Fluid treatment device and method for cleaning fluid treatment device

Abstract

A fluid processing apparatus and a method for cleaning the fluid processing apparatus are provided that can more effectively remove fluids and contamination adhering to an area including the upper part of the inside of a cover provided in the fluid processing apparatus than conventional methods, thereby preventing contamination of wafers. [Solution] The fluid processing device of this embodiment comprises a holding section capable of holding the workpiece so that the first surface of the workpiece is exposed, a rotation mechanism for rotating the holding section, a cover arranged to surround the holding section, and a first fluid supply section for supplying a first fluid to the area surrounded by the cover, and the holding section has a main surface facing the first surface of the workpiece held by the holding section, and has one or both of a fluid guide recess having a concave shape recessed relative to the main surface and a fluid guide protrusion having a convex shape protruding relative to the main surface.

Description

[Technical Field]

[0001] The present invention relates to a fluid treatment device and a method for cleaning a fluid treatment device. [Background technology]

[0002] Device chips used in electrical equipment such as mobile phones and PCs (Personal Computers) are manufactured using wafers made of semiconductor materials such as silicon. Specifically, planned division lines are set on the surface of the wafer, and devices are formed in each of a plurality of regions separated by these planned division lines.

[0003] The wafer on which the devices are formed is then ground from the back side by a grinding device or the like to a predetermined thickness, and then divided along the planned division lines by a dividing device (a cutting device, a laser processing device, or the like), thereby producing a plurality of device chips, each having a device.

[0004] During the processing performed by the above-described processing devices, such as the grinding device and the dividing device, contamination such as processing debris (grinding debris and cutting debris) is generated. If the wafer is processed or transported while the contamination remains on the wafer, the wafer cannot be processed or transported appropriately. Furthermore, the contamination adheres to the device chips formed from the wafer, resulting in the production of low-quality device chips.

[0005] For this reason, processed wafers may be cleaned using a cleaning liquid or the like in a fluid processing device (cleaning device, surface processing device, etc.), or the surface of the wafer may be treated using a chemical solution (see, for example, Patent Document 1).

[0006] As described in Patent Document 1, for example, a fluid processing apparatus includes a holding unit capable of holding a wafer as the object to be processed, a base plate having a main surface facing the wafer held by the holding unit, a rotation mechanism for rotating the base plate around a rotation axis intersecting the main surface, a cover provided to surround the holding unit and the base plate, and a fluid supply unit for supplying a fluid such as a cleaning liquid or a chemical liquid to the area surrounded by the cover.

[0007] The cover provided in the fluid processing device has the role of preventing the fluid used to process the wafer from scattering outside the fluid processing device, collecting and recovering the fluid, and controlling the airflow within the fluid processing device. [Prior art documents] [Patent documents]

[0008] [Patent Document 1] Japanese Patent Publication No. 2022-045184 Summary of the Invention [Problem to be solved by the invention]

[0009] After processing a wafer with a fluid processing device, fluid may adhere to the inner wall of the cover, or contaminants that were attached to the wafer may adhere to the inner wall of the cover along with the fluid. If fluid or contaminants adhere to the inner wall of the cover, the contaminants may fall onto the surface of the processed wafer or onto the wafer holder of the fluid processing device, contaminating the wafer or the holder.

[0010] Therefore, in some fluid processing devices, cleaning is performed to clean the inner wall of the cover of the fluid processing device, separate from the processing of the wafers. Cleaning of the inner wall of the cover is performed by supplying a fluid for cleaning the inner wall of the cover from a fluid supply unit that supplies fluid to the wafers. However, due to the structure of the device, it is difficult for the cleaning fluid to reach the upper part of the inner wall of the cover. For this reason, when cleaning the fluid processing device, a wafer or a plate-like object resembling a wafer may be placed in the holder. If a wafer or the like is present during cleaning of the fluid processing device, the cleaning fluid may collide with the upper surface of the wafer or the like, causing it to splash, allowing some of the fluid to reach the inner wall of the cover.

[0011] However, even when using cleaning wafers, it is difficult to ensure that a sufficient amount of cleaning fluid reaches the top of the inner wall of the cover. Furthermore, when using cleaning wafers, it takes time to prepare the cleaning wafers and to transport them into and out of the fluid processing device, which effectively increases the cost and time required for wafer processing.

[0012] Therefore, in view of the above circumstances, the object of the present invention is to provide a fluid processing apparatus and a cleaning method for a fluid processing apparatus that can more effectively remove fluids and contamination adhering to areas including the upper part of the inner wall of the cover provided in the fluid processing apparatus than conventional methods, thereby reducing contamination of the wafer and the fluid processing apparatus. [Means for solving the problem]

[0013] A fluid processing device according to one aspect of the present invention is a fluid processing device that processes a workpiece having a first surface and a second surface opposite the first surface by supplying a fluid to the workpiece, and includes: a holding section that can hold the workpiece so that the first surface of the workpiece is exposed; a base plate that has a main surface facing the second surface of the workpiece held by the holding section; a rotation mechanism that rotates the base plate around a rotation axis that intersects the main surface; a cover that is arranged to surround the holding section and the base plate; and a first fluid supply section that supplies a first fluid to the area surrounded by the cover, and the base plate has one or both of a fluid guide recess that has a concave shape that is recessed relative to the main surface and a fluid guide protrusion that has a convex shape that protrudes relative to the main surface.

[0014] Another aspect of the present invention provides a fluid processing device that supplies a fluid to a workpiece having a first surface and a second surface opposite the first surface to process the workpiece, and includes a table having a main surface that can support the workpiece from the second surface side so that the first surface of the workpiece is exposed, a rotation mechanism that rotates the table around an axis of rotation that passes through the center of the table and intersects the main surface, a cover provided on the outer periphery of the table, and a fluid supply unit that supplies a first fluid to an area surrounded by the cover, and the table has one or both of a fluid guide recess having a concave shape that is recessed relative to the main surface and a fluid guide protrusion having a convex shape that protrudes relative to the main surface.

[0015] Preferably, the fluid guide protrusion has an annular portion surrounding the rotation axis.

[0016] Preferably, the fluid guide protrusion has an arc-shaped portion.

[0017] Preferably, the fluid guide protrusion has an inclined portion inclined with respect to the rotation axis so as to move away from the main surface as it moves away from the rotation axis, and the fluid guide recess has an inclined portion inclined with respect to the rotation axis so as to move closer to the main surface as it moves away from the rotation axis.

[0018] Preferably, the fluid guide convex portion has a first side surface arranged on the rotating shaft side, a second side surface arranged on the opposite side of the first side surface and provided on the outer periphery of the base plate, and a protrusion portion including an area sandwiched between the first side surface and the second side surface, and a through hole having one end opening on the first side surface side and the other end opening on the second side surface side is formed in the protrusion portion.

[0019] Preferably, the fluid guide recess and the fluid guide protrusion are formed from the rotation shaft side toward the outside of the main surface.

[0020] Preferably, the main surface has an opening, and the apparatus further includes a second fluid supply section that supplies a second fluid to the second surface of the object to be processed through the opening.

[0021] Preferably, the first fluid supply unit has a fluid supply point adjustment unit that moves the supply point of the first fluid between a first point on the main surface and a second point that is farther from the rotation axis than the first point.

[0022] Preferably, the cover has a side portion provided along a direction parallel to the rotation axis, and a canopy portion having a shape that approaches the rotation axis with increasing distance from the side portion.

[0023] A method for cleaning a fluid processing device according to yet another aspect of the present invention is a method for cleaning a fluid processing device that processes a workpiece having a first surface and a second surface opposite to the first surface by supplying a fluid to the workpiece, the workpiece comprising: a holder that holds the workpiece so that the first surface of the workpiece is exposed; a base plate having a main surface facing the second surface of the workpiece held by the holder; a rotation mechanism that rotates the base plate around a rotation axis that passes through the center of the base plate and intersects with the main surface; a cover provided to surround the holder and the base plate; and a second surface in an area surrounded by the cover. and a fluid supply unit that supplies a first fluid, wherein the base plate is provided with a fluid guide unit that includes one or both of a concave fluid guide recess that is recessed into the main surface and a convex fluid guide protrusion that protrudes from the main surface, and the cleaning device includes a rotation step of rotating the base plate around the rotation axis by the rotation mechanism, and a first fluid supply step of supplying the first fluid to the main surface of the base plate by the fluid supply unit, and when the rotation step and the first fluid supply step are performed, the first fluid supplied to the main surface moves along the fluid guide unit due to centrifugal force generated by the rotation of the rotation axis, leaves the main surface, reaches the inner surface of the cover, and cleans the inner surface of the cover.

