Transport hand and transport device

Abstract

This effectively avoids damage to the transported object caused by sudden temperature changes. [Solution] A ceramic transport hand 10 is formed in a plate shape on which a thin plate-like transport object such as a wafer X can be placed and is configured to be attachable to a transport device that transports the transport object, and a thin-film electric heating line 13 that generates heat when electricity is applied is disposed on at least one of the placement surface Fa on which the transport object is placed and the back surface Fb. Also, a transport device 1 configured to be attachable to the transport hand 10 includes a power supply unit that applies electricity to the electric heating line 13, and is configured to transport the transport object by placing it on the placement surface Fa of the transport hand 10 in a state in which the electric heating line 13 is heated by the application of electricity from the power supply unit.

Description

[Technical Field]

[0001] The present invention relates to a transport hand that is configured to be able to place a thin plate-shaped transport object such as a silicon wafer and that is capable of being attached to a transport device, and to a transport device that is equipped with such a transport hand and is capable of transporting the transport object. [Background technology]

[0002] For example, the following patent document discloses a wafer transport robot (hereinafter simply referred to as a "transport robot") capable of transporting wafers for semiconductor device manufacturing. This transport robot includes a base, an elevator shaft, an arm, a hand, and a control device. In this case, the transport robot is configured such that the base of the hand is fixed to the tip of the arm, and the wafer to be transported can be placed on the tip of the hand. As a result, this transport robot can transport a wafer placed on the hand by raising and lowering the arm relative to the base using the elevator shaft and rotating the arm about the elevator shaft. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] JP 2022-144478 A (pages 4-10, figures 1-6) Summary of the Invention [Problem to be solved by the invention]

[0004] However, the transport robot (transport device) and its hand (transport hand) disclosed in the above-mentioned patent documents have the following problems to be solved: Specifically, this type of transport device is installed in a semiconductor device manufacturing site (site where various processes are performed on wafers) as in the example disclosed in the above-mentioned patent documents, and is widely used in applications such as transporting wafers from a stock position for unprocessed wafers or a processing position for a previous process to a processing position in a high-temperature processing tank such as a dryer, and transporting processed wafers that have completed processing in a high-temperature processing tank to a stock position for processed wafers or a processing position for the next process.

[0005] In this case, in the above-described site of use, the temperature of the wafer before being transferred to the high-temperature processing tank is lower than that inside the high-temperature processing tank. Furthermore, since the thin-plate-shaped transfer hand is prone to heat radiation to the surrounding air (heat absorption from the surrounding air), it is basically at a temperature similar to the temperature of the surrounding air, i.e., lower than that inside the high-temperature processing tank. Therefore, in a transfer device such as the above-described transfer robot, the temperature of the wafer placed on the hand at the pre-transfer position and transferred into the high-temperature processing tank may rise suddenly from the moment it is transferred from outside the high-temperature processing tank into the tank. This sudden thermal expansion of the wafer may cause damage such as cracks in the thin film formed on the wafer or in the wafer substrate itself.

[0006] Furthermore, in the above-described site of use, the position to which the wafer is transferred after processing in the high-temperature processing tank is at a lower temperature than the temperature inside the high-temperature processing tank. Furthermore, as described above, the temperature of the transfer hand is lower than the temperature inside the high-temperature processing tank. Therefore, in a transfer device such as the above-described transfer robot, when a wafer is placed on the hand inside the high-temperature processing tank (when the hand comes into contact with a wafer whose temperature has been increased inside the tank) or when the wafer placed on the hand is transferred out of the high-temperature processing tank, the temperature of the wafer may be suddenly lowered. This may result in a sudden thermal contraction of the wafer, which may cause damage such as cracks in the thin film formed on the wafer or in the wafer substrate itself.

[0007] The present invention has been made in consideration of the above-mentioned problems to be solved, and its main object is to provide a transport hand and a transport device that can effectively avoid damage to the transported object caused by sudden temperature changes. [Means for solving the problem]

[0008] In order to achieve the above object, the transport hand described in claim 1 is a ceramic transport hand formed in a plate shape on which a thin plate-shaped transport object can be placed and configured to be attachable to a transport device that transports the transport object, and at least one of the surface on which the transport object is placed and the back surface of the surface is provided with a thin-film heating element that generates heat when electricity is applied.

