Film forming method, article manufacturing method, and pattern forming apparatus

Abstract

To provide a technique advantageous for promoting filling of a space between a substrate and a pattern region of a mold with a curable composition.SOLUTION: The film forming method includes a first step of disposing a first curable composition on a substrate and molding the first curable composition using a first mold having a first pattern to form a first film to which the first pattern is transferred, and a second step of disposing a second curable composition on the first film and molding the second curable composition using a second mold having a second pattern to form a second film to which the second pattern is transferred.SELECTED DRAWING: Figure 16

Description

[Technical Field]

[0001] The present invention relates to a film forming method, an article manufacturing method, and a pattern forming apparatus. [Background technology]

[0002] Imprinting is known as a method for transferring a pattern of an original onto a substrate. In imprinting, a curable composition is placed on a substrate, and the curable composition is brought into contact with a pattern area of ​​a mold. The curable composition is then filled into the space between the substrate and the pattern area, and the curable composition is then cured. If the space between the substrate and the pattern area is not filled sufficiently with the curable composition, defects such as voids may occur in the pattern or film formed by the curable composition. Therefore, a sufficient filling time is required to ensure that the space between the substrate and the pattern area is completely filled with the curable composition, which may result in a decrease in throughput.

[0003] Patent Document 1 describes supplying a gas such as helium between the substrate and the mold to promote filling of the imprint material into recesses in the pattern region of the mold. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] Japanese Patent Application Publication No. 2018-085419 Summary of the Invention [Problem to be solved by the invention]

[0005] An object of the present invention is to provide an advantageous technique for facilitating the filling of a curable composition into the space between a substrate and a patterned region of a mold. [Means for solving the problem]

[0006] One aspect of the present invention relates to a film formation method, the film formation method including a first step of placing a first curable composition on a substrate and molding the first curable composition using a first mold having a first pattern to form a first film to which the first pattern is transferred; and a second step of placing a second curable composition on the first film and molding the second curable composition using a second mold having a second pattern to form a second film to which the second pattern is transferred. [Effects of the Invention]

[0007] The present invention provides an advantageous technique for facilitating the filling of the curable composition into the space defined by the substrate and the patterned area of ​​the mold. [Brief explanation of the drawings]

[0008] [Figure 1] FIG. 2 is a diagram schematically illustrating the configuration of a first film-forming apparatus that can be used to carry out a first step. [Figure 2] FIG. 4 is a diagram schematically illustrating the configuration of a second film-forming apparatus that can be used to perform the second step. [Figure 3] FIG. 2 is a diagram illustrating an example of an arrangement of a plurality of shot areas on a substrate. [Figure 4] FIG. 2 is a diagram schematically showing a first configuration example of a first mold. [Figure 5] FIG. 3 is a diagram schematically showing an example of the configuration of a second mold. [Figure 6] FIG. 10 is a diagram schematically showing a second configuration example of the first mold. [Figure 7] FIG. 10 is a diagram schematically showing a third configuration example of the first mold. [Figure 8] FIG. 10 is a diagram schematically showing a fourth configuration example of the first mold. [Figure 9] FIG. 2 is a diagram schematically illustrating the spreading of droplets of a second curable composition placed in a second step onto a first transfer pattern of a first film formed on a substrate in a first step. [Figure 10] FIG. 4 is a diagram schematically illustrating how the second curable composition is filled into the space between the first film on the substrate and the second mold in the second step. [Figure 11] FIG. 2 is a diagram schematically showing an example in which a first film and a second film are formed on a substrate having an uneven surface. [Figure 12] FIG. 10 is a diagram schematically illustrating how droplets of the second curable composition deposited in the second step spread when the first transfer pattern of the first film has a rectangular lattice. [Figure 13] 1A to 1C are diagrams showing the steps of a film forming method according to an embodiment. [Figure 14] FIG. 1 is a diagram illustrating the procedure of the first step. [Figure 15] FIG. 10 is a diagram illustrating the procedure of the second step. [Figure 16] 1A to 1C are diagrams schematically illustrating a film forming method according to an embodiment. [Figure 17] FIG. 1 is a diagram showing an example of the arrangement of a pattern forming apparatus according to an embodiment. [Figure 18] 1A to 1C are diagrams illustrating a method for manufacturing an article according to an embodiment. DETAILED DESCRIPTION OF THE INVENTION

[0009] Preferred embodiments of the present invention will be described in detail below with reference to the accompanying drawings. Note that the following embodiments do not limit the scope of the invention. Although the embodiments describe multiple features, not all of these features are necessarily essential to the invention, and multiple features may be combined arbitrarily. Furthermore, in the accompanying drawings, the same reference numerals are used to designate identical or similar components, and redundant descriptions will be omitted.

