Burn-in board and burn-in system

Abstract

To provide a burn-in board and a burn-in system.SOLUTION: The present invention provides a burn-in board, comprising: a plurality of test sockets, each of which is configured to accommodate a device under test and comprises at least one socket power supply module; and at least one signal test board, coupled on the burn-in board, for making a signal connection to at least one of the plurality of test sockets of the burn-in board and receiving a signal related to a power supply setting. The signal test board controls the burn-in board based on the signal to supply power to at least one of the plurality of test sockets to perform a test procedure. The at least one socket power supply module has a power supply compensation mechanism to make the power received by each of the DUTs consistent.SELECTED DRAWING: Figure 8

Description

[Technical Field]

[0001] The present invention relates to a device and a burn-in system used on a burn-in board, and more particularly to a burn-in system suitable for different transmission interfaces and a device equipped with a power supply compensation mechanism. [Background technology]

[0002] In the semiconductor or PCB industry, burn-in is a process of testing wafers or chips. Multiple wafers or chips are mounted on corresponding test sockets on a burn-in board and subjected to various parameter tests, such as temperature, stress, and frequency, to detect defects in the design, materials, process, or manufacturing process that may occur in subsequent processes.

[0003] Currently, burn-in boards used by manufacturers are customized to meet the needs of each customer's product. Therefore, each time a different product has different burn-in test requirements, a burn-in board with different test conditions must be remanufactured. Furthermore, wafers or chips must be individually placed on the corresponding burn-in board for testing according to different test items or parameters, which makes the entire test process time-consuming. When a customer requires a wide range of product frequencies to be tested within a certain period of time, how to efficiently solve the above problem and reduce the manufacturing cost of burn-in boards is the problem that this invention aims to solve.

[0004] FIG. 1 schematically illustrates a conventional burn-in board 710 having a signal interface 140 and a power interface 150, which receive test signals (10 MHz signals) for burn-in testing and power signals for operating the entire burn-in board, respectively. The burn-in board 710 also has a plurality of test sockets 120 arranged in an array, each socket 120 used to accommodate a device under test (DUT), e.g., a chip. The signal interface 140 and the power interface 150 are a combination of various connectors and electronic components, configured to transmit signals to each test socket 120 via specific conductive paths. However, this configuration has certain defects that affect the consistency of the test. The burn-in board 710 typically has a considerable area, and the signal interface 140 and the power interface 150 are typically located on the side of the burn-in board 710. The length of the conductive path between the test socket 120 and the interfaces 140 and 150 is determined by the position of the test socket 120 relative to the burn-in board 710. Therefore, the same signal may arrive at different test sockets 120 at different times, and the longer conductive paths may cause signal loss, which may affect test quality, and the longer conductive paths may cause instability in power supplies far from the power interface 150. Furthermore, a single burn-in board in such a configuration can only perform a single test on all devices under test simultaneously, which limits the application of other test schedules or upper limits for test signals that could improve test efficiency.

[0005] Therefore, there is a need to develop improved configurations aimed at reducing signal loss, optimizing various test schedules, increasing the upper limit of each test signal, and adapting to various transmission interfaces. Summary of the Invention [Problem to be solved by the invention]

[0006] To solve the above problems, the present invention provides a burn-in board with a power supply compensation mechanism, allowing each DUT to receive the same stable power supply. The present invention also provides a signal test board that can adapt to different test environments and different transmission interfaces, control different parameters of the burn-in board, and test DUTs with a large number of different parameters. [Means for solving the problem]

[0007] To achieve the above object, the present invention provides a burn-in board including a plurality of test sockets each configured to accommodate a device under test and equipped with at least one socket power supply module, and at least one signal test board coupled to the burn-in board for signal connection to at least one of the plurality of test sockets on the burn-in board and for receiving signals related to power supply settings. The signal test board controls the burn-in board based on the signals to supply power to at least one of the plurality of test sockets to perform a test procedure. The at least one socket power supply module has a power supply compensation mechanism to match the power received by each of the devices under test.