[0009] The transport hand described in claim 2 is the transport hand described in claim 1, in which the heating element is arranged on the placement surface, and the transport object placed on the placement surface is configured to be able to be placed thereon so that the transport object is not in contact with the heating element.

[0010] The transport hand described in claim 3 is the transport hand described in claim 1 or 2, in which an insulating material is arranged at the attachment part that is attached to the transport device, to reduce the amount of heat transferred from the transport hand, whose temperature has been increased by the heat generated by the heating element, to the transport device.

[0011] The conveying device described in claim 4 is configured to be able to attach the conveying hand described in claim 1 or 2, and is equipped with a power supply unit that supplies electricity to the heating element, and is configured to be able to place the object to be conveyed on the placement surface of the conveying hand when the heating element is heated by the electricity supplied by the power supply unit and convey the object to be conveyed.

[0012] The conveying device described in claim 5 is the conveying device described in claim 4, in which an insulating material is arranged at the attachment portion to which the conveying hand is attached, to reduce the amount of heat transferred from the conveying hand, whose temperature has been increased by the heat generated by the heating element, to the conveying device. [Effects of the Invention]

[0013] In the transport hand described in claim 1, a thin-film heating element that generates heat when electricity is applied is disposed on at least one of the mounting surface on which the transport object is placed and the rear surface of the mounting surface. Also, in the transport device described in claim 4, the transport hand described above can be attached, and the transport device includes a power supply unit that applies electricity to the heating element, and is configured to be able to transport the transport object by placing it on the mounting surface of the transport hand in a state where the heating element is heated by electricity applied from the power supply unit.

[0014] Therefore, according to the transport hand of claim 1 and the transport device of claim 4, when an object to be transported is transported to a position where the temperature is higher than the position before transport, the object placed on the mounting surface can be transported in a state where the temperature is increased by radiant heat from the heating element and the transport hand whose temperature is increased by the heat generated by the heating element, and by direct heat transfer from the transport hand, thereby preventing a sudden increase in temperature and sudden thermal expansion of the object at the destination, and thereby preferably preventing damage to the object. Also, when an object to be transported is transported to a position where the temperature is lower than the position before transport, the temperature of the transport hand on which the object is placed at the position before transport is increased by the heat generated by the heating element, so a sudden decrease in temperature of the object due to heat transfer to the transport hand can be avoided, and sudden thermal contraction can be avoided, and thereby preferably preventing damage to the object.

[0015] In the transport hand described in claim 2, a heating element is disposed on the placement surface, and the transport object placed on the placement surface can be placed on it so that the object does not come into contact with the heating element. Therefore, with the transport hand described in claim 2 and a transport device equipped with such a transport hand, it is possible to avoid a situation in which the transport object placed on the placement surface comes into contact with the heating element, causing damage to the transport object due to the voltage flowing through the heating element, and it is also possible to avoid a situation in which the temperature of the part of the transport object that comes into contact with the heating element is partially increased.

[0016] In the transport hand described in claim 3, a heat insulating material is provided at the attachment part where the transport hand is attached to the transport device, to reduce the amount of heat transferred from the transport hand whose temperature has been increased by the heat generated by the heating element. Also, in the transport device described in claim 5, a heat insulating material is provided at the attachment part where the transport hand is attached, to reduce the amount of heat transferred from the transport hand whose temperature has been increased by the heat generated by the heating element to the transport device.

[0017] Therefore, with the transport hand described in claim 3 and the transport device described in claim 5, it is possible to avoid a situation in which the amount of heat required to sufficiently raise the temperature of the placement section on which the transport object is placed or the transport object placed on the placement section is insufficient due to heat transfer from the mounting section to the transport device when the heating element is heated, thereby efficiently raising the temperature of the placement section and the transport object, and it is also possible to preferably avoid malfunctions of the transport device caused by excessive temperature rise. [Brief explanation of the drawings]

[0018] [Figure 1] FIG. 1 is a configuration diagram of a transport device 1. [Figure 2] FIG. 2 is a plan view of the transport hand 10. [Figure 3] FIG. 3 is a cross-sectional view taken along line AA in FIG. 2. [Figure 4] 1 is a perspective view of the appearance of the vicinity of a groove 12b in the placement portion 12 of the transport hand 10. FIG. DETAILED DESCRIPTION OF THE INVENTION

[0019] Hereinafter, embodiments of the "transport hand" and the "transport device" will be described with reference to the accompanying drawings.

