Multilayer electronic components

Abstract

A multilayer electronic component including first and second inductors and a shield conductor integrated with a laminate achieves desired characteristics. [Solution] The electronic component (1) includes an inductor (L24), an inductor (L25), conductor layers (614, 741), a laminate (50) for integrating the inductors (L24, L25) and the conductor layers (614, 741), and a shielding conductor (80) integrated with the laminate (50). The shielding conductor (80) includes a first conductor portion (80E) covering a side surface (50E) of the laminate (50). The inductors (L24, L25) are wound around axes (A4, A5), respectively, that are perpendicular to the stacking direction (T) of the laminate (50). The conductor layers (614, 741) connect the inductors (L24, L25) and the first conductor portion (80E).

Description

[Technical Field]

[0001] The present invention relates to a multilayer electronic component having a plurality of inductors and a shielding conductor integrated into the laminate. [Background technology]

[0002] One type of electronic component used in communication devices is a bandpass filter that includes multiple resonators. Each of the multiple resonators is, for example, an LC resonator configured using an inductor and a capacitor. The characteristics of the bandpass filter can be adjusted, for example, by adjusting the coupling between the multiple resonators.

[0003] In recent years, as communication devices have become smaller and more space-saving, the density of electronic components used in communication devices has increased. As a result, the spacing between multiple electronic components mounted on a mounting board has become smaller. As the spacing between multiple electronic components becomes smaller, electromagnetic interference between the multiple electronic components becomes more likely to occur. To suppress electromagnetic interference, it is possible to provide a shield on the body of the electronic component.

[0004] Patent Document 1 discloses an electronic component including a rectangular parallelepiped main body, an internal conductor provided within the main body, a ground external electrode provided on the bottom surface of the main body, and a shield electrode covering the four side surfaces of the main body. The internal conductor electrically connects the shield electrode and the ground external electrode. This electronic component can incorporate a bandpass filter. [Prior art documents] [Patent documents]

[0005] [Patent Document 1] Japanese Patent Application Publication No. 2017-076796 Summary of the Invention [Problem to be solved by the invention]

[0006] The miniaturization and space-saving of communication devices also requires the miniaturization of electronic components. As electronic components become smaller, it becomes more difficult to change the shape and arrangement of elements installed inside the electronic components. As a result, it becomes more difficult to adjust the characteristics of the electronic components. For example, if the electronic component is a bandpass filter, it becomes difficult to adjust the coupling between multiple resonators, making it difficult to achieve the desired characteristics.

[0007] The present invention has been made in view of the above problems, and an object of the present invention is to provide a multilayer electronic component that includes a plurality of inductors and a shielding conductor integrated with a laminate, and that is capable of achieving desired characteristics. [Means for solving the problem]

[0008] The multilayer electronic component of the present invention includes a first inductor, a second inductor, at least one first conductor layer, a laminate for integrating the first inductor, the second inductor, and the at least one first conductor layer, the laminate including a plurality of stacked dielectric layers, and a shielding conductor integrated with the laminate. The laminate has a first surface and a second surface located at both ends in the stacking direction of the plurality of dielectric layers, and a first side surface, a second side surface, a third side surface, and a fourth side surface connecting the first surface and the second surface. The first side surface and the second side surface face opposite each other, and the third side surface and the fourth side surface face opposite each other. The shielding conductor includes a first portion covering the first side surface. The first inductor and the second inductor are wound around a first axis and a second axis, respectively, perpendicular to the stacking direction. At least one first conductor layer connects the first inductor and the second inductor to the first portion. [Effects of the Invention]

[0009] In the multilayer electronic component of the present invention, the shielding conductor includes a first portion covering the first side surface. At least one first conductor layer connects the first inductor and the second inductor to the first portion. This makes it possible to achieve desired characteristics in a multilayer electronic component including the first and second inductors and the shielding conductor. [Brief explanation of the drawings]

[0010] [Figure 1] 1 is a circuit diagram showing an example of a circuit configuration of a multilayer electronic component according to an embodiment of the present invention. [Figure 2] 1 is a perspective view showing the appearance of a multilayer electronic component according to an embodiment of the present invention; [Figure 3] 1 is a perspective view showing a laminate of a multilayer electronic component according to an embodiment of the present invention; [Figure 4] FIG. 2 is an explanatory diagram showing pattern-forming surfaces of first to third dielectric layers in a laminate of a multilayer electronic component according to one embodiment of the present invention. [Figure 5] FIG. 2 is an explanatory diagram showing pattern-forming surfaces of fourth to sixth dielectric layers in a laminate of a multilayer electronic component according to one embodiment of the present invention. [Figure 6] FIG. 2 is an explanatory diagram showing pattern-forming surfaces of seventh to ninth dielectric layers in a laminate of a multilayer electronic component according to one embodiment of the present invention. [Figure 7] FIG. 2 is an explanatory diagram showing pattern-forming surfaces of the 10th to 12th dielectric layers in the laminate of the multilayer electronic component according to the embodiment of the present invention. [Figure 8] FIG. 2 is an explanatory diagram showing pattern-forming surfaces of thirteenth to fifteenth dielectric layers in a laminate of a multilayer electronic component according to one embodiment of the present invention. [Figure 9] FIG. 2 is an explanatory diagram showing pattern-forming surfaces of 16th to 18th dielectric layers in a laminate of a multilayer electronic component according to one embodiment of the present invention. [Figure 10]FIG. 2 is an explanatory diagram showing pattern-forming surfaces of the 19th to 22nd dielectric layers in the laminate of the multilayer electronic component according to the embodiment of the present invention. [Figure 11] FIG. 2 is an explanatory diagram showing pattern-forming surfaces of 23rd to 25th dielectric layers in a laminate of a multilayer electronic component according to one embodiment of the present invention. [Figure 12] FIG. 2 is an explanatory diagram showing pattern-forming surfaces of the 26th and 27th dielectric layers in the laminate of the multilayer electronic component according to the embodiment of the present invention. [Figure 13] 1 is a perspective view showing an interior of a laminate of a multilayer electronic component according to an embodiment of the present invention; [Figure 14] 1 is a plan view showing a part of the interior of a laminate of a multilayer electronic component according to an embodiment of the present invention. [Figure 15] FIG. 4 is a plan view showing another part of the interior of the laminate of the multilayer electronic component according to the embodiment of the present invention. DETAILED DESCRIPTION OF THE INVENTION

[0011] Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. First, with reference to FIG. 1, a schematic configuration of a multilayer electronic component (hereinafter simply referred to as electronic component) 1 according to an embodiment of the present invention will be described. FIG. 1 is a circuit diagram showing the circuit configuration of the electronic component 1. FIG. 1 shows a branching filter (diplexer) as an example of the electronic component 1. The electronic component 1 includes a common terminal 2, a first signal terminal 3, a second signal terminal 4, a first circuit 10, and a second circuit 20.

[0012] In terms of the circuit configuration, the first circuit 10 is provided between the common terminal 2 and the first signal terminal 3. In terms of the circuit configuration, the second circuit 20 is provided between the common terminal 2 and the second signal terminal 4. In this application, the expression "in terms of the circuit configuration" is used to refer to the arrangement on a circuit diagram, not the arrangement in a physical configuration.

[0013] The first circuit 10 is a filter configured to selectively pass signals having frequencies within a first passband. The second circuit 20 is a filter configured to selectively pass signals having frequencies within a second passband different from the first passband. Each of the first and second circuits 10 and 20 is configured as an LC filter circuit including at least one inductor and at least one capacitor. In this embodiment, both the first and second circuits 10 and 20 are bandpass filters. In addition, in this embodiment, the first passband is a frequency band lower than the second passband.

[0014] A first signal having a frequency within a first passband that is input to the common terminal 2 selectively passes through the first circuit 10 and is output from the first signal terminal 3. A second signal having a frequency within a second passband that is input to the common terminal 2 selectively passes through the second circuit 20 and is output from the second signal terminal 4. In this way, the electronic component 1 separates the first and second signals.

[0015] Next, an example of the circuit configuration of the electronic component 1 will be described with reference to Fig. 1. The electronic component 1 further includes an inductor L10 having one end connected to the common terminal 2.

[0016] The first circuit 10 includes inductors L11, L12, L13, and L14, and capacitors C11, C12, C13, C14, C15, C16, C17, C18, and C19.

[0017] One end of inductor L11 is connected to the other end of inductor L10. One end of capacitor C11 is connected to the other end of inductor L11. One end of capacitor C12 is connected to the other end of capacitor C11. One end of capacitor C13 is connected to one end of capacitor C11. The other end of capacitor C13 is connected to the other end of capacitor C12.

[0018] One end of the capacitor C14 is connected to one end of the capacitor C11. One end of the inductor L12 is connected to the connection point between the capacitors C11 and C12. One end of the capacitor C15 is connected to the other end of the capacitor C12. The other ends of the inductor L12 and the capacitors C14 and C15 are connected to ground.

