Inspection device, inspection method, and bonding system

Abstract

Provided are an inspection device, an inspection method, and a bonding system that can obtain bonding conditions for improving the bonding state of a product. [Solution] An inspection device according to one aspect of the present disclosure includes an input unit that acquires temperature image data generated by an imaging device photographing a sample bonded at a predetermined bonding area in accordance with preset first bonding conditions in a time series, and a processor that inspects the bonding state of the sample based on the temperature image data. The processor determines second bonding conditions to improve the bonding state based on the first bonding conditions and the inspection results of the bonding state.

Description

[Technical Field]

[0001] The present disclosure relates to an inspection device, an inspection method, and a bonding system. [Background technology]

[0002] Patent Document 1 discloses a non-destructive testing method using infrared lock-in thermography to determine the quality of a lap joint made by friction stir welding dissimilar metal materials. This non-destructive testing method determines the quality of the joint by comparing the amount and phase of acquired infrared light with predetermined judgment values. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] International Publication No. 2013 / 085075 Summary of the Invention [Problem to be solved by the invention]

[0004] The present disclosure provides an inspection device, an inspection method, and a bonding system that can obtain bonding conditions for improving the bonding state of a product. [Means for solving the problem]

[0005] An inspection device according to one aspect of the present disclosure includes: an input unit that acquires temperature image data generated by an image capture device that captures images of the sample bonded in a predetermined bonding region in accordance with a first bonding condition that has been set in advance; and a processor for inspecting the bonding condition of the sample based on the temperature image data. The processor determines second bonding conditions for improving the bonding state based on the first bonding conditions and the inspection results of the bonding state.

[0006] An inspection method according to one aspect of the present disclosure includes: The bonding state of the sample is inspected based on temperature image data generated by time-series photographing of the sample bonded in a predetermined bonding region in accordance with a first bonding condition that has been set in advance by an imaging device. The inspection method is a processor acquiring temperature image data; The method includes a step in which the processor determines second bonding conditions for improving the bonding state based on the first bonding conditions and the inspection results of the bonding state.

[0007] A joint system according to one aspect of the present disclosure includes: The system includes an inspection device that inspects the bonding state of the sample based on temperature image data generated by an imaging device taking time-series images of the sample bonded in a predetermined bonding area according to a first bonding condition that has been set in advance, and a bonding device that bonds a workpiece of the same type as the sample based on the inspection results of the bonding state. The inspection equipment is an input unit for acquiring temperature image data; and a processor for inspecting the bonding condition of the sample based on the temperature image data. the processor determines second bonding conditions for improving the bonding state based on the first bonding conditions and the inspection result of the bonding state; The joining device acquires second joining condition data indicating second joining conditions, and joins the workpieces based on the acquired second joining condition data. [Effects of the Invention]

[0008] According to the present disclosure, bonding conditions for improving the bonding state of a product can be obtained. [Brief explanation of the drawings]

[0009] [Figure 1] FIG. 1 is a block diagram illustrating an example configuration of a manufacturing system according to an embodiment of the present disclosure. [Figure 2A] Block diagram showing an example of the configuration of the inspection device of Figure 1 [Figure 2B] A block diagram showing an example of the configuration of the joining device of FIG. [Figure 3]Schematic diagram showing an example of the configuration of a pressure device [Figure 4] 1 is a flowchart showing an example of an inspection method according to the present embodiment. [Figure 5] A flowchart showing an example of the image acquisition process of FIG. 4. [Figure 6] Schematic diagram illustrating a phase image [Figure 7] 5 is a flowchart showing an example of the effective bonding area determination process shown in FIG. 4. [Figure 8A] Schematic diagram showing an example of a binarized image [Figure 8B] Schematic diagram showing an example of a binarized image [Figure 9A] Schematic diagram showing an example of a mask image [Figure 9B] Schematic diagram showing an example of a mask image [Figure 10A] Schematic diagram showing an example of an effective bonding area image [Figure 10B] Schematic diagram showing an example of an effective bonding area image [Figure 11A] Graph showing the phase distribution in a phase image of a workpiece having a bonded area with a bond strength of 532N [Figure 11B] Graph showing the phase distribution in a phase image of a workpiece having a bonded area with a bond strength of 712 N [Figure 11C] Graph showing the phase distribution in a phase image of a workpiece having a bonded area with a bond strength of 950N [Figure 12] Graph showing an example of the correlation between effective area ratio and bonding strength [Figure 13] Graph showing an example of the relationship between phase range and correlation coefficient [Figure 14] Flowchart showing an example of an effective phase range determination process [Figure 15] Schematic diagram including a group of images for explaining the process of determining an effective phase range [Figure 16] 1 is a flowchart showing an example of a joining method according to the present embodiment. DETAILED DESCRIPTION OF THE INVENTION

[0010] Hereinafter, embodiments will be described with reference to the drawings as appropriate. However, more detailed description than necessary may be omitted. For example, detailed description of well-known matters or redundant description of substantially identical configurations may be omitted. This is to avoid unnecessary redundancy in the following description and to facilitate understanding by those skilled in the art. Note that the inventors provide the accompanying drawings and the following description to enable those skilled in the art to fully understand the present disclosure, and do not intend for them to limit the subject matter described in the claims.

[0011] [1. Configuration] [1-1. Manufacturing system configuration] FIG. 1 is a block diagram showing an example configuration of a manufacturing system 1 according to an embodiment of the present disclosure. The manufacturing system 1 includes an inspection system 100 and a bonding system 200. The inspection system 100 inspects the bonding state of a sample 90 that has been laser-bonded under preset bonding conditions, modifies the bonding conditions in accordance with the inspection results, and transmits the modified bonding conditions to the bonding system 200. The bonding system 200 laser-bonds a workpiece 80 in accordance with the received modified bonding conditions. This makes it possible to improve the bonding state of the workpiece 80 compared to when the unmodified bonding conditions are used. The sample 90 and the workpiece 80 are, for example, the same type of product having a similar structure.

