Dressing method and processing apparatus

Abstract

To provide a dressing method and a processing device capable of improving productivity more than before.SOLUTION: The dressing method for dressing the tip of the cutting blade 31 having the cutting edge 34 includes a holding step 10001 of holding the dressing tool 111 on the holding table 10 of the processing apparatus 1 and a dressing step 1002 of performing dressing by cutting the tip of the cutting blade 31 into the dressing tool 111 by a predetermined amount. The holding table 10 is provided with an ultrasonic vibration applying unit 15 for applying ultrasonic vibration to the holding table 10. In the dressing step 1002, the dressing of the cutting blade 31 is performed in a state where the ultrasonic vibration is generated in the holding table 10.SELECTED DRAWING: Figure 7

Description

[Technical Field]

[0001] The present invention relates to a dressing method and a processing apparatus. [Background technology]

[0002] Dicing a workpiece such as a wafer into individual chips is known as a dicing process using a processing device (cutting device). Dicing is performed using a cutting blade (processing unit) attached to the tip of the spindle of the processing device. The cutting blade is selected from various cutting blades, including electroformed blades made of diamond abrasive grains bonded with nickel plating or other bonding (electroformed bond), resin blades made of diamond abrasive grains bonded with resin or metal bond, and metal bond blades, depending on the characteristics of the workpiece (wafer, etc.).

[0003] Here, after the cutting blade is attached to the processing device, a dressing process is carried out using a dressing tool to cut the cutting blade into the dressing tool in order to make the cutting blade perfectly round and to protrude (sharpen) the abrasive grains before actual processing (see, for example, Patent Document 1). [Prior art documents] [Patent documents]

[0004] [Patent Document 1] Japanese Patent Application Laid-Open No. 2000-049120 Summary of the Invention [Problem to be solved by the invention]

[0005] However, conventional dressing processes have had the problem that dressing cutting blades using hard bonds, such as electroformed bonds or metal bonds, takes time and reduces productivity.

[0006] The present invention has been made in view of the above problems, and an object of the present invention is to provide a dressing method and processing apparatus that can improve productivity compared to conventional methods. [Means for solving the problem]

[0007] In order to solve the above-mentioned problems and achieve the object, the dressing method of the present invention is a dressing method for dressing the tip of a cutting blade having a cutting edge, and includes a holding step of holding a dressing tool on a holding table of a processing device, and a dressing step of dressing the tip of the cutting blade by cutting a predetermined amount into the dressing tool, wherein the holding table is equipped with an ultrasonic vibration imparting unit that generates ultrasonic vibrations in the holding table, and in the dressing step, the cutting blade is dressed while the ultrasonic vibrations are generated in the holding table.

[0008] In addition, in order to solve the above-mentioned problems and achieve the object, the processing apparatus of the present invention is a processing apparatus that is configured to include at least a holding table that holds a workpiece, a moving unit that moves the holding table, a processing unit having a cutting blade that processes the workpiece held on the holding table, and a control unit, wherein the workpiece is a dressing tool, the holding table is equipped with an ultrasonic vibration imparting unit that generates ultrasonic vibrations in the holding table, and the cutting blade is dressed while the ultrasonic vibrations are generated in the holding table.

[0009] A second holding table for holding the dressing tool may be provided near the holding table, and the second holding table may be provided with an ultrasonic vibration imparting unit for generating ultrasonic vibrations in the second holding table, and dressing of the cutting blade may be performed while the ultrasonic vibrations are being generated in the second holding table. [Effects of the Invention]

[0010] The present invention includes an ultrasonic vibration imparting unit that generates ultrasonic vibrations on a holding table that holds a dressing tool, and in the dressing step, while the ultrasonic vibration imparting unit generates ultrasonic vibrations on the holding table that holds the dressing tool, dresses the cutting blade with the dressing tool on the ultrasonically vibrating holding table. Therefore, the present invention can complete dressing in a shorter time than conventional methods, even for cutting blades that use hard bonds such as electroformed bonds or metal bonds, which conventionally took a particularly long time to dress and reduced productivity, thereby improving productivity compared to conventional methods. [Brief explanation of the drawings]