[0019] One end of inductor L13 is connected to the other end of capacitor C12. One end of inductor L14 is connected to the other end of inductor L13. The other end of inductor L14 is connected to the first signal terminal 3. Capacitor C16 is connected in parallel to inductor L13. Capacitor C17 is connected in parallel to inductor L14.

[0020] The capacitor C18 is connected to the connection point between the inductor L13 and the inductor L14. One end of the capacitor C19 is connected to the other end of the inductor L14. The other ends of the capacitors C18 and C19 are connected to ground.

[0021] The second circuit 20 includes inductors L21, L22, L23, L24, L25, and L26, and capacitors C21, C22, C23, C24, C25, C26, C27, C28, C29, C30, C31, C32, and C33.

[0022] One end of inductor L21 is connected to one end of capacitor C21. One end of inductor L22 is connected to one end of capacitor C22. One end of inductor L23 is connected to one end of capacitor C23. One end of inductor L24 is connected to one end of capacitor C24. One end of inductor L25 is connected to one end of capacitor C25. The other ends of inductors L21 to L25 and capacitors C21 to C25 are connected to ground.

[0023] One end of capacitor C26 is connected to the other end of inductor L10. The other end of capacitor C26, one end of capacitor C27, one end of capacitor C28, and one end of capacitor C31 are connected to one end of inductor L21. The other end of capacitor C27 and one end of capacitor C29 are connected to one end of inductor L22. The other end of capacitor C28, one end of capacitor C30, and one end of capacitor C32 are connected to one end of inductor L23. The other end of capacitor C30 and the other end of capacitor C31 are connected to one end of inductor L24. The other end of capacitor C29, the other end of capacitor C32, and one end of capacitor C33 are connected to one end of inductor L25.

[0024] One end of the inductor L26 is connected to the other end of the capacitor C33, and the other end of the inductor L26 is connected to the second signal terminal 4.

[0025] Next, other configurations of the electronic component 1 will be described with reference to Figures 2 and 3. Figure 2 is a perspective view showing the appearance of the electronic component 1. Figure 3 is a perspective view showing the laminate of the electronic component 1.

[0026] The electronic component 1 includes a laminate 50. The laminate 50 includes a plurality of laminated dielectric layers and a plurality of conductors (a plurality of conductor layers and a plurality of through holes). The common terminal 2, the first signal terminal 3, the second signal terminal 4, the first circuit 10, and the second circuit 20 are integrated into the laminate 50.

[0027] The laminate 50 has a first surface 50A and a second surface 50B located at both ends of the stacking direction T of the multiple dielectric layers, and four side surfaces 50C to 50F connecting the first surface 50A and the second surface 50B. The side surfaces 50C and 50D face in opposite directions from each other, and the side surfaces 50E and 50F also face in opposite directions from each other. The side surfaces 50C to 50F may be perpendicular to the first surface 50A and the second surface 50B.

[0028] Here, the X direction, Y direction, and Z direction are defined as shown in FIGS. 2 and 3. The X direction, Y direction, and Z direction are perpendicular to each other. In this embodiment, a direction parallel to the stacking direction T is defined as the Z direction. The direction opposite to the X direction is defined as the -X direction, the direction opposite to the Y direction is defined as the -Y direction, and the direction opposite to the Z direction is defined as the -Z direction. The expression "when viewed from a predetermined direction (e.g., stacking direction T)" means that the object is viewed from a position away from the predetermined direction or a direction parallel to the predetermined direction.

[0029] As shown in FIG. 3, the first surface 50A is located at the end of the laminate 50 in the -Z direction. The first surface 50A is also the bottom surface of the laminate 50. The second surface 50B is located at the end of the laminate 50 in the Z direction. The second surface 50B is also the top surface of the laminate 50. The side surface 50C is located at the end of the laminate 50 in the -X direction. The side surface 50D is located at the end of the laminate 50 in the X direction. The side surface 50E is located at the end of the laminate 50 in the -Y direction. The side surface 50F is located at the end of the laminate 50 in the Y direction.

[0030] As shown in FIGS. 2 and 3 , the electronic component 1 further includes electrodes 111, 112, and 113 provided on the first surface 50A of the laminate 50. The electrode 111 is located closer to the side surface 50E than to the side surface 50F. The electrodes 112 and 113 are located closer to the side surface 50F than to the side surface 50E. The electrode 112 is located near the corner where the side surface 50D intersects with the side surface 50F, and the electrode 113 is located near the corner where the side surface 50C intersects with the side surface 50F. The electrode 111 corresponds to the common terminal 2, the electrode 112 corresponds to the first signal terminal 3, and the electrode 113 corresponds to the second signal terminal 4. Therefore, the common terminal 2 and the first and second signal terminals 3 and 4 are provided on the first surface 50A of the laminate 50.

[0031] The electronic component 1 further includes ground terminals 114, 115, and 116 provided on the first surface 50A of the laminate 50. The ground terminal 114 is disposed between the electrode 112 and the electrode 113. The ground terminal 115 is disposed between the electrode 111 and the side surface 50D. The ground terminal 116 is disposed between the electrode 111 and the side surface 50C. Each of the ground terminals 114, 115, and 116 is connected to ground.

[0032] The electronic component 1 further includes a shielding conductor 80 made of a conductor and integrated with the laminate 50. The shielding conductor 80 is provided on at least one of the four side surfaces 50C to 50F. In the present embodiment, the shielding conductor 80 includes a first conductor portion 80E provided on the side surface 50E of the laminate 50 and a second conductor portion 80F provided on the side surface 50F of the laminate 50. The first conductor portion 80E covers the entirety or almost the entirety of the side surface 50E. The second conductor portion 80F covers the entirety or almost the entirety of the side surface 50F.

[0033] The shield conductor 80 further includes a conductor portion 80B provided on the second surface 50B of the laminate 50, a conductor portion 80C provided on the side surface 50C of the laminate 50, and a conductor portion 80D provided on the side surface 50D of the laminate 50. The conductor portion 80B covers the entire second surface 50B. The conductor portion 80C covers the entire or almost the entire side surface 50C. The conductor portion 80D covers the entire or almost the entire side surface 50D.

[0034] The shield conductor 80 may include multiple laminated metal layers. In this case, the first conductor portion 80E, the second conductor portion 80F, and the conductor portions 80B, 80C, and 80D are preferably continuous. That is, the first and second conductor portions 80E and 80F are preferably connected to the conductor portions 80B, 80C, and 80D, respectively.

[0035] The shielding conductor 80 is electrically connected to the ground terminals 114, 115, and 116. The laminate 50 includes a plurality of conductors that electrically connect the shielding conductor 80 and the ground terminals 114, 115, and 116.

[0036] Next, an example of the plurality of dielectric layers and the plurality of conductors constituting the laminate 50 will be described with reference to Figures 4(a) to 12(b). In this example, the laminate 50 includes 27 laminated dielectric layers. Hereinafter, these 27 dielectric layers will be referred to as the 1st to 27th dielectric layers, in order from the bottom up. The 1st to 27th dielectric layers will be denoted by reference numerals 51 to 77.

[0037] In Figures 4(a) to 12(a), multiple circles represent multiple through holes. Multiple through holes are formed in each of the dielectric layers 51 to 76. The multiple through holes are formed by filling holes for the through holes with conductive paste. Each of the multiple through holes is connected to an electrode, a terminal, a conductive layer, or another through hole. In the following explanation, the connection relationship between each of the multiple through holes and the electrodes, terminals, conductive layers, or other through holes is explained in terms of the connection relationship when the first to 27th dielectric layers 51 to 77 are stacked. Also, in Figures 4(a) to 12(a), multiple specific through holes among the multiple through holes are each assigned a reference symbol.

[0038] 4(a) shows the pattern-formed surface of the first dielectric layer 51. On the pattern-formed surface of the dielectric layer 51, electrodes 111 to 113 and ground terminals 114 to 116 are formed.

[0039] In FIG. 4(a), two through holes denoted by reference numerals 51T6 and 51T7 are connected to a ground terminal 115. In the following description, the through hole denoted by reference numeral 51T6 will be simply referred to as the through hole 51T6. Furthermore, through holes denoted by reference numerals other than the through hole 51T6 will be referred to in the same manner as the through hole 51T6. The two through holes 51T8 shown in FIG. 4(a) are connected to a ground terminal 114. The two through holes 51T9 shown in FIG. 4(a) are connected to a ground terminal 116.

[0040] 4(b) shows the pattern-formed surface of the second dielectric layer 52. Conductor layers 521, 522, 523, 524, and 525 are formed on the pattern-formed surface of the dielectric layer 52. The through-hole 51T6 and the through-hole 52T6 shown in FIG. 4(b) are connected to the conductor layer 524. The through-hole 51T7 and the through-hole 52T7 shown in FIG. 4(b) are connected to the conductor layer 525. The two through-holes 51T8 and the two through-holes 51T9 are connected to the two through-holes 52T8 and the two through-holes 52T9 shown in FIG. 4(b), respectively.

