Active information display dynamic memory module and information display method thereof

Abstract

We provide an active information display dynamic memory module. [Solution] An active information display dynamic memory module including a microcontroller unit, a sequence presence detection hub electrically connected to the microcontroller unit, and a display panel electrically connected to the microcontroller unit. By designing a customized microcontroller unit for a DRAM module under the JEDEC standard, a new functional circuit can be designed in the circuit layout on the circuit board, and the microcontroller unit can be electrically connected to and controlled by the sequence presence detection hub and the display panel through firmware design, thereby enabling the active display of specifications and information of memory modules of different architectures.

Description

Technical Field

[0001] The present invention relates to the technical field of memory, and particularly to an active information display dynamic memory module and an information display method thereof.

Background Art

[0002] Conventional memory modules include Double Data Rate (DDR) memory architecture, Compression Attached Memory Module version 2 (CAMM2) architecture, and Solid-State Drive (SSD) architecture. Memory modules are usually mounted on the motherboard, and inside a computer host or a notebook computer, in order to understand the state and related information of the memory module, either read the information of the memory module through software or enter the Basic Input / Output System (BIOS) through firmware. Therefore, in a case without software execution and in an environment that is not BIOS, the state of the memory module cannot be known, and only passive data display can be performed, which is very inconvenient.

Summary of the Invention

Problems to be Solved by the Invention

[0003] The object of the present invention is to provide an active information display dynamic memory module that enables the active display of specifications and information of memory modules of different architectures by designing a customized control IC (e.g., a microcontroller unit (MCU)) for dynamic random-access memory (DRAM) modules under the Joint Electron Device Engineering Council (JEDEC) standards, designing a new functional circuit on the circuit layout on the circuit board, and electrically connecting and controlling the control IC to a serial presence detection hub (SPDhub) and a display panel through firmware design. [Means for solving the problem]

[0004] Based on the above objective, the present invention provides an active information display dynamic memory module including a microcontroller unit, a sequence presence detection hub electrically connected to the microcontroller unit, and a display panel electrically connected to the microcontroller unit.

[0005] In some embodiments, the active information display dynamic memory module further includes the microcontroller unit, the sequence presence detection hub, and a circuit board on which the display panel is mounted.

[0006] In some embodiments, the active information display dynamic memory module has a double data rate (DDR) memory architecture, the sequence presence detection hub is mounted on the back surface of the circuit board, the microcontroller unit is mounted on the front surface of the circuit board, and the display panel is mounted on the back surface of the circuit board.

[0007] In some embodiments, the active information display dynamic memory module further includes a first heat sink provided corresponding to the area above the back surface of the circuit board.

[0008] In some embodiments, the portion of the first heatsink corresponding to the display panel has a first window portion to expose the display panel.

[0009] In some embodiments, the active information display dynamic memory module is a compressed connection memory module (CAMM2) architecture, and the sequence presence detection hub, the microcontroller unit, and the display panel are mounted on the same surface of the circuit board.

[0010] In some embodiments, the circuit mounting plate has an extended blank portion to which the display panel is attached.

[0011] In some embodiments, the active information display dynamic memory module further includes a second heatsink provided above the surface of the circuit board on which the sequence presence detection hub, the microcontroller unit, and the display panel are mounted.

[0012] In some embodiments, the portion of the second heatsink corresponding to the display panel has a second window to expose the display panel.

[0013] In some embodiments, the display panel is an organic light-emitting diode (OLED) display panel.

[0014] To the above objective, the present invention further provides an information display method for an active information display dynamic memory module, which is suitably used in an active information display dynamic memory module comprising a microcontroller unit, a sequence presence detection hub, and a display panel, wherein, when the active information display dynamic memory module is electrically connected to a motherboard, the method comprises the steps of: acquiring data stored in the sequence presence detection hub via the motherboard by the microcontroller unit; and, after the microcontroller unit has acquired the data, controlling it to actively display the data on the display panel.

[0015] To make the above-mentioned objectives, features, and advantages of the present invention clearer and easier to understand, they will be described in detail below with reference to specific embodiments shown in the drawings. [Brief explanation of the drawing]

[0016] [Figure 1] This is a schematic block diagram of the structure of the active information display dynamic memory module of the present invention. [Figure 2] This is an exploded schematic diagram of the back surface portion of the first embodiment of the active information display dynamic memory module of the present invention. [Figure 3] This is an exploded schematic diagram of the front surface portion of the first embodiment of the active information display dynamic memory module of the present invention. [Figure 4] This is a schematic diagram of a partial combination of the first embodiment of the active information display dynamic memory module of the present invention. [Figure 5] This is a schematic diagram of the first heatsink used in accordance with the first embodiment of the active information display dynamic memory module of the present invention. [Figure 6] This is a schematic diagram of a part of a second embodiment of the active information display dynamic memory module of the present invention. [Figure 7] This is a schematic diagram of a combination of a second embodiment of the active information display dynamic memory module of the present invention. [Figure 8]It is a schematic diagram of a second heat sink used corresponding to a second embodiment of the active information display dynamic memory module of the present invention. [Figure 9] It is a combined schematic diagram of a third embodiment of the active information display dynamic memory module of the present invention.