[0011] [Figure 1] FIG. 1 is a perspective view showing an example of the configuration of a processing device according to an embodiment. [Figure 2] 2 is a perspective view showing a holding table and a second holding table of the processing apparatus of FIG. [Figure 3] 3 is a top view showing a second holding table of the processing apparatus of FIG. 1. FIG. [Figure 4] 4 is a cross-sectional view showing a second holding table of the processing apparatus of FIG. [Figure 5] FIG. 5 is a flowchart showing the procedure of the dressing method according to the embodiment. [Figure 6] FIG. 6 is a perspective view illustrating the holding step shown in FIG. [Figure 7] FIG. 7 is a perspective view illustrating the dressing step shown in FIG. [Figure 8] FIG. 8 is a cross-sectional view illustrating another example of the holding step and the dressing step shown in FIG. DETAILED DESCRIPTION OF THE INVENTION

[0012] Modes (embodiments) for carrying out the present invention will be described in detail with reference to the drawings. The present invention is not limited to the contents described in the following embodiments. Furthermore, the components described below include those that can be easily imagined by a person skilled in the art and those that are substantially the same. Furthermore, the configurations described below can be combined as appropriate. Furthermore, various omissions, substitutions, or modifications of the configuration can be made within the scope of the gist of the present invention.

[0013] [Embodiment] A dressing method and processing apparatus according to an embodiment of the present invention will be described with reference to the drawings. FIG. 1 is a perspective view showing an example of the configuration of a processing apparatus 1 according to an embodiment. FIG. 2 is a perspective view showing a holding table 10 and a second holding table 20 of the processing apparatus 1 of FIG. 1. FIG. 3 is a top view showing the second holding table 20 of the processing apparatus 1 of FIG. 1. FIG. 4 is a cross-sectional view showing the second holding table 20 of the processing apparatus 1 of FIG. 1. As shown in FIG. 2, the processing apparatus 1 according to an embodiment is configured (equipped) with at least a holding table 10 (first holding table 10), a second holding table 20, a processing unit 30, a moving unit 40, and a control unit 50.

[0014] The processing apparatus 1 is an apparatus that cuts workpieces 100, 110 shown in FIG. 1 using a cutting blade 31 of a processing unit 30 (described later). The workpiece 100, which is one of the objects to be processed (cut) by the processing apparatus 1, is, for example, a disk-shaped wafer such as a semiconductor device wafer or an optical device wafer, made of a base material such as silicon, sapphire, silicon carbide (SiC), or gallium arsenide, as shown in FIG. 1. The workpiece 100 has a plurality of planned division lines formed in a lattice pattern on a flat surface 101, and a plurality of devices such as ICs (Integrated Circuits) and LSIs (Large Scale Integration) are formed in areas defined by the plurality of planned division lines. As shown in FIG. 1, the workpiece 100 has a support tape 105 attached to a flat back surface 104 on the back side of the front surface 101, and an annular frame 106 may be attached to the outer edge of the support tape 105. That is, the workpiece 100 may be supported and fixed to the opening of the annular frame 106 via the support tape 105. Furthermore, the workpiece 100 is not limited to a wafer, and may be a circular package substrate having a plurality of devices sealed with resin, such as a CSP (Chip Size Package) or a QFN (Quad Flat Non-leaded package), a ceramic plate, a glass plate, or the like.

[0015] The workpiece 110, which is another of the objects to be processed (cut) by the processing apparatus 1, is, for example, a dressing tool 110, as shown in FIG. 1 . The processing apparatus 1 uses the dressing tool 110 shown in FIG. 1 to dress the cutting blade 31 for the purpose of making the cutting blade 31 perfectly round and protruding (sharpening) the abrasive grains. The dressing tool 110 is used for dressing the cutting blade 31 by removing the metal plating or bonding material covering the abrasive grains of the cutting blade 31 through cutting processing by the cutting blade 31, thereby protruding the abrasive grains and sharpening the cutting blade 31, i.e., improving the processing quality of the cutting blade 31. The dressing tool 110 is formed, for example, in the shape of a rectangular plate, from a bonding material in which abrasive grains, such as white alundum (WA) or green carbon (GC), whose abrasive grain size is smaller than that of the cutting edge 34 of the cutting blade 31 (see FIGS. 7 and 8 ), are bonded with a resin or the like. The dressing tool 110 is appropriately selected and used depending on the characteristics of the cutting edge 34 of the cutting blade 31.

