Substrate, transfer method, method for manufacturing an LED panel, and method for manufacturing a device

Abstract

To provide a receptor substrate that can increase the success rate of picking up objects to be transferred when using a stamper, a method for manufacturing this receptor substrate, and a transfer method and a method for manufacturing an LED panel using this receptor substrate. [Solution] A receptor substrate on which a plurality of transfer targets are arranged to be transferred to another substrate using a stamper, wherein the substrate has a plurality of sections on which a group of transfer targets that are transferred simultaneously in a single transfer operation by the stamper are arranged, and outside the sections there is a non-arrangement area where no transfer targets are arranged, and each of the plurality of sections is surrounded by the non-arrangement area.

Description

Technical Field

[0001] The present invention relates to a receptor substrate, a method for manufacturing a receptor substrate, a transfer method, a method for manufacturing an LED panel, and a stamper.

Background Art

[0002] In recent years, nitride semiconductor optical devices have come to be used as backlights for liquid crystal displays and as displays for signage. In these applications, since a large number of optical devices are used at once, a high-speed transfer technique is required. As a high-speed transfer technique, generally, batch transfer by a stamp method using a stamper has been performed, and it has become possible to transfer about 1,000 to tens of thousands of devices at once.

[0003] Optical devices are produced in large quantities by a semiconductor process on, for example, a sapphire substrate. When manufacturing a 4-inch display substrate using LEDs with a side length of 100 μm or less, called micro LEDs, millions of micro LEDs are required. Micro LEDs, which are tiny devices on the order of several tens of μm, are separated from the sapphire substrate, which is an epi-substrate, and then used.

[0004] As a separation method, it is common to bond a support substrate as a donor precursor substrate to the optical devices arranged on the sapphire substrate, and separate the optical devices from the sapphire substrate by laser lift-off. Thereby, a donor substrate on which a large number of optical devices are arranged on the surface can be obtained.

[0005] Such a method is not limited to those related to optical devices, and can also be applied to manufacturing a donor substrate on which a plurality of transfer objects such as fine semiconductor devices are arranged on the surface.

[0006] In addition, the transfer objects on the donor substrate are transferred onto a receptor substrate so as to be arranged corresponding to, for example, the circuit substrate of a product, and can be transferred from this receptor substrate onto another substrate such as the circuit substrate of the product by a stamp method.

[0007] For example, Patent Document 1 proposes a method for accurately transferring an object to be transferred from a donor substrate to a receptor substrate using laser irradiation. [Prior art documents] [Patent Documents]

[0008] [Patent Document 1] Japanese Patent Publication No. 2020-4478 [Overview of the project] [Problems that the invention aims to solve]

[0009] Conventionally, when transferring components from one receptor substrate to another using a stamping method, problems such as failing to pick up some of the components or mistakenly picking up devices adjacent to the components to be transferred sometimes occurred. These issues reduced the productivity of products that contained multiple components to be transferred.

[0010] The present invention has been made to solve the above problems, and aims to provide a receptor substrate that can increase the success rate of picking up an object to be transferred when transferring using a stamper, a method for manufacturing the receptor substrate, a transfer method using the receptor substrate, a method for manufacturing an LED panel, and a stamper. [Means for solving the problem]

[0011] In order to solve the above problems, the present invention provides a receptor substrate on which a plurality of transfer targets are arranged, which are to be transferred to another substrate using a stamper, The system has multiple compartments in which a group of objects to be transferred are arranged, which are to be transferred simultaneously in a single transfer operation by the stamper. Outside the aforementioned compartment, there is a non-placement area where the object to be transferred is not placed, The present invention provides a receptor substrate in which each of the aforementioned plurality of sections is surrounded by the aforementioned non-placement area.

[0012] The receptor substrate of the present invention has multiple compartments in which a group of objects to be transferred are arranged and transferred simultaneously in a single transfer operation by a stamper. This allows for transfer to be performed compartment by compartment, eliminating the need to transfer all objects at once using a large stamper. As a result, pickup failures caused by warping of the stamper or receptor substrate in the planar direction can be prevented.