[0010] In this specification and the accompanying drawings, directions are indicated in an XYZ coordinate system, with the XY plane representing a direction parallel to the surface of the substrate. The directions parallel to the X, Y, and Z axes in the XYZ coordinate system are referred to as the X direction, Y direction, and Z direction, respectively, and rotation around the X axis, Y axis, and Z axis are referred to as θX, θY, and θZ, respectively. Control or drive about the X, Y, and Z axes refers to control or drive about directions parallel to the X axis, Y axis, and Z axis, respectively. Control or drive about the θX, θY, and θZ axes refers to control or drive about rotation around an axis parallel to the X axis, Y axis, and Z axis, respectively. Position refers to information that can be determined based on coordinates of the X, Y, and Z axes, and orientation refers to information that can be determined by values ​​of the θX, θY, and θZ axes. Positioning refers to controlling the position and / or orientation. Alignment may include controlling the position and / or attitude of at least one of the substrate and the mold so as to reduce an alignment error (overlay error) between the substrate or its shot area and the mold pattern area. Alignment may also include control to correct or change the shape of at least one of the substrate or its shot area and the mold pattern area.

[0011] FIG. 16 schematically illustrates a film formation method according to one embodiment. The film formation method according to one embodiment includes a first step, which is illustrated schematically in FIGS. 16(a) to 16(d), and a second step, which is illustrated schematically in FIGS. 16(e) to 16(g). The first step is a step of disposing a first curable composition CM1 on a substrate S and molding the first curable composition CM1 using a first mold M1 having a first pattern to form a first film F1 to which the first pattern has been transferred. The second step is a step of disposing a second curable composition CM2 on the first film F1 and molding the second curable composition CM2 using a second mold M2 having a second pattern to form a second film F2 to which the second pattern has been transferred.

[0012] The curable compositions CM1 and CM2 may be made of the same material or different materials. The first curable composition CM1 and the second curable composition CM2 are materials that cure when curing energy CE is applied. Examples of the curing energy CE include electromagnetic waves and heat. The electromagnetic waves may be, for example, light having a wavelength selected from the range of 10 nm to 1 mm, such as infrared light, visible light, and ultraviolet light. The curable compositions CM1 and CM2 may be compositions that cure by irradiation with light or by heating. Among these, the photocurable composition that cures by irradiation with light contains at least a polymerizable compound and a photopolymerization initiator and may further contain a non-polymerizable compound or solvent, as needed. The non-polymerizable compound is at least one selected from the group consisting of a sensitizer, a hydrogen donor, an internal mold release agent, a surfactant, an antioxidant, and a polymer component. The curable compositions CM1 and CM2 may be arranged on a substrate in the form of droplets, or in the form of islands or films formed by connecting multiple droplets. Alternatively, the curable compositions CM1 and CM2 may be applied in the form of a film onto the substrate using a spin coater or a slit coater. The viscosity (at 25°C) of the curable compositions CM1 and CM2 may be, for example, 1 mPa·s or more and 100 mPa·s or less. Materials that can be used for the substrate S include, for example, glass, ceramics, metals, semiconductors (Si, GaN, SiC, etc.), and resins. If necessary, a member made of a material different from that of the substrate S may be provided on the surface of the substrate S. The substrate may be, for example, a silicon wafer, a compound semiconductor wafer, or quartz glass.

[0013] The film formation method schematically shown in Fig. 16 will be described in more detail below. First, as shown in Fig. 16(a), a first curable composition CM1 may be disposed on a substrate S. The first curable composition CM1 may be disposed on the substrate S, for example, in the form of a plurality of droplets spaced apart from one another. The substrate S may have a plurality of shot regions (including regions that will become shot regions hereinafter), and the first curable composition CM1 may be disposed in all of the plurality of shot regions.

[0014] Next, as shown in FIG. 16(b), a first mold M1 having a first pattern (not shown) may be positioned so that the first mold M1 contacts the first curable composition CM1 on the multiple shot areas of the substrate S. This may be done by driving at least one of the first mold M1 and the substrate S. This initiates filling of the space between the substrate S and the first mold M1 with the first curable composition CM1, and a liquid film of the first curable composition CM1 may be formed between the multiple shot areas of the substrate S and the first mold M1. Before contacting the first mold M1 with the first curable composition CM1 on the substrate S, a filling-promoting gas may be provided in the space between the substrate S and the first mold M1. The filling-promoting gas may include, for example, at least one of helium gas, nitrogen gas, and a condensable gas (e.g., pentafluoropropane (PFP)).

[0015] 16(c), the first curable composition CM1 is cured by applying curing energy CE to the first curable composition CM1 between the first mold M1 and the multiple shot areas of the substrate S. This results in a first film F1 to which the first pattern has been transferred by molding the first curable composition CM1 using the first mold M1 having the first pattern.

[0016] 16(d), the first mold M1 is separated from the first film F1 by driving at least one of the first mold M1 and the substrate S.

[0017] 16(e), a second curable composition CM2 can be disposed on the shot region SR of the substrate S. The second curable composition CM2 can be disposed on the shot region SR of the substrate S in the form of, for example, a plurality of droplets of liquid.

[0018] 16(f), a second mold M2 having a second pattern (not shown) can be positioned so that the second mold M2 comes into contact with the second curable composition CM2 on one shot region SR of the substrate S. This can be done by driving at least one of the second mold M2 and the substrate S. This starts filling the space between the substrate S (first film F1 thereon) and the second mold M2 with the second curable composition CM2, and a liquid film of the second curable composition CM2 can be formed between the shot region SR of the substrate S and the second mold M2.