[0016] 1, the dressing tool 110 may have a support tape 105 similar to that described above attached to a flat back surface 114 behind the front surface 111, and an annular frame 106 similar to that described above attached to the outer edge of the support tape 105. That is, the dressing tool 110 may be supported and fixed to the opening of the annular frame 106 via the support tape 105. Note that both the workpiece 100 (such as a wafer) and the dressing tool 110 described above are workpieces in the present invention.

[0017] As shown in FIGS. 1 and 2 , the holding table 10 is a so-called chuck table that includes a disk-shaped frame with a recess and a disk-shaped suction portion fitted into the recess. The suction portion of the holding table 10 is formed of porous ceramic or the like with numerous porous holes and is connected to a vacuum suction source (not shown) via a vacuum suction path (not shown). The upper surface of the suction portion of the holding table 10 is a holding surface 11 on which a workpiece 100 or a dressing tool 110, equipped with a support tape 105 and an annular frame 106, is placed. The holding surface 11 suction-holds the placed workpiece 100 or dressing tool 110 via the support tape 105 by negative pressure introduced from the vacuum suction source. The holding surface 11 and the upper surface of the frame of the holding table 10 are coplanar and parallel to the horizontal XY plane. The holding table 10 is movable along the X-axis direction, which is parallel to the horizontal direction, by an X-axis direction moving unit 41 of the moving unit 40. The holding table 10 has a rotary drive source (not shown) provided below the frame body and the suction portion, and is configured to be freely rotatable (rotatable) around the central axis of the holding surface 11, which is parallel to the Z-axis direction that passes through the center of the holding surface 11 and is parallel to the vertical direction, by the rotary drive source.

[0018] 2, the holding table 10 is equipped with an ultrasonic vibration imparting unit 15 that generates ultrasonic vibrations in the holding table 10. In this embodiment, the ultrasonic vibration imparting unit 15 is provided on the cylindrical side surface of the frame of the holding table 10, at a position below the holding surface 11 of the holding table 10. Under the control of the control unit 50, the ultrasonic vibration imparting unit 15 generates ultrasonic vibrations based on power supplied via the control unit 50, and imparts ultrasonic vibrations to the frame of the holding table 10, thereby imparting ultrasonic vibrations to the dressing tool 110 on the holding surface 11 via the holding surface 11.

[0019] 2, only one ultrasonic vibration imparting unit 15 is provided on the cylindrical side surface of the frame of the holding table 10, but the present invention is not limited to this and two or more ultrasonic vibration imparting units 15 may be provided. When two or more ultrasonic vibration imparting units 15 are provided, they are preferably provided at the same height in the vertical direction and in positions that are horizontally symmetrical with respect to a center line that passes through the center of the holding surface 11 in the vertical direction. In other words, they are preferably provided in an array at equal intervals from each other in the circumferential direction around the center line of the holding surface 11. In this case, ultrasonic vibrations can be introduced uniformly onto the holding surface 11.

[0020] As shown in Figures 1 and 2, the second holding table 20 is disposed (placed) near the holding table 10, adjacent to the holding table 10. In the example of this embodiment shown in Figures 1 and 2, two second holding tables 20 are disposed, one for each of the two processing units 30, but the present invention is not limited to this and only one, or three or more, may be disposed. Each second holding table 20 moves along the X-axis direction together with the holding table 10 by the X-axis direction moving unit 41 of the moving unit 40. The second holding table 20 holds the dressing tool 110.