Mode for Carrying Out the Invention

[0017] The advantages, features, and technical methods for achieving the present invention will be described in more detail with reference to exemplary embodiments and the accompanying drawings, which are easier to understand. Since the present invention can be realized in different forms, it should not be understood that the present invention is limited to the embodiments described herein. Rather, for those skilled in the art, the provided embodiments convey the present disclosure more clearly and completely to the scope of the present invention, and the present invention is only defined by the scope of the attached patent application.

[0018] Also, the terms "comprising" and / or "including" mean the presence of the said features, regions, wholes, steps, operations, elements, and / or parts, but do not exclude the presence or addition of one or more other features, regions, wholes, steps, operations, elements, parts, and / or combinations thereof.

[0019] To make it easier to understand the content and achievable effects of the present invention, it will be described in detail below in combination with each specific embodiment listed in the drawings.

[0020] FIG. 1 is a structural block schematic diagram of the active information display dynamic memory module of the present invention. FIG. 2 is an exploded schematic diagram of the back surface portion of the first embodiment of the active information display dynamic memory module of the present invention. FIG. 3 is an exploded schematic diagram of the front surface portion of the first embodiment of the active information display dynamic memory module of the present invention. FIG. 4 is a schematic diagram of a combination of a part of this first embodiment of the active information display dynamic memory module of the present invention.

[0021] Please refer to FIG. 1. The active information display dynamic memory module 10 of the first embodiment of the present invention includes a microcontroller unit (MCU) 100, a serial presence detect hub (SPDhub) 200, and a display panel 300. In some embodiments, the microcontroller unit 100 and the serial presence detect hub 200 may be in the form of an integrated circuit (IC), that is, the microcontroller unit 100 may be a microcontroller unit integrated circuit (MCU IC), and the serial presence detect hub 200 may be a serial presence detect hub integrated circuit (SPDhub IC), but is not limited thereto.

[0022] The microcontroller unit 100 may be a normal microcontroller unit or a customized microcontroller unit, that is, it may be replaced and used according to the design requirements.

[0023] The serial presence detect hub 200 may be electrically connected to the microcontroller unit 100. In some embodiments, the serial presence detect hub 200 may communicate with the microcontroller unit 100 via an inter-integrated circuit (I2C) interface or an improved inter-integrated circuit (I3C) interface. The microcontroller unit 100 may read data in the serial presence detect hub 200 via an I2C interface or an I3C interface (for example, a bus), and the data includes, but is not limited to, memory module timing (or frequency), retarding timing, capacity, voltage, and temperature.

[0024] In some embodiments, the sequence presence detection hub 200 and the microcontroller unit 100 may communicate with the motherboard via an I2C interface or an I3C interface. The motherboard may read data from the sequence presence detection hub 200 via the I2C interface or an I3C interface, which may include, but are not limited to, memory module timing (or frequency), retardation timing, capacitance, voltage, and temperature, and transmit this data to the microcontroller unit 100 via the I2C interface or an I3C interface.

[0025] The display panel 300 may be electrically connected to the microcontroller unit 100. In some embodiments, the display panel 300 may communicate with the microcontroller unit 100 via one of the following interfaces: I2C interface, Serial Peripheral Interface (SPI), or 8080 interface. In some embodiments, the display panel 300 may be, but is not limited to, an Organic Light-Emitting Diode (OLED) display panel. The display panel 300 may actively display various information and play dynamic short films, trademark dynamic graphics, brand dynamic graphics, etc., the various information may be the aforementioned data stored in the sequence presence detection hub 200, the data including, but not limited to, memory module timing (or frequency), retardation timing, capacitance, voltage, and temperature.