[0024] A method for cleaning a fluid processing device according to yet another aspect of the present invention is a method for cleaning a fluid processing device that processes a workpiece having a first surface and a second surface opposite to the first surface by supplying a fluid to the workpiece, the method comprising: a table having a main surface that supports the second surface side of the workpiece so that the first surface of the workpiece is exposed; a rotation mechanism that rotates the table around a rotation axis that passes through the center of the table and intersects the main surface; a cover provided on the outer periphery of the table; and a fluid supply unit that supplies a first fluid to an area surrounded by the cover, wherein the table The table is provided with a fluid guide section including one or both of a fluid guide recess having a concave shape recessed into the main surface and a fluid guide protrusion having a convex shape protruding from the main surface, and the table is provided with a rotation step of rotating the table around the rotation axis by the rotation mechanism, and a first fluid supply step of supplying the first fluid to the main surface of the table by the fluid supply section, and when the rotation step and the first fluid supply step are carried out, the first fluid supplied to the main surface travels along the fluid guide section due to centrifugal force generated by the rotation of the rotation axis, leaves the main surface, reaches the inner surface of the cover, and cleans the inner surface of the cover. [Effects of the Invention]

[0025] A fluid processing device according to one aspect of the present invention has one or both of a fluid guide recess having a concave shape recessed relative to a main surface of a holder and a fluid guide protrusion having a convex shape protruding relative to the main surface. When the main surface is rotated around a rotation axis by a rotation mechanism and a first fluid is supplied into the cover by a first fluid supply unit, the supplied first fluid flows along the fluid guide recess or the fluid guide protrusion due to centrifugal force and proceeds toward the upper part of the inner wall of the cover.

[0026] The first fluid that has reached the upper part of the inner wall of the cover flows down along the inner wall of the cover to the lower part of the inner wall of the cover, thereby allowing the first fluid to remove fluids and contaminants adhering to the entire area including the upper part of the inner wall of the cover. [Brief explanation of the drawings]

[0027] [Figure 1] FIG. 1 is a perspective view schematically showing a grinding device according to a first embodiment. [Figure 2] FIG. 2 is an exploded perspective view schematically showing the cleaning unit. [Figure 3] FIG. 3 is a perspective view schematically showing the cleaning unit. [Figure 4] FIG. 4 is a perspective view schematically showing a table included in the cleaning unit. [Figure 5] Figure 5(A) is a cross-sectional view showing a schematic view of a cleaning unit and a portion of a wafer when the cover of the cleaning unit is in an open position, and Figure 5(B) is a cross-sectional view showing a schematic view of a cleaning unit and a portion of a wafer when the cover of the cleaning unit is in a storage position. [Figure 6] FIG. 6 is a cross-sectional view that schematically shows the cover, the base plate, the rotating shaft, the nozzle, and the like. [Figure 7] FIG. 7 is a cross-sectional view schematically showing a fluid guide protrusion. [Figure 8] FIG. 8 is a flow chart showing the flow of each step of the cleaning method carried out by the fluid cleaning device according to this embodiment. [Figure 9] FIG. 9 is a side view schematically showing a fluid guide convex portion provided in the cleaning unit according to the second embodiment. [Figure 10] FIG. 10 is a cross-sectional view schematically showing a fluid guide convex portion provided in the cleaning unit according to the second embodiment. [Figure 11] FIG. 11 is a top view schematically showing a base plate and a fluid guide convex portion provided in a cleaning unit according to the third embodiment. [Figure 12] FIG. 12 is a top view schematically showing a base plate and a fluid guide convex portion provided in a cleaning unit according to the fourth embodiment. [Figure 13] FIG. 13 is a top view schematically showing a base plate and a fluid guide convex portion provided in a cleaning unit according to the fifth embodiment. [Figure 14] FIG. 14 is a cross-sectional view schematically showing a cover, a base plate, a rotation shaft, a nozzle, and the like provided in a cleaning unit according to the sixth embodiment. [Figure 15] FIG. 15 is a top view schematically showing a base plate and a fluid guide convex portion provided in a cleaning unit according to a sixth embodiment. DETAILED DESCRIPTION OF THE INVENTION

[0028] A fluid processing apparatus according to a first embodiment of the present invention will now be described with reference to the accompanying drawings. The fluid processing apparatus according to this embodiment is incorporated as a cleaning unit in, for example, a grinding apparatus that grinds disk-shaped wafers.

[0029] The cleaning unit cleans wafers ground by the grinding machine. However, the processing machine in which the fluid treatment device is incorporated is not limited to the grinding machine. Furthermore, the fluid treatment device does not have to be incorporated into the processing machine, and may be an independent device.

[0030] Furthermore, the fluid treatment apparatus is not limited to one that cleans wafers with a fluid. For example, the fluid treatment apparatus may be an apparatus that treats wafers with a fluid. An example of such an apparatus is a spin coater. In any case, in the fluid treatment apparatus described below, the wafer is the object to be treated.

[0031] Fig. 1 is a perspective view that schematically shows a grinding apparatus 2. Prior to describing the configuration of the grinding apparatus 2, a description will be given of a wafer (workpiece) 11 (see Fig. 6) that is ground by the grinding apparatus 2. The wafer (workpiece) 11 is configured in a disk shape having a circular first surface 11a (front surface, see Fig. 5(A) etc.) and a circular second surface 11b (back surface, see Fig. 5(A) etc.) opposite to the first surface 11a.

[0032] The wafer 11 may be made of, for example, silicon (Si), silicon carbide (SiC), gallium nitride (GaN), gallium arsenide (GaAs), or other semiconductor materials. The wafer 11 may also be made of sapphire, quartz, glass, ceramics, or other materials. Examples of glass include alkali glass, non-alkali glass, soda-lime glass, lead glass, borosilicate glass, and quartz glass. However, the shape and material of the wafer 11 are not limited to these.

[0033] A plurality of mutually intersecting division lines (not shown) are set on the first surface 11a of the wafer 11. Devices (not shown), such as ICs, are formed in each of the regions defined by the division lines on the first surface 11a of the wafer 11.

[0034] The wafer 11 is thinned by grinding it from the second surface 11b side using the grinding device 2, and then divided along the dividing lines using a cutting device or laser processing device to form individual device chips. However, the dividing lines do not necessarily have to be provided on the wafer 11. Furthermore, the wafer 11 does not necessarily have to have any devices provided thereon.

[0035] A tape-like protective member may be attached to the first surface 11a of the wafer 11 in advance to protect the first surface 11a while the wafer 11 is being ground. The protective member includes, for example, a base layer and an adhesive layer formed on the base layer.

[0036] Next, we will explain each component of the grinding device 2. As shown in Fig. 1, the grinding device 2 has a base 4 that supports each component. Cassette mounting tables 26a and 26b are arranged on the front upper surface of the base 4. A transfer robot 30 is installed on the base 4 at a position adjacent to the cassette mounting tables 26a and 26b.

[0037] The wafers 11 are transported, for example, in cassettes 28a and 28b that can accommodate a plurality of wafers 11, and then loaded into the grinding device 2. The transfer robot 30 takes out the wafers 11 from the cassettes 28a and 28b placed on the cassette mounting tables 26a and 26b, and transports the wafers 11 to a positioning table 32 provided on the base 4 at a position adjacent to the transfer robot 30.

[0038] The positioning table 32 has a plurality of positioning pins arranged in a ring. When the wafer 11 is placed in the central placement area, the positioning table 32 moves each of the positioning pins radially inward in unison to position the wafer 11 at a predetermined position. A loading arm 34 and an unloading arm 36 are provided on the upper surface of the base 4 at positions adjacent to the positioning table 32. The wafer 11, whose position has been adjusted by the positioning table 32, is transported by the loading arm 34.

[0039] A disk-shaped turntable 6 is provided on the central upper surface of the base 4 so as to be rotatable within a horizontal plane. For example, four chuck tables 8 are provided on the upper surface of the turntable 6, spaced apart from each other by 90 degrees in the circumferential direction. When the turntable 6 is rotated, each chuck table 8 can be moved. However, the number of chuck tables 8 is not limited to four.

