Cleaning agent composition for wiping and undiluted cleaning agent composition for wiping
A cleaning agent composition with hydrophilic and hydrophobic glycol ether compounds and water addresses the limitations of existing compositions by providing superior wiping and drying properties for manual cleaning of metal masks.
Patent Information
- Authority / Receiving Office
- JP · JP
- Patent Type
- Applications
- Current Assignee / Owner
- Filing Date
- 2024-09-04
- Publication Date
- 2026-03-16
AI Technical Summary
Existing cleaning agent compositions for metal masks are not suitable for manual wiping, as they either spread flux or fail to remove solder particles effectively, leading to contamination or incomplete cleaning.
A cleaning agent composition comprising a hydrophilic glycol ether compound with a boiling point between 140°C and 190°C, a hydrophobic glycol ether compound with a boiling point between 190°C and 260°C, and water, in specific proportions, providing excellent wiping and drying properties.
The composition enables effective removal of flux and solder particles with minimal contamination, ensuring thorough cleaning and rapid drying on metal masks and other surfaces.
Smart Images

Figure 2026047635000008 
Figure 2026047635000009 
Figure 2026047635000001
Abstract
Description
Technical Field
[0001] The present invention relates to a cleaning agent composition for wiping and a stock solution of the cleaning agent composition for wiping.
Background Art
[0002] As a method for joining electronic circuits, soldering is most commonly performed. For example, in order to supply an appropriate amount of solder when joining components to a substrate, a method of printing a solder paste (a paste obtained by mixing solder particles and a flux) through a metal plate (metal mask) having holes in the pattern to be printed is performed. The above metal mask needs to be cleaned at the end of printing for storage and reuse, or to ensure printing accuracy.
[0003] For example, Japanese Patent Laid-Open No. 9-59688 (Patent Document 1) discloses a cleaning agent composition for a metal mask, which contains 25 to 45% by weight of one or more glycol ether compounds having a certain boiling point and being water-soluble, 5 to 25% by weight of one or more glycol ether compounds having a certain boiling point and a certain amount of water-solubility, 0.005 to 1.0% by weight of an amine compound, and water to make 100% by weight (abstract, claim 1). Further, Japanese Patent Laid-Open No. 9-59698 (Patent Document 2) discloses a cleaning agent composition for a metal mask, which contains 25 to 45% by weight of a glycol ether compound having a certain boiling point, 5 to 25% by weight of an organic solvent having a certain boiling point and solubility in a certain amount of water, 0.005 to 1.0% by weight of an amine compound, and water to make 100% by weight (abstract, claim 1).
[0004] Japanese Patent Laid-Open No. 2018-21093 (Patent Document 3) discloses a cleaning agent composition for a screen plate, which contains an amine (Component A) or a salt thereof having a solubility in 100 g of water at 25°C of less than 10 g, a solvent (Component B) having a solubility in 100 g of water at 25°C of 0.02 g or more and less than 10 g, and water, and the Component A is at least one selected from primary amines, secondary amines, and tertiary amines having 6 to 26 carbon atoms (claim 1).
Prior Art Documents
[0005] [Patent Document 1] Japanese Patent Application Publication No. 9-59688 [Patent Document 2] Japanese Patent Application Publication No. 9-59698 [Patent Document 3] Japanese Patent Publication No. 2018-21093 [Overview of the Initiative] [Problems that the invention aims to solve]
[0006] Metal masks are cleaned using methods such as ultrasonic cleaning, spray cleaning, and manual wiping. However, cleaning agent compositions suitable for manual wiping have not been investigated until now. For example, the cleaning agent composition described in Patent Document 1 cleans metal masks well when used with ultrasonic cleaning, but when used with manual wiping, it can spread the flux and contaminate other areas, or only the flux may be wiped away, leaving solder particles on the metal mask.
[0007] The present invention has been made in view of the above circumstances, and aims to provide a wiping detergent composition and a wiping detergent composition stock solution that have excellent wiping properties and drying properties. [Means for solving the problem]
[0008] The present inventors conducted diligent research to solve the above problems and, as a result, discovered that a cleaning agent composition containing a hydrophilic glycol ether compound having a predetermined boiling point, a hydrophobic glycol ether compound having a predetermined boiling point, and water exhibits excellent wiping and drying properties, thus completing the present invention. That is, the present invention is as follows.