[0021] The second holding tables 20 all have the same configuration except for the positions at which they are disposed. In the following, the description of the second holding tables 20 applies to all second holding tables 20 unless otherwise specified to the effect that the properties of each second holding table 20 are different from each other. The second holding table 20 is formed in the shape of a rectangular plate, and is disposed at a position where its upper surface 21 is at the same height as the holding surface 11 of the holding table 10. A dressing tool 110 is placed on the upper surface 21 of the second holding table 20.

[0022] 2 and 3, the second holding table 20 has a plurality of groove-shaped suction paths 22 formed in its upper surface 21. The groove-shaped suction paths 22 are connected to a vacuum suction source 24 (see FIG. 4) provided below the second holding table 20 through suction holes 23 (see FIGS. 3 and 4) formed in the bottom surface along the vertical direction. The second holding table 20 holds the dressing tool 110 placed on its upper surface 21 by suctioning the groove-shaped suction paths 22 with the vacuum suction source 24 through the suction holes 23.

[0023] The upper surface 21 of the second holding table 20, which is the holding surface that suction-holds the dressing tool 110, is formed smaller than the holding surface 11 of the holding table 10, is formed smaller than the workpiece 100 in a plan view, and is formed to have the same (substantially the same) shape and size as the dressing tool 110 in a plan view. In this way, the second holding table 20 is a so-called sub-chuck table that holds the dressing tool 110, while the holding table 10 is a main chuck table that suction-holds the workpiece 100 and can also hold the dressing tool 110. Note that both the holding table 10 (first holding table 10) and the second holding table 20 are holding tables in the present invention.

[0024] 4, the second holding table 20 includes an ultrasonic vibration imparting unit 25 that generates ultrasonic vibrations in the second holding table 20. In this embodiment, the ultrasonic vibration imparting unit 25 is provided at a position below the upper surface 21 inside the second holding table 20. Under the control of the control unit 50, the ultrasonic vibration imparting unit 25 generates ultrasonic vibrations based on power supplied via the control unit 50, and imparts ultrasonic vibrations toward the upper surface 21 of the second holding table 20, thereby imparting ultrasonic vibrations to the dressing tool 110 on the upper surface 21 via the upper surface 21.

[0025] 4, a plurality (two) of ultrasonic vibration imparting units 25 are provided in a region below upper surface 21 inside second holding table 20, at the same vertical height and at positions that are horizontally symmetrical with respect to a center line that passes vertically through the center of upper surface 21, but the present invention is not limited to this, and only one, or three or more, may be provided. Since a plurality (two) of ultrasonic vibration imparting units 25 are provided in this manner at the same vertical height and at positions that are horizontally symmetrical with respect to the center line of upper surface 21, ultrasonic vibrations can be introduced uniformly onto upper surface 21.

[0026] In this embodiment, a gap is formed between the holding table 10 and the second holding table 20. For this reason, the ultrasonic vibration imparting unit 15 can impart sufficiently effective ultrasonic vibrations only to the holding table 10 on which the ultrasonic vibration imparting unit 15 is provided, and cannot impart sufficiently effective ultrasonic vibrations to the second holding table 20. On the other hand, the ultrasonic vibration imparting unit 25 can impart sufficiently effective ultrasonic vibrations only to the second holding table 20 on which the ultrasonic vibration imparting unit 25 is provided, and cannot impart sufficiently effective ultrasonic vibrations to the holding table 10.

[0027] As shown in FIG. 1, the processing unit 30 includes a cutting blade 31 that processes workpieces 100, 110 held on the holding table 10, and a spindle 32. The cutting blade 31 has a circular cutting edge 34 (see FIGS. 7 and 8) formed in an annular shape with a predetermined thickness. In this embodiment, the cutting edge 34 of the cutting blade 31 is, for example, an electroformed blade in which abrasive grains such as diamond or cubic boron nitride (CBN) are bonded with a metal plating (electroformed bond) such as nickel plating, or a resin blade or metal-bonded blade in which abrasive grains such as diamond or CBN are bonded with a bond material (binding material) such as resin bond or metal bond. The cutting blade 31 may be appropriately selected depending on the characteristics of the workpiece 100. The cutting blade 31 may be a so-called hub blade in which the annular cutting edge 34 is fixed to the outer periphery of a circular base, or a so-called hubless blade essentially consisting of the annular cutting edge 34 alone.