[0019] Here, in the first step, grooves to which the first pattern of the first mold M1 is transferred are formed on the surface of the first film F1. Therefore, these grooves facilitate the filling of the space between the substrate S (the first film F1 thereon) and the second mold M2 with the second curable composition CM2. In other words, the first film F1 having the grooves to which the first pattern of the first mold M1 is transferred functions as a filling-facilitating film that facilitates the filling of the second curable composition in the second step. Before contacting the second mold M2 with the second curable composition CM2 on the first film F1 on the substrate S, a filling-facilitating gas may be provided in the space between the first film F1 and the second mold M2. The filling-facilitating gas may include, for example, at least one of helium gas, nitrogen gas, and a condensable gas (e.g., pentafluoropropane (PFP)).

[0020] 16(f), the second curable composition CM2 is cured by applying curing energy CE to the second curable composition CM2 between the first film F1 and the second mold M2 on the shot region SR of the substrate S. This results in a second film F2 to which the second pattern has been transferred by molding the second curable composition CM2 using the second mold M2 having the second pattern.

[0021] 16(g), the second mold M2 is separated from the second film F2. This can be done by driving at least one of the second mold M2 and the substrate S. The second step shown in FIGS. 16(e) to 16(g) can be performed on multiple shot regions SR of the substrate S.

[0022] 16(a) to (d), the first pattern of the first mold M1 can be transferred all at once to a first curable composition CM1 that has spread so as to cover the entire area including multiple shot regions SR of the substrate S. Meanwhile, in the second process shown in Figures 16(e) to (g), the second pattern of the second mold M2 can be transferred to a second curable composition CM2 in units of shot regions SR.

[0023] In this embodiment, a first process is added to the conventional process, but the resulting delay in processing is small because the first process is performed collectively on multiple shot areas of the substrate S. On the other hand, if the filling time for each shot area is reduced by Δt due to the first film F1, the time required to transfer the second pattern of the second mold M2 to multiple shot areas on one substrate is reduced by Δt × N (N is the number of shot areas).

[0024] 1 schematically shows the configuration of a first film-forming apparatus FFE1 that can be used to perform the first step. The first film-forming apparatus FFE1 can include a substrate holder SH1 that holds a substrate S, and a substrate driving mechanism SD1 that drives the substrate S by driving the substrate holder SH1. The substrate driving mechanism SD1 can be configured to drive the substrate S about multiple axes (e.g., three axes: X-axis, Y-axis, and θZ-axis, and preferably six axes: X-axis, Y-axis, Z-axis, θX-axis, θY-axis, and θZ-axis).

[0025] The first film-forming apparatus FFE1 may also include a mold holding unit MH1 that holds the first mold M1, and a mold driving mechanism MA1 that drives the mold holding unit MH1 to drive the first mold M1. The mold driving mechanism MA1 may be configured to drive the first mold M1 about multiple axes (e.g., three axes: Z-axis, θX-axis, and θY-axis, or preferably six axes: X-axis, Y-axis, Z-axis, θX-axis, θY-axis, and θZ-axis).

[0026] The first film-forming apparatus FFE1 can also include a shape control unit MD1 that controls the shape of the first mold M1 held by the mold holding unit MH1 about the Z axis. The shape control unit MD1 can control the shape of the first mold M1 about the Z axis, for example, by adjusting the pressure on the back surface (the surface opposite to the surface having the patterned region that contacts the first curable composition) of the first mold M1 held by the mold holding unit MH1. Typically, when the patterned region of the first mold M1 is brought into contact with the first curable composition on the substrate S, the shape of the first mold M1 can be controlled by the shape control unit MD1 so that it has a downwardly convex shape.

[0027] The first film-forming apparatus FFE1 may also include a curing unit CU1 that irradiates curing energy to the first curable composition filled in the space between the multiple shot areas of the substrate S and the first mold M1, thereby curing the first curable composition. The first film-forming apparatus FFE1 may also include a dispenser DU1 that places the first curable composition on the multiple shot areas of the substrate S. However, the first film-forming apparatus FFE1 may be loaded or supplied with a substrate S on which the first curable composition has been placed on the multiple shot areas of the substrate S, in which case the dispenser DU1 may be omitted. The first film-forming apparatus FFE1 may also include an alignment scope AS1. The alignment scope AS1 may be used to detect the position of an alignment mark provided on the substrate S.

[0028] The first film forming apparatus FFE1 may also include a control unit CNT1 that controls the substrate holding unit SH1, substrate driving mechanism SD1, mold holding unit MH1, mold driving mechanism MA1, curing unit CU1, dispenser DU1, alignment scope AS1, shape control unit MD1, etc. The control unit CNT1 may be configured, for example, by a PLD (abbreviation for Programmable Logic Device) such as an FPGA (abbreviation for Field Programmable Gate Array), an ASIC (abbreviation for Application Specific Integrated Circuit), a general-purpose or dedicated computer with an embedded program, or a combination of all or part of these.

[0029] 2 schematically shows the configuration of a second film-forming apparatus FFE2 that can be used to perform the second step. The second film-forming apparatus FFE2 can include a substrate holder SH2 that holds a substrate S on which a first film F1 has been formed, and a substrate driving mechanism SD2 that drives the substrate S by driving the substrate holder SH2. The substrate driving mechanism SD2 can be configured to drive the substrate S about multiple axes (e.g., three axes: X-axis, Y-axis, and θZ-axis, or preferably six axes: X-axis, Y-axis, Z-axis, θX-axis, θY-axis, and θZ-axis).