[0041] FIG. 4(c) shows the pattern-formed surface of the third dielectric layer 53. Conductor layers 531, 532, and 533 are formed on the pattern-formed surface of the dielectric layer 53. The through-hole 52T6 is connected to the through-hole 53T6 shown in FIG. 4(c). The through-hole 52T7, the two through-holes 52T8, and the through-holes 53T1b, 53T10, and 53T11 shown in FIG. 4(c) are connected to the conductor layer 533. The two through-holes 52T9 are connected to the two through-holes 53T9 shown in FIG. 4(c).

[0042] FIG. 5(a) shows the pattern-formed surface of the fourth dielectric layer 54. Conductor layers 541, 542, 543, 544, and 545 are formed on the pattern-formed surface of the dielectric layer 54. The through holes 53T1b and 53T11 and the through holes 54T1b and 54T11 shown in FIG. 5(a) are connected to the conductor layer 542. The through hole 53T6 is connected to the through hole 54T6 shown in FIG. 5(a). The two through holes 53T9 are connected to the two through holes 54T9 shown in FIG. 5(a). The through hole 53T10 and the through hole 54T10 shown in FIG. 5(a) are connected to the conductor layer 545.

[0043] FIG. 5(b) shows the pattern-formed surface of the fifth dielectric layer 55. Conductor layers 551, 552, 553, 554, and 555 are formed on the pattern-formed surface of the dielectric layer 55. The two through holes 54T9 are connected to the two through holes 55T9 shown in FIG. 5(b). The through holes 54T1b, 54T6, 54T10, and 54T11 are connected to the through holes 55T1b, 55T6, 55T10, and 55T11 shown in FIG. 5(b), respectively. The through hole 55T5a shown in FIG. 5(b) is connected to the conductor layer 551.

[0044] 5(c) shows the pattern-formed surface of the sixth dielectric layer 56. Conductor layers 561, 562, 563, and 564 are formed on the pattern-formed surface of the dielectric layer 56. The through holes 55T1b, 55T5a, 55T6, and 55T11 are connected to the through holes 56T1b, 56T5a, 56T6, and 56T11 shown in FIG. 5(c), respectively. The two through holes 55T9, the through hole 55T10, and the through hole 56T5b shown in FIG. 5(c) are connected to the conductor layer 561.

[0045] Fig. 6(a) shows the pattern-forming surface of the seventh dielectric layer 57. Conductor layers 571, 572, 573, 574, and 575 are formed on the pattern-forming surface of the dielectric layer 57. The through-holes 56T1b, 56T5a, 56T5b, 56T6, and 56T11 are connected to the through-holes 57T1b, 57T5a, 57T5b, 57T6, and 57T11 shown in Fig. 6(a), respectively. The through-holes 57T2a and 57T4a shown in Fig. 6(a) are connected to the conductor layers 572 and 571, respectively.

[0046] Fig. 6(b) shows the pattern formation surface of the eighth dielectric layer 58. Conductor layers 581, 582, and 583 are formed on the pattern formation surface of the dielectric layer 58. Through holes 57T1b, 57T2a, 57T4a, 57T5a, 57T5b, 57T6, and 57T11 are connected to through holes 58T1b, 58T2a, 58T4a, 58T5a, 58T5b, 58T6, and 58T11 shown in Fig. 6(b), respectively.

[0047] FIG. 6(c) shows the pattern-formed surface of the ninth dielectric layer 59. Conductor layers 591, 592, and 593 are formed on the pattern-formed surface of the dielectric layer 59. Through holes 58T1b, 58T2a, 58T4a, 58T5a, 58T5b, 58T6, and 58T11 are connected to through holes 59T1b, 59T2a, 59T4a, 59T5a, 59T5b, 59T6, and 59T11 shown in FIG. 6(c), respectively. Through hole 59T1a shown in FIG. 6(c) is connected to conductor layer 592.

[0048] FIG. 7(a) shows the pattern-formed surface of the tenth dielectric layer 60. Conductor layers 601, 602, 603, 604, and 605 are formed on the pattern-formed surface of the dielectric layer 60. The through holes 59T1a, 59T2a, 59T4a, and 59T5b are connected to the through holes 60T1a, 60T2a, 60T4a, and 60T5b shown in FIG. 7(a), respectively. The through holes 59T1b and 59T11 and the through holes 60T1b and 60T11 shown in FIG. 7(a) are connected to the conductor layer 602. The through hole 59T5a and the through hole 60T5a shown in FIG. 7(a) are connected to the conductor layer 601. The through hole 59T6 and the through hole 60T6 shown in FIG. 7(a) are connected to the conductor layer 604. The conductor layer 602 is connected to the second conductor portion 80F (see FIG. 2) of the shield conductor 80. The conductor layer 604 is connected to the first conductor portion 80E (see FIG. 2) of the shield conductor 80.

[0049] FIG. 7(b) shows the pattern-formed surface of the eleventh dielectric layer 61. Conductor layers 611, 612, 613, and 614 are formed on the pattern-formed surface of the dielectric layer 61. The through holes 60T1a, 60T2a, 60T4a, 60T5a, and 60T6 are connected to the through holes 61T1a, 61T2a, 61T4a, 61T5a, and 61T6 shown in FIG. 7(b), respectively. The through holes 60T1b and 60T11 and the through hole 61T1b shown in FIG. 7(b) are connected to the conductor layer 613. The through hole 61T3a shown in FIG. 7(b) is connected to the conductor layer 612. The through hole 60T5b and the through holes 61T4b and 61T5b shown in FIG. 7(b) are connected to the conductor layer 614. The conductor layer 614 is connected to the first conductor portion 80E of the shield conductor 80 (see FIG. 2).

[0050] Fig. 7(c) shows the pattern formation surface of the twelfth dielectric layer 62. Conductor layers 621 and 622 are formed on the pattern formation surface of the dielectric layer 62. Through holes 61T1a, 61T1b, 61T2a, 61T3a, 61T4a, 61T4b, 61T5a, 61T5b, and 61T6 are connected to through holes 62T1a, 62T1b, 62T2a, 62T3a, 62T4a, 62T4b, 62T5a, 62T5b, and 62T6 shown in Fig. 7(c), respectively.

[0051] Fig. 8(a) shows the patterned surface of the 13th dielectric layer 63. Through holes 62T1a, 62T1b, 62T2a, 62T3a, 62T4a, 62T4b, 62T5a, 62T5b, and 62T6 are connected to through holes 63T1a, 63T1b, 63T2a, 63T3a, 63T4a, 63T4b, 63T5a, 63T5b, and 63T6 shown in Fig. 8(a), respectively.

[0052] Fig. 8(b) shows the patterned surface of the 14th dielectric layer 64. The through holes 63T1a, 63T1b, 63T2a, 63T3a, 63T4a, 63T4b, 63T5a, 63T5b, and 63T6 are connected to the through holes 64T1a, 64T1b, 64T2a, 64T3a, 64T4a, 64T4b, 64T5a, 64T5b, and 64T6 shown in Fig. 8(b), respectively.

[0053] 8(c) shows the pattern formation surface of the 15th dielectric layer 65. Conductor layers 651 and 652 are formed on the pattern formation surface of the dielectric layer 65. The through holes 64T1a, 64T2a, 64T3a, 64T4a, 64T4b, 64T5a, 64T5b, and 64T6 are connected to the through holes 65T1a, 65T2a, 65T3a, 65T4a, 65T4b, 65T5a, 65T5b, and 65T6 shown in FIG. 8(c), respectively. The through hole 64T1b and the through holes 65T1b and 65T3b shown in FIG. 8(c) are connected to the conductor layer 651.

[0054] 9(a) shows the pattern formation surface of the 16th dielectric layer 66. A conductor layer 661 is formed on the pattern formation surface of the dielectric layer 66. The through holes 65T1a, 65T1b, 65T2a, 65T3a, 65T3b, 65T4a, 65T4b, 65T5a, and 65T5b are connected to the through holes 66T1a, 66T1b, 66T2a, 66T3a, 66T3b, 66T4a, 66T4b, 66T5a, and 66T5b shown in FIG. 9(a), respectively. The through hole 65T6 is connected to the conductor layer 661.

[0055] 9(b) shows the pattern formation surface of the 17th dielectric layer 67. Conductor layers 671 and 672 are formed on the pattern formation surface of the dielectric layer 67. Through holes 66T1a, 66T1b, 66T2a, 66T3a, 66T3b, 66T4a, 66T4b, 66T5a, and 66T5b are connected to through holes 67T1a, 67T1b, 67T2a, 67T3a, 67T3b, 67T4a, 67T4b, 67T5a, and 67T5b shown in FIG. 9(b), respectively.