[0012] The inspection system 100 includes an inspection device 10 , an infrared camera 17 , an excitation source 18 , a control box 15 , a power supply 16 , and an alarm device 19 .

[0013] The inspection system 100 uses an active thermography method in which excitation energy is applied to the sample 90 to be inspected and temperature images are taken, thereby non-destructively predicting the bonding state of the sample 90. In this embodiment, the inspection system 100 applies excitation energy to the sample 90 using an excitation source 18 and takes temperature images in time series using an infrared camera 17.

[0014] 1, the sample 90 includes a transparent material 91 that mainly transmits light irradiated from a light source for welding or welding (for example, a laser device 27 described below), and an absorbing material 92 that mainly absorbs the light. The transparent material 91 and / or the absorbing material 92 are melted by the light from the light source, and the transparent material 91 and the absorbing material 92 are bonded together at a bonding region 95. In this embodiment, the inspection system 100 can non-destructively predict the bonding state between the transparent material 91 and the absorbing material 92.

[0015] The material of the sample 90 is, for example, a resin such as polybutylene terephthalate (PBT), polyphenylene sulfide (PPS), or polyamide (PA). Alternatively, the material of the sample 90 may be ceramics. The material of the sample 90 may be a metal such as cold-rolled steel (SPCC steel) or aluminum. The material of the sample 90 may be a new material such as CFRP (carbon fiber reinforced plastic), GFRP (glass fiber reinforced plastic), or CNF (cellulose nanofiber).

[0016] The infrared camera 17 is an example of an imaging device that captures images of an imaging area including at least a portion of the sample 90 in time series to generate multiple temperature image data (hereinafter, sometimes simply referred to as "temperature images"). The infrared camera 17 generates temperature image data by converting infrared image data into a temperature distribution, but in this specification, there may be cases where there is no particular distinction between the infrared image data before conversion and the temperature image data after conversion. The infrared camera 17 includes an infrared sensor that detects infrared rays having a wavelength of, for example, 3 μm to 15 μm. The frame rate of the infrared camera 17 is, for example, 50 Hz (or 50 fps), but is not limited to this.

[0017] The excitation source 18 is an example of a heating device capable of heating the sample 90. The excitation source 18 is, for example, a light source such as a xenon lamp, a halogen lamp, or a laser light source, but is not limited to these, and may be any energy source capable of radiating energy.

[0018] The excitation source 18 can perform flash heating (pulse heating) by emitting a flash of light, step heating by heating in steps, or heating by continuously repeating these. The wavelength band of light emitted by the excitation source 18 may be the same as or different from the wavelength band of infrared light detectable by the infrared camera 17. While one excitation source 18 is shown in FIG. 1 as an example, the number of excitation sources 18 is not limited to this and may be two or more.

[0019] The power supply 16 supplies power to the infrared camera 17 and the excitation source 18. The control box 15 includes a control circuit that controls the power supply 16 based on a control signal from the inspection device 10. The control box 15 may also control the light emission method, light emission cycle, light emission time, etc. of the excitation source 18.

[0020] The notification device 19 notifies information to the outside. For example, the notification device 19 is controlled by the inspection device 10 and notifies a user of information indicating the inspection result of the internal state of the sample 90. The notification device 19 may include a visual notification device such as a light source such as an LED, a display, or an indicator. The notification device 19 may also include an auditory notification device such as a speaker.

[0021] The joining system 200 includes a joining device 20, a laser device 27 equipped with a laser light source, and a pressure device 28. The joining device 20 controls the laser device 27 to irradiate the workpieces 80 with laser light, thereby joining the workpieces 80. The workpieces 80 have a configuration similar to that of the sample 90, and include a transmissive material 81 that mainly transmits the laser light, and an absorbing material 82 that mainly absorbs the light. In the example of FIG. 1 , the laser light from the laser device 27 passes through a glass plate 70 to reach the workpieces 80. The glass plate 70 includes a material that is transparent to a specific wavelength (for example, the wavelength of the laser light from the laser device 27).

[0022] The pressure device 28 applies pressure to the workpiece 80, particularly the joining region of the workpiece 80, via the glass plate 70 in accordance with a control signal from the joining device 20. The pressure applied by the pressure device 28 is performed, for example, simultaneously with the irradiation of laser light by the laser device 27. While the structure of the pressure device 28 is shown schematically in FIG. 1, a specific structural example of the pressure device 28 will be described later.

[0023] [1-2. Configuration of inspection equipment] 2A is a block diagram showing an example of the configuration of the inspection device 10 of FIG.

[0024] The processor 11 is composed of a CPU, an MPU, etc., and controls the entire inspection device 10 by executing various programs stored in the storage device 12. The processor 11 controls the excitation source 18 via the control box 15, thereby controlling the start and stop of the heating output of the excitation source 18. The processor 11 also controls the imaging operations of the infrared camera 17, such as the start and stop of imaging. The processor 11 also performs an analysis process to inspect the sample 90 based on the temperature image data stored in the storage device 12, as will be described later.

[0025] The storage device 12 is a recording medium for recording various information including programs and data necessary to realize the functions of the inspection device 10. The storage device 12 is realized, for example, by a semiconductor storage device such as a flash memory or a solid-state drive (SSD), a magnetic storage device such as a hard disk drive (HDD), or other recording media, either alone or in combination. The storage device 12 is not limited to an internal storage device installed in the same housing as the processor 11, but may also be, for example, an external storage device or a NAS (network-attached storage) type storage device. The storage device 12 may include a volatile memory such as a RAM.