[0040] Each chuck table 8 has an internal suction path (not shown) one end of which is connected to a suction source (not shown), and the other end of the suction path is connected to a holding surface 8a on the chuck table 8. The holding surface 8a is formed, for example, by the upper surface of a porous member. When a wafer 11 is placed on the holding surface 8a, the chuck table 8 can suction-hold the wafer 11 by activating the suction source and applying negative pressure to the wafer 11 through the porous member. The chuck table 8 rotates around an axis that intersects with the holding surface 8a.

[0041] The wafer 11 is loaded onto the chuck table 8 in the loading area 6a shown in Fig. 1. In the loading area 6a, the wafer 11 is loaded onto the chuck table 8 by the loading arm 34 so that the second surface 11b of the wafer 11 is exposed.

[0042] After the wafer 11 is loaded onto the chuck table 8 positioned in the loading area 6a, the turntable 6 is rotated to move the chuck table 8 to the rough grinding area 6b. After rough grinding is performed on the second surface 11b of the wafer 11 in the rough grinding area 6b, the turntable 6 is rotated to move the chuck table 8 to the finish grinding area 6c adjacent to the rough grinding area 6b. Then, finish grinding is performed on the second surface 11b of the wafer 11 in the finish grinding area 6c.

[0043] A standing portion 22 is provided at the rear of the base 4. A first grinding unit (processing unit) 10a that roughly grinds the second surface 11b of the wafer 11 held by the chuck table 8 positioned in the rough grinding region 6b is supported on the front surface of the standing portion 22.

[0044] A second grinding unit (processing unit) 10b that finish-grinds the second surface 11b of the wafer 11 held by the chuck table 8 positioned in the finish-grinding region 6c is supported at a position adjacent to the first grinding unit 10a on the front surface of the standing portion 22. The first grinding unit 10a and the second grinding unit 10b are configured to be moved up and down by processing feed units 24a and 24b, respectively.

[0045] The first grinding unit 10a and the second grinding unit 10b are provided with spindles 14a and 14b, whose upper ends are connected to spindle motors 12a and 12b, respectively, and which extend vertically. The spindles 14a and 14b are rotated by the spindle motors 12a and 12b.

[0046] Wheel mounts 16a and 16b are connected to the lower ends of the spindles 14a and 14b, respectively. Grinding wheels 18a and 18b are attached to the lower surfaces of the wheel mounts 16a and 16b, respectively. Circularly arranged grinding wheels 20a and 20b are provided on the lower surfaces of the grinding wheels 18a and 18b. The wafer 11 held by the chuck table 8 is ground by the grinding wheels 20a and 20b.

[0047] When the first grinding unit 10a and the second grinding unit 10b grind the wafer 11 held on the chuck table 8, first, the chuck table 8 and the grinding wheels 18a and 18b are rotated at predetermined rotational speeds, respectively. Then, the processing feed units 24a and 24b are operated to lower the grinding wheels 18a and 18b at a predetermined feed speed.

[0048] When the rotating grinding wheels 20a, 20b come into contact with the second surface 11b of the wafer 11, the wafer 11 is ground by the grinding wheels 20a, 20b. The grinding wheels 18a, 18b are lowered until the wafer 11 reaches a predetermined thickness, and then the grinding wheels 18a, 18b are raised to complete the grinding. When the wafer 11 is being ground, a grinding fluid such as pure water is supplied to the grinding wheels 20a, 20b from a nozzle (not shown) or the like, and the grinding fluid removes processing debris and grinding heat generated by grinding.

[0049] The wafer 11 is unloaded from the chuck table 8 in the unloading area 6d. After the finish grinding of the wafer 11 is performed in the finish grinding area 6c, the turntable 6 is rotated to move the chuck table 8 to the unloading area 6d, and the wafer 11 is unloaded from the chuck table 8 by the unloading arm 36.

[0050] A cleaning unit 38, which is a fluid treatment apparatus according to this embodiment that cleans and dries the ground wafer 11, is disposed near the unloading arm 36 on the upper surface of the base 4 and the transfer robot 30. The wafer 11 that has been cleaned and dried by the cleaning unit 38 is then carried out of the cleaning unit 38 by the transfer robot 30 and stored in the cassettes 28a and 28b placed on the cassette placement stages 26a and 26b.

[0051] Next, details of the cleaning unit that cleans the wafer 11 after grinding will be described. Fig. 2 is an exploded perspective view that schematically shows an example of the cleaning unit 38a, and Fig. 3 is a perspective view that schematically shows an example of the cleaning unit 38a. As shown in Figs. 2 and 3, the cleaning unit 38a according to the example includes a table (holding unit) 40 that holds the wafer 11, a rotation drive source 52 such as a motor that rotates the table 40, and a fluid supply unit (first fluid supply device) 56 that supplies a fluid (cleaning liquid, first fluid) to the wafer 11 supported on the table 40.

[0052] 4 is a perspective view schematically showing the table (holding portion) 40. The table 40 is made of a metal material such as stainless steel or ceramics. The table 40 includes a base plate (table base) 42a, which is a substantially circular plate-shaped member having a diameter equivalent to that of the wafer 11.

[0053] The main surface (upper surface) 48a of the base plate 42a is provided with fluid guide protrusions 200 for controlling the flow of fluid such as cleaning liquid. The configuration and function of the fluid guide protrusions 200 will be described in detail later.

[0054] Three or more support protrusions 44 are arranged on the main surface 48a of the base plate 42a, supporting the wafer 11 from below through point contact. The support protrusions 44 are, for example, conical or cylindrical members with a small upper surface area, and come into contact with the supported wafer 11 over a small area that can be considered point contact. The support protrusions 44 are members that support the weight of the wafer 11. The support protrusions 44 are arranged rotationally symmetrically on the main surface 48a of the base plate 42a, and stably support the wafer 11 from below.

[0055] Three or more outer peripheral support parts 46 are arranged on the outer peripheral part 50a of the base plate 42a to support the outer peripheral edge of the wafer 11 from the sides. In the cleaning unit 38, the wafer 11 is sufficiently supported from below by the support protrusions 44, so the outer peripheral support parts 46 do not need to support the wafer 11 from below, and only need to contact the side of the wafer 11 with a relatively small contact area. Next, the outer peripheral support parts 46 will be described in detail.

[0056] Figure 4 is a perspective view showing a schematic representation of the table 40, Figure 5(A) is a cross-sectional view showing a schematic representation of the cleaning unit and a portion of the wafer when the cover is in the open position, and Figure 5(B) is a cross-sectional view showing a schematic representation of the cleaning unit and a portion of the wafer when the cover is in the storage position.

[0057] 4, 5(A), and 5(B), the outer periphery support part 46 includes a main body 92 through which a shaft part 94 passes. The shaft part 94 is disposed on the outer periphery part 50a of the base plate 42a parallel to the main surface 48a of the base plate 42a and along the circumferential direction of the base plate 42a. The main body 92 is a prismatic member that can rotate around the shaft part 94, and rotates within a plane perpendicular to the main surface 48a of the base plate 42a.

[0058] A protrusion 98 extending outward from the base plate 42a is connected to a portion of the main body 92 below the shaft 94. Furthermore, an L-shaped elastic member support portion 102 is fixed to the underside of the base plate 42a at a position where the outer periphery support portion 46 of the base plate 42a is disposed. The L-shaped elastic member support portion 102 includes a vertical portion 102a (see FIGS. 5(A) and 5(B)) that is longer than the portion of the outer periphery support portion 46 below the shaft 94 of the main body 92, and a horizontal portion 102b that extends outward from the lower end of the vertical portion 102a.

[0059] The horizontal portion 102b of the elastic member support portion 102 and the protruding portion 98 of the outer periphery support portion 46 face each other and are connected by an elastic member 100 such as a coil spring. The elastic member 100 fixed to the horizontal portion 102b of the elastic member support portion 102 urges the protruding portion 98 upward. In other words, the outer periphery support portion 46 is urged by the elastic member 100 so that the portion of the outer periphery support portion 46 above the shaft portion 94 of the main body 92 falls toward the center of the base plate 42a.