[0013] Furthermore, since each compartment of the receptor substrate of the present invention is surrounded by an unplaced area where no object to be transferred is placed, it is possible to prevent accidentally picking up a device placed in an adjacent compartment during a single transfer operation by the stamper.

[0014] As a result, the receptor substrate of the present invention can increase the success rate of picking up objects to be transferred, and consequently improve the productivity of products containing the objects to be transferred.

[0015] For example, the object to be transferred may be a micro-LED or a semiconductor chip.

[0016] The object to be transferred is not particularly limited, but can be, for example, a micro-LED or a semiconductor chip.

[0017] Furthermore, the present invention relates to a method for manufacturing a receptor substrate on which a plurality of transfer targets are arranged, which are to be transferred to another substrate using a stamper, A step of preparing a donor substrate equipped with the object to be transferred and a receptor precursor substrate, The process involves transferring the object to be transferred from the donor substrate to the receptor precursor substrate by laser lift-off to obtain a receptor substrate. Includes, In the step of obtaining the receptor substrate, on the receptor precursor substrate, a plurality of sections are formed in which a group of transfer objects to be transferred simultaneously by one transfer operation of the stamper are arranged. Outside the sections, a non-arrangement area where the transfer objects are not arranged is formed, and the transfer of the transfer objects by laser lift-off is performed such that each of the plurality of sections is surrounded by the non-arrangement area, thereby providing a method for manufacturing a receptor substrate.

[0018] According to such a method for manufacturing a receptor substrate, the success rate of picking up the transfer objects can be increased, and as a result, the receptor substrate of the present invention capable of improving the productivity of products provided with the transfer objects can be manufactured.

[0019] Further, in the present invention, there is provided a transfer method for transferring a plurality of transfer objects from the receptor substrate of the present invention to another substrate using a stamper, including a stamping step of transferring the group of transfer objects from at least one of the plurality of sections of the receptor substrate to the other substrate simultaneously in one transfer operation using the stamper for each section.

[0020] According to such a transfer method, since the receptor substrate of the present invention is used, the success rate of picking up the transfer objects can be increased, and as a result, excellent transfer efficiency can be achieved.

[0021] Further, in the present invention, there is provided a method for manufacturing an LED panel, including a step of preparing a receptor substrate which is the receptor substrate described in the present invention and in which the transfer object is a micro LED, a step of preparing an LED panel substrate, and a step of transferring the micro LEDs, which are the group of transfer objects, from at least one of the plurality of sections of the receptor substrate to the LED panel substrate simultaneously in one transfer operation using a stamper for each section and providing a method for manufacturing an LED panel.

[0022] In the manufacturing method of such an LED panel, since transfer is performed using the receptor substrate of the present invention, the success rate of picking up micro LEDs can be increased, and as a result, an LED panel can be manufactured with high productivity.

[0023] Further, in the present invention, there is provided a stamper provided with a stamper head on one surface of a substrate, wherein a region on one surface of the substrate where the stamper head is not provided has a region subjected to a release treatment.

[0024] With such a stamper, due to the presence of the region subjected to the release treatment, even when the stamper touches a part of an adjacent section to the section to be transferred, picking up of an unintended adjacent section can be suppressed, and the success rate of picking up the transfer object can be increased. Further, such a stamper subjected to such a release treatment is not limited to the use of picking up for each section, and is particularly effective for repair (re-transfer of the transfer object to a portion of the substrate on which the transfer object is arranged where a defective transfer object has been removed).

[0025] For example, the release treatment can be forming a release film.

[0026] The release treatment is not particularly limited, but for example, a release film can be formed.

[0027] For example, the release film can be a fluororesin film or a metal film.

[0028] The release film is not particularly limited, but for example, it can be a fluororesin film or a metal film.

[0029] For example, the surface of the stamper head for picking up the transfer object can have protrusions.