[0026] The interface 13 communicatively connects the inspection device 10 to external devices such as the infrared camera 17, the control box 15, the alarm device 19, and the excitation source 18. The interface 13 also includes a communication circuit that performs data communication in accordance with an existing wired communication standard or wireless communication standard, and communicatively connects the inspection device 10 to the bonding device 20.

[0027] The interface 13 is an example of an input unit that connects the inspection device 10 and the infrared camera 17 to input temperature image data from the infrared camera 17 to the inspection device 10. The interface 13 is also an example of an output unit that connects the inspection device 10 to external devices such as the control box 15, the alarm device 19, and the excitation source 18 to output information such as control signals from the processor 11 to the external devices. Such input and output units may be integrated as an input / output interface 13 as shown in FIG. 2A, or may be realized as multiple interface circuits.

[0028] [1-3. Configuration of the joining device] Fig. 2B is a block diagram showing an example of the configuration of the joining device 20 in Fig. 1. The joining device 20 includes a processor 21, a storage device 22, and an interface 23.

[0029] The processor 21 is composed of a CPU, an MPU, etc., and controls the entire bonding device 20 by executing various programs stored in the storage device 12.

[0030] The processor 21 can also control the driving of the laser device 27. For example, the processor 21 controls the laser device 27 to control the timing of starting and stopping the output of laser light by the laser device 27, the output power, etc. The laser device 27 is configured to be able to move the laser light source, and the processor 21 may adjust the moving speed of the laser light source by controlling the laser device 27. The processor 21 also controls the pressurizing operation of the pressurizing device 28, such as starting and stopping pressurization.

[0031] The processor 21 does not need to perform all of the above controls, and the joining device 20 may be provided with a laser driving device that controls the driving of the laser device 27, or a pressure driving device that controls the driving of the pressure device 28.

[0032] The storage device 22 is a recording medium that records various information including programs and data required to realize the functions of the bonding device 20. The storage device 22 may have a configuration similar to that of the storage device 12 in FIG. 2A.

[0033] The interface 23 communicatively connects the bonding device 20 to external devices such as the laser device 27 and the pressure device 28. The interface 23 also includes a communication circuit that performs data communication in accordance with an existing wired communication standard or wireless communication standard, and communicatively connects the bonding device 20 to the inspection device 10. The interface 23 may have a configuration similar to that of the interface 13 in FIG. 2A.

[0034] [1-4. Composition of pressure device] 3 is a schematic diagram showing an example of the configuration of the pressurizing device 28. The pressurizing device 28 shown in FIG. 3 includes stages 281 and 282 that hold the workpiece 80 and the glass plate 70 by sandwiching them, and an elevator 283 that supports the stages 281 and 282. For example, the stage 281 is fixed, and the elevator 283 can move up and down under the control of the processor 21 of the bonding device 20. The pressurizing device 28 further includes a pressure meter 284 that measures the pressure applied to the workpiece 80, and a displacement meter 285 that measures the vertical displacement of the stage 282. The displacement meter 285 can measure the amount of sinking of the workpiece 80 by measuring the vertical displacement of the stage 282.

[0035] The processor 21 can adjust the pressure applied to the workpiece 80 by raising and lowering the lifting platform 283.

[0036] Furthermore, as shown in FIG. 3 , the pressure device 28 may further include a plurality of partial pressure jigs 286. The partial pressure jigs 286 are disposed between the workpiece 80 and the stage 282 and support the workpiece 80. The partial pressure jigs 286 can partially adjust the pressure applied to the workpiece 80 by, for example, increasing or decreasing the thickness under control of the processor 21. For example, four partial pressure jigs 286 are disposed at the four corners of the workpiece 80 in a plan view, and the pressure applied to the four corners of the workpiece 80 can be partially adjusted by increasing or decreasing the thickness of each partial pressure jigs 286. The number of partial pressure jigs 286 may be two or more and is not limited to four. In order to finely adjust the partial pressure applied to the workpiece 80, a large number (for example, 10 to 100) of partial pressure jigs 286 may be disposed below the workpiece 80.

[0037] The partial pressure jig 286 may be a piezoelectric element whose thickness can be changed by applying a voltage, or may be a jig whose thickness can be mechanically changed in response to the driving of a motor, for example.

[0038] [2. Operation] [2-1. Testing Method] 4 is a flowchart showing an example of an inspection method according to the present embodiment. Each process shown in this flow is executed by, for example, the processor 11 of the inspection device 10. The processor 11 performs the inspection method of FIG. 4 on the sample 90.

[0039] The processor 11 first acquires bonding condition data (S1). The bonding condition data is data representing the conditions (an example of a first bonding condition) of the bonding process performed on the sample 90 to be inspected. The bonding conditions include, for example, one or more of various conditions such as the timing of starting and stopping the output of laser light by the laser device 27, the irradiation time of the laser light, the output power, the moving speed of the laser light source, the moving path of the laser light source, the timing of starting and stopping the application of pressure by the pressure device 28, the pressure, and the relationship between time and the pressure position. The bonding conditions are set in advance by, for example, a user, and the bonding condition data is stored in the storage device 12.

[0040] Next, the processor 11 executes a phase image acquisition process (S2). Fig. 5 is a flowchart showing an example of the phase image acquisition process S2 of Fig. 4.