[0060] 5(B), when the wafer 11 supported by the support protrusions 44 is placed above the base plate 42a, the outer circumferential edge of the wafer 11 placed above the base plate 42a abuts against the side surface of the main body 92 above the shaft portion 94, facing the center of the base plate 42a. At this time, the main body 92 presses the wafer 11 toward the center of the base plate 42a due to the action of the elastic member 100. The wafer 11 is clamped from the sides by being pressed toward the center of the base plate 42a by each of the three or more outer circumferential support portions 46.

[0061] Claws 96 that protrude toward the center of the base plate 42a are formed on the upper end of the main body 92. The claws 96 have the function of preventing the wafer 11 from jumping out of the base plate 42a when cleaning the wafer 11 supported on the table 40. In other words, the table 40 holds the wafer 11 being cleaned in the cleaning unit 38 in a predetermined position by the support projections 44, the outer periphery support portion 46, and the claws 96 of the main body 92.

[0062] 2 and 3, the cleaning unit 38a includes a cylindrical cover (table cover) 66 that covers the outer periphery of the table 40 (the base plate 42a and the outer periphery support portion 46). An opening 68 having a diameter larger than the diameter of the base plate 42a is formed in the upper part of the cover 66.

[0063] 5(A) and 5(B), an eave portion (tapered portion) 66b having an inner diameter that decreases as it approaches the opening 68 is formed at the upper end of the upper end of the eave portion 66b on the inner wall of the cover 66. A side portion (cylindrical portion) 66a is connected to the lower end of the eave portion 66b on the inner wall of the cover 66, and is provided along a direction intersecting the main surface 48a, and has a diameter sufficient to cover, from the outer periphery, three or more outer periphery support members 46, each having a base plate 42 disposed on its outer periphery. Here, the diameter of the opening 68 is set to be insufficient to surround, from the outer periphery, three or more outer periphery support members 46.

[0064] A lifting unit 70 is connected to the lower end of the cover 66. The lifting unit 70 includes, for example, a plurality of sets of air cylinders 72 extending in the vertical direction, piston rods 74 whose lower ends are housed in the air cylinders 72, and connecting parts 76 that connect the upper ends of the piston rods 74 to the lower end of the cover 66. A piston (not shown) that divides the internal space of the air cylinder 72 into upper and lower parts is connected to the lower end of each piston rod 74.

[0065] The lifting unit 70 raises and lowers the cover 66 by controlling the air pressure in the internal space of the air cylinder 72 to raise and lower the piston. More specifically, the lifting unit 70 raises and lowers the cover 66 between an open position (FIG. 5(A)) in which the table 40 is exposed from an opening 68 in the cover 66 to allow the wafer 11 to be loaded and unloaded, and a storage position (FIG. 5(B)) in which the table 40 is stored.

[0066] When cleaning the wafer 11, the lifting unit 70 raises the cover 66 to the storage position and covers the outer periphery of the table 40 with the cover 66 so as to prevent the fluid (cleaning liquid) supplied to the wafer 11 from scattering outside the cleaning unit 38. When loading or unloading the wafer 11 onto or from the table 40, the cover 66 is lowered to the open position and the base plate 42a is exposed outside the cover 66 through the opening 68.

[0067] FIG. 5(A) is a cross-sectional view schematically showing a portion of the cleaning unit and wafers when the cover is in the open position, and FIG. 5(B) is a cross-sectional view schematically showing a portion of the cleaning unit and wafers when the cover is in the retracted position. When the lifting unit 70 lowers the cover 66 from the retracted position (FIG. 5(B)) to the open position (FIG. 5(A)), the eaves portion 66b on the inner wall of the cover 66 comes into contact with the protrusion 98 of the outer periphery support part 46. FIG. 5(A) is an enlarged cross-sectional view schematically showing the eaves portion 66b coming into contact with the protrusion 98 of the outer periphery support part 46 and the eaves portion 66b pressing against the protrusion 98. When the eaves portion 66b presses against the protrusion 98, the main body 92 of the outer periphery support part 46 rotates around the shaft 94, and the outer periphery support part 46 opens.

[0068] When the outer peripheral support parts 46 are opened, it becomes possible to carry the wafer 11 into the space surrounded by the cover 66. Furthermore, if the wafer 11 is supported from the outer peripheral side by the outer peripheral support parts 46, when the outer peripheral support parts 46 are opened, the support of the wafer 11 by the outer peripheral support parts 46 is released, and the wafer 11 can be carried out.

[0069] Then, after placing the wafer 11 on the support protrusions 44 on the main surface 48a of the base plate 42a, when the cover 66 is raised to the storage position (FIG. 5(B)), the eaves 66b no longer comes into contact with the protrusions 98. FIG. 5(B) schematically shows a state in which the eaves 66b does not come into contact with the protrusions 98 of the outer periphery support part 46. As shown in FIG. 5(B), in this state, the outer periphery support part 46 is biased by the elastic member 100 to close, and the wafer 11 is supported from the side.

[0070] The cleaning unit 38a includes a rotary drive source 52 such as a motor that rotates the table 40. A spindle 54 of the rotary drive source 52 is connected to the center of the underside of the base plate 42a, and when the spindle 54 is rotated by the rotary drive source 52, the base plate 42a rotates around the spindle 54. As will be described later, a fluid supply path 110 (see FIG. 6) is formed at the center of the rotary drive source 52 and the spindle 54. An opening 112 at one end of the fluid supply path 110 is shown in FIGS. 2, 3, and 4.

[0071] The cleaning unit 38a further includes a fluid supply unit 56 that supplies a fluid (cleaning liquid) to the second surface 11b and the first surface 11a of the wafer 11 supported on the table 40. The configuration of the fluid supply unit 56 is shown in FIG.

[0072] The fluid supply unit 56 includes a plurality of upper nozzles 60 serving as nozzles for the cleaning liquid (fluid) to be sprayed onto the second surface 11b of the wafer 11, an upper housing 58 in which the plurality of upper nozzles 60 are installed, and a liquid supply pipe 62 connected to the upper housing 58. The cleaning liquid (fluid) supplied to the upper housing 58 through the liquid supply pipe 62 is sprayed from the upper nozzles 60 onto the second surface 11b of the wafer 11.

[0073] In the cleaning unit 38, for example, water mixed with hydrofluoric acid (HF), ozone water, water mixed with ammonium hydroxide (NH4OH), water mixed with carbon dioxide gas, pure water, etc. are used as cleaning liquid (fluid). The other end of the liquid supply pipe 62 is connected to a fluid supply source (not shown) that contains these fluids.

[0074] The cleaning unit 38 also includes a valve (not shown) that controls the supply state of the fluid from the fluid supply source to the liquid feed pipe 62. In the cleaning unit 38, the valve is switched appropriately to select and use various fluids according to the stage of cleaning the wafer 11. However, the number of cleaning liquid supply sources and valves, and the fluids used are not limited to these.

[0075] The fluid supply unit 56 also has a fluid supply point adjustment section (not shown). The fluid supply point adjustment section can change the point to which the fluid is supplied (the fluid supply point) between a first point on the main surface 48a of the base plate 42a or the second surface 11b of the wafer 11 and a second point on the main surface 48a of the base plate or the second surface 11b of the wafer 11, the second point being at a different distance from the rotation center line 13a (see FIG. 6) than the first point. However, the point to which the fluid is supplied may be changed between three or more supply points on the main surface 48a of the base plate 42a or the second surface 11b of the wafer 11.

[0076] The fluid supply point adjusting unit can adjust the position of the fluid supply point on the main surface 48a of the base plate or on the wafer 11 by adjusting the flow rate of the fluid (cleaning liquid) supplied from the upper fluid nozzle 60. Furthermore, the fluid supply unit 56 may be provided with a movement mechanism, and may move relative to the main surface 48a of the base plate or the wafer 11, thereby adjusting the position of the fluid supply point on the main surface 48a of the base plate or on the wafer 11.

[0077] The fluid supply unit 56 includes a fluid supply path 110 that vertically passes through the center of each of the rotation drive source 52, the spindle 54, and the base plate 42a. The upper end of the fluid supply path 110 exposed on the main surface 48a of the base plate 42a functions as a lower nozzle 114 (see FIG. 6) that supplies fluid through the fluid supply path 110 to the first surface 11a of the wafer 11 that is supported by the support protrusions 44 and floats above the base plate 42a.