[0030] The second film-forming apparatus FFE2 may also include a mold holding unit MH2 that holds the second mold M2, and a mold driving mechanism MA2 that drives the mold holding unit MH2 to drive the second mold M2. The mold driving mechanism MA2 may be configured to drive the second mold M2 about multiple axes (e.g., three axes: Z-axis, θX-axis, and θY-axis, or preferably six axes: X-axis, Y-axis, Z-axis, θX-axis, θY-axis, and θZ-axis).

[0031] The second film-forming apparatus FFE2 can also include a shape control unit MD2 that controls the shape of the second mold M2 held by the mold holding unit MH2 about the Z axis. The shape control unit MD2 can control the shape of the second mold M2 about the Z axis, for example, by adjusting the pressure on the back surface (the surface opposite to the surface having the patterned region that contacts the second curable composition) of the second mold M2 held by the mold holding unit MH2. Typically, when the patterned region of the second mold M2 is brought into contact with the second curable composition on the substrate S, the shape of the second mold M2 can be controlled by the shape control unit MD2 so that it has a downwardly convex shape.

[0032] The second film-forming apparatus FFE2 may also include a curing unit CU2 that irradiates curing energy to the second curable composition filled in the space between the shot area of ​​the substrate S and the second mold M2, thereby curing the second curable composition. The second film-forming apparatus FFE2 may also include a dispenser DU2 that places the second curable composition on the shot area of ​​the substrate S. However, a substrate S on which the second curable composition has been placed on multiple shot areas of the substrate S may be loaded or supplied to the second film-forming apparatus FFE2, in which case the dispenser DU2 may not be required. The second film-forming apparatus FFE2 may also include an alignment scope AS2. The alignment scope AS2 may be used to detect the position of an alignment mark provided on the substrate S.

[0033] The second film forming apparatus FFE2 may also include a control unit CNT2 that controls the substrate holding unit SH2, substrate driving mechanism SD2, mold holding unit MH2, mold driving mechanism MA2, curing unit CU2, dispenser DU2, alignment scope AS2, shape control unit MD2, etc. The control unit CNT2 may be configured, for example, by a PLD (abbreviation for Programmable Logic Device) such as an FPGA (abbreviation for Field Programmable Gate Array), an ASIC (abbreviation for Application Specific Integrated Circuit), a general-purpose or dedicated computer with an embedded program, or a combination of all or part of these.

[0034] 3 illustrates an example of an arrangement of multiple shot areas SR on a substrate S. Note that in Fig. 3, for simplicity of illustration, only one shot area is labeled with the symbol SR. The substrate S may have rectangular shot areas (full fields) and shot areas whose shapes are partially defined by arcs along the edges of the substrate S (partial fields).

[0035] 4(a), (b), and (c) schematically show a first configuration example of the first mold M1. FIGS. 4(a) and (b) are a schematic plan view and a schematic side view, respectively, of the first mold M1. The first mold M1 has a pattern region PS1 (first pattern region) having a first pattern P1. The pattern region PS1 is an area that comes into contact with the first curable composition CM1 in the first step and includes an area facing multiple shot areas on the substrate S. FIG. 4(c) is an enlarged view of a portion of the pattern region PS1 in one example. As exemplified in FIG. 4(c), the first pattern P1 may be a line-and-space pattern, and the width of each line and space in the line-and-space pattern may be smaller than the radius of each droplet of the first curable composition CM1 disposed on the substrate S. The width of each line and space in the line-and-space pattern may be, for example, 10 μm or less. Furthermore, the width of each of the lines and spaces of the line and space pattern may be, for example, 1 μm or more. The first pattern P1 may be, for example, another pattern such as a grid pattern.

[0036] 5(a), (b), and (c) schematically show configuration examples of the second mold M2. FIGS. 5(a) and (b) are a schematic plan view and a schematic side view, respectively, of the second mold M2. The second mold M2 has a pattern region PS2 (second pattern region) having a second pattern P2. The pattern region PS2 is a region that comes into contact with the second curable composition CM2 in the second step and includes a region facing one shot region of the substrate S. FIG. 5(c) is an enlarged view of a portion of the pattern region PS2 in one example. The second pattern P2 can be, for example, a line-and-space pattern, as exemplified in FIG. 5(c), but may also be other patterns.

[0037] The second mold M2 according to the first configuration example is suitable for transferring a second pattern P2 onto a first film F1 formed using the first mold M1 according to the first configuration example. The first film F1 formed using the first mold M1 may have a first feature (e.g., a groove) formed by transferring the first pattern P1. The second pattern P2 may have a second feature (e.g., a groove) extending in a direction intersecting the direction in which the first feature extends when the second mold M2 is disposed on the second curable composition CM2. The second feature may extend, for example, in a direction perpendicular to the direction in which the first feature extends when the second mold M2 is disposed on the second curable composition CM2.