[0041] 5, in the phase image acquisition process S2, first, the processor 11 acquires analysis conditions (S11). The analysis conditions are stored in advance in, for example, the storage device 12. The analysis conditions are, for example, parameters such as an effective phase range, an analysis time, and a set frequency for the phase image, which will be described later. The analysis time includes, for example, an analysis start time and an analysis end time. Alternatively, the processor 11 may acquire, instead of the analysis time, a setting as to which of the multiple temperature images generated by the infrared camera 17 to use for the analysis.

[0042] Next, the processor 11 starts heating the sample 90 with the excitation source 18 and capturing an image of the sample 90 with the infrared camera 17 (S12).

[0043] The processor 11 acquires, via the interface 13, a plurality of temperature images that are generated by the infrared camera 17 photographing the sample 90 in time series (S13).

[0044] Next, the processor 11 performs a discrete Fourier transform or a Fourier transform on the temperature images acquired in step S13 (S14) and extracts a phase image according to the analysis conditions (S15). The phase image indicates, for example, the phase characteristics at a set frequency of the data after the discrete Fourier transform or the Fourier transform.

[0045] FIG. 6 is a schematic diagram illustrating a phase image 31. The phase image 31 in FIG. 6 is a phase image of a tubular sample 90 in which the bonded region extends annularly and the cross section of the bonded portion perpendicular to the extension direction is circular. In the phase image 31 in FIG. 6, the phase value of each pixel is shown in gray scale. That is, as shown in the scale on the right side of FIG. 6, in the phase image 31, pixels with a phase value of 20.0° are shown in black, pixels with a phase value of 10.0° are shown in white, and pixels with a phase value greater than 10.0° and less than 20.0° are shown in gray.

[0046] Next, the processor 11 performs filtering on the phase image extracted in step S15 (S16). The filtering is, for example, image processing such as local equalization (smoothing) filtering, high-pass filtering, and low-pass filtering. The filtering may include processing for adjusting a tone curve. The processor 11 performs filtering to perform processing such as edge enhancement, shading adjustment, and contrast adjustment.

[0047] Returning to FIG. 4, the processor 11 determines, in the phase image, a valid bonded region of the bonded region of the sample 90, whose phase value is within the valid phase range (S3). Here, the "bonded region" refers to a region designated as a target for bonding. While it is generally desirable for the bonded region to be completely bonded, depending on the bonding quality, some or all of the bonded region may not be bonded. Furthermore, the actually bonded portion of the bonded region may include portions where the bonding strength is equal to or greater than a predetermined value and portions where the bonding strength is less than the predetermined value. The valid bonded region refers to a region of the bonded region that is expected to meet a predetermined quality. The "valid phase range" is determined in advance, for example, by the valid phase range determination process described below, and is stored in the storage device 12, for example. The technical knowledge for determining the valid bonded region based on the phase value will be described later.

[0048] FIG. 7 is a flowchart showing an example of the effective bonding area determination process S3 of FIG.

[0049] 7, in the effective joint region determination process S3, first, the processor 11 performs a binarization process on the phase image 31 to generate a binarized image in which pixels in the phase image 31 whose phase values ​​are within a predetermined range are set to white (pixel value 1) (S21). In the binarization process S21, pixels whose phase values ​​are outside the predetermined range are set to black (pixel value 0).

[0050] 8A and 8B are schematic diagrams showing examples of binarized images generated in step S21. FIG. 8A illustrates a binarized image B1 of a workpiece having a circular bonded region in a planar view. FIG. 8B illustrates a binarized image B2 of a workpiece having a rectangular bonded region in a planar view. In the example of FIG. 8A, processor 11 generates binarized image B1 by turning pixels in phase image 31 whose phase value is 12° or less into white.

[0051] Returning to FIG. 7, the processor 11 acquires bonded region mask information from the storage device 12 (S22). The mask information is information that indicates a portion of the phase image that corresponds to the bonded region of the sample 90. The mask information is determined based on drawings and design information. An example of mask information is a mask image in which pixels that correspond to the bonded region of the phase image are white (pixel value 1) and other pixels are black (pixel value 0), as shown in FIGS. 9A and 9B. FIG. 9A illustrates a mask image M1 for a workpiece having a circular bonded region in a planar view, and FIG. 9B illustrates a mask image M2 for a workpiece having a rectangular bonded region in a planar view.

[0052] 7, the processor 11 generates an effective joint area image by superimposing the binary image generated in step S21 on the mask image acquired in step S22 (S23). For example, in step S23, the processor 11 acquires, for each pixel, a logical product of the pixel value of the binary image and the pixel value of the mask image, and sets the acquired logical product as the pixel value of the corresponding pixel in the effective joint area image.

[0053] 10A and 10B are schematic diagrams showing examples of effective bonding area images generated in step S22. Fig. 10A illustrates an effective bonding area image E1 for a workpiece having an annular bonding area in a planar view. Fig. 10B illustrates an effective bonding area image E2 for a workpiece having a rectangular bonding area in a planar view.

[0054] The processor 11 determines that the area occupied by white pixels in the effective joining area images E1 and E2 is the effective joining area (S24).

[0055] Returning to FIG. 4, the processor 11 determines whether or not there is a bonding defect based on the effective bonding area image (S4). For example, the processor 11 determines that there is a bonding defect when the effective bonding area image contains at least one pixel that is not a valid bonding area, i.e., a black pixel (a pixel with a pixel value of 0), in the bonding area. Alternatively, the processor 11 may determine that there is a bonding defect when the number of black pixels present in the bonding area in the effective bonding area image is equal to or greater than a predetermined value. In the examples shown in FIGS. 10A and 10B, it can be seen that there are black pixels in the bonding area.