[0078] The liquid supply pipe 62 branches midway from the fluid supply source to the upper housing 58 and is connected to the lower end of the fluid supply path 110. The fluid supply unit 56 supplies the cleaning liquid from the upper nozzle 60 to the second surface 11b of the wafer 11 through the liquid supply pipe 62, and also supplies the cleaning liquid from the lower nozzle (see FIG. 6) 114 to the first surface 11a of the wafer 11 through the fluid supply path 110. It can also be said that the fluid supply unit 56 includes a first fluid supply part that supplies the cleaning liquid to the second surface 11b of the wafer 11, and a second fluid supply part that supplies the cleaning liquid to the first surface 11a of the wafer 11.

[0079] 2 and 3, the cleaning unit 38 may include a sliding unit 78 that brings a cleaning tool 86 into contact with and slides it on the second surface 11b of the wafer 11. As shown in FIG. 2 and other figures, the sliding unit 78 includes an elevation rotation unit 80 that combines a rotation drive source such as a motor and an elevation drive source such as an air cylinder. The sliding unit 78 further includes an elevation shaft 82 whose lower end is housed in the elevation rotation unit 80 and extends vertically, and an arm 84 that extends horizontally from the upper end of the elevation shaft 82. The cleaning tool 86 is attached to the lower tip of the arm 84.

[0080] The cleaning tool 86 is a member such as a sponge or a brush made of resin or the like. The lifting shaft 82 is capable of raising and lowering the arm 84 and rotating it. When cleaning the second surface 11b of the wafer 11 supported on the table 40, the sliding unit 78 moves the cleaning tool 86 to the second surface 11b of the wafer 11 surrounded by the cover 66 and slides it over the second surface 11b of the wafer 11.

[0081] Next, a procedure for cleaning both surfaces of the wafer 11 ground by the grinding apparatus 2 in the cleaning unit 38 according to this embodiment will be described. The wafer 11, whose second surface 11b has been ground by the first grinding unit 10a and the second grinding unit 10b of the grinding apparatus 2, is transferred from the chuck table 8 to the cleaning unit 38 by the unloading arm 36. At this time, the second surface 11b, which is the surface to be ground, faces upward.

[0082] When placing the wafer 11 on the table 40, the lifting unit 70 is operated in advance to lower the cover 66 to the open position 88, and the outer periphery support part 46 is opened as shown in FIG. 5(A). Then, the unloading arm 36 places the wafer 11 on the base plate 42a of the table 40. At this time, the wafer 11 is supported from below by the support protrusions 44.

[0083] Thereafter, the lifting unit 70 is operated to raise the cover 66 to the storage position 90. Then, as shown in FIG. 5(B), the outer peripheral support parts 46 close to support the wafer 11 from the outer periphery, and the table 40 is stored in the cover 66.

[0084] The cleaning unit 38a may also have a partition wall (not shown) that can be raised and lowered and can house the table 40, the fluid supply unit 56, and the sliding unit 78. In this case, the partition wall is raised to shield the internal space of the cleaning unit 38 from the outside when cleaning the wafer 11. When the internal space of the cleaning unit 38 is shielded from the outside by the partition wall, it is possible to prevent processing debris and cleaning liquid adhering to the wafer 11 from scattering to the outside, and the grinding device 2 can be kept clean.

[0085] Next, the rotary drive source 52 is operated to rotate the table 40 supporting the wafer 11. The rotation speed at this time is set to about 300 rpm. Also, the valve of the fluid supply unit 56 is operated to connect the liquid supply pipe 62 to the corresponding fluid supply source.

[0086] Then, a fluid (cleaning liquid) is supplied from the upper nozzle 60 to the second surface 11b of the wafer 11, and a fluid is supplied from the lower nozzle 114, which has a fluid supply path 110 and an opening 112, to the first surface 11a of the wafer 11. As a result, the wafer 11 is cleaned from both the first surface 11a and the second surface 11b. That is, processing debris adhering to the first surface 11a and the second surface 11b of the wafer 11 is taken in by the cleaning liquid and washed away from the wafer 11.

[0087] The supply rate of the fluid (cleaning liquid) is preferably set to, for example, 500 ml / min or more and 2000 ml / min or less. It is also possible to clean only the second surface 11b of the wafer 11 without cleaning the first surface 11a. In this case, there is no need to supply fluid from the lower nozzle 114, and only the fluid supply unit 56 is operated.

[0088] If it is desired to thoroughly clean the second surface 11b, which is the surface to be ground of the wafer 11 in the grinding device 2, the sliding unit 78 may be operated to bring the cleaning tool 86 into contact with the second surface 11b. At this time, the cleaning tool 86 is moved in an arc-shaped path that passes through the center of the rotating wafer 11, and is brought into contact with the second surface 11b in the region from the center to the outer periphery of the second surface 11b of the wafer 11, whereby the second surface 11b is cleaned by the cleaning tool 86.

[0089] After the first surface 11a and the second surface 11b of the wafer 11 are cleaned by appropriately switching the fluids, the supply of the fluids is stopped. Then, the table 40 is further rotated to dry the wafer 11. At this time, it is preferable to rotate the table 40 at a rotation speed of 300 rpm or more and 2000 rpm or less, for example.

[0090] Here, for example, when the wafer 11 is supported from below by the support protrusions 44 with an extremely small area, cleaning liquid containing processing debris is unlikely to accumulate around the support protrusions 44. Furthermore, because the wafer 11 is supported from below by the support protrusions 44, there is no need for the outer peripheral support portion 46 to support the weight of the wafer 11, and the outer peripheral support portion 46 does not come into contact with the second surface 11b of the wafer 11. Therefore, fluid does not accumulate on the first surface 11a of the wafer 11 around the outer peripheral support portion 46.

[0091] Therefore, in this case, in the cleaning unit 38, the cleaning liquid that has absorbed the processing debris remains on the second surface 11b of the wafer 11 and evaporates, so that the processing debris does not stick to the second surface 11b of the wafer 11. Therefore, both surfaces of the wafer 11 can be cleaned so that no processing debris remains.

[0092] Meanwhile, the cleaning liquid (fluid) that has absorbed the processing debris is scattered to the outside of the wafer 11 due to centrifugal force generated by the rotation of the wafer 11, and adheres to the inner wall of the cover 66. If the cleaning liquid dries in this state, the processing debris will remain on the inner wall of the cover 66 and become a source of contamination. Therefore, in the fluid processing apparatus (cleaning unit 38) according to this embodiment, the inner wall of the cover 66 is cleaned using the configuration described below.

[0093] Next, the configuration and operation of the fluid guide protrusion 200 provided on the main surface 48a of the base plate 42a will be described. Fig. 6 is a cross-sectional view schematically showing the cover 66, the base plate 42a, the fluid supply path 110, etc., and Fig. 7 is a cross-sectional view schematically showing the fluid guide protrusion 200. Note that Fig. 6 illustrates the state in which fluid 15 is supplied from the fluid supply unit 56.

[0094] As shown in FIGS. 6 and 7, the base plate 42a has a fluid guide protrusion 200 that is provided on the outer periphery of the base plate 42a and has an annular portion that surrounds the rotation center line (rotation axis) 13a of the spindle 54. The fluid guide protrusion 200 has an upper surface 202 and a lower surface 204 that are substantially parallel to the main surface 48a of the base plate 42a. The fluid guide protrusion 200 also has a side surface 208 that is substantially perpendicular to the main surface 48a of the base plate 42a. The fluid guide protrusion 200 also has an inclined portion 206 that is inclined with respect to the rotation center line 13a so as to become increasingly away from the main surface 48a as it moves away from the rotation center line 13a. The inclined portion 206 is located closer to the rotation center line 13a of the spindle 54 than the side surface 208.

[0095] With the wafer 11 having been removed from the cleaning unit 38 and no longer supported by the support protrusions 44 or the like, the table 40 (base plate 42a) is rotated about the rotation center line 13a. In this state, when the fluid supply unit 56 supplies the fluid 15 to the main surface 48a of the base plate 42a of the table 40, the fluid 15 supplied to the main surface 48a moves toward the outer periphery of the base plate 42a due to centrifugal force. The fluid 15 then reaches the fluid guide protrusions 200 and moves upward along the inclined portions 206 of the fluid guide protrusions 200 (moves in the direction of the arrow in FIG. 6 ), then leaves the fluid guide protrusions 200 and proceeds upward toward the inner wall of the upper region of the cover 66.