[0008] To achieve the above object, the present invention provides a burn-in board including a plurality of test sockets, each configured to accommodate a device under test (DUT), at least one signal test board coupled to the burn-in board for signal connection to at least one of the plurality of test sockets and for receiving signals related to power supply settings, and a plurality of socket power supply modules, each of which forms an electrical connection with at least one of the socket power supply modules, the signal test board controls the burn-in board based on the signals to supply power to at least one of the plurality of test sockets to perform a test procedure, and the at least one socket power supply module has a power supply compensation mechanism to match the power received by each of the devices under test.

[0009] In the burn-in board described above, the socket power supply module further includes a power detection element configured to detect the power transmitted to the device under test, and when the power detection element detects that there is a first difference between the power transmitted from the socket power supply module to the device under test and the power supply setting, the socket power supply module adjusts the power transmitted from the socket power supply module to the device under test based on the first difference.

[0010] In the above-mentioned burn-in board, the socket power module is an integrated power module or a power management integrated circuit.

[0011] In the above-mentioned burn-in board, the socket power supply module is electrically connected to the device under test and the signal test board, respectively, and the socket detection module is configured to detect the power of the device under test during testing, and when the socket detection module detects that there is a second difference between the device under test and the power supply setting, it transmits the second difference to the signal test board, and the signal test board adjusts the power supply of the test socket based on the second difference.

[0012] To achieve the above object, the present invention provides a burn-in system integrated with a signal test board, the system including: a control unit configured to be programmed based on a plurality of transmission interfaces, for outputting a test signal corresponding to one of the plurality of transmission interfaces and for receiving a control signal from a signal control system; a storage unit; a multi-port unit for signal connection to a plurality of test sockets; and communication units for signal connection to the control unit, the storage unit, and the multi-port unit, respectively, wherein the control unit outputs a test signal to at least one of the plurality of test sockets based on the control signal.

[0013] To achieve the above object, the present invention provides a burn-in system integrated with a signal test board, the system including: a storage unit; a multi-port unit for signal connection to a plurality of test sockets; and a communication unit for signal connection to the storage unit and the multi-port unit, respectively, configured to be programmed based on a plurality of transmission interfaces, to output a test signal corresponding to one of the plurality of transmission interfaces, and to receive a control signal from a signal control system, wherein the communication unit outputs the test signal to at least one of the plurality of test sockets based on the control signal.

[0014] The burn-in board as described above further includes a conversion unit configured to make a signal connection to one test socket of the plurality of transmission interfaces.

[0015] In the burn-in board described above, the plurality of transmission interfaces include at least one of PCIe, SATA, and USB. [Brief explanation of the drawings]

[0016] [Figure 1] FIG. 1 is a block diagram showing a schematic configuration of a conventional burn-in device. [Figure 2] 1 is a schematic diagram showing a burn-in device having a processor test function according to the present invention; [Figure 3] 1 is a schematic diagram showing a burn-in device of the present invention disposed in a burn-in tester. [Figure 4A] FIG. 2 is a bottom view showing the burn-in apparatus and connector of the present invention. [Figure 4B] 1 is a side view showing the burn-in apparatus and connector of the present invention; [Figure 5] 1 is a schematic diagram showing a signal test board of the present invention connected to a test socket; [Figure 6] FIG. 2 is a schematic diagram showing the signal path of the present invention. [Figure 7]1 is a schematic diagram showing the configuration of a signal test board and a device under test according to the present invention; [Figure 8] 1 is a diagram illustrating the configuration of a burn-in board having a power supply compensation mechanism according to the present invention. [Figure 9A] 1 is a schematic diagram illustrating a socket power module of the present invention. [Figure 9B] 1 is a schematic diagram illustrating a socket detection module of the present invention. [Figure 10] 1 is a schematic diagram illustrating a burn-in system of the present invention. DETAILED DESCRIPTION OF THE INVENTION

[0017] Various embodiments of the present invention will be described below with reference to schematic diagrams of idealized embodiments of the present invention. The shapes and arrangements shown in these diagrams may vary due to manufacturing techniques, designs, and / or tolerances. Therefore, the embodiments described herein do not limit the structure of the present invention to specific elements or shapes, and should also include differences in manufacturing shapes.