[0056] If it is determined that there is a poor connection (Yes in S4), the processor 11 causes the notification device 19 to perform a notification operation (S5). This allows the user to know that there is a poor connection. The notification operation includes, for example, emitting a warning sound from a speaker or turning on or blinking a light source such as an LED. Alternatively, the processor 11 may cause a display, which is an example of the notification device 19, to display information indicating the analysis results such as the connection state and the determination result.

[0057] Furthermore, if it is determined that there is a bonding defect (Yes in S4), the processor 11 resets the bonding conditions to improve the bonding state based on the bonding condition data acquired in step S1 and the result of the effective bonding area determination process S3 (S6). Steps S5 and S6 may be performed in any order. Alternatively, in this embodiment, step S5 may be omitted.

[0058] The joining conditions reset in step S6 include, for example, the irradiation time of the laser light by the laser device 27, the output power, the spot size such as the spot diameter, the moving speed of the laser light source, the moving path of the laser light source, the pressure applied by the pressure device 28, the pressure position, the relationship between the time and the pressure position, the number of joining repetitions, the amount of sinking of the joining objects, etc. Furthermore, in the case of spiral irradiation of the laser light, the reset joining conditions may include the width and interval of the spiral irradiation, the moving speed of the laser light source, etc.

[0059] In step S6, the processor 11 resets the bonding conditions so that, for example, the irradiation time of the laser light to positions on the sample 90 corresponding to pixels (black pixels) that are not in the effective bonding area of ​​the bonding area is made longer than the current irradiation time. Note that the current irradiation time is included in the bonding condition data acquired in step S1.

[0060] Additionally or alternatively, the processor 11 resets the bonding conditions so as to increase the pressure applied to positions on the sample 90 corresponding to pixels in the bonding area that are not in the effective bonding area from the currently set value.

[0061] Additionally or alternatively, if the number of pixels in the joining area that are not in the valid joining area is greater than a predetermined value, the processor 11 may reduce the moving speed of the laser light source from a currently set value.

[0062] The processor 11 may reset the joining conditions by correcting the joining condition data acquired in step S1 based on the result of the effective joining area determination process S3. For example, the processor 11 calculates a correction value for the joining condition data acquired in step S1. In this case, the processor 11 resets the joining conditions by correcting the joining condition data acquired in step S1 with the correction value.

[0063] The processor 11 transmits reset data indicating the reset joining conditions (an example of the second joining conditions) to the joining device 20 via the interface 13 (S7). Alternatively, the processor 11 may store the reset data in an external storage device such as a storage device in an external server. This allows the joining device 20 to join the workpieces 80 by referring to the reset data.

[0064] When step S7 is completed, or when it is determined in step S4 that there is no poor connection, the processor 11 ends the processing of FIG.

[0065] [2-2. Effective phase range determination process] The valid phase range and the valid phase range determination process for determining the valid phase range will be described below.

[0066] The inventors have found that in phase images of the bonded regions of the sample 90 or workpiece 80, there is a correlation between the phase value and the bonded state, e.g., bond strength. As an example, the inventors have found that in the phase image 31 shown in FIG. 6, the lower the phase value, the greater the bond strength of the corresponding bonded region, and the better the bonded state. The example in FIG. 6 indicates that the lower the phase value, the easier the heat conducts, and the higher the phase value, the more difficult the heat conducts. Therefore, the example in FIG. 6 indicates that the easier the heat conducts, the greater the bond strength.

[0067] 11A, 11B, and 11C are graphs showing that the lower the phase value, the greater the bonding strength. FIGS. 11A to 11C are graphs showing the distribution of phases in phase images of sample 90 having bonded regions with bonding strengths of 532 N, 712 N, and 950 N, respectively. The horizontal axis of the graphs in FIGS. 11A to 11C represents the phase value, and the vertical axis represents the normalized frequency. The bonding strengths shown in FIGS. 11A to 11C were obtained by acquiring phase images of sample 90 and then performing actual measurements on sample 90, such as by conducting a known bonding strength test.

[0068] 11A to 11C, it can be seen that the greater the bonding strength, the higher the frequency of pixels in the phase image with phase values ​​of 12° or less. Based on this finding, the inventors have come up with the technical idea of ​​predicting the bonding condition, such as bonding strength, based on the effective area ratio, which indicates an example of the ratio of the number of pixels with phase values ​​within the effective phase range (12° or less in the examples of FIGS. 11A to 11C).

[0069] Fig. 12 is a graph showing an example of the correlation between the effective area ratio and the bond strength. The effective area ratio in the graph of Fig. 12 is the ratio (proportion) of the number of pixels whose phase values ​​are within the effective phase range to the total number of pixels in the entire bonded region in the phase image. In this example, the effective phase range is 12° or less. In this graph, the correlation coefficient r between the effective area ratio and the bond strength is 0.98, which indicates a strong correlation between the effective area ratio and the bond strength.

[0070] The inventors also discovered that the effective phase range can change depending on the analysis conditions, and came up with the effective phase range determination process described below for searching for the effective phase range.

[0071] 11A to 11C show the results when the upper limit of the phase value is 12°, but the correlation coefficient can change by changing the phase range. FIG. 13 is a graph showing an example of the relationship between the phase range and the correlation coefficient. The horizontal axis of FIG. 13 indicates the phase range. When the horizontal axis of FIG. 13 is 12°, the correlation coefficient on the vertical axis represents the correlation coefficient between the effective area ratio and the bonding strength, calculated by counting the number of pixels with a phase value of 12° or less.

[0072] Thus, as an example, the correlation coefficient between the effective area ratio and the bond strength depends on the upper limit of the phase value. More generally, the correlation coefficient between the effective area ratio and the bond strength depends on the range of the phase value, for example, the upper and lower limits of the phase value.