[0038] 6 schematically shows a second configuration example of the first mold M1. The first mold M1 of the second configuration example has multiple regions MSR corresponding to the multiple shot regions SR of the substrate S, and each region MSR has multiple lines LR as a first pattern P1, and the multiple lines LR may coincide with the radial direction RD1 in each region MSR. The first film F1 formed using such a first mold M1 has multiple grooves formed by transferring the multiple lines LR of the first pattern P1, and the extension direction of the multiple grooves may coincide with the radial direction in each shot region SR.

[0039] In one example, the multiple lines LR provided in each region MSR of the first mold M1 may include lines LR that are shorter than 1 / 2, 1 / 5, or 1 / 10 of the length of the short side of each region MSR (in other words, the length of the short side of each shot region of the substrate S). In this case, the multiple grooves in the first film F1 formed using the first mold M1 may include grooves that are shorter than 1 / 2, 1 / 5, or 1 / 10 of the length of the short side of the shot region SR.

[0040] 7 schematically shows a third configuration example of the first mold M1. The first mold M1 of the third configuration example has a plurality of lines LR as the first pattern P1, and the plurality of lines LR may coincide with the radial direction RD2 on the substrate S. The first film F1 formed using such a first mold M1 has a plurality of grooves formed by transferring the plurality of lines LR of the first pattern P1, and the extension direction of the plurality of grooves may coincide with the radial direction on the substrate S.

[0041] In one example, the multiple lines LR provided in the first mold M1 may include lines LR that are shorter than 1 / 5, 1 / 10, or 1 / 100 of the radius of the pattern region PS1 of the first mold M1. In this case, the multiple grooves in the first film F1 formed using the first mold M1 may include grooves that are shorter than 1 / 5, 1 / 10, or 1 / 100 of the radius of the substrate S.

[0042] 8 schematically shows a fourth configuration example of the first mold M1. The first mold M1 of the third configuration example may have a rectangular grating as the first pattern P1. The first film F1 formed using such a first mold M1 may have a rectangular grating formed by transferring the rectangular grating of the first pattern P1. The rectangular grating as the first pattern P1 may be separated among multiple regions corresponding to the multiple shot regions SR, or may extend over the entire pattern region PS1 of the first mold M1 without being separated among the multiple regions.

[0043] 9 shows a schematic diagram of droplets of the second curable composition CM2 deposited in the second step on the first transfer pattern TP1 of the first film F1 formed on the substrate S in the first step. The first transfer pattern TP1 is a pattern to which the first pattern P1 is transferred. The droplets of the second curable composition CM2 tend to spread in the direction of the lines and spaces that make up the line-and-space pattern of the first transfer pattern TP1. This can contribute to facilitating the filling of the second curable composition CM2 in the direction of the lines and spaces.

[0044] FIG. 10 schematically illustrates how the second curable composition CM2 fills the space between the first film F1 and the second mold M2 on the substrate S in the second step. In the example of FIG. 10, the extension direction (Y direction) of the features (each element of the line and space) constituting the first transfer pattern TP1 of the first film F1 intersects or is perpendicular to the extension direction (X direction) of the features of the second pattern of the second mold M2. Therefore, the second curable composition CM2 easily spreads in two directions (X direction, Y direction), which promotes the filling of the space between the first film F1 and the second mold M2 on the substrate S with the second curable composition CM2. This can shorten the time required to transfer the second pattern P2 of the second mold M2 onto each shot area of ​​the substrate S.

[0045] The surface of the substrate S on which the first film F1 and the second film F2 are formed may be flat as illustrated in Figures 8 and 9, or may have an unevenness UN as illustrated in Figure 11. When the surface of the substrate S on which the first film F1 and the second film F2 are formed has an unevenness UN, the first film F1 can also function as a planarizing film.

[0046] 12 is a schematic diagram showing the spreading of droplets of the second curable composition CM2 deposited in the second step when the first transfer pattern TP1 of the first film F1 formed on the substrate S in the first step has a rectangular grid. When the first transfer pattern TP1 has a rectangular grid, the spreading of the droplets of the second curable composition CM2 is promoted in two directions, which can also promote filling of the second curable composition CM2.

[0047] Figure 13 shows the steps of a film formation method of one embodiment. The film formation method of one embodiment includes a first step S100 of forming a first film F1 as a filling promotion film on a substrate S, and a second step S200 of forming a second film F2 on the first film F1. The first step S100 is shown schematically in Figures 16(a) to 16(d), and the second step S200 is shown schematically in Figures 16(e) to 16(g).

[0048] A detailed example of the first step S100 is shown in Figure 14. The first step S100 shown in Figure 14 is performed in the first film-forming equipment FFE1 and can be controlled by the control unit CNT1. In step S101, a first mold M1 is loaded into the first film-forming equipment FFE1, and the first mold M1 is held by the mold holding unit MH1. In step S102, a substrate S is loaded into the first film-forming equipment FFE1, and the substrate S is held by the substrate holding unit SH1.

[0049] In step S103, the position of the substrate S is measured using an alignment scope AS1. In step S104, while the substrate S is driven by a substrate driving mechanism SD1, a plurality of droplets of the first curable composition CM1 are placed in an area of ​​the substrate S including a plurality of shot areas using a dispenser DU1.