[0018] To facilitate understanding of the present invention, a method for arranging a burn-in apparatus with processor testing capabilities according to the present invention will first be briefly described. FIG. 2 is a schematic diagram showing a burn-in apparatus 100 with processor testing capabilities according to the present invention, and FIG. 3 is a schematic diagram of the burn-in apparatus with processor testing capabilities according to the present invention arranged in a burn-in tester. The burn-in apparatus 100 with processor testing capabilities mainly comprises a burn-in board 110 on which a plurality of test sockets 120 are arranged, each of which accommodates one DUT for testing. The burn-in board 110 also comprises a signal interface 140 and a power interface 150, which respectively receive test signals for the burn-in test and power supply signals for operating the burn-in board 110. The burn-in test board configuration described above is a commonly used configuration method by those skilled in the art. However, compared to the burn-in test board described above, the present invention uses a signal test board 200 that is detachably mounted on the burn-in board 110 and can be connected to an external signal control system 300 via a subsystem module 130. Alternatively, the burn-in board 110 can connect to the external signal control system 300 via the subsystem module 130. The burn-in board 110 inputs settings through the signal control system 300 to control different parameters of the signal test board 200 and perform a burn-in test. Although the signal control system 300 is connected only to the burn-in equipment 100 with the top-level processor test function in FIG. 3, in reality, the signal control system 300 is connected to each burn-in equipment 100 with each processor test function in FIG. 3. In one example, the signal test board 200 is a circuit configuration for providing a high-frequency test signal. A specific connection method for the signal test board 200 of the present invention will be described later. Also, for ease of understanding, only frequency parameters are used in the description in this specification, so the signal test board 200 is not limited to controlling only frequency, but also includes other parameters that require testing, such as temperature, stress, etc., and can also control parameters that require multiple tests.The signal control system 300 is an external computer device that transmits signals to the subsystem module 130 via a common interface such as Ethernet. The burn-in equipment 100 with processor test function is connected to a test equipment 400 outside the test chamber 500 of FIG. 3, and the test equipment 400 provides signals via the signal interface 140 of the burn-in board 110, which are then transmitted to the signal test board 200. The subsystem module 130 can perform the following function settings on each signal test board 200: (1) update the high-frequency test program settings of the signal test board 200; and (2) update the firmware of the FPGA in the signal test board 200. The test equipment 400 has a power supply 410 that supplies the necessary power to the burn-in board 110 via the power supply interface 150 of the burn-in board 110.

[0019] 4A and 4B are bottom and side views of the signal test board, and FIG. 5 is a schematic diagram showing the signal test board connected to the burn-in board. The signal test board 200 includes a communication interface for signal connection to the signal control system 300 and a circuit assembly for outputting test signals, which can be arranged on the top surface of the signal test board 200. At least one first connector 210 is fixed to the bottom surface of the signal test board 200 (i.e., the surface facing the burn-in board 110), and a connector or socket (FIG. 5) corresponding to the first connector 210 is arranged on the top surface of the burn-in board 110 (i.e., the surface shared with the test socket 120), for example, by means of a board-to-board connector. The selection of the installation method is determined by the wiring of the burn-in board 110. Depending on the configuration of the first connector 210, the signal test board 200 can be arranged on the burn-in board 110 in the form of a mezzanine board to form electrical and signal connections. The mezzanine board arrangement allows the test socket 120 to be interposed between the burn-in board 110 and the signal test board 200. Although only one signal test board 200 is shown in the figure, more signal test boards 200 are possible. Each signal test board 200 is connected to a specific test socket 120 and serves to test a portion of the device under test. The arrangement of the first connector 210 may depend on how the electrical and signal connections with the burn-in board 110 are formed, and is therefore not limited to the arrangement shown in FIGS. 4A and 4B . Only one first connector 210 may be centrally arranged, and the arrangement direction of the first connector 210 is also not limited. A control element 230 is further attached to the top surface of the signal test board 200 (i.e., the opposite side from the burn-in board 110). The control element 230 is a field programmable gate array (FPGA) or a central processing unit (CPU), and is mainly used to generate high-frequency programs required for testing.Overall, the signal test board 200 is used to receive signals from the signal control system 300, transmit test signals to multiple test sockets 120 for testing, and receive and integrate data fed back by the test sockets 120 in the burn-in board 110 and return it to the signal control system 300.