[0030] By having protrusions on the surface to be picked up, better pick-up performance can be exhibited.

[0031] In this case, it is preferable that the protrusions are arranged in a matrix.

[0032] The matrix-like arrangement of protrusions allows for more stable pickup.

[0033] Furthermore, it is preferable that the size of the projection is such that the diameter of the circumscribed circle circumscribed around the projection is 0.5 to 1.5 times the diameter of the circumscribed circle circumscribed around the object to be transferred.

[0034] By limiting the range in this way, the data can be transferred with greater precision.

[0035] Furthermore, the surface of the stamper head that picks up the object to be transferred may have an adhesive layer.

[0036] The stamper of the present invention may also achieve pickup by an adhesive layer.

[0037] Furthermore, the surface of the stamper head that picks up the object to be transferred may be made from adhesive.

[0038] The stamper of the present invention may also implement pickup using adhesive.

[0039] The stamper head may be made of silicone resin.

[0040] The stamper head can be made from, for example, a silicone resin.

[0041] The stamper of the present invention can be used, for example, in repair processing.

[0042] As described above, the stamper of the present invention is particularly effective for repairs. [Effects of the Invention]

[0043] As described above, the receptor substrate of the present invention can increase the success rate of picking up the object to be transferred, and as a result, improve the productivity of products equipped with the object to be transferred.

[0044] Furthermore, the method for manufacturing the receptor substrate of the present invention can increase the success rate of picking up the object to be transferred, and as a result, it is possible to manufacture a receptor substrate of the present invention that can improve the productivity of products equipped with the object to be transferred.

[0045] Furthermore, the transfer method of the present invention can increase the success rate of picking up the object to be transferred, and as a result, excellent transfer efficiency can be achieved.

[0046] Furthermore, the LED panel manufacturing method of the present invention enables the production of LED panels with high productivity.

[0047] Furthermore, the stamper of the present invention can increase the success rate of picking up the object to be transferred. [Brief explanation of the drawing]

[0048] [Figure 1] This is a schematic plan view showing an example of a receptor substrate of the present invention. [Figure 2] This is a schematic flowchart showing an example of a transfer method using an example of the receptor substrate of the present invention. [Figure 3] This is a schematic flowchart showing a part of the manufacturing method for an LED panel using an example of the receptor substrate of the present invention. [Figure 4] This is a schematic flow chart showing a part of an example of a method for manufacturing the receptor substrate of the present invention. [Figure 5] This is a schematic flow chart showing another part of an example of the method for manufacturing the receptor substrate of the present invention. [Figure 6] This is a schematic flow chart showing another part of an example of the method for manufacturing the receptor substrate of the present invention. [Figure 7] This is a schematic flow chart showing another part of an example of the method for manufacturing the receptor substrate of the present invention. [Figure 8] This is a schematic flow chart showing another part of an example of the method for manufacturing the receptor substrate of the present invention. [Figure 9] This is a schematic flow chart showing another part of an example of the method for manufacturing the receptor substrate of the present invention. [Figure 10] This is a schematic flow chart showing another part of an example of the method for manufacturing the receptor substrate of the present invention. [Modes for carrying out the invention]

[0049] As mentioned above, there was a need to develop a receptor substrate that could increase the success rate of picking up objects during transfer using a stamper.

[0050] As a result of diligent research into the above-mentioned problems, the inventors of the present invention have found that if a receptor substrate has multiple compartments in which a group of objects to be transferred are placed in a single transfer operation by a stamper, and each of these compartments is surrounded by an area where no objects to be transferred are placed, it is possible to prevent missing some of the objects to be transferred or mistakenly picking up a device adjacent to an object to be transferred, and thus the present invention has been completed.

[0051] That is, the present invention relates to a receptor substrate on which a plurality of objects to be transferred are arranged, which are to be transferred to another substrate using a stamper, The system has multiple compartments in which a group of objects to be transferred are arranged, which are to be transferred simultaneously in a single transfer operation by the stamper. Outside the aforementioned compartment, there is a non-placement area where the object to be transferred is not placed, The receptor substrate is such that each of the aforementioned plurality of sections is surrounded by the aforementioned non-placement area.

