The present specification discloses the following aspects.

[0107] A mounting device (1) according to a first aspect includes an imaging unit (12), an acquisition unit (1231), a storage unit (124), and a determination unit (1232). The imaging unit (12) performs a first imaging process and a second imaging process. In the first imaging process, before a first component (100A) is mounted on a first board (200A), an image of a first region (R11) including a first mounting position (Po11) where the first component (100A) is to be mounted on the first board (200A) is captured to acquire a first image (Im1). In the second imaging process, before a second component (100B) of the same type as the first component (100A) is mounted on a second substrate (200B) of the same type as the first substrate (200A), an image of a second region (R12) including a second mounting position (Po12) where the second component (100B) will be mounted on the second substrate (200B) is acquired to obtain a second image (Im3). The acquisition unit (1231) acquires inspection information including inspection results regarding the first mounting position (Po11) on the first substrate (200A) and the first component (100A) on the first substrate (200A) obtained by an inspection device (M4) that inspects the first substrate (200A). The storage unit (124) stores the first image (Im1) when the inspection information acquired by the acquisition unit (1231) indicates that the condition of the first mounting position (Po11) on the first substrate (200A) is normal. The determination unit (1232) determines whether the state of the second mounting position (Po12) of the second board (200B) is normal or not by comparing the second image (Im3) acquired by the imaging unit (12) in the second imaging process with the first image (Im1) stored in the memory unit (124).

[0108] According to this aspect, it is possible to suppress a decrease in productivity due to mounting defects.

[0109] In the mounting apparatus (1) according to the second aspect, in the first aspect, the imaging unit (12) further performs a third imaging process and a fourth imaging process. In the third imaging process, after the first component (100A) is mounted on the first board (200A), an image of a third region (R13) including the first component (100A) on the first board (200A) is captured to obtain a third image (Im2). In the fourth imaging process, after the second component (100B) is mounted on the second board (200B), an image of a fourth region (R14) including the second component (100B) on the second board (200B) is captured to obtain a fourth image (Im4). The storage unit (124) further stores the third image (Im2) when the condition of the first component (100A) on the first board (200A) is normal based on the inspection information acquired by the acquisition unit (1231). The determination unit 1232 further performs a second determination process that is different from the first determination process, which is the determination process described above. In the second determination process, the fourth image Im4 acquired by the imaging unit 12 in the fourth imaging process is compared with the third image Im2 stored in the storage unit 124 to determine whether the condition of the second component 100B on the second board 200B is normal.

[0110] According to this aspect, it is possible to suppress a decrease in productivity due to mounting defects.

[0111] A mounting apparatus (1) according to a third aspect includes an imaging unit (12), an acquisition unit (1231), a storage unit (124), and a determination unit (1232). The imaging unit (12) performs a first imaging process and a second imaging process. In the first imaging process, after a first component (100A) is mounted on a first board (200A), an image of a first region (R13) including the first component (100A) on the first board (200A) is captured to acquire a first image (Im2). In the second imaging process, after a second component (100B) of the same type as the first component (100A) is mounted on a second board (200B) of the same type as the first board (200A), an image of a second region (R14) including the second component (100B) on the second board (200B) is captured to acquire a second image (Im4). The acquisition unit (1231) acquires inspection information including the first mounting position (Po11), where the first component (100A) is mounted on the first substrate (200A), and the inspection results of the first component (100A) on the first substrate (200A) by an inspection device (M4) that inspects the first substrate (200A). The storage unit (124) stores a first image (Im2) when the state of the first component (100A) on the first substrate (200A) is normal based on the inspection information acquired by the acquisition unit (1231). The determination unit (1232) determines whether the state of the second component (100B) on the second substrate (200B) is normal by comparing a second image (Im4) acquired by the imaging unit (12) in the second imaging process with the first image (Im2) stored in the storage unit (124).

[0112] According to this aspect, it is possible to suppress a decrease in productivity due to mounting defects.

[0113] In the mounting device (1) according to the fourth aspect, in any one of the first to third aspects, the imaging unit (12), the acquisition unit (1231), the memory unit (124), and the determination unit (1232) are housed in the same housing (120).

[0114] According to this aspect, it is possible to improve the processing speed compared to when the first determination process or the second determination process is performed outside the mounting device (1).

[0115] In the mounting device (1) according to the fifth aspect, in any one of the first to fourth aspects, the second imaging process and the determination process are performed in parallel.

[0116] According to this aspect, it is possible to reduce the processing time.

[0117] In the mounting device (1) according to the sixth aspect, in the second aspect, the fourth imaging process and the second determination process are performed in parallel.

[0118] According to this aspect, it is possible to reduce the processing time.