[0009] [1] A wiping detergent composition comprising a hydrophilic glycol ether compound, a hydrophobic glycol ether compound, and water, The boiling point of the above hydrophilic glycol ether compound is between 140°C and 190°C. The boiling point of the above hydrophobic glycol ether compound is between 190°C and 260°C. The content of the above hydrophilic glycol ether compound is 3% by mass or more and 25% by mass or less of the total amount of the above wiping detergent composition. The content of the above hydrophobic glycol ether compound is 1% by mass or more and 10% by mass or less of the total amount of the above wiping detergent composition. The amine compound content is greater than 0% by mass and 0.005% by mass or less of the total amount of the above-mentioned cleaning agent composition for wiping, or the composition does not contain the above-mentioned amine compound. A wiping detergent composition wherein the water content is 70% by mass or more and 95% by mass or less of the total wiping detergent composition.
[0010] [2] The wiping detergent composition described above is uniform in appearance and transparent at a temperature of 25°C, as described in [1].
[0011] [3] The above hydrophilic glycol ether compound comprises at least one compound selected from the group consisting of 3-methoxy-3-methyl-1-butanol, dipropylene glycol monomethyl ether, diethylene glycol dimethyl ether, diethylene glycol methyl ethyl ether, and diethylene glycol diethyl ether, as described in [1] or [2].
[0012] [4] The above hydrophobic glycol ether compound comprises at least one compound selected from the group consisting of dipropylene glycol monobutyl ether, dipropylene glycol monopropyl ether, ethylene glycol monohexyl ether, and diethylene glycol butyl methyl ether, as described in any of [1] to [3].
[0013] [5]A cleaning agent composition stock solution for wiping, containing a hydrophilic glycol ether compound and a hydrophobic glycol ether compound, The boiling point of the hydrophilic glycol ether compound is 140°C or higher and 190°C or lower, The boiling point of the hydrophobic glycol ether compound is 190°C or higher and 260°C or lower, The content ratio of the hydrophilic glycol ether compound is 30% by mass or more and 90% by mass or less based on the whole of the cleaning agent composition stock solution for wiping, The content ratio of the hydrophobic glycol ether compound is 10% by mass or more and 70% by mass or less based on the whole of the cleaning agent composition stock solution for wiping, The content ratio of the amine compound exceeds 0% by mass and is 0.1% by mass or less based on the whole of the cleaning agent composition stock solution for wiping, or the amine compound is not contained, A cleaning agent composition stock solution for wiping, which is diluted 3.3 to 20 times with water and used when cleaning an object to be cleaned.
[0014] [6]The cleaning agent composition stock solution for wiping may further contain water, The content ratio of the water is 0% by mass or more and 10% by mass or less based on the whole of the cleaning agent composition stock solution for wiping according to [5].
Advantages of the Invention
[0015] According to the present invention, it becomes possible to provide a cleaning agent composition for wiping and a cleaning agent composition stock solution for wiping, which are excellent in wiping property and drying property.
Brief Description of the Drawings
[0016] [Figure 1] Figure 1 is a photograph showing the result of the wiping property evaluation in the examples. [Figure 2] Figure 2 is a photograph showing the result of the wiping property evaluation in the examples. [[ID=X]]
Modes for Carrying Out the Invention
[0017] Hereinafter, an embodiment of the present invention (hereinafter referred to as "this embodiment") will be described. However, this embodiment is not limited thereto. In this specification, the notation in the form of "A to Z" means the upper and lower limits of the range (that is, A or more and Z or less). When there is no unit description for A and only the unit is described for Z, the units of A and Z are the same.