[0028] The cutting blade 31 is attached to the tip of the spindle 32 and is rotated by the spindle 32, which serves as the rotation axis, to cut the workpiece 100 held on the holding table 10. The cutting blade 31 is also attached to the tip of the spindle 32 and is rotated by the spindle 32, which serves as the rotation axis, to cut the dressing tool 110 held on the holding table 10 or the second holding table 20, thereby being dressed by the dressing tool 110.

[0029] The spindle 32 is provided such that the rotation axis direction is parallel to the horizontal direction and parallel to the Y-axis direction, which is perpendicular to the X-axis direction. That is, the spindle 32 is provided so as to be rotatable about an axis parallel to the Y-axis direction, and is rotated about the axis by a motor (not shown) connected to the spindle 32. The spindle 32 supports the cutting blade 31 attached to the tip of the spindle 32 so as to be rotatable about the axis parallel to the Y-axis direction.

[0030] The spindle 32 of the processing unit 30 is provided so as to be movable in the Y-axis direction and the Z-axis direction by a Y-axis direction moving unit 42 and a Z-axis direction moving unit 43 of the moving unit 40, respectively. In this embodiment, as shown in FIG. 1, the processing device 1 is provided with two sets of processing units 30, that is, a two-spindle dicer, a so-called facing dual type cutting device (processing device).

[0031] 1, the movement unit 40 in this embodiment includes an X-axis direction movement unit 41, a Y-axis direction movement unit 42, and a Z-axis direction movement unit 43. The X-axis direction movement unit 41 moves the holding table 10 and the second holding table 20 along the X-axis direction relative to the processing unit 30. The Y-axis direction movement unit 42 and the Z-axis direction movement unit 43 move the processing unit 30 along the Y-axis direction and the Z-axis direction relative to the holding table 10 and the second holding table 20, respectively.

[0032] In this embodiment, the X-axis direction moving unit 41, the Y-axis direction moving unit 42, and the Z-axis direction moving unit 43 are all known ball screw mechanisms having a motor, a ball screw, and a guide. The X-axis direction moving unit 41, the Y-axis direction moving unit 42, and the Z-axis direction moving unit 43 each include an encoder that reads the rotational position of the motor, and detects the relative positions of the holding table 10 (and the second holding table 20) and the processing unit 30 in the X-axis direction, the Y-axis direction, and the Z-axis direction based on the rotational position of the motor read by the encoder, and outputs the detected relative positions to the control unit 50. Here, the relative positions in the X-axis direction, the Y-axis direction, and the Z-axis direction are determined using an apparatus coordinate system provided in the processing apparatus 1. The X-axis moving unit 41, the Y-axis moving unit 42 and the Z-axis moving unit 43 are not limited to a configuration in which the relative positions of the holding table 10 (and the second holding table 20) and the processing unit 30 are detected by an encoder, but may also be configured with linear scales parallel to the X-axis, Y-axis and Z-axis directions, respectively, and reading heads that are movable in the X-axis, Y-axis and Z-axis directions by the X-axis moving unit 41, the Y-axis moving unit 42 and the Z-axis moving unit 43, respectively, and that read the graduations of the linear scales.

[0033] The processing unit 30 rotates the cutting blade 31 attached to the tip of the spindle 32 around an axis parallel to the Y-axis direction by the rotational movement of the spindle 32, while moving the cutting blade 31 along the X-axis direction relative to the workpiece 100 on the holding table 10 using the X-axis movement unit 41, thereby cutting the workpiece 100 along the planned dividing line with the cutting blade 31 to form a cutting groove (processing groove), thereby dividing the workpiece 100 along the planned dividing line.