[0056] 9(c) shows the pattern formation surface of the 18th dielectric layer 68. Conductor layers 681 and 682 are formed on the pattern formation surface of the dielectric layer 68. Through holes 67T1a, 67T1b, 67T2a, 67T3a, 67T3b, 67T4a, 67T4b, 67T5a, and 67T5b are connected to through holes 68T1a, 68T1b, 68T2a, 68T3a, 68T3b, 68T4a, 68T4b, 68T5a, and 68T5b shown in FIG.

[0057] Fig. 10(a) shows the pattern formation surface of the 19th dielectric layer 69. Conductor layers 691 and 692 are formed on the pattern formation surface of the dielectric layer 69. Through holes 68T1a, 68T1b, 68T2a, 68T3a, 68T3b, 68T4a, 68T4b, 68T5a, and 68T5b are connected to through holes 69T1a, 69T1b, 69T2a, 69T3a, 69T3b, 69T4a, 69T4b, 69T5a, and 69T5b shown in Fig. 10(a), respectively.

[0058] 10(b) shows the pattern-formed surfaces of the 20th and 21st dielectric layers 70 and 71. The through holes 69T1a, 69T1b, 69T2a, 69T3a, 69T3b, 69T4a, 69T4b, 69T5a, and 69T5b are respectively connected to through holes 70T1a, 70T1b, 70T2a, 70T3a, 70T3b, 70T4a, 70T4b, 70T5a, and 70T5b formed in the dielectric layer 70. Furthermore, in the dielectric layers 70 and 71, adjacent through holes with the same reference numeral are connected to each other.

[0059] Fig. 10(c) shows the pattern formation surface of the 22nd dielectric layer 72. A conductor layer 721 is formed on the pattern formation surface of the dielectric layer 72. Through holes 70T1a, 70T1b, 70T2a, 70T3a, 70T3b, 70T4a, 70T4b, 70T5a, and 70T5b formed in the dielectric layer 71 are connected to through holes 72T1a, 72T1b, 72T2a, 72T3a, 72T3b, 72T4a, 72T4b, 72T5a, and 72T5b shown in Fig. 10(c), respectively.

[0060] Fig. 11(a) shows the pattern formation surface of the 23rd dielectric layer 73. A conductor layer 731 is formed on the pattern formation surface of the dielectric layer 73. The through holes 72T1a, 72T1b, 72T2a, 72T3a, 72T3b, 72T4a, 72T4b, 72T5a, and 72T5b are connected to the through holes 73T1a, 73T1b, 73T2a, 73T3a, 73T3b, 73T4a, 73T4b, 73T5a, and 73T5b shown in Fig. 11(a), respectively.

[0061] FIG. 11(b) shows the pattern-formed surface of the 24th dielectric layer 74. A conductor layer 741 is formed on the pattern-formed surface of the dielectric layer 74. The through holes 73T1a, 73T1b, 73T2a, 73T3a, 73T3b, 73T4a, and 73T5a are connected to the through holes 74T1a, 74T1b, 74T2a, 74T3a, 74T3b, 74T4a, and 74T5a shown in FIG. 11(b), respectively. The through holes 73T4b and 73T5b and the through holes 74T4b and 74T5b shown in FIG. 11(b) are connected to the conductor layer 741. The conductor layer 741 is connected to the first conductor portion 80E (see FIG. 2) of the shield conductor 80.

[0062] FIG. 11(c) shows the pattern-formed surface of the 25th dielectric layer 75. A conductor layer 751 is formed on the pattern-formed surface of the dielectric layer 75. The through holes 74T1a, 74T2a, 74T3a, 74T4a, 74T4b, 74T5a, and 74T5b are connected to the through holes 75T1a, 75T2a, 75T3a, 75T4a, 75T4b, 75T5a, and 75T5b shown in FIG. 11(c), respectively. The through holes 74T1b and 74T3b and the through holes 75T1b and 75T3b shown in FIG. 11(c) are connected to the conductor layer 751. The conductor layer 751 is connected to the second conductor portion 80F of the shield conductor 80 (see FIG. 2).

[0063] Figure 12(a) shows the pattern formation surface of the 26th dielectric layer 76. Conductor layers 761, 762, 763, 764, and 765 are formed on the pattern formation surface of the dielectric layer 76. The conductor layer 764 is connected to the conductor layer 762. In Figure 12(a), the boundary between the conductor layer 762 and the conductor layer 764 is indicated by a dotted line.

[0064] The conductor layer 761 has a first end 761a and a second end 761b located at both ends of the conductor layer 761 in the longitudinal direction. The conductor layer 762 has a first end 762a and a second end 762b located at both ends of the conductor layer 762 in the longitudinal direction. The conductor layer 763 has a first end 763a and a second end 763b located at both ends of the conductor layer 763 in the longitudinal direction. The conductor layer 764 has a first end 764a and a second end 764b located at both ends of the conductor layer 764 in the longitudinal direction. The conductor layer 765 has a first end 765a and a second end 765b located at both ends of the conductor layer 765 in the longitudinal direction.

[0065] A first end 761a of the conductor layer 761, a second end 762b of the conductor layer 762, a first end 763a of the conductor layer 763, a second end 764b of the conductor layer 764, and a second end 765b of the conductor layer 765 are located closer to the first conductor portion 80E of the shield conductor 80 (lower positions in FIG. 12(a)) than the second conductor portion 80F of the shield conductor 80. The second end 761b of the conductor layer 761, a first end 762a of the conductor layer 762, a second end 763b of the conductor layer 763, a first end 764a of the conductor layer 764, and a first end 765a of the conductor layer 765 are located closer to the second conductor portion 80F of the shield conductor 80 (upper positions in FIG. 12(a)). The second end 762b of the conductor layer 762 is connected to a portion of the conductor layer 764 near the second end 764b.

[0066] The through hole 75T1a and the through hole 76T1a shown in FIG. 12(a) are connected to a portion near the first end 761a of the conductor layer 761. The through hole 75T1b and the through hole 76T1b shown in FIG. 12(a) are connected to a portion near the second end 761b of the conductor layer 761. The through hole 75T2a and the through hole 76T2a shown in FIG. 12(a) are connected to a portion near the first end 762a of the conductor layer 762. The through hole 75T3a and the through hole 76T3a shown in FIG. 12(a) are connected to a portion near the first end 763a of the conductor layer 763. The through hole 75T3b and the through hole 76T3b shown in FIG. 12(a) are connected to a portion near the second end 763b of the conductor layer 763. The through hole 75T4a and the through hole 76T4a shown in FIG. 12(a) are connected to a portion near the first end 764a of the conductor layer 764. The through hole 75T4b and the through hole 76T4b shown in FIG. 12(a) are connected to a portion near the second end 764b of the conductor layer 764. The through hole 75T5a and the through hole 76T5a shown in FIG. 12(a) are connected to a portion near the first end 765a of the conductor layer 765. The through hole 75T5b and the through hole 76T5b shown in FIG. 12(a) are connected to a portion near the second end 765b of the conductor layer 765.

[0067] Figure 12(b) shows the pattern formation surface of the 27th dielectric layer 77. Conductor layers 771, 772, 773, 774, and 775 are formed on the pattern formation surface of the dielectric layer 77. The conductor layer 774 is connected to the conductor layer 772. In Figure 12(b), the boundary between the conductor layer 772 and the conductor layer 774 is indicated by a dotted line.

[0068] The conductor layer 771 has a first end 771a and a second end 771b located at both ends of the conductor layer 771 in the longitudinal direction. The conductor layer 772 has a first end 772a and a second end 772b located at both ends of the conductor layer 772 in the longitudinal direction. The conductor layer 773 has a first end 773a and a second end 773b located at both ends of the conductor layer 773 in the longitudinal direction. The conductor layer 774 has a first end 774a and a second end 774b located at both ends of the conductor layer 774 in the longitudinal direction. The conductor layer 775 has a first end 775a and a second end 775b located at both ends of the conductor layer 775 in the longitudinal direction.

[0069] The first end 771a of the conductor layer 771, the second end 772b of the conductor layer 772, the first end 773a of the conductor layer 773, the second end 774b of the conductor layer 774, and the second end 775b of the conductor layer 775 are located closer to the first conductor portion 80E of the shield conductor 80 (lower positions in FIG. 12(b)) than the second conductor portion 80F of the shield conductor 80. The second end 771b of the conductor layer 771, the first end 772a of the conductor layer 772, the second end 773b of the conductor layer 773, the first end 774a of the conductor layer 774, and the first end 775a of the conductor layer 775 are located closer to the second conductor portion 80F of the shield conductor 80 (upper positions in FIG. 12(b)). The second end 772b of the conductor layer 772 is connected to a portion of the conductor layer 774 near the second end 774b.