[0096] The fluid 15 that reaches the inner wall including the region above the cover 66 flows down along the inner wall, thereby supplying the cleaning liquid to the entire inner wall including the region above the cover 66. As a result, contamination and the like adhering to the inner wall are washed away by the cleaning liquid from the entire inner wall.

[0097] If the fluid guide protrusions 200 were not provided on the base plate 42a, the fluid 15 supplied to the main surface 48a of the base plate 42a would only reach the inner wall of the cover 66 up to the same height as the base plate 42a (main surface 48a), making it difficult to supply the fluid 15 to a higher position on the inner wall. This makes it difficult to remove contamination on the upper part of the inner wall of the cover 66. On the other hand, in this embodiment, the fluid guide protrusions 200 make it possible to clean the entire area of ​​the inner wall of the cover 66, including the upper part.

[0098] Next, a method for cleaning a fluid processing apparatus according to this embodiment will be described. The method for cleaning a fluid processing apparatus (cleaning unit 38a) according to this embodiment is carried out before and after cleaning the wafer 11 described above. Fig. 8 is a flow chart showing the flow of each step of the method for cleaning a fluid cleaning apparatus according to this embodiment. As shown in Fig. 8, the method for cleaning a fluid processing apparatus according to this embodiment includes a rotation step S10 and a fluid supply step S20.

[0099] Before the rotation step S10, the wafer 11 is carried out from the fluid treatment device (cleaning unit 38a), and the lifting unit 70 is operated to lift the cover 66. Then, as shown in FIG. 5(B), the table 40 is accommodated in the cover 66.

[0100] Then, a rotation step S10 is performed to start rotating the table 40. In the rotation step S10, the table 40 is rotated around the rotation center line 13a by the rotary drive source 52. At this time, it is preferable to rotate the table 40 at a rotation speed of about 1500 rpm, for example.

[0101] Next, in the fluid supplying step S20, the fluid 15 is supplied to the base plate 42a from the fluid supply unit 56. Specifically, the fluid is supplied to the base plate 42a from the upper nozzle 60, and also from the lower nozzle 114 having the fluid supply path 110 and the opening 112.

[0102] The fluid may be a fluid used as a cleaning liquid for cleaning the wafer 11. However, the fluid used for cleaning the wafer 11 may be different from the fluid used in the cleaning method of the fluid cleaning device. The supply rate of the fluid may be set to, for example, 800 ml / min.

[0103] It is not necessary for the fluid to be supplied from both the upper nozzle 60 and the lower nozzle 114. In other words, the fluid may be supplied to the base plate 42a from either the upper nozzle 60 or the lower nozzle 114.

[0104] 6, the fluid 15 supplied to the base plate 42a moves up the inclined portion 206 of the fluid guide protrusion 200 due to centrifugal force, and continues to move through the air with the same momentum until it reaches a region including the upper portion of the inner wall of the cover 66. As a result, the entire inner wall of the cover 66 is cleaned.

[0105] The rotation step S10 and the fluid supply step S20 may be performed in reverse order. That is, after the fluid is supplied to the table 40 in the fluid supply step, centrifugal force may be applied to the fluid in the rotation step, causing it to travel toward the inner wall of the cover 66.

[0106] Next, a modified example of the cleaning unit (fluid processing device) will be described. Fig. 9 is a side view of the fluid guide convex part 300 provided in the cleaning unit according to the second embodiment, and Fig. 10 is a cross-sectional view of the fluid guide convex part 300 provided in the cleaning unit according to the second embodiment. The cleaning unit according to the second embodiment differs from the first embodiment in the shape of the fluid guide convex part 300.

[0107] 9 and 10, the fluid guide protrusion 300 included in the cleaning unit according to the second embodiment has a first side surface 302 arranged on the rotation center line 13a side, a second side surface 308 arranged on the opposite side to the first side surface 302 and provided on the outer periphery of the base plate 42b, and a protrusion 310 including an area sandwiched between the first side surface 302 and the second side surface 308. Note that Fig. 9 is a side view seen from the second side surface 308 side.

[0108] The first side surface 302 has a first inclined portion 304 that is inclined with respect to the rotation center line 13a so as to move away from the main surface 48b as the distance from the rotation center line 13a increases, and a second inclined portion 306 that is inclined with respect to the rotation center line 13a so as to move closer to the main surface 48b as the distance from the rotation center line 13a increases. The protrusion 310 has a through hole 312 that is open at one end toward the first side surface 302 and at the other end toward the second side surface 308.

[0109] In this case, when centrifugal force generated by the rotation of the base plate 42b acts on the fluid 15 supplied to the base plate 42b and moves the fluid 15 to the fluid guide protrusion 300, the fluid 15 climbs the first inclined portion 304 and accumulates on the second inclined portion 306. At this time, the flow path of the fluid 15 is narrowed by the through hole 312 and the fluid 15 passes through the through hole 31 at a relatively high speed, so the flow rate of the fluid 15 passing through the through hole 31 and moving through the air from the base plate 42b toward the inner wall of the cover 66 becomes higher. In other words, the cleaning power of the fluid 15 on the inner wall of the cover 66 can be improved.

[0110] Here, the angle formed between the main surface 48b and the penetrating direction of the through-hole 312 is set to, for example, 20° or more and 60° or less. The fluid supply rate is set to, for example, 700 ml / min or more and 800 ml / min or less, and the rotation speed of the table 40 is set to, for example, 1400 rpm or more and 15600 rpm or less.

[0111] However, there are no limitations to these settings for the angle between the main surface 48b and the through-hole 312, the amount of fluid supplied, and the rotation speed of the table 40. The configuration of the second embodiment other than the fluid guide protrusion 300 is the same as that of the first embodiment.

[0112] 11 is a top view of a base plate 42c and a fluid guide protrusion 400 included in a cleaning unit according to the third embodiment. In the third embodiment, the shape of the fluid guide protrusion 400 differs from that of the first embodiment. That is, as shown in FIG. 11, the fluid guide protrusion 400 according to the third embodiment has an arc-shaped portion that intersects in the radial direction of the main surface 48c of the base plate 42c.

[0113] That is, the fluid guide convex portion 400 has a shape that constitutes each of the three portions obtained by removing a portion of the fluid guide convex portion 200 of the first embodiment and dividing it into three. Other configurations of the cleaning unit according to the third embodiment are the same as those of the first embodiment. A cleaning unit having a fluid guide convex portion 400 of this shape can also obtain the same effects as those of the first and second embodiments.

[0114] In particular, in the third embodiment, the fluid guide protrusions 400 are arranged between the support protrusions 44 or the outer peripheral support portions 46 in the circumferential direction of the base plate 42c. In this case, the fluid that passes through the fluid guide protrusions 400 does not collide with the support protrusions 44 or the outer peripheral support portions 46. If the fluid that is released into the air through the fluid guide protrusions 400 were to collide with the support protrusions 44 or the like, the fluid would be widely scattered toward the outside of the cover 66. In the third embodiment, such a situation can be avoided.

[0115] 12 is a top view of the base 42d and the fluid guide convex portion 500 included in the cleaning unit according to the fourth embodiment. In the fourth embodiment, the shape of the fluid guide convex portion 500 is similar to that of the fluid guide convex portion 400 of the third embodiment, but the arrangement position on the base 42d is different from that of the third embodiment.

[0116] That is, in the cleaning unit according to the fourth embodiment, the fluid guide convex portions 500 and the cutout portions 116b provided on the outer periphery of the base 42d are alternately arranged in the circumferential direction of the base 42d, as shown in Fig. 12. From another perspective, the fluid guide convex portions 500 are arranged on the outer periphery of the main surface 48d of the base 42d.

[0117] The cutout portion 116b provided on the outer periphery of the base 42d forms a space for installing the outer periphery support portion 46. Other configurations of the cleaning unit according to the fourth embodiment are the same as those of the third embodiment. The cleaning unit having the fluid guide convex portion 500 of this shape also provides the same effects as those of the first to third embodiments.