[0034] The processing unit 30 rotates the cutting blade 31 attached to the tip of the spindle 32 around an axis parallel to the Y-axis direction by rotating the spindle 32, while using the X-axis direction moving unit 41 to move the cutting blade 31 along the X-axis direction relative to the dressing tool 110 on the holding table 10 or the second holding table 20, thereby performing a dressing process in which the tip of the cutting edge 34 of the cutting blade 31 is dressed with the dressing tool 110 by cutting the dressing tool 110 with the tip of the cutting edge 34 of the cutting blade 31.

[0035] The control unit 50 controls the operation of various components of the processing apparatus 1, causing the processing apparatus 1 to perform various processes, such as cutting the workpiece 100 and dressing the cutting blade 31, including the steps of the dressing method according to this embodiment. In the first embodiment, the control unit 50 includes a computer system. The computer system included in the control unit 50 includes an arithmetic processing device having a microprocessor such as a central processing unit (CPU), a storage device having memory such as a read-only memory (ROM) or a random access memory (RAM), and an input / output interface device. The arithmetic processing device of the control unit 50 performs arithmetic processing according to a computer program stored in the storage device of the control unit 50, and outputs control signals for controlling the processing apparatus 1 to each component of the processing apparatus 1 via the input / output interface device of the control unit 50.

[0036] Next, this specification will explain a dressing method according to this embodiment with reference to the drawings. FIG. 5 is a flowchart showing the processing steps of the dressing method according to this embodiment. FIG. 6 is a perspective view explaining the holding step 1001 shown in FIG. 5. FIG. 7 is a perspective view explaining the dressing step 1002 shown in FIG. 5. FIG. 8 is a cross-sectional view explaining another example of the holding step 1001 and the dressing step 1002 shown in FIG. 5. The dressing method according to this embodiment is an example of an operation process performed by the processing apparatus 1 according to this embodiment, and is a dressing method for dressing the tip of the cutting blade 31 having the cutting edge 34 in the processing apparatus 1, and includes a holding step 1001 and a dressing step 1002 as shown in FIG. 5.

[0037] A first example of a dressing method according to the embodiment is a method in which, in a holding step 1001, a dressing tool 110 is held on a holding table 10 of a processing device 1 as shown in FIG. 6, and, in a dressing step 1002, the tip of the cutting edge 34 of a cutting blade 31 is dressed with the dressing tool 110 on the holding table 10 as shown in FIG. 7.

[0038] 6, the holding step 1001 in the first example is a step of holding the dressing tool 110 on the holding table 10 of the processing device 1. In the holding step 1001 in the first example, as shown in FIG. 6, the dressing tool 110 supported and fixed to the opening of the annular frame 106 via the support tape 105 is transported and placed on the holding table 10 of the processing device 1 by a transport unit (not shown), and the dressing tool 110 placed on the holding table 10 is suction-held by the holding surface 11 of the holding table 10 via the support tape 205.

[0039] As shown in FIG. 7 , the dressing step 1002 in the first example is a step of dressing the tip of the cutting edge 34 of the cutting blade 31 by cutting a predetermined amount into the dressing tool 110 on the holding table 10 after the holding step 1001 in the first example is performed. Here, in this embodiment, the predetermined amount is, for example, the same amount (radial length) as the cutting depth when the tip of the cutting edge 34 of the cutting blade 31 cuts the workpiece 100 (such as a wafer) or an amount (radial length) greater than the cutting depth, or an amount (radial length) less than the total radial length of the cutting edge 34, and can be changed appropriately depending on the cutting depth in the cutting performed after dressing. In the dressing step 1002 in the first example, the tip of the cutting edge 34 of the cutting blade 31 is dressed while ultrasonic vibrations are generated in the holding table 10 by the ultrasonic vibration imparting unit 15.

[0040] Specifically, in the dressing step 1002 in the first example, first, ultrasonic vibration is generated in the holding table 10 by the ultrasonic vibration imparting unit 15, thereby generating ultrasonic vibration in the dressing tool 110 on the holding surface 11 of the holding table 10. Next, in the dressing step 1002 in the first example, a rotational motion is applied to the spindle 32, causing the cutting blade 31 attached to the tip of the spindle 32 to rotate around an axis parallel to the Y-axis direction.