[0070] The through hole 76T1a is connected to a portion of the conductor layer 771 near the first end 771a. The through hole 76T1b is connected to a portion of the conductor layer 771 near the second end 771b. The through hole 76T2a is connected to a portion of the conductor layer 772 near the first end 772a. The through hole 76T3a is connected to a portion of the conductor layer 773 near the first end 773a. The through hole 76T3b is connected to a portion of the conductor layer 773 near the second end 773b. The through hole 76T4a is connected to a portion of the conductor layer 774 near the first end 774a. The through hole 76T4b is connected to a portion of the conductor layer 774 near the second end 774b. The through hole 76T5a is connected to a portion of the conductor layer 775 near the first end 775a. The through hole 76T5b is connected to a portion of the conductor layer 775 near the second end 775b.

[0071] The laminate 50 shown in Figure 3 is formed by stacking the first to 27th dielectric layers 51 to 77 so that the pattern-forming surface of the first dielectric layer 51 becomes the first surface 50A of the laminate 50, and the surface opposite the pattern-forming surface of the 27th dielectric layer 77 becomes the second surface 50B of the laminate 50.

[0072] Fig. 13 shows the inside of the laminate 50, which is formed by stacking the 1st to 27th dielectric layers 51 to 77. As shown in Fig. 13, inside the laminate 50, the multiple conductor layers and multiple through holes shown in Figs. 4(a) to 12(b) are stacked.

[0073] The following describes the correspondence between the components of the circuit of the electronic component 1 shown in Fig. 1 and the components inside the laminate 50 shown in Fig. 4(a) to Fig. 12(b). The conductor layer 652 forms at least a part of the inductor L10.

[0074] Next, the first circuit 10 will be described. The conductor layers 721 and 731 and the through holes connecting these conductor layers form at least a part of the inductor L11. The conductor layers 661, 671, 681, and 691 and the multiple through holes connecting these conductor layers form at least a part of the inductor L12. The conductor layers 672, 682, and 692 and the multiple through holes connecting these conductor layers form at least a part of the inductor L13. The conductor layers 611 and 621 and the through holes connecting these conductor layers form at least a part of the inductor L14.

[0075] The conductor layers 563 and 573 and the dielectric layer 56 between these conductor layers constitute at least a portion of the capacitor C11. The conductor layers 573 and 583 and the dielectric layer 57 between these conductor layers constitute at least a portion of the capacitor C12. The conductor layers 583 and 593 and the dielectric layer 58 between these conductor layers constitute at least a portion of the capacitor C13. The conductor layers 533 and 544 and the dielectric layer 53 between these conductor layers constitute at least a portion of the capacitor C14.

[0076] The conductor layers 543 and 553 and the dielectric layer 54 between these conductor layers constitute at least a portion of the capacitor C15. The conductor layers 532 and 543 and the dielectric layer 53 between these conductor layers constitute at least a portion of the capacitor C16. The conductor layers 523 and 532 and the dielectric layer 52 between these conductor layers constitute at least a portion of the capacitor C17. The conductor layers 532 and 533 constitute at least a portion of the capacitor C18. The conductor layers 553 and 562 and the dielectric layer 55 between these conductor layers constitute at least a portion of the capacitor C19.

[0077] Next, the components of the second circuit 20 will be described. Conductor layers 592, 761, and 771 and through holes 53T1b, 54T1b, 55T1b, 56T1b, 57T1b, 58T1b, 59T1a, 59T1b, 60T1a, 60T1b, 61T1a, 61T1b, 62T1a, 62T1b, 63T1a, 63T1b, 64T1a, 64T1b, 65T1a, 65T1b, 6 6T1a, 66T1b, 67T1a, 67T1b, 68T1a, 68T1b, 69T1a, 69T1b, 70T1a, 70T1b, 72T1a, 72T1b, 73T1a, 73T1b, 74T1a, 74T1b, 75T1a, 75T1b, 76T1a, and 76T1b form at least a part of inductor L21.

[0078] The conductor layers 762 and 772 and the through holes 57T2a, 58T2a, 59T2a, 60T2a, 61T4b, 61T2a, 62T4b, 62T2a, 63T4b, 63T2a, 64T4b, 64T2a, 65T4b, 65T2a, 66T4b, 66T2a, 67T4b, 67T2a, 68T4b, 68T2a, 69T4b, 69T2a, 70T4b, 70T2a, 72T4b, 72T2a, 73T4b, 73T2a, 74T4b, 74T2a, 75T4b, 75T2a, 76T4b, and 76T2a form at least a part of the inductor L22.

[0079] Conductor layers 763 and 773 and through holes 61T3a, 62T3a, 63T3a, 64T3a, 65T3a, 65T3b, 66T3a, 66T3b, 67T3a, 67T3b, 68T3a, 68T3b, 69T3a, 69T3b, 70T3a, 70T3b, 72T3a, 72T3b, 73T3a, 73T3b, 74T3a, 74T3b, 75T3a, 75T3b, 76T3a, and 76T3b form at least a part of inductor L23.

[0080] Conductor layers 764 and 774 and through holes 57T4a, 58T4a, 59T4a, 60T4a, 61T4a, 61T4b, 62T4a, 62T4b, 63T4a, 63T4b, 64T4a, 64T4b, 65T4a, 65T4b, 66T4a, 66T4b, 67T4a, 67T4b, 68T4a, 68T4b, 69T4a, 69T4b, 70T4a, 70T4b, 72T4a, 72T4b, 73T4a, 73T4b, 74T4a, 74T4b, 75T4a, 75T4b, 76T4a, and 76T4b form at least a part of inductor L24.

[0081] Conductor layers 765 and 775, and through holes 55T5a, 56T5a, 56T5b, 57T5a, 57T5b, 58T5a, 58T5b, 59T5a, 59T5b, 60T5a, 60T5b, 61T5a, 61T5b, 62T5a, 62T5b, 63T5a, 63T5b, 64T5a, 64T5b, 65T5a, 65T5b, 66T5a, 66T5b, 67T5a, 67T5b, 68T5a, 68T5b, 69T5a, 69T5b, 70T5a, 70T5b, 72T5a, 72T5b, 73T5a, 73T5b, 74T5a, 74T5b, 75T5a, 75T5b, 76T5a, and 76T5b form at least a part of inductor L25.

[0082] The conductor layer 522 forms at least a part of the inductor L26.

[0083] The conductor layers 561 and 564 constitute at least a part of the capacitor C21. The conductor layers 533 and 552 and the dielectric layers 53 and 54 between these conductor layers constitute at least a part of the capacitor C22. The conductor layers 561 and 575 and the dielectric layer 56 between these conductor layers constitute at least a part of the capacitor C23. The conductor layers 561 and 571 and the dielectric layer 56 between these conductor layers constitute at least a part of the capacitor C24. The conductor layers 551 and 561 and the dielectric layer 55 between these conductor layers constitute at least a part of the capacitor C25.

[0084] Conductor layers 555, 564, 574, and 582 and the dielectric layers 55, 56, and 57 between these conductor layers constitute at least a portion of capacitor C26. Conductor layers 572 and 582 and the dielectric layer 57 between these conductor layers constitute at least a portion of capacitor C27. Conductor layers 575 and 582 and the dielectric layer 57 between these conductor layers constitute at least a portion of capacitor C28. Conductor layers 541 and 552 and the dielectric layer 54 between these conductor layers constitute at least a portion of capacitor C29.

[0085] The conductor layers 571 and 581 and the dielectric layer 57 between these conductor layers constitute at least a part of the capacitor C30. The conductor layers 571 and 582 and the dielectric layer 57 between these conductor layers constitute at least a part of the capacitor C31. The conductor layers 581 and 591 and the dielectric layer 58 between these conductor layers constitute at least a part of the capacitor C32. The conductor layers 531 and 541 and the dielectric layer 53 between these conductor layers constitute at least a part of the capacitor C33.

[0086] Next, structural features of electronic component 1 according to this embodiment will be described with reference to Figs. 1 to 15. First, the configuration of inductors L21 to L25 of second circuit 20 will be described in detail. Fig. 14 is a plan view showing a portion of the interior of electronic component 1. Fig. 15 is a plan view showing another portion of the interior of electronic component 1. Fig. 14 shows a portion of each of inductors L21 to L25 and conductor layers 602, 614, and 751. Fig. 15 shows a portion of each of inductors L21 to L25 and conductor layers 602, 741, and 751.

[0087] The pair of inductors L24 and L25 and one of the pair of inductors L21 and L23 correspond to the pair of "first inductor" and "second inductor" in the present invention, and the other corresponds to the pair of "third inductor" and "fourth inductor" in the present invention. Furthermore, the pair of conductor layers 614 and 741 and one of the pair of conductor layers 602 and 751 correspond to the "first conductor layer" in the present invention, and the other corresponds to the "second conductor layer" in the present invention. In the following description, the pair of inductors L24 and L25 corresponds to the pair of "first inductor" and "second inductor" in the present invention, the pair of inductors L21 and L23 corresponds to the pair of "third inductor" and "fourth inductor" in the present invention, each of the conductor layers 614 and 741 corresponds to the "first conductor layer" in the present invention, and each of the conductor layers 602 and 751 corresponds to the "second conductor layer" in the present invention.