[0020] 5 is a schematic diagram showing a signal test board of the present invention connected to a test socket. In a specific embodiment of the present invention, signal test board 200 and test socket 120 are configured to establish a signal connection via first connector 210, so that signal test board 200, signal control system 300 (and / or subsystem module 130) form a signal connection with test socket 120, and first connector 210 is, for example, a board-to-board connector. For example, by connecting to burn-in board 110 via first connector 210 and controlling signals, signal test board 200 transmits a 10 MHz signal to test socket 120 to perform a burn-in test on a DUT.

[0021] The burn-in equipment 100 with processor test capabilities of the present invention will now be described in detail. The thin control signal path P1 in FIG. 6 is used by the test equipment 400 to send / receive control signals to / from the control elements 230 in each signal test board 200. The test equipment 400 transmits a 10 MHz signal to trigger the signal test board 200 to perform the burn-in procedure for each burn-in module. The burn-in procedure can be modified according to the burn-in board with different test requirements or various burn-in modules (e.g., high-temperature modules, high-voltage modules) added to the burn-in board 110 to test different parameters. The burn-in procedure controls each burn-in module via a 10 MHz signal or is embedded in the signal test board 200, which controls each burn-in module to set the subsystem module 130 via a graphical user interface (GUI) on the signal control system 300 using test parameter setting signals (thick test parameter setting signal path P2 in FIG. 5).

[0022] The arrangement between signal test board 200 and DUT D will be described below. Referring to FIG. 7, which is a schematic diagram of the burn-in board and test object of the burn-in apparatus with processor test function of the present invention, M1 to M3 indicate different interrelationships between signal test board 200 and DUT D in the test socket. In the embodiment of M1, for example, configured as previously described in FIGS. 4A and 4B, signal test board 200 is fixed to burn-in board 110 and connected to multiple DUTs D, so that signal test board 200 can perform burn-in tests on multiple DUTs D. In the embodiment of M2, DUT D and signal test board 200 are mounted on the same load board and then mounted together on burn-in board 110 to perform the burn-in test. In the embodiment of M3, the signal test board 200 performs a burn-in test on a DUT D (DUT D is not shown in the embodiment of M3 because the DUT D is mounted on the test socket 120 and is located between the signal test board 200 and the burn-in board 110) using a mezzanine board method, so it can be seen that M3 can be connected to a signal test board 200 customized for each DUT D. As described above, the signal test board 200 can be customized to different sizes and styles on the burn-in board 110 according to customer needs, without the need to redesign the burn-in board 110, thereby reducing manufacturing costs and wiring complexity.

[0023] 8, which is a block diagram of a burn-in board equipped with a power supply compensation mechanism of the present invention, shows a second embodiment of the present invention. The burn-in board 110 in the second embodiment is configured based on the above-mentioned M3 system. A plurality of test sockets 120 are arranged on the burn-in board 110, and each test socket 120 has at least one socket power supply module 121 and at least one socket detection module 122. The area showing the DUT in the figure indicates that a device under test (DUT) is installed in the test socket 120 (hereinafter referred to as the "DUT"), and the area showing the signal test board 200 indicates that the signal test board 200 is mounted on the test socket 120. Therefore, each signal test board 200 in FIG. 8 simultaneously controls two test sockets 120 to supply power to the corresponding two DUTs. For example, the signal test board 200 of GROUP#1 shown in FIG. 8 controls the test sockets 120 for testing to supply power to DUT#0 and DUT#8.