[0020] 1 is an example of a "transport device" and is configured to be able to transport a silicon wafer X (hereinafter also simply referred to as "wafer X"), which is an example of a "thin-plate-like object to be transported." Specifically, this transport device 1 includes a transport mechanism 2, a power supply unit 3, a control unit 4, and a transport hand 10, and is installed at a manufacturing site for semiconductor devices, etc., and is configured to transport the wafer X from a stack position of the wafer X before processing or a processing position of a previous process (for example, a wet film formation processing position using a spin coater) to a processing device such as a drying device (the above-mentioned "high-temperature processing bath": not shown), and to transport the wafer X after processing from the processing device to a stack position after processing or a processing position of the next process.

[0021] In this case, the transport hand 10 is an example of a "ceramic transport hand", and as shown in Figures 2 and 3, an attachment portion 11 for attaching to the transport mechanism 2 and a mounting portion 12 on which the wafer X to be transported can be placed are integrally formed from dense ceramics, and the entirety is formed into a thin plate (flat plate) that is approximately U-shaped when viewed from above.

[0022] In this transport hand 10, the mounting portion 11 is provided with insertion holes H11, H11... (see FIG. 2) through which bolts (not shown) for attaching the transport hand 10 to the transport mechanism 2 can be inserted, and an insulating plate 20 (an example of an "insulating material") is disposed on the mounting portion 11 to reduce the amount of heat transferred from the transport hand 10 (mounting portion 11) attached to the transport mechanism 2 to the transport mechanism 2. In this case, in the transport hand 10 of this example, the insulating plate 20 is formed in a flat plate shape from dense ceramics (for example, "Alsima L" or "Corseed" manufactured by Asuzac Co., Ltd.). In addition, in the transport hand 10 of this example, as shown in FIGS. 2 to 4, the mounting portion 12 is provided with a contact portion 12a so that only a portion of the outer edge of the wafer X placed on the mounting portion 12 is in contact with the transport hand 10 (mounting portion 12) (a state in which the portion of the wafer X other than the outer edge is not in contact with the transport hand 10).

[0023] Furthermore, in the transport hand 10 of this example, as will be described later, a heating line 13 composed of a "thin film heating element" that generates heat when current is applied from the power supply unit 3 is disposed on the wafer X mounting surface Fa of the transport hand 10. In this case, the transport hand 10 of this example is formed into a thin film by, for example, thick film printing using paint containing conductive metal powder (stainless steel, etc.). Note that, instead of forming the "thin film heating element" such as the heating line 13 by thick film printing, it can be formed by various methods, such as adhering a conductive metal thin film cut to a desired shape to the mounting surface Fa.

[0024] 2, in the transport hand 10 of this example, ends 13a and 13b of the electric heating line 13 are formed on the mounting part 11 so that the electric heating line 13 is connected to an electrode part (a connection part for connecting the electric heating line 13 to the power supply part 3; not shown) provided on the transport mechanism 2 when the mounting part 11 is attached to the transport mechanism 2. Furthermore, in the transport hand 10 of this example, as shown in FIG. 4, a groove part 12b is provided from the center part of the mounting part 12 (the part on the right side in the figure) to a part closer to the mounting part 11 (the part on the left side in the figure), and the electric heating line 13 is formed in this groove part 12b. This makes it possible for the wafer X placed on the mounting part 12 so as to be in contact with the contact part 12a to be in a state of non-contact with the electric heating line 13.

[0025] It should be noted that a "thin-film heating element" such as the heating line 13 is not limited to being disposed on the placement surface Fa as in the transport hand 10 of this example, but may be disposed on the back surface Fb or on both the placement surface Fa and the back surface Fb (not shown). Furthermore, when the heating line 13 is disposed on the placement surface Fa, a ceramic thin plate (not shown) may be disposed on the placement surface Fa so as to cover the area where the heating line 13 is formed, thereby making it possible to configure the wafer X to be in a state of non-contact with the heating line 13.

[0026] 1, the transport mechanism 2 includes an attachment portion 2a to which the transport hand 10 can be attached, and also includes an arm portion and the like that can move the attachment portion 2a to any position. The attachment portion 2a is also provided with a connector (not shown) that has electrodes for connecting the ends 13a, 13b of the heating line 13 provided on the transport hand 10 to the power supply 3, as described above. The transport mechanism 2 is configured to be able to transport the wafer X held by the transport hand 10 attached to the attachment portion 2a to any position by moving the attachment portion 2a using the arm portion and the like.