[0073] Therefore, when determining the effective bonding region, if an effective phase range (for example, 12° or less) in which the correlation coefficient is large is applied, it is possible to predict with particularly high accuracy the bonding state of the sample 90. Below, an effective phase range determination process for searching for a phase range in which the correlation coefficient is equal to or greater than a threshold, for example, the largest, will be described.

[0074] Fig. 14 is a flowchart showing an example of a process for determining an effective phase range. The process in Fig. 14 is executed by, for example, the processor 11, and the determined effective phase range is stored in the storage device 12. Alternatively, the process in Fig. 14 may be executed by another information processing device. An example in which the processor 11 is the main controller will be described below.

[0075] First, the processor 11 executes a phase image acquisition process S2 (see FIG. 5) on another sample. The other sample is of the same type as the sample 90, and has a junction region similar to that of the sample 90.

[0076] The processor 11 acquires the junction region mask information (S31). Step S31 may be the same processing as step S22 in FIG.

[0077] If the mask information is not pre-stored in the storage device 12, the processor 11 may generate the mask information based on the phase image.

[0078] An example of the process of generating such a mask image M3 will be described with reference to Fig. 15. The processor 11 segments the portion of the phase image 31 that corresponds to the junction region to generate a segment image 32. Next, the processor 11 generates a mask image M3 by setting the portion of the segment image 32 that corresponds to the junction region to white (pixel value 1) and the other portion to black (pixel value 0). The processor 11 stores the generated mask image M3 in the storage device 12.

[0079] 14, the processor 11 calculates the area of ​​the joint region from the joint region mask information acquired in step S31 (S32). For example, the processor 11 calculates the number of white pixels in the mask image M3 as the area of ​​the joint region.

[0080] Next, the processor 11 generates a joint region image 33 by excluding regions other than the joint region from the phase image (S33). For example, as shown in Fig. 15, the processor 11 generates the joint region image 33 by coloring the portions of the segment image 32 other than the portions corresponding to the joint region black (pixel value 0). Alternatively, the processor 11 may generate the joint region image 33 by performing a mask process on the phase image 31 using a mask image M3.

[0081] Next, the processor 11 acquires a preset phase search range. In the illustrated example, the processor 11 acquires the minimum value Ni and maximum value Ne of the phase values ​​to be searched (S34). The minimum value Ni and maximum value Ne are, for example, stored in the storage device 12 in advance. In this embodiment, a phase range (effective phase range) is searched for in which the correlation coefficient between the minimum value Ni and the maximum value Ne is the largest. In this case, the processor 11 divides the phase range between the minimum value Ni and the maximum value Ne into n steps (n is an integer of 2 or more) and calculates the correlation coefficient for each step. The number of steps n is also stored in the storage device 12 in advance and is acquired by the processor 11 in step S34.

[0082] To search for the phase, processor 11 sets the initial value of variable k (k is an integer equal to or greater than 0) to 0 (S35), and sets the current phase value N to Ni+(Ne-Ni)k / n (S36). When k is the initial value (0), N=Ni.

[0083] The processor 11 performs binarization processing on the bonding area image 33 to generate an effective bonding area image 34 in which pixels in the bonding area image 33 whose phase values ​​are within a predetermined range (Ni or more and N or less) are set to white (pixel value 1) (S37). The effective bonding area image 34 is an image showing the effective bonding area.

[0084] Next, the processor 11 calculates the number of white pixels in the effective bonding area image 34 as the area of ​​the effective bonding area (S38).

[0085] The processor 11 calculates the ratio of the area of ​​the effective bonding area to the area of ​​the bonding area as the effective area ratio (S39). For example, the processor 11 calculates the effective area ratio (A1 / A2) by dividing the area of ​​the effective bonding area (A1) calculated in step S38 by the area of ​​the bonding area (A2) calculated in step S32.

[0086] Processor 11 searches for a valid phase range within the search range by repeating the processes of steps S36 to S39. Specifically, for example, after executing the processes of steps S36 to S39, processor 11 determines whether N determined in step S36 is equal to Ne (S40). If N=Ne is not true (No in S40), processor 11 increments k (S41) and executes the processes of steps S36 to S40.

[0087] If N=Ne in step S40 (Yes in S40), the process proceeds to step S42.

[0088] In step S42, the processor 11 acquires the bonding strength of the sample (S42). The bonding strength is measured by, for example, a peel test.

[0089] The processor 11 associates the effective area ratio calculated in step S39 with the bonding strength obtained in step S42 and records them in the storage device 12.

[0090] The above process is executed until the number of data (number of samples) reaches a predetermined number (S44, S45). The predetermined number is determined in advance by a user or the like. For example, if the number of data is insufficient (No in S44), the sample is replaced (S45), and the processes of steps S1, S31 to S44 are executed for the replaced sample. The replaced sample is a sample of the same type and has a similar structure to the sample before replacement and workpiece 80.

[0091] When the number of data reaches a predetermined number (Yes in S44), processor 11 calculates the correlation coefficient between the effective area ratio and the bonding strength for each phase range based on the data recorded in step S43 (S46), thereby obtaining a graph showing the relationship between the phase range and the correlation coefficient as shown in FIG.

[0092] Based on the result of step S46, the processor 11 determines an effective phase range in which the correlation coefficient between the effective area ratio and the bonding strength is equal to or greater than a threshold (S47). The determined effective phase range is used in step S3 of FIG. 4, which determines the effective bonding area.

[0093] [2-3.Joining method] 4 (Yes in S4), the inspection device 10 transmits reset data indicating the joining conditions reset in step S6 to the joining device 20 (S7). The joining device 20 joins the workpieces 80 based on the received reset data.