[0024] 9A, which is a schematic diagram showing the socket power supply module of the present invention, during the burn-in test, test socket 120, which is far from the power supply side (not shown) of burn-in board 110, may receive insufficient power and become unstable due to factors such as a long power supply line and large loss. Therefore, the power received by each device under test is made consistent through a power compensation mechanism provided in socket power supply module 121. Specifically, referring also to FIG. 9A, which is a schematic diagram showing the socket power supply module of the present invention, socket power supply module 121 further includes power detection element 1215, which is electrically connected between socket power supply module 121 and device under test (DUT) to detect the power transmitted to the device under test (path within area C1). If the power detection element 1215 detects a first difference between the power transmitted from the socket power supply module 121 to the DUT and the power supply setting, it transmits a compensation signal related to the first difference to the socket power supply module 121 (path within area C2), and the socket power supply module 121 processes the compensation signal via a power supply (DC converter) IC, thereby adjusting the power transmitted from the socket power supply module 121 to the DUT based on the first difference. For example, if the socket power supply module 121 receives power from the power supply 410 and outputs a voltage of 1 V to the DUT for testing based on the power supply setting signal, the power detection element 1215 detects whether there is a difference in the voltage transmitted from the socket power supply module 121 to the DUT based on VOSNS+ and VOSNS− in FIG. 9A. If there is a first difference between the voltage detected by the power detection element 1215 and the parameter of the power supply setting (for example, if the detected voltage is 0.8, it indicates that there is a first difference of 0.2V), a compensation signal related to the first difference is transmitted to the socket power supply module 121, and then the socket power supply module 121 processes the compensation signal via a power conversion IC to adjust the voltage transmitted from the socket power supply module 121 to the device under test DUT to 1.2V based on the first difference of 0.2V.This mechanism overcomes the 0.2V voltage loss due to the line, reducing the voltage received by the DUT to approximately 1.0V. Because each DUT receives different power due to different losses, the voltage loss compensation mechanism ensures that the DUTs in each test socket 120 receive the same voltage. The socket power supply module 121 also includes a voltage stabilization mechanism. For example, when the power supply experiences different load changes, the current may suddenly increase and the voltage may drop. At this time, the socket power supply module 121 fine-tunes and stabilizes the voltage. In a specific embodiment of the present invention, the socket power supply module 121 is a DC / DC converter, an integrated power supply module, a power management integrated circuit, a module having the same functions as the socket power supply module, or a combination thereof, and integrates various power management functions in power management applications, thereby facilitating the design and simplification of power management systems.

[0025] 9B, a schematic diagram of a socket detection module of the present invention is shown. Each socket detection module 122 is electrically connected to a device under test (DUT) and a signal test board 200, respectively. The socket detection module 122 is used to detect the power supply of the device under test (DUT) and whether the power supply is the same as the parameters (i.e., power supply settings) set by the test signals during testing. If the socket detection module 122 detects that the parameters of the device under test (DUT) are different from the parameters set by the test signals, it detects that there is a second difference between the voltage of the device under test (DUT) and the parameters set by the test signals and transmits the second difference to the signal test board 200, which then adjusts the power supply of the test socket 120 based on the second difference. The voltage of each DUT during the burn-in test is detected in real time by each socket detection module 122, so that the signal test board 200 can adjust the power supply of each test socket 120 based on the second difference of each DUT, thereby ensuring that the voltage received by each DUT during the burn-in test is consistent. In a specific embodiment, a user operates the signal control system 300 to transmit a power supply setting signal to the subsystem module 130, which then transmits the signal to each of the signal test boards 200. The control element 230 of each signal test board 200 controls the power supply of the test socket 120 based on the power supply setting parameters. The socket detection module 122 then detects via FPGA whether there is a difference between the DUT and the power supply setting parameters (for example, converting the voltage or current signal of the DUT into a numerical detection value indicating the magnitude of the voltage or current via the socket detection module 122, and obtaining the second difference based on the detection value and the output value of the power supply setting). The signal test board 200 then readjusts the power supply of the test socket 120 based on the second difference to compensate for the difference caused by losses in the system hardware path. In this way, the signal test board 200 can control the voltages received by the DUTs in the group to be matched.In a specific embodiment of the present invention, whenever a change in impedance on the power path occurs due to a hardware change in the system (such as, but not limited to, a PCB replacement, a socket replacement, or a component replacement on the power path), the power supply of the test socket 120 is readjusted via the socket detection module 122 to compensate for the difference due to losses in the system hardware path. In a specific embodiment of the present invention, the socket detection module 122 is an analog-to-digital converter.