[0088] Each of the inductors L21 to L25 is an inductor wound around an axis extending in a direction perpendicular to the stacking direction T. Here, a columnar structure formed by connecting multiple through holes in series is called a columnar conductor. The columnar conductor extends in a direction parallel to the stacking direction T. Each of the inductors L21 to L25 includes at least one conductor layer and at least one columnar conductor.

[0089] The inductor L21 includes columnar conductors T1a and T1b extending in the stacking direction T, a conductor layer 761 connecting the columnar conductors T1a and T1b, and a conductor layer 592 connected to the columnar conductor T1a. The columnar conductor T1a is connected to a portion of the conductor layer 761 near a first end 761a. The columnar conductor T1b is connected to a portion of the conductor layer 761 near a second end 761b. The conductor layer 592 is connected to an end of the columnar conductor T1a opposite to the conductor layer 761.

[0090] The columnar conductor T1a is configured by connecting through holes 59T1a, 60T1a, 61T1a, 62T1a, 63T1a, 64T1a, 65T1a, 66T1a, 67T1a, 68T1a, 69T1a, 70T1a, 72T1a, 73T1a, 74T1a, and 75T1a in series. The columnar conductor T1b is formed by connecting through holes 53T1b, 54T1b, 55T1b, 56T1b, 57T1b, 58T1b, 59T1b, 60T1b, 61T1b, 62T1b, 63T1b, 64T1b, 65T1b, 66T1b, 67T1b, 68T1b, 69T1b, 70T1b, 72T1b, 73T1b, 74T1b, and 75T1b in series.

[0091] The columnar conductor T1b is connected to the ground terminal 114 via the conductor layer 533 and the through-hole 52T8, and is also connected to the ground terminal 115 via the conductor layer 533, the through-hole 52T7, the conductor layer 525, and the through-hole 51T7.

[0092] The inductor L21 is wound around an axis A1 perpendicular to the stacking direction T so as to form an opening surrounded by the conductor layers 592, 761 and the columnar conductors T1a, T1b. For convenience, the axis A1 is depicted in FIGS. 14 and 15 as extending in a direction parallel to the X direction, but the axis A1 may be tilted with respect to a direction parallel to the X direction.

[0093] The inductor L21 further includes a conductor layer 771 and through holes 76T1a and 76T1b that electrically connect the conductor layer 761 and the conductor layer 771 to each other.

[0094] The inductor L22 includes a columnar conductor T2a extending in the stacking direction T and a conductor layer 762 connected to the columnar conductor T2a. The columnar conductor T2a is connected to a portion of the conductor layer 762 in the vicinity of a first end 762a.

[0095] The columnar conductor T2a is formed by connecting through holes 57T2a, 58T2a, 59T2a, 60T2a, 61T2a, 62T2a, 63T2a, 64T2a, 65T2a, 66T2a, 67T2a, 68T2a, 69T2a, 70T2a, 72T2a, 73T2a, 74T2a, and 75T2a in series.

[0096] A second end 762b of the conductor layer 762 is connected to the conductor layer 764. The conductor layer 764 is connected to the pillar-shaped conductor T4b. The pillar-shaped conductor T4b is formed by connecting through holes 61T4b, 62T4b, 63T4b, 64T4b, 65T4b, 66T4b, 67T4b, 68T4b, 69T4b, 70T4b, 72T4b, 73T4b, 74T4b, and 75T4b in series. The pillar-shaped conductor T4b essentially forms a part of the inductor L22. The connection relationship between the pillar-shaped conductor T4b and the ground terminal 116 will be described later.

[0097] The inductor L22 is wound around an axis A2 perpendicular to the stacking direction T so as to form an opening surrounded by the conductor layer 762 and the columnar conductors T2a and T4b. For convenience, the axis A2 is depicted in FIGS. 14 and 15 as extending in a direction parallel to the X direction, but the axis A2 may be tilted with respect to a direction parallel to the X direction.

[0098] The inductor L22 further includes a conductor layer 772 and a through-hole 76T2a that electrically connects the conductor layer 762 and the conductor layer 772 together.

[0099] The inductor L23 includes pillar-shaped conductors T3a and T3b extending in the stacking direction T, and a conductor layer 763 connecting the pillar-shaped conductors T3a and T3b. The pillar-shaped conductor T3a is connected to a portion of the conductor layer 763 near a first end 763a. The pillar-shaped conductor T3b is connected to a portion of the conductor layer 763 near a second end 763b.

[0100] The columnar conductor T3a is formed by serially connecting through holes 61T3a, 62T3a, 63T3a, 64T3a, 65T3a, 66T3a, 67T3a, 68T3a, 69T3a, 70T3a, 72T3a, 73T3a, 74T3a, and 75T3a. The columnar conductor T3b is formed by serially connecting through holes 65T3b, 66T3b, 67T3b, 68T3b, 69T3b, 70T3b, 72T3b, 73T3b, 74T3b, and 75T3b.

[0101] The columnar conductor T3b is connected to the ground terminal 114 via the conductor layer 651, a portion of the columnar conductor T1b, the conductor layer 533, and through holes 52T8 and 51T8, and is also connected to the ground terminal 115 via the conductor layer 651, a portion of the columnar conductor T1b, the conductor layer 533, the through hole 52T7, the conductor layer 525, and the through hole 51T7.

[0102] The inductor L23 is wound around an axis A3 perpendicular to the stacking direction T so as to form an opening surrounded by the conductor layer 763 and the columnar conductors T3a and T3b. For convenience, the axis A3 is depicted in FIGS. 14 and 15 as extending in a direction parallel to the X direction, but the axis A3 may be tilted with respect to a direction parallel to the X direction.

[0103] The inductor L23 further includes a conductor layer 773 and through holes 76T3a and 76T3b that electrically connect the conductor layer 763 and the conductor layer 773 to each other.

[0104] The inductor L24 includes pillar-shaped conductors T4a and T4b extending in the stacking direction T, and a conductor layer 764 connecting the pillar-shaped conductors T4a and T4b. The pillar-shaped conductor T4a is connected to a portion of the conductor layer 764 near a first end 764a. The pillar-shaped conductor T4b is connected to a portion of the conductor layer 764 near a second end 764b.

[0105] The columnar conductor T4a is formed by connecting through holes 57T4a, 58T4a, 59T4a, 60T4a, 61T4a, 62T4a, 63T4a, 64T4a, 65T4a, 66T4a, 67T4a, 68T4a, 69T4a, 70T4a, 72T4a, 73T4a, 74T4a, and 75T4a in series.

[0106] The columnar conductor T4b is connected to the ground terminal 116 via the conductor layer 614, part of the columnar conductor T5b, the conductor layer 561, and through holes 55T9, 54T9, 53T9, 52T9, and 51T9. The configuration of the columnar conductor T5b will be described later.

[0107] The inductor L24 is wound around an axis A4 perpendicular to the stacking direction T so as to form an opening surrounded by the conductor layer 764 and the columnar conductors T4a and T4b. For convenience, the axis A4 is depicted in FIGS. 14 and 15 as extending in a direction parallel to the X direction, but the axis A4 may be tilted with respect to a direction parallel to the X direction.

[0108] The inductor L24 further includes a conductor layer 774 and through holes 76T4a and 76T4b that electrically connect the conductor layer 764 and the conductor layer 774 together.

[0109] The inductor L25 includes pillar-shaped conductors T5a and T5b extending in the stacking direction T, and a conductor layer 765 connecting the pillar-shaped conductors T5a and T5b. The pillar-shaped conductor T5a is connected to a portion of the conductor layer 765 near a first end 765a. The pillar-shaped conductor T5b is connected to a portion of the conductor layer 765 near a second end 765b.

[0110] The columnar conductor T5a is formed by connecting through holes 55T5a, 56T5a, 57T5a, 58T5a, 59T5a, 60T5a, 61T5a, 62T5a, 63T5a, 64T5a, 65T5a, 66T5a, 67T5a, 68T5a, 69T5a, 70T5a, 72T5a, 73T5a, 74T5a, and 75T5a in series. The columnar conductor T5b is formed by connecting through holes 56T5b, 57T5b, 58T5b, 59T5b, 60T5b, 61T5b, 62T5b, 63T5b, 64T5b, 65T5b, 66T5b, 67T5b, 68T5b, 69T5b, 70T5b, 72T5b, 73T5b, 74T5b, and 75T5b in series.

[0111] The columnar conductor T5b is connected to the ground terminal 116 via the conductor layer 561 and through holes 55T9, 54T9, 53T9, 52T9, and 51T9.