[0050] In step S105, the mold driving mechanism MA1 and / or the substrate driving mechanism SD1 brings the pattern region PS1 of the first mold M1 into contact with the droplets of the first curable composition CM1 on the substrate S. This starts filling the space between the substrate S and the pattern region PS1 of the first mold M1 with the first curable composition CM1.

[0051] In step S106, the curing unit CU1 applies curing energy to the first curable composition CM1 between the substrate S and the pattern region PS1 of the first mold M1, thereby curing the first curable composition CM1 and forming a first film F1 as a filling-promoting film. This transfers the first pattern P1 of the first mold M1 to the first film F1 as a first transfer pattern TF1. In step S107, the mold driving mechanism MA1 and / or the substrate driving mechanism SD1 separate the first mold M1 from the first film F1 on the substrate S.

[0052] In step S108, the substrate S is unloaded from the first film-forming equipment FFE1. In step S109, it is determined whether there is a next substrate S to be processed, and if there is a next substrate S to be processed, steps S102 to S108 are executed for that substrate S. On the other hand, if all of the substrates S to be processed have been processed, in step S110, the first mold M1 is unloaded from the first film-forming equipment FFE1.

[0053] FIG. 15 shows a detailed example of the second step S200. The second step S200 shown in FIG. 15 is performed in the second film-forming apparatus FFE2 and can be controlled by the control unit CNT2. In step S201, a second mold M2 is carried into the second film-forming apparatus FFE2, and the second mold M2 is held by the mold holding unit MH2. In step S202, a substrate S having a first film F1 formed thereon as a filling promotion film is carried into the second film-forming apparatus FFE2, and the substrate S is held by the substrate holding unit SH2.

[0054] In step S203, the positions of multiple shot regions SR on the substrate S are measured using an alignment scope AS2. In step S204, while the substrate S is driven by the substrate driving mechanism SD1, multiple droplets of the second curable composition CM2 are placed using a dispenser DU2 onto one shot region SR selected from the multiple shot regions on the substrate S. This causes the multiple droplets of the second curable composition CM2 to begin spreading. Because the first film F1 has the first transfer pattern TP1, this promotes the spreading of the multiple droplets of the second curable composition CM2. This promotes the filling of the second curable composition CM2 into the space between (the first film F1 of) the substrate S and the pattern region PS2 of the second mold M2.

[0055] In step S205, the mold driving mechanism MA2 and / or the substrate driving mechanism SD2 brings the pattern region PS2 of the second mold M2 into contact with the droplets of the second curable composition CM2 on the shot region SR of the substrate S. This further progresses the filling of the second curable composition CM2 into the space between (the first film F1 of) the substrate S and the pattern region PS2 of the second mold M2. In step S205, the shot region SR and the second mold M2 may be aligned.

[0056] In step S206, the curing unit CU1 applies curing energy to the second curable composition CM2 between (the first film F1 of) the substrate S and the pattern region PS2 of the second mold M2, thereby curing the second curable composition CM2 and forming a second film F2. This transfers the second pattern P2 of the second mold M2 to the second film F2 as a second transfer pattern. In step S207, the mold driving mechanism MA2 and / or the substrate driving mechanism SD2 separate the second mold M2 from the second film F2 on the substrate S.

[0057] In step S208, it is determined whether there is a shot region SR to be processed next, and if there is a shot region SR to be processed next, steps S203 to S207 are executed for that shot region SR. On the other hand, if all of the shot regions SR to be processed have been processed, the substrate S is unloaded from the second film-forming equipment FFE2 in step S209. In step S210, it is determined whether there is a substrate S to be processed next, and if there is a substrate S to be processed next, steps S202 to S209 are executed for that substrate S. On the other hand, if all of the substrates S to be processed have been processed, the second mold M2 is unloaded from the second film-forming equipment FFE2 in step S211.

[0058] 17 shows an example of the configuration of a pattern formation apparatus PFE that performs the first step S100 and the second step S200. The pattern formation apparatus PFE may include a coating apparatus CT, a first film formation apparatus FFU1, and a second film formation apparatus FFU2. The coating apparatus CT coats the curable composition on the substrate. The coating apparatus CT may be configured to deposit multiple droplets of the curable composition on the substrate by, for example, an inkjet method. Alternatively, the coating apparatus CT may be configured to deposit the curable composition on the substrate by a spin coating method.

[0059] The first film-forming apparatus FFU1 forms a first film F1 to which the first pattern P1 has been transferred by, for example, using a first mold M1 having a first pattern P1 to mold the first curable composition applied to a substrate by the coating apparatus CT. The second film-forming apparatus FFU2 forms a second film F2 to which the second pattern P2 has been transferred by using a second mold M2 having a second pattern P2 to mold the second curable composition applied to the first film F1 by the coating apparatus CT to form the second film F2 to which the second pattern P2 has been transferred. The first and second curable compositions may be the same material or different materials. The first film-forming apparatus FFU1 may have a configuration in which the dispenser DU1 has been removed from the first film-forming apparatus FFE1. The second film-forming apparatus FFU2 may have a configuration in which the dispenser DU2 has been removed from the second film-forming apparatus FFE2.