[0026] In another embodiment of the present invention, the socket power supply module 121 and the socket detection module 122 are disposed on the burn-in board 110 rather than within the test socket 120. Each of the test sockets 120 forms an electrical connection with at least one of the socket power supply modules 121, and the signal test board 200 controls the burn-in board 110 based on the signal to supply power to at least one of the plurality of test sockets 120 to proceed with the test procedure. In another embodiment of the present invention, the device under test (DUT) is powered by multiple power sources during burn-in testing, and each of the test sockets 120 can supply more stable power by detecting between the multiple socket power supply modules 121 corresponding to the multiple power sources.

[0027] 10 is a schematic diagram of a burn-in system according to a third embodiment of the present invention, the burn-in system 1000 is applied to a signal test board. The burn-in system 1000 includes a control unit 1010, a storage unit 1020, a multi-port unit 1030, a communication unit 1040, and a conversion unit 1050. The control unit 1010 is a CPU or FPGA configured to be programmed based on multiple transmission interfaces, so as to output a test signal corresponding to one of the multiple transmission interfaces and receive a control signal from the signal control system 300, thereby ensuring high-frequency signal and data transmission requirements. For example, if the DUT belongs to a PCIe interface, the control unit 1010 can be reprogrammed based on the lines and firmware of the DUT, test socket 120, or burn-in board 110, allowing the burn-in system 1000 to output test signals applied to the PCIe interface. If the DUT belongs to a SATA interface, the control unit 1010 can be reprogrammed based on the lines and firmware of the DUT, test socket 120, or burn-in board 110, allowing the burn-in system 1000 to output test signals applied to the SATA interface. The storage unit 1020 is used to store and retrieve data and control signals, such as programming for different transmission interfaces and corresponding output test signals. The multi-port unit 1030, such as a PCIe switch, provides signal connections to multiple test sockets 120, allowing multiple test sockets 120 to share ports, thereby providing efficient many-to-many communication. A communication unit 1040 provides signal connections to the control unit 1010, the storage unit 1020 and the multiport unit 1030, respectively.The communication unit 1040 is the root complex and core of the burn-in system 1000. It manages communication signals in the test environment, such as functioning as a bridge between the system's main memory and each device, initializing and configuring each device, managing data transmission, processing read / write requests issued by devices, and supporting multiple ports, connecting each port to a device or the multi-port unit 1030. The conversion unit 1050 is, for example, a PCI-PCIe bridge and can be configured as needed. The conversion unit 1050 is a conversion device that connects traditional interface devices with modern interface systems, allowing existing interface equipment to continue to be used in the interface environment. The control unit 1010 outputs a test signal to at least one of the multiple test sockets 120 based on the control signal. The multiple transmission interfaces of the signal test board 200 and the multiple test sockets 120 include at least one of PCIe, SATA, and USB, or other transmission interfaces suitable for the DUT or the test socket 120. The multiple DUTs are endpoints in the system architecture.

[0028] Generally speaking, conventional burn-in boards or signal test boards can only perform burn-in tests on devices under test based on the test functions assigned at the time of manufacture. As the test environment for devices under test (e.g., test types and upper test limits) becomes increasingly stringent with the changing times, the existing burn-in board or signal test board configuration becomes insufficient, or a signal test board must be replaced for devices under test, test sockets 120, or burn-in boards 110 with different transmission interfaces. To address this drawback, the present invention configures the burn-in system 1000 to function as an independent signal test board for system-level testing. The burn-in system 1000 can be reprogrammed to suit different devices under test, test sockets 120, or burn-in boards 110 with different transmission interfaces according to the test needs of different devices under test and customers, transmitting test signals corresponding to the transmission interface and converting test patterns provided by customers to send them to the devices under test. In other words, the burn-in system 1000 itself is a test system, and new types of test conditions can be realized simply by using the power supply system and signal control system of the existing burn-in board. For example, conventional burn-in configurations can only test one test item at a time. For example, in a long-term burn-in test, the test is performed through multiple consecutive patterns, with each test pattern lasting approximately 168 hours, or even 1,000 hours. Because conventional burn-in configurations can only perform a single test item (e.g., voltage) in each test pattern, it is difficult to identify which DUTs are responding poorly to other test factors in that pattern. In this regard, the burn-in system 1000 provided by the present invention performs independent system-level testing. The burn-in system 1000 can be configured to switch to other test items (e.g., pressure) between patterns, enabling early detection of DUTs with poor responses. In another embodiment of the present invention, multiple burn-in systems 1000 can be configured to adjust the schedule of different test items according to customer expectations.