[0018] ≪Wiping cleaning composition≫ The wiping cleaning composition according to this embodiment is a wiping cleaning composition containing a hydrophilic glycol ether compound, a hydrophobic glycol ether compound, and water, the boiling point of the above hydrophilic glycol ether compound is 140°C or more and 190°C or less, the boiling point of the above hydrophobic glycol ether compound is 190°C or more and 260°C or less, the content ratio of the above hydrophilic glycol ether compound is 3% by mass or more and 25% by mass or less based on the whole of the wiping cleaning composition, the content ratio of the above hydrophobic glycol ether compound is 1% by mass or more and 10% by mass or less based on the whole of the wiping cleaning composition, the content ratio of the amine compound is more than 0% and 0.005% by mass or less based on the whole of the wiping cleaning composition, or the amine compound is not contained, the content ratio of the above water is 70% by mass or more and 95% by mass or less based on the whole of the wiping cleaning composition.
[0019] By having the above-described configuration, the wiping cleaning composition (hereinafter sometimes simply referred to as "cleaning composition") is excellent in wiping property and drying property. Here, "wiping property" means the ease of wiping off dirt (for example, solder paste, etc.) attached to an object to be cleaned such as a metal mask with a wiping material such as a cloth impregnated with the above cleaning composition. "Drying property" means the ease of drying the above cleaning composition on the surface of an object to be cleaned such as a metal mask.
[0020] The above-mentioned cleaning agent composition is used to remove dirt (for example, flux (rosin-based flux, water-soluble flux, etc.), solder paste, and various other pastes) adhering to the surface or crevices of an object to be cleaned. The material of the object to be cleaned can be any material that is commonly used. Examples of such materials include metals such as iron, stainless steel, nickel, copper, and aluminum; inorganic materials such as silica and alumina; and polyester resins such as polyamide (nylon), polypropylene (PP), polyethylene (PE), polyimide, acrylonitrile-butadiene-styrene copolymer resin (ABS resin), polyvinyl chloride (PVC), acetal resin, acrylic resin, polystyrene (PS), polycarbonate (PC), polyetheretherketone (PEEK), polytetrafluoroethylene (Teflon®), polyethylene terephthalate (PET), and polybutylene terephthalate (PBT); polyvinyl alcohol (PVA); and epoxy resin. In this embodiment, the objects to be cleaned include, for example, metal masks, screen plates, squeegees, substrates after test printing, and substrates with printing defects.
[0021] <Hydrophilic glycol ether compounds> The above cleaning composition contains a hydrophilic glycol ether compound. In this embodiment, "glycol ether compound" means an ether compound of a dihydric alcohol. In this embodiment, "hydrophilic" means having a solubility in water at 20°C of more than 50% by mass. The above hydrophilic glycol ether compound may be synthesized from known starting materials by known methods. The above hydrophilic glycol ether compound may be a commercially available product used as is.
[0022] In this embodiment, the boiling point of the hydrophilic glycol ether compound is 140°C or higher and 190°C or lower, preferably 150°C or higher and 185°C or lower, and more preferably 155°C or higher and 180°C or lower. When the boiling point of the hydrophilic glycol ether compound is 140°C or higher, there is little compositional change due to volatilization loss, resulting in a detergent composition with excellent wiping properties during use. Furthermore, when the boiling point of the hydrophilic glycol ether compound is 190°C or lower, the detergent composition has excellent drying properties. The above boiling points are the boiling points when the atmospheric pressure is 1013.25 hPa.
[0023] The hydrophilic glycol ether compound described above preferably contains at least one compound selected from the group consisting of 3-methoxy-3-methyl-1-butanol (MMB), dipropylene glycol monomethyl ether (MFDG), diethylene glycol dimethyl ether (DMDG), diethylene glycol methyl ethyl ether (MEDG), and diethylene glycol diethyl ether (DEDG). The structural formulas of the hydrophilic glycol ether compounds described above are shown below.