[0060] The pattern formation device PFE may include a rotation mechanism AT that rotates the first mold M1 to be transported to the first film formation device FFU1 according to the direction in which the features constituting the second pattern P2 extend. The rotation of the first mold M1 by the rotation mechanism AT may be performed so that the direction in which the first features formed in the first film F1 by transferring the first pattern P1 extend intersects with the direction in which the second features of the second pattern P2 extend. The rotation mechanism AT may form part of an alignment mechanism for aligning the substrate.

[0061] The pattern formation device PFE may include load ports LP1, LP2 in which containers containing substrates are placed, and substrate transport mechanisms TR1, TR2 that transport the substrates. The rotation mechanism AT or an alignment mechanism including the rotation mechanism AT may be disposed between the transport path of the substrates by the substrate transport mechanism TR1 and the transport path of the substrates by the substrate transport mechanism TR2. The pattern formation device PFE may further include a control unit CNT that controls the coating device CT, the first film formation device FFU1, the second film formation device FFU2, the rotation mechanism AT, the substrate transport mechanisms TR1, TR2, etc.

[0062] FIG. 18 schematically illustrates an embodiment of an article manufacturing method. The article forming method includes the steps of forming the first film F1 and the second film described above. Specifically, in the step illustrated in FIG. 18(a), a first curable composition is disposed on a substrate S, and a first mold M1 having a first pattern is used to mold the first curable composition, thereby forming a first film F1 to which the first pattern is transferred. In the steps illustrated in FIGS. 18(b) and 18(c), a second curable composition is disposed on the first film F1, and a second mold M2 having a second pattern is used to mold the second curable composition, thereby forming a second film F2 to which the second pattern is transferred. The process of forming the second film F2 can be performed for each shot region SR.

[0063] 18(d), a resist film R may be formed on the second film F2. In the step shown in Fig. 18(e), for example, the resist film R may be etched back to expose the upper surface of the second film F2.

[0064] 18(f), the remaining resist film R is used as an etching mask to etch the second film F2 and the first film F1, thereby exposing the surface of the substrate S. The surface of the substrate S may be, for example, the surface of a bare wafer (e.g., a single crystal silicon wafer or an SOI wafer), or the surface of a substrate having at least one layer on a bare wafer.

[0065] In the step shown in FIG. 18(e), the substrate S is etched using the remaining resist R as an etching mask, thereby forming a pattern on the substrate S.

[0066] Thereafter, various processes are performed on the substrate S to manufacture an article such as a semiconductor device or MEMS.

[0067] The present specification and drawings contain the following disclosure: (Item 1) a first step of disposing a first curable composition on a substrate and molding the first curable composition using a first mold having a first pattern to form a first film onto which the first pattern is transferred; a second step of placing a second curable composition on the first film and molding the second curable composition using a second mold having a second pattern to form a second film onto which the second pattern is transferred; A film forming method comprising the steps of: (Item 2) the substrate has a plurality of shot areas; In the first step, the first pattern is transferred collectively to the first curable composition that has spread so as to cover the entire area including the plurality of shot areas. 2. The film forming method according to item 1, (Item 3) In the second step, the second pattern is transferred to the second curable composition in units of shot areas. 3. The film forming method according to item 2, (Item 4) the first film has a first feature formed by transfer of the first pattern; the second pattern has second features extending in a direction intersecting a direction in which the first features extend when the second mold is placed on the second curable composition; 3. The film forming method according to item 2, (Item 5) the second feature extends in a direction perpendicular to a direction in which the first feature extends when the second mold is placed on the second curable composition; 5. The film forming method according to item 4, (Item 6) a plurality of grooves are formed in the first film by transferring the first pattern; The direction in which the plurality of grooves extend coincides with the radial direction in each shot area. 3. The film forming method according to item 2, (Item 7) The plurality of grooves include grooves that are shorter than half the length of the short side of the shot area. 7. The film forming method according to item 6, (Item 8) a plurality of grooves are formed in the first film by transferring the first pattern; The direction in which the plurality of grooves extend corresponds to the radial direction of the substrate. 3. The film forming method according to item 2, (Item 9) the plurality of grooves include grooves that are shorter than a radius of the substrate; 9. The film forming method according to item 8, (Item 10) the first pattern has a plurality of regions corresponding to a plurality of shot regions of the substrate, each region having a plurality of lines; The direction in which the lines extend corresponds to the radial direction in each region. 3. The film forming method according to item 2, (Item 11) The plurality of lines include lines shorter than the length of the short side of each region. 11. The film forming method according to item 10. (Item 12) the first pattern has a plurality of lines; The direction in which the lines extend corresponds to the radial direction in the first mold. 3. The film forming method according to item 2, (Item 13) the plurality of lines include lines that are shorter than a radius of the pattern area of ​​the first mold; Item 13. The film forming method according to item 12. (Item 14) the first pattern includes a rectangular grid; 3. The film forming method according to item 2, (Item 15) the first curable composition is disposed on the substrate in the form of a plurality of spaced apart droplets; the first pattern includes a line and space pattern; the width of each of the lines and spaces of the line and space pattern is smaller than the radius of each droplet disposed on the substrate; 3. The film forming method according to item 2, (Item 16) the first pattern includes a line and space pattern; The width of each of the lines and spaces of the line and space pattern is 10 μm or less. 3. The film forming method according to item 2, (Item 17) The substrate on which the first step is performed has an uneven surface. 2. The film forming method according to item 1, (Item 18) The first curable composition and the second curable composition are the same material. 2. The film forming method according to item 1, (Item 19) the first curable composition and the second curable composition are different materials; 2. The film forming method according to item 1, Pa (item 20) forming a first film and a second film on a substrate by the film forming method according to any one of items 1 to 19; obtaining an article by processing the substrate on which the first film and the second film are formed; A method for manufacturing an article, comprising: (Item 21) an application device that applies a curable composition onto a substrate; a first film forming device that forms a first film to which the first pattern is transferred by using a first mold having a first pattern to shape the curable composition applied onto the substrate by the application device; a second film forming device that forms a second film to which the second pattern is transferred by molding the curable composition applied onto the first film on the substrate by the application device using a second mold having a second pattern; A pattern forming apparatus comprising: (Item 22) a rotation mechanism that rotates the first mold to be transported to the first film forming device in accordance with a direction in which features constituting the second pattern extend; 22. The pattern forming apparatus according to item 21, further comprising: (others) The invention is not limited to the above-described embodiments, and various modifications and variations are possible without departing from the spirit and scope of the invention. Therefore, the appended items are provided to publicize the scope of the invention. [Explanation of symbols]