[0094] Fig. 16 is a flowchart showing an example of such a joining method by the joining device 20. Each process shown in this flow is executed by, for example, the processor 21 of the joining device 20. The processor 21 performs the joining method of Fig. 16 on the workpiece 80.

[0095] 16, first, the processor 21 acquires joining condition data (S51). When the processor 21 receives reset data from the inspection device 10, the processor 21 acquires the reset data as joining condition data in step S51. When the processor 21 has not received reset data, the processor 21 acquires joining condition data previously stored in the storage device 22. The joining condition data is data that represents the conditions of the joining process to be performed on the workpiece 80, and has the same data structure as the joining condition data acquired by the processor 11 in step S1 of FIG. 4, for example.

[0096] The initial data of the bonding condition data is set, for example, by a user and stored in the storage device 22. For example, every time the processor 21 receives reset data from the inspection device 10, the bonding condition data stored in the storage device 22 is replaced (overwritten) with the received reset data.

[0097] The processor 21 joins the workpieces 80 based on the joining condition data acquired in step S51 (S52). For example, in step S52, the processor 21 controls the laser device 27 and / or the pressure device 28 so as to realize the conditions included in the joining condition data acquired in step S51.

[0098] This allows the joining device 20 to join the workpiece 80 according to the improved joining conditions based on the results of the effective joining area determination process S3 in Figure 4, thereby improving the joining quality of the workpiece 80 manufactured after obtaining the improved joining conditions.

[0099] [3. Effects, etc.] As described above, the inspection device 10 according to this embodiment includes an interface 13, which is an example of an input unit, and a processor 11. The interface 13 acquires temperature image data generated by an imaging device taking time-series images of a sample bonded in a predetermined bonding region according to a first bonding condition that has been set in advance. The processor 11 inspects the bonding state of the sample based on the temperature image data. The processor 11 determines second bonding conditions for improving the bonding state based on the first bonding conditions and the inspection results of the bonding state (S6).

[0100] According to this embodiment, it is possible to obtain second joining conditions for improving the joining state of the product. For example, the joining apparatus 20 can join the workpieces 80 according to the second joining conditions obtained in this manner, and the joining quality of the workpieces 80 manufactured after the second joining conditions are obtained can be improved.

[0101] The processor 11 may perform a Fourier transform or a discrete Fourier transform on the temperature image data to generate a phase image showing the phase characteristics of the sample (S2), determine an effective bonding area in the bonding area of ​​the phase image, where the phase value is within a predetermined range (S3), and inspect the bonding condition based on the size of the effective bonding area.

[0102] According to this configuration, the inspection device 10 can inspect the bonding state of the sample based on a more practical index, namely, the size of the effective bonding area.

[0103] In this embodiment, samples are joined using laser light. The first joining conditions include at least one set value of the irradiation time of the laser light, the output power of the laser light, and the number of repetitions of the laser light irradiation. The processor 11 adjusts at least one set value of the irradiation time, the output power, and the number of repetitions of the laser light irradiation included in the first joining conditions based on the inspection results of the joined state, and determines the adjusted set value as the second joining condition. With this configuration, it is possible to obtain the second joining condition for improving the joined state for a joining method including laser joining.

[0104] In this embodiment, the samples are bonded by applying pressure to the samples in addition to irradiating them with laser light. The first bonding conditions further include at least one set value of the pressure and the pressure position for the pressure. The processor 11 adjusts at least one set value of the pressure and the pressure position included in the first bonding conditions based on the inspection results of the bonded state, and determines the adjusted set value as the second bonding condition. With this configuration, it is possible to obtain the second bonding condition for improving the bonded state for a bonding method including a pressurizing step.

[0105] The processor 11 may cause the notification device 19 to notify the user of information indicating the inspection result of the bonding state. This allows the user to know the inspection result of the bonding state.

[0106] The processor 11 may store the second joining conditions in a storage device. Such a storage device may be the storage device 12 included in the inspection device 10, or may be an external storage device such as a storage device in an external server. For example, the joining device 20 can join the workpieces 80 in accordance with the second joining conditions stored in the storage device, thereby improving the joining quality of the workpieces 80 manufactured after the second joining conditions are obtained.

[0107] 4. Other Embodiments As described above, the embodiments have been described as examples of the technology in the present disclosure. However, the technology in the present disclosure is not limited to these, and can be applied to embodiments in which modifications, substitutions, additions, omissions, etc. are made as appropriate. Furthermore, it is also possible to combine the components described in the above embodiments to create new embodiments. Therefore, other embodiments will be described below as examples.

[0108] In the above embodiment, the inspection method including the filtering process and the binarization process has been described. However, the processor 11 may omit at least one of the filtering process and the binarization process as long as it can inspect the bonding state of the sample 90 based on the size of the effective bonding area.

[0109] [5.Examples] The following describes exemplary aspects of the present disclosure.

[0110] <Aspect 1> an input unit that acquires temperature image data generated by an image capture device that captures images of the sample bonded in a predetermined bonding region in accordance with a first bonding condition that has been set in advance; a processor for inspecting the bonding state of the sample based on the temperature image data; the processor determines second bonding conditions for improving the bonding state based on the first bonding conditions and the inspection result of the bonding state; Inspection equipment.

[0111] <Aspect 2> The processor applying a Fourier transform or a discrete Fourier transform to the temperature image data to generate a phase image indicative of the phase characteristics of the sample; determining an effective joint area in which the phase value is within a predetermined range in the joint area of ​​the phase image; inspecting the bonding state based on the size of the effective bonding area; 2. The inspection device according to claim 1.