[0119] The mounting method according to the seventh aspect includes a first imaging step (ST1), a second imaging step (ST11), an acquisition step (ST5), a storage step (ST7), and a determination step (ST13). In the first imaging step (ST1), before a first component (100A) is mounted on a first board (200A), an image of a first region (R11) including a first mounting position (Po11) where the first component (100A) is to be mounted on the first board (200A) is captured to obtain a first image (Im1). In a second imaging step (ST11), before a second component (100B) of the same type as the first component (100A) is mounted on a second substrate (200B) of the same type as the first substrate (200A), an image of a second region (R12) including a second mounting position (Po12) where the second component (100B) will be mounted on the second substrate (200B) is acquired to acquire a second image (Im3). In an acquisition step (ST5), inspection information including inspection results regarding the first mounting position (Po11) on the first substrate (200A) and the first component (100A) on the first substrate (200A) is acquired by an inspection device (M4) that inspects the first substrate (200A). In a storage step (ST7), if the condition of the first mounting position (Po11) on the first substrate (200A) is normal based on the inspection information acquired in the acquisition step (ST5), a first image (Im1) is stored. In the judgment step (ST13), the second image (Im3) acquired in the second imaging step (ST11) is compared with the first image (Im1) stored in the storage step (ST7) to determine whether the condition of the second mounting position (Po12) on the second board (200B) is normal or not.

[0120] According to this aspect, it is possible to suppress a decrease in productivity due to mounting defects.

[0121] The mounting method according to the eighth aspect is the same as that of the seventh aspect, but further includes a third imaging step (ST3) and a fourth imaging step (ST15). In the third imaging step (ST3), after a first component (100A) is mounted on a first substrate (200A), an image of a third region (R13) including the first component (100A) on the first substrate (200A) is captured to obtain a third image (Im2). In the fourth imaging step (ST15), after a second component (100B) is mounted on the second substrate (200B), an image of a fourth region (R14) including the second component (100B) on the second substrate (200B) is captured to obtain a fourth image (Im4). In the storage step (ST7), if the condition of the first component (100A) on the first substrate (200A) is normal based on the inspection information acquired in the acquisition step (ST5), a third image (Im2) is further stored. The mounting method further includes a second judgment step (ST17) different from the first judgment step (ST13), which is the judgment step (ST13). In the second judgment step (ST17), the fourth image (Im4) acquired in the fourth imaging step (ST15) is compared with the third image (Im2) stored in the storage step (ST7) to determine whether the condition of the second component (100B) on the second substrate (200B) is normal.

[0122] According to this aspect, it is possible to suppress a decrease in productivity due to mounting defects.

[0123] A mounting method according to a ninth aspect includes a first imaging step (ST3), a second imaging step (ST15), an acquisition step (ST5), a storage step (ST7), and a determination step (ST17). In the first imaging step (ST3), after a first component (100A) is mounted on a first board (200A), an image of a first region (R13) including the first component (100A) on the first board (200A) is taken to acquire a first image (Im2). In the second imaging step (ST15), after a second component (100B) of the same type as the first component (100A) is mounted on a second board (200B) of the same type as the first board (200A), an image of a second region (R14) including the second component (100B) on the second board (200B) is taken to acquire a second image (Im4). In the acquisition step (ST5), an inspection device (M4) that inspects the first substrate (200A) acquires inspection information including the first mounting position (Po11), where the first component (100A) is mounted on the first substrate (200A), and the inspection results for the first component (100A) on the first substrate (200A). In the storage step (ST7), if the condition of the first component (100A) on the first substrate (200A) is normal based on the inspection information acquired in the acquisition step (ST5), a first image (Im2) is stored. In the determination step (ST17), a determination is made as to whether the condition of the second component (100B) on the second substrate (200B) is normal by comparing the second image (Im4) acquired in the second imaging step (ST15) with the first image (Im2) stored in the storage step (ST7).

[0124] According to this aspect, it is possible to suppress a decrease in productivity due to mounting defects.

[0125] The configurations according to the second and fourth to sixth aspects are not essential for the mounting device (1) and can be omitted as appropriate.

[0126] The configuration according to the eighth aspect is not essential to the mounting method and can be omitted as appropriate. [Explanation of symbols]

[0127] 1 Mounting equipment 12 Imaging device (imaging unit) 100A 1st part 100B Second part 120 cabinet 124 Storage section 200A 1st board 200B 2nd board 1231 Acquisition Department 1232 Judgment section Im1 image (first image) Im2 images (1st and 3rd images) Im3 image (second image) Im4 images (2nd and 4th images) Po11 1st mounting position Po12 2nd mounting position R11 1st area R12 2nd area R13 3rd area (1st area) R14 4th area (2nd area) ST1 First imaging step ST3 Third imaging step (first imaging step) ST5 Acquisition Step ST7 Memory Step ST11 Second imaging step ST13 First judgment step (judgment step) ST15 4th imaging step (2nd imaging step) ST17 Second judgment step