[0024] [ka]
[0025] The content of the hydrophilic glycol ether compound is preferably 3.5% to 20% by mass, and more preferably 4% to 18% by mass, relative to the total amount of the wiping detergent composition. A content of 3% by mass or more of the hydrophilic glycol ether compound results in a detergent composition with excellent wiping properties. Furthermore, a content of 25% by mass or less results in a detergent composition with excellent drying properties. In other words, a content of the hydrophilic glycol ether compound within the above range results in a detergent composition with excellent wiping and drying properties. The hydrophilic glycol ether compound can be determined by gas chromatography analysis. The conditions for gas chromatography analysis are as follows. Equipment: Gas meter GC-14B (manufactured by Shimadzu Corporation) Detector: Thermal conductivity detector (TCD) Column: Thermon-3000 (manufactured by Shinwa Chemical Co., Ltd.) Evaporation chamber temperature: 160℃ Detector temperature: 160℃
[0026] <Hydrophobic glycol ether compounds> The above cleaning composition contains a hydrophobic glycol ether compound. In this embodiment, "hydrophobic" means having a solubility in water at 20°C of 50% by mass or less. The hydrophobic glycol ether compound may be synthesized from known starting materials by known methods. The hydrophobic glycol ether compound may be a commercially available product used as is.
[0027] In this embodiment, the boiling point of the hydrophobic glycol ether compound is 190°C or higher and 260°C or lower, preferably 195°C or higher and 250°C or lower, and more preferably 200°C or higher and 245°C or lower. When the boiling point of the hydrophobic glycol ether compound is 190°C or higher, the detergent composition has less odor and excellent workability. Furthermore, when the boiling point of the hydrophobic glycol ether compound is 260°C or lower, the detergent composition has excellent drying properties. The above boiling points are the boiling points when the atmospheric pressure is 1013.25 hPa.
[0028] The above hydrophobic glycol ether compound preferably contains at least one compound selected from the group consisting of dipropylene glycol monobutyl ether (BFDG), dipropylene glycol monopropyl ether (PFDG), ethylene glycol monohexyl ether (HeG), and diethylene glycol butyl methyl ether (BDM). The structural formulas of the above hydrophobic glycol ether compounds are shown below.
[0029] [ka]
[0030] The content of the hydrophobic glycol ether compound is preferably 1% to 10% by mass, more preferably 2% to 9% by mass, and more preferably 3% to 8% by mass, relative to the total amount of the wiping detergent composition. A content of 1% by mass or more of the hydrophobic glycol ether compound results in a detergent composition with excellent wiping properties. Furthermore, a content of 10% by mass or less results in a detergent composition with excellent drying properties. The hydrophobic glycol ether compound can be determined by gas chromatography analysis. The conditions for gas chromatography analysis are as follows. Equipment: Gas meter GC-14B (manufactured by Shimadzu Corporation) Detector: Thermal conductivity detector (TCD) Column: Thermon-3000 (manufactured by Shinwa Chemical Co., Ltd.) Evaporation chamber temperature: 160℃ Detector temperature: 160℃
[0031] In one aspect of this embodiment, the mass ratio of the hydrophilic glycol ether compound to the hydrophobic glycol ether compound in the above-mentioned detergent composition is preferably 3:1 to 1:1, and more preferably 2.5:1 to 1.5:1.
[0032] <Water> The above-mentioned detergent composition contains water. The water is not particularly limited as long as it is water used as a raw material for various industrial products. The water may be distilled water or deionized water. In one aspect of this embodiment, the electrical conductivity of the water may be 1 to 300 μS / cm or 1 to 100 μS / cm.
[0033] The water content is 70% to 95% by mass of the total wipe-cleaning agent composition, preferably 75% to 93% by mass, and more preferably 80% to 90% by mass. This results in a cleaning agent composition with excellent work safety and environmental safety. The water content can be determined by analysis using a Karl Fischer moisture meter. The conditions for analysis using a Karl Fischer moisture meter are as follows. Analytical conditions for Karl Fischer moisture meter Equipment: Karl Fischer moisture meter MKV-710 (manufactured by Kyoto Electronics Manufacturing Co., Ltd.) Measurement method: volumetric titration method Measurement temperature: 20℃
[0034] <Amine compounds> In this embodiment, the content of the amine compound is greater than 0% by mass and 0.005% by mass or less of the total wipe-cleaning agent composition, or the amine compound is not present. By setting the content of the amine compound within the above range, it is possible to reduce the effects of discoloration and corrosion on metals in the object to be cleaned. In one aspect of this embodiment, the content of the amine compound may be 0% by mass or more and 0.004% by mass or less of the total wipe-cleaning agent composition. In another aspect of this embodiment, it is more preferable that the cleaning agent composition does not contain the amine compound.