[0118] In particular, in the cleaning unit according to the fourth embodiment, when the fluid supplied to the main surface 48d of the base 42d moves due to the centrifugal force generated by the rotation of the base 42d, the distance the fluid travels before reaching the fluid guide protrusion 500 becomes large. In other words, the fluid hits the fluid guide protrusion 500 at a position farther away from the rotation center line 13c. The further away from the rotation center line 13c, the greater the centrifugal force the fluid receives, and therefore the flow rate of the fluid climbing the fluid guide protrusion 500 and proceeding into the air becomes relatively high. This increases the cleaning effect of the fluid.

[0119] 13 is a top view of a base plate 42e, a fluid guide protrusion 600, and a fluid guide recess 700 included in a cleaning unit according to the fifth embodiment. The shape of the fluid guide protrusion 600 and its arrangement on the base plate 42e of the fifth embodiment are similar to the shape of the fluid guide protrusion 500 and its arrangement on the base 42d of the fourth embodiment. In this embodiment, in addition to the fluid guide protrusion 600, a fluid guide recess 700 is further provided on the base plate 42e.

[0120] The fluid guide recess 700 is a groove formed from the rotation center line 13d toward the outside of the base plate 42e. The fluid guide recess 700 does not have to follow the radial direction of the base plate 42e, and may have a slightly curled shape as shown in Fig. 13. In this way, the cleaning unit having the fluid guide protrusion 600 and the fluid guide recess 700 can also achieve the same effects as the first to fourth embodiments.

[0121] For example, if the base plate 42e does not have the fluid guide recess 700, the fluid supplied to the base plate 42e and subjected to centrifugal force will spread isotropically in all directions from the rotation center line 13d toward the outside of the base plate 42e, and will therefore be dispersed into each path, with the flow rate of the fluid in each path being relatively small.

[0122] In contrast, in the fifth embodiment, fluid guide recesses 700 are formed in the base plate 42e. In this case, the fluid moving under centrifugal force is guided by the fluid guide recesses 700, so that most of the fluid supplied to the main surface 48e of the base plate 42e gathers at and passes through each fluid guide recess 700. This narrows the fluid's travel path, causing the fluid to travel intensively along a specific path. In this case, the fluid flow rate increases in each path, and the fluid that passes through the fluid guide recesses 700, climbs the fluid guide protrusions 600, and travels through the air experiences a greater impact force on the cover 66.

[0123] The fluid guide recess 700 may be replaced with a fluid guide protrusion. That is, instead of the fluid guide recess 700, a fluid guide protrusion having the cross-sectional shape shown in Fig. 7 may be formed from the rotation center line 13d side toward the outside of the base plate 42e.

[0124] Fig. 14 is a cross-sectional view schematically showing a cover 66, a table 42f, a fluid supply unit 56b, etc. provided in the cleaning unit 38b according to the sixth embodiment. Fig. 15 is a top view schematically showing the table 42f and a fluid guide recess 800 provided in the cleaning unit 38b according to the sixth embodiment.

[0125] The cleaning unit 38b shown in FIG. 14 includes a table 900, which is a holder that can support the wafer 11 (processing object) from the first surface 11a side so that the second surface 11b of the wafer 11 is exposed.

[0126] The table 900 is connected to one end of a spindle 930. The other end of the spindle 930 is connected to a rotation mechanism (not shown). The rotation mechanism operates to generate a rotational driving force, which causes the table 900 to rotate together with the spindle 930 around the rotation center line 13e.

[0127] The table 900 has a plurality of suction holes 910a, 910b, 910c, 910d, 910e, 910f, 910g, 910h, and 910i in a main surface (upper surface) 900a. As shown in Fig. 15, the suction holes 910a to 910i are arranged in this order: 910a, 910b, 910c, 910d, and 910e, along a first direction that is the radial direction of the table 900. Furthermore, the suction holes 910f, 910g, 910c, 910h, and 910i are arranged in this order along a second direction that is perpendicular to the first direction.

[0128] Suction holes 910a to 910i are connected to through-hole 920 provided inside spindle 930. One end of through-hole 920 is connected to suction holes 910a to 910i, and the other end is connected to a suction source (not shown).

[0129] After placing the wafer 11 on the table 900 so that the first surface 11a faces the main surface 900a of the table 900, when the suction source is activated, a negative pressure generated from the suction source acts on the first surface 11a of the wafer 11 through the through-hole 920 and the suction holes 910a to 910i. As a result, the wafer 11 is sucked onto the table 900 and held thereon.

[0130] A fluid guide recess 800 is provided on the main surface 900a of the table 900. The fluid guide recess 800, like the suction holes 910a to 910i, is arranged concentrically on the main surface 900a of the table 900. However, the fluid guide recess 800 is provided closer to the outer periphery of the table 900 than the suction holes 910a to 910i.

[0131] The side surface of the fluid guide recess 800 on the outer periphery side of the table 900 has an inclined portion 800a that is inclined with respect to the rotation center line 13e so as to approach the main surface 900a as it moves away from the rotation center line 13e. By providing a fluid guide recess 800 having such a shape, the present embodiment also achieves the same effects as the first embodiment. That is, as shown in FIG. 14, the fluid 15 supplied to the table 900 passes through the inclined portion 800a of the fluid guide recess 800 due to centrifugal force and reaches a region including the upper part of the inner wall of the cover 66. As a result, the entire inner wall of the cover 66 is cleaned.

[0132] The fluid guide recess 800 may be arranged similarly to the fluid guide protrusion 400 provided on the base plate 42c of the third embodiment (Figure 11) and the fluid guide protrusion 500 provided on the base plate 42c of the fourth embodiment (Figure 12).

[0133] Furthermore, the support table 900 may be provided with a fluid guide protrusion instead of the fluid guide recess 800, or may be provided with a fluid guide protrusion together with the fluid guide recess 800. When the support table 900 is provided with a fluid guide protrusion, the fluid guide protrusion is arranged so as not to prevent contact between the workpiece and the main surface 900a. Specifically, the fluid guide protrusion is arranged outside the outer diameter of the workpiece placed on the support table 900.

[0134] The support table may also be a table equipped with a porous plate for holding the workpiece. Such a support table may include, for example, a metal frame having a recess on the top, and a porous plate fitted into the recess. The porous plate may be made of porous ceramics having countless pores, such as silica (SiO2) or alumina (Al2O3).

[0135] A through-hole is provided inside the frame, one end of which is connected to the porous plate and the other end of which is connected to a negative pressure source such as a vacuum pump. When the negative pressure source is activated with the first surface 11a of the workpiece 11 in contact with the porous plate, negative pressure generated by the negative pressure source acts on the first surface 11a of the workpiece 11 through the through-hole and the pores in the porous plate. As a result, the workpiece 11 is sucked in and held by the porous plate. In other words, the porous plate forms the main surface (holding surface) that holds the workpiece.

[0136] In the case of a table equipped with such a porous plate, one or both of a fluid guide recess and a fluid guide protrusion can be provided on the main surface to the extent that a sufficient area can be secured on the main surface for the workpiece to be held on the main surface. For example, in the case of a fluid guide protrusion, it is preferable to provide the fluid guide protrusion closer to the outer periphery of the table than the workpiece held on the table.

[0137] The support table may also be a pin-chuck type chuck table. A pin-chuck type chuck table has, for example, a base and a number of pins provided on the surface of the base. The tips of the many pins form a main surface (holding surface) that holds the workpiece.

[0138] The base is provided with a through-hole that penetrates from the surface to the underside of the base. The end of the through-hole on the underside of the base is connected to a negative pressure source such as a vacuum pump. When the negative pressure source is activated with the first surface 11a of the workpiece 11 in contact with the holding surface formed by the tips of the numerous pins, negative pressure generated by the negative pressure source acts on the first surface 11a of the workpiece 11 through the through-hole and gaps between the pins. As a result, the workpiece 11 is sucked in and held.

[0139] In the case of such a pin chuck type chuck table, one or both of a fluid guide recess and a fluid guide protrusion can be provided on the main surface to the extent that a sufficient area can be secured on the main surface for holding the workpiece on the main surface. For example, in the case of a fluid guide protrusion, it is preferable to provide the fluid guide protrusion closer to the outer periphery of the base than the workpiece held by the multiple pins.

[0140] As explained above, according to the first to sixth embodiments of the present invention, the fluid processing device has one or both of a fluid guide recess provided in the base and a fluid guide protrusion having a convex shape protruding from the main surface. When the base plate is rotated around the rotation axis by the rotation mechanism and a first fluid is supplied into the cover by the first fluid supply unit, the supplied fluid flows along the fluid guide recess or the fluid guide protrusion due to centrifugal force and is sprayed onto the upper part of the inner wall of the cover.