[0052] Furthermore, the present invention relates to a method for manufacturing a receptor substrate on which a plurality of transfer targets are arranged, which are to be transferred to another substrate using a stamper, A step of preparing a donor substrate equipped with the object to be transferred and a receptor precursor substrate, The process involves transferring the object to be transferred from the donor substrate to the receptor precursor substrate by laser lift-off to obtain a receptor substrate. Includes, In the process of obtaining the receptor substrate, a plurality of sections are formed on the receptor precursor substrate where a group of objects to be transferred are arranged to be transferred simultaneously in a single transfer operation by the stamper, and a non-arrangement area is formed outside the sections where no objects to be transferred are arranged, and each of the plurality of sections is surrounded by the non-arrangement area, thereby providing a method for manufacturing a receptor substrate in which the objects to be transferred are transferred by laser lift-off.

[0053] Furthermore, the present invention relates to a transfer method for transferring multiple objects to be transferred from a receptor substrate to another substrate using a stamper, The transfer method includes a stamping step in which, for each of the plurality of compartments of the receptor substrate, a group of objects to be transferred are simultaneously transferred to the other substrates in a single transfer operation using the stamper, for each compartment.

[0054] Furthermore, the present invention relates to a method for manufacturing an LED panel, The present invention provides a receptor substrate, comprising the steps of preparing a receptor substrate in which the object to be transferred is a microLED, The process of preparing the LED panel substrate, A step of transferring a group of micro-LEDs, which are the objects to be transferred, from at least one of the plurality of compartments of the receptor substrate to the LED panel substrate simultaneously in a single transfer operation using a stamper, for each compartment. This is a method for manufacturing LED panels, including the following:

[0055] Furthermore, the present invention relates to a stamper having a stamper head provided on one side of a substrate, The area on one side of the substrate where a stamper head is not provided is a stamper having a region that has undergone a release treatment.

[0056] The present invention will be described in detail below, but the present invention is not limited to these descriptions.

[0057] Figure 1 shows a schematic plan view of the receptor substrate of the present invention. The receptor substrate 1 in Figure 1 has multiple transfer targets 4 arranged on it. The receptor substrate 1 in Figure 1 also has multiple sections 2 where a group of transfer targets 4 are arranged, and outside of the sections 2, there is an area 3 where no transfer targets 4 are arranged. Each of the multiple sections 2 is surrounded by the area 3 where no transfer targets 4 are arranged.

[0058] An example of a transfer method using such a receptor substrate 1 will be explained with reference to Figure 2.

[0059] First, as shown in Figure 2(A), the receptor substrate 1 is fixed on the receptor stage 11, and the other substrate 9 is fixed on the substrate stage 91.

[0060] Next, a group of transfer targets 4 placed in one of the multiple compartments 2 of the receptor substrate 1 are simultaneously transferred to another substrate 9 in a single transfer operation using a stamper 8.

[0061] Specifically, as shown by the arrows in Figure 2(A), the stamper 8, which has a stamper head 81 at its lower end, is lowered, and the stamper head 81 is brought into contact with a group of transfer objects 4 located in one section 2. As a result, as shown in Figure 2(B), the stamper 8 can pick up the group of transfer objects 4 in one section. The stamper 8 moves onto another substrate 9 as shown by the arrows in Figure 2(B), and rises, leaving the group of transfer objects 4 on the other substrate 9 as shown in Figure 2(C).

[0062] The transfer described above is carried out section by section, starting from at least one section.