[0112] The inductor L25 is wound around an axis A5 perpendicular to the stacking direction T so as to form an opening surrounded by the conductor layer 765 and the columnar conductors T5a and T5b. For convenience, the axis A5 is depicted in FIGS. 14 and 15 as extending in a direction parallel to the X direction, but the axis A5 may be tilted with respect to a direction parallel to the X direction.

[0113] The inductor L25 further includes a conductor layer 775 and through holes 76T5a and 76T5b that electrically connect the conductor layer 765 and the conductor layer 775 together.

[0114] Next, the features of the inductors L21 to L23 will be described. In the multilayer body 50, the inductor L21 is connected to the inductor L23 via the conductor layers 651 and 751. However, in the multilayer body 50, the inductor L21 is not connected to the inductor L22.

[0115] The inductor L22 includes a first portion L22A extending parallel to a portion of the inductor L21 and a second portion L22B connected to the first portion L22A and extending away from the inductor L21. Also, as shown in FIG. 14, the conductor layer 762 of the inductor L22 includes a first portion 762A extending parallel to a portion of the conductor layer 761 of the inductor L21 and a second portion 762B connected to the first portion 762A and extending away from the conductor layer 761. Also, as shown in FIG. 15, the conductor layer 772 of the inductor L22 includes a first portion 772A extending parallel to a portion of the conductor layer 771 of the inductor L21 and a second portion 772B connected to the first portion 772A and extending away from the conductor layer 771. The first portion L22A of the inductor L22 includes the first portions 762A and 772A. The second portion L22B of the inductor L22 includes second portions 762B and 772B.

[0116] The inductor L21 and the first portion L22A (first portions 762A, 772A) of the inductor L22 extend in a direction parallel to the Y direction. The second portion L22B (second portions 762B, 772B) of the inductor L22 extends to approach the columnar conductor T4b of the inductor L24 and is connected to the inductor L24 (conductor layers 764, 774).

[0117] The inductor L23 includes a third portion L23A extending to sandwich the first portion L22A of the inductor L22 between itself and a portion of the inductor L21, and a fourth portion L23B connected to the third portion L23A and extending toward the inductor L21. Also, as shown in Fig. 14, the conductor layer 763 of the inductor L23 includes a third portion 763A extending to sandwich the first portion 762A of the conductor layer 762 of the inductor L22 between itself and a portion of the conductor layer 761 of the inductor L21, and a fourth portion 763B connected to the third portion 763A and extending toward the conductor layer 761. 15, the conductor layer 773 of the inductor L23 includes a third portion 773A extending to sandwich the first portion 772A of the conductor layer 772 of the inductor L22 between itself and a part of the conductor layer 771 of the inductor L21, and a fourth portion 773B connected to the third portion 773A and extending to approach the conductor layer 771. The third portion L23A of the inductor L23 includes the third portions 763A and 773A. The fourth portion L23B of the inductor L23 includes the fourth portions 763B and 773B.

[0118] The fourth portion L23B (fourth portions 763B, 773B) of the inductor L23 extends close to the columnar conductor T1b of the inductor L21. The columnar conductor T3b of the inductor L23 is connected to the fourth portion L23B. The columnar conductor T3b is connected to the columnar conductor T1b via the conductor layers 651, 751. The dimension of the columnar conductor T3b in the stacking direction T is smaller than the dimension of the columnar conductor T1b in the stacking direction T.

[0119] Inductors L21 and L23 are connected to ground terminal 114. Inductor L22 is connected to ground terminal 116. Ground terminal 114 is disposed closer to side surface 50F than to side surface 50E. Ground terminal 116 is disposed closer to side surface 50E than to side surface 50F.

[0120] A second end 761b of the conductor layer 761 of the inductor L21, a second end 771b of the conductor layer 771 of the inductor L21, a second end 762b of the conductor layer 762 of the inductor L22, a second end 772b of the conductor layer 772 of the inductor L22, a second end 763b of the conductor layer 763 of the inductor L23, and a second end 773b of the conductor layer 773 of the inductor L23 are connected to ground. The second ends 761b, 763b, 771b, and 773b are located closer to the side surface 50F than to the side surface 50E. The second ends 762b and 772b are located closer to the side surface 50E than to the side surface 50F.

[0121] The direction of current flowing through the conductor layers 761 and 771 of inductor L21 (toward ground) is from side surface 50E to side surface 50F. The direction of current flowing through the conductor layers 762 and 772 of inductor L22 is from side surface 50F to side surface 50E. The direction of current flowing through the conductor layers 763 and 773 of inductor L23 is from side surface 50E to side surface 50F. In other words, the direction of current flowing through the conductor layers 762 and 772 is opposite to that of the conductor layers 761, 763, 771, and 773. In this embodiment, inductors L21 to L23 are arranged so that the direction of current flowing through each conductor layer of two adjacent inductors with a gap between them is opposite.

[0122] When viewed from the stacking direction T, the second portion L22B (second portions 762B, 772B) of the inductor L22 is disposed between the first end 763a of the conductor layer 763 of the inductor L23 and the first end 773a of the conductor layer 773 of the inductor L23 and the side surface 50E. When viewed from the stacking direction T, the fourth portion L23B (fourth portions 763B, 773B) of the inductor L23 is disposed between the first end 762a of the conductor layer 762 of the inductor L22 and the first end 772a of the conductor layer 772 of the inductor L22 and the side surface 50F.

[0123] Next, the features of inductors L24 and L25 will be described. Inductor L24 is arranged in a position where inductors L22 and L23 are sandwiched between inductor L24 and inductor L21. Inductor L25 is arranged in a position where inductor L24 is sandwiched between inductors L22 and L23. Inductor L25 is also arranged between inductor L24 and side surface 50C. Each of inductors L24 and L25 extends in a direction parallel to the Y direction.

[0124] The inductor L24 is connected to the inductor L22, but is not connected to the inductors L21 and L23.

[0125] The pillar-shaped conductor T5b of the inductor L25 is connected to the pillar-shaped conductor T4b of the inductor L24 via the conductor layers 614 and 741.

[0126] The inductors L24 and L25 are connected to the ground terminal 116. The columnar conductor T4b of the inductor L24 and the columnar conductor T5b of the inductor L25 are arranged closer to the ground terminal 116 than the ground terminals 114 and 115 are.

[0127] A second end 764b of the conductor layer 764 of the inductor L24, a second end 774b of the conductor layer 774 of the inductor L24, a second end 765b of the conductor layer 765 of the inductor L25, and a second end 775b of the conductor layer 775 of the inductor L25 are connected to ground. The second ends 764b, 765b, 774b, and 775b are located closer to side surface 50E than to side surface 50F.

[0128] The direction of current flowing through the conductor layers 764, 774 of inductor L24 (toward ground) is from side surface 50F to side surface 50E. The direction of current flowing through the conductor layers 764, 774 is opposite to that of the conductor layers 763, 773 of inductor L23. The direction of current flowing through the conductor layers 765, 775 of inductor L25 is from side surface 50F to side surface 50E.

[0129] Next, the features of the conductor layers 602, 614, 741, and 751 will be described. The conductor layer 602 connects the columnar conductor T1b of the inductor L21 to the second conductor portion 80F of the shield conductor 80. The conductor layer 751 connects the columnar conductor T1b of the inductor L21 to the columnar conductor T3b of the inductor L23, and also connects the columnar conductor T1b of the inductor L21 and the columnar conductor T3b of the inductor L23 to the second conductor portion 80F of the shield conductor 80. The conductor layers 602 and 751 are arranged at different positions in the stacking direction T.

[0130] Each of the conductor layers 614 and 741 connects the columnar conductor T4b of the inductor L24 and the columnar conductor T5b of the inductor L25, and also connects the columnar conductor T4b of the inductor L24 and the columnar conductor T5b of the inductor L25 to the first conductor portion 80E of the shield conductor 80. The conductor layers 614 and 741 are arranged at different positions in the stacking direction T.

[0131] Next, a description will be given of features relating to the first conductor portion 80E and the second conductor portion 80F of the shield conductor 80. The electronic component 1 further includes a specific columnar conductor formed by connecting through holes 53T11, 54T11, 55T11, 56T11, 57T11, 58T11, 59T11, and 60T11 in series. The specific columnar conductor is connected to the columnar conductor T1b of the inductor L21 via conductor layers 533, 542, 602, and 613.

[0132] The first conductor portion 80E is connected to the ground terminal 116 via the conductor layers 614 and 741, the columnar conductors T4b and T5b, the conductor layer 561, and the through holes 55T9, 54T9, 53T9, 52T9, and 51T9. The second conductor portion 80F is connected to the ground terminal 114 via the conductor layers 602 and 751, the columnar conductors T1b and T3b, specific columnar conductors, the conductor layers 542 and 533, and the through holes 52T8 and 51T8.