[0026] In some embodiments, the active information display dynamic memory module 10 of the present invention further includes a circuit board 1000. A microcontroller unit 100, a sequence presence detection hub 200, and a display panel 300 may be mounted on the circuit board 1000. In this embodiment, the active information display dynamic memory module 10 may be a Double Data Rate (DDR) memory architecture and is provided upright via an upright slot (not shown). For example, the DDR memory architecture includes the conventional generations of DDR, DDR2, DDR3, DDR4, and DDR5, and in this embodiment, the specifications of a DDR5 unbuffered dual in-line memory module (UDIMM) / Clocked Unbuffered DIMM (CUDIMM) will be used as an example. The sequence presence detection hub 200 may be mounted on the back surface 1200 of the circuit mounting plate 1000, the microcontroller unit 100 may be mounted on the front surface 1100 of the circuit mounting plate 1000, and the display panel 300 may be mounted on the adhesive area 1300 on the back surface 1200 of the circuit mounting plate 1000.

[0027] Figure 5 is a schematic diagram of the first heatsink used in this first embodiment of the active information display dynamic memory module of the present invention.

[0028] Please refer to Figure 5. The active information display dynamic memory module 10 of the first embodiment may be provided with a corresponding first heat sink 400. The first heat sink 400 may be provided above the back surface 1200 of the circuit mounting plate 1000. In some embodiments, a first window 410 may be provided at the location of the display panel 300 on the first heat sink 400 so that the display panel 300 is exposed and various information displayed on the display panel 300 can be directly seen from the outside.

[0029] Figure 6 is an exploded schematic diagram of a part of the second embodiment of the active information display dynamic memory module of the present invention. Figure 7 is a combined schematic diagram of this second embodiment of the active information display dynamic memory module of the present invention. The structural blocks of the active information display dynamic memory module of the second embodiment and the structural blocks of the active information display dynamic memory module of the first embodiment described above are almost the same, and the differences will be explained in the paragraph below, but the same elements are represented by the same numbers.

[0030] Please refer to Figures 1, 6, and 7 simultaneously. The active information display dynamic memory module 10 of the second embodiment includes a microcontroller unit (MCU) 100, a serial presence detection hub (SPDhub) 200, and a display panel 300. In some embodiments, the microcontroller unit 100 and the serial presence detection hub 200 may be in integrated circuit (IC) form; that is, the microcontroller unit 100 may be a microcontroller unit integrated circuit (MCU IC), and the serial presence detection hub 200 may be a serial presence detection hub integrated circuit (SPDhub IC), but are not limited thereto.

[0031] The microcontroller unit 100 may be a standard microcontroller unit or a customized microcontroller unit; in other words, it may be replaced as needed in the design.

[0032] The sequence presence detection hub 200 may be electrically connected to the microcontroller unit 100. In some embodiments, the sequence presence detection hub 200 may communicate with the microcontroller unit 100 via an inter-integrated circuit (I2C) interface or an improved inter-integrated circuit (I3C) interface. The microcontroller unit 100 may read data in the sequence presence detection hub 200 via the I2C interface or I3C interface (e.g., a bus), which may include, but are not limited to, memory module timing (or frequency), retardation timing, capacitance, voltage, and temperature.

[0033] In some embodiments, the sequence presence detection hub 200 and the microcontroller unit 100 may communicate with the motherboard via an I2C interface or an I3C interface. The motherboard may read data from the sequence presence detection hub 200 via the I2C interface or an I3C interface, which may include, but are not limited to, memory module timing (or frequency), retardation timing, capacitance, voltage, and temperature, and transmit this data to the microcontroller unit 100 via the I2C interface or an I3C interface.

[0034] The display panel 300 may be electrically connected to the microcontroller unit 100. In some embodiments, the display panel 300 may communicate with the microcontroller unit 100 via one of the following interfaces: I2C interface, Serial Peripheral Interface (SPI), or 8080 interface. In some embodiments, the display panel 300 may be, but is not limited to, an Organic Light-Emitting Diode (OLED) display panel. The display panel 300 may actively display various information and play dynamic short films, trademark dynamic graphics, brand dynamic graphics, etc., the various information may be the aforementioned data stored in the sequence presence detection hub 200, the data including, but not limited to, memory module timing (or frequency), retardation timing, capacitance, voltage, and temperature.

[0035] In some embodiments, the active information display dynamic memory module 10 of the present invention further includes a circuit board 2000. A microcontroller unit 100, a sequence presence detection hub 200, and a display panel 300 may be mounted on the circuit board 2000. In this embodiment, the active information display dynamic memory module 10 may be a Compression Attached Memory Module version 2 (CAMM2) architecture. For example, the Compression Attached Memory Module may include CAMM and CAMM2, and in this embodiment, CAMM2 will be described as an example. The sequence presence detection hub 200, the microcontroller unit 100, and the display panel 300 may be mounted on the same surface 2100 of the circuit board 2000. In some embodiments, the circuit board 2000 of this embodiment may have an extended blank portion 2200, and the display panel 300 may be mounted on an adhesive region 2300 in the extended blank portion 2200.