[0027] The power supply unit 3 is an example of a "power supply unit that supplies electricity to a heating element," and generates heat by passing electricity between the ends 13a, 13b of the heating line 13 under the control of the control unit 4. The control unit 4 controls the transfer device 1 overall. Specifically, the control unit 4 controls the power supply unit 3 to pass electricity through the heating line 13 of the transfer hand 10 attached to the attachment portion 2a, thereby causing the heating line 13 to generate heat and raising the temperature of the transfer hand 10. The control unit 4 also controls the transfer mechanism 2 to move the transfer hand 10, thereby transferring the wafer X on the transfer hand 10 to an arbitrary transfer position.

[0028] Next, a description will be given of the transportation of the wafer X by the transport device 1. It is assumed that the attachment of the transport hand 10 to the attachment portion 2a (such as screwing the bolts inserted through the insertion holes H11 into the attachment portion 2a and connecting the ends 13a and 13b of the heating line 13 to the power supply portion 3 via the connectors) has already been completed, and a description of these procedures will be omitted.

[0029] As an example, the transfer device 1 of this example can be used to transfer a wafer X to be subjected to heat treatment in a high-temperature treatment tank from a pre-treatment stack position into the high-temperature treatment tank, and to transfer the wafer X that has completed the heat treatment in the high-temperature treatment tank from the high-temperature treatment tank to a post-treatment stack position.

[0030] During the transport process by the transport device 1, first, the control unit 4 controls the power supply unit 3 to start supplying electricity to the heating line 13. As a result, the heating line 13 generates heat, raising the temperature of the placement unit 12 of the transport hand 10. At this time, under the control of the control unit 4, the power supply unit 3 supplies electricity to the heating line 13 so that the temperature of the placement unit 12 becomes an intermediate temperature between the temperatures at the pre-processing stack position and the post-processing stack position (the room temperature where the transport device 1 is installed) and the temperature inside the high-temperature processing tank, for example.

[0031] Next, when the time required for the temperature of the mounting portion 12 to be sufficiently increased by the heat generated by the heating line 13 has elapsed since the power supply unit 3 started to supply current, the control unit 4 controls the transfer mechanism 2 to move the transfer hand 10 to the pre-processing stack position and place the wafer X on the mounting portion 12. At this time, the temperature of the wafer X on the mounting portion 12 is gradually increased by the radiant heat from the heating line 13 and the mounting portion 12 whose temperature has been increased by the heat generated by the heating line 13, and by direct heat transfer via the contact portion 12a. In this example, as described above, the temperature of the mounting portion 12 is intermediate between the temperature at the pre-processing stack position and the temperature in the high-temperature processing tank. This prevents the temperature of the wafer X placed on the mounting portion 12 from being suddenly increased to a high temperature.

[0032] Next, the control unit 4 controls the transfer mechanism 2 to transfer the wafer X from the pre-processing stack position into the high-temperature processing tank. At this time, since the temperature of the wafer X on the mounting unit 12 has been increased as described above, a sudden increase in temperature of the wafer X transferred into the high-temperature processing tank is avoided. As described above, the transfer device 1 (transfer hand 10) of this example does not cause a sudden increase in temperature of the wafer X when transferring it from the pre-processing stack position into the high-temperature processing tank, and it is possible to suitably avoid damage to the wafer X due to sudden thermal expansion.

[0033] On the other hand, when the processing of the wafer X in the high-temperature processing tank is completed, the control unit 4 controls the transfer mechanism 2 to transfer the wafer X from the high-temperature processing tank to the post-processing stack position. At this time, since the temperature of the mounting portion 12 of the transfer hand 10 is increased by the heat generated by the electric heating line 13 as described above, when the wafer X is placed on the mounting portion 12 in the high-temperature processing tank, a sudden drop in the temperature of the wafer X, which has been heated to a high temperature by the processing in the high-temperature processing tank, is avoided. Furthermore, even when the wafer X is transferred out of the high-temperature processing tank and toward the post-processing stack position, a sudden drop in the temperature of the wafer X on the mounting portion 12 is avoided due to the radiant heat from the electric heating line 13 and the mounting portion 12, which has been increased in temperature by the heat generated by the electric heating line 13, and direct heat transfer via the contact portion 12a. As described above, the transfer device 1 (transfer hand 10) of this example does not cause a sudden drop in the temperature of the wafer X when transferring it from the high-temperature processing tank to the post-processing stack position, and it is possible to suitably avoid damage to the wafer X due to sudden thermal contraction.