[0035] The above amine compounds include primary amines, secondary amines, and tertiary amines. In this embodiment, examples of the above amine compounds include n-hexylamine, n-octylamine, n-dodecylamine, n-stearylamine, N-methylhexylamine, N,N-dimethylhexylamine, N-ethylethanolamine, diethanolamine, triethanolamine, and triisopropanolamine.
[0036] <Other ingredients> The cleaning agent composition according to this embodiment may further contain other components as long as the effects of the present invention are achieved. Examples of the above-mentioned other components include surfactants, rust inhibitors, pH adjusters, chelating agents, thickeners, wetting agents, evaporation retarders, antioxidants, ultraviolet absorbers, pigments, fragrances, and preservatives.
[0037] <Characteristics of the detergent composition> In one aspect of this embodiment, the above-mentioned cleaning agent composition for wiping is uniform in appearance and transparent at a temperature of 25°C. Here, "uniform in appearance" means that the cleaning agent composition does not separate into two or more layers in appearance when left standing. "Standing" means the time when the cleaning agent composition is kept free from external forces other than gravity for 4 hours. More specifically, "Standing" can also be understood as the time when the cleaning agent composition is kept free from vibration, rotation, and stirring for 4 hours. In one aspect of this embodiment, the cleaning agent composition may be uniform in appearance or may separate into two or more layers in appearance at temperatures below 20°C. The cleaning agent composition may be uniform in appearance or may separate into two or more layers in appearance at temperatures above 50°C. In this embodiment, "transparent" means that there is no interaction between the cleaning agent composition and visible light, and no absorption or scattering of visible light occurs.
[0038] <Uses of detergent compositions> The cleaning agent composition for wiping according to this embodiment is preferably used to wipe away dirt (e.g., flux and solder paste, etc.) adhering to an object to be cleaned, such as a metal mask, using a wiping material (e.g., a cloth, etc.) impregnated with the cleaning agent composition.
[0039] Conventional cleaning agent compositions were not suitable for manual wiping. For example, the cleaning agent composition described in Patent Document 1 cleaned metal masks well when used with ultrasonic cleaning, but when used with manual wiping, it would either spread the flux and contaminate other areas, or only the flux would be wiped away, leaving solder particles on the metal mask.
[0040] On the other hand, the cleaning agent composition according to this embodiment contains the hydrophilic glycol ether compound, the hydrophobic glycol ether compound, and water in predetermined proportions, thereby providing appropriate drying properties and enabling simultaneous wiping of flux and solder particles. In other words, the cleaning agent composition according to this embodiment has excellent wiping and drying properties.
[0041] ≪Undiluted Cleaning Agent Composition for Wiping≫ The wipe-off cleaning agent composition stock solution according to this embodiment is a wipe-off cleaning agent composition stock solution comprising a hydrophilic glycol ether compound and a hydrophobic glycol ether compound, The boiling point of the above hydrophilic glycol ether compound is between 140°C and 190°C. The boiling point of the above hydrophobic glycol ether compound is between 190°C and 260°C. The content of the above hydrophilic glycol ether compound is 30% by mass or more and 90% by mass or less of the total volume of the above wipe-off cleaning agent composition stock solution. The content of the above hydrophobic glycol ether compound is 10% by mass or more and 70% by mass or less of the total volume of the above wipe-cleaning agent composition stock solution. The amine compound content is greater than 0% by mass and less than or equal to 0.1% by mass of the total undiluted solution of the above-mentioned cleaning agent composition for wiping, or the composition does not contain the above-mentioned amine compound. When cleaning objects, the cleaning agent is used after diluting it with water 3.3 to 20 times. The above cleaning agent composition can be obtained by diluting the undiluted solution of the above cleaning agent composition at the above ratio (volume ratio).
[0042] In one aspect of this embodiment, the undiluted cleaning agent composition for wiping may further contain water, and the water content is preferably 0% by mass or more and 10% by mass or less of the total undiluted cleaning agent composition for wiping.