[0068] S: substrate, CM1: first curable composition, CM2: second curable composition, P1: first pattern, P2: second pattern, F1: first film, F2: second film, M1: first mold, M2: second mold

Claims

1. a first step of disposing a first curable composition on a substrate and molding the first curable composition using a first mold having a first pattern to form a first film having the first pattern transferred thereto; a second step of placing a second curable composition on the first film and molding the second curable composition using a second mold having a second pattern to form a second film onto which the second pattern has been transferred; A film forming method comprising the steps of:

2. the substrate has a plurality of shot areas; In the first step, the first pattern is transferred collectively to the first curable composition that has spread so as to cover the entire area including the plurality of shot areas.

2. The film forming method according to claim 1.

3. In the second step, the second pattern is transferred to the second curable composition in units of shot areas.

3. The film forming method according to claim 2.

4. the first film has first features formed by transfer of the first pattern; the second pattern has second features extending in a direction intersecting a direction in which the first features extend when the second mold is placed on the second curable composition; 3. The film forming method according to claim 2.

5. the second feature extends in a direction perpendicular to a direction in which the first feature extends when the second mold is placed on the second curable composition; 5. The film forming method according to claim 4.

6. a plurality of grooves are formed in the first film by transferring the first pattern; The direction in which the plurality of grooves extend coincides with the radial direction in each shot area.

3. The film forming method according to claim 2.

7. the plurality of grooves include grooves that are shorter than half the length of the short side of the shot area; 7. The film forming method according to claim 6.

8. a plurality of grooves are formed in the first film by transferring the first pattern; The direction in which the plurality of grooves extend corresponds to the radial direction of the substrate.

3. The film forming method according to claim 2.

9. the plurality of grooves include grooves that are shorter than a radius of the substrate; 9. The film forming method according to claim 8.

10. the first pattern has a plurality of regions corresponding to a plurality of shot regions of the substrate, each region having a plurality of lines; The direction in which the lines extend corresponds to the radial direction in each region.

3. The film forming method according to claim 2.

11. The plurality of lines include lines shorter than the length of the short side of each region. The film forming method according to claim 10 .

12. the first pattern has a plurality of lines; The direction in which the lines extend corresponds to the radial direction of the first mold.

3. The film forming method according to claim 2.

13. the plurality of lines include lines shorter than a radius of the pattern area of ​​the first mold; The film forming method according to claim 12 .

14. the first pattern includes a rectangular grid; 3. The film forming method according to claim 2.

15. the first curable composition is disposed on the substrate in the form of a plurality of spaced apart droplets; the first pattern includes a line and space pattern, the width of each of the lines and spaces of the line and space pattern is smaller than the radius of each droplet disposed on the substrate; 3. The film forming method according to claim 2.

16. the first pattern includes a line and space pattern, The width of each of the lines and spaces of the line and space pattern is 10 μm or less.

3. The film forming method according to claim 2.

17. The substrate on which the first step is performed has an uneven surface.

2. The film forming method according to claim 1.

18. The first curable composition and the second curable composition are the same material.

2. The film forming method according to claim 1.

19. the first curable composition and the second curable composition are different materials from each other; 2. The film forming method according to claim 1. Pa

20. forming a first film and a second film on a substrate by the film forming method according to any one of claims 1 to 19; obtaining an article by processing the substrate on which the first film and the second film are formed; A method for manufacturing an article, comprising:

21. an application device that applies a curable composition onto a substrate; a first film forming device that forms a first film to which the first pattern is transferred by using a first mold having a first pattern to shape the curable composition applied onto the substrate by the application device; a second film forming device that forms a second film to which the second pattern is transferred by molding the curable composition applied onto the first film on the substrate by the application device using a second mold having a second pattern; A pattern forming apparatus comprising:

22. a rotation mechanism that rotates the first mold to be transported to the first film forming device in accordance with a direction in which features constituting the second pattern extend; 22. The pattern forming apparatus according to claim 21, further comprising:

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