[0034] In this case, as described above, in the transfer device 1 of this example, the heat insulating plate 20 is disposed on the mounting portion 11 to reduce the amount of heat transferred from the transfer hand 10 (mounting portion 11) attached to the transfer mechanism 2 to the transfer mechanism 2. Therefore, when the mounting portion 12 and the like are heated by the heat generated by the heating line 13 as described above, it is possible to sufficiently reduce the amount of heat transferred from the transfer hand 10 (mounting portion 11) to the transfer mechanism 2. This makes it possible to efficiently increase the temperature of the mounting portion 12 and the wafer X mounted on the mounting portion 12 by the heat generated by the heating line 13, and also makes it possible to preferably avoid a situation in which the transfer mechanism 2 malfunctions due to an excessive temperature increase.

[0035] Thereafter, the control unit 4 repeatedly transfers the wafer X from the pre-processing stack position into the high-temperature processing tank and from the high-temperature processing tank to the post-processing stack position, and when there are no more wafers X to be transferred, the control unit 3 controls the power supply unit 3 to stop powering the heating line 13.

[0036] In this way, in the transport hand 10, the heating line 13, which is made up of a thin-film heating element that generates heat when electricity is applied, is disposed on at least one of the mounting surface Fa on which the wafer X (transport object) is placed and the back surface Fb thereof. The transport device 1 is configured to be able to mount the transport hand 10 and includes a power supply unit 3 that applies electricity to the heating line 13, and is configured to be able to transport the wafer X by placing it on the mounting surface Fa of the transport hand 10 in a state in which the heating line 13 is heated by the application of electricity from the power supply unit 3.

[0037] Therefore, with the transport hand 10 and transport device 1, when the wafer X is transported to a position where the temperature is higher than the position before the transport, the wafer X placed on the mounting portion 12 can be transported in a state where the temperature is increased by radiant heat from the heating line 13 and the mounting portion 12 whose temperature is increased by the heat generated by the heating line 13, and by direct heat transfer via the contact portion 12a, thereby preventing a sudden increase in temperature and sudden thermal expansion of the wafer X at the transport destination, and thus suitably preventing damage to the wafer X. Furthermore, even when the wafer X is transported to a position where the temperature is lower than the position before the transport, the temperature of the transport hand 10 (mounting portion 12) on which the wafer X is placed at the position before the transport is increased by the heat generated by the heating line 13, thereby preventing a sudden drop in temperature of the wafer X due to heat transfer to the transport hand 10 and avoiding a sudden thermal contraction, thereby suitably preventing damage to the wafer X.

[0038] Furthermore, in the transport hand 10, the electric heating line 13 is disposed on the mounting surface Fa, and the electric heating line 13 is formed in the groove 12b so that the wafer X placed on the mounting surface Fa can be placed thereon without contacting the electric heating line 13. Therefore, with the transport hand 10 and the transport device 1, it is possible to prevent the wafer X from being damaged due to the voltage flowing through the electric heating line 13 coming into contact with the wafer X placed on the mounting section 12, and it is also possible to prevent the temperature of the wafer X at the portion in contact with the electric heating line 13 from being partially increased.

[0039] Furthermore, in this transport hand 10, an insulating plate 20 (thermal insulating material) is provided on the attachment part 11 attached to the transport device 1, which reduces the amount of heat transferred from the transport hand 10, whose temperature has been increased by the heat generated by the heating line 13, to the transport mechanism 2. Therefore, with this transport hand 10 and transport device 1, it is possible to avoid a situation in which the amount of heat required to sufficiently increase the temperature of the placement part 12 on which the wafer X is placed or the wafer X placed on the placement part 12 is insufficient due to heat transfer from the attachment part 11 to the transport mechanism 2 when the heating line 13 is heated, thereby efficiently increasing the temperature of the placement part 12 and the wafer X and preferably avoiding malfunction of the transport mechanism 2 caused by an excessive temperature increase.

[0040] The configurations of the "transport hand" and the "transport device" are not limited to the examples of the configurations of the transport hand 10 and the transport device 1 described above.