[0041] In the dressing step 1002 in the first example, the X-axis moving unit 41, the Y-axis moving unit 42 and the Z-axis moving unit 43 move the tip of the cutting edge 34 of the rotating cutting blade 31 towards the ultrasonically vibrating dressing tool 110 on the holding table 10, so that the tip of the cutting edge 34 of the rotating cutting blade 31 cuts into the ultrasonically vibrating dressing tool 110 on the holding table 10.

[0042] In the dressing step 1002 in the first example, the tip of the cutting edge 34 of the rotating cutting blade 31 is then caused to cut into the ultrasonically vibrating dressing tool 110 on the holding table 10, and as shown in Figure 7, the X-axis direction moving unit 41 moves the cutting blade 31 along the X-axis direction relative to the dressing tool 110 on the holding table 10, thereby cutting the dressing tool 110 with the tip of the cutting edge 34 of the cutting blade 31, thereby dressing the tip of the cutting edge 34 of the cutting blade 31 with the dressing tool 110.

[0043] A second example of a dressing method according to the embodiment is a method in which, in a holding step 1001, a dressing tool 110 is held on a second holding table 20 of the processing apparatus 1 as shown in FIG. 8, and, in a dressing step 1002, the tip of the cutting edge 34 of the cutting blade 31 is dressed with the dressing tool 110 on the second holding table 20 as shown in FIG. 7.

[0044] 8, the holding step 1001 in the second example is a step of holding the dressing tool 110 on the second holding table 20 of the processing device 1. In the holding step 1001 in the second example, as shown in Fig. 8, the dressing tool 110 without the support tape 105 and the annular frame 106 attached thereto is transported and placed on the second holding table 20 of the processing device 1 by a transport unit (not shown), and the dressing tool 110 placed on the second holding table 20 is suction-held by the upper surface 21 of the second holding table 20 from, for example, the back surface 114 side.

[0045] 8, the dressing step 1002 in the second example is a step of dressing the tip of the cutting edge 34 of the cutting blade 31 by cutting a predetermined amount into the dressing tool 110 on the second holding table 20 after the holding step 1001 in the second example is performed. In the dressing step 1002 in the second example, the tip of the cutting edge 34 of the cutting blade 31 is dressed while ultrasonic vibrations are generated in the second holding table 20 by the ultrasonic vibration imparting unit 25.

[0046] Specifically, in the dressing step 1002 in the second example, first, the ultrasonic vibration imparting unit 25 generates ultrasonic vibrations in the second holding table 20, thereby generating ultrasonic vibrations in the dressing tool 110 on the upper surface 21 of the second holding table 20. Next, in the dressing step 1002 in the second example, a rotational motion is applied to the spindle 32, causing the cutting blade 31 attached to the tip of the spindle 32 to rotate around an axis parallel to the Y-axis direction.

[0047] In the dressing step 1002 in the second example, the X-axis moving unit 41, the Y-axis moving unit 42 and the Z-axis moving unit 43 move the tip of the cutting edge 34 of the rotating cutting blade 31 toward the ultrasonically vibrating dressing tool 110 on the second holding table 20, so that the tip of the cutting edge 34 of the rotating cutting blade 31 cuts into the ultrasonically vibrating dressing tool 110 on the second holding table 20.

[0048] In the dressing step 1002 in the second example, the tip of the cutting edge 34 of the rotating cutting blade 31 is then caused to cut into the ultrasonically vibrating dressing tool 110 on the second holding table 20, and as shown in Figure 8, the X-axis direction moving unit 41 moves the cutting blade 31 along the X-axis direction relative to the dressing tool 110 on the second holding table 20, thereby cutting the dressing tool 110 with the tip of the cutting edge 34 of the cutting blade 31, thereby dressing the tip of the cutting edge 34 of the cutting blade 31 with the dressing tool 110.