[0043] ≪Method for producing a cleaning agent composition for wiping≫ The method for producing the wiping detergent composition according to this embodiment includes the steps of preparing the hydrophilic glycol ether compound, the hydrophobic glycol ether compound, and water, and adding the hydrophilic glycol ether compound and the hydrophobic glycol ether compound to the water. Any method may be used for the addition step. Examples of the addition step include adding the hydrophilic glycol ether compound, the hydrophobic glycol ether compound, and water to a flask, and adding the hydrophilic glycol ether compound, the hydrophobic glycol ether compound, and water on an industrial scale at a chemical plant or the like.
[0044] ≪Method for cleaning objects≫ The cleaning method for the object to be cleaned according to this embodiment is: A method for cleaning an object to be cleaned, comprising wiping the surface or gaps of the object to be cleaned with a wiping material impregnated with the above-mentioned wiping cleaning agent composition.
[0045] In this embodiment, the wiping material is not particularly limited as long as it can be impregnated with the wiping cleaning agent composition. Examples of the wiping material include cloths, nonwoven fabrics, paper (e.g., paper towels, cleaning paper), melamine resin sponges, and urethane resin sponges.
[0046] In the cleaning method for the object to be cleaned in this embodiment, the temperature of the cleaning agent composition is preferably 15 to 50°C, more preferably 20 to 45°C, and even more preferably 25 to 40°C.
[0047] In one aspect of this embodiment, after wiping the surface or gaps of the object to be cleaned with the wiping material, rinsing with water, aqueous alcohol, or aqueous glycol ether may be performed.
[0048] The cleaning agent composition for wiping according to this embodiment can be suitably used to remove flux or solder paste. That is, the cleaning agent composition for wiping is preferably for flux cleaning or solder paste cleaning. [Examples]
[0049] The present invention will be described in detail below with reference to examples, but the present invention is not limited to these examples.
[0050] ≪Raw materials≫ The names of the raw material compounds used in this example are shown in Table 1 below. [Table 1]
[0051] <Preparation of detergent composition> First, detergent compositions No. 1 to No. 15 (examples) and detergent compositions No. 101 to No. 114 (comparative examples) were prepared based on the formulations shown in Tables 2-1, 2-2, 3-1, and 3-2.
[0052] <Performance evaluation of detergent compositions> (Visual evaluation of detergent composition) The detergent compositions of samples No. 1 to No. 15 and No. 101 to No. 114 were left to stand at 25°C. The appearance of each detergent composition was then observed. The evaluation results are shown in Tables 2-1, 2-2, 3-1, and 3-2. In the tables, "separated" indicates that the composition separated into two layers: an aqueous phase and an organic phase. "Homogeneous" indicates that the interface between the aqueous and organic phases was not visible to the naked eye, meaning the composition was uniform in appearance.
[0053] From the results in Tables 2-1, 2-2, 3-1, and 3-2, the detergent compositions of Samples No. 1 to No. 15, as well as the detergent compositions of Samples No. 101, 102, 105, 108, 109, and 111-114, were uniform in appearance. On the other hand, the detergent compositions of Samples No. 103, 104, 106, 107, and 110 separated into two layers. All of the detergent compositions were transparent.
[0054] (Evaluation of wiping ability) (Preparing the test pieces) As a test piece for evaluating wipeability, a stainless steel plate (size: 100 x 100 x t1 mm) with solder paste (model: M705-GRN360 K2-V, manufacturer: Senju Metal Industry Co., Ltd.) (0.1 g) applied to its surface was prepared.
[0055] (Evaluation test of wiping properties) The wiping properties of each cleaning agent composition were evaluated by 10 panelists (evaluators) using the following procedure. First, 1g of each cleaning agent composition was dropped onto cleaning paper (product name: Bencot, manufacturer: Asahi Kasei Corporation, size: 9 x 9 cm) and allowed to soak. Solder paste on a SUS plate was then wiped off using this cleaning paper. The wiping properties of each cleaning agent composition were evaluated based on the evaluation criteria below. The most frequent evaluation result among the evaluation results of the 10 panelists is shown in the table. The evaluation results are shown in Tables 2-1, 2-2, 3-1, and 3-2. [Evaluation Criteria] A: It is easy to wipe away dirt and has excellent wiping properties. B: Easy to wipe away dirt and has excellent wiping properties. C: Dirt is slightly difficult to wipe off, and the wiping performance is somewhat inferior. D: Dirt is difficult to wipe off, and the wiping ability is poor.