[0063] When attempting to pick up all objects to be transferred at once using a large stamper, the pickup surface of the stamper head may warp, significantly impacting the process and resulting in some objects being unable to be picked up. On the other hand, in the receptor substrate 1 of the present invention, a group of objects to be transferred 4, which are simultaneously transferred in a single transfer operation by the stamper 8, are arranged in each of multiple sections 2. Therefore, there is no need to use a large stamper that picks up all objects 4 on the receptor substrate 1 at once. By using the receptor substrate 1 of the present invention, a stamper equipped with a stamper head 81 sized to match the size of each section 2 can be used. This eliminates the problem of warping of the pickup surface of the stamper head 81, and allows for uniform and complete pickup of a group of objects 4 within a single section 2. Although the number of stamps increases, this ultimately improves the success rate of pickup. Furthermore, even if the receptor substrate is warped, the impact of the warping can be reduced by picking up each section as described above.

[0064] Furthermore, in the receptor substrate 1 of the present invention, each of the multiple compartments 2 is surrounded by a non-placement area 3. As shown in Figure 2(B), when picking up a transfer target object 4 from one compartment 2 with the stamper 8, it is possible to prevent transfer target objects 4 located in adjacent compartments 2 from adhering to the stamper 8, thereby preventing the accidental pickup of a device adjacent to the target transfer target object 4.

[0065] As described above, the receptor substrate 1 of the present invention prevents the failure to pick up a portion of the object to be transferred 4, or the erroneous pickup of a device adjacent to the object to be transferred 4. As a result, the success rate of picking up the object to be transferred can be increased.

[0066] The object to be transferred 4 is not particularly limited, but could be, for example, a micro-LED or a semiconductor chip.

[0067] Figure 1 schematically shows an example in which multiple transfer targets 4, each consisting of a red micro-light-emitting diode (LED) 41, a green micro-LED 42, and a blue micro-LED 43, are arranged. In Figure 1, for illustrative purposes, each micro-LED 41-43 is shown to be visible, but in reality, micro-LEDs are integrated at a density that makes them invisible to the naked eye.

[0068] In each of the multiple sections 2 shown in Figure 1, for example, micro-LEDs 41-43, which can be directly mounted on the backplane of a single smartwatch, can be arranged at pixel pitch as a group of transfer targets 4. In the example in Figure 1, micro-LEDs 41-43 for nine smartwatches are arranged at pixel pitch on the receptor substrate 1.

[0069] Furthermore, using the receptor substrate 1, as shown in Figure 3, micro-LEDs, which are the objects to be transferred 4, can be transferred from at least one of the sections 2 of the receptor substrate 1 to another substrate, the LED panel substrate 9, for each section 2, and laid out on this substrate 9 to manufacture one LED panel 10. Here, the LED panel substrate 9 can be, for example, a backplane.

[0070] As described above, by using the receptor substrate 1 of the present invention to transfer the object to be transferred 4, not only small products such as smartwatches but also large devices such as large LED panels can be manufactured with high productivity. In particular, even when manufacturing large devices, by using multiple receptor substrates 1 of the present invention to match the size of the device and performing continuous transfer by stamper, large devices can be manufactured efficiently without changing the size of the stamper 8 used. In other words, the receptor substrate 1 of the present invention can be easily applied to changes in product size and is also easily applicable to the manufacture of large devices.

[0071] When applying to large devices, multiple stampers may be used simultaneously. In this case as well, the transfer of objects 4 from at least one of the multiple compartments 2 is performed simultaneously for each compartment 2 in a single transfer operation using one stamper.

[0072] The size of the applicable device is not particularly limited, but for example, 25mm 2 Over 100m 2 It can be used to manufacture devices having the following circuit boards.

[0073] In the example shown in Figure 1, red 41, green 42, and blue 43 micro-LEDs are placed in each section 2. However, the receptor substrate 1 on which the micro-LEDs are placed may have one or two of these three colors of LEDs placed in each section 2.

[0074] The shape of the compartment is preferably rectangular, as shown in Figure 1. A rectangular shape improves productivity and ease of application to large devices. Furthermore, in cases where one device is manufactured in a single compartment, the compartment shape is not limited to a rectangle; it can be circular, elliptical, or other polygonal shapes, expanding the design possibilities for the device.