[0141] According to the seventh embodiment of the present invention, the fluid processing device has a fluid guide recess provided in the table. When the table is rotated around the rotation axis by the rotation mechanism and the first fluid is supplied into the cover by the first fluid supply unit, the supplied fluid flows along the fluid guide recess by centrifugal force and is sprayed onto the upper part of the inner wall of the cover.

[0142] In the first to seventh embodiments, the fluid sprayed onto the upper part of the inner wall of the cover flows down along the inner wall of the cover to the lower part of the inner wall of the cover, thereby allowing the first fluid to remove fluid and contamination adhering to the entire area including the upper part of the inner wall of the cover.

[0143] In addition, the structures, methods, etc. according to the above-described embodiments can be modified as appropriate without departing from the scope of the object of the present invention. [Explanation of symbols]

[0144] 11 wafers 11a 1st side (front) 11b 2nd side (back side) 13a, 13b, 13c, 13d, 13e Rotation center line 15 Fluid 2 Grinding equipment 4 Foundation 6. Turntable 6a Loading area 6b Rough grinding area 6c Finish grinding area 6d Unloading area 8 Chuck table 8a Holding surface 10a, 10b Grinding unit (processing unit) 12a, 12b Spindle motor 14a, 14b Spindle 16a, 16b Wheel mount 18a, 18b Grinding wheels 20a, 20b Grinding wheel 22 Standing section 24a, 24b Processing feed unit 26a, 26b Cassette placement table (cassette placement area) 28a, 28b cassette 30 Transport robot 32 Positioning table 34 Loading Arm 36 Unloading Arm 38a, 38b Cleaning unit 40 Table (holding part) 42a, 42b, 42c, 42d, 42e base plate 44 Support protrusion 46 Periphery support part 48a, 48b, 48c, 48d, 48e Main surface (top surface) 50a outer periphery 52 Rotational drive source 54 Rotation axis 56 Fluid supply unit 58 Upper housing 60 Upper nozzle 62 Liquid supply pipe 64 Aperture 66 Table Cover 66a Side part 66b Eaves 68 Aperture 70 Lifting unit 72 Air Cylinder 74 Piston rod 76 Connection 78 Sliding unit 80 Lifting and Rotating Unit 82 Elevating shaft 84 Arm 86 Cleaning equipment 88 Open position 90 Storage Location 92 Main Unit 94 Shaft 96 Claw 98 Protrusion 100 Elastic member 102 Elastic member support part 110 Fluid supply path 112 Aperture 114 Lower Nozzle 116a, 116b, 116c Notch 200, 300, 400, 500, 600 Fluid guide protrusion (fluid guide part) 700,800 Fluid guide recess (fluid guide portion) 202 Top surface 204 Bottom surface 206 Inclined section 208 Side 302 1st aspect 304 1st slope section 306 2nd slope part 308 Second aspect 310 Protrusion 312 Through hole 900 Holding unit (support table) 900a top 910a,910b,910c,910d,910e, 910f,910g,910h,910i Suction hole 920 Space 930 Spindle

Claims

1. A fluid treatment device that treats a workpiece by supplying a fluid to the workpiece, the workpiece having a first surface and a second surface opposite to the first surface, a holder capable of holding the object to be treated so that the first surface of the object to be treated is exposed; a base plate having a main surface facing the second surface of the object to be processed held by the holding portion; a rotation mechanism that rotates the base plate around a rotation axis that intersects with the main surface; a cover provided to surround the holding portion and the base plate; a first fluid supply unit that supplies a first fluid to an area surrounded by the cover, The base plate has one or both of a fluid guide recess having a concave shape recessed relative to the main surface and a fluid guide protrusion having a convex shape protruding relative to the main surface.

2. A fluid treatment device that supplies a fluid to a treatment object having a first surface and a second surface opposite to the first surface, a table having a main surface capable of supporting the object to be processed from the second surface side so that the first surface of the object to be processed is exposed; a rotation mechanism that rotates the table around a rotation axis that passes through the center of the table and intersects with the main surface; a cover provided on the outer periphery of the table; a fluid supply unit that supplies a first fluid to an area surrounded by the cover, The table has one or both of a fluid guide recess having a concave shape recessed relative to the main surface and a fluid guide protrusion having a convex shape protruding relative to the main surface.

3. 3. The fluid processing device according to claim 1, wherein the fluid guide projection has an annular portion surrounding the rotation shaft.

4. 3. The fluid treatment device according to claim 1, wherein the fluid guide projection has an arc-shaped portion.

5. the fluid guide protrusion has an inclined portion inclined with respect to the rotation axis so as to move away from the main surface as the fluid guide protrusion moves away from the rotation axis, 3. The fluid processing device according to claim 1, wherein the fluid guide recess has an inclined portion that is inclined with respect to the rotation axis so as to approach the main surface with increasing distance from the rotation axis.

6. the fluid guide convex portion has a first side surface disposed on the rotation shaft side, a second side surface disposed on the opposite side to the first side surface and provided on the outer circumferential side of the base plate, and a protrusion portion including a region sandwiched between the first side surface and the second side surface, 3. The fluid processing device according to claim 1, wherein the protrusion has a through-hole formed therein, the through-hole having one end opening toward the first side surface and the other end opening toward the second side surface.

7. 3. The fluid processing device according to claim 1, wherein the fluid guide recess and the fluid guide protrusion are formed from the rotary shaft side toward the outside of the main surface.

8. the main surface has an opening; 3. The fluid treatment apparatus according to claim 1, further comprising a second fluid supply section that supplies a second fluid to the second surface of the treatment object through the opening.

9. 3. The fluid processing device according to claim 1, wherein the first fluid supply unit has a fluid supply point adjustment unit that moves the supply point of the first fluid between a first point on the main surface and a second point that is farther from the rotation axis than the first point.

10. 3. The fluid processing device according to claim 1, wherein the cover has a side portion provided along a direction parallel to the rotation axis, and a visor portion having a shape that approaches the rotation axis as it moves away from the side portion.

11. A method for cleaning a fluid processing device that processes a workpiece having a first surface and a second surface opposite to the first surface by supplying a fluid to the workpiece, comprising: The fluid treatment device comprises: a holder that holds the object to be processed so that the first surface of the object to be processed is exposed; a base plate having a main surface facing the second surface of the object to be processed held by the holding portion; a rotation mechanism that rotates the base plate around a rotation axis that passes through a center of the base plate and intersects with the main surface; a cover provided to surround the holding portion and the base plate; a fluid supply unit that supplies a first fluid to an area surrounded by the cover, the base plate is provided with a fluid guide portion including one or both of a fluid guide recess having a concave shape recessed relative to the main surface and a fluid guide protrusion having a convex shape protruding relative to the main surface, a rotating step of rotating the base plate around the rotation axis by the rotation mechanism; a first fluid supplying step of supplying the first fluid to the main surface of the base plate by the fluid supply unit, When the rotation step and the first fluid supply step are carried out, the first fluid supplied to the main surface moves along the fluid guide portion due to centrifugal force generated by the rotation of the rotation shaft, leaves the main surface, reaches the inner surface of the cover, and cleans the inner surface of the cover.

12. A method for cleaning a fluid processing device that processes a workpiece having a first surface and a second surface opposite to the first surface by supplying a fluid to the workpiece, comprising: a table having a main surface that supports the second surface side of the object to be processed so that the first surface of the object to be processed is exposed; a rotation mechanism that rotates the table around a rotation axis that passes through the center of the table and intersects with the main surface; a cover provided on the outer periphery of the table; a fluid supply unit that supplies a first fluid to an area surrounded by the cover, the table includes a fluid guide portion including one or both of a fluid guide recess having a concave shape recessed relative to the main surface and a fluid guide protrusion having a convex shape protruding relative to the main surface, a rotating step of rotating the table around the rotation axis by the rotation mechanism; a first fluid supplying step of supplying the first fluid to the main surface of the table by the fluid supply unit, When the rotation step and the first fluid supply step are carried out, the first fluid supplied to the main surface moves along the fluid guide portion due to centrifugal force generated by the rotation of the rotation shaft, leaves the main surface, reaches the inner surface of the cover, and cleans the inner surface of the cover.

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