[0056] From the results in Tables 2-1, 2-2, 3-1, and 3-2, it was found that the cleaning agent compositions of Samples No. 1 to No. 15 were evaluated as A or B, indicating good wiping properties (Figure 1). On the other hand, the cleaning agent compositions of Samples No. 102, 104, 105, 107, 109-112, and 114 were evaluated as C or D. In particular, the cleaning agent composition of Sample No. 112 had too high a solubility in flux, so it could not spread the flux and wipe it away completely (Figure 2). Also, the cleaning agent composition of Sample No. 112 left behind solder particles that could not be completely wiped away (Figure 1).
[0057] (Evaluation of drying properties) The drying properties of each cleaning agent composition were evaluated using the following procedure. First, approximately 0.1 g of each cleaning agent composition was dropped onto cleaning paper (product name: Bencot, manufacturer: Asahi Kasei Corporation, size: 3 x 3 cm), and the surface of the SUS plate was wiped. Then, the condition of the SUS surface at room temperature (25°C) was observed visually at elapsed time intervals, and the drying properties of each cleaning agent composition were evaluated based on the evaluation criteria below. The evaluation results are shown in Tables 2-1, 2-2, 3-1, and 3-2. [Evaluation Criteria] A: After wiping, it dried at room temperature for more than 1 minute but less than 5 minutes. B: After wiping, it dried at room temperature for more than 5 minutes but less than 10 minutes. C: After wiping, it was dried at room temperature for more than 10 minutes but less than 20 minutes. D: The product dried in less than 1 minute at room temperature after wiping, or there was still liquid residue even after 20 minutes.
[0058] From the results in Tables 2-1, 2-2, 3-1, and 3-2, it was found that the cleaning agent compositions of Samples No. 1 to No. 15 were evaluated as A or B and had good drying properties. On the other hand, the cleaning agent compositions of Samples No. 101, 103-108, 112, and 113 were evaluated as C or D. In particular, the cleaning agent composition of Sample 112 dried at room temperature in less than 1 minute after wiping.
[0059] (Odor evaluation) The odor of each detergent composition was evaluated using the following procedure. First, 200g of each detergent composition was placed in a beaker (capacity 300ml) and stirred at a temperature of 25°C. Ten panelists, standing 5cm away from the beaker, performed a sensory evaluation of the odor of each detergent composition according to the following criteria. The most frequent evaluation result from the ten panelists is shown in the table. The evaluation results are shown in Tables 2-1, 2-2, 3-1, and 3-2. [Evaluation Criteria] A: It has little odor and does not pose any problems during work. B: There is a slight odor, but it does not pose a problem for the work. C: An unpleasant odor is detected, which poses a problem for the work. D: The strong odor causes headaches, nausea, and other symptoms, making it extremely difficult to continue working.
[0060] From the results in Tables 2-1, 2-2, 3-1, and 3-2, it was found that the detergent compositions of Samples No. 1 to No. 15 received an evaluation of A or B, indicating no odor issues. On the other hand, the detergent compositions of Samples No. 104-106, 109, 110, and 112 received an evaluation of C.
[0061] (Measurement of contact angle) The contact angle of each cleaning agent composition was measured using the following procedure. First, 0.005 g of each cleaning agent composition was dropped onto a SUS plate. Next, the contact angle of the dropped droplet was measured using a CA-D type contact angle meter (manufactured by Kyowa Interface Science Co., Ltd.) (measurement temperature: 25°C). The measurement results are shown in Tables 2-1, 2-2, 3-1, and 3-2. In the tables, a "-" indicates that the cleaning agent composition has separated and therefore could not be measured (measurement was not possible).