[0029] In addition, in a modification of the third embodiment of the present invention, the burn-in system 1000 includes a storage unit 1020, a multiport unit 1030 that connects signals to a plurality of test sockets 120, and a communication unit 1040 that is programmed based on a plurality of transmission interfaces and configured to output a test signal corresponding to one of the plurality of transmission interfaces. Each communication unit 1040 connects signals to the storage unit 1020 and the multiport unit 1030, and is used to receive a control signal from the signal control system 300. In this modification, the communication unit 1040 is a root complex, and the difference from the third embodiment is that the communication unit 1040 also functions as the control unit 1010. The communication unit 1040 is also programmed based on a plurality of transmission interfaces and configured to output a test signal corresponding to one of the plurality of transmission interfaces. Each communication unit 1040 connects signals to the storage unit 1020 and the multiport unit 1030, and outputs a test signal to at least one of the plurality of test sockets based on the control signal. In a specific embodiment of the present invention, the control unit 1010 is a CPU or FPGA, and the communication unit 1040 is an FPGA. In a specific variant, the communication unit 1040 is a CPU or FPGA. In a specific embodiment of the present invention, the control unit 1010 or the communication unit 1040 is respectively connected to components such as a hard disk, a memory, a flash memory, etc.

[0030] In addition to the above, those skilled in the art can apply the teachings of the present invention to various burn-in test items. Various burn-in test items to which the present invention can be applied are described in detail below. (1) Open / Short Test: This test verifies whether the test signal pins are in contact with the wafer or chip and detects whether the signal pins are shorted to normal signal pins. (2) DC Parametric Test: This test verifies whether the DC parameters of the wafer or chip meet the design specifications. These parameters include output drive current, current leakage, power current, and threshold level. (3) Functional Test: This test verifies whether the wafer or chip can correctly perform the expected logic functions and creates test vectors or truth tables to detect wafer or chip failures. (4) AC Parametric Test is used to verify whether a wafer or chip meets timing specifications. Parameters include propagation delay, setup and hold time, access time, refresh time, and rise / fall times. (5) Data Binning is used to classify wafers or chips according to the test results. (6) Pattern Programming is used to edit the microcode of a logic algorithm test vector generator (ALPG) to process test patterns. (7) Socket Programming is used to edit parallel test settings. The above-described order and test contents are not limited to various actual burn-in tests, and the configuration of the present invention can also be used for other undisclosed burn-in test items.

[0031] In summary, the most significant advantages of the burn-in equipment with processor test capabilities of the present invention compared with the prior art are: (1) Customers do not need to purchase new test equipment with higher frequencies or more burn-in test item capabilities at this stage. They can continue to use their original burn-in equipment and adapt to ever-changing semiconductor test technologies, thereby extending the life of the burn-in equipment. It also accommodates the increased high-frequency test requirements and test items of the devices under test. For example, the signal test board can provide higher-frequency test signals to test the devices under test, replacing the 10 MHz signals provided by the original test equipment. (2) Regarding the power supply to the devices under test, a compensation mechanism ensures that each device under test receives consistent power. (3) By placing a signal test board for system-level testing on the system, different test item types and schedules can be adjusted, and devices with faulty responses can be detected as early as possible, reprogrammed according to the requirements of different transmission interfaces, and control signals corresponding to the transmission interfaces can be output. This eliminates the need to replace different signal test boards, burn-in boards, or burn-in sockets every time a device under test with a different transmission interface is replaced, as in the prior art. According to the above, the burn-in equipment of the present invention can improve test efficiency, provide higher test signal quantity / density, optimize PCB wiring, flexibly adjust installation method, flexibly adjust setting parameter method, and adapt to new or test technology, ultimately realizing reduced test costs for devices under test, stable power supply, and flexible schedule. [Explanation of symbols]