Claims

1. an imaging unit that performs a first imaging process to capture a first image by imaging a first region including a first mounting position on a first board where a first component is to be mounted before the first component is mounted on the first board, and a second imaging process to capture a second image by imaging a second region including a second mounting position on the second board where a second component identical to the first component is to be mounted before the second component is mounted on a second board identical to the first board; an acquisition unit that acquires inspection information including an inspection result regarding the first mounting position of the first board and the first component on the first board, by an inspection device that inspects the first board; a storage unit that stores the first image when the state of the first mounting position on the first board is normal based on the inspection information acquired by the acquisition unit; and a determination unit that performs a determination process to determine whether or not a state of the second mounting position on the second board is normal by comparing the second image acquired by the imaging unit in the second imaging process with the first image stored in the storage unit, Mounting equipment.

2. The imaging unit a third imaging process of capturing an image of a third region including the first component on the first substrate after the first component is mounted on the first substrate to obtain a third image; and After the second component is mounted on the second substrate, a fourth imaging process is further performed to capture an image of a fourth region on the second substrate including the second component to obtain a fourth image; The storage unit further storing the third image when the condition of the first component on the first board is normal based on the inspection information acquired by the acquisition unit; The determination unit different from the first determination process, which is the determination process, a second determination process is further performed in which the fourth image acquired by the imaging unit in the fourth imaging process is compared with the third image stored in the storage unit to determine whether or not the state of the second component on the second board is normal. The mounting device according to claim 1 .

3. an imaging unit that performs a first imaging process of capturing an image of a first region on a first substrate including a first component to obtain a first image after the first component is mounted on the first substrate, and a second imaging process of capturing an image of a second region on the second substrate including a second component of the same type as the first component to obtain a second image after a second component of the same type as the first substrate is mounted on the second substrate; an acquisition unit that acquires inspection information including an inspection result regarding a first mounting position, which is a position where the first component is to be mounted on the first board, and the first component on the first board, by an inspection device that inspects the first board; a storage unit that stores the first image when the state of the first component on the first board is normal based on the inspection information acquired by the acquisition unit; a determination unit that performs a determination process to determine whether or not a state of the second component on the second board is normal by comparing the second image acquired by the imaging unit in the second imaging process with the first image stored in the storage unit, Mounting equipment.

4. The imaging unit, the acquisition unit, the storage unit, and the determination unit are accommodated in the same housing. The mounting device according to any one of claims 1 to 3.

5. The second imaging process and the determination process are performed in parallel. The mounting device according to any one of claims 1 to 3.

6. The fourth imaging process and the second determination process are performed in parallel. The mounting device according to claim 2 .

7. a first imaging step of capturing an image of a first region including a first mounting position on a first substrate, the first region being a position where the first component is to be mounted, to obtain a first image before the first component is mounted on the first substrate; a second imaging step of capturing an image of a second region including a second mounting position, which is a position where a second component identical to the first component is mounted on a second substrate identical to the first substrate, to obtain a second image before the second component is mounted on the second substrate; an acquiring step of acquiring inspection information including an inspection result regarding the first mounting position of the first board and the first component on the first board by an inspection device that inspects the first board; a storage step of storing the first image when the state of the first mounting position on the first board is normal based on the inspection information acquired in the acquisition step; a determining step of determining whether or not a state of the second mounting position on the second board is normal by comparing the second image acquired in the second imaging step with the first image stored in the storage step. How to implement it.

8. a third imaging step of capturing an image of a third region including the first component on the first substrate after the first component is mounted on the first substrate to obtain a third image; a fourth imaging step of capturing an image of a fourth region including the second component on the second substrate after the second component is mounted on the second substrate to obtain a fourth image, In the storing step, if the state of the first component on the first board is normal based on the inspection information acquired in the acquiring step, the third image is further stored; The method further includes a second determination step, which is a step different from the first determination step, of determining whether or not a state of the second component on the second board is normal by comparing the fourth image acquired in the fourth imaging step with the third image stored in the storage step. The mounting method according to claim 7.

9. a first imaging step of capturing an image of a first region including the first component on the first substrate after the first component is mounted on the first substrate to obtain a first image; a second imaging step of capturing an image of a second region including the second component on the second substrate after the second component, which is the same type as the first component, is mounted on the second substrate, to obtain a second image; an acquiring step of acquiring inspection information including an inspection result relating to a first mounting position, which is a position where the first component is to be mounted on the first board, and the first component on the first board, by an inspection device that inspects the first board; a storage step of storing the first image when the state of the first component on the first board is normal based on the inspection information acquired in the acquisition step; a determining step of determining whether or not a state of the second component on the second board is normal by comparing the second image acquired in the second imaging step with the first image stored in the storage step. How to implement it.

Images