[0062] (Measurement of surface tension) The surface tension of each detergent composition was measured using the Dunouy method. The measuring device used was a Dunouy surface tensile meter manufactured by Ohira Rika Kogyo Co., Ltd. The measurement results are shown in Tables 2-1, 2-2, 3-1, and 3-2. In the tables, a "-" indicates that the detergent composition was separated and therefore not measured (not possible to measure).
[0063] The results from Tables 2-1, 2-2, 3-1, and 3-2 suggest that the cleaning agent compositions of Samples No. 1 to No. 15 achieve both wiping and drying properties by having contact angles and surface tensions within an appropriate range (45-70° and 35-45 mN / m, respectively).
[0064] [Table 2-1]
[0065] [Table 2-2]
[0066] [Table 3-1]
[0067] [Table 3-2]
[0068] As described above, embodiments and examples of the present invention have been explained, but it is also intended from the outset that the configurations of each of the above embodiments and examples may be combined as appropriate.
[0069] The embodiments and examples disclosed herein should be considered in all respects to be illustrative and not restrictive. The scope of the present invention is indicated by the claims rather than the embodiments and examples described above, and all modifications within the meaning and scope of the claims are intended to be included.
Claims
1. A cleaning agent composition for wiping containing a hydrophilic glycol ether compound, a hydrophobic glycol ether compound, and water, The boiling point of the hydrophilic glycol ether compound is 140°C or higher and 190°C or lower. The boiling point of the hydrophobic glycol ether compound is 190°C or higher and 260°C or lower. The content of the hydrophilic glycol ether compound is 3% by mass or more and 25% by mass or less of the total amount of the wiping detergent composition. The content of the hydrophobic glycol ether compound is 1% by mass or more and 10% by mass or less of the total amount of the wiping detergent composition. The proportion of the amine compound is greater than 0% by mass and 0.005% by mass or less of the total amount of the wiping detergent composition, or the composition does not contain the amine compound. A wiping detergent composition wherein the water content is 70% by mass or more and 95% by mass or less of the total wiping detergent composition.
2. The wiping detergent composition according to claim 1, wherein the wiping detergent composition is uniform in appearance and transparent at a temperature of 25°C.
3. The cleaning agent composition for wiping according to claim 1 or claim 2, wherein the hydrophilic glycol ether compound comprises at least one compound selected from the group consisting of 3-methoxy-3-methyl-1-butanol, dipropylene glycol monomethyl ether, diethylene glycol dimethyl ether, diethylene glycol methyl ethyl ether, and diethylene glycol diethyl ether.
4. The cleaning agent composition for wiping according to claim 1 or claim 2, wherein the hydrophobic glycol ether compound comprises at least one compound selected from the group consisting of dipropylene glycol monobutyl ether, dipropylene glycol monopropyl ether, ethylene glycol monohexyl ether, and diethylene glycol butyl methyl ether.
5. A wipe-off cleaning agent composition stock solution comprising a hydrophilic glycol ether compound and a hydrophobic glycol ether compound, The boiling point of the hydrophilic glycol ether compound is 140°C or higher and 190°C or lower. The boiling point of the hydrophobic glycol ether compound is 190°C or higher and 260°C or lower. The content of the hydrophilic glycol ether compound is 30% by mass or more and 90% by mass or less of the total volume of the undiluted cleaning agent composition for wiping. The content of the hydrophobic glycol ether compound is 10% by mass or more and 70% by mass or less of the total volume of the undiluted cleaning agent composition for wiping. The content of the amine compound is greater than 0% by mass and less than or equal to 0.1% by mass of the total undiluted cleaning agent composition for wiping, or the composition does not contain the amine compound. A concentrated solution of a wiping-type cleaning agent composition, used by diluting it with water 3.3 to 20 times when cleaning objects.
6. The undiluted solution of the wiping detergent composition may further contain water. The water content is 0% by mass or more and 10% by mass or less with respect to the total amount of the wipe-cleaning agent composition stock solution according to claim 5.
Citation Information
Patent Citations
Detergent composition for metal mask
JP1997059688A
Detergent composition for metal mask
JP1997059698A
Detergent composition for screen printing plates
JP2018021093A