[0075] The width of the non-arranged area 3 is not particularly limited, but is preferably 10 μm or more and 50 mm or less. In another respect, the width of the non-arranged area 3 is preferably 0.025 times or more and 0.1 times or less the width of each section 2. In the case of a receptor substrate 1 on which red 41, green 42, and blue 43 micro-LEDs are arranged, it is preferably 2 times or more and 100 times or less the shortest distance between the LEDs.

[0076] Furthermore, while it is preferable that no objects to be transferred exist in the non-placement area, a small number of objects to be transferred may unintentionally exist due to manufacturing precision, or a small number of objects to be transferred or dummy objects to be transferred may exist for purposes such as stress relief. In such cases, the total area of ​​the existing objects to be transferred is preferably 10% or less of the area of ​​the non-placement area, more preferably 1% or less, particularly preferably 0.1% or less, extremely preferably 0.01% or less, and most preferably 0.001% or less.

[0077] The main body of the receptor substrate 1 (receptor precursor substrate 6 described below) is not particularly limited, and a substrate commonly used as a receptor substrate can be used. For example, the receptor precursor substrate may be a glass substrate such as a synthetic quartz glass substrate, and may have an adhesive layer on the surface of the glass substrate. The adhesive strength of this adhesive layer is preferably strong enough to allow the object to be transferred by a stamper in a later process.

[0078] The stamper 8 is not particularly limited, and any stamper commonly used as stamper 8 can be used. Preferably, the area of ​​the stamper head on the surface of the stamper where the stamper head is located is treated with a release film such as a fluororesin film or a metal film. Here, the metal film can be formed, for example, by vapor deposition, sputtering, or plating. Such a release film can suppress the unintended pickup of adjacent areas even if the stamper touches a part of an area adjacent to the area to be transferred. Furthermore, a stamper with such a release treatment is effective not only for area-by-area pickup but also particularly for repair (re-transferring objects to a substrate where defective objects have been removed). When using a stamper with a release treatment for repair, the stamper head can accommodate repairs of various sizes, such as dimensions corresponding to 1 to 3 objects or dimensions corresponding to an area. The surface of the stamper head that picks up the objects to be transferred can, for example, have an adhesive layer or be made from an adhesive. Furthermore, a protrusion can be provided on the surface of the stamper head that picks up the object to be transferred, thereby improving the pick-up performance. In particular, when picking up a single object to be transferred, using a stamper head with a single protrusion enables high-precision transfer. There are no particular restrictions on the size of this protrusion, but it is preferable that the diameter of the circumscribed circle circumscribing the protrusion is 0.5 to 1.5 times, more preferably 0.7 to 1.3 times, and particularly preferably 0.9 to 1.1 times, the diameter of the circumscribed circle circumscribing the object to be transferred. By setting it within this range, high-precision transfer can be achieved.

[0079] Such stampers can be manufactured, for example, by forming a stamper head on a circular, elliptical, square, or other polygonal substrate using silicone resin or the like. The size of the stamper can be changed depending on the object to be transferred and the process to which it is applied, but it is preferable that the diameter (in the case of a circular shape), the major axis (in the case of an elliptical shape), and the length of the longest side (in the case of a square or other polygonal shape) of the substrate are 10 to 200 mm, and the thickness is 0.5 to 3 mm, as this can accommodate many objects to be transferred and processes. Furthermore, when applied to a large number of objects to be transferred or objects of large size, it is preferable that the length of the substrate is 200 to 1000 mm and the thickness is 0.5 to 6 mm. It is preferable that the stamper head is smaller than the substrate, and its length is preferably about 2 to 20 mm shorter than the length of the substrate, in terms of stamper head formability and securing an effective area. The protrusions are preferably sized such that the diameter of their circumscribed circle is 1 to 150 μm, and their height is preferably 1 to 500 μm. When many protrusions are provided on the stamper head, it is preferable to arrange them in a matrix. In this case, protrusions do not need to be provided on the outer edge of the stamper head. When protrusions are arranged in a matrix, the pitch between the protrusions is preferably about 5 to 1000 μm.