[0049] In the dressing method and processing apparatus 1 according to the embodiment having the above configuration, the holding table 10 holding the dressing tool 110 is equipped with an ultrasonic vibration imparting unit 15 that generates ultrasonic vibrations in the holding table 10, and in the dressing step 1002, the cutting blade 31 is dressed by the dressing tool 110 on the ultrasonically vibrating holding table 10 while the ultrasonic vibration imparting unit 15 is generating ultrasonic vibrations in the holding table 10 holding the dressing tool 110. Also, in the dressing method and processing apparatus 1 according to the embodiment, the second holding table 20 holding the dressing tool 110 is equipped with an ultrasonic vibration imparting unit 25 that generates ultrasonic vibrations in the second holding table 20, and in the dressing step 1002, the cutting blade 31 is dressed by the ultrasonically vibrating dressing tool 110 on the second holding table 20 while the ultrasonic vibration imparting unit 25 is generating ultrasonic vibrations in the second holding table 20 holding the dressing tool 110. Therefore, the dressing method and processing apparatus 1 according to the embodiment can complete dressing in a shorter time than conventionally possible, even for cutting blades that use hard bonds such as electroplated bonds or metal bonds, which traditionally took a particularly long time to dress and reduced productivity, thereby achieving the advantageous effect of improving productivity compared to conventionally possible.

[0050] Furthermore, conventionally, when dressing by introducing ultrasonic vibrations to the cutting blade side is performed, a dedicated spindle for introducing ultrasonic vibrations is required, making the introduction difficult. In contrast, the dressing method and processing apparatus 1 according to the embodiment avoid introducing ultrasonic vibrations to the cutting blade 31 side and instead provide ultrasonic vibration imparting units 15, 25 that impart ultrasonic vibrations to the holding table 10 that holds the dressing tool 110 and the second holding table 20, respectively. Therefore, the dressing method and processing apparatus 1 according to the embodiment can be easily implemented in a conventional processing apparatus by installing the ultrasonic vibration imparting units 15, 25. When dressing is performed, the ultrasonic vibration imparting units 15, 25 are turned on and operated to easily perform dressing by introducing ultrasonic vibrations. Furthermore, when dressing is not performed, such as when cutting a workpiece 100 (such as a wafer), the ultrasonic vibration imparting units 15, 25 are turned off and stopped, allowing cutting and other processes to be performed appropriately.

[0051] The present invention is not limited to the above-described embodiment, and can be implemented in various modifications without departing from the gist of the present invention. [Explanation of symbols]

[0052] 1 Processing equipment 10 Holding table 15,25 Ultrasonic vibration unit 20 Second holding table 30 processing units 31 Cutting blade 34 cutting edge 40 Mobile Units 50 Control Unit 100 Workpiece 110 Dressing Tools 1001 holding steps 1002 Dressing Step

Claims

1. A dressing method for dressing a tip of a cutting blade having a cutting edge, comprising: a holding step of holding the dressing tool on a holding table of the processing device; a dressing step of dressing the tip of the cutting blade by cutting a predetermined amount into the dressing tool; Equipped with The holding table is provided with an ultrasonic vibration imparting unit that generates ultrasonic vibrations in the holding table, In the dressing step, the cutting blade is dressed while the ultrasonic vibration is generated in the holding table. Dressing method.

2. A processing device, a holding table for holding the workpiece; a moving unit that moves the holding table; The apparatus is configured to include at least a processing unit having a cutting blade for processing the workpiece held on the holding table, and a control unit, the workpiece is a dressing tool; The holding table is provided with an ultrasonic vibration imparting unit that generates ultrasonic vibrations in the holding table, dressing the cutting blade while the ultrasonic vibration is being generated on the holding table; Processing equipment.

3. a second holding table for holding the dressing tool in the vicinity of the holding table; the second holding table is provided with an ultrasonic vibration imparting unit that generates ultrasonic vibrations in the second holding table; dressing the cutting blade while the ultrasonic vibration is being generated in the second holding table; The processing device according to claim 2.

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