[0032] Burn-in equipment with 100 processor test capabilities 110 Burn-in Board 120 test socket 121 Socket Power Module 1215 Power detection element 122 Socket Detection Module 130 Subsystem Module 140 Signal Interface 150 Power Interface 200 Signal Test Board 210 First Connector 230 Control Elements 300 Signal Control System 400 Test Equipment 410 Power supply 500 chambers 710 Burn-in Board 1000 Burn-in System 1010 Control Unit 1020 Storage Unit 1030 Multiport Unit 1040 Communication Unit 1050 conversion unit DUT / D Device under test M1~M3 configuration method P1 control signal path P2 Test parameter setting signal

Claims

1. a plurality of test sockets, each configured to accommodate a device under test, and each including at least one socket power module; at least one signal test board coupled on a burn-in board for signal connection to at least one of the plurality of test sockets of the burn-in board and for receiving signals related to power supply settings; A burn-in board comprising: the signal test board controls the burn-in board based on the signal to supply power to at least one of the plurality of test sockets to perform a test procedure; the at least one socket power module has a power compensation mechanism to match the power received by each of the devices under test; Burn-in board.

2. a plurality of test sockets, each configured to receive a device under test; at least one signal test board coupled on a burn-in board for signal connection to at least one of the plurality of test sockets of the burn-in board and for receiving signals related to power supply settings; a plurality of socket power supply modules, each of the test sockets corresponding to at least one of the socket power supply modules to form an electrical connection therewith; A burn-in board comprising: the signal test board controls the burn-in board based on the signal to supply power to at least one of the plurality of test sockets to perform a test procedure; the at least one socket power module has a power compensation mechanism to match the power received by each of the devices under test; Burn-in board.

3. 3. The burn-in board of claim 1, wherein the socket power supply module further comprises a power detection element configured to detect power transmitted to the device under test, and when the power detection element detects that there is a first difference between the power transmitted from the socket power supply module to the device under test and the power supply setting, the socket power supply module adjusts the power transmitted from the socket power supply module to the device under test based on the first difference.

4. 3. The burn-in board of claim 1, wherein the socket power module is an integrated power module or a power management integrated circuit.

5. the socket power module is electrically connected to the device under test and the signal test board, respectively, and the socket detection module is configured to detect the power of the device under test during testing; if the socket detection module detects a second difference between the device under test and the power supply setting, transmitting the second difference to the signal test board, and the signal test board adjusting the power supply of the test socket based on the second difference; 3. The burn-in board according to claim 1 or 2.

6. a control unit configured to be programmed based on a plurality of transmission interfaces, for outputting a test signal corresponding to one of the plurality of transmission interfaces and receiving a control signal from a signal control system; A storage unit; a multi-port unit for connecting signals to multiple test sockets; communication units providing signal connections to the control unit, the storage unit, and the multiport unit, respectively; 1. A burn-in system integrated into a signal test board, comprising: the control unit outputs a test signal to at least one of the plurality of test sockets based on the control signal. Burn-in system.

7. A storage unit; a multi-port unit for connecting signals to multiple test sockets; a communication unit, each of which is signal-connected to the storage unit and the multiport unit and configured to be programmed based on a plurality of transmission interfaces, for outputting a test signal corresponding to one of the plurality of transmission interfaces and receiving a control signal from a signal control system; 1. A burn-in system integrated into a signal test board, comprising: the communication unit outputs a test signal to at least one of the plurality of test sockets based on the control signal. Burn-in system.

8. 8. The burn-in system of claim 6, further comprising a conversion unit configured to provide a signal connection to a test socket of one of the plurality of transmission interfaces.

9. The burn-in system of claim 8 , wherein the plurality of transmission interfaces include at least one of PCIe, SATA, and USB.

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