[0080] The other substrate 9 is not limited to product substrates such as LED panel substrates, but may also be other receptor precursor substrates for transferring the object to be transferred 4 to the product substrate.

[0081] The object 4 transferred from the receptor substrate 1 of the present invention can be connected to a circuit board, for example, by a flip-chip bonding method.

[0082] Next, an example of a method for manufacturing the receptor substrate 1 of the present invention will be described with reference to Figures 4 to 10. Note that the receptor substrate 1 of the present invention can also be manufactured by methods other than those described below.

[0083] First, as shown in Figure 4(R1), a receptor precursor substrate 6 and a donor substrate 5 on which multiple red micro-LEDs 41 are arranged are prepared. In Figure 4(R1), the red micro-LEDs 41 are arranged on the upward-facing surface of the donor substrate 5.

[0084] Next, as shown in Figure 4(R2), the donor substrate 5 is flipped over so that the side with the red micro-LED 41 is facing the receptor precursor substrate 6, as shown in Figure 4(R3). Also, the laser light source 7 is prepared and aligned.

[0085] Next, as shown in Figure 4(R4), a line laser beam is emitted from the laser light source 7 toward the donor substrate 5. The line laser light of the laser beam blinks. The red micro LED 41 struck by the laser beam flies toward the receptor precursor substrate 6, as shown in Figure 4(R4), and attaches to a predetermined position on the receptor precursor substrate 6. When transferring micro LEDs to the receptor substrate at a pitch different from that of the micro LEDs on the donor substrate in this way, it is preferable not to perform laser lift-off while the donor substrate and the receptor substrate are in contact, but rather to maintain a non-contact state by, for example, keeping a certain distance between the donor substrate and the receptor substrate, and to perform laser lift-off while changing the moving speed of the donor substrate and the receptor substrate.

[0086] As shown in Figure 4(R5), with the laser light source 7 fixed, moving the receptor precursor substrate 6 and the donor substrate 5 causes multiple red micro LEDs 41 to fly sequentially toward the receptor precursor substrate 6 in sync with the flashing of the laser, and attach to the pattern at a predetermined position.

[0087] Next, as shown in Figure 4(R6) and Figures 5(R7) to 5(R12), the alignment and laser irradiation are repeated. This allows multiple red micro-LEDs 41 to be transferred to the receptor precursor substrate 6 in the desired pattern.

[0088] Next, as shown in Figure 6(R13), each component is returned to its original position (Figure 4(R3)), and the donor substrate 5 is removed as shown in Figure 6(R14).

[0089] Next, as shown in Figure 6(G1), a donor substrate 5 on which multiple green micro-LEDs 42 are arranged is prepared, and as shown in Figures 6(G2) to (G4) and Figures 7(G5) to (G10), alignment and laser irradiation are repeated, similar to the case of the red micro-LEDs 41. This allows multiple green micro-LEDs 42 to be transferred to the receptor precursor substrate 6 in a desired pattern.

[0090] Next, as shown in Figure 8(G11), each component is returned to its original position (Figure 6(G2)), and the donor substrate 5 is removed as shown in Figure 8(G12).

[0091] Next, as shown in Figure 8(B1), a donor substrate 5 on which multiple blue micro-LEDs 43 are arranged is prepared, and as shown in Figures 8(B2) to (B4) and Figures 9(B5) to (B10), alignment and laser irradiation are repeated, similar to the case of the red micro-LEDs 41. This allows the blue micro-LEDs 43 to be transferred to the receptor precursor substrate 6 in the desired pattern.

[0092] Next, as shown in Figure 10(B11), each component is returned to its original position (Figure 8(B2)), and the donor substrate 5 is removed as shown in Figure 10(B12).