[0112] <Aspect 3> The sample is bonded by laser light, the first bonding condition includes at least one set value of a laser beam irradiation time, an output power of the laser beam, and a repetition number of the laser beam irradiation; the processor adjusts at least one setting value of the irradiation time, the output power, and the number of repetitions of the laser light irradiation included in the first bonding condition based on the inspection result of the bonding state, and determines the adjusted setting value as the second bonding condition; 3. The inspection device according to claim 1 or 2.

[0113] <Aspect 4> The samples are bonded by applying pressure to the samples in addition to irradiating them with laser light. the first bonding condition further includes at least one set value of a pressure and a pressure position related to the pressure application; the processor adjusts at least one set value of the pressure force and the pressure position included in the first bonding condition based on the inspection result of the bonding state, and determines the adjusted set value as the second bonding condition; 4. The inspection device according to embodiment 3.

[0114] <Aspect 5> 5. The inspection device according to any one of aspects 1 to 4, wherein the processor causes the notification device to notify information indicating the inspection result of the bonding state.

[0115] <Aspect 6> 6. The inspection device according to any one of aspects 1 to 5, wherein the processor stores the second bonding condition in the storage device.

[0116] <Aspect 7> An inspection method for inspecting a bonding state of a sample based on temperature image data generated by an imaging device taking time-series images of the sample bonded in a predetermined bonding region in accordance with a first bonding condition that is set in advance, the method comprising: a processor acquiring temperature image data; a step of determining, by a processor, second bonding conditions for improving the bonding state based on the first bonding conditions and the inspection result of the bonding state; 12. A testing method comprising:

[0117] <Aspect 8> A bonding system including: an inspection device that inspects a bonding state of a sample based on temperature image data generated by an imaging device taking time-series images of a sample bonded in a predetermined bonding region in accordance with a first bonding condition that is set in advance; and a bonding device that bonds a workpiece of the same type as the sample based on the inspection result of the bonding state, The inspection equipment is an input unit for acquiring temperature image data; a processor for inspecting the bonding state of the sample based on the temperature image data; the processor determines second bonding conditions for improving the bonding state based on the first bonding conditions and the inspection result of the bonding state; the joining device acquires second joining condition data indicating second joining conditions, and joins the workpieces based on the acquired second joining condition data; Joining system. [Industrial Applicability]

[0118] The present disclosure is applicable to an inspection apparatus and an inspection method. [Explanation of symbols]

[0119] 1. Manufacturing System 10 Inspection equipment 11 processors 12 Storage device 13 Interface 15 Control Box 16 Power supply 17. Infrared Camera 18 Excitation Source 19 Alarm device 20 Bonding equipment 21 processors 22 Storage device 23 Interface 27 Laser Device 28 Pressure Device 70 Glass Plate 80 Work 81 Transparent material 82 Absorbent material 90 samples 91 Transparent material 92 Absorbent material 95 Joint area 100 Inspection Systems 200 Joint System

Claims

1. an input unit that acquires temperature image data generated by an image capture device that captures images of the sample bonded in a predetermined bonding region in accordance with a first bonding condition that has been set in advance; a processor for inspecting a bonding state of the sample based on the temperature image data; the processor determines second bonding conditions for improving the bonding state based on the first bonding conditions and the inspection result of the bonding state. Inspection equipment.

2. The processor: performing a Fourier transform or a discrete Fourier transform on the temperature image data to generate a phase image showing the phase characteristics of the sample; determining an effective joint area in the joint area of ​​the phase image, the effective joint area being within a predetermined range of phase values; inspecting the bonding state based on the size of the effective bonding area; The inspection device according to claim 1 .

3. The sample is bonded by laser light; the first joining condition includes at least one set value of an irradiation time of the laser light, an output power of the laser light, and a repetition number of the irradiation of the laser light, the processor adjusts at least one set value of the irradiation time, the output power, and the number of repetitions of the laser light irradiation, which are included in the first bonding condition, based on the inspection result of the bonding state, and determines the adjusted set value as the second bonding condition. The inspection device according to claim 1 .

4. The sample is bonded by applying pressure to the sample in addition to the irradiation of the laser light, the first joining condition further includes at least one set value of a pressure and a pressure position related to the pressing, the processor adjusts at least one set value of the pressing force and the pressing position included in the first joining condition based on the inspection result of the joining state, and determines the adjusted set value as the second joining condition. The inspection device according to claim 3 .

5. 5. The inspection device according to claim 1, wherein the processor causes a notification device to notify information indicating the inspection result of the bonding state.

6. The inspection device according to claim 1 , wherein the processor stores the second bonding condition in a storage device.

7. 1. An inspection method for inspecting a bonding state of a sample based on temperature image data generated by an imaging device photographing the sample in a time series, the sample being bonded in a predetermined bonding region in accordance with a first bonding condition that is set in advance, the method comprising: a processor acquiring the temperature image data; determining, by the processor, second bonding conditions for improving the bonding state based on the first bonding conditions and the inspection result of the bonding state; 12. A testing method comprising:

8. A joining system including: an inspection device that inspects a joining state of a sample based on temperature image data generated by an imaging device taking time-series images of the sample joined in a predetermined joining region in accordance with a first preset joining condition; and a joining device that joins a workpiece of the same type as the sample based on the inspection results of the joining state, The inspection device includes: an input unit for acquiring the temperature image data; a processor for inspecting a bonding state of the sample based on the temperature image data; the processor determines second bonding conditions for improving the bonded state based on the first bonding conditions and the inspection result of the bonded state; the joining device acquires second joining condition data indicating the second joining condition, and joins the workpieces based on the acquired second joining condition data; Joining system.

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