[0041] For example, while the example in which the insulating plate 20, an example of a "thermal insulating material," is disposed on the mounting portion 11 as one of the components of the transport hand 10 has been described, instead of this configuration, an "insulating material" such as the insulating plate 20 can be provided as a separate component from the "transport hand" and disposed between the "mounted portion" and the "transport hand." A "transport device" configured in this manner, similar to the transport hand 10 equipped with the insulating plate 20 and the transport device 1 equipped with the transport hand 10, can avoid a situation in which the amount of heat required to sufficiently raise the temperature of the mounting portion 12 on which the wafer X is placed or the wafer X placed on the mounting portion 12 is insufficient due to heat transfer from the mounting portion 11 to the transport mechanism 2 when the heating line 13 is heated, thereby efficiently raising the temperatures of the mounting portion 12 and the wafer X and preferably avoiding malfunction of the transport mechanism 2 caused by an excessive temperature rise.

[0042] Although the above description has been given with reference to an example of a usage mode in which the wafer X is transported while the electric heating line 13 is constantly heated by energizing the electric heating line 13, it is also possible to employ a configuration in which the energization of the electric heating line 13 (heat generation by the electric heating line 13) is stopped when there is no risk of a sudden temperature change in the wafer X, or when there is no risk of the wafer X being damaged even if a sudden temperature change occurs. Furthermore, the amount of heat generated by the electric heating line 13, i.e., the amount of temperature rise in the mounting portion 12 and the wafer X, can be configured not only to maintain a constant amount of heat, but also to be changed appropriately within a range that does not result in damage to the wafer X.

[0043] Furthermore, although the description has been given with reference to an example of a mode of use in which the electric heating line 13 is heated in order to prevent damage to the wafer X due to a sudden temperature change, for example, when a process is required to volatilize a solvent contained in a coating applied to the wafer X or to volatilize a cleaning liquid remaining on the surface of the wafer X after cleaning the wafer X, if a solvent or cleaning liquid that requires a small amount of heat for volatilization is used, the wafer X can be volatilized by raising the temperature of the wafer X using heat from the transport hand 10 while the wafer X is being transported by the transport device 1 equipped with the transport hand 10. When such a configuration is adopted, a processing tank (drying chamber) for drying is not required, and therefore the manufacturing costs of semiconductors and the like using the wafer X can be significantly reduced.

[0044] In addition, the configuration of the transport hand 10 and the transport device 1 capable of transporting a wafer X as an "object to be transported" has been described as an example, but the "object to be transported" is not limited to this, and the transport device 1 may be configured to be capable of transporting various "thin plate-like articles" such as display parts such as small liquid crystal panels and small organic EL panels. [Explanation of symbols]

[0045] 1. Conveyor device 2. Transport mechanism 2a Mounted part 3 Power supply section 4. Control Unit 10 Transport hand 11 Mounting part 12 Placement section 12a Contact part 12b Groove 13 Electric heating line 13a,13b end 20 Insulation board Fa Placement surface Facebook back H11 Insertion hole X Silicon Wafer

Claims

1. A ceramic transport hand formed in a plate shape on which a thin plate-shaped transport object can be placed and configured to be attachable to a transport device that transports the transport object, The transport hand has a thin-film heating element that generates heat when electricity is applied, disposed on at least one of a placement surface on which the object to be transported is placed and a surface behind the placement surface.

2. 2. The transport hand according to claim 1, wherein the heating element is disposed on the placement surface, and the transport object placed on the placement surface can be placed on the placement surface so that the transport object does not come into contact with the heating element.

3. 3. The transport hand according to claim 1, wherein a heat insulating material is provided at a mounting portion attached to the transport device, the heat insulating material reducing the amount of heat transferred from the transport hand to the transport device when the temperature of the transport hand is increased by the heat generated by the heating element.

4. a power supply unit configured to be able to attach the transport hand according to claim 1 or 2 and to energize the heating element; The transport device is configured to be able to transport the object by placing it on the placement surface of the transport hand in a state in which the heating element is heated by energization from the power supply unit.

5. 5. The transport device according to claim 4, wherein an insulating material is arranged on the mounting portion to which the transport hand is attached, to reduce the amount of heat transferred from the transport hand, the temperature of which has been increased by the heat generated by the heating element, to the transport device.

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