[0093] The above alignment can be performed by creating multiple sections 2 in which a group of micro-LEDs 41-43 are arranged, forming non-arrangement areas 3 outside the sections 2 where no micro-LEDs 41-43 are arranged, and each of the multiple sections 2 is surrounded by the non-arrangement areas 3, thereby transferring each micro-LED 41-43 (selective laser lift-off), and the receptor substrate 1 of the present invention can be manufactured.

[0094] The donor substrate 5 and light source 7 used are not particularly limited, and those commonly used in laser lift-off can be used. Specifically, the donor substrate refers to a substrate (supply substrate) equipped with an object to be transferred for laser lift-off, and can be the same type of substrate as the receptor substrate described above, or a glass substrate such as a synthetic silica glass substrate having an ablation layer such as a polyimide layer on its surface. Having this ablation layer facilitates laser lift-off.

[0095] Furthermore, from the perspective of the supply substrate, instead of a donor substrate, a receptor substrate may be obtained by transferring the object to be transferred from a wafer on which micro-LEDs or semiconductor chips are formed to a receptor precursor substrate by laser lift-off.

[0096] It should be noted that the present invention is not limited to the embodiments described above. The embodiments described above are illustrative, and any configuration that is substantially identical to the technical idea described in the claims of the present invention and achieves similar effects is included within the technical scope of the present invention.

Claims

1. A substrate on which multiple objects to be transferred are arranged, The aforementioned multiple objects to be transferred are densely packed within multiple sections arranged in a matrix, The aforementioned multiple sections are surrounded by non-placement areas, A substrate in which the length of the non-placement area in the adjacent direction between two adjacent sections in one of the plurality of sections is greater than the distance between adjacent transfer objects in the adjacent direction within each of the two adjacent sections.

2. The substrate according to claim 1, wherein no object to be transferred exists in the non-placement area.

3. If the object to be transferred or a dummy object to be transferred exists in the non-placement area, The substrate according to claim 1, wherein the total area of ​​the objects to be transferred located in the non-placement area is 10% or less of the area of ​​the non-placement area.

4. The substrate according to claim 1, wherein the densely packed objects to be transferred within the aforementioned section are arranged in a matrix.

5. The substrate according to claim 1, wherein, within the aforementioned section, the densely packed objects to be transferred are arranged in a matrix-like manner, with multiple objects to be transferred serving as units.

6. The substrate according to claim 1, wherein the plurality of objects to be transferred are attached to an adhesive layer provided on the glass substrate.

7. The substrate according to claim 1, wherein the object to be transferred is a microLED or a semiconductor chip.

8. The substrate according to any one of claims 1 to 7, wherein the width of the non-placed area is 10 μm or more and 50 mm or less.

9. The substrate according to any one of claims 1 to 7, wherein the width of the non-placed area is 0.025 times or more and 0.1 times or less each of the plurality of sections.

10. The object to be transferred is a micro-LED, The substrate according to any one of claims 1 to 6, wherein the width of the non-arranged area is 2 times or more and 100 times or less the shortest distance of the micro-LED.

11. A transfer method for transferring multiple objects to be transferred from one substrate to another using a stamper, according to any one of claims 1 to 7, A transfer method comprising a stamping step in which, for each of the aforementioned sections, objects to be transferred, which are densely packed within that section, are transferred from one substrate to another substrate using the stamper.

12. A method for manufacturing an LED panel, A step of preparing a substrate according to any one of claims 1 to 7, wherein the object to be transferred is a microLED, The process of preparing the LED panel substrate, For each of the aforementioned sections, the process involves transferring the objects to be transferred, which are densely packed within that section, from the substrate to the LED panel substrate using a stamper. A method for manufacturing an LED panel, including the following:

13. A method for manufacturing a device, A step of preparing a substrate according to any one of claims 1 to 7, The process of preparing the circuit board, For each of the aforementioned sections, the process involves transferring the objects to be transferred, which are densely packed within that section, from the substrate to the circuit board using a stamper. A method for manufacturing a device that includes [a specific device].

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