[0133] Furthermore, the first conductor portion 80E is connected to the ground terminal 114 via through holes 55T10 and 54T10, conductor layer 545, through hole 53T10, conductor layer 533, and through holes 52T8 and 51T8 connected to the conductor layer 561. Furthermore, the first conductor portion 80E and the second conductor portion 80F are connected to the ground terminal 115 via through hole 52T7 connected to the conductor layer 533, conductor layer 525, and through hole 51T7.

[0134] Next, the operation and effect of the electronic component 1 according to this embodiment will be described. In this embodiment, at least a portion of the inductor L24 and at least a portion of the inductor L25 are adjacent to each other with a gap therebetween. Each of the conductor layers 614 and 741 connects the columnar conductor T4b of the inductor L24 and the columnar conductor T5b of the inductor L25, which are adjacent to each other with a gap therebetween. The number of conductor layers connecting the columnar conductors T4b and T5b is not limited to two, and may be one, or three or more. In this embodiment, for example, the coupling between the inductor L24 and the inductor L25 can be adjusted by changing the number and positions of the conductor layers connecting the columnar conductors T4b and T5b.

[0135] Furthermore, in this embodiment, each of the conductor layers 614 and 741 further connects the columnar conductor T4b of the inductor L24 and the columnar conductor T5b of the inductor L25 to the first conductor portion 80E of the shield conductor 80. This also makes it possible to adjust the coupling between the inductor L24 and the inductor L25. Thus, in this embodiment, by utilizing the conductor layers 614 and 741 and the first conductor portion 80E, it is possible to adjust the coupling between the inductor L24 and the inductor L25, thereby enabling the electronic component 1 to have desired characteristics.

[0136] Similarly, in this embodiment, the conductor layer 751 connects the columnar conductor T1b of the inductor L21 and the columnar conductor T3b of the inductor L23. The number of conductor layers connecting the columnar conductor T1b of the inductor L21 and the columnar conductor T3b of the inductor L23 is not limited to one, and may be two or more. In this embodiment, for example, the coupling between the inductor L21 and the inductor L23 can be adjusted by changing the number and positions of the conductor layers connecting the columnar conductor T1b and the columnar conductor T3b.

[0137] Furthermore, in this embodiment, the conductor layer 751 further connects the columnar conductor T1b of the inductor L21 and the columnar conductor T3b of the inductor L23 to the second conductor portion 80F of the shield conductor 80. This also makes it possible to adjust the coupling between the inductor L21 and the inductor L23. Thus, in this embodiment, by utilizing the conductor layer 751 and the second conductor portion 80F, it is possible to adjust the coupling between the inductor L21 and the inductor L23, thereby enabling the electronic component 1 to have desired characteristics.

[0138] In particular, in this embodiment, a portion of the inductor L21 and a portion of the inductor L23 are adjacent to each other with a gap therebetween. To achieve this, the fourth portion L23B of the inductor L23 extends closer to the inductor L21. As a result, according to this embodiment, as described above, the conductor layer 751 can easily connect the columnar conductor T1b of the inductor L21 and the columnar conductor T3b of the inductor L23.

[0139] Furthermore, in this embodiment, as described above, the first conductor portion 80E and the second conductor portion 80F of the shield conductor 80 are connected to the ground terminals 114 to 116 via a plurality of columnar conductors with relatively large cross-sectional areas, thereby improving the shielding function of the shield conductor 80.

[0140] The present invention is not limited to the above-described embodiment and can be modified in various ways. The present invention is not limited to electronic components having the circuit configuration shown in Fig. 1, but can be applied to electronic components having various circuit configurations as long as they satisfy the requirements of the claims. For example, the multilayer electronic component of the present invention is not limited to a multilayer duplexer, but may also be a multilayer filter device.

[0141] As described above, the multilayer electronic component of the present invention includes a first inductor, a second inductor, at least one first conductor layer, a laminate for integrating the first inductor, the second inductor, and the at least one first conductor layer, the laminate including a plurality of stacked dielectric layers, and a shielding conductor integrated with the laminate. The laminate has a first surface and a second surface located at both ends in the stacking direction of the plurality of dielectric layers, and a first side surface, a second side surface, a third side surface, and a fourth side surface connecting the first surface and the second surface. The first side surface and the second side surface face opposite each other, and the third side surface and the fourth side surface face opposite each other. The shielding conductor includes a first portion covering the first side surface. The first inductor and the second inductor are wound around a first axis and a second axis, respectively, perpendicular to the stacking direction. At least one first conductor layer connects the first inductor and the second inductor to the first portion.

[0142] In the multilayer electronic component of the present invention, at least a portion of the first inductor and at least a portion of the second inductor may be adjacent to each other with a gap therebetween.

[0143] In the multilayer electronic component of the present invention, the at least one first conductor layer may be a plurality of first conductor layers arranged at different positions in the stacking direction.

[0144] In the multilayer electronic component of the present invention, each of the first inductor and the second inductor may include a conductor layer extending in a direction perpendicular to the stacking direction. The conductor layer may have a first end and a second end connected to ground. The second end of the conductor layer of the first inductor and the second end of the conductor layer of the second inductor may be located closer to the first side surface than to the second side surface.

[0145] The multilayer electronic component of the present invention may further include a third inductor wound around a third axis perpendicular to the lamination direction, and a second conductor layer for connecting the third inductor and the shielding conductor. The third inductor may include a conductor layer extending in a direction perpendicular to the lamination direction. The conductor layer may have a first end and a second end connected to ground. The second end of the conductor layer of the third inductor may be located closer to the second side surface than the first side surface. The shielding conductor may include a second portion covering one of the second side surface, the third side surface, and the fourth side surface. The second conductor layer may connect the third inductor and the second portion.

[0146] The multilayer electronic component of the present invention may further include a fourth inductor wound around a fourth axis perpendicular to the lamination direction, and the fourth inductor may be connected to the second conductor layer.

[0147] The multilayer electronic component of the present invention may further include a filter circuit including a first inductor and a second inductor. [Explanation of symbols]

[0148] 1... multilayer electronic component, 2... common terminal, 3... first signal terminal, 4... second signal terminal, 10... first circuit, 20... second circuit, 50... laminate, 50A... first surface, 50B... second surface, 50C to 50F... side surface, 80... shield conductor, 80B to 80D... conductor portion, 80E... first conductor portion, 80F... second conductor portion, 111 to 116... electrodes, C11 to C19, C21 to C33... capacitors, L10 to L14, L21 to L26... inductors.

Claims

1. a first inductor; a second inductor; at least one first conductor layer; a laminate for integrating the first inductor, the second inductor, and the at least one first conductor layer, the laminate including a plurality of stacked dielectric layers; a shield conductor integrated with the laminate; the laminate has a first surface and a second surface located at both ends in a stacking direction of the plurality of dielectric layers, and a first side surface, a second side surface, a third side surface, and a fourth side surface connecting the first surface and the second surface, the first side and the second side face opposite each other; the third side and the fourth side face opposite each other; the shield conductor includes a first portion covering the first side surface; the first inductor and the second inductor are wound around a first axis and a second axis, respectively, that are perpendicular to the stacking direction; The multilayer electronic component is characterized in that the at least one first conductor layer connects the first inductor and the second inductor to the first portion.

2. 2. The multilayer electronic component according to claim 1, wherein at least a portion of the first inductor and at least a portion of the second inductor are adjacent to each other with a gap therebetween.

3. 2. The multilayer electronic component according to claim 1, wherein the at least one first conductor layer comprises a plurality of first conductor layers arranged at different positions in the stacking direction.

4. each of the first inductor and the second inductor includes a conductor layer extending in a direction perpendicular to the stacking direction; the conductor layer has a first end and a second end connected to ground; 2. The multilayer electronic component according to claim 1, wherein the second end of the conductor layer of the first inductor and the second end of the conductor layer of the second inductor are located closer to the first side surface than to the second side surface.

5. a third inductor wound around a third axis perpendicular to the lamination direction; 2. The multilayer electronic component according to claim 1, further comprising a second conductor layer for connecting said third inductor and said shield conductor.

6. the third inductor includes a conductor layer extending in a direction perpendicular to the stacking direction, the conductor layer has a first end and a second end connected to ground; 6. The multilayer electronic component according to claim 5, wherein the second end of the conductor layer of the third inductor is located closer to the second side surface than to the first side surface.

7. the shield conductor includes a second portion covering one of the second side, the third side, and the fourth side; 6. The multilayer electronic component according to claim 5, wherein the second conductor layer connects the third inductor and the second portion.

8. further comprising a fourth inductor wound around a fourth axis perpendicular to the lamination direction, 6. The multilayer electronic component according to claim 5, wherein the fourth inductor is connected to the second conductor layer.

9. 2. The multilayer electronic component according to claim 1, further comprising a filter circuit including the first inductor and the second inductor.

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