[0036] Figure 8 is a schematic diagram of a second heatsink used in this second embodiment of the active information display dynamic memory module of the present invention.

[0037] Please refer to Figure 8. In the second embodiment, the active information display dynamic memory module 10 may be provided with a second heatsink 500. The second heatsink 500 may be provided above the surface 2100 on the circuit mounting plate 2000 to which the sequence presence detection hub 200, the microcontroller unit 100, and the display panel 300 are mounted. In some embodiments, a second window 510 may be provided at the location of the second heatsink 500 corresponding to the display panel 300 in order to expose the display panel 300, thereby allowing various information displayed on the display panel 300 to be directly seen from the outside.

[0038] Figure 9 is a schematic diagram of the combination of a third embodiment of the active information display dynamic memory module of the present invention. Please refer to Figure 9. The active information display dynamic memory module 10 may be, but is not limited to, a solid-state hard disk (SSD) architecture arranged corresponding to each element in the structural block diagram of Figure 1. The structural block of the active information display dynamic memory module of the third embodiment is substantially the same as the structural block of the active information display dynamic memory module of the second embodiment described above, and its function and structure will not be described further.

[0039] As described above, the active information display dynamic memory module 10 of the present invention actively displays the specifications and information of memory modules of different architectures by designing a customized control IC (e.g., a microcontroller unit (MCU) 100) for a DRAM module under the JEDEC standard, designing a new functional circuit in the circuit layout on the circuit board 1000 or circuit board 2000, and electrically connecting and controlling the control IC (e.g., a microcontroller unit (MCU) 100) to the sequence presence detection hub 200 and the display panel 300 through firmware design. [Explanation of symbols]

[0040] 10: Active Information Display Dynamic Memory Module 100: Microcontroller Unit 200: Sequence Presence Detection Hub 300: Display Panel 400: First heatsink 410: Window Section 1 500: Second heatsink 510: Second Window Section 1000: Circuit board 1100: Front surface 1200: Back side surface 1300: Adhesive area 2000: Circuit board 2100: Surface 2200: Extended blank section 2300: Adhesive area

Claims

1. Microcontroller unit and A sequence presence detection hub electrically connected to the aforementioned microcontroller unit, A display panel electrically connected to the aforementioned microcontroller unit, An active information display dynamic memory module including [a specific feature].

2. The active information display dynamic memory module according to claim 1, further comprising the microcontroller unit, the sequence presence detection hub, and a circuit mounting plate on which the display panel is attached.

3. The active information display dynamic memory module according to claim 2, wherein the active information display dynamic memory module has a double data rate (DDR) memory architecture, the sequence presence detection hub is mounted on the back surface of the circuit board, the microcontroller unit is mounted on the front surface of the circuit board, and the display panel is mounted on the back surface of the circuit board.

4. The active information display dynamic memory module according to claim 3, further comprising a first heat sink provided corresponding to the upper part of the back surface of the circuit mounting plate.

5. The active information display dynamic memory module according to claim 4, wherein the portion of the first heatsink corresponding to the display panel has a first window portion for exposing the display panel.

6. The active information display dynamic memory module according to claim 2, wherein the active information display dynamic memory module has a compressed connection memory module (CAMM2) architecture, and the sequence presence detection hub, the microcontroller unit, and the display panel are mounted on the same surface of the circuit board.

7. The active information display dynamic memory module according to claim 6, wherein the circuit mounting plate has an extended blank portion to which the display panel is attached.

8. The active information display dynamic memory module according to claim 7, further comprising a second heat sink provided above the surface of the circuit mounting plate on which the sequence presence detection hub, the microcontroller unit, and the display panel are mounted.

9. The active information display dynamic memory module according to claim 8, wherein the portion of the second heatsink corresponding to the display panel has a second window portion for exposing the display panel.

10. The active information display dynamic memory module according to any one of claims 1 to 5, wherein the display panel is an organic light-emitting diode (OLED) display panel.

11. In an active information display dynamic memory module used in an active information display dynamic memory module including a microcontroller unit, a sequence presence detection hub, and a display panel, When the aforementioned active information display dynamic memory module is electrically connected to the motherboard, The process involves the microcontroller unit acquiring data stored in the sequence presence detection hub via the motherboard, The process involves controlling the microcontroller unit to actively display the data on the display panel after it has acquired the data, A method for displaying information of an active information display dynamic memory module equipped